WO2018043564A1 - Optical filter and device using optical filter - Google Patents
Optical filter and device using optical filter Download PDFInfo
- Publication number
- WO2018043564A1 WO2018043564A1 PCT/JP2017/031156 JP2017031156W WO2018043564A1 WO 2018043564 A1 WO2018043564 A1 WO 2018043564A1 JP 2017031156 W JP2017031156 W JP 2017031156W WO 2018043564 A1 WO2018043564 A1 WO 2018043564A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin
- group
- compound
- optical filter
- substrate
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 205
- 150000001875 compounds Chemical class 0.000 claims abstract description 226
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 238000010521 absorption reaction Methods 0.000 claims abstract description 73
- 229920005989 resin Polymers 0.000 claims description 245
- 239000011347 resin Substances 0.000 claims description 245
- 239000000463 material Substances 0.000 claims description 114
- 239000010408 film Substances 0.000 claims description 88
- 238000002834 transmittance Methods 0.000 claims description 86
- 125000004432 carbon atom Chemical group C* 0.000 claims description 32
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 26
- -1 polyparaphenylene Polymers 0.000 claims description 24
- 238000003384 imaging method Methods 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 125000001424 substituent group Chemical group 0.000 claims description 12
- 229920005668 polycarbonate resin Polymers 0.000 claims description 11
- 239000004431 polycarbonate resin Substances 0.000 claims description 11
- 239000009719 polyimide resin Substances 0.000 claims description 11
- 125000000623 heterocyclic group Chemical group 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 125000004122 cyclic group Chemical group 0.000 claims description 9
- 229920005672 polyolefin resin Polymers 0.000 claims description 9
- 150000001450 anions Chemical class 0.000 claims description 8
- 125000004429 atom Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229920001225 polyester resin Polymers 0.000 claims description 8
- 239000004645 polyester resin Substances 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229920000570 polyether Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000004695 Polyether sulfone Substances 0.000 claims description 5
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 5
- 229920006393 polyether sulfone Polymers 0.000 claims description 5
- 239000002952 polymeric resin Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 125000004437 phosphorous atom Chemical group 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 4
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical class [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 125000004642 (C1-C12) alkoxy group Chemical group 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 3
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 3
- 125000002252 acyl group Chemical group 0.000 claims description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 229920001230 polyarylate Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 claims description 3
- 239000012788 optical film Substances 0.000 claims description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 230000001629 suppression Effects 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 192
- 239000002585 base Substances 0.000 description 87
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 75
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 42
- 238000000034 method Methods 0.000 description 39
- 239000011521 glass Substances 0.000 description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 31
- 239000002904 solvent Substances 0.000 description 28
- 230000003595 spectral effect Effects 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 26
- 239000011342 resin composition Substances 0.000 description 22
- 239000000243 solution Substances 0.000 description 22
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 239000000975 dye Substances 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 239000006096 absorbing agent Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 229910010413 TiO 2 Inorganic materials 0.000 description 14
- 238000000465 moulding Methods 0.000 description 14
- 238000000576 coating method Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 238000003786 synthesis reaction Methods 0.000 description 11
- 238000000411 transmission spectrum Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 6
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 6
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000706 filtrate Substances 0.000 description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000002950 monocyclic group Chemical group 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- 238000007142 ring opening reaction Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000000738 acetamido group Chemical group [H]C([H])([H])C(=O)N([H])[*] 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000004708 n-butylthio group Chemical group C(CCC)S* 0.000 description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004706 n-propylthio group Chemical group C(CC)S* 0.000 description 2
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical class N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical class C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 description 2
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WLTSXAIICPDFKI-FNORWQNLSA-N (E)-3-dodecene Chemical compound CCCCCCCC\C=C\CC WLTSXAIICPDFKI-FNORWQNLSA-N 0.000 description 1
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- BNBRIFIJRKJGEI-UHFFFAOYSA-N 2,6-difluorobenzonitrile Chemical compound FC1=CC=CC(F)=C1C#N BNBRIFIJRKJGEI-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ROHFBIREHKPELA-UHFFFAOYSA-N 2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]prop-2-enoic acid;methane Chemical compound C.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O.CC(C)(C)C1=CC(CC(=C)C(O)=O)=CC(C(C)(C)C)=C1O ROHFBIREHKPELA-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 1
- HESXPOICBNWMPI-UHFFFAOYSA-N 4-[2-[4-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=C(C(C)(C)C=2C=CC(N)=CC=2)C=CC=1C(C)(C)C1=CC=C(N)C=C1 HESXPOICBNWMPI-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- NRNFFDZCBYOZJY-UHFFFAOYSA-N C=C(C=C1)C=CC1=C Chemical compound C=C(C=C1)C=CC1=C NRNFFDZCBYOZJY-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical group [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- BCTOWEAPQVVELZ-UHFFFAOYSA-L [F-].[F-].F.F.F.F.[Na+].[Na+] Chemical compound [F-].[F-].F.F.F.F.[Na+].[Na+] BCTOWEAPQVVELZ-UHFFFAOYSA-L 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JMVIPXWCEHBYAH-UHFFFAOYSA-N cyclohexanone;ethyl acetate Chemical compound CCOC(C)=O.O=C1CCCCC1 JMVIPXWCEHBYAH-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- OVTCUIZCVUGJHS-UHFFFAOYSA-N dipyrrin Chemical compound C=1C=CNC=1C=C1C=CC=N1 OVTCUIZCVUGJHS-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000000869 ion-assisted deposition Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000006606 n-butoxy group Chemical group 0.000 description 1
- 125000006126 n-butyl sulfonyl group Chemical group 0.000 description 1
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical class Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B23/00—Methine or polymethine dyes, e.g. cyanine dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B47/00—Porphines; Azaporphines
- C09B47/04—Phthalocyanines abbreviation: Pc
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
- C09B57/00—Other synthetic dyes of known constitution
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/26—Reflecting filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Definitions
- the present invention relates to an optical filter and an apparatus using the optical filter. Specifically, the present invention relates to an optical filter containing a compound having absorption in a specific wavelength region, and a solid-state imaging device and a camera module using the optical filter.
- a solid-state image pickup device such as a video camera, a digital still camera, or a mobile phone with a camera function uses a CCD or CMOS image sensor, which is a solid-state image pickup device for a color image.
- Silicon photodiodes that are sensitive to near infrared rays that cannot be sensed by the eyes are used. These solid-state image sensors need to be corrected for visibility so that they appear natural to the human eye.
- Optical filters that selectively transmit or cut light in a specific wavelength region (for example, near-infrared cut) Filter) is often used.
- a near-infrared cut filter those manufactured by various methods are conventionally used.
- a near-infrared cut filter in which a transparent resin is used as a substrate and a near-infrared absorbing pigment is contained in the transparent resin is known (see, for example, Patent Document 1).
- the near-infrared cut filter described in Patent Document 1 may not always have sufficient near-infrared absorption characteristics.
- Patent Document 2 proposes a near-infrared cut filter having both a wide viewing angle and a high visible light transmittance.
- Patent Document 3 discloses a near-infrared cut filter that uses a phthalocyanine dye having a specific structure to achieve both a high visible light transmittance and a long absorption maximum wavelength, both of which have been the conventional problems. It is described that can be obtained.
- the applied base material has a sufficiently strong absorption band in the vicinity of 700 nm, but the near-infrared wavelength region of 900 to 1200 nm, for example. Has almost no absorption. For this reason, light in the near-infrared wavelength region is cut almost only by the reflection of the dielectric multilayer film, but in such a configuration, slight stray light due to internal reflection in the optical filter and reflection between the optical filter and the lens is obtained.
- ghosts and flares may occur.
- Patent Document 4 As an optical filter using a substrate having a wide absorption in the near-infrared wavelength region, an infrared shielding filter as in Patent Document 4 has been proposed.
- a broad absorption in the near-infrared wavelength region is achieved mainly by applying a compound having a dithiolene structure, but the absorption intensity near 700 nm is not sufficient.
- image degradation may occur due to color shading.
- Patent Document 5 discloses a near-infrared cut filter having a near-infrared absorbing glass substrate and a layer containing a near-infrared absorbing pigment, but the color shading is sufficiently improved even with the configuration described in Patent Document 5.
- FIG. 5 of Patent Document 5 shows an optical characteristic graph when incident at 0 degrees and incident at 30 degrees. However, the visible light transmission band is also observed when incident at 30 degrees. A large wavelength shift is observed in the skirt region (630 to 700 nm).
- the present inventors have a base material that has an absorption band with sufficient intensity in the vicinity of a wavelength of 700 nm and a wide absorption band in the near-infrared wavelength region of 900 nm or more.
- an optical filter capable of achieving the intended near-infrared cut characteristics, visible light transmittance, color shading suppression effect and ghost suppression effect can be obtained, and the present invention has been completed. Examples of embodiments of the present invention are shown below.
- An optical filter having a substrate that satisfies the following requirements (a), (b), and (c), and that satisfies the following requirements (d) and (e): (A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm; (B) The difference (X 2 ⁇ X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more; (C) The transmittance at a wavelength of 900 nm, the transmittance at a wavelength of 1000 nm, and the transmittance at a wavelength of 1100 nm are all 65% or less; (D) In the wavelength range of 430 to 580 nm, the average transmittance when measured from the vertical direction of the optical filter is 75% or more; (E) In the wavelength region of 1100 nm to 1200
- R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ⁇ L e, (L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3
- the substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms, Adjacent R 3 may form a ring which may have a substituent L, n represents an integer of 0 to 4, X represents an anion necessary to neutralize the charge, M represents a metal atom, Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom; y represents 0 or 1.
- the transparent resin constituting the transparent resin layer is a cyclic polyolefin resin, aromatic polyether resin, polyimide resin, fluorene polycarbonate resin, fluorene polyester resin, polycarbonate resin, polyamide resin, polyarylate.
- Resin polysulfone resin, polyethersulfone resin, polyparaphenylene resin, polyamideimide resin, polyethylene naphthalate resin, fluorinated aromatic polymer resin, (modified) acrylic resin, epoxy resin, Item characterized by being at least one resin selected from the group consisting of an allyl ester curable resin, a silsesquioxane ultraviolet curable resin, an acrylic ultraviolet curable resin, and a vinyl ultraviolet curable resin [ [2] to [8] Optical filter.
- optical filter according to any one of items [1] to [10], which is for a solid-state imaging device.
- a solid-state imaging device comprising the optical filter according to any one of items [1] to [11].
- an optical filter that has excellent near-infrared cut characteristics, little incident angle dependency, and excellent transmittance characteristics in the visible wavelength region, color shading suppression effect, and ghost suppression effect.
- FIGS. 1A and 1B are schematic views showing examples of preferable configurations of the optical filter of the present invention.
- FIG. 2A is a schematic diagram illustrating a method for measuring the transmittance when measured from the vertical direction of the optical filter.
- FIG. 2B is a schematic diagram illustrating a method of measuring the transmittance when measured from an angle of 30 ° with respect to the vertical direction of the optical filter.
- FIG. 3 is a spectral transmission spectrum of the substrate obtained in Example 1.
- FIG. 4 is a spectral transmission spectrum of the optical filter obtained in Example 1.
- FIG. 5 is a spectral transmission spectrum of the substrate obtained in Example 2.
- FIG. 6 is a spectral transmission spectrum of the substrate obtained in Example 6.
- FIG. 7 is a spectral transmission spectrum of the base material obtained in Example 7.
- FIG. 1A is a schematic diagram illustrating a method for measuring the transmittance when measured from the vertical direction of the optical filter.
- FIG. 2B is a schematic diagram illustrating a method of
- FIG. 8 is a spectral transmission spectrum of the base material (near infrared absorbing glass substrate) used in Comparative Example 3.
- FIG. 9 is a spectral transmission spectrum of the base material obtained in Comparative Example 4.
- FIG. 10 is a spectral transmission spectrum of the base material obtained in Comparative Example 5. It is a schematic diagram for demonstrating the color shading evaluation of the camera image performed in the Example and the comparative example. It is a schematic diagram for demonstrating the ghost evaluation of the camera image performed in the Example and the comparative example.
- the optical filter of the present invention is characterized by having a base material that satisfies the requirements (a), (b), and (c) described later, and that satisfies the requirements (d) and (e) described later.
- the optical filter of the present invention preferably has a dielectric multilayer film on at least one surface of the substrate.
- the substrate used in the present invention satisfies the following requirements (a), (b) and (c); (A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm; (B) The difference (X 2 ⁇ X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more; (C) The transmittance (c1) at a wavelength of 900 nm, the transmittance (c2) at a wavelength of 1000 nm, and the transmittance (c3) at a wavelength of 1100 nm are all 65% or less.
- the substrate preferably further satisfies at least one of the following requirements (f) to (h):
- the component constituting the layer containing the compound (A) is not particularly limited, and examples thereof include a transparent resin, a sol-gel material, a low-temperature-curing glass material, and the like.
- a transparent resin is preferable from the viewpoint of compatibility with A).
- the compound (A) is not particularly limited as long as it has a maximum absorption in the wavelength region of 650 nm or more and 760 nm or less, but is preferably a solvent-soluble dye compound, and is a squarylium compound, a phthalocyanine compound, and a cyanine compound. It is more preferable that it is at least one selected from the group consisting of compounds, it is more preferable that a squarylium compound is included, and it is particularly preferable that there are two or more compounds including a squarylium compound.
- the compound (A) is two or more types including a squarylium compound, two or more types of squarylium compounds having different structures may be used, or a combination of a squarylium compound and another compound (A) may be used.
- the other compound (A) a phthalocyanine compound and a cyanine compound are particularly preferable.
- the squarylium-based compound has excellent visible light permeability, steep absorption characteristics, and a high molar extinction coefficient, but may generate fluorescence that causes scattered light during light absorption. In such a case, an optical filter with less scattered light and better camera image quality can be obtained by using a combination of the squarylium compound and the other compound (A).
- the absorption maximum wavelength of the compound (A) is preferably 660 nm or more and 755 nm or less, more preferably 670 nm or more and 750 nm or less, and further preferably 680 nm or more and 745 nm or less.
- the difference between the absorption maximum wavelengths of the compound (A) to be applied having the shortest absorption maximum wavelength and the longest absorption maximum wavelength is preferably 10 to The thickness is 60 nm, more preferably 15 to 55 nm, still more preferably 20 to 50 nm. It is preferable that the difference in absorption maximum wavelength is in the above-mentioned range because scattered light due to fluorescence can be sufficiently reduced and a wide absorption band near 700 nm and an excellent visible light transmittance can be compatible.
- the total content of the compound (A) is, for example, a base material made of a transparent resin substrate containing the compound (A) or a curable resin on the transparent resin substrate containing the compound (A).
- a base material on which a resin layer such as an overcoat layer made of, etc. is used it is preferably 0.04 to 2.0 parts by weight, more preferably 0.06 to 2.0 parts by weight with respect to 100 parts by weight of the transparent resin. 1.5 parts by weight, more preferably 0.08 to 1.0 part by weight, and the compound (A) is contained as a base on a support such as a glass support or a resin support as a base.
- a base material on which a transparent resin layer such as an overcoat layer made of a curable resin or the like is used it is preferably 0.1% with respect to 100 parts by weight of the resin forming the transparent resin layer containing the compound (A). 4 to 5.0 parts by weight, more preferably 0 6 to 4.0 parts by weight, more preferably 0.8 to 3.5 parts by weight.
- the difference (X 2 ⁇ X 1 ) between the wavelengths X 1 and X 2 is preferably 53 nm or more, more preferably 55 nm or more, and further preferably 58 nm or more.
- an upper limit is not specifically limited, Since a visible transmittance
- the difference (X 2 ⁇ X 1 ) is in the above range, it has an absorption band with sufficient intensity (width) in the near-infrared wavelength region close to the visible region. It is preferable because color shading can be suppressed even under such a large incident angle condition.
- the value of the wavelength (X 1 + X 2 ) / 2 between X 1 and X 2 can be said to be the center wavelength of the absorption band in the near infrared wavelength region close to the visible region, preferably 670 nm or more and 740 nm or less. Is 680 nm to 730 nm, more preferably 690 nm to 720 nm. It is preferable that the value of the wavelength represented by (X 1 + X 2 ) / 2 be in the above range because light in the wavelength region near the long wavelength end of the visible region can be cut more efficiently.
- X 1 preferably has a wavelength of 650 nm to 720 nm, more preferably a wavelength of 655 nm to 710 nm, and still more preferably a wavelength of 660 nm to 700 nm.
- X 1 in such a range is preferable because it tends to provide a camera image with less noise and excellent color reproducibility.
- All of the transmittances (c1), (c2) and (c3) are preferably 60% or less, more preferably 55% or less, and even more preferably 50% or less.
- the lower limit is not particularly limited, but depending on the properties of the near-infrared absorber, if the transmittance value in the near-infrared wavelength region is too low, the visible transmittance may decrease, or the thickness of the substrate may become extremely thick. For example, it is preferably 5% or more. It is preferable that the transmittances (c1), (c2), and (c3) are in the above ranges because a ghost suppressing effect at a practically sufficient level can be obtained.
- the substrate may be a single layer or a multilayer as long as it has a layer containing the compound (A).
- the substrate preferably contains a near infrared absorber, and the near infrared absorber is contained in a different layer even if it is contained in the same layer as the compound (A). It may be.
- the layer containing the compound (A) and the layer containing the near-infrared absorber are the same, for example, a base material composed of a transparent resin substrate containing the compound (A) and the near-infrared absorber, the compound (A) and the near-infrared absorber A compound (on a base material in which a resin layer such as an overcoat layer made of a curable resin or the like is laminated on a transparent resin substrate containing an infrared absorber, a glass support or a base resin support)
- an overcoat layer made of a curable resin containing the compound (A) on the transparent resin substrate containing the near infrared absorber for example, an overcoat layer made of a curable resin containing the compound (A) on the transparent resin substrate containing the near infrared absorber, etc.
- Base material on which a resin layer is laminated base material on which a resin layer such as an overcoat layer made of a curable resin containing a near infrared absorber is laminated on a transparent resin substrate containing the compound (A), a glass support
- An overcoat layer made of a curable resin containing the compound (A) and an overcoat layer made of a curable resin containing a near infrared absorber are laminated on a support such as a resin support as a body or a base.
- the near-infrared absorber is not particularly limited as long as it has a wide absorption in the wavelength range of 900 to 1200 nm.
- the near-infrared absorbing dye, the near-infrared absorbing fine particles, the conductive metal oxide, and the phosphate glass Examples thereof include transition metal components therein.
- T 1 is preferably 3% or less, more preferably 2% or less, and still more preferably 1% or less. If T 1 is in the above range, it can be said that the transmittance cut of the absorption band is sufficient, and flare around the light source can be suppressed in the camera image, which is preferable.
- the substrate of the present invention preferably contains a near-infrared absorber, but when the near-infrared absorber is the compound (S), the absorption intensity and visible transmittance in the near-infrared wavelength region can be compatible at a high level. It is preferable because of its tendency.
- the compound (S) is not particularly limited as long as it has an absorption maximum in a wavelength region of 1050 nm or more and 1200 nm or less, but is preferably a solvent-soluble dye compound, more preferably a diimonium compound or a metal dithiolate complex system. At least one compound selected from the group consisting of compounds, pyrrolopyrrole compounds, cyanine compounds, croconium compounds and naphthalocyanine compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds At least one compound selected from the group consisting of a diimonium compound represented by the following formula (I) and a metal dithiolate complex compound represented by the following formula (II
- R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ⁇ L e, (L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3
- the substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms, Adjacent R 3 may form a ring which may have a substituent L, n represents an integer of 0 to 4, X represents an anion necessary to neutralize the charge, M represents a metal atom, Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom, y represents 0 or 1.
- R 1 is preferably a hydrogen atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclohexyl group, adamantyl group, trifluoromethyl group.
- R 2 is preferably a chlorine atom, fluorine atom, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclohexyl group, phenyl group, hydroxyl group , Amino group, dimethylamino group, cyano group, nitro group, methoxy group, ethoxy group, n-propoxy group, n-butoxy group, acetylamino group, propionylamino group, N-methylacetylamino group, trifluoromethanoylamino Group, pentafluoroethanoylamino group, tert-butanoylamino group, cyclohexylinoylamino group, n-butylsulfonyl group, methylthio group, ethylthio group, n-propylthio
- X is an anion necessary for neutralizing the electric charge, and one molecule is required when the anion is divalent, and two molecules are required when the anion is monovalent.
- the two anions may be the same or different, but are preferably the same from the viewpoint of synthesis.
