WO2018043564A1 - 光学フィルターおよび光学フィルターを用いた装置 - Google Patents

光学フィルターおよび光学フィルターを用いた装置 Download PDF

Info

Publication number
WO2018043564A1
WO2018043564A1 PCT/JP2017/031156 JP2017031156W WO2018043564A1 WO 2018043564 A1 WO2018043564 A1 WO 2018043564A1 JP 2017031156 W JP2017031156 W JP 2017031156W WO 2018043564 A1 WO2018043564 A1 WO 2018043564A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
group
compound
optical filter
substrate
Prior art date
Application number
PCT/JP2017/031156
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
達也 葛西
勝也 長屋
正子 堀内
大介 重岡
Original Assignee
Jsr株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr株式会社 filed Critical Jsr株式会社
Priority to KR1020197005541A priority Critical patent/KR102388961B1/ko
Priority to CN202110181464.7A priority patent/CN112946804B/zh
Priority to JP2018537346A priority patent/JP6791251B2/ja
Priority to CN201780052711.5A priority patent/CN109642973B/zh
Priority to KR1020217038932A priority patent/KR102434709B1/ko
Publication of WO2018043564A1 publication Critical patent/WO2018043564A1/ja

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B47/00—Porphines; Azaporphines
    • C09B47/04—Phthalocyanines abbreviation: Pc
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B57/00—Other synthetic dyes of known constitution
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/26—Reflecting filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/28—Interference filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

