WO2019192680A1

WO2019192680A1 - Apparatus for handling a carrier in a vacuum chamber, vacuum deposition system, and method of handling a carrier in a vacuum chamber

Info

Publication number: WO2019192680A1
Application number: PCT/EP2018/058471
Authority: WO
Inventors: Matthias HEYMANNS; Jens GRÖLS
Original assignee: Applied Materials, Inc.
Priority date: 2018-04-03
Filing date: 2018-04-03
Publication date: 2019-10-10
Also published as: JP2020518122A; KR20190116968A; CN110557952A; KR102215483B1

Abstract

An apparatus (100) for handling a carrier in a vacuum chamber is described. The apparatus (100) includes a vacuum chamber (101) having a wall (102) with an opening (106). A first driving unit (142) is arranged outside the vacuum chamber (101) and configured to move a first driven part (143) extending through the opening (106) into the vacuum chamber (101). A first component (150) for holding or moving a carrier (30) is attached to the first driven part (143) in the vacuum chamber (101). The first driven part (143) provides a first supply passage (147) for supplying the first component (150). Further, a vacuum deposition system and a method of handling a carrier are described.

Description

APPARATUS FOR HANDLING A CARRIER IN A VACUUM CHAMBER, VACUUM DEPOSITION SYSTEM, AND METHOD OF HANDLING A CARRIER

IN A VACUUM CHAMBER

FIELD

[0001] Embodiments of the present disclosure relate to an apparatus for handling a carrier in a vacuum chamber, a vacuum deposition system, and a method of handling a carrier in a vacuum chamber. In particular, embodiments of the present disclosure relate to holding or moving a carrier in a vacuum chamber. More specifically, embodiments of the present disclosure relate to holding a carrier and moving a carrier in an alignment direction in a vacuum chamber.

[0002] Embodiments of the present disclosure particularly relate to a vacuum deposition system for depositing a material on a substrate carried by a carrier, wherein the substrate is aligned with respect to a mask before the deposition. Methods and apparatuses described herein may be used in the manufacture of organic light-emitting diode (OLED) devices.

BACKGROUND

[0003] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates may be used in several applications and in several technical fields. For instance, coated substrates may be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used for the manufacture of television screens, computer monitors, mobile phones, other hand-held devices and the like, e.g. for displaying information. An OLED device, such as an OLED display, may include one or more layers of an organic material situated between two electrodes that are deposited on a substrate.

[0004] During the deposition of a coating material on a substrate, the substrate may be held by a substrate carrier, and a mask may be held by a mask carrier in front of the substrate. A material pattern, e.g. a plurality of pixels, corresponding to an opening pattern of the mask can be deposited on the substrate, e.g. by evaporation. [0005] The functionality of an OLED device typically depends on the accuracy of the coating pattern and the thickness of the organic material, which should be within a predetermined range. For obtaining high-resolution OLED devices, technical challenges with respect to the deposition of evaporated materials need to be mastered. In particular, an accurate and smooth transport of a substrate carrier carrying a substrate and/or of a mask carrier carrying a mask through a vacuum system is challenging. Further, a precise handling of the substrate carrier with respect to the mask carrier is important for achieving high quality deposition results, e.g. for producing high-resolution OLED devices. Further, it would be beneficial to supply the components for handling the carrier in a space-efficient or space-saving manner. Furthermore, an efficient utilization of the coating material is beneficial, and idle times of the system are to be kept as short as possible.

[0006] In view of the above, it would be beneficial to provide apparatuses, systems and methods for methods for accurately handling of carriers for carrying substrates and/or masks in a vacuum chamber. SUMMARY

[0007] In light of the above, an apparatus for handling a carrier in a vacuum chamber, a vacuum deposition system, and a method of handling a carrier in a vacuum chamber are provided. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings. [0008] According to one aspect of the present disclosure, an apparatus for handling a carrier in a vacuum chamber is provided. The apparatus includes a vacuum chamber having a wall with an opening. The apparatus further includes a first driving unit arranged outside the vacuum chamber and configured to move a first driven part extending through the opening into the vacuum chamber. The apparatus further includes a first component for holding or moving a carrier attached to the first driven part in the vacuum chamber. The first driven part provides a first supply passage for supplying the first component.

[0009] According to a further aspect of the present disclosure, a vacuum deposition system is provided. The vacuum deposition system includes the apparatus for handling a carrier according to embodiments described herein. The vacuum deposition system further includes a deposition source. The deposition source is provided in a deposition area of the vacuum chamber. The first component is configured for holding or moving the carrier in the deposition area.

[0010] According to a further aspect of the present disclosure, a method of handling a carrier in a vacuum chamber is provided. The vacuum chamber has a wall with an opening. A first driven part, which can be moved by a first driving unit, is arranged outside the vacuum chamber. The first driven part extends through the opening into the vacuum chamber. The method includes holding or moving a first carrier in the vacuum chamber with a first component attached to the first driven part. The method further includes supplying the first component with at least one of electric power or signals through a first supply passage provided in the first driven part.

[0011] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing the described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS [0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

Fig. 1 shows a schematic sectional view of an apparatus for handling a carrier according to embodiments described herein;

Fig. 2 shows a schematic sectional view of an apparatus for handling a carrier according to embodiments described herein; Fig. 3 shows a schematic sectional view of a vacuum deposition system including an apparatus for handling a carrier according to embodiments described herein in a first position; Fig. 4A shows the apparatus for handling the carrier of Fig. 3 in a second position;

Fig. 4B shows the apparatus for handling the carrier of Fig. 3 in a third position;

Fig. 5 shows a schematic sectional view of an apparatus for handling a carrier according to embodiments described herein;

Fig. 6 shows an exploded view of the apparatus for handling a carrier of Fig. 5;

Fig. 7 shows a perspective view of the apparatus for handling a carrier of Fig. 5; and

Fig. 8 is a flow diagram illustrating a method of handling a carrier in a vacuum chamber according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS [0013] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. [0014] Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0015] Fig. 1 is a schematic sectional view of an apparatus 100 for handling a carrier in a vacuum chamber 101 according to embodiments described herein.

[0016] According to the present disclosure,“handling a carrier” can for example include operations such as moving a carrier, holding a carrier or aligning a carrier. In embodiments of the present disclosure, the carrier described herein can be a substrate carrier configured to carry a substrate or can be a mask carrier configured to carry a mask or a shield. Fig. 1 exemplarily shows the carrier 30 as a substrate carrier carrying a substrate 11.

