WO2018084075A1 - フィラー含有フィルム - Google Patents

フィラー含有フィルム Download PDF

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Publication number
WO2018084075A1
WO2018084075A1 PCT/JP2017/038851 JP2017038851W WO2018084075A1 WO 2018084075 A1 WO2018084075 A1 WO 2018084075A1 JP 2017038851 W JP2017038851 W JP 2017038851W WO 2018084075 A1 WO2018084075 A1 WO 2018084075A1
Authority
WO
WIPO (PCT)
Prior art keywords
filler
resin layer
containing film
anisotropic conductive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/038851
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
三宅　健
生子 久我
怜司 塚尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to KR1020197010975A priority Critical patent/KR102359094B1/ko
Priority to CN201780064897.6A priority patent/CN109996837A/zh
Priority to US16/344,489 priority patent/US11001686B2/en
Priority to KR1020227003492A priority patent/KR102513747B1/ko
Publication of WO2018084075A1 publication Critical patent/WO2018084075A1/ja
Anticipated expiration legal-status Critical
Priority to US17/315,788 priority patent/US20210261743A1/en
Ceased legal-status Critical Current

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Definitions

  • the present invention relates to a filler-containing film such as an anisotropic conductive film.
  • Filler-containing films in which filler is dispersed in the resin layer are used in a wide variety of applications such as matte films, condenser films, optical films, label films, anti-static films, anisotropic conductive films ( Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document 4).
  • the conductive particles are identified in the anisotropic conductive film in order to suppress variations in the number of conductive particles captured by the terminal.
  • the number of conductive particles spaced apart from each other in the anisotropic conductive film in order to achieve both the securing of connection reliability between opposing terminals and the suppression of short-circuits between adjacent terminals has been proposed (Patent Document 6) and the like.
  • JP 2006-15680 A JP2015-138904A JP2013-103368A JP 2014-183266 A Japanese Patent No. 4887700 JP 2015-167106 A
  • the pressing jig for anisotropic conductive connection.
  • the thrust required for the pressing jig to push the conductive particles into the terminal increases, and the conventional pressing jig may not be able to cope with it. In this case, the pressing jig is modified. And there is concern about an increase in costs.
  • the present invention improves the trapping property of the conductive particles at the terminal and improves the conduction characteristics. It is an object of the present invention to improve and prevent the thrust required for a pressing jig for pressing a filler-containing film such as an anisotropic conductive film against an electronic component from becoming excessively high.
  • the characteristics of the filler-containing film are controlled using the relationship between the filler particle size of the filler-containing film and the thickness of the layer holding the filler as an index (necessary for the pressing jig in the anisotropic conductive film described above.
  • the problem of thrust to be used is an example).
  • the present inventor has a specific range of the ratio of the particle diameter of the filler and the thickness of the layer holding the filler when the filler-containing film is pressure-bonded to the article, or the filler is dispersed regularly.
  • the inventors have found that the properties of the filler-containing film can be adjusted by increasing the ratio of the number of fillers present in a non-contact manner and adjusting the area occupancy of the filler, thereby completing the present invention.
  • the anisotropic conductive film will be described in detail. When the anisotropic conductive film is thermocompression bonded to an electronic component, it is necessary for the pressing jig to improve the capturing property of fillers such as conductive particles in the terminal.
  • a filler such as conductive particles is regularly dispersed in a resin layer (preferably an insulating resin layer), and the ratio of the number of fillers such as conductive particles existing in a non-contact manner is increased. It has been found that it is effective to set the ratio of the layer thickness to the average particle diameter of the filler within a specific range, and to adjust the area occupancy of the filler in the filler-containing film such as an anisotropic conductive film. Was completed.
  • the present invention is a filler-containing film having a filler dispersion layer in which fillers are regularly arranged in a resin layer, The area occupation ratio of the filler in plan view is 25% or less, The ratio La / D of the resin layer thickness La to the filler particle size D is 0.3 to 1.3, Provided is a filler-containing film in which the number ratio of fillers in non-contact with each other is 95% or more with respect to the whole filler.
  • the present invention provides, as a preferred embodiment of the filler-containing film, a filler-containing film used as an anisotropic conductive film, wherein the filler is conductive particles, the resin layer of the filler dispersion layer is an insulating resin layer. .
  • the present invention provides a film bonded body in which the above-mentioned filler-containing film is bonded to an article, a connection structure in which the first article and the second article are connected via the above-mentioned filler-containing film, particularly Provided is a connection structure in which a first electronic component and a second electronic component are anisotropically conductively connected via a filler-containing film used as an anisotropic conductive film. Furthermore, the present invention provides a connection structure manufacturing method in which the first article and the second article are pressure-bonded via the filler-containing film described above, and the first article and the second article are the first electronic component and the second electronic, respectively.
  • the first electronic component and the second electronic component were anisotropically conductively connected by thermocompression bonding of the first electronic component and the second electronic component through a filler-containing film used as an anisotropic conductive film as a component.
  • a method for manufacturing a connection structure is provided for manufacturing the connection structure.
  • fillers such as conductive particles are regularly dispersed in a resin layer (preferably an insulating resin layer), and the filler is in total. Since the number ratio of fillers in non-contact with each other is 95% or more, each filler is pressed evenly when a filler-containing film such as an anisotropic conductive film is thermocompression bonded to an electronic component. Since the ratio La / D between the layer thickness La of the layer and the average particle diameter D of the filler is 0.3 or more and 1.3 or less, when a thermo-compression bonding of a filler-containing film such as an anisotropic conductive film to an electronic component is performed.
  • the displacement of the filler is less likely to occur, the arrangement and dispersion state of the filler at the crimping site can be maintained in the state before the crimping. Therefore, the filler of the anisotropic conductive film is easily captured by the terminal. The same tendency can be obtained for connections other than the anisotropic conductive film.
  • the area occupancy of the filler such as conductive particles is 25% or less.
  • a filler-containing film such as an anisotropic conductive film is pressure-bonded to an electronic component, the thrust required for the pressing jig can be prevented from becoming excessively high.
  • there is an optical film but the optical performance of the filler can be adjusted by adjusting the independent number ratio in the thickness direction in the resin layer of the filler and in non-contact in a plan view. . The same can be said for materials that are directly connected to the appearance, such as a matte film.
  • FIG. 1A is a plan view showing the arrangement of fillers (conductive particles) in a filler-containing film (an anisotropic conductive film which is one mode) 10A of an example.
  • FIG. 1B is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10A of an example.
  • FIG. 2 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10B of the example.
  • FIG. 3 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10C of the example.
  • FIG. 1A is a plan view showing the arrangement of fillers (conductive particles) in a filler-containing film (an anisotropic conductive film which is one mode) 10A of an example.
  • FIG. 1B is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one
  • FIG. 4 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10D of an example.
  • FIG. 5 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10E of the example.
  • FIG. 6 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10F of the example.