Definitions

  • the present invention relates to an optical filter and an apparatus using the optical filter. Specifically, the present invention relates to an optical filter containing a compound having absorption in a specific wavelength region, and a solid-state imaging device and a camera module using the optical filter.
  • a solid-state image pickup device such as a video camera, a digital still camera, or a mobile phone with a camera function uses a CCD or CMOS image sensor, which is a solid-state image pickup device for a color image.
  • Silicon photodiodes that are sensitive to near infrared rays that cannot be sensed by the eyes are used. These solid-state image sensors need to be corrected for visibility so that they appear natural to the human eye.
  • Optical filters that selectively transmit or cut light in a specific wavelength region (for example, near-infrared cut) Filter) is often used.
  • a near-infrared cut filter those manufactured by various methods are conventionally used.
  • a near-infrared cut filter in which a transparent resin is used as a substrate and a near-infrared absorbing pigment is contained in the transparent resin is known (see, for example, Patent Document 1).
  • the near-infrared cut filter described in Patent Document 1 may not always have sufficient near-infrared absorption characteristics.
  • Patent Document 2 proposes a near-infrared cut filter having both a wide viewing angle and a high visible light transmittance.
  • Patent Document 3 discloses a near-infrared cut filter that uses a phthalocyanine dye having a specific structure to achieve both a high visible light transmittance and a long absorption maximum wavelength, both of which have been the conventional problems. It is described that can be obtained.
  • the applied base material has a sufficiently strong absorption band in the vicinity of 700 nm, but the near-infrared wavelength region of 900 to 1200 nm, for example. Has almost no absorption. For this reason, light in the near-infrared wavelength region is cut almost only by the reflection of the dielectric multilayer film, but in such a configuration, slight stray light due to internal reflection in the optical filter and reflection between the optical filter and the lens is obtained.
  • ghosts and flares may occur.
  • Patent Document 4 As an optical filter using a substrate having a wide absorption in the near-infrared wavelength region, an infrared shielding filter as in Patent Document 4 has been proposed.
  • a broad absorption in the near-infrared wavelength region is achieved mainly by applying a compound having a dithiolene structure, but the absorption intensity near 700 nm is not sufficient.
  • image degradation may occur due to color shading.
  • Patent Document 5 discloses a near-infrared cut filter having a near-infrared absorbing glass substrate and a layer containing a near-infrared absorbing pigment, but the color shading is sufficiently improved even with the configuration described in Patent Document 5.
  • FIG. 5 of Patent Document 5 shows an optical characteristic graph when incident at 0 degrees and incident at 30 degrees. However, the visible light transmission band is also observed when incident at 30 degrees. A large wavelength shift is observed in the skirt region (630 to 700 nm).
  • the present inventors have a base material that has an absorption band with sufficient intensity in the vicinity of a wavelength of 700 nm and a wide absorption band in the near-infrared wavelength region of 900 nm or more.
  • an optical filter capable of achieving the intended near-infrared cut characteristics, visible light transmittance, color shading suppression effect and ghost suppression effect can be obtained, and the present invention has been completed. Examples of embodiments of the present invention are shown below.
  • An optical filter having a substrate that satisfies the following requirements (a), (b), and (c), and that satisfies the following requirements (d) and (e): (A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm; (B) The difference (X 2 ⁇ X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more; (C) The transmittance at a wavelength of 900 nm, the transmittance at a wavelength of 1000 nm, and the transmittance at a wavelength of 1100 nm are all 65% or less; (D) In the wavelength range of 430 to 580 nm, the average transmittance when measured from the vertical direction of the optical filter is 75% or more; (E) In the wavelength region of 1100 nm to 1200
  • R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ⁇ L e, (L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3
  • the substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms, Adjacent R 3 may form a ring which may have a substituent L, n represents an integer of 0 to 4, X represents an anion necessary to neutralize the charge, M represents a metal atom, Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom; y represents 0 or 1.
  • the transparent resin constituting the transparent resin layer is a cyclic polyolefin resin, aromatic polyether resin, polyimide resin, fluorene polycarbonate resin, fluorene polyester resin, polycarbonate resin, polyamide resin, polyarylate.
  • Resin polysulfone resin, polyethersulfone resin, polyparaphenylene resin, polyamideimide resin, polyethylene naphthalate resin, fluorinated aromatic polymer resin, (modified) acrylic resin, epoxy resin, Item characterized by being at least one resin selected from the group consisting of an allyl ester curable resin, a silsesquioxane ultraviolet curable resin, an acrylic ultraviolet curable resin, and a vinyl ultraviolet curable resin [ [2] to [8] Optical filter.
  • optical filter according to any one of items [1] to [10], which is for a solid-state imaging device.
  • a solid-state imaging device comprising the optical filter according to any one of items [1] to [11].
  • an optical filter that has excellent near-infrared cut characteristics, little incident angle dependency, and excellent transmittance characteristics in the visible wavelength region, color shading suppression effect, and ghost suppression effect.
  • FIGS. 1A and 1B are schematic views showing examples of preferable configurations of the optical filter of the present invention.
  • FIG. 2A is a schematic diagram illustrating a method for measuring the transmittance when measured from the vertical direction of the optical filter.
  • FIG. 2B is a schematic diagram illustrating a method of measuring the transmittance when measured from an angle of 30 ° with respect to the vertical direction of the optical filter.
  • FIG. 3 is a spectral transmission spectrum of the substrate obtained in Example 1.
  • FIG. 4 is a spectral transmission spectrum of the optical filter obtained in Example 1.
  • FIG. 5 is a spectral transmission spectrum of the substrate obtained in Example 2.
  • FIG. 6 is a spectral transmission spectrum of the substrate obtained in Example 6.
  • FIG. 7 is a spectral transmission spectrum of the base material obtained in Example 7.
  • FIG. 1A is a schematic diagram illustrating a method for measuring the transmittance when measured from the vertical direction of the optical filter.
  • FIG. 2B is a schematic diagram illustrating a method of
  • FIG. 8 is a spectral transmission spectrum of the base material (near infrared absorbing glass substrate) used in Comparative Example 3.
  • FIG. 9 is a spectral transmission spectrum of the base material obtained in Comparative Example 4.
  • FIG. 10 is a spectral transmission spectrum of the base material obtained in Comparative Example 5. It is a schematic diagram for demonstrating the color shading evaluation of the camera image performed in the Example and the comparative example. It is a schematic diagram for demonstrating the ghost evaluation of the camera image performed in the Example and the comparative example.
  • the optical filter of the present invention is characterized by having a base material that satisfies the requirements (a), (b), and (c) described later, and that satisfies the requirements (d) and (e) described later.
  • the optical filter of the present invention preferably has a dielectric multilayer film on at least one surface of the substrate.
  • the substrate used in the present invention satisfies the following requirements (a), (b) and (c); (A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm; (B) The difference (X 2 ⁇ X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more; (C) The transmittance (c1) at a wavelength of 900 nm, the transmittance (c2) at a wavelength of 1000 nm, and the transmittance (c3) at a wavelength of 1100 nm are all 65% or less.
  • the substrate preferably further satisfies at least one of the following requirements (f) to (h):
  • the component constituting the layer containing the compound (A) is not particularly limited, and examples thereof include a transparent resin, a sol-gel material, a low-temperature-curing glass material, and the like.
  • a transparent resin is preferable from the viewpoint of compatibility with A).
  • the compound (A) is not particularly limited as long as it has a maximum absorption in the wavelength region of 650 nm or more and 760 nm or less, but is preferably a solvent-soluble dye compound, and is a squarylium compound, a phthalocyanine compound, and a cyanine compound. It is more preferable that it is at least one selected from the group consisting of compounds, it is more preferable that a squarylium compound is included, and it is particularly preferable that there are two or more compounds including a squarylium compound.
  • the compound (A) is two or more types including a squarylium compound, two or more types of squarylium compounds having different structures may be used, or a combination of a squarylium compound and another compound (A) may be used.
  • the other compound (A) a phthalocyanine compound and a cyanine compound are particularly preferable.
  • the squarylium-based compound has excellent visible light permeability, steep absorption characteristics, and a high molar extinction coefficient, but may generate fluorescence that causes scattered light during light absorption. In such a case, an optical filter with less scattered light and better camera image quality can be obtained by using a combination of the squarylium compound and the other compound (A).
  • the absorption maximum wavelength of the compound (A) is preferably 660 nm or more and 755 nm or less, more preferably 670 nm or more and 750 nm or less, and further preferably 680 nm or more and 745 nm or less.
  • the difference between the absorption maximum wavelengths of the compound (A) to be applied having the shortest absorption maximum wavelength and the longest absorption maximum wavelength is preferably 10 to The thickness is 60 nm, more preferably 15 to 55 nm, still more preferably 20 to 50 nm. It is preferable that the difference in absorption maximum wavelength is in the above-mentioned range because scattered light due to fluorescence can be sufficiently reduced and a wide absorption band near 700 nm and an excellent visible light transmittance can be compatible.
  • the total content of the compound (A) is, for example, a base material made of a transparent resin substrate containing the compound (A) or a curable resin on the transparent resin substrate containing the compound (A).
  • a base material on which a resin layer such as an overcoat layer made of, etc. is used it is preferably 0.04 to 2.0 parts by weight, more preferably 0.06 to 2.0 parts by weight with respect to 100 parts by weight of the transparent resin. 1.5 parts by weight, more preferably 0.08 to 1.0 part by weight, and the compound (A) is contained as a base on a support such as a glass support or a resin support as a base.
  • a base material on which a transparent resin layer such as an overcoat layer made of a curable resin or the like is used it is preferably 0.1% with respect to 100 parts by weight of the resin forming the transparent resin layer containing the compound (A). 4 to 5.0 parts by weight, more preferably 0 6 to 4.0 parts by weight, more preferably 0.8 to 3.5 parts by weight.
  • the difference (X 2 ⁇ X 1 ) between the wavelengths X 1 and X 2 is preferably 53 nm or more, more preferably 55 nm or more, and further preferably 58 nm or more.
  • an upper limit is not specifically limited, Since a visible transmittance
  • the difference (X 2 ⁇ X 1 ) is in the above range, it has an absorption band with sufficient intensity (width) in the near-infrared wavelength region close to the visible region. It is preferable because color shading can be suppressed even under such a large incident angle condition.
  • the value of the wavelength (X 1 + X 2 ) / 2 between X 1 and X 2 can be said to be the center wavelength of the absorption band in the near infrared wavelength region close to the visible region, preferably 670 nm or more and 740 nm or less. Is 680 nm to 730 nm, more preferably 690 nm to 720 nm. It is preferable that the value of the wavelength represented by (X 1 + X 2 ) / 2 be in the above range because light in the wavelength region near the long wavelength end of the visible region can be cut more efficiently.
  • X 1 preferably has a wavelength of 650 nm to 720 nm, more preferably a wavelength of 655 nm to 710 nm, and still more preferably a wavelength of 660 nm to 700 nm.
  • X 1 in such a range is preferable because it tends to provide a camera image with less noise and excellent color reproducibility.
  • All of the transmittances (c1), (c2) and (c3) are preferably 60% or less, more preferably 55% or less, and even more preferably 50% or less.
  • the lower limit is not particularly limited, but depending on the properties of the near-infrared absorber, if the transmittance value in the near-infrared wavelength region is too low, the visible transmittance may decrease, or the thickness of the substrate may become extremely thick. For example, it is preferably 5% or more. It is preferable that the transmittances (c1), (c2), and (c3) are in the above ranges because a ghost suppressing effect at a practically sufficient level can be obtained.
  • the substrate may be a single layer or a multilayer as long as it has a layer containing the compound (A).
  • the substrate preferably contains a near infrared absorber, and the near infrared absorber is contained in a different layer even if it is contained in the same layer as the compound (A). It may be.
  • the layer containing the compound (A) and the layer containing the near-infrared absorber are the same, for example, a base material composed of a transparent resin substrate containing the compound (A) and the near-infrared absorber, the compound (A) and the near-infrared absorber A compound (on a base material in which a resin layer such as an overcoat layer made of a curable resin or the like is laminated on a transparent resin substrate containing an infrared absorber, a glass support or a base resin support)
