WO2019184591A1 - 用于显示面板的散热装置及其制造方法、显示装置 - Google Patents
用于显示面板的散热装置及其制造方法、显示装置 Download PDFInfo
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- WO2019184591A1 WO2019184591A1 PCT/CN2019/073956 CN2019073956W WO2019184591A1 WO 2019184591 A1 WO2019184591 A1 WO 2019184591A1 CN 2019073956 W CN2019073956 W CN 2019073956W WO 2019184591 A1 WO2019184591 A1 WO 2019184591A1
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- thermally conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Definitions
- the present disclosure relates to the field of display technologies, and in particular, to a heat dissipation device for a display panel, a method of manufacturing the same, and a display device.
- the display panel generates heat during operation.
- a single layer of heat dissipation layer is used to dissipate heat from the display panel.
- a heat dissipation device for a display panel including: a first heat conduction layer on a side of the display panel facing away from the display surface, wherein the first heat conduction layer is disposed on the first heat conduction layer a through hole; and a second heat conducting layer on a side of the first heat conducting layer away from the display panel, a part of the second heat conducting layer is connected to the display panel through the through hole;
- the thermal conductivity of the first heat conduction layer in a direction parallel to the display surface is greater than the thermal conductivity of the first heat conduction layer in a direction perpendicular to the display surface;
- the second heat conduction layer is perpendicular to The thermal conductivity in the direction of the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface.
- the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the second thermally conductive layer in a direction parallel to the display surface.
- the first thermally conductive layer comprises a thermally conductive graphite layer; the second thermally conductive layer comprises a metallic layer.
- an orthographic projection of the first thermally conductive layer on the display panel is located inside an orthographic projection of the second thermally conductive layer on the display panel, and an edge of the second thermally conductive layer is used The cover of the protection display panel is connected.
- the heat dissipation device further includes: a third heat conduction layer disposed on the sidewall portion of the cover plate and connected to the second heat conduction layer.
- the third thermally conductive layer is located inside a region enclosed by the side wall portion of the cover plate and is disposed on the side wall portion of the cover plate in a circumferential manner.
- the projection of the third thermally conductive layer on the substrate of the display panel does not overlap with the display area of the display panel.
- the third thermally conductive layer comprises at least one of a metal plating layer, a metal heat conductive patch, a thermally conductive ceramic patch, and a thermally conductive graphite layer.
- a heat dissipation device for a display panel including: a first heat conduction layer located on a side of the display panel facing away from the display surface, and passing through the first connection layer a display panel connection, the first heat conduction layer is provided with a through hole; and a second heat conduction layer is located on a side of the first heat conduction layer away from the display panel, through the second connection layer and the first a heat conducting layer is connected, a portion of the second heat conducting layer is connected to the display panel through the through hole; wherein a thermal conductivity of the first heat conducting layer in a direction parallel to the display surface is greater than Thermal conductivity of the first heat conduction layer in a direction perpendicular to the display surface; thermal conductivity of the second heat conduction layer in a direction perpendicular to the display surface is greater than the first heat conduction layer being perpendicular to the The thermal conductivity in the direction of the display surface.
- the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the second thermally conductive layer in a direction parallel to the display surface.
- the first thermally conductive layer comprises a thermally conductive graphite layer; the second thermally conductive layer comprises a metallic layer.
- the first connection layer and the second connection layer are both thermally conductive connection layers.
- the first connection layer and the second connection layer are both glue layers.
- an orthographic projection of the first thermally conductive layer on the display panel is located inside an orthographic projection of the second thermally conductive layer on the display panel, and an edge of the second thermally conductive layer passes through A portion of the second connection layer is connected to a cover for protecting the display panel.
- the heat sink further includes: a third heat conducting layer disposed on the sidewall portion of the cap plate and connected to the second heat conducting layer through the second connecting layer.
- the third thermally conductive layer is located inside a region enclosed by the side wall portion of the cover plate and is disposed on the side wall portion of the cover plate in a circumferential manner.
- the projection of the third thermally conductive layer on the substrate of the display panel does not overlap with the display area of the display panel.
- the third thermally conductive layer comprises at least one of a metal plating layer, a metal heat conductive patch, a thermally conductive ceramic patch, and a thermally conductive graphite layer.
- a portion of the second thermally conductive layer passes through the through hole and is connected to the display panel through the first connection layer and the second connection layer.
- the first connection layer is provided with a first opening corresponding to the through hole, a part of the second heat conduction layer passes through the through hole and the first opening and is The display panel is connected by the second connection layer.
- the second connection layer is provided with a second opening corresponding to the through hole, a portion of the second heat conduction layer passes through the through hole and the second opening and is The display panel is connected by the first connection layer.
- a heat dissipation device for a display panel including: a first heat conduction layer on a side of the display panel facing away from the display surface; and a second heat conduction layer located at the a side of the first heat conduction layer away from the display panel; wherein a thermal conductivity of the first heat conduction layer in a direction parallel to the display surface is greater than a width of the first heat conduction layer perpendicular to the display surface The thermal conductivity in the direction; the thermal conductivity of the second thermally conductive layer in a direction perpendicular to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface.