[0017] Generally speaking, the carrier described herein can be a substrate carrier or a mask carrier. Hereinafter, the term“first carrier” specifies the carrier as a substrate carrier configured to carry a substrate. The term“second carrier” specifies the carrier as a mask carrier configured to carry a mask. It is to be understood that the first carrier may be alternatively a mask carrier configured to carry a mask or a shield.

[0018] Generally speaking, the carrier may be movable along a transport path by a carrier transport system. In some embodiments, the carrier may be contactlessly held during the transport, e.g. by a magnetic levitation system. In particular, the carrier transport system may be a magnetic levitation system configured to contactlessly transport the carrier along the transport path in the vacuum chamber. The carrier transportation system may be configured to transport the carrier into a deposition area of the vacuum chamber in which the alignment system and a deposition source are arranged.

[0019] A“substrate carrier” relates to a carrier device configured to carry a substrate 11 in the vacuum chamber 101. For example, the substrate carrier can be configured to carry the substrate along a first transport path in a first direction. The substrate carrier may hold the substrate 11 during the deposition of a coating material on the substrate 11. In some embodiments, the substrate 11 may be held at the substrate carrier in a non-horizontal orientation, particularly in an essentially vertical orientation, e.g. during moving the carrier, transporting the carrier along a transportation path, aligning the carrier and/or during a deposition process. In the embodiment depicted in Fig. 1, the substrate 11 is held at the carrier 30 in an essentially vertical orientation. For example, an angle between the substrate surface and the gravity vector may be less than 10°, particularly less than 5°.

[0020] For example, the substrate 11 may be held at a holding surface of the carrier during the transport through the vacuum chamber 101. The carrier may include a carrier body with a holding surface configured to hold the substrate 11, particularly in a non horizontal orientation, more particularly in an essentially vertical orientation. In particular, the substrate 11 may be held at the carrier by a chucking device, e.g. by an electrostatic chuck (ESC) or by a magnetic chuck. The chucking device may be integrated in the carrier, e.g. in an atmospheric enclosure provided in the carrier.

[0021] A“mask carrier” as used herein relates to a carrier device configured to carry a mask for the transport of the mask along a mask transport path in the vacuum chamber. The mask carrier may carry the mask during transport, during alignment and/or during deposition on the substrate through the mask. In some embodiments, the mask may be held at the mask carrier in a non-horizontal orientation, particularly in an essentially vertical orientation during transport and/or alignment. The mask may be held at the mask carrier by a chucking device, e.g. a mechanical chuck such as a clamp, an electrostatic chuck or a magnetic chuck. Other types of chucking devices may be used which may be connected to or integrated in the mask carrier.

[0022] For instance, the mask may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask which is configured for masking one or more edge regions of the substrate, such that no material is deposited on the one or more edge regions during the coating of the substrate. A shadow mask is a mask configured for masking a plurality of features which are to be deposited on the substrate. For instance, the shadow mask can include a plurality of small openings, e.g. an opening pattern with 10.000 or more openings, particularly 1.000.000 or more openings.

[0023] An“essentially vertical orientation” as used herein may be understood as an orientation with a deviation of 10° or less, particularly 5° or less from a vertical orientation, i.e. from the gravity vector. For example, an angle between a main surface of a substrate (or mask) and the gravity vector may be between +10° and -10°, particularly between 0° and -5°. In some embodiments, the orientation of the substrate (or mask) may not be exactly vertical during transport and/or during deposition, but slightly inclined with respect to the vertical axis, e.g. by an inclination angle between 0° and -5°, particularly between -1° and -5°. A negative angle refers to an orientation of a substrate (or mask) wherein the substrate (or mask) is inclined downward. A deviation of the substrate orientation from a gravity vector during deposition may be beneficial and might result in a more stable deposition process, or a face down orientation might be suitable for reducing particles on the substrate during deposition. However, an exactly vertical orientation (+/- 1°) during transport and/or during deposition is also possible. In other embodiments, the substrates and masks may be transported in a non-vertical orientation, and/or the substrates may be coated in a non-vertical orientation, e.g. an essentially horizontal orientation.

[0024] As depicted in Fig. 1, a wall 102 of the vacuum chamber 101 has an opening 106. The vacuum chamber 101 is adapted to maintain a vacuum inside the vacuum chamber volume. An atmospheric environment 180, for example, an atmospheric environment with an atmospheric pressure of about 1 bar, may surround the vacuum chamber 101.

[0025] The apparatus 100 includes a first driving unit 142. In embodiments, the first driving unit 142 can include a linear actuator. The first driving unit 142 is arranged outside the vacuum chamber 101. The first driving unit 142 is configured to move a first driven part 143. For example, a linear movement may be transmitted to the first driven part 143 by the first driving unit 142. The first driving unit 142 may be a linear Z-actuator configured to move the first driven part 143 in a second direction Z.

[0026] The first driven part 143 extends through the opening 106 into the vacuum chamber 101. In other words, the first driven part 143 passes from outside of the vacuum chamber, e.g. from an atmospheric environment, through the wall 102 of the vacuum chamber 101. Accordingly, the first driven part 143 extending through the wall 102 is driven by the first driving unit 142 from outside the vacuum chamber 101. By driving the first driven part 143 from outside the vacuum chamber 101, maintenance and handling of the driving unit can be facilitated and the flexibility of the apparatus can be increased.

[0027] The opening 106 may be sealed with a flexible element, particularly with an axially deflectable element, e.g. a vacuum bellow, while allowing an axial movement of the first driven part 143. In particular, a portion of the first driven part 143 can be connected with the wall 102 of the vacuum chamber via the flexible element, such that the opening in the wall 102 through which the first driven part 143 extends is sealed in a vacuum-tight manner. [0028] When the first driving unit 142 for driving the first driven part 143 can be arranged outside the vacuum chamber, i.e. in the atmospheric environment 180 under atmospheric pressure, a non-vacuum compatible driving unit can be used which is typically more cost-efficient and easier to handle than a vacuum-compatible driving unit. Further, an arbitrary type of a first driving unit 142, e.g. including an electric motor or a stepper motor can be provided. The generation of particles inside the vacuum chamber by the driving unit which may include mechanical bearings can be avoided. Maintenance of the driving unit may be facilitated.