  • an overcoat layer made of a curable resin containing the compound (A) on the transparent resin substrate containing the near infrared absorber for example, an overcoat layer made of a curable resin containing the compound (A) on the transparent resin substrate containing the near infrared absorber, etc.
  • Base material on which a resin layer is laminated base material on which a resin layer such as an overcoat layer made of a curable resin containing a near infrared absorber is laminated on a transparent resin substrate containing the compound (A), a glass support
  • An overcoat layer made of a curable resin containing the compound (A) and an overcoat layer made of a curable resin containing a near infrared absorber are laminated on a support such as a resin support as a body or a base.
  • the near-infrared absorber is not particularly limited as long as it has a wide absorption in the wavelength range of 900 to 1200 nm.
  • the near-infrared absorbing dye, the near-infrared absorbing fine particles, the conductive metal oxide, and the phosphate glass Examples thereof include transition metal components therein.
  • T 1 is preferably 3% or less, more preferably 2% or less, and still more preferably 1% or less. If T 1 is in the above range, it can be said that the transmittance cut of the absorption band is sufficient, and flare around the light source can be suppressed in the camera image, which is preferable.
  • the substrate of the present invention preferably contains a near-infrared absorber, but when the near-infrared absorber is the compound (S), the absorption intensity and visible transmittance in the near-infrared wavelength region can be compatible at a high level. It is preferable because of its tendency.
  • the compound (S) is not particularly limited as long as it has an absorption maximum in a wavelength region of 1050 nm or more and 1200 nm or less, but is preferably a solvent-soluble dye compound, more preferably a diimonium compound or a metal dithiolate complex system. At least one compound selected from the group consisting of compounds, pyrrolopyrrole compounds, cyanine compounds, croconium compounds and naphthalocyanine compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds At least one compound selected from the group consisting of a diimonium compound represented by the following formula (I) and a metal dithiolate complex compound represented by the following formula (II
  • R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ⁇ L e, (L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3
  • the substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms, Adjacent R 3 may form a ring which may have a substituent L, n represents an integer of 0 to 4, X represents an anion necessary to neutralize the charge, M represents a metal atom, Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom, y represents 0 or 1.
  • R 1 is preferably a hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclohexyl group, adamantyl group, trifluoromethyl group.
  • R 2 is preferably a chlorine atom, fluorine atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclohexyl group, phenyl group, hydroxyl group , Amino group, dimethylamino group, cyano group, nitro group, methoxy group, ethoxy group, n-propoxy group, n-butoxy group, acetylamino group, propionylamino group, N-methylacetylamino group, trifluoromethanoylamino Group, pentafluoroethanoylamino group, tert-butanoylamino group, cyclohexylinoylamino group, n-butylsulfonyl group, methylthio group, ethylthio group, n-propylthio
  • X is an anion necessary for neutralizing the electric charge, and one molecule is required when the anion is divalent, and two molecules are required when the anion is monovalent.
  • the two anions may be the same or different, but are preferably the same from the viewpoint of synthesis.
  • X will not be restrict
  • X is (X-10), (X-16), (X-17), (X-21), (X-21) in Table 1 above from the viewpoint of heat resistance, light resistance and spectral properties of the diimonium compound.
  • X-22), (X-24) and (X-28) are particularly preferred.
  • Examples of the diimonium compound represented by the above formula (I) include those listed in Tables 2-1 to 2-4 below.
  • R 3 is preferably a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclohexyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, phenyl group, methylthio group, ethylthio group, n-propylthio group, n-butylthio group, phenylthio group, benzylthio group, adjacent R When 3 forms a ring, it is preferably a heterocyclic ring in which at least one sulfur atom or nitrogen atom is contained in the ring.
  • the M is preferably a transition metal, more preferably Ni, Pd, or Pt.
  • the D is preferably a nitrogen atom or a phosphorus atom
  • the R i is preferably an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, or an n-pentyl group.
  • the absorption maximum wavelength of the compound (S) is preferably from 1060 nm to 1190 nm, more preferably from 1070 nm to 1180 nm, still more preferably from 1080 nm to 1170 nm.
  • the absorption maximum wavelength of the compound (S) is in such a range, unnecessary near-infrared rays can be efficiently cut, and an excellent ghost suppression effect can be obtained.
  • the compound (S) may be synthesized by a generally known method.
  • Japanese Patent No. 4168031 Japanese Patent No. 4225296, JP-T 2010-516823, JP-A 63-165392 Etc. can be synthesized with reference to the methods described in the above.
  • the content of the compound (S) is, for example, a base material made of a transparent resin substrate containing the compound (A) and the compound (S) or a transparent resin substrate containing the compound (S) as the base material.
  • a substrate on which a resin layer such as an overcoat layer made of a curable resin containing the compound (A) is laminated it is preferably 0.01-2. 0 parts by weight, more preferably 0.02 to 1.5 parts by weight, particularly preferably 0.03 to 1.0 parts by weight.
  • the substrate include a glass support and a resin support as a base.
  • a transparent resin layer such as an overcoat layer composed of a curable resin containing the compound (A) and the compound (S) is laminated on a support, or on a transparent resin substrate containing the compound (A)
  • Curable resin containing compound (S) in
  • a base material on which a resin layer such as an overcoat layer is used it is preferably 0.1 to 5.0 with respect to 100 parts by weight of the resin forming the transparent resin layer containing the compound (A). Parts by weight, more preferably 0.2 to 4.0 parts by weight, particularly preferably 0.3 to 3.0 parts by weight.
  • an optical filter having both good near infrared absorption characteristics and high visible light transmittance can be obtained.
  • Xc is preferably 630 to 655 nm, more preferably 632 to 652 nm, and still more preferably 634 to 650 nm. If Xc is less than 628 nm, the transmittance in the wavelength region corresponding to red tends to be low, and color reproducibility tends to decrease. If it exceeds 658 nm, sufficient absorption intensity cannot be ensured, and the camera image Color shading tends to occur.
  • Xc represents a wavelength that satisfies a predetermined condition when the spectral transmittance is evaluated from the short wavelength side toward the long wavelength side.
  • the average transmittance of the substrate in the wavelength region of 430 to 580 nm is preferably 75% or more, more preferably 78% or more, and particularly preferably 80% or more.
  • a substrate having such transmission characteristics is used, high light transmission characteristics can be achieved in the visible range, and a highly sensitive camera function can be achieved.
  • the thickness of the substrate can be appropriately selected according to the desired application and is not particularly limited, but is preferably 10 to 200 ⁇ m, more preferably 20 to 180 ⁇ m, and further preferably 25 to 150 ⁇ m.
  • an optical filter using the substrate can be reduced in thickness and weight, and can be suitably used for various applications such as a solid-state imaging device.
  • a base material made of the transparent resin substrate is used in a lens unit such as a camera module, it is preferable because the lens unit can be reduced in height and weight.
  • the transparent resin used for the transparent resin layer, the transparent resin substrate and the resin support constituting the base material is not particularly limited as long as it does not impair the effects of the present invention.
  • thermal stability and film Glass transition temperature (Tg) is preferably 110 to 380 ° C., in order to obtain a film capable of forming a dielectric multilayer film by high temperature vapor deposition performed at a vapor deposition temperature of 100 ° C. or higher while ensuring moldability to
  • a resin having a temperature of 110 to 370 ° C., more preferably 120 to 360 ° C. is used.
  • the glass transition temperature of the resin is 140 ° C. or higher because a film capable of depositing a dielectric multilayer film at a higher temperature can be obtained.
  • the total light transmittance (JIS K7105) of the resin plate is preferably 75 to 95%, more preferably 78 to 95. %, More preferably 80 to 95% of the resin can be used. If a resin having a total light transmittance in such a range is used, the resulting substrate exhibits good transparency as an optical film.
  • the weight average molecular weight (Mw) in terms of polystyrene measured by a gel permeation chromatography (GPC) method of the transparent resin is usually 15,000 to 350,000, preferably 30,000 to 250,000.
  • the average molecular weight (Mn) is usually 10,000 to 150,000, preferably 20,000 to 100,000.
  • transparent resins examples include cyclic polyolefin resins, aromatic polyether resins, polyimide resins, fluorene polycarbonate resins, fluorene polyester resins, polycarbonate resins, polyamide (aramid) resins, polyarylate resins, and polysulfones.
  • ester-based curable resins examples include ester-based curable resins, silsesquioxane-based ultraviolet curable resins, acrylic-based ultraviolet curable resins, and vinyl-based ultraviolet curable resins.
  • Transparent resins may be used alone or in combination of two or more.
  • the cyclic polyolefin-based resin is obtained from at least one monomer selected from the group consisting of a monomer represented by the following formula (X 0 ) and a monomer represented by the following formula (Y 0 ).
  • a resin and a resin obtained by hydrogenating the resin are preferable.
  • R x1 to R x4 each independently represents an atom or group selected from the following (i ′) to (ix ′), and k x , mx and p x are each independently 0 Or represents a positive integer.
  • R x1 and R x2 or R x3 and R x4 are bonded to each other to form a monocyclic or polycyclic hydrocarbon ring or heterocyclic ring (provided that R x1 to R which are not involved in the bond) x4 each independently represents an atom or group selected from (i ′) to (vi ′).
  • Ix ′ A monocyclic hydrocarbon ring or heterocycle formed by bonding R x2 and R x3 to each other (provided that R x1 and R x4 not involved in the bonding are each independently the above (i Represents an atom or group selected from ') to (vi').
  • R y1 and R y2 each independently represent an atom or group selected from the above (i ′) to (vi ′), or R y1 and R y2 are bonded to each other formed monocyclic or polycyclic alicyclic hydrocarbon, an aromatic hydrocarbon or heterocyclic, k y and p y are each independently, represent 0 or a positive integer.
  • the aromatic polyether-based resin preferably has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2).
  • R 1 to R 4 each independently represents a monovalent organic group having 1 to 12 carbon atoms, and a to d each independently represents an integer of 0 to 4.
  • R 1 ⁇ R 4 and a ⁇ d independently has the same meaning as R 1 ⁇ R 4 and a ⁇ d of the formula (1)
  • Y represents a single bond
  • -SO 2 -Or> C O
  • R 7 and R 8 each independently represent a halogen atom, a monovalent organic group having 1 to 12 carbon atoms or a nitro group
  • g and h each independently represent 0 to 4
  • m represents 0 or 1.
  • R 7 is not a cyano group.
  • the aromatic polyether resin further has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (3) and a structural unit represented by the following formula (4). Is preferred.
  • R 5 and R 6 each independently represents a monovalent organic group having 1 to 12 carbon atoms
  • Z represents a single bond, —O—, —S—, —SO 2 —,> C ⁇ O, —CONH—, —COO— or a divalent organic group having 1 to 12 carbon atoms
  • e and f each independently represent an integer of 0 to 4, and n represents 0 or 1.
  • R 7 , R 8 , Y, m, g and h are each independently synonymous with R 7 , R 8 , Y, m, g and h in formula (2), and R 5 , R 6 , Z, n, e and f are each independently synonymous with R 5 , R 6 , Z, n, e and f in the formula (3).
  • the polyimide resin is not particularly limited as long as it is a polymer compound containing an imide bond in a repeating unit.
  • the method described in JP-A-2006-199945 and JP-A-2008-163107 is used. Can be synthesized.
  • the fluorene polycarbonate resin is not particularly limited as long as it is a polycarbonate resin containing a fluorene moiety, and can be synthesized, for example, by the method described in JP-A-2008-163194.
  • the fluorene polyester resin is not particularly limited as long as it is a polyester resin containing a fluorene moiety.
  • the fluorene polyester resin can be synthesized by the method described in JP 2010-285505 A or JP 2011-197450 A. Can do.
  • the fluorinated aromatic polymer resin is not particularly limited, but is selected from the group consisting of an aromatic ring having at least one fluorine atom, an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond, and an ester bond.
  • the polymer preferably contains a repeating unit containing at least one bond, and can be synthesized, for example, by the method described in JP-A-2008-181121.
  • the acrylic ultraviolet curable resin is not particularly limited, but is synthesized from a resin composition containing a compound having one or more acrylic or methacrylic groups in the molecule and a compound that decomposes by ultraviolet rays to generate active radicals. Can be mentioned.
  • the acrylic ultraviolet curable resin is a base material in which a transparent resin layer containing a compound (A) and a curable resin is laminated on a glass support or a resin support as a base, or a compound ( When using a base material in which a resin layer such as an overcoat layer made of a curable resin or the like is used on a transparent resin substrate containing A), it can be particularly preferably used as the curable resin.