- the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the second thermally conductive layer in a direction parallel to the display surface.
- the first heat conduction layer is connected to the display panel through a first connection layer; the second heat conduction layer is connected to the first heat conduction layer through a second connection layer.
- a display device comprising: a display panel and a heat sink for the display panel as described above.
- a method of manufacturing a heat dissipating device includes: disposing a first heat conducting layer on a side of the display panel facing away from the display surface, wherein the first heat conducting layer is disposed on the first heat conducting layer a through hole; and a second heat conducting layer disposed on a side of the first heat conducting layer away from the display panel, wherein a portion of the second heat conducting layer is connected to the display panel through the through hole; Wherein the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface; the second thermally conductive layer The thermal conductivity in a direction perpendicular to the display surface is greater than a thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface.
- the first thermally conductive layer is coupled to a side of the display panel that faces away from the display surface using a first connection layer; the second thermally conductive layer is coupled to the first The side of the heat conductive layer that is away from the display panel.
- the manufacturing method before the second heat conducting layer is disposed on a side of the first heat conducting layer away from the display panel, the manufacturing method further includes: in a cover for protecting the display panel A third heat conducting layer is disposed on the side wall portion.
- the projection of the third thermally conductive layer on the substrate of the display panel does not overlap with the display area of the display panel.
- FIG. 1 is a schematic cross-sectional view showing a heat sink for a display panel, in accordance with some embodiments of the present disclosure
- FIG. 2 is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure
- FIG. 3 is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure
- FIG. 4A is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure
- FIG. 4B is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure
- FIG. 4C is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure.
- FIG. 5 is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure
- FIG. 6 is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure
- FIG. 7 is a top view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- FIG. 8 is a flowchart illustrating a method of fabricating a heat sink for a display panel, in accordance with some embodiments of the present disclosure
- FIG. 9 is a schematic cross-sectional view showing a structure according to some embodiments of the present disclosure at step S802 of FIG. 8;
- FIG. 10 is a schematic cross-sectional view showing a structure according to still another embodiment of the present disclosure at step S802 of FIG. 8;
- FIG. 11 is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- a particular device when it is described that a particular device is located between the first device and the second device, there may be intervening devices between the particular device and the first device or the second device, or there may be no intervening devices.
- that particular device can be directly connected to the other device without intervening devices, or without intervening devices directly connected to the other devices.
- the inventors of the present disclosure have found that since the brightness of the display screen is not uniform over the entire display panel, the current flowing through the electronic components of each sub-pixel used for the control panel display may be different, which results in these electronic components.
- the amount of heat generated is also different. This heat is concentrated in the heat concentration area of the display panel. The accumulation of heat causes a change in the local temperature of the display panel, so that the current flowing through the electronic component is affected by the temperature and a certain drift occurs, thereby causing display distortion in the area, thereby affecting the display effect.
- embodiments of the present disclosure provide a heat dissipation device to improve the heat dissipation effect of the display panel.
- a heat sink according to some embodiments of the present disclosure is described in detail below with reference to the accompanying drawings.
- FIG. 1 is a schematic cross-sectional view illustrating a heat sink for a display panel, in accordance with some embodiments of the present disclosure.
- the heat sink 10 may include a first heat conductive layer 131 and a second heat conductive layer 132 .
- the first heat conduction layer 131 is located on a side of the display panel 110 that faces away from the display surface.
- the first heat conduction layer 131 is provided with a through hole 1312.
- the display panel 110 may include a substrate 111 and an encapsulation layer 112 .
- the first heat conductive layer 131 may be disposed on a side of the substrate 111 facing away from the display surface, for example, may be disposed on a lower surface of the substrate 111.
- the structure of the display panel shown in FIG. 1 is merely exemplary.
- the display panel may also include other structural layers such as a light emitting layer, an integrated circuit layer, and the like. Therefore, the structure of the display panel of the embodiment of the present disclosure is not limited thereto, and the other drawings are similar.
- the display surface here refers to the light-emitting surface of the display panel.
- the second heat conduction layer 132 is located on a side of the first heat conduction layer 131 away from the display panel 110 . A portion of the second heat conductive layer 132 is connected to the display panel 110 through the through hole 1312 , for example, to the substrate 111 of the display panel 110 .
- the thermal conductivity (which may also be referred to as thermal conductivity) of the first thermally conductive layer 131 in a direction parallel to the display surface is greater than the thermal conductivity of the first thermally conductive layer 131 in a direction perpendicular to the display surface.
- the thermal conductivity of the second heat conduction layer 132 in a direction perpendicular to the display surface is greater than the thermal conductivity of the first heat conduction layer 131 in a direction perpendicular to the display surface.
- the first heat conductive layer is disposed on a side of the display panel facing away from the display surface.
- a through hole is disposed on the first heat conduction layer.
- a second heat conducting layer is disposed on a side of the first heat conducting layer away from the display panel. A portion of the second heat conductive layer is connected to the display panel through the through hole.
- the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface. This can make the heat of the display panel relatively uniform in the direction parallel to the display surface, preventing heat from being concentrated in a certain area, thereby facilitating the heat dissipation effect.
