CN106292194A - 硅片传输系统 - Google Patents

硅片传输系统 Download PDF

Info

Publication number
CN106292194A
CN106292194A CN201510270081.1A CN201510270081A CN106292194A CN 106292194 A CN106292194 A CN 106292194A CN 201510270081 A CN201510270081 A CN 201510270081A CN 106292194 A CN106292194 A CN 106292194A
Authority
CN
China
Prior art keywords
silicon chip
straight line
transmission system
arm
hands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510270081.1A
Other languages
English (en)
Other versions
CN106292194B (zh
Inventor
刘凯
胡松立
姜杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201510270081.1A priority Critical patent/CN106292194B/zh
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to JP2018512474A priority patent/JP6592591B2/ja
Priority to SG11201709649XA priority patent/SG11201709649XA/en
Priority to US15/576,070 priority patent/US10254661B2/en
Priority to KR1020177036282A priority patent/KR102050004B1/ko
Priority to EP16799259.3A priority patent/EP3306397B1/en
Priority to PCT/CN2016/082790 priority patent/WO2016188371A1/zh
Priority to TW105116090A priority patent/TWI644768B/zh
Publication of CN106292194A publication Critical patent/CN106292194A/zh
Application granted granted Critical
Publication of CN106292194B publication Critical patent/CN106292194B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B25J9/0087—Dual arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0096—Programme-controlled manipulators co-operating with a working support, e.g. work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/14—Arm movement, spatial
    • Y10S901/17—Cylindrical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/19—Drive system for arm
    • Y10S901/23—Electric motor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Abstract

本发明公开了一种硅片传输系统，包括：双臂机械手、上片直线手和下片直线手；其中，所述双臂机械手从硅片存储装置中将待曝光的硅片取出并移送到预对准装置上，并从缓存台将曝光完成的硅片取下放回硅片存储装置中；上片直线手用于将预对准后的硅片移动至工件台，下片直线手将曝光完成后的硅片移动至缓存台。所述双臂机械手、上片直线手和下片直线手可以并行动作，达到节省硅片传输时间的目的。

