TWI644768B - 矽片傳輸系統 - Google Patents

矽片傳輸系統 Download PDF

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TWI644768B
TWI644768B TW105116090A TW105116090A TWI644768B TW I644768 B TWI644768 B TW I644768B TW 105116090 A TW105116090 A TW 105116090A TW 105116090 A TW105116090 A TW 105116090A TW I644768 B TWI644768 B TW I644768B
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Taiwan
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silicon wafer
arm
linear
transmission system
manipulator
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TW105116090A
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TW201700236A (zh
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劉凱
胡松立
姜杰
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大陸商上海微電子裝備（集團）股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B25J9/0087—Dual arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/14—Arm movement, spatial
    • Y10S901/17—Cylindrical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/19—Drive system for arm
    • Y10S901/23—Electric motor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

一種矽片傳輸系統，用於光蝕刻系統，該光蝕刻系統包括一矽片儲存裝置、一預對準裝置、一緩存台以及一工件台，該矽片傳輸系統包括：一雙臂機械手，用於從該矽片儲存裝置中將待曝光的矽片取出並移送到該預對準裝置上，並從該緩存台將曝光完成的矽片取下放回至該矽片儲存裝置中；一上片直線手，用於將預對準後的矽片移動至該工件台；以及一下片直線手，用於將曝光完成後的矽片移動至該緩存台。該雙臂機械手、上片直線手和下片直線手可以並行動作，達到節省矽片傳輸時間的目的。

