WO2018066159A1 - パターン描画装置、およびパターン描画方法 - Google Patents
パターン描画装置、およびパターン描画方法 Download PDFInfo
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- WO2018066159A1 WO2018066159A1 PCT/JP2017/018139 JP2017018139W WO2018066159A1 WO 2018066159 A1 WO2018066159 A1 WO 2018066159A1 JP 2017018139 W JP2017018139 W JP 2017018139W WO 2018066159 A1 WO2018066159 A1 WO 2018066159A1
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- Prior art keywords
- substrate
- pattern
- scanning
- light
- spot
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Definitions
- the present invention relates to a pattern drawing apparatus and a pattern drawing method for drawing a pattern by scanning spot light irradiated on an irradiated object.
- a drawing apparatus using a rotating polygon mirror for example, as disclosed in Japanese Patent Application Laid-Open No. 2008-200964, a main scanning direction in which a plurality of laser exposure units having a polygon mirror are provided and an exposure beam is scanned by the polygon mirror.
- an image forming apparatus that draws an image by overlapping a part (end part) of the scanning region in FIG.
- the exposure beam is shifted in the sub-scanning direction orthogonal to the main scanning direction due to the difference in surface tilt of the plurality of reflecting surfaces of the polygon mirror in the overlapping region at the end of the scanning region.
- Japanese Patent Application Laid-Open No. 2008-200964 also provides a mechanism for mechanically moving the laser exposure unit including the polygon mirror in the sub-scanning direction so as to reduce the deviation in the overlapping region of the image. It is disclosed.
- a plurality of drawing units that draw a pattern by scanning a drawing beam condensed as a spot on a substrate in a first direction are arranged in the first direction, and the first of the substrate
- a pattern drawing apparatus that draws a pattern drawn by a plurality of drawing units by joining in a first direction by moving in a second direction that intersects a direction, and is to be drawn by the plurality of drawing units
- a position measuring unit that measures the position of the exposed region on the substrate, and a position measured by the position measuring unit in order to reduce a position error of the pattern drawn by each of the drawing units with respect to the exposed region.
- a spot of a drawing beam projected from each of a plurality of drawing units arranged in the first direction is scanned on the substrate in the first direction, and the substrate is moved to the first direction.
- a pattern drawing method in which a pattern drawn by each of the plurality of drawing units is drawn in the first direction by moving in a crossing second direction, and a position of a reference pattern formed on the substrate is determined.
- a measurement stage that is detected during the movement of the substrate and measures the position of the exposed area on the substrate, and a pattern that is drawn by each of the drawing units is measured based on the position measured in the measurement stage.
- a first adjustment stage for adjusting the position of the spot in each of the drawing units in the second direction during the movement of the substrate in order to align with an exposure area, and drawing in each of the drawing units A second adjustment step for adjusting the position of the spot by each of the drawing units in the second direction more finely than the first adjustment step in order to reduce a joint error of the pattern in the second direction; ,including.
- a rotary polygon mirror that performs one-dimensional scanning in the main scanning direction on a drawing beam whose intensity is modulated in accordance with a pattern to be drawn on the substrate, and the drawing beam that has been one-dimensionally scanned.
- the pattern drawing apparatus for drawing a pattern on the substrate is incident on the rotary polygon mirror to adjust the position of the spot light that is one-dimensionally scanned in the main scanning direction in the sub-scanning direction.
- the first optically adjusting member disposed in the optical path of the previous drawing beam or in the optical path of the drawing beam from the rotary polygon mirror to the substrate, and the one-dimensionally scanned in the main scanning direction.
- FIG. 1 shows schematic structure of the device manufacturing system containing the pattern exposure apparatus by 1st Embodiment which performs an exposure process to a board
- FIG. 1 shows schematic structure of the device manufacturing system containing the pattern exposure apparatus by 1st Embodiment which performs an exposure process to a board
- FIG. 1 shows schematic structure of the device manufacturing system containing the pattern exposure apparatus by 1st Embodiment which performs an exposure process to a board
- FIG. shows the structure of the exposure apparatus of FIG.
- It is a block diagram which shows the structure of the electrical control system of the exposure apparatus shown in FIG. 10 is a time chart showing an origin signal output from an origin sensor in the scanning unit shown in FIG. 5 and an incident permission signal generated by the selection element drive control unit shown in FIG. 9 according to the origin signal.