Description

硅片传输系统
技术领域
本发明涉及光刻机领域，特别涉及一种硅片传输系统。
背景技术
微电子技术的发展促进了计算机技术、通信技术和其它电子信息技术的更新换代，在信息产业革命中起着重要的先导和基础作用，光刻机是微电子器件制造业中不可或缺的工具。
为了降低芯片制造成本，使用者对光刻机的产率要求越来越高。光刻机生产商在市场与利益驱动下，也不断进行光刻机的产率提升。同时，为了能够迎合市场多变的需求，需要能够兼容多种硅片尺寸。
光刻机产率提升的重要技术点是硅片传输系统的产率提升。在工件台载着硅片曝光完，需要一张新的硅片情况下，硅片传输必须保证已经提前做好了与工件台进行交接硅片的准备工作。所以，硅片传输的产率要大于光刻机自身的产率。
提升硅片传输的产率一般有两种途径，一是不断提高传输机械手的运动性能，即其速度、加速度、稳定时间等，二是优化硅片传输的系统配置，即通过预对准、机械手等设备布局。但是，目前的设备生产商仅通过提升机械手的运动性能来提高光刻机产率。
发明内容
本发明提供一种硅片传输系统，以解决现有光刻机中硅片传输速率较慢的问题。
为解决上述技术问题，本发明提供一种硅片传输系统，包括：双臂机械手、上片直线手和下片直线手；其中，所述双臂机械手从硅片存储装置中将待曝光的硅片取出并移送到预对准装置上，并从缓存台将曝光完成的硅片取下放回硅片存储装置中；上片直线手用于将预对准后的硅片移动至工件台，下片直线手将曝光完成后的硅片移动至缓存台。
作为优选，所述双臂机械手包括：机械手本体，与机械手本体活动连接的上片臂和下片臂。
作为优选，所述上片直线和手下片直线手均包括：片叉、直线电机和滑块，其中，所述片叉通过滑块与所述直线电机的活动端连接。
作为优选，所述直线电机包括直线电机定子、滑轨和直线电机动子，所述滑轨设置在所述直线电机定子上，所述直线电机动子通过所述滑块带动片叉沿所述滑轨运动。
作为优选，所述片叉包括：与滑块固接的片臂，与所述片臂固接的连接件，固定在所述连接件上且对称设置的承片面。
作为优选，所述承片面上还设置有橡胶吸盘。
作为优选，所述橡胶吸盘包括：刚性吸附部、围绕所述刚性吸附部设置的喇叭状橡胶盘和设置在所述刚性吸附部底部的密封片，所述刚性吸附部内部设置有真空气道。
作为优选，所述机械手采用双臂圆柱坐标机械手。
与现有技术相比，本发明具有以下优点：
1、双臂机械手不需要与工件台交接，减轻了双臂机械手的压力；
2、上、下片直线手的片叉无垂向运动轴，实现与工件台、预对准、机械手的交接；
3、利用上、下片直线手，分别负责从工件台上片与下片，提高交接时间；
4、通过上、下片直线手片叉的设计，能够兼容处理2、3、4、5、6、8英寸硅片、键合片、翘曲片；
5、所述双臂机械手、上片直线手和下片直线手可以并行动作，达到节省硅片传输时间的目的。。
附图说明
图1为本发明一具体实施方式中硅片传输系统的结构示意图；
图2为本发明一具体实施方式中硅片传输系统中双臂机械手的结构示意图；
图3为本发明一具体实施方式中硅片传输系统中上/下片直线手的结构示意图；
图4为本发明一具体实施方式中硅片传输系统中片叉的结构示意图；
图5为本发明一具体实施方式中硅片传输系统中片叉的应用示意图；
图6为本发明一具体实施方式中硅片传输系统中橡胶吸盘的立体结构示意图；
图7为本发明一具体实施方式中硅片传输系统中橡胶吸盘的结构示意图；
图8为本发明一具体实施方式中硅片传输系统的初始状态示意图；
图9-11为本发明一具体实施方式中硅片传输系统中不同流程下硅片交接示意图；
图12-14为本发明一具体实施方式中硅片传输系统中工件台中P-PIN位于不同位置时示意图。
图中所示：100-双臂机械手、101-机械手本体、102-上片臂、103-下片臂；
200-上片直线手、300-下片直线手；
301-片叉、3011-承片面、3012-连接件、3013-片臂、3014a-刚性吸附部、3014b-橡胶盘、3014c-密封片、3014d-真空气道；
302-直线电机定子、303-直线电机动子、304-滑块、305-滑轨；
400-硅片存储装置、500-预对准装置、600-工件台、700-缓存台、800-交接PARK位。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
如图1至图7所示，本发明的硅片传输系统，包括：双臂机械手100、上片直线手200和下片直线手300；其中，所述双臂机械手100从硅片存储装置400中将待曝光的硅片取出并移送到预对准装置500上，并从缓存台700将曝光完成的硅片取下放回硅片存储装置400中；上片直线手200用于将预对准后的硅片移动至工件台600，下片直线手300将曝光完成后的硅片移动至缓存台700。具体地，本发明通过一个双臂机械手100、上片直线手200、下片直线手300配合使用，实现了硅片在硅片存储装置400、预对准装置500、工件台600、缓存台700的流转，减少了双臂机械手100从硅片存储装置400取放片的循环时间，提高了硅片产率。其工作流程为双臂机械手100负责从硅片存储装置400中取出硅片，然后运动至缓存台700将曝光后的硅片取出，再将未曝光硅片放至预对准装置500上，最后将曝光后的硅片放回硅片存储装置400；上片直线手200负责将预对准后的硅片放到工件台600上；下片直线手300负责将曝光后的硅片放到缓存台700上，循环作业，双臂机械手100不需要与工件台600交接，简化了机械手交接流程，减少了机械手取放硅片循环时间。
请重点参照图2，结合图1，本发明中双臂机械手100选用的双臂圆柱坐标机械手，用来实现硅片在硅片存储装置400、预对准装置500和缓存台700之间的流转。所述双臂机械手100包括：机械手本体101，与机械手本体101活动连接的上片臂102和下片臂103。所述上、下片臂102、103完全相同，轮流执行不同动作。
请重点参照图3，结合图1，上片直线手200负责将预对准后的硅片放到工件台600，下片直线手300负责将曝光后的硅片放到缓存台700上。本发明中，所述上片直线手200和手下片直线手300均包括：片叉301、直线电机和滑块304，所述直线电机包括直线电机定子302、滑轨305和直线电机动子303，所述滑轨305设置在所述直线电机定子302上，所述直线电机动子303通过所述滑块304带动片叉301沿所述滑轨305运动，从而实现片叉301在水平向的直线运动。
进一步的，请参照图4，所述片叉301包括：与滑块304固接的片臂3013，与所述片臂3013固接的连接件3012，固定在所述连接件3012上且对称设置的承片面3011，进一步的，所述承片面3011上的一端为直角梯形，另一端为矩形，便于承接硅片，且如图5所示，通过设置片叉301，其能够兼容处理2、3、4、5、6、8英寸硅片、键合片、翘曲片，兼容性好。所述承片面3011上还设置有橡胶吸盘3014，用于吸附硅片，较佳的，所述橡胶吸盘3014设置在两承片面3011相互接近的一侧，确保其可以吸附各种尺寸的硅片。
请重点参照图6和图7，所述橡胶吸盘3014包括：刚性吸附部3014a、围绕所述刚性吸附部3014a设置的喇叭状橡胶盘3014b和设置在所述刚性吸附部3014a底部的密封片3014c，所述刚性吸附部3014a内部设置有真空气道3014d。
如图8所示，本发明的硅片传输系统工作时的初始状态为：缓存台700有一张曝光完硅片，具体位于缓存台700交接位；上片直线手200无硅片，其片叉301位于交接PARK位800；预对准装置500上有一张预对准完成的硅片，位于交接高位；双臂机械手100的上片臂101有一张待预对准硅片，下片臂102为空且位于缓存台700位置处；工件台600有一张曝完光硅片位于其交接位。
请参照图9至图11，结合图1至图8以及表1，本发明的硅片传输系统的工作流程为：
双臂机械手100的下片臂103从缓存台700取下曝光后的硅片移送至硅片存储装置400。具体为：下片臂103运动至缓存台700下片位；工件台600运动至下片位，下片臂103运动至硅片存储装置400交接位、下片臂103放硅片至硅片存储装置400，最后，下片臂103运动返回至缓存台700交接位。
上片直线手200取出预对准完成的硅片并运送至工件台600。请结合图12至图14，其具体步骤包括：上片直线手200的片叉301运动至交接park位800，接着运动至预对准装置500交接位，开真空；预对准装置500降落至交接位，关真空；预对准装置500降落至交接低位，完成硅片交接；接着，上片直线手200的片叉301带着硅片运动至交接park位800；工件台600运动至上片位，P-PIN顶起硅片至交接位；上片直线手200的片叉301关真空，工件台600的P-PIN开真空，顶起至交接高位，硅片交接至P-PIN上，上片直线手200的片叉301避让，P-PIN带硅片降落安全空间；工件台600的P-PIN带硅片降落至工件台600表面，工件台600带着硅片运动至曝光位。
下片直线手300取下工件台600上曝光完成的硅片运动至缓存台700。其具体步骤包括：下片直线手300片叉301运动至下片位，开真空；工件台600的P-PIN关真空，降落至低位，硅片交接至下片直线手300的片叉301上；片叉301带动硅片到缓存台700处。
上片臂102从硅片存储装置400取硅片，上片臂102运动至预对准装置500交接位，上片臂102放硅片至预对准装置500处，上片臂102运动至硅片存储装置400。
需要说明的是，所述双臂机械手100、上片直线手200和下片直线手300可以并行动作，也就是说，上述一些动作可以同时进行，如表1方式，可以通过根据需要规划硅片传输系统的工作流程，达到节省硅片传输时间的目的。
表1：
由表1可知，采用本发明的硅片传输系统，传输硅片的循环周期14.5S，计算产率248WPH，达到提高了硅片传输系统的传输效率，进而提高了光刻机的产率。本发明的双臂机械手100不需要与工件台600交接，可节省流程时间11.3S，双臂机械手100与预对准装置500交接时，只是双臂机械手100的上片臂101将硅片放到预对准装置500上，预对准装置500下片是通过上片直线手200来实现的，而不需要通过双臂机械手100的下片臂103来操作，所以可以节省预对准下片时间3.7S。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (8)

