WO2018030256A1 - 膜形成方法及び膜形成装置 - Google Patents

膜形成方法及び膜形成装置 Download PDF

Info

Publication number
WO2018030256A1
WO2018030256A1 PCT/JP2017/028188 JP2017028188W WO2018030256A1 WO 2018030256 A1 WO2018030256 A1 WO 2018030256A1 JP 2017028188 W JP2017028188 W JP 2017028188W WO 2018030256 A1 WO2018030256 A1 WO 2018030256A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pattern
minimum dimension
film
inkjet head
Prior art date
Application number
PCT/JP2017/028188
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
剛 野本
裕司 岡本
Original Assignee
住友重機械工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友重機械工業株式会社 filed Critical 住友重機械工業株式会社
Priority to KR1020197000852A priority Critical patent/KR20190040960A/ko
Priority to CN201780041443.7A priority patent/CN109475895A/zh
Publication of WO2018030256A1 publication Critical patent/WO2018030256A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/008—Controlling printhead for accurately positioning print image on printing material, e.g. with the intention to control the width of margins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a film forming method and a film forming apparatus.
  • Photolithography technology or screen printing technology is used to form a resist pattern for patterning the transparent conductive film of the touch panel.
  • a high-definition pattern can be formed, but the apparatus cost, the waste liquid processing cost, and the like increase.
  • the method using the screen printing technique is more advantageous than the method using the photolithography technique in terms of apparatus cost and waste liquid treatment cost, but it is difficult to form a high-definition pattern.
  • Patent Document 1 A technique for forming a resist pattern using an inkjet printing technique has been proposed (Patent Document 1).
  • An object of the present invention is to provide a film forming method and a film forming apparatus capable of forming an edge giving a minimum dimension of a pattern with high definition using an ink jet printing technique.
  • a film is formed on the substrate by ejecting droplets from the inkjet head toward the substrate based on pattern data that defines the pattern of the film to be formed.
  • a film forming method for A film forming method is provided in which the relative movement direction of the inkjet head and the substrate is orthogonal to the direction of the minimum dimension of the pattern defined by the pattern data.
  • a film is formed by ejecting droplets from the inkjet head toward the substrate based on the pattern data while moving in a direction orthogonal to the direction of the minimum dimension of the pattern defined by the pattern data.
  • a film forming apparatus is provided.
  • FIG. 1 is a schematic view of a film forming apparatus according to an embodiment.
  • FIG. 2 is a plan view showing a resist pattern used as an etching mask when patterning a transparent electrode of a touch panel as an example of a film to be formed.
  • FIG. 3A is a diagram showing a target landing position of a droplet and a variation in the landing position
  • FIG. 3B is a diagram showing an example of a film shape when a band-shaped film is formed while moving the substrate in the y direction. It is.
  • FIG. 4 is a diagram showing the positional relationship between the resist film to be formed and the inkjet head.
  • FIG. 1 is a schematic view of a film forming apparatus according to an embodiment.
  • FIG. 2 is a plan view showing a resist pattern used as an etching mask when patterning a transparent electrode of a touch panel as an example of a film to be formed.
  • FIG. 3A is a diagram showing a target landing position of a droplet and a variation
  • FIG. 5 is a diagram showing the positional relationship between the arrangement of the inkjet head of a film forming apparatus according to another embodiment and the resist film to be formed.
  • FIG. 6 is a view showing the positional relationship between the arrangement of the inkjet head of a film forming apparatus according to still another embodiment and the resist film to be formed.
  • 7A and 7B are views showing the positional relationship between an inkjet head and a resist film to be formed in a film forming apparatus according to still another embodiment.
  • 8A and 8B are diagrams showing another positional relationship between the ink jet head of the film forming apparatus according to the embodiment shown in FIGS. 7A and 7B and the resist film to be formed.
  • FIGS. 9A and 9B are views showing the positional relationship between an inkjet head and a resist film to be formed in a film forming apparatus according to still another embodiment.
  • 10A and 10B are diagrams showing another positional relationship between the inkjet head and the resist film to be formed in the film forming apparatus according to the embodiment shown in FIGS. 9A and 9B.
  • FIG. 11 is a diagram showing a film pattern to be formed by a film forming method according to another embodiment.
  • 12A and 12B are views showing the positional relationship between the ink jet head of the film forming apparatus according to the embodiment shown in FIG. 11 and the resist film to be formed.