- FIG. 13A is a diagram for explaining a pattern drawn when local magnification correction is not performed
- FIG. 13B is a drawing when local magnification correction (reduction) is performed according to the time chart shown in FIG. It is a figure explaining the pattern to be performed.
- FIG. 15 is a diagram illustrating a configuration of a beam switching unit according to Modification 2 when the optical element for selection in the beam switching unit illustrated in FIG. 6 is replaced with Modification 1 of FIG. 14. It is a figure which shows the detailed optical arrangement
- FIG. 17A shows a prism-shaped electro-optical element used as a third modification instead of the optical element for selection
- FIG. 17B is a diagram showing an example of another electro-optical element. It is a figure which shows in detail the structure of the wavelength conversion part in the pulse light generation part of the light source device in 2nd Embodiment. It is a figure which shows the optical path of the beam from the light source device in 2nd Embodiment to the first optical element for selection. It is a figure which shows the structure of the driver circuit of the optical path from the optical element for selection in the 2nd Embodiment to the optical element for selection of the next stage, and the optical element for selection.
- FIG. 24A is a diagram for explaining how the beam position is adjusted by the parallel flat plate provided in the scanning unit shown in FIG. 23.
- the parallel incident plane and exit plane of the parallel flat plate are the beam center line (main line).
- FIG. 24B is a diagram illustrating a state in which the beam position is adjusted by a parallel plate provided in the scanning unit shown in FIG.
- FIG. 24 shows the state in which the mutually parallel entrance plane and exit surface incline from 90 degree
- FIG. 24 schematically shows an exaggerated state of a beam in a part of the optical path in the scanning unit (drawing unit) shown in FIG.
- FIG. 24 shows an optical system arrangement from a polygon mirror to a substrate of the scanning unit (drawing unit) shown in FIG. 23.
- a pattern drawing apparatus and a pattern drawing method according to an aspect of the present invention will be described in detail below with reference to the accompanying drawings by listing preferred embodiments.
- the aspect of this invention is not limited to these embodiment, What added the various change or improvement is included. That is, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same elements, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the scope of the present invention.
- FIG. 1 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs an exposure process on a substrate (irradiated body) P according to the first embodiment.
- EX an exposure apparatus
- FIG. 1 an XYZ orthogonal coordinate system in which the gravity direction is the Z direction is set, and the X direction, the Y direction, and the Z direction will be described according to the arrows shown in the drawing.
- the device manufacturing system 10 is a system (substrate processing apparatus) that manufactures an electronic device by performing predetermined processing (exposure processing or the like) on the substrate P.
- a manufacturing line for manufacturing a flexible display as an electronic device for example, a film-like touch panel, a film-like color filter for a liquid crystal display panel, a flexible wiring, or a flexible sensor is constructed. It is a manufacturing system. The following description is based on the assumption that a flexible display is used as the electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display.
- the device manufacturing system 10 sends out the substrate P from a supply roll FR1 obtained by winding a flexible sheet-like substrate (sheet substrate) P in a roll shape, and continuously performs various processes on the delivered substrate P. After that, the substrate P after various treatments is wound up by the recovery roll FR2, and has a so-called roll-to-roll (Roll To Roll) structure.
- the substrate P has a belt-like shape in which the moving direction (transport direction) of the substrate P is the longitudinal direction (long) and the width direction is the short direction (short).
- the film-like substrate P includes at least a processing apparatus (first processing apparatus) PR1, a processing apparatus (second processing apparatus) PR2, an exposure apparatus (third processing apparatus) EX, An example of winding up to the collection roll FR2 through the processing device (fourth processing device) PR3 and the processing device (fifth processing device) PR4 is shown.
- the X direction is a direction (conveying direction) in which the substrate P is directed from the supply roll FR1 to the collection roll FR2 in the horizontal plane.
- the Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction (short direction) of the substrate P.
- the Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which gravity acts.
- a resin film or a foil (foil) made of a metal or alloy such as stainless steel is used.
- the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Among them, one containing at least one or more may be used. Further, the thickness and rigidity (Young's modulus) of the substrate P may be in a range that does not cause folds or irreversible wrinkles due to buckling in the substrate P when passing through the conveyance path of the device manufacturing system 10. .
- a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 ⁇ m to 200 ⁇ m is typical of a suitable sheet substrate.
