WO2018123537A1 - 感放射線性組成物、パターン形成方法及び金属酸化物 - Google Patents
感放射線性組成物、パターン形成方法及び金属酸化物 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F30/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F30/04—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/42—Introducing metal atoms or metal-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
Definitions
- the present invention relates to a radiation-sensitive composition, a pattern formation method, and a metal oxide.
- Radiation sensitive compositions used for microfabrication by lithography include electromagnetic waves such as deep ultraviolet rays (ArF excimer laser light, KrF excimer laser light, etc.), extreme ultraviolet rays (EUV: Extreme Ultraviolet), and charged particle beams such as electron beams.
- electromagnetic waves such as deep ultraviolet rays (ArF excimer laser light, KrF excimer laser light, etc.), extreme ultraviolet rays (EUV: Extreme Ultraviolet), and charged particle beams such as electron beams.
- Such radiation-sensitive compositions are required to improve resist performance as processing technology becomes finer.
- the types and molecular structures of polymers, acid generators and other components used in the composition have been studied, and further their combinations have been studied in detail (Japanese Patent Laid-Open No. 11-125907, (See JP-A-8-146610 and JP-A-2000-298347).
- the radiation-sensitive composition is required to further improve various resist performances, especially when exposed to electron beams, EUV, etc. It is required that sensitivity can be exhibited.
- the conventional radiation-sensitive composition cannot satisfy this requirement.
- the present invention has been made based on the above situation, and an object thereof is to provide a radiation-sensitive composition having excellent sensitivity.
- the invention made in order to solve the said subject is a radiation sensitive composition containing the metal oxide which has a structural unit represented by following formula (1), and a solvent.
- M is germanium, tin, or lead.
- R 1 is a carbon that includes at least one of a group having an unsaturated bond and an electron-withdrawing group, and is bonded to M by a carbon atom.
- It is a monovalent organic group of several 30 or less.
- Another invention made in order to solve the above-described problems includes a step of forming a film on a substrate by applying the above-mentioned radiation-sensitive composition, a step of exposing the film, and the exposed film And a step of developing the pattern.
- M is germanium, tin, or lead.
- R 1 is a carbon that includes at least one of a group having an unsaturated bond and an electron-withdrawing group, and is bonded to M by a carbon atom. (It is a monovalent organic group of several 30 or less.)
- metal oxide refers to a compound containing at least a metal atom and an oxygen atom.
- organic group is a group having at least one carbon atom.
- the radiation-sensitive composition and pattern formation method of the present invention can form a pattern while exhibiting excellent sensitivity.
- the metal oxide of this invention can be used suitably as a raw material of the said radiation sensitive composition. Therefore, these can be suitably used for manufacturing semiconductor devices that are expected to be further miniaturized in the future.
- the radiation-sensitive composition is also referred to as a metal oxide (hereinafter referred to as “[A] metal oxide”) having a structural unit represented by the following formula (1) (hereinafter also referred to as “structural unit (I)”). ) And a solvent (hereinafter also referred to as “[B] solvent”).
- the radiation-sensitive composition is an arbitrary one such as a radiation-sensitive base generator (hereinafter also referred to as “[C] base generator”), [D] surfactant, etc., as long as the effects of the present invention are not impaired. You may further contain a component.
- the said radiation sensitive composition can be used suitably for the pattern formation method exposed with extreme ultraviolet rays or an electron beam. Hereinafter, each component will be described.
- the metal oxide has a structural unit (I).
- the metal oxide may further have an arbitrary structural unit such as structural units (II) to (IV) described later.
- the said radiation sensitive composition can use [A] metal oxide individually by 1 type or in combination of 2 or more types.
- a metal oxide becomes a main component of a film formed from the radiation-sensitive composition.
- the “main component” is a component having the largest content, for example, a component having a content of 50% by mass or more.
- the said radiation sensitive composition is excellent in a sensitivity because [A] metal oxide has structural unit (I).
- the reason why the radiation-sensitive composition has the above-described configuration provides the above-mentioned effect is not necessarily clear, but can be inferred as follows, for example. That is, [A] a metal oxide, when subjected to the action of exposure light such as EUV or electron beam, between the metal atom represented by M and the group represented by R 1 in the following formula (1) It is considered that the metal-carbon covalent bond is cleaved to generate radicalization (elimination of the group represented by R 1 ).
- the radicalized [A] metal oxides are bonded to each other to increase the molecular weight, so that the solubility in the developer changes and the pattern changes. It is thought that formation becomes possible.
- the metal-carbon covalent bond contained in the structural unit (I) is a bond between a carbon atom and germanium, tin, or lead that is the same group (group 14) as the carbon atom in the periodic table. It is considered that it is difficult to ionize because of its relatively stable polarization and relatively small polarization.
- the group represented by R 1 contained in the structural unit (I) includes a group having an unsaturated bond and / or an electron withdrawing group, and thus is relatively stable even when radicalized. Conceivable.
- the radiation-sensitive composition can promote the high molecular weight at the time of exposure while suppressing the high molecular weight of the metal oxide [A] in the unexposed state. It is considered that excellent sensitivity can be exhibited while having sufficient stability as a radiation composition.
- M is germanium, tin, or lead.
- R 1 is a monovalent organic group having 30 or less carbon atoms, which includes at least one of an unsaturated bond group and an electron withdrawing group, and is bonded to M with a carbon atom.
- M is preferably tin.
- the monovalent organic group represented by R 1 may include a group having a plurality of unsaturated bonds, or may include a plurality of electron withdrawing groups.
- the upper limit of the carbon number in the monovalent organic group represented by R 1 is preferably 20, more preferably 10, and even more preferably 5.
- Examples of the group having an unsaturated bond in R 1 include an aromatic group, an ethylenic double bond-containing group, and an acetylenic triple bond-containing group.
- An aromatic group is a group containing one or more aromatic rings, for example, an aryl group such as a phenyl group, a tolyl group, a xylyl group, a naphthyl group, an anthryl group; A substituted aryl group in which part or all of the hydrogen atoms of the aryl group are substituted with a heteroatom-containing group; Arylene groups having 6 to 30 carbon atoms such as a phenylene group, a tolylene group, a xylylene group, a naphthylene group and an anthrene group; Examples thereof include a substituted arylene group in which part or all of the hydrogen atoms of the arylene group are substituted with a hetero atom-containing group.
- hetero atom-containing group that replaces the aryl group and arylene group examples include halogen atoms such as fluorine atom, chlorine atom, bromine atom, iodine atom, hydroxy group, carboxy group, cyano group, amino group, sulfanyl group (—SH ) And the like.