  • FIG. 7 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10G of the example.
  • FIG. 8 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10H of the example.
  • FIG. 9 is a cross-sectional view of a filler-containing film (an anisotropic conductive film which is one embodiment) 10I of the example.
  • anisotropic conductive film which is one embodiment of the filler-containing film of the present invention will be mainly described in detail with reference to the drawings.
  • symbol represents the same or equivalent component.
  • FIG. 1A is a plan view for explaining the arrangement of fillers (or conductive particles) 1 in a filler-containing film (an anisotropic conductive film which is one embodiment) 10A of the present invention.
  • FIG. 1B is an XX cross-sectional view of the filler-containing film 10A.
  • the filler 1 is ordered on one side of the resin layer 2 (or insulating resin layer) formed from a resin having a relatively low minimum melt viscosity. Distributed in a typical array.
  • Filler 1 includes known inorganic fillers (metals, metal oxides, metal nitrides, etc.), organic fillers (resin particles, rubber particles, etc.), organic materials and inorganic materials, depending on the use of the filler-containing film.
  • inorganic fillers metal, metal oxides, metal nitrides, etc.
  • organic fillers resin particles, rubber particles, etc.
  • organic materials and inorganic materials depending on the use of the filler-containing film.
  • a silica filler for example, in an optical film or a matte film, a silica filler, a titanium oxide filler, a styrene filler, an acrylic filler, a melamine filler, various titanates, and the like can be used.
  • titanium oxide, magnesium titanate, zinc titanate, bismuth titanate, lanthanum oxide, calcium titanate, strontium titanate, barium titanate, barium zirconate titanate, lead zirconate titanate and mixtures thereof Etc. can be used.
  • the adhesive film can contain polymer rubber particles, silicone rubber particles, and the like.
  • the anisotropic conductive film contains conductive particles.
  • the conductive particles include metal particles such as nickel, cobalt, silver, copper, gold, and palladium, alloy particles such as solder, metal-coated resin particles, and metal-coated resin particles having insulating fine particles attached to the surface. .
  • metal particles such as nickel, cobalt, silver, copper, gold, and palladium
  • alloy particles such as solder
  • metal-coated resin particles are preferable in that the resin particles repel after being connected, so that the contact with the terminal is easily maintained and the conduction performance is stabilized.
  • the surface of the conductive particles may be subjected to an insulation treatment that does not hinder the conduction characteristics by a known technique.
  • the filler mentioned according to the above-mentioned use is not limited to the use, and may be contained in a filler-containing film for other use as required. Moreover, in the filler-containing film for each application, two or more kinds of fillers can be used in combination as required.
  • the shape of the filler is determined by appropriately selecting from a spherical shape, an elliptical sphere, a columnar shape, a needle shape, a combination thereof, and the like according to the use of the filler-containing film.
  • a spherical shape is preferable because it is easy to confirm the filler arrangement and it is easy to maintain a uniform state.
  • the conductive particles that are fillers are preferably substantially spherical.
  • substantially spherical particles as the conductive particles, for example, in producing an anisotropic conductive film in which conductive particles are arranged using a transfer mold as described in JP-A-2014-60150, Since the conductive particles roll smoothly on the mold, the conductive particles can be filled into a predetermined position on the transfer mold with high accuracy. Therefore, the conductive particles can be accurately arranged.
  • the particle diameter D of the filler 1 is preferably 1 ⁇ m or more and 30 ⁇ m or less, more preferably 3 ⁇ m or more and 9 ⁇ m, in order to be able to cope with variations in wiring height, to suppress increase in conduction resistance, and to suppress short circuit. It is as follows.
  • the particle size of the filler before being dispersed in the resin layer 2 can be measured by a general particle size distribution measuring device, and the average particle size can also be obtained by using the particle size distribution measuring device.
  • An example of the measuring apparatus is FPIA-3000 (Malvern).
  • the particle diameter D of the filler such as conductive particles in the filler-containing film such as an anisotropic conductive film can be obtained from observation with an electron microscope such as SEM.
  • the number of samples for measuring the particle diameter D of the filler is desirably 200 or more.
  • the diameter of the shape imitating the maximum length or a sphere based on the planar image or cross-sectional image of the filler-containing film can be used as the particle diameter D of the filler.
  • fillers 1 such as conductive particles are not randomly arranged in a plan view of the film but regularly arranged. It is preferable that the fillers 1 exist without contacting each other in a plan view of the film, and the fillers 1 exist without overlapping each other in the film thickness direction. Therefore, the ratio of the number of fillers 1 that are in non-contact with each other is 95% or more, preferably 98% or more, and more preferably 99.5% or more with respect to the whole filler. Moreover, it is preferable that the position of each filler 1 in the film thickness direction is also aligned. For example, as shown in FIG.
  • the fillers 1 can be arranged in a hexagonal lattice, and the filling amount Lb of the fillers 1 in the film thickness direction can be made uniform as will be described later.
  • the filler in the dispersion state of the filler in which the number ratio of fillers existing in non-contact with each other is 95% or more, there may be a portion Px where the filler is missing with respect to a predetermined regular arrangement of the filler (FIG. 1A). ). This missing filler can be confirmed by the regular presence of the filler in a predetermined direction of the film within the allowable range of the characteristics.
  • examples of the regular arrangement of the filler include a lattice arrangement such as a rectangular lattice, an oblique lattice, a square lattice, and other rectangular lattices.
  • particle rows in which fillers are linearly arranged at predetermined intervals may be arranged in parallel at predetermined intervals.
  • the regular arrangement is not particularly limited as long as it is repeated in the longitudinal direction of the film.
  • the fillers when the fillers are arranged in a hexagonal lattice, a tetragonal lattice, or an oblique lattice (that is, a rhombic lattice), the three fillers P1 are arranged in order of increasing distance from the arbitrary filler P0.
  • the ratio (Lmax / Lmin) is preferably 1 or more and 1.2 or less, more preferably 1.1 or less, and even more preferably 1.05 or less (FIG. 1A).
  • the fillers are arranged in a hexagonal lattice, five fillers P1, P2, P3, P4, and P5 are selected in order of increasing distance from an arbitrary filler P0, and the maximum distance is the same as described above.
  • the ratio (Lmax / Lmin) between (Lmax) and the minimum distance (Lmin) is determined, the ratio is preferably 1 or more and 1.1 or less.
  • the ratio of the maximum distance to the minimum distance (Lmax / Lmin) is 1 in design, but in practice A slight misalignment occurs during the production of a filler-containing film such as an anisotropic conductive film, and when the filler-containing film is used as a wound body, a slight misalignment occurs due to tightening depending on the thickness of the filler-containing film. There is a fear.
  • the upper limit of the above ratio (Lmax / Lmin) is an allowable range of filler displacement in the present invention.