- the thermal conductivity of the second thermally conductive layer in a direction perpendicular to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface. This can enable these evenly distributed heat of the display panel to be transmitted through the second heat conducting layer in a direction perpendicular to the display surface, thereby improving the heat dissipation effect.
- the thermal conductivity of the first thermally conductive layer 131 in a direction parallel to the display surface is greater than the thermal conductivity of the second thermally conductive layer 132 in a direction parallel to the display surface. This can make the heat of the display panel relatively uniform in the direction parallel to the display surface, which is beneficial to improve the heat dissipation effect.
- the first thermally conductive layer 131 can include a layer of thermally conductive graphite.
- the first heat conductive layer 131 may include a graphene layer.
- the second thermally conductive layer 132 can include a metal layer.
- the second heat conductive layer may include at least one of a metal plating layer and a metal heat conductive patch.
- the second heat conductive layer may be a copper foil or a stainless steel sheet or the like.
- FIG. 1 shows that two heat conducting layers are disposed on the side of the display panel facing away from the display surface.
- the scope of the embodiments of the present disclosure is not limited thereto.
- more heat conducting layers such as three layers, four layers, etc., may be disposed on the side of the display panel facing away from the display surface.
- the heat conduction performance for example, thermal conductivity
- the heat conduction performance of the heat conduction layer close to the display panel in a direction parallel to the display surface is better than the heat conduction layer away from the display panel; and away from the display panel
- the thermal conductivity of the thermally conductive layer in a direction perpendicular to the display surface is superior to that of the thermal conductive layer adjacent to the display panel. This is beneficial to improve the heat dissipation effect.
- FIG. 2 is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- the heat sink 20 shown in FIG. 2 includes a first heat conductive layer 131 and a second heat conductive layer 132.
- the first heat conduction layer 131 is connected to the display panel 110.
- the first heat conduction layer 131 is provided with a through hole 1312.
- the second heat conduction layer 132 is connected to the first heat conduction layer 131.
- a portion of the second heat conductive layer 132 is connected to the substrate 111 of the display panel 110 through the through hole 1312.
- the orthographic projection of the first thermally conductive layer 131 on the display panel 110 is located inside the orthographic projection of the second thermally conductive layer 132 on the display panel 110. That is, the orthographic projection of the second heat conducting layer 132 on the display panel 110 completely covers the orthographic projection of the first heat conducting layer 131 on the display panel 110. In other words, the edge of the second heat conductive layer 132 exceeds the edge of the first heat conductive layer 131, as shown by the dotted line frame in FIG. 2 (in addition, reference may also be made to FIG. 7). Still further, the edge of the second heat conductive layer 132 covers the edge of the first heat conductive layer 131.
- a cover plate 240 is also shown in FIG.
- the cover 240 can be used to protect the display panel 110.
- the cover 240 may include a main body portion 241 that covers the display panel 110 and a side wall portion 242 that is coupled to the main body portion.
- the edge of the second thermally conductive layer 132 is coupled to the cover plate 240.
- the second heat conductive layer 132 may include a portion extending along a side surface of the side wall portion of the cover plate 240, the extended portion being coupled to the cover plate 240.
- FIG. 3 is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure.
- the structure shown in Fig. 3 is substantially similar to the structure shown in Fig. 2.
- the same or similar structures as those shown in FIG. 2 shown in FIG. 3 will not be described again.
- the heat sink 30 may further include a third heat conducting layer 350.
- the third heat conductive layer 350 may be disposed on the side wall portion 242 of the cap plate 240.
- the third heat conducting layer 350 is on a portion of the cover plate 240 near the edge.
- the third heat conductive layer 350 may be connected to the second heat conductive layer 132.
- the area of the side surface of the side wall portion of the cover plate is larger than the area of the side surface of the display panel. Providing a third heat conducting layer on the side wall portion of the cover plate can increase the radiation area of the cover plate radiating heat to the outside, thereby achieving a good heat dissipation effect.
- the third thermally conductive layer 350 is located within the area enclosed by the sidewall portion 242 of the cover plate 240 and is disposed on the sidewall portion 242 of the cover plate 240 in a circumferential manner. This can better serve the heat dissipation effect.
- the third heat conductive layer 350 may further extend beyond a connecting portion (not shown) of the side wall portion 242 and the main body portion 241 such that a portion of the third heat conductive layer may be on the display panel 110. On the surface, this can further improve the heat dissipation effect.
- the display panel 110 includes a display area 1101.
- the projection of the third heat conducting layer 350 on the substrate 111 of the display panel 110 does not overlap with the projection (eg, orthographic projection) of the display region 1101 of the display panel on the substrate 111.
- the third heat conductive layer 350 may include at least one of a metal plating layer (eg, copper or the like), a metal heat conductive patch, a thermally conductive ceramic patch, and a thermally conductive graphite layer (eg, a graphene layer).
- a metal plating layer eg, copper or the like
- a metal heat conductive patch e.g., copper or the like
- a thermally conductive ceramic patch e.g, copper or the like
- a thermally conductive graphite layer eg, a graphene layer
- FIG. 4A is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- the heat sink 40 may include a first heat conductive layer 131 and a second heat conductive layer 132.
