WO2017206828A1 - 光刻机刀口组、大视场光刻机和曝光方法 - Google Patents
光刻机刀口组、大视场光刻机和曝光方法 Download PDFInfo
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- WO2017206828A1 WO2017206828A1 PCT/CN2017/086270 CN2017086270W WO2017206828A1 WO 2017206828 A1 WO2017206828 A1 WO 2017206828A1 CN 2017086270 W CN2017086270 W CN 2017086270W WO 2017206828 A1 WO2017206828 A1 WO 2017206828A1
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- exposure
- scanning
- blade
- knife edge
- scanning direction
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
Definitions
- a TFT (Thin Film Transistor) lithography machine is a main device in the field of flat panel manufacturing for projecting a pattern on a reticle through an objective lens onto a substrate.
- the objective lens is also expanded from one field of view to a plurality of fields of view.
- the G6 objective lens is equipped with six objective lenses in six fields of view.
- the movable knife edge is a mechanism for illuminating static exposure and shielding the mask mark.
- the original movable knife edge is arranged under the illumination device, taking the G4.5 generation movable knife edge as an example, the G4.5 generation movable knife edge structure As shown in FIG.
- a scanning pair of knife edges movable in the scanning direction, the scanning direction edge group for shielding an alignment mark of the reticle on the mask table;
- the present invention also provides a large field lithography machine having a plurality of exposure regions, including from top to bottom:
- a lighting device for providing illumination light
- a spot of illumination light provided by the illumination device is trimmed by the non-scanning window formed by the knife edge group for exposure;
- the scanning pair of knife edge groups are located on the coarse motion stage of the mask table, and the height is higher than the reticle, and the scanning to the knife edge group follows the coarse motion table movement of the mask table during exposure.
- the scanning pair of knife edges includes a front blade and a rear blade that are parallel to each other in the longitudinal direction.
- a sensor is further disposed under the mask table for sensing illumination light passing through the slit
- the scanning blade group further includes a first moving rail and a first driving device, the longitudinal direction of the first moving rail is a scanning direction, and the first driving device drives the front blade and the rear blade edge
- the first motion guide rail movement is described.
- the first driving device is a linear motor respectively disposed at both ends of the front blade and the rear blade.
- the non-scanning knife edge group is located between the objective lens array group and the substrate.
- the non-scanning blade group includes four blades, and the four blades are arranged in two rows and two columns.
- the blades are square.
- the non-scanning blade group further includes a second moving rail and a second driving device whose longitudinal direction is a non-scanning direction, and the second driving device drives the four blades to move along the second moving rail to perform a field of view. Adjustment.
- the present invention also provides an exposure method using the large field of view lithography machine as described above, comprising the steps of:
- Step 1 Before the exposure, the illumination test in the exposure area is performed by the scanning to the knife edge group in the exposure area in the scanning direction;
- the reticle has two symmetrically distributed alignment regions and a plurality of patterned regions arranged in an array, two of the alignment regions being located on opposite sides of the reticle, each of the graphic regions corresponding to An exposure area.
- said scanning blade set includes a front blade and a rear blade, said front and rear blades being placed over said alignment area upon exposure to block illumination light directed toward said alignment area.
- the illumination test in the exposure area by the scanning to the knife edge group in the exposure area in the exposure area is specifically: the rear blade is provided with a slit, and the sensor is disposed under the mask table.
- the front blade is fixed above the alignment area, the rear blade moves along the scanning direction, and the sensor receives illumination sequentially passing through the slit and the mask table.
- the illumination parameter of the illumination light in the exposed area is obtained.
- the lithography machine knife edge group, the large field lithography machine and the exposure method provided by the invention during the test, the scanning moves to the knife edge group once for the illumination test, and after the test is completed, moves to the top of the alignment mark; during the exposure, the scanning direction
- the knife edge group follows the mask table to move at the same speed and in the same direction, keeping the alignment marks of the scan edge group and the reticle relatively stationary. If it is a full field of view exposure, the non-scanning to the knife edge group does not need to move. If it is a partial exposure, the non-scanning to the knife edge group is moved to the field of view of the partial exposure, and the window formed by the non-scanning to the knife edge group forms a control illumination spot.
