WO2020056818A1 - 一种包含可移动装卸模块的抛光装卸部件模块 - Google Patents

一种包含可移动装卸模块的抛光装卸部件模块 Download PDF

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Publication number
WO2020056818A1
WO2020056818A1 PCT/CN2018/110042 CN2018110042W WO2020056818A1 WO 2020056818 A1 WO2020056818 A1 WO 2020056818A1 CN 2018110042 W CN2018110042 W CN 2018110042W WO 2020056818 A1 WO2020056818 A1 WO 2020056818A1
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Prior art keywords
loading
unloading
module
polishing
unloading position
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PCT/CN2018/110042
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English (en)
French (fr)
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顾海洋
张志军
古枫
王东辉
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杭州众硅电子科技有限公司
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Publication of WO2020056818A1 publication Critical patent/WO2020056818A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines

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  • the invention belongs to the technical field of grinding or polishing devices, and in particular relates to a polishing loading and unloading component module of a chemical mechanical planarization device used in a semiconductor integrated circuit chip manufacturing process.
  • Integrated circuits are playing an increasingly important role in all walks of life and are the cornerstone of the modern information society.
  • the feature sizes of integrated circuits continue to be miniaturized, so the high planarization of the surface of semiconductor thin films has an important impact on the high performance, low cost and high yield of the device.
  • Chemical mechanical planarization (Chemical Mechanical Planarization, CMP) equipment is one of the seven key equipment in the field of integrated circuit manufacturing. The principle is to use a comprehensive balance of chemical etching of the polishing liquid and mechanical friction of the polishing pad to finely remove the material on the wafer surface.
  • CMP is first used for planarization, device isolation, and device construction in the front-end process of chip manufacturing, and secondly, metal interconnections in the back-end process of chip manufacturing are also used.
  • CMP is also a key process in the integrated circuit 3D packaging TSV process. Because of its relatively diverse and critical applications, CMP has become a standard process and core equipment in integrated circuit manufacturing.
  • chemical mechanical polishing technology has been developed into a combination of on-line measurement, online endpoint detection, cleaning and other technologies of chemical mechanical polishing technology is the integrated circuit to the miniaturization, multilayering, thinning, flattening process development products. At the same time, it is also a process technology necessary for the wafer to transition from 200mm to 300mm or even larger diameters, improve productivity, reduce manufacturing costs, and globally planarize the substrate.
  • a typical chemical mechanical planarization equipment usually includes multiple polishing units and auxiliary devices such as cleaning, wafer transport, and drying.
  • the polishing unit usually includes a table, a polishing disk, a polishing head, a polishing arm, a dresser, a polishing liquid arm, etc.
  • the polishing disk, a polishing head, a polishing arm, a dresser, and a polishing liquid arm are arranged on the table according to the processing position.
  • the spatial arrangement of the polishing unit and modules such as cleaning and wafer transportation has a great impact on the overall polishing output of the chemical mechanical planarization equipment.
  • the transfer of wafers between the polishing unit and the outside and between the polishing units is usually achieved by loading and unloading tables or similar devices.
  • the four polishing units are arranged side by side. The wafer transfer is completed by the loading and unloading area at the end of the flattening equipment and two linear transport mechanisms arranged along the polishing unit arrangement direction. The other side of the linear transport mechanism is a cleaning area.
  • Each of the above-mentioned linear transport mechanisms provides services for two polishing units, and sets two transfer stations for each polishing unit.
  • the polishing head of the polishing unit can load and unload wafers from one of the transfer stations.
  • this layout has the disadvantage that although each polishing unit is provided with two transfer stations, the polishing unit directly loads and unloads wafers from only one of them during the polishing process, so there is still room for improvement from the perspective of wafer transfer efficiency.
  • the purpose of the present invention is to propose a polishing loading and unloading component module for a chemical mechanical planarization device, which includes a movable loading and unloading module, for the problems of low wafer transfer efficiency and complicated transfer mechanism structure in the existing chemical mechanical planarization equipment.
  • the technical solution adopted by the present invention is a polishing loading and unloading component module including a movable loading and unloading module, which includes one loading and unloading module and two polishing modules, the loading and unloading module is centered, and the two polishing modules are located on both sides of the module.