- the first heat conduction layer 131 is located on a side of the display panel 110 facing away from the display surface, and is connected to the display panel 110 through the first connection layer 121 .
- the first heat conduction layer 131 is provided with a through hole 1312.
- the second heat conduction layer 132 is located on a side of the first heat conduction layer 131 away from the display panel 110 .
- the second heat conduction layer 132 is connected to the first heat conduction layer 131 through the second connection layer 122.
- a portion of the second heat conductive layer 132 is connected to the display panel 110 through the through hole 1312 , for example, to the substrate 111 of the display panel 110 .
- the thermal conductivity of the first heat conduction layer 131 in a direction parallel to the display surface is greater than the thermal conductivity of the first heat conduction layer 131 in a direction perpendicular to the display surface.
- the thermal conductivity of the second heat conduction layer 132 in a direction perpendicular to the display surface is greater than the thermal conductivity of the first heat conduction layer 131 in a direction perpendicular to the display surface.
- the first heat conducting layer is connected to the side of the display panel facing away from the display surface by the first connecting layer.
- a through hole is disposed on the first heat conduction layer.
- the second heat conducting layer is connected to a side of the first heat conducting layer remote from the display panel by using the second connecting layer.
- a portion of the second heat conductive layer is connected to the display panel through the through hole.
- the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface. This can make the heat of the display panel relatively uniform in the direction parallel to the display surface, preventing heat from being concentrated in a certain area, thereby facilitating the heat dissipation effect.
- the thermal conductivity of the second thermally conductive layer in a direction perpendicular to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface. This can enable these evenly distributed heat of the display panel to be transmitted through the second heat conducting layer in a direction perpendicular to the display surface, thereby improving the heat dissipation effect.
- the heat dissipating device can make the display panel dissipate heat relatively easily in different directions, thereby improving the heat dissipating effect.
- the display panel produces different amounts of heat in different areas of its operation. Different heats are concentrated in different areas, which will form different temperature zones on the panel, which will affect the display effect of the image.
- the related technology uses a single layer of heat dissipation layer to dissipate heat from the display panel, but the heat dissipation effect of the single layer heat dissipation layer is limited.
- different layers of thermally conductive layers are disposed on a side of the lower substrate of the display panel facing away from the display surface. Since different heat conducting layer materials have different thermal conductivity in different heat conducting directions, the heat conducting layers provided with different layers can take into account the heat conduction effects in different directions. This can improve the heat dissipation of the display panel.
- the thermal conductivity of the first thermally conductive layer 131 in a direction parallel to the display surface is greater than the thermal conductivity of the second thermally conductive layer 132 in a direction parallel to the display surface.
- the thermal conductivity of the first heat conducting layer in a direction parallel to the display surface is superior to that of the second heat conductive layer, which can make the heat of the display panel relatively uniform in a direction parallel to the display surface, preventing heat from accumulating in A certain area. Since the thermal conductivity of the second heat conduction layer in a direction perpendicular to the display surface is superior to that of the first heat conduction layer, the uniform distribution of heat of the display panel can be transmitted through the second heat conduction layer in a direction perpendicular to the display surface. , thereby improving the heat dissipation effect.
- the first thermally conductive layer 131 can include a layer of thermally conductive graphite.
- the first heat conductive layer 131 may include a graphene layer.
- the second thermally conductive layer 132 can include a metal layer.
- the second heat conductive layer may include at least one of a metal plating layer and a metal heat conductive patch.
- the second heat conductive layer may be a copper foil or a stainless steel sheet or the like.
- the first connection layer 121 and the second connection layer 122 may both be thermally conductive connection layers.
- the first connection layer 121 and the second connection layer 122 may both be glue layers.
- the glue layer as the first connection layer or the second connection layer is relatively thin (for example, several micrometers to ten micrometers), so that heat can be easily transferred.
- a portion of the second thermally conductive layer 132 passes through the via 1312 and is connected to the display panel 110 through the first connection layer 121 and the second connection layer 122.
- the second heat conductive layer 132 may include a convex portion that passes through the through hole 1312.
- the protruding portion may be connected to the substrate 111 of the display panel 110 through the first connection layer 121 and the second connection layer 122.
- FIG. 4B is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- the structure of the heat sink 40' shown in FIG. 4B is substantially similar to the structure of the heat sink 40 shown in FIG. 4A.
- the structure of the heat sink 40' shown in Fig. 4B differs from the structure of the heat sink 40 shown in Fig. 4A in that the first connection layer 121 is provided with a first opening 1212 corresponding to the through hole 1312.
- the first opening 1212 is aligned with the corresponding through hole 1312.
- a portion of the second heat conductive layer 132 passes through the through hole 1312 and the first opening 1212 and is connected to the display panel 110 through the second connection layer 122.
- the second heat conductive layer 132 may include a convex portion that passes through the through hole 1312 and the first opening 1212.
- the protruding portion may be connected to the substrate 111 of the display panel 110 through the second connection layer 122.
- FIG. 4C is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- the structure of the heat sink 40" shown in Fig. 4C is substantially similar to the structure of the heat sink 40 shown in Fig. 4A.