[0029] The apparatus 100 further includes a first component 150. The first component 150 is provided in the interior of the vacuum chamber 101, i.e. in the vacuum environment of the vacuum chamber volume. The first component 150 is configured to hold or to move the carrier 30. For example, the first component 150 may hold the carrier 30 during the deposition of a coating material on the substrate 11. In embodiments, the first component 150 can be configured to hold a mask carrier configured to carry a mask. In another example, the first component 150 may move the carrier in at least one direction, particularly in at least one alignment direction. The at least one alignment direction can be a direction for aligning the carrier prior to a deposition process.

[0030] The first component 150 is provided at the first driven part 143. In particular, the first component 150 can be attached to an end portion of the first driven part 143, as depicted in Fig. 1. The first component 150 may be attached to the first driven part 143 by one or more connecting elements. In some embodiments, the first component 150 is directly attached to the first driven part 143.

[0031] As the first component 150 is attached to the first driven part 143, the first component 150 can be moved together with the first driven part 143 by the first driving unit 142. When the first component 150 for holding or moving a carrier 30 is moved by a driving unit provided outside of the vacuum chamber 101, maintenance and service of the respective components can be facilitated which are easily accessible from outside.

[0032] The first driven part 143 provides a first supply passage 147. In particular, the first supply passage 147 can be provided in the interior of the first driven part 143. Accordingly, the first supply passage 147 can be formed by an inner volume of the first driven part 143. For example, the first supply passage 147 can extend from a first end portion of the first driven part 143 to a second end portion of the first driven part 143. The second end portion of the first driven part 143 may be opposite to the first end portion.

[0033] The first supply passage 147 is a first supply passage 147 for supplying the first component 150. Supplying the first component 150 can for example include supplying the first component 150 with at least one of electrical power or signals. In particular, one or more cables may extend through the first supply passage 147 to the first component 150 from outside the vacuum chamber, such that the first component 150 can be connected to a power supply and/or a controller provided outside the vacuum chamber. [0034] Thus, the first component 150, which is movable in a second direction Z via the first driving unit 142 can be supplied with electrical power and/or signals. For example, the first component 150 may include an alignment device 151 and/or a magnetic chuck which can be supplied with electrical power from outside the vacuum chamber through the first driven part 143. [0035] With the first supply passage 147 provided by the first driven part 143, the first component 150 provided inside the vacuum chamber can be supplied from outside the vacuum chamber. As the first component 150 is attached to the first driven part 143, the first component 150 can also be moved together with the first driven part 143 by the first driving unit 142. Accordingly, the first driven part 143 may be used both for supplying and moving the first component 150. Accordingly, a separate cable feedthrough in the vacuum chamber wall for supplying the first component may be omitted. This may reduce the costs of an apparatus for handling a carrier.

[0036] According to some embodiments of the present disclosure, which can be combined with embodiments described herein, the first driven part includes a hollow shaft configured to feed at least one of a power cable and a signal cable to the first component 150 from outside the vacuum chamber.

[0037] The at least one of a power cable and a signal cable shown in Fig. 1 is connected to the first component 150 which is provided inside the vacuum chamber 101. Hereinafter, the at least one of a power cable and a signal cable is also termed simply as a“cable” or a “cable 161”. The cable 161 can be connected to the first component 150 via a connection socket. The connection socket may be provided at a housing of the first component 150. In some embodiments, the connection socket is provided inside the housing of the first component 150. As illustratively shown in Fig. 1, the cable 161 can extend into the interior of the first component 150.

[0038] According to embodiments, which can be combined with some embodiments described herein, the first supply passage 147 provides a fluid connection between an interior of the first component 150 and an atmospheric environment 180 outside the vacuum chamber. For example, a fluid connection can be provided between the interior of the housing of the first component 150 and the atmospheric environment.

[0039] When the interior of first component 150 is adapted to be operated in an atmospheric environment, the first component 150 can be supplied through the first supply passage 147. For example, an electronic device or an electromagnet unit may not be adapted to be operated under vacuum conditions. In this case, the electromagnet unit would be provided in an atmospheric enclosure of the first component, in particular a vacuum- tight enclosure, inside the vacuum chamber for operating properly. Accordingly, an atmospheric environment can be provided inside the first component 150 through the first supply passage 147. In this case, the first component can be supplied by non-vacuum compatible equipment, e.g. non-vacuum compatible electrical cabling. Acquisition costs and/or maintenance costs may be reduced. Further, particle generation in the vacuum chamber may be reduced as the electrical cabling, e.g. the cable 161, is not exposed to the vacuum environment inside the vacuum chamber 101. Further, a contamination of the vacuum environment in the vacuum chamber can be reduced or avoided by supplying the first component through the first supply passage, e.g. when the interior of the first component 150 or electronic devices arranged therein are not vacuum-compatible. [0040] In embodiments, a flexible element, in particular an axially expendable element, is provided at the opening 106 of the wall 102, through which the first driven part 143 passes, in a vacuum-tight manner. The longitudinal axis of the axially expandable element may extend in a second direction Z. For example, an expandable element such as a bellow element can connect a portion of the first driven part with the wall 102 such that an opening in the wall 102 through which the first driven part 143 extends is closed in a vacuum-tight manner.

[0041] In embodiments of the present disclosure, which can be combined with embodiments described herein, the first driving unit can move the first driven part in the second direction Z. The second direction can be substantially perpendicular to the wall, e.g. the side wall, of the vacuum chamber and/or can be substantially perpendicular to the transport path of the carrier transport system.

[0042] According to some embodiments of the present disclosure, which can be combined with embodiments described herein, the first component 150 can be a mount, particularly a magnetic mount configured to hold the carrier. The magnetic mount may hold the carrier by exerting an attractive magnetic force on the carrier. In some embodiments, the first component can be a magnetic mount with an electropermanent magnet. The cable 161 may be a power cable supplying an electromagnet of the mount with electric power and/or a signal cable configured to control the magnetic mount. The electromagnet may be provided at an atmospheric pressure inside a housing of the magnetic mount.

[0043] In some embodiments, the first component 150 is an alignment device. In particular, the alignment device can include a piezo actuator configured to move the carrier in at least one alignment direction. In some embodiments, the piezo actuator can be further configured to move the carrier in a second alignment direction transverse to the first alignment direction and/or in a third alignment direction transverse to the first and second alignment directions.

