WO2016152758A1 - ビーム走査装置、ビーム走査方法、および描画装置 - Google Patents
ビーム走査装置、ビーム走査方法、および描画装置 Download PDFInfo
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- WO2016152758A1 WO2016152758A1 PCT/JP2016/058644 JP2016058644W WO2016152758A1 WO 2016152758 A1 WO2016152758 A1 WO 2016152758A1 JP 2016058644 W JP2016058644 W JP 2016058644W WO 2016152758 A1 WO2016152758 A1 WO 2016152758A1
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- scanning
- incident
- optical system
- center axis
- irradiated surface
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
- G03F7/70366—Rotary scanning
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
- G02B26/124—Details of the optical system between the light source and the polygonal mirror
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Definitions
- the present invention relates to a beam scanning apparatus, a beam scanning method, and a drawing apparatus that scan a spot light of a beam irradiated on an irradiated surface of an object and draw and expose a predetermined pattern.
- a spot light of a laser beam is projected onto an irradiated object (object) such as a photosensitive drum, and the spot light is mainly projected in a one-dimensional direction along a main scanning line by a rotary polygon mirror. It is known to draw a desired pattern or image (characters, figures, photographs, etc.) on the irradiated object by moving the irradiated object in the sub-scanning direction orthogonal to the main scanning line direction while scanning. .
- JP-A-8-11348 discloses a beam scanning device that adjusts the inclination of the main scanning line of a beam.
- the beam scanning device described in Japanese Patent Application Laid-Open No. 8-11348 includes a plate inclined in the beam irradiation direction and an optical unit placed on the plate, and the plate is placed on the main body. Has been. Then, by rotating the plate in the main scanning direction with respect to the main body, the optical unit is rotated to adjust the inclination of the main scanning line. Since this adjustment results in different lengths on both sides of the midpoint of the main scanning line, the lengths on both sides of the midpoint of the main scanning line can be obtained by rotating the optical unit in the main scanning direction with respect to the plate. Adjust so that is equal.
- the optical unit is integrally provided with a light source that emits a modulated beam for drawing, a collimator lens that converts the beam into parallel light, a rotary polygon mirror, and an f ⁇ lens.
- the optical unit is rotated around a position far away from the main scanning line, and therefore, multiple adjustments (adjusting the rotation of the plate with respect to the main body) , Rotation adjustment of the optical unit with respect to the plate, adjustment of the distance of the optical unit from the photosensitive member, correction of drawing writing timing, etc.) must be performed.
- multiple adjustments adjusting the rotation of the plate with respect to the main body
- Rotation adjustment of the optical unit with respect to the plate adjustment of the distance of the optical unit from the photosensitive member, correction of drawing writing timing, etc.
- the pattern is drawn most frequently.
- the inclination of the scanning line (the inclination of the main scanning line direction with respect to the direction orthogonal to the sub-scanning direction) may be finely adjusted. Therefore, there is a demand for easily adjusting the inclination of the scanning line. Therefore, in the embodiment of the present invention, such a problem is solved.
- a first aspect of the present invention is a beam scanning device that projects the spot light of a beam from a light source device onto an irradiated surface of an object while scanning the spot light on the irradiated surface in a one-dimensional manner.
- An incident optical member for incident the beam from the light source device, a scanning deflection member for deflecting the beam from the incident optical member for the one-dimensional scanning, and the deflected beam incident A projection optical system that projects onto the irradiated surface, a scanning that is formed on the irradiated surface by scanning the spot light, supporting the incident optical member, the scanning deflection member, and the projection optical system.
- a support frame that is rotatable about a first rotation center axis that is coaxial within a predetermined tolerance and an irradiation center axis that passes through a specific point on the line perpendicularly to the irradiated surface.
- a beam scanning device that irradiates a spot light of a beam from a light source device on an irradiated surface of an object while scanning the spot light on the irradiated surface in a one-dimensional manner.
- An incident optical member that receives the beam from the light source device, a scanning deflecting member that deflects the beam from the incident optical member for the one-dimensional scanning, and the deflected beam.
- a projection optical system that projects onto the illuminated surface, and a specific point on a scanning line that is provided between the illuminated surface and the projection optical system and is formed on the illuminated surface by scanning the spot light.
- An image rotation optical system that rotates the scanning line around a rotation center axis that is coaxial with an irradiation center axis that passes perpendicularly to the surface to be irradiated.
- a beam scanning device is used to project the spot light of the beam from the light source device onto the irradiated surface of the object, and the spot light is scanned one-dimensionally on the irradiated surface.
- a beam scanning method comprising: an incident step for causing the beam scanning device to make the beam from the light source device enter; a deflection step for deflecting the incident beam for the one-dimensional scanning; and the deflected beam.
- a fourth aspect of the present invention is a drawing apparatus that projects the spot light of a beam from a light source device onto an irradiated surface of an object while scanning the spot light on the irradiated surface in a one-dimensional manner.
- An incident optical member that receives the beam from the light source device; a scanning deflecting member that deflects the beam from the incident optical member for the one-dimensional scanning;
- a projection optical system for projecting onto the irradiation surface, the incident optical member, the scanning deflecting member, a support frame for supporting the projection optical system, and the support frame in parallel with the normal line of the irradiated surface.
- a rotation support mechanism that is supported by the apparatus main body in a state of being rotatable around one rotation center axis, and the incident axis of the beam incident on the incident optical member and the first rotation center axis are within a predetermined allowable range.
- a light introducing optical system for guiding the incident optical member said beam from said light source device is coaxial.
- a fifth aspect of the present invention is a drawing apparatus that projects the spot light of the beam from the light source device onto the irradiated surface of the object while scanning the spot light on the irradiated surface in one dimension
- a scanning deflection member for deflecting the beam from the light source device for the one-dimensional scanning
- a projection optical system for projecting the deflected beam onto the irradiated surface
- the scanning deflection member When the normal of the irradiated surface passing through a specific point on the scanning line formed on the irradiated surface by scanning the spot light and the support frame that supports the projection optical system is an irradiation central axis,
- a coupling member that couples the support frame and the apparatus main body so that a support portion of the support frame to the apparatus main body is limited to a region within a predetermined radius from the irradiation central axis.
- a sixth aspect of the present invention is a beam scanning device that scans the spot light in a one-dimensional manner while converging the beam projected on the illuminated surface of the object into the spot light on the illuminated surface.
- a deflecting member that scans the spot light by reflecting the incident beam and deflecting the reflected beam within a predetermined angle range, and a light-sending optical that transmits the incident beam toward the deflecting member
- a projection optical system that projects the incident beam from the light transmission optical system and projects it onto the deflecting member, and projects the reflected beam to project the spot light of the reflected beam onto the irradiated surface. And comprising.
- a drawing apparatus for drawing a predetermined pattern by scanning a beam projected on an irradiated surface of an object in a one-dimensional manner, and deflecting the beam for one-dimensional scanning.
- a deflecting member that transmits the beam from the light source device and transmits the light toward the deflecting member, and the beam from the light transmitting optical system is incident on the deflecting member.
- a projection optical system that projects and projects the beam reflected by the deflecting member onto the irradiated surface.
- An eighth aspect of the present invention is a drawing apparatus that draws a predetermined pattern on the irradiated object by repeatedly scanning the drawing beam projected on the irradiated object by rotation of a rotary polygon mirror,
- An origin detection unit that generates an origin signal when it is detected that a second reflecting surface different from the first reflecting surface that reflects the drawing beam among the plurality of reflecting surfaces of the rotary polygon mirror has reached a predetermined angular position; , A predetermined delay from the generation of the origin signal with reference to a predetermined time determined by the rotational speed of the rotary polygon mirror from when the origin signal is generated until the second reflecting surface becomes the first reflecting surface.
- a control device for instructing start of drawing by the drawing beam at timing.
- FIG. 2 is a detailed view of the rotating drum of FIG. 1 around which a substrate is wound. It is a figure which shows the drawing line of a spot light, and the alignment mark formed on the board
- FIG. 2 is an enlarged view of a main part of the exposure apparatus in FIG. 1.
- FIG. 5 is a detailed view showing an optical configuration of the light introducing optical system in FIG. 4.
- FIG. 6 is a schematic explanatory diagram illustrating switching of an optical path by the drawing optical element of FIG. 5. It is an optical block diagram of the beam scanning apparatus of FIG.
- FIG. 12 is a perspective view showing a structure that holds a plurality of the beam scanning devices shown in FIGS. 4, 10, and 11. It is a perspective view which shows the attachment structure with the exposure apparatus main-body part of the structure shown in FIG. FIG.
- FIG. 5 is a diagram showing a distortion state of an exposure area where a predetermined pattern is exposed by the exposure head of FIG. 4. It is a figure which shows the optical structure of the beam scanning apparatus in the modification 1. It is a figure which shows the optical structure of the beam scanning apparatus in the modification 2.
- FIG. 17A is a diagram of the optical configuration of the beam scanning apparatus according to the fourth modification viewed in a plane parallel to the XtZt plane
- FIG. 17B illustrates the optical configuration of the beam scanning apparatus according to the fourth modification as the YtZt plane. It is the figure seen in the parallel surface.
- FIG. 18A is a diagram of the optical configuration of the beam scanning apparatus according to Modification 5 as viewed in a plane parallel to the XtYt plane.
- 18B illustrates the optical configuration of the beam scanning apparatus according to Modification 5 as a YtZt plane. It is the figure seen in the parallel surface. It is a figure which shows the optical structure of the beam scanning apparatus in the modification 6. It is a figure which shows the structure in the case of arrange
- FIG. 1 is a schematic configuration diagram of a device manufacturing system 10 including an exposure apparatus EX that performs an exposure process on a substrate (an object to be irradiated) FS of an embodiment.
- the device manufacturing system 10 is a manufacturing system in which a manufacturing line for manufacturing a flexible display, a flexible wiring, a flexible sensor, etc. as an electronic device is constructed. The following description is based on the assumption that a flexible display is used as the electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display.
- the device manufacturing system 10 sends out a substrate FS from a supply roll (not shown) obtained by winding a flexible sheet-like substrate (sheet substrate) FS in a roll shape, and continuously performs various processes on the delivered substrate FS. After the application, the substrate FS after various treatments is wound up by a collecting roll (not shown), and has a so-called roll-to-roll structure.
- the substrate FS has a strip shape in which the moving direction of the substrate FS is the longitudinal direction (long) and the width direction is the short direction (short).
- the substrate FS after various treatments is in a state in which a plurality of electronic devices are connected along the longitudinal direction, and is a multi-sided substrate.
- the substrate FS sent from the supply roll is sequentially subjected to various processes by the process apparatus PR1, the exposure apparatus EX, the process apparatus PR2, and the like, and is taken up by the collection roll.
- the X direction is a direction (conveyance direction) from the process apparatus PR1 to the process apparatus PR2 through the exposure apparatus EX in the horizontal plane.
- the Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction (short direction) of the substrate FS.
- the Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which gravity acts.
- the substrate FS for example, a resin film, or a foil (foil) made of a metal or alloy such as stainless steel is used.
- the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Among them, one containing at least one or more may be used. Further, the thickness and rigidity (Young's modulus) of the substrate FS may be in a range that does not cause folds due to buckling or irreversible wrinkles in the substrate FS when passing through the transport path of the exposure apparatus EX.
- a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 ⁇ m to 200 ⁇ m is typical of a suitable sheet substrate.
- the substrate FS may receive heat in each process performed by the process apparatus PR1, the exposure apparatus EX, and the process apparatus PR2, it is preferable to select the substrate FS having a material whose thermal expansion coefficient is not significantly large. .
- the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film.
- the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide.
- the substrate FS may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, etc. are bonded to the ultrathin glass. It may be.
- the flexibility of the substrate FS means a property that the substrate FS can be bent without being sheared or broken even when a force of its own weight is applied to the substrate FS. .
- flexibility includes a property of bending by a force of about its own weight.
- the degree of flexibility varies depending on the material, size, and thickness of the substrate FS, the layer structure formed on the substrate FS, the environment such as temperature and humidity, and the like. In any case, when the substrate FS is correctly wound around various conveying rollers, rotating drums, and other members for conveying direction provided in the conveying path in the device manufacturing system 10 according to the present embodiment, the substrate FS buckles and folds. If the substrate FS can be smoothly transported without being damaged or broken (breaking or cracking), it can be said to be a flexible range.
- the process apparatus PR1 performs a pre-process on the substrate FS exposed by the exposure apparatus EX.
- the process apparatus PR1 sends the substrate FS that has been processed in the previous process toward the exposure apparatus EX.
- the substrate FS sent to the exposure apparatus EX by this pre-process is a substrate (photosensitive substrate) FS having a photosensitive functional layer (photosensitive layer) formed on the surface thereof.
- This photosensitive functional layer is applied as a solution on the substrate FS and dried to form a layer (film).
- a typical photosensitive functional layer is a photoresist (in liquid or dry film form), but as a material that does not require development processing, the photosensitivity of the part that has been irradiated with ultraviolet rays is modified.
- SAM silane coupling agent
- the pattern portion exposed to ultraviolet rays on the substrate FS is modified from lyophobic to lyophilic.
- a pattern layer to be an electrode, a semiconductor, insulation, or a wiring or electrode for connection can be formed.
- a photosensitive reducing agent is used as the photosensitive functional layer, the plating reducing group is exposed on the pattern portion exposed to the ultraviolet rays on the substrate FS. Therefore, after exposure, the substrate FS is immediately immersed in a plating solution containing palladium ions for a certain period of time, so that a pattern layer of palladium is formed (deposited).
- a plating process is an additive process.
- the substrate FS sent to the exposure apparatus EX has a base material of PET or the like.
- PEN may be formed by depositing a metallic thin film such as aluminum (Al) or copper (Cu) on the entire surface or selectively, and further laminating a photoresist layer thereon.
- the exposure apparatus EX is a direct drawing type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus, and the irradiated surface (photosensitive surface) of the substrate FS supplied from the process apparatus PR1.
- a light pattern corresponding to a predetermined pattern for an electronic device, circuit or wiring for display is irradiated.
- the exposure apparatus EX transmits the spot light SP of the exposure beam LB on the surface to be irradiated of the substrate FS in a predetermined manner while transporting the substrate FS in the + X direction (sub-scanning direction).
- the intensity of the spot light SP is modulated (ON / OFF) at high speed according to pattern data (drawing data).
- a light pattern corresponding to a predetermined pattern such as an electronic device, a circuit, or a wiring is drawn and exposed on the surface to be irradiated of the substrate FS. That is, the spot light SP is relatively two-dimensionally scanned on the irradiated surface of the substrate FS by the sub-scanning of the substrate FS and the main scanning of the spot light SP, and a predetermined pattern is drawn and exposed on the substrate FS.
- an electronic device is comprised by the several pattern layer (layer in which the pattern was formed) being piled up, the pattern corresponding to each layer is exposed by the exposure apparatus EX.
- the process apparatus PR2 performs post-process processing (for example, plating processing, development / etching processing, etc.) on the substrate FS exposed by the exposure apparatus EX. By this subsequent process, a pattern layer of the electronic device is formed on the substrate FS. Since the electronic device is configured by overlapping a plurality of pattern layers, after the pattern is formed on the first layer by each process of the device manufacturing system 10, each process of the device manufacturing system 10 is performed again. By passing, a pattern is formed in the second layer.
- post-process processing for example, plating processing, development / etching processing, etc.
- the exposure apparatus EX is stored in the temperature control chamber ECV.
- This temperature control chamber ECV suppresses a shape change due to the temperature of the substrate FS transported inside by keeping the inside at a predetermined temperature.
- the temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via passive or active vibration isolation units SU1, SU2.
- the anti-vibration units SU1 and SU2 reduce vibration from the installation surface E.
- the installation surface E may be the floor surface of the factory itself, or may be a surface on an installation base (pedestal) installed on the floor surface in order to obtain a horizontal surface.
- the exposure apparatus EX includes at least a substrate transport mechanism 12, a light source device (pulse light source device) 14, an exposure head 16, a control device 18, and a plurality of alignment microscopes ALG (ALG1 to ALG4).
- the substrate transport mechanism 12 transports the substrate FS transported from the process apparatus PR1 at a predetermined speed in the exposure apparatus EX, and then sends the substrate FS to the process apparatus PR2 at a predetermined speed.
- the substrate transport mechanism 12 defines a transport path for the substrate FS transported in the exposure apparatus EX.
- the substrate transport mechanism 12 includes an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotating drum (cylindrical drum) DR, a tension adjusting roller RT2, in order from the upstream side ( ⁇ X direction side) in the transport direction of the substrate FS.
- a driving roller R2 and a driving roller R3 are provided.
- the edge position controller EPC adjusts the position in the width direction (the Y direction and the short direction of the substrate FS) of the substrate FS transported from the process apparatus PR1.
- the edge position controller EPC has a position at the end (edge) in the width direction of the substrate FS being transported in a state of a predetermined tension, which is about ⁇ 10 ⁇ m to several tens ⁇ m with respect to the target position.
- the position of the substrate FS in the width direction is adjusted by moving the substrate FS in the width direction so that it falls within the range (allowable range).
- the edge position controller EPC has a roller over which the substrate FS is stretched, and an edge sensor (edge detection unit) (not shown) that detects the position of the edge (edge) in the width direction of the substrate FS. Based on the detection signal, the roller of the edge position controller EPC is moved in the Y direction to adjust the position in the width direction of the substrate FS.
- the driving roller R1 rotates while holding both front and back surfaces of the substrate FS conveyed from the edge position controller EPC, and conveys the substrate FS toward the rotating drum DR.
- the edge position controller EPC includes the position of the substrate FS along with the position in the width direction of the substrate FS so that the longitudinal direction of the substrate FS wound around the rotating drum DR is always orthogonal to the central axis AXo of the rotating drum DR.
- the parallelism between the rotation axis of the roller of the edge position controller EPC and the Y axis may be appropriately adjusted so as to correct the tilt error in the traveling direction.
- the rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting with the Z direction in which gravity acts, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo. ),
- the substrate FS is transported in the + X direction by rotating around the central axis AXo while supporting a part of the substrate FS in the longitudinal direction.
