WO2016188371A1 - 硅片传输系统 - Google Patents

硅片传输系统 Download PDF

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Publication number
WO2016188371A1
WO2016188371A1 PCT/CN2016/082790 CN2016082790W WO2016188371A1 WO 2016188371 A1 WO2016188371 A1 WO 2016188371A1 CN 2016082790 W CN2016082790 W CN 2016082790W WO 2016188371 A1 WO2016188371 A1 WO 2016188371A1
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WO
WIPO (PCT)
Prior art keywords
silicon wafer
arm
hand
linear motor
robot
Prior art date
Application number
PCT/CN2016/082790
Other languages
English (en)
French (fr)
Inventor
刘凯
胡松立
姜杰
Original Assignee
上海微电子装备有限公司
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Filing date
Publication date
Application filed by 上海微电子装备有限公司 filed Critical 上海微电子装备有限公司
Priority to JP2018512474A priority Critical patent/JP6592591B2/ja
Priority to EP16799259.3A priority patent/EP3306397B1/en
Priority to US15/576,070 priority patent/US10254661B2/en
Priority to KR1020177036282A priority patent/KR102050004B1/ko
Priority to SG11201709649XA priority patent/SG11201709649XA/en
Publication of WO2016188371A1 publication Critical patent/WO2016188371A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B25J9/0087—Dual arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/14—Arm movement, spatial
    • Y10S901/17—Cylindrical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/19—Drive system for arm
    • Y10S901/23—Electric motor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Definitions

  • the present invention relates to the field of lithography machines, and more particularly to a silicon wafer transmission system.
  • microelectronics technology has promoted the upgrading of computer technology, communication technology and other electronic information technology. It plays an important role in the information industry revolution.
  • the lithography machine is an indispensable tool in the manufacturing of microelectronic devices. .
  • the invention provides a silicon wafer transmission system to solve the problem that the silicon wafer transmission rate is slow in the existing lithography machine.
  • the present invention provides a silicon wafer transmission system for a lithography system, the lithography system including a silicon memory device, a pre-alignment device, a buffer table, and a workpiece stage.
  • the silicon wafer transfer system includes: a two-arm robot for taking out and transferring the silicon wafer to be exposed from the silicon wafer storage device to the pre-alignment device, and from the cache The stage removes the exposed silicon wafer and puts it back into the silicon wafer storage device; a top sheet straight hand for moving the pre-aligned silicon wafer to the workpiece stage; and a lower sheet straight hand for The wafer after the exposure is completed is moved to the buffer table.
  • the dual-arm manipulator comprises: a robot body, an upper arm and a lower arm movably connected to the robot body.
  • the upper linear hand and the lower linear hand each comprise: a fork, a linear motor and a slider, wherein the fork is connected to the movable end of the linear motor through the slider .
  • the linear motor comprises a linear motor stator, a slide rail and a linear motor mover
  • the slide rail is disposed on the linear motor stator
  • the linear motor mover drives the fork by the slider Move along the slide rails.
  • the sheet fork comprises: a connecting arm fixed to the slider, a connecting member fixed to the connecting arm, and two pieces of the bearing surface fixed on the connecting member and symmetrically disposed.
  • At least two rubber suction cups are disposed on the carrier surface.
  • each of the at least two rubber suction cups comprises: a rigid adsorption portion, a flared rubber disk disposed around the rigid adsorption portion, and a sealing sheet disposed at a bottom of the rigid adsorption portion, A vacuum air passage is formed between the sealing piece and the rigid adsorption portion, and the rigid adsorption portion is provided with a through hole communicating with the vacuum air passage.
  • At least two of the dual-arm manipulator, the upper-sheet straight hand, and the lower-sheet straight hand operate in a parallel manner.
  • the wafer transport system is compatible with silicon wafers carrying 2, 3, 4, 5, 6, and 8 inches by providing a distance between the two sheet faces of the sheet fork.
