WO2017130741A1 - 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法 - Google Patents
塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法 Download PDFInfo
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- WO2017130741A1 WO2017130741A1 PCT/JP2017/001040 JP2017001040W WO2017130741A1 WO 2017130741 A1 WO2017130741 A1 WO 2017130741A1 JP 2017001040 W JP2017001040 W JP 2017001040W WO 2017130741 A1 WO2017130741 A1 WO 2017130741A1
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- Prior art keywords
- coating
- application
- container
- substrate
- application needle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
- B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/11—Vats or other containers for liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27318—Manufacturing methods by local deposition of the material of the layer connector in liquid form by dispensing droplets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Definitions
- the present invention relates to a coating mechanism, a coating apparatus, a method for manufacturing an object to be coated, and a method for manufacturing a substrate, and in particular, a process for mounting a minute electronic component such as an LED (Light Emitting Diode) or a MEMS (Micro Electro Mechanical Systems).
- a coating mechanism a coating apparatus, a method for manufacturing an object to be coated, and a method for manufacturing a substrate.
- Patent Document 1 may not be able to meet such a request reliably.
- the coating material container is positioned with the coating material container upper hole and the coating needle shaft as a guide and fixed with a magnet. This is because there is a possibility that the shaft gap is biased. As a result, the coating amount slightly changes, and the above-mentioned requirements cannot be satisfied, or there is no room for satisfying the above-mentioned requirements.
- an object of the present invention is to provide a coating mechanism, a coating apparatus, a method for manufacturing an object to be coated, and a substrate that can prevent the coating needle shaft from being biased with respect to the mounting hole when the coating material container is mounted. It is to provide a manufacturing method.
- the coating mechanism of the present invention includes a coating needle and a coating material container that stores and holds the coating material.
- the coating material container has a fixed part and a container part.
- the fixing portion is configured to be fixed to a fixing member included in the application mechanism.
- the container part has upper and lower holes through which the application needle passes, and the side surface of the container part has a first ridge. The lower surface of the first ridge is in contact with the upper surface of the fixing portion.
- a gap is provided between a portion of the side surface of the container portion below the first ridge and the side surface of the fixed portion. The container part can move horizontally within the gap.
- the side surface of the container portion has a second ridge below the first ridge.
- the fixed portion is configured to be sandwiched between the first ridge and the second ridge.
- the coating apparatus of the present invention is equipped with the above-described coating mechanism.
- the method for manufacturing an object to be coated according to the present invention uses either the coating mechanism or the coating apparatus.
- the substrate manufacturing method of the present invention includes a step of drawing a circuit pattern on a substrate by applying a coating material onto a surface to be coated of the substrate by the above-described coating apparatus.
- the coating needle shaft it is possible to prevent the coating needle shaft from being biased with respect to the mounting hole when the coating material container is mounted.
- FIG. 1 It is a typical perspective view of a coating device.
- A) is a front view of a coating mechanism.
- B) is a side view of the coating mechanism.
- A) And (B) is the expanded view which looked at the flange part containing a cam surface from the side surface. It is sectional drawing when it sees from the side surface when the conventional coating material container is attached to the member. It is a figure showing the example at the time of using the conventional application
- FIG. 1 is sectional drawing seen from the side surface when the coating material container of 1st Embodiment is attached to the member.
- FIG. 1 is sectional drawing seen from the side surface when the coating material container of 1st Embodiment is attached to the member.
- FIG. 1 is sectional drawing seen from the side surface when the coating material container of 1st Embodiment is attached to the member.
- FIG. 1 is sectional drawing seen from the side surface when the coating material container of 2nd Embodiment is attached to the member.
- B) is the figure which looked at the coating material container from the bottom.
- FIG. 1 is a schematic perspective view of a coating apparatus 200 according to an embodiment of the present invention.
- a coating apparatus 200 according to the first embodiment of the present invention includes a base 12, an X-axis table 1, a Y-axis table 2, and a Z-axis table 3 that are arranged on the floor surface.
- a coating mechanism 4, an observation optical system 6, a CCD camera 7 connected to the observation optical system 6, and a control unit 11 are included.
- a Y-axis table 2 configured to be movable in the Y-axis direction in FIG. 1 is installed on the upper surface of the base 12. Specifically, a guide portion is installed on the lower surface of the Y-axis table 2 and is slidably connected along a guide rail installed on the upper surface of the base 12. A ball screw is connected to the lower surface of the Y-axis table 2. By operating the ball screw by a driving member such as a motor, the Y-axis table 2 can move along the guide rail (in the Y-axis direction). Further, the upper surface portion of the Y-axis table 2 is a mounting surface on which the substrate 5 that is an object to be coated is mounted.
