WO2017067024A1 - 色阻掩膜板及其使用方法 - Google Patents

色阻掩膜板及其使用方法 Download PDF

Info

Publication number
WO2017067024A1
WO2017067024A1 PCT/CN2015/093977 CN2015093977W WO2017067024A1 WO 2017067024 A1 WO2017067024 A1 WO 2017067024A1 CN 2015093977 W CN2015093977 W CN 2015093977W WO 2017067024 A1 WO2017067024 A1 WO 2017067024A1
Authority
WO
WIPO (PCT)
Prior art keywords
alignment
test
color resist
mark
coating
Prior art date
Application number
PCT/CN2015/093977
Other languages
English (en)
French (fr)
Inventor
熊源
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US14/896,672 priority Critical patent/US9891464B2/en
Publication of WO2017067024A1 publication Critical patent/WO2017067024A1/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular, to a color resist mask and a method of using the same.
  • the display panel is a main component of the liquid crystal display.
  • the main structure of the display panel includes an array substrate, a color film substrate disposed corresponding to the array substrate, and a liquid crystal layer disposed between the array substrate and the color filter substrate.
  • the liquid crystal display can display color images mainly based on RGB color resistance in the color film substrate.
  • RGB color resist coating Before performing RGB color resist coating, it is necessary to prepare a color resistance test piece to test parameters such as exposure characteristics, film thickness, color gamut and color coordinates of RGB color resistance. After the test is passed, the RGB color resist is formed on the color filter substrate using the color resist mask. In this way, it is necessary to use two masks for two alignment operations to complete the RGB color resistance, which results in a high production cost of the color film substrate.
  • the present invention provides a color resist mask which can reduce the manufacturing cost of a color filter substrate and a method for using the same, and solves the technical problem of high production cost of the conventional color film substrate.
  • the embodiment of the present invention provides the following technical solutions:
  • the invention provides a color resist mask for preparing a color resist test piece in conjunction with a lithography machine, comprising:
  • the alignment test identification area includes a plurality of equally spaced alignment test identifiers
  • the alignment coating identification region includes a plurality of equally spaced alignment coating marks, wherein the alignment coating identifier and the alignment test mark cooperate to position a coating area of the test color resistance;
  • a pattern mask region comprising a plurality of mask patterns for coating the test color resist
  • the alignment test identifier and the alignment coating identifier are in one-to-one correspondence; determining the adjacent alignment coating identifier according to the spacing of adjacent pixels and the side length of the single exposure region of the lithography machine a spacing between the adjacent ones of the alignment test identifiers; and a spacing between the alignment coating identifiers and the corresponding alignment test identifiers;
  • the pattern of the alignment test mark is different from the pattern of the alignment coating mark
  • the spacing between the adjacent alignment coating marks is greater than or equal to the side length of the single exposure area of the lithography machine, and the lateral spacing between the adjacent alignment test marks is greater than or equal to the light
  • the side length of the single exposure area of the engraving, the longitudinal spacing between adjacent alignment test marks is equal to the longitudinal spacing of the adjacent pixels.
  • the spacing between the alignment coating mark and the corresponding alignment test mark is satisfied:
  • d is the spacing of the alignment coating identification and the corresponding alignment test mark
  • num is the number of the alignment coating marks in the alignment coating identification area
  • p is the spacing of adjacent pixels
  • n is Any positive integer greater than one
  • d is greater than the side length of the single exposure region of the lithography machine.
  • the alignment coating mark includes a red alignment coating mark, a blue alignment coating mark, and a green alignment coating mark;
  • the alignment test identifier includes a red alignment test identifier, a blue alignment test identifier, and a green alignment test identifier.
  • the alignment coating mark includes a red alignment coating mark, a blue alignment coating mark, a green alignment coating mark, and a yellow alignment coating mark;
  • the alignment test identifier includes a red alignment test identifier, a blue alignment test identifier, a green alignment test identifier, and a yellow alignment test identifier.
  • the invention provides a color resist mask for forming a color resist test piece using a lithography machine, which comprises:
  • the alignment test identification area includes a plurality of equally spaced alignment test identifiers
  • the alignment coating identification region includes a plurality of equally spaced alignment coating marks, wherein the alignment coating identifier and the alignment test mark cooperate to position a coating area of the test color resistance;
  • a pattern mask region comprising a plurality of mask patterns for coating the test color resist
  • the alignment test identifier and the alignment coating identifier are in one-to-one correspondence; determining the adjacent alignment coating identifier according to the spacing of adjacent pixels and the side length of the single exposure region of the lithography machine a spacing between the adjacent, and the spacing between the adjacent alignment test identifiers; determining a spacing of the alignment coating identifier and the corresponding alignment test identifier based on a spacing of adjacent pixels.
  • the pattern of the alignment test mark is different from the pattern of the alignment coat mark.
  • the spacing between adjacent alignment coating marks is greater than or equal to the side length of the single exposure area of the lithography machine.
  • the lateral spacing between adjacent alignment test marks is greater than or equal to the side length of the single exposure area of the lithography machine.
  • the longitudinal spacing between adjacent alignment test marks is equal to the longitudinal pitch of the adjacent pixels.
  • the spacing between the alignment coating mark and the corresponding alignment test mark is satisfied:
  • d is the spacing of the alignment coating identification and the corresponding alignment test mark
  • num is the number of the alignment coating marks in the alignment coating identification area
  • p is the spacing of adjacent pixels
  • n is Any positive integer greater than one
  • d is greater than the side length of the single exposure region of the lithography machine.
  • the alignment coating mark includes a red alignment coating mark, a blue alignment coating mark, and a green alignment coating mark;
  • the alignment test identifier includes a red alignment test identifier, a blue alignment test identifier, and a green alignment test identifier.
  • the alignment coating mark includes a red alignment coating mark, a blue alignment coating mark, a green alignment coating mark, and a yellow alignment coating mark;
  • the alignment test identifier includes a red alignment test identifier, a blue alignment test identifier, a green alignment test identifier, and a yellow alignment test identifier.
  • the present invention also provides a method of using a color resist mask for forming a color resist test piece using a photolithography machine, wherein the color resist mask comprises:
  • the alignment test identification area includes a plurality of equally spaced alignment test identifiers
  • the alignment coating identification region includes a plurality of equally spaced alignment coating marks, wherein the alignment coating identifier and the alignment test mark cooperate to position a coating area of the test color resistance;
  • a pattern mask region comprising a plurality of mask patterns for coating the test color resist