  • the loading and unloading module has two loading and unloading positions in a direction perpendicular to the arrangement direction of the loading and unloading module and two polishing modules, respectively corresponding to the two polishing modules, and the loading and unloading module can be moved back and forth between the two loading and unloading positions.
  • the polishing module includes a fixed platform, a polishing pad, a polishing head, and a polishing shaft.
  • the polishing pad is located on the fixed platform.
  • the polishing shaft can drive the polishing head to rotate to the loading / unloading position.
  • the above loading and unloading module includes a fixed frame, a water tank, a linear motion module, a loading and unloading platform module, a loading and unloading platform fixing block, and an isolation cover.
  • the water tank and the linear motion module are fixed on the fixing frame, and the loading and unloading platform fixing block is fixed to the sliding block of the linear motion module.
  • the loading and unloading platform module is fixed on the loading and unloading platform fixing block, and the lower part of the loading and unloading platform fixing block is fixed with an isolation cover to isolate the lower part of the loading and unloading platform from the liquid. Move back and forth between the second loading and unloading positions.
  • a first nozzle module and a second nozzle module are respectively provided at two loading and unloading positions of the loading and unloading module, and the first nozzle module and the second nozzle module are both fixed on a fixed platform.
  • the first nozzle module and the second nozzle module are respectively disposed at the edges of the first loading position and the second loading position.
  • the loading and unloading station module can be raised and lowered in the vertical direction to complete the wafer transfer with the polishing head.
  • the present invention further proposes a method for transferring wafers by using the polishing loading and unloading component module, which specifically includes the following steps:
  • the loading and unloading station module stops at the first loading and unloading position, and waits for the first polishing head corresponding to the position carrying the wafer that has completed the first stage polishing;
  • the present invention Compared with the existing chemical mechanical planarization equipment technology, the present invention has the following beneficial technical effects:
  • the present invention modulates the loading and unloading part and the polishing part into one polishing loading and unloading integrated module. This layout simplifies the equipment structure, improves the manufacturing efficiency of the equipment, and reduces the space occupied by the equipment.
  • the polishing head is saved and turned back to the corresponding polishing pad, and then turned back for cleaning, which saves the transmission time and improves the efficiency.
  • the polishing module can be freely expanded as required. Three or more modules can be spliced to further increase the flexibility of wafer manufacturing, improve manufacturing efficiency, reduce equipment space, and increase output.
  • FIG. 1 is a perspective view of the entire module for polishing, loading and unloading of the present invention
  • FIG. 2 is a schematic structural diagram of a loading module in the module shown in FIG. 1;
  • 1 the first loading and unloading position
  • 2 the first polishing head rotating shaft
  • 3 the first polishing head
  • 4 the first polishing pad
  • 5 the first fixed platform
  • 6 the second loading and unloading position
  • 7 the second polishing head rotating shaft
  • 8 second polishing head
  • 9 second polishing pad
  • 10 second fixed platform
  • 11 water tank
  • 12 first nozzle module
  • 13 linear motion module
  • 14 second nozzle module
  • 15 loading and unloading table Module
  • 16 mounting block fixing block
  • 17 isolation cover
  • 18 fixed frame.
  • the invention discloses a polishing loading and unloading component module for chemical mechanical planarization equipment.
  • the polishing loading and unloading component module is composed of one loading and unloading module and two polishing modules.
  • the layout is shown in FIG. 1 and includes a first loading and unloading position, a first polishing head rotating shaft 2, a first polishing head 3, a first polishing pad 4, and a second polishing module.
  • a fixed platform 5 a second loading / unloading position 6, a second polishing head rotating shaft 7, a second polishing head 8, a second polishing pad 9, and a second fixed platform 10.
  • the polishing pad, the polishing shaft and other components are fixed on a fixed platform, and the polishing head is fixed on the polishing shaft.
  • the polishing shaft drives the polishing head to rotate to the loading and unloading position. After the operation is completed, the polishing head is rotated to the top of the polishing pad for polishing.
  • the first loading / unloading position corresponds to the first polishing head 3, and the second loading / unloading position 6 corresponds to the second polishing head 8.