- the rotary drum DR supports the exposure area (part) on the substrate FS on which the beam LB (spot light SP) from the exposure head 16 is projected on its circumferential surface.
- On both sides in the Y direction of the rotating drum DR there is a shaft Sft supported by an annular bearing so as to rotate around the central axis AXo.
- the shaft Sft rotates around the central axis AXo when a rotational torque from a rotation driving source (not shown) (for example, a motor or a speed reduction mechanism) controlled by the control device 18 is applied.
- a rotation driving source for example, a motor or a speed reduction mechanism
- a central plane Poc a plane including the central axis AXo and parallel to the YZ plane.
- the driving rollers R2 and R3 are arranged at a predetermined interval along the transport direction (+ X direction) of the substrate FS, and give a predetermined slack (play) to the exposed substrate FS. Similarly to the drive roller R1, the drive rollers R2 and R3 rotate while holding both front and back surfaces of the substrate FS, and transport the substrate FS toward the process apparatus PR2.
- the driving rollers R2 and R3 are provided on the downstream side (+ X direction side) in the transport direction with respect to the rotating drum DR.
- the driving roller R2 is located on the upstream side ( ⁇ X in the transport direction) with respect to the driving roller R3. (Direction side).
- the tension adjusting rollers RT1 and RT2 are urged in the ⁇ Z direction, and apply a predetermined tension in the longitudinal direction to the substrate FS that is wound around and supported by the rotary drum DR. Thereby, the longitudinal tension applied to the substrate FS applied to the rotary drum DR is stabilized within a predetermined range.
- the control device 18 rotates the drive rollers R1 to R3 by controlling a rotation drive source (not shown) (for example, a motor, a speed reducer, etc.).
- the light source device 14 has a light source (pulse light source) and emits a pulsed beam (pulse light, laser) LB.
- This beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency of the beam LB is Fe.
- the beam LB emitted from the light source device 14 enters the exposure head 16.
- the light source device 14 emits and emits the beam LB at the emission frequency Fe under the control of the control device 18.
- the light source device 14 includes a semiconductor laser element that generates pulsed light in the infrared wavelength region, a fiber amplifier, and a wavelength conversion element (harmonic) that converts amplified pulsed light in the infrared wavelength region into pulsed light in the ultraviolet wavelength region.
- a fiber amplifier laser light source composed of a generating element) or the like may be used.
- high-intensity ultraviolet pulsed light having an emission frequency (oscillation frequency) Fe of several hundreds of MHz and a light emission time of one pulse of about picoseconds.
- the exposure head 16 includes a plurality of beam scanning devices MD (MD1 to MD6) into which the beams LB are incident.
- the exposure head 16 draws a predetermined pattern on a part of the substrate FS supported by the circumferential surface of the rotary drum DR by the plurality of beam scanning devices MD1 to MD6.
- the exposure head 16 is a so-called multi-beam type exposure head in which a plurality of beam scanning devices MD1 to MD6 having the same configuration are arranged. Since the exposure head 16 repeatedly performs the pattern exposure for the electronic device on the substrate FS, the exposure area W (formation area of one electronic device) where the pattern is exposed is along the longitudinal direction of the substrate FS. A plurality are provided at predetermined intervals (see FIG. 3).
- the odd-numbered beam scanning devices (beam scanning units) MD1, MD3, MD5 are arranged on the upstream side ( ⁇ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc. In addition, they are arranged in parallel in the Y direction.
- the even-numbered beam scanning devices (beam scanning units) MD2, MD4, MD6 are arranged on the downstream side (+ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc and arranged in parallel in the Y direction.
- the odd-numbered beam scanning devices MD1, MD3, and MD5 and the even-numbered beam scanning devices MD2, MD4, and MD6 are provided symmetrically with respect to the center plane Poc.
- the beam scanning device MD projects the beam LB from the light source device 14 so as to converge on the spot light SP on the irradiated surface of the substrate FS, and the spot light SP on the irradiated surface of the substrate FS.
- a one-dimensional scan is performed along a typical drawing line SLn.
- the drawing lines (scanning lines) SLn of the plurality of beam scanning devices MD1 to MD6 are joined together without being separated from each other in the Y direction (the width direction of the substrate FS, the scanning direction), as shown in FIGS. Is set to Hereinafter, the beams LB incident on the beam scanning devices MD (MD1 to MD6) may be represented as LB1 to LB6.
- the beams LB (LB1 to LB6) incident on the beam scanning devices MD (MD1 to MD6) are linearly polarized beams (P-polarized light or S-polarized light) polarized in a predetermined direction. It is assumed that a polarized beam is incident. Further, the drawing line SLn of the beam scanning device MD1 may be represented as SL1, and the drawing lines SLn of the beam scanning devices MD2 to MD6 may be represented as SL2 to SL6.
- each of the beam scanning devices MD shares the scanning region so that all of the plurality of beam scanning devices MD1 to MD6 cover all of the width direction of the exposure region W. . Accordingly, each beam scanning device MD (MD1 to MD6) can draw a pattern for each of a plurality of regions divided in the width direction of the substrate FS. For example, if the scanning width in the Y direction (the length of the drawing line SLn) by one beam scanning device MD is about 30 to 60 mm, three odd-numbered beam scanning devices MD1, MD3, MD5 and even-numbered beams are used.
- the width in the Y direction that can be drawn is increased to about 180 to 360 mm.
- the lengths of the drawing lines SL1 to SL6 are the same. That is, the scanning distance of the spot light SP of the beam LB scanned along each of the drawing lines SL1 to SL6 is the same.
- the actual drawing lines SLn are set slightly shorter than the maximum length that the spot light SP can actually scan on the irradiated surface.
- the maximum length of the drawing line SLn that can be used for pattern drawing is 50 mm when the drawing magnification in the main scanning direction (Y direction) is an initial value (no magnification correction)
- the length is set to about 51 mm with a margin of about 0.5 mm on each of the scanning start point side and the scanning end point side of the drawing line SLn.
- the drawing lines SL1 to SL6 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane Poc interposed therebetween.
- the odd-numbered drawing lines SL1, SL3, and SL5 are located on the irradiated surface of the substrate FS on the upstream side ( ⁇ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc.
- the even-numbered drawing lines SL2, SL4, and SL6 are located on the irradiated surface of the substrate FS on the downstream side (+ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc.
- the drawing lines SL1 to SL6 are substantially parallel along the width direction of the substrate FS, that is, along the central axis AXo of the rotary drum DR.
- the drawing lines SL1, SL3, and SL5 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS.
- the drawing lines SL2, SL4, and SL6 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS.
- the drawing line SL2 is arranged between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate FS.
- the drawing line SL3 is arranged between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate FS.
- the drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate FS, and the drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 in the width direction of the substrate FS. Is done.
- the scanning direction of the spot light SP of the beam LB scanned along each of the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction and is the same direction.
- the scanning direction of the spot light SP of the beam LB scanned along each of the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction and is the same direction.
- the scanning direction of the spot light SP of the beam LB scanned along the drawing lines SL1, SL3, SL5 and the scanning direction of the spot light SP of the beam LB scanned along the drawing lines SL2, SL4, SL6 are mutually different. The reverse direction.
- the scanning direction of the spot light SP of the beam LB scanned along the drawing lines SL1, SL3, SL5 is the -Y direction
- the spot of the beam LB scanned along the drawing lines SL2, SL4, SL6 is the + Y direction.
- the drawing start positions (drawing start point positions) of the drawing lines SL1, SL3, and SL5 and the drawing start positions of the drawing lines SL2, SL4, and SL6 are adjacent (or partially overlapped) in the Y direction.
- the drawing end positions (drawing end positions) of the drawing lines SL3 and SL5 and the drawing end positions of the drawing lines SL2 and SL4 are adjacent (or partially overlap) in the Y direction.
- the width of the drawing line SLn in the sub-scanning direction is a thickness corresponding to the size (diameter) ⁇ of the spot light SP.
- the spot light SP may be irradiated along the drawing line SLn so as to overlap by a predetermined length (for example, half the size ⁇ of the spot light SP).
- a predetermined length for example, half the size ⁇ of the spot light SP.
- the spot light SP projected on the drawing line SLn during main scanning is discrete according to the oscillation frequency Fe of the beam LB. become. Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the beam LB and the spot light SP projected by the next one pulse light in the main scanning direction.
- the amount of overlap is set by the size ⁇ of the spot light SP, the scanning speed of the spot light SP, and the oscillation frequency Fe of the beam LB, but when the intensity distribution of the spot light SP is approximated by a Gaussian distribution, It is preferable to overlap the effective diameter size ⁇ determined by 1 / e 2 (or 1/2) of the SP peak intensity by about ⁇ / 2.
- the substrate FS effectively applies the spot light SP between one scanning of the spot light SP along the drawing line SLn and the next scanning. It is desirable to set so as to move by a distance of approximately 1 ⁇ 2 or less of a large size ⁇ .
- the exposure amount to the photosensitive functional layer on the substrate FS can be set by adjusting the peak value of the beam LB (pulse light), but the exposure amount can be increased in a situation where the intensity of the beam LB cannot be increased.
- the main scanning of the spot light SP is caused by either a decrease in the scanning speed of the spot light SP in the main scanning direction, an increase in the oscillation frequency Fe of the beam LB, or a decrease in the transport speed in the sub scanning direction of the substrate FS.
- the overlap amount in the direction or the sub-scanning direction may be increased to 1 ⁇ 2 or more of the effective size ⁇ .
- Each beam scanning device MD transmits the beam LB (LB1 to LB6) to the substrate FS so that the beam LB (LB1 to LB6) is perpendicular to the irradiated surface of the substrate FS at least in the XZ plane. Irradiate toward. That is, each beam scanning device MD (MD1 to MD6) advances in the XZ plane toward the central axis AXo of the rotating drum DR, that is, coaxial (parallel) with the normal line of the irradiated surface. Beams LB (LB1 to LB6) are irradiated (projected) onto the substrate FS.
- Each of the beam scanning devices MD has a beam LB (LB1 to LB6) applied to the drawing lines SLn (SL1 to SL6) to the irradiated surface of the substrate FS in a plane parallel to the YZ plane.
- the beam LB (LB1 to LB6) is irradiated toward the substrate FS so as to be vertical. That is, with respect to the main scanning direction of the spot light SP on the irradiated surface, the beams LB (LB1 to LB6) projected onto the substrate FS are scanned in a telecentric state.
- the irradiation central axes Le1 to Le6 are lines connecting the drawing lines SL1 to SL6 and the central axis AXo on the XZ plane.
- the irradiation center axes Le1, Le3, Le5 of the odd-numbered beam scanning devices MD1, MD3, MD5 are in the same direction in the XZ plane, and the irradiation centers of the odd-numbered beam scanning devices MD2, MD4, MD6 are respectively the same.
- the axes Le2, Le4, and Le6 are in the same direction on the XZ plane.
- the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set so that the angle with respect to the center plane Poc becomes ⁇ ⁇ (see FIG. 4). .
- scale parts SD (SDa, SDb) having scales formed in an annular shape over the entire circumferential direction of the outer peripheral surface of the rotary drum DR are provided at both ends of the rotary drum DR.
- the scale part SD (SDa, SDb) is a diffraction grating in which concave or convex grating lines are engraved at a constant pitch (for example, 20 ⁇ m) in the circumferential direction of the outer peripheral surface of the rotary drum DR. Composed.
- the scale portion SD (SDa, SDb) rotates integrally with the rotary drum DR around the central axis AXo.
- a plurality of encoders (scale read heads) EC are provided so as to face the scale portion SD (SDa, SDb).
- the encoder EC optically detects the rotational position of the rotary drum DR.
- Two encoders EC (EC1a, EC2a) are provided facing the scale portion SDa provided at the end portion on the ⁇ Y direction side of the rotating drum DR, and provided at the end portion on the + Y direction side of the rotating drum DR.
- Two encoders EC (EC1b, EC2b) are provided facing the scale part SDb.
- the encoder EC projects a measurement light beam toward the scale portion SD (SDa, SDb), and photoelectrically detects the reflected light beam (diffracted light), thereby detecting the scale portion SD.
- a detection signal corresponding to a change in the circumferential direction of (SDa, SDb) is output to the control device 18.
- the control device 18 interpolates and digitally processes the detection signal with a counter circuit (not shown), thereby changing the angular change of the rotary drum DR, that is, the change in the circumferential position of the outer peripheral surface with submicron resolution. It can be measured.
- the control device 18 can also measure the transport speed of the substrate FS from the angle change of the rotary drum DR.
- the encoders EC1a and EC1b are provided on the upstream side ( ⁇ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc, and are arranged on the same line as the irradiation center axes Le1, Le3, and Le5 in the XZ plane. ing. That is, on the XZ plane, lines connecting the projection positions (reading positions) of the measurement light beams projected from the encoders EC1a and EC1b onto the scale portions SDa and SDb and the central axis AXo are the irradiation central axes Le1 and Le3. , Le5 are arranged on the same line.
- the encoders EC2a, EC2b are provided on the downstream side (+ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc, and are on the same line as the irradiation center axes Le2, Le4, Le6 on the XZ plane.
- lines connecting the projection positions (reading positions) of the measurement light beams projected from the encoders EC2a and EC2b onto the scale portions SDa and SDb and the central axis AXo are the irradiation central axes Le2 and Le4. , Le6 are arranged on the same line.
- the substrate FS is wound inside the scale portions SDa and SDb at both ends of the rotary drum DR.
- the outer peripheral surface of the scale portion SD (SDa, SDb) is set to be the same surface as the outer peripheral surface of the substrate FS wound around the rotary drum DR. That is, the radius (distance) from the central axis AXo of the outer peripheral surface of the scale part SD (SDa, SDb) is the same as the radius (distance) from the central axis AXo of the outer peripheral surface of the substrate FS wound around the rotary drum DR. It is set to become.
- the encoder EC (EC1a, EC1b, EC2a, EC2b) can detect the scale portion SD (SDa, SDb) at the same radial position as the irradiated surface of the substrate FS wound around the rotary drum DR, Abbe error caused by the difference between the measurement position and the processing position (such as the scanning position of the spot light SP) in the radial direction of the rotary drum DR can be reduced.
- the radius of the outer peripheral surface of the scale part SD (SDa, SDb) and the substrate FS wound around the rotary drum DR are It is difficult to always make the radius of the outer peripheral surface the same. Therefore, in the case of the scale portion SD (SDa, SDb) shown in FIG. 2, the radius of the outer peripheral surface (scale surface) is set to coincide with the radius of the outer peripheral surface of the rotary drum DR. Furthermore, the scale portion SD can be constituted by an individual disk, and the disk (scale disk) can be coaxially attached to the shaft Sft of the rotary drum DR. Even in this case, it is preferable to align the radius of the outer peripheral surface (scale surface) of the scale disk and the radius of the outer peripheral surface of the rotary drum DR so that the Abbe error falls within the allowable value.
- the alignment microscope ALG (ALG1 to ALG4) shown in FIG. 1 is for detecting alignment marks MK (MK1 to MK4) on which a substrate FS is formed as shown in FIG. A plurality (four in this embodiment) are provided.
- the alignment marks MK (MK1 to MK4) are reference marks for relatively aligning (aligning) the predetermined pattern drawn in the exposure area W on the irradiated surface of the substrate FS with the substrate FS. .
- the alignment microscope ALG (ALG1 to ALG4) detects the alignment mark MK (MK1 to MK4) on the substrate FS supported by the circumferential surface of the rotary drum DR.
- the alignment microscope ALG (ALG1 to ALG4) is upstream ( ⁇ X direction side) in the transport direction of the substrate FS with respect to the irradiated region on the substrate FS by the spot light SP of the beam LB (LB1 to LB6) from the exposure head 16. Is provided.
- the alignment microscope ALG (ALG1 to ALG4) is an observation optical system that obtains an enlarged image of a local region including a light source for projecting illumination light for alignment onto the substrate FS and alignment marks MK (MK1 to MK4) on the surface of the substrate FS. And an image sensor such as a CCD or CMOS that captures an enlarged image of the objective lens with a high-speed shutter while the substrate FS is moving in the transport direction.
- the imaging signal captured by the alignment microscope ALG (ALG1 to ALG4) is sent to the control device 18.
- the control device 18 performs alignment mark MK (MK1) based on the image analysis of the imaging signal and information on the rotational position of the rotating drum DR at the moment of imaging (measured by the encoder EC that reads the scale portion SD shown in FIG. 2). To MK4) to detect the position of the substrate FS.
- the illumination light for alignment is light in a wavelength range that has little sensitivity to the photosensitive functional layer on the substrate FS, for example, light having a wavelength of about 500 to 800 nm.
- Alignment marks MK1 to MK4 are provided around each exposure area W.
- a plurality of alignment marks MK1 and MK4 are formed on both sides of the exposure region W in the width direction of the substrate FS at a constant interval Dh along the longitudinal direction of the substrate FS.
- the alignment mark MK1 is formed on the ⁇ Y direction side in the width direction of the substrate FS
- the alignment mark MK4 is formed on the + Y direction side in the width direction of the substrate FS.
- Such alignment marks MK1 and MK4 are located at the same position in the longitudinal direction (X direction) of the substrate FS when the substrate FS is not deformed due to a large tension or a thermal process. Be placed.
- the alignment marks MK2 and MK3 are between the alignment mark MK1 and the alignment mark MK4, and extend along the width direction (short direction) of the substrate FS in the margin of the exposure area W between the + X direction side and the ⁇ X direction side. Is formed.
- the alignment mark MK2 is formed on the ⁇ Y direction side in the width direction of the substrate FS
- the alignment mark MK3 is formed on the + Y direction side of the substrate FS.
- the Y-direction interval between the alignment mark MK1 and the margin alignment mark MK2 arranged at the ⁇ Y-direction side edge of the substrate FS, the Y-direction interval between the margin alignment mark MK2 and the alignment mark MK3, and The interval in the Y direction between the alignment mark MK4 arranged at the side edge in the + Y direction of the substrate FS and the alignment mark MK3 in the blank portion is set to the same distance.