  • the dual-arm manipulator employs a cylindrical coordinate robot with two robot arms.
  • the present invention has the following advantages:
  • the two-arm manipulator does not need to be handed over to the workpiece table, which reduces the pressure on the two-arm manipulator;
  • the two-arm manipulator, the upper straight hand and the lower straight hand can be operated in parallel to save the transmission time of the silicon wafer.
  • FIG. 1 is a schematic structural view of a silicon wafer transmission system according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a dual-arm manipulator in a silicon wafer transmission system according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of an upper/lower straight line hand in a silicon wafer transmission system according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of a sheet fork in a silicon wafer transmission system according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of application of a slice fork in a silicon wafer transmission system according to an embodiment of the present invention
  • FIG. 6 is a schematic perspective structural view of a rubber suction cup in a silicon wafer transmission system according to an embodiment of the present invention
  • FIG. 7 is a schematic structural view of a rubber suction cup in a silicon wafer transmission system according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of an initial state of a silicon wafer transmission system according to an embodiment of the present invention.
  • 9-11 are schematic diagrams showing the transfer of silicon wafers in different processes in a silicon wafer transmission system according to an embodiment of the present invention.
  • FIG 12-14 are schematic views showing the push pins of the workpiece stage in different positions in the silicon wafer transfer system according to an embodiment of the present invention.
  • 301-chip fork 3011-sheet surface, 3012-connecting member, 3013-connecting arm, 3014a-rigid adsorption portion, 3014b-rubber disk, 3014c-sealing sheet, 3014d-vacuum air passage, 3014e-through hole;
  • 400-silicon memory device 500-pre-aligned device, 600-workpiece table, 700-cache station, 800-handover wait bit.
  • the silicon wafer transfer system of the present invention comprises: a dual-arm manipulator 100, a top-sheet straight hand 200 and a lower-sheet straight hand 300; wherein the dual-arm manipulator 100 is from the silicon wafer storage device 400.
  • the silicon wafer to be exposed is taken out and transferred to the pre-alignment device 500, and the exposed silicon wafer is removed from the buffer table 700 and placed back into the silicon wafer storage device 400; the upper linear hand 200 is used for pre-aligning
  • the succeeding silicon wafer is moved to the workpiece stage 600, and the lower linear hand 300 moves the exposed wafer to the buffer stage 700.
  • the present invention realizes the silicon wafer in the silicon wafer storage device 400, the pre-alignment device 500, the workpiece table 600, and the buffer table 700 by using a dual-arm robot 100, a top-sheet linear hand 200, and a lower-sheet linear hand 300.
  • the circulation reduces the cycle time of the dual-arm manipulator 100 to take and place the film from the silicon memory device 400, thereby improving the yield of the silicon wafer.
  • the workflow is that the upper arm of the dual-arm manipulator 100 (described later) is responsible for taking a silicon wafer to be exposed from the silicon memory device 400 and then moving to the buffer table 700 through the lower arm (described later).
  • the exposed silicon wafer is taken out, the silicon wafer to be exposed is placed on the pre-alignment device 500, and the exposed silicon wafer is finally returned to the silicon wafer storage device 400;
  • the upper linear hand 200 It is responsible for placing the pre-aligned silicon wafer on the workpiece table 600 for exposure;
  • the lower sheet straight hand 300 is responsible for placing the exposed silicon wafer on the buffer table 700 for cyclic operation, and the dual-arm robot 100 does not need to be attached to the workpiece table 600.
  • Handover simplifying the robot handoff process and reducing the manipulator Take and place the wafer cycle time.
  • the dual-arm manipulator 100 of the present invention selects a cylindrical coordinate robot with two robot arms for implementing the silicon wafer in the silicon memory storage device 400, the pre-alignment device 500, and the buffer table 700. Between the flow.
  • the dual-arm manipulator 100 includes a robot body 101, an upper arm 102 and a lower arm 103 movably coupled to the robot body 101.
