JP6587945B2 - 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法 - Google Patents

塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法 Download PDF

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JP6587945B2
JP6587945B2 JP2016013003A JP2016013003A JP6587945B2 JP 6587945 B2 JP6587945 B2 JP 6587945B2 JP 2016013003 A JP2016013003 A JP 2016013003A JP 2016013003 A JP2016013003 A JP 2016013003A JP 6587945 B2 JP6587945 B2 JP 6587945B2
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coating
application
container
application needle
substrate
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JP2016013003A
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Japanese (ja)
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JP2017131826A (ja
JP2017131826A5 (enExample
Inventor
山中　昭浩
昭浩 山中
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NTN Corp
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NTN Corp
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Priority to JP2016013003A priority Critical patent/JP6587945B2/ja
Application filed by NTN Corp filed Critical NTN Corp
Priority to CN201780007891.5A priority patent/CN108602085B/zh
Priority to PCT/JP2017/001040 priority patent/WO2017130741A1/ja
Priority to US16/072,874 priority patent/US10751747B2/en
Priority to EP17743972.6A priority patent/EP3409375B8/en
Priority to TW106102043A priority patent/TWI712452B/zh
Publication of JP2017131826A publication Critical patent/JP2017131826A/ja
Publication of JP2017131826A5 publication Critical patent/JP2017131826A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
    • H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
    • H01L2224/27318—Manufacturing methods by local deposition of the material of the layer connector in liquid form by dispensing droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2016013003A 2016-01-27 2016-01-27 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法 Active JP6587945B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016013003A JP6587945B2 (ja) 2016-01-27 2016-01-27 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法
PCT/JP2017/001040 WO2017130741A1 (ja) 2016-01-27 2017-01-13 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法
US16/072,874 US10751747B2 (en) 2016-01-27 2017-01-13 Application mechanism, application apparatus, method for manufacturing object to which application material is applied, and method for manufacturing substrate
EP17743972.6A EP3409375B8 (en) 2016-01-27 2017-01-13 Application mechanism and method for manufacturing an object to which an application material is applied
CN201780007891.5A CN108602085B (zh) 2016-01-27 2017-01-13 涂布机构、涂布装置、涂有涂布材料的对象物的制造方法以及基板的制造方法
TW106102043A TWI712452B (zh) 2016-01-27 2017-01-20 塗佈機構、塗佈裝置、被塗佈對象物的製造方法及基板的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016013003A JP6587945B2 (ja) 2016-01-27 2016-01-27 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法

Publications (3)

Publication Number Publication Date
JP2017131826A JP2017131826A (ja) 2017-08-03
JP2017131826A5 JP2017131826A5 (enExample) 2019-02-14
JP6587945B2 true JP6587945B2 (ja) 2019-10-09

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JP2016013003A Active JP6587945B2 (ja) 2016-01-27 2016-01-27 塗布機構、塗布装置、被塗布対象物の製造方法、および基板の製造方法

Country Status (6)

Country Link
US (1) US10751747B2 (enExample)
EP (1) EP3409375B8 (enExample)
JP (1) JP6587945B2 (enExample)
CN (1) CN108602085B (enExample)
TW (1) TWI712452B (enExample)
WO (1) WO2017130741A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766345B (zh) 2020-08-21 2022-06-01 研能科技股份有限公司 運動環境淨化裝置
CN117023029B (zh) * 2023-09-07 2024-02-27 广东百能家居有限公司 一种蜂窝板自动生产线及方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482027Y1 (enExample) * 1968-07-11 1973-01-19
JP3894776B2 (ja) * 2001-11-09 2007-03-22 富士通メディアデバイス株式会社 吐出装置および吐出方法
US6824023B2 (en) * 2002-02-20 2004-11-30 Lg. Philips Lcd Co., Ltd. Liquid crystal dispensing apparatus
JP4162086B2 (ja) * 2003-08-26 2008-10-08 Ｔｄｋ株式会社 液体材料塗布方法
JP4834981B2 (ja) * 2004-12-03 2011-12-14 大日本印刷株式会社 パターン形成体の製造方法
JP4767708B2 (ja) * 2005-03-28 2011-09-07 Ｎｔｎ株式会社 塗布ユニットおよびパターン修正装置
JP4767567B2 (ja) 2005-03-28 2011-09-07 Ｎｔｎ株式会社 パターン修正装置
JP4890024B2 (ja) * 2005-12-27 2012-03-07 Ｎｔｎ株式会社 塗布針固定方法と、それを用いた液状材料塗布機構および欠陥修正装置
JP4719050B2 (ja) * 2006-03-30 2011-07-06 Ｎｔｎ株式会社 パターン修正装置およびその塗布ユニット
JP4802027B2 (ja) * 2006-03-30 2011-10-26 Ｎｔｎ株式会社 パターン修正装置およびその塗布ユニット
US9162249B2 (en) * 2008-10-01 2015-10-20 Panasonic Intellectual Property Management Co., Ltd. Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same
JP2013055286A (ja) * 2011-09-06 2013-03-21 Ntn Corp 液体塗布装置、パターン修正装置、微細パターン描画装置および液体塗布方法
JP5779123B2 (ja) * 2012-03-05 2015-09-16 富士フイルム株式会社 パターン形成方法及びパターン形成基板の製造方法
JP6019365B2 (ja) * 2013-10-29 2016-11-02 兵神装備株式会社 吐出システムの製造方法
JP6180283B2 (ja) * 2013-11-06 2017-08-16 武蔵エンジニアリング株式会社 液体材料吐出装置および方法
JP6452147B2 (ja) * 2015-01-19 2019-01-16 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6749814B2 (ja) * 2015-11-12 2020-09-02 Ntn株式会社 高さ検出装置およびそれを搭載した塗布装置

Also Published As

Publication number Publication date
TW201738000A (zh) 2017-11-01
TWI712452B (zh) 2020-12-11
EP3409375A4 (en) 2020-03-18
US10751747B2 (en) 2020-08-25
JP2017131826A (ja) 2017-08-03
CN108602085A (zh) 2018-09-28
EP3409375A1 (en) 2018-12-05
WO2017130741A1 (ja) 2017-08-03
US20190060948A1 (en) 2019-02-28
EP3409375B8 (en) 2022-09-28
CN108602085B (zh) 2020-10-13
EP3409375B1 (en) 2022-04-06

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