  • Epoxy resin Although it does not restrict
  • the ultraviolet curable epoxy resin for example, synthesized from a composition containing a compound having one or more epoxy groups in the molecule and a compound that generates an acid by ultraviolet rays (hereinafter also referred to as “photo acid generator”).
  • thermosetting epoxy resins include those synthesized from a composition containing one or more epoxy groups in the molecule and an acid anhydride. Can do.
  • the epoxy ultraviolet curable resin contains, as the base material, a base material obtained by laminating a transparent resin layer containing the compound (A) on a glass support or a base resin support, and the compound (A). In the case of using a base material in which a resin layer such as an overcoat layer made of a curable resin is laminated on a transparent resin substrate to be used, it can be particularly suitably used as the curable resin.
  • cyclic polyolefin resins examples include Arton manufactured by JSR Corporation, ZEONOR manufactured by Nippon Zeon Co., Ltd., APEL manufactured by Mitsui Chemicals, Inc., and TOPAS manufactured by Polyplastics Corporation.
  • polyethersulfone resins examples include Sumika Excel PES manufactured by Sumitomo Chemical Co., Ltd.
  • polyimide resins examples include Neoprim L manufactured by Mitsubishi Gas Chemical Co., Ltd.
  • commercially available polycarbonate resins include Pure Ace manufactured by Teijin Limited.
  • Examples of commercially available fluorene polycarbonate resins include Iupizeta EP-5000 manufactured by Mitsubishi Gas Chemical Co., Ltd.
  • Examples of commercially available fluorene polyester resins include OKP4HT manufactured by Osaka Gas Chemical Co., Ltd.
  • Examples of commercially available acrylic resins include NIPPON CATALYST ACRYVIEWER.
  • Examples of commercially available silsesquioxane-based ultraviolet curable resins include Silplus manufactured by Nippon Steel Chemical Co., Ltd.
  • the base material may further contain other dye (X) that does not correspond to the compound (A) and the compound (S).
  • the other dye (X) is not particularly limited as long as it has a maximum absorption wavelength in the region of wavelength less than 650 nm or more than 760 nm and less than 1050 nm, but a dye having an absorption maximum wavelength in the region of more than 760 nm and less than 1050 nm is preferable.
  • examples of such dyes include squarylium compounds, phthalocyanine compounds, cyanine compounds, naphthalocyanine compounds, croconium compounds, octaphyrin compounds, diimonium compounds, pyrrolopyrrole compounds, and boron dipyrromethene (BODIPY). And at least one compound selected from the group consisting of a compound, a perylene compound, and a metal dithiolate compound.
  • the content of the other pigment (X) is, for example, when a substrate made of a transparent resin substrate containing the other pigment (X) is used as the substrate, with respect to 100 parts by weight of the transparent resin.
  • the amount is preferably 0.005 to 1.0 part by weight, more preferably 0.01 to 0.9 part by weight, particularly preferably 0.02 to 0.8 part by weight.
  • It contains a base material in which a transparent resin layer such as an overcoat layer made of a curable resin containing other dye (X) is laminated on a support such as a resin support, or a compound (A).
  • a transparent resin containing other pigment (X) When using a base material in which a resin layer such as an overcoat layer made of a curable resin containing other pigment (X) is laminated on a transparent resin substrate, a transparent resin containing other pigment (X) For 100 parts by weight of the resin forming the layer, 0.05 to 4.0 parts by weight preferred, and more preferably from 0.1 to 3.0 parts by weight, particularly preferably 0.2 to 2.0 parts by weight.
  • the base material may further contain an antioxidant, a near-ultraviolet absorber, a fluorescence quencher, and the like as other components as long as the effects of the present invention are not impaired. These other components may be used alone or in combination of two or more.
  • Examples of the near ultraviolet absorber include azomethine compounds, indole compounds, benzotriazole compounds, triazine compounds, and the like.
  • antioxidants examples include 2,6-di-t-butyl-4-methylphenol, 2,2′-dioxy-3,3′-di-t-butyl-5,5′-dimethyldiphenylmethane, tetrakis [Methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, tris (2,4-di-t-butylphenyl) phosphite and the like.
  • these other components may be mixed with a resin or the like when producing a substrate, or may be added when a resin is synthesized.
  • the addition amount is appropriately selected according to the desired properties, but is usually 0.01 to 5.0 parts by weight, preferably 0.05 to 2.0 parts by weight, based on 100 parts by weight of the resin. Part.
  • the transparent resin substrate can be formed by, for example, melt molding or cast molding, and further, if necessary, After molding, a substrate on which an overcoat layer is laminated can be produced by coating a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent.
  • a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent.
  • the base material is an overcoat comprising a curable resin containing the compound (A) on a support such as a glass support or a base resin support or a transparent resin substrate containing no compound (A).
  • a support such as a glass support or a base resin support or a transparent resin substrate containing no compound (A).
  • the resin solution containing the compound (A) is melt-molded or cast-molded on the support or the transparent resin substrate, preferably spin After coating by a method such as coating, slit coating or ink jetting, the solvent is dried and removed, and if necessary, further irradiation with light or heating is performed, whereby the compound (A) is formed on the support or the transparent resin substrate.
  • the base material in which the transparent resin layer containing this was formed can be manufactured.
  • melt molding a method of melt molding a pellet obtained by melt-kneading a resin, a compound (A) and other components as necessary; a resin, a compound (A) and a necessary
  • Examples include a method of melt-molding pellets.
  • the melt molding method include injection molding, melt extrusion molding, and blow molding.
  • ⁇ Cast molding As the cast molding, a method of removing a solvent by casting a resin composition containing a compound (A), a resin, a solvent and other components as required on a suitable support; or a compound (A) and After removing a solvent by casting a curable composition containing a photocurable resin and / or a thermosetting resin and other components as necessary on an appropriate support, ultraviolet irradiation, heating, etc. It can also be produced by a method of curing by an appropriate method.
  • the base material is a base material made of a transparent resin substrate containing the compound (A)
  • the base material can be obtained by peeling the coating film from the support after cast molding
  • the base material is made of a curable resin containing the compound (A) on a support such as a glass support or a base resin support or a transparent resin substrate containing no compound (A).
  • the substrate can be obtained by not peeling the coating film after cast molding.
  • the support examples include phosphates containing copper components such as near-infrared absorbing glass plates (for example, “BS-11” manufactured by Matsunami Glass Industrial Co., Ltd. and “NF-50T” manufactured by AGC-Techno Glass Co., Ltd.). Glass plate), transparent glass plate (for example, non-alkali glass plate such as “OA-10G” manufactured by Nippon Electric Glass Co., Ltd., “AN100” manufactured by Asahi Glass Co., Ltd.), steel belt, steel drum, and transparent resin (for example, polyester) Film, cyclic olefin resin film) support.
  • BS-11 manufactured by Matsunami Glass Industrial Co., Ltd. and “NF-50T” manufactured by AGC-Techno Glass Co., Ltd.
  • Glass plate for example, non-alkali glass plate such as “OA-10G” manufactured by Nippon Electric Glass Co., Ltd., “AN100” manufactured by Asahi Glass Co., Ltd.
  • steel belt for example, steel drum
  • transparent resin for example,
  • the optical component such as glass plate, quartz or transparent plastic is coated with the resin composition and the solvent is dried, or the curable composition is coated and cured and dried.
  • a transparent resin layer can also be formed on the component.
  • the amount of residual solvent in the transparent resin layer (transparent resin substrate) obtained by the above method should be as small as possible.
  • the amount of the residual solvent is preferably 3% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight with respect to the weight of the transparent resin layer (transparent resin substrate). It is as follows. When the amount of residual solvent is in the above range, a transparent resin layer (transparent resin substrate) that can easily exhibit a desired function, in which deformation and characteristics hardly change can be obtained.
  • the optical filter according to the present invention has a base material that satisfies the requirements (a), (b), and (c), and satisfies the following requirements (d) and (e): (D) In the wavelength range of 430 to 580 nm, the average value (d1) of transmittance when measured from the vertical direction of the optical filter is 75% or more; (E) In the wavelength region of 1100 nm to 1200 nm, the average value (e1) of transmittance when measured from the vertical direction of the optical filter is 5% or less.
  • the optical filter of the present invention satisfies the above requirements (d) and (e), it has excellent transmittance characteristics and near-infrared cut characteristics in the visible wavelength region, has little incident angle dependency, has a color shading suppression effect, and a ghost. It is an optical filter with excellent suppression effect.
  • the average value (d1) of the transmittance in the requirement (d) is preferably 78% or more, more preferably 80% or more, and further preferably 82% or more.
  • the average value (d1) of the transmittance is in this range, excellent imaging sensitivity can be achieved when the optical filter of the present invention is used as a solid-state imaging device.
  • the average value (e1) of the transmittance in requirement (e) is preferably 4% or less, more preferably 3% or less, and even more preferably 2% or less. When the average value (e1) of the transmittance is within this range, good black reproducibility can be achieved near the center of the camera image.
  • the optical filter of the present invention has the base material, the incident angle dependency of the optical characteristics can be reduced even in the form having the dielectric multilayer film.
  • of the difference from the wavelength value (Xb) at which the transmittance when measured from the angle is 50% is preferably less than 20 nm, more preferably less than 15 nm, and even more preferably less than 10 nm. is there.
  • the thickness of the optical filter of the present invention is preferably thin in consideration of the recent trend of thinner and lighter solid-state imaging devices. Since the optical filter of the present invention includes the substrate, it can be thinned.
  • the thickness of the optical filter of the present invention is preferably 210 ⁇ m or less, more preferably 190 ⁇ m or less, further preferably 160 ⁇ m or less, particularly preferably 130 ⁇ m or less, and the lower limit is not particularly limited, but is preferably 20 ⁇ m or more.
  • the optical filter of the present invention preferably has a dielectric multilayer film on at least one surface of the substrate.
  • the dielectric multilayer film in the present invention is a film having the ability to reflect near-infrared rays or a film having an antireflection effect in the visible range. By having a dielectric multilayer film, a better visible light transmittance and near-infrared radiation are obtained. Cut characteristics can be achieved.
  • the dielectric multilayer film may be provided on one side of the substrate or on both sides.
  • the optical filter When it is provided on one side, it is possible to obtain an optical filter that is excellent in production cost and manufacturability and has high strength and is less likely to warp or twist when provided on both sides.
  • the optical filter When the optical filter is applied to a solid-state imaging device, it is preferable that the optical filter is less warped or twisted. Therefore, it is preferable to provide a dielectric multilayer film on both surfaces of the resin substrate.
  • the dielectric multilayer film preferably has reflection characteristics over the entire wavelength range of 700 to 1100 nm, more preferably 700 to 1150 nm, and even more preferably 700 to 1200 nm.
  • the first optical layer mainly having a reflection characteristic in the vicinity of a wavelength of 700 to 950 nm when measured from an angle of 5 ° with respect to the vertical direction of the optical filter is used.
  • a configuration (see FIG. 1 (a)) having a second optical layer on one side of the material and having a reflection characteristic mainly in the vicinity of 900 nm to 1150 nm on the other side of the substrate, and the vertical direction of the optical filter
  • the fourth optical layer having a third optical layer having a reflection characteristic mainly in the vicinity of a wavelength of 700 to 1150 nm on one side of the substrate and having an antireflection characteristic in the visible range.
  • the form (refer FIG.1 (b)) which has on the other surface of material is mentioned.
  • Examples of the dielectric multilayer film include those in which a high refractive index material layer and a low refractive index material layer are alternately laminated.
  • a material constituting the high refractive index material layer a material having a refractive index of 1.7 or more can be used, and a material having a refractive index of usually 1.7 to 2.5 is selected.
  • Such materials include titanium oxide, zirconium oxide, tantalum pentoxide, niobium pentoxide, lanthanum oxide, yttrium oxide, zinc oxide, zinc sulfide, or indium oxide as the main components, and titanium oxide, tin oxide, and / or Alternatively, a material containing a small amount of cerium oxide or the like (for example, 0 to 10% by weight based on the main component) can be used.
  • a material having a refractive index of 1.6 or less can be used, and a material having a refractive index of usually 1.2 to 1.6 is selected.
  • examples of such materials include silica, alumina, lanthanum fluoride, magnesium fluoride, and sodium hexafluoride sodium.