- These alignment marks MK (MK1 to MK4) may be formed together when the pattern layer of the first layer is formed. For example, when the pattern of the first layer is exposed, the alignment mark pattern may be exposed around the exposure area W where the pattern is exposed.
- the alignment mark MK may be formed in the exposure area W. For example, it may be formed in the exposure area W along the outline of the exposure area W.
- the alignment microscope ALG1 is arranged so as to image the alignment mark MK1 existing in the observation region (detection region) Vw1 by the objective lens.
- alignment microscopes ALG2 to ALG4 are arranged so as to image alignment marks MK2 to MK4 existing in observation regions Vw2 to Vw4 by the objective lens. Therefore, the plurality of alignment microscopes ALG1 to ALG4 are provided in order of the alignment microscopes ALG1 to ALG4 from the ⁇ Y direction side of the substrate FS in correspondence with the positions of the plurality of alignment marks MK1 to MK4.
- the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw (Vw1 to Vw4) of the alignment microscope ALG is greater than the length of the exposure region W in the X direction. Is also provided to be shorter.
- the number of alignment microscopes ALG provided in the Y direction can be changed according to the number of alignment marks MK formed in the width direction of the substrate FS.
- the size of the observation regions Vw1 to Vw4 on the surface to be irradiated of the substrate FS is set according to the size of the alignment marks MK1 to MK4 and the alignment accuracy (position measurement accuracy), but is about 100 to 500 ⁇ m square. That's it.
- FIG. 4 is an enlarged view of a main part of the exposure apparatus EX.
- the exposure apparatus EX further includes a plurality of light introducing optical systems BDU (BDU1 to BDU6) and a main body frame UB.
- the light introducing optical system BDU (BDU1 to BDU6) guides the beam LB (LB1 to LB6) from the light source device 14 to the beam scanning device MD (MD1 to MD6).
- the light introducing optical system BDU1 guides the beam LB1 to the beam scanning device MD1
- the light introducing optical system BDU2 guides the beam LB2 to the beam scanning device MD2.
- the light introducing optical systems BDU3 to BDU6 guide the beams LB3 to LB6 to the beam scanning devices MD3 to MD6.
- the beam LB from the light source device 14 is branched or incident on each of the light introducing optical systems BDU1 to BDU6 by an optical member such as a beam splitter (not shown) or a switching optical deflector.
- the light introduction optical system BDU (BDU1 to BDU6) modulates the intensity of the spot light SP projected on the irradiated surface of the substrate FS by the beam scanning device MD (MD1 to MD6) at high speed according to the pattern data (ON / ON).
- the drawing optical element AOM (AOM1 to AOM6) is turned off.
- the drawing optical element AOM is an acousto-optic modulator.
- This pattern data is stored in a storage area (not shown) of the control device 18.
- the main body frame UB holds a plurality of light introducing optical systems BDU1 to BDU6 and a plurality of beam scanning devices MD1 to MD6.
- the main body frame UB includes a first frame portion Ub1 that holds a plurality of light introduction optical systems BDU1 to BDU6, and a second frame portion Ub2 that holds a plurality of beam scanning devices MD1 to MD6.
- the first frame unit Ub1 holds a plurality of light introduction optical systems BDU1 to BDU6 above the plurality of beam scanning devices MD1 to MD6 (+ Z direction side) held by the second frame unit Ub2.
- the odd-numbered light introducing optical systems BDU1, BDU3, and BDU5 correspond to the positions of the odd-numbered beam scanning devices MD1, MD3, and MD5, and are upstream of the transport direction of the substrate FS ( ⁇ X direction) with respect to the center plane Poc.
- the first frame portion Ub1 is held so as to be disposed on the side).
- the even-numbered light introducing optical systems BDU2, BDU4, and BDU6 correspond to the positions of the even-numbered beam scanning devices MD2, MD4, and MD6, and are located downstream of the center plane Poc in the transport direction of the substrate FS (
- the first frame portion Ub1 is held so as to be disposed on the + X direction side).
- the configuration of the light introducing optical system BDU will be described in detail later.
- the first frame unit Ub1 supports the plurality of light introducing optical systems BDU1 to BDU6 from below ( ⁇ Z direction side).
- the first frame portion Ub1 is provided with a plurality of openings Hs (Hs1 to Hs6) corresponding to the plurality of light introducing optical systems BDU1 to BDU6.
- the plurality of openings Hs1 to Hs6 allow the beams LB1 to LB6 emitted from the plurality of light introducing optical systems BDU1 to BDU6 to enter the corresponding beam scanning devices MD1 to MD6 without being blocked by the first frame unit Ub1. . That is, the beams LB (LB1 to LB6) emitted from the light introducing optical system BDU (BDU1 to BDU6) enter the beam scanning device MD (MD1 to MD6) through the opening Hs (Hs1 to Hs6).
- the second frame unit Ub2 holds each of the beam scanning devices MD (MD1 to MD6) so as to be rotatable around the irradiation center axis Le (Le1 to Le6). That is, each beam scanning device MD (MD1 to MD6) can be rotated around the irradiation center axis Le (Le1 to Le6) by the second frame portion Ub2.
- the holding structure of the beam scanning device MD by the second frame portion Ub2 will be described in detail later.
- FIG. 5 is a detailed diagram showing the optical configuration of the light introducing optical system BDU
- FIG. 6 is a schematic explanatory diagram for explaining the switching of the optical path (ON / OFF of the beam LB) by the drawing optical element AOM.
- the odd-numbered light introducing optical systems BDU1, BDU3, and BDU5 and the even-numbered light introducing optical systems BDU2, BDU4, and BDU6 are provided symmetrically with respect to the center plane Poc. Since each light introducing optical system BDU (BDU1 to BDU6) has the same configuration, only the light introducing optical system BDU1 will be described, and description of the other light introducing optical systems BDU will be omitted.
- the light introducing optical system BDU1 includes optical lens systems G1 and G2 and reflection mirrors M1 to M5 in addition to the drawing optical element AOM1.
- the beam LB1 is incident on the drawing optical element AOM1 so as to be a beam waist in the drawing optical element AOM1.
- the drawing optical element AOM1 transmits the incident beam LB1 to the absorber AB when the drive signal (high frequency signal) from the control device 18 is off (low), and the control device 18 When the drive signal (high frequency signal) from is on (high), the first-order diffracted light diffracted from the incident beam LB1 is directed to the reflecting mirror M1.
- the absorber AB is an optical trap that absorbs the beam LB1 in order to suppress leakage of the beam LB1 to the outside.
- the control device 18 turns on or off (high / low) the drive signal (high frequency signal) to be applied to the drawing optical element AOM1 according to the pattern data, so that the beam LB1 is directed to the reflection mirror M1. (Drawing optical element AOM1 is turned on) or switching to absorber AB (drawing optical element AOM1 is turned off) is switched. This is because when viewed on the irradiated surface of the substrate FS, the intensity of the spot light SP of the beam LB1 reaching the irradiated surface (substrate FS) from the beam scanning device MD1 is high and low depending on the pattern data. (For example, zero level) means that the signal is modulated at high speed.
- a plurality of pieces of pattern data are two-dimensionally decomposed so that the direction along the scanning direction (Y direction) of the spot light SP is the row direction and the direction along the transport direction (X direction) of the substrate FS is the column direction.
- Bitmap data composed of pixel data. This pixel data is 1-bit data of “0” or “1”. The pixel data “0” means that the intensity of the spot light SP irradiated on the substrate FS is set to a low level, and the pixel data “1” indicates that the intensity of the spot light SP irradiated on the substrate FS is high. Means level.
- the control device 18 outputs an off drive signal (high frequency signal) to the drawing optical element AOM1 of the light introducing optical system BDU1, and the pixel data is “1”. Outputs an ON drive signal (high-frequency signal) to the drawing optical element AOM1.
- the number of pixel data for one column of the pattern data is determined according to the size of the pixel on the irradiated surface and the length of the drawing line SLn, and the size of one pixel is determined by the size ⁇ of the spot light SP.
- the size of one pixel is about the size ⁇ of the spot light SP or more.
- the size of one pixel is set to about 3 ⁇ m square or more. Therefore, in order to draw a finer pattern, the effective size ⁇ of the spot light SP is made smaller and the size of one pixel is set smaller.
- the number (pulse number) of the spot light SP projected along the drawing line SL1 is the number of pixel data for one column of pattern data. Doubled.
- This pattern data is stored in a memory (not shown).
- the pixel data for one column may be referred to as a pixel data column Dw, and the pattern data is bitmap data in which a plurality of pixel data columns Dw (Dw1, Dw2,..., Dwn) are arranged in the column direction. is there.
- control device 18 reads a pixel data string (pixel data for one column) Dw (for example, Dw1) of pattern data, and reads the read pixels in synchronization with the scanning of the spot light SP by the beam scanning device MD1.
- a drive signal corresponding to the pixel data of the data string Dw1 is sequentially output to the drawing optical element AOM1 of the light introducing optical system BDU1.
- the data for one pixel selected from the read pixel data string Dw1 is shifted in the row direction at every timing when two pulses of the spot light SP are projected along the drawing line SL1. Then, drive signals corresponding to the selected data for one pixel are sequentially output to the drawing optical element AOM1.
- strength is modulated according to pixel data for every 2 pulses of the spot light SP irradiated on the irradiation surface of the board
- the control device 18 reads out the next pixel data string Dw2. Then, with the start of scanning of the spot light SP of the beam scanning device MD1, a drive signal corresponding to the pixel data of the read pixel data string Dw2 is sequentially output to the drawing optical element AOM1 of the light introducing optical system BDU1. In this way, each time scanning of the spot light SP is started, a drive signal corresponding to the pixel data in the pixel data column Dw of the next column is sequentially output to the drawing optical element AOM1. As a result, a pattern corresponding to the pattern data can be drawn and exposed.
- the pattern data is provided for each beam scanning device MD.
- the beam LB1 from the drawing optical element AOM1 is incident on the absorber AB or the reflecting mirror M1 via the beam shaping optical lens system G1. That is, regardless of whether the drawing optical element AOM1 is on or off, the beam LB1 that has passed through the drawing optical element AOM1 passes through the optical lens system G1.
- the drawing optical element AOM1 is switched on and the beam LB1 enters the reflection mirror M1, the optical path of the beam LB1 is bent by the reflection mirrors M1 to M5 in FIG. Ejected toward.
- the reflection mirror M5 emits the beam LB1 so as to be coaxial with the irradiation center axis Le1.
- the reflecting mirror M1 of the light introducing optical system BDU1 is made so that the axis of the beam LB1 from the light introducing optical system BDU1 is coaxial with the irradiation center axis Le1 set in the beam scanning device MD1 and enters the beam scanning device MD1.
- the optical path is bent by ⁇ M5.
- An optical lens system G2 for beam shaping is provided between the reflection mirror M4 and the reflection mirror M5.
- the exposure head 16 including at least a plurality of beam scanning devices MD (MD1 to MD6) and the light introducing optical system BDU (BDU1 to BDU6) constitute the drawing device of the present embodiment.
- the main body frame UB may also constitute part of the drawing apparatus.
- each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.
- the direction parallel to the irradiation center axis Le (Le1) is the Zt direction
- the substrate FS is on the plane orthogonal to the Zt direction
- the substrate FS moves the exposure apparatus EX from the process apparatus PR1.
- the direction toward the process apparatus PR2 is defined as the Xt direction
- the direction perpendicular to the Xt direction on the plane perpendicular to the Zt direction is defined as the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 7 (and FIG. 5) are the three-dimensional coordinates of X, Y, and Z in FIG. ) And the three-dimensional coordinates rotated so as to be parallel to each other.
- the reflection mirror M10, the beam expander BE, and the reflection mirror M11 are arranged along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the irradiated surface (substrate FS).
- Polarization beam splitter BS1 reflection mirror M12, image shift optical member (parallel plate) SR, deflection adjustment optical member (prism) DP, field aperture FA, reflection mirror M13, ⁇ / 4 wavelength plate QW, cylindrical lens CYa, reflection mirror M14, polygon mirror PM, f ⁇ lens FT, reflection mirror M15, and cylindrical lens CYb are provided.
- an optical lens system G10 and a photodetector DT1 for detecting reflected light from the irradiated surface (substrate FS) via the polarization beam splitter BS1 are provided.
- the beam LB1 incident on the beam scanning device MD1 travels in the ⁇ Zt direction and is incident on the reflection mirror M10 inclined by 45 ° with respect to the XtYt plane.
- the axis of the beam LB1 incident on the beam scanning device MD1 is incident on the reflection mirror M10 so as to be coaxial with the irradiation center axis Le1.
- the reflection mirror M10 functions as an incident optical member that causes the beam LB1 to enter the beam scanning device MD1, and the incident beam LB1 is directed toward the reflection mirror M11 along the optical axis AXa set parallel to the Xt axis. Reflect in the direction.
- the optical axis AXa is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane.
- the beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE arranged along the optical axis AXa and enters the reflection mirror M11.
- the beam expander BE expands the diameter of the transmitted beam LB1.
- the beam expander BE includes a condensing lens Be1 and a collimating lens Be2 that collimates the beam LB1 that diverges after being converged by the condensing lens Be1.
- the reflection mirror M11 is disposed with an inclination of 45 ° with respect to the YtZt plane, and reflects the incident beam LB1 (optical axis AXa) toward the polarization beam splitter BS1 in the ⁇ Yt direction.
- the polarization separation surface of the polarization beam splitter BS1 is disposed at an angle of 45 ° with respect to the YtZt plane, reflects a P-polarized beam, and transmits a linearly polarized (S-polarized) beam polarized in a direction orthogonal to the P-polarized light. Is.
- the polarization beam splitter BS1 reflects the beam LB1 from the reflection mirror M11 in the -Xt direction and guides it to the reflection mirror M12 side.
- the reflection mirror M12 is disposed with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the ⁇ Zt direction toward the reflection mirror M13 that is separated from the reflection mirror M12 in the ⁇ Zt direction.
- the beam LB1 reflected by the reflection mirror M12 passes through the image shift optical member SR, the deflection adjustment optical member DP, and the field aperture (field stop) FA along the optical axis AXc parallel to the Zt axis, and then reflects the reflection mirror M13. Is incident on.
- the image shift optical member SR two-dimensionally adjusts the center position in the cross section of the beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction (optical axis AXc) of the beam LB1.
- the image shift optical member SR is composed of two quartz parallel plates Sr1 and Sr2 arranged along the optical axis AXc.
- the parallel plate Sr1 can be tilted around the Xt axis
- the parallel plate Sr2 is Yt. It can be tilted around its axis.
- the parallel plates Sr1 and Sr2 are inclined about the Xt axis and the Yt axis, respectively, so that the position of the center of the beam LB1 is shifted two-dimensionally by a minute amount on the XtYt plane orthogonal to the traveling direction of the beam LB1.
- the parallel plates Sr1 and Sr2 are driven by an actuator (drive unit) (not shown) under the control of the control device 18.
- the deflection adjusting optical member DP finely adjusts the inclination of the beam LB1 reflected by the reflecting mirror M12 and passing through the image shift optical member SR with respect to the optical axis AXc.
- the deflection adjusting optical member DP is composed of two wedge-shaped prisms Dp1 and Dp2 arranged along the optical axis AXc, and each of the prisms Dp1 and Dp2 is provided so as to be able to rotate 360 ° about the optical axis AXc. It has been.
- the axis of the beam LB1 reaching the reflecting mirror M12 and the optical axis AXc are paralleled, or the axis of the beam LB1 reaching the irradiated surface (substrate FS) and irradiation. Parallelism with the central axis Le1 is performed. Note that the beam LB1 after the deflection adjustment by the two prisms Dp1 and Dp2 may be laterally shifted in a plane parallel to the cross section of the beam LB, and the lateral shift is performed by the previous image shift optical member SR. It can be restored.
- the prisms Dp1 and Dp2 are driven by an actuator (drive unit) (not shown) under the control of the control device 18.
- the beam LB1 that has passed through the image shift optical member SR and the deflection adjustment optical member DP passes through the circular aperture of the field aperture FA and reaches the reflection mirror M13.
- the circular aperture of the field aperture FA is a stop that cuts the skirt portion of the intensity distribution in the cross section of the beam LB1 expanded by the beam expander BE. If the circular aperture of the field aperture FA is a variable luminous aperture whose diameter can be adjusted, the intensity (luminance) of the spot light SP can be adjusted.
- the reflection mirror M13 is disposed with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 toward the reflection mirror M14 in the + Xt direction.
- the beam LB1 reflected by the reflection mirror M13 enters the reflection mirror M14 via the ⁇ / 4 wavelength plate QW and the cylindrical lens CYa.
- the reflection mirror M14 reflects the incident beam LB1 toward the polygon mirror (rotating polygonal mirror, scanning deflection member) PM.
- the polygon mirror PM reflects the incident beam LB1 toward the + Xt direction toward the f ⁇ lens FT having the optical axis AXf parallel to the Xt axis.
- the polygon mirror PM deflects (reflects) the incident beam LB1 in a plane parallel to the XtYt plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate FS.
- the polygon mirror PM has a rotation axis AXp extending in the Zt-axis direction and a plurality of reflection surfaces RP (eight reflection surfaces RP in the present embodiment) formed around the rotation axis AXp.
- the reflection direction of the beam LB1 is deflected by one reflection surface RP, and the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate FS is along the scanning direction (the width direction of the substrate FS, the Yt direction). Can be scanned.
- the spot light SP of the beam LB1 can be scanned along the drawing line SL1 by one reflecting surface RP.
- the number of drawing lines SL1 in which the spot light SP is scanned on the irradiated surface of the substrate FS by one rotation of the polygon mirror PM is eight, which is the same as the number of the reflecting surfaces RP.
- the polygon mirror PM is rotated at a constant speed by a polygon driving unit RM including a motor and the like.
- the rotation of the polygon mirror PM by the polygon drive unit RM is controlled by the control device 18.
