Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/6773—Conveying cassettes, containers or carriers
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/04—Coating on selected surface areas, e.g. using masks
  • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67017—Apparatus for fluid treatment
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

• Embodiments of the present disclosure relate to apparatuses and methods for transportation of carriers or substrates, more specifically carriers or substrates for layer deposition on large area substrates.
• substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process.
• PVD physical vapor deposition
• CVD chemical vapor deposition
• the process can be performed in a processing chamber of a deposition apparatus, where the substrate to be coated is located.
• a deposition material is provided in the processing chamber.
• a plurality of materials such as small molecules, metals, oxides, nitrides, and carbides may be used for deposition on a substrate.
• other processes like etching, structuring, annealing, or the like can be conducted in processing chambers.
• Coated substrates can be used in several applications and in several technical fields.
• an application can be organic light emitting diode (OLED) panels.
• Further applications include insulating panels, microelectronics, such as semiconductor devices, substrates with thin film transistors (TFTs), color filters or the like.
• OLEDs are solid-state devices composed of thin films of (organic) molecules that create light with the application of electricity.
• OLED displays can provide bright displays on electronic devices and use reduced power compared to, for example, liquid crystal displays (LCDs).
• the organic molecules are generated (e.g., evaporated, sputtered, or sprayed etc.) and deposited as layer on the substrates.
• the particles can for example pass through a mask having a boundary or a specific pattern to deposit material at desired positions on the substrate, e.g. to form an OLED pattern on the substrate.
• An alignment of the substrate with respect to the mask and a quality of the processed substrate, in particular of the deposited layer, can be provided. As an example, the alignment should be accurate and steady in order to achieve good process results. Systems used for alignment of substrates and masks can be susceptible to external interferences, such as vibrations. Further, systems for alignment may increase the cost of ownership. [0005] In view of the above, there is a need for apparatuses, which can provide for an improved control of the transportation of carriers or substrates during the layer deposition process.
• a method of contactless alignment of a carrier assembly includes levitating the carrier assembly in a vacuum chamber; moving the carrier assembly while levitating to positioning the carrier assembly relative to a predetermined position, particularly a mask or a mask carrier; and aligning the carrier assembly relative to the mask or the mask carrier in at least one direction selected from the group consisting of: the substrate transport direction, a first direction being vertical +- 15°, and a combination thereof.
• a method of processing a substrate of a carrier assembly includes a method of contactless alignment of the carrier assembly, wherein the mask or the mask carrier is positioned in the vacuum chamber, and processing the substrate in the vacuum chamber.
• the method f contactless alignment of the carrier assembly includes levitating the carrier assembly in a vacuum chamber; moving the carrier assembly while levitating to positioning the carrier assembly relative to a predetermined position, particularly a mask or a mask carrier; and aligning the carrier assembly relative to the mask or the mask carrier in at least one direction selected from the group consisting of: the substrate transport direction, a first direction being vertical +- 15°, and a combination thereof.
• an apparatus for contactless alignment of a carrier assembly and a mask or a mask carrier relative to each other in a vacuum chamber of a substrate processing system includes a guiding structure having a plurality of active magnetic units within the vacuum chamber, wherein the guiding structure is configured to levitate the carrier assembly in the vacuum chamber; a drive structure having a plurality of further active magnetic units within the vacuum chamber, wherein the drive structure is configured to drive the carrier assembly along a transport direction without mechanical contact; two or more alignment actuators to contact the mask, the substrate, or the mask and the substrate within the vacuum chamber; and a controller connected to guiding structure, the drive structure and the two or more alignment actuators and configured to control the plurality of active magnetic units and the plurality of further active magnetic units to provide a pre-alignment with the guiding structure and the drive structure and to provide mechanical alignment with the two or more alignment actuators.
• FIG. 1A shows a schematic side view of an of an apparatus to transport a carrier assembly, for example a carrier having a substrate loaded thereon, in a substrate processing system according to embodiments of the present disclosure
• FIG. IB shows a top view of an apparatus according to FIG. 1A;
• FIG. 1C shows another side view of an apparatus according to FIG. 1A;
• FIG. 2 shows an apparatus, for example a substrate processing system including an apparatus to transport a carrier assembly according to embodiments of the present disclosure
• FIGS. 3 A and 3B show a schematic side views of transporting a carrier assembly, for example a carrier having a substrate loaded thereon, according to embodiments of the present disclosure
• FIGS. 4 A and 4B show a schematic side view to illustrate methods of aligning a substrate within a substrate processing system according to embodiments of the present disclosure
• FIG. 5 shows a schematic view of a mask or a mask arrangement, which can be utilized in combination with an apparatus to transport a carrier assembly or in a substrate processing system, according to embodiments of the present disclosure
• FIG. 6 shows a schematic view of a mask or a mask arrangement, which can be utilized in combination with an apparatus to transport a carrier assembly or in a substrate processing system, according to embodiments of the present disclosure
• FIG. 7 shows a schematic view of a holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber according to embodiments described herein
• FIG. 8 shows a cross-sectional view of a holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber according to embodiments described herein;
• FIG. 9 shows a schematic view of a holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber according to further embodiments described herein;
• FIG. 10 shows a flowchart for illustrating a method of aligning a carrier assembly and a mask relative to each other according to embodiments of the present disclosure.