- the shape, then the non-scanning edge group can remain stationary, simply moving the mask table and the table, the exposure field can be removed from one exposure area, and the other exposure area is moved into the exposure field to continue exposure. Complete exposure for all exposed areas.
- Figure 5 is a schematic view of the structure of the rear blade
- Figure 9 is a schematic view showing the position of the non-scanning knife edge group when exposed in a partial field of view.
- 401-illumination device 404-reticle, 404a-front mark, 404b-rear mark, 101-Y to blade 1, 102-X to blade 1, 103-Y to blade 2, 104-X to the blade two, 605-sensor;
- the lithography machine blade set includes:
- the scanning to the cutting edge group is mainly used for shielding the alignment mark of the reticle on the mask table, and preventing the alignment mark from being printed on the substrate during exposure, please refer to FIG.
- the scan moves toward the knife edge group following the mask table in the same direction at the same speed, so that it remains stationary with respect to the alignment mark;
- the non-scanning blade group is mainly used for moving to the exposure area of the partial exposure field to a exposure area during partial exposure to form a window, the illumination device Providing illumination light through the trimming of the window to form a desired spot to be irradiated onto the exposed area for exposure of the exposed area;
- the present invention provides a large field lithography machine for performing exposure using the above-described lithography machine blade group, which includes, from top to bottom, in order:
- a mask table (not shown) with a reticle 4 placed on the surface, and the periphery of the mask table is placed to be moved a moving coarse movement stage 207 for moving the mask table to a large stroke;
- the objective lens array group has six objective lenses 306 arranged in two rows in parallel in the scanning direction, three objective lenses 306 in each row, and three objective lenses 306 arranged in the non-scanning direction.
- a workpiece stage (not shown) is provided with a substrate (not shown) on which a scanning exposure is required, and the mask table and the workpiece stage are moved in the same direction and at the same speed, and the direction is defined as a scanning direction, in a horizontal plane and a scanning direction.
- the orthogonal direction is defined as the non-scanning direction;
- a non-scanning knife edge group located between the objective lens array group and the substrate, the non-scanning blade group moving in a non-scanning direction.
- the specific structure of the scanning blade group is as follows: two sides of the coarse movement table 207 of the mask table parallel to the scanning direction are respectively provided with a first moving rail 205 whose length direction is parallel to the edge, which is The length of the first moving rail 205 is the range of travel of the scanning to the knife group; the two blades are mounted on the two first moving rails 205, and the two blades are the front blade 203 and the rear blade 204, respectively, and the two blades are long.
- a blade four 304 each of which is square; the four blades are evenly distributed on two second moving rails 307 whose length direction is parallel to the non-scanning direction, and the second driving device includes a length direction parallel to the second moving rail a lead screw 308 of 307 and a rotary motor 305 coupled to the lead screw 308, a screw 308 is sleeved with a blade, and each rotary motor 305 and the lead screw 308 are engaged such that the blades respectively move on the second moving rail 307.
- the stroke of the four blades is measured by an encoder that is provided by each rotary motor 305.
- the two second moving rails 307 are respectively disposed under the two rows of objective lenses 306 in the objective lens array, and each of the second moving rails 307 has two blades, each of which is in a set of screw rods 308 and a rotating motor.
- the driving of 305 is moved along the second moving rail 307, and the light passing through each row of objective lenses 306 is controlled, and the cooperative motion of the four blades realizes trimming of the spot of the illumination light in the exposed area.
- the present invention also provides an exposure method using the large field of view lithography machine as described above, comprising the steps of:
- Step 1 The reticle 4 is provided with an alignment area 401 and a plurality of pattern areas 402 arranged in a periodic array. As shown in FIG. 6, the alignment area 401 is symmetrically distributed on both sides of the reticle 4, and the alignment area 401 An alignment mark is provided thereon for aligning the reticle 4 with the substrate upon exposure.
- Step 3 The mask table and the workpiece table are moved in the same direction, so that the next exposure region is moved into the exposure field, and the exposure regions are exposed by repeating steps 1 and 2 until the exposure of all the exposed regions is completed.