  • the method for laminating the high refractive index material layer and the low refractive index material layer is not particularly limited as long as a dielectric multilayer film in which these material layers are laminated is formed.
  • a multilayer film can be formed.
  • each of the high refractive index material layer and the low refractive index material layer is usually preferably from 0.1 ⁇ to 0.5 ⁇ , where ⁇ (nm) is the near infrared wavelength to be blocked.
  • the value of ⁇ (nm) is, for example, 700 to 1400 nm, preferably 750 to 1300 nm.
  • the optical thickness obtained by multiplying the refractive index (n) by the thickness (d) (n ⁇ d) by ⁇ / 4 the high refractive index material layer, and the low refractive index.
  • the thicknesses of the respective layers of the refractive index material layer are almost the same value, and there is a tendency that the blocking / transmission of a specific wavelength can be easily controlled from the relationship between the optical characteristics of reflection / refraction.
  • the total number of high refractive index material layers and low refractive index material layers in the dielectric multilayer film is preferably 16 to 70 layers, more preferably 20 to 60 layers, as a whole. If the thickness of each layer, the thickness of the dielectric multilayer film as a whole of the optical filter, and the total number of layers are within the above ranges, a sufficient manufacturing margin can be secured, and the warpage of the optical filter and cracks in the dielectric multilayer film can be reduced. can do.
  • the thickness of each layer of the rate material layer, the order of stacking, and the number of stacks it has sufficient light cut characteristics in the near infrared wavelength region while ensuring sufficient transmittance in the visible region, In addition, it is possible to reduce the reflectance when near infrared rays are incident from an oblique direction.
  • optical thin film design software for example, manufactured by Essential Macleod, Thin Film Center Co., Ltd.
  • optical thin film design software for example, manufactured by Essential Macleod, Thin Film Center Co., Ltd.
  • the target transmittance at a wavelength of 400 to 700 nm is set to 100%
  • the target Tolerance value is set to 1
  • the target transmittance at a wavelength of 705 to 950 nm is set to 0%.
  • Parameter setting method such as setting Target Tolerance value to 0.5 can be mentioned.
  • These parameters can change the value of Target Tolerance by further finely dividing the wavelength range according to various characteristics of the substrate (i).
  • the optical filter of the present invention is within the range not impairing the effects of the present invention, between the base material and the dielectric multilayer film, the surface opposite to the surface on which the dielectric multilayer film is provided, or the dielectric multilayer film.
  • an anti-reflection film On the opposite side of the surface of the film where the substrate is provided, an anti-reflection film, a hard layer is used for the purpose of improving the surface hardness of the substrate or the dielectric multilayer film, improving the chemical resistance, antistatic and scratching.
  • Functional films such as a coating film and an antistatic film can be provided as appropriate.
  • the optical filter of the present invention may include one layer made of the functional film or two or more layers.
  • the optical filter of the present invention may include two or more similar layers or two or more different layers.
  • the method of laminating the functional film is not particularly limited, but a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent is melt-molded or cast in the same manner as described above on a base material or a dielectric multilayer film. Examples of the method include molding.
  • it can also be produced by applying a curable composition containing the coating agent or the like on a substrate or a dielectric multilayer film with a bar coater or the like and then curing it by ultraviolet irradiation or the like.
  • the coating agent examples include ultraviolet (UV) / electron beam (EB) curable resins and thermosetting resins. Specifically, vinyl compounds, urethanes, urethane acrylates, acrylates, epoxy And epoxy acrylate resins. Examples of the curable composition containing these coating agents include vinyl, urethane, urethane acrylate, acrylate, epoxy, and epoxy acrylate curable compositions.
  • UV ultraviolet
  • EB electron beam
  • the curable composition may contain a polymerization initiator.
  • a polymerization initiator a known photopolymerization initiator or a thermal polymerization initiator can be used, and a photopolymerization initiator and a thermal polymerization initiator may be used in combination.
  • a polymerization initiator may be used individually by 1 type, and may use 2 or more types together.
  • the blending ratio of the polymerization initiator in the curable composition is preferably 0.1 to 10% by weight, more preferably 0.5 to 10% by weight, when the total amount of the curable composition is 100% by weight. More preferably, it is 1 to 5% by weight.
  • a functional film such as an antireflective film, a hard coat film or an antistatic film having excellent curing characteristics and handleability of the curable composition and having a desired hardness. it can.
  • organic solvent may be added as a solvent to the curable composition, and known organic solvents can be used.
  • organic solvents include alcohols such as methanol, ethanol, isopropanol, butanol and octanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; ethyl acetate, butyl acetate, ethyl lactate, ⁇ -butyrolactone, propylene Esters such as glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate; Ethers such as ethylene glycol monomethyl ether and diethylene glycol monobutyl ether; Aromatic hydrocarbons such as benzene, toluene and xylene; Dimethylformamide, dimethylacetamide, N- Examples include amides such as methylpyrrolidone.
  • solvents may be used alone or in combination of two or more.
  • the thickness of the functional film is preferably 0.1 to 20 ⁇ m, more preferably 0.5 to 10 ⁇ m, and particularly preferably 0.7 to 5 ⁇ m.
  • the corona is applied to the surface of the base material, the functional film or the dielectric multilayer film.
  • Surface treatment such as treatment or plasma treatment may be performed.
  • the optical filter of the present invention has a wide viewing angle and has excellent near-infrared cutting ability and the like. Therefore, it is useful for correcting the visibility of a solid-state imaging device such as a CCD or CMOS image sensor of a camera module.
  • a solid-state imaging device such as a CCD or CMOS image sensor of a camera module.
  • digital still cameras, smartphone cameras, mobile phone cameras, digital video cameras, wearable device cameras, PC cameras, surveillance cameras, automotive cameras, TVs, car navigation systems, personal digital assistants, video game machines, and portable game machines It is useful for fingerprint authentication system, digital music player, etc. Furthermore, it is also useful as a heat ray cut filter attached to a glass plate of an automobile or a building.
  • the solid-state imaging device of the present invention includes the optical filter of the present invention.
  • the solid-state imaging device is an image sensor including a solid-state imaging device such as a CCD or a CMOS image sensor.
  • a digital still camera a camera for a smartphone, a camera for a mobile phone, a camera for a wearable device, a digital camera It can be used for applications such as video cameras.
  • the camera module of the present invention includes the optical filter of the present invention.
  • Parts means “parts by weight” unless otherwise specified.
  • the measurement method of each physical property value and the evaluation method of the physical property are as follows.
  • the molecular weight of the resin was measured by the following method (a) or (b) in consideration of the solubility of each resin in a solvent.
  • GPC gel permeation chromatography
  • Standard polystyrene equivalent weight average molecular weight (Mw) and number average molecular weight (Mn) were measured using a GPC apparatus (HLC-8220 type, column: TSKgel ⁇ -M, developing solvent: THF) manufactured by Tosoh Corporation.
  • the logarithmic viscosity was measured by the following method (c) instead of the molecular weight measurement by the said method.
  • (C) A part of the polyimide resin solution was added to anhydrous methanol to precipitate the polyimide resin, and filtered to separate from the unreacted monomer.
  • 0.1 g of polyimide obtained by vacuum drying at 80 ° C. for 12 hours is dissolved in 20 mL of N-methyl-2-pyrrolidone, and the logarithmic viscosity ( ⁇ ) at 30 ° C. is obtained by the following formula using a Canon-Fenske viscometer. Asked.
  • ⁇ ⁇ ln (t s / t 0) ⁇ / C t 0 : Flowing time of solvent t s : Flowing time of dilute polymer solution C: 0.5 g / dL ⁇ Glass transition temperature (Tg)> Using a differential scanning calorimeter (DSC6200) manufactured by SII Nano Technologies, Inc., the rate of temperature increase was measured at 20 ° C. per minute under a nitrogen stream.
  • the transmittance when measured from the vertical direction of the optical filter the light transmitted perpendicular to the filter is measured as shown in FIG. 2A, and the angle is 30 ° with respect to the vertical direction of the optical filter.
  • the transmittance when measured from the above the light transmitted at an angle of 30 ° with respect to the vertical direction of the filter as shown in FIG. 2B was measured.
  • this transmittance is measured using the spectrophotometer under the condition that light is perpendicularly incident on the substrate and the filter, except when measuring (Xb).
  • it is measured using the spectrophotometer under the condition that light is incident at an angle of 30 ° with respect to the vertical direction of the filter.
  • ⁇ Camera image color shading evaluation> The color shading evaluation when the optical filter was incorporated in the camera module was performed by the following method.
  • a camera module is created in the same manner as in Japanese Patent Application Laid-Open No. 2016-110067, and a white plate having a size of 300 mm ⁇ 400 mm is formed using the created camera module as a D65 light source (standard light source device “Macbeth Judge II” manufactured by X-Rite) Images were taken below, and the difference in color between the center and edge of the white plate in the camera image was evaluated according to the following criteria.
  • the positional relationship between the white plate 112 and the camera module was adjusted so that the white plate 112 occupied 90% or more of the area in the camera image 111 when shooting.
  • Ghost evaluation when the optical filter was incorporated in the camera module was performed by the following method.
  • a camera module is created in the same manner as in Japanese Patent Application Laid-Open No. 2016-110067, and the camera module is used to take a picture under a halogen lamp light source (“Luminer Ace LA-150TX” manufactured by Hayashi Watch Industry Co., Ltd.) in a dark room.
  • a halogen lamp light source (“Luminer Ace LA-150TX” manufactured by Hayashi Watch Industry Co., Ltd.) in a dark room.
  • the degree of ghost generation around the light source in the image was evaluated according to the following criteria.
  • DCM dodec-3-ene
  • ⁇ Resin synthesis example 2> In a 3 L four-necked flask, 35.12 g of 2,6-difluorobenzonitrile, 87.60 g of 9,9-bis (4-hydroxyphenyl) fluorene, 41.46 g of potassium carbonate, N, N-dimethylacetamide (hereinafter referred to as “DMAc”). 443 g and 111 g of toluene were added. Subsequently, a thermometer, a stirrer, a three-way cock with a nitrogen introduction tube, a Dean Stark tube and a cooling tube were attached to the four-necked flask.
  • DMAc N, N-dimethylacetamide
  • the obtained resin B had a number average molecular weight (Mn) of 75,000, a weight average molecular weight (Mw) of 188,000, and a glass transition temperature (Tg) of 285 ° C.
  • ⁇ Resin synthesis example 3> In a 500 mL five-necked flask equipped with a thermometer, stirrer, nitrogen inlet tube, dropping funnel with side tube, Dean-Stark tube and condenser tube, 1,4-bis (4-amino- ⁇ , ⁇ -Dimethylbenzyl) benzene (27.66 g) and 4,4'-bis (4-aminophenoxy) biphenyl (7.38 g) were added and dissolved in ⁇ -butyrolactone (68.65 g) and N, N-dimethylacetamide (17.16 g). The resulting solution was cooled to 5 ° C.
  • resin C A part of this polyimide resin solution was poured into 1 L of methanol to precipitate the polyimide.
  • the IR spectrum of the obtained resin C was measured, 1704 cm -1 characteristic of imido group, absorption of 1770 cm -1 were observed.
  • Resin C had a glass transition temperature (Tg) of 310 ° C. and a logarithmic viscosity of 0.87.
  • Example 1 an optical filter having a base material made of a transparent resin substrate was prepared according to the following procedure and conditions.
  • the peeled coating film was further dried at 100 ° C. under reduced pressure for 8 hours to obtain a base material composed of a transparent resin substrate having a thickness of 0.1 mm, a length of 60 mm, and a width of 60 mm.
  • the spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined. The results are shown in FIG. 3 and Table 5-1.
  • a dielectric multilayer film (I) is formed as a first optical layer on one side of the obtained base material, and a dielectric multilayer film (II) is formed as a second optical layer on the other side of the base material.
  • an optical filter having a thickness of about 0.105 mm was obtained.
  • the dielectric multilayer film (I) is formed by alternately laminating silica (SiO 2 ) layers and titania (TiO 2 ) layers at a deposition temperature of 100 ° C. (26 layers in total).
  • the dielectric multilayer film (II) is formed by alternately laminating silica (SiO 2 ) layers and titania (TiO 2 ) layers at a deposition temperature of 100 ° C. (20 layers in total).
  • the silica layer and the titania layer are in order of the titania layer, the silica layer, the titania layer,..., The silica layer, the titania layer, and the silica layer from the substrate side.
  • the outermost layer of the optical filter was a silica layer.
  • the dielectric multilayer films (I) and (II) were designed as follows.
  • the wavelength-dependent characteristics of the base material refractive index and the applied compound (S) and compound (in order to achieve the antireflection effect in the visible range and the selective transmission / reflection performance in the near infrared range Optimization was performed using optical thin film design software (Essential Macleod, Thin Film Center) according to the absorption characteristics of A).