  • 13A and 13B are diagrams showing another positional relationship between the inkjet head of the film forming apparatus according to the embodiment shown in FIGS.
  • FIGS. 14A and 14B are views showing the positional relationship between an inkjet head and a resist film to be formed in a film forming apparatus according to still another embodiment.
  • FIG. 15A is a diagram showing another positional relationship between the ink jet head of the film forming apparatus according to the embodiment shown in FIGS. 14A and 14B and the resist film to be formed.
  • FIG. 16A is a schematic view of a film forming apparatus according to still another embodiment
  • FIG. 16B is a diagram showing an example of a film pattern formed on a flexible substrate.
  • FIG. 17 is a flowchart of a procedure executed by the control device of the film forming apparatus according to still another embodiment.
  • FIG. 1 shows a schematic diagram of a film forming apparatus according to an embodiment.
  • a support portion 23 is supported on the base 20 via a moving mechanism 21.
  • the substrate 50 is supported on the upper surface (support surface) of the support portion 23.
  • the moving mechanism 21 can move the substrate 50 in a two-dimensional direction by moving the support portion 23 in a two-dimensional direction parallel to the support surface.
  • the support surface of the support part 23 is kept horizontal.
  • An xyz orthogonal coordinate system in which two directions parallel to the support surface are defined as an x axis and ay axis is defined.
  • the inkjet head 25 is disposed above the substrate 50 supported by the support portion 23.
  • the ink jet head 25 is supported on the base 20 by a portal frame 24.
  • the inkjet head 25 includes a plurality of head blocks 26.
  • the plurality of head blocks 26 are attached to a common support member 28.
  • Each head block 26 is provided with a plurality of nozzle holes. A droplet of the film material is discharged from the nozzle hole toward the substrate 50.
  • a film is formed by curing the liquid film material adhering to the substrate 50.
  • a photocurable resin, a thermosetting resin, or the like can be used as the film material.
  • a light source or a heat source for curing the film material attached to the substrate 50 is disposed on the side of the inkjet head 25.
  • the control device 30 controls the movement of the support portion 23 by the moving mechanism 21 and the discharge of the film material from the nozzle holes of the inkjet head 25.
  • the control device 30 includes a storage device 31, and the storage device 31 stores film pattern data to be formed.
  • the control device 30 controls the moving mechanism 21 and the inkjet head 25 based on the pattern data, so that a film having a desired pattern can be formed on the substrate 50.
  • Various commands and data are input from the input device 35 to the control device 30.
  • the input device 35 for example, a keyboard, a pointing device, a USB port, a communication device, or the like is used.
  • Various information regarding the operation of the film forming apparatus is output to the output device 36.
  • the output device 36 for example, a liquid crystal display, a speaker, a USB port, a communication device, or the like is used.
  • FIG. 2 shows a resist film 53 used as an etching mask when patterning a transparent electrode of a touch panel as an example of a film to be formed.
  • the transparent electrode is formed by etching a transparent conductive film made of ITO or the like using the resist film 53 as an etching mask.
  • a dot pattern is added to the region where the resist is applied.
  • the plurality of pad portions 51 are arranged in a matrix, and the connection portion 52 connects the plurality of pad portions 51 in the column direction.
  • the row direction corresponds to the x direction
  • the column direction corresponds to the y direction.
  • An interval G between the pad portions 51 adjacent in the x direction is the minimum dimension of the pattern.
  • the direction of this minimum dimension is the x direction, and its size is, for example, about 30 ⁇ m.
  • the pad portions 51 adjacent in the x direction are connected. If the two pad portions 51 that should originally be separated from each other are connected, the touch panel does not operate normally. However, even if the landing position of the liquid droplet is shifted in the y direction, the two pad portions 51 that are separated in the x direction are not connected. Therefore, it is preferable that the positional accuracy in the x direction of the droplet forming the pair of edges 54 that give the minimum dimension of the pattern is higher than the positional accuracy in the y direction.
  • FIG. 3A shows the landing target position of the droplet and the variation of the landing position.
  • the landing target position 55 is represented by a solid line, and a plurality of scattered landing positions are represented by broken lines.