  • the alignment test identifier and the alignment coating identifier are in one-to-one correspondence; determining the adjacent alignment coating identifier according to the spacing of adjacent pixels and the side length of the single exposure region of the lithography machine a spacing between the adjacent ones of the alignment test identifiers; and a spacing between the alignment coating identifiers and the corresponding alignment test identifiers;
  • the method for using the color resist mask includes:
  • the color resist layer is patterned to form a test color resist pattern composed of the test color resist in the middle of the color resist test piece.
  • the alignment coating mark includes a red alignment coating mark, a blue alignment coating mark, and a green alignment coating mark;
  • the alignment test identifier includes a red alignment test identifier, a blue alignment test identifier, and a green alignment test identifier;
  • the method for using the color resist mask includes:
  • the edge test red color resist layer is patterned to form a substrate red alignment test mark, a substrate blue alignment test mark, and a substrate green alignment test formed by the test color resistance at the edge of the color resistance test piece.
  • the pattern of the alignment test mark is different from the pattern of the alignment coat mark.
  • the spacing between adjacent alignment coating marks is greater than or equal to the side length of the single exposure area of the lithography machine.
  • the lateral spacing between adjacent alignment test marks is greater than or equal to the side length of the single exposure area of the lithography machine.
  • the longitudinal spacing between adjacent alignment test marks is equal to the longitudinal pitch of the adjacent pixels.
  • the spacing between the alignment coating mark and the corresponding alignment test mark is satisfied:
  • d is the spacing of the alignment coating identification and the corresponding alignment test mark
  • num is the number of the alignment coating marks in the alignment coating identification area
  • p is the spacing of adjacent pixels
  • n is Any positive integer greater than one
  • d is greater than the side length of the single exposure region of the lithography machine.
  • the color resist mask of the present invention Compared with the prior art, the color resist mask of the present invention and the method of using the same, by simultaneously setting the alignment coating area with the alignment coating mark on the same mask and the alignment with the alignment test mark The identification area is tested, and the spacing between the alignment coating mark and the corresponding alignment test mark is determined according to the spacing of adjacent pixels; thereby, the manufacturing cost of the color film substrate can be effectively reduced; and the manufacturing cost of the existing color film substrate is solved. High technical issues.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a color resist mask according to the present invention.
  • 2A is a schematic view showing the fabrication of a color resist test piece using the color resist mask of the present invention
  • 2B is a second schematic view showing the fabrication of a color resist test piece using the color resist mask of the present invention
  • 2C is a third schematic view showing the fabrication of a color resist test piece using the color resist mask of the present invention.
  • FIG. 3 is a flow chart of a method of using the color resist mask of the present invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a color resist mask according to the present invention.
  • the color resist mask 10 of the preferred embodiment includes an alignment coating mark region 11, a registration test mark region 12, and a pattern mask region 13.
  • the alignment test identification area 12 includes a plurality of equally spaced alignment test identifications 121.
  • the alignment coating identification area 11 includes a plurality of equally spaced alignment coating marks 111, wherein the alignment coating mark 111 and the alignment test mark 121 cooperate to position the coated area of the test color resistance.
  • the pattern mask area 13 includes a plurality of mask patterns (omitted from the drawing) for coating the test color resist, and the mask pattern may be any pattern of a preset design.
  • the pattern of the alignment test mark 121 and the pattern of the alignment coating mark 111 are different.
  • the alignment test mark 121 is a square pattern
  • the alignment coating mark 111 is a "m" type pattern.
  • the alignment test mark 121 and the alignment coating mark 111 are in one-to-one correspondence, and the spacing between adjacent alignment coating marks 111 is determined according to the pitch of adjacent pixels and the side length of the single exposure area 112 of the lithography machine. And the spacing between adjacent alignment test marks 121. Specifically, the spacing c between adjacent alignment coating marks 111 is greater than or equal to the side length of the single exposure area 112 of the lithography machine, and the lateral spacing b between adjacent alignment test marks 121 is greater than or equal to lithography. The side length of the single exposure area 112 of the machine, the longitudinal spacing a between adjacent alignment test marks 121 is equal to the spacing of adjacent pixels.
  • the spacing c between adjacent alignment coating marks 111 and the lateral spacing b between adjacent alignment test marks 121 should be greater than or equal to the single time of the lithography machine.
  • the spacing between the alignment coating identifier 111 and the corresponding alignment test identifier 121 is determined according to the spacing of the adjacent pixels. Specifically, the spacing between the alignment coating identifier 111 and the corresponding alignment test identifier 121 satisfies:
  • d is the spacing between the alignment coating mark and the corresponding alignment test mark
  • num is the number of the alignment coating marks 111 in the alignment coating identification area 11
  • p is the spacing of adjacent pixels
  • n is greater than 1 Any positive integer
  • d is greater than the side length of the single exposure region 112 of the lithography machine.
  • d is larger than the single exposure area 112 of the lithography machine in order to avoid the influence of the exposure operation when the alignment test mark 121 is made on the subsequent test color resistance.
  • the alignment coating identifier 111 includes a red alignment coating identifier 1111, a blue alignment coating identifier 1112, and a green alignment coating identifier 1113;
  • the alignment test identifier 121 includes a red alignment test identifier. 1211, blue alignment test mark 1212 and green registration test mark 1213. Therefore, the value of the above parameter num is 3.
  • the test red color resist layer is coated on the substrate of the color resist test piece, and then the red alignment test mark 1211, the blue alignment test mark 1212, and the green pair of the alignment test mark area 12 of the color resist mask 10 are used.
  • the bit test mark 1213 is configured to pattern the test red color resist layer on the edge of the color resist test piece to form a substrate red alignment test mark 21 and a substrate blue pair formed by testing the red color resistance on the edge of the color resist test piece.
  • the bit test mark 22 and the substrate green alignment test mark 23 is configured to pattern the test red color resist layer on the edge of the color resist test piece to form a substrate red alignment test mark 21 and a substrate blue pair formed by testing the red color resistance on the edge of the color resist test piece.
  • test red color resist layer in the middle of the color resist test piece is patterned to form a test red color group map in the middle of the color resist test piece.
  • Case R Specifically, all the tested red color resists in the middle of the color resist test piece are moved by moving the color resist test piece at a pitch distance of three times adjacent pixels (to pass the area of the test blue color group pattern and the test green color resist pattern). The layer is patterned to form a test red color group pattern R in the middle of the color resist test piece.