[0044] The term “aligning” refers to a positioning of the carrier exactly at a predetermined position in the vacuum chamber, particularly at a predetermined position relative to a second carrier. The carrier can be aligned in at least one alignment direction, particularly in two or three alignment directions which may be essentially perpendicular with respect to each other

[0045] According to embodiments of the present disclosure, which can be combined with embodiments described herein, the apparatus of handling a carrier in a vacuum chamber can include a second driving unit arranged outside the vacuum chamber. The second driving unit can be configured to move a second driven part extending through the opening into the vacuum chamber. The apparatus can further include a second component for holding or moving a carrier attached to the second driven part in the vacuum chamber. In embodiments, the second driven part can provide a second supply passage for supplying the second component.

[0046] Fig. 2 is a schematic sectional view of an apparatus 200 for handling a carrier in a vacuum chamber 101 according to embodiments described herein. The apparatus 200 is similar to the apparatus 100 shown in Fig. 1, such that reference can be made to the above explanations, which are not repeated here.

[0047] The apparatus 200 includes a first component 150 for holding or moving a first carrier 10 and a second component 155 for holding or moving a second carrier 20. The first component 150 is configured for holding or moving the first carrier 10. The second component 155 is configured for holding or moving the second carrier 20. The apparatus 200 shown in Fig. 2 further includes a second driving unit 145 arranged outside the vacuum chamber 101. The second driving unit 145 is configured to move a second driven part 146.

[0048] Hereinafter, an assembly including the first driving unit 142 and the first driven part 143 is sometimes referred to as a“first shifting device 141”. Similarly, an assembly including the second driving unit 145 and the second driven part 146 is sometimes referred to as a“second shifting device 144”. A system configured to align the first carrier 10, particularly with respect to the second carrier 20, is hereinafter sometimes referred to as an “alignment system 130”. The alignment system 130 includes the first driving unit 142 and the first driven part 143, wherein the first component 150 for holding or moving the first carrier is provided at the first driven part 143. The alignment system 130 may further include the second driving unit 145 and the second driven part 146 as well as the second component 155 for holding or moving the second carrier provided at the second driven part 146.

[0049] In Fig. 2, the second component 155 is attached to the second driven part 146. Similar to the first driven part 143, the second driven part 146 can provide a supply passage, i.e. a second supply passage 149 as shown in Fig. 2, for supplying the second component 155, particularly with at least one of electrical power and signals.

[0050] In some embodiments, the second driven part 146 is configured to feed a supply element such as a cable to a component arranged inside the vacuum chamber, e.g. to a component provided at an end portion of the second driven part 146 inside the vacuum chamber. For example, the second component 155 for holding or moving the second carrier 20 can be supplied with electrical power from outside the vacuum chamber through the driven part 146.

[0051] In embodiments, the second driven part 146 includes a hollow shaft configured to feed at least one of a power cable and a signal cable to the second component 155 from outside the vacuum chamber 101.

[0052] According to some embodiments of the present disclosure, which can be combined with embodiments described herein, the apparatus 200 can include a vacuum feedthrough 170 in the first supply passage 147. The vacuum feedthrough 170 can be configured to separate a vacuum environment in an interior of the first component 150 from an atmospheric environment 180 outside the vacuum chamber 101.

[0053] According to some embodiments of the present disclosure, which can be combined with embodiments described herein, an interior of the first component can be configured for a vacuum environment, and a vacuum feedthrough is provided in a first supply passage. Additionally or alternatively, an interior of the second component is configured for an atmospheric environment, and the second supply passage provides a fluid connection between the interior of the second component and the atmospheric environment outside the vacuum chamber.

[0054] According to embodiments of the present disclosure, which can be combined with embodiments described herein, the first component 150 can be the alignment device configured to move the first carrier in at least one alignment direction, and the second component 155 can be the magnetic mount configured to hold the second carrier next to the first carrier. In particular, the first component 150 may include one or more piezoelectric actuators for aligning the first carrier 10 in one or more alignment directions, and the second component 155 may include a mount, particularly a magnetic mount, configured for holding the second carrier 20 at the second component 155. The one or more piezoelectric actuators may be supplied with one or more cables extending through the first supply passage 147, and the magnetic mount for holding the second carrier may be supplied with one or more cables extending through the second supply passage 149. [0055] In some embodiments, the apparatus 200 can further include a third component

157 for holding or moving a carrier. In Fig. 2, the third component 157 is configured to hold the first carrier 10 at the first component 150. In particular, the third component 157 may be a magnetic mount configured to hold the first carrier 10 at the alignment device.

[0056] The apparatus 200 can include a cable feedthrough 109 in the wall 102 of the vacuum chamber 101 for supplying the third component 157. In embodiments, the third component 157 can be a magnetic mount configured to hold the carrier, the first carrier 10, at the first component 150. The first component 150 may be the alignment device configured to align the first carrier 10 and the third component 157 may be configured to hold the first carrier 10 at the alignment device. [0057] The first driven part 143 and the second driven part 146 may extend through the same opening provided in a side wall of the vacuum chamber. The opening may be vacuum-sealed by a flexible element, particularly a bellow element.

[0058] Fig. 3 is a schematic sectional view of a vacuum deposition system 350. The vacuum deposition system includes an apparatus 300 for handling a carrier in a vacuum chamber 101 according to embodiments described herein. The apparatus 300 is similar to the apparatus 200 shown in FIG. 2, such that reference can be made to the above explanations, which are not repeated here and only the differences will be discussed in the following. [0059] In Fig. 3, the first component is an alignment device 151, in particular, an alignment device including at least one piezo actuator. The second component is the magnetic mount 152 configured to hold the second carrier 20. The magnetic mount 152 includes an atmospheric enclosure provided in the interior of the magnetic mount 152. In particular, the interior of the magnetic mount 152 is in fluid connection with the atmospheric environment 180 through the second supply passage 149. Accordingly, the magnetic mount 152 can be supplied from outside of the vacuum chamber, while maintaining the atmospheric condition in the interior of the magnetic mount 152.

[0060] As shown in Fig. 3, a cable 163, which can be a power cable or a signal cable, passes through the second supply passage 149 from outside the vacuum chamber to the interior of the magnetic mount 152.

[0061] In embodiments, the alignment device 151 can be adapted to operate under vacuum conditions, i.e. the alignment device 151 can be vacuum compatible. The interior of the alignment device 151 may be exposed to the vacuum of the vacuum chamber 101. By providing the vacuum feedthrough 170 in the first supply passage 147, the vacuum environment in the interior of the alignment device 151 can be separated from the atmospheric environment 180 outside the vacuum chamber. Accordingly, the alignment device 151 can be supplied by a power and/or signal cable from outside, while the vacuum environment in the interior of the alignment device 151 can be maintained.