- the substrate P may receive heat in each process performed by the processing apparatus PR1, the processing apparatus PR2, the exposure apparatus EX, the processing apparatus PR3, and the processing apparatus PR4, the substrate P is made of a material whose thermal expansion coefficient is not remarkably large. It is preferable to select the substrate P.
- the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film.
- the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide.
- the substrate P may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.
- the flexibility of the substrate P means the property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. .
- flexibility includes a property of bending by a force of about its own weight.
- the degree of flexibility varies depending on the material, size and thickness of the substrate P, the layer structure formed on the substrate P, the environment such as temperature or humidity, and the like. In any case, when the substrate P is correctly wound around the conveyance direction changing members such as various conveyance rollers and rotating drums provided in the conveyance path in the device manufacturing system 10 according to the first embodiment, If the substrate P can be smoothly transported without being bent and creased or damaged (breaking or cracking), it can be said to be a flexible range.
- the processing apparatus PR1 applies the coating process to the substrate P while transporting the substrate P transported from the supply roll FR1 toward the processing apparatus PR2 in a transport direction (+ X direction) along the longitudinal direction at a predetermined speed. It is the coating device which performs.
- the processing apparatus PR1 selectively or uniformly applies the photosensitive functional liquid to the surface of the substrate P.
- the substrate P having the photosensitive functional liquid applied on the surface thereof is conveyed toward the processing apparatus PR2.
- the processing apparatus PR2 is a drying apparatus that performs a drying process on the substrate P while transporting the substrate P transported from the processing apparatus PR1 toward the exposure apparatus EX in the transport direction (+ X direction) at a predetermined speed. .
- the processing apparatus PR2 removes the solvent or water contained in the photosensitive functional liquid with a blower, an infrared light source, a ceramic heater, or the like that blows drying air (hot air) such as hot air or dry air onto the surface of the substrate P, and performs photosensitivity. Dry sexual function liquid.
- a film to be a photosensitive functional layer photosensitive layer
- the photosensitive functional layer may be formed on the surface of the substrate P by attaching a dry film to the surface of the substrate P.
- a pasting apparatus for sticking the dry film to the substrate P may be provided instead of the processing apparatus PR1 and the processing apparatus PR2.
- a typical one of the photosensitive functional liquid (layer) is a photoresist (liquid or dry film).
- a photoresist liquid or dry film
- the lyophilic property of the part that has been irradiated with ultraviolet rays There is a photosensitive silane coupling agent (SAM) that is modified, or a photosensitive reducing agent in which a plating reducing group is exposed in a portion irradiated with ultraviolet rays.
- SAM photosensitive silane coupling agent
- the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophobic to lyophilic.
- conductive ink ink containing conductive nanoparticles such as silver or copper
- a liquid containing a semiconductor material on the lyophilic portion, a thin film transistor (TFT) or the like
- a pattern layer to be an electrode, a semiconductor, insulation, or a wiring for connection can be formed.
- a photosensitive reducing agent is used as the photosensitive functional liquid (layer)
- the plating reducing group is exposed to the pattern portion exposed to ultraviolet rays on the substrate P. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions or the like for a certain period of time, so that a pattern layer of palladium is formed (deposited).
- Such a plating process is an additive process, but may be based on an etching process as a subtractive process.
- the substrate P sent to the exposure apparatus EX is made of PET or PEN as a base material, and a metal thin film such as aluminum (Al) or copper (Cu) is deposited on the entire surface or selectively, and further, It may be a laminate of a photoresist layer thereon.
- a photosensitive reducing agent is used as the photosensitive functional liquid (layer).
- the exposure apparatus EX is a processing apparatus that performs exposure processing on the substrate P while transporting the substrate P transported from the processing apparatus PR2 toward the processing apparatus PR3 in the transport direction (+ X direction) at a predetermined speed.
- the exposure apparatus EX uses a light corresponding to a pattern for an electronic device (for example, a pattern of an electrode or wiring of a TFT constituting the electronic device) on the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface). Irradiate the pattern. Thereby, a latent image (modified portion) corresponding to the pattern is formed on the photosensitive functional layer.
- the exposure apparatus EX is a direct drawing type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus (pattern drawing apparatus).
- the exposure apparatus EX transmits the spot light SP of the pulsed beam LB (pulse beam) for exposure to the substrate P while conveying the substrate P in the + X direction (sub-scanning direction).
- the intensity of the spot light SP is modulated at high speed according to the pattern data (drawing data, pattern information) while one-dimensionally scanning (main scanning) in the predetermined scanning direction (Y direction) on the irradiated surface (photosensitive surface). (ON / OFF).