- X will not be restrict
- X is (X-10), (X-16), (X-17), (X-21), (X-21) in Table 1 above from the viewpoint of heat resistance, light resistance and spectral properties of the diimonium compound.
- X-22), (X-24) and (X-28) are particularly preferred.
- Examples of the diimonium compound represented by the above formula (I) include those listed in Tables 2-1 to 2-4 below.
- R 3 is preferably a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, cyclohexyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, phenyl group, methylthio group, ethylthio group, n-propylthio group, n-butylthio group, phenylthio group, benzylthio group, adjacent R When 3 forms a ring, it is preferably a heterocyclic ring in which at least one sulfur atom or nitrogen atom is contained in the ring.
- the M is preferably a transition metal, more preferably Ni, Pd, or Pt.
- the D is preferably a nitrogen atom or a phosphorus atom
- the R i is preferably an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, or an n-pentyl group.
- the absorption maximum wavelength of the compound (S) is preferably from 1060 nm to 1190 nm, more preferably from 1070 nm to 1180 nm, still more preferably from 1080 nm to 1170 nm.
- the absorption maximum wavelength of the compound (S) is in such a range, unnecessary near-infrared rays can be efficiently cut, and an excellent ghost suppression effect can be obtained.
- the compound (S) may be synthesized by a generally known method.
- Japanese Patent No. 4168031 Japanese Patent No. 4225296, JP-T 2010-516823, JP-A 63-165392 Etc. can be synthesized with reference to the methods described in the above.
- the content of the compound (S) is, for example, a base material made of a transparent resin substrate containing the compound (A) and the compound (S) or a transparent resin substrate containing the compound (S) as the base material.
- a substrate on which a resin layer such as an overcoat layer made of a curable resin containing the compound (A) is laminated it is preferably 0.01-2. 0 parts by weight, more preferably 0.02 to 1.5 parts by weight, particularly preferably 0.03 to 1.0 parts by weight.
- the substrate include a glass support and a resin support as a base.
- a transparent resin layer such as an overcoat layer composed of a curable resin containing the compound (A) and the compound (S) is laminated on a support, or on a transparent resin substrate containing the compound (A)
- Curable resin containing compound (S) in
- a base material on which a resin layer such as an overcoat layer is used it is preferably 0.1 to 5.0 with respect to 100 parts by weight of the resin forming the transparent resin layer containing the compound (A). Parts by weight, more preferably 0.2 to 4.0 parts by weight, particularly preferably 0.3 to 3.0 parts by weight.
- an optical filter having both good near infrared absorption characteristics and high visible light transmittance can be obtained.
- Xc is preferably 630 to 655 nm, more preferably 632 to 652 nm, and still more preferably 634 to 650 nm. If Xc is less than 628 nm, the transmittance in the wavelength region corresponding to red tends to be low, and color reproducibility tends to decrease. If it exceeds 658 nm, sufficient absorption intensity cannot be ensured, and the camera image Color shading tends to occur.
- Xc represents a wavelength that satisfies a predetermined condition when the spectral transmittance is evaluated from the short wavelength side toward the long wavelength side.
- the average transmittance of the substrate in the wavelength region of 430 to 580 nm is preferably 75% or more, more preferably 78% or more, and particularly preferably 80% or more.
- a substrate having such transmission characteristics is used, high light transmission characteristics can be achieved in the visible range, and a highly sensitive camera function can be achieved.
- the thickness of the substrate can be appropriately selected according to the desired application and is not particularly limited, but is preferably 10 to 200 ⁇ m, more preferably 20 to 180 ⁇ m, and further preferably 25 to 150 ⁇ m.
- an optical filter using the substrate can be reduced in thickness and weight, and can be suitably used for various applications such as a solid-state imaging device.
- a base material made of the transparent resin substrate is used in a lens unit such as a camera module, it is preferable because the lens unit can be reduced in height and weight.
- the transparent resin used for the transparent resin layer, the transparent resin substrate and the resin support constituting the base material is not particularly limited as long as it does not impair the effects of the present invention.
- thermal stability and film Glass transition temperature (Tg) is preferably 110 to 380 ° C., in order to obtain a film capable of forming a dielectric multilayer film by high temperature vapor deposition performed at a vapor deposition temperature of 100 ° C. or higher while ensuring moldability to
- a resin having a temperature of 110 to 370 ° C., more preferably 120 to 360 ° C. is used.
- the glass transition temperature of the resin is 140 ° C. or higher because a film capable of depositing a dielectric multilayer film at a higher temperature can be obtained.
- the total light transmittance (JIS K7105) of the resin plate is preferably 75 to 95%, more preferably 78 to 95. %, More preferably 80 to 95% of the resin can be used. If a resin having a total light transmittance in such a range is used, the resulting substrate exhibits good transparency as an optical film.
- the weight average molecular weight (Mw) in terms of polystyrene measured by a gel permeation chromatography (GPC) method of the transparent resin is usually 15,000 to 350,000, preferably 30,000 to 250,000.
- the average molecular weight (Mn) is usually 10,000 to 150,000, preferably 20,000 to 100,000.
- transparent resins examples include cyclic polyolefin resins, aromatic polyether resins, polyimide resins, fluorene polycarbonate resins, fluorene polyester resins, polycarbonate resins, polyamide (aramid) resins, polyarylate resins, and polysulfones.
- ester-based curable resins examples include ester-based curable resins, silsesquioxane-based ultraviolet curable resins, acrylic-based ultraviolet curable resins, and vinyl-based ultraviolet curable resins.
- Transparent resins may be used alone or in combination of two or more.
- the cyclic polyolefin-based resin is obtained from at least one monomer selected from the group consisting of a monomer represented by the following formula (X 0 ) and a monomer represented by the following formula (Y 0 ).
- a resin and a resin obtained by hydrogenating the resin are preferable.
- R x1 to R x4 each independently represents an atom or group selected from the following (i ′) to (ix ′), and k x , mx and p x are each independently 0 Or represents a positive integer.
- R x1 and R x2 or R x3 and R x4 are bonded to each other to form a monocyclic or polycyclic hydrocarbon ring or heterocyclic ring (provided that R x1 to R which are not involved in the bond) x4 each independently represents an atom or group selected from (i ′) to (vi ′).
- Ix ′ A monocyclic hydrocarbon ring or heterocycle formed by bonding R x2 and R x3 to each other (provided that R x1 and R x4 not involved in the bonding are each independently the above (i Represents an atom or group selected from ') to (vi').
- R y1 and R y2 each independently represent an atom or group selected from the above (i ′) to (vi ′), or R y1 and R y2 are bonded to each other formed monocyclic or polycyclic alicyclic hydrocarbon, an aromatic hydrocarbon or heterocyclic, k y and p y are each independently, represent 0 or a positive integer.
- the aromatic polyether-based resin preferably has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2).
- R 1 to R 4 each independently represents a monovalent organic group having 1 to 12 carbon atoms, and a to d each independently represents an integer of 0 to 4.
- R 1 ⁇ R 4 and a ⁇ d independently has the same meaning as R 1 ⁇ R 4 and a ⁇ d of the formula (1)
- Y represents a single bond
- -SO 2 -Or> C O
- R 7 and R 8 each independently represent a halogen atom, a monovalent organic group having 1 to 12 carbon atoms or a nitro group
- g and h each independently represent 0 to 4
- m represents 0 or 1.
- R 7 is not a cyano group.
- the aromatic polyether resin further has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (3) and a structural unit represented by the following formula (4). Is preferred.
- R 5 and R 6 each independently represents a monovalent organic group having 1 to 12 carbon atoms
- Z represents a single bond, —O—, —S—, —SO 2 —,> C ⁇ O, —CONH—, —COO— or a divalent organic group having 1 to 12 carbon atoms
- e and f each independently represent an integer of 0 to 4, and n represents 0 or 1.
- R 7 , R 8 , Y, m, g and h are each independently synonymous with R 7 , R 8 , Y, m, g and h in formula (2), and R 5 , R 6 , Z, n, e and f are each independently synonymous with R 5 , R 6 , Z, n, e and f in the formula (3).
- the polyimide resin is not particularly limited as long as it is a polymer compound containing an imide bond in a repeating unit.
- the method described in JP-A-2006-199945 and JP-A-2008-163107 is used. Can be synthesized.
- the fluorene polycarbonate resin is not particularly limited as long as it is a polycarbonate resin containing a fluorene moiety, and can be synthesized, for example, by the method described in JP-A-2008-163194.
- the fluorene polyester resin is not particularly limited as long as it is a polyester resin containing a fluorene moiety.
- the fluorene polyester resin can be synthesized by the method described in JP 2010-285505 A or JP 2011-197450 A. Can do.
- the fluorinated aromatic polymer resin is not particularly limited, but is selected from the group consisting of an aromatic ring having at least one fluorine atom, an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond, and an ester bond.
- the polymer preferably contains a repeating unit containing at least one bond, and can be synthesized, for example, by the method described in JP-A-2008-181121.
- the acrylic ultraviolet curable resin is not particularly limited, but is synthesized from a resin composition containing a compound having one or more acrylic or methacrylic groups in the molecule and a compound that decomposes by ultraviolet rays to generate active radicals. Can be mentioned.
- the acrylic ultraviolet curable resin is a base material in which a transparent resin layer containing a compound (A) and a curable resin is laminated on a glass support or a resin support as a base, or a compound ( When using a base material in which a resin layer such as an overcoat layer made of a curable resin or the like is used on a transparent resin substrate containing A), it can be particularly preferably used as the curable resin.
- Epoxy resin Although it does not restrict
- the ultraviolet curable epoxy resin for example, synthesized from a composition containing a compound having one or more epoxy groups in the molecule and a compound that generates an acid by ultraviolet rays (hereinafter also referred to as “photo acid generator”).
- thermosetting epoxy resins include those synthesized from a composition containing one or more epoxy groups in the molecule and an acid anhydride. Can do.
- the epoxy ultraviolet curable resin contains, as the base material, a base material obtained by laminating a transparent resin layer containing the compound (A) on a glass support or a base resin support, and the compound (A). In the case of using a base material in which a resin layer such as an overcoat layer made of a curable resin is laminated on a transparent resin substrate to be used, it can be particularly suitably used as the curable resin.
- cyclic polyolefin resins examples include Arton manufactured by JSR Corporation, ZEONOR manufactured by Nippon Zeon Co., Ltd., APEL manufactured by Mitsui Chemicals, Inc., and TOPAS manufactured by Polyplastics Corporation.
- polyethersulfone resins examples include Sumika Excel PES manufactured by Sumitomo Chemical Co., Ltd.
- polyimide resins examples include Neoprim L manufactured by Mitsubishi Gas Chemical Co., Ltd.
- commercially available polycarbonate resins include Pure Ace manufactured by Teijin Limited.
- Examples of commercially available fluorene polycarbonate resins include Iupizeta EP-5000 manufactured by Mitsubishi Gas Chemical Co., Ltd.
- Examples of commercially available fluorene polyester resins include OKP4HT manufactured by Osaka Gas Chemical Co., Ltd.
- Examples of commercially available acrylic resins include NIPPON CATALYST ACRYVIEWER.
- Examples of commercially available silsesquioxane-based ultraviolet curable resins include Silplus manufactured by Nippon Steel Chemical Co., Ltd.
- the base material may further contain other dye (X) that does not correspond to the compound (A) and the compound (S).
- the other dye (X) is not particularly limited as long as it has a maximum absorption wavelength in the region of wavelength less than 650 nm or more than 760 nm and less than 1050 nm, but a dye having an absorption maximum wavelength in the region of more than 760 nm and less than 1050 nm is preferable.
- examples of such dyes include squarylium compounds, phthalocyanine compounds, cyanine compounds, naphthalocyanine compounds, croconium compounds, octaphyrin compounds, diimonium compounds, pyrrolopyrrole compounds, and boron dipyrromethene (BODIPY). And at least one compound selected from the group consisting of a compound, a perylene compound, and a metal dithiolate compound.
- the content of the other pigment (X) is, for example, when a substrate made of a transparent resin substrate containing the other pigment (X) is used as the substrate, with respect to 100 parts by weight of the transparent resin.
- the amount is preferably 0.005 to 1.0 part by weight, more preferably 0.01 to 0.9 part by weight, particularly preferably 0.02 to 0.8 part by weight.
- It contains a base material in which a transparent resin layer such as an overcoat layer made of a curable resin containing other dye (X) is laminated on a support such as a resin support, or a compound (A).
- a transparent resin containing other pigment (X) When using a base material in which a resin layer such as an overcoat layer made of a curable resin containing other pigment (X) is laminated on a transparent resin substrate, a transparent resin containing other pigment (X) For 100 parts by weight of the resin forming the layer, 0.05 to 4.0 parts by weight preferred, and more preferably from 0.1 to 3.0 parts by weight, particularly preferably 0.2 to 2.0 parts by weight.
- the base material may further contain an antioxidant, a near-ultraviolet absorber, a fluorescence quencher, and the like as other components as long as the effects of the present invention are not impaired. These other components may be used alone or in combination of two or more.
- Examples of the near ultraviolet absorber include azomethine compounds, indole compounds, benzotriazole compounds, triazine compounds, and the like.
- antioxidants examples include 2,6-di-t-butyl-4-methylphenol, 2,2′-dioxy-3,3′-di-t-butyl-5,5′-dimethyldiphenylmethane, tetrakis [Methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, tris (2,4-di-t-butylphenyl) phosphite and the like.
- these other components may be mixed with a resin or the like when producing a substrate, or may be added when a resin is synthesized.
- the addition amount is appropriately selected according to the desired properties, but is usually 0.01 to 5.0 parts by weight, preferably 0.05 to 2.0 parts by weight, based on 100 parts by weight of the resin. Part.
- the transparent resin substrate can be formed by, for example, melt molding or cast molding, and further, if necessary, After molding, a substrate on which an overcoat layer is laminated can be produced by coating a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent.
- a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent.
- the base material is an overcoat comprising a curable resin containing the compound (A) on a support such as a glass support or a base resin support or a transparent resin substrate containing no compound (A).
- a support such as a glass support or a base resin support or a transparent resin substrate containing no compound (A).
- the resin solution containing the compound (A) is melt-molded or cast-molded on the support or the transparent resin substrate, preferably spin After coating by a method such as coating, slit coating or ink jetting, the solvent is dried and removed, and if necessary, further irradiation with light or heating is performed, whereby the compound (A) is formed on the support or the transparent resin substrate.
- the base material in which the transparent resin layer containing this was formed can be manufactured.
- melt molding a method of melt molding a pellet obtained by melt-kneading a resin, a compound (A) and other components as necessary; a resin, a compound (A) and a necessary
- Examples include a method of melt-molding pellets.
- the melt molding method include injection molding, melt extrusion molding, and blow molding.
- ⁇ Cast molding As the cast molding, a method of removing a solvent by casting a resin composition containing a compound (A), a resin, a solvent and other components as required on a suitable support; or a compound (A) and After removing a solvent by casting a curable composition containing a photocurable resin and / or a thermosetting resin and other components as necessary on an appropriate support, ultraviolet irradiation, heating, etc. It can also be produced by a method of curing by an appropriate method.
- the base material is a base material made of a transparent resin substrate containing the compound (A)
- the base material can be obtained by peeling the coating film from the support after cast molding
- the base material is made of a curable resin containing the compound (A) on a support such as a glass support or a base resin support or a transparent resin substrate containing no compound (A).
- the substrate can be obtained by not peeling the coating film after cast molding.
- the support examples include phosphates containing copper components such as near-infrared absorbing glass plates (for example, “BS-11” manufactured by Matsunami Glass Industrial Co., Ltd. and “NF-50T” manufactured by AGC-Techno Glass Co., Ltd.). Glass plate), transparent glass plate (for example, non-alkali glass plate such as “OA-10G” manufactured by Nippon Electric Glass Co., Ltd., “AN100” manufactured by Asahi Glass Co., Ltd.), steel belt, steel drum, and transparent resin (for example, polyester) Film, cyclic olefin resin film) support.
- BS-11 manufactured by Matsunami Glass Industrial Co., Ltd. and “NF-50T” manufactured by AGC-Techno Glass Co., Ltd.
- Glass plate for example, non-alkali glass plate such as “OA-10G” manufactured by Nippon Electric Glass Co., Ltd., “AN100” manufactured by Asahi Glass Co., Ltd.
- steel belt for example, steel drum
- transparent resin for example,
- the optical component such as glass plate, quartz or transparent plastic is coated with the resin composition and the solvent is dried, or the curable composition is coated and cured and dried.
- a transparent resin layer can also be formed on the component.
- the amount of residual solvent in the transparent resin layer (transparent resin substrate) obtained by the above method should be as small as possible.
- the amount of the residual solvent is preferably 3% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight with respect to the weight of the transparent resin layer (transparent resin substrate). It is as follows. When the amount of residual solvent is in the above range, a transparent resin layer (transparent resin substrate) that can easily exhibit a desired function, in which deformation and characteristics hardly change can be obtained.
- the optical filter according to the present invention has a base material that satisfies the requirements (a), (b), and (c), and satisfies the following requirements (d) and (e): (D) In the wavelength range of 430 to 580 nm, the average value (d1) of transmittance when measured from the vertical direction of the optical filter is 75% or more; (E) In the wavelength region of 1100 nm to 1200 nm, the average value (e1) of transmittance when measured from the vertical direction of the optical filter is 5% or less.
- the optical filter of the present invention satisfies the above requirements (d) and (e), it has excellent transmittance characteristics and near-infrared cut characteristics in the visible wavelength region, has little incident angle dependency, has a color shading suppression effect, and a ghost. It is an optical filter with excellent suppression effect.
- the average value (d1) of the transmittance in the requirement (d) is preferably 78% or more, more preferably 80% or more, and further preferably 82% or more.
- the average value (d1) of the transmittance is in this range, excellent imaging sensitivity can be achieved when the optical filter of the present invention is used as a solid-state imaging device.
- the average value (e1) of the transmittance in requirement (e) is preferably 4% or less, more preferably 3% or less, and even more preferably 2% or less. When the average value (e1) of the transmittance is within this range, good black reproducibility can be achieved near the center of the camera image.
- the optical filter of the present invention has the base material, the incident angle dependency of the optical characteristics can be reduced even in the form having the dielectric multilayer film.
- of the difference from the wavelength value (Xb) at which the transmittance when measured from the angle is 50% is preferably less than 20 nm, more preferably less than 15 nm, and even more preferably less than 10 nm. is there.
- the thickness of the optical filter of the present invention is preferably thin in consideration of the recent trend of thinner and lighter solid-state imaging devices. Since the optical filter of the present invention includes the substrate, it can be thinned.
- the thickness of the optical filter of the present invention is preferably 210 ⁇ m or less, more preferably 190 ⁇ m or less, further preferably 160 ⁇ m or less, particularly preferably 130 ⁇ m or less, and the lower limit is not particularly limited, but is preferably 20 ⁇ m or more.
- the optical filter of the present invention preferably has a dielectric multilayer film on at least one surface of the substrate.
- the dielectric multilayer film in the present invention is a film having the ability to reflect near-infrared rays or a film having an antireflection effect in the visible range. By having a dielectric multilayer film, a better visible light transmittance and near-infrared radiation are obtained. Cut characteristics can be achieved.
- the dielectric multilayer film may be provided on one side of the substrate or on both sides.
- the optical filter When it is provided on one side, it is possible to obtain an optical filter that is excellent in production cost and manufacturability and has high strength and is less likely to warp or twist when provided on both sides.
- the optical filter When the optical filter is applied to a solid-state imaging device, it is preferable that the optical filter is less warped or twisted. Therefore, it is preferable to provide a dielectric multilayer film on both surfaces of the resin substrate.
- the dielectric multilayer film preferably has reflection characteristics over the entire wavelength range of 700 to 1100 nm, more preferably 700 to 1150 nm, and even more preferably 700 to 1200 nm.
- the first optical layer mainly having a reflection characteristic in the vicinity of a wavelength of 700 to 950 nm when measured from an angle of 5 ° with respect to the vertical direction of the optical filter is used.
- a configuration (see FIG. 1 (a)) having a second optical layer on one side of the material and having a reflection characteristic mainly in the vicinity of 900 nm to 1150 nm on the other side of the substrate, and the vertical direction of the optical filter
- the fourth optical layer having a third optical layer having a reflection characteristic mainly in the vicinity of a wavelength of 700 to 1150 nm on one side of the substrate and having an antireflection characteristic in the visible range.
- the form (refer FIG.1 (b)) which has on the other surface of material is mentioned.