Description

矽片傳輸系統
本發明有關於光蝕刻機領域，特別有關於一種矽片傳輸系統。
微電子技術的發展促進電腦技術、通信技術和其它電子資訊技術的更新換代，在資訊產業革命中起著重要的先導和基礎作用，光蝕刻機是微電子裝置製造業中不可或缺的工具。
為了降低晶片製造成本，使用者對光蝕刻機的產率要求越來越高。光蝕刻機生產商在市場與利益驅動下，也不斷進行光蝕刻機的產率提升。同時，為了能夠迎合市場多變的需求，需要能夠相容多種矽片尺寸。
光蝕刻機的產率提升的重要技術點是矽片傳輸系統的產率提升。在工件台載著矽片曝光完，需要一張新的矽片情況下，矽片傳輸必須保證已經提前做好與工件台進行交接矽片的準備工作。所以，矽片傳輸的產率要大於光蝕刻機自身的產率。
提升矽片傳輸的產率一般有兩種途徑，一是不斷提高傳輸機械手的運動性能，即其速度、加速度、穩定時間等，二是最佳化矽片傳輸的系統組態，即藉由預對準、機械手等設備的佈局。但是，目前的設備生產商僅藉由提升機械手的運動性能來提高光蝕刻機的產率。
本發明提供一種矽片傳輸系統，以解決現有光蝕刻機中矽片傳輸速率較慢的問題。
為解決上述技術問題，本發明提供一種矽片傳輸系統，用於光蝕刻系統，該光蝕刻系統包括一矽片儲存裝置、一預對準裝置、一緩存台以及一工件台，其特徵在於，該矽片傳輸系統包括：一雙臂機械手，用於從該矽片儲存裝置中將待曝光的矽片取出並移送到該預對準裝置上，並從該緩存台將曝光完成的矽片取下放回至該矽片儲存裝置中；一上片直線手，用於將預對準後的矽片移動至該工件台；以及一下片直線手，用於將曝光完成後的矽片移動至該緩存台。
作為較佳，該雙臂機械手包括：一機械手本體，與機械手本體活動連接的一上片臂和一下片臂。
作為較佳，該上片直線手和該下片直線手均包括：一片叉、一線性電動機和一滑塊，其中，該片叉藉由該滑塊與該線性電動機的活動端連接。
作為較佳，該線性電動機包括一線性電動機定子、一滑軌和一線性電動機動子，該滑軌設置在該線性電動機定子上，該線性電動機動子藉由該滑塊帶動片叉沿該滑軌運動。
作為較佳，該片叉包括：與該滑塊固接的連接臂、與該連接臂固接的一連接件、和固定在該連接件上且對稱設置的兩片承片面。
作為較佳，該等承片面上還設置有至少兩個橡膠吸盤。
作為較佳，該至少兩個橡膠吸盤中的每一個包括：一剛性吸附部、圍繞該剛性吸附部設置的一喇叭狀橡膠盤和設置在該剛性吸附部的底部的一密封片，該密封片與該剛性吸附部之間形成真空氣道，該剛性吸附部開設有與該真空氣道連通的通孔。
作為較佳，該雙臂機械手、該上片直線手和該下片直線手中的至少兩個以並行方式工作。
作為較佳，藉由設置該片叉的兩片承片面間的距離，該矽片傳輸系統能夠相容承載2、3、4、5、6、8英寸的矽片。
作為較佳，該雙臂機械手採用帶兩個機械臂的圓柱座標式機械手。
與現有技術相比，本發明具有以下優點：1、雙臂機械手不需要與工件台交接，減輕雙臂機械手的壓力；2、上、下片直線手的片叉無垂直方向的運動軸，實現與工件台、預對準、機械手的交接；3、利用上、下片直線手，分別負責從工件台上片與下片，提高交接時間；4、藉由上、下片直線手的片叉的設計，能夠相容承接2、3、4、5、6、8英寸矽片、鍵合片、翹曲片；5、該雙臂機械手、上片直線手和下片直線手可以並行動作，達到節省矽片傳輸時間的目的。
100‧‧‧雙臂機械手
101‧‧‧機械手本體
102‧‧‧上片臂
103‧‧‧下片臂
200‧‧‧上片直線手
300‧‧‧下片直線手
301‧‧‧片叉
302‧‧‧線性電動機定子
303‧‧‧線性電動機動子
304‧‧‧滑塊
305‧‧‧滑軌
400‧‧‧矽片儲存裝置
500‧‧‧預對準裝置
600‧‧‧工件台
700‧‧‧緩存台
800‧‧‧交接等待位
3011‧‧‧承片面
3012‧‧‧連接件
3013‧‧‧連接臂
3014‧‧‧橡膠吸盤
3014a‧‧‧剛性吸附部
3014b‧‧‧橡膠盤
3014c‧‧‧密封片
3014d‧‧‧真空氣道
3014e‧‧‧通孔
圖1為本發明一具體實施方式中矽片傳輸系統的結構示意圖；圖2為本發明一具體實施方式中矽片傳輸系統中雙臂機械手的 結構示意圖；圖3為本發明一具體實施方式中矽片傳輸系統中上/下片直線手的結構示意圖；圖4為本發明一具體實施方式中矽片傳輸系統中片叉的結構示意圖；圖5為本發明一具體實施方式中矽片傳輸系統中片叉的應用示意圖；圖6為本發明一具體實施方式中矽片傳輸系統中橡膠吸盤的立體結構示意圖；圖7為本發明一具體實施方式中矽片傳輸系統中橡膠吸盤的結構示意圖；圖8為本發明一具體實施方式中矽片傳輸系統的初始狀態示意圖；圖9至11為本發明一具體實施方式中矽片傳輸系統中不同流程下矽片交接示意圖；圖12至14為本發明一具體實施方式中矽片傳輸系統中工件台的推頂銷位於不同位置時示意圖。
為使本發明的上述目的、特徵和優點能夠更加明顯易懂，下面結合附圖對本發明的具體實施方式做詳細的說明。需說明的是，本發明附圖均採用簡化的形式且均使用非精準的比例，僅用以方便、清晰地輔助說明本發明實施例的目的。