  • the upper and lower blade arms 102, 103 are identical, and the rotation performs different actions.
  • the upper linear hand 200 is responsible for placing the pre-aligned silicon wafer on the workpiece stage 600
  • the lower linear hand 300 is responsible for placing the exposed silicon wafer on the buffer table 700.
  • the upper linear hand 200 and the lower linear hand 300 each include a slice fork 301, a linear motor and a slider 304
  • the linear motor includes a linear motor stator 302, a slide rail 305, and a linear motor mover 303.
  • the slide rail 305 is disposed on the linear motor stator 302, and the linear motor mover 303 drives the sheet fork 301 to move along the slide rail 305 through the slider 304, thereby realizing the sheet fork 301 in a horizontal direction. Linear motion.
  • the fork 301 includes a connecting arm 3013 fixed to the slider 304, and a connecting member 3012 fixed to the connecting arm 3013 is fixed on the connecting member 3012 and symmetrically disposed.
  • the receiving surface 3011 further, one end of the receiving surface 3011 is a right-angled trapezoid, and the other end is rectangular, which is convenient for receiving the silicon wafer, and as shown in FIG. 5, by setting the distance between the two bearing surfaces 3011,
  • the sheet fork 301 can be compatible with 2, 3, 4, 5, 6, or 8 inch silicon wafers, bonding sheets or warped sheets, and has good compatibility.
  • the bearing surface 3011 is further provided with a rubber suction cup 3014 for adsorbing the silicon wafer.
  • the rubber suction cup 3014 is disposed on the side of the two bearing surfaces 3011 adjacent to each other to ensure that it can adsorb silicon wafers of various sizes. .
  • the rubber suction cup 3014 includes a rigid suction portion 3014a, a flared rubber disk 3014b disposed around the rigid adsorption portion 3014a, and a sealing piece 3014c disposed at the bottom of the rigid adsorption portion 3014a.
  • a vacuum air passage 3014d is disposed between the sealing piece 3014c and the rigid suction portion 3014a, and a through hole 3014e communicating with the vacuum air passage 3014d is opened in the rigid adsorption portion 3014a.
  • the initial state of the silicon wafer transfer system of the present invention is: the buffer table 700 has an exposed silicon wafer, specifically located at the intersection of the buffer table 700; the upper linear hand 200 has no silicon wafer, The sheet fork 301 is located at the transfer waiting position 800; the pre-alignment device 500 has a pre-aligned silicon wafer, specifically located at the intersection high position of the pre-alignment device 500; the upper arm 102 of the dual-arm robot 100 has a pre-alignment
  • the wafer 44 is empty and is located at the position of the buffer table 700.
  • the workpiece table 600 has an exposed silicon wafer, specifically located at the intersection of the workpiece table 600.
  • the lower arm 103 of the dual-arm manipulator 100 removes the exposed silicon wafer from the buffer table 700, while the workpiece table 600 moves to the lower position, and the lower-sheet straight hand 300 moves to the workpiece table 600.
  • the exposed silicon wafer is removed, and the upper linear hand 200 is moved to the intersection of the pre-alignment device 500 to remove the pre-aligned silicon wafer.
  • the upper arm 102 of the dual-arm manipulator 100 is moved to the intersection of the pre-alignment device 500, and the silicon wafer to be pre-aligned is placed on the pre-alignment device 500, while the workpiece table 600 is moved.
  • the upper linear hand 200 carries the pre-aligned silicon wafer to the workpiece table 600 for transfer
  • the lower linear hand 300 carries the exposed silicon wafer to the buffer table 700.
  • the lower arm 103 of the dual-arm manipulator 100 is moved to the silicon wafer storage device 400 to place the exposed silicon wafer into the device, and the upper wafer arm 102 is moved to the silicon wafer storage device 400.