  • the fillers are arranged in a non-contact and even manner. Therefore, when the filler-containing film is configured as an anisotropic conductive film, it is possible to apply pressure uniformly to the conductive particles that are the fillers 1 during anisotropic conductive connection, and to actually reduce the variation in conduction resistance.
  • a method of disposing the filler while suppressing such a slight positional deviation when a filler-containing film such as an anisotropic conductive film is manufactured as described later, there is a portion where the filler should be disposed in advance. It is preferable to prepare a prescribed mold, place a filler at the site, and transfer the filler to the resin layer.
  • the lattice axis or the array axis may be parallel to the longitudinal direction of the filler-containing film or may intersect with the longitudinal direction of the filler-containing film.
  • the filler-containing film is an anisotropic conductive film
  • it can be determined according to the terminal width to be connected, the terminal pitch, and the like.
  • the filler-containing film is an anisotropic conductive film for fine pitch, as shown in FIG. 1A, at least one lattice axis A of the filler 1 is skewed with respect to the longitudinal direction of the filler-containing film 10A.
  • the angle ⁇ formed between the longitudinal direction of the terminal 20 connected by the filler-containing film 10A and the lattice axis A is preferably set to 16 ° to 74 °. Even in applications other than anisotropic conductive films, the effect of stabilizing the capture state is expected by inclining in this way.
  • the interparticle distance of the filler 1 such as conductive particles is such that the area occupancy of the filler 1 in the filler-containing film such as an anisotropic conductive film is 25% or less, preferably 0.5% or more and 23% as described later.
  • it is more preferably set to be 1.4% or more and less than 20%.
  • the number density of the filler is preferably set to 30 to 32000 / mm 2 .
  • the interparticle distance of the filler 1 is appropriately determined according to the size and terminal pitch of the terminals connected by the filler-containing film.
  • the filler-containing film is configured as an anisotropic conductive film
  • the anisotropic conductive film is made to correspond to fine pitch COG (Chip-On-Glass)
  • the distance between the closest particles is reduced from the point of suppressing short circuit.
  • the particle diameter D is preferably 0.5 times or more, more preferably 0.7 times or more.
  • the distance between the closest particles is preferably 4 times or less, more preferably 3 times or less of the particle diameter D of the filler.
  • the closest distance between the fillers is 0.5 ⁇ m or more regardless of the particle diameter of the filler.
  • the number density of the filler is obtained by arbitrarily setting a plurality of rectangular regions (5 or more, preferably 10 or more) rectangular regions each having a side of 100 ⁇ m or more, and obtaining the total area of the measurement regions as 2 mm 2 or more. it can. What is necessary is just to adjust suitably the magnitude
  • the number density was measured using 200 images of an area of 100 ⁇ m ⁇ 100 ⁇ m area arbitrarily selected from the filler-containing film 10A using an observation image by a metal microscope, etc. Can be obtained by averaging.
  • the area of 100 ⁇ m ⁇ 100 ⁇ m area is an area where one or more bumps exist in a connection object having a space between bumps of 50 ⁇ m or less.
  • the number density of fillers such as conductive particles can be obtained by observing with a metal microscope as described above, or by measuring an observation image with image analysis software (for example, WinROOF, Mitani Corporation, etc.). Good.
  • the number density of fillers such as conductive particles depends on the particle diameter, hardness, etc. of the filler as long as the area occupancy of the filler is 25% or less. Is set. That is, in the case of an anisotropic conductive film, if the number density of the filler is too small, it cannot cope with the connection of fine pitch electronic components, and if it is too large, a short circuit is caused. 30 to 32000 / mm 2 is preferable, and 280 to 28000 / mm 2 is more preferable.
  • a filler such as conductive particles is used so that the thrust required for the pressing jig at the time of anisotropic conductive connection or the like is not excessively increased. Is less than 25%, preferably less than 23%, more preferably less than 20%. Moreover, 0.5% or more is preferable from the point of ensuring conduction
  • the area occupancy in the filler-containing film may be appropriately selected depending on the application, and is not limited as long as it does not interfere with the production, but it can be said that the above-mentioned stability is also obtained in connections other than anisotropic conductive connections. Therefore, a range similar to the above is preferable.
  • the number density of the filler is obtained by the above-described method, and the average of the planar view area of one filler is obtained by measurement from an observation image of the film surface with a metal microscope or the like.
  • the above-described image analysis software (WinROOF, Mitani Corporation) may be used.
  • the area occupancy of the filler is used as an index of the thrust required for the pressing jig when thermocompression bonding to the electronic component, and the area of the filler
  • the particle diameter of the filler, the number density of fillers, and the like are set so that the occupation ratio is 25% or less.
  • the interparticle distance of fillers and the number density have been determined according to the terminal width of electronic parts, the distance between terminals, the particle diameter of filler, the arrangement of fillers, etc. The interparticle distance and number density of the filler are determined so that the rate is 25% or less.
  • an anisotropic conductive film is crimped
  • the optical performance of a filler can be adjusted by adjusting the area occupation rate etc. of a filler as mentioned above. The same can be said for materials that are directly connected to the appearance, such as a matte film.
  • ⁇ Resin layer> (Viscosity of resin layer)
  • the manufacturing method of a filler containing film, etc. it can determine suitably.
  • the thickness can be set to about 1000 Pa ⁇ s depending on the method for producing the filler-containing film.
  • a method for producing a filler-containing film when the filler is held on the surface of the resin layer in a predetermined arrangement and the filler is pushed into the resin layer, the resin layer is formed from the point that the resin layer can be formed into a film.
  • the minimum melt viscosity is preferably 1100 Pa ⁇ s or more.
  • a dent 2b is formed around the exposed portion of the filler 1 pushed into the resin layer 2 as shown in FIG. 1B, or a resin as shown in FIG. From the point of forming a dent 2c on the surface of the resin layer 2 immediately above the filler 1 pushed into the layer 2, it is preferably 1500 Pa ⁇ s or more, more preferably 2000 Pa ⁇ s or more, further preferably 3000 to 15000 Pa ⁇ s, Even more preferably, it is 3000 to 10,000 Pa ⁇ s.
  • This minimum melt viscosity can be obtained using a rotary rheometer (manufactured by TA Instruments Inc.) as an example, kept constant at a measurement pressure of 5 g, and using a measurement plate having a diameter of 8 mm, and more specifically in the temperature range. At 30 to 200 ° C., it can be obtained by setting the temperature rising rate 10 ° C./min, the measurement frequency 10 Hz, and the load fluctuation 5 g with respect to the measurement plate.
  • the minimum melt viscosity of the resin layer 2 By setting the minimum melt viscosity of the resin layer 2 to a high viscosity of 1500 Pa ⁇ s or more, unnecessary movement of the filler can be suppressed when the filler-containing film is pressure-bonded to an article, and in particular, the filler-containing film is an anisotropic conductive film. In this case, it is possible to prevent the conductive particles to be sandwiched between the terminals during anisotropic conductive connection from flowing due to resin flow.