- Examples of the ethylenic double bond-containing group include alkenyl groups having 2 to 30 carbon atoms such as ethenyl group, propenyl group, butenyl group; Alkenediyl groups having 2 to 30 carbon atoms such as ethenediyl group, propenediyl group, butenediyl group; Examples thereof include an alicyclic unsaturated hydrocarbon group having 3 to 30 carbon atoms having a double bond such as a cyclopropenyl group, a cyclopentenyl group, a cyclohexenyl group and a norbornenyl group.
- the “hydrocarbon group” includes a chain hydrocarbon group, an alicyclic hydrocarbon group, and an aromatic hydrocarbon group.
- the “hydrocarbon group” may be a saturated hydrocarbon group or an unsaturated hydrocarbon group.
- the “chain hydrocarbon group” refers to a hydrocarbon group that does not include a cyclic structure but includes only a chain structure, and includes both a linear hydrocarbon group and a branched hydrocarbon group.
- alicyclic hydrocarbon group refers to a hydrocarbon group that includes only an alicyclic structure as a ring structure and does not include an aromatic ring structure, and includes a monocyclic alicyclic hydrocarbon group and a polycyclic alicyclic group. Includes both hydrocarbon groups.
- alicyclic hydrocarbon group does not need to be composed only of the alicyclic structure, and a part thereof may include a chain structure.
- “Aromatic hydrocarbon group” refers to a hydrocarbon group containing an aromatic ring structure as a ring structure.
- the aromatic hydrocarbon group does not need to be composed only of an aromatic ring structure, and a part thereof may include a chain structure or an alicyclic structure.
- Examples of the acetylenic triple bond-containing group include alkynyl groups having 2 to 30 carbon atoms such as ethynyl group, propynyl group, butynyl group; Examples thereof include alkynediyl groups having 2 to 30 carbon atoms such as ethynediyl group, propynediyl group and butynediyl group.
- an aromatic group and an ethylenic double bond-containing group are preferable, an aryl group and an alkenyl group are more preferable, and a phenyl group and an ethenyl group are further preferable.
- Examples of the electron withdrawing group contained in R 1 include a cyano group, a nitro group, a halogenated alkyl group, —COO—, a cationic group, an alkoxy group, —SO 2 — and the like.
- the upper limit of the number of carbon atoms of the halogenated alkyl group, the cationic group, and the alkoxy group is not particularly limited, but is preferably 30, more preferably 10, and even more preferably 3.
- halogenated alkyl group examples include a fluorinated alkyl group, an alkyl chloride group, an alkyl bromide group, etc. Among them, a fluorinated alkyl group is preferred, a perfluoroalkyl group is more preferred, and a trifluoromethyl group is preferred. Further preferred.
- Examples of the cationic group include an ammonium group, a phosphonium group, a sulfonium group, an iodonium group, a diazonium group, and the like.
- alkoxy group examples include a methoxy group, an ethoxy group, an n-propoxy group, and an i-propoxy group.
- a cyano group As the electron withdrawing group, a cyano group, a nitro group, a halogenated alkyl group, —COO— and a cationic group are preferable.
- a structural unit (I-1) represented by the following formula (1-1) is preferable.
- R 1A is a monovalent organic group having 2 to 29 carbon atoms including a group having an unsaturated bond, and bonded to one of the carbon atoms constituting the unsaturated bond to the carbon atom bonded to M.
- R X1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. n is an integer of 1 to 3. If R 1A there are a plurality, the plurality of R 1A may be the same or different. If R X1 there is a plurality, the plurality of R X1 may be the same or different.
- the alkyl group having 1 to 5 carbon atoms represented by R X1 is a methyl group, an ethyl group, a propyl group, an i-propyl group, an n-butyl group, a sec-butyl group, Examples thereof include alkyl groups having 1 to 5 carbon atoms such as isobutyl group and tert-butyl group. Among these, a hydrogen atom, a methyl group, and an ethyl group are preferable.
- the first substituent may include a group having a plurality of unsaturated bonds, and may include one or a plurality of electron-withdrawing groups.
- the second substituent may include a plurality of electron withdrawing groups, or may include a group having one or more unsaturated bonds.
- Examples of the first substituent represented by R 1A include groups represented by the following formulas (A-1) to (A-3).
- R 2A ⁇ R 4A are each independently a monovalent organic group having 1-27 hydrogen atoms or carbon atoms, or two or more of these groups with each other It represents a ring structure having 3 to 30 ring members which is formed together with the carbon atom or carbon chain to which these are bonded.
- R 5A is a monovalent organic group having 1 to 27 carbon atoms.
- Ar is a substituted or unsubstituted aryl group having 6 to 29 carbon atoms.
- the “number of ring members” means the number of atoms constituting the ring of the aromatic ring structure, aromatic heterocyclic structure, alicyclic structure and aliphatic heterocyclic structure. In the case of a polycyclic ring structure, The number of atoms that constitute
- the carbon number of the monovalent organic group represented by R 2A to R 5A is preferably 1 to 20, more preferably 1 to 10, and still more preferably 1 to 3.
- Examples of the monovalent organic group represented by R 2A to R 5A include, for example, a monovalent hydrocarbon group having 1 to 27 carbon atoms, a divalent organic group at the carbon-carbon end of the hydrocarbon group or the terminal on the bond side.
- Examples include a group ( ⁇ ) containing a heteroatom-containing group, a group obtained by substituting part or all of the hydrogen atoms of the hydrocarbon group and group ( ⁇ ) with a monovalent heteroatom-containing group.
- Examples of the monovalent hydrocarbon group having 1 to 27 carbon atoms include a monovalent chain hydrocarbon group having 1 to 27 carbon atoms, a monovalent alicyclic hydrocarbon group having 3 to 27 carbon atoms, and 6 carbon atoms. To 27 monovalent aromatic hydrocarbon groups.
- Examples of the monovalent chain hydrocarbon group having 1 to 27 carbon atoms include alkyl groups such as a methyl group, an ethyl group, an n-propyl group, and an i-propyl group; An alkenyl group such as an ethenyl group, a propenyl group, a butenyl group; Examples thereof include alkynyl groups such as ethynyl group, propynyl group and butynyl group.