  • the silicon wafer to be pre-aligned is taken out, and at the same time, the workpiece table 600 is moved to the exposure position exposure, the upper linear hand 200 is moved to the transfer waiting position 800, and the lower linear hand 300 transfers the exposed silicon wafer to the buffer table 700.
  • the workflow of the silicon wafer transmission system can be planned according to the needs to save the transmission time of the silicon wafer.
  • Table 1 lists the various workflows of the silicon wafer transmission system of the present invention, and respectively gives the dual-arm manipulator 100 and the upper film straight line. The hand 200 and the lower straight hand 300 take time for each process.
  • the cycle period of the silicon wafer is 14.5S, and the yield is 248WPH, which improves the transmission efficiency of the wafer transmission system, thereby improving the yield of the lithography machine.
  • the dual-arm manipulator 100 of the present invention does not need to be handed over to the workpiece table 600, and the process time 11.3S can be saved. When the dual-arm manipulator 100 is handed over to the pre-alignment device 500, only the upper arm 102 of the dual-arm manipulator 100 places the silicon wafer.
  • the pre-alignment device 500 is realized by the upper linear hand 200, and does not need to be operated by the lower arm 103 of the dual-arm robot 100, so that the pre-alignment time can be saved. 3.7S.

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

一种硅片传输系统，用于光刻系统，该光刻系统包括一硅片存储装置(400)、一预对准装置(500)、一缓存台(700)以及一工件台(600)，所述硅片传输系统包括：一双臂机械手(100)，用于从所述硅片存储装置(400)中将待曝光的硅片取出并移送到所述预对准装置(500)上，并从所述缓存台(700)将曝光完成的硅片取下放回至所述硅片存储装置(400)中；一上片直线手(200)，用于将预对准后的硅片移动至所述工件台(600)；以及一下片直线手(300)，用于将曝光完成后的硅片移动至所述缓存台(700)。所述双臂机械手(100)、上片直线手(200)和下片直线手(300)可以并行动作，达到节省硅片传输时间的目的。

Description

硅片传输系统 技术领域
本发明涉及光刻机领域，特别涉及一种硅片传输系统。