  • the resin layer 2 when the filler 1 is pressed is such that the filler 1 is exposed from the resin layer 2.
  • the resin layer 2 is plastically deformed to form a highly viscous viscous material that forms a recess 2 b (FIG. 1B) in the resin layer 2 around the filler 1, or
  • a dent 2 c (FIG. 6) is formed on the surface of the resin layer 2 immediately above the filler 1.
  • the lower limit of the viscosity of the resin layer 2 at 60 ° C. is preferably 3000 Pa ⁇ s or more, more preferably 4000 Pa ⁇ s or more, further preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s or less. Preferably it is 15000 Pa.s or less, More preferably, it is 10000 Pa.s or less. This measurement is performed by the same measurement method as that for the minimum melt viscosity, and can be obtained by extracting a value at a temperature of 60 ° C.
  • the specific viscosity of the resin layer 2 when the filler 1 is pushed into the resin layer 2 is preferably at least 3000 Pa ⁇ s, more preferably 4000 Pa, depending on the shape and depth of the recesses 2b and 2c to be formed.
  • S or more, more preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s or less, more preferably 15000 Pa ⁇ s or less, and even more preferably 10000 Pa ⁇ s or less.
  • such a viscosity is preferably obtained at 40 to 80 ° C., more preferably 50 to 60 ° C.
  • the depression 2b (FIG. 1B) is formed around the filler 1 exposed from the resin layer 2, thereby preventing the filler 1 from being flattened when the filler-containing film is bonded to the article.
  • the resistance received from the resin is reduced compared to the case where there is no dent 2b.
  • the filler-containing film is an anisotropic conductive film
  • the conductive particles are easily sandwiched between the terminals at the time of anisotropic conductive connection, whereby the conduction performance is improved and the trapping property is improved.
  • the filler-containing film is compared with the case where there is no dent 2c.
  • the pressure at the time of pressure bonding to the article is easily concentrated on the filler 1. Therefore, when the filler-containing film is an anisotropic conductive film, the conductive particles are easily sandwiched between the terminals at the time of anisotropic conductive connection, so that the trapping property is improved and the conduction performance is improved.
  • Such improvement in trapping properties is not limited to anisotropic conductive films, and similar effects can be expected for filler-containing films other than anisotropic conductive films.
  • a filler-containing film (an anisotropic conductive film which is one embodiment thereof) 10A is composed of a filler dispersion layer 3 (FIG. 1B).
  • the filler 1 is regularly dispersed with the filler 1 exposed on one side of the resin layer 2.
  • the fillers 1 are not in contact with each other in the plan view of the film, the fillers 1 are regularly dispersed in the film thickness direction without overlapping each other, and the single layer filler layer in which the positions of the fillers 1 in the film thickness direction are aligned. Is configured.
  • an inclination 2b is formed with respect to the tangential plane 2p of the resin layer 2 at the center between adjacent fillers.
  • undulations 2c may be formed on the surface of the resin layer immediately above the filler 1 embedded in the resin layer 2 (FIG. 6).
  • inclination means a state in which the flatness of the surface of the resin layer is impaired in the vicinity of the filler 1 and a part of the resin layer is missing from the tangential plane 2p to reduce the amount of resin. means. In other words, in the inclination, the surface of the resin layer around the filler is missing with respect to the tangential plane.
  • “undulation” means a state in which the surface of the resin layer immediately above the filler has undulations, and the resin is reduced due to the presence of a portion having a height difference such as undulations. In other words, the amount of resin in the resin layer immediately above the filler is smaller than when the surface of the resin layer directly above the filler is in a tangential plane.
  • the filler-containing film is formed as an anisotropic conductive film by forming the slope 2b (FIG. 1B) around the filler 1 exposed from the resin layer 2, the anisotropic conductive Since the resistance received from the resin against the flattening of the filler 1 that occurs when the filler 1 is clamped between the terminals at the time of connection is reduced as compared to the case where there is no inclination 2b, the filler is easily clamped at the terminal. As a result, the conduction performance is improved and the trapping property is improved. This inclination is preferably along the outer shape of the filler.
  • the filler-containing films such as anisotropic conductive films.
  • the inclination and undulation may be partially lost by heat pressing the resin layer, and the present invention includes this.
  • the filler may be exposed at one point on the surface of the resin layer.
  • the filler-containing film is configured as an anisotropic conductive film, there are a variety of electronic parts to be connected. As long as tuning is performed according to these, it is desired that the degree of freedom in design is high so that various requirements can be satisfied. Therefore, it can be used even if the inclination or undulation is reduced or partially disappeared.
  • the undulation 2c (FIG. 6) is formed on the surface of the resin layer 2 immediately above the filler 1 that is buried without being exposed from the resin layer 2, the filler-containing film is different from the case of the inclination.
  • the filler-containing film is different from the case of the inclination.
  • the maximum depth Le of the slope 2b from the viewpoint of easily obtaining the effect of the slope 2b (FIG. 1B) of the resin layer 2 around the exposed portion of the filler and the undulation 2c (FIG. 6) of the resin layer immediately above the filler.
  • the particle diameter D of the filler 1 (Le / D) is preferably less than 50%, more preferably less than 30%, still more preferably 20 to 25%, and the maximum diameter Ld of the slope 2b or the undulation 2c
  • the ratio (Ld / D) of the filler 1 to the particle diameter D is preferably 100% or more, more preferably 100 to 150%, and the ratio of the maximum depth Lf of the undulation 2c to the particle diameter D of the filler 1 ( Lf / D) is greater than 0, preferably less than 10%, more preferably 5% or less.
  • the diameter Lc of the exposed (immediately above) portion of the filler 1 in the slope 2b or the undulation 2c can be made equal to or less than the particle diameter D of the filler 1, and is preferably 10 to 90% of the particle diameter D. Further, it may be exposed at one point on the top of the filler 1, or the particle diameter D may be completely embedded in the resin layer 2 and the diameter Lc may be zero.
  • the presence of the slope 2b and undulation 2c on the surface of the resin layer 2 can be confirmed by observing the cross section of a filler-containing film such as an anisotropic conductive film with a scanning electron microscope, This can also be confirmed in surface field observation.
  • the tilt 2b and the undulation 2c can be observed even with an optical microscope or a metal microscope.
  • the size of the slope 2b and the undulation 2c can be confirmed by adjusting the focus during image observation. The same applies even after the inclination or undulation is reduced by heat pressing as described above. This is because traces may remain.
  • the resin layer 2 may be conductive or insulating depending on the use of the filler-containing film, and may be plastic or curable, but can preferably be formed from an insulating curable resin composition.
  • it can be formed from an insulating thermopolymerizable composition containing a thermopolymerizable compound and a thermal polymerization initiator. You may make a thermopolymerizable composition contain a photoinitiator as needed.