- Examples of the monovalent alicyclic hydrocarbon group having 3 to 27 carbon atoms include monocyclic alicyclic saturated hydrocarbon groups such as a cyclopentyl group and a cyclohexyl group; Monocyclic alicyclic unsaturated hydrocarbon groups such as cyclopentenyl group and cyclohexenyl group; Polycyclic alicyclic saturated hydrocarbon groups such as norbornyl group, adamantyl group and tricyclodecyl group; Examples thereof include polycyclic alicyclic unsaturated hydrocarbon groups such as a norbornenyl group and a tricyclodecenyl group.
- Examples of the monovalent aromatic hydrocarbon group having 6 to 27 carbon atoms include aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group and anthryl group; Examples thereof include aralkyl groups such as benzyl group, phenethyl group, naphthylmethyl group and anthrylmethyl group.
- hetero atom constituting the monovalent heteroatom-containing group and the divalent heteroatom-containing group examples include an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, and a halogen atom.
- halogen atom examples include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- Examples of the divalent heteroatom-containing group include —O—, —CO—, —S—, —SO 2 —, —CS—, —NR′—, a group in which two or more of these are combined, and the like. It is done.
- R ′ is a hydrogen atom or a monovalent hydrocarbon group.
- Examples of the monovalent heteroatom-containing group include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom, hydroxy group, carboxy group, cyano group, amino group and sulfanyl group (—SH). .
- Examples of the ring structure having 3 to 30 ring members constituted by a carbon atom or a carbon chain to which two or more of R 2A to R 4A are combined and bonded to each other include an alicyclic structure such as a cycloalkane structure, a lactone Examples include an aliphatic heterocyclic structure such as a ring structure.
- R 2A to R 5A are preferably a hydrogen atom and a monovalent hydrocarbon group, more preferably a hydrogen atom and a monovalent chain hydrocarbon group, still more preferably a hydrogen atom and an alkyl group, and particularly preferably a hydrogen atom.
- Examples of the aryl group represented by Ar and its substituent include the same groups as the aryl group exemplified in the above formula (1).
- the number of carbon atoms of the aryl group represented by Ar is preferably 6 to 20, and more preferably 6 to 10.
- a phenyl group is preferable.
- Examples of the second substituent represented by R 1A include a group represented by the following formula (A-4).
- W is a divalent electron withdrawing group.
- R 6A is an organic group having 1 to 29 carbon atoms.
- Examples of the divalent electron withdrawing group represented by W include —COO—, —CH 2 COO—, —SO 2 — and the like.
- Examples of the monovalent organic group represented by R 6A include the same groups as the monovalent organic groups exemplified in R 2A to R 5A .
- the number of carbon atoms of the monovalent organic group represented by R 6A is preferably 1-20, more preferably 1-10, and still more preferably 1-3.
- the monovalent organic group represented by R 6A is preferably a monovalent hydrocarbon group, more preferably a monovalent chain hydrocarbon group, still more preferably an alkyl group, and particularly preferably a methyl group.
- the lower limit of the content ratio of the structural unit (I) with respect to all structural units constituting the metal oxide is preferably 20 mol%, more preferably 50 mol%, and even more preferably 70 mol%.
- an upper limit of the said content rate 99 mol% is preferable and 90 mol% is more preferable.
- the monovalent electron-withdrawing group represented by R 1A for example, those of monovalent among those exemplified as the electron withdrawing group of R 1 in the formula (1), i.e. a cyano group, a nitro group, a halogen Alkyl group, cationic group, alkoxy group and the like.
- n is preferably 1 or 2, and more preferably 1.
- Examples of the structural unit (I) include a structural unit represented by the following formula.
- M is synonymous with the above formula (1).
- the metal oxide may have a structural unit (II) represented by the following formula (2).
- the lower limit of the content ratio of the structural unit (II) with respect to all structural units constituting the [A] metal oxide is preferably 1 mol%, and 3 mol % Is more preferable, and 5 mol% is more preferable.
- an upper limit of the said content rate 50 mol% is preferable and 30 mol% is more preferable.
- the metal oxide may have a structural unit (III) represented by the following formula (3).
- M is synonymous with said formula (1).
- R 2 and R 3 are each independently a monovalent organic group having 1 to 30 carbon atoms bonded to M through a carbon atom.
- Examples of the monovalent organic group represented by R 2 and R 3 include a bond among the organic groups exemplified in relation to R 2A to R 5A in the above formulas (A-1) to (A-2). Examples thereof include those having a carbon atom at the end on the hand side.
- the monovalent organic group represented by R 2 and R 3 is preferably the same group as the group represented by R 1 in the above formula (1).
- —C (R X1 ) 3-n- (R 1A ) A group similar to the group represented by n is more preferable.
- Examples of the structural unit (III) include a structural unit represented by the following formula.
- M is synonymous with the above formula (1).
- the lower limit of the content ratio of the structural unit (III) to all structural units constituting the [A] metal oxide is preferably 1 mol%, and 3 mol % Is more preferable, and 5 mol% is more preferable.
- an upper limit of the said content rate 50 mol% is preferable and 30 mol% is more preferable.
- the metal oxide may have a structural unit (IV) represented by the following formula (4).
- R 4 to R 6 are each independently a monovalent organic group having 1 to 30 carbon atoms bonded to M through a carbon atom.
- Examples of the monovalent organic group represented by R 4 to R 6 may be the same groups as the organic groups exemplified in the above formula (3).
- the monovalent organic group represented by R 4 to R 6 may be the same group as the group represented by R 1 in the above formula (1).
- the lower limit of the carbon number of the monovalent organic group represented by R 4 to R 6 is preferably 2, and more preferably 3.
- the upper limit of the carbon number is preferably 10, and more preferably 5.
- the monovalent organic group represented by R 4 to R 6 is preferably a monovalent hydrocarbon group, more preferably a monovalent chain hydrocarbon group, and still more preferably an alkyl group.
- Examples of the structural unit (IV) include a tributyltin oxide structure represented by the following formula.
- M is synonymous with the above formula (1).
- the lower limit of the content ratio of the structural unit (IV) to all structural units constituting the [A] metal oxide is preferably 1 mol%, and 3 mol % Is more preferable, and 5 mol% is more preferable.
- an upper limit of the said content rate 30 mol% is preferable and 20 mol% is more preferable.
- the metal oxide may have other structural units other than the structural units (I) to (IV).
- the other structural unit for example, a structural unit represented by (R 7 -MO 3/2 ) (R 7 does not correspond to the organic group represented by R 1 , and is bonded to M by a carbon atom.
- the upper limit of the content ratio of the other structural units with respect to all the structural units constituting the metal oxide is, for example, 10 mol%.
- the lower limit of the weight average molecular weight (Mw) of the metal oxide is preferably 700, more preferably 1,000, still more preferably 1,200, and particularly preferably 1,400.