- Examples of the dielectric multilayer film include those in which a high refractive index material layer and a low refractive index material layer are alternately laminated.
- a material constituting the high refractive index material layer a material having a refractive index of 1.7 or more can be used, and a material having a refractive index of usually 1.7 to 2.5 is selected.
- Such materials include titanium oxide, zirconium oxide, tantalum pentoxide, niobium pentoxide, lanthanum oxide, yttrium oxide, zinc oxide, zinc sulfide, or indium oxide as the main components, and titanium oxide, tin oxide, and / or Alternatively, a material containing a small amount of cerium oxide or the like (for example, 0 to 10% by weight based on the main component) can be used.
- a material having a refractive index of 1.6 or less can be used, and a material having a refractive index of usually 1.2 to 1.6 is selected.
- examples of such materials include silica, alumina, lanthanum fluoride, magnesium fluoride, and sodium hexafluoride sodium.
- the method for laminating the high refractive index material layer and the low refractive index material layer is not particularly limited as long as a dielectric multilayer film in which these material layers are laminated is formed.
- a multilayer film can be formed.
- each of the high refractive index material layer and the low refractive index material layer is usually preferably from 0.1 ⁇ to 0.5 ⁇ , where ⁇ (nm) is the near infrared wavelength to be blocked.
- the value of ⁇ (nm) is, for example, 700 to 1400 nm, preferably 750 to 1300 nm.
- the optical thickness obtained by multiplying the refractive index (n) by the thickness (d) (n ⁇ d) by ⁇ / 4 the high refractive index material layer, and the low refractive index.
- the thicknesses of the respective layers of the refractive index material layer are almost the same value, and there is a tendency that the blocking / transmission of a specific wavelength can be easily controlled from the relationship between the optical characteristics of reflection / refraction.
- the total number of high refractive index material layers and low refractive index material layers in the dielectric multilayer film is preferably 16 to 70 layers, more preferably 20 to 60 layers, as a whole. If the thickness of each layer, the thickness of the dielectric multilayer film as a whole of the optical filter, and the total number of layers are within the above ranges, a sufficient manufacturing margin can be secured, and the warpage of the optical filter and cracks in the dielectric multilayer film can be reduced. can do.
- the thickness of each layer of the rate material layer, the order of stacking, and the number of stacks it has sufficient light cut characteristics in the near infrared wavelength region while ensuring sufficient transmittance in the visible region, In addition, it is possible to reduce the reflectance when near infrared rays are incident from an oblique direction.
- optical thin film design software for example, manufactured by Essential Macleod, Thin Film Center Co., Ltd.
- optical thin film design software for example, manufactured by Essential Macleod, Thin Film Center Co., Ltd.
- the target transmittance at a wavelength of 400 to 700 nm is set to 100%
- the target Tolerance value is set to 1
- the target transmittance at a wavelength of 705 to 950 nm is set to 0%.
- Parameter setting method such as setting Target Tolerance value to 0.5 can be mentioned.
- These parameters can change the value of Target Tolerance by further finely dividing the wavelength range according to various characteristics of the substrate (i).
- the optical filter of the present invention is within the range not impairing the effects of the present invention, between the base material and the dielectric multilayer film, the surface opposite to the surface on which the dielectric multilayer film is provided, or the dielectric multilayer film.
- an anti-reflection film On the opposite side of the surface of the film where the substrate is provided, an anti-reflection film, a hard layer is used for the purpose of improving the surface hardness of the substrate or the dielectric multilayer film, improving the chemical resistance, antistatic and scratching.
- Functional films such as a coating film and an antistatic film can be provided as appropriate.
- the optical filter of the present invention may include one layer made of the functional film or two or more layers.
- the optical filter of the present invention may include two or more similar layers or two or more different layers.
- the method of laminating the functional film is not particularly limited, but a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent is melt-molded or cast in the same manner as described above on a base material or a dielectric multilayer film. Examples of the method include molding.
- it can also be produced by applying a curable composition containing the coating agent or the like on a substrate or a dielectric multilayer film with a bar coater or the like and then curing it by ultraviolet irradiation or the like.
- the coating agent examples include ultraviolet (UV) / electron beam (EB) curable resins and thermosetting resins. Specifically, vinyl compounds, urethanes, urethane acrylates, acrylates, epoxy And epoxy acrylate resins. Examples of the curable composition containing these coating agents include vinyl, urethane, urethane acrylate, acrylate, epoxy, and epoxy acrylate curable compositions.
- UV ultraviolet
- EB electron beam
- the curable composition may contain a polymerization initiator.
- a polymerization initiator a known photopolymerization initiator or a thermal polymerization initiator can be used, and a photopolymerization initiator and a thermal polymerization initiator may be used in combination.
- a polymerization initiator may be used individually by 1 type, and may use 2 or more types together.
- the blending ratio of the polymerization initiator in the curable composition is preferably 0.1 to 10% by weight, more preferably 0.5 to 10% by weight, when the total amount of the curable composition is 100% by weight. More preferably, it is 1 to 5% by weight.
- a functional film such as an antireflective film, a hard coat film or an antistatic film having excellent curing characteristics and handleability of the curable composition and having a desired hardness. it can.
- organic solvent may be added as a solvent to the curable composition, and known organic solvents can be used.
- organic solvents include alcohols such as methanol, ethanol, isopropanol, butanol and octanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; ethyl acetate, butyl acetate, ethyl lactate, ⁇ -butyrolactone, propylene Esters such as glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate; Ethers such as ethylene glycol monomethyl ether and diethylene glycol monobutyl ether; Aromatic hydrocarbons such as benzene, toluene and xylene; Dimethylformamide, dimethylacetamide, N- Examples include amides such as methylpyrrolidone.
- solvents may be used alone or in combination of two or more.
- the thickness of the functional film is preferably 0.1 to 20 ⁇ m, more preferably 0.5 to 10 ⁇ m, and particularly preferably 0.7 to 5 ⁇ m.
- the corona is applied to the surface of the base material, the functional film or the dielectric multilayer film.
- Surface treatment such as treatment or plasma treatment may be performed.
- the optical filter of the present invention has a wide viewing angle and has excellent near-infrared cutting ability and the like. Therefore, it is useful for correcting the visibility of a solid-state imaging device such as a CCD or CMOS image sensor of a camera module.
- a solid-state imaging device such as a CCD or CMOS image sensor of a camera module.
- digital still cameras, smartphone cameras, mobile phone cameras, digital video cameras, wearable device cameras, PC cameras, surveillance cameras, automotive cameras, TVs, car navigation systems, personal digital assistants, video game machines, and portable game machines It is useful for fingerprint authentication system, digital music player, etc. Furthermore, it is also useful as a heat ray cut filter attached to a glass plate of an automobile or a building.
- the solid-state imaging device of the present invention includes the optical filter of the present invention.
- the solid-state imaging device is an image sensor including a solid-state imaging device such as a CCD or a CMOS image sensor.
- a digital still camera a camera for a smartphone, a camera for a mobile phone, a camera for a wearable device, a digital camera It can be used for applications such as video cameras.
- the camera module of the present invention includes the optical filter of the present invention.
- Parts means “parts by weight” unless otherwise specified.
- the measurement method of each physical property value and the evaluation method of the physical property are as follows.
- the molecular weight of the resin was measured by the following method (a) or (b) in consideration of the solubility of each resin in a solvent.
- GPC gel permeation chromatography
- Standard polystyrene equivalent weight average molecular weight (Mw) and number average molecular weight (Mn) were measured using a GPC apparatus (HLC-8220 type, column: TSKgel ⁇ -M, developing solvent: THF) manufactured by Tosoh Corporation.
- the logarithmic viscosity was measured by the following method (c) instead of the molecular weight measurement by the said method.
- (C) A part of the polyimide resin solution was added to anhydrous methanol to precipitate the polyimide resin, and filtered to separate from the unreacted monomer.
- 0.1 g of polyimide obtained by vacuum drying at 80 ° C. for 12 hours is dissolved in 20 mL of N-methyl-2-pyrrolidone, and the logarithmic viscosity ( ⁇ ) at 30 ° C. is obtained by the following formula using a Canon-Fenske viscometer. Asked.
- ⁇ ⁇ ln (t s / t 0) ⁇ / C t 0 : Flowing time of solvent t s : Flowing time of dilute polymer solution C: 0.5 g / dL ⁇ Glass transition temperature (Tg)> Using a differential scanning calorimeter (DSC6200) manufactured by SII Nano Technologies, Inc., the rate of temperature increase was measured at 20 ° C. per minute under a nitrogen stream.
- the transmittance when measured from the vertical direction of the optical filter the light transmitted perpendicular to the filter is measured as shown in FIG. 2A, and the angle is 30 ° with respect to the vertical direction of the optical filter.
- the transmittance when measured from the above the light transmitted at an angle of 30 ° with respect to the vertical direction of the filter as shown in FIG. 2B was measured.
- this transmittance is measured using the spectrophotometer under the condition that light is perpendicularly incident on the substrate and the filter, except when measuring (Xb).
- it is measured using the spectrophotometer under the condition that light is incident at an angle of 30 ° with respect to the vertical direction of the filter.
- ⁇ Camera image color shading evaluation> The color shading evaluation when the optical filter was incorporated in the camera module was performed by the following method.
- a camera module is created in the same manner as in Japanese Patent Application Laid-Open No. 2016-110067, and a white plate having a size of 300 mm ⁇ 400 mm is formed using the created camera module as a D65 light source (standard light source device “Macbeth Judge II” manufactured by X-Rite) Images were taken below, and the difference in color between the center and edge of the white plate in the camera image was evaluated according to the following criteria.
- the positional relationship between the white plate 112 and the camera module was adjusted so that the white plate 112 occupied 90% or more of the area in the camera image 111 when shooting.
- Ghost evaluation when the optical filter was incorporated in the camera module was performed by the following method.
- a camera module is created in the same manner as in Japanese Patent Application Laid-Open No. 2016-110067, and the camera module is used to take a picture under a halogen lamp light source (“Luminer Ace LA-150TX” manufactured by Hayashi Watch Industry Co., Ltd.) in a dark room.
- a halogen lamp light source (“Luminer Ace LA-150TX” manufactured by Hayashi Watch Industry Co., Ltd.) in a dark room.
- the degree of ghost generation around the light source in the image was evaluated according to the following criteria.
- DCM dodec-3-ene
- ⁇ Resin synthesis example 2> In a 3 L four-necked flask, 35.12 g of 2,6-difluorobenzonitrile, 87.60 g of 9,9-bis (4-hydroxyphenyl) fluorene, 41.46 g of potassium carbonate, N, N-dimethylacetamide (hereinafter referred to as “DMAc”). 443 g and 111 g of toluene were added. Subsequently, a thermometer, a stirrer, a three-way cock with a nitrogen introduction tube, a Dean Stark tube and a cooling tube were attached to the four-necked flask.
- DMAc N, N-dimethylacetamide
- the obtained resin B had a number average molecular weight (Mn) of 75,000, a weight average molecular weight (Mw) of 188,000, and a glass transition temperature (Tg) of 285 ° C.
- ⁇ Resin synthesis example 3> In a 500 mL five-necked flask equipped with a thermometer, stirrer, nitrogen inlet tube, dropping funnel with side tube, Dean-Stark tube and condenser tube, 1,4-bis (4-amino- ⁇ , ⁇ -Dimethylbenzyl) benzene (27.66 g) and 4,4'-bis (4-aminophenoxy) biphenyl (7.38 g) were added and dissolved in ⁇ -butyrolactone (68.65 g) and N, N-dimethylacetamide (17.16 g). The resulting solution was cooled to 5 ° C.
- resin C A part of this polyimide resin solution was poured into 1 L of methanol to precipitate the polyimide.
- the IR spectrum of the obtained resin C was measured, 1704 cm -1 characteristic of imido group, absorption of 1770 cm -1 were observed.
- Resin C had a glass transition temperature (Tg) of 310 ° C. and a logarithmic viscosity of 0.87.
- Example 1 an optical filter having a base material made of a transparent resin substrate was prepared according to the following procedure and conditions.
- the peeled coating film was further dried at 100 ° C. under reduced pressure for 8 hours to obtain a base material composed of a transparent resin substrate having a thickness of 0.1 mm, a length of 60 mm, and a width of 60 mm.
- the spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined. The results are shown in FIG. 3 and Table 5-1.
- a dielectric multilayer film (I) is formed as a first optical layer on one side of the obtained base material, and a dielectric multilayer film (II) is formed as a second optical layer on the other side of the base material.
- an optical filter having a thickness of about 0.105 mm was obtained.
- the dielectric multilayer film (I) is formed by alternately laminating silica (SiO 2 ) layers and titania (TiO 2 ) layers at a deposition temperature of 100 ° C. (26 layers in total).
- the dielectric multilayer film (II) is formed by alternately laminating silica (SiO 2 ) layers and titania (TiO 2 ) layers at a deposition temperature of 100 ° C. (20 layers in total).
- the silica layer and the titania layer are in order of the titania layer, the silica layer, the titania layer,..., The silica layer, the titania layer, and the silica layer from the substrate side.
- the outermost layer of the optical filter was a silica layer.
- the dielectric multilayer films (I) and (II) were designed as follows.
- the wavelength-dependent characteristics of the base material refractive index and the applied compound (S) and compound (in order to achieve the antireflection effect in the visible range and the selective transmission / reflection performance in the near infrared range Optimization was performed using optical thin film design software (Essential Macleod, Thin Film Center) according to the absorption characteristics of A).
- optical thin film design software Essential Macleod, Thin Film Center
- the input parameters (Target values) to the software are as shown in Table 3 below.
- the dielectric multilayer film (I) is formed by alternately stacking a silica layer having a film thickness of 31 to 157 nm and a titania layer having a film thickness of 10 to 95 nm.
- the dielectric multi-layer film (II) is a multi-layer vapor-deposited film having 20 layers, in which a silica layer having a thickness of 37 to 194 nm and a titania layer having a thickness of 12 to 114 nm are alternately stacked. It was.
- An example of the optimized film configuration is shown in Table 4 below.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- the results are shown in FIG. 4 and Table 5-1.
- the average value of transmittance at a wavelength of 430 to 580 nm was 84%
- the average value of transmittance at a wavelength of 1100 to 1200 nm was 1% or less
- Example 2 an optical filter having a base material made of a transparent resin substrate was prepared according to the following procedure and conditions.
- Example 1 0.04 part of the compound (A-3) represented by the following formula (a-3) (absorption maximum wavelength 703 nm in dichloromethane) as the compound (A) and the following formula (a-4) Compound (a-4) (absorption maximum wavelength in dichloromethane 736 nm) 0.08 part was used, and compound (s-8) described in Table 2-3 above as compound (S) (in dichloromethane) 0.06 parts of absorption maximum wavelength (1096 nm) and other dye (X) represented by the following formula (X-1) (X-1) (absorption maximum wavelength in dichloromethane: 887 nm)
- X-1 absorption maximum wavelength in dichloromethane: 887 nm
- a base material made of a transparent resin substrate containing the compound (A) and the compound (S) was obtained in the same procedure and conditions as in Example 1 except that 0.01 part was used. The spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1
- a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
- the multilayer film (III) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as the second optical layer on the other surface of the base material (20 layers in total).
- a dielectric multilayer film (IV) was formed to obtain an optical filter having a thickness of about 0.105 mm.
- the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependency of the base material refractive index.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 3 an optical filter having a base material composed of a transparent resin substrate having a resin layer on both sides was prepared according to the following procedure and conditions.
- Example 1 0.06 part of compound (a-4) as compound (A) and compound (a-5) represented by the following formula (a-5) (absorption maximum wavelength in dichloromethane: 713 nm) 0.06 Example 1 except that 0.08 part of the compound (s-13) described in Table 2-4 (maximum absorption wavelength 1096 nm in dichloromethane) was used as the compound (S). A transparent resin substrate containing the compound (A) and the compound (S) was obtained in the same procedure and conditions.
- a resin composition (1) having the following composition was applied to one side of the obtained transparent resin substrate with a bar coater and heated in an oven at 70 ° C. for 2 minutes to volatilize and remove the solvent. At this time, the coating conditions of the bar coater were adjusted so that the thickness after drying was 2 ⁇ m. Next, it exposed using the conveyor type exposure machine (exposure amount 500mJ / cm ⁇ 2 >, 200mW), the resin composition (1) was hardened, and the resin layer was formed on the substrate made from transparent resin. Similarly, a resin layer made of the resin composition (1) is formed on the other surface of the transparent resin substrate, and the resin layers are provided on both surfaces of the transparent resin substrate containing the compound (A) and the compound (S). A substrate was obtained. The spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined. The results are shown in Table 5-1.
- Resin composition (1) 60 parts by weight of tricyclodecane dimethanol diacrylate, 40 parts by weight of dipentaerythritol hexaacrylate, 5 parts by weight of 1-hydroxycyclohexyl phenyl ketone, methyl ethyl ketone (solvent, solid content concentration (TSC): 30% )
- a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
- a dielectric multilayer film (VI) was formed to obtain an optical filter having a thickness of about 0.109 mm.
- the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 4 an optical filter having a substrate formed by forming a transparent resin layer containing the compound (A) on both surfaces of a resin support was prepared according to the following procedure and conditions.
- Resin A obtained in Resin Synthesis Example 1 and methylene chloride were added to a container to prepare a solution having a resin concentration of 20% by weight, and the resin substrate of Example 1 was used except that the obtained solution was used.
- a resin support was prepared in the same manner as the preparation.
- Example 3 In the same manner as in Example 3, a resin layer made of the resin composition (2) having the following composition was formed on both surfaces of the obtained resin support, and the compound (A) and the compound ( A base material formed by forming a transparent resin layer containing S) was obtained. The spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined. The results are shown in Table 5-1.
- Resin composition (2) 100 parts by weight of tricyclodecane dimethanol diacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.10 parts by weight of compound (a-1), 0.10 parts by weight of compound (a-2) Parts, 1.75 parts by weight of compound (s-6), methyl ethyl ketone (solvent, TSC: 25%)
- a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
- a dielectric multilayer film (VIII) was formed to obtain an optical filter having a thickness of about 0.109 mm.
- the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 5 an optical filter having a base material composed of a transparent glass substrate having a transparent resin layer containing the compound (A) on one side was prepared by the following procedure and conditions.
- a resin composition (3) having the following composition was applied with a spin coater.
- the solvent was volatilized and removed by heating on a hot plate at 80 ° C. for 2 minutes.
- coating conditions of the spin coater were adjusted so that the thickness after drying might be set to 2 micrometers.
- Resin composition (3) 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.20 part by weight of compound (a-1), compound (A-2) 0.20 part by weight, compound (s-6) 3.50 part by weight, methyl ethyl ketone (solvent, TSC: 35%)
- a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
- a multilayer film (IX) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the base material (20 layers in total)
- a dielectric multilayer film (X) was formed to obtain an optical filter having a thickness of about 0.107 mm.
- the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 6 an optical filter having a base material composed of a near-infrared absorbing glass substrate having a transparent resin layer containing the compound (A) on one side was prepared by the following procedure and conditions.
- a resin composition (4) having the following composition was applied on a near infrared absorbing glass substrate “BS-11 (thickness 120 ⁇ m)” (manufactured by Matsunami Glass Industry Co., Ltd.) cut to a size of 60 mm in length and 60 mm in width with a spin coater. Then, the solvent was volatilized and removed by heating at 80 ° C. for 2 minutes on a hot plate. Under the present circumstances, the application
- Resin composition (4) 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.15 part by weight of compound (a-3), compound (A-4) 0.30 part by weight, methyl ethyl ketone (solvent, TSC: 35%)
- a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
- a multilayer film (XI) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the substrate (20 layers in total).
- a dielectric multilayer film (XII) was formed to obtain an optical filter having a thickness of about 0.107 mm.
- the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 7 an optical filter having a base material made of a transparent resin substrate containing the compound (A) and having a transparent resin layer containing near-infrared absorbing fine particles on both surfaces was prepared according to the following procedure and conditions.
- Example 2 a transparent resin substrate containing compound (A) was obtained by the same procedure and conditions as in Example 2 except that compound (S-8) and the other dye (X-1) were not used. It was.
- a base material made of a transparent resin substrate containing (A) was obtained.
- the spectral transmittance of this substrate was measured, and the transmittance at (T 1 ), (X 1 ), (X 2 ), (Xc) and each wavelength was determined.
- the results are shown in FIG. 7 and Table 5-1.