• the disclosure refers to a carrier assembly, which may include one or more elements of the group consisting of: a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support.
• a carrier assembly which may include one or more elements of the group consisting of: a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support.
• the term "contactless" as used throughout the present disclosure can be understood in the sense that a weight of e.g. the carrier and the substrate is not held by a mechanical contact or mechanical forces, but is held by a magnetic force.
• the carrier assembly is held in a levitating or floating state using magnetic forces instead of mechanical forces.
• the apparatus described herein may have no mechanical means, such as a mechanical rail, supporting the weight of the deposition source assembly.
• levitating or levitation refers to a state of an object, wherein the objects floats without mechanical contact or support.
• moving an object refers to providing a driving force, e.g. a force in a direction different than a levitation force, wherein the object is moved from one position to another, different position, for example a different lateral position.
• a driving force e.g. a force in a direction different than a levitation force
• an object such as a carrier assembly can be levitated, i.e. by a force counteracting gravity, and can be moved in a direction different then a direction parallel to gravity while being levitated.
• the contactless levitation, transportation and/or alignment of the carrier assembly is beneficial in that no particles are generated due to a mechanical contact between the deposition source assembly and sections of the apparatus, such as mechanical rails, during the transport or alignment of the carrier assembly. Accordingly, embodiments described herein provide for an improved purity and uniformity of the layers deposited on the substrate, in particular since a particle generation is minimized when using the contactless levitation, transportation and/or alignment.
• a further advantage, as compared to mechanical means for guiding the carrier assembly, is that embodiments described herein do not suffer from friction affecting the linearity and/or precision of the movement of the carrier assembly.
• the contactless transportation of the carrier assembly allows for a frictionless movement of the carrier assembly, wherein an alignment of the carrier assembly relative to a mask can be controlled and maintained with high precision.
• the levitation allows for fast acceleration or deceleration of the carrier assembly speed and/or fine adjustment of the carrier assembly speed.
• the material of mechanical rails typically suffers from deformations, which may be caused by evacuation of a chamber, by temperature, usage, wear, or the like. Such deformations affect the position of the carrier assembly, and hence affect the quality of the deposited layers.
• embodiments described herein allow for a compensation of potential deformations present in e.g. the guiding structure described herein.
• embodiments described herein allow for a contactless alignment of the carrier assembly. Accordingly, an improved and/or more efficient alignment of the substrate relative to the mask can be provided.
• the apparatus is configured for a contactless translation of the carrier assembly along a vertical direction, e.g. the y-direction, and/or along one or more transversal directions, e.g. the x-direction.
• Embodiments described herein allow for a contactless rotation of the carrier assembly with respect to at least one rotation axis for angularly aligning the carrier assembly, e.g. relative to a mask. Rotation of the deposition source assembly with respect to a rotation axis may be provided within an angle range from 0.003 degrees to 3 degrees. Embodiments described herein allow for an additional mechanical rotation of the carrier assembly, i.e. with contact, with respect to at least one rotation axis for angularly aligning the carrier assembly, e.g. relative to a mask. Mechanical rotation of the deposition source assembly with respect to a rotation axis may be provided within an angle range from 0.0001 degrees to 3 degrees.
• substantially parallel directions may include directions, which make a small angle of up to 10 degrees with each other, or even up to 15 degrees.
• the terminology of “substantially perpendicular” directions may include directions which make an angle of less than 90 degrees with each other, e.g. at least 80 degrees or at least 75 degrees. Similar considerations apply to the notions of substantially parallel or perpendicular axes, planes, areas or the like.
• a vertical direction is considered a direction substantially parallel to the direction along which the force of gravity extends.
• a vertical direction may deviate from exact verticality (the latter being defined by the gravitational force) by an angle of, e.g., up to 15 degrees.
• the y-direction described herein (indicated with “Y” in the figures) is a vertical direction.
• the y-direction shown in the figures defines the direction of gravity.
• Embodiments described herein may further involve the notion of a "transversal direction".
• a transversal direction is to be understood to distinguish over a vertical direction.
• a transversal direction may be perpendicular or substantially perpendicular to the exact vertical direction defined by gravity.
• the x-direction and the z-direction described herein are transversal directions.
• the embodiments described herein can be utilized for coating large area substrates, e.g., for display manufacturing.
• the substrates or substrate receiving areas for which the apparatuses and methods described herein are provided can be large area substrates.
• a large area substrate or carrier can be GEN 4.5, which corresponds to about 0.67 m 2 substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m 2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
• substrate as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate.
• substrate may embrace flexible substrates such as a web or a foil.
• substantially inflexible is understood to distinguish over “flexible”.
• a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.
• a substrate may be made of any material suitable for material deposition.
• the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, metal or any other material or combination of materials which can be coated by a deposition process.
• an apparatus 100 for contactless transportation of a carrier assembly 110 and/or a substrate 120 is provided.
• the apparatus includes a carrier assembly 110.
• the carrier assembly 110 can include the substrate 120.
• the carrier assembly 110 includes a first passive magnetic unit 150.