- the upper limit of the Mw is preferably 20,000, more preferably 10,000, further preferably 8,000, and particularly preferably 7,000.
- Mw of [A] metal oxide is a value measured using gel permeation chromatography (GPC) under the following conditions.
- GPC column For example, two “G2000HXL”, one “G3000HXL” and one “G4000HXL” manufactured by Tosoh Corporation Column temperature: 40 ° C.
- Elution solvent Tetrahydrofuran Flow rate: 1.0 mL / min Sample concentration: 1.0% by mass
- Detector Differential refractometer Standard material: Monodisperse polystyrene
- the lower limit of the metal oxide content in terms of solid content in the radiation-sensitive composition is preferably 50% by mass, preferably 70% by mass, and more preferably 90% by mass.
- the “solid content” refers to components other than the [B] solvent in the radiation-sensitive composition.
- the metal oxide is a compound (i) represented by the following formula (i) or condensation of this compound (i) in the presence of a catalyst such as a quaternary ammonium salt such as tetramethylammonium hydroxide. It can be obtained by a condensation reaction using a condensate (ii) having a partial structure represented by the following formula (ii) obtained by In addition, the condensate (ii) may have the structural unit (I).
- M and R 1 are as defined in the above formula (1).
- J is independently a halogen atom, a hydroxy group, an ethynyl group, an ethynyl group substituted with a monovalent hydrocarbon group having 1 to 20 carbon atoms, a group represented by —OR B , or —N (R B ) is a group represented by 3 .
- R B is a monovalent organic group. If R B is plural, R B may be the same or different.
- a is 1 or 2.
- Examples of the halogen atom represented by J include a chlorine atom, a fluorine atom, and an iodine atom, and a chlorine atom is preferable.
- Examples of the monovalent hydrocarbon group for substituting the ethynyl group include the same groups as those exemplified for R 2A to R 5A .
- the monovalent organic group represented by R B is preferably a monovalent hydrocarbon group, more preferably a monovalent chain hydrocarbon group, and further preferably an alkyl group.
- the lower limit of the carbon atoms of the monovalent organic group represented by R B, 2 is preferable.
- the upper limit of the carbon number is preferably 10, and more preferably 5.
- M and R 2 to R 6 have the same meanings as the above formulas (2) to (4).
- J is synonymous with the above formulas (i) to (ii).
- a solvent will not be specifically limited if it is a solvent which can melt
- Examples of the solvent include organic solvents such as alcohol solvents, ether solvents, ketone solvents, amide solvents, ester solvents, hydrocarbon solvents, and the like.
- organic solvent an alcohol solvent is preferable.
- alcohol solvents examples include monoalcohol solvents such as methanol, ethanol, n-propanol, iso-propanol, n-butanol, iso-butanol, sec-butanol, tert-butanol, and 4-methyl-2-pentanol; Polyhydric alcohol solvents such as ethylene glycol, 1,2-propylene glycol, 1,3-butylene glycol; Examples thereof include polyhydric alcohol partial ether solvents such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether.
- monoalcohol solvents such as methanol, ethanol, n-propanol, iso-propanol, n-butanol, iso-butanol, sec-butanol, tert-butanol, and 4-methyl-2-pentanol
- organic solvent for example, the solvents described in paragraphs [0201] to [0206] of JP-A-2016-28274 can be used.
- the solvent may be a mixed solvent containing the organic solvent as a main component and containing a small amount of water.
- the solvent is such a mixed solvent, [A] the metal oxide can be hydrated, and as a result, the storage stability of the radiation-sensitive composition can be improved. In addition, high molecular weight of [A] metal oxide can be promoted during pattern formation.
- the lower limit of the water content in this mixed solvent is preferably 0.01% by mass, more preferably 0.1% by mass, and even more preferably 1% by mass.
- the upper limit of the water content is preferably 20% by mass, and more preferably 10% by mass. If the water content exceeds the above upper limit, the storage stability may be lowered, and the uniformity of the formed film may be lowered.
- the solvent is preferably an organic solvent, more preferably an alcohol solvent.
- the carbon number of the alcohol solvent is preferably 1 or more and 10 or less.
- the radiation-sensitive composition may contain one or more [B] solvents.
- the base generator generates a base in the exposed portion by direct action of exposure light or action of secondary electrons generated from the metal oxide [A] due to exposure light.
- the radiation-sensitive composition contains the [C] base generator, it is possible to promote the high molecular weight of the [A] metal oxide in the exposed portion by the base, and as a result, the radiation sensitivity. It is considered that the sensitivity of the composition can be further improved.
- the radiation sensitive composition contains the [C] base generator in the form of a free compound (hereinafter referred to as “[C] base generator” as appropriate), and a part of [A] metal oxide. Or may be both of these forms.
- Base generators include, for example, complexes of transition metals such as cobalt (hereinafter also referred to as “transition metal complexes”), nitrobenzyl carbamates, ⁇ , ⁇ -dimethyl-3,5-dimethoxybenzyl carbamates, acyloxy Examples include iminos and 2-nitrobenzyl cyclohexyl carbamate.
- transition metal complexes such as cobalt (hereinafter also referred to as “transition metal complexes”), nitrobenzyl carbamates, ⁇ , ⁇ -dimethyl-3,5-dimethoxybenzyl carbamates, acyloxy Examples include iminos and 2-nitrobenzyl cyclohexyl carbamate.
- Specific examples of the base generator include compounds described in paragraphs [0272] to [0276] of JP-A No. 2016-200698.
- the said radiation sensitive composition contains a [C] base generator
- a [C] base generator as a minimum of content of [C] base generator with respect to 100 mass parts of [A] metal oxides, 0.1 mass part is preferable, 1 part by mass is more preferred, and 3 parts by mass is still more preferred.
- 10 mass parts is preferable and 5 mass parts is more preferable.
- Surfactant has the effect of improving the coating property, striation, developability and the like of the radiation-sensitive composition.
- a nonionic surfactant is preferable.
- specific examples of the surfactant for example, those described in paragraph [0140] of JP-A-2009-134088, a nonionic acetylene group-containing surfactant, and the like can be used.
- Surfactant can be used individually by 1 type or in combination of 2 or more types.
- the said radiation sensitive composition contains [D] surfactant
- the upper limit of the content is preferably 1 part by mass, and more preferably 0.5 parts by mass.
- the radiation-sensitive composition may contain, for example, an acid generator, an acid diffusion controller, a fluorine atom-containing polymer, etc. as other optional components.