- Resin composition (5) 100 parts by weight of tricyclodecane dimethanol diacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 35 parts by weight of near-infrared absorbing fine particle dispersion (YMF-02A manufactured by Sumitomo Metal Mining Co., Ltd.) About 10 parts by weight in terms of solid content), methyl ethyl ketone (solvent, TSC: 30%)
- a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total).
- a dielectric multilayer film (XIV) was formed to obtain an optical filter having a thickness of about 0.109 mm.
- the dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1.
- the spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 8 to 13 Resin, solvent, drying conditions of resin substrate, compound (A), compound (S), and other dye (X) were changed in the same manner as in Example 3 except for changing as shown in Table 5-1. Materials and optical filters were made. The optical properties of the obtained substrate and optical filter are shown in Table 5-1. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
- Example 1 In Example 1, except that the compound (S) and the compound (A) were not used, a substrate and an optical filter were prepared in the same manner as in Example 1, and optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 1 exhibits relatively good visible light transmittance, the optical property has a large incident angle dependency, and the base material has no absorption in the vicinity of 700 nm or in the near infrared wavelength region. Therefore, it was confirmed that the color shading suppression effect and the ghost suppression effect were inferior.
- Comparative Example 2 An optical filter was prepared and the optical characteristics were evaluated in the same manner as in Example 1 except that a transparent glass substrate “OA-10G (thickness 150 ⁇ m)” (manufactured by Nippon Electric Glass Co., Ltd.) was used as the substrate. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 2 shows relatively good visible light transmittance, the optical property has a large incident angle dependency, and the base material has no absorption in the vicinity of 700 nm or near infrared wavelength region. Therefore, it was confirmed that the color shading suppression effect and the ghost suppression effect were inferior.
- OA-10G thickness 150 ⁇ m
- Example 3 An optical filter was prepared in the same manner as in Example 1 except that a near-infrared absorbing glass substrate “BS-11 (thickness 120 ⁇ m)” (manufactured by Matsunami Glass Industry Co., Ltd.) was used as a base material, and optical characteristics were evaluated. did. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 3 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was poor.
- BS-11 thickness 120 ⁇ m
- Example 4 In Example 3, 0.08 part of compound (a-4) and 0.06 part of compound (a-5) were used as compound (A) without using compound (S), and dye (X— 1) Except having used 0.01 part, the base material and the optical filter were created like Example 3, and the optical characteristic was evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 5 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the near-infrared wavelength region of the substrate was not sufficient and the ghost suppression effect was inferior.
- Example 6 a substrate and an optical filter were prepared in the same manner as in Example 6 except that the resin composition (6) having the following composition was used instead of the resin composition (4).
- Resin composition (6) 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.15 part by weight of compound (a-1), methyl ethyl ketone (Solvent, TSC: 35%)
- the optical properties of the obtained substrate and optical filter were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2.
- the spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 5 showed relatively good optical properties, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was poor.
- Example 6 In Example 3, 0.04 part of the compound (a-3) and 0.08 part of the compound (a-4) were used as the compound (A), and 0.01% of the compound (s-6) was used as the compound (S). A substrate and an optical filter were prepared in the same manner as in Example 3 except that the parts were used, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 6 showed relatively good optical properties, it was confirmed that the absorption intensity in the near infrared wavelength region of the substrate was not sufficient and the ghost suppression effect was inferior.
- Example 3 except that 0.04 part of the compound (a-1) was used as the compound (A) and 0.07 part of the compound (s-6) was used as the compound (S) in Example 3.
- a substrate and an optical filter were prepared in the same manner as described above, and the optical characteristics were evaluated.
- a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2.
- the optical filter obtained in Comparative Example 7 showed relatively good optical properties, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was inferior.
- Example 8 In Example 3, 0.04 part of compound (a-1) was used as compound (A), and compound (s-14) described in Table 2-4 above (absorption in dichloromethane) was used as compound (S). A substrate and an optical filter were prepared in the same manner as in Example 3 except that 0.45 part of the maximum wavelength (1097 nm) was used, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 8 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was inferior.
- Optical filter 2 Spectrophotometer 3: Light 10: Base material 11: First optical layer 12: Second optical layer 13: Third optical layer 14: Fourth optical layer 111: Camera image 112: White plate 113: Example of the center of the white plate 114: Example of the edge of the white plate 121: Camera image 122: Light source 123: Example of ghost around the light source
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Optical Filters (AREA)
- Laminated Bodies (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Blocking Light For Cameras (AREA)
Abstract
Description
(a)波長650nm以上760nm以下の領域に吸収極大を有する化合物(A)を含む層を有する;
(b)波長640nm以上の領域において透過率が10%となる一番短い波長(X1)と二番目に短い波長(X2)との差(X2-X1)が50nm以上である;
(c)波長900nmにおける透過率、波長1000nmにおける透過率、および波長1100nmにおける透過率がいずれも65%以下である;
(d)波長430~580nmの領域において、光学フィルターの垂直方向から測定した場合の透過率の平均値が75%以上である;
(e)波長1100nm~1200nmの領域において、光学フィルターの垂直方向から測定した場合の透過率の平均値が5%以下である。 [1] An optical filter having a substrate that satisfies the following requirements (a), (b), and (c), and that satisfies the following requirements (d) and (e):
(A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm;
(B) The difference (X 2 −X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more;
(C) The transmittance at a wavelength of 900 nm, the transmittance at a wavelength of 1000 nm, and the transmittance at a wavelength of 1100 nm are all 65% or less;
(D) In the wavelength range of 430 to 580 nm, the average transmittance when measured from the vertical direction of the optical filter is 75% or more;
(E) In the wavelength region of 1100 nm to 1200 nm, the average transmittance when measured from the vertical direction of the optical filter is 5% or less.
(f)波長690~720nmの領域における透過率の最小値(T1)が5%以下である。 [4] The optical filter according to any one of items [1] to [3], wherein the base material further satisfies the following requirement (f):
(F) The minimum transmittance (T 1 ) in the wavelength range of 690 to 720 nm is 5% or less.
(g)波長1050nm以上1200nm以下の領域に吸収極大を有する化合物(S)を含む。 [5] The optical filter according to any one of items [1] to [4], wherein the substrate further satisfies the following requirement (g):
(G) A compound (S) having an absorption maximum in a wavelength region of 1050 nm to 1200 nm is included.
選ばれる少なくとも1種の化合物であることを特徴とする、項[5]に記載の光学フィルター。 [6] The item [5], wherein the compound (S) is at least one compound selected from the group consisting of compounds represented by the following formulas (I) and (II): Optical filter.
R1~R3は、それぞれ独立に水素原子、ハロゲン原子、スルホ基、水酸基、シアノ基、ニトロ基、カルボキシ基、リン酸基、-NRgRh基、-SRi基、-SO2Ri基、-OSO2Ri基または下記La~Lhのいずれかを表し、RgおよびRhは、それぞれ独立に水素原子、-C(O)Ri基または下記La~Leのいずれかを表し、Riは下記La~Leのいずれかを表し、
(La)炭素数1~12の脂肪族炭化水素基
(Lb)炭素数1~12のハロゲン置換アルキル基
(Lc)炭素数3~14の脂環式炭化水素基
(Ld)炭素数6~14の芳香族炭化水素基
(Le)炭素数2~14の複素環基
(Lf)炭素数1~12のアルコキシ基
(Lg)置換基Lを有してもよい炭素数1~12のアシル基、
(Lh)置換基Lを有してもよい炭素数1~12のアルコキシカルボニル基
置換基Lは、炭素数1~12の脂肪族炭化水素基、炭素数1~12のハロゲン置換アルキル基、炭素数3~14の脂環式炭化水素基、炭素数6~14の芳香族炭化水素基および炭素数3~14の複素環基からなる群より選ばれる少なくとも1種であり、
隣り合うR3同士は、置換基Lを有してもよい環を形成してもよく、
nは0~4の整数を表し、
Xは電荷を中和させるのに必要なアニオンを表し、
Mは金属原子を表し、
ZはD(Ri)4を表し、Dは窒素原子、リン原子またはビスマス原子を表し、
yは0もしくは1を表す。
R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ~ L e,
(L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3 to 14 carbon atoms (L d ) carbon C 6-14 aromatic hydrocarbon group (L e ) C 2-14 heterocyclic group (L f ) C 1-12 alkoxy group (L g ) carbon number optionally having
(L h ) an alkoxycarbonyl group having 1 to 12 carbon atoms which may have a substituent L. The substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms,
Adjacent R 3 may form a ring which may have a substituent L,
n represents an integer of 0 to 4,
X represents an anion necessary to neutralize the charge,
M represents a metal atom,
Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom;
y represents 0 or 1.
本発明で用いられる基材は、下記要件(a)、(b)および(c)を満たす;
(a)波長650nm以上760nm以下の領域に吸収極大を有する化合物(A)を含む層を有する;
(b)波長640nm以上の領域において透過率が10%となる一番短い波長(X1)と二番目に短い波長(X2)との差(X2-X1)が50nm以上である;
(c)波長900nmにおける透過率(c1)、波長1000nmにおける透過率(c2)、および波長1100nmにおける透過率(c3)がいずれも65%以下である。 [Base material]
The substrate used in the present invention satisfies the following requirements (a), (b) and (c);
(A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm;
(B) The difference (X 2 −X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more;
(C) The transmittance (c1) at a wavelength of 900 nm, the transmittance (c2) at a wavelength of 1000 nm, and the transmittance (c3) at a wavelength of 1100 nm are all 65% or less.
(f)波長690~720nmの領域における透過率の最小値(T1)が5%以下である;
(g)波長1050nm以上1200nm以下の領域に吸収極大を有する化合物(S)を含む;
(h)波長600nm以上の領域において透過率が50%超から50%以下となる際の透過率が50%となる最も短い波長(Xc)が波長628~658nmの範囲にある。 The substrate preferably further satisfies at least one of the following requirements (f) to (h):
(F) The minimum transmittance (T 1 ) in the wavelength region of 690 to 720 nm is 5% or less;
(G) including a compound (S) having an absorption maximum in a wavelength region of 1050 nm to 1200 nm;
(H) In the region where the wavelength is 600 nm or more, the shortest wavelength (Xc) at which the transmittance is 50% when the transmittance is more than 50% to 50% or less is in the wavelength range of 628 to 658 nm.
要件(a)において、化合物(A)を含む層を構成する成分は特に限定されないが、例えば、透明樹脂、ゾルゲル材料、低温硬化ガラス材料などが挙げられるが、取扱いが容易であることや化合物(A)との相溶性の観点から透明樹脂であることが好ましい。 <Requirement (a)>
In the requirement (a), the component constituting the layer containing the compound (A) is not particularly limited, and examples thereof include a transparent resin, a sol-gel material, a low-temperature-curing glass material, and the like. A transparent resin is preferable from the viewpoint of compatibility with A).
化合物(A)は、波長650nm以上760nm以下の領域に吸収極大を有する化合物であれば特に制限されないが、溶剤可溶型の色素化合物であることが好ましく、スクアリリウム系化合物、フタロシアニン系化合物およびシアニン系化合物からなる群より選ばれる少なくとも1種であることがより好ましく、スクアリリウム系化合物を含むことがさらに好ましく、スクアリリウム系化合物を含む2種以上であることが特に好ましい。化合物(A)がスクアリリウム系化合物を含む2種以上である場合、構造の異なるスクアリリウム系化合物が2種以上でもよく、スクアリリウム系化合物とその他の化合物(A)との組み合わせでもよい。その他の化合物(A)としては、フタロシアニン系化合物およびシアニン系化合物が特に好ましい。 << Compound (A) >>
The compound (A) is not particularly limited as long as it has a maximum absorption in the wavelength region of 650 nm or more and 760 nm or less, but is preferably a solvent-soluble dye compound, and is a squarylium compound, a phthalocyanine compound, and a cyanine compound. It is more preferable that it is at least one selected from the group consisting of compounds, it is more preferable that a squarylium compound is included, and it is particularly preferable that there are two or more compounds including a squarylium compound. When the compound (A) is two or more types including a squarylium compound, two or more types of squarylium compounds having different structures may be used, or a combination of a squarylium compound and another compound (A) may be used. As the other compound (A), a phthalocyanine compound and a cyanine compound are particularly preferable.
前記波長X1とX2との差(X2-X1)は、好ましくは53nm以上、より好ましくは55nm以上、さらに好ましくは58nm以上である。上限は特に限定されないが、化合物(A)やその他の近赤外線吸収剤の特性によっては値が大きすぎると可視透過率が低下する場合があるため、例えば100nm以下であることが好ましい。前記差(X2-X1)が上記のような範囲にあると、可視領域に近い近赤外波長領域において十分な強度(幅)の吸収帯を有することとなり、例えば入射角度45度などのような入射角度が大きい条件においても色シェーディングを抑制できるため好ましい。 <Requirement (b)>
The difference (X 2 −X 1 ) between the wavelengths X 1 and X 2 is preferably 53 nm or more, more preferably 55 nm or more, and further preferably 58 nm or more. Although an upper limit is not specifically limited, Since a visible transmittance | permeability may fall when a value is too large depending on the characteristic of a compound (A) and other near-infrared absorbers, it is preferable that it is 100 nm or less, for example. When the difference (X 2 −X 1 ) is in the above range, it has an absorption band with sufficient intensity (width) in the near-infrared wavelength region close to the visible region. It is preferable because color shading can be suppressed even under such a large incident angle condition.
前記透過率(c1)、(c2)および(c3)はいずれも、好ましくは60%以下、より好ましくは55%以下、さらに好ましくは50%以下である。下限は特に限定されないが、近赤外線吸収剤の特性によっては近赤外波長領域の透過率の値が低すぎると可視透過率が低下したり、基材の厚みが極端に厚くなってしまう場合があるため、例えば5%以上であることが好ましい。前記透過率(c1)、(c2)および(c3)が上記範囲にあれば、実用上十分なレベルのゴースト抑制効果を得ることができるため好ましい。 <Requirement (c)>
All of the transmittances (c1), (c2) and (c3) are preferably 60% or less, more preferably 55% or less, and even more preferably 50% or less. The lower limit is not particularly limited, but depending on the properties of the near-infrared absorber, if the transmittance value in the near-infrared wavelength region is too low, the visible transmittance may decrease, or the thickness of the substrate may become extremely thick. For example, it is preferably 5% or more. It is preferable that the transmittances (c1), (c2), and (c3) are in the above ranges because a ghost suppressing effect at a practically sufficient level can be obtained.
前記T1は、好ましくは3%以下、より好ましくは2%以下、さらに好ましくは1%以下である。T1が上記の範囲にあれば、吸収帯の透過率カットが十分であるということができ、カメラ画像において光源周辺のフレアを抑制することができるため好ましい。 <Requirement (f)>
The T 1 is preferably 3% or less, more preferably 2% or less, and still more preferably 1% or less. If T 1 is in the above range, it can be said that the transmittance cut of the absorption band is sufficient, and flare around the light source can be suppressed in the camera image, which is preferable.
本発明の基材は近赤外線吸収剤を含むことが好ましいが、該近赤外線吸収剤が前記化合物(S)であると、近赤外線波長領域の吸収強度と可視透過率とを高いレベルで両立できる傾向にあるため好ましい。 <Requirement (g)>
The substrate of the present invention preferably contains a near-infrared absorber, but when the near-infrared absorber is the compound (S), the absorption intensity and visible transmittance in the near-infrared wavelength region can be compatible at a high level. It is preferable because of its tendency.
化合物(S)は、波長1050nm以上1200nm以下の領域に吸収極大を有していれば特に制限されないが、好ましくは溶剤可溶型の色素化合物であり、より好ましくはジイモニウム系化合物、金属ジチオラート錯体系化合物、ピロロピロール系化合物、シアニン系化合物、クロコニウム系化合物およびナフタロシアニン系化合物からなる群より選ばれる少なくとも1種の化合物であり、さらに好ましくはジイモニウム系化合物および金属ジチオラート錯体系化合物からなる群より選ばれる少なくとも1種の化合物であり、特に好ましくは下記式(I)で表されるジイモニウム系化合物および下記式(II)で表される金属ジチオラート錯体系化合物からなる群より選ばれる少なくとも1種である。このような化合物(S)を用いることにより、良好な近赤外線吸収特性と優れた可視光透過率を達成することができる。 ≪Compound (S) ≫
The compound (S) is not particularly limited as long as it has an absorption maximum in a wavelength region of 1050 nm or more and 1200 nm or less, but is preferably a solvent-soluble dye compound, more preferably a diimonium compound or a metal dithiolate complex system. At least one compound selected from the group consisting of compounds, pyrrolopyrrole compounds, cyanine compounds, croconium compounds and naphthalocyanine compounds, more preferably selected from the group consisting of diimonium compounds and metal dithiolate complex compounds At least one compound selected from the group consisting of a diimonium compound represented by the following formula (I) and a metal dithiolate complex compound represented by the following formula (II). . By using such a compound (S), good near-infrared absorption characteristics and excellent visible light transmittance can be achieved.
R1~R3は、それぞれ独立に水素原子、ハロゲン原子、スルホ基、水酸基、シアノ基、ニトロ基、カルボキシ基、リン酸基、-NRgRh基、-SRi基、-SO2Ri基、-OSO2Ri基または下記La~Lhのいずれかを表し、RgおよびRhは、それぞれ独立に水素原子、-C(O)Ri基または下記La~Leのいずれかを表し、Riは下記La~Leのいずれかを表し、
(La)炭素数1~12の脂肪族炭化水素基
(Lb)炭素数1~12のハロゲン置換アルキル基
(Lc)炭素数3~14の脂環式炭化水素基
(Ld)炭素数6~14の芳香族炭化水素基
(Le)炭素数2~14の複素環基
(Lf)炭素数1~12のアルコキシ基
(Lg)置換基Lを有してもよい炭素数1~12のアシル基、
(Lh)置換基Lを有してもよい炭素数1~12のアルコキシカルボニル基
置換基Lは、炭素数1~12の脂肪族炭化水素基、炭素数1~12のハロゲン置換アルキル基、炭素数3~14の脂環式炭化水素基、炭素数6~14の芳香族炭化水素基および炭素数3~14の複素環基からなる群より選ばれる少なくとも1種であり、
隣り合うR3同士は置換基Lを有してもよい環を形成してもよく、
nは0~4の整数を表し、
Xは電荷を中和させるのに必要なアニオンを表し、
Mは金属原子を表し、
ZはD(Ri)4を表し、 Dは窒素原子、リン原子またはビスマス原子を表し、
yは0もしくは1を表す。
R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ~ L e,
(L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3 to 14 carbon atoms (L d ) carbon C 6-14 aromatic hydrocarbon group (L e ) C 2-14 heterocyclic group (L f ) C 1-12 alkoxy group (L g ) carbon number optionally having
(L h ) an alkoxycarbonyl group having 1 to 12 carbon atoms which may have a substituent L. The substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms,
Adjacent R 3 may form a ring which may have a substituent L,
n represents an integer of 0 to 4,
X represents an anion necessary to neutralize the charge,
M represents a metal atom,
Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom,
y represents 0 or 1.
前記Xcは、好ましくは630~655nm、より好ましくは632~652nm、さらに好ましくは634~650nmである。Xcが628nm未満であると、赤色に相当する波長領域の透過率が低くなり、色再現性が低下する傾向にあり、658nm超であると、十分な強度の吸収強度を確保できず、カメラ画像に色シェーディングが発生してしまう傾向にある。 <Requirement (h)>
Xc is preferably 630 to 655 nm, more preferably 632 to 652 nm, and still more preferably 634 to 650 nm. If Xc is less than 628 nm, the transmittance in the wavelength region corresponding to red tends to be low, and color reproducibility tends to decrease. If it exceeds 658 nm, sufficient absorption intensity cannot be ensured, and the camera image Color shading tends to occur.
波長430~580nmの領域における基材の平均透過率は、好ましくは75%以上、さらに好ましくは78%以上、特に好ましくは80%以上である。このような透過特性を有する基材を用いると、可視域において高い光線透過特性を達成でき、高感度なカメラ機能を達成することができる。 <Other properties and physical properties>
The average transmittance of the substrate in the wavelength region of 430 to 580 nm is preferably 75% or more, more preferably 78% or more, and particularly preferably 80% or more. When a substrate having such transmission characteristics is used, high light transmission characteristics can be achieved in the visible range, and a highly sensitive camera function can be achieved.