• the apparatus includes a guiding structure 170 extending in a carrier assembly transportation direction.
• the guiding structure includes a plurality of active magnetic units 175.
• the carrier assembly 110 is movable along the guiding structure 170.
• the first passive magnetic unit 150 e.g. a bar of ferromagnetic material, and the plurality of active magnetic units of the guiding structure 170 are configured for providing a first magnetic levitation force for levitating the carrier assembly 110.
• the means for levitating as described herein are means for providing a contactless force to levitate e.g. a carrier assembly.
• the apparatus 100 may be arranged in a processing chamber.
• the processing chamber may be a vacuum chamber or a vacuum deposition chamber.
• vacuum can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar.
• the apparatus 100 can include one or more vacuum pumps, such as turbo pumps and/or cryo-pumps, connected to the vacuum chamber for generation of the vacuum inside the vacuum chamber.
• FIG. 1A shows a side view of the apparatus 100.
• the apparatus 100 includes a carrier assembly 110. Further, the apparatus includes a guiding structure 170.
• the apparatus may further include a drive structure 180.
• the drive structure includes a plurality of further active magnetic units.
• the carrier assembly can include a second passive magnetic unit 160, e.g. a bar of ferromagnetic material to interact with the further active magnetic units 185 of the drive structure 180.
• FIG. 1 a shows a side view of the X-Y-plane.
• FIG. IB shows a top view of the apparatus 100 of FIG. 1A.
• FIG. IB shows the X-Z-plane. From the top, the plurality of active magnetic units 175 are shown in FIG. IB.
• FIG. 1C shows another side view of the apparatus 100.
• FIG. 1C shows the set-Y-plane.
• an active magnetic unit 175 of the plurality of active magnetic units is shown.
• the active magnetic unit 175 provides magnetic force interacting with a first passive magnetic unit 150 of the carrier assembly 110.
• the first passive magnetic unit 150 can be a rod of a ferromagnetic material.
• a rod can be a portion of the carrier assembly 110 that is connected to a support structure 112.
• the rod or the first passive magnetic unit, respectively, may also be integrally formed with a support structure 112 for supporting the substrate 120.
• the carrier assembly 110 can further include a second passive magnetic unit 160, for example a further rod.
• the further rod can be connected to the carrier assembly 110.
• the rod or the second passive magnetic unit, respectively, may also be integrally formed with the support structure 112.
• a passive magnetic unit may refer to an element with magnetic properties, which are not subject to active control or adjustment, at least not during operation of the apparatus 100.
• the magnetic properties of a passive magnetic unit e.g. the rod or the further rod of the carrier assembly, are not subject to active control during movement of the carrier assembly through the deposition apparatus or processing apparatus in general.
• a controller of the apparatus 100 is not configured to control a passive magnetic unit of the deposition source assembly.
• a passive magnetic unit may be adapted for generating a magnetic field, e.g. a static magnetic field.
• a passive magnetic unit may not be configured for generating an adjustable magnetic field.
• a passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet or may have permanent magnetic properties.
• an active magnetic unit offers more flexibility and precision in light of the adjustability and controllability of the magnetic field generated by the active magnetic unit.
• the magnetic field generated by an active magnetic unit may be controlled to provide for an alignment of the carrier assembly 110. For example, by controlling the adjustable magnetic field, a magnetic levitation force acting on the carrier assembly 110 may be controlled with high accuracy, thus allowing for a contactless alignment of the carrier assembly and, thus, a substrate, by the active magnetic unit.
• the plurality of active magnetic units 175 provides for a magnetic force on the first passive magnetic unit 150 and, thus, the carrier assembly 110.
• the plurality of active magnetic units 175 levitate the carrier assembly 110.
• the further active magnetic units 185 drive the carrier within the processing system, for example along the X-direction, i.e. along a first direction that is substrate transport direction. Accordingly, the plurality of further active magnetic units 185 form the drive structure for moving the carrier assembly 110 while being levitated by the plurality of active magnetic units 175.
• the further active magnetic units 185 interact with the second passive magnetic unit 160 to provide a force along the substrate transport direction.
• the second passive magnetic unit 160 can include a plurality of permanent magnets, which are arranged with an alternating polarity. The resulting magnetic fields of the second passive magnetic unit 160 can interact with the plurality of further active magnetic units 185 to move the carrier assembly 110 while being levitated.
• the active magnetic units can be controlled to provide adjustable magnetic fields.
• the adjustable magnetic field may be a static or a dynamic magnetic field.
• an active magnetic unit is configured for generating a magnetic field for providing a magnetic levitation force extending along a vertical direction.
• an active magnetic unit may be configured for providing a magnetic force extending along a transversal direction.
• An active magnetic unit, as described herein, may be or include an 5 element selected from the group consisting of: an electromagnetic device; a solenoid; a coil; a superconducting magnet; or any combination thereof.
• FIG. 2 shows an apparatus 200 for processing a substrate in a vacuum chamber.
• the vacuum chamber 252 can for example have a chamber wall 253.
• the gate valve 262 can be provided in the chamber wall 253. The gate valve can be opened to load the carrier
• FIG. 2 shows an embodiment of an apparatus 200 having two gate valves 262 and two guiding structures 170. Accordingly, two carrier assemblies 110 can be loaded and unloaded from the vacuum chamber 252, for example, alternating or simultaneously.