1.一种硅片传输系统，其特征在于，包括：双臂机械手、上片直线手和下片直线手；其中，所述双臂机械手从硅片存储装置中将待曝光的硅片取出并移送到预对准装置上，并从缓存台将曝光完成的硅片取下放回硅片存储装置中；同时，上片直线手将预对准后的硅片移动至工件台，下片直线手将曝光完成后的硅片移动至缓存台。
2.如权利要求1所述的硅片传输系统，其特征在于，所述双臂机械手包括：机械手本体，与机械手本体活动连接的上片臂和下片臂。
3.如权利要求1所述的硅片传输系统，其特征在于，所述上片直线手和所述下片直线手均包括：片叉、直线电机和滑块，其中，所述片叉通过滑块与所述直线电机的活动端连接。
4.如权利要求3所述的硅片传输系统，其特征在于，所述直线电机包括直线电机定子、滑轨和直线电机动子，所述滑轨设置在所述直线电机定子上，所述直线电机动子通过所述滑块带动片叉沿所述滑轨运动。
5.如权利要求4所述的硅片传输系统，其特征在于，所述片叉包括：与所述滑块固接的片臂，与所述片臂固接的连接件，固定在所述连接件上且对称设置的承片面。
6.如权利要求5所述的硅片传输系统，其特征在于，所述承片面上还设置有橡胶吸盘。
7.如权利要求6所述的硅片传输系统，其特征在于，所述橡胶吸盘包括：刚性吸附部、围绕所述刚性吸附部设置的喇叭状橡胶盘和设置在所述刚性吸附部底部的密封片，所述刚性吸附部内部设置有真空气道。
8.如权利要求1所述的硅片传输系统，其特征在于，所述机械手采用双臂圆柱坐标机械手。
CN201510270081.1A 2015-05-24 2015-05-24 硅片传输系统 Active CN106292194B (zh)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CN201510270081.1A CN106292194B (zh) 2015-05-24 2015-05-24 硅片传输系统
SG11201709649XA SG11201709649XA (en) 2015-05-24 2016-05-20 Silicon wafer transportation system
US15/576,070 US10254661B2 (en) 2015-05-24 2016-05-20 Silicon wafer transportation system
KR1020177036282A KR102050004B1 (ko) 2015-05-24 2016-05-20 실리콘 웨이퍼 이송 시스템
JP2018512474A JP6592591B2 (ja) 2015-05-24 2016-05-20 シリコンウエハ搬送システム
EP16799259.3A EP3306397B1 (en) 2015-05-24 2016-05-20 Silicon wafer transportation system
PCT/CN2016/082790 WO2016188371A1 (zh) 2015-05-24 2016-05-20 硅片传输系统
TW105116090A TWI644768B (zh) 2015-05-24 2016-05-24 矽片傳輸系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510270081.1A CN106292194B (zh) 2015-05-24 2015-05-24 硅片传输系统