- the effective length (for example, 50 mm) of the drawing line SL1 is set to a length equal to or shorter than the maximum scanning length (for example, 51 mm) that allows the spot light SP to be scanned by the polygon mirror PM.
- the center point of the drawing line SL1 (the irradiation center axis Le1 passes) is set at the center of the maximum scanning length.
- the effective length of the drawing line SL1 is 50 mm
- the spot light SP is irradiated onto the substrate FS along the drawing line SL1 while overlapping the spot light SP having an effective size ⁇ of 4 ⁇ m by 2.0 ⁇ m.
- the feed speed (conveyance speed) Vt of the substrate FS in the sub-scanning direction is 8 mm / sec and that the spot light SP is scanned at intervals of 2.0 ⁇ m in the sub-scanning direction as well, along the drawing line SL1.
- the maximum incident angle of view (corresponding to the maximum scanning length of the spot light SP) at which the beam LB1 reflected by one reflecting surface RP of the polygon mirror PM effectively enters the f ⁇ lens FT is the focal length of the f ⁇ lens FT and the maximum scanning. It is roughly determined by the length.
- the ratio of the rotation angles (scanning efficiency ⁇ p) contributing to the actual scanning out of the rotation angles of 45 ° for one reflection surface RP is about 1/3. This corresponds to the maximum incident angle of view of the f ⁇ lens FT (the range of ⁇ 15 °, that is, the range of 30 °).
- the length of the drawing line SLn is LBL ( ⁇ m), and the overlap ratio of the spot light SP is Uo.
- the transport speed of the substrate FS is Vt ( ⁇ m / sec)
- the number of reflection surfaces RP of the polygon mirror PM is Np
- the emission frequency Fe (Hz) Is represented by Fe LBL ⁇ Vt / ( ⁇ p ⁇ YP 2 ).
- the cylindrical lens CYa causes the incident beam LB1 to be incident on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) of the polygon mirror PM. Converge into slits. Even if the reflecting surface RP is inclined with respect to the Zt direction (inclination of the reflecting surface RP with respect to the normal of the XtYt plane) by the cylindrical lens CYa whose bus line is parallel to the Yt direction, the influence is suppressed. It is possible to suppress the irradiation position of the beam LB1 irradiated on the irradiated surface of the substrate FS from shifting in the Xt direction.
- the f ⁇ lens FT having the optical axis AXf extending in the Xt-axis direction is a telecentric scan lens that projects the beam LB1 reflected by the polygon mirror PM onto the reflection mirror M15 so as to be parallel to the optical axis AXf on the XtYt plane. It is.
- the incident angle ⁇ of the beam LB1 to the f ⁇ lens FT changes according to the rotation angle ( ⁇ / 2) of the polygon mirror PM.
- the f ⁇ lens FT projects the beam LB1 to the image height position on the irradiated surface of the substrate FS in proportion to the incident angle ⁇ through the reflection mirror M15 and the cylindrical lens CYb.
- the reflection mirror M15 reflects the incident beam LB1 in the ⁇ Zt direction toward the substrate FS via the cylindrical lens CYb.
- the beam LB1 projected on the substrate FS is a minute spot light having a diameter of about several ⁇ m (for example, 3 ⁇ m) on the irradiated surface of the substrate FS. Converged to SP. Further, the spot light SP projected on the irradiated surface of the substrate FS is one-dimensionally scanned by the polygon mirror PM along the drawing line SL1 extending in the Yt direction.
- the optical axis AXf of the f ⁇ lens FT and the irradiation center axis Le1 are on the same plane, and the plane is parallel to the XtZt plane. Therefore, the beam LB1 traveling on the optical axis AXf is reflected in the ⁇ Zt direction by the reflecting mirror M15, and is projected on the substrate FS so as to be coaxial with the irradiation center axis Le1.
- at least the f ⁇ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS.
- At least the reflecting members (reflecting mirrors M11 to M15) and the polarizing beam splitter BS1 function as an optical path deflecting member that bends the optical path of the beam LB1 from the reflecting mirror M10 to the substrate FS.
- the incident axis of the beam LB1 incident on the reflecting mirror M10 and the irradiation center axis Le1 can be made substantially coaxial.
- the beam LB1 passing through the beam scanning device MD1 travels in the ⁇ Zt direction and is projected onto the substrate FS after passing through a substantially U-shaped or U-shaped optical path.
- the spot light SP of the beam LB (LB1 to LB6) is one-dimensionally scanned in the scanning direction (Y direction) by each beam scanning device MD (MD1 to MD6).
- the spot light SP can be relatively two-dimensionally scanned on the irradiated surface of the substrate FS. Therefore, a predetermined pattern can be drawn and exposed on the exposure region W of the substrate FS.
- the drawing optical elements AOM (AOM1 to AOM6) are provided in the light introducing optical system BDU (BDU1 to BDU6), they may be provided in the beam scanning device MD. In this case, a drawing optical element AOM may be provided between the reflection mirror M10 and the reflection mirror M14.
- the photodetector DT1 has a photoelectric conversion element that photoelectrically converts incident light.
- a predetermined reference pattern is formed on the surface of the rotary drum DR.
- the portion on the rotary drum DR on which the reference pattern is formed is made of a material having a low reflectance (10 to 50%) with respect to the wavelength region of the beam LB, and on the rotary drum DR on which the reference pattern is not formed.
- the other part is made of a material having a reflectance of 10% or less or a material that absorbs light.
- the beam scanning device MD1 irradiates the spot light SP of the beam LB1 to the region where the reference pattern of the rotary drum DR is formed in a state where the substrate FS is not wound (or a state where the substrate FS is passed through the transparent portion).
- the reflected light is a cylindrical lens CYb, a reflection mirror M15, an f ⁇ lens FT, a polygon mirror PM, a reflection mirror M14, a cylindrical lens CYa, a ⁇ / 4 wavelength plate QW, a reflection mirror M13, a field aperture FA, a deflection adjusting optical member DP. Then, it passes through the image shift optical member SR and the reflection mirror M12 and enters the polarization beam splitter BS1.
- a ⁇ / 4 wavelength plate QW is provided between the polarizing beam splitter BS1 and the substrate FS, specifically, between the reflection mirror M13 and the cylindrical lens CYa.
- the beam LB1 irradiated to the substrate FS is converted from the P-polarized light to the circularly-polarized beam LB1 by the ⁇ / 4 wavelength plate QW, and the reflected light incident on the polarization beam splitter BS1 from the substrate FS is converted to the ⁇ /
- the circularly polarized light is converted to S polarized light by the four-wavelength plate QW. Therefore, the reflected light from the substrate FS passes through the polarization beam splitter BS1 and enters the photodetector DT1 through the optical lens system G10.
- the rotating drum DR is rotated.
- the beam scanning device MD1 scans the spot light SP
- the spot light SP is irradiated two-dimensionally on the outer peripheral surface of the rotary drum DR. Therefore, the image of the reference pattern formed on the rotary drum DR can be acquired by the photodetector DT1.
- the intensity change of the photoelectric signal output from the photodetector DT1 is changed at each scanning time in response to a clock pulse signal (generated in the light source device 14) for pulse emission of the spot light SP.
- a clock pulse signal generated in the light source device 14
- one-dimensional image data in the Yt direction is obtained for every fixed distance in the sub-scanning direction (for example, 1/2 of the size ⁇ of the spot light SP).
- the sub-scanning direction for example, 1/2 of the size ⁇ of the spot light SP.
- the control device 18 measures the inclination of the drawing line SL1 of the beam scanning device MD based on the acquired two-dimensional image information of the reference pattern of the rotating drum DR.
- the inclination of the drawing line SL1 may be a relative inclination between the beam scanning devices MD (MD1 to MD6), or may be an inclination (absolute inclination) with respect to the central axis AXo of the rotary drum DR. Good. It goes without saying that the inclinations of the respective drawing lines SL2 to SL6 can be measured in the same manner.
- An origin sensor 20 is provided around the polygon mirror PM of the beam scanning device MD1 as shown in FIG.
- the origin sensor 20 outputs a pulsed origin signal SH indicating the start of scanning of the spot light SP by each reflecting surface RP.
- the origin sensor 20 outputs an origin signal SH when the rotational position of the polygon mirror PM comes to a predetermined position immediately before the scanning of the spot light SP by the reflecting surface RP is started.
- the polygon mirror PM can deflect the beam LB1 projected on the substrate FS within the effective scanning angle range ⁇ s. That is, when the reflection direction (deflection direction) of the beam LB1 reflected by the polygon mirror PM is within the effective scanning angle range ⁇ s, the reflected beam LB1 enters the f ⁇ lens FT.
- the origin sensor 20 outputs the origin signal SH when the rotational position of the polygon mirror PM comes to a predetermined position immediately before the reflection direction of the beam LB1 reflected by the reflecting surface RP falls within the effective scanning angle range ⁇ s. Since the spot light SP is scanned eight times during the period of one rotation of the polygon mirror PM, the origin sensor 20 also outputs the origin signal SH eight times during the one rotation period.
- the origin signal SH detected by the origin sensor 20 is sent to the control device 18. After the origin sensor 20 outputs the origin signal SH, scanning along the drawing line SL1 of the spot light SP is started.
- the origin sensor 20 is a reflection surface RP next to the reflection surface RP that performs scanning of the spot light SP (deflection of the beam LB) from now on (in this embodiment, the reflection surface RP just before the rotation direction of the polygon mirror PM). Is used to output the origin signal SH.
- the reflection surface RP that deflects the beam LB1 is represented by RPa, and the other reflection surfaces RP are rotated counterclockwise (the rotation direction of the polygon mirror PM).
- RPb to RPh around the opposite direction are represented by RPb to RPh around the opposite direction).
- the origin sensor 20 is a light source unit 22 that emits a laser beam Bga in a non-photosensitive wavelength region such as a semiconductor laser, and a mirror that reflects the laser beam Bga from the light source unit 22 and projects it onto the reflection surface RPb of the polygon mirror PM. And a beam transmission system 20 a having 24 and 26.
- the origin sensor 20 includes a light receiving unit 28, mirrors 30 and 32 for guiding the reflected light (reflected beam Bgb) of the laser beam Bga reflected by the reflecting surface RPb to the light receiving unit 28, and a reflected beam Bgb reflected by the mirror 32.
- a beam receiving system 20b including a lens system 34 for condensing the light into a minute spot light.
- the light receiving unit 28 includes a photoelectric conversion element that receives the spot light of the reflected beam Bgb collected by the lens system 34.
- the position at which the laser beam Bga is projected onto each reflecting surface RP of the polygon mirror PM is set to be the pupil plane (focal position) of the lens system 34.
- the beam transmission system 20a and the beam reception system 20b are configured so that when the rotational position of the polygon mirror PM reaches a predetermined position immediately before the scanning of the spot light SP by the reflection surface RP starts, It is provided at a position where the reflected beam Bgb of the emitted laser beam Bga can be received. That is, the beam transmitting system 20a and the beam receiving system 20b are the reflected beams of the laser beam Bga emitted by the beam transmitting system 20a when the reflecting surface RP that scans the spot light SP is at a predetermined angular position. It is provided at a position where Bgb can be received.
- symbol Msf of FIG. 8 is the shaft of the rotary motor of the polygon drive part RM arrange
- a light-shielding body having a very small slit opening is provided immediately before the light-receiving surface of the photoelectric conversion element in the light-receiving unit 28 (not shown). While the angle position of the reflection surface RPb is within a predetermined angle range, the reflected beam Bgb is incident on the lens system 34, and the spot light of the reflected beam Bgb scans the light shield in the light receiving unit 28 in a certain direction. To do. During the scanning, spot light of the reflected beam Bgb that has passed through the slit opening of the light shield is received by the photoelectric conversion element, and the received light signal is amplified by an amplifier and output as a pulsed origin signal SH.
- the origin sensor 20 detects the origin signal SH using the reflection surface RPb that is one before the rotation direction from the reflection surface RPa that deflects the beam LB (scans the spot light SP). Therefore, if the angle ⁇ j formed between the adjacent reflecting surfaces RP (for example, the reflecting surfaces RPa and RPb) has an error with respect to the design value (135 degrees when there are eight reflecting surfaces RP), As shown in FIG. 9, the generation timing of the origin signal SH may be different for each reflection surface RP due to error variations.
- the origin signal SH generated using the reflecting surface RPb is SH1.
- the origin signal SH generated using the reflection surfaces RPc, RPd, RPe,... Is SH2, SH3, SH4,.
- the interval between the generation timings of the origin signals SH (SH1, SH2, SH3,...) is a time Tpx.
- This time Tpx is the time required for the polygon mirror PM to rotate by one surface of the reflection surface RP.
- the timing of the origin signal SH generated using the reflection surfaces RPc and RPd is shifted from the normal generation timing due to the error of the angle ⁇ j formed by the reflection surface RP of the polygon mirror PM.
- the time intervals Tp1, Tp2, Tp3,... At which the origin signals SH1, SH2, SH3, SH4,... Are generated are not constant in the order of ⁇ seconds due to manufacturing errors of the polygon mirror PM.
- deviations in the generation timings of the origin signals SH1, SH2, SH3,... Are exaggerated.
- the drawing start point (on the irradiated surface of the substrate FS of the spot light SP drawn by each reflecting surface RP (RPa to RPh) due to the error of the angle ⁇ j formed between the adjacent reflecting surfaces RP of the polygon mirror PM ( The position of the scanning start point) varies in the main scanning direction.
- the drawing of the spot light SP is started with the drawing start point after the time Tpx after the generation of one pulse-like origin signal SH. That is, after the time Tpx from the generation of the origin signal SH, the control device 18 applies the drawing optical element AOM1 of the light introducing optical system BDU1 that makes the beam LB1 incident on the beam scanning device MD1 to the pixel data of the pixel data string Dw.
- the corresponding drive signals (ON / OFF) are sequentially output.
- the reflecting surface RPb used for detecting the origin signal SH and the reflecting surface RP that actually scans the spot light SP can be made the same reflecting surface.
- the control device 18 sequentially applies drive signals corresponding to the pixel data of the pixel data string Dw1 to the drawing optical element AOM1 of the light introducing optical system BDU1 after a time Tpx from the generation of the origin signal SH1. Output. Thereby, the spot light SP can be scanned with the reflecting surface RPb used for detecting the origin signal SH1.
- the control device 18 sequentially outputs drive signals corresponding to the pixel data of the pixel data string Dw2 to the drawing optical element AOM1 of the light introducing optical system BDU1 after a time Tpx from the generation of the origin signal SH2. Thereby, the spot light SP can be scanned with the reflection surface RPc used for detecting the origin signal SH2.
- the time Tpx during which the polygon mirror PM rotates 45 degrees is accurate on the order of microseconds, that is, the polygon mirror PM is rotated uniformly and precisely at a constant speed.
- the reflection surface RP used for generating the origin signal SH always rotates exactly 45 degrees after the time Tpx, and the beam LB1 is changed to f ⁇ .
- the angle is reflected toward the lens FT. Therefore, by increasing the rotational isokineticity of the polygon mirror PM and reducing the speed unevenness during one rotation as much as possible, the position of the reflecting surface RP used for generating the origin signal SH and the beam LB1 are deflected to generate the spot light SP.
- the position of the reflection surface RP used for scanning can be made different. Thereby, the freedom degree of arrangement
- the reflection surface RP to be detected by the origin sensor 20 is one before the rotation direction of the reflection surface RP that deflects the beam LB1, but may be one before the rotation direction of the polygon mirror PM. Not limited to.
- the origin signal SH is generated.
- the drawing start point may be set after n ⁇ time Tpx.
- the number Np of the reflection surfaces RP of the polygon mirror PM is 8, the rotation speed (rotation speed) Vp is 36,000 rpm, the scanning efficiency is ⁇ p ⁇ 1/3, and the spot light SP on the substrate FS is effective.
- the diameter ⁇ is 3 ⁇ m
- the length LBL of the drawing line SL1 is 50 mm
- the pitch (interval) YP of the drawing line SL1 in the sub-scanning direction (Xt direction) is the overlap ratio Uo (0 ⁇
- the overlap rate Uo 1 ⁇ 2, that is, when the spot light SP is overlapped by 1 ⁇ 2 of the size ⁇
- Vt 4800 ⁇ m / sec.
- the beam scanning devices MD2 to MD6 are similarly provided with an origin sensor 20.
- FIG. 10 is a cross-sectional view showing a holding structure of the beam scanning device MD by the second frame portion Ub2. Since the holding structure of the beam scanning device MD is the same for each beam scanning device MD, only the holding structure of the beam scanning device MD1 will be described, and the description of the holding structures of the other beam scanning devices MD will be omitted. . In FIG. 10, as in FIG. 7, description will be made using three-dimensional coordinates of Xt, Yt, and Zt.
- the beam scanning device MD1 includes optical components (reflection mirrors M10 to M15, beam expander BE, polarization beam splitter BS1, image shift optical member SR, deflection adjustment optical member DP, field aperture FA, ⁇ / 4 wavelength plate QW,
- the cylindrical lenses CYa and CYb, the polygon mirror PM, the f ⁇ lens FT, the optical lens system G10, and the photodetector DT1) are supported as shown in FIG. 7, and a support frame 40 that can rotate around the irradiation center axis Le1 is provided.
- the support frame 40 has a substantially U-shaped or U-shaped shape corresponding to the optical path of the beam LB1 passing through the beam scanning device MD1.
- the support frame 40 is parallel to the XtYt plane and is disposed substantially in parallel in the Zt direction, and two parallel support portions 42 and 44, and a closing support portion that closes one end of the two parallel support portions 42 and 44. 46.
- the closing support portion 46 is provided on the ⁇ Xt direction side of the parallel support portions 42 and 44.
- Optical components of the beam scanning device MD (reflection mirror M10,... Polygon mirror PM, f ⁇ lens FT, reflection mirror M15, cylindrical lens CYb, etc.) are arranged along the outer peripheral surface of the support frame 40. .
- the reflection mirrors M10 and M11, the beam expander BE, the polarization beam splitter BS1, the optical lens system G10, and the photodetector DT1 are supported by the surface of the parallel support portion 42 on the + Zt direction side.