• Loading and unloading the carrier assemblies 110 alternatingly has the advantage, that a processing tool, for example a deposition source, can process a substrate of a carrier assembly while another substrate of another carrier assembly is unloaded or loaded, respectively. Accordingly, the throughput of the apparatus 200 can be increased.
• a processing tool for example a deposition source
• the apparatus 200 further includes a maintenance chamber 20 254, which may for example be a further vacuum chamber.
• the maintenance chamber 254 can be separated from the vacuum chamber 252 by a further gate valve 264.
• the apparatus 200 can be a deposition apparatus.
• a deposition source assembly 270 can be moved along a track 272.
• the track 272 or a portion of the track 272 can extend into the 25 maintenance chamber 254 in order to move the deposition source assembly from the vacuum chamber 252 into the maintenance chamber 254.
• Moving the deposition source assembly 270 into the maintenance chamber has the advantage that the deposition source assembly can be maintained outside of the vacuum chamber 252.
• the maintenance chamber 254 can be vented to have maintenance 30 access to the deposition source assembly while the vacuum chamber 252 can stay evacuated.
• a second deposition source assembly 270 can be in operation in the vacuum chamber 252 while the first deposition source assembly 270 can be maintained in the maintenance chamber 254. Additionally or alternatively, the reduced number of times at which the vacuum chamber 252 needs to be vented results in a cleaner environment in the vacuum chamber 252.
• the deposition source assembly 270 can include support 274.
• the support 274 can include drive units to move the deposition source assembly 270 along the track 272.
• the support 274 can further include magnetic units to levitate the deposition source assembly.
• One or more deposition sources can be included in the deposition source assembly. As exemplarily shown in FIG.
• FIG. 2 shows a deposition source assembly facing a substrate of the upper carrier assembly 110 of FIG. 2.
• the deposition source assembly can be moved along a substrate mounted on the carrier of the carrier assembly.
• the deposition source assembly can include one or more line sources. A combination of providing a line source and a movement of the deposition source assembly allows for depositing material on a rectangular substrate, such as large area substrate for display manufacturing.
• distribution pipes of a deposition source assembly may include one or more point sources, which can be moved along a substrate surface.
• the deposition source assembly may also rotate the deposition sources such that the deposition sources are directed towards a substrate of the lower carrier assembly 110 shown in FIG. 2. Accordingly, a carrier assembly 110 can be loaded out of and into the vacuum chamber 252 at a first position of the upper and lower position shown in FIG. 2 while the substrate of a carrier assembly on the corresponding other position of the upper and lower position shown in FIG. 2 can be processed. After processing of the corresponding other substrate, loading of a new substrate, for example on the carrier assembly 110, can be completed. After rotation of the one or more deposition sources of the deposition source assembly 270 a substrate, which has been loaded at the first position of the upper and lower position shown in FIG. 2 can be processed. Similarly, during processing (e.g. layer deposition) of a substrate in the first position, unloading and loading of another substrate in the other position can be conducted.
• processing e.g. layer deposition
• the speed of the deposition source assembly along the source transportation direction may be controlled for controlling the deposition rate.
• the speed of the deposition source assembly can be adjusted in real-time under the control of a controller.
• the adjustment can be provided for compensating a deposition rate change.
• a speed profile may be defined.
• the speed profile may determine the speed of the deposition source assembly at different positions.
• the speed profile may be provided to or stored in the controller.
• the controller may control the drive system such that the speed of the deposition source assembly is in accordance with the speed profile. Accordingly, a real-time control and adjustment of the deposition rate can be provided, so that the layer uniformity can be further improved.
• a translational movement of the deposition source assembly along the source transportation direction allows for a high coating precision, in particular a high masking precision during the coating process, since the substrate and the mask can remain stationary during coating.
• a mask 212 can be provided between the deposition source assembly 270 and a substrate of a carrier assembly 110.
• FIG. 2 shows a first mask 212 in an upper position, i.e. in a position between the deposition source assembly and the upper carrier assembly 110 and a second mask 212 in the lower position, i.e. in a position between the deposition source assembly and the lower carrier assembly 110.
• a mask can be an edge exclusion mask or can be a mask (a shadow mask for depositing a pattern on a substrate.
• the mask can be supported by a mask carrier. Accordingly, an alignment of, a levitation of, or a mechanical contact to a mask as referred to herein may also be provided with reference to the mask carrier.
• Embodiments of the present disclosure referred to moving levitated carrier assemblies in processing apparatus. Movement of levitated carrier assemblies allow for higher positioning precision as compared to movement of the carrier assemblies, which are mechanically supported, i.e. not supported without contact that is mechanical contact on e.g. substrate transport rollers.
• levitated carrier assembly movement allows for a high position in substrate positioning in a transport direction and/or a vertical direction, for example the X-direction and the Y-direction of FIGS. 1 A to 1C.
• the positioning precision of carrier assemblies according to embodiments described herein allow for an improved alignment of a substrate supported by a carrier of a carrier assembly relative to the mask 212.