- the said radiation sensitive composition contains a [C] base generator, an acid generator is not normally contained.
- the said radiation sensitive composition may contain 1 type, or 2 or more types of arbitrary components, respectively.
- the acid generator is a substance that generates an acid in the exposed portion by the action of exposure light or the like.
- the radiation-sensitive composition contains an acid generator, the high molecular weight of the metal oxide [A] in the exposed portion can be promoted by the acid, and as a result, the sensitivity can be further improved. It is considered possible.
- the acid generator in the radiation-sensitive composition may be in the form of a low molecular compound (hereinafter also referred to as “acid generator” as appropriate), or a form incorporated as part of [A] metal oxide or the like. However, both forms may be used.
- Examples of the acid generator include onium salt compounds, N-sulfonyloxyimide compounds, halogen-containing compounds, diazoketone compounds, and the like.
- onium salt compounds examples include sulfonium salts, tetrahydrothiophenium salts, iodonium salts, phosphonium salts, diazonium salts, pyridinium salts, and the like.
- acid generator examples include compounds described in paragraphs [0080] to [0113] of JP-A-2009-134088.
- the said radiation sensitive composition contains an acid generator
- content of the acid generator with respect to 100 mass parts of [A] metal oxides it can be set as 0.1 to 30 mass parts, for example. .
- the acid diffusion control body controls the diffusion phenomenon in the film of the acid generated from the acid generator and the like by exposure, and has an effect of suppressing an undesirable chemical reaction in the unexposed area. Moreover, while improving the storage stability of the said radiation sensitive composition, the resolution is improved. Furthermore, in pattern formation using the radiation-sensitive composition, it is possible to suppress a change in the line width of the pattern due to a change in the holding time from exposure to development processing, that is, process stability can be improved.
- a form of a free compound hereinafter referred to as “acid diffusion controller” as appropriate
- Examples of the acid diffusion controller include compounds having one nitrogen atom in the same molecule, compounds having two nitrogen atoms in the same molecule, compounds having three nitrogen atoms, amide group-containing compounds, urea compounds, nitrogen-containing compounds And heterocyclic compounds. Further, as the acid diffusion controlling agent, a photodegradable base that is sensitized by exposure to generate a weak acid can also be used.
- acid diffusion controller examples include compounds described in paragraphs [0189] to [0197] of JP-A-2016-28274.
- the said radiation sensitive composition contains an acid diffusion control agent
- content of the acid diffusion control agent with respect to 100 mass parts of [A] metal oxides they shall be 0.1 mass part or more and 20 mass parts or less, for example. Can do.
- the radiation-sensitive composition contains, for example, [A] metal oxide and [B] solvent and optional components such as [C] base generator and [D] surfactant used as necessary at a predetermined ratio. And preferably by filtering the obtained mixture through a membrane filter having a pore size of about 0.2 ⁇ m.
- the lower limit of the solid content concentration of the radiation-sensitive composition is preferably 0.1% by mass, more preferably 0.5% by mass, further preferably 1% by mass, and particularly preferably 1.5% by mass.
- the upper limit of the solid content concentration is preferably 50% by mass, more preferably 30% by mass, further preferably 10% by mass, and particularly preferably 5% by mass.
- the pattern forming method includes a step of forming a film by coating the radiation-sensitive composition on a substrate (hereinafter also referred to as “coating step”) and a step of exposing the film (hereinafter referred to as “exposure step”). And a step of developing the exposed film (hereinafter also referred to as “developing step”).
- coating step a step of forming a film by coating the radiation-sensitive composition on a substrate
- exposure step a step of exposing the film
- developing step a step of developing the exposed film
- a film is formed by applying the radiation-sensitive composition to the substrate.
- the radiation-sensitive composition is usually applied to one surface side of the substrate.
- suitable coating means such as spin coating, cast coating, roll coating, are employable.
- the [B] solvent in the film is volatilized by pre-baking (PB) as necessary.
- PB pre-baking
- the substrate include a silicon wafer and a wafer coated with aluminum.
- the lower limit of the average thickness of the film is preferably 1 nm, more preferably 10 nm, still more preferably 20 nm, and particularly preferably 30 nm.
- the upper limit of the average thickness is preferably 1,000 nm, more preferably 200 nm, still more preferably 100 nm, and particularly preferably 70 nm.
- the lower limit of the PB temperature is preferably 60 ° C, more preferably 80 ° C.
- 140 degreeC is preferable and 120 degreeC is more preferable.
- the lower limit of the PB time is preferably 5 seconds, and more preferably 10 seconds.
- the upper limit of the PB time is preferably 600 seconds, and more preferably 300 seconds.
- an organic or inorganic antireflection film can be formed in advance on a substrate to be used.
- a protective film can be provided on the film formed in this step, for example.
- an immersion protective film may be provided on the film formed in this step, for example, in order to avoid direct contact between the immersion medium and the film.
- the film is exposed.
- This exposure is performed by irradiating with radiation through a mask having a predetermined pattern with an immersion medium such as water as the case may be.
- the radiation include visible light, ultraviolet light, far ultraviolet light, vacuum ultraviolet light (EUV; wavelength 13.5 nm), electromagnetic waves such as X-rays and ⁇ -rays, and charged particle beams such as electron beams and ⁇ -rays.
- EUV vacuum ultraviolet light
- EUV electron beam
- post-exposure baking may be performed after exposure.
- PEB post-exposure baking
- 50 degreeC is preferable and 80 degreeC is more preferable.
- an upper limit of the temperature of PEB 180 degreeC is preferable and 130 degreeC is more preferable.
- the lower limit of the PEB time is preferably 5 seconds, and more preferably 10 seconds.
- the upper limit of the PEB time is preferably 600 seconds, and more preferably 300 seconds.
- the film exposed in the exposure step is developed.
- the developer used for the development include an alkaline aqueous solution and a developer containing an organic solvent.
- alkaline aqueous solution examples include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, n-propylamine, diethylamine, di-n-propylamine, triethylamine, methyldiethylamine, Ethyldimethylamine, triethanolamine, tetramethylammonium hydroxide (TMAH), pyrrole, piperidine, choline, 1,8-diazabicyclo- [5.4.0] -7-undecene, 1,5-diazabicyclo- [4. 3.0] -5-nonene, and an alkaline aqueous solution in which at least one of alkaline compounds is dissolved.
- TMAH tetramethylammonium hydroxide
- the lower limit of the content of the alkaline compound in the alkaline aqueous solution is preferably 0.1% by mass, more preferably 0.5% by mass, and even more preferably 1% by mass.