  • droplets of the film material are ejected from a predetermined nozzle hole of the inkjet head 25 while moving the substrate 50 (FIG. 1) in the y direction.
  • Possible causes of variation in the landing position of the droplet include variation in the ejection direction from the nozzle hole, variation in the moving speed of the substrate 50, variation in the ejection timing from the nozzle hole, variation in the droplet ejection speed, and the like.
  • variation in the ejection direction from the nozzle hole causes variation in position in both the x and y directions.
  • the other three variation factors cause a variation in position in the y direction, but do not cause a variation in position in the x direction.
  • the maximum variation width Dx in the x direction is smaller than the maximum variation width Dy in the y direction.
  • FIG. 3B shows an example of the shape of the film when the band-like film is formed while moving the substrate 50 (FIG. 1) in the y direction.
  • the inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction. Since the variation in the droplet landing position in the x direction is smaller than the variation in the y direction, the edges on both sides of the strip film 56 long in the y direction are higher in linearity than the edges on both sides of the strip film 57 long in the x direction. The variation in the width of the film 56 (the variation in the position in the x direction) is smaller than the variation in the width of the film 57 (the variation in the position in the y direction).
  • FIG. 4 shows the positional relationship between the resist film 53 to be formed and the inkjet head 25.
  • Pattern data is created so that the direction of the minimum dimension of the resist film 53 coincides with the x direction.
  • a minimum dimension is given by a pair of edges 54 of the resist film 53.
  • the control device 30 controls the moving mechanism 21 to move the substrate 50 (FIG. 1) in the y direction, while dropping the film material from each nozzle hole 27 of the inkjet head 25. To discharge. If the entire resist film 53 cannot be formed over the entire area of the substrate 50 by one movement (hereinafter referred to as scanning) of the substrate 50 in the y direction, the substrate 50 is shifted in the x direction and the second and subsequent scans are performed. As a result, the entire resist film 53 can be formed.
  • the relationship with the direction of movement is the same as the relationship between the direction of the edge of the film 56 in FIG. 3B and the direction of movement of the substrate. Therefore, as described with reference to FIGS. 3A and 3B, the variation in the position in the x direction of the pair of edges 54 (FIG. 4) that gives the minimum dimension of the pattern can be reduced, and the edge 54 The degree of straightness can be increased. Thereby, it can suppress that the two pad parts 51 adjacent to a x direction on both sides of the part of a minimum dimension will mutually continue.
  • the film is formed while the inkjet head 25 is stationary with respect to the base 20 and the support portion 23 is moved in the y direction.
  • the ink jet head 25 is moved with respect to the base 20, a slight change occurs in the posture due to the movement of the ink jet head 25.
  • the change in the posture of the ink jet head 25 causes a variation in the positional accuracy of the landing position because it changes the ejection direction of the droplets.
  • since the ink jet head 25 is stationary with respect to the base 20 at the time of film formation it is possible to reduce the variation in the landing position due to the change in the posture of the ink jet head 25.
  • the resist film is formed using the ink jet printing technique, but other films may be formed.
  • the minimum dimension is given by the gap between the areas where the resist is applied.
  • the minimum dimension may be given by the area where the resist is applied.
  • the inkjet head 25 is stationary and the substrate 50 is moved during film formation.
  • the substrate 50 may be stationary and the inkjet head 25 may be moved.
  • the direction orthogonal to the direction of the minimum dimension (x direction) of the film pattern to be formed The effect of suppressing variation in position due to relative movement of the substrate 50 and the inkjet head 25 in the (y direction) can be obtained.
  • FIG. 5 shows the positional relationship between the arrangement of the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed.
  • the pattern of the resist film 53 is the same as the pattern of the resist film 53 in the embodiment shown in FIGS.
  • the inkjet head 25 is provided with a plurality of nozzle holes 27y arranged in a direction (y direction) orthogonal to the direction of the minimum dimension (x direction) of the resist film 53.
  • a plurality of nozzle holes 27x arranged at equal intervals in the x direction are provided.
  • the plurality of nozzle holes 27y arranged in the y direction are arranged in two rows, and the plurality of nozzle holes 27y in each row are arranged at the same x coordinate.
