SG11201709649XA - Silicon wafer transportation system - Google Patents

Silicon wafer transportation system

Info

Publication number
SG11201709649XA
SG11201709649XA SG11201709649XA SG11201709649XA SG11201709649XA SG 11201709649X A SG11201709649X A SG 11201709649XA SG 11201709649X A SG11201709649X A SG 11201709649XA SG 11201709649X A SG11201709649X A SG 11201709649XA SG 11201709649X A SG11201709649X A SG 11201709649XA
Authority
SG
Singapore
Prior art keywords
silicon wafer
transportation system
wafer transportation
silicon
wafer
Prior art date
Application number
SG11201709649XA
Other languages
English (en)
Inventor
Kai Liu
Songli Hu
Jie Jiang
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201709649XA publication Critical patent/SG11201709649XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B25J9/0087—Dual arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/14—Arm movement, spatial
    • Y10S901/17—Cylindrical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/19—Drive system for arm
    • Y10S901/23—Electric motor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11201709649XA 2015-05-24 2016-05-20 Silicon wafer transportation system SG11201709649XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510270081.1A CN106292194B (zh) 2015-05-24 2015-05-24 硅片传输系统
PCT/CN2016/082790 WO2016188371A1 (zh) 2015-05-24 2016-05-20 硅片传输系统

Publications (1)

Publication Number Publication Date
SG11201709649XA true SG11201709649XA (en) 2017-12-28

Family

ID=57393753

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709649XA SG11201709649XA (en) 2015-05-24 2016-05-20 Silicon wafer transportation system

Country Status (8)

Country Link
US (1) US10254661B2 (zh)
EP (1) EP3306397B1 (zh)
JP (1) JP6592591B2 (zh)
KR (1) KR102050004B1 (zh)
CN (1) CN106292194B (zh)
SG (1) SG11201709649XA (zh)
TW (1) TWI644768B (zh)
WO (1) WO2016188371A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109240043B (zh) * 2018-09-20 2021-06-15 矽电半导体设备(深圳)股份有限公司 自动光刻机
CN111354668B (zh) * 2018-12-24 2023-09-29 上海微电子装备（集团）股份有限公司 硅片传输系统及方法
WO2020167956A1 (en) * 2019-02-14 2020-08-20 Persimmon Technologies Corporation Modular material handling robot platform
US10867822B1 (en) 2019-07-26 2020-12-15 Yaskawa America, Inc. Wafer pre-alignment apparatus and method
CN110828357A (zh) * 2019-11-21 2020-02-21 江苏索尔思通信科技有限公司 一种手动上光阻上片载具
CN111252536B (zh) * 2020-03-11 2022-02-22 上海御微半导体技术有限公司 一种物料传输装置
CN114077162A (zh) * 2020-08-12 2022-02-22 苏州源卓光电科技有限公司 一种光刻系统、基片交接系统及曝光方法
CN114791691A (zh) * 2021-01-25 2022-07-26 苏州源卓光电科技有限公司 一种全自动曝光机
WO2023165701A1 (de) 2022-03-03 2023-09-07 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum fixieren eines substrates
CN114888983A (zh) * 2022-05-31 2022-08-12 杭州中为光电技术有限公司 硅片自动倒角清洗一体化设备