- the present invention has the following beneficial effects as compared with the prior art:
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (26)
- 一种光刻机刀口组,设置在光刻机内,所述光刻机在曝光时,掩模台和工件台按照相同方向运动,该方向定义为扫描方向,在水平面上与扫描方向正交的方向定义为非扫描方向;其特征在于,包括在所述扫描方向上可运动的扫描向刀口组,所述扫描向刀口组用于遮挡所述掩模台上掩模版的对准标记;在所述非扫描方向上可运动的非扫描向刀口组;所述光刻机的照明装置提供的照明光的光斑由所述非扫描向刀口组形成的窗口修剪后用于曝光;曝光时所述扫描向刀口组相对于所述掩模版的对准标记保持静止,所述非扫描向刀口组相对于所述照明装置保持静止。
- 一种大视场光刻机,具有多个曝光区域,从上至下依次包括:一照明装置,用于提供照明光;一掩模台,用于放置掩模版;一工件台,用于放置需要扫描曝光的基板,曝光时所述掩模台和所述工件台按照相同方向、相同速度运动,该方向定义为扫描方向,在水平面上与扫描方向正交的方向定义为非扫描方向;其特征在于,还设置有在所述扫描方向上可运动的扫描向刀口组,所述扫描向刀口组用于遮挡所述掩模版的对准标记;在所述非扫描方向上可运动的非扫描向刀口组;所述照明装置提供的照明光的光斑由所述非扫描向刀口组形成的窗口修剪后用于曝光;对所述多个曝光区域中的一个曝光时,所述扫描向刀口组相对于所述掩模版的对准标记保持相对静止,所述非扫描向刀口组相对于所述照明装置保持静止,通过移动所述掩模台和所述工件台将所述多个曝光区域逐个移动至所述照明装置的照明视场内,即可完成所述多个曝光区域的曝光。
- 如权利要求2所述的大视场光刻机,其特征在于,所述扫描向刀口组位于所述掩模台的粗动台上,且高度高于所述掩模版,曝光时所述扫描向刀口组跟随所述掩模台的粗动台运动。
- 如权利要求3所述的大视场光刻机,其特征在于,所述扫描向刀口组包括长度方向互相平行的前刀片和后刀片。
- 如权利要求4所述的大视场光刻机,其特征在于,所述前刀片和所述后刀片皆为长度方向平行于非扫描方向的金属片,所述后刀片上开设有长度方向平行于非扫描方向的狭缝。
- 如权利要求5所述的大视场光刻机,其特征在于,在所述掩模台下方还设置有传感器,用于感应穿过所述狭缝的照明光。
- 如权利要求5所述的大视场光刻机,其特征在于,所述扫描向刀口组还包括第一运动导轨和第一驱动装置,所述第一运动导轨的长度方向为扫描方向,所述第一驱动装置驱动所述前刀片和后刀片沿所述第一运动导轨运动。
- 如权利要求7所述的大视场光刻机,其特征在于,设置有两个相互平行的所述第一运动导轨,所述前刀片和所述后刀片的两个端部皆在两个第一运动导轨上移动。
- 如权利要求8所述的大视场光刻机,其特征在于,所述第一驱动装置为分别设置在所述前刀片、所述后刀片两个端部的直线电机。
- 如权利要求8所述的大视场光刻机,其特征在于,所述前刀片和所述后刀片的两端与所述第一运动导轨的连接处上皆设置有解耦装置。
- 如权利要求10所述的大视场光刻机,其特征在于,所述解耦装置为交叉滚珠轴环。
- 如权利要求8所述的大视场光刻机,其特征在于,所述前刀片和所述后刀片的两端与所述第一运动导轨的连接处上皆设置有刀片定位装置。
- 如权利要求12所述的大视场光刻机,其特征在于,所述刀片定位装置为导轨钳制器,用于使所述前刀片和所述后刀片静止在所述第一运动导轨上。
- 如权利要求8所述的大视场光刻机,其特征在于,所述第一运动导轨上各自设置有方位测量装置。
- 如权利要求14所述的大视场光刻机,其特征在于,所述方位测量装置为光栅尺。
- 如权利要求2所述的大视场光刻机,其特征在于,还包括物镜阵列组,位于所述掩模台和所述基板之间,所述物镜阵列组具有若干个呈阵列排布的物镜。
- 如权利要求16所述的大视场光刻机,其特征在于,所述非扫描向刀口组位于所述物镜阵列组与所述基板之间。