[0062] In embodiments, the apparatus for handling a carrier can include a third component for holding or moving the first carrier. In Fig. 3, the third component is a magnetic mount, which may be similar to the magnetic mount 152 described above and only the differences with respect to the magnetic mount 152 will be described. In the following, the third component is referred to as the“first mount 153”, and the magnetic mount 152 is referred to as the“second mount 152”.

[0063] The first mount 153 is typically configured to hold the first carrier 10. In particular, the first mount 153 can be configured to hold the first carrier 10 at the alignment device 151. More particularly, the first mount 153 is connected to the alignment device 151. Accordingly, the first mount 153 can be moved together with the alignment device 151 by the first driving unit 142. [0064] In embodiments, an atmospheric enclosure is provided in the interior of the first mount 153. The interior of the first mount 153 is typically sealed in a vacuum-tight manner in order to maintain the atmospheric pressure in the interior of the first mount 153.

[0065] As described herein, the second mount 152 can be supplied through the second supply passage 149. In embodiments, the first mount 153 is supplied by a power or signal cable 165 fed through the cable feedthrough 109. The power cable or signal cable 165 can be fed through the cable feedthrough 109 into the interior of the vacuum chamber 101. The power or signal cable 165 can supply the first mount 153 via a connection box of the first mount 153. The first mount 153 and in particular the connection box are typically configured to seal the interior of the first mount 153, such that the power cable or signal cable 165 can be connected from the vacuum environment in the vacuum chamber 101 with the interior of the first mount 153 while maintaining the atmospheric pressure in the interior of the first mount 153.

[0066] According to embodiments of the present disclosure, which can be combined with embodiments described herein, the power or signal cable 165 is an electrical cabling with a material for use in vacuum environments. For example, the power or signal cable 165 can be an in-vacuum cable such as a copper wire with vacuum compatible insulation. In particular, the power or signal cable 165 can be an electrical cabling with a low rate of outgassing. [0067] The vacuum deposition system may be configured to deposit one or more materials on a substrate carried by the first carrier 10. A deposition source 105, particularly a vapor source configured to evaporate an organic material, may be provided in the vacuum chamber. The deposition source 105 may be arranged such that a material can be directed from the deposition source 105 toward the first carrier 10 that is mounted to the first mount 153.

[0068] The vacuum deposition system 350 includes a deposition source 105 provided in a deposition area of the vacuum chamber 101. In some embodiments, the first component is configured for holding or moving the carrier in the deposition area. [0069] The vacuum deposition system 350 may be a vacuum deposition system configured to deposit one or more materials on a substrate carried by the first carrier 10.

[0070] A deposition source 105, particularly a vapor source configured to evaporate an organic material, may be provided in the vacuum chamber. The deposition source 105 may be arranged such that a material can be directed from the deposition source 105 toward the first carrier 10 that is mounted to the first mount 153 of the alignment system.

[0071] Alternatively or additionally, the deposition source may include a rotatable distribution pipe provided with vapor outlets. The distribution pipe may extend essentially in a vertical direction and may be rotatable around an essentially vertical rotation axis. The deposition material may be evaporated in a crucible of the evaporation source and may be directed toward the substrate through the vapor outlets which are provided in the distribution pipe.

[0072] In particular, the deposition source 105 may be provided as a line source extending in an essentially vertical direction. The height of the deposition source 105 in the vertical direction may be adapted to a height of the vertically oriented substrate such that the substrate can be coated by moving the deposition source 105 past the substrate in a first direction X.

[0073] In Fig. 3, the first carrier 10 is a substrate carrier which carries a substrate 11 to be coated, and the second carrier 20 is a mask carrier which carries a mask 21 to be arranged in front of the substrate 11 during deposition. The first carrier 10 and the second carrier 20 can be aligned relative to each other with the first shifting device 141, such that an evaporated material can be deposited exactly in a predetermined pattern on the substrate as defined by the mask.

[0074] In particular, the second carrier 20 which is mounted to the second mount 152 can be moved to a predetermined position in the second direction Z with the second shifting device 144. The first carrier 10 can be moved to a predetermined position adjacent to the second carrier 20 in the second direction Z with the first shifting device 141. The first carrier 10 can then be aligned with the alignment device 151 in the alignment direction, particularly in the second direction Z, and/or optionally in one or more further alignment directions.

[0075] In some embodiments, which may be combined with other embodiments described herein, the alignment system 130 extends through a wall 102, in particular a side wall, of the vacuum chamber 101 and is flexibly connected to the side wall via a vibration isolation element 103 for providing a vibration isolation between the alignment system 130 and the side wall. The vibration isolation element may be an axially expandable element such as a bellow element.

[0076] According to some embodiments, which can be combined with embodiments described herein, the apparatus for handling a carrier can include a carrier transport system configured to transport the carrier in the vacuum chamber in a first direction X. The first driving unit can be configured to move the first driven part in a second direction Z transverse to the first direction.

[0077] The apparatus 300 shown in Fig. 3 includes a first carrier transport system 120 configured to transport a first carrier along the first transport path in the first direction X.

The second direction Z may be essentially perpendicular to the first direction X along which the first carrier is transported by the first carrier transport system 120. After the transport of the first carrier in the first direction X, the first carrier can be mounted to the first mount 153 and be shifted in the second direction Z away from the first transport path, e.g. toward the deposition source 105 or toward the second carrier 20 carrying a mask.

[0078] The first carrier transport system 120 may include a magnetic levitation system with at least one magnet unit 121, particularly with at least one actively controlled magnet unit configured to contactlessly hold the first carrier 10 at a guiding structure.

[0079] In some embodiments, the at least one alignment direction may essentially correspond to the second direction Z. Accordingly, the first carrier can be moved in the second direction Z by the first shifting device 141 and by the alignment device 151. The first shifting device 141 may be configured to perform a coarse positioning of the first carrier in the second direction Z, and the alignment device 151 may be configured to perform a fine alignment of the first carrier in the second direction Z. [0080] In some embodiments, the alignment device 151 is configured to move the second mount 152 in the second direction Z, and optionally in at least one of the first direction X and a third direction Y transverse to the first and second direction. The third direction Y may be an essentially vertical direction. Accordingly, the first carrier can be exactly positioned by the alignment device 151 in the first direction X, the second direction Z and/or the third direction Y. In other embodiments, the alignment device 151 can move the first mount 153 only in two directions, e.g. in the second direction Z and in the third direction Y. In further embodiments, the alignment device 151 can move the first mount 153 only in one direction, particularly in the second direction Z.