- a light pattern corresponding to a predetermined pattern such as an electronic device, a circuit, or a wiring is drawn and exposed on the irradiated surface of the substrate P. That is, the spot light SP is relatively two-dimensionally scanned on the irradiated surface of the substrate P by the sub-scanning of the substrate P and the main scanning of the spot light SP, and a predetermined pattern is drawn and exposed on the substrate P. . Further, since the substrate P is transported along the transport direction (+ X direction), the exposed area W where the pattern is exposed by the exposure apparatus EX is spaced a predetermined distance along the longitudinal direction of the substrate P. A plurality of them are provided (see FIG. 4).
- the exposed area W is also a device forming area. Since the electronic device is configured by superimposing a plurality of pattern layers (layers on which patterns are formed), a pattern corresponding to each layer may be exposed by the exposure apparatus EX.
- the processing apparatus PR3 is a wet processing apparatus that performs wet processing on the substrate P while transporting the substrate P transported from the exposure apparatus EX toward the processing apparatus PR4 in the transport direction (+ X direction) at a predetermined speed. is there.
- the processing apparatus PR3 performs a plating process which is a kind of wet process on the substrate P. That is, the substrate P is immersed in a plating solution stored in the processing tank for a predetermined time. As a result, a pattern layer corresponding to the latent image is deposited (formed) on the surface of the photosensitive functional layer.
- a predetermined material for example, palladium
- a predetermined material for example, palladium
- a coating process or a plating process of a liquid which is a kind of wet process is performed by the processing apparatus PR3.
- a pattern layer corresponding to the latent image is formed on the surface of the photosensitive functional layer. That is, a predetermined material (for example, conductive ink or palladium) is selectively formed on the substrate P according to the difference between the irradiated portion of the spot light SP of the photosensitive functional layer of the substrate P and the irradiated portion, This is the pattern layer.
- photosensitive functional layer when a photoresist is employed as the photosensitive functional layer, development processing which is a kind of wet processing is performed by the processing apparatus PR3. In this case, a pattern corresponding to the latent image is formed on the photosensitive functional layer (photoresist) by this development processing.
- the processing apparatus PR4 performs cleaning / drying processing on the substrate P while transporting the substrate P transported from the processing apparatus PR3 toward the recovery roll FR2 in the transport direction (+ X direction) at a predetermined speed. It is a drying device.
- the processing apparatus PR4 cleans the substrate P that has been subjected to the wet processing with pure water, and then dries until the moisture content of the substrate P is equal to or lower than a predetermined value at a glass transition temperature or lower.
- the processing apparatus PR4 may be an annealing / drying apparatus that performs an annealing process and a drying process on the substrate P.
- the substrate P is irradiated with, for example, high-intensity pulsed light from a strobe lamp in order to strengthen the electrical coupling between the nanoparticles contained in the applied conductive ink.
- a processing apparatus (wet processing apparatus) PR5 that performs an etching process between the processing apparatus PR4 and the recovery roll FR2, and a substrate P that has been subjected to the etching process.
- a processing apparatus (cleaning / drying apparatus) PR6 for performing the cleaning / drying process may be provided.
- a photoresist is adopted as the photosensitive functional layer
- a pattern layer is formed on the substrate P by performing an etching process. That is, a predetermined material (for example, aluminum (Al) or copper (Cu)) is selectively formed on the substrate P according to the difference between the irradiated portion of the spot light SP of the photosensitive functional layer of the substrate P and the irradiated portion. This is a pattern layer.
- the processing apparatuses PR5 and PR6 have a function of transporting the substrate P sent in the transport direction (+ X direction) at a predetermined speed toward the collection roll FR2.
- the function of the plurality of processing apparatuses PR1 to PR4 (including processing apparatuses PR5 and PR6 as necessary) to transfer the substrate P in the + X direction is configured as a substrate transfer apparatus.
- One pattern layer is formed on the substrate P through at least each process of the device manufacturing system 10.
- each process of the device manufacturing system 10 as shown in FIG. 1 is performed at least twice in order to generate the electronic device. Have to go through. Therefore, a pattern layer can be laminated
- the processed substrate P is in a state in which a plurality of electronic devices are connected along the longitudinal direction of the substrate P with a predetermined interval. That is, the substrate P is a multi-sided substrate.