  • optical thin film design software Essential Macleod, Thin Film Center
  • the input parameters (Target values) to the software are as shown in Table 3 below.
  • the dielectric multilayer film (I) is formed by alternately stacking a silica layer having a film thickness of 31 to 157 nm and a titania layer having a film thickness of 10 to 95 nm.
  • the dielectric multi-layer film (II) is a multi-layer vapor-deposited film having 20 layers, in which a silica layer having a thickness of 37 to 194 nm and a titania layer having a thickness of 12 to 114 nm are alternately stacked. It was.
  • An example of the optimized film configuration is shown in Table 4 below.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • the results are shown in FIG. 4 and Table 5-1.
  • the average value of transmittance at a wavelength of 430 to 580 nm was 84%
  • the average value of transmittance at a wavelength of 1100 to 1200 nm was 1% or less
  • Example 2 an optical filter having a base material made of a transparent resin substrate was prepared according to the following procedure and conditions.
  • Example 1 0.04 part of the compound (A-3) represented by the following formula (a-3) (absorption maximum wavelength 703 nm in dichloromethane) as the compound (A) and the following formula (a-4) Compound (a-4) (absorption maximum wavelength in dichloromethane 736 nm) 0.08 part was used, and compound (s-8) described in Table 2-3 above as compound (S) (in dichloromethane) 0.06 parts of absorption maximum wavelength (1096 nm) and other dye (X) represented by the following formula (X-1) (X-1) (absorption maximum wavelength in dichloromethane: 887 nm)
  • X-1 absorption maximum wavelength in dichloromethane: 887 nm
  • a base material made of a transparent resin substrate containing the compound (A) and the compound (S) was obtained in the same procedure and conditions as in Example 1 except that 0.01 part was used. The spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1
  • a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
  • the multilayer film (III) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as the second optical layer on the other surface of the base material (20 layers in total).
  • a dielectric multilayer film (IV) was formed to obtain an optical filter having a thickness of about 0.105 mm.
  • the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependency of the base material refractive index.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 3 an optical filter having a base material composed of a transparent resin substrate having a resin layer on both sides was prepared according to the following procedure and conditions.
  • Example 1 0.06 part of compound (a-4) as compound (A) and compound (a-5) represented by the following formula (a-5) (absorption maximum wavelength in dichloromethane: 713 nm) 0.06 Example 1 except that 0.08 part of the compound (s-13) described in Table 2-4 (maximum absorption wavelength 1096 nm in dichloromethane) was used as the compound (S). A transparent resin substrate containing the compound (A) and the compound (S) was obtained in the same procedure and conditions.
  • a resin composition (1) having the following composition was applied to one side of the obtained transparent resin substrate with a bar coater and heated in an oven at 70 ° C. for 2 minutes to volatilize and remove the solvent. At this time, the coating conditions of the bar coater were adjusted so that the thickness after drying was 2 ⁇ m. Next, it exposed using the conveyor type exposure machine (exposure amount 500mJ / cm ⁇ 2 >, 200mW), the resin composition (1) was hardened, and the resin layer was formed on the substrate made from transparent resin. Similarly, a resin layer made of the resin composition (1) is formed on the other surface of the transparent resin substrate, and the resin layers are provided on both surfaces of the transparent resin substrate containing the compound (A) and the compound (S). A substrate was obtained. The spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined. The results are shown in Table 5-1.
  • Resin composition (1) 60 parts by weight of tricyclodecane dimethanol diacrylate, 40 parts by weight of dipentaerythritol hexaacrylate, 5 parts by weight of 1-hydroxycyclohexyl phenyl ketone, methyl ethyl ketone (solvent, solid content concentration (TSC): 30% )
  • a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
  • a dielectric multilayer film (VI) was formed to obtain an optical filter having a thickness of about 0.109 mm.
  • the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 4 an optical filter having a substrate formed by forming a transparent resin layer containing the compound (A) on both surfaces of a resin support was prepared according to the following procedure and conditions.
  • Resin A obtained in Resin Synthesis Example 1 and methylene chloride were added to a container to prepare a solution having a resin concentration of 20% by weight, and the resin substrate of Example 1 was used except that the obtained solution was used.
  • a resin support was prepared in the same manner as the preparation.
  • Example 3 In the same manner as in Example 3, a resin layer made of the resin composition (2) having the following composition was formed on both surfaces of the obtained resin support, and the compound (A) and the compound ( A base material formed by forming a transparent resin layer containing S) was obtained. The spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined. The results are shown in Table 5-1.
  • Resin composition (2) 100 parts by weight of tricyclodecane dimethanol diacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.10 parts by weight of compound (a-1), 0.10 parts by weight of compound (a-2) Parts, 1.75 parts by weight of compound (s-6), methyl ethyl ketone (solvent, TSC: 25%)
  • a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
  • a dielectric multilayer film (VIII) was formed to obtain an optical filter having a thickness of about 0.109 mm.
  • the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 5 an optical filter having a base material composed of a transparent glass substrate having a transparent resin layer containing the compound (A) on one side was prepared by the following procedure and conditions.
  • a resin composition (3) having the following composition was applied with a spin coater.
  • the solvent was volatilized and removed by heating on a hot plate at 80 ° C. for 2 minutes.
  • coating conditions of the spin coater were adjusted so that the thickness after drying might be set to 2 micrometers.
  • Resin composition (3) 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.20 part by weight of compound (a-1), compound (A-2) 0.20 part by weight, compound (s-6) 3.50 part by weight, methyl ethyl ketone (solvent, TSC: 35%)
  • a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
  • a multilayer film (IX) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the base material (20 layers in total)
  • a dielectric multilayer film (X) was formed to obtain an optical filter having a thickness of about 0.107 mm.
  • the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 6 an optical filter having a base material composed of a near-infrared absorbing glass substrate having a transparent resin layer containing the compound (A) on one side was prepared by the following procedure and conditions.
  • a resin composition (4) having the following composition was applied on a near infrared absorbing glass substrate “BS-11 (thickness 120 ⁇ m)” (manufactured by Matsunami Glass Industry Co., Ltd.) cut to a size of 60 mm in length and 60 mm in width with a spin coater. Then, the solvent was volatilized and removed by heating at 80 ° C. for 2 minutes on a hot plate. Under the present circumstances, the application
  • Resin composition (4) 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.15 part by weight of compound (a-3), compound (A-4) 0.30 part by weight, methyl ethyl ketone (solvent, TSC: 35%)
  • a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
  • a multilayer film (XI) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the substrate (20 layers in total).
  • a dielectric multilayer film (XII) was formed to obtain an optical filter having a thickness of about 0.107 mm.
  • the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 7 an optical filter having a base material made of a transparent resin substrate containing the compound (A) and having a transparent resin layer containing near-infrared absorbing fine particles on both surfaces was prepared according to the following procedure and conditions.
  • Example 2 a transparent resin substrate containing compound (A) was obtained by the same procedure and conditions as in Example 2 except that compound (S-8) and the other dye (X-1) were not used. It was.
  • a base material made of a transparent resin substrate containing (A) was obtained.
  • the spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined.
  • the results are shown in FIG. 7 and Table 5-1.
  • Resin composition (5) 100 parts by weight of tricyclodecane dimethanol diacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 35 parts by weight of near-infrared absorbing fine particle dispersion (YMF-02A manufactured by Sumitomo Metal Mining Co., Ltd.) About 10 parts by weight in terms of solid content), methyl ethyl ketone (solvent, TSC: 30%)
  • a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
  • a dielectric multilayer film (XIV) was formed to obtain an optical filter having a thickness of about 0.109 mm.
  • the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
  • the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 8 to 13 Resin, solvent, drying conditions of resin substrate, compound (A), compound (S), and other dye (X) were changed in the same manner as in Example 3 except for changing as shown in Table 5-1. Materials and optical filters were made. The optical properties of the obtained substrate and optical filter are shown in Table 5-1. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
  • Example 1 In Example 1, except that the compound (S) and the compound (A) were not used, a substrate and an optical filter were prepared in the same manner as in Example 1, and optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 1 exhibits relatively good visible light transmittance, the optical property has a large incident angle dependency, and the base material has no absorption in the vicinity of 700 nm or in the near infrared wavelength region. Therefore, it was confirmed that the color shading suppression effect and the ghost suppression effect were inferior.
  • Comparative Example 2 An optical filter was prepared and the optical characteristics were evaluated in the same manner as in Example 1 except that a transparent glass substrate “OA-10G (thickness 150 ⁇ m)” (manufactured by Nippon Electric Glass Co., Ltd.) was used as the substrate. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 2 shows relatively good visible light transmittance, the optical property has a large incident angle dependency, and the base material has no absorption in the vicinity of 700 nm or near infrared wavelength region. Therefore, it was confirmed that the color shading suppression effect and the ghost suppression effect were inferior.
  • OA-10G thickness 150 ⁇ m
  • Example 3 An optical filter was prepared in the same manner as in Example 1 except that a near-infrared absorbing glass substrate “BS-11 (thickness 120 ⁇ m)” (manufactured by Matsunami Glass Industry Co., Ltd.) was used as a base material, and optical characteristics were evaluated. did. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 3 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was poor.
  • BS-11 thickness 120 ⁇ m
  • Example 4 In Example 3, 0.08 part of compound (a-4) and 0.06 part of compound (a-5) were used as compound (A) without using compound (S), and dye (X— 1) Except having used 0.01 part, the base material and the optical filter were created like Example 3, and the optical characteristic was evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 5 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the near-infrared wavelength region of the substrate was not sufficient and the ghost suppression effect was inferior.
  • Example 6 a substrate and an optical filter were prepared in the same manner as in Example 6 except that the resin composition (6) having the following composition was used instead of the resin composition (4).
  • Resin composition (6) 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.15 part by weight of compound (a-1), methyl ethyl ketone (Solvent, TSC: 35%)
  • the optical properties of the obtained substrate and optical filter were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2.
  • the spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 5 showed relatively good optical properties, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was poor.
  • Example 6 In Example 3, 0.04 part of the compound (a-3) and 0.08 part of the compound (a-4) were used as the compound (A), and 0.01% of the compound (s-6) was used as the compound (S). A substrate and an optical filter were prepared in the same manner as in Example 3 except that the parts were used, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 6 showed relatively good optical properties, it was confirmed that the absorption intensity in the near infrared wavelength region of the substrate was not sufficient and the ghost suppression effect was inferior.
  • Example 3 except that 0.04 part of the compound (a-1) was used as the compound (A) and 0.07 part of the compound (s-6) was used as the compound (S) in Example 3.
  • a substrate and an optical filter were prepared in the same manner as described above, and the optical characteristics were evaluated.
  • a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2.
  • the optical filter obtained in Comparative Example 7 showed relatively good optical properties, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was inferior.
  • Example 8 In Example 3, 0.04 part of compound (a-1) was used as compound (A), and compound (s-14) described in Table 2-4 above (absorption in dichloromethane) was used as compound (S). A substrate and an optical filter were prepared in the same manner as in Example 3 except that 0.45 part of the maximum wavelength (1097 nm) was used, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 8 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was inferior.
  • Optical filter 2 Spectrophotometer 3: Light 10: Base material 11: First optical layer 12: Second optical layer 13: Third optical layer 14: Fourth optical layer 111: Camera image 112: White plate 113: Example of the center of the white plate 114: Example of the edge of the white plate 121: Camera image 122: Light source 123: Example of ghost around the light source