前記基材を構成する透明樹脂層、透明樹脂製基板および樹脂製支持体に用いられる透明樹脂としては、本発明の効果を損なわないものである限り特に制限されないが、例えば、熱安定性およびフィルムへの成形性を確保し、かつ、100℃以上の蒸着温度で行う高温蒸着により誘電体多層膜を形成しうるフィルムとするため、ガラス転移温度(Tg)が、好ましくは110~380℃、より好ましくは110~370℃、さらに好ましくは120~360℃である樹脂が挙げられる。また、前記樹脂のガラス転移温度が140℃以上であると、誘電体多層膜をより高温で蒸着形成しえるフィルムが得られるため、特に好ましい。 <Transparent resin>
The transparent resin used for the transparent resin layer, the transparent resin substrate and the resin support constituting the base material is not particularly limited as long as it does not impair the effects of the present invention. For example, thermal stability and film Glass transition temperature (Tg) is preferably 110 to 380 ° C., in order to obtain a film capable of forming a dielectric multilayer film by high temperature vapor deposition performed at a vapor deposition temperature of 100 ° C. or higher while ensuring moldability to Preferably, a resin having a temperature of 110 to 370 ° C., more preferably 120 to 360 ° C. is used. Further, it is particularly preferable that the glass transition temperature of the resin is 140 ° C. or higher because a film capable of depositing a dielectric multilayer film at a higher temperature can be obtained.
環状ポリオレフィン系樹脂としては、下記式(X0)で表される単量体および下記式(Y0)で表される単量体からなる群より選ばれる少なくとも1種の単量体から得られる樹脂、および当該樹脂を水素添加することで得られる樹脂が好ましい。 ≪Cyclic polyolefin resin≫
The cyclic polyolefin-based resin is obtained from at least one monomer selected from the group consisting of a monomer represented by the following formula (X 0 ) and a monomer represented by the following formula (Y 0 ). A resin and a resin obtained by hydrogenating the resin are preferable.
(i')水素原子
(ii')ハロゲン原子
(iii')トリアルキルシリル基
(iv')酸素原子、硫黄原子、窒素原子またはケイ素原子を含む連結基を有する、置換または非置換の炭素数1~30の炭化水素基
(v')置換または非置換の炭素数1~30の炭化水素基
(vi')極性基(但し、(iv')を除く。)
(vii')Rx1とRx2またはRx3とRx4とが、相互に結合して形成されたアルキリデン基(但し、前記結合に関与しないRx1~Rx4は、それぞれ独立に前記(i')~(vi')より選ばれる原子または基を表す。)
(viii')Rx1とRx2またはRx3とRx4とが、相互に結合して形成された単環もしくは多環の炭化水素環または複素環(但し、前記結合に関与しないRx1~Rx4は、それぞれ独立に前記(i')~(vi')より選ばれる原子または基を表す。)
(ix')Rx2とRx3とが、相互に結合して形成された単環の炭化水素環または複素環(但し、前記結合に関与しないRx1とRx4は、それぞれ独立に前記(i')~(vi')より選ばれる原子または基を表す。)
(I ′) a hydrogen atom (ii ′) a halogen atom (iii ′) a trialkylsilyl group (iv ′) a substituted or unsubstituted carbon atom having a linking group containing an oxygen atom, a sulfur atom, a nitrogen atom or a
(Vii ′) an alkylidene group formed by bonding R x1 and R x2 or R x3 and R x4 to each other (provided that R x1 to R x4 not involved in the bonding are independently the above (i ′ )-(Vi ′) represents an atom or group selected from.
(Viii ′) R x1 and R x2 or R x3 and R x4 are bonded to each other to form a monocyclic or polycyclic hydrocarbon ring or heterocyclic ring (provided that R x1 to R which are not involved in the bond) x4 each independently represents an atom or group selected from (i ′) to (vi ′).
(Ix ′) A monocyclic hydrocarbon ring or heterocycle formed by bonding R x2 and R x3 to each other (provided that R x1 and R x4 not involved in the bonding are each independently the above (i Represents an atom or group selected from ') to (vi').
芳香族ポリエーテル系樹脂は、下記式(1)で表される構造単位および下記式(2)で表される構造単位からなる群より選ばれる少なくとも1種の構造単位を有することが好ましい。 ≪Aromatic polyether resin≫
The aromatic polyether-based resin preferably has at least one structural unit selected from the group consisting of a structural unit represented by the following formula (1) and a structural unit represented by the following formula (2).
ポリイミド系樹脂としては、特に制限されず、繰り返し単位にイミド結合を含む高分子化合物であればよく、例えば、特開2006-199945号公報や特開2008-163107号公報に記載されている方法で合成することができる。 ≪Polyimide resin≫
The polyimide resin is not particularly limited as long as it is a polymer compound containing an imide bond in a repeating unit. For example, the method described in JP-A-2006-199945 and JP-A-2008-163107 is used. Can be synthesized.
フルオレンポリカーボネート系樹脂としては、特に制限されず、フルオレン部位を含むポリカーボネート樹脂であればよく、例えば、特開2008-163194号公報に記載されている方法で合成することができる。 ≪Fluorene polycarbonate resin≫
The fluorene polycarbonate resin is not particularly limited as long as it is a polycarbonate resin containing a fluorene moiety, and can be synthesized, for example, by the method described in JP-A-2008-163194.
フルオレンポリエステル系樹脂としては、特に制限されず、フルオレン部位を含むポリエステル樹脂であればよく、例えば、特開2010-285505号公報や特開2011-197450号公報に記載されている方法で合成することができる。 ≪Fluorene polyester resin≫
The fluorene polyester resin is not particularly limited as long as it is a polyester resin containing a fluorene moiety. For example, the fluorene polyester resin can be synthesized by the method described in JP 2010-285505 A or JP 2011-197450 A. Can do.
フッ素化芳香族ポリマー系樹脂としては、特に制限されないが、フッ素原子を少なくとも1つ有する芳香族環と、エーテル結合、ケトン結合、スルホン結合、アミド結合、イミド結合およびエステル結合からなる群より選ばれる少なくとも1つの結合を含む繰り返し単位とを含有するポリマーであることが好ましく、例えば特開2008-181121号公報に記載されている方法で合成することができる。 ≪Fluorinated aromatic polymer resin≫
The fluorinated aromatic polymer resin is not particularly limited, but is selected from the group consisting of an aromatic ring having at least one fluorine atom, an ether bond, a ketone bond, a sulfone bond, an amide bond, an imide bond, and an ester bond. The polymer preferably contains a repeating unit containing at least one bond, and can be synthesized, for example, by the method described in JP-A-2008-181121.
アクリル系紫外線硬化型樹脂としては、特に制限されないが、分子内に一つ以上のアクリル基もしくはメタクリル基を有する化合物と、紫外線によって分解して活性ラジカルを発生させる化合物を含有する樹脂組成物から合成されるものを挙げることができる。アクリル系紫外線硬化型樹脂は、前記基材として、ガラス支持体上やベースとなる樹脂製支持体上に化合物(A)および硬化性樹脂を含む透明樹脂層が積層された基材や、化合物(A)を含有する透明樹脂製基板上に硬化性樹脂等からなるオーバーコート層などの樹脂層が積層された基材を用いる場合、該硬化性樹脂として特に好適に使用することができる。 ≪Acrylic UV curable resin≫
The acrylic ultraviolet curable resin is not particularly limited, but is synthesized from a resin composition containing a compound having one or more acrylic or methacrylic groups in the molecule and a compound that decomposes by ultraviolet rays to generate active radicals. Can be mentioned. The acrylic ultraviolet curable resin is a base material in which a transparent resin layer containing a compound (A) and a curable resin is laminated on a glass support or a resin support as a base, or a compound ( When using a base material in which a resin layer such as an overcoat layer made of a curable resin or the like is used on a transparent resin substrate containing A), it can be particularly preferably used as the curable resin.
エポキシ系樹脂としては、特に制限されないが、紫外線硬化型と熱硬化型に大別することができる。紫外線硬化型エポキシ系樹脂としては、例えば、分子内に一つ以上のエポキシ基を有する化合物と、紫外線によって酸を発生させる化合物(以下「光酸発生剤」ともいう)を含有する組成物から合成されるものを挙げることができ、熱硬化型エポキシ系樹脂としては、例えば、分子内に一つ以上のエポキシ基を有する化合物と、酸無水物を含有する組成物から合成されるものを挙げることができる。エポキシ系紫外線硬化型樹脂は、前記基材として、ガラス支持体上やベースとなる樹脂製支持体上に化合物(A)を含む透明樹脂層が積層された基材や、化合物(A)を含有する透明樹脂製基板上に硬化性樹脂等からなるオーバーコート層などの樹脂層が積層された基材を用いる場合、該硬化性樹脂として特に好適に使用することができる。 ≪Epoxy resin≫
Although it does not restrict | limit especially as an epoxy-type resin, it can divide roughly into an ultraviolet curing type and a thermosetting type. As the ultraviolet curable epoxy resin, for example, synthesized from a composition containing a compound having one or more epoxy groups in the molecule and a compound that generates an acid by ultraviolet rays (hereinafter also referred to as “photo acid generator”). Examples of thermosetting epoxy resins include those synthesized from a composition containing one or more epoxy groups in the molecule and an acid anhydride. Can do. The epoxy ultraviolet curable resin contains, as the base material, a base material obtained by laminating a transparent resin layer containing the compound (A) on a glass support or a base resin support, and the compound (A). In the case of using a base material in which a resin layer such as an overcoat layer made of a curable resin is laminated on a transparent resin substrate to be used, it can be particularly suitably used as the curable resin.
透明樹脂の市販品としては、以下の市販品等を挙げることができる。環状ポリオレフィン系樹脂の市販品としては、JSR(株)製アートン、日本ゼオン(株)製ゼオノア、三井化学(株)製APEL、ポリプラスチックス(株)製TOPASなどを挙げることができる。ポリエーテルサルホン系樹脂の市販品としては、住友化学(株)製スミカエクセルPESなどを挙げることができる。ポリイミド系樹脂の市販品としては、三菱ガス化学(株)製ネオプリムLなどを挙げることができる。ポリカーボネート系樹脂の市販品としては、帝人(株)製ピュアエースなどを挙げることができる。フルオレンポリカーボネート系樹脂の市販品としては、三菱ガス化学(株)製ユピゼータEP-5000などを挙げることができる。フルオレンポリエステル系樹脂の市販品としては、大阪ガスケミカル(株)製OKP4HTなどを挙げることができる。アクリル系樹脂の市販品としては、(株)日本触媒製アクリビュアなどを挙げることができる。シルセスキオキサン系紫外線硬化型樹脂の市販品としては、新日鐵化学(株)製シルプラスなどを挙げることができる。 ≪Commercial product≫
The following commercial products etc. can be mentioned as a commercial item of transparent resin. Examples of commercially available cyclic polyolefin resins include Arton manufactured by JSR Corporation, ZEONOR manufactured by Nippon Zeon Co., Ltd., APEL manufactured by Mitsui Chemicals, Inc., and TOPAS manufactured by Polyplastics Corporation. Examples of commercially available polyethersulfone resins include Sumika Excel PES manufactured by Sumitomo Chemical Co., Ltd. Examples of commercially available polyimide resins include Neoprim L manufactured by Mitsubishi Gas Chemical Co., Ltd. Examples of commercially available polycarbonate resins include Pure Ace manufactured by Teijin Limited. Examples of commercially available fluorene polycarbonate resins include Iupizeta EP-5000 manufactured by Mitsubishi Gas Chemical Co., Ltd. Examples of commercially available fluorene polyester resins include OKP4HT manufactured by Osaka Gas Chemical Co., Ltd. Examples of commercially available acrylic resins include NIPPON CATALYST ACRYVIEWER. Examples of commercially available silsesquioxane-based ultraviolet curable resins include Silplus manufactured by Nippon Steel Chemical Co., Ltd.
前記基材には、さらに、化合物(A)および化合物(S)に該当しない、その他の色素(X)が含まれていてもよい。 <Other dye (X)>
The base material may further contain other dye (X) that does not correspond to the compound (A) and the compound (S).
前記基材は、本発明の効果を損なわない範囲において、その他成分として、さらに酸化防止剤、近紫外線吸収剤および蛍光消光剤などを含有してもよい。これらその他成分は、1種単独で用いてもよいし、2種以上を併用してもよい。 <Other ingredients>
The base material may further contain an antioxidant, a near-ultraviolet absorber, a fluorescence quencher, and the like as other components as long as the effects of the present invention are not impaired. These other components may be used alone or in combination of two or more.
前記基材が、化合物(A)を含有する透明樹脂製基板を含む基材である場合、該透明樹脂製基板は、例えば、溶融成形またはキャスト成形により形成することができ、さらに、必要により、成形後に、反射防止剤、ハードコート剤および/または帯電防止剤等のコーティング剤をコーティングすることで、オーバーコート層が積層された基材を製造することができる。 <Manufacturing method of substrate>
When the substrate is a substrate including a transparent resin substrate containing the compound (A), the transparent resin substrate can be formed by, for example, melt molding or cast molding, and further, if necessary, After molding, a substrate on which an overcoat layer is laminated can be produced by coating a coating agent such as an antireflection agent, a hard coating agent and / or an antistatic agent.
前記溶融成形としては、具体的には、樹脂と化合物(A)と必要に応じて他の成分とを溶融混練りして得られたペレットを溶融成形する方法;樹脂と化合物(A)と必要応じて他の成分とを含有する樹脂組成物を溶融成形する方法;または、化合物(A)、樹脂、溶剤および必要に応じて他の成分を含む樹脂組成物から溶剤を除去して得られたペレットを溶融成形する方法などが挙げられる。溶融成形方法としては、射出成形、溶融押出成形またはブロー成形などを挙げることができる。 ≪Melt molding≫
Specifically, as the melt molding, a method of melt molding a pellet obtained by melt-kneading a resin, a compound (A) and other components as necessary; a resin, a compound (A) and a necessary A method of melt-molding a resin composition containing other components as required; or obtained by removing the solvent from the resin composition containing compound (A), resin, solvent and other components as necessary Examples include a method of melt-molding pellets. Examples of the melt molding method include injection molding, melt extrusion molding, and blow molding.
前記キャスト成形としては、化合物(A)、樹脂、溶剤および必要に応じて他の成分を含む樹脂組成物を適当な支持体の上にキャスティングして溶剤を除去する方法;または化合物(A)と、光硬化性樹脂および/または熱硬化性樹脂と、必要に応じて他の成分とを含む硬化性組成物を適当な支持体の上にキャスティングして溶媒を除去した後、紫外線照射や加熱などの適切な手法により硬化させる方法などにより製造することもできる。 ≪Cast molding≫
As the cast molding, a method of removing a solvent by casting a resin composition containing a compound (A), a resin, a solvent and other components as required on a suitable support; or a compound (A) and After removing a solvent by casting a curable composition containing a photocurable resin and / or a thermosetting resin and other components as necessary on an appropriate support, ultraviolet irradiation, heating, etc. It can also be produced by a method of curing by an appropriate method.
本発明に係る光学フィルターは、前記要件(a)、(b)および(c)を満たす基材を有し、かつ、下記要件(d)および(e)を満たすことを特徴とする:
(d)波長430~580nmの領域において、光学フィルターの垂直方向から測定した場合の透過率の平均値(d1)が75%以上である;
(e)波長1100nm~1200nmの領域において、光学フィルターの垂直方向から測定した場合の透過率の平均値(e1)が5%以下である。 [Optical filter]
The optical filter according to the present invention has a base material that satisfies the requirements (a), (b), and (c), and satisfies the following requirements (d) and (e):
(D) In the wavelength range of 430 to 580 nm, the average value (d1) of transmittance when measured from the vertical direction of the optical filter is 75% or more;
(E) In the wavelength region of 1100 nm to 1200 nm, the average value (e1) of transmittance when measured from the vertical direction of the optical filter is 5% or less.
要件(d)における前記透過率の平均値(d1)は、好ましくは78%以上、より好ましくは80%以上、さらに好ましくは82%以上である。前記透過率の平均値(d1)がこの範囲にあると、本発明の光学フィルターを固体撮像素子用途として使用した場合、優れた撮像感度を達成することができる。 <Requirement (d)>
The average value (d1) of the transmittance in the requirement (d) is preferably 78% or more, more preferably 80% or more, and further preferably 82% or more. When the average value (d1) of the transmittance is in this range, excellent imaging sensitivity can be achieved when the optical filter of the present invention is used as a solid-state imaging device.
要件(e)における前記透過率の平均値(e1)は、好ましくは4%以下、より好ましくは3%以下、さらに好ましくは2%以下である。前記透過率の平均値(e1)がこの範囲にあると、カメラ画像の中心付近において良好な黒色再現性を達成することができる。 <Requirement (e)>
The average value (e1) of the transmittance in requirement (e) is preferably 4% or less, more preferably 3% or less, and even more preferably 2% or less. When the average value (e1) of the transmittance is within this range, good black reproducibility can be achieved near the center of the camera image.
本発明の光学フィルターは、前記基材を有するため、誘電体多層膜を有する形態においても光学特性の入射角依存を低減することができる。具体的には、波長600~800nmの範囲において、光学フィルターの垂直方向から測定した時の透過率が50%となる最も短い波長の値(Xa)と、光学フィルターの垂直方向に対して30°の角度から測定した時の透過率が50%となる波長の値(Xb)との差の絶対値|Xa-Xb|は、好ましくは20nm未満、より好ましくは15nm未満、さらに好ましくは10nm未満である。 <Other properties and physical properties>
Since the optical filter of the present invention has the base material, the incident angle dependency of the optical characteristics can be reduced even in the form having the dielectric multilayer film. Specifically, in the wavelength range of 600 to 800 nm, the shortest wavelength value (Xa) at which the transmittance when measured from the vertical direction of the optical filter is 50%, and 30 ° with respect to the vertical direction of the optical filter. The absolute value | Xa−Xb | of the difference from the wavelength value (Xb) at which the transmittance when measured from the angle is 50% is preferably less than 20 nm, more preferably less than 15 nm, and even more preferably less than 10 nm. is there.
本発明の光学フィルターは、前記基材の少なくとも一方の面に誘電体多層膜を有することが好ましい。本発明における誘電体多層膜とは、近赤外線を反射する能力を有する膜または可視域における反射防止効果を有する膜であり、誘電体多層膜を有することでより優れた可視光透過率と近赤外線カット特性を達成することができる。 [Dielectric multilayer film]
The optical filter of the present invention preferably has a dielectric multilayer film on at least one surface of the substrate. The dielectric multilayer film in the present invention is a film having the ability to reflect near-infrared rays or a film having an antireflection effect in the visible range. By having a dielectric multilayer film, a better visible light transmittance and near-infrared radiation are obtained. Cut characteristics can be achieved.
本発明の光学フィルターは、本発明の効果を損なわない範囲において、基材と誘電体多層膜との間、基材の誘電体多層膜が設けられた面と反対側の面、または誘電体多層膜の基材が設けられた面と反対側の面に、基材や誘電体多層膜の表面硬度の向上、耐薬品性の向上、帯電防止および傷消しなどの目的で、反射防止膜、ハードコート膜や帯電防止膜などの機能膜を適宜設けることができる。 [Other functional membranes]
The optical filter of the present invention is within the range not impairing the effects of the present invention, between the base material and the dielectric multilayer film, the surface opposite to the surface on which the dielectric multilayer film is provided, or the dielectric multilayer film. On the opposite side of the surface of the film where the substrate is provided, an anti-reflection film, a hard layer is used for the purpose of improving the surface hardness of the substrate or the dielectric multilayer film, improving the chemical resistance, antistatic and scratching. Functional films such as a coating film and an antistatic film can be provided as appropriate.
本発明の光学フィルターは、視野角が広く、優れた近赤外線カット能等を有する。したがって、カメラモジュールのCCDやCMOSイメージセンサー等の固体撮像素子の視感度補正用として有用である。特に、デジタルスチルカメラ、スマートフォン用カメラ、携帯電話用カメラ、デジタルビデオカメラ、ウェアラブルデバイス用カメラ、PCカメラ、監視カメラ、自動車用カメラ、テレビ、カーナビゲーション、携帯情報端末、ビデオゲーム機、携帯ゲーム機、指紋認証システム、デジタルミュージックプレーヤー等に有用である。さらに、自動車や建物等のガラス板等に装着される熱線カットフィルターなどとしても有用である。 [Use of optical filter]
The optical filter of the present invention has a wide viewing angle and has excellent near-infrared cutting ability and the like. Therefore, it is useful for correcting the visibility of a solid-state imaging device such as a CCD or CMOS image sensor of a camera module. In particular, digital still cameras, smartphone cameras, mobile phone cameras, digital video cameras, wearable device cameras, PC cameras, surveillance cameras, automotive cameras, TVs, car navigation systems, personal digital assistants, video game machines, and portable game machines It is useful for fingerprint authentication system, digital music player, etc. Furthermore, it is also useful as a heat ray cut filter attached to a glass plate of an automobile or a building.