• the alignment can be improved to provide for the desired precision for some mask configurations or can be improved to allow for a reduced complexity of a separate alignment system for some other mask configurations.
• the apparatuses and methods according to the present disclosure can be used for vertical substrate processing.
• the substrate is vertically oriented during processing of the substrate, i.e. the substrate is arranged parallel to a vertical direction as described herein, i.e. allowing possible deviations from exact verticality.
• a small deviation from exact verticality of the substrate orientation can be provided, for example, because a substrate support with such a deviation might result in a more stable substrate position or a reduced particle adherence on a substrate surface.
• An essentially vertical substrate may have a deviation of +- 15° or below from the vertical orientation. Accordingly, embodiments of the present disclosure can refer to a direction being vertical +-15°, wherein reference to a substrate orientation is made.
• FIGS. 3 A and 3B show alternative embodiment of an apparatus to provide a substrate orientation being vertical, wherein a small deviation having an absolute value of 15° or smaller can be provided.
• the substrate 120 supported by the support 112 can be slightly inclined to face downwardly. This reduces particle adherence to the substrate surface during processing of the substrate.
• FIG. 3 A shows a carrier assembly having a first passive magnetic unit 150 and a second passive magnetic unit 160.
• a support 112 for supporting the substrate 120 can be provided between the first passive magnetic unit and the second passive magnetic unit.
• FIG. 3A further shows the guiding structure 170 and the drive structure 180.
• the carrier assembly is shown in FIG. 3A is inclined, i.e.
• the carrier assembly has a slight deviation from the vertical orientation, by providing a further active magnetic unit 370 or a plurality of further active magnetic units 370 distributed along the length of the guiding structure 170, wherein the second passive magnetic unit 160 is attracted by the further active magnetic unit 370. Accordingly, the carrier assembly is provided in the levitated state, wherein the lower end of the carrier assembly is pulled sideward by the further active magnetic unit 370. Other elements for pulling the lower end of the carrier assembly sideward without mechanical contact can also be provided.
• the deviation from the vertical orientation may also be provided by passive magnetic units, e.g. permanent magnets.
• the carrier assembly may have a permanent magnet provided as the second passive magnetic unit 160 or in addition, e.g. adjacent to, the second passive magnetic unit 160.
• a further permanent magnet can be provided below the permanent magnet.
• the further permanent magnet and the permanent magnet can be provided with opposing polarity to attract each other.
• the carrier assembly can be deflected from the vertical orientation. Further, the attracting force may provide a guiding along the transportation direction.
• a yet further pair of permanent magnets may be provided to provide a guiding force at the upper side of the carrier.
• FIG. 3B shows another embodiment of the present disclosure having a first passive magnetic unit 150 and the second passive magnetic unit 160.
• the support 112 is shaped to provide a substrate inclination while the carrier assembly is vertical.
• the carrier assembly e.g. a carrier assembly 110 is shown herein, can include one or more holding devices (not shown) configured for holding the substrate 120 at a plate or a frame.
• the one or more holding devices can include at least one of mechanical, electrostatic, electrodynamic (van der Waals), electromagnetic and/or magnetic means, such as mechanical and/or magnetic clamps.
• the carrier assembly includes, or is, an electrostatic chuck (E-chuck).
• the E-chuck can have a supporting surface, for example the support 112 shown in FIGS. 1C, 3A, and 3B, for supporting the substrate 120 thereon.
• the E-chuck includes a dielectric body having electrodes embedded therein.
• the dielectric body can be fabricated from a dielectric material, preferably a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or an equivalent material.
• the electrodes may be coupled to a power source, which provides power to the electrode to control a chucking force.
• the chucking force is an electrostatic force acting on the substrate 120 to fix the substrate on the supporting surface of the support.
• the carrier assembly 110 includes, or is, an electrodynamic chuck or Gecko chuck (G-chuck).
• the G-chuck can have a supporting surface for supporting the substrate thereon.
• the chucking force can be an electrodynamic force acting on the substrate to fix the substrate on the supporting surface.
• FIGS. 4 A and 4B show operational states of the apparatus 100 according to embodiments, which can be combined with other embodiments described herein.
• FIGS. 4A and 4B show a side view of the apparatus 100.
• the guiding structure 170 may extend along a transport direction of the carrier assembly, i.e. the X-direction in FIGS. 4A and 4B.
• the transport direction of the carrier assembly is a transversal direction as described herein.
• the guiding structure 170 may have a linear shape extending along the transport direction.
• the length of the guiding structure 170 along the source transportation direction may be from 1 to 30m.
• the substrate 120 may be arranged substantially parallel to the drawing plane, e.g. with a deviation of +15°.
• the substrate may be provided in a substrate receiving area during the substrate processing, for example layer deposition process.
• the substrate receiving area has dimensions, e.g. a length and a width, which are the same or slightly (e.g. 5-20 %) larger as the corresponding dimensions of the substrate.
• the carrier assembly 110 may be translatable along the guiding structure 170 in the transportation direction, e.g. the x-direction.
• FIGS. 4A and 4B show the carrier assembly 110 at different positions along the x-direction relative to the guiding structure 170.
• the horizontal arrow 485 indicates a driving force of the drive structure 180.
• the vertical arrows 475 indicate a levitation force acting on the carrier assembly.