  • each of the head blocks 26 is provided with a plurality of nozzle holes 27 arranged in a line.
  • the two head blocks 26 are arranged in such a posture that the arrangement direction of the nozzle holes 27 is parallel to the y direction.
  • the nozzle holes 27y for two rows are realized.
  • the plurality of nozzle holes 27x are realized.
  • the distance between the two rows of nozzle holes 27 y in the x direction corresponds to the minimum dimension of the resist film 53.
  • “corresponding” does not mean that the interval in the x direction of the nozzle holes 27y is equal to the minimum dimension, but the edge of the film formed by the droplets ejected from the nozzle holes 27y in one row, This means that the distance from the edge of the film formed by the droplets ejected from the nozzle holes 27y in the other row is equal to the minimum dimension.
  • the control device 30 controls the inkjet head 25 and the moving mechanism 21 (FIG. 1), and the droplets discharged from some of the nozzle holes 27y of the plurality of nozzle holes 27y are used in the resist film 53.
  • a pair of edges 54 are formed that give the smallest dimension. Portions other than the edge 54 are formed by droplets ejected from the nozzle hole 27x.
  • the edge 54 giving the minimum dimension can be formed using the other nozzle holes 27y in the same row. Thereby, the exchange frequency of the head block 26 for edge formation can be decreased.
  • the plurality of nozzle holes 27y arranged in the y direction are configured in two rows, but may be configured in one row.
  • one edge 54 may be formed by the first scanning and the other edge 54 may be formed by the second scanning.
  • FIG. 6 shows the positional relationship between the arrangement of the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed.
  • the inkjet head 25 has a plurality of nozzle holes 27 arranged in a direction parallel to the direction of the minimum dimension (x direction).
  • the pitch of the nozzle holes 27 that discharge droplets for forming a pair of edges 54 that give the minimum dimension of the pattern of the resist film 53 is defined as a first pitch P1.
  • the row of the plurality of nozzle holes 27 includes a portion arranged at a second pitch P2 shorter than the first pitch P1, and a portion where the first pitch P1 is secured. No other nozzle hole is arranged between the two nozzle holes 27 arranged at the first pitch P1.
  • the nozzle holes 27 arranged at the second pitch P ⁇ b> 2 are provided in each of the plurality of head blocks 26.
  • the pitch between the nozzle hole 27 at the end (right end in FIG. 6) of one head block 26 and the nozzle hole 27 at the end (left end in FIG. 6) of the other head block 26 is the first pitch P1.
  • Two head blocks 26 are positioned.
  • the control device 30 (FIG. 1) forms a pair of edges 54 that give the minimum dimension in the resist film 53 with droplets ejected from the two nozzle holes 27 in which the first pitch P1 is secured.
  • the inkjet head 25 and the moving mechanism 21 (FIG. 1) are controlled.
  • the nozzle hole 27 is not disposed between the edges 54 that give the minimum dimension. For this reason, it is possible to prevent droplets from landing between the edges 54 due to a malfunction of the nozzle hole 27 or the like. As a result, it is possible to suppress the occurrence of a problem that the portions to be separated of the resist film 53 are continuous.
  • FIGS. 7A to 8B Still another embodiment will be described with reference to FIGS. 7A to 8B.
  • differences from the embodiment shown in FIGS. 1 to 4 will be described, and descriptions of common configurations will be omitted.
  • FIG. 7A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed.
  • a region indicated by a broken line in the resist film 53 indicates a region where the resist is not yet applied.
  • Two head blocks 26 are arranged side by side in the y direction. Each head block 26 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction.
  • One head block 26 is fixed to the other head block 26 so as to be displaced in the x direction by half the pitch of the nozzle holes 27. For this reason, as a whole, the pitch of the nozzle holes 27 in the x direction is narrowed to half the pitch of the nozzle holes 27 of one head block 26 as the entire inkjet head 25.
  • the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the minimum dimension (x direction).
  • the dot pattern is given to the area
  • One edge 54 giving the minimum dimension in the resist film 53 is formed by droplets ejected from one nozzle hole 27 of one head block 26.
  • the substrate 50 (FIG. 1) is shifted in the minimum dimension direction (x direction). As a result, it becomes possible to apply the droplets ejected from the inkjet head 25 to the region where the resist is not applied in the first scanning.
  • the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the minimum dimension (x direction).
  • the edge 54 that is not formed in the step of FIG. 7B among the pair of edges 54 that give the minimum dimension in the resist film 53 is formed.