- the structure of the heat sink 40" shown in Fig. 4C is compared with the structure of the heat sink 40 shown in Fig. 4A.
- the difference is that the second connection layer 122 is provided with a second opening 1222 corresponding to the through hole 1312.
- the second opening 1222 is aligned with the corresponding through hole 1312.
- a portion of the second heat conductive layer 132 passes through the through hole 1312 and the second opening 1222 and is connected to the display panel 110 through the first connection layer 121.
- the second heat conductive layer 132 may include a convex portion that passes through the through hole 1312 and the second opening 1222.
- the protruding portion may be connected to the substrate 111 of the display panel 110 through the first connection layer 121.
- FIG. 5 is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure.
- the heat sink 50 shown in FIG. 5 includes a first heat conductive layer 131 and a second heat conductive layer 132.
- the first heat conduction layer 131 is connected to the display panel 110 through the first connection layer 121.
- the first heat conduction layer 131 is provided with a through hole 1312.
- the second heat conduction layer 132 is connected to the first heat conduction layer 131 through the second connection layer 122.
- a portion of the second heat conductive layer 132 is connected to the substrate 111 of the display panel 110 through the through hole 1312.
- the orthographic projection of the first thermally conductive layer 131 on the display panel is located inside the orthographic projection of the second thermally conductive layer 132 on the display panel.
- the edge of the second heat conductive layer 132 exceeds the edge of the first heat conductive layer 131, as shown by the dotted line frame in FIG. 5 (in addition, reference may also be made to FIG. 7).
- the edge of the second thermally conductive layer non-contactly covers the edge of the first thermally conductive layer.
- a cover plate 240 is also shown in FIG.
- the edge of the second thermally conductive layer 132 is coupled to the cover 240 for protecting the display panel 110 through a portion of the second connection layer 122.
- the second thermally conductive layer 132 can include a portion that extends along a side of the sidewall portion 242 of the cover plate 240. The extended portion is coupled to the cover plate 240 by a portion of the second connection layer 122.
- the second connection layer 122 is connected to the first connection layer 121, as shown in FIG.
- the heat of the display panel can be better transmitted, which has better heat dissipation effect, and the first heat conduction layer and the second heat conduction layer can be connected. More solid.
- FIG. 6 is a schematic cross-sectional view showing a heat sink for a display panel according to further embodiments of the present disclosure.
- the structure shown in Fig. 6 is substantially similar to the structure shown in Fig. 5.
- the same or similar structures as those shown in FIG. 5 shown in FIG. 6 will not be described again.
- the heat sink 60 may further include a third heat conducting layer 350.
- the third heat conductive layer 350 may be disposed on the side wall portion 242 of the cap plate 240.
- the third heat conducting layer 350 is on a portion of the cover plate 240 near the edge.
- the third heat conductive layer 350 may be connected to the second heat conductive layer 132 through the second connection layer 122.
- the area of the side surface of the side wall portion of the cover plate is larger than the area of the side surface of the display panel. Providing a third heat conducting layer on the side wall portion of the cover plate can increase the radiation area of the cover plate radiating heat to the outside, thereby achieving a good heat dissipation effect.
- the third thermally conductive layer 350 is located inside the area enclosed by the side wall portion 242 of the cover plate 240 and is disposed on the side wall portion of the cover plate 240 in a circumferential manner. This can better serve the heat dissipation effect.
- the third heat conductive layer 350 may further extend beyond a connecting portion (not shown) of the side wall portion 242 and the main body portion 241 such that a portion of the third heat conductive layer may be on the display panel 110. On the surface, this can further improve the heat dissipation effect.
- the projection of the third thermal conductive layer 350 on the substrate 111 of the display panel 110 does not overlap with the projection of the display region 1101 of the display panel on the substrate 111.
- the third heat conductive layer 350 may include at least one of a metal plating layer (eg, copper or the like), a metal heat conductive patch, a thermally conductive ceramic patch, and a thermally conductive graphite layer (eg, a graphene layer).
- a metal plating layer eg, copper or the like
- a metal heat conductive patch e.g., copper or the like
- a thermally conductive ceramic patch e.g, copper or the like
- a thermally conductive graphite layer eg, a graphene layer
- FIG. 7 is a top view showing a heat sink for a display panel according to further embodiments of the present disclosure.
- the edge of the second heat conductive layer 132 exceeds the edge of the first heat conductive layer 131.
- the orthographic projection of the first heat conducting layer 131 on the display panel 110 is located inside the orthographic projection of the second heat conducting layer 132 on the display panel 110.
- the first heat conduction layer 131 is provided with a plurality of through holes 1312 , for example, may be designed as an array of through holes.
- FIG. 8 is a flow chart illustrating a method of fabricating a heat sink for a display panel, in accordance with some embodiments of the present disclosure.
- FIG. 9 is a schematic cross-sectional view showing a structure according to some embodiments of the present disclosure at step S802 of FIG.
- the first heat conductive layer 131 may be formed on a side of the display panel 110 facing away from the display surface by a process such as deposition. Then, a through hole 1312 is formed in the first heat conductive layer 131 by etching or the like.