• the first passive magnetic unit 150 may have magnetic properties substantially along the length of first passive magnetic unit 150 in the transport direction.
• the magnetic field generated by the active magnetic units 175' interacts with the magnetic properties of the first passive magnetic unit 150 to provide for a first magnetic levitation force and a second magnetic levitation force. Accordingly, a contactless levitation, transportation and alignment of the carrier assembly 110 may be provided.
• the carrier assembly 110 is provided at a first position.
• two or more active magnetic units 175' are activated by the controller 440 to generate a magnetic field for levitating the carrier assembly 110.
• the carrier assembly hangs below the guiding structure 170 without mechanical contact.
• two active magnetic units 175' provide a magnetic force, which is indicated by arrows 475.
• the magnetic forces contact the gravity force in order to levitate the carrier assembly.
• the controller 440 controls the two active magnetic units 175', in particular for individually controls the two active magnetic units, to maintain the carrier assembly in a levitating state.
• one or more further active magnetic units 185' are controlled by the controller 440.
• the further active magnetic units interact with the second passive magnetic unit 160, for example a set of alternating permanent magnets, to generate a driving force indicated by arrow 485.
• the driving force moves the substrate, for example the substrate supported by the support of the carrier assembly, along the transport direction.
• the transport direction can be the X-direction.
• the number of further active magnetic units 185 ', which are simultaneously controlled to provide the driving force is 1 to 3.
• the control of the further active magnetic units 185 ' may also be provided by a second controller different from the controller 440 controlling the active magnetic units 175'.
• the movement of the carrier assembly moves the substrate along the transport direction, for example the X-direction. Accordingly, at a first position, the substrate is positioned below the first group of active magnetic units 175' and at a further, different position, the substrate is positioned below the further, different group of active magnetic units 175'.
• the controller 440 controls which active magnetic units 175' provides a levitation force for a respective position and controls the respective active magnetic units to levitate the carrier assembly. For example, the levitating force can be provided by subsequent active magnetic units 175' while the substrate is moving.
• the carrier assembly is handed over from one set of active magnetic units to another set of active magnetic unit.
• FIG. 4B shows the carrier assembly in a second position.
• the position shown in FIG. 4B corresponds to a processing position, in which the substrate is processed.
• the carrier assembly In the processing position, the carrier assembly can be moved to a desired position.
• the substrate is aligned relative to the mask with the contactless transport system described in the present disclosure.
• two active magnetic units 175' provide a first magnetic force indicated by arrow 494 and a second magnetic force indicated by arrow 496.
• the controller 440 controls the two active magnetic units 175 'to provide for an alignment in a vertical direction, for example the Y-direction in FIG. 4B. Further, additionally or alternatively, the controller 440 controls the two active magnetic units 175' to provide for an alignment, wherein the carrier assembly is rotated in the X-Y- plane. Both alignment movements can exemplarily be seen in FIG. 4B by comparing the position of the dotted carrier assembly 410 and the position of the carrier assembly 110 drawn with solid lines.
• the controller may be configured for controlling the active magnetic units 175' for translationally aligning the carrier assembly in a vertical direction.
• the carrier assembly 110 may be positioned into a target vertical position.
• the carrier assembly 110 may be maintained in the target vertical position under the control of the controller 440.
• the controller is configured for controlling the active magnetic units 175' for angularly aligning the deposition source with respect to a first rotation axis, e.g. a rotational axis perpendicular to a main substrate surface, e.g. a rotational axis extending in a Z-direction in the present disclosure.
• an alignment of the carrier assembly can be provided with an alignment range from 0.1 mm to 3 mm.
• an alignment precision, particularly a contactless alignment precision, in the vertical direction can be 50 ⁇ or below, for example 1 ⁇ to 10 ⁇ , such as 5 ⁇ .
• a rotational alignment precision, particularly a contactless alignment precision can be 3° or below.
• one or more further active magnetic units 185' can provide a driving force as indicated by arrow 498.
• the controller controls the one or more further active magnetic units 185' to provide for an alignment in transport direction, for example the X-direction in FIG. 4B.
• an alignment of the carrier assembly in a transport direction can be provided with an alignment range extending along the length of the guiding structure.
• an alignment precision, particularly a contactless alignment precision, in the transport direction can be 50 ⁇ or below, for example 5 ⁇ or 30 ⁇ .
• FIG. 5 shows one embodiment of mask alignment, which can be combined with other embodiments of the present disclosure.
• the mask 512 shown in FIG. 5 is an edge exclusion mask.
• the edge exclusion mask covers a portion of the edge of the substrate 120 by providing an edge 514 of the mask 512.
• the width 516 of the portion of the substrate 120 can be 10 mm or below, for example 5 mm or below.
• An open area (or opening 518) is provided by the edge 514, i.e. is surrounded by the edge 514.
• the partition wall may optionally provided in the middle of the edge exclusion mask 512, such that there are two or more openings 518 surrounded by corresponding edges. Yet, the openings are not configured to define pattern features.
• the openings are configured to define areas of the substrate.
• the area of the opening 518 shown in FIG. 5 is at least 80% of the area of the substrate.
• each opening as an area of at least 0.1% of the substrate area.