- the upper limit of the content is preferably 20% by mass, more preferably 10% by mass, and still more preferably 5% by mass.
- TMAH aqueous solution As the alkaline aqueous solution, a TMAH aqueous solution is preferable, and a 2.38 mass% TMAH aqueous solution is more preferable.
- Examples of the organic solvent in the developer containing the organic solvent include the same organic solvents as exemplified in the [B] solvent of the radiation-sensitive composition. Among these, those containing ester solvents, ether solvents, alcohol solvents, ketone solvents, amide solvents, hydrocarbon solvents or combinations thereof are preferred, those containing ester solvents are more preferred, esters A single solvent of the system solvent is more preferable, and propylene glycol monomethyl ether acetate is particularly preferable.
- the lower limit of the content of the organic solvent in the developer containing the organic solvent is preferably 80% by mass, more preferably 90% by mass, further preferably 95% by mass, and particularly preferably 99% by mass.
- a developer containing an organic solvent is preferable.
- These developers may be used alone or in combination of two or more.
- the substrate is washed with water and then dried.
- a positive pattern can be obtained.
- a developer containing an organic solvent is used as the developer, a negative pattern can be obtained.
- the metal oxide has a structural unit represented by the following formula (1).
- M is germanium, tin, or lead.
- R 1 is a monovalent organic group having 30 or less carbon atoms, which includes at least one of an unsaturated bond group and an electron withdrawing group, and is bonded to M with a carbon atom.
- the metal oxide can be suitably used as a raw material for the above-mentioned radiation-sensitive composition.
- the details of the metal oxide have been already described in [A] Metal oxide, and thus description thereof is omitted.
- GPC column 2 “G2000HXL”, 1 “G3000HXL”, and 1 “G4000HXL” manufactured by Tosoh Corporation Column temperature: 40 ° C.
- Elution solvent Tetrahydrofuran Flow rate: 1.0 mL / min Sample concentration: 1.0% by mass Sample injection volume: 100 ⁇ L
- Detector Differential refractometer Standard material: Monodisperse polystyrene
- Examples 2 to 6 and Comparative Examples 1 to 3 The metals of Examples 2 to 6 having the structural units (I) represented by the following formulas (X-2) to (X-6) are operated in the same manner as in Example 1 except that the monomers are appropriately changed.
- D-1 Nonionic acetylene group-containing surfactant (“Surfinol 465” from Nissin Chemical)
- Example 7 This was carried out by mixing 3.000 parts by mass of metal oxide (A-1) and 97.000 parts by mass of solvent (B-1) and filtering the resulting mixture through a membrane filter having a pore size of 0.2 ⁇ m.
- the radiation sensitive composition (J-1) of Example 7 was prepared.
- Example 8 to 14 and Comparative Examples 4 to 6 Except that the types and contents of each component were as shown in Table 1 below, the same operations as in Example 7 were performed, and the radiation-sensitive compositions (J-2) to (J-8) of Examples 8 to 14 and The radiation sensitive compositions (j-1) to (j-3) of Comparative Examples 4 to 6 were prepared. In Table 1 below, “-” indicates that the corresponding component was not used.
- sensitivity The pattern is formed while varying the exposure amount, and a line-and-space pattern (1L1S) consisting of a line portion having a line width of 150 nm and a space portion having a width of 150 nm formed between adjacent line portions is 1: 1.
- the exposure amount (optimal exposure amount) that can be formed with a line width of was determined. This optimum exposure amount was defined as sensitivity ( ⁇ C / cm 2 ). It can be evaluated that the lower the numerical value, the better the sensitivity.