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Optical Filters (AREA)
  • Laminated Bodies (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Blocking Light For Cameras (AREA)
PCT/JP2017/031156 2016-08-31 2017-08-30 光学フィルターおよび光学フィルターを用いた装置 WO2018043564A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020197005541A KR102388961B1 (ko) 2016-08-31 2017-08-30 광학 필터 및 광학 필터를 사용한 장치
CN202110181464.7A CN112946804B (zh) 2016-08-31 2017-08-30 光学滤波器及使用光学滤波器的装置
JP2018537346A JP6791251B2 (ja) 2016-08-31 2017-08-30 光学フィルターおよび光学フィルターを用いた装置
CN201780052711.5A CN109642973B (zh) 2016-08-31 2017-08-30 光学滤波器及使用光学滤波器的装置
KR1020217038932A KR102434709B1 (ko) 2016-08-31 2017-08-30 광학 필터 및 광학 필터를 사용한 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-169260 2016-08-31
JP2016169260 2016-08-31

Publications (1)

Publication Number Publication Date
WO2018043564A1 true WO2018043564A1 (ja) 2018-03-08

Family

ID=61300840

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/031156 WO2018043564A1 (ja) 2016-08-31 2017-08-30 光学フィルターおよび光学フィルターを用いた装置

Country Status (4)

Country Link
JP (2) JP6791251B2 (ko)
KR (2) KR102388961B1 (ko)
CN (2) CN112946804B (ko)
WO (1) WO2018043564A1 (ko)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200004237A (ko) * 2018-07-03 2020-01-13 주식회사 엘엠에스 지문인식센서용 광학원판 및 이를 포함하는 광학필터
JP2020037719A (ja) * 2018-09-03 2020-03-12 日本電気硝子株式会社 ガラス物品の製造方法、及び枠部材
WO2020054718A1 (ja) * 2018-09-14 2020-03-19 富士フイルム株式会社 近赤外線吸収性組成物、分散液の製造方法、膜、光学フィルタ、パターン形成方法、積層体、固体撮像素子、画像表示装置及び赤外線センサ
WO2020054695A1 (ja) * 2018-09-12 2020-03-19 Jsr株式会社 光学フィルターおよびその用途
JPWO2020196051A1 (ko) * 2019-03-28 2020-10-01
CN111983743A (zh) * 2019-05-21 2020-11-24 Jsr株式会社 光学滤波器、摄像装置与照相机模块
WO2020241535A1 (ja) 2019-05-31 2020-12-03 富士フイルム株式会社 光センサおよびセンシング装置
WO2020255927A1 (ja) * 2019-06-20 2020-12-24 Ａｇｃ株式会社 光学フィルタ、撮像装置および光学センサー
CN112147731A (zh) * 2019-06-27 2020-12-29 Jsr株式会社 光学滤波器、固体摄像装置、照相机模块、生物体认证装置、光学滤波器用树脂层
JPWO2021256116A1 (ko) * 2020-06-15 2021-12-23
WO2022085636A1 (ja) * 2020-10-21 2022-04-28 Ａｇｃ株式会社 光学フィルタ
WO2022130773A1 (ja) 2020-12-17 2022-06-23 富士フイルム株式会社 組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
WO2022131191A1 (ja) 2020-12-16 2022-06-23 富士フイルム株式会社 組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
JP7415815B2 (ja) 2020-06-22 2024-01-17 Ａｇｃ株式会社 光学フィルタ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021009271A (ja) * 2019-07-03 2021-01-28 Jsr株式会社 カメラモジュールおよび電子機器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338395A (ja) * 2004-05-26 2005-12-08 Jsr Corp 近赤外線カットフィルターおよびその製造方法
JP2006301489A (ja) * 2005-04-25 2006-11-02 Nidec Copal Corp 近赤外線カットフィルタ
JP2007131748A (ja) * 2005-11-10 2007-05-31 Nippon Shokubai Co Ltd 近赤外線吸収剤を含有する感圧接着剤組成物およびその用途
WO2012169447A1 (ja) * 2011-06-06 2012-12-13 旭硝子株式会社 光学フィルタ、固体撮像素子、撮像装置用レンズおよび撮像装置
JP2014059550A (ja) * 2012-08-23 2014-04-03 Asahi Glass Co Ltd 近赤外線カットフィルタ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163813B2 (ja) 1992-12-28 2001-05-08 日本ゼオン株式会社 近赤外線吸収樹脂組成物、および成形品
JP4736373B2 (ja) * 2004-08-03 2011-07-27 日油株式会社 近赤外線吸収材及びそれを用いた表示装置
JP5489669B2 (ja) 2008-11-28 2014-05-14 Ｊｓｒ株式会社 近赤外線カットフィルターおよび近赤外線カットフィルターを用いた装置
KR101414139B1 (ko) 2012-09-03 2014-08-06 장 제임스 멀티 롤러를 구비하는 스냅링
JP6263843B2 (ja) 2013-02-28 2018-01-24 株式会社リコー 通信管理システム、通信管理方法、及びプログラム
CN105122095B (zh) * 2013-04-10 2017-07-21 旭硝子株式会社 红外线遮蔽滤波器、固体摄像元件、摄像装置和显示装置
WO2014168189A1 (ja) * 2013-04-10 2014-10-16 旭硝子株式会社 赤外線遮蔽フィルタ
KR101590137B1 (ko) 2013-08-30 2016-02-01 주식회사 솔켐 디시아노페닐기를 함유한 스티렌계 공중합체 및 이로부터 형성된 프탈로시아닌계 화합물
WO2015056734A1 (ja) * 2013-10-17 2015-04-23 Jsr株式会社 光学フィルター、固体撮像装置およびカメラモジュール
KR101801671B1 (ko) * 2014-01-31 2017-11-27 후지필름 가부시키가이샤 컬러 필터용 녹색 착색 조성물, 착색막, 컬러 필터, 고체 촬상 소자
JP2015200878A (ja) * 2014-03-31 2015-11-12 富士フイルム株式会社 赤外線センサ、近赤外線吸収組成物、硬化膜、近赤外線吸収フィルタ、イメージセンサ、カメラモジュールおよび化合物
JP6358114B2 (ja) * 2015-02-02 2018-07-18 Jsr株式会社 光学フィルターおよび光学フィルターを用いた装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338395A (ja) * 2004-05-26 2005-12-08 Jsr Corp 近赤外線カットフィルターおよびその製造方法
JP2006301489A (ja) * 2005-04-25 2006-11-02 Nidec Copal Corp 近赤外線カットフィルタ
JP2007131748A (ja) * 2005-11-10 2007-05-31 Nippon Shokubai Co Ltd 近赤外線吸収剤を含有する感圧接着剤組成物およびその用途
WO2012169447A1 (ja) * 2011-06-06 2012-12-13 旭硝子株式会社 光学フィルタ、固体撮像素子、撮像装置用レンズおよび撮像装置
JP2014059550A (ja) * 2012-08-23 2014-04-03 Asahi Glass Co Ltd 近赤外線カットフィルタ