背景技术
微电子技术的发展促进了计算机技术、通信技术和其它电子信息技术的更新换代，在信息产业革命中起着重要的先导和基础作用，光刻机是微电子器件制造业中不可或缺的工具。
为了降低芯片制造成本，使用者对光刻机的产率要求越来越高。光刻机生产商在市场与利益驱动下，也不断进行光刻机的产率提升。同时，为了能够迎合市场多变的需求，需要能够兼容多种硅片尺寸。
光刻机产率提升的重要技术点是硅片传输系统的产率提升。在工件台载着硅片曝光完，需要一张新的硅片情况下，硅片传输必须保证已经提前做好了与工件台进行交接硅片的准备工作。所以，硅片传输的产率要大于光刻机自身的产率。
提升硅片传输的产率一般有两种途径，一是不断提高传输机械手的运动性能，即其速度、加速度、稳定时间等，二是优化硅片传输的系统配置，即通过预对准、机械手等设备布局。但是，目前的设备生产商仅通过提升机械手的运动性能来提高光刻机产率。
发明内容
本发明提供一种硅片传输系统，以解决现有光刻机中硅片传输速率较慢的问题。
为解决上述技术问题，本发明提供一种硅片传输系统，用于光刻系统，该光刻系统包括一硅片存储装置、一预对准装置、一缓存台以及一工件台， 其特征在于，所述硅片传输系统包括：一双臂机械手，用于从所述硅片存储装置中将待曝光的硅片取出并移送到所述预对准装置上，并从所述缓存台将曝光完成的硅片取下放回至所述硅片存储装置中；一上片直线手，用于将预对准后的硅片移动至所述工件台；以及一下片直线手，用于将曝光完成后的硅片移动至所述缓存台。
作为优选，所述双臂机械手包括：一机械手本体，与机械手本体活动连接的一上片臂和一下片臂。
作为优选，所述上片直线手和所述下片直线手均包括：一片叉、一直线电机和一滑块，其中，所述片叉通过所述滑块与所述直线电机的活动端连接。
作为优选，所述直线电机包括一直线电机定子、一滑轨和一直线电机动子，所述滑轨设置在所述直线电机定子上，所述直线电机动子通过所述滑块带动片叉沿所述滑轨运动。
作为优选，所述片叉包括：与所述滑块固接的连接臂，与所述连接臂固接的一连接件，固定在所述连接件上且对称设置的两片承片面。
作为优选，所述承片面上还设置有至少两个橡胶吸盘。
作为优选，所述至少两个橡胶吸盘中的每一个包括：一刚性吸附部、围绕所述刚性吸附部设置的一喇叭状橡胶盘和设置在所述刚性吸附部底部的一密封片，所述密封片与所述刚性吸附部之间形成真空气道，所述刚性吸附部开设有与所述真空气道连通的通孔。
作为优选，所述双臂机械手、所述上片直线手和所述下片直线手中的至少两个以并行方式工作。
作为优选，通过设置所述片叉的两片承片面间的距离，所述硅片传输系统能够兼容承载2、3、4、5、6、8英寸的硅片。
作为优选，所述双臂机械手采用带两个机械臂的圆柱坐标式机械手。
与现有技术相比，本发明具有以下优点：
1、双臂机械手不需要与工件台交接，减轻了双臂机械手的压力；
2、上、下片直线手的片叉无垂向运动轴，实现与工件台、预对准、机械手的交接；
3、利用上、下片直线手，分别负责从工件台上片与下片，提高交接时间；
4、通过上、下片直线手片叉的设计，能够兼容承接2、3、4、5、6、8英寸硅片、键合片、翘曲片；
5、所述双臂机械手、上片直线手和下片直线手可以并行动作，达到节省硅片传输时间的目的。
附图说明
图1为本发明一具体实施方式中硅片传输系统的结构示意图；
图2为本发明一具体实施方式中硅片传输系统中双臂机械手的结构示意图；
图3为本发明一具体实施方式中硅片传输系统中上/下片直线手的结构示意图；
图4为本发明一具体实施方式中硅片传输系统中片叉的结构示意图；
图5为本发明一具体实施方式中硅片传输系统中片叉的应用示意图；
图6为本发明一具体实施方式中硅片传输系统中橡胶吸盘的立体结构示意图；
图7为本发明一具体实施方式中硅片传输系统中橡胶吸盘的结构示意图；
图8为本发明一具体实施方式中硅片传输系统的初始状态示意图；
图9-11为本发明一具体实施方式中硅片传输系统中不同流程下硅片交接示意图；
图12-14为本发明一具体实施方式中硅片传输系统中工件台的推顶销位于不同位置时示意图。
图中所示：100-双臂机械手、101-机械手本体、102-上片臂、103-下片臂；
200-上片直线手、300-下片直线手；
301-片叉、3011-承片面、3012-连接件、3013-连接臂、3014a-刚性吸附部、3014b-橡胶盘、3014c-密封片、3014d-真空气道、3014e-通孔；