  • An anisotropic conductive film is mentioned as what is formed from an insulating curable resin composition.
  • thermopolymerizable compound When a thermal polymerization initiator and a photopolymerization initiator are used in combination, one that also functions as a photopolymerizable compound may be used as the thermopolymerizable compound, and a photopolymerizable compound is contained separately from the thermopolymerizable compound. May be. Preferably, a photopolymerizable compound is contained separately from the thermally polymerizable compound.
  • a thermal cationic curing initiator is used as the thermal polymerization initiator
  • an epoxy resin is used as the thermal polymerizable compound
  • a radical photopolymerization initiator is used as the photopolymerization initiator
  • an acrylate compound is used as the photopolymerizable compound.
  • the photopolymerization initiator As the photopolymerization initiator, a plurality of types that react to light having different wavelengths may be contained. As a result, during the production of a filler-containing film such as an anisotropic conductive film, the primary photocuring of the resin constituting the resin layer and the photocuring of the resin for bonding electronic components to each other during anisotropic conductive connection, etc. The wavelength used for the secondary photocuring can be properly used. You may apply to uses other than an anisotropic conductive film.
  • photocuring during the production of the anisotropic conductive film, all or part of the photopolymerizable compound contained in the insulating resin layer can be photocured.
  • this photocuring the arrangement of the conductive particles 1 in the insulating resin layer 2 is maintained or fixed, and it is expected that the short circuit is suppressed and the trapping of the conductive particles is improved.
  • this photocuring is preferably performed when the ratio (La / D) between the layer thickness La of the insulating resin layer 2 and the average particle diameter D of the conductive particles 1 is less than 0.6.
  • the insulating resin layer 2 can more reliably hold or fix the arrangement of the conductive particles and adjust the viscosity of the insulating resin layer 2. This is in order to suppress a decrease in yield in the connection between electronic components using an anisotropic conductive film.
  • the amount of the photopolymerizable compound in the resin layer is preferably 30% by mass or less, more preferably 10% by mass or less, and still more preferably less than 2% by mass. This is because when the amount of the photopolymerizable compound is too large, the thrust applied to the pushing at the time of connection increases.
  • thermally polymerizable composition examples include a thermal radical polymerizable acrylate composition containing a (meth) acrylate compound and a thermal radical polymerization initiator, and a thermal cationic polymerizable epoxy system containing an epoxy compound and a thermal cationic polymerization initiator.
  • thermal cationic polymerizable epoxy composition containing a thermal cationic polymerization initiator examples include compositions.
  • a thermal anionic polymerizable epoxy composition containing a thermal anionic polymerization initiator may be used.
  • a plurality of kinds of polymerizable compounds may be used in combination as long as they do not cause any trouble. Examples of combined use include combined use of a thermal cationic polymerizable compound and a thermal radical polymerizable compound.
  • the (meth) acrylate compound a conventionally known thermal polymerization type (meth) acrylate monomer can be used.
  • a monofunctional (meth) acrylate monomer or a bifunctional or higher polyfunctional (meth) acrylate monomer can be used.
  • thermal radical polymerization initiator examples include organic peroxides and azo compounds.
  • organic peroxides that does not generate nitrogen that causes bubbles can be preferably used.
  • the amount of the thermal radical polymerization initiator used is preferably 2 to 60 parts by weight, more preferably 100 parts by weight of the (meth) acrylate compound. 5 to 40 parts by mass.
  • the epoxy compound examples include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolac type epoxy resin, a modified epoxy resin thereof, an alicyclic epoxy resin, and the like. it can.
  • an oxetane compound may be used in combination.
  • thermal cationic polymerization initiator those known as thermal cationic polymerization initiators for epoxy compounds can be employed.
  • thermal cationic polymerization initiators for epoxy compounds.
  • iodonium salts, sulfonium salts, phosphonium salts, ferrocenes, etc. that generate an acid by heat are used.
  • an aromatic sulfonium salt showing a good potential with respect to temperature can be preferably used.
  • the amount of the thermal cationic polymerization initiator used is preferably 2 to 60 mass relative to 100 parts by mass of the epoxy compound. Part, more preferably 5 to 40 parts by weight.
  • the thermopolymerizable composition preferably contains a film-forming resin and a silane coupling agent.
  • the film-forming resin include phenoxy resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin resin, and the like. be able to.
  • a phenoxy resin can be preferably used from the viewpoint of film forming property, workability, and connection reliability.
  • the weight average molecular weight is preferably 10,000 or more.
  • the silane coupling agent include an epoxy silane coupling agent and an acrylic silane coupling agent. These silane coupling agents are mainly alkoxysilane derivatives.
  • an insulating filler may be contained in the thermopolymerizable composition in order to adjust the melt viscosity.
  • examples of this include silica powder and alumina powder.
  • a fine filler having an insulating filler particle size of 20 to 1000 nm is preferable, and the blending amount is preferably 5 to 50 parts by mass with respect to 100 parts by mass of a thermally polymerizable compound (photopolymerizable compound) such as an epoxy compound.
  • the insulating filler contained separately from the filler 1 is preferably used when the use of the filler-containing film is an anisotropic conductive film, but may not be insulating depending on the use. For example, a conductive fine filler may be used.
  • the resin layer forming the filler dispersion layer appropriately contains a finer insulating filler (so-called nanofiller) different from the filler 1 as necessary. be able to.
  • the filler-containing film of the present invention includes a filler, a softening agent, an accelerator, an anti-aging agent, a colorant (pigment, dye), an organic solvent, an ion catcher agent, etc. in addition to the above-described insulating or conductive filler. You may make it contain.
  • the ratio (La / D) between the layer thickness La of the resin layer 2 and the particle diameter D of the filler 1 is 0.3 or more and 1.3 or less. is there.
  • the particle diameter D of the filler 1 means the average particle diameter.
  • this ratio (La / D) is preferably greater than 0.3, more preferably 0.4 or more. Further, it is preferably 1 or less from the viewpoint of suppressing excessive resin flow during anisotropic conductive connection and realizing low-pressure mounting.
  • the ratio (La / D) is preferably less than 1, more preferably less than 0.6, Preferably it is 0.5 or less. In this case, the filler 1 may penetrate the resin layer 2.
  • the filler 1 has an embedding rate (Lb / D) of 30% or more and 100% or less, as shown in FIG.
  • the filler 1 is embedded so as to protrude from one surface of the resin layer 2.
  • the filler-containing film of the present invention as in the filler-containing film (an anisotropic conductive film which is one embodiment) 10B shown in FIG. A mode in which the film surface is exposed from one side of the layer 2 and embedded so that the film surface and the top portion 1a of the filler 1 are substantially flush with each other, a filler-containing film shown in FIG.
  • the filler 1 is exposed from the resin layer 2 at one point of the top 1a, and the filler 1 is from the resin layer 2 as in the filler-containing film (an anisotropic conductive film which is one embodiment) 10F shown in FIG.