如圖1至圖7所示，本發明的矽片傳輸系統包括：雙臂機械手100、上片直線手200和下片直線手300；其中，該雙臂 機械手100從矽片儲存裝置400中將待曝光的矽片取出並移送到預對準裝置500上，並從緩存台700將曝光完成的矽片取下放回矽片儲存裝置400中；上片直線手200用於將預對準後的矽片移動至工件台600，下片直線手300將曝光完成後的矽片移動至緩存台700。具體地，本發明藉由一個雙臂機械手100、上片直線手200、下片直線手300配合使用，實現矽片在矽片儲存裝置400、預對準裝置500、工件台600、緩存台700的移轉，減少雙臂機械手100從矽片儲存裝置400取放片的迴圈時間，提高矽片的產率。其工作流程為雙臂機械手100的上片臂(見後文描述)負責從矽片儲存裝置400中取出一待曝光的矽片，然後運動至緩存台700藉由下片臂(見後文描述)將另一曝光後的矽片取出，再將該待曝光的矽片放至預對準裝置500上，最後將該曝光後的矽片放回矽片儲存裝置400；上片直線手200負責將預對準後的矽片放到工件台600上進行曝光；下片直線手300負責將曝光後的矽片放到緩存台700上，迴圈作業，雙臂機械手100不需要與工件台600交接，簡化機械手交接流程，減少機械手取放矽片的迴圈時間。
請重點參照圖2，結合圖1，本發明中雙臂機械手100選用帶兩個機械臂的圓柱座標式機械手，用來實現矽片在矽片儲存裝置400、預對準裝置500和緩存台700之間的移轉。該雙臂機械手100包括：機械手本體101、與機械手本體101活動連接的上片臂102和下片臂103。該上、下片臂102、103完全相同，輪替執行不同的動作。
請重點參照圖3，結合圖1，上片直線手200負責將預對準後的矽片放到工件台600，下片直線手300負責將曝光後的 矽片放到緩存台700上。本發明中，該上片直線手200和下片直線手300均包括：片叉301、線性電動機和滑塊304，該線性電動機包括線性電動機定子302、滑軌305和線性電動機動子303，該滑軌305設置在該線性電動機定子302上，該線性電動機動子303藉由該滑塊304帶動片叉301沿該滑軌305運動，從而實現片叉301在水平方向的直線運動。
進一步的，請參照圖4，該片叉301包括：與滑塊304固接的連接臂3013、與該連接臂3013固接的連接件3012、和固定在該連接件3012上且對稱設置的承片面3011，進一步的，該承片面3011上的一端為直角梯形，另一端為矩形，便於承接矽片，且如圖5所示，藉由設置兩承片面3011之間的距離，使該片叉301能夠相容承接2、3、4、5、6、8英寸矽片、鍵合片或翹曲片，相容性好。該承片面3011上還設置有橡膠吸盤3014，其用於吸附矽片，較佳的，該橡膠吸盤3014設置在兩承片面3011相互接近的一側，確保其可以吸附各種尺寸的矽片。
請重點參照圖6和圖7，該橡膠吸盤3014包括：剛性吸附部3014a、圍繞該剛性吸附部3014a設置的喇叭狀橡膠盤3014b和設置在該剛性吸附部3014a的底部的密封片3014c，該密封片3014c與剛性吸附部3014a之間設置有真空氣道3014d，該剛性吸附部3014a中開設有與該真空氣道3014d連通的通孔3014e。
如圖8至10所示為本發明矽片傳輸系統實際工作時的一具體實施過程。如圖8所示，本發明的矽片傳輸系統工作時的初始狀態為：緩存台700有一張曝光完的矽片，具體位於緩存台700的交接位；上片直線手200無矽片，其片叉301位於交接等待位 800；預對準裝置500上有一張預對準完成的矽片，具體位於預對準裝置500的交接高位；雙臂機械手100的上片臂102有一張待預對準的矽片，下片臂103為空且位於緩存台700位置處；工件台600上有一張曝光完的矽片，具體位於工件台600的交接位。
如圖9所示，雙臂機械手100的下片臂103從緩存台700取下曝光後的矽片，同時，工件台600運動至下片位，下片直線手300移動至工件台600的交接位取下曝光後的矽片，上片直線手200運動至預對準裝置500的交接位取下預對準後的矽片。
之後，如圖10所示，雙臂機械手100的上片臂102運動至預對準裝置500的交接位，將待預對準的矽片放置預對準裝置500上，同時，工件台600運動至上片位，上片直線手200攜帶預對準後的矽片運送至工件台600處進行交接，下片直線手300攜帶曝光後的矽片運送至緩存台700。
接下來，如圖11所示，雙臂機械手100的下片臂103運動至矽片儲存裝置400處將曝光後的矽片放進裝置中，上片臂102運動至矽片儲存裝置400處，取出待預對準的矽片，同時，工件台600運動至曝光位曝光，上片直線手200運動至交接等待位800等候，下片直線手300將曝光後的矽片交接至緩存台700。
根據需要規劃矽片傳輸系統的工作流程可達到節省矽片傳輸時間的目的，表1列出本發明矽片傳輸系統各個工作流程，並分別給予該雙臂機械手100、上片直線手200和下片直線手300進行每個過程的耗時。
由表1可知，採用本發明的矽片傳輸系統，傳輸矽片的迴圈週期14.5S，計算產率248WPH，達到提高矽片傳輸系統的傳輸效率，進而提高光蝕刻機的產率。本發明的雙臂機械手100不需要與工件台600交接，可節省流程時間11.3S，雙臂機械手100與預對準裝置500交接時，只是雙臂機械手100的上片臂102將矽片放到預對準裝置500上，預對準裝置500下片是藉由上片直線手200來實現的，而不需要藉由雙臂機械手100的下片臂103來操作，所以可以節省預對準下片時間3.7S。
顯然，本領域的技術人員可以對發明進行各種改動和變型而不脫離本發明的精神和範圍。這樣，倘若本發明的這些修改和變型屬於本發明請求項及其等同技術的範圍之內，則本發明也意圖包括這些改動和變型在內。