- a gate-shaped structure is provided so as to straddle the guide rail of the Y-axis table 2 in the X-axis direction.
- an X-axis table 1 that is movable in the X-axis direction is mounted.
- the X-axis table 1 can move in the X-axis direction using, for example, a ball screw.
- the Z-axis table 3 is mounted on the moving body of the X-axis table 1, and the coating mechanism 4 and the observation optical system 6 are mounted on the Z-axis table 3.
- the coating mechanism 4 and the observation optical system 6 can move in the X direction together with the Z-axis table 3.
- the coating mechanism 4 is provided to apply a coating material to the coated surface (upper surface side) of the substrate 5 using a coating needle provided in the coating mechanism 4.
- the observation optical system 6 is provided for observing the application position of the substrate 5 to be applied.
- the CCD camera 7 of the observation optical system 6 converts the observed image into an electrical signal.
- the Z-axis table 3 supports the coating mechanism 4 and the observation optical system 6 so as to be movable in the Z-axis direction.
- the control unit 11 includes an operation panel 8, a monitor 9, and a control computer 10.
- the control unit 11 controls the X-axis table 1, the Y-axis table 2, the Z-axis table 3, the coating mechanism 4, and the observation optical system 6.
- the operation panel 8 is used for inputting a command to the control computer 10.
- the monitor 9 displays image data converted by the CCD camera 7 of the observation optical system 6 and output data from the control computer 10.
- the drawing position of the substrate 5 to be coated is set to the position just below the observation optical system 6 in the X axis.
- the drawing is moved by the table 1 and the Y-axis table 2, the drawing start position is observed and confirmed by the observation optical system 6, and the drawing start position is determined.
- a circuit pattern is drawn based on the determined drawing start position. From the drawing start position, the substrate 5 is moved by the X-axis table 1 and the Y-axis table 2 so that the drawing position is directly below the coating mechanism 4.
- the coating mechanism 4 is driven to perform coating. By repeating this continuously, a circuit pattern can be drawn.
- the relationship between the descending end position of the application needle 24 and the focus position of the observation optical system 6 is stored in advance, and at the time of drawing, the application needle 24 is positioned with the position where the image is focused by the observation optical system 6 as the Z-axis direction reference.
- the application is performed after the position in the Z-axis direction is moved by the Z-axis table to a height at which it contacts the substrate 5. If the area of the circuit pattern to be drawn is large and the change in the substrate surface height of the substrate 5 to be coated during drawing is large, the focus position is confirmed in the middle if necessary and the position in the Z-axis direction is corrected. Then apply.
- the adjustment of the focus position at this time may be a method of automatically focusing using image processing, or the height position of the surface of the substrate 5 to be coated is always detected and corrected in real time using a laser sensor or the like. You can hang it.
- a substrate on which a pattern is formed can be obtained by a substrate manufacturing method including a step of forming a circuit pattern of a substrate from the beginning by a method of drawing a circuit pattern on the substrate 5 as described above.
- the substrate manufacturing method includes a step of correcting a defect in the circuit pattern of the substrate already formed by another method such as a printing method or an inkjet method. A substrate having no defect in the pattern can be obtained.
- the application mechanism 4 fixed to the Z-axis table 3 shown in FIG. 1 includes a servo motor 41, a cam 43, a bearing 44, a cam connecting plate 45, a movable portion 46, an application needle holder 20, and the application.
- An application needle 24 held by the needle holder 20 and an application material container 21 are mainly included.
- the servo motor 41 is installed such that the rotation axis extends in a direction along the Z-axis direction shown in FIG.
- a cam 43 is connected to the rotation shaft of the servo motor 41.
- the cam 43 is rotatable about the rotation axis of the servo motor 41.
- the cam 43 includes a central portion connected to the rotation shaft of the servo motor 41 and a flange portion connected to one end portion of the central portion.
- the upper surface (surface on the servo motor 41 side) of the flange portion is a cam surface 61.
- the cam surface 61 is formed in an annular shape along the outer periphery of the center portion, and is formed in a slope shape so that the distance from the bottom surface of the flange portion varies.
- the cam surface 61 is disposed at a distance from the upper end flat region 62 having the largest distance from the bottom surface of the flange portion, and the upper end flat region 62.