- the collection roll FR2 that collects the substrate P formed in a state where the electronic devices are connected may be mounted on a dicing apparatus (not shown).
- the dicing apparatus equipped with the collection roll FR2 divides (processes) the processed substrate P for each electronic device (exposed area W, which is a device formation area), so that the electronic device becomes a plurality of single wafers.
- the dimensions of the substrate P for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more.
- substrate P is not limited to an above-described dimension.
- FIG. 2 is a block diagram showing the configuration of the exposure apparatus EX.
- the exposure apparatus EX is stored in the temperature control chamber ECV.
- This temperature control chamber ECV keeps the inside at a predetermined temperature and a predetermined humidity, thereby suppressing a change in shape due to the temperature of the substrate P transported inside, and occurring along with the hygroscopicity and transport of the substrate P.
- the humidity is set in consideration of static charge.
- the temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via passive or active vibration isolation units SU1, SU2.
- the anti-vibration units SU1 and SU2 reduce vibration from the installation surface E.
- the installation surface E may be the floor surface of the factory itself, or may be a surface on an installation base (pedestal) that is exclusively installed on the floor surface in order to obtain a horizontal surface.
- the control device (control unit) 16 controls each part of the exposure apparatus EX.
- the control device 16 includes a computer and a recording medium on which the program is recorded, and functions as the control device 16 of the first embodiment when the computer executes the program.
- the substrate transport mechanism 12 constitutes a part of the substrate transport apparatus of the device manufacturing system 10, and after the substrate P transported from the processing apparatus PR2 is transported at a predetermined speed in the exposure apparatus EX, the processing is performed. It sends out to the apparatus PR3 at a predetermined speed.
- the substrate transport mechanism 12 defines a transport path for the substrate P transported in the exposure apparatus EX.
- the substrate transport mechanism 12 includes an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotating drum (cylindrical drum) DR, a tension adjusting roller RT2, in order from the upstream side ( ⁇ X direction side) in the transport direction of the substrate P.
- a driving roller R2 and a driving roller R3 are provided.
- the edge position controller EPC adjusts the position in the width direction (the Y direction and the short direction of the substrate P) of the substrate P transported from the processing apparatus PR2.
- the edge position controller EPC has a position at the end (edge) in the width direction of the substrate P that is transported in a state of a predetermined tension, which is about ⁇ 10 ⁇ m to several tens ⁇ m with respect to the target position.
- the position of the substrate P in the width direction is adjusted by moving the substrate P in the width direction so that it falls within this range (allowable range).
- the edge position controller EPC includes a roller on which the substrate P is stretched in a state where a predetermined tension is applied, and an edge sensor (end detection unit) (not shown) that detects the position of the end portion (edge) in the width direction of the substrate P. And have.
- the edge position controller EPC adjusts the position of the substrate P in the width direction by moving the roller of the edge position controller EPC in the Y direction based on the detection signal detected by the edge sensor.
- the driving roller (nip roller) R1 rotates while holding both front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P toward the rotating drum DR.
- the edge position controller EPC appropriately adjusts the position in the width direction of the substrate P so that the longitudinal direction of the substrate P wound around the rotating drum DR is always orthogonal to the central axis AXo of the rotating drum DR.
- the parallelism between the rotation axis of the roller and the Y axis of the edge position controller EPC may be appropriately adjusted so as to correct the tilt error in the traveling direction of the substrate P.
- the rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting with the direction in which gravity works, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo.
- the rotating drum DR rotates around the central axis AXo while supporting (holding) a part of the substrate P by bending the outer surface (circumferential surface) into a cylindrical surface in the longitudinal direction. Transport P in the + X direction.
- the rotating drum DR supports an area (portion) on the substrate P onto which the beam LB (spot light SP) from the exposure head 14 is projected on its outer peripheral surface.
- the rotating drum DR supports (holds and holds) the substrate P from the surface (back surface) opposite to the surface on which the electronic device is formed (surface on which the photosensitive surface is formed).
- shafts Sft supported by annular bearings are provided so that the rotating drum DR rotates around the central axis AXo.
- the shaft Sft rotates at a constant rotational speed around the central axis AXo by receiving a rotational torque from a rotational drive source (not shown) (for example, a motor or a speed reduction mechanism) controlled by the control device 16.
- a rotational drive source not shown
- a plane including the central axis AXo and parallel to the YZ plane is referred to as a central plane Poc.