• FIG. 5 shows a carrier assembly 110 having the substrate 120 supported thereon.
• the carrier assembly 110 and, thus, the substrate 120 can be aligned relative to the mask 512, and thus the edges 514 of the mask.
• the alignment of the carrier assembly and the mask is according to embodiments of the present disclosure is conducted by control of the active magnetic units, for example active magnetic units 175' of the guiding structure 170 and/or further active magnetic units 185' of the driving structure 180.
• the alignment precision utilizing alignment by active magnetic units can be sufficient for the desired precision of processing the substrate.
• the alignment of the substrate and the mask relative to each other is provided by active magnetic units of a substrate transportation system, which levitates the substrate, e.g. a substrate transportation system without mechanical contact.
• display manufacturing such as manufacturing of OLED displays, may include metallization processes, in which the conductive layer is provided over large areas on the substrate, for example areas corresponding to one or more openings 518 in FIG. 5.
• Metallization process can be conducted utilizing an edge exclusion mask 512.
• the alignment of the substrate and the mask relative to each other can be provided by active magnetic units of the guiding structure and/or active magnetic unit of the drive structure.
• the precision of the alignment with the active magnetic units e.g. a precision of 50 ⁇ or below can be sufficient for the metallization process.
• FIG. 6 shows a further embodiment of a mask alignment.
• FIG. 6 shows a shadow mask 612 including a plurality of small openings 614.
• the area of the openings i.e. the area of one feature of a pattern to be generated, can be 0.01% or below of the substrate area.
• FIG. 6 shows a carrier assembly 110 having the substrate 120 supported thereon.
• the pre-alignment can be conducted by control of active magnetic elements, for example active magnetic elements 175' of the guiding structure 170 and/or further active magnetic units 185 ' of the driving structure 180.
• a pre-alignment of the substrate and the mask relative to each other is provided by active magnetic elements of a substrate transportation system, which levitates the substrate, e.g. a substrate transportation system without mechanical contact.
• the pre-alignment can have a precision of 50 ⁇ or below.
• the precision of the pre-alignment allows for utilizing alignment actuators 630, for example piezoelectric actuators, such as piezoelectric alignment actuators, which reduce the complexity of an alignment unit or alignment system.
• an alignment unit or alignment system can include two or more, for example four alignment actuators.
• FIGS. 7 and 8 show schematic views of a holding arrangement 700 for supporting a substrate carrier 111 of a carrier assembly 110 and a mask carrier 740 during layer deposition in a processing chamber according to embodiments described herein.
• FIG. 8 shows a cross-sectional view of the holding arrangement 700 for supporting the substrate carrier 111 and the mask carrier 740 during layer deposition in a processing chamber according to embodiments described herein.
• FIG. 9 shows a schematic view of a holding arrangement having four alignment actuators.
• Alignment systems used on vertical-operated tools can work from outside of a processing chamber, i.e., from the atmospheric side.
• the alignment system can be connected to a substrate carrier and a mask carrier with stiff arms, e.g., extending through a wall of the processing chamber.
• a mechanical path between mask carrier or mask and substrate carrier or substrate is long, making the system susceptible to external interference (vibrations, heating, etc.) and tolerances.
• the present disclosure provides a holding arrangement with two or more alignment actuators, which provide a short connection path between the mask carrier and the substrate carrier.
• the holding arrangement according to the embodiments described herein is less susceptible to external interference, and a quality of the deposited layers can be improved.
• the holding arrangement 700 includes two or more alignment actuators connectable to at least one of the substrate carrier 111 and the mask carrier 740, wherein the holding arrangement 700 is configured to support the substrate carrier 111 in, or parallel to, a first plane, wherein a first alignment actuator 710 of the two or more alignment actuators is configured to move the carrier assembly and the mask carrier 740 relative to each other at least in a first direction Y, wherein a second alignment actuator 720 of the two or more alignment actuators is configured to move the carrier assembly and the mask carrier 740 relative to each other at least in the first direction Y and a second direction X different from the first direction Y, and wherein the first direction Y and the second direction X are in the first plane.
• the two or more alignment actuators can also be referred to as "alignment blocks”.
• a mask 725 can be attached to the mask carrier 740.
• the holding arrangement 700 is configured for supporting at least one of the substrate carrier 111 and the mask carrier 740 in a substantially vertical orientation, in particular during layer deposition.
• the substrate 120 can be aligned with respect to the mask carrier 740 or mask 725, and the quality of the deposited layers can be improved.
• the two or more alignment actuators can be connectable to at least one of the carrier assembly and the mask carrier 140.
• the two or more alignment actuators are connectable to the carrier assembly or substrate carrier 111, wherein the two or more alignment actuators are configured to move the substrate carrier 130 relative to the mask carrier 140.
• the mask carrier 140 can be in a fixed or stationary position.
• the two or more alignment actuators are connectable to the mask carrier 140, wherein the two or more alignment actuators are configured to move the mask carrier 140 relative to the substrate carrier 11.
• the substrate carrier 111 can be in a fixed or stationary position.
• the two or more alignment actuators include at least one of a third alignment actuator 930 and a fourth alignment actuator 940.