  • the structure of the loading and unloading module is shown in FIG. 2 and includes: a first loading and unloading position 1, a second loading and unloading position 6, a water tank 11, a first nozzle module 12, a linear motion module 13, a second nozzle module 14, a loading platform module 15, and loading and unloading.
  • the water tank 11 and the linear motion module 13 are fixed on a fixed frame 18.
  • the loading and unloading platform fixing block 16 is fixed on the linear motion module 13, the loading and unloading platform module 15 is fixed on the loading and unloading platform fixing block 16, and a lower part of the loading and unloading platform fixing block 16 is fixed with an isolation cover 17 to isolate the lower part of the loading and unloading platform from liquid.
  • the linear motion module 13 can move the loading and unloading station module 15 back and forth between the first loading position 1 and the second loading position 6, and the first nozzle module 12 and the second nozzle module correspond to the edges of the first loading position 1 and the second loading position 6. 14. Both nozzle modules are fixed on the holder 18
  • the wafer transfer process of the present invention is as follows:
  • the loading and unloading station module 15 stops at the first loading and unloading position 1 and waits for the first polishing head 3 corresponding to the first loading and unloading position 1 to carry the first stage polished wafer to be transferred to the first loading and unloading position 1;
  • the loading and unloading station module 15 rises to pick up the wafer. After receiving the wafer, the loading and unloading module 15 moves directly to the second loading and unloading position 6, and then the first polishing head 3 corresponding to the first loading and unloading position is cleaned on the upper part of the first loading and unloading position. By moving the loading and unloading station module 15, the first polishing head 3 does not need to be turned back above the first polishing pad 4 and then turned back to be cleaned, thereby saving the transfer time and improving the efficiency.
  • the second polishing head 8 is transferred to the second loading and unloading position 6, and then the polished wafers on the loading and unloading station module 15 at the second loading and unloading position 6 are removed, and the robotic arm then removes the wafers to be polished. Loaded on the loading and unloading station module 15 in the second loading and unloading position 6.
  • the loading / unloading station module 15 at the second loading / unloading position 6 is moved under the first polishing head 3 at the first loading / unloading position. Subsequently, the loading and unloading station module 15 rises, and the first polishing head 3 corresponding to the first loading and unloading position is adsorbed and transferred to the polishing area for polishing, and polishing of the next wafer is started.
  • the loading and unloading station module 15 in the first loading and unloading position is moved to the second loading and unloading position 6, and at the same time, the second polishing head 8 corresponding to the second loading and unloading position 6 is moved to the upper part of the second loading and unloading position 6, and the loading and unloading module 15 is raised and sucked
  • the loading and unloading station module 15 is moved from the second loading and unloading position 6 to the first loading and unloading position, and the second polishing head 8 corresponding to the second loading and unloading position 6 is cleaned on the upper part of the second loading and unloading position 6.
  • the robot removes the polished wafer on the loading and unloading station module 15 at the first loading and unloading position, loads the wafer to be polished, and then the loading and unloading module 15 stops at the first loading and unloading position and waits.
  • the first polishing head 3 corresponding to the first loading and unloading position unloads the polished wafer and starts the cycle again.
  • the wafer loading component structure of the present invention has the advantage that by modularizing the loading and unloading part and the polishing part, it can be spliced into the layout shown in FIG. 1.
  • This layout simplifies the equipment structure, improves the manufacturing efficiency of the equipment, and reduces the space occupied by the equipment. And it can be expanded freely as needed, and it can be spliced by 3 or more modules with the layout shown in Figure 1, which further improves the flexibility of wafer manufacturing, improves manufacturing efficiency, reduces equipment space, and increases output.