Publications (2)

Publication Number Publication Date
CN106292194A true CN106292194A (zh) 2017-01-04
CN106292194B CN106292194B (zh) 2018-03-30

Family

ID=57393753

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510270081.1A Active CN106292194B (zh) 2015-05-24 2015-05-24 硅片传输系统

Country Status (8)

Country Link
US (1) US10254661B2 (zh)
EP (1) EP3306397B1 (zh)
JP (1) JP6592591B2 (zh)
KR (1) KR102050004B1 (zh)
CN (1) CN106292194B (zh)
SG (1) SG11201709649XA (zh)
TW (1) TWI644768B (zh)
WO (1) WO2016188371A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109240043A (zh) * 2018-09-20 2019-01-18 深圳市矽电半导体设备有限公司 自动光刻机
CN110828357A (zh) * 2019-11-21 2020-02-21 江苏索尔思通信科技有限公司 一种手动上光阻上片载具
CN111252536A (zh) * 2020-03-11 2020-06-09 上海御微半导体技术有限公司 一种物料传输装置
CN111354668A (zh) * 2018-12-24 2020-06-30 上海微电子装备（集团）股份有限公司 硅片传输系统及方法
CN114888983A (zh) * 2022-05-31 2022-08-12 杭州中为光电技术有限公司 硅片自动倒角清洗一体化设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022520634A (ja) 2019-02-14 2022-03-31 パーシモン テクノロジーズ コーポレイション モジュール式材料取扱いロボットプラットフォーム
US10867822B1 (en) 2019-07-26 2020-12-15 Yaskawa America, Inc. Wafer pre-alignment apparatus and method
WO2023165701A1 (de) 2022-03-03 2023-09-07 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum fixieren eines substrates