  • the pattern of the color resist test piece is as shown in Fig. 2A. In order to clearly represent the image, the size ratio and position of the test red color group pattern R, the substrate red alignment test mark 21, the substrate blue alignment test mark 22, and the substrate green alignment test mark 23 are adjusted.
  • a test blue color resist layer is coated on the substrate of the color resist test piece, and the position of the color resist mask 30 is adjusted according to the substrate blue alignment test mark 22 and the blue alignment coating mark 1112.
  • the film pattern may face the area of the blue color group pattern 22 of the color resistance test piece.
  • test blue color resist layer in the middle of the color resist test piece is patterned to form a test blue color group map in the middle of the color resist test piece.
  • Case B Specifically, all the test blue color resist layers in the middle of the color resist test piece are patterned by moving the color resistance test piece at a distance of three times the distance between adjacent pixels to form a test blue in the middle of the color resistance test piece.
  • Color group pattern B At this time, the pattern of the color resist test piece is as shown in Fig. 2B.
  • a test green color resist layer is coated on the substrate of the color resist test piece, and the position of the color resist mask 30 is adjusted according to the substrate green alignment test mark 23 and the green alignment coating mark 1113.
  • test green color resist layer in the middle of the color resist test piece is patterned to form a test green color group map in the middle of the color resist test piece.
  • Case G Specifically, all the test green color resist layers in the middle of the color resist test piece are patterned by moving the color resist test piece at a distance of three times the distance between adjacent pixels to form a test green in the middle of the color resistance test piece.
  • Color group pattern G At this time, the pattern of the color resist test piece is as shown in Fig. 2C.
  • the alignment coating mark of the color resist mask of the preferred embodiment may include a red alignment coating mark, a blue alignment coating mark, a green alignment coating mark, and a yellow alignment coating mark.
  • the color resist mask of the preferred embodiment simultaneously sets the alignment coating identification area with the alignment coating mark and the alignment test identification area with the alignment test mark, and determines the alignment coating according to the spacing of adjacent pixels.
  • the spacing between the identification and the corresponding alignment test identification. Therefore, the color resist mask can be used for the color resist test piece and the color film color resistance, thereby effectively reducing the manufacturing cost of the color film substrate; and solving the high production cost of the existing color film substrate. technical problem.
  • the present invention also provides a method of using a color resist mask, wherein the specific structure of the color resist mask is as described in the preferred embodiment of the color resist mask described above. Please refer to FIG. 3.
  • FIG. 3 is a flow chart of a method for using the color resist mask according to the present invention.
  • the method of using the color resist mask of the preferred embodiment includes:
  • Step S301 using the alignment test mark of the alignment test mark area of the color resist mask, patterning the test color resist layer at the edge of the color resistance test piece to form a test color resistance at the edge of the color resistance test piece
  • the substrate alignment test mark is constructed.
  • Step S302 according to the substrate alignment test mark and the alignment coating mark, use the mask pattern of the pattern mask area of the color resist mask to graphically process the test color resist layer in the middle of the color resist test piece, A test color resist pattern composed of a test color resistance is formed in the middle of the color resist test piece.
  • the alignment coating mark includes a red alignment coating mark, a blue alignment coating mark, and a green alignment coating mark;
  • the alignment test mark includes a red alignment test mark and a blue alignment mark. Test identification and green registration test identification.
  • step S301 a test red color resist layer is coated on the substrate of the color resist test piece, and then a red alignment test mark, a blue alignment test mark, and a green pair of the alignment test mark area of the color resist mask are used.
  • Bit test mark, the red color resist layer of the edge of the color resistance test piece is patterned to form a substrate red alignment test mark formed by testing the red color resistance at the edge of the color resistance test piece, and the substrate blue alignment test Identification and substrate green alignment test identification. Then it proceeds to step S302.
  • step S302 the test red color resist layer in the middle of the color resist test piece is patterned by using the mask pattern of the pattern mask area of the color resist mask to form a test red color in the middle of the color resist test piece. Group pattern.
  • a test blue color resist layer is coated on the substrate of the color resist test piece, and the position of the color resist mask is adjusted according to the substrate blue alignment test mark and the blue alignment coating mark.
  • the test blue color resist layer in the middle of the color resist test piece is patterned to form a test blue color group pattern in the middle of the color resist test piece.
  • a green color resist layer is coated on the substrate of the color resist test piece, and the position of the color resist mask is adjusted according to the green alignment test mark of the substrate and the green alignment coating mark.
  • test green color resist layer in the middle of the color resist test piece is patterned to form a test green color group pattern in the middle of the color resist test piece.
  • the alignment coating mark of the color resist mask of the preferred embodiment may include a red alignment coating mark, a blue alignment coating mark, a green alignment coating mark, and a yellow alignment coating mark.
  • the alignment test identification includes a red alignment test identification, a blue alignment test identification, a green registration test identification, and a yellow registration test identification.
  • the pattern of the alignment test mark is different from the pattern of the alignment coating mark; the spacing between the adjacent alignment coating marks is greater than or equal to the side length of the single exposure area of the lithography machine, and the adjacent alignment
  • the lateral spacing between the test marks is greater than or equal to the side length of the single exposure area of the lithography machine, and the longitudinal spacing between adjacent alignment test marks is equal to the longitudinal spacing of adjacent pixels.
  • the spacing between the alignment coating mark and the corresponding alignment test mark satisfies:
  • d is the spacing between the alignment coating mark and the corresponding alignment test mark
  • num is the number of the alignment coating marks in the alignment coating identification area
  • p is the spacing of adjacent pixels
  • n is an arbitrary value greater than 1.
  • a positive integer, d is greater than the side length of the single exposure area of the lithography machine.
  • the color resist mask of the present invention and the method of using the same by simultaneously setting the alignment coating mark area with the alignment coating mark on the same mask plate and the alignment test mark area having the alignment test mark, and according to The spacing of the adjacent pixels determines the spacing between the alignment coating mark and the corresponding alignment test mark; thereby effectively reducing the manufacturing cost of the color film substrate; and solving the technical problem of high manufacturing cost of the existing color film substrate.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