  • the head block 26 that ejects the droplets that form the edge 54 is the same as the head block 26 that ejects the droplets that form the other edge 54 in the step of FIG. 7B.
  • the positional accuracy is affected by the mounting accuracy of the head block 26 to the support member 28 (FIG. 1).
  • the relative positional accuracy of the pair of edges 54 is the mounting position of the head block 26. Not affected by tolerances. Thereby, the fall of the relative positional accuracy of a pair of edge 54 can be suppressed.
  • the pair of edges 54 that give the minimum dimension are formed by two scans.
  • the pitch of the nozzle holes 27 of one head block 26 corresponds to the interval between the pair of edges 54 that gives the minimum dimension
  • the pair of edges 54 may be formed by one scan.
  • FIG. 9A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the resist film 53 to be formed.
  • a region indicated by a broken line in the resist film 53 indicates a region where the resist is not yet applied.
  • the inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction.
  • the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the minimum dimension (x direction).
  • a dot pattern is given to the region where the resist is applied.
  • One edge 54 giving the minimum dimension in the resist film 53 is formed by droplets ejected from one nozzle hole 27 ⁇ / b> A of the inkjet head 25.
  • the substrate 50 (FIG. 1) is shifted in the minimum dimension direction (x direction) by a distance corresponding to the minimum dimension.
  • the edge 54 that has not been formed by the first scan can be formed by the droplets ejected from the nozzle hole 27A.
  • the resist film 53 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) orthogonal to the direction of the minimum dimension (x direction).
  • the edge 54 that is not formed in the step of FIG. 9B among the pair of edges 54 that give the minimum dimension in the resist film 53 is formed.
  • the nozzle hole 27A that discharges the droplet that forms the edge 54 is the same as the nozzle hole 27A that discharges the droplet that forms one edge 54 in the step of FIG. 9B.
  • the position of the edge 54 is not affected by the variation in the discharge direction of the droplets for each nozzle hole 27. For this reason, variation in the relative positional relationship between the pair of edges 54 can be further reduced.
  • the moving mechanism 21 has a function of rotating the substrate 50 in the in-plane direction of the support surface (rotation direction about an axis perpendicular to the support surface).
  • FIG. 11 shows a pattern of the film 60 to be formed.
  • the direction of the minimum dimension of the resist film 53 is only one direction in the x direction.
  • the interval G in the row direction (x direction) and the interval G in the column direction (y direction) of a plurality of isolated patterns arranged in a matrix are equal, and the interval G is the minimum dimension of the pattern. That is, the direction of the minimum dimension is two directions, the x direction and the y direction.
  • FIG. 12A shows the positional relationship between the inkjet head 25 and the film 60 to be formed in the film forming apparatus according to this embodiment.
  • a region indicated by a broken line in the film 60 indicates that the film material has not been applied yet.
  • the inkjet head 25 is provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction.
  • a part of the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) perpendicular to the direction of one minimum dimension (x direction).
  • a dot pattern is given to the area where the film material is applied.
  • a film material is applied to a region including a pair of edges 61 that give a minimum dimension in the x direction.
  • No film material is applied to the region including the pair of edges 62 that gives the minimum dimension in the y direction.
  • the control device 30 controls the moving mechanism 21 to rotate the substrate 50 by 90 °.
  • the already formed edge 61 gives the minimum dimension in the y direction
  • the unformed edge 62 gives the minimum dimension in the x direction.
  • the film 60 is formed while moving the substrate 50 (FIG. 1) in the direction (y direction) orthogonal to the direction (x direction) of the minimum dimension given by the unformed edge 62.
  • the film material is applied to a region including a pair of edges 62 that give the minimum dimension of the pattern of the film 60.
  • FIG. 14A shows the positional relationship between the inkjet head 25 of the film forming apparatus according to this embodiment and the film 60 to be formed.
  • a region indicated by a broken line in the film 60 indicates that the film material has not been applied yet.
  • the ink jet head 25 includes a head block 26 provided with a plurality of nozzle holes 27 arranged at equal intervals in the x direction and another head block 26 provided with a plurality of nozzle holes 27 arranged at equal intervals in the y direction. .
  • a part of the film 60 is formed while moving the substrate 50 (FIG. 1) in a direction (y direction) perpendicular to the direction of one minimum dimension (x direction).