  • the displacement movement of the loading and unloading table module 15 and the cleaning part are separately placed, and the robot is used to transfer the wafer, so that the processes between multiple polishing modules can be operated in parallel, which greatly improves the manufacturing efficiency of the equipment.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本发明公开了一种包含可移动装卸模块的抛光装卸部件模块，包含一个装卸模块和两个抛光模块，装卸模块居中，两个抛光模块位于其两侧，所述装卸模块在与装卸模块和两个抛光模块排列方向相垂直的方向上有两个装卸位置，分别对应所述两个抛光模块，装卸模块可在两个装卸位置之间来回移动。装卸模块包含直线运动模块、装卸台模块、装卸台固定块，所述直线运动模块固定在固定架上，装卸台固定块固定在直线运动模块的滑动块上，直线运动模块可以使装卸台模块在两个装卸位置即第一装卸位置和第二装卸位置之间来回移动。本发明通过装卸台模块的移动，省却了抛光头转回对应抛光垫上方后再转回来清洗，可以节省传输时间，显著提高了效率。

Description

一种包含可移动装卸模块的抛光装卸部件模块 技术领域
本发明属于磨削或抛光装置技术领域，具体涉及一种半导体集成电路芯片制造过程中使用的化学机械平坦化设备的抛光装卸部件模块。
背景技术
集成电路在各行各业中发挥着越来越非常重要的作用，是现代信息社会的基石。随着半导体行业的飞速发展,集成电路特征尺寸不断趋于微细化,因此半导体薄膜表面的高平坦化对器件的高性能、低成本、高成品率有着重要的影响。
化学机械平坦化(Chemical Mechanical Planarization,CMP)设备是集成电路制造领域的七大关键设备之一。其原理是利用抛光液化学刻蚀和抛光垫机械摩擦的综合平衡作用，对晶圆表面材料进行精细去除。在集成电路制造中，CMP首先被用于芯片制造前道工艺的平坦化、器件隔离、器件构造，其次在芯片制造后道工艺的金属互连也需使用。同时，CMP在集成电路3D封装TSV工艺中也是关键的工艺手段。正是因为具有相对多样且关键的应用，CMP已经成为集成电路制造中的标准工艺和核心装备。
目前，化学机械抛光技术已经发展成集在线量测、在线终点检测、清洗等技术于一体的化学机械抛光技术是集成电路向微细化、多层化、薄型化、平坦化工艺发展的产物。同时也是晶圆由200mm向300mm乃至更大直径过渡、提高生产率、降低制造成本、衬底全局平坦化所必需的工艺技术。
一个典型的化学机械平坦化设备通常包括多个抛光单元以及清洗、晶圆运输、干燥等辅助装置。抛光单元通常包括工作台、抛光盘、抛光头、抛光臂、修整器、抛光液臂等，抛光盘、抛光头、抛光臂、修整器、抛光液臂按照工艺加工位置布置在工作台上。实际的晶圆加工过程中发现，抛光单元与清洗、晶圆运输等模块的空间布置对于化学机械平坦化设备整体的抛光产出有极大的影响。晶圆在抛光单元与外部以及在抛光单元之间的传输通常依靠装卸台或起类似作用的装置来实现。关于装卸台与抛光单元的空间布局，有的采用装卸台与三个抛光单元为正方形布局的形式。由于一个装卸台需要给三个抛光单元提供装卸服务，因此这种技术布局的缺点是工艺过程复杂。另有采用将四个抛光单元并排排列，晶圆传输由位于平坦化设备端部的装卸区和沿抛光单元排列方向设置的两个线性运输机构完成，线性运输机构的另一侧为清洗区。上述每一个线性运输机构为两个抛光单元提供服务，并为每个抛光单元设置两个传输工 位，抛光单元的抛光头可以从其中一个传输工位装卸晶圆。但这种布局的缺点是每个抛光单元虽然设置两个传输工位，但抛光过程中抛光单元只从其中一个直接装卸晶圆，因此从晶圆传输效率的角度分析还有需要改进的余地。