一种色阻掩膜板及其使用方法。色阻掩膜版（10）包括对位涂布标识区域（11）以及对位测试标识区域（12），对位涂布标识区域（11）包括多个涂布彩膜色阻的等间距的对位涂布标识（111）；对位测试标识区域（12）包括多个用于涂布测试色阻的等间距的对位测试标识（121）；其中对位测试标识（121）和对位涂布标识（111）一一对应。

Description

色阻掩膜板及其使用方法 技术领域
本发明涉及液晶显示技术领域，特别涉及一种色阻掩膜板及其使用方法。
 背景技术
液晶显示器以体积小、重量轻等优点，广泛应用于各种领域。显示面板是液晶显示器的主要组成部分，显示面板主要结构包括阵列基板、与阵列基板对应设置的彩膜基板、设置于阵列基板与彩膜基板之间的液晶层。其中，液晶显示器能呈现彩色影像主要是基于彩膜基板中的RGB色阻。
在进行RGB色阻涂布之前，需要先制作色阻测试片，以测试RGB色阻的曝光特性、膜厚、色域以及色坐标等参数。测试通过后，再使用色阻掩膜板在彩膜基板上制作RGB色阻。这样需要使用两块掩膜板进行两次对位操作才能完成RGB色阻的制作，造成彩膜基板的制作成本较高。
故，有必要提供一种色阻掩膜板及其使用方法，以解决现有技术所存在的问题。
 技术问题
有鉴于此，本发明提供一种可降低彩膜基板的制作成本的色阻掩膜板及其使用方法；以解决现有的彩膜基板的制作成本较高的技术问题。
技术解决方案
为解决上述技术问题，本发明实施例提供了以下技术方案：
本发明提供一种色阻掩膜板，用于配合光刻机制作色阻测试片，其包括：
对位测试标识区域，包括多个等间距的对位测试标识；
对位涂布标识区域，包括多个等间距的对位涂布标识，其中所述对位涂布标识和所述对位测试标识配合对测试色阻的涂布区域进行定位；以及
图样掩膜区域，包括多个用于涂布所述测试色阻的掩膜图样；
其中所述对位测试标识和所述对位涂布标识一一对应；根据相邻像素的间距以及所述光刻机的单次曝光区域的边长确定相邻的所述对位涂布标识之间的间距，以及相邻的所述对位测试标识之间的间距；根据相邻像素的间距确定所述对位涂布标识和相应的所述对位测试标识的间距；
其中所述对位测试标识的图样与所述对位涂布标识的图样不同；
其中相邻的所述对位涂布标识之间的间距大于等于所述光刻机的单次曝光区域的边长，相邻的所述对位测试标识之间的横向间距大于等于所述光刻机的单次曝光区域的边长，相邻的所述对位测试标识之间的纵向间距等于所述相邻像素的纵向间距。
在本发明所述的色阻掩膜板中，所述对位涂布标识和相应的所述对位测试标识的间距满足：
d=num*n*p；
其中d为对位涂布标识和相应的对位测试标识的间距，num为所述对位涂布标识区域中的所述对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于所述光刻机的单次曝光区域的边长。
在本发明所述的色阻掩膜板中，所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；
所述对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识。
在本发明所述的色阻掩膜板中，所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识、绿色对位涂布标识以及黄色对位涂布标识；
所述对位测试标识包括红色对位测试标识、蓝色对位测试标识、绿色对位测试标识以及黄色对位测试标识。
本发明提供一种色阻掩膜板，用于使用光刻机制作色阻测试片，其包括：
对位测试标识区域，包括多个等间距的对位测试标识；
对位涂布标识区域，包括多个等间距的对位涂布标识，其中所述对位涂布标识和所述对位测试标识配合对测试色阻的涂布区域进行定位；以及
图样掩膜区域，包括多个用于涂布所述测试色阻的掩膜图样；
其中所述对位测试标识和所述对位涂布标识一一对应；根据相邻像素的间距以及所述光刻机的单次曝光区域的边长确定相邻的所述对位涂布标识之间的间距，以及相邻的所述对位测试标识之间的间距；根据相邻像素的间距确定所述对位涂布标识和相应的所述对位测试标识的间距。
在本发明所述的色阻掩膜板中，所述对位测试标识的图样与所述对位涂布标识的图样不同。
在本发明所述的色阻掩膜板中，相邻的所述对位涂布标识之间的间距大于等于所述光刻机的单次曝光区域的边长。
在本发明所述的色阻掩膜板中，相邻的所述对位测试标识之间的横向间距大于等于所述光刻机的单次曝光区域的边长。
在本发明所述的色阻掩膜板中，相邻的所述对位测试标识之间的纵向间距等于所述相邻像素的纵向间距。
在本发明所述的色阻掩膜板中，所述对位涂布标识和相应的所述对位测试标识的间距满足：
d=num*n*p；
其中d为对位涂布标识和相应的对位测试标识的间距，num为所述对位涂布标识区域中的所述对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于所述光刻机的单次曝光区域的边长。
在本发明所述的色阻掩膜板中，所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；
所述对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识。
在本发明所述的色阻掩膜板中，所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识、绿色对位涂布标识以及黄色对位涂布标识；
所述对位测试标识包括红色对位测试标识、蓝色对位测试标识、绿色对位测试标识以及黄色对位测试标识。
本发明还提供一种色阻掩膜板的使用方法，用于使用光刻机制作色阻测试片，其中所述色阻掩膜板包括：
对位测试标识区域，包括多个等间距的对位测试标识；
对位涂布标识区域，包括多个等间距的对位涂布标识，其中所述对位涂布标识和所述对位测试标识配合对测试色阻的涂布区域进行定位；以及
图样掩膜区域，包括多个用于涂布所述测试色阻的掩膜图样；
其中所述对位测试标识和所述对位涂布标识一一对应；根据相邻像素的间距以及所述光刻机的单次曝光区域的边长确定相邻的所述对位涂布标识之间的间距，以及相邻的所述对位测试标识之间的间距；根据相邻像素的间距确定所述对位涂布标识和相应的所述对位测试标识的间距；
所述色阻掩膜板的使用方法包括：
使用所述色阻掩膜板的所述对位测试标识区域的所述对位测试标识，对所述色阻测试片的边缘的测试色阻层进行图形化处理，以在所述色阻测试片的边缘形成所述测试色阻构成的基板对位测试标识；以及
根据所述基板对位测试标识以及所述对位涂布标识，使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片的中部的测试色阻层进行图形化处理，以在所述色阻测试片的中部形成所述测试色阻构成的测试色阻图案。