  • a dot pattern is attached to the area where the film material is applied.
  • the film material discharged from the head block 26 having the nozzle holes 27 arranged in the x direction is applied to a region including the pair of edges 61 that give the minimum dimension in the x direction.
  • FIG. 15A the region where the film material is not applied in the process of FIG. 14B while moving the substrate 50 (FIG. 1) in the direction (x direction) perpendicular to the direction of the other smallest dimension (y direction).
  • a film material is applied to the film 60 to complete the film 60.
  • a dot pattern is attached to the area where the film material is applied. This scanning forms a pair of edges 62 that give the minimum dimension in the y direction.
  • both of the edges that give the minimum dimension in the direction orthogonal to each other scan the substrate in the direction orthogonal to the direction of the minimum dimension. Formed when. For this reason, the straightness can be increased at any edge, and the relative positional accuracy of the pair of edges can be increased.
  • FIGS. 16A and 16B differ from the embodiment shown in FIGS. 1 to 4 and descriptions of common configurations will be omitted.
  • FIG. 16A shows a schematic diagram of a film forming apparatus according to this example.
  • the flexible substrate 70 is sent from the feeding roll 71 to the winding roll 72.
  • the moving mechanism 73 is controlled by the control device 30, the feeding roll 71 and the winding roll 72 are rotated.
  • the inkjet head 25 is disposed above the flexible substrate 70 while being fed from the feed roll 71 and wound on the take-up roll 72.
  • the configuration of the inkjet head 25 is the same as the configuration of the inkjet head 25 of the embodiment shown in FIGS.
  • the feeding direction of the flexible substrate 70 corresponds to the scanning direction (y direction) of the substrate 50 in the embodiment of FIGS. 1 to 4, and the width direction of the flexible substrate 70 is in the x direction in the embodiments of FIGS. Correspond.
  • a film can be formed on the flexible substrate 70 by discharging droplets of the film material from the inkjet head 25 while feeding the flexible substrate 70 in the y direction.
  • FIG. 16B shows an example of the pattern of the film 75 formed on the flexible substrate 70.
  • the direction of the minimum dimension of the pattern of the film 75 is the width direction (x direction).
  • the control device 30 (FIG. 16A) controls the feeding speed of the flexible substrate 70 and the ejection of the film material from the inkjet head 25.
  • the relative movement direction of the inkjet head 25 and the flexible substrate 70 is relative to the direction of the minimum dimension of the film pattern to be formed. Orthogonal. Therefore, the same effect as that of the embodiment shown in FIGS. 1 to 4 can be obtained.
  • FIG. 17 shows a flowchart of a procedure executed by the control device 30 of the film forming apparatus according to the present embodiment.
  • pattern data input from the input device 35 (FIG. 1) is stored in the storage device 31 (FIG. 1) (step S1).
  • the direction of the minimum dimension of the pattern defined by the input pattern data is detected (step S2).
  • the direction of the minimum dimension is compared with the moving direction of the substrate during film formation (step S3).
  • the moving direction of the substrate during film formation is stored in the control device 30 in advance.
  • step S4 film formation is executed (step S4). If the two are orthogonal, the control device 30 outputs information notifying the output device 36 (FIG. 1) that the direction of the minimum dimension of the pattern data is deviated from the optimum direction (step S5).
  • the operator can know that the direction of the minimum dimension of the pattern data is deviated from the optimum direction by looking at the information output to the output device 36.
  • the operator corrects the pattern data so as to rotate the direction of the minimum dimension.
  • the corrected pattern data is input from the input device 35 again. Thereby, the fall of the relative position accuracy of the edge of the pattern which gives a minimum dimension can be suppressed.
  • the direction of the minimum dimension of the pattern defined by the current pattern data may be output as information output to the output device. If the direction of the minimum dimension and the moving direction of the substrate during film formation are not orthogonal, the pattern data may be automatically corrected so that they are orthogonal.
PCT/JP2017/028188 2016-08-10 2017-08-03 膜形成方法及び膜形成装置 WO2018030256A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020197000852A KR20190040960A (ko) 2016-08-10 2017-08-03 막형성방법 및 막형성장치
CN201780041443.7A CN109475895A (zh) 2016-08-10 2017-08-03 膜形成方法及膜形成装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016157066A JP6862041B2 (ja) 2016-08-10 2016-08-10 膜形成方法及び膜形成装置
JP2016-157066 2016-08-10