本発明の固体撮像装置は、本発明の光学フィルターを具備する。ここで、固体撮像装置とは、CCDやCMOSイメージセンサー等といった固体撮像素子を備えたイメージセンサーであり、具体的にはデジタルスチルカメラ、スマートフォン用カメラ、携帯電話用カメラ、ウェアラブルデバイス用カメラ、デジタルビデオカメラ等の用途に用いることができる。例えば、本発明のカメラモジュールは、本発明の光学フィルターを具備する。 [Solid-state imaging device]
The solid-state imaging device of the present invention includes the optical filter of the present invention. Here, the solid-state imaging device is an image sensor including a solid-state imaging device such as a CCD or a CMOS image sensor. Specifically, a digital still camera, a camera for a smartphone, a camera for a mobile phone, a camera for a wearable device, a digital camera It can be used for applications such as video cameras. For example, the camera module of the present invention includes the optical filter of the present invention.
樹脂の分子量は、各樹脂の溶剤への溶解性等を考慮し、下記の(a)または(b)の方法にて測定を行った。
(a)ウォターズ(WATERS)社製のゲルパーミエ-ションクロマトグラフィー(GPC)装置(150C型、カラム:東ソー社製Hタイプカラム、展開溶剤:o-ジクロロベンゼン)を用い、標準ポリスチレン換算の重量平均分子量(Mw)および数平均分子量(Mn)を測定した。
(b)東ソー社製GPC装置(HLC-8220型、カラム:TSKgelα‐M、展開溶剤:THF)を用い、標準ポリスチレン換算の重量平均分子量(Mw)および数平均分子量(Mn)を測定した。 <Molecular weight>
The molecular weight of the resin was measured by the following method (a) or (b) in consideration of the solubility of each resin in a solvent.
(A) Weight average molecular weight in terms of standard polystyrene using a gel permeation chromatography (GPC) apparatus manufactured by WATERS (150C type, column: H type column manufactured by Tosoh Corporation, developing solvent: o-dichlorobenzene) (Mw) and number average molecular weight (Mn) were measured.
(B) Standard polystyrene equivalent weight average molecular weight (Mw) and number average molecular weight (Mn) were measured using a GPC apparatus (HLC-8220 type, column: TSKgelα-M, developing solvent: THF) manufactured by Tosoh Corporation.
(c)ポリイミド樹脂溶液の一部を無水メタノールに投入してポリイミド樹脂を析出させ、ろ過して未反応単量体から分離した。80℃で12時間真空乾燥して得られたポリイミド0.1gをN-メチル-2-ピロリドン20mLに溶解し、キャノン-フェンスケ粘度計を使用して30℃における対数粘度(μ)を下記式により求めた。 In addition, about the resin synthesize | combined in the resin synthesis example 3 mentioned later, the logarithmic viscosity was measured by the following method (c) instead of the molecular weight measurement by the said method.
(C) A part of the polyimide resin solution was added to anhydrous methanol to precipitate the polyimide resin, and filtered to separate from the unreacted monomer. 0.1 g of polyimide obtained by vacuum drying at 80 ° C. for 12 hours is dissolved in 20 mL of N-methyl-2-pyrrolidone, and the logarithmic viscosity (μ) at 30 ° C. is obtained by the following formula using a Canon-Fenske viscometer. Asked.
t0:溶媒の流下時間
ts:希薄高分子溶液の流下時間
C:0.5g/dL
<ガラス転移温度(Tg)>
エスアイアイ・ナノテクノロジーズ株式会社製の示差走査熱量計(DSC6200)を用いて、昇温速度:毎分20℃、窒素気流下で測定した。 μ = {ln (t s / t 0)} / C
t 0 : Flowing time of solvent t s : Flowing time of dilute polymer solution C: 0.5 g / dL
<Glass transition temperature (Tg)>
Using a differential scanning calorimeter (DSC6200) manufactured by SII Nano Technologies, Inc., the rate of temperature increase was measured at 20 ° C. per minute under a nitrogen stream.
基材の各波長における透過率、(T1)、(X1)、(X2)および(Xc)、ならびに、光学フィルターの各波長域における透過率、(Xa)および(Xb)は、株式会社日立ハイテクノロジーズ製の分光光度計(U-4100)を用いて測定した。 <Spectral transmittance>
The transmittance at each wavelength of the substrate, (T 1 ), (X 1 ), (X 2 ) and (Xc), and the transmittance at each wavelength region of the optical filter, (Xa) and (Xb) Measurement was performed using a spectrophotometer (U-4100) manufactured by Hitachi High-Technologies Corporation.
光学フィルターをカメラモジュールに組み込んだ際の色シェーディング評価は下記の方法で行った。特開2016-110067号公報と同様の方法でカメラモジュールを作成し、作成したカメラモジュールを用いて300mm×400mmサイズの白色板をD65光源(X-Rite社製標準光源装置「マクベスジャッジII」)下で撮影し、カメラ画像における白色板の中央部と端部における色目の違いを以下の基準で評価した。 <Camera image color shading evaluation>
The color shading evaluation when the optical filter was incorporated in the camera module was performed by the following method. A camera module is created in the same manner as in Japanese Patent Application Laid-Open No. 2016-110067, and a white plate having a size of 300 mm × 400 mm is formed using the created camera module as a D65 light source (standard light source device “Macbeth Judge II” manufactured by X-Rite) Images were taken below, and the difference in color between the center and edge of the white plate in the camera image was evaluated according to the following criteria.
光学フィルターをカメラモジュールに組み込んだ際のゴースト評価は下記の方法で行った。特開2016-110067号公報と同様の方法でカメラモジュールを作成し、作成したカメラモジュールを用いて暗室中ハロゲンランプ光源(林時計工業社製「ルミナーエースLA-150TX」)下で撮影し、カメラ画像における光源周辺のゴースト発生具合を以下の基準で評価した。 <Ghost evaluation of camera images>
Ghost evaluation when the optical filter was incorporated in the camera module was performed by the following method. A camera module is created in the same manner as in Japanese Patent Application Laid-Open No. 2016-110067, and the camera module is used to take a picture under a halogen lamp light source (“Luminer Ace LA-150TX” manufactured by Hayashi Watch Industry Co., Ltd.) in a dark room. The degree of ghost generation around the light source in the image was evaluated according to the following criteria.
下記実施例で用いた化合物(A)および化合物(S)は、一般的に知られている方法で合成した。一般的合成方法としては、例えば、特開昭60-228448号公報、特開平1-146846号公報、特開平1-228960号公報、特許第4081149号公報、「フタロシアニン -化学と機能―」(アイピーシー、1997年)、特開2009-108267号公報、特開2010-241873号公報、特許第3699464号公報、特許第4740631号公報などに記載されている方法を挙げることができる。 [Synthesis example]
Compound (A) and compound (S) used in the following examples were synthesized by a generally known method. As general synthesis methods, for example, JP-A-60-228448, JP-A-1-14684, JP-A-1-228960, JP-A-4081149, “phthalocyanine -chemistry and function-” (I PC, 1997), Japanese Patent Application Laid-Open No. 2009-108267, Japanese Patent Application Laid-Open No. 2010-241873, Japanese Patent No. 3699464, Japanese Patent No. 4740631, and the like.
下記式(a)で表される8-メチル-8-メトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ-3-エン(以下「DNM」ともいう。)100g、1-ヘキセン(分子量調節剤)18gおよびトルエン(開環重合反応用溶媒)300gを、窒素置換した反応容器に仕込み、この溶液を80℃に加熱した。次いで、反応容器内の溶液に、重合触媒として、トリエチルアルミニウムのトルエン溶液(0.6mol/リットル)0.2gと、メタノール変性の六塩化タングステンのトルエン溶液(濃度0.025mol/リットル)0.9gとを添加し、この溶液を80℃で3時間加熱攪拌することにより開環重合反応させて開環重合体溶液を得た。この重合反応における重合転化率は97%であった。 <Resin synthesis example 1>
8-methyl-8-methoxycarbonyltetracyclo represented by the following formula (a) [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene (hereinafter also referred to as “DNM”) 100 g, 1-hexene (molecular weight regulator) 18 g and toluene (ring-opening polymerization solvent) 300 g were charged into a nitrogen-substituted reaction vessel. The solution was heated to 80 ° C. Next, 0.2 g of a toluene solution of triethylaluminum (0.6 mol / liter) and 0.9 g of a toluene solution of methanol-modified tungsten hexachloride (concentration 0.025 mol / liter) were used as a polymerization catalyst. And the solution was heated and stirred at 80 ° C. for 3 hours to cause a ring-opening polymerization reaction to obtain a ring-opening polymer solution. The polymerization conversion rate in this polymerization reaction was 97%.
3Lの4つ口フラスコに2,6-ジフルオロベンゾニトリル35.12g、9,9-ビス(4-ヒドロキシフェニル)フルオレン87.60g、炭酸カリウム41.46g、N,N-ジメチルアセトアミド(以下「DMAc」ともいう。)443gおよびトルエン111gを添加した。続いて、4つ口フラスコに温度計、撹拌機、窒素導入管付き三方コック、ディーンスターク管および冷却管を取り付けた。次いで、フラスコ内を窒素置換した後、得られた溶液を140℃で3時間反応させ、生成する水をディーンスターク管から随時取り除いた。水の生成が認められなくなったところで、徐々に温度を160℃まで上昇させ、そのままの温度で6時間反応させた。室温(25℃)まで冷却後、生成した塩をろ紙で除去し、ろ液をメタノールに投じて再沈殿させ、ろ別によりろ物(残渣)を単離した。得られたろ物を60℃で一晩真空乾燥し、白色粉末(以下「樹脂B」ともいう。)を得た(収率95%)。得られた樹脂Bは、数平均分子量(Mn)が75,000、重量平均分子量(Mw)が188,000であり、ガラス転移温度(Tg)が285℃であった。 <Resin synthesis example 2>
In a 3 L four-necked flask, 35.12 g of 2,6-difluorobenzonitrile, 87.60 g of 9,9-bis (4-hydroxyphenyl) fluorene, 41.46 g of potassium carbonate, N, N-dimethylacetamide (hereinafter referred to as “DMAc”). 443 g and 111 g of toluene were added. Subsequently, a thermometer, a stirrer, a three-way cock with a nitrogen introduction tube, a Dean Stark tube and a cooling tube were attached to the four-necked flask. Next, after the atmosphere in the flask was replaced with nitrogen, the resulting solution was reacted at 140 ° C. for 3 hours, and water produced was removed from the Dean-Stark tube as needed. When no more water was observed, the temperature was gradually raised to 160 ° C. and reacted at that temperature for 6 hours. After cooling to room temperature (25 ° C.), the produced salt was removed with a filter paper, the filtrate was poured into methanol for reprecipitation, and the filtrate (residue) was isolated by filtration. The obtained filtrate was vacuum-dried overnight at 60 ° C. to obtain a white powder (hereinafter also referred to as “resin B”) (yield 95%). The obtained resin B had a number average molecular weight (Mn) of 75,000, a weight average molecular weight (Mw) of 188,000, and a glass transition temperature (Tg) of 285 ° C.
温度計、撹拌器、窒素導入管、側管付き滴下ロート、ディーンスターク管および冷却管を備えた500mLの5つ口フラスコに、窒素気流下、1,4-ビス(4-アミノ-α,α-ジメチルベンジル)ベンゼン27.66gおよび4,4’-ビス(4-アミノフェノキシ)ビフェニル7.38gを入れて、γ―ブチロラクトン68.65g及びN,N-ジメチルアセトアミド17.16gに溶解させた。得られた溶液を、氷水バスを用いて5℃に冷却し、同温に保ちながら1,2,4,5-シクロヘキサンテトラカルボン酸二無水物22.62gおよびイミド化触媒としてトリエチルアミン0.50gを一括添加した。添加終了後、180℃に昇温し、随時留出液を留去させながら、6時間還流させた。反応終了後、内温が100℃になるまで空冷した後、N,N-ジメチルアセトアミド143.6gを加えて希釈し、攪拌しながら冷却し、固形分濃度20重量%のポリイミド樹脂溶液264.16gを得た。このポリイミド樹脂溶液の一部を1Lのメタノール中に注ぎいれてポリイミドを沈殿させた。濾別したポリイミドをメタノールで洗浄した後、100℃の真空乾燥機中で24時間乾燥させて白色粉末(以下「樹脂C」ともいう。)を得た。得られた樹脂CのIRスペクトルを測定したところ、イミド基に特有の1704cm-1、1770cm-1の吸収が見られた。樹脂Cはガラス転移温度(Tg)が310℃であり、対数粘度を測定したところ、0.87であった。 <Resin synthesis example 3>
In a 500 mL five-necked flask equipped with a thermometer, stirrer, nitrogen inlet tube, dropping funnel with side tube, Dean-Stark tube and condenser tube, 1,4-bis (4-amino-α, α -Dimethylbenzyl) benzene (27.66 g) and 4,4'-bis (4-aminophenoxy) biphenyl (7.38 g) were added and dissolved in γ-butyrolactone (68.65 g) and N, N-dimethylacetamide (17.16 g). The resulting solution was cooled to 5 ° C. using an ice water bath, and while maintaining the same temperature, 22.62 g of 1,2,4,5-cyclohexanetetracarboxylic dianhydride and 0.50 g of triethylamine as an imidation catalyst were added. Added all at once. After completion of the addition, the temperature was raised to 180 ° C. and refluxed for 6 hours while distilling off the distillate as needed. After completion of the reaction, the reaction solution was air-cooled until the internal temperature reached 100 ° C., diluted by adding 143.6 g of N, N-dimethylacetamide, cooled with stirring, and 264.16 g of a polyimide resin solution having a solid content concentration of 20% by weight. Got. A part of this polyimide resin solution was poured into 1 L of methanol to precipitate the polyimide. The polyimide separated by filtration was washed with methanol and dried in a vacuum dryer at 100 ° C. for 24 hours to obtain a white powder (hereinafter also referred to as “resin C”). The IR spectrum of the obtained resin C was measured, 1704 cm -1 characteristic of imido group, absorption of 1770 cm -1 were observed. Resin C had a glass transition temperature (Tg) of 310 ° C. and a logarithmic viscosity of 0.87.
実施例1では、透明樹脂製基板からなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 1]
In Example 1, an optical filter having a base material made of a transparent resin substrate was prepared according to the following procedure and conditions.
実施例2では、透明樹脂製基板からなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 2]
In Example 2, an optical filter having a base material made of a transparent resin substrate was prepared according to the following procedure and conditions.
実施例3では、両面に樹脂層を有する透明樹脂製基板からなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 3]
In Example 3, an optical filter having a base material composed of a transparent resin substrate having a resin layer on both sides was prepared according to the following procedure and conditions.
続いて、実施例1と同様に、得られた基材の片面に第一光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計26層)誘電体多層膜(V)を形成し、さらに基材のもう一方の面に第二光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計20層)誘電体多層膜(VI)を形成し、厚さ約0.109mmの光学フィルターを得た。誘電体多層膜の設計は、実施例1と同様に基材屈折率の波長依存性等を考慮した上で、実施例1と同じ設計パラメーターを用いて行った。得られた光学フィルターの垂直方向および垂直方向から30°の角度から測定した分光透過率を測定し、各波長領域における光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-1に示す。 Resin composition (1): 60 parts by weight of tricyclodecane dimethanol diacrylate, 40 parts by weight of dipentaerythritol hexaacrylate, 5 parts by weight of 1-hydroxycyclohexyl phenyl ketone, methyl ethyl ketone (solvent, solid content concentration (TSC): 30% )
Subsequently, in the same manner as in Example 1, a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total). And a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as the second optical layer on the other surface of the substrate (20 layers in total). A dielectric multilayer film (VI) was formed to obtain an optical filter having a thickness of about 0.109 mm. The dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1. The spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
実施例4では、樹脂製支持体の両面に化合物(A)を含む透明樹脂層を形成してなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 4]
In Example 4, an optical filter having a substrate formed by forming a transparent resin layer containing the compound (A) on both surfaces of a resin support was prepared according to the following procedure and conditions.
続いて、実施例1と同様に、得られた基材の片面に第一光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計26層)誘電体多層膜(VII)を形成し、さらに基材のもう一方の面に第二光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計20層)誘電体多層膜(VIII)を形成し、厚さ約0.109mmの光学フィルターを得た。誘電体多層膜の設計は、実施例1と同様に基材屈折率の波長依存性等を考慮した上で、実施例1と同じ設計パラメーターを用いて行った。得られた光学フィルターの垂直方向および垂直方向から30°の角度から測定した分光透過率を測定し、各波長領域における光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-1に示す。 Resin composition (2): 100 parts by weight of tricyclodecane dimethanol diacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.10 parts by weight of compound (a-1), 0.10 parts by weight of compound (a-2) Parts, 1.75 parts by weight of compound (s-6), methyl ethyl ketone (solvent, TSC: 25%)
Subsequently, in the same manner as in Example 1, a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total). And a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as the second optical layer on the other surface of the base material (total 20 layers). A dielectric multilayer film (VIII) was formed to obtain an optical filter having a thickness of about 0.109 mm. The dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1. The spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
実施例5では、片面に化合物(A)を含む透明樹脂層を有する透明ガラス基板からなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 5]
In Example 5, an optical filter having a base material composed of a transparent glass substrate having a transparent resin layer containing the compound (A) on one side was prepared by the following procedure and conditions.
続いて、実施例1と同様に、得られた基材の片面に第一光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計26層)誘電体多層膜(IX)を形成し、さらに基材のもう一方の面に第二光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計20層)誘電体多層膜(X)を形成し、厚さ約0.107mmの光学フィルターを得た。誘電体多層膜の設計は、実施例1と同様に基材屈折率の波長依存性等を考慮した上で、実施例1と同じ設計パラメーターを用いて行った。得られた光学フィルターの垂直方向および垂直方向から30°の角度から測定した分光透過率を測定し、各波長領域における光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-1に示す。 Resin composition (3): 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.20 part by weight of compound (a-1), compound (A-2) 0.20 part by weight, compound (s-6) 3.50 part by weight, methyl ethyl ketone (solvent, TSC: 35%)
Subsequently, in the same manner as in Example 1, a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total). A multilayer film (IX) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the base material (20 layers in total) A dielectric multilayer film (X) was formed to obtain an optical filter having a thickness of about 0.107 mm. The dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1. The spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
実施例6では、片面に化合物(A)を含む透明樹脂層を有する近赤外線吸収ガラス基板からなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 6]
In Example 6, an optical filter having a base material composed of a near-infrared absorbing glass substrate having a transparent resin layer containing the compound (A) on one side was prepared by the following procedure and conditions.
続いて、実施例1と同様に、得られた基材の片面に第一光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計26層)誘電体多層膜(XI)を形成し、さらに基材のもう一方の面に第二光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計20層)誘電体多層膜(XII)を形成し、厚さ約0.107mmの光学フィルターを得た。誘電体多層膜の設計は、実施例1と同様に基材屈折率の波長依存性等を考慮した上で、実施例1と同じ設計パラメーターを用いて行った。得られた光学フィルターの垂直方向および垂直方向から30°の角度から測定した分光透過率を測定し、各波長領域における光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-1に示す。 Resin composition (4): 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.15 part by weight of compound (a-3), compound (A-4) 0.30 part by weight, methyl ethyl ketone (solvent, TSC: 35%)
Subsequently, in the same manner as in Example 1, a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total). A multilayer film (XI) is formed, and a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the substrate (20 layers in total). A dielectric multilayer film (XII) was formed to obtain an optical filter having a thickness of about 0.107 mm. The dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1. The spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
実施例7では、両面に近赤外線吸収微粒子を含む透明樹脂層を有する、化合物(A)を含む透明樹脂製基板からなる基材を有する光学フィルターを以下の手順および条件で作成した。 [Example 7]
In Example 7, an optical filter having a base material made of a transparent resin substrate containing the compound (A) and having a transparent resin layer containing near-infrared absorbing fine particles on both surfaces was prepared according to the following procedure and conditions.