- the radiation-sensitive compositions of the examples had better sensitivity than the radiation-sensitive compositions of the comparative examples.
- the radiation-sensitive composition and pattern formation method of the present invention can form a pattern while exhibiting excellent sensitivity.
- the metal oxide of this invention can be used suitably as a raw material of the said radiation sensitive composition. Therefore, these can be suitably used for manufacturing semiconductor devices that are expected to be further miniaturized in the future.
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Abstract
Description
当該感放射線性組成物は、下記式(1)で表される構造単位(以下、「構造単位(I)」ともいう)を有する金属酸化物(以下、「[A]金属酸化物」ともいう)及び溶媒(以下、「[B]溶媒」ともいう)を含有する。当該感放射線性組成物は、本発明の効果を損なわない範囲において、後述する感放射線性塩基発生体(以下、「[C]塩基発生体」ともいう)、[D]界面活性剤等の任意成分をさらに含有してもよい。当該感放射線性組成物は、極端紫外線又は電子線により露光するパターン形成方法に好適に用いることができる。以下、各成分について説明する。
[A]金属酸化物は、構造単位(I)を有する。[A]金属酸化物は、後述する構造単位(II)~(IV)等の任意の構造単位をさらに有していてもよい。当該感放射線性組成物は、[A]金属酸化物を1種単独で又は2種以上を組み合わせて用いることができる。[A]金属酸化物は、当該感放射線性組成物により形成される膜の主成分となる。ここで「主成分」とは、最も含有量の多い成分であり、例えば含有量が50質量%以上の成分を指す。
構造単位(I)は、下記式(1)で表される。
フェニル基、トリル基、キシリル基、ナフチル基、アントリル基等のアリール基;
このアリール基の有する水素原子の一部又は全部をヘテロ原子含有基で置換した置換アリール基;
フェニレン基、トリレン基、キシリレン基、ナフチレン基、アントリレン基等の炭素数6~30のアリーレン基;
このアリーレン基の有する水素原子の一部又は全部をヘテロ原子含有基で置換した置換アリーレン基などが挙げられる。
エテニル基、プロペニル基、ブテニル基等の炭素数2~30のアルケニル基;
エテンジイル基、プロペンジイル基、ブテンジイル基等の炭素数2~30のアルケンジイル基;
シクロプロペニル基、シクロペンテニル基、シクロヘキセニル基、ノルボルネニル基等の二重結合を有する炭素数3~30の脂環式不飽和炭化水素基などが挙げられる。
エチニル基、プロピニル基、ブチニル基等の炭素数2~30のアルキニル基;
エチンジイル基、プロピンジイル基、ブチンジイル基等の炭素数2~30のアルキンジイル基などが挙げられる。
上記式(A-1)中、R2A~R4Aは、それぞれ独立して、水素原子若しくは炭素数1~27の1価の有機基であるか、又はこれらの基のうち2つ以上が互いに合わせられこれらが結合する炭素原子若しくは炭素鎖と共に構成される環員数3~30の環構造を表す。
上記式(A-2)中、R5Aは、炭素数1~27の1価の有機基である。
上記式(A-3)中、Arは、置換又は非置換の炭素数6~29のアリール基である。
メチル基、エチル基、n-プロピル基、i-プロピル基等のアルキル基;
エテニル基、プロペニル基、ブテニル基等のアルケニル基;
エチニル基、プロピニル基、ブチニル基等のアルキニル基などが挙げられる。
シクロペンチル基、シクロヘキシル基等の単環の脂環式飽和炭化水素基;
シクロペンテニル基、シクロヘキセニル基等の単環の脂環式不飽和炭化水素基;
ノルボルニル基、アダマンチル基、トリシクロデシル基等の多環の脂環式飽和炭化水素基;
ノルボルネニル基、トリシクロデセニル基等の多環の脂環式不飽和炭化水素基などが挙げられる。
フェニル基、トリル基、キシリル基、ナフチル基、アントリル基等のアリール基;
ベンジル基、フェネチル基、ナフチルメチル基、アントリルメチル基等のアラルキル基などが挙げられる。
[A]金属酸化物は、下記式(2)で表される構造単位(II)を有していてもよい。
[A]金属酸化物は下記式(3)で表される構造単位(III)を有していてもよい。
[A]金属酸化物は、下記式(4)で表される構造単位(IV)を有していてもよい。
GPCカラム:例えば東ソー社の「G2000HXL」2本、「G3000HXL」1本、及び「G4000HXL」1本
カラム温度:40℃
溶出溶媒:テトラヒドロフラン
流速:1.0mL/分
試料濃度:1.0質量%
試料注入量:100μL
検出器:示差屈折計
標準物質:単分散ポリスチレン
[A]金属酸化物は、例えば水酸化テトラメチルアンモニウム等の第四級アンモニウム塩などの触媒の存在下、下記式(i)で表される化合物(i)や、この化合物(i)の縮合により得られる下記式(ii)で表される部分構造を有する縮合物(ii)等を用いた縮合反応により得ることができる。なお、縮合物(ii)は、構造単位(I)を有していてもよい。
上記式(ii)中、aは、1又は2である。
[B]溶媒は、少なくとも[A]金属酸化物と、必要により含有される任意成分等とを溶解又は分散可能な溶媒であれば特に限定されない。なお、[A]金属酸化物の合成に用いられた反応溶媒をそのまま[B]溶媒として用いてもよい。
メタノール、エタノール、n-プロパノール、iso-プロパノール、n-ブタノール、iso-ブタノール、sec-ブタノール、tert-ブタノール、4-メチル-2-ペンタノール等のモノアルコール系溶媒;
エチレングリコール、1,2-プロピレングリコール、1,3-ブチレングリコール等の多価アルコール系溶媒;
エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル等の多価アルコール部分エーテル系溶媒などが挙げられる。
[C]塩基発生体は、露光光による直接的な作用や、露光光に起因して[A]金属酸化物から生じた二次電子による作用により、露光部において塩基を発生する。当該感放射線性組成物が[C]塩基発生体を含有することで、露光部での[A]金属酸化物の高分子量化を上記塩基によって促進することができ、その結果、当該感放射線性組成物の感度をより向上することができると考えられる。当該感放射線性組成物における[C]塩基発生体の含有形態としては、遊離の化合物(以下、適宜「[C]塩基発生剤」と称する)の形態でも、[A]金属酸化物の一部として組み込まれた形態でも、これらの両方の形態でもよい。
[D]界面活性剤は、当該感放射線性組成物の塗工性、ストリエーション、現像性等を改良する効果を奏する。界面活性剤としては、例えばノニオン系界面活性剤が好ましい。界面活性剤の具体例としては、例えば特開2009-134088号公報の段落[0140]に記載のものや、ノニオン系アセチレン基含有界面活性剤等を用いることもできる。[D]界面活性剤は、1種単独で又は2種以上を組み合わせて用いることができる。
当該感放射線性組成物は、上記[A]~[D]成分以外にも、その他の任意成分として、例えば酸発生体、酸拡散制御体、フッ素原子含有重合体等を含有していてもよい。但し、当該感放射線性組成物が[C]塩基発生体を含有する場合、通常酸発生体は含有しない。当該感放射線性組成物は、任意成分をそれぞれ1種又は2種以上含有していてもよい。