在本发明所述的色阻掩膜板的使用方法中，所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；
所述对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识；
所述色阻掩膜板的使用方法包括：
涂布测试红色色阻层；
使用所述色阻掩膜板的所述对位测试标识区域的所述红色对位测试标识、所述蓝色对位测试标识以及所述绿色对位测试标识，对所述色阻测试片的边缘的测试红色色阻层进行图形化处理，以在所述色阻测试片的边缘形成所述测试色阻构成的基板红色对位测试标识、基板蓝色对位测试标识以及基板绿色对位测试标识；
使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片中部的测试红色色阻层进行图形化处理，以在所述色阻测试片的中部形成测试红色色阻图案；
涂布测试蓝色色阻层；
根据所述基板蓝色对位测试标识以及所述蓝色对位涂布标识，对色阻掩膜板的位置进行调整；
使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片中部的测试蓝色色阻层进行图形化处理，以在所述色阻测试片的中部形成测试蓝色色阻图案；
涂布测试绿色色阻层；
根据所述基板绿色对位测试标识以及所述绿色对位涂布标识，对色阻掩膜板的位置进行调整；
使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片中部的测试绿色色阻层进行图形化处理，以在所述色阻测试片的中部形成测试绿色色阻图案。
在本发明所述的色阻掩膜板的使用方法中，所述对位测试标识的图样与所述对位涂布标识的图样不同。
在本发明所述的色阻掩膜板的使用方法中，相邻的所述对位涂布标识之间的间距大于等于所述光刻机的单次曝光区域的边长。
在本发明所述的色阻掩膜板的使用方法中，相邻的所述对位测试标识之间的横向间距大于等于所述光刻机的单次曝光区域的边长。
在本发明所述的色阻掩膜板的使用方法中，相邻的所述对位测试标识之间的纵向间距等于所述相邻像素的纵向间距。
在本发明所述的色阻掩膜板的使用方法中，所述对位涂布标识和相应的所述对位测试标识的间距满足：
d=num*n*p；
其中d为对位涂布标识和相应的对位测试标识的间距，num为所述对位涂布标识区域中的所述对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于所述光刻机的单次曝光区域的边长。
 有益效果
相对于现有技术，本发明的色阻掩膜板及其使用方法，通过在同一掩膜板上同时设置具有对位涂布标识的对位涂布标识区域以及具有对位测试标识的对位测试标识区域，同时根据相邻像素的间距确定对位涂布标识和相应的对位测试标识的间距；从而可有效的降低彩膜基板制作成本；解决了现有的彩膜基板的制作成本较高的技术问题。
 附图说明
图1为本发明的色阻掩膜板的优选实施例的结构示意图；
图2A为使用本发明的色阻掩膜板制作色阻测试片的制作示意图之一；
图2B为使用本发明的色阻掩膜板制作色阻测试片的制作示意图之二；
图2C为使用本发明的色阻掩膜板制作色阻测试片的制作示意图之三；
图3为本发明的色阻掩膜板的使用方法的流程图。
 本发明的最佳实施方式
请参照附图中的图式，其中相同的组件符号代表相同的组件。以下的说明是基于所例示的本发明具体实施例，其不应被视为限制本发明未在此详述的其它具体实施例。
请参照图1，图1为本发明的色阻掩膜板的优选实施例的结构示意图。本优选实施例的色阻掩膜板10包括对位涂布标识区域11、对位测试标识区域12以及图样掩膜区域13。对位测试标识区域12包括多个等间距的对位测试标识121。对位涂布标识区域11包括多个等间距的对位涂布标识111，其中对位涂布标识111和对位测试标识121配合对测试色阻的涂布区域进行定位。图样掩膜区域13包括多个用于涂布测试色阻的掩膜图样（图中省略），该掩膜图样可为预设设计的任何图形。其中对位测试标识121的图样和对位涂布标识111的图样不同。在本优选实施例中对位测试标识121为正方形的图样，对位涂布标识111为“米”字型的图样。
其中对位测试标识121和对位涂布标识111一一对应，根据相邻像素的间距以及光刻机的单次曝光区域112的边长确定相邻的对位涂布标识111之间的间距，以及相邻的对位测试标识121之间的间距。具体的：相邻的对位涂布标识111之间的间距c大于等于光刻机的单次曝光区域112的边长，相邻的对位测试标识121之间的横向间距b大于等于光刻机的单次曝光区域112的边长，相邻的对位测试标识121之间的纵向间距a等于相邻像素的间距。
为了保证两次曝光操作不会相互影响，相邻的对位涂布标识111之间的间距c以及相邻的对位测试标识121之间的横向间距b均应大于等于光刻机的单次曝光区域112的边长。如该单次曝光区域112为正方形区域，单次曝光区域112的边长为该正方形区域的边长，如该单次曝光区域112为长方形区域，单次曝光区域112的边长为该正方形区域的长边或短边。
根据相邻像素的间距确定对位涂布标识111和相应的对位测试标识121的间距，具体的：对位涂布标识111和相应的对位测试标识121的间距满足：
d=num*n*p；
其中d为对位涂布标识和相应的对位测试标识的间距，num为对位涂布标识区域11中的对位涂布标识111的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于光刻机的单次曝光区域112的边长。这里的d大于光刻机的单次曝光区域112也是为了避免制作对位测试标识121时的曝光操作对后续制作测试色阻的影响。
在本优选实施例中，对位涂布标识111包括红色对位涂布标识1111、蓝色对位涂布标识1112以及绿色对位涂布标识1113；对位测试标识121包括红色对位测试标识1211、蓝色对位测试标识1212以及绿色对位测试标识1213。因此上面的参数num的取值为3。
使用本优选实施例的色阻掩膜板10配合光刻机制作色阻测试片时，
首先在色阻测试片的基板上涂布测试红色色阻层，然后使用色阻掩膜板10的对位测试标识区域12的红色对位测试标识1211、蓝色对位测试标识1212以及绿色对位测试标识1213，对色阻测试片的边缘的测试红色色阻层进行图形化处理，以在色阻测试片的边缘形成测试红色色阻构成的基板红色对位测试标识21、基板蓝色对位测试标识22以及基板绿色对位测试标识23。
随后使用色阻掩膜板10的图样掩膜区域13的掩膜图样，对色阻测试片中部的测试红色色阻层进行图形化处理，以在色阻测试片的中部形成测试红色色组图案R。具体的，这里通过以三倍相邻像素的间距距离移动色阻测试片（以越过测试蓝色色组图案和测试绿色色阻图案的区域），对色阻测试片中部的所有测试红色色阻层进行图形化处理，以在色阻测试片的中部形成测试红色色组图案R。这时色阻测试片的图案如图2A所示。为了清晰的表示图像，这里对测试红色色组图案R、基板红色对位测试标识21、基板蓝色对位测试标识22以及基板绿色对位测试标识23的尺寸比例以及位置进行调整。