  • the surface of the resin layer 2 immediately above the filler 1 is not exposed and has a recess (a portion recessed from the surface of the surrounding resin layer) 2c.
  • the embedding rate is the surface 2a of the resin layer 2 in which the filler 1 is embedded (the surface on the side where the filler 1 is exposed, of the front and back surfaces of the resin layer 2, or the filler is the resin layer 2).
  • the distance between the tangent plane 2p at the center between adjacent fillers and the deepest part of the filler 1 is the amount of filling Lb.
  • it is the ratio (Lb / D) of the embedding amount Lb to the particle diameter D of the filler 1 (FIG. 1B). Therefore, as shown in FIG. 4, when the filler 1 is embedded deeper than the film surface, the embedding rate (Lb / D) is greater than 100%, and an example is 105% or less. .
  • the filling rate (Lb / D) when the filler 1 just penetrates the resin layer 2 is 100%.
  • the filler 1 can be maintained in a predetermined particle dispersion state or a predetermined arrangement by the resin layer 2, and the embedding rate is 100% or less, preferably 70. % Or less, more preferably less than 60%, when the filler-containing film of the resin constituting the resin layer 2 is configured as an anisotropic conductive film, the filler is flowed and captured during anisotropic conductive connection.
  • the amount of resin that acts to reduce the rate can be reduced. Moreover, since the unnecessary resin layer 2 is reduced, the filler is easily pushed.
  • the filler 1 tends to roll on the resin layer 2 during anisotropic conductive connection, and it is difficult to maintain the filler 1 in a predetermined position, so that the capture rate is lowered. . Further, when the embedding rate exceeds 100% and the filler is completely buried in the resin layer 2, the filler 1 is caused to flow by the resin flow of the resin layer 2 at the time of anisotropic conductive connection, and the trapping property is reduced. A short circuit may occur. Moreover, the effect which the characteristic improves by aligning the grade which the filler is exposed from the resin layer 2 can be anticipated.
  • an embedding rate (Lb / D) is 99% or more of the total number of fillers contained in the anisotropic conductive film which is one aspect
  • the resin layer 2 and the top portion 1a of the filler 1 are substantially flush with each other.
  • the filler-containing film is configured as an anisotropic conductive film as compared to the filler-containing film 10A (FIG. 1B) in which the filler 1 protrudes from 2, the film thickness direction around each filler 1 during anisotropic conductive connection
  • the advantage is that the amount of resin in is uniform.
  • the filler-containing film 10E (FIG.
  • the filler when the filler is pushed into the terminal or the bump in the anisotropic conductive connection, the amount of resin around the top 1a of the filler 1 is uniform, so that the filler 1 is difficult to move. In addition, it is possible to expect an effect of increasing the capturing property and suppressing the short circuit. This is particularly effective when the fine pitch and the space between the bumps are narrow.
  • the surface in which the filler 1 is embedded among the front and back surfaces of the resin layer 2 are recessed as compared with the surrounding flat surface 2a.
  • the dent 2b may be formed when the filler 1 is pushed into the resin layer 2 during the production of the filler-containing film and the viscosity of the resin layer at the time of pushing is in the above-described preferred viscosity range.
  • the filler-containing film When the filler-containing film is configured as an anisotropic conductive film due to the depression 2b on the surface of the resin layer 2, the filler 1 is flattened when the filler 1 is sandwiched between terminals during anisotropic conductive connection. On the other hand, the resistance received from the resin layer 2 is reduced as compared with the case where there is no recess 2b, and the effect that the pushing of the filler into the terminal tends to be uniform can be expected. In this way, the filler-containing film has characteristics in performance and quality because the filler and the resin are more specific than those obtained by simply applying a kneaded binder ( Performance improvement and quality stabilization can be expected.
  • the dent 2c in the filler-containing film (an anisotropic conductive film which is one aspect thereof) 10F (FIG. 6) is also used when the filler 1 is pushed into the resin layer 2 during the production of the filler-containing film. Is in the preferred viscosity range described above. Since the recess 2c is formed on the surface of the resin layer 2, when the filler-containing film is configured as an anisotropic conductive film as compared with the case where there is no recess 2c, the pressure at the time of anisotropic conductive connection is filler. 1 can be easily concentrated, and the effect that the push-in of the filler in the terminal tends to be uniform can be expected. Thus, as a filler containing film, the difference from what was obtained by apply
  • dents 2b and 2c on the surface of the resin layer 2 can be confirmed by observing a cross section of the filler-containing film with a scanning electron microscope, and can also be confirmed with surface field observation with a scanning electron microscope. It can also be observed with an optical microscope or a metal microscope.
  • the second resin layer 4 having a lower minimum melt viscosity than the resin constituting the resin layer 2 can be laminated on the filler dispersion layer 3 (FIGS. 7 to 9). . Since the second resin layer 4 has a lower melt viscosity than the resin layer 2, when the filler-containing film is configured as an anisotropic conductive film, it is formed by terminals such as bumps of electronic components during anisotropic conductive connection. It is possible to improve the adhesiveness between the electronic components facing each other by filling the space.
  • the second resin layer 4 having a viscosity lower than that of the resin layer 2 at the time of anisotropic conductive connection, the adhesion between the electronic components can be improved, and the flow of the second resin layer 4 can be improved. Because of its high performance, it is possible to make it difficult to prevent the filler from being pinched or pushed.
  • the second resin layer 4 is laminated on the filler dispersion layer 3
  • the second resin layer is applied to the electronic component pressed by the tool regardless of whether the second resin layer 4 is on the formation surface of the recess 2b. 4 is preferably applied (the resin layer 2 is applied to an electronic component placed on the stage).
  • the minimum melt viscosity ratio between the resin layer 2 and the second resin layer 4 is that the space formed by the electrodes and bumps of the electronic component is more easily filled with the second resin layer 4 as the difference is increased. Adhesiveness can be improved. In addition, as the difference is increased, the amount of movement of the resin present in the filler dispersion layer 3 is relatively reduced, and the filler 1 between the terminals is less likely to be caused to flow by the resin flow, thereby improving the filler capturing property at the terminals. This is preferable. Practically, the minimum melt viscosity ratio between the resin layer 2 and the second resin layer 4 is preferably 2 or more, more preferably 5 or more, and still more preferably 8 or more.
  • the preferable minimum melt viscosity of the second resin layer 4 more specifically satisfies the above-mentioned ratio and is 3000 Pa ⁇ s or less, more preferably 2000 Pa ⁇ s or less, and particularly 100 to 2000 Pa ⁇ s.
  • the second resin layer 4 can be formed by adjusting the viscosity in the same resin composition as the resin layer 2.
  • the layer thickness of the second resin layer 4 is preferably 4 to 20 ⁇ m. Alternatively, it is preferably 1 to 8 times the particle diameter of the filler.