Publications (1)

Publication Number Publication Date
WO2018030256A1 true WO2018030256A1 (ja) 2018-02-15

Family

ID=61162803

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/028188 WO2018030256A1 (ja) 2016-08-10 2017-08-03 膜形成方法及び膜形成装置

Country Status (5)

Country Link
JP (1) JP6862041B2 (zh)
KR (1) KR20190040960A (zh)
CN (1) CN109475895A (zh)
TW (1) TWI688431B (zh)
WO (1) WO2018030256A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566730A (zh) * 2018-08-22 2021-03-26 东京毅力科创株式会社 绘制装置和绘制方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111565519B (zh) * 2020-06-02 2021-08-17 锡凡半导体无锡有限公司 一种印刷无感光蚀工艺
CN115989090B (zh) * 2020-09-03 2023-12-15 柯尼卡美能达株式会社 图案形成方法以及喷墨印刷装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003329828A (ja) * 2002-03-06 2003-11-19 Seiko Epson Corp 液状物の吐出方法、液状物の吐出装置、カラーフィルタの製造方法およびカラーフィルタ、液晶表示装置、エレクトロルミネッセンス装置の製造方法およびエレクトロルミネッセンス装置、並びにプラズマディスプレイパネルの製造方法およびプラズマディスプレイ
JP2011051225A (ja) * 2009-09-01 2011-03-17 Olympus Corp 画像記録装置の記録不良検査方法
JP2012236152A (ja) * 2011-05-12 2012-12-06 Shibaura Mechatronics Corp 液滴塗布装置及び液滴塗布方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797277A (en) 1980-12-09 1982-06-16 Nec Corp Television video audio simultaneous transmitter
JP2007190770A (ja) * 2006-01-18 2007-08-02 Fujifilm Corp インクジェット描画装置および方法
JP2009255007A (ja) * 2008-04-21 2009-11-05 Hitachi Ltd パターン形成方法、これによる基板の製造方法、基板、並びにパターン形成装置
JP5663342B2 (ja) * 2011-02-21 2015-02-04 東レエンジニアリング株式会社 塗布方法および塗布装置
JP2013071085A (ja) * 2011-09-28 2013-04-22 Minebea Co Ltd パターン形成方法
JP6053459B2 (ja) * 2012-11-01 2016-12-27 住友重機械工業株式会社 基板製造方法及び基板製造装置
JP2015026655A (ja) * 2013-07-25 2015-02-05 住友重機械工業株式会社 薄膜形成方法及び薄膜形成装置
JP6085578B2 (ja) * 2014-03-11 2017-02-22 住友重機械工業株式会社 膜形成方法及び膜形成装置
KR101779738B1 (ko) * 2014-06-25 2017-09-18 코니카 미놀타 가부시키가이샤 패턴 형성 방법, 투명 도전막을 구비한 기재, 디바이스 및 전자 기기
CN105499069B (zh) * 2014-10-10 2019-03-08 住友重机械工业株式会社 膜形成装置及膜形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003329828A (ja) * 2002-03-06 2003-11-19 Seiko Epson Corp 液状物の吐出方法、液状物の吐出装置、カラーフィルタの製造方法およびカラーフィルタ、液晶表示装置、エレクトロルミネッセンス装置の製造方法およびエレクトロルミネッセンス装置、並びにプラズマディスプレイパネルの製造方法およびプラズマディスプレイ
JP2011051225A (ja) * 2009-09-01 2011-03-17 Olympus Corp 画像記録装置の記録不良検査方法
JP2012236152A (ja) * 2011-05-12 2012-12-06 Shibaura Mechatronics Corp 液滴塗布装置及び液滴塗布方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566730A (zh) * 2018-08-22 2021-03-26 东京毅力科创株式会社 绘制装置和绘制方法