发明内容
本发明目的在于针对现有化学机械平坦化设备中存在的晶圆传输效率低、传输机构结构复杂的问题提出一种化学机械平坦化设备用的一种包含可移动装卸模块的抛光装卸部件模块，通过将装卸部分和抛光部分进行模块化，可以简化设备结构，提高设备的制造效率，缩小设备的占地空间。
为实现上述目的，本发明采用的技术方案为一种包含可移动装卸模块的抛光装卸部件模块，包含一个装卸模块和两个抛光模块，装卸模块居中，两个抛光模块位于其两侧，所述装卸模块在与装卸模块和两个抛光模块排列方向相垂直的方向上有两个装卸位置，分别对应所述两个抛光模块，装卸模块可在两个装卸位置之间来回移动。
上述抛光模块包含固定平台，抛光垫，抛光头，抛光转轴，抛光垫位于固定平台上，抛光转轴可带动抛光头旋转至装卸位置。
上述装卸模块包含固定架、水槽、直线运动模块、装卸台模块、装卸台固定块、隔离罩，所述水槽和直线运动模块固定在固定架上，装卸台固定块固定在直线运动模块的滑动块上，装卸台模块固定在装卸台固定块上，并且装卸台固定块下部固定有隔离罩使装卸台下部与液体隔离，直线运动模块可以使装卸台模块在两个装卸位置即第一装卸位置和第二装卸位置之间来回移动。
装卸模块的两个装卸位置上分别设置有第一喷嘴模块和第二喷嘴模块，第一喷嘴模块和第二喷嘴模块都固定在固定台上。
第一喷嘴模块和第二喷嘴模块分别设置在第一装卸位置和第二装卸位置的边缘。
装卸台模块可在垂直方向上上升和下降，与抛光头完成晶圆移转。
本发明还进一步提出一种利用上述抛光装卸部件模块进行晶圆传输的方法，具体包含以下步骤：
S1：装卸台模块停止在第一装卸位置，等待该位置对应的携带已完成第一阶段抛光的晶圆的第一抛光头；
S2：第一抛光头转移到第一装卸位置后，装卸台模块上升接取晶圆，并直接移动到第二装卸位置；
S3：第一抛光头在第一装卸位置上部进行清洗，移动到第二装卸位置的装卸台模块的晶圆被第二抛光头吸取，开始第二阶段的抛光，第二抛光头转移到第二抛光垫上后，机械手装载上新的待抛光晶圆；
S4：当第一装卸位置对应的第一抛光头清洗完成时，在第二装卸位置上的装卸台模块移动至第一装卸位置的第一抛光头下方，随后装卸台模块上升，第一装卸位置对应的第一抛光头完成对待抛光晶圆吸附并转移至抛光区域抛光；
S5：第一装卸位置的装卸台模块移动至第二装卸位置，与此同时第二装卸位置对应的第二抛光头运动转移到第二装卸位置上部，装卸台模块上升，吸取已完成第二阶段抛光的晶圆，吸取完毕后，装卸台模块由第二装卸位置移动至第一装卸位置；
S6：第二装卸位置对应的第二抛光头在第二装卸位置上部进行清洗，与此同时，机械手将在第一装卸位置上的装卸台模块上的已完成第二阶段抛光的晶圆取走，然后等待第一抛光头上的完成第一阶段抛光的晶圆；
S7：第一抛光头转移到第一装卸位置后，装卸台模块上升接取完成第一阶段抛光的晶圆，并直接移动到第二装卸位置；
S8：重复以上步骤，直至全部晶圆抛光完毕。
与现有化学机械平坦化设备技术相比，本发明具有以下有益技术效果：
1，本发明通过将装卸部分和抛光部分进行模块化，拼接成一个抛光装卸整体模块，这种布局简化了设备结构，提高了设备的制造效率，并且缩小设备的占地空间。
2，通过装卸台模块的移动，就省却抛光头转回对应抛光垫上方后再转回来清洗，节省了传输时间，提高了效率。
3，通过装卸台模块的位移运动以及清洗部分单独放置，再配合机械手传输晶圆，使得多个抛光模块之间工序实现并联运行，大幅度提高设备的制造效率。
4，抛光装卸整体模块可以根据需要进行自由扩展，可以由三个以及更多的该模块进行拼接，进一步提高晶圆制造的柔性，提高制造效率，缩小设备的空间，增加产量。
附图说明
图1为本发明抛光装卸整体模块的立体效果图；