然后在色阻测试片的基板上涂布测试蓝色色阻层，根据基板蓝色对位测试标识22以及蓝色对位涂布标识1112，对色阻掩膜板30的位置进行调整。即将色阻掩膜板30的蓝色对位涂布标识1112移动至基板的基板蓝色对位测试标识22处，或将基板的基板蓝色对位测试标识22移动至色阻掩膜板30的蓝色对位涂布标识1112处。由于蓝色对位涂布标识1112和相应的蓝色对位测试标识1212的间距满足d=num*n*p的条件，因此移动后的色阻掩膜板10的图样掩膜区域13的掩膜图样可以正对色阻测试片的测试蓝色色组图案22的区域。
随后使用色阻掩膜板10的图样掩膜区域13的掩膜图样，对色阻测试片中部的测试蓝色色阻层进行图形化处理，以在色阻测试片的中部形成测试蓝色色组图案B。具体的，这里通过以三倍相邻像素的间距的距离移动色阻测试片，对色阻测试片中部的所有测试蓝色色阻层进行图形化处理，以在色阻测试片的中部形成测试蓝色色组图案B。这时色阻测试片的图案如图2B所示。
随后在色阻测试片的基板上涂布测试绿色色阻层，根据基板绿色对位测试标识23以及绿色对位涂布标识1113，对色阻掩膜板30的位置进行调整。即将色阻掩膜板30的绿色对位涂布标识1113移动至基板的基板绿色对位测试标识23处，或将基板的基板绿色对位测试标识23移动至色阻掩膜板30的绿色对位涂布标识1113处。由于绿色对位涂布标识1113和相应的绿色对位涂布标识1213的间距满足d=num*n*p的条件，因此移动后的色阻掩膜板10的图样掩膜区域13的掩膜图样可以正对色阻测试片的测试绿色色组图案23的区域。
随后使用色阻掩膜板10的图样掩膜区域13的掩膜图样，对色阻测试片中部的测试绿色色阻层进行图形化处理，以在色阻测试片的中部形成测试绿色色组图案G。具体的，这里通过以三倍相邻像素的间距的距离移动色阻测试片，对色阻测试片中部的所有测试绿色色阻层进行图形化处理，以在色阻测试片的中部形成测试绿色色组图案G。这时色阻测试片的图案如图2C所示。
这样即完成了本优选实施例的色阻掩膜板10配合光刻机制作红绿蓝色阻测试片的制作过程。
优选的，本优选实施例的色阻掩膜板的对位涂布标识可包括红色对位涂布标识、蓝色对位涂布标识、绿色对位涂布标识以及黄色对位涂布标识。对位测试标识包括红色对位测试标识、蓝色对位测试标识、绿色对位测试标识以及黄色对位测试标识。这样只需要将对位涂布标识和相应的所述对位测试标识的间距d的满足条件d=num*n*p中的num设置为4，其他操作与上述的色阻测试片的制作过程相同或相似，同样可以完成红蓝绿黄的色阻测试片的制作。
本优选实施例的色阻掩膜板同时设置具有对位涂布标识的对位涂布标识区域以及具有对位测试标识的对位测试标识区域，同时根据相邻像素的间距确定对位涂布标识和相应的对位测试标识的间距。因此该色阻掩膜板既可用于制作色阻测试片，又可用于制作彩膜色阻，从而可有效的降低彩膜基板制作成本；解决了现有的彩膜基板的制作成本较高的技术问题。
本发明还提供一种色阻掩膜板的使用方法，其中色阻掩膜板的具体结构如上述色阻掩膜板的优选实施例中所述。请参照图3，图3为本发明的色阻掩膜板的使用方法的流程图。本优选实施例的色阻掩膜板的使用方法包括：
步骤S301，使用色阻掩膜板的对位测试标识区域的对位测试标识，对色阻测试片的边缘的测试色阻层进行图形化处理，以在色阻测试片的边缘形成测试色阻构成的基板对位测试标识。
步骤S302，根据基板对位测试标识以及对位涂布标识，使用色阻掩膜板的图样掩膜区域的掩膜图样，对色阻测试片的中部的测试色阻层进行图形化处理，以在色阻测试片的中部形成测试色阻构成的测试色阻图案。
下面详细说明本优选实施例的色阻掩膜板的使用方法的各步骤的具体流程。
在本优选实施例中，对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识。
在步骤S301中，在色阻测试片的基板上涂布测试红色色阻层，然后使用色阻掩膜板的对位测试标识区域的红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识，对色阻测试片的边缘的测试红色色阻层进行图形化处理，以在色阻测试片的边缘形成测试红色色阻构成的基板红色对位测试标识、基板蓝色对位测试标识以及基板绿色对位测试标识。随后转到步骤S302。
在步骤S302中，使用色阻掩膜板的图样掩膜区域的掩膜图样，对色阻测试片中部的测试红色色阻层进行图形化处理，以在色阻测试片的中部形成测试红色色组图案。
随后在色阻测试片的基板上涂布测试蓝色色阻层，根据基板蓝色对位测试标识以及蓝色对位涂布标识，对色阻掩膜板的位置进行调整。
然后使用色阻掩膜板的图样掩膜区域的掩膜图样，对色阻测试片中部的测试蓝色色阻层进行图形化处理，以在色阻测试片的中部形成测试蓝色色组图案。
随后在色阻测试片的基板上涂布测试绿色色阻层，根据基板绿色对位测试标识以及绿色对位涂布标识，对色阻掩膜板的位置进行调整。
然后使用色阻掩膜板的图样掩膜区域的掩膜图样，对色阻测试片中部的测试绿色色阻层进行图形化处理，以在色阻测试片的中部形成测试绿色色组图案。
这样即完成了本优选实施例的色阻掩膜板的制作红绿蓝色阻测试片的使用过程。
优选的，本优选实施例的色阻掩膜板的对位涂布标识可包括红色对位涂布标识、蓝色对位涂布标识、绿色对位涂布标识以及黄色对位涂布标识。对位测试标识包括红色对位测试标识、蓝色对位测试标识、绿色对位测试标识以及黄色对位测试标识。
优选的，对位测试标识的图样与对位涂布标识的图样不同；相邻的对位涂布标识之间的间距大于等于光刻机的单次曝光区域的边长，相邻的对位测试标识之间的横向间距大于等于光刻机的单次曝光区域的边长，相邻的对位测试标识之间的纵向间距等于相邻像素的纵向间距。
优选的，对位涂布标识和相应的对位测试标识的间距满足：
d=num*n*p；
其中d为对位涂布标识和相应的对位测试标识的间距，num为对位涂布标识区域中的对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于光刻机的单次曝光区域的边长。
本优选实施例的色阻掩膜板的使用方法的具体实施过程与上述的色阻掩膜板的优选实施例中的相关描述相同，具体请参见上述色阻掩膜板的优选实施例中的相关描述。
本发明的色阻掩膜板及其使用方法，通过在同一掩膜板上同时设置具有对位涂布标识的对位涂布标识区域以及具有对位测试标识的对位测试标识区域，同时根据相邻像素的间距确定对位涂布标识和相应的对位测试标识的间距；从而可有效的降低彩膜基板制作成本；解决了现有的彩膜基板的制作成本较高的技术问题。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (19)