- FIG. 3B is a developed view of the flange portion including the cam surface 61 arranged in an annular shape so as to surround the center portion, as viewed from the side.
- the bearing 44 is arranged so as to contact the cam surface 61 of the cam 43.
- the bearing 44 is arranged in a specific direction (on the right side of the servo motor 41) as viewed from the cam 43 as shown in FIG. 2A, and the cam 43 is rotated by rotating the rotation shaft of the servo motor 41. At this time, the state in contact with the cam surface 61 is maintained.
- a cam coupling plate 45 is connected to the bearing 44. In the cam connecting plate 45, the other end opposite to the one end connected to the bearing 44 is fixed to the movable portion 46.
- An application needle holder fixing part 47 and an application needle holder storage part 48 are connected to the movable part 46.
- the application needle holder 20 is stored in the application needle holder storage portion 48.
- the application needle holder 20 includes an application needle 24.
- the application needle 24 is arranged so as to protrude from the application needle holder 20 on the lower surface of the application needle holder 20 (the lower side opposite to the side where the servo motor 41 is located).
- a coating material container 21 is disposed under the coating needle holder 20. The application needle 24 is held in the application material container 21 in an inserted state.
- the fixed pin 52 is installed in the movable part 46.
- the other fixing pin 51 is installed on the gantry holding the servo motor 41.
- a spring 50 is installed so as to connect the fixing pins 51 and 52. Due to the spring 50, the movable portion 46 is in a state of receiving a tensile force toward the coating material container 21 side. Further, the tensile force generated by the spring 50 acts on the bearing 44 via the movable portion 46 and the cam connecting plate 45. The bearing 44 is kept pressed against the cam surface 61 of the cam 43 by the tensile force of the spring 50.
- the movable part 46, the application needle holder fixing part 47, and the application needle holder storage part 48 are connected to a linear guide 49 installed on the gantry.
- the linear guide 49 is disposed so as to extend in the Z-axis direction. Therefore, the movable part 46, the application needle holder fixing part 47, and the application needle holder storage part 48 are movable along the Z-axis direction.
- FIG. 4 is a cross-sectional view of the conventional coating material container 21 as viewed from the side when it is attached to the member 69.
- the coating material container 21 stores a coating material used when drawing a pattern.
- This coating material is a highly viscous metal conductive material or the like.
- a lower hole 72 is opened in the bottom portion of the coating material container 21, and an upper hole 71 is opened in the upper lid portion 29.
- the application needle 24 is provided so as to be movable along a straight line passing through the lower hole 72 and the upper hole 71.
- the application needle 24 can be reciprocated upward and downward by the linear movement mechanism of the application mechanism 4.
- the lower hole 72 is sized such that the tip of the application needle 24 can protrude downward through the application needle 24 and the application material held in the application material container 21 does not sag. Is set.
- the upper hole 71 has a size that allows the application needle 24 to reciprocate in the vertical direction. That is, since the application needle 24 can move in the vertical direction, minute gaps 73 a and 73 b are formed between the wall of the upper hole 71 and the application needle 24. When the application needle 24 that can reciprocate in the vertical direction moves downward, the application needle 24 protrudes from the lower hole 72 toward the object to be applied in a state where the application material is attached to the surface of the tip of the application needle 24.
- Application material container 21 is fixed by adhering fixing pin 93 of application material container 21 to magnet 92 of member 69. If the bonding position is shifted or the size of the coating material container 21 varies, the coating needle 24 may not be installed at the correct position.
- FIG. 5 is a diagram showing an example in which the application needle 24 is installed at the correct position when the conventional application material container 21 is used.
- the tip of the application needle 24 can be protruded from the lower hole 72 by moving the application needle 24 downward.
- FIG. 6 is a diagram showing an example in which the application needle 24 is installed at a position shifted when the conventional application material container 21 is used.
- the tip of the application needle 24 protrudes in a state of being biased from the lower hole 72.
- the application amount changes due to this bias.
- FIG. 7 is a diagram showing another example in which the application needle 24 is installed at a position shifted when the conventional application material container 21 is used.
- the application needle 24 since the application needle 24 is shifted to the right side, the left gap 73 a between the wall of the upper hole 71 and the application needle 24 widens, and there is no gap between the wall of the upper hole 71 and the right side.
- a force acts on the contact portion between the wall of the upper hole 71 and the application needle 24, an uneven load is generated.