302-直线电机定子、303-直线电机动子、304-滑块、305-滑轨；
400-硅片存储装置、500-预对准装置、600-工件台、700-缓存台、800-交接等待位。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
如图1至图7所示，本发明的硅片传输系统，包括：双臂机械手100、上片直线手200和下片直线手300；其中，所述双臂机械手100从硅片存储装置400中将待曝光的硅片取出并移送到预对准装置500上，并从缓存台700将曝光完成的硅片取下放回硅片存储装置400中；上片直线手200用于将预对准后的硅片移动至工件台600，下片直线手300将曝光完成后的硅片移动至缓存台700。具体地，本发明通过一个双臂机械手100、上片直线手200、下片直线手300配合使用，实现了硅片在硅片存储装置400、预对准装置500、工件台600、缓存台700的流转，减少了双臂机械手100从硅片存储装置400取放片的循环时间，提高了硅片产率。其工作流程为双臂机械手100的上片臂(见后文描述)负责从硅片存储装置400中取出一待曝光的硅片，然后运动至缓存台700通过下片臂(见后文描述)将另一曝光后的硅片取出，再将所述待曝光的硅片放至预对准装置500上，最后将所述曝光后的硅片放回硅片存储装置400；上片直线手200负责将预对准后的硅片放到工件台600上进行曝光；下片直线手300负责将曝光后的硅片放到缓存台700上，循环作业，双臂机械手100不需要与工件台600交接，简化了机械手交接流程，减少了机械手 取放硅片循环时间。
请重点参照图2，结合图1，本发明中双臂机械手100选用带两个机械臂的圆柱坐标式机械手，用来实现硅片在硅片存储装置400、预对准装置500和缓存台700之间的流转。所述双臂机械手100包括：机械手本体101，与机械手本体101活动连接的上片臂102和下片臂103。所述上、下片臂102、103完全相同，轮替执行不同动作。
请重点参照图3，结合图1，上片直线手200负责将预对准后的硅片放到工件台600，下片直线手300负责将曝光后的硅片放到缓存台700上。本发明中，所述上片直线手200和下片直线手300均包括：片叉301、直线电机和滑块304，所述直线电机包括直线电机定子302、滑轨305和直线电机动子303，所述滑轨305设置在所述直线电机定子302上，所述直线电机动子303通过所述滑块304带动片叉301沿所述滑轨305运动，从而实现片叉301在水平向的直线运动。
进一步的，请参照图4，所述片叉301包括：与滑块304固接的连接臂3013，与所述连接臂3013固接的连接件3012，固定在所述连接件3012上且对称设置的承片面3011，进一步的，所述承片面3011上的一端为直角梯形，另一端为矩形，便于承接硅片，且如图5所示，通过设置两承片面3011之间的距离，使所述片叉301能够兼容承接2、3、4、5、6、8英寸硅片、键合片或翘曲片，兼容性好。所述承片面3011上还设置有橡胶吸盘3014，用于吸附硅片，较佳的，所述橡胶吸盘3014设置在两承片面3011相互接近的一侧，确保其可以吸附各种尺寸的硅片。
请重点参照图6和图7，所述橡胶吸盘3014包括：刚性吸附部3014a、围绕所述刚性吸附部3014a设置的喇叭状橡胶盘3014b和设置在所述刚性吸附部3014a底部的密封片3014c，所述密封片3014c与刚性吸附部3014a之间设置有真空气道3014d，所述刚性吸附部3014a中开设有与所述真空气道3014d连通的通孔3014e。
如图8-10所示为本发明硅片传输系统实际工作时的一具体实施过程。如图8所示，本发明的硅片传输系统工作时的初始状态为：缓存台700有一张曝光完的硅片，具体位于缓存台700的交接位；上片直线手200无硅片，其片叉301位于交接等待位800；预对准装置500上有一张预对准完成的硅片，具体位于预对准装置500的交接高位；双臂机械手100的上片臂102有一张待预对准的硅片，下片臂103为空且位于缓存台700位置处；工件台600上有一张曝光完的硅片，具体位于工件台600的交接位。
如图9所示，双臂机械手100的下片臂103从缓存台700取下曝光后的硅片，同时，工件台600运动至下片位，下片直线手300移动至工件台600的交接位取下曝光后的硅片，上片直线手200运动至预对准装置500的交接位取下预对准后的硅片。