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2517669B2 (ja) * 1989-05-24 1996-07-24 キヤノン株式会社 露光装置
US5376862A (en) * 1993-01-28 1994-12-27 Applied Materials, Inc. Dual coaxial magnetic couplers for vacuum chamber robot assembly
JP3200285B2 (ja) * 1994-06-29 2001-08-20 キヤノン株式会社 基板搬送装置
US5800018A (en) * 1995-12-30 1998-09-01 Colombo; John P Nonslip travel pillow
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
SG102718A1 (en) * 2002-07-29 2004-03-26 Asml Holding Nv Lithography tool having a vacuum reticle library coupled to a vacuum chamber
US6826451B2 (en) * 2002-07-29 2004-11-30 Asml Holding N.V. Lithography tool having a vacuum reticle library coupled to a vacuum chamber
JP3674864B2 (ja) * 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
CN101894779B (zh) * 2003-08-29 2013-05-01 交叉自动控制公司 用于半导体处理的方法和装置
JP2006272526A (ja) * 2005-03-30 2006-10-12 Nidec Sankyo Corp 搬送用ロボットのハンド及びそのハンドを有する搬送用ロボット
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
KR20070005796A (ko) * 2005-07-06 2007-01-10 삼성전자주식회사 반도체 노광 설비
WO2007046430A1 (ja) * 2005-10-19 2007-04-26 Nikon Corporation 物体の搬出入方法及び搬出入装置、露光方法及び露光装置、並びにデバイス製造方法
JP4660434B2 (ja) 2006-07-21 2011-03-30 株式会社安川電機 搬送機構およびそれを備えた処理装置
JP2008251754A (ja) * 2007-03-29 2008-10-16 Nikon Corp 基板搬送方法及び装置、並びに露光方法及び装置
TWI478272B (zh) 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
CN101158866A (zh) * 2007-10-24 2008-04-09 上海微电子装备有限公司 用于硅片传输系统的服务器架构以及信息交换方法
TWI394224B (zh) 2009-02-24 2013-04-21 Intevac Inc 載送及處理基板之裝置與方法
JP5336885B2 (ja) * 2009-03-03 2013-11-06 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
KR20110016639A (ko) * 2009-08-12 2011-02-18 주식회사 아토 기판처리장치
CN102347261B (zh) * 2010-08-02 2015-12-02 北京中科信电子装备有限公司 一种硅片传输系统布局结构
US9186799B2 (en) * 2011-07-13 2015-11-17 Brooks Automation, Inc. Compact direct drive spindle
JP5601331B2 (ja) 2012-01-26 2014-10-08 株式会社安川電機 ロボットハンドおよびロボット
CN103424991B (zh) * 2012-05-15 2015-09-30 上海微电子装备有限公司 一种硅片直线交换装置及方法
CN103531502B (zh) * 2012-07-03 2016-12-21 上海微电子装备有限公司 一种工件台装置
CN103984208B (zh) * 2013-02-07 2016-03-02 上海微电子装备有限公司 掩模版传输系统
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
TWM481113U (zh) 2014-01-28 2014-07-01 Wen-Yang Chen 具有內崁式真空防洩穩定吸取晶圓片之機械手臂葉板
CN204303792U (zh) * 2015-01-12 2015-04-29 北京七星华创电子股份有限公司 多腔室堆栈式晶圆处理设备

Also Published As

Publication number Publication date
EP3306397A1 (en) 2018-04-11
US20180143541A1 (en) 2018-05-24
TWI644768B (zh) 2018-12-21
KR102050004B1 (ko) 2019-11-28
JP6592591B2 (ja) 2019-10-16
CN106292194B (zh) 2018-03-30
CN106292194A (zh) 2017-01-04
JP2018517308A (ja) 2018-06-28
TW201700236A (zh) 2017-01-01
WO2016188371A1 (zh) 2016-12-01
EP3306397A4 (en) 2019-01-16
EP3306397B1 (en) 2020-01-29
US10254661B2 (en) 2019-04-09
KR20180008714A (ko) 2018-01-24

Similar Documents

Publication Publication Date Title
SG10201600648YA (en) Wafer processing system
IL257409B (en) Transport system
GB2527921B (en) Wafer releasing
SG11201709649XA (en) Silicon wafer transportation system
HK1224386A1 (zh) 矽游絲
HK1245998A1 (zh) 半導體器件
GB201819585D0 (en) Wafer test system
TWI563631B (en) Semiconductor Device
HK1222476A1 (zh) 半導體器件
GB2550791B (en) Supercomputer using wafer scale integration
IL258223B1 (en) Local semiconductor foil thinning
TWI560882B (en) Semiconductor structure
PL3458353T3 (pl) Układ transportowy
ZA201800236B (en) Belt transportation system
ZA201704996B (en) Terreplane transportation system
HK1244353A1 (zh) 半導體器件
GB201521117D0 (en) Transportation device
SG10201704247PA (en) Wafer processing system
GB201420531D0 (en) Semiconductor structure
ZA201900794B (en) Reduced sugar wafer
IL259859A (en) Transport system
GB2556490B (en) Semiconductor photodiode
HK1247440A1 (zh) 摻雜矽晶片的方法
KR101561920B9 (ko) 반도체 패키지
TWI563653B (en) Semiconductor device