- FIG. 8A is a cross-sectional view as seen from the side when the coating material container 21 of the first embodiment is attached to the member 69.
- FIG. 8B is a view of the coating material container 21 as viewed from below.
- the difference between the coating material container 21 of the first embodiment shown in FIGS. 8A and 8B and the conventional coating material container 21 of FIG. 4 is that the coating material container 21 of the first embodiment is That is, it is divided into a fixing part 21b and a container part 21a.
- the fixing portion 21b has a fixing pin 93.
- the fixing portion 21 b is fixed by adhering the fixing pin 93 to the magnet 92 of the member 69.
- ⁇ 80 is provided on the side surface of the container portion 21a.
- the upper surface of the fixing portion 21b is in contact with the lower surface of the flange 80 and supports the flange 80.
- Clearances 74a and 74b are provided between a portion of the side surface of the container portion 21a below the flange 80 and the side surface of the fixing portion 21b.
- the container portion 21a can be inserted into the fixed portion 21b with gaps 74a and 74b. Even after the fixing pin 93 of the fixing portion 21b is bonded to the magnet 92 of the member 69, the container portion 21a can move left and right within the gaps 74a and 74b. Even if the gaps 73 a and 73 b of the needle 24 are reduced, the container portion 21 a can be easily installed at the correct position with respect to the application needle 24.
- FIG. 9 is a diagram illustrating an example in which the application needle 24 is installed at a position shifted when the application material container 21 according to the first embodiment is used.
- FIG. 10 is a diagram showing a state in which the container portion 21a is moved to the right side from the state shown in FIG.
- the left gap 74a is widened and the right gap 74b is narrowed by moving the container portion 21a to the right. Alignment is performed by moving the container portion 21 a to the right along the application needle 24, and no uneven load is generated between the application needle 24 and the upper hole 71. It can protrude from the center position. As a result, application with a more stable application amount becomes possible.
- the application needle 24 is positioned at its upper end position (mostly to the servo motor 41. (Close position). At this time, the tip end portion of the application needle 24 is immersed in the application material held in the application material container 21.
- the application needle 24 moves the application material container 21. It passes through the lower hole 72 formed in the bottom of the coating material container 21 and protrudes downward from the bottom surface of the coating material container 21. At this time, a part of the coating material is attached to the surface of the coating needle 24 protruding from the bottom surface of the coating material container 21.
- the Z-axis table 3 (see FIG. 1) moves the coating mechanism 4 toward the substrate 5 so that the tip of the coating needle 24 comes into contact with the surface of the substrate 5 to apply the coating material onto the surface of the substrate 5. Can do.
- the tip of the application needle 24 is adjusted to be at the center of the lower hole 72 by moving the position of the container portion 21a horizontally. 5 can be applied appropriately.
- the servo motor 41 may be driven after the movement of the Z-axis table 3 first, or the operations of the Z-axis table 3 and the servo motor 41 may be performed almost simultaneously.
- the rotational motion of the servo motor 41 can be converted into the motion (vertical motion) of the coating needle 24 in the Z-axis direction.
- the application needle 24 can be moved quickly and accurately in the Z-axis direction.
- FIG. 11A is a cross-sectional view seen from the side when the coating material container 21 of the second embodiment is attached to the member 69.
- FIG. 11B is a view of the coating material container 21 as viewed from below.
- the ridge 81 is provided on the side surface of the container portion 21a.
- the upper surface of the fixing portion 21b is in contact with the lower surface of the flange 80 and supports the flange 80.
- Clearances 74a and 74b are provided between a portion of the side surface of the container portion 21a below the flange 80 and the side surface of the fixing portion 21b.
- the upper surface of the flange 81 on the side surface of the container portion 21a contacts the lower surface of the fixed portion 21b.
- the problem that an uneven load is generated due to the force acting on the wall of the upper hole 71 and the contact portion of the application needle 24 is avoided, and the application amount is more stable. Can be applied.
- the container portion 21a is not detached from the fixing portion 21b, and the application material container 21 can be easily attached and detached.