[0081] The alignment device 151 and the first mount 153 may be fixed to the driven part 143 of the first shifting device 141, such that the alignment device 151 and the first mount 153 can be moved by the first shifting device 141 in the second direction Z. The first shifting device 141 includes a first driving unit 142 and a first driven part 143 that can be moved by the first driving unit 142 in the second direction Z. The alignment device 151 together with the first mount 153 may be provided at the driven part 143, e.g. at a front end of the driven part 143 such as to be movable together with the driven part 143 in the second direction Z. The driven part 143 may comprise a linearly extending bar or arm extending from outside the vacuum chamber into the vacuum chamber in the second direction Z and can be moved by the first driving unit 142.

[0082] In some embodiments, which can be combined with other embodiments described herein, the first driving unit 142 of the first shifting device 141 may include a linear actuator configured to move the driven part 143 in the second direction Z by a distance of 10 mm or more, particularly 20 mm or more, more particularly 30 mm or more. For example, the first driving unit 142 may include a mechanical actuator, an electro- mechanical actuator, e.g. a stepper motor, an electric motor, a hydraulic actuator and/or a pneumatic actuator configured to move the driven part 143 in the second direction Z by a distance of 10 mm or more.

[0083] In some embodiments, which may be combined with other embodiments described herein, the alignment device 151 may include at least one precision actuator, e.g. at least one piezo actuator, configured to move the first mount in the at least one alignment direction. In particular, the alignment device 151 includes two or three piezo actuators configured to move the first mount in two or three alignment directions. The piezo actuator of the alignment device 151 may be configured to move the first mount 153 in the second direction Z, and optionally in the first direction X and/or in the third direction Y. The alignment device 151 may be configured for a fine positioning (or fine alignment) of the first mount 153 having the first carrier 10 mounted thereon in the at least one alignment direction. For example, the alignment device may be configured for a positioning of the first carrier with a sub-5 -pm accuracy, particularly with a sub-pm accuracy. Accordingly, by having the alignment device 151 together with the first mount 153 provided at the driven part 143 of the first shifting device, a coarse positioning of the first mount can be performed by the first shifting device 141, and a fine positioning of the first mount can be provided by the alignment device 151.

[0084] In some embodiments, which may be combined with other embodiments described herein, the first mount 153 includes a magnetic chuck configured to magnetically hold the first carrier 10 at the first mount 153. For example, the first mount 153 may include an electropermanent magnet device configured to magnetically hold the first carrier at the first mount. An electropermanent magnet device can be switched between a holding state and a releasing state by applying an electric pulse to a coil of the electropermanent magnet device. In particular, a magnetization of at least one magnet of the electropermanent magnet device can be changed by applying the electric pulse.

[0085] The alignment system 130 shown in Fig. 3 may be (rigidly) fixed to a support 110 that is provided in the vacuum chamber, e.g. attached to the top wall of the vacuum chamber. In some embodiments, which may be combined with other embodiments described herein, the support 110 extends in the first direction X and carries or supports the at least one magnet unit 121 of the first carrier transport system 120. Accordingly, both the at least one magnet unit 121 and the alignment system 130 are fixed to the same mechanical support inside the vacuum chamber, such that vibrations or other movements of the vacuum chamber are transferred to the alignment system 130 and to the levitation magnets of the magnetic levitation system to the same extent. The alignment accuracy can be further improved and the carrier transport can be facilitated.

[0086] In some embodiments, the deposition source 105 may include a distribution pipe with a plurality of vapor openings or nozzles for directing the coating material into the deposition area. Further, the deposition source may include a crucible configured for heating and evaporating the coating material. The crucible may be connected to the distribution pipe such as to be in fluid communication with the distribution pipe.

[0087] In some embodiments, which may be combined with other embodiments described herein, the deposition source may be rotatable. For example, the deposition source may be rotatable from a first orientation in which the vapor openings of the deposition source are directed toward the deposition area to a second orientation in which the vapor openings are directed toward a second deposition area. The deposition area and the second deposition area may be located on opposite sides of the deposition source, and the deposition source may be rotatable by an angle of about 180° between the deposition area and the second deposition area.

[0088] The first carrier transport system 120 may be configured for a contactless transport of the first carrier 10 in the vacuum chamber 101. For example, the first carrier transport system 120 may hold and transport the first carrier 10 by magnetic forces. In particular, the first carrier transport system 120 may include a magnetic levitation system.

[0089] In the exemplary embodiment of Fig. 3, the first carrier transport system 120 includes at least one magnet unit 121 arranged at least partially above the first carrier 10 and configured to carry at least a part of the weight of the first carrier 10. The at least one magnet unit 121 may include an actively controlled magnet unit configured to contactlessly hold the first carrier 10. The first carrier transport system 120 may further include a drive device configured to contactlessly move the first carrier 10 in the first direction X. In some embodiments, the drive device may be arranged at least partially below the first carrier 10. The drive device may include a drive such as a linear motor configured to move the first carrier by applying a magnetic force on the first carrier (not depicted).

[0090] In some embodiments, the alignment system 130 comprises a main body 131 which is fixed to a support 110 provided inside the vacuum chamber. The first driving unit 142 of the first shifting device 141 and the second driving unit 145 of the second shifting device 144 may be fixed to the main body 131 of the alignment system 130. The main body 131 of the alignment system 130 may provide a feed-through through the wall 102 for the driven part 143 of the first shifting device and for the second driven part 146 of the second shifting device. The main body 131 of the alignment system 130 may be flexibly connected to the wall 102 of the vacuum chamber 101 via the vibration isolation element 103.

[0091] The main body 131 of the alignment system 130 may be fixed to the support 110. The support 110 may be (directly or indirectly) fixed to a top wall of the vacuum chamber and/or may be provided as a support rail or support girder which may extend in the first direction X. The top wall of the vacuum chamber is typically more strongly reinforced and less movable than the vertically extending side walls.