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040019408A1 (en) * 2002-07-29 2004-01-29 Asml Us, Inc. Lithography tool having a vacuum reticle library coupled to a vacuum chamber
CN101158866A (zh) * 2007-10-24 2008-04-09 上海微电子装备有限公司 用于硅片传输系统的服务器架构以及信息交换方法
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
CN102347261A (zh) * 2010-08-02 2012-02-08 北京中科信电子装备有限公司 一种硅片传输系统布局结构
CN103424991A (zh) * 2012-05-15 2013-12-04 上海微电子装备有限公司 一种硅片直线交换装置及方法
CN103531502A (zh) * 2012-07-03 2014-01-22 上海微电子装备有限公司 一种工件台装置
CN103824797A (zh) * 2012-11-16 2014-05-28 上海微电子装备有限公司 硅片传输装置和方法
CN103984208A (zh) * 2013-02-07 2014-08-13 上海微电子装备有限公司 掩模版传输系统
CN204303792U (zh) * 2015-01-12 2015-04-29 北京七星华创电子股份有限公司 多腔室堆栈式晶圆处理设备

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2517669B2 (ja) * 1989-05-24 1996-07-24 キヤノン株式会社 露光装置
US5376862A (en) * 1993-01-28 1994-12-27 Applied Materials, Inc. Dual coaxial magnetic couplers for vacuum chamber robot assembly
JP3200285B2 (ja) * 1994-06-29 2001-08-20 キヤノン株式会社 基板搬送装置
US5800018A (en) * 1995-12-30 1998-09-01 Colombo; John P Nonslip travel pillow
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
SG102718A1 (en) 2002-07-29 2004-03-26 Asml Holding Nv Lithography tool having a vacuum reticle library coupled to a vacuum chamber
JP3674864B2 (ja) * 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
WO2005022602A2 (en) * 2003-08-29 2005-03-10 Crossing Automation, Inc. A method and apparatus for semiconductor processing
JP2006272526A (ja) * 2005-03-30 2006-10-12 Nidec Sankyo Corp 搬送用ロボットのハンド及びそのハンドを有する搬送用ロボット
KR20070005796A (ko) 2005-07-06 2007-01-10 삼성전자주식회사 반도체 노광 설비
US8279406B2 (en) * 2005-10-19 2012-10-02 Nikon Corporation Article loading/unloading method and article loading/unloading device, exposure method and exposure apparatus, and method of manufacturing device
JP4660434B2 (ja) 2006-07-21 2011-03-30 株式会社安川電機 搬送機構およびそれを備えた処理装置
JP2008251754A (ja) * 2007-03-29 2008-10-16 Nikon Corp 基板搬送方法及び装置、並びに露光方法及び装置
TWI478272B (zh) 2007-08-15 2015-03-21 尼康股份有限公司 A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method
TWI394224B (zh) 2009-02-24 2013-04-21 Intevac Inc 載送及處理基板之裝置與方法
JP5336885B2 (ja) * 2009-03-03 2013-11-06 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
KR20110016639A (ko) * 2009-08-12 2011-02-18 주식회사 아토 기판처리장치
US9186799B2 (en) * 2011-07-13 2015-11-17 Brooks Automation, Inc. Compact direct drive spindle
JP5601331B2 (ja) 2012-01-26 2014-10-08 株式会社安川電機 ロボットハンドおよびロボット
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
TWM481113U (zh) 2014-01-28 2014-07-01 Wen-Yang Chen 具有內崁式真空防洩穩定吸取晶圓片之機械手臂葉板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040019408A1 (en) * 2002-07-29 2004-01-29 Asml Us, Inc. Lithography tool having a vacuum reticle library coupled to a vacuum chamber
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
CN101158866A (zh) * 2007-10-24 2008-04-09 上海微电子装备有限公司 用于硅片传输系统的服务器架构以及信息交换方法
CN102347261A (zh) * 2010-08-02 2012-02-08 北京中科信电子装备有限公司 一种硅片传输系统布局结构
CN103424991A (zh) * 2012-05-15 2013-12-04 上海微电子装备有限公司 一种硅片直线交换装置及方法
CN103531502A (zh) * 2012-07-03 2014-01-22 上海微电子装备有限公司 一种工件台装置
CN103824797A (zh) * 2012-11-16 2014-05-28 上海微电子装备有限公司 硅片传输装置和方法
CN103984208A (zh) * 2013-02-07 2014-08-13 上海微电子装备有限公司 掩模版传输系统
CN204303792U (zh) * 2015-01-12 2015-04-29 北京七星华创电子股份有限公司 多腔室堆栈式晶圆处理设备