- the image shift optical member SR, the deflection adjustment optical member DP, and the field aperture FA are supported on the surface of the closing support portion 46 on the ⁇ Xt direction side.
- the ⁇ / 4 wave plate QW, the cylindrical lenses CYa and CYb, the reflection mirrors M14 and M15, the polygon mirror PM, the f ⁇ lens FT, and the origin sensor 20 are on the ⁇ Zt direction side of the parallel support portion 44.
- the reflection mirror M12 is supported by a surface on the + Zt direction side of the parallel support portion 42 or a surface on the ⁇ Xt direction side of the closing support portion 46, and the reflection mirror M13 is a surface on the ⁇ Xt direction side of the closing support portion 46, Alternatively, the parallel support portion 44 is supported by the surface on the ⁇ Zt direction side.
- the support frame 40 (particularly the parallel support portion 44) supports the polygon mirror PM by supporting the polygon drive unit RM (rotary motor).
- the outer ring portion of the annular bearing 48 that is a part of the drawing apparatus is fixed to each of the parallel support portions 42 and 44 so that the central axis of the column member BX1 is coaxial with the irradiation central axis Le1.
- the inner ring portion is fixed to the outer peripheral surface of the column member BX1.
- the annular bearing 48 between the parallel support portion 42 on the + Zt direction side and the support member BX1 is composed of, for example, an angular ball bearing of a rear surface combination, and a parallel support portion 44 on the ⁇ Zt direction side.
- the annular bearing 48 between the support member BX1 and the support member BX1 is a deep groove ball bearing.
- the beam scanning device MD1 (including the support frame 40) is tilted by ⁇ with respect to the center plane Poc by the support member BX1 when it deviates in the + X (+ Xt) direction from the center of gravity position (FIGS. 1 and 4). Supported by As described above, the beam scanning device MD1 is supported in a cantilever manner on the column member BX1 (second frame portion Ub2) provided at the position of the irradiation center axis Le1.
- the beam scanning device MD1 has a drive mechanism 50 that rotates the support frame 40 relative to the second frame portion Ub2.
- the drive mechanism 50 is provided in a space between the two parallel support portions 42 and 44. Thereby, the beam scanning device MD1 can be made compact.
- the drive mechanism 50 will be described in detail with reference to FIG.
- the drive mechanism 50 includes a linear actuator 52, a movable member 54, a driven member 56, and springs 58 and 60.
- the linear actuator 52, the movable member 54, and the spring 58 are supported on a plate-like drive support member 62 that is parallel to the XtYt plane.
- a vertical portion 62a extending in a plate shape in the + Zt direction is provided integrally with the YzZt plane.
- the vertical portion 62a is fixed to a side surface Ub2a parallel to the YtZt plane of the second frame portion Ub2.
- a U-shaped recess Ubx that fits and holds the column member BX1 is formed on the side surface Ub2a of the second frame portion Ub2 so that the center line of the cylindrical column member BX1 is coaxial with the irradiation center axis Le1. ing.
- the column member BX1 fitted in the recess Ubx is fixed so as to be sandwiched between the vertical portion 62a of the drive support member 62 and the recess Ubx.
- the driven member 56 is supported in a state of being fixed to the inner surface side (the side surface in the + Xt direction) of the closing support portion 46 of the support frame 40.
- the driven member 56 is configured to contact a part of the movable member 54 that rotates by receiving the linear thrust of the linear actuator 52 and to receive a force in the ⁇ Yt direction.
- the entire beam scanning device MD1 rotates around the column member BX1 (irradiation center axis Le1).
- the linear actuator 52 includes a rod 52a that can advance and retract in the Xt direction, and moves the rod 52a forward and backward in the Xt direction under the control of the control device 18.
- the movement position of the rod 52 a in the Xt direction is measured by a highly accurate linear encoder or the like, and the measured value is sent to the control device 18.
- the movable member 54 can rotate around a rotation shaft 54 a provided on the drive support member 62.
- the movable member 54 includes a first contact portion 54b that comes into contact with the roller 52b at the tip of the rod 52a, and a roller (second contact portion) 54c that comes into contact with an end surface portion parallel to the XtZt plane of the driven member 56.
- the tension spring 58 biases the first contact portion 54b in the + Xt direction so that the roller 52b at the tip of the rod 52a and the first contact portion 54b of the movable member 54 are always in contact with each other. Therefore, one end of the tension spring 58 is fixed to the drive support member 62, and the other end is fixed near the first contact portion 54 b of the movable member 54.
- the tension spring 60 is configured so that the roller (second contact portion) 54c rotatably supported by the movable member 54 and the end surface portion of the driven member 56 parallel to the XtZt plane are always in contact with each other. A biasing force is generated so as to draw the roller 54c toward the driven member 56 side. Therefore, one end of the tension spring 60 is fixed to the shaft portion of the roller 54 c of the movable member 54, and the other end is fixed to the driven member 56.
- the contact surface of the first contact portion 54b of the movable member 54 that contacts the roller 52b and the driven member 56 that contacts the roller 54c. Is set so as to be orthogonal to the contact surface of the end face portion in the XtYt plane.
- the center of gravity of the beam scanning device MD1 is set in the XtYt plane.
- the point is set so as to be substantially on the line segment Pmc.
- the rotating shaft 54a of the movable member 54 and the shaft of the roller 54c are also arranged on the line segment Pmc.
- the movable member 54 rotates around the rotation shaft 54a in the clockwise direction on the paper surface of FIG. 11, and the roller 54c of the movable member 54 moves in the + Yt direction.
- the driven member 56 moves in the + Yt direction while maintaining a contact state with the roller 54c by the urging force of the spring 60. Therefore, the closing support portion 46 side of the beam scanning device MD1 rotates in the + Yt direction side (also referred to as + ⁇ zt rotation) around the irradiation center axis Le1.
- the distance from the rotation shaft 54a of the movable member 54 to the first contact portion 54b is set longer than the distance from the rotation shaft 54a of the movable member 54 to the axis of the roller 54c.
- the amount of movement of the rod 52a in the Xt direction is reduced to the amount of movement of the driven member 56 in the Yt direction.
- the distance from the center line (irradiation center axis Le1) of the cylindrical column member BX1 which is the mechanical rotation center of the beam scanning device MD1, to the driven member 56 to which the rotational driving force is applied, can be increased.
- the rotation angle amount of the beam scanning device MD1 with respect to the unit movement amount of the rod 52a of the linear actuator 52 can be made sufficiently small, and the rotation angle setting of the beam scanning device MD1 can be controlled with high resolution ( ⁇ rad).
- each of the beam scanning devices MD1 to MD6 has a cylindrical support member BX1, an annular bearing 48, and an apparatus main body (second frame portion Ub2). Thus, it is rotatably supported coaxially with each of the irradiation center axes Le1 to Le6. Accordingly, each of the beam scanning devices MD1 to MD6 is held in the apparatus main body in the vicinity of immediately above each of the drawing lines SL1 to SL6 formed on the substrate FS, and the closing support portion 46 side of each of the beam scanning devices MD1 to MD6 is mechanical. Is not constrained by the device (state that is not firmly fastened to the apparatus main body, the main body frame UB, etc.).
- the drawing lines SL1 to SL6 may fluctuate in the direction along the outer peripheral surface of the rotary drum DR. It is suppressed. That is, the interval between the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6 shown in FIG. There is also an advantage that it can be maintained at a constant distance in the order of microns.
- the second frame portion Ub2 and the column member BX1 that support each of the beam scanning devices MD1 to MD6 are made of a low thermal expansion coefficient metal material (Invar or the like) or a glass ceramic material (trade name: Zerodur or the like). A thermally stable structure can be obtained.
- the circular columnar support member BX1 and the annular bearing 48 shown in FIG. 10 are the second frame in which the support frame 40 (that is, the entire beam scanning device MD) is the apparatus main body.
- the two upper and lower annular bearings 48 shown in FIG. 10 serve as support portions for the device main body (second frame portion Ub2) of the support frame 40 (that is, the entire beam scanning device MD).
- a predetermined radius here, the radius of the outer periphery of the annular bearing 48
- Le Le1 to Le6
- the annular bearing 48 may be omitted, the upper end portion of the cylindrical column member BX1 may be combined with the parallel support portion 42, and the lower end portion of the column member BX1 may be combined with the parallel support portion 44.
- the circular columnar column member BX1 having a predetermined radius from the irradiation center axis Le (Le1 to Le6) functions as a coupling member.
- FIG. 12 is a perspective view showing a state in which the column member BX1 and the drive support member 62 are attached to the second frame portion Ub2 shown in FIG. 4 (or FIG. 10, FIG. 11).
- the second frame portion Ub2 is a prismatic member extending in the Y direction.
- the side surface Ub2a in the ⁇ X direction and the side surface Ub2b in the + X direction are each an angle ⁇ ⁇ (see FIG. 4) with respect to the YZ plane. It is formed to tilt.
- it is formed so as to penetrate the upper and lower sides of the side surface Ub2a.
- the recessed portion Ubx is formed so as to penetrate the upper and lower sides of the side surface Ub2b.
- the vertical part 62a (refer FIG. 10, FIG. 11) integrated with the drive support member 62 side surface Ub2a, so that each of recessed part Ubx formed in side surface Ub2a, Ub2b of 2nd frame part Ub2 may be covered. It is fixed to Ub2b.
- the second frame portion Ub2 having such a structure is provided on the third frame portion Ub3 for installation on the main body frame (main body columns BFa and BFb) of the exposure apparatus EX that supports the rotary drum DR, the alignment microscopes ALG1 to ALG4, and the like. Combined.
- FIG. 13 is a perspective view showing a structure for attaching the third frame portion Ub3 shown in FIG. 12 to the main body columns BFa and BFb of the exposure apparatus EX.
- the second frame portion Ub2 is suspended from the first frame portion Ub1 of the main body frame UB, but here the second frame portion Ub2 is a part of the main body frame UB.
- the main body columns BFa and BFb that pivotally support the rotary drum DR are mounted.
- the third frame portion Ub3 has a prismatic horizontal portion extending in the Y direction that fixes the second frame portion Ub2 of the main body frame UB in FIG. 4 in the center and both ends in the Y direction in the Z direction.
- the leg portions on both sides of the third frame portion Ub3 are supported on the main body columns BFa and BFb (which are also coupled to the main body frame UB) of the exposure apparatus EX installed with a space in the Y direction.
- the main body columns BFa and BFb are not shown in FIG. 12, but the shafts Sft protruding from both ends in the Y direction of the rotary drum DR shown in FIG. -It is pivotally supported via a bearing at a position separated in the Z direction.
- the upper end surfaces of the main body columns BFa and BFb are formed to have a certain width (for example, 5 cm or more) in the Y direction.
- One leg portion of the third frame portion Ub3, here, the leg portion on the + Y direction side is fixed on the main body column BFa via the pedestal 500, but the third frame portion Ub3 formed longer in the Z direction.
- the leg portion on the + Y direction side may be directly fixed on the main body column BFa.
- a top member 501 having a V-shaped groove formed in a ridge line parallel to the Y axis is fixed to the lower end surface of the leg portion on the ⁇ Y direction side of the third frame portion Ub3, and the upper surface of the main body column BFb
- the steel ball 502 fitted into the V-shaped groove of the top member 501 is supported so as to be able to roll at that position.
- the top member 501 and the steel ball 502 have a degree of freedom of relative movement only in the Y direction along the V-shaped groove. Further, an urging force that the V-shaped groove of the top member 501 always abuts against the steel ball 502 between the protruding portion Ub4 on the side surface of the leg portion on the ⁇ Y direction side of the third frame portion Ub3 and the main body column BFb.
- a tension spring 503 is provided to urge the third frame portion Ub3 (and the second frame portion Ub2) in the ⁇ Z direction.
- the entire exposure head 16 composed of the six beam scanning devices MD1 to MD6 is located near the center plane Poc in the X direction. Therefore, stress in the direction inclined in the X direction is unlikely to be generated in the legs of the third frame portion Ub3 that supports the load of the entire exposure head 16, and deformation of the third frame portion Ub3 and the second frame portion Ub2 is suppressed. Therefore, the entire exposure head 16 can be stably held at a predetermined position.
- the upper end portions of the main body columns BFa and BFb are arranged in the Y direction. It is conceivable that the distance fluctuates within a range of several microns due to changes in environmental temperature and the influence of heat generating components (motor, AOM, electric substrate, etc.) Or, according to the rotational cycle of the rotating drum DR, depending on the slight eccentricity of the shaft Sft of the rotating drum DR, the shaft blur of the motor or the speed reducer connected to the shaft Sft, the mounting condition of the bearing supporting the shaft Sft, etc.
- stress in the Y direction is generated in the main body columns BFa and BFb, and the interval in the Y direction of the main body columns BFa and BFb varies within a range of about several microns.
- the third frame portion Ub3 and the second frame portion are composed of the top member 501 and the steel ball 502 having a degree of freedom in the Y direction as shown in FIG. Since Ub2 is supported, the possibility of deforming the third frame portion Ub3 and the second frame portion Ub2 is avoided even if such a change occurs.
- the beam scanning devices MD1 to MD6 use the photodetector DT1 shown in FIG. 7 and the reference pattern formed on the surface of the rotary drum DR, respectively, to tilt the drawing lines SL1 to SL6. (Slope error) can be measured by itself. Therefore, the control device 18 can drive the linear actuator 52 of each beam scanning device MD (MD1 to MD6) based on the measured inclination angle of each drawing line SLn (SL1 to SL6). Accordingly, the drawing lines SLn (SL1 to SL6) can be made relatively parallel, or the drawing lines SLn (SL1 to SL6) can be made parallel to the central axis AXo of the rotary drum DR.
- control device 18 distorts the substrate FS wound around the rotary drum DR based on the position of the alignment mark MK (MK1 to MK4) on the substrate FS detected using the alignment microscope ALG (ALG1 to ALG4).
- the distortion of the exposure area W may be detected, and the linear actuator 52 of each beam scanning device MD (MD1 to MD4) may be driven accordingly. Thereby, the overlay accuracy of the pattern formed in the lower layer and the predetermined pattern to be newly exposed is improved.
- FIG. 14 is a view showing a state of distortion in the exposure region W where a predetermined pattern is exposed by the exposure head 16.
- the distortion of the exposure area W is caused by the distortion of the substrate FS that is wound around the rotary drum DR and conveyed. Even if the substrate FS is not distorted, the exposure region W itself of the substrate FS may be distorted when the substrate FS is distorted and transported when the lower pattern layer is formed.
- the control device 18 estimates the distortion of the exposure region W based on the position of the alignment mark MK (MK1 to MK4) on the substrate FS detected using the alignment microscope ALG (ALG1 to ALG4), and the distortion of the exposure region W.
- the linear actuator 52 of each beam scanning device MD (MD1 to MD6) is driven in accordance with the state.
- the position of MK3 can be detected, but the positions of alignment marks MK2 and MK3 located upstream of the observation regions Vw1 to Vw4 ( ⁇ X direction side) are sent to the substrate FS and drawing exposure proceeds. You can only do it. Therefore, the control device 18, for example, from the distortion amount and the distortion tendency obtained from the detection results of the respective positions of the alignment marks MK1 to MK4 attached around the exposure area W one before in the longitudinal direction of the substrate FS.
- the distortion of the exposure area W where the current pattern is exposed may be estimated.
- the beam scanning device MD is set with high accuracy around the irradiation center axis Le passing through the midpoint (specific point) of the drawing line SLn perpendicularly to the irradiated surface of the substrate FS. Since it can be rotated, the inclination of the drawing line SLn can be adjusted easily and precisely. In this way, the drawing line SLn rotates on the irradiated surface of the substrate FS around the midpoint of the drawing line SLn, and therefore, the X (Xt) direction and Y (Yt) direction of the drawing line SLn. The inclination of the drawing line SLn can be easily adjusted while minimizing the position variation.
- the drawing line SLn when the drawing line SLn is rotated with a position away from the drawing line SLn as a center point, the position of the drawing line SLn is greatly moved so as to draw an arc around the center point. Then, it is possible to minimize each position variation at both ends (scanning start point and scanning end point) of the drawing line SLn. That is, the position fluctuations at both ends due to the inclination adjustment of the drawing line SLn are symmetric with respect to the midpoint of the drawing line SLn.
- the irradiation center axis Le may be an axis passing through an arbitrary point (specific point) on the drawing line SLn perpendicularly to the irradiated surface of the substrate FS.
- the drawing line SLn rotates around an arbitrary point on the drawing line SLn, but the position of the drawing line SLn is compared with the case where the center point is set at a position away from the drawing line SLn. Variation (lateral shift) can be reduced.
- the beam scanning device MD since the beam LB is incident on the reflection mirror M10 of the beam scanning device MD so as to be substantially coaxial with the irradiation center axis Le passing vertically through the midpoint of the drawing line SLn, the beam scanning device MD Even when it is rotated by ⁇ zt around the irradiation center axis Le, the position of the beam LB incident on the reflection mirror M10 does not change. Therefore, even when the beam scanning device MD is rotated by ⁇ zt, the optical path of the beam LB passing through the beam scanning device MD does not change, and the beam LB passes correctly through the beam scanning device MD as specified.
- the spot light SP is not projected onto the surface to be irradiated on the substrate FS due to the beam LB1 being shifted or the like, or is spotted at a position deviated from the drawing line SLn after tilt adjustment. There is no problem that the light SP is projected.
- Optical components are supported by the support frame 40 of the beam scanning device MD.
- the frame portion Ub2 is supported so as to be rotatable. Since the linear actuator 52 supported by the second frame portion Ub2 can be electrically controlled, the drawing line is determined according to the detected position of the alignment mark MK and the measured inclination of the drawing line SLn. The inclination of SLn can be automatically adjusted automatically.
- the rotation center of the drawing line SLn (SL1 to SL6) is set to the midpoint of the drawing line SLn. As long as it is on the drawing line SLn, it may be shifted from the middle point.