之后，如图10所示，双臂机械手100的上片臂102运动至预对准装置500的交接位，将待预对准的硅片放置预对准装置500上，同时，工件台600运动至上片位，上片直线手200携带预对准后的硅片运送至工件台600处进行交接，下片直线手300携带曝光后的硅片运送至缓冲台700。
接下来，如图11所示，双臂机械手100的下片臂103运动至硅片存储装置400处将曝光后的硅片放进装置中，上片臂102运动至硅片存储装置400处，取出待预对准的硅片，同时，工件台600运动至曝光位曝光，上片直线手200运动至交接等待位800等候，下片直线手300将曝光后的硅片交接至缓冲台700。
根据需要规划硅片传输系统的工作流程可达到节省硅片传输时间的目的，表1列出了本发明硅片传输系统各个工作流程，并分别给出了所述双臂机械手100、上片直线手200和下片直线手300进行每个过程的耗时。
表1：
Figure PCTCN2016082790-appb-000001
Figure PCTCN2016082790-appb-000002
Figure PCTCN2016082790-appb-000003
由表1可知，采用本发明的硅片传输系统，传输硅片的循环周期14.5S，计算产率248WPH，达到提高了硅片传输系统的传输效率，进而提高了光刻机的产率。本发明的双臂机械手100不需要与工件台600交接，可节省流程时间11.3S，双臂机械手100与预对准装置500交接时，只是双臂机械手100的上片臂102将硅片放到预对准装置500上，预对准装置500下片是通过上片直线手200来实现的，而不需要通过双臂机械手100的下片臂103来操作，所以可以节省预对准下片时间3.7S。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (10)

  1. 一种硅片传输系统，用于光刻系统，该光刻系统包括一硅片存储装置、一预对准装置、一缓存台以及一工件台，其特征在于，所述硅片传输系统包括：
    一双臂机械手，用于从所述硅片存储装置中将待曝光的硅片取出并移送到所述预对准装置上，并从所述缓存台将曝光完成的硅片取下放回至所述硅片存储装置中；
    一上片直线手，用于将预对准后的硅片移动至所述工件台；以及
    一下片直线手，用于将曝光完成后的硅片移动至所述缓存台。
  2. 如权利要求1所述的硅片传输系统，其特征在于，所述双臂机械手包括：一机械手本体，与机械手本体活动连接的一上片臂和一下片臂。
  3. 如权利要求1所述的硅片传输系统，其特征在于，所述上片直线手和所述下片直线手均包括：一片叉、一直线电机和一滑块，其中，所述片叉通过所述滑块与所述直线电机的活动端连接。
  4. 如权利要求3所述的硅片传输系统，其特征在于，所述直线电机包括一直线电机定子、一滑轨和一直线电机动子，所述滑轨设置在所述直线电机定子上，所述直线电机动子通过所述滑块带动片叉沿所述滑轨运动。
  5. 如权利要求4所述的硅片传输系统，其特征在于，所述片叉包括：与所述滑块固接的连接臂，与所述连接臂固接的一连接件，固定在所述连接件上且对称设置的两片承片面。
  6. 如权利要求5所述的硅片传输系统，其特征在于，所述两片承片面上还设置有至少两个橡胶吸盘。
  7. 如权利要求6所述的硅片传输系统，其特征在于，所述至少两个橡胶吸盘中的每一个包括：一刚性吸附部、围绕所述刚性吸附部设置的一喇叭状橡胶盘和设置在所述刚性吸附部底部的一密封片，所述密封片与所述刚性吸 附部之间形成真空气道，所述刚性吸附部开设有与所述真空气道连通的通孔。
  8. 如权利要求1所述的硅片传输系统，其特征在于，所述双臂机械手、所述上片直线手和所述下片直线手中的至少两个以并行方式工作。
  9. 如权利要求5所述的硅片传输系统，其特征在于，通过设置所述片叉的两片承片面间的距离，所述硅片传输系统能够兼容承接2、3、4、5、6、8英寸的硅片。
  10. 如权利要求1所述的硅片传输系统，其特征在于，所述双臂机械手采用带两个机械臂的圆柱坐标式机械手。
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US20180143541A1 (en) 2018-05-24
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