- FIG. 10 is a schematic cross-sectional view showing a structure according to still another embodiment of the present disclosure at step S802 of FIG.
- the first heat conduction layer 131 is connected to the side of the display panel 110 facing away from the display surface by the first connection layer 121.
- the first heat conductive layer 131 may be attached to the substrate 111 of the display panel.
- the first heat conduction layer 131 is provided with a through hole 1312.
- the first heat conducting layer 131 may be connected to the side of the display panel 110 facing away from the display surface by using the first connecting layer 121, and then the through hole 1312 is formed on the first heat conducting layer 131 by etching or the like, thereby forming The structure shown in FIG.
- step S804 the second heat conductive layer is disposed on a side of the first heat conductive layer away from the display panel. A portion of the second heat conductive layer is connected to the display panel through the through hole.
- FIG. 1 is a schematic cross-sectional view showing a structure according to some embodiments of the present disclosure at step S804 of FIG.
- a second thermally conductive layer 132 is formed on a side of the first thermally conductive layer 131 remote from the display panel 110, such as by deposition or the like.
- a portion of the second heat conductive layer 132 is connected to the display panel 110 through the through hole 1312.
- FIG. 4A is a schematic cross-sectional view showing a structure according to still another embodiment of the present disclosure at step S804 of FIG. 8.
- the second heat conduction layer 132 is connected to the side of the first heat conduction layer 131 away from the display panel 110 by the second connection layer 122.
- a portion of the second heat conductive layer 132 is connected to the display panel 110 through the through hole 1312.
- the thermal conductivity of the second thermally conductive layer in a direction perpendicular to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface. This can enable these evenly distributed heat of the display panel to be transmitted through the second heat conducting layer in a direction perpendicular to the display surface, thereby improving the heat dissipation effect.
- the manufacturing method may further include: providing a third heat conducting layer on a sidewall portion of the cover plate for protecting the display panel.
- a third heat conductive layer may be formed on the side wall portion of the cap plate by a process such as deposition and etching.
- the third thermally conductive layer can be joined to the second thermally conductive layer using a second tie layer.
- the third thermally conductive layer may be disposed on the side wall portion of the cover in a circumferential manner within a region enclosed by the side wall portion of the cover.
- the projection of the third thermally conductive layer on the substrate of the display panel does not overlap with the projection of the display area of the display panel on the substrate.
- a through hole is provided in the first heat conducting layer. In other embodiments, no through holes may be provided on the first heat conducting layer.
- a heat sink according to further embodiments of the present disclosure will be described below with reference to FIG.
- FIG. 11 is a schematic cross-sectional view showing a heat sink for a display panel in accordance with further embodiments of the present disclosure.
- the first heat conduction layer is disposed on a side of the display panel facing away from the display surface
- the second heat conduction layer is disposed on a side of the first heat conduction layer away from the display panel.