  1. 一种色阻掩膜板，用于配合光刻机制作色阻测试片，其包括：
    对位测试标识区域，包括多个等间距的对位测试标识；
    对位涂布标识区域，包括多个等间距的对位涂布标识，其中所述对位涂布标识和所述对位测试标识配合对测试色阻的涂布区域进行定位；以及
    图样掩膜区域，包括多个用于涂布所述测试色阻的掩膜图样；
    其中所述对位测试标识和所述对位涂布标识一一对应；根据相邻像素的间距以及所述光刻机的单次曝光区域的边长确定相邻的所述对位涂布标识之间的间距，以及相邻的所述对位测试标识之间的间距；根据相邻像素的间距确定所述对位涂布标识和相应的所述对位测试标识的间距；
    其中所述对位测试标识的图样与所述对位涂布标识的图样不同；
    其中相邻的所述对位涂布标识之间的间距大于等于所述光刻机的单次曝光区域的边长，相邻的所述对位测试标识之间的横向间距大于等于所述光刻机的单次曝光区域的边长，相邻的所述对位测试标识之间的纵向间距等于所述相邻像素的纵向间距。
  2. 根据权利要求1所述的色阻掩膜板，其中所述对位涂布标识和相应的所述对位测试标识的间距满足：
    d=num*n*p；
    其中d为对位涂布标识和相应的对位测试标识的间距，num为所述对位涂布标识区域中的所述对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于所述光刻机的单次曝光区域的边长。
  3. 根据权利要求1所述的色阻掩膜板，其中所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；
    所述对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识。
  4. 根据权利要求1所述的色阻掩膜板，其中所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识、绿色对位涂布标识以及黄色对位涂布标识；
    所述对位测试标识包括红色对位测试标识、蓝色对位测试标识、绿色对位测试标识以及黄色对位测试标识。
  5. 一种色阻掩膜板，用于配合光刻机制作色阻测试片，其包括：
    对位测试标识区域，包括多个等间距的对位测试标识；
    对位涂布标识区域，包括多个等间距的对位涂布标识，其中所述对位涂布标识和所述对位测试标识配合对测试色阻的涂布区域进行定位；以及
    图样掩膜区域，包括多个用于涂布所述测试色阻的掩膜图样；
    其中所述对位测试标识和所述对位涂布标识一一对应；根据相邻像素的间距以及所述光刻机的单次曝光区域的边长确定相邻的所述对位涂布标识之间的间距，以及相邻的所述对位测试标识之间的间距；根据相邻像素的间距确定所述对位涂布标识和相应的所述对位测试标识的间距。
  6. 根据权利要求5所述的色阻掩膜板，其中所述对位测试标识的图样与所述对位涂布标识的图样不同。
  7. 根据权利要求5所述的色阻掩膜板，其中相邻的所述对位涂布标识之间的间距大于等于所述光刻机的单次曝光区域的边长。
  8. 根据权利要求5所述的色阻掩膜板，其中相邻的所述对位测试标识之间的横向间距大于等于所述光刻机的单次曝光区域的边长。
  9. 根据权利要求5所述的色阻掩膜板，其中相邻的所述对位测试标识之间的纵向间距等于所述相邻像素的纵向间距。
  10. 根据权利要求5所述的色阻掩膜板，其中所述对位涂布标识和相应的所述对位测试标识的间距满足：
    d=num*n*p；
    其中d为对位涂布标识和相应的对位测试标识的间距，num为所述对位涂布标识区域中的所述对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于所述光刻机的单次曝光区域的边长。
  11. 根据权利要求5所述的色阻掩膜板，其中所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；
    所述对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识。
  12. 根据权利要求5所述的色阻掩膜板，其中所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识、绿色对位涂布标识以及黄色对位涂布标识；
    所述对位测试标识包括红色对位测试标识、蓝色对位测试标识、绿色对位测试标识以及黄色对位测试标识。
  13. 一种色阻掩膜板的使用方法，用于配合光刻机制作色阻测试片，其中所述色阻掩膜板包括：
    对位测试标识区域，包括多个等间距的对位测试标识；
    对位涂布标识区域，包括多个等间距的对位涂布标识，其中所述对位涂布标识和所述对位测试标识配合对测试色阻的涂布区域进行定位；以及
    图样掩膜区域，包括多个用于涂布所述测试色阻的掩膜图样；
    其中所述对位测试标识和所述对位涂布标识一一对应；根据相邻像素的间距以及所述光刻机的单次曝光区域的边长确定相邻的所述对位涂布标识之间的间距，以及相邻的所述对位测试标识之间的间距；根据相邻像素的间距确定所述对位涂布标识和相应的所述对位测试标识的间距；
    所述色阻掩膜板的使用方法包括：
    使用所述色阻掩膜板的所述对位测试标识区域的所述对位测试标识，对所述色阻测试片的边缘的测试色阻层进行图形化处理，以在所述色阻测试片的边缘形成所述测试色阻构成的基板对位测试标识；以及
    根据所述基板对位测试标识以及所述对位涂布标识，使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片的中部的测试色阻层进行图形化处理，以在所述色阻测试片的中部形成所述测试色阻构成的测试色阻图案。
  14. 根据权利要求13所述的色阻掩膜板的使用方法，其中
    所述对位涂布标识包括红色对位涂布标识、蓝色对位涂布标识以及绿色对位涂布标识；
    所述对位测试标识包括红色对位测试标识、蓝色对位测试标识以及绿色对位测试标识；
    所述色阻掩膜板的使用方法包括：
    涂布测试红色色阻层；
    使用所述色阻掩膜板的所述对位测试标识区域的所述红色对位测试标识、所述蓝色对位测试标识以及所述绿色对位测试标识，对所述色阻测试片的边缘的测试红色色阻层进行图形化处理，以在所述色阻测试片的边缘形成所述测试色阻构成的基板红色对位测试标识、基板蓝色对位测试标识以及基板绿色对位测试标识；
    使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片中部的测试红色色阻层进行图形化处理，以在所述色阻测试片的中部形成测试红色色阻图案；
    涂布测试蓝色色阻层；
    根据所述基板蓝色对位测试标识以及所述蓝色对位涂布标识，对色阻掩膜板的位置进行调整；
    使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片中部的测试蓝色色阻层进行图形化处理，以在所述色阻测试片的中部形成测试蓝色色阻图案；
    涂布测试绿色色阻层；
    根据所述基板绿色对位测试标识以及所述绿色对位涂布标识，对色阻掩膜板的位置进行调整；
    使用所述色阻掩膜板的所述图样掩膜区域的所述掩膜图样，对所述色阻测试片中部的测试绿色色阻层进行图形化处理，以在所述色阻测试片的中部形成测试绿色色阻图案。
  15. 根据权利要求13所述的色阻掩膜板的使用方法，其中所述对位测试标识的图样与所述对位涂布标识的图样不同。
  16. 根据权利要求13所述的色阻掩膜板的使用方法，其中相邻的所述对位涂布标识之间的间距大于等于所述光刻机的单次曝光区域的边长。
  17. 根据权利要求13所述的色阻掩膜板的使用方法，其中相邻的所述对位测试标识之间的横向间距大于等于所述光刻机的单次曝光区域的边长。
  18. 根据权利要求13所述的色阻掩膜板的使用方法，其中相邻的所述对位测试标识之间的纵向间距等于所述相邻像素的纵向间距。
  19. 根据权利要求13所述的色阻掩膜板的使用方法，其中所述对位涂布标识和相应的所述对位测试标识的间距满足：
    d=num*n*p；
    其中d为对位涂布标识和相应的对位测试标识的间距，num为所述对位涂布标识区域中的所述对位涂布标识的数量，p为相邻像素的间距，n为大于1的任意正整数，d大于所述光刻机的单次曝光区域的边长。
PCT/CN2015/093977 2015-10-22 2015-11-06 色阻掩膜板及其使用方法 WO2017067024A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/896,672 US9891464B2 (en) 2015-10-22 2015-11-06 Color resist mask sheet and method of use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510691024.0 2015-10-22
CN201510691024.0A CN105182680B (zh) 2015-10-22 2015-10-22 色阻掩膜板及其使用方法