- 如权利要求1或17所述的大视场光刻机,其特征在于,所述非扫描向刀口组包括四个刀片,且四个所述刀片排列成两行两列。
- 如权利要求18所述的大视场光刻机,其特征在于,所述刀片为方形。
- 如权利要求18所述的大视场光刻机,其特征在于,所述非扫描向刀口组还包括长度方向为非扫描方向的第二运动导轨和第二驱动装置,所述第二驱动装置驱动四个刀片沿所述第二运动导轨运动进行视场调节。
- 如权利要求20所述的大视场光刻机,其特征在于,设置有两个相对的所述第二运动导轨,每个所述第二运动导轨上分别有两个所述刀片,两个所述刀片分别在所述第二运动导轨上移动。
- 如权利要求20所述的大视场光刻机,其特征在于,所述第二驱动装置包括与所述第二运动导轨平行设置的丝杆和与所述丝杠连接的旋转电机,所述非扫描向刀口组中的各个刀片分别用所述旋转电机和丝杆的组合进行驱动。
- 一种使用如权利要求2所述的大视场光刻机的曝光方法,其特征在于,包括如下步骤:步骤一:在曝光前,由所述扫描向刀口组在曝光区域内在扫描向移动进行所述曝光区域内的光照测试;步骤二:由所述非扫描向刀口组移动至所述曝光区域内形成用于修剪照明光的光斑的窗口;步骤三:所述掩模台和所述工件台按照同一方向移动,所述扫描向刀口组跟随所述掩模台运动并相对于所述掩模版的对准标记保持静止,所述非扫描向刀口组相对于所述照明装置保持静止,完成对所述曝光区域的曝光;步骤四:通过移动所述掩模台和所述工件台将下一个曝光区域移至照明装置的照明视场内,重复步骤一至步骤三对所述下一个曝光区域进行曝光。
- 如权利要求23所述的曝光方法,其特征在于,所述掩模版具有两个呈对称分布的对准区域和若干个呈阵列排布的图形区域,两个所述对准区域位于所述掩模版两侧,每个所述图形区域对应一个曝光区域。
- 如权利要求24所述的曝光方法,其特征在于,所述扫描向刀口组包括前刀片和后刀片,曝光时所述前刀片和后刀片放置在所述对准区域上方,阻挡照向所述对准区域的照明光。
- 如权利要求23所述的曝光方法,其特征在于,步骤二中由扫描向刀口组在该曝光区域内在扫描向移动进行该曝光区域内的光照测试具体为: 所述后刀片上设置有狭缝,在所述掩模台下方设置有传感器,在测试时,所述前刀片固定在所述对准区域上方,所述后刀片沿着所述扫描方向移动,所述传感器通过接收依次透过所述狭缝和所述掩模台的照明光,得到在该曝光区域内的照明光的光照参数。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/306,399 US10732509B2 (en) | 2016-05-31 | 2017-05-27 | Knife edge set of mask aligner, large-view-field mask aligner, and exposure method |
KR1020187037337A KR102176255B1 (ko) | 2016-05-31 | 2017-05-27 | 마스크 정렬기의 나이프 에지 세트. 넓은-시야-범위 마스크 정렬기, 및 노출 방법 |
JP2018555182A JP6706343B2 (ja) | 2016-05-31 | 2017-05-27 | フォトリソグラフィ装置のナイフエッジ群、大視野フォトリソグラフィ装置、および露光方法 |
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US20200041910A1 (en) | 2020-02-06 |
KR102176255B1 (ko) | 2020-11-09 |
TWI681260B (zh) | 2020-01-01 |
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KR20190009808A (ko) | 2019-01-29 |
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