• the two or more alignment actuators are configured to move or align the carrier assembly or substrate carrier 111 or mask carrier 140 in, or parallel to, a first plane (e.g., in x-direction and y-direction), and are configured to adjust or change an angular position of the substrate carrier 130 or mask carrier 140 in, or parallel to, a first plane.
• a first plane e.g., in x-direction and y-direction
• At least one alignment actuator of the two or more alignment actuators is configured to move the substrate 120 and the mask carrier 140 relative to each other in a third direction Z, in particular wherein the third direction is substantially perpendicular to the first plane and/or a substrate surface 711.
• the first alignment actuator 710 and the second alignment actuator 720 are configured to move the substrate carrier 111 or mask carrier 140 in the third direction Z.
• a distance between the substrate 120 and the mask 725 can be adjusted by moving the carrier assembly or the substrate carrier 111 or the mask carrier 140 in the third direction Z.
• the distance between the substrate 120, or substrate carrier 111, and the mask 725 can be adjusted to be substantially constant in an area of a substrate surface 711 configured for layer deposition thereon.
• the distance can be less than 1 mm, specifically less than 500 micrometers, and more specifically less than 50 micrometers.
• the first alignment actuator 710 is floating with respect to the second direction X.
• the term "floating" may be understood as the first alignment actuator 710 allowing a movement of the substrate carrier 130 in the second direction X, e.g., driven by the second alignment actuator 720.
• the substrate carrier 111 can have a first edge portion 732 and a second edge portion 734.
• the first edge portion and the second edge portion can be located on opposing sides of the substrate carrier 111.
• a substrate area of the substrate carrier, in which the substrate 120 can be positioned, can be provided between the first edge portion 732 and the second edge portion 734.
• the first edge portion 732 can be an upper edge portion or top edge portion of the substrate carrier.
• the second edge portion 734 can be a lower edge portion or bottom edge portion of the substrate carrier.
• the first alignment actuator 710 and the second alignment actuator 720 are provided at the first edge portion 732 or the second edge portion 734.
• the first alignment actuator 710 and the second alignment actuator 720 can be provided in corners or corner regions of the substrate carrier 111 , for example, in corners or corner regions of the first edge portion 732 or the second edge portion 734.
• the two or more alignment actuators can be electric or pneumatic actuators.
• the two or more alignment actuators can for example be linear alignment actuators.
• the two or more alignment actuators can include at least one actuator selected from the group consisting of: a stepper actuator, a brushless actuator, a DC (direct current) actuator, a voice coil actuator, and a piezoelectric actuator.
• actuator can refer to motors, e.g., stepper motors.
• the two or more alignment actuators can be configured to move or position carrier assembly or the substrate carrier 111, correspondingly the substrate, with a precision of less than about plus/minus 1 micrometer.
• the two or more alignment actuators can be configured to move or position the substrate carrier 111 with a precision of about plus/minus 0.5 micrometer, and specifically about 0.1 micrometer, in at least one of the first direction Y, the second direction X, and the third direction Z.
• FIG. 10 shows a flowchart illustrating a method of contactless alignment of a carrier assembly according to embodiments of the present disclosure.
• the carrier assembly is levitated.
• active magnetic units 175' are activated and/or controlled by the controller 440 two provide a magnetic force counteracting the gravity force. The magnetic force serves for levitating the carrier assembly.
• Block 904 shows moving the carrier assembly for positioning the carrier assembly relative to a mask. According to embodiments described herein, the moving or movement of the carrier assembly is conducted while the carrier assembly is levitated.
• Block 906 shows aligning the carrier assembly relative to the mask. Accordingly, the movement of the carrier assembly is controlled to provide for positioning with a sufficient precision, i.e. an alignment, of the carrier assembly relative to the mask.
• the carrier assembly and/or the mask may be mechanically contacted, for example with alignment actuator, to provide a further mechanical alignment.
• the alignment shown in block 906 can be considered a pre-alignment.
• the transportation system or holding apparatus for a carrier assembly is configured for providing an alignment or, at least, a pre-alignment. Methods described herein provide a movement of the carrier assembly without mechanical contact, e.g. while being levitated, wherein a contactless transportation system allows for sufficient precision to align the substrate, for example a substrate supported by a carrier and/or being a portion of a carrier assembly, and a mask relative to each other.
• the precision can be 100 ⁇ below such as 50 ⁇ or below.
• the present disclosure have several advantages including avoiding separate alignment actuators for some applications or at least reducing the complexity of alignment actuators for many applications.
• An improved and/or more efficient alignment of the substrate relative to the mask can be provided. Accordingly, costs of ownership of processing systems can be reduced.
• some embodiments of the present disclosure allow for an increased throughput.
• Further advantages include inter alia a reduce particle generation in processing systems, for example deposition systems for large area substrates, such as utilized for OLED display manufacturing. For example, an improved purity and uniformity of the layers deposited on the substrate may be provided.

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• 2016
  • 2016-05-18 JP JP2017557376A patent/JP6585191B2/ja active Active
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  • 2016-05-18 WO PCT/EP2016/061142 patent/WO2017198298A1/en active Application Filing
  • 2016-05-18 CN CN201680027738.4A patent/CN109154062B/zh active Active
• 2017
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