图2为图1所示模块中的装卸模块的结构示意图；
图中使用的附图标记的含义：
1：第一装卸位置，2：第一抛光头转轴，3：第一抛光头，4：第一抛光垫，5：第 一固定平台，6：第二装卸位置，7：第二抛光头转轴，8：第二抛光头，9：第二抛光垫，10：第二固定平台，11：水槽，12：第一喷嘴模块，13：直线运动模块，14：第二喷嘴模块，15：装卸台模块，16：装卸台固定块，17：隔离罩，18：固定架。
具体实施方式
下面结合附图对本发明作进一步详细的说明。
本发明公开了一种化学机械平坦化设备用的抛光装卸部件模块。本抛光装卸部件模块由1个装卸模块和2个抛光模块组成，布局如图1所示，包含第一装卸位置，第一抛光头转轴2，第一抛光头3，第一抛光垫4，第一固定平台5，第二装卸位置6，第二抛光头转轴7，第二抛光头8，第二抛光垫9，第二固定平台10。
抛光垫，抛光转轴及其他部件组成固定在固定平台上，抛光头固定在抛光转轴上。抛光转轴带动抛光头旋转至装卸位置，完成动作后，旋转至抛光垫上方进行抛光。第一装卸位置对应第一抛光头3，第二装卸位置6对应第二抛光头8。
装卸模块的结构如图2所示，包含：第一装卸位置1，第二装卸位置6，水槽11，第一喷嘴模块12，直线运动模块13，第二喷嘴模块14，装卸台模块15，装卸台固定块16，隔离罩17，固定架18。水槽11和直线运动模块13固定在固定架18上。装卸台固定块16固定在直线运动模块13上，装卸台模块15固定在装卸台固定块16上，并且装卸台固定块16下部固定有隔离罩17使装卸台下部与液体隔离。直线运动模块13可以使装卸台模块15在第一装卸位置1与第二装卸位置6来回移动，在第一装卸位置1与第二装卸位置6边缘对应有第一喷嘴模块12和第二喷嘴模块14。两个喷嘴模块都固定在固定架18上
本发明的传输晶圆过程如下：
首先，装卸台模块15停止在第一装卸位置1，等待第一装卸位置1对应的携带已完成第一阶段抛光晶圆的第一抛光头3转移到第一装卸位置1；
装卸台模块15上升接取晶圆，接取晶圆后装卸台模块15直接移动到第二装卸位置6，然后第一装卸位置对应的第一抛光头3在第一装卸位置上部进行清洗。通过装卸台模块15的移动，这样第一抛光头3就不需要转回第一抛光垫4上方后再转回来清洗，因此节省了传输时间,提高了效率。
与此同时，第二抛光头8转移到第二装卸位置6，然后将在第二装卸位置6上的装卸台模块15上的已经抛光好的晶圆取走，机械手再将待抛光的晶圆装载在第二装卸位 置6上的装卸台模块15上。
当第一装卸位置对应的抛光头已经清洗完成时，在第二装卸位置6上的装卸台模块15移动至第一装卸位置的第一抛光头3下。随后装卸台模块15上升，第一装卸位置对应的第一抛光头3完成吸附并转移至抛光区域抛光，开始下一片晶圆的抛光。
然后第一装卸位置的装卸台模块15移动至第二装卸位置6，与此同时第二装卸位置6对应的第二抛光头8运动转移到第二装卸位置6上部，装卸台模块15上升，吸取已经抛光完毕的晶圆，吸取完毕后，装卸台模块15由第二装卸位置6移动至第一装卸位置，第二装卸位置6对应的第二抛光头8在第二装卸位置6上部进行清洗。这样的好处是第二抛光头8就不需要转回第二抛光垫9上方后再转回来清洗，因此节省了传输时间,提高了效率。
与此同时，机械手将在第一装卸位置上的装卸台模块15上的已经抛光好的晶圆取走，并装载上待抛光的晶圆，然后装卸台模块15停止在第一装卸位置上等待第一装卸位置对应的第一抛光头3卸载抛光好的晶圆，再次开始循环。
本发明的晶圆装载部件结构的优点：通过将装卸部分和抛光部分进行模块化，可以拼接成图1所示布局。此布局简化了设备结构，提高设备的制造效率，缩小设备的占地空间。并且可以根据需要进行自由扩展，可以由3个以及更多的图1所示布局的模块进行拼接，进一步提高晶圆制造的柔性，提高制造效率，缩小设备的空间，增加产量。并且通过装卸台模块15的位移运动以及清洗部分单独放置，再配合机械手传输晶圆，使得多个抛光模块之间工序实现并联运行，大幅度提高设备的制造效率。