Claims (8)

  1. 一種矽片傳輸系統，用於光蝕刻系統，該光蝕刻系統包括一矽片儲存裝置、一預對準裝置、一緩存台以及一工件台，其特徵在於：該矽片傳輸系統包括：一雙臂機械手，該雙臂機械手包括：一機械手本體、與該機械手本體活動連接的一上片臂和一下片臂，該雙臂機械手的該上片臂用於從該矽片儲存裝置中將待曝光的一矽片取出並移送到該預對準裝置上，該雙臂機械手的該下片臂從該緩存台將曝光完成的另一矽片取下放回至該矽片儲存裝置中；一上片直線手，用於將預對準後的該矽片移動至該工件台；以及一下片直線手，用於將曝光完成後的該矽片移動至該緩存台，其中，該雙臂機械手、該上片直線手和該下片直線手中的至少兩個以並行方式工作。
  2. 如請求項1之矽片傳輸系統，其中，該上片直線手和該下片直線手均包括：一片叉、一線性電動機和一滑塊，其中，該片叉藉由該滑塊與該線性電動機的活動端連接。
  3. 如請求項2之矽片傳輸系統，其中，該線性電動機包括一線性電動機定子、一滑軌和一線性電動機動子，該滑軌設置在該線性電動機定子上，該線性電動機動子藉由該滑塊帶動該片叉沿該滑軌運動。
  4. 如請求項3之矽片傳輸系統，其中，該片叉包括：與該滑塊固接的一連接臂、與該連接臂固接的一連接件、和固定在該連接件上且對稱設置的兩片承片面。
  5. 如請求項4之矽片傳輸系統，其中，該兩片承片面之每一者上還設置有至少一個橡膠吸盤。
  6. 如請求項5之矽片傳輸系統，其中，該至少一個橡膠吸盤包括：一剛性吸附部、圍繞該剛性吸附部設置的一喇叭狀橡膠盤和設置在該剛性吸附部的底部的一密封片，該密封片與該剛性吸附部之間形成真空氣道，該剛性吸附部開設有與該真空氣道連通的通孔。
  7. 如請求項4之矽片傳輸系統，其中，藉由設置該片叉的該兩片承片面間的距離，該矽片傳輸系統能夠相容承接2、3、4、5、6、8英寸的該矽片。
  8. 如請求項1之矽片傳輸系統，其中，該雙臂機械手採用帶兩個機械臂的圓柱座標式機械手。
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CN106292194A (zh) 2017-01-04
US10254661B2 (en) 2019-04-09
TW201700236A (zh) 2017-01-01
EP3306397A1 (en) 2018-04-11

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