- the present invention provides a coating mechanism for conducting conductive pattern drawing, correcting open defects in conductive patterns, forming fine circuit patterns such as RFID tags, correcting defects, and applying a conductive adhesive. And particularly advantageously applied to applicators.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/072,874 US10751747B2 (en) | 2016-01-27 | 2017-01-13 | Application mechanism, application apparatus, method for manufacturing object to which application material is applied, and method for manufacturing substrate |
| EP17743972.6A EP3409375B8 (en) | 2016-01-27 | 2017-01-13 | Application mechanism and method for manufacturing an object to which an application material is applied |
| CN201780007891.5A CN108602085B (zh) | 2016-01-27 | 2017-01-13 | 涂布机构、涂布装置、涂有涂布材料的对象物的制造方法以及基板的制造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-013003 | 2016-01-27 | ||
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| TWI766345B (zh) | 2020-08-21 | 2022-06-01 | 研能科技股份有限公司 | 運動環境淨化裝置 |
| CN117023029B (zh) * | 2023-09-07 | 2024-02-27 | 广东百能家居有限公司 | 一种蜂窝板自动生产线及方法 |
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| JP2006276188A (ja) * | 2005-03-28 | 2006-10-12 | Ntn Corp | パターン修正装置およびパターン修正方法 |
| JP2006310266A (ja) * | 2005-03-28 | 2006-11-09 | Ntn Corp | 塗布ユニットおよびパターン修正装置 |
| JP4802027B2 (ja) * | 2006-03-30 | 2011-10-26 | Ntn株式会社 | パターン修正装置およびその塗布ユニット |
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| JPS482027Y1 (enExample) * | 1968-07-11 | 1973-01-19 | ||
| JP3894776B2 (ja) * | 2001-11-09 | 2007-03-22 | 富士通メディアデバイス株式会社 | 吐出装置および吐出方法 |
| US6824023B2 (en) * | 2002-02-20 | 2004-11-30 | Lg. Philips Lcd Co., Ltd. | Liquid crystal dispensing apparatus |
| JP4162086B2 (ja) * | 2003-08-26 | 2008-10-08 | Tdk株式会社 | 液体材料塗布方法 |
| JP4834981B2 (ja) * | 2004-12-03 | 2011-12-14 | 大日本印刷株式会社 | パターン形成体の製造方法 |
| JP4890024B2 (ja) * | 2005-12-27 | 2012-03-07 | Ntn株式会社 | 塗布針固定方法と、それを用いた液状材料塗布機構および欠陥修正装置 |
| JP4719050B2 (ja) * | 2006-03-30 | 2011-07-06 | Ntn株式会社 | パターン修正装置およびその塗布ユニット |
| US9162249B2 (en) * | 2008-10-01 | 2015-10-20 | Panasonic Intellectual Property Management Co., Ltd. | Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same |
| JP2013055286A (ja) * | 2011-09-06 | 2013-03-21 | Ntn Corp | 液体塗布装置、パターン修正装置、微細パターン描画装置および液体塗布方法 |
| JP5779123B2 (ja) * | 2012-03-05 | 2015-09-16 | 富士フイルム株式会社 | パターン形成方法及びパターン形成基板の製造方法 |
| JP6019365B2 (ja) * | 2013-10-29 | 2016-11-02 | 兵神装備株式会社 | 吐出システムの製造方法 |
| JP6180283B2 (ja) * | 2013-11-06 | 2017-08-16 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置および方法 |
| JP6452147B2 (ja) * | 2015-01-19 | 2019-01-16 | 武蔵エンジニアリング株式会社 | 液体材料吐出装置 |
| JP6749814B2 (ja) * | 2015-11-12 | 2020-09-02 | Ntn株式会社 | 高さ検出装置およびそれを搭載した塗布装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006276188A (ja) * | 2005-03-28 | 2006-10-12 | Ntn Corp | パターン修正装置およびパターン修正方法 |
| JP2006310266A (ja) * | 2005-03-28 | 2006-11-09 | Ntn Corp | 塗布ユニットおよびパターン修正装置 |
| JP4802027B2 (ja) * | 2006-03-30 | 2011-10-26 | Ntn株式会社 | パターン修正装置およびその塗布ユニット |
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Also Published As
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| TW201738000A (zh) | 2017-11-01 |
| TWI712452B (zh) | 2020-12-11 |
| EP3409375A4 (en) | 2020-03-18 |
| US10751747B2 (en) | 2020-08-25 |
| JP2017131826A (ja) | 2017-08-03 |
| CN108602085A (zh) | 2018-09-28 |
| JP6587945B2 (ja) | 2019-10-09 |
| EP3409375A1 (en) | 2018-12-05 |
| US20190060948A1 (en) | 2019-02-28 |
| EP3409375B8 (en) | 2022-09-28 |
| CN108602085B (zh) | 2020-10-13 |
| EP3409375B1 (en) | 2022-04-06 |
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