以上具体实施方式的描述并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (7)

  1. 一种包含可移动装卸模块的抛光装卸部件模块，其特征在于，包含一个装卸模块和两个抛光模块组成，装卸模块居中，两个抛光模块位于其两侧，所述装卸模块在与装卸模块和两个抛光模块排列方向相垂直的方向上有两个装卸位置，分别对应所述两个抛光模块，装卸模块可在所述两个装卸位置之间来回移动。
  2. 根据权利要求1所述的抛光装卸部件模块，其特征在于所述抛光模块包含固定平台，抛光垫，抛光头，抛光转轴，抛光垫位于固定平台上，抛光转轴可带动抛光头旋转至装卸位置。
  3. 根据权利要求2所述的抛光装卸部件模块，其特征在于所述装卸模块包含固定架(18)、水槽(11)、直线运动模块(13)、装卸台模块(15)、装卸台固定块(16)、隔离罩(17)，所述水槽(11)和直线运动模块(13)固定在固定架(18)上，装卸台固定块(16)固定在直线运动模块(13)的滑动块上，装卸台模块(15)固定在装卸台固定块(16)上，并且装卸台固定块(16)下部固定有隔离罩(17)使装卸台模块下部与液体隔离，直线运动模块(13)可以使装卸台模块(15)在两个装卸位置即第一装卸位置(1)和第二装卸位置(6)之间来回移动。
  4. 根据权利要求3所述的抛光装卸部件模块，其特征在于所述装卸模块的第一装卸位置(1)和第二装卸位置(6)上分别设置有第一喷嘴模块(12)和第二喷嘴模块(14)，第一喷嘴模块(12)和第二喷嘴模块(14)都固定在固定架(18)上。
  5. 根据权利要求4所述的抛光装卸部件模块，其特征在于所述第一喷嘴模块(12)和第二喷嘴模块(14)分别设置在第一装卸位置(1)和第二装卸位置(6)的边缘。
  6. 根据权利要求3所述的抛光装卸部件模块，其特征在于所述装卸台模块可在垂直方向上上升和下降，与抛光头完成晶圆移转。
  7. 一种根据权利要求6所述的抛光装卸部件模块进行晶圆传输的方法，其特征在于包含以下步骤：
    S1：装卸台模块(15)停止在第一装卸位置(1)，等待该位置对应的携带已完成第一阶段抛光的晶圆的第一抛光头(3)；
    S2：第一抛光头(3)转移到第一装卸位置(1)后，装卸台模块上升接取晶圆，并直接移动到第二装卸位置(6)；
    S3：第一抛光头(3)在第一装卸位置(1)上部进行清洗，移动到第二装卸位置(6)的装卸台模块的晶圆被第二抛光头(8)吸取，开始第二阶段的抛光，第二抛光头(8)转移到第二抛光垫(9)上后，机械手装载上新的待抛光晶圆；
    S4：当第一装卸位置(1)对应的第一抛光头(3)清洗完成时，在第二装卸位置(6)上的装卸台模块移动至第一装卸位置(1)的第一抛光头(3)下方，随后装卸台模块上升，第 一装卸位置(1)对应的第一抛光头(3)完成对待抛光晶圆吸附并转移至抛光区域抛光；
    S5：第一装卸位置(1)的装卸台模块移动至第二装卸位置(6)，与此同时第二装卸位置(6)对应的第二抛光头(8)运动转移到第二装卸位置(6)上部，装卸台模块上升，吸取已完成第二阶段抛光完毕的晶圆，吸取完毕后，装卸台模块由第二装卸位置(6)移动至第一装卸位置(1)；
    S6：第二装卸位置(6)对应的第二抛光头(8)在第二装卸位置(6)上部进行清洗，与此同时，机械手将在第一装卸位置(1)上的装卸台模块上的已完成第二阶段抛光的晶圆取走，然后等待第一抛光头(3)上的完成第一阶段抛光的晶圆；
    S7：第一抛光头(3)转移到第一装卸位置(1)后，装卸台模块上升接取完成第一阶段抛光的晶圆，并直接移动到第二装卸位置(6)；
    S8：重复以上步骤，直至全部晶圆抛光完毕。
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