  • the minimum melt viscosity of the filler-containing films 10G, 10H, and 10I combined with the resin layer 2 and the second resin layer 4 is preferably 200 to 4000 Pa ⁇ s.
  • the second resin layer 4 can be laminated on one side of the filler dispersion layer 3 like a filler-containing film 10 ⁇ / b> G shown in FIG. 7.
  • the relationship between the particle diameter D of the filler 1 and the layer thickness La of the resin layer 2 is such that La / D is 0.3 or more and 1.3 or less as described above.
  • the second resin layer 4 is laminated on the protruding surface, and the second resin layer 4 The filler 1 may be bitten.
  • the resin layer 4 is preferably laminated as described above, and more preferably 90% or less.
  • the second resin layer 4 may be laminated on the surface opposite to the surface of the resin layer 2 in which the filler 1 is embedded.
  • a third resin layer may be provided on the opposite side across the second resin layer 4 and the resin layer 2.
  • the third resin layer can function as a tack layer.
  • it may be provided to fill a space formed by the electrodes and bumps of the electronic component.
  • the resin composition, viscosity, and thickness of the third resin layer may be the same as or different from those of the second resin layer.
  • the minimum melt viscosity of the filler-containing film obtained by combining the resin layer 2, the second resin layer 4, and the third resin layer is not particularly limited, but can be 200 to 4000 Pa ⁇ s.
  • a plurality of filler dispersion layers may be laminated, and a layer that does not contain a filler like the second resin layer may be interposed between the laminated filler dispersion layers, A second resin layer or a third resin layer may be provided on the outermost layer.
  • the filler 1 is held in a predetermined arrangement on the surface of the resin layer 2, and the filler 1 is formed on the resin layer 2 with a flat plate or a roller. Push in.
  • the embedding amount Lb of the filler 1 in the resin layer 2 can be adjusted by the pressing force, temperature, etc. when the filler 1 is pushed in, and the presence / absence, shape and depth of the recesses 2b and 2c are It can be adjusted according to the viscosity, indentation speed, temperature, etc. of the resin layer 2 at the time.
  • the method for holding the filler 1 on the resin layer 2 is not particularly limited.
  • the filler 1 is held on the resin layer 2 using a transfer mold.
  • a transfer mold for example, a known opening forming method such as a photolithographic method is used for an inorganic material such as silicon, various ceramics, glass, and stainless steel, and an organic transfer material such as various resins. Can be used.
  • the transfer mold can take a plate shape, a roll shape, or the like.
  • the anisotropic conductive film that is a filler-containing film has a certain length in order to economically connect electronic components using the anisotropic conductive film. It is preferable that Therefore, the anisotropic conductive film is manufactured to have a length of preferably 5 m or more, more preferably 10 m or more, and further preferably 25 m or more. On the other hand, if the anisotropic conductive film is excessively long, it becomes impossible to use a conventional connection device used when an electronic component is manufactured using the anisotropic conductive film, and the handleability is also poor.
  • the length of the anisotropic conductive film is preferably 5000 m or less, more preferably 1000 m or less, and even more preferably 500 m or less.
  • Such a long body of the anisotropic conductive film is preferably a wound body wound around a core from the viewpoint of excellent handleability. Even for applications other than anisotropic conductive films, the upper limit is considered to be the same as above for the same or similar reasons.
  • the filler-containing film of the present invention can be used in the same manner as the conventional filler-containing film, and the article is not particularly limited as long as the filler-containing film can be bonded. It can be attached to various articles according to the use of the filler-containing film by pressure bonding, preferably by heat pressure bonding. At the time of bonding, light irradiation may be used, and heat and light may be used in combination. For example, when the resin layer of the filler-containing film has sufficient adhesiveness to the article to which the filler-containing film is bonded, the filler-containing film is a single article by lightly pressing the resin layer of the filler-containing film against the article. The film sticking body stuck on the surface can be obtained.
  • the surface of the article is not limited to a flat surface, and may be uneven, or may be bent as a whole.
  • the filler-containing film may be bonded to the article using a pressure roller. Thereby, the filler of a filler containing film and articles
  • a filler-containing film may be interposed between two facing articles, the two facing articles may be joined with a thermocompression roller or a pressing tool, and the filler may be sandwiched between the articles. Further, the filler-containing film may be sandwiched between the articles so that the filler and the article are not in direct contact with each other.
  • the filler-containing film is an anisotropic conductive film
  • a first electronic component such as an IC chip, an IC module, or an FPC, an FPC, a glass substrate through the anisotropic conductive film
  • a second electronic component such as a plastic substrate, a rigid substrate, or a ceramic substrate.
  • IC chips and wafers may be stacked using an anisotropic conductive film to form a multilayer.
  • the electronic component connected with the anisotropic conductive film of this invention is not limited to the above-mentioned electronic component. It can be used for various electronic parts that have been diversified in recent years.
  • the present invention includes a connection structure in which the filler-containing film of the present invention is attached to various articles by pressure bonding, and a method for producing the connection structure.
  • the filler-containing film is an anisotropic conductive film
  • a method for manufacturing a connection structure for anisotropic conductive connection between electronic components using the anisotropic conductive film, and a connection obtained thereby A structure, that is, a connection structure in which electronic components are anisotropically conductively connected by the anisotropic conductive film of the present invention is also included.
  • the anisotropic conductive film is used for second electronic components such as various substrates.
  • the first electronic component such as an IC chip on the side where the conductive particles 1 of the anisotropic conductive film temporarily bonded and temporarily bonded from the side where the conductive particles 1 are embedded in the surface is not embedded in the surface. And can be manufactured by thermocompression bonding.
  • the insulating resin layer of the anisotropic conductive film contains not only a thermal polymerization initiator and a thermal polymerizable compound, but also a photopolymerization initiator and a photopolymerizable compound (may be the same as the thermal polymerizable compound), A pressure bonding method using both light and heat may be used. In this way, unintentional movement of the conductive particles can be minimized. Further, the side on which the conductive particles are not embedded may be temporarily attached to the second electronic component for use. Note that the anisotropic conductive film may be temporarily attached to the first electronic component instead of the second electronic component.
  • the anisotropic conductive film is formed of a laminate of the conductive particle dispersion layer 3 and the second insulating resin layer 4, the conductive particle dispersion layer 3 is temporarily attached to a second electronic component such as various substrates. Then, the first electronic component such as an IC chip is aligned and placed on the second insulating resin layer 4 side of the anisotropic conductive film that has been temporarily pressure-bonded, and thermocompression-bonded.
  • the second insulating resin layer 4 side of the anisotropic conductive film may be temporarily attached to the first electronic component.
  • the conductive particle dispersion layer 3 side can be temporarily attached to the first electronic component for use.
  • anisotropic conductive film which is one embodiment of the filler-containing film of the present invention will be specifically described with reference to examples.