酸発生体は、露光光等の作用により、露光部において酸を発生する物質である。当該感放射線性組成物が酸発生体を含有することで、露光部での[A]金属酸化物の高分子量化を上記酸によって促進することができ、その結果、感度をより向上することができると考えられる。当該感放射線性組成物における酸発生体の含有形態としては、低分子化合物の形態(以下、適宜「酸発生剤」ともいう)でも、[A]金属酸化物等の一部として組み込まれた形態でも、これらの両方の形態でもよい。
酸拡散制御体は、露光により酸発生体等から生じる酸の膜中における拡散現象を制御し、未露光領域における好ましくない化学反応を抑制する効果を奏する。また、当該感放射線性組成物の保存安定性をより向上すると共に、解像度を向上する。さらに、当該感放射線性組成物を用いたパターン形成において、露光から現像処理までの引き置き時間の変動によるパターンの線幅変化を抑えること、すなわちプロセス安定性を向上することができる。当該感放射線性組成物における酸拡散制御体の含有形態としては、遊離の化合物(以下、適宜「酸拡散制御剤」と称する)の形態でも、[A]金属酸化物の一部として組み込まれた形態でも、これらの両方の形態でもよい。
当該感放射線性組成物は、例えば[A]金属酸化物及び[B]溶媒と、必要に応じて用いられる[C]塩基発生剤、[D]界面活性剤等の任意成分とを所定の割合で混合し、好ましくは得られた混合物を孔径0.2μm程度のメンブランフィルターで濾過することにより調製することができる。当該感放射線性組成物の固形分濃度の下限としては、0.1質量%が好ましく、0.5質量%がより好ましく、1質量%がさらに好ましく、1.5質量%が特に好ましい。上記固形分濃度の上限としては、50質量%が好ましく、30質量%がより好ましく、10質量%がさらに好ましく、5質量%が特に好ましい。
当該パターン形成方法は、基板に当該感放射線性組成物を塗工することで膜を形成する工程(以下、「塗工工程」ともいう)と、上記膜を露光する工程(以下、「露光工程」ともいう)と、上記露光された膜を現像する工程(以下、「現像工程」ともいう)とを備える。当該パターン形成方法によれば、上述の当該感放射線性組成物を用いているので、優れた感度を発揮しつつ、パターンを形成することができる。以下、各工程について説明する。
本工程では、基板に当該感放射線性組成物を塗工することで膜を形成する。本工程では、通常、基板の一方の面側に当該感放射線性組成物を塗工する。塗工方法としては、特に限定されないが、例えば回転塗工、流延塗工、ロール塗工等の適宜の塗工手段を採用することができる。具体的には、得られる膜が所定の厚さになるように当該感放射線性組成物を塗工した後、必要に応じてプレベーク(PB)することで膜中の[B]溶媒等を揮発させる。基板としては、例えばシリコンウエハ、アルミニウムで被覆されたウエハ等が挙げられる。
本工程では、上記膜を露光する。この露光は、場合によっては水等の液浸媒体を介しつつ、所定のパターンを有するマスクを介して放射線を照射することにより行う。上記放射線としては、例えば可視光線、紫外線、遠紫外線、真空紫外線(EUV;波長13.5nm)、X線、γ線等の電磁波;電子線、α線等の荷電粒子線などが挙げられる。これらの中で、露光により[A]金属酸化物が有する金属-炭素共有結合を開裂させ易い放射線が好ましく、具体的にはEUV及び電子線が好ましい。
本工程では、上記露光工程で露光された膜を現像する。この現像に用いる現像液としては、アルカリ水溶液、有機溶媒を含む現像液等が挙げられる。
当該金属酸化物は、下記式(1)で表される構造単位を有する。
[実施例1]
3.16gのベンジルスズトリクロリドを100gの0.5M水酸化テトラメチルアンモニウム水溶液中に投入し、室温で激しく90分撹拌した。析出した沈殿物を濾過後、50gの水で2回水洗することにより、下記式(X-1)で表される構造単位(I)を有する金属酸化物(A-1)を合成した。金属酸化物(A-1)のMwは、1,800であった。なお、Mwは、以下の条件によるゲルパーミエーションクロマトグラフィーを用いて測定される値である。
GPCカラム:東ソー社の「G2000HXL」2本、「G3000HXL」1本、及び「G4000HXL」1本
カラム温度:40℃
溶出溶媒:テトラヒドロフラン
流速:1.0mL/分
試料濃度:1.0質量%
試料注入量:100μL
検出器:示差屈折計
標準物質:単分散ポリスチレン
単量体を適宜変更した以外は、実施例1と同様に操作し、下記式(X-2)~(X-6)で表される構造単位(I)を有する実施例2~6の金属酸化物(A-2)~(A-6)と、下記式(x-1)~(x-3)で表される構造単位を有する比較例1~3の金属酸化物(a-1)~(a-3)とを合成した。
感放射線性組成物の調製に用いた[A]金属酸化物以外の成分を以下に示す。
B-1:4-メチル-2-ペンタノール
C-1:2-ニトロベンジルシクロヘキシルカルバメート
D-1:ノニオン系アセチレン基含有界面活性剤(日信化学社の「サーフィノール465」)
金属酸化物(A-1)3.000質量部と、溶媒(B-1)97.000質量部とを混合し、得られた混合物を孔径0.2μmのメンブレンフィルターで濾過することにより、実施例7の感放射線性組成物(J-1)を調製した。
各成分の種類及び含有量を下記表1に示す通りとした以外は実施例7と同様に操作し、実施例8~14の感放射線性組成物(J-2)~(J-8)及び比較例4~6の感放射線性組成物(j-1)~(j-3)を調製した。なお、下記表1中の「-」は該当する成分を使用しなかったことを示す。
実施例及び比較例の各感放射線性組成物を用い、下記方法によりパターンを形成することでその感度を評価した。評価結果を下記表1にあわせて示す。
東京エレクトロン社のクリーントラックACT-8内で、シリコンウエハ上に各感放射線性組成物をスピンコートした後、80℃、60秒間の条件でPBを行い、平均厚み50nmの膜を形成した。次に、簡易型の電子線描画装置(日立製作所社の「HL800D」、出力;50KeV、電流密度;5.0アンペア/cm2)を用いて上記膜に電子線を照射し、パターニングを行った。電子線の照射後、上記クリーントラックACT-8内で、プロピレングリコールモノメチルエーテルアセテートを用い、23℃で1分間、パドル法により現像した後、乾燥させることでパターンを形成した。
露光量を変量させながら上記パターン形成を行い、線幅150nmのライン部と、隣接するライン部間に形成される幅150nmのスペース部とからなるライン・アンド・スペースパターン(1L1S)を1対1の線幅に形成できる露光量(最適露光量)を求めた。この最適露光量を感度(μC/cm2)とした。感度は、その数値が低いほど良好であると評価できる。
Claims (11)
- 上記R1で表される1価の有機基が不飽和結合を有する基を含み、
この不飽和結合を有する基が、芳香族基及びエチレン性二重結合含有基のうち少なくとも1種である請求項1に記載の感放射線性組成物。 - 上記R1で表される1価の有機基が電子求引性基を含み、
この電子求引性基が、シアノ基、ニトロ基、ハロゲン化アルキル基、-COO-、及びカチオン性基のうち少なくとも1種である請求項1又は請求項2に記載の感放射線性組成物。 - 上記構造単位が、下記式(1-1)で表される請求項1、請求項2又は請求項3に記載の感放射線性組成物。
- 上記金属酸化物の固形分換算での含有量が、50質量%以上である請求項1から請求項4のいずれか1項に記載の感放射線性組成物。
- 上記溶媒が、有機溶媒である請求項1から請求項5のいずれか1項に記載の感放射線性組成物。
- 上記有機溶媒が、炭素数1~10のアルコール系溶媒を含む請求項6に記載の感放射線性組成物。
- 基板に、請求項1から請求項7のいずれか1項に記載の感放射線性組成物を塗工することにより膜を形成する工程と、
上記膜を露光する工程と、
上記露光された膜を現像する工程と
を備えるパターン形成方法。 - 上記現像工程で用いる現像液が有機溶媒を含む請求項8に記載のパターン形成方法。
- 上記露光工程で用いる放射線が、極端紫外線又は電子線である請求項8又は請求項9に記載のパターン形成方法。
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US20190310551A1 (en) | 2019-10-10 |
TW201825505A (zh) | 2018-07-16 |
EP3564752A4 (en) | 2020-08-26 |
KR20190099429A (ko) | 2019-08-27 |
JPWO2018123537A1 (ja) | 2019-10-31 |
EP3564752A1 (en) | 2019-11-06 |
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