[0092] In some embodiments, which may be combined with other embodiments described herein, the first carrier transportation system 120 may be provided for transporting the first carrier along a first transport path in the first direction X, and a second carrier transportation system 122 may be provided for transporting the second carrier 20 along a second transport path parallel to the first transport path in the first direction X. The first carrier transportation system 120 and/or the second carrier transportation system 122 may be configured as magnetic levitation systems for a contactless carrier transport. In particular, the first carrier transportation system 120 may include at least one magnet unit 121, particularly an actively controlled magnet unit, for contactlessly holding the first carrier 10. The second carrier transportation system 122 may include at least one second magnet unit 123, particularly an actively controlled magnet unit, for contactlessly holding the second carrier 20. Typically, each magnetic levitation system includes a plurality of actively controlled magnet units which may be arranged along the first direction X at an essentially equal spacing. For example, the actively controlled magnet units may be fixed to the support 110.

[0093] In Fig. 3, the first carrier 10 and the second carrier 20 are contactlessly held by actively controlled magnet units of the first carrier transportation system 120 and the second carrier transportation system 122. The first mount 153 is provided at a distance from the first carrier 10 in the second direction Z, and the second mount 152 is provided at a distance from the second carrier 20 in the second direction Z.

[0094] Fig. 4A shows the apparatus 300 of FIG. 3 in a second position. The second carrier 20 has been mounted to the second mount 152 by moving the second mount to the second carrier 20 in the second direction Z and magnetically attaching the second carrier 20 to the second mount 152. The second carrier 20 is then moved by the second shifting device 144 in the second direction Z to a predetermined position, e.g. by a distance of 20 mm or more. In particular, the mask 21 that is carried by the second carrier 20 is positioned at a predetermined position facing the deposition source 105.

[0095] As is further depicted in Fig. 4A, the first carrier 10 carrying the substrate 11 is transported by the first carrier transport system 120 into the deposition area, and the first mount 153 is mounted to the first carrier by moving the first mount 153 to the first carrier 10 with the first shifting device 141. [0096] As is schematically depicted in Fig. 4B, the first carrier 10 is then moved in the second direction Z toward the second carrier 20 by the first shifting device 141 until the substrate 11 is positioned close to the mask 21. Subsequently, the first carrier 10 is aligned in at least one alignment direction, particularly in the second direction Z, with the alignment device 151. The first carrier 10 may be positioned exactly at a predetermined position by the alignment device 151 which may include one or more piezo actuators.

[0097] One or more materials can be deposited on the substrate 11 by the deposition source 105 through the openings of the mask 21. An accurate material pattern can be deposited on the substrate.

[0098] FIG. 5 is a sectional view of an apparatus 400 for handling a carrier according to embodiments described herein. FIG. 6 is an exploded view of the alignment system 130 of the apparatus 400 of FIG. 5. FIG. 7 is a perspective view of the alignment system 130 of the apparatus 400 of FIG. 5. The apparatus 400 is similar to the apparatus 300 shown in FIG. 3, such that reference can be made to the above explanations, which are not repeated here. [0099] A first driving unit 142 (e.g. a first Z-actuator) and a second driving unit 145 (e.g. a second Z-actuator) are provided outside the vacuum chamber 101. The first and the second driving unit are fixed to the main body 131. In some embodiments, the main body 131 is rigidly fixed to a support inside the vacuum chamber (not depicted in Fig. 5), e.g. via screws or bolts 108, and flexibly connected to the wall 102. [00100] The first driving unit 142 is configured to move the first driven part 143 which extends through the main body 131 into the vacuum chamber in the second direction Z, and the second driving unit 145 is configured to move the second driven part 146 which extends through the main body 131 into the vacuum chamber in the second direction Z. The second mount 152 for mounting a first carrier to the alignment system is provided at a front end of the first driven part 143, and a first mount 153 for mounting a second carrier to the alignment system is provided at a front end of the second driven part 146. Accordingly, the second mount 152 and the first mount 153 can be moved independently of each other in the second direction Z by the respective shifting device, in order to position the first and second carriers at respective predetermined positions in the second direction Z.

[00101] The second driven part 146 protrudes further into the vacuum chamber than the first driven part 143, such that the first carrier and the second carrier can be held adjacent to each other at the first mount and the second mount which are provided at the front ends of the driven parts.

[00102] The first mount 153 is connected to the first driven part 143 via an alignment device 151, particularly including at least one piezo actuator. Accordingly, a fine positioning (or fine alignment) of the first carrier with respect to the second carrier can be performed by accurately positioning the first mount 153 at a predetermined position with the alignment device 151.

[00103] In Fig. 7, a small gap is provided between the main body 131 of the alignment system 130 and the wall 102 of the vacuum chamber such that the main body 131 does not move together with the wall 102, e.g. when the side wall vibrates or when the side wall moves due to a pressure change inside the vacuum chamber.

[00104] In some embodiments, the apparatus includes two or more alignment systems in the deposition area which are spaced-apart from each other in the first direction X. Each alignment system may be configured in accordance with the alignment system 130 according to embodiments described herein. For example, a second mount of a first alignment system may be configured to hold an upper front part of the first carrier, and a first mount of a second alignment system may be configured to hold an upper rear part of the first carrier. Each alignment system may extend through the side wall of the vacuum chamber, such that the respective driving units of the respective shifting devices are positioned outside the vacuum chamber. Further, each alignment system may be flexibly connected to the side wall of the vacuum system via a respective vibration isolation element. In some embodiments, each alignment system is mechanically fixed to the same support that is provided inside the vacuum chamber, e.g. fixed to the top wall of the vacuum chamber.

[00105] The alignment device of the first alignment system may be configured to align the first carrier in the first direction X, the second direction Z, and the third direction Y, and the alignment device of the second alignment system may be configured to align the first carrier in the first direction Z and in the third direction Y. Further alignment systems with further alignment devices may be provided. Accordingly, the first carrier, being a three-dimensional object, can be positioned and rotated exactly to a predetermined translational and rotational position in the deposition area with respect to the second carrier. [00106] Fig. 8 is a flow diagram illustrating a method of handling a carrier in a vacuum chamber according to embodiments described herein.

[00107] In box 720, a first carrier is moved in the vacuum chamber 101 with a first component attached to a first driven part. The first component may be an alignment device, particularly including one or more piezoelectric actuators for aligning the first carrier in one or more alignment directions. The vacuum chamber 101 has a wall with an opening. The first driven part can be moved by a first driving unit arranged outside the vacuum chamber and extends through the opening into the vacuum chamber. The first carrier may be a substrate carrier.

In box 720, the substrate carrier may be aligned relative to a second carrier holding a mask with the first component. The first component is supplied with at least one of electric power or signals through a first supply passage provided in the first driven part.