Publications (1)

Publication Number Publication Date
WO2017067024A1 true WO2017067024A1 (zh) 2017-04-27

Family

ID=54904852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/093977 WO2017067024A1 (zh) 2015-10-22 2015-11-06 色阻掩膜板及其使用方法

Country Status (3)

Country Link
US (1) US9891464B2 (zh)
CN (1) CN105182680B (zh)
WO (1) WO2017067024A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106019814B (zh) * 2016-05-30 2019-11-12 京东方科技集团股份有限公司 掩膜板及膜层的制备方法
CN106647011A (zh) 2017-03-14 2017-05-10 京东方科技集团股份有限公司 显示基板的制作方法、显示基板、显示面板和显示装置
CN107065281B (zh) 2017-04-12 2020-07-03 深圳市华星光电技术有限公司 一种彩色色阻的制作方法
CN107065283B (zh) * 2017-04-17 2020-04-07 深圳市华星光电半导体显示技术有限公司 高ppi面板cf光罩共用的方法
CN108564560B (zh) * 2017-12-29 2021-05-11 深圳市华星光电半导体显示技术有限公司 基于色阻颜色的对位方法及对位系统
CN108089368B (zh) * 2018-01-15 2022-04-19 京东方科技集团股份有限公司 彩膜基板及制备方法、显示装置
CN113189812B (zh) * 2021-04-29 2022-11-29 滁州惠科光电科技有限公司 彩色滤光层制作方法、相关基板及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06273947A (ja) * 1993-03-17 1994-09-30 Topcon Corp 露光装置及び露光工程におけるアライメント方法
JP2001124922A (ja) * 1999-10-28 2001-05-11 Sharp Corp 露光用マスクおよびそれを用いたカラーフィルタ基板の製造方法
JP2003287873A (ja) * 2002-03-27 2003-10-10 Kyocera Corp フォトマスク、基準基板および露光機ならびにカラーフィルターの製造方法
CN101140424A (zh) * 2007-09-20 2008-03-12 上海微电子装备有限公司 一种分段交错对准标记组合及其对准方法
CN103969873A (zh) * 2014-04-23 2014-08-06 京东方科技集团股份有限公司 用于将掩膜版和基板对齐的方法及彩膜基板的制造方法
CN104808434A (zh) * 2015-05-21 2015-07-29 合肥京东方光电科技有限公司 基板、掩膜板及显示装置、对位方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62108206A (ja) * 1985-11-06 1987-05-19 Canon Inc カラ−フィルタ−の製造方法
JPH09171106A (ja) * 1995-10-19 1997-06-30 Fuji Photo Film Co Ltd カラーフィルターの作製方法
JP3816274B2 (ja) * 1999-07-19 2006-08-30 凸版印刷株式会社 カラーフィルタの製造方法およびそれに用いる露光方法
CN103744214B (zh) * 2013-12-31 2016-08-17 深圳市华星光电技术有限公司 一种液晶显示器的玻璃基板的曝光方法
JP2015129831A (ja) * 2014-01-07 2015-07-16 凸版印刷株式会社 カラーフィルタの製造方法およびカラーフィルタ
CN104317158B (zh) * 2014-11-14 2018-05-22 京东方科技集团股份有限公司 一种掩膜板、掩膜板组、彩膜基板及显示装置
CN104808451B (zh) * 2015-05-15 2017-07-18 合肥京东方光电科技有限公司 一种对位曝光方法
CN105158962A (zh) * 2015-08-24 2015-12-16 武汉华星光电技术有限公司 一种彩色滤光片及其制作方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06273947A (ja) * 1993-03-17 1994-09-30 Topcon Corp 露光装置及び露光工程におけるアライメント方法
JP2001124922A (ja) * 1999-10-28 2001-05-11 Sharp Corp 露光用マスクおよびそれを用いたカラーフィルタ基板の製造方法
JP2003287873A (ja) * 2002-03-27 2003-10-10 Kyocera Corp フォトマスク、基準基板および露光機ならびにカラーフィルターの製造方法
CN101140424A (zh) * 2007-09-20 2008-03-12 上海微电子装备有限公司 一种分段交错对准标记组合及其对准方法
CN103969873A (zh) * 2014-04-23 2014-08-06 京东方科技集团股份有限公司 用于将掩膜版和基板对齐的方法及彩膜基板的制造方法
CN104808434A (zh) * 2015-05-21 2015-07-29 合肥京东方光电科技有限公司 基板、掩膜板及显示装置、对位方法

Also Published As

Publication number Publication date
US9891464B2 (en) 2018-02-13
US20170115526A1 (en) 2017-04-27
CN105182680A (zh) 2015-12-23
CN105182680B (zh) 2019-12-17

Similar Documents

Publication Publication Date Title
WO2017067024A1 (zh) 色阻掩膜板及其使用方法
WO2019015020A1 (zh) 一种液晶显示面板的制作方法
WO2013166735A1 (zh) 彩色滤光片及其制作方法
WO2014107890A1 (zh) 彩色滤光片基板及其制造方法和液晶面板
WO2013166736A1 (zh) 液晶显示面板和液晶显示器
WO2014047982A1 (zh) 彩色滤光基板以及其相关制作方法
WO2018023855A1 (zh) Oled薄膜封装结构及其制作方法
WO2016058172A1 (zh) 一种coa基板及其制作方法
WO2017008340A1 (zh) 显示面板及其制作方法
WO2010134779A2 (en) Half tone mask having multi half permeation part and manufacturing method of the same
WO2019223296A1 (zh) 一种显示面板的制作方法和显示面板
WO2020082431A1 (zh) 彩膜基板和显示面板
WO2017008318A1 (zh) 一种阵列基板及其制作方法
WO2020135023A1 (zh) 显示装置、阵列基板及其工艺方法
WO2019051968A1 (zh) 彩膜基板的制作方法
WO2016095251A1 (zh) 一种液晶显示面板的制作方法
WO2013177823A1 (zh) 液晶面板及其彩色滤光片基板和制造方法
WO2013143183A1 (zh) 光刻蚀方法及曝光系统
WO2017015940A1 (zh) 一种阵列基板及其制作方法
WO2018032558A1 (zh) 一种阵列基板及其制作方法
WO2017173686A1 (zh) 一种液晶显示面板及其制作方法
KR100816340B1 (ko) 액정 표시 장치 제조용 노광 마스크와 이를 이용한 액정표시 장치 제조에서의 기판의 노광 방법
WO2016090690A1 (zh) 一种ltps像素单元及其制造方法
WO2018205345A1 (zh) 一种掩膜板以及阵列基板的制备方法
WO2017201772A1 (zh) 阵列基板、液晶显示面板及阵列基板的制造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14896672

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15906541

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15906541

Country of ref document: EP

Kind code of ref document: A1