続いて、実施例1と同様に、得られた基材の片面に第一光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計26層)誘電体多層膜(XIII)を形成し、さらに基材のもう一方の面に第二光学層としてシリカ(SiO2)層とチタニア(TiO2)層とが交互に積層されてなる(合計20層)誘電体多層膜(XIV)を形成し、厚さ約0.109mmの光学フィルターを得た。誘電体多層膜の設計は、実施例1と同様に基材屈折率の波長依存性等を考慮した上で、実施例1と同じ設計パラメーターを用いて行った。得られた光学フィルターの垂直方向および垂直方向から30°の角度から測定した分光透過率を測定し、各波長領域における光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-1に示す。 Resin composition (5): 100 parts by weight of tricyclodecane dimethanol diacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 35 parts by weight of near-infrared absorbing fine particle dispersion (YMF-02A manufactured by Sumitomo Metal Mining Co., Ltd.) About 10 parts by weight in terms of solid content), methyl ethyl ketone (solvent, TSC: 30%)
Subsequently, in the same manner as in Example 1, a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a first optical layer on one side of the obtained base material (26 layers in total). And a silica (SiO 2 ) layer and a titania (TiO 2 ) layer are alternately laminated as a second optical layer on the other surface of the base material (total 20 layers). A dielectric multilayer film (XIV) was formed to obtain an optical filter having a thickness of about 0.109 mm. The dielectric multilayer film was designed using the same design parameters as in Example 1 in consideration of the wavelength dependence of the refractive index of the substrate as in Example 1. The spectral transmittance measured from the vertical direction of the obtained optical filter and an angle of 30 ° from the vertical direction was measured, and the optical characteristics in each wavelength region were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
樹脂、溶媒、樹脂製基板の乾燥条件、化合物(A)、化合物(S)およびその他の色素(X)を表5-1に示すように変更したこと以外は、実施例3と同様にして基材および光学フィルターを作成した。得られた基材および光学フィルターの光学特性を表5-1に示す。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-1に示す。 [Examples 8 to 13]
Resin, solvent, drying conditions of resin substrate, compound (A), compound (S), and other dye (X) were changed in the same manner as in Example 3 except for changing as shown in Table 5-1. Materials and optical filters were made. The optical properties of the obtained substrate and optical filter are shown in Table 5-1. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-1.
実施例1において、化合物(S)および化合物(A)を用いなかったこと以外は、実施例1と同様にして基材および光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。比較例1で得られた光学フィルターは、比較的良好な可視光透過率を示すものの、光学特性の入射角依存性が大きく、基材が700nm付近や近赤外波長領域に吸収を持たないことから、色シェーディング抑制効果やゴースト抑制効果に劣ることが確認された。 [Comparative Example 1]
In Example 1, except that the compound (S) and the compound (A) were not used, a substrate and an optical filter were prepared in the same manner as in Example 1, and optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 1 exhibits relatively good visible light transmittance, the optical property has a large incident angle dependency, and the base material has no absorption in the vicinity of 700 nm or in the near infrared wavelength region. Therefore, it was confirmed that the color shading suppression effect and the ghost suppression effect were inferior.
基材として透明ガラス基板「OA-10G(厚み150um)」(日本電気硝子(株)製)を用いたこと以外は、実施例1と同様にして光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。比較例2で得られた光学フィルターは、比較的良好な可視光透過率を示すものの、光学特性の入射角依存性が大きく、基材が700nm付近や近赤外波長領域に吸収を持たないことから、色シェーディング抑制効果やゴースト抑制効果に劣ることが確認された。 [Comparative Example 2]
An optical filter was prepared and the optical characteristics were evaluated in the same manner as in Example 1 except that a transparent glass substrate “OA-10G (thickness 150 μm)” (manufactured by Nippon Electric Glass Co., Ltd.) was used as the substrate. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 2 shows relatively good visible light transmittance, the optical property has a large incident angle dependency, and the base material has no absorption in the vicinity of 700 nm or near infrared wavelength region. Therefore, it was confirmed that the color shading suppression effect and the ghost suppression effect were inferior.
基材として近赤外線吸収ガラス基板「BS-11(厚み120um)」(松浪硝子工業(株)製)を用いたこと以外は、実施例1と同様にして光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。また、基材の分光透過スペクトルを図8に示す。比較例3で得られた光学フィルターは、比較的良好な光学特性を示すものの、基材の700nm付近の吸収強度が十分でなく、色シェーディング抑制効果に劣ることが確認された。 [Comparative Example 3]
An optical filter was prepared in the same manner as in Example 1 except that a near-infrared absorbing glass substrate “BS-11 (thickness 120 μm)” (manufactured by Matsunami Glass Industry Co., Ltd.) was used as a base material, and optical characteristics were evaluated. did. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 3 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was poor.
実施例3において、化合物(S)を用いずに、化合物(A)として化合物(a-4)0.08部および化合物(a-5)0.06部を用いたこと、ならびに色素(X-1)0.01部を用いたこと以外は、実施例3と同様にして基材および光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。また、基材の分光透過スペクトルを図9に示す。比較例5で得られた光学フィルターは、比較的良好な光学特性を示すものの、基材の近赤外波長領域における吸収強度が十分でなく、ゴースト抑制効果に劣ることが確認された。 [Comparative Example 4]
In Example 3, 0.08 part of compound (a-4) and 0.06 part of compound (a-5) were used as compound (A) without using compound (S), and dye (X— 1) Except having used 0.01 part, the base material and the optical filter were created like Example 3, and the optical characteristic was evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 5 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the near-infrared wavelength region of the substrate was not sufficient and the ghost suppression effect was inferior.
実施例6において、樹脂組成物(4)の代わりに下記組成の樹脂組成物(6)を用いたこと以外は、実施例6と同様にして基材および光学フィルターを作成した。 [Comparative Example 5]
In Example 6, a substrate and an optical filter were prepared in the same manner as in Example 6 except that the resin composition (6) having the following composition was used instead of the resin composition (4).
得られた基材および光学フィルターの光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。また、基材の分光透過スペクトルを図10に示す。比較例5で得られた光学フィルターは、比較的良好な光学特性を示すものの、基材の700nm付近の吸収強度が十分でなく、色シェーディング抑制効果に劣ることが確認された。 Resin composition (6): 20 parts by weight of tricyclodecane dimethanol diacrylate, 80 parts by weight of dipentaerythritol hexaacrylate, 4 parts by weight of 1-hydroxycyclohexyl phenyl ketone, 0.15 part by weight of compound (a-1), methyl ethyl ketone (Solvent, TSC: 35%)
The optical properties of the obtained substrate and optical filter were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. The spectral transmission spectrum of the substrate is shown in FIG. Although the optical filter obtained in Comparative Example 5 showed relatively good optical properties, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was poor.
実施例3において、化合物(A)として化合物(a-3)0.04部および化合物(a-4)0.08部を用いたこと、化合物(S)として化合物(s-6)0.01部を用いたこと以外は、実施例3と同様にして基材および光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。比較例6で得られた光学フィルターは、比較的良好な光学特性を示すものの、基材の近赤外波長領域における吸収強度が十分でなく、ゴースト抑制効果に劣ることが確認された。 [Comparative Example 6]
In Example 3, 0.04 part of the compound (a-3) and 0.08 part of the compound (a-4) were used as the compound (A), and 0.01% of the compound (s-6) was used as the compound (S). A substrate and an optical filter were prepared in the same manner as in Example 3 except that the parts were used, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 6 showed relatively good optical properties, it was confirmed that the absorption intensity in the near infrared wavelength region of the substrate was not sufficient and the ghost suppression effect was inferior.
実施例3において、化合物(A)として化合物(a-1)0.04部を用いたこと、化合物(S)として化合物(s-6)0.07部を用いたこと以外は、実施例3と同様にして基材および光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。比較例7で得られた光学フィルターは、比較的良好な光学特性を示すものの、基材の700nm付近の吸収強度が十分でなく、色シェーディング抑制効果に劣ることが確認された。 [Comparative Example 7]
Example 3 except that 0.04 part of the compound (a-1) was used as the compound (A) and 0.07 part of the compound (s-6) was used as the compound (S) in Example 3. A substrate and an optical filter were prepared in the same manner as described above, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 7 showed relatively good optical properties, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was inferior.
実施例3において、化合物(A)として化合物(a-1)0.04部を用いたこと、化合物(S)として上記表2-4に記載の化合物(s-14)(ジクロロメタン中での吸収極大波長1097nm)0.45部を用いたこと以外は、実施例3と同様にして基材および光学フィルターを作成し、光学特性を評価した。また、得られた光学フィルターを用いてカメラモジュールを作成し、カメラ画像の色シェーディングおよびゴーストの評価を行った。結果を表5-2に示す。比較例8で得られた光学フィルターは、比較的良好な光学特性を示すものの、基材の700nm付近の吸収強度が十分でなく、色シェーディング抑制効果に劣ることが確認された。 [Comparative Example 8]
In Example 3, 0.04 part of compound (a-1) was used as compound (A), and compound (s-14) described in Table 2-4 above (absorption in dichloromethane) was used as compound (S). A substrate and an optical filter were prepared in the same manner as in Example 3 except that 0.45 part of the maximum wavelength (1097 nm) was used, and the optical characteristics were evaluated. In addition, a camera module was created using the obtained optical filter, and color shading and ghost of the camera image were evaluated. The results are shown in Table 5-2. Although the optical filter obtained in Comparative Example 8 showed relatively good optical characteristics, it was confirmed that the absorption intensity in the vicinity of 700 nm of the substrate was not sufficient and the color shading suppression effect was inferior.
形態(1):化合物(A)を含む透明樹脂製基板
形態(2):化合物(A)を含む透明樹脂製基板の両面に樹脂層を有する
形態(3):樹脂製支持体の両面に化合物(A)を含む透明樹脂層を有する
形態(4):透明ガラス基板の片方の面に化合物(A)を含む透明樹脂層を有する
形態(5):近赤外線吸収ガラス基板の片方の面に化合物(A)を含む透明樹脂層を有する
形態(6):化合物(A)を含む透明樹脂製基板の両面に近赤外線吸収微粒子を含む透明樹脂層を有する
形態(7):化合物(A)を含まない透明樹脂製基板(比較例)
形態(8):透明ガラス基板(比較例)
形態(9):近赤外線吸収ガラス基板(比較例)
<透明樹脂>
樹脂A:環状ポリオレフィン系樹脂(樹脂合成例1)
樹脂B:芳香族ポリエーテル系樹脂(樹脂合成例2)
樹脂C:ポリイミド系樹脂(樹脂合成例3)
樹脂D:環状オレフィン系樹脂「ゼオノア 1420R」(日本ゼオン(株)製)
<ガラス基板>
ガラス基板(1):縦60mm、横60mmの大きさにカットした透明ガラス基板「OA-10G(厚み150μm)」(日本電気硝子(株)製)
ガラス基板(2):縦60mm、横60mmの大きさにカットした近赤外線吸収ガラス基板「BS-11(厚み120μm)」(松浪硝子工業(株)製)
<近赤外線吸収色素>
≪化合物(A)≫
化合物(a-1):上記の化合物(a-1)(ジクロロメタン中での吸収極大波長698nm)
化合物(a-2):上記の化合物(a-2)(ジクロロメタン中での吸収極大波長733nm)
化合物(a-3):上記の化合物(a-3)(ジクロロメタン中での吸収極大波長703nm)
化合物(a-4):上記の化合物(a-4)(ジクロロメタン中での吸収極大波長736nm)
化合物(a-5):上記の化合物(a-5)(ジクロロメタン中での吸収極大波長713nm)
化合物(a-6):下記式(a-6)で表されるシアニン系化合物(ジクロロメタン中での吸収極大波長681nm) <Form of substrate>
Form (1): Transparent resin substrate containing compound (A) Form (2): Transparent resin substrate containing compound (A) has resin layers on both sides Form (3): Compound on both sides of resin support Form (4): having a transparent resin layer containing compound (A) on one side of the transparent glass substrate Form (5): compound on one side of the near-infrared absorbing glass substrate Form (6): having transparent resin layer containing near-infrared absorbing fine particles on both sides of transparent resin substrate containing compound (A) Form (7): containing compound (A) Transparent resin substrate (comparative example)
Form (8): Transparent glass substrate (comparative example)
Form (9): Near-infrared absorbing glass substrate (comparative example)
<Transparent resin>
Resin A: Cyclic polyolefin resin (resin synthesis example 1)
Resin B: Aromatic polyether resin (resin synthesis example 2)
Resin C: Polyimide resin (resin synthesis example 3)
Resin D: Cyclic olefin resin “Zeonor 1420R” (manufactured by Nippon Zeon Co., Ltd.)
<Glass substrate>
Glass substrate (1): Transparent glass substrate “OA-10G (thickness 150 μm)” cut to 60 mm length and 60 mm width (manufactured by Nippon Electric Glass Co., Ltd.)
Glass substrate (2): Near-infrared absorbing glass substrate “BS-11 (thickness 120 μm)” cut to a size of 60 mm length and 60 mm width (manufactured by Matsunami Glass Industry Co., Ltd.)
<Near-infrared absorbing dye>
<< Compound (A) >>
Compound (a-1): Compound (a-1) above (absorption maximum wavelength in dichloromethane 698 nm)
Compound (a-2): Compound (a-2) above (absorption maximum wavelength in dichloromethane: 733 nm)
Compound (a-3): Compound (a-3) described above (maximum absorption wavelength 703 nm in dichloromethane)
Compound (a-4): Compound (a-4) above (absorption maximum wavelength in dichloromethane 736 nm)
Compound (a-5): Compound (a-5) above (absorption maximum wavelength in dichloromethane of 713 nm)
Compound (a-6): A cyanine compound represented by the following formula (a-6) (absorption maximum wavelength in dichloromethane: 681 nm)
化合物(s-6):上記の化合物(s-6)(ジクロロメタン中での吸収極大波長1093nm)
化合物(s-8):上記の化合物(s-8)(ジクロロメタン中での吸収極大波長1096nm)
化合物(s-13):上記の化合物(s-14)(ジクロロメタン中での吸収極大波長1096nm)
化合物(s-14):上記の化合物(s-15)(ジクロロメタン中での吸収極大波長1097nm)
≪その他の色素(X)≫
色素(X-1):上記の色素(X-1)(ジクロロメタン中での吸収極大波長887nm)
色素(X-2):下記式(X-2)で表される色素(ジクロロメタン中での吸収極大波長811nm)
Compound (s-6): Compound (s-6) above (absorption maximum wavelength in dichloromethane of 1093 nm)
Compound (s-8): Compound (s-8) above (absorption maximum wavelength in dichloromethane of 1096 nm)
Compound (s-13): Compound (s-14) above (absorption maximum wavelength in dichloromethane of 1096 nm)
Compound (s-14): Compound (s-15) above (absorption maximum wavelength in dichloromethane of 1097 nm)
≪Other dye (X) ≫
Dye (X-1): the above dye (X-1) (absorption maximum wavelength in dichloromethane: 887 nm)
Dye (X-2): Dye represented by the following formula (X-2) (absorption maximum wavelength in dichloromethane: 811 nm)
溶媒(1):塩化メチレン
溶媒(2):N,N-ジメチルアセトアミド
溶媒(3):シクロヘキサン/キシレン(重量比:7/3)
表5-1および表5-2における、実施例および比較例の(透明)樹脂製基板の乾燥条件は以下の通りである。なお、減圧乾燥前に、塗膜をガラス板から剥離した。
Solvent (1): Methylene chloride Solvent (2): N, N-dimethylacetamide Solvent (3): Cyclohexane / xylene (weight ratio: 7/3)
In Tables 5-1 and 5-2, the drying conditions of the (transparent) resin substrates of Examples and Comparative Examples are as follows. In addition, the coating film was peeled from the glass plate before drying under reduced pressure.
条件(1):20℃/8hr→減圧下 100℃/8hr
条件(2):60℃/8hr→80℃/8hr→減圧下 140℃/8hr
条件(3):60℃/8hr→80℃/8hr→減圧下 100℃/24hr <Film drying conditions>
Condition (1): 20 ° C./8 hr → under reduced
Condition (2): 60 ° C./8 hr → 80 ° C./8 hr → under reduced pressure 140 ° C./8 hr
Condition (3): 60 ° C./8 hr → 80 ° C./8 hr → under reduced
2:分光光度計
3:光
10:基材
11:第一光学層
12:第二光学層
13:第三光学層
14:第四光学層
111:カメラ画像
112:白色板
113:白色板の中央部の例
114:白色板の端部の例
121:カメラ画像
122:光源
123:光源周辺のゴーストの例 1: Optical filter 2: Spectrophotometer 3: Light 10: Base material 11: First optical layer 12: Second optical layer 13: Third optical layer 14: Fourth optical layer 111: Camera image 112: White plate 113: Example of the center of the white plate 114: Example of the edge of the white plate 121: Camera image 122: Light source 123: Example of ghost around the light source
Claims (13)
- 下記要件(a)、(b)および(c)を満たす基材を有し、かつ、下記要件(d)および(e)を満たすことを特徴とする光学フィルター:
(a)波長650nm以上760nm以下の領域に吸収極大を有する化合物(A)を含む層を有する;
(b)波長640nm以上の領域において透過率が10%となる一番短い波長(X1)と二番目に短い波長(X2)との差(X2-X1)が50nm以上である;
(c)波長900nmにおける透過率、波長1000nmにおける透過率、および波長1100nmにおける透過率がいずれも65%以下である;
(d)波長430~580nmの領域において、光学フィルターの垂直方向から測定した場合の透過率の平均値が75%以上である;
(e)波長1100nm~1200nmの領域において、光学フィルターの垂直方向から測定した場合の透過率の平均値が5%以下である。 An optical filter having a substrate satisfying the following requirements (a), (b) and (c) and satisfying the following requirements (d) and (e):
(A) having a layer containing the compound (A) having an absorption maximum in a wavelength region of 650 nm to 760 nm;
(B) The difference (X 2 −X 1 ) between the shortest wavelength (X 1 ) with a transmittance of 10% and the second shortest wavelength (X 2 ) in the wavelength region of 640 nm or more is 50 nm or more;
(C) The transmittance at a wavelength of 900 nm, the transmittance at a wavelength of 1000 nm, and the transmittance at a wavelength of 1100 nm are all 65% or less;
(D) In the wavelength range of 430 to 580 nm, the average transmittance when measured from the vertical direction of the optical filter is 75% or more;
(E) In the wavelength region of 1100 nm to 1200 nm, the average transmittance when measured from the vertical direction of the optical filter is 5% or less. - 前記化合物(A)を含む層が透明樹脂層であることを特徴とする、請求項1に記載の光学フィルター。 The optical filter according to claim 1, wherein the layer containing the compound (A) is a transparent resin layer.
- 前記基材の少なくとも一方の面に誘電体多層膜を有することを特徴とする、請求項1または2に記載の光学フィルター。 3. The optical filter according to claim 1, further comprising a dielectric multilayer film on at least one surface of the substrate.
- 前記基材が、さらに下記要件(f)を満たすことを特徴とする、請求項1~3のいずれか一項に記載の光学フィルター:
(f)波長690~720nmの領域における透過率の最小値(T1)が5%以下である。 The optical filter according to any one of claims 1 to 3, wherein the substrate further satisfies the following requirement (f):
(F) The minimum transmittance (T 1 ) in the wavelength range of 690 to 720 nm is 5% or less. - 前記基材が、さらに下記要件(g)を満たすことを特徴とする、請求項1~4のいずれに一項に記載の光学フィルター:
(g)波長1050nm以上1200nm以下の領域に吸収極大を有する化合物(S)を含む。 The optical filter according to any one of claims 1 to 4, wherein the substrate further satisfies the following requirement (g):
(G) A compound (S) having an absorption maximum in a wavelength region of 1050 nm to 1200 nm is included. - 前記化合物(S)が、下記式(I)および(II)で表される化合物からなる群より選ばれる
少なくとも1種の化合物であることを特徴とする、請求項5に記載の光学フィルター。
R1~R3は、それぞれ独立に水素原子、ハロゲン原子、スルホ基、水酸基、シアノ基、ニトロ基、カルボキシ基、リン酸基、-NRgRh基、-SRi基、-SO2Ri基、-OSO2Ri基または下記La~Lhのいずれかを表し、RgおよびRhは、それぞれ独立に水素原子、-C(O)Ri基または下記La~Leのいずれかを表し、Riは下記La~Leのいずれかを表し、
(La)炭素数1~12の脂肪族炭化水素基
(Lb)炭素数1~12のハロゲン置換アルキル基
(Lc)炭素数3~14の脂環式炭化水素基
(Ld)炭素数6~14の芳香族炭化水素基
(Le)炭素数2~14の複素環基
(Lf)炭素数1~12のアルコキシ基
(Lg)置換基Lを有してもよい炭素数1~12のアシル基、
(Lh)置換基Lを有してもよい炭素数1~12のアルコキシカルボニル基
置換基Lは、炭素数1~12の脂肪族炭化水素基、炭素数1~12のハロゲン置換アルキル基、炭素数3~14の脂環式炭化水素基、炭素数6~14の芳香族炭化水素基および炭素数3~14の複素環基からなる群より選ばれる少なくとも1種であり、
隣り合うR3同士は、置換基Lを有してもよい環を形成してもよく、
nは0~4の整数を表し、
Xは電荷を中和させるのに必要なアニオンを表し、
Mは金属原子を表し、
ZはD(Ri)4を表し、Dは窒素原子、リン原子またはビスマス原子を表し、
yは0もしくは1を表す。) The optical filter according to claim 5, wherein the compound (S) is at least one compound selected from the group consisting of compounds represented by the following formulas (I) and (II).