[00108] In optional box 710, a second carrier is held in the vacuum chamber with a second component attached at a second driven part. The second driven part can be moved by a second driving unit arranged outside the vacuum chamber, and the second driven part extends through the same opening as the first driven part into the vacuum chamber 101. The second carrier may be a mask carrier which may be held at the second component by magnetic forces.

The second component is supplied with at least one of electric power or signals through a second supply passage provided in the second driven part. The second component can be a magnetic mount.

[00109] The apparatus described herein can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices. For example, the deposition source can be an evaporation source, particularly an evaporation source for depositing one or more organic materials on a substrate to form a layer of an OLED device.

[00110] The embodiments described herein can be utilized for evaporation on large area substrates, e.g., for OLED display manufacturing. Specifically, the substrates for which the structures and methods according to embodiments described herein are provided, are large area substrates, e.g. having a surface area of 0.5 m² or more, particularly 1 m² or more. For instance, a large area substrate or carrier can be GEN 4.5, which corresponds to a surface area of about 0.67 m² (0.73 x 0.92m), GEN 5, which corresponds to a surface area of about

1.4 m² (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m² (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7m² (2.2 m x

2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m² (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half sizes of the GEN generations may also be provided in OLED display manufacturing.

[00111] According to some embodiments, which can be combined with other embodiments described herein, the substrate thickness can be from 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or below, such as 0.5 mm. The term“substrate” as used herein may particularly embrace substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. However, the present disclosure is not limited thereto, and the term“substrate” may also embrace flexible substrates such as a web or a foil. The term“substantially inflexible” is understood to distinguish over“flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.9 mm or below, such as 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[00112] According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass, and the like), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process. [00113] According to embodiments described herein, the method for transporting and aligning of a substrate carrier and a mask carrier in a vacuum chamber can be conducted use computer programs, software, computer software products and the interrelated controllers, which can have a CPU, a memory, a user interface, and input and output devices being in communication with the corresponding components of the apparatus. [00114] In some embodiments, the mask carriers and the substrate carriers may be differently sized. For example, the mask carriers may be larger than the substrate carriers, particularly in a vertical direction, as is schematically depicted in Fig. 3.

[00115] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. An apparatus (100) for handling a carrier in a vacuum chamber, comprising: a vacuum chamber (101) having a wall (102) with an opening (106); a first driving unit (142) arranged outside the vacuum chamber (101) and configured to move a first driven part (143) extending through the opening (106) into the vacuum chamber (101); and a first component (150) for holding or moving a carrier attached to the first driven part (143) in the vacuum chamber (101), the first driven part (143) providing a first supply passage (147) for supplying the first component (150). 2. The apparatus of claim 1, wherein the first component (150) is a magnetic mount configured to hold the carrier, particularly a magnetic mount with an electropermanent magnet.

3. The apparatus of claim 1, wherein the first component (150) is an alignment device (151), particularly a piezo actuator, configured to move the carrier in at least one alignment direction.

4. The apparatus according to any of claims 1 to 3, wherein the first driven part (143) comprises a hollow shaft configured to feed at least one of a power cable and a signal cable (161, 163) to the first component (150) from outside the vacuum chamber (101).

5. The apparatus according to any of claims 1 to 4, further comprising a vacuum feedthrough (170) in the first supply passage (147) configured to separate a vacuum environment in an interior of the first component (150) from an atmospheric environment (180) outside the vacuum chamber (101).

6. The apparatus according to any of claims 1 to 4, wherein the first supply passage (147) provides a fluid connection between an interior of the first component (150) and an atmospheric environment (180) outside the vacuum chamber.

7. The apparatus of any of claims 1 to 6, further comprising: a second driving unit (145) arranged outside the vacuum chamber (101) and configured to move a second driven part (146) extending through the opening (106) into the vacuum chamber (101); and a second component (155) for holding or moving a carrier attached to the second driven part (146) in the vacuum chamber (101), the second driven part (146) providing a second supply passage (149) for supplying the second component (155).

8. The apparatus according to claim 7, wherein the second driven part (146) comprises a hollow shaft configured to feed at least one of a power cable and a signal cable (161, 163) to the second component (155) from outside the vacuum chamber (101). 9. The apparatus of claim 7 or 8, wherein the first component (150) is an alignment device (151) configured to move a first carrier (10) in at least one alignment direction, and the second component is a magnetic mount (152) configured to hold a second carrier (20) next to the first carrier (10).

10. The apparatus of any of claims 7 to 9, wherein an interior of the first component (150) is configured for a vacuum environment, and a vacuum feedthrough (170) is provided in first supply passage (147), and/or wherein an interior of the second component (155) is configured for an atmospheric environment, and the second supply passage (149) provides a fluid connection between the interior of the second component (155) and the atmospheric environment outside the vacuum chamber (101).

11. The apparatus according any of claims 1 to 10, further comprising at least one cable feedthrough (109) in the wall (102) of the vacuum chamber (101) for supplying a third component (157) for holding or moving a carrier, particularly wherein the third component (157) is a magnetic mount (153) configured to hold the carrier at the first component (150). 12. The apparatus of any of claims 1 to 11, further comprising a carrier transport system (120) configured to transport the carrier in the vacuum chamber in a first direction, wherein the first driving unit (142) is configured to move the first driven part (143) in a second direction transverse to the first direction.

13. A vacuum deposition system (350), comprising: the apparatus according to any of claims 1 to 12; and a deposition source (105) provided in a deposition area of the vacuum chamber

(101), wherein the first component (150) is configured for holding or moving the carrier in the deposition area.

14. A method of handling a carrier in a vacuum chamber (101), the vacuum chamber (101) having a wall with an opening (106), wherein a first driven part (143) which can be moved by a first driving unit (142) arranged outside the vacuum chamber (101) extends through the opening (106) into the vacuum chamber, the method comprising: holding or moving a first carrier (10) in the vacuum chamber (101) with a first component (150) attached to the first driven part (143); and supplying the first component (150) with at least one of electric power or signals through a first supply passage (147) provided in the first driven part (143). 15. The method of claim 14, wherein a second driven part (146) which can be moved by a second driving unit (145) arranged outside the vacuum chamber (101) extends through the opening (106) into the vacuum chamber (101), the method further comprising: holding a second carrier (20) in the vacuum chamber with a second component (155) attached to the second driven part (146); and supplying the second component (155) with at least one of electric power or signals through a second supply passage (149) provided in the second driven part (146), wherein the first carrier (10) is moved with respect to the second carrier (20) by the first component (150).