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102158811B1 (ko) 2018-07-03 2020-09-22 주식회사 엘엠에스 지문인식센서용 광학원판 및 이를 포함하는 광학필터
KR20200004237A (ko) * 2018-07-03 2020-01-13 주식회사 엘엠에스 지문인식센서용 광학원판 및 이를 포함하는 광학필터
JP2020037719A (ja) * 2018-09-03 2020-03-12 日本電気硝子株式会社 ガラス物品の製造方法、及び枠部材
TWI753299B (zh) * 2018-09-12 2022-01-21 日商Ｊｓｒ股份有限公司 光學濾波器及其用途
WO2020054695A1 (ja) * 2018-09-12 2020-03-19 Jsr株式会社 光学フィルターおよびその用途
CN112585508B (zh) * 2018-09-12 2023-02-28 Jsr株式会社 光学滤波器、固体摄像装置及照相机模块
JP7255600B2 (ja) 2018-09-12 2023-04-11 Jsr株式会社 光学フィルターおよびその用途
CN112585508A (zh) * 2018-09-12 2021-03-30 Jsr株式会社 光学滤波器及其用途
JPWO2020054695A1 (ja) * 2018-09-12 2021-08-30 Jsr株式会社 光学フィルターおよびその用途
JPWO2020054718A1 (ja) * 2018-09-14 2021-09-30 富士フイルム株式会社 近赤外線吸収性組成物、分散液の製造方法、膜、光学フィルタ、パターン形成方法、積層体、固体撮像素子、画像表示装置及び赤外線センサ
WO2020054718A1 (ja) * 2018-09-14 2020-03-19 富士フイルム株式会社 近赤外線吸収性組成物、分散液の製造方法、膜、光学フィルタ、パターン形成方法、積層体、固体撮像素子、画像表示装置及び赤外線センサ
KR102566220B1 (ko) * 2018-09-14 2023-08-11 후지필름 가부시키가이샤 근적외선 흡수성 조성물, 분산액의 제조 방법, 막, 광학 필터, 패턴 형성 방법, 적층체, 고체 촬상 소자, 화상 표시 장치 및 적외선 센서
JP7142711B2 (ja) 2018-09-14 2022-09-27 富士フイルム株式会社 近赤外線吸収性組成物、分散液の製造方法、膜、光学フィルタ、パターン形成方法、積層体、固体撮像素子、画像表示装置及び赤外線センサ
KR20210033506A (ko) * 2018-09-14 2021-03-26 후지필름 가부시키가이샤 근적외선 흡수성 조성물, 분산액의 제조 방법, 막, 광학 필터, 패턴 형성 방법, 적층체, 고체 촬상 소자, 화상 표시 장치 및 적외선 센서
JP7347498B2 (ja) 2019-03-28 2023-09-20 Ａｇｃ株式会社 光学フィルタ
CN113573888A (zh) * 2019-03-28 2021-10-29 Ａｇｃ株式会社 光学滤波器
WO2020196051A1 (ja) * 2019-03-28 2020-10-01 Ａｇｃ株式会社 光学フィルタ
JPWO2020196051A1 (ko) * 2019-03-28 2020-10-01
CN113573888B (zh) * 2019-03-28 2023-02-28 Ａｇｃ株式会社 光学滤波器
CN111983743B (zh) * 2019-05-21 2024-02-27 Jsr株式会社 光学滤波器、摄像装置与照相机模块
CN111983743A (zh) * 2019-05-21 2020-11-24 Jsr株式会社 光学滤波器、摄像装置与照相机模块
WO2020241535A1 (ja) 2019-05-31 2020-12-03 富士フイルム株式会社 光センサおよびセンシング装置
WO2020255927A1 (ja) * 2019-06-20 2020-12-24 Ａｇｃ株式会社 光学フィルタ、撮像装置および光学センサー
JP7484911B2 (ja) 2019-06-20 2024-05-16 Ａｇｃ株式会社 光学フィルタ、撮像装置および光学センサー
CN112147731A (zh) * 2019-06-27 2020-12-29 Jsr株式会社 光学滤波器、固体摄像装置、照相机模块、生物体认证装置、光学滤波器用树脂层
CN112147731B (zh) * 2019-06-27 2023-12-05 Jsr株式会社 光学滤波器、固体摄像装置及照相机模块
WO2021256116A1 (ja) * 2020-06-15 2021-12-23 富士フイルム株式会社 赤外線吸収組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
JPWO2021256116A1 (ko) * 2020-06-15 2021-12-23
JP7397195B2 (ja) 2020-06-15 2023-12-12 富士フイルム株式会社 赤外線吸収組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
JP7415815B2 (ja) 2020-06-22 2024-01-17 Ａｇｃ株式会社 光学フィルタ
WO2022085636A1 (ja) * 2020-10-21 2022-04-28 Ａｇｃ株式会社 光学フィルタ
WO2022131191A1 (ja) 2020-12-16 2022-06-23 富士フイルム株式会社 組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ
WO2022130773A1 (ja) 2020-12-17 2022-06-23 富士フイルム株式会社 組成物、膜、光学フィルタ、固体撮像素子、画像表示装置および赤外線センサ

Also Published As

Publication number Publication date
JP7088261B2 (ja) 2022-06-21
KR102434709B1 (ko) 2022-08-22
KR20210150591A (ko) 2021-12-10
CN112946804B (zh) 2023-03-24
JP2021028726A (ja) 2021-02-25
JP6791251B2 (ja) 2020-11-25
KR20190040973A (ko) 2019-04-19
CN112946804A (zh) 2021-06-11
KR102388961B1 (ko) 2022-04-22
CN109642973B (zh) 2021-06-08
CN109642973A (zh) 2019-04-16
JPWO2018043564A1 (ja) 2019-06-24

Similar Documents

Publication Publication Date Title
JP7088261B2 (ja) 光学フィルターおよび光学フィルターを用いた装置
JP6627864B2 (ja) 光学フィルターおよび光学フィルターを用いた装置
JP6358114B2 (ja) 光学フィルターおよび光学フィルターを用いた装置
JP7163918B2 (ja) 近赤外線カットフィルターおよび該近赤外線カットフィルターを用いた装置
WO2017213047A1 (ja) 光学フィルターおよび光学センサー装置
JP7405228B2 (ja) 光学フィルター用樹脂組成物、光学フィルター、カメラモジュールおよび電子機器
WO2014002864A1 (ja) 固体撮像素子用光学フィルターおよびその用途
WO2017164024A1 (ja) 光学フィルターおよび光学フィルターを用いた装置
JP6578718B2 (ja) 光学フィルターおよび光学フィルターを用いた装置
WO2015022892A1 (ja) 光学フィルターおよび前記フィルターを用いた装置
JP2017032685A (ja) 光学フィルターおよび光学フィルターを用いた装置
JP6693585B2 (ja) 光学フィルターおよび光学フィルターを用いた装置
CN112180487A (zh) 照相机模块及电子设备
JP7505259B2 (ja) 光学フィルターおよびその用途
JP7207395B2 (ja) 光学フィルターおよび光学フィルターを用いた装置
JP2019053157A (ja) 光学フィルターおよび光学フィルターを用いた装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17846568

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2018537346

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20197005541

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17846568

Country of ref document: EP

Kind code of ref document: A1