R 1 to R 3 are each independently a hydrogen atom, a halogen atom, a sulfo group, a hydroxyl group, a cyano group, a nitro group, a carboxy group, a phosphoric acid group, a —NR g R h group, a —SR i group, —SO 2 R i group, —OSO 2 R i group or any of the following L a to L h , wherein R g and R h are each independently a hydrogen atom, —C (O) R i group or the following L a to L e It represents either, R i represents any of the following L a ~ L e,
(L a ) an aliphatic hydrocarbon group having 1 to 12 carbon atoms (L b ) a halogen-substituted alkyl group having 1 to 12 carbon atoms (L c ) an alicyclic hydrocarbon group having 3 to 14 carbon atoms (L d ) carbon C 6-14 aromatic hydrocarbon group (L e ) C 2-14 heterocyclic group (L f ) C 1-12 alkoxy group (L g ) carbon number optionally having substituent L 1 to 12 acyl groups,
(L h ) an alkoxycarbonyl group having 1 to 12 carbon atoms which may have a substituent L. The substituent L is an aliphatic hydrocarbon group having 1 to 12 carbon atoms, a halogen-substituted alkyl group having 1 to 12 carbon atoms, At least one selected from the group consisting of an alicyclic hydrocarbon group having 3 to 14 carbon atoms, an aromatic hydrocarbon group having 6 to 14 carbon atoms and a heterocyclic group having 3 to 14 carbon atoms,
Adjacent R 3 may form a ring which may have a substituent L,
n represents an integer of 0 to 4,
X represents an anion necessary to neutralize the charge,
M represents a metal atom,
Z represents D (R i ) 4 , D represents a nitrogen atom, a phosphorus atom or a bismuth atom;
y represents 0 or 1. ) - 前記誘電体多層膜が前記基材の両面に形成されていることを特徴とする請求項3~6のいずれか1項に記載の光学フィルター。 7. The optical filter according to claim 3, wherein the dielectric multilayer film is formed on both surfaces of the base material.
- 前記化合物(A)が、スクアリリウム系化合物、フタロシアニン系化合物およびシアニン系化合物からなる群より選ばれる少なくとも1種の化合物であることを特徴とする請求項1~7のいずれか1項に記載の光学フィルター。 The optical system according to any one of claims 1 to 7, wherein the compound (A) is at least one compound selected from the group consisting of squarylium compounds, phthalocyanine compounds, and cyanine compounds. filter.
- 前記透明樹脂層を構成する透明樹脂が、環状ポリオレフィン系樹脂、芳香族ポリエーテル系樹脂、ポリイミド系樹脂、フルオレンポリカーボネート系樹脂、フルオレンポリエステル系樹脂、ポリカーボネート系樹脂、ポリアミド系樹脂、ポリアリレート系樹脂、ポリサルホン系樹脂、ポリエーテルサルホン系樹脂、ポリパラフェニレン系樹脂、ポリアミドイミド系樹脂、ポリエチレンナフタレート系樹脂、フッ素化芳香族ポリマー系樹脂、(変性)アクリル系樹脂、エポキシ系樹脂、アリルエステル系硬化型樹脂、シルセスキオキサン系紫外線硬化型樹脂、アクリル系紫外線硬化型樹脂およびビニル系紫外線硬化型樹脂からなる群より選ばれる少なくとも1種の樹脂であることを特徴とする請求項2~8のいずれか1項に記載の光学フィルター。 The transparent resin constituting the transparent resin layer is a cyclic polyolefin resin, aromatic polyether resin, polyimide resin, fluorene polycarbonate resin, fluorene polyester resin, polycarbonate resin, polyamide resin, polyarylate resin, Polysulfone resin, polyethersulfone resin, polyparaphenylene resin, polyamideimide resin, polyethylene naphthalate resin, fluorinated aromatic polymer resin, (modified) acrylic resin, epoxy resin, allyl ester resin 9. At least one resin selected from the group consisting of a curable resin, a silsesquioxane ultraviolet curable resin, an acrylic ultraviolet curable resin, and a vinyl ultraviolet curable resin. The optical film according to any one of Over.
- 前記基材が、化合物(A)および化合物(S)を含む透明樹脂製基板を含有することを特徴とする請求項1~9のいずれか1項に記載の光学フィルター。 The optical filter according to any one of claims 1 to 9, wherein the substrate contains a transparent resin substrate containing the compound (A) and the compound (S).
- 固体撮像装置用である請求項1~10のいずれか1項に記載の光学フィルター。 The optical filter according to any one of claims 1 to 10, which is used for a solid-state imaging device.
- 請求項1~11のいずれか1項に記載の光学フィルターを具備する固体撮像装置。 A solid-state imaging device comprising the optical filter according to any one of claims 1 to 11.
- 請求項1~11のいずれか1項に記載の光学フィルターを具備するカメラモジュール。 A camera module comprising the optical filter according to any one of claims 1 to 11.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018537346A JP6791251B2 (en) | 2016-08-31 | 2017-08-30 | Optical filter and equipment using optical filter |
KR1020197005541A KR102388961B1 (en) | 2016-08-31 | 2017-08-30 | Optical filters and devices using optical filters |
CN202110181464.7A CN112946804B (en) | 2016-08-31 | 2017-08-30 | Optical filter and device using the same |
CN201780052711.5A CN109642973B (en) | 2016-08-31 | 2017-08-30 | Optical filter and device using the same |
KR1020217038932A KR102434709B1 (en) | 2016-08-31 | 2017-08-30 | Optical filter and device using optical filter |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-169260 | 2016-08-31 | ||
JP2016169260 | 2016-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018043564A1 true WO2018043564A1 (en) | 2018-03-08 |
Family
ID=61300840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2017/031156 WO2018043564A1 (en) | 2016-08-31 | 2017-08-30 | Optical filter and device using optical filter |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6791251B2 (en) |
KR (2) | KR102434709B1 (en) |
CN (2) | CN112946804B (en) |
WO (1) | WO2018043564A1 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200004237A (en) * | 2018-07-03 | 2020-01-13 | 주식회사 엘엠에스 | Optical disc for fingerprint recognition sensor and optical filter including the same |
JP2020037719A (en) * | 2018-09-03 | 2020-03-12 | 日本電気硝子株式会社 | Method for producing glass article, and frame member |
WO2020054718A1 (en) * | 2018-09-14 | 2020-03-19 | 富士フイルム株式会社 | Near-infrared-absorbent composition, method for manufacturing liquid dispersion, film, optical filter, pattern formation method, layered body, solid-state imaging element, image display device, and infrared sensor |
WO2020054695A1 (en) * | 2018-09-12 | 2020-03-19 | Jsr株式会社 | Optical filter and use thereof |
WO2020196051A1 (en) * | 2019-03-28 | 2020-10-01 | Agc株式会社 | Optical filter |
CN111983743A (en) * | 2019-05-21 | 2020-11-24 | Jsr株式会社 | Optical filter, imaging device, and camera module |
WO2020241535A1 (en) | 2019-05-31 | 2020-12-03 | 富士フイルム株式会社 | Optical sensor and sensing device |
WO2020255927A1 (en) * | 2019-06-20 | 2020-12-24 | Agc株式会社 | Optical filter, imaging device, and optical sensor |
CN112147731A (en) * | 2019-06-27 | 2020-12-29 | Jsr株式会社 | Optical filter, solid-state imaging device, camera module, biometric authentication device, and resin layer for optical filter |
JPWO2021256116A1 (en) * | 2020-06-15 | 2021-12-23 | ||
JP2022001928A (en) * | 2020-06-22 | 2022-01-06 | Agc株式会社 | Optical filter |
WO2022085636A1 (en) * | 2020-10-21 | 2022-04-28 | Agc株式会社 | Optical filter |
WO2022131191A1 (en) | 2020-12-16 | 2022-06-23 | 富士フイルム株式会社 | Composition, membrane, optical filter, solid image pickup element, image display apparatus, and infrared ray sensor |
WO2022130773A1 (en) | 2020-12-17 | 2022-06-23 | 富士フイルム株式会社 | Composition, film, optical filter, solid-state imaging element, image display device, and infrared sensor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021009271A (en) * | 2019-07-03 | 2021-01-28 | Jsr株式会社 | Camera module and electronic equipment |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005338395A (en) * | 2004-05-26 | 2005-12-08 | Jsr Corp | Near ir ray cut-off filter and its manufacturing method |
JP2006301489A (en) * | 2005-04-25 | 2006-11-02 | Nidec Copal Corp | Near-infrared ray cut filter |
JP2007131748A (en) * | 2005-11-10 | 2007-05-31 | Nippon Shokubai Co Ltd | Pressure-sensitive adhesive composition comprising near infrared light absorber and use thereof |
WO2012169447A1 (en) * | 2011-06-06 | 2012-12-13 | 旭硝子株式会社 | Optical filter, solid-state imaging element, imaging device lens and imaging device |
JP2014059550A (en) * | 2012-08-23 | 2014-04-03 | Asahi Glass Co Ltd | Near-infrared cut filter |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3163813B2 (en) | 1992-12-28 | 2001-05-08 | 日本ゼオン株式会社 | Near-infrared absorbing resin composition and molded article |
JP4736373B2 (en) * | 2004-08-03 | 2011-07-27 | 日油株式会社 | Near infrared absorbing material and display device using the same |
JP5489669B2 (en) | 2008-11-28 | 2014-05-14 | Jsr株式会社 | Near-infrared cut filter and device using near-infrared cut filter |
KR101414139B1 (en) | 2012-09-03 | 2014-08-06 | 장 제임스 | Snap Ring having Multi Roller |
JP6263843B2 (en) | 2013-02-28 | 2018-01-24 | 株式会社リコー | Communication management system, communication management method, and program |
JP6269657B2 (en) * | 2013-04-10 | 2018-01-31 | 旭硝子株式会社 | Infrared shielding filter, solid-state imaging device, and imaging / display device |
WO2014168189A1 (en) * | 2013-04-10 | 2014-10-16 | 旭硝子株式会社 | Infrared-blocking filter |
KR101590137B1 (en) | 2013-08-30 | 2016-02-01 | 주식회사 솔켐 | Styrene-based copolymer containing dicyanophenyl functional groups and phthalocyanine-based compound synthesized from the copolymer |
CN105452911B (en) * | 2013-10-17 | 2017-06-09 | Jsr株式会社 | Optical filter, solid camera head and camera module |
JP6170515B2 (en) * | 2014-01-31 | 2017-07-26 | 富士フイルム株式会社 | Green colored composition for color filter, colored film, color filter, solid-state imaging device |
JP2015200878A (en) * | 2014-03-31 | 2015-11-12 | 富士フイルム株式会社 | Infrared sensor, near infrared absorption composition, cured film, near infrared absorption filter, image sensor, camera module and compound |
JP6358114B2 (en) * | 2015-02-02 | 2018-07-18 | Jsr株式会社 | Optical filter and device using optical filter |
-
2017
- 2017-08-30 KR KR1020217038932A patent/KR102434709B1/en active IP Right Grant
- 2017-08-30 WO PCT/JP2017/031156 patent/WO2018043564A1/en active Application Filing
- 2017-08-30 CN CN202110181464.7A patent/CN112946804B/en active Active
- 2017-08-30 JP JP2018537346A patent/JP6791251B2/en active Active
- 2017-08-30 KR KR1020197005541A patent/KR102388961B1/en active IP Right Grant
- 2017-08-30 CN CN201780052711.5A patent/CN109642973B/en active Active
-
2020
- 2020-11-04 JP JP2020184099A patent/JP7088261B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005338395A (en) * | 2004-05-26 | 2005-12-08 | Jsr Corp | Near ir ray cut-off filter and its manufacturing method |
JP2006301489A (en) * | 2005-04-25 | 2006-11-02 | Nidec Copal Corp | Near-infrared ray cut filter |
JP2007131748A (en) * | 2005-11-10 | 2007-05-31 | Nippon Shokubai Co Ltd | Pressure-sensitive adhesive composition comprising near infrared light absorber and use thereof |
WO2012169447A1 (en) * | 2011-06-06 | 2012-12-13 | 旭硝子株式会社 | Optical filter, solid-state imaging element, imaging device lens and imaging device |
JP2014059550A (en) * | 2012-08-23 | 2014-04-03 | Asahi Glass Co Ltd | Near-infrared cut filter |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102158811B1 (en) | 2018-07-03 | 2020-09-22 | 주식회사 엘엠에스 | Optical disc for fingerprint recognition sensor and optical filter including the same |
KR20200004237A (en) * | 2018-07-03 | 2020-01-13 | 주식회사 엘엠에스 | Optical disc for fingerprint recognition sensor and optical filter including the same |
JP2020037719A (en) * | 2018-09-03 | 2020-03-12 | 日本電気硝子株式会社 | Method for producing glass article, and frame member |
CN112585508B (en) * | 2018-09-12 | 2023-02-28 | Jsr株式会社 | Optical filter, solid-state imaging device, and camera module |
WO2020054695A1 (en) * | 2018-09-12 | 2020-03-19 | Jsr株式会社 | Optical filter and use thereof |
TWI753299B (en) * | 2018-09-12 | 2022-01-21 | 日商Jsr股份有限公司 | Optical filters and their uses |
JP7255600B2 (en) | 2018-09-12 | 2023-04-11 | Jsr株式会社 | Optical filter and its use |
CN112585508A (en) * | 2018-09-12 | 2021-03-30 | Jsr株式会社 | Optical filter and use thereof |
JPWO2020054695A1 (en) * | 2018-09-12 | 2021-08-30 | Jsr株式会社 | Optical filters and their uses |
JPWO2020054718A1 (en) * | 2018-09-14 | 2021-09-30 | 富士フイルム株式会社 | Near-infrared absorbing composition, method for producing dispersion, film, optical filter, pattern forming method, laminate, solid-state image sensor, image display device and infrared sensor |
WO2020054718A1 (en) * | 2018-09-14 | 2020-03-19 | 富士フイルム株式会社 | Near-infrared-absorbent composition, method for manufacturing liquid dispersion, film, optical filter, pattern formation method, layered body, solid-state imaging element, image display device, and infrared sensor |
KR102566220B1 (en) * | 2018-09-14 | 2023-08-11 | 후지필름 가부시키가이샤 | Near-infrared absorbing composition, method for producing dispersion, film, optical filter, pattern formation method, laminate, solid-state imaging device, image display device, and infrared sensor |
JP7142711B2 (en) | 2018-09-14 | 2022-09-27 | 富士フイルム株式会社 | Near-infrared absorbing composition, method for producing dispersion liquid, film, optical filter, pattern forming method, laminate, solid-state imaging device, image display device, and infrared sensor |
KR20210033506A (en) * | 2018-09-14 | 2021-03-26 | 후지필름 가부시키가이샤 | Near-infrared absorbing composition, manufacturing method of dispersion, film, optical filter, pattern forming method, laminate, solid-state imaging device, image display device, and infrared sensor |
JP7347498B2 (en) | 2019-03-28 | 2023-09-20 | Agc株式会社 | optical filter |
CN113573888A (en) * | 2019-03-28 | 2021-10-29 | Agc株式会社 | Optical filter |
JPWO2020196051A1 (en) * | 2019-03-28 | 2020-10-01 | ||
WO2020196051A1 (en) * | 2019-03-28 | 2020-10-01 | Agc株式会社 | Optical filter |
CN113573888B (en) * | 2019-03-28 | 2023-02-28 | Agc株式会社 | Optical filter |
CN111983743B (en) * | 2019-05-21 | 2024-02-27 | Jsr株式会社 | Optical filter, image pickup device, and camera module |
CN111983743A (en) * | 2019-05-21 | 2020-11-24 | Jsr株式会社 | Optical filter, imaging device, and camera module |
WO2020241535A1 (en) | 2019-05-31 | 2020-12-03 | 富士フイルム株式会社 | Optical sensor and sensing device |
WO2020255927A1 (en) * | 2019-06-20 | 2020-12-24 | Agc株式会社 | Optical filter, imaging device, and optical sensor |
JP7484911B2 (en) | 2019-06-20 | 2024-05-16 | Agc株式会社 | Optical filter, imaging device and optical sensor |
CN112147731A (en) * | 2019-06-27 | 2020-12-29 | Jsr株式会社 | Optical filter, solid-state imaging device, camera module, biometric authentication device, and resin layer for optical filter |
CN112147731B (en) * | 2019-06-27 | 2023-12-05 | Jsr株式会社 | Optical filter, solid-state imaging device, and camera module |
WO2021256116A1 (en) * | 2020-06-15 | 2021-12-23 | 富士フイルム株式会社 | Infrared-absorbing composition, film, optical filter, solid-state imaging element, image display device, and infrared sensor |
JPWO2021256116A1 (en) * | 2020-06-15 | 2021-12-23 | ||
JP7397195B2 (en) | 2020-06-15 | 2023-12-12 | 富士フイルム株式会社 | Infrared absorbing compositions, films, optical filters, solid-state imaging devices, image display devices, and infrared sensors |
JP2022001928A (en) * | 2020-06-22 | 2022-01-06 | Agc株式会社 | Optical filter |
JP7415815B2 (en) | 2020-06-22 | 2024-01-17 | Agc株式会社 | optical filter |
WO2022085636A1 (en) * | 2020-10-21 | 2022-04-28 | Agc株式会社 | Optical filter |
WO2022131191A1 (en) | 2020-12-16 | 2022-06-23 | 富士フイルム株式会社 | Composition, membrane, optical filter, solid image pickup element, image display apparatus, and infrared ray sensor |
WO2022130773A1 (en) | 2020-12-17 | 2022-06-23 | 富士フイルム株式会社 | Composition, film, optical filter, solid-state imaging element, image display device, and infrared sensor |
Also Published As
Publication number | Publication date |
---|---|
CN109642973A (en) | 2019-04-16 |
JPWO2018043564A1 (en) | 2019-06-24 |
JP2021028726A (en) | 2021-02-25 |
KR20210150591A (en) | 2021-12-10 |
KR102434709B1 (en) | 2022-08-22 |
CN112946804B (en) | 2023-03-24 |
JP7088261B2 (en) | 2022-06-21 |
CN109642973B (en) | 2021-06-08 |
JP6791251B2 (en) | 2020-11-25 |
KR102388961B1 (en) | 2022-04-22 |
CN112946804A (en) | 2021-06-11 |
KR20190040973A (en) | 2019-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7088261B2 (en) | Optical filters and devices using optical filters | |
JP6627864B2 (en) | Optical filter and device using optical filter | |
JP7163918B2 (en) | Near-infrared cut filter and device using the near-infrared cut filter | |
JP6358114B2 (en) | Optical filter and device using optical filter | |
WO2017213047A1 (en) | Optical filter and optical sensor device | |
JP7405228B2 (en) | Resin compositions for optical filters, optical filters, camera modules and electronic devices | |
WO2014002864A1 (en) | Solid-state image capture element optical filter and application thereof | |
WO2017164024A1 (en) | Optical filter and apparatus using optical filter | |
JP6578718B2 (en) | Optical filter and device using optical filter | |
WO2015022892A1 (en) | Optical filter and device using optical filter | |
CN112180487A (en) | Camera module and electronic device | |
JP6693585B2 (en) | Optical filter and device using optical filter | |
JP7505259B2 (en) | Optical filters and their uses | |
JP2019053157A (en) | Optical filter and device using optical filter | |
JP7207395B2 (en) | Optical filters and devices using optical filters | |
TWI850217B (en) | Optical filter, solid-state imaging device, and camera module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 17846568 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2018537346 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20197005541 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 17846568 Country of ref document: EP Kind code of ref document: A1 |