- the reflection mirror M10, the beam expander BE, the reflection mirror M11, and the circular columnar support member BX1 (which are arranged along the optical axis AXa) And the annular bearing 48) may be translated from the position of FIG. 7 (FIG. 11) in the + Yt direction.
- FIG. 15 is a diagram showing an optical configuration of the beam scanning device MD in Modification 1.
- the same components as those in FIG. 7 are denoted by the same reference numerals, and the description thereof is omitted. Since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.
- the beam scanning device MD1 includes a reflection mirror M10, a beam expander BE, a reflection mirror M20, a beam splitter BS2, a reflection mirror M21, a polarization beam splitter BS3, a ⁇ / 4 wavelength plate QW, reflection mirrors M22 to M24, a cylindrical lens CYa, and a polygon mirror.
- the image shift optical member SR and the deflection adjustment optical member DP are omitted.
- the beam LB1 incident on the beam scanning device MD1 travels in the ⁇ Zt direction and enters the reflection mirror M10.
- the beam LB1 incident on the beam scanning device MD1 is incident on the reflection mirror M10 so as to be coaxial with the irradiation center axis Le1.
- the reflection mirror M10 functioning as an incident optical member reflects the incident beam LB1 toward the reflection mirror M20 in the ⁇ Xt direction.
- the beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE and enters the reflection mirror M20.
- the reflection mirror M20 reflects the incident beam LB1 toward the reflection mirror M21 in the ⁇ Zt direction.
- the beam LB1 reflected by the reflection mirror M20 enters the beam splitter BS2.
- the beam splitter BS2 transmits a part of the incident beam LB1 toward the reflection mirror M21 and reflects the remaining part of the incident beam LB1 toward the position detector DT2.
- the beam splitter BS2 transmits more light than the reflected beam LB1 toward the reflecting mirror M21. For example, the ratio between the transmitted light amount and the reflected light amount is 9: 1.
- the reflection mirror M21 reflects the incident beam LB1 toward the reflection mirror M22 in the + Xt direction.
- the beam LB1 reflected by the reflection mirror M21 is transmitted through the polarization beam splitter BS3 and the ⁇ / 4 wavelength plate QW and enters the reflection mirror M22.
- the polarization beam splitter BS3 transmits the P-polarized beam and reflects the S-polarized beam LB1. Since the beam LB1 incident on the beam scanning device MD1 is a P-polarized beam, the polarization beam splitter BS3 transmits the beam LB1 from the reflection mirror M21 toward the reflection mirror M22.
- the beam LB1 whose optical path is bent by the reflection mirrors M22 to M24 passes through the cylindrical lens CYa and enters the polygon mirror PM.
- the generatrix of the cylindrical lens CYa is set parallel to the XtYt plane, and the beam LB1 is condensed in a slit shape in a direction parallel to the XtYt plane on the reflection surface RP of the polygon mirror PM having a rotation axis parallel to the Zt axis. Is done.
- the polygon mirror PM deflects the incident beam LB1 and reflects it toward the + ⁇ t direction toward the f ⁇ lens FT.
- the polygon mirror PM is rotated at a constant speed by a polygon drive unit (motor) RM.
- the f ⁇ lens FT having the optical axis AXf extending in the Xt-axis direction passes through the reflecting mirror M15 and the cylindrical lens CYb, and the spot light SP of the beam LB1 at the image height position on the irradiated surface of the substrate FS proportional to the incident angle.
- the reflection mirror M15 reflects the incident beam LB1 in the ⁇ Zt direction toward the substrate FS via the cylindrical lens CYb.
- the beam LB1 projected on the substrate FS is a minute spot light having a diameter of about several ⁇ m (for example, 3 ⁇ m) on the irradiated surface of the substrate FS.
- the f ⁇ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS.
- At least the reflecting members (reflecting mirrors M15, M20 to M24) function as an optical path deflecting member that bends the optical path of the beam LB1 from the reflecting mirror M10 to the substrate FS.
- the incident axis of the beam LB1 incident on the reflecting mirror M10 and the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in the Zt direction can be made substantially coaxial.
- Reflected light from the rotating drum DR passes through the cylindrical lens CYb, the reflecting mirror M15, the f ⁇ lens FT, the polygon mirror PM, the cylindrical lens CYa, the reflecting mirrors M24 to M22, and the ⁇ / 4 wavelength plate QW. Then, the light enters the polarizing beam splitter BS3.
- the beam LB1 irradiated on the substrate FS by the ⁇ / 4 wavelength plate QW provided between the polarizing beam splitter BS3 and the substrate FS, specifically, between the polarizing beam splitter BS3 and the reflecting mirror M22.
- the position detector DT2 detects the center position of the incident beam LB1, and for example, a quadrant sensor is used.
- This four-divided sensor has four photodiodes (photoelectric conversion elements), and is orthogonal to the traveling direction of the beam LB1 using the difference in the amount of light received by each of the four photodiodes (signal level difference).
- the center position of the beam LB1 is detected on the XtZt plane. Thereby, it can be determined whether or not the beam LB1 is displaced from a desired position.
- the image shift optical member SR and the deflection adjustment optical member DP described in the above embodiment may be provided between the reflection mirror M10 and the beam splitter BS2. Thereby, the control apparatus 18 can adjust the center position and inclination of beam LB1 based on the detection result of position detector DT2.
- FIG. 16 is a diagram showing an optical configuration of the beam scanning device MD in Modification 2.
- FIG. 16 only the portions different from those in FIG. 7 or FIG. 15 are shown, and the optical system closer to the reflection mirror M10 than the polygon mirror PM is not shown.
- the same components as those in FIG. 7 or 15 are denoted by the same reference numerals, and the description thereof is omitted. Since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.
- the beam scanning device MD1 includes an image rotation optical system IR that rotates the drawing line SL1 about the irradiation center axis Le1 (centering on the middle point of the drawing line SL1).
- the image rotation optical system IR rotates the drawing line SL1 by rotating around the irradiation center axis Le1.
- the image rotation optical system IR is provided between the cylindrical lens CYb and the irradiated surface of the substrate FS.
- an image rotator can be used as the image rotation optical system IR.
- the image rotation optical system IR is provided so that the incident axis of the beam LB1 passing through the midpoint of the scanning locus of the beam LB1 incident on the image rotation optical system IR from the cylindrical lens CYb is substantially coaxial with the irradiation center axis Le1. . Thereby, the image rotation optical system IR can rotate the drawing line SL1 about the irradiation center axis Le1.
- the image rotation optical system IR is rotated around the irradiation center axis Le1 by an actuator (drive unit) (not shown) controlled by the control device 18.
- the image rotation optical system IR can be rotatably supported by a part of the parallel support portion 44 of the support frame 40 shown in FIG. Therefore, even if the support frame 40 (beam scanning device MD1) does not have a structure that can rotate around the irradiation center axis Le1, the image rotation optical system IR is rotated around the irradiation center axis Le1, thereby drawing lines. The inclination of SL1 can be adjusted. Further, the support frame 40 (beam scanning device MD1) is configured to be rotatable around the irradiation center axis Le1, and the image rotation optical system IR is also independent of the support frame 40 (beam scanning device MD1). You may make it rotate (theta) zt around the axis
- the image rotation optical system IR can be independently rotated around the irradiation center axis Le1, so that, for example, drawing is performed by the image rotation optical system IR.
- fine adjustment of the inclination of the drawing line SL1 can be performed by rotating the entire beam scanning device MD1. Therefore, it is possible to improve the accuracy of adjusting the inclination of the drawing line SL1.
- the irradiation center axis Le1 is an axis passing through an arbitrary point on the drawing line SL1 perpendicularly to the irradiated surface of the substrate FS, the irradiation center axis Le1 is imaged from the cylindrical lens CYb correspondingly. You may make it pass the arbitrary points of the scanning locus
- Modification 3 In Modification 2, the beam scanning device MD (MD1 to MD6) is rotated about the irradiation center axis Le (Le1 to Le6), but the beam scanning device MD (MD1 to MD6) is used. It is not necessary to rotate around the irradiation center axis Le (Le1 to Le6). In this case, the second frame unit Ub2 may hold the support frame 40 of the beam scanning device MD (MD1 to MD6) fixed in a non-rotatable state. Even if the beam scanning device MD (MD1 to MD6) does not rotate around the irradiation center axis Le (Le1 to Le6), the drawing line SLn (SL1 to SL6) is generated by the image rotation optical system IR shown in FIG. This is because it can be rotated around the irradiation center axis Le (Le1 to Le6).
- FIGS. 17A and 17B are diagrams showing an optical configuration of the beam scanning device MD in Modification 4.
- FIG. 17A and 17B the same components as those in FIG. 7 are denoted by the same reference numerals, and the description thereof is omitted. Since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.
- FIG. 17A shows the beam scanning device MD1 of Modification 4 in a plane parallel to the XtZt plane
- FIG. 17B shows the beam scanning device MD1 of Modification 4 in a plane parallel to the YtZt plane. It is what I saw.
- the beam scanning device MD1 includes a cylindrical lens CYa, a reflecting member RF, an f ⁇ lens FT, a polygon mirror PM, and a cylindrical lens CYb.
- the beam LB1 incident on the beam scanning device MD1 in the ⁇ Zt direction is set to be coaxial with the irradiation center axis Le1 passing through the midpoint of the drawing line SL1 in parallel with the Zt axis.
- a lens system GLa is provided in front of the beam scanning device MD1 in the optical path of the beam LB1, and the beam LB1 is condensed into spot light on a surface Cjp optically conjugate with the surface of the substrate FS.
- the beam LB1 collected on the conjugate plane Cjp is incident on the cylindrical lens CYa along the irradiation center axis Le1 while diverging isotropically.
- the cylindrical lens CYa is set so that the generatrix is parallel to the Yt axis so as to have refractive power in the Xt direction. Further, the beam LB1 immediately after passing through the cylindrical lens CYa is converged to a substantially parallel light beam in the Xt direction, and proceeds in the ⁇ Zt direction while being diverged in the Yt direction.
- the reflection surface Rf1 on the upper side of the reflection member RF (an inclination of 45 ° with respect to the XtYt plane) is such that the beam LB1 incident through the cylindrical lens CYa enters the optical axis AXf in the visual field region above the optical axis AXf of the f ⁇ lens FT.
- the beam LB1 is reflected in the ⁇ X direction so as to be incident in parallel with the beam.
- the beam LB1 transmitted through the visual field region on the upper side (+ Zt direction side) of the f ⁇ lens FT is incident on the reflection surface RP (parallel to the Zt axis) of the polygon mirror PM.
- the reflection surface RP of the polygon mirror PM is installed at the same height position as the optical axis AXf in the Zt direction, and is set at the position of the pupil plane epf of the f ⁇ lens FT or a position near it. Therefore, the rotation axis AXp of the polygon mirror PM and the optical axis AXf of the f ⁇ lens FT are set to be orthogonal to each other in a plane parallel to the XtZt plane.
- the cylindrical lens CYa and the f ⁇ lens FT the beam LB1 incident on the polygon mirror PM is converged on the reflection surface RP in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM and reflected. It is projected as a slit-like distribution extending in a direction parallel to the Yt axis on the surface RP.
- the polygon mirror PM Since the reflecting surface RP of the polygon mirror PM is parallel to the Zt axis (perpendicular to the optical axis AXf in the XtZt plane), the polygon mirror passes through the visual field region above (+ Zt direction side) the optical axis AXf of the f ⁇ lens FT.
- the beam LB1 that reaches the reflection surface RP of PM and is reflected to the + Xt direction side passes through the visual field region below ( ⁇ Zt direction side) the optical axis AXf of the f ⁇ lens FT, and below the reflecting member RF.
- Toward the reflecting surface Rf2 (inclined by 45 ° with respect to the XtYt plane).
- the optical path of the beam LB1 incident on the polygon mirror PM and the optical path of the beam LB reflected by the polygon mirror PM are symmetric with respect to the optical axis AXf in the XtZt plane.
- the beam LB1 reflected by the lower reflecting surface Rf2 of the reflecting member RF and traveling in the ⁇ Zt direction is spotted on the substrate FS through the cylindrical lens CYb whose generating line is parallel to the Yt direction and has refractive power in the Xt direction. It is converged to become light SP.
- the optical path of the beam LB1 from the conjugate plane Cjp to the substrate FS (irradiation surface) is the reflection plane RP (pupil plane epf) of the polygon mirror PM. Therefore, the spot light SP projected on the substrate FS is formed as an image of the spot light of the beam LB1 collected on the conjugate plane Cjp.
- the beam LB1 incident on the reflecting surface RP of the polygon mirror PM from the f ⁇ lens FT and the beam LB1 are The beam LB1 reflected by the reflection surface RP and incident on the f ⁇ lens FT passes through the same optical path in the XtYt plane.
- the beam LB1 irradiated to the lower reflecting surface Rf2 of the reflecting member RF is the central portion in the Yt direction of the reflecting surface Rf2, and the spot light SP of the beam LB1 projected onto the substrate FS is the drawing line SL1. It is located at the upper middle point (the point through which the irradiation center axis Le1 passes).
- the reflection surface RP of the polygon mirror PM When the reflection surface RP of the polygon mirror PM is slightly tilted from the state perpendicular to the optical axis AXf in the XtYt plane due to the rotation about the rotation axis AXp of the polygon mirror PM, it is reflected by the reflection surface RP of the polygon mirror PM.
- the beam LB1 that passes through the f ⁇ lens FT and reaches the lower reflection surface Rf2 of the reflection member RF is shifted in the Yt direction on the reflection surface Rf2 in accordance with the rotation of the polygon mirror PM.
- the spot light SP can be one-dimensionally scanned along the drawing line SL1.
- the upper reflecting surface Rf1 and the lower reflecting surface Rf2 of the reflecting member RF are elongated in the Yt direction so as to cover the scanning range of the beam LB1 along the drawing line SL1.
- the plane mirror forming the upper reflection surface Rf1 has a Yt-direction dimension of the beam LB1 incident from the lens system GLa. It may be made small enough to cover the diameter.
- the cylindrical lens CYa functions as an incident optical member that causes the beam LB1 to enter the beam scanning device MD1.
- the f ⁇ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS.
- At least the reflecting surface Rf1 and the reflecting surface Rf2 of the reflecting member RF function as an optical path deflecting member that bends the optical path of the beam LB1 from the cylindrical lens CYa to the substrate FS.
- the optical components (cylindrical lenses CYa and CYb, reflecting member RF, polygon mirror PM, f ⁇ lens FT, etc.) of the beam scanning device MD1 shown in FIGS. 17A and 17B are supported by the support shown in FIGS. Similar to the frame 40, the frame is supported by a support frame that can rotate around the irradiation center axis Le1. Also in the configuration of the modification example 4, even if the beam scanning device MD1 rotates ⁇ zt around the irradiation center axis Le1, the position of the beam LB incident on the cylindrical lens CYa does not change.
- the optical path of the beam LB passing through the beam scanning device MD1 does not change, and the beam LB passes through the beam scanning device MD1 correctly as specified.
- the spot light SP is not projected onto the surface (irradiated surface) of the substrate FS due to the beam LB1 being displaced or the like, or deviated from the drawing line SLn after the tilt adjustment. There is no problem that the spot light SP is projected to the position.
- FIGS. 18A and 18B are diagrams showing an optical configuration of a beam scanning device MD in Modification 5.
- FIG. 18A and 18B the same reference numerals are given to the same components as those in FIGS. 17A and 17B, and the description thereof is omitted. Since each beam scanning device MD (MD1 to MD6) has the same configuration, only the beam scanning device MD1 will be described, and the description of the other beam scanning devices MD will be omitted.
- 18A shows the beam scanning device MD1 of Modification 5 in a plane parallel to the XtYt plane
- FIG. 18B shows the beam scanning device MD1 of Modification 5 in a plane parallel to the YtZt plane. It is what I saw.
- the beam scanning apparatus MD1 according to the modification 5 translates the irradiation center axis Le1 from the position of the midpoint of the drawing line SL1 in the + Yt direction with respect to the beam scanning apparatus MD1 according to the modification 4 illustrated in FIGS. 17A and 17B.
- the point is different.
- the lens system GLa for condensing the beam LB1 before entering the beam scanning device MD1 on the conjugate plane Cjp and the cylindrical lens CYa are integrally translated in the + Yt direction.
- the beam LB1 is reflected by the reflection surface RP of the polygon mirror PM and irradiated to the lower reflection surface Rf2 through the f ⁇ lens FT. Are scanned in the -Yt direction.
- the extension line of the irradiation center axis Le1 is on the drawing line SL1.
- the beam scanning device MD1 is set to pass through an arbitrary point (specific point), the beam scanning device MD1 is rotated by ⁇ zt around the irradiation center axis Le1, and the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) is irradiated with the irradiation center axis Le1.
- the spot light SP can be accurately scanned along the drawing line SL1 even if the beam scanning device MD1 is rotated by ⁇ zt.
- the position of the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane is a position along the drawing line SL1. Any position in the Yt direction may be used. Therefore, if the dimension of the cylindrical lens CYa in the generatrix direction is extended, the position of the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane can be freely changed, and the setting of the light guide path of the beam LB1. There is an advantage that the degree of freedom increases.
- the position of the beam LB1 incident on the beam scanning device MD1 (cylindrical lens CYa) in the XtYz plane can be freely set in the Yt direction, the mechanical rotation center axis (irradiation center axis) of the beam scanning device MD1.
- the coaxiality between Le1) and the axis of the incident beam LB1 can be matched with high accuracy in the Yt direction.
- FIGS. 19 and 20 are diagrams showing an optical configuration of a beam scanning device MD in Modification 6.
- the direction parallel to the optical axis AXf of the f ⁇ lens FT is the Xt direction
- the direction parallel to the optical axis AXf of the f ⁇ lens FT is also the Xt direction in FIGS.
- the SP scanning direction will be described as Yt (Y) direction, and the Xt direction and the direction perpendicular to the Yt direction will be described as Zt direction.
- FIG. 19 shows the beam scanning device MD1 of Modification 6 viewed in a plane parallel to the XtYt plane.