  • Examples 1 to 5 Comparative Example 1 (1) Production of anisotropic conductive film
  • an insulating resin layer forming resin composition for forming a conductive particle dispersion layer and a second insulating resin layer forming resin composition were respectively prepared. Prepared.
  • the minimum melt viscosity of the insulating resin layer was 3000 Pa ⁇ s or more, and the ratio of the minimum melt viscosity of the insulating resin layer to the minimum melt viscosity of the second insulating resin layer was 2 or more.
  • a resin composition for forming an insulating resin layer (high viscosity resin layer) was coated on a PET film having a film thickness of 50 ⁇ m with a bar coater, dried in an oven at 80 ° C. for 5 minutes, and shown in Table 2 on the PET film. An insulating resin layer having a thickness was formed. Similarly, a second insulating resin layer was formed on the PET film with the thickness shown in Table 2.
  • the conductive particles (average particle diameter 3.5 ⁇ m) 1 have a hexagonal lattice arrangement shown in FIG. 1A in a plan view so that the distance between the conductive particles is 3.5 ⁇ m and the number density is 23600 particles / mm 2.
  • a mold was produced. A well-known transparent resin pellet was poured into this mold in a molten state, and cooled and hardened to form a resin mold having recesses arranged as shown in FIG. 1A.
  • This resin mold was filled with conductive particles (Sekisui Chemical Co., Ltd., Ni / Au plated resin particles, average particle size 3.5 ⁇ m), and the above-mentioned insulating resin layer was covered thereon, It stuck by pressing at 0.5 MPa. Then, the insulating resin layer is peeled from the mold, and the conductive particles on the insulating resin layer are pressed into the insulating resin layer (pressing conditions: 60 to 70 ° C., 0.5 MPa) to form a conductive particle dispersion layer. (Examples 1 to 5).
  • conductive resin was mixed with the resin composition forming the insulating resin layer shown in Table 1, and an insulating resin layer (number density of 50000 / mm 2 ) in which the conductive particles were randomly dispersed in a single layer was obtained. Formed.
  • the embedment rate (Lb / D) of each example and comparative example and the embedded state of conductive particles in the insulating resin layer (whether or not the conductive particles are exposed from the insulating resin layer) were observed with a metal microscope, and the conductive particles The area occupancy of was determined.
  • the number ratio (non-contact ratio of the conductive particles) in which the conductive particles exist in non-contact with each other with respect to the entire conductive particles was determined by observing 10 locations of 50 ⁇ m ⁇ 50 ⁇ m with a metal microscope. It shows in Table 2.
  • a two-layer type anisotropic conductive film was produced by laminating a second insulating resin layer on the surface of the conductive particle dispersion layer (Examples 1 to 5, Comparative Example 1).
  • the second insulating resin layer was laminated on the surface of the conductive particle dispersion layer on the side where the conductive particles were pushed.
  • the conduction resistance of the obtained connection for evaluation was measured by a four-terminal method.
  • the initial conduction resistance is preferably 2 ⁇ or less in practice, and more preferably 0.6 ⁇ or less.
  • (B) Conductivity reliability Conductivity after the connected object for evaluation obtained in (a) was placed in a constant temperature bath at a temperature of 85 ° C. and a humidity of 85% RH for 500 hours was measured in the same manner as the initial conductivity resistance.
  • the conduction resistance is preferably 5 ⁇ or less practically.
  • (C) Average number of particles captured The same evaluation IC as in (a) was used, and this evaluation IC and the ITO pattern glass substrate corresponding to the terminal pattern were heated and pressurized under the same conditions as in (a) and heated. The number of trapped conductive particles was measured for 100 terminal pairs after pressurization, and the average was obtained. The average number of particles captured is preferably 3 or more per terminal for practical use.
  • IC for short-circuit rate evaluation (comb tooth TEG (test element group of 7.5 ⁇ m space)) Outline 15 x 13mm Thickness 0.5mm Bump specifications Size 25 ⁇ 140 ⁇ m, distance between bumps 7.5 ⁇ m, bump height 15 ⁇ m
  • Short-circuit rate evaluation criteria A Less than 50 ppm B: 50 ppm or more and less than 200 ppm C: 200 ppm or more
  • the anisotropic conductive films of Examples 1 to 5 have a ratio La / D between the layer thickness La of the insulating resin layer 2 and the average particle diameter D of the conductive particles of 0.3 to 1.3.
  • the initial conduction resistance, conduction reliability, and average particle trapping number were all good, and the measured values were stable and stable.
  • La / D is preferably larger than 0.3
  • Example 2 with La / D of 0.5 has both initial conduction resistance, conduction reliability, and average particle capture number. It turns out that it was excellent.
  • the range of 0.3 to 1.3 is allowed as the numerical value of La / D.
  • the thickness of the insulating resin layer 2 is a predetermined value at the time of design. This means that the thickness may vary from the thickness, which is advantageous in terms of the manufacturing cost of the anisotropic conductive film, and particularly advantageous when the anisotropic conductive film is long and there is a concern about fluctuations in the thickness of the resin layer. Become. In Example 3, as in Examples 4 and 5, there were some portions where the insulating resin layer and the conductive particles were flush with each other.
  • Comparative Example 1 the number density of the conductive particles was high, the area occupation ratio exceeded 25%, the thrust by the pressing jig was insufficient, and the conduction reliability was inferior. There was a large variation in the average number of particles captured. Also, the short rate was inferior.
  • the heating and pressurizing conditions were set to a temperature of 180 ° C., a pressure of 30 MPa, and the pressure was lowered.
  • the initial conduction resistance was 0.2 ⁇
  • Comparative Example 1 it was 1.2 ⁇ .
  • the pressure was increased under the heating and pressurizing conditions, the temperature was 180 ° C., the pressure was 90 MPa, and the time was 5 seconds, the initial conduction resistance of all of Example 1, Example 2, and Comparative Example 1 was 0.2 ⁇ .
  • Comparative Example 1 it was found that a pressure of 90 MPa was necessary to achieve the initial conduction resistance of 0.2 ⁇ , but in Examples 1 and 2, it was found that the pressure could be achieved at 30 MPa. According to the anisotropic conductive film, it was confirmed that low-pressure mounting was possible.
  • Filler (conductive particles) 2 Resin layer (insulating resin layer) 2b dent (tilt) 2c Dent (undulation) 3 Filler dispersion layer (conductive particle dispersion layer) 4 Second resin layer 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I Filler-containing film (an anisotropic conductive film which is one embodiment thereof) La Layer thickness of the resin layer Lb Distance between the tangent plane at the center between adjacent fillers and the deepest part of the filler Lc Diameter of the exposed (immediately above) portion of the filler in the inclination or undulation Ld Inclination of the resin layer around or immediately above the filler Or the maximum undulation diameter Le The maximum depth of inclination in the resin layer around the filler Lf The maximum undulation depth in the resin layer immediately above the filler

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