- the thermal conductivity of the first thermally conductive layer in a direction parallel to the display surface is greater than the thermal conductivity of the first thermally conductive layer in a direction perpendicular to the display surface. This can make the heat of the display panel relatively uniform in the direction parallel to the display surface, preventing heat from being concentrated in a certain area, thereby facilitating the heat dissipation effect.
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Abstract
Description
Claims (29)
- 一种用于显示面板的散热装置,包括:第一导热层,位于所述显示面板的背离显示面的一侧,所述第一导热层上设置有通孔;以及第二导热层,位于所述第一导热层的远离所述显示面板的一侧,所述第二导热层的一部分穿过所述通孔与所述显示面板连接;其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率;所述第二导热层在垂直于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率。
- 根据权利要求1所述的散热装置,其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第二导热层在平行于所述显示面的方向上的热导率。
- 根据权利要求2所述的散热装置,其中,所述第一导热层包括导热石墨层;所述第二导热层包括金属层。
- 根据权利要求1所述的散热装置,其中,所述第一导热层在所述显示面板上的正投影位于所述第二导热层在所述显示面板上的正投影的内部,所述第二导热层的边缘与用于保护显示面板的盖板连接。
- 根据权利要求4所述的散热装置,还包括:第三导热层,设置在所述盖板的侧壁部上,与所述第二导热层连接。
- 根据权利要求5所述的散热装置,其中,所述第三导热层位于由所述盖板的侧壁部所围成的区域内部且以环绕的方式设置在所述盖板的侧壁部上。
- 根据权利要求5所述的散热装置,其中,所述第三导热层在所述显示面板的基板上的投影与所述显示面板的显示区域在所述基板上的投影不重叠。
- 根据权利要求5所述的散热装置,其中,所述第三导热层包括:金属镀层、金属导热贴片、导热陶瓷贴片和导热石墨层的至少一种。
- 一种用于显示面板的散热装置,包括:第一导热层,位于所述显示面板的背离显示面的一侧,且通过第一连接层与所述显示面板连接,所述第一导热层上设置有通孔;以及第二导热层,位于所述第一导热层的远离所述显示面板的一侧,通过第二连接层与所述第一导热层连接,所述第二导热层的一部分穿过所述通孔与所述显示面板连接;其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率;所述第二导热层在垂直于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率。
- 根据权利要求9所述的散热装置,其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第二导热层在平行于所述显示面的方向上的热导率。
- 根据权利要求10所述的散热装置,其中,所述第一导热层包括导热石墨层;所述第二导热层包括金属层。
- 根据权利要求9所述的散热装置,其中,所述第一连接层和所述第二连接层均为导热连接层。
- 根据权利要求9至12任意一项所述的散热装置,其中,所述第一连接层和所述第二连接层均为胶连层。
- 根据权利要求9所述的散热装置,其中,所述第一导热层在所述显示面板上的正投影位于所述第二导热层在所述显示面板上的正投影的内部,所述第二导热层的边缘通过所述第二连接层的一部分与用于保护显示面板的盖板连接。
- 根据权利要求14所述的散热装置,还包括:第三导热层,设置在所述盖板的侧壁部上,与所述第二导热层通过所述第二连接层连接。
- 根据权利要求15所述的散热装置,其中,所述第三导热层位于由所述盖板的侧壁部所围成的区域内部且以环绕的方式设置在所述盖板的侧壁部上。
- 根据权利要求15所述的散热装置,其中,所述第三导热层在所述显示面板的基板上的投影与所述显示面板的显示区域在所述基板上的投影不重叠。
- 根据权利要求15所述的散热装置,其中,所述第三导热层包括:金属镀层、金属导热贴片、导热陶瓷贴片和导热石墨层的至少一种。
- 根据权利要求9所述的散热装置,其中,所述第二导热层的一部分穿过所述通孔并与所述显示面板通过所述第一连接层和所述第二连接层连接。
- 根据权利要求9所述的散热装置,其中,所述第一连接层上设置有与所述通孔对应的第一开口,所述第二导热层的一部分穿过所述通孔和所述第一开口并与所述显示面板通过所述第二连接层连接。
- 根据权利要求9所述的散热装置,其中,所述第二连接层上设置有与所述通孔对应的第二开口,所述第二导热层的一部分穿过所述通孔和所述第二开口并与所述显示面板通过所述第一连接层连接。
- 一种用于显示面板的散热装置,包括:第一导热层,位于所述显示面板的背离显示面的一侧;第二导热层,位于所述第一导热层的远离所述显示面板的一侧;其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率;所述第二导热层在垂直于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率。
- 根据权利要求22所述的散热装置,其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第二导热层在平行于所述显示面的方向上的热导率。
- 根据权利要求22所述的散热装置,其中,所述第一导热层通过第一连接层与所述显示面板连接;所述第二导热层通过第二连接层与所述第一导热层连接。
- 一种显示装置,包括:显示面板和如权利要求1至24任意一项所述的用于所述显示面板的散热装置。
- 一种散热装置的制造方法,包括:将第一导热层设置在显示面板的背离显示面的一侧,其中,所述第一导热层上设置有通孔;以及将第二导热层设置在所述第一导热层的远离所述显示面板的一侧,其中,所述第二导热层的一部分穿过所述通孔与所述显示面板连接;其中,所述第一导热层在平行于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率;所述第二导热层在垂直于所述显示面的方向上的热导率大于所述第一导热层在垂直于所述显示面的方向上的热导率。
- 根据权利要求26所述的制造方法,其中,利用第一连接层将所述第一导热层连接在所述显示面板的背离显示面的一侧;利用第二连接层将所述第二导热层连接在所述第一导热层的远离所述显示面板的一侧。
- 根据权利要求26所述的制造方法,其中,在将第二导热层设置在所述第一导热层的远离所述显示面板的一侧之前,所述制造方法还包括:在用于保护所述显示面板的盖板的侧壁部上设置第三导热层。
- 根据权利要求28所述的制造方法,其中,所述第三导热层在所述显示面板的基板上的投影与所述显示面板的显示区域在所述基板上的投影不重叠。
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US16/489,557 US11224149B2 (en) | 2018-03-27 | 2019-01-30 | Heat dissipating device for display panel, manufacturing method thereof and display device |
EP19756088.1A EP3780921B1 (en) | 2018-03-27 | 2019-01-30 | Heat dissipation device for display panel, manufacturing method thereof, and display device |
JP2019570409A JP2021516863A (ja) | 2018-03-27 | 2019-01-30 | 表示パネルに用いられる放熱装置及びその製造方法、表示装置 |
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CN201820416869.8U CN207939941U (zh) | 2018-03-27 | 2018-03-27 | 用于显示面板的散热装置和显示装置 |
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CN113140160B (zh) * | 2021-04-26 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | 显示模组 |