Also Published As

Publication number Publication date
JP6862041B2 (ja) 2021-04-21
TWI688431B (zh) 2020-03-21
KR20190040960A (ko) 2019-04-19
CN109475895A (zh) 2019-03-15
JP2018026443A (ja) 2018-02-15
TW201805069A (zh) 2018-02-16

Similar Documents

Publication Publication Date Title
US8226193B2 (en) Liquid droplet jetting apparatus
JP2008544333A (ja) フラットパネルディスプレイ用インクジェット印刷システム及び方法
JP2001088277A (ja) 基体を印刷する方法、およびその方法の使用に適した印刷装置
WO2018030256A1 (ja) 膜形成方法及び膜形成装置
KR101174878B1 (ko) 인쇄 방법 및 인쇄 장치
JP2009023292A (ja) ラインヘッド型インクジェット装置
JPWO2013089049A1 (ja) タッチパネルの製造方法、及び基板製造装置
KR100786995B1 (ko) 잉크젯 인쇄장치
JP2004141758A (ja) 液滴吐出装置のドット位置補正方法、アライメントマスク、液滴吐出方法、電気光学装置およびその製造方法、並びに電子機器
JP2007256312A (ja) カラーフィルタの製造方法、有機エレクトロルミネッセンス素子の製造方法及びこれに用いるインクジェット塗工装置
TWI673180B (zh) 膜形成裝置及膜形成方法
TWI574849B (zh) 噴墨裝置、及噴墨裝置之噴頭配置方法
CN109562407B (zh) 膜形成装置及膜形成方法
KR20130120775A (ko) 인쇄 장치 및 이를 이용한 유기 발광 표시장치 제조 방법
KR20150130836A (ko) 잉크젯 마킹방법 및 잉크젯 마킹 시스템
JP2016135559A (ja) インクジェットプリンタ
KR20120079733A (ko) 박막트랜지스터 인쇄장치 및 이를 이용한 박막트랜지스터 인쇄방법
JP2021079359A (ja) インク塗布制御装置及びインク塗布方法
JP2019000780A (ja) インクジェット塗布装置
WO2017208858A1 (ja) 膜パターン描画方法
JP2012196851A (ja) インクジェットプリンタおよびドット間隔調整方法
KR20190030203A (ko) 인쇄 장치
JP2008036575A (ja) パターン形成方法及び液滴吐出装置
JP2009166366A (ja) 液体吐出装置、及び、ドット形成方法
KR20180013181A (ko) 잉크젯 인쇄 장비 및 방법 및 그를 이용한 표시 장치 제조 방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17839327

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20197000852

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17839327

Country of ref document: EP

Kind code of ref document: A1