- the axis of the beam LB1 incident on the beam scanning device MD1 (irradiation center axis Le1). Is set to be coaxial with the optical axis AXf of the f ⁇ lens FT. That is, in this modification, a scanning beam that is emitted from the f ⁇ lens FT and passes through the cylindrical lens CYb is directly projected onto the substrate FS without providing a mirror (reflecting surface) that bends the beam LB1 after the f ⁇ lens FT.
- a beam LB1 emitted from the light source device 14 and intensity-modulated (on / off) by the drawing optical element AOM1 is a cylindrical lens CYa via a lens system G30, mirrors M30 and M31, and a lens system G31. Led to.
- the beam LB1 incident on the beam scanning device MD1 is set so as to be coaxial with the irradiation center axis Le1.
- the beam LB1 incident on the cylindrical lens CYa is shaped into a parallel light beam having a predetermined cross-sectional diameter.
- the beam LB1 reflected from the cylindrical lens CYa by the reflection mirror M14 and reaching the reflection surface RP of the polygon mirror PM remains a parallel light beam in the XtYt plane, and becomes a light beam converged by the cylindrical lens CYa in the Zt direction.
- the beam LB1 reflected (polarized) by the polygon mirror PM passes through the f ⁇ lens FT and the cylindrical lens CYb and is condensed as the spot light SP on the surface (irradiated surface) of the substrate FS.
- the optical axis AXf of the f ⁇ lens FT and the irradiation center axis Le1 are set so as to coincide with each other and be parallel to the Xt axis, and their extension lines are the center axis (rotation center axis) AXo of the rotary drum DR. Orthogonal to
- the main body frame 300 that supports the beam scanning device MD1 of Modification 6 has an opening 300A through which the beam LB1 scanned along the drawing line SL1 passes, and the beam scanning device MD1 has an optical axis AXf (irradiation). It is rotatably supported by the main body frame 300 via an annular bearing 301 whose radius from the central axis Le1) includes the opening 300A. Since the center line of the annular bearing 301 is set to be coaxial with the optical axis AXf (irradiation center axis Le1), the beam scanning device MD1 is centered on the optical axis AXf (irradiation center axis Le1) and around the Xt axis. Rotate. This rotation is referred to as ⁇ xt rotation.
- FIG. 20 shows a state in which a plurality of beam scanning devices MD of Modification 6 shown in FIG. 19 are arranged in a plane parallel to the XZ plane.
- the body frame 300 has an odd-numbered beam scanning device MD1.
- MD3, MD5 are provided with openings 300A through which scanning beams pass from each of the MD3, MD5 at regular intervals in the Y direction, and openings through which even-numbered beam scanning devices MD2, MD4, MD6 pass.
- 300B is provided at a certain interval in the Y direction.
- the substrate FS wound around the rotary drum DR is transported horizontally in the ⁇ X direction and wound about a half turn from the upper part of the rotary drum DR, and then the lower part of the rotary drum DR. It leaves and is transported in the + X direction. Therefore, here, the central plane Poc including the central axis AXo of the rotary drum DR is parallel to the XY plane.
- the mechanical rotation centers of the beam scanning devices MD by the annular bearing 301 are set to the irradiation center axes Le1 to Le6, and the beams LB1 to LB incident on the beam scanning devices MD are set. Since LB6 is guided so as to be coaxial with the respective irradiation center axes Le1 to Le6, each beam scanning device MD is rotated around each of the irradiation center axes Le1 to Le6, as in the previous embodiments and modifications. Is rotated by ⁇ xt, the posture positions of the beams LB1 to LB6 incident on the lens system G30 do not change.
- the lens system G30 functions as an incident optical member that causes the beam LB (LB1 to LB6) to enter the beam scanning device MD (MD1 to MD6).
- the f ⁇ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS.
- the reflecting members (reflecting mirrors M14, M30, M31) function as an optical path deflecting member that bends the optical path of the beam LB (LB1 to LB6) from the lens system G30 to the substrate FS.
- FIG. 21 shows, as an example, a state in which the drawing line SL1 of the beam scanning device MD1 parallel to the Yt axis in the initial state is rotated counterclockwise by an angle ⁇ ss in the XtYt plane (irradiated surface).
- the maximum value of the actually rotatable angle ⁇ ss is as small as about ⁇ 2 °.
- the middle point of the drawing line SL1 before adjustment is CC
- the irradiation center axis Le1 extending in the Zt direction is set to pass through the middle point CC
- the drawing line SL1 is a beam scan that coincides with the irradiation center axis Le1. It is assumed that ⁇ zt is rotated (tilted) about the mechanical rotation center axis of the device MD1.
- the drawing line SL1a When the drawing line SL1 is rotated by an angle ⁇ ss from the initial state, the drawing line SL1a is inclined with respect to the Yt axis.
- the drawing start point STa of the adjusted drawing line SL1a is displaced by ( ⁇ XSa, ⁇ YSa) from the initial drawing start point ST, and the drawing end point SEa of the adjusted drawing line SL1a is from the initial drawing end point SE.
- the position is shifted by ( ⁇ XEa, ⁇ YEa). This misalignment becomes a joint error with the pattern drawn on the drawing line SL2 of the adjacent beam scanning device MD2.
- the drawing line SL2 of the adjacent beam scanning device MD2 is positioned on the + Yt direction side with respect to the drawing line SL1a and it is necessary to perform continuous exposure at the initial drawing start point ST, the drawing of the adjusted drawing line SL1a is performed. It is necessary to slightly shift the starting point STa in the direction of the arrow Ar.
- the shift as indicated by the arrow Ar can be realized by slightly advancing the timing of writing the drawing data after the time Tpx from the generation of the origin signal SH described in FIG.
- the shift amount ⁇ Ar when the angle ⁇ ss is ⁇ 0.5 ° is about 0.95 ⁇ m
- the shift amount ⁇ Ar when the angle ⁇ ss is ⁇ 1.0 °. Is about 3.8 ⁇ m
- the shift amount ⁇ Ar when the angle ⁇ ss is ⁇ 2.0 ° is about 15.2 ⁇ m
- the writing data can be started.
- the drawing line SL2 of the adjacent beam scanning device MD2 is located on the ⁇ Yt direction side with respect to the drawing line SL1a and it is necessary to perform continuous exposure at the initial drawing end point SE, the adjusted drawing line SL1a It is necessary to slightly shift the drawing end point SEa in the direction of the arrow Af.
- the drawing start point STa of the drawing line SL1a after being adjusted by the angle ⁇ ss is displaced by ⁇ XSa in the ⁇ Xt direction with respect to the initial drawing start point ST
- the drawing end point SEa is the initial drawing end point SE. Is shifted by ⁇ XEa in the + Xt direction.
- Such positional deviation errors ⁇ XSa and ⁇ XEa in the Xt direction (sub-scanning direction) are offset of the error ⁇ XSa or ⁇ XEa with respect to the measurement value (counter output value) of the encoder EC that measures the rotation angle position of the rotary drum DR. Correction can be made by starting drawing of each drawing line SLn in response to the value obtained by adding.
- the measurement resolution of the rotational angle position of the rotating drum DR by the encoder EC (and the scale part SD) is the size of the spot light SP. It is set to 1/2 or less of ⁇ , preferably 1/10 or less.
- FIG. 22 the mechanical rotation center axis (first rotation center axis) Mrp of the beam scanning device MD1 and the midpoint CC (irradiation center axis Le1) of the drawing line SL1 correspond to the state as shown in FIG.
- FIG. 6 is an exaggerated view showing a state where a relative displacement error ⁇ A ( ⁇ Ax, ⁇ Ay) is present.
- the incident axis of the beam LB1 incident on the beam scanning device MD1 is coaxial with the rotation center axis Mrp.
- the description of the symbols and symbols described in FIG. 21 is omitted. As shown in FIG.
- the drawing line SL1 that is parallel to the Yt axis in the initial state before adjustment has an angle around the rotation center axis Mrp shifted by an error ( ⁇ Ax, ⁇ Ay) from the position of the midpoint CC (Le1).
- the drawing line SL1b is inclined by ⁇ ss.
- the drawing line SL1b is obtained by translating the drawing line SL1a shown in FIG. 21 in the XtYt plane under the influence of errors ( ⁇ Ax, ⁇ Ay). Accordingly, the drawing start point STb of the adjusted drawing line SL1b is deviated from the drawing start point STa in the state of FIG. 21 by the error ⁇ Xcc in the ⁇ Xt direction and the error ⁇ Ycc in the + Yt direction.
- the drawing end point SEb of the adjusted drawing line SL1b is shifted from the drawing end point SEa in the state of FIG. 21 by the error ⁇ Xcc in the ⁇ Xt direction and the error ⁇ Ycc in the + Yt direction, and the adjusted drawing line SL1b.
- the midpoint CC ′ (Le1 ′) also deviates from the midpoint CC (Le1) of the drawing line SL1 in the state of FIG. 21 by an error ⁇ Xcc in the ⁇ Xt direction and an error ⁇ Ycc in the + Yt direction.
- the drawing start point STb of the adjusted drawing line SL1b is displaced by ( ⁇ XSa + ⁇ Xcc) in the Xt direction and ( ⁇ YSa ⁇ Ycc) in the Yt direction with respect to the initial drawing start point ST.
- the drawing end point SEb of SL1b is displaced from the initial drawing end point SE by ( ⁇ XEa ⁇ Xcc) in the Xt direction and ( ⁇ YEa + ⁇ Ycc) in the Yt direction.
- the incident axis of the beam LB1 and the rotation center axis Mrp coincide with each other, and the rotation center axis Mrp and the midpoint CC (Le1) of the drawing line SL1 have an error ( ⁇ Ax,
- the shift amounts ⁇ Ar and ⁇ Af of the drawing line SL1b are calculated, and the time Tpx described in FIG. 9 is shortened by the corresponding time ⁇ Tpx.
- the pattern data (drawing data) writing timing may be corrected by increasing or decreasing the length.
- the length LBL (eg, 50 mm) from the drawing start point STb to the drawing end point SEb of the adjusted drawing line SL1b needs to be within the maximum scanning length (eg, 51 mm) of the spot light SP.
- an error ( ⁇ XSa + ⁇ Xcc) or ( ⁇ XEa ⁇ Xcc) offset from the measurement value (counter output value) of the encoder EC that measures the rotation angle position of the rotary drum DR. Correction can be made by starting drawing of each drawing line SLn in response to the added value. 21 and 22, an example in which the irradiation center axis Le1 passes through the midpoint CC of the drawing line SLn has been described as an example.
- the irradiation center axis Le1 is on the drawing line SLn. It may pass through any point. Even in this case, the calculation principle of the shift amounts ⁇ Ar and ⁇ Af of the drawing line SLn is the same.
- the mechanical rotation center axis Mrp and the irradiation center axis Le1 of the beam scanning device MD1 are preferably coaxial within a predetermined allowable range ⁇ Q ( ⁇ Bx, ⁇ By) in the XtYt plane.
- the allowable range ⁇ Q is, for example, the actual position (actual position) of the drawing start point STb (or the drawing end point SEb) of the adjusted drawing line SL1b when the beam scanning device MD1 is mechanically tilted by a predetermined angle ⁇ sm.
- the predetermined angle ⁇ sm can be set to an upper limit angle (for example, ⁇ 2 °) at which the beam scanning device MD1 can be mechanically rotated.
- each light introducing optical system BDU shown in FIG. 7 At least one of the image shift optical member SR and the deflection adjustment optical member DP as shown in FIG. 7 may be provided between the reflection mirrors M1 to M5 of (BDU1 to BDU6).
- the center axis of the support member BX1 is set to be coaxial with the rotation center axis Mrp or coaxial with the rotation center axis Mrp and the irradiation center axis Le within a predetermined allowable range ⁇ Q.
- the beam LB is incident on the beam scanning device MD so that the incident axis of the beam LB incident on the beam scanning device MD coincides with the rotation center axis Mrp
- the incidence of the beam LB incident on the beam scanning device MD is performed.
- the axis and the rotation center axis Mrp may be coaxial within a predetermined allowable range ⁇ Q.
- the incident axis of the beam LB incident on the beam scanning device MD may coincide with the irradiation center axis Le and be coaxial with the rotation center axis Mrp within a predetermined allowable range ⁇ Q.
- the mechanical rotation center axis (second rotation center axis) of the image rotation optical system IR is within the predetermined allowable range ⁇ Q with respect to the irradiation center axis Le. It only needs to be coaxial.
- the incident axis of the beam LB passing through the midpoint of the scanning locus of the beam LB incident on the image rotation optical system IR from the f ⁇ lens FT and the mechanical rotation center axis of the image rotation optical system IR are within a predetermined allowable range ⁇ Q. Is set to be coaxial.
- the light source device 14 is not mounted on the beam scanning device MD that is rotatable with respect to the exposure apparatus body, but a conventional device (Japanese Patent Laid-Open No. 08-011348).
- a small solid light source such as a semiconductor laser diode or LED is provided in the beam scanning device MD (for example, the support frame 40), and the solid light source is controlled to emit pulses based on drawing data. May be. In that case, the drawing optical element AOM shown in FIGS. 5 and 6 is not necessary.
- intensity modulation (on / off) of the spot light SP based on the drawing data is provided, for example, in the light introducing optical system BDU (BDU1 to BDU6) in FIG.
- the light source device 14 is a fiber amplifier laser light source
- the seed light (pulse light) in the infrared wavelength region before entering the fiber amplifier is used in the drawing optical element AOM (AOM1 to AOM6).
- the ultraviolet pulse beam itself output from the light source device 14 may be modulated in a burst wave shape according to the drawing data.
- the drawing optical element AOM provided in the light introducing optical system BDU is used as an optical element for selecting whether or not to guide the beam LB from the light source device 14 to the beam scanning device MD (referred to as switching element AOM). Is called.
- switching element AOM an optical element for selecting whether or not to guide the beam LB from the light source device 14 to the beam scanning device MD
- switching element AOM it is necessary to make the rotational speeds of the polygon mirrors PM of the beam scanning device MD coincide with each other and to perform synchronous control so that the phase of the rotational angle also maintains a predetermined relationship.
- a beam transmission system (mirror or the like) is provided so that the beam LB from the light source device 14 sequentially passes through each switching element AOM of the beam scanning device MD, and responds to the origin signal SH of the polygon mirror PM.
- the synchronous control is performed so that any one of the switching elements AOM is sequentially turned on only during one scanning period of the spot light SP on the drawing line SLn.
- the drawing exposure of the spot light SP by the beam scanning apparatus MD is performed on the substrate FS supported in a curved shape by the rotating drum DR.
- a drawing exposure of the spot light SP may be performed on the supported substrate FS. That is, the beam scanning device MD may perform drawing exposure of the spot light SP on the substrate FS supported in a planar shape.
- a mechanism for supporting the substrate FS in a planar shape one disclosed in International Publication No. 2013/150677 pamphlet can be used. Briefly, the plurality of rollers around which the annular belt is wound are defined so that the annular belt is planar in the region where the substrate FS is supported.
- substrate FS conveyed is closely_contact
- FIG. 23 shows a configuration of a beam scanning device MD ′ according to the second embodiment, and the beam scanning device MD ′ of FIG. 23 is a beam scanning device MDn (shown in FIG. 5, FIG. 7, FIG. 10, etc.). MD1 to MD6) can be replaced.
- the same members as those of the previous beam scanning device MDn are denoted by the same reference numerals, and detailed description thereof is omitted.
- the beam scanning device MD ′ according to the second embodiment collects light after the drawing optical element AOMn (AOM1 to AOM6) in the light introducing optical system (also referred to as a beam distribution optical system) BDUn (BDU1 to BDU6).
- the beam LBn (LB1 to LB6) transmitted by the single-mode optical fiber SMF that enters the generated beam LBn (LB1 to LB6) is introduced.
- the exit end Pbo of the optical fiber SMF is fixed in the + Zt direction of the reflection mirror M10 of the beam scanning device MDn, and the beam LB1 converged at the exit end Pbo is reflected by the reflection mirror M10 while diverging at a predetermined numerical aperture (NA). Then, the light enters the condensing lens Be1 and the collimating lens Be2 constituting the beam expander BE.
- the beam LB1 is condensed at a condensing position Pb1 between the condensing lens Be1 and the collimating lens Be2, and then becomes a diverging beam LB1 which is incident on the collimating lens Be2 and converted into a parallel light beam.
- the beam LB1 emitted from the collimator lens Be2 is reflected by the reflection mirror M12, the image shift optical member SR, the deflection adjustment optical member DP, the field aperture FA, the reflection mirror M13, the ⁇ / 4 wavelength plate QW, and the cylindrical similarly to FIG.
- the light is condensed as spot light SP on the substrate FS via the lens CYa, the reflection mirror M14, the polygon mirror PM, the f ⁇ lens FT, the reflection mirror M15, and the cylindrical lens CYb.
- the surface on which the spot light SP is formed (the surface of the substrate FS) is optically conjugate with the condensing position Pb1 and the exit end PBo.
- the mirror M11, the polarization beam splitter BS1, the lens system G10, and the photodetector DT1 shown in FIG. 7 are omitted.
- the beam scanning device MD ′ is pivotally supported by the column member BX1 so as to be rotatable within a predetermined angle range around the irradiation central axis Le1, but the optical fiber SMF is The emission end Pbo can be fixed at an arbitrary position shifted from the irradiation center axis Le1.
- the beam energy (illuminance per unit area of spot light) needs to be considerably high depending on the sensitivity of the photosensitive functional layer on the substrate FS. There is. Therefore, the optical transmission using the single mode optical fiber SMF as shown in FIG.
- the photosensitive functional layer is sensitive to light having a wavelength longer than the ultraviolet wavelength range, for example, a wavelength in the range of 500 nm to 700 nm
- light transmission by a single mode optical fiber SMF is possible as shown in FIG. It becomes.