KR20230013964A (ko) * | 2021-07-20 | 2023-01-27 | 삼성전자주식회사 | 방열 구조를 포함하는 전자 장치 |
CN114495747B (zh) * | 2022-01-28 | 2024-02-02 | 北海惠科光电技术有限公司 | 散热结构及显示装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101014821A (zh) * | 2004-09-07 | 2007-08-08 | 先进能源科技公司 | 具有金属基底和石墨翼片的复合散热器 |
CN203554877U (zh) * | 2013-11-08 | 2014-04-16 | 昆山汉品电子有限公司 | 一种金属基双面碳复合导热材 |
CN203590668U (zh) * | 2013-11-26 | 2014-05-07 | 昆山汉品电子有限公司 | 复合散热薄膜 |
CN207939941U (zh) * | 2018-03-27 | 2018-10-02 | 京东方科技集团股份有限公司 | 用于显示面板的散热装置和显示装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW326087B (en) * | 1995-09-29 | 1998-02-01 | Intel Corp | Cooling system for computer systems |
JP3885246B2 (ja) * | 1996-01-12 | 2007-02-21 | 松下電器産業株式会社 | プラズマディスプレイパネル |
US6097597A (en) * | 1998-06-30 | 2000-08-01 | Mitsubishi Denki Kabushiki Kaisha | Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus |
GB9814835D0 (en) * | 1998-07-08 | 1998-09-09 | Europ Org For Nuclear Research | A thermal management board |
US6052280A (en) * | 1999-01-19 | 2000-04-18 | Alliedsignal Inc. | Carbon/carbon heat spreader |
KR100544129B1 (ko) * | 2003-09-01 | 2006-01-23 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
JP2005141194A (ja) * | 2003-10-14 | 2005-06-02 | Seiko Epson Corp | 補強構造体、表示装置、及び電子機器 |
US8400607B2 (en) * | 2005-10-11 | 2013-03-19 | Barco N.V. | Display assemblies and methods of display |
JP2007248689A (ja) * | 2006-03-15 | 2007-09-27 | Hitachi Displays Ltd | 表示装置 |
KR100759574B1 (ko) * | 2006-04-11 | 2007-09-18 | 삼성에스디아이 주식회사 | 플라즈마 표시장치 |
JP2007286527A (ja) * | 2006-04-20 | 2007-11-01 | Fujitsu Hitachi Plasma Display Ltd | 表示パネルを有する表示装置およびその解体方法 |
KR100849108B1 (ko) | 2006-12-08 | 2008-07-30 | 엘지전자 주식회사 | 플라즈마 디스플레이 장치 및 그에 따른 제조과정 |
JP4857253B2 (ja) * | 2007-12-07 | 2012-01-18 | 株式会社日立製作所 | 画像表示装置 |
US8636382B2 (en) * | 2009-06-25 | 2014-01-28 | Sharp Kabushiki Kaisha | Light source apparatus, image display apparatus and television receiving apparatus |
JP2011071375A (ja) | 2009-09-28 | 2011-04-07 | Dainippon Printing Co Ltd | 電磁波シールド材 |
US8391010B2 (en) * | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
JP2012146828A (ja) | 2011-01-12 | 2012-08-02 | Kyocera Corp | 放熱構造及び放熱部材 |
JP5791984B2 (ja) | 2011-07-13 | 2015-10-07 | 株式会社Joled | ディスプレイ装置 |
CN202354003U (zh) * | 2011-10-31 | 2012-07-25 | 深圳富泰宏精密工业有限公司 | 便携式电子装置 |
DE102011086196A1 (de) * | 2011-11-11 | 2013-05-16 | Mekra Lang Gmbh & Co. Kg | Monitor sowie Gehäuserückwand für einen Monitor |
CN204494234U (zh) | 2015-04-14 | 2015-07-22 | 京东方科技集团股份有限公司 | 一种背光模组及显示装置 |
KR20160012703A (ko) | 2014-07-25 | 2016-02-03 | 삼성전자주식회사 | 발열 부품을 포함하는 전자 장치 |
KR20160070243A (ko) | 2014-12-09 | 2016-06-20 | (주)엘지하우시스 | 방열시트 |
CN205809778U (zh) * | 2016-05-31 | 2016-12-14 | 京东方科技集团股份有限公司 | 移动显示设备 |
KR101743022B1 (ko) * | 2016-10-31 | 2017-06-02 | 신화인터텍 주식회사 | 방열 시트 및 그 제조 방법 |
CN107507518A (zh) | 2017-09-05 | 2017-12-22 | 武汉华星光电半导体显示技术有限公司 | 柔性显示装置 |
-
2018
- 2018-03-27 CN CN201820416869.8U patent/CN207939941U/zh active Active
-
2019
- 2019-01-30 EP EP19756088.1A patent/EP3780921B1/en active Active
- 2019-01-30 WO PCT/CN2019/073956 patent/WO2019184591A1/zh unknown
- 2019-01-30 US US16/489,557 patent/US11224149B2/en active Active
- 2019-01-30 JP JP2019570409A patent/JP2021516863A/ja active Pending
- 2019-01-30 KR KR1020197037476A patent/KR102309283B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101014821A (zh) * | 2004-09-07 | 2007-08-08 | 先进能源科技公司 | 具有金属基底和石墨翼片的复合散热器 |
CN203554877U (zh) * | 2013-11-08 | 2014-04-16 | 昆山汉品电子有限公司 | 一种金属基双面碳复合导热材 |
CN203590668U (zh) * | 2013-11-26 | 2014-05-07 | 昆山汉品电子有限公司 | 复合散热薄膜 |
CN207939941U (zh) * | 2018-03-27 | 2018-10-02 | 京东方科技集团股份有限公司 | 用于显示面板的散热装置和显示装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3780921A4 * |
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