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109240043A (zh) * 2018-09-20 2019-01-18 深圳市矽电半导体设备有限公司 自动光刻机
CN109240043B (zh) * 2018-09-20 2021-06-15 矽电半导体设备(深圳)股份有限公司 自动光刻机
CN111354668A (zh) * 2018-12-24 2020-06-30 上海微电子装备（集团）股份有限公司 硅片传输系统及方法
CN111354668B (zh) * 2018-12-24 2023-09-29 上海微电子装备（集团）股份有限公司 硅片传输系统及方法
CN110828357A (zh) * 2019-11-21 2020-02-21 江苏索尔思通信科技有限公司 一种手动上光阻上片载具
CN111252536A (zh) * 2020-03-11 2020-06-09 上海御微半导体技术有限公司 一种物料传输装置
CN114888983A (zh) * 2022-05-31 2022-08-12 杭州中为光电技术有限公司 硅片自动倒角清洗一体化设备

Also Published As

Publication number Publication date
TWI644768B (zh) 2018-12-21
SG11201709649XA (en) 2017-12-28
US20180143541A1 (en) 2018-05-24
KR20180008714A (ko) 2018-01-24
WO2016188371A1 (zh) 2016-12-01
US10254661B2 (en) 2019-04-09
EP3306397B1 (en) 2020-01-29
EP3306397A4 (en) 2019-01-16
JP2018517308A (ja) 2018-06-28
KR102050004B1 (ko) 2019-11-28
TW201700236A (zh) 2017-01-01
JP6592591B2 (ja) 2019-10-16
CN106292194B (zh) 2018-03-30
EP3306397A1 (en) 2018-04-11

Similar Documents

Publication Publication Date Title
CN106292194A (zh) 硅片传输系统
CN106625621B (zh) 一种基于拉伸共形原理的柔性膜曲面转移机械手
CN105810619B (zh) 电池片旋转搬运机构
TW200932073A (en) Releasing and collecting system for printed circuit board and turn-over method using the same
CN103424991B (zh) 一种硅片直线交换装置及方法
CN205920952U (zh) 芯片贴片设备
CN106115260A (zh) 器件高速取放装置
KR20190117734A (ko) 칩 본딩 디바이스.
CN106057709A (zh) 芯片贴片设备及其应用
CN109709773A (zh) 双台面pcb曝光设备
CN107452648A (zh) 晶粒拾取方法
CN104838481A (zh) 基板输送前室机构
CN210260291U (zh) 一种机械手上下料设备
CN108190517A (zh) 平板类工件对位传送装置及方法
JP2017059777A (ja) 搬送装置およびはんだボール印刷システム
TW201519332A (zh) 高產出之高精度晶片接合裝置
CN201685264U (zh) 硅片机械手
WO2021026957A1 (zh) 高精度大板级微组装设备
KR101657531B1 (ko) 다이 이송 유닛, 이를 포함하는 다이 본딩 장치 및 다이 이송 방법
CN204957792U (zh) 一种ldi单机自动装置
CN206961803U (zh) 一种接力式快速取片、装片装置及其采用它的装片机
CN209460574U (zh) 双台面pcb曝光设备
CN105149174A (zh) 三维机转台夹具
JP2009059961A (ja) ダイボンダー装置
CN201120610Y (zh) 取送、对中功能一体化机器人装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information
CB02 Change of applicant information

Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai

Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd

Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai

Applicant before: Shanghai Micro Electronics Equipment Co., Ltd.

GR01 Patent grant
GR01 Patent grant