- the incident end (not shown) of the optical fiber SMF in FIG. 23 is disposed after the branching mirror M1 after the drawing optical element AOMn in the light introducing optical system BDUn shown in FIG. Specifically, the drawing beam LBn reflected by the mirror M1 is converted into a beam condensed at a predetermined NA (numerical aperture) by a condensing lens, and an optical fiber SMF is formed at the condensing point (beam waist position). It is only necessary to fix the incident end of.
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Abstract
Description
Vt=(Vp・Np・YP)=(Fe・αp・YP2/LBL)
となる。したがって、この関係が満たされるように、基板FSの搬送速度Vt(μm/秒)、ポリゴンミラーPMの回転速度Vp(rps)、光源装置14の発光周波数Fe(Hz)が調整される。
上記実施の形態は、以下のような変形も可能である。
ところで、上記実施の形態および各変形例において、ビーム走査装置MDのθzt回転(またはθxt回転)によって描画ラインSLnの傾きを調整した場合は、描画ライン上の描画開始点と描画終了点とが調整前の位置に対してずれることになる。図21は、一例として、初期状態でYt軸と平行なビーム走査装置MD1の描画ラインSL1をXtYt平面(被照射面)内で反時計回りに角度θssだけ回転させた様子を示す。図21は説明のために角度θssを誇張して図示したもので、実際に回転可能な角度θssの最大値は±2°程度と極めて小さい。図21において、調整前の描画ラインSL1の中点をCCとすると、Zt方向に延びる照射中心軸Le1は中点CCを通るように設定され、描画ラインSL1は照射中心軸Le1と一致したビーム走査装置MD1の機械的な回転中心軸を中心としてθzt回転(傾斜)するように設定されているものとする。さらに、描画ラインSL1の描画開始点をST、描画終了点をSEとすると、描画開始点STから描画終了点SEまでの長さLBLがYt方向に関する実際のパターン描画幅となる。したがって、描画開始点STから中点CCまでの長さLBhと、中点CCから描画終了点SEまでの長さLBhとは等しく、LBh=LBL/2になっているものとする。
ΔAr=〔LBh・(1-cos(θss))〕/cos(θss)・・・(1)
ΔAf=〔LBh・(1-cos(θss))〕/cos(θss)・・・(2)
で求められる。図21のように、中点CC(Le1)が精密にビーム走査装置MD1の回転中心に設定されている場合、シフト量ΔArとシフト量ΔAfの絶対値は等しくなる。シフト量ΔAfの方向は、描画ラインSL1a上のスポット光SPの走査方向と同じなので、この場合は、調整された角度θssに応じたシフト量ΔAfに対応した時間ΔTpx(=ΔAr/スポット光SPの走査速度Vss)だけ、図9で説明した時間Tpxを長くして描画データの書き出しを開始すればよい。
ΔXcc=-ΔAy・sin(θss)+ΔAx・(1-cos(θss))・・・(3)
ΔYcc=ΔAy・(1-cos(θss))+ΔAx・sin(θss) ・・・(4)
図23は、第2の実施の形態によるビーム走査装置MD’の構成を示し、図23のビーム走査装置MD’は、先の図5、図7、図10等に示したビーム走査装置MDn(MD1~MD6)の各々と置き換え可能な構成となっている。図23のビーム走査装置MD’を構成する部材に関しては、先のビーム走査装置MDnの部材と同じものには同じ符号を付し、その詳細な説明を省略する。本第2の実施の形態によるビーム走査装置MD’は、光導入光学系(ビーム分配光学系とも呼ぶ)BDUn(BDU1~BDU6)内の描画用光学素子AOMn(AOM1~AOM6)の後で集光されるビームLBn(LB1~LB6)を入射する単一モードの光ファイバーSMFで伝送されるビームLBn(LB1~LB6)を導入するように構成される。
Claims (31)
- 光源装置からのビームのスポット光を対象物の被照射面に投射しつつ、前記スポット光を前記被照射面上で1次元に走査するビーム走査装置であって、
前記光源装置からの前記ビームを入射する入射光学部材と、
前記入射光学部材からの前記ビームを前記1次元の走査のために偏向する走査用偏向部材と、
偏向された前記ビームを入射して前記被照射面に投射する投射光学系と、
前記入射光学部材、前記走査用偏向部材、および、前記投射光学系を支持して、前記スポット光の走査によって前記被照射面上に形成される走査線上の特定点を前記被照射面に対して垂直に通る照射中心軸と所定の許容範囲内で同軸となる第1の回転中心軸の回りに回転可能な支持フレームと、
を備える、ビーム走査装置。 - 請求項1に記載のビーム走査装置であって、
前記入射光学部材に入射する前記ビームの入射軸は、前記照射中心軸と同軸であり、
前記照射中心軸が前記第1の回転中心軸と前記所定の許容範囲内で同軸となるように、前記入射光学部材から前記対象物までの前記ビームの光路を折り曲げる光路偏向部材を備え、
前記支持フレームは、さらに前記光路偏向部材を支持する、ビーム走査装置。 - 請求項2に記載のビーム走査装置であって、
前記光路偏向部材は、前記投射光学系を介して入射光学部材からの前記ビームを前記走査用偏向部材側に反射させ、前記投射光学系を介して前記走査用偏向部材が偏向した前記ビームを前記被照射面へ反射する反射部材を有する、ビーム走査装置。 - 請求項2または3に記載のビーム走査装置であって、
前記被照射面と前記投射光学系との間に設けられ、前記照射中心軸と前記所定の許容範囲内で同軸となる第2の回転中心軸を中心に前記走査線を回転させる像回転光学系を備え、
前記支持フレームは、さらに前記像回転光学系を回転可能に支持する、ビーム走査装置。 - 請求項4に記載のビーム走査装置であって、
前記第2の回転中心軸が前記投射光学系から前記像回転光学系に入射する前記ビームの走査軌跡の中点を通る前記ビームの入射軸と前記所定の許容範囲内で同軸となるように前記像回転光学系が設けられている、ビーム走査装置。 - 請求項1~5のいずれか1項に記載のビーム走査装置であって、
前記支持フレームを前記第1の回転中心軸の回りに回転可能に保持する本体フレームに支持され、前記支持フレームを前記第1の回転中心軸の回りに回転させるアクチュエータを備える、ビーム走査装置。 - 請求項6に記載のビーム走査装置であって、
前記支持フレームは、略並行に配置された2枚の平行支持部と、前記2枚の平行支持部の一端を塞ぐ閉塞支持部とを有し、
前記入射光学部材、前記走査用偏向部材、および、前記投射光学系は、前記支持フレームの前記平行支持部と前記閉塞支持部に沿って配置され、
前記アクチュエータは、前記2枚の平行支持部の間に設けられている、ビーム走査装置。 - 光源装置からのビームのスポット光を対象物の被照射面上で照射しつつ、前記スポット光を前記被照射面上で1次元に走査するビーム走査装置であって、
前記光源装置からの前記ビームを入射する入射光学部材と、
前記入射光学部材からの前記ビームを前記1次元の走査のために偏向する走査用偏向部材と、
偏向された前記ビームを入射して前記被照射面に投射する投射光学系と、
前記被照射面と前記投射光学系との間に設けられ、前記スポット光の走査によって前記被照射面上に形成される走査線上の特定点を前記被照射面に対して垂直に通る照射中心軸と所定の許容範囲内で同軸となる回転中心軸の回りに前記走査線を回転させる像回転光学系と、
を備える、ビーム走査装置。 - 請求項8に記載のビーム走査装置であって、
前記回転中心軸が前記投射光学系から前記像回転光学系に入射する前記ビームの走査軌跡の中点を通る前記ビームの入射軸と前記所定の許容範囲内で同軸となるように前記像回転光学系が設けられている、ビーム走査装置。 - ビーム走査装置を用いて、光源装置からのビームのスポット光を対象物の被照射面に投射しつつ、前記スポット光を前記被照射面上で1次元に走査するビーム走査方法であって、
前記ビーム走査装置に光源装置からの前記ビームを入射させる入射ステップと、
入射した前記ビームを前記1次元の走査のために偏向する偏向ステップと、
偏向された前記ビームを入射して前記被照射面に投射する投射ステップと、
前記スポット光の走査によって前記被照射面上に形成される走査線上の特定点を前記被照射面に対して垂直に通る照射中心軸と所定の許容範囲内で同軸となる回転中心軸の回りに前記走査線を回転させる回転ステップと、
を含む、ビーム走査方法。 - 請求項10に記載のビーム走査方法であって、
前記回転ステップは、第1の前記回転中心軸を中心に前記ビーム走査装置を回転させることで、前記第1の回転中心軸を中心に前記走査線を回転させる、ビーム走査方法。 - 請求項11に記載のビーム走査方法であって、
入射ステップは、前記ビーム走査装置に入射する前記ビームの入射軸が前記回転中心軸と所定の許容範囲内で同軸となるように、前記ビームを入射させる、ビーム走査方法。 - 請求項10~12のいずれか1項に記載のビーム走査方法であって、
前記回転ステップは、第2の前記回転中心軸の回りに像回転光学系を回転させることで、前記第2の回転中心軸を中心に前記走査線を回転させる、ビーム走査方法。 - 請求項13に記載のビーム走査方法であって、
前記像回転光学系は、前記第2の回転中心軸が前記像回転光学系に入射する前記ビームの走査軌跡の中点を通る前記ビームの入射軸と前記所定の許容範囲内で同軸となるように設けられている、ビーム走査方法。 - 光源装置からのビームのスポット光を対象物の被照射面に投射しつつ、前記スポット光を前記被照射面上で1次元に走査する描画装置であって、
前記光源装置からの前記ビームを受ける入射光学部材と、
前記入射光学部材からの前記ビームを前記1次元の走査のために偏向する走査用偏向部材と、
偏向された前記ビームを入射して前記被照射面に投射する投射光学系と、
前記入射光学部材、前記走査用偏向部材、および、前記投射光学系を支持する支持フレームと、
前記支持フレームを、前記被照射面の法線と平行な第1の回転中心軸の回りに回転可能な状態で装置本体に支持する回転支持機構と、
前記入射光学部材に入射する前記ビームの入射軸と前記第1の回転中心軸とが所定の許容範囲内で同軸となるように、前記光源装置からの前記ビームを前記入射光学部材に導く光導入光学系と、
を備える、描画装置。 - 請求項15に記載の描画装置であって、
前記被照射面の法線のうちの前記スポット光の走査によって前記被照射面上に形成される走査線上の特定点を通る法線を照射中心軸としたとき、前記支持フレームは、前記第1の回転中心軸と前記照射中心軸とが所定の許容範囲内で同軸に設定されるように、前記入射光学部材から前記対象物までの前記ビームの光路を折り曲げる光路偏向部材を支持する、描画装置。 - 請求項16に記載の描画装置であって、
前記被照射面と前記投射光学系との間に設けられ、前記照射中心軸と前記所定の許容範囲内で同軸となる第2の回転中心軸を中心に前記走査線を回転させる像回転光学系を備え、
前記支持フレームは、さらに前記像回転光学系を回転可能に支持する、描画装置。 - 光源装置からのビームのスポット光を対象物の被照射面に投射しつつ、前記スポット光を前記被照射面上で1次元に走査する描画装置であって、
前記光源装置からの前記ビームを前記1次元の走査のために偏向する走査用偏向部材と、
偏向された前記ビームを入射して前記被照射面に投射する投射光学系と、
前記走査用偏向部材、および前記投射光学系を支持する支持フレームと、
前記スポット光の走査によって前記被照射面上に形成される走査線上の特定点を通る前記被照射面の法線を照射中心軸としたとき、前記支持フレームの装置本体への支持部分が前記照射中心軸から所定の半径内の領域に制限されるように、前記支持フレームと前記装置本体とを結合する結合部材と、
を備える、描画装置。 - 請求項18に記載の描画装置であって、
前記結合部材は、前記装置本体に設けられる支柱部材に対して、前記照射中心軸と所定の許容範囲内で同軸となる第1の回転中心軸の回りに回転可能に、前記支持フレームを前記支柱部材に結合する、描画装置。 - 請求項19に記載の描画装置であって、
前記光源装置からの前記ビームを受ける入射光学部材と、
前記照射中心軸が前記第1の回転中心軸と前記所定の許容範囲内で同軸となるように、前記入射光学部材から前記対象物までの前記ビームの光路を折り曲げる光路偏向部材と、
を備え、
前記支持フレームは、さらに前記入射光学部材と前記光路偏向部材を支持し、
前記入射光学部材に入射する前記ビームの入射軸は、前記照射中心軸と同軸である、描画装置。 - 請求項18~20のいずれか1項に記載の描画装置であって、
前記被照射面と前記投射光学系との間に設けられ、前記照射中心軸と前記所定の許容範囲内で同軸となる第2の回転中心軸を中心に前記走査線を回転させる像回転光学系を備え、
前記支持フレームは、さらに前記像回転光学系を回転可能に支持する、描画装置。 - 対象物の被照射面に投射されるビームを前記被照射面上でスポット光に収斂しつつ、前記スポット光を1次元に走査するビーム走査装置であって、
入射ビームを反射するとともに、反射ビームを所定角度の範囲内で偏向することで、前記スポット光を走査させる偏向部材と、
前記入射ビームを、前記偏向部材に向かわせるように送光する送光光学系と、
前記送光光学系からの前記入射ビームを入射して前記偏向部材に投射するとともに、前記反射ビームを入射して前記反射ビームの前記スポット光を前記被照射面に投射する投射光学系と、
を備える、ビーム走査装置。 - 請求項22に記載のビーム走査装置であって、
レンズ系によって収斂された後、拡散された前記入射ビームが前記送光光学系に入射し、
前記レンズ系は、前記被照射面と光学的に共役な共役面で前記入射ビームを収斂する、ビーム走査装置。 - 請求項23に記載のビーム走査装置であって、
前記偏向部材は、回転軸と回転軸の周りに形成された複数の反射面を有する回転多面鏡であり、
前記偏向部材による前記反射ビームの走査方向と直交する方向に関して、前記入射ビームが入射する前記反射面と前記被照射面とは光学的に共役関係にある、ビーム走査装置。 - 請求項22~24のいずれか1項に記載のビーム走査装置であって、
前記送光光学系は、前記偏向部材による前記反射ビームの走査方向に母線を有するシリンドリカルレンズを含み、
前記投射光学系は、テレセントリック系のスキャンレンズである、ビーム走査装置。 - 請求項22~25のいずれか1項に記載のビーム走査装置であって、
前記投射光学系から前記偏向部材に入射する前記入射ビームと、前記偏向部材から前記投射光学系に向かう前記反射ビームとは、前記偏向部材による走査方向と直交する方向に関して、前記投射光学系の光軸を挟んで対称に一定の角度を有する、ビーム走査装置。 - 請求項22~26のいずれか1項に記載のビーム走査装置であって、
前記偏向部材、前記送光光学系、および、前記投射光学系を支持し、且つ、前記スポット光の走査によって前記被照射面上に規定される走査線上の特定点を前記被照射面に対して垂直に通る照射中心軸と所定の許容範囲内で同軸となる回転中心軸の回りに回転可能な支持フレームを備え、
前記送光光学系に入射する前記入射ビームの入射軸は、前記照射中心軸と同軸である、ビーム走査装置。 - 対象物の被照射面に投射されるビームを1次元に走査して所定のパターンを描画する描画装置であって、
前記ビームを1次元の走査のために偏向する偏向部材と、
光源装置からの前記ビームを入射して、前記偏向部材に向かわせるように送光する送光光学系と、
前記送光光学系からの前記ビームを入射して前記偏向部材に投射するとともに、前記偏向部材で反射した前記ビームを前記被照射面に投射する投射光学系と、
を備える、描画装置。 - 請求項28に記載の描画装置であって、
前記偏向部材、前記送光光学系、および、前記投射光学系を支持し、且つ、前記ビームの走査によって前記被照射面上に規定される走査線上の特定点を前記被照射面に対して垂直に通る照射中心軸と所定の許容範囲内で同軸となる回転中心軸の回りに回転可能な支持フレームを備え、
前記送光光学系に入射する前記ビームの入射軸は、前記照射中心軸と同軸である、描画装置。 - 請求項28または29に記載の描画装置であって、
前記被照射面に投射される前記ビームの強度を描画データに応じて変調させる描画用光学素子を備える、描画装置。 - 被照射体に投射される描画用ビームを回転多面鏡の回転によって繰り返し走査して、前記被照射体上に所定のパターンを描画する描画装置であって、
前記回転多面鏡の複数の反射面のうち前記描画用ビームを反射する第1反射面と異なる第2反射面が所定の角度位置になったことを検知したときに原点信号を発生する原点検出部と、
前記原点信号が発生してから前記第2反射面が前記第1反射面となるまでの前記回転多面鏡の回転速度で決まる所定時間を基準にして、前記原点信号の発生から所定の遅延したタイミングで前記描画用ビームによる描画開始を指示する制御装置と、
を備える、描画装置。
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Also Published As
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JP6740999B2 (ja) | 2020-08-19 |
KR20200024956A (ko) | 2020-03-09 |
KR102195908B1 (ko) | 2020-12-29 |
JP2020194167A (ja) | 2020-12-03 |
CN107430272A (zh) | 2017-12-01 |
CN110596886A (zh) | 2019-12-20 |
KR20170127460A (ko) | 2017-11-21 |
CN110596887A (zh) | 2019-12-20 |
CN110596888B (zh) | 2022-04-01 |
JP7074160B2 (ja) | 2022-05-24 |
CN111638631A (zh) | 2020-09-08 |
KR102169506B1 (ko) | 2020-10-23 |
TW202024716A (zh) | 2020-07-01 |
CN111638631B (zh) | 2023-03-10 |
TW201704889A (zh) | 2017-02-01 |
TWI691799B (zh) | 2020-04-21 |
CN110596886B (zh) | 2021-12-07 |
TWI698662B (zh) | 2020-07-11 |
CN110596888A (zh) | 2019-12-20 |
TWI718030B (zh) | 2021-02-01 |
JPWO2016152758A1 (ja) | 2017-12-28 |
CN107430272B (zh) | 2020-05-29 |
CN110596887B (zh) | 2022-04-01 |
TW202028887A (zh) | 2020-08-01 |
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