- the driving rollers (nip rollers) R2 and R3 are arranged at a predetermined interval along the transport direction (+ X direction) of the substrate P, and give a predetermined slack (play) to the substrate P after exposure.
- the drive rollers R2 and R3 rotate while holding both front and back surfaces of the substrate P, and transport the substrate P toward the processing apparatus PR3.
- the tension adjusting rollers RT1 and RT2 are urged in the ⁇ Z direction, and apply a predetermined tension in the longitudinal direction to the substrate P that is wound around and supported by the rotary drum DR. As a result, the longitudinal tension applied to the substrate P applied to the rotating drum DR is stabilized within a predetermined range.
- the control device 16 rotates the driving rollers R1 to R3 by controlling a rotation driving source (not shown) (for example, a motor, a speed reducer, etc.).
- a rotation driving source for example, a motor, a speed reducer, etc.
- the rotation axes of the drive rollers R1 to R3 and the rotation axes of the tension adjustment rollers RT1 and RT2 are parallel to the center axis AXo of the rotation drum DR.
- the light source device LS (LSa, LSb) generates and emits a pulsed beam (pulse beam, pulsed light, laser) LB.
- the beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the light emission frequency (oscillation frequency, predetermined frequency) of the beam LB is Fa.
- the beam LB emitted from the light source device LS (LSa, LSb) is incident on the exposure head 14 via the beam switching unit BDU.
- the light source device LS (LSa, LSb) emits and emits the beam LB at the emission frequency Fa according to the control of the control device 16.
- the configuration of the light source device LS (LSa, LSb) will be described later in detail.
- a semiconductor laser element that generates pulsed light in the infrared wavelength region, a fiber amplifier, an amplified red light, and the like. Consists of a wavelength conversion element (harmonic generation element) that converts pulsed light in the outer wavelength range to pulsed light in the ultraviolet wavelength range, with an oscillation frequency Fa of several hundred MHz, and an emission time of one pulsed light of about picoseconds It is assumed that a fiber amplifier laser light source (harmonic laser light source) capable of obtaining high-intensity ultraviolet pulsed light is used.
- the beam LB from the light source device LSa may be represented by LBa and the beam LB from the light source device LSb may be represented by LBb.
- the beam switching unit BDU switches the scanning unit Un on which the beams LBa and LBb are incident so that the beam LBn is incident on the scanning unit (drawing unit) Un that scans the spot light SP. That is, the beam switching unit BDU causes the beam LBa from the light source device LSa to enter one of the scanning units U1 to U3 that scans the spot light SP. Similarly, the beam switching unit BDU causes the beam LBb from the light source device LSb to enter one scanning unit Un that scans the spot light SP among the scanning units U4 to U6.
- the beam switching unit BDU will be described in detail later.
- the scanning unit Un that scans the spot light SP is switched in the order of U1 ⁇ U2 ⁇ U3, and for the scanning units U4 to U6, the scanning that scans the spot light SP. Assume that the unit Un is switched in the order of U4 ⁇ U5 ⁇ U6.
- the configurations of the beam switching unit BDU and the light source device LS are disclosed in, for example, International Publication No. 2015/166910 pamphlet, but will be described in detail later with reference to FIGS. To do.
- the exposure head 14 is a so-called multi-beam type exposure head in which a plurality of scanning units Un (U1 to U6) having the same configuration are arranged.
- the exposure head 14 draws a pattern on a part of the substrate P supported by the outer peripheral surface (circumferential surface) of the rotary drum DR by a plurality of scanning units Un (U1 to U6). Since the exposure head 14 repeatedly performs pattern exposure for an electronic device on the substrate P, an exposure area (electronic device formation area) W where the pattern is exposed is a predetermined length along the longitudinal direction of the substrate P. A plurality are provided at intervals (see FIG. 4). The plurality of scanning units Un (U1 to U6) are arranged in a predetermined arrangement relationship.
- the plurality of scanning units Un are arranged in a staggered arrangement in two rows in the transport direction of the substrate P with the center plane Poc interposed therebetween.
- the odd-numbered scanning units U1, U3, U5 are arranged in a line on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P with respect to the center plane Poc and at a predetermined interval along the Y direction.
- the even-numbered scanning units U2, U4, U6 are arranged in a line at a predetermined interval along the Y direction on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc.
- the odd-numbered scanning units U1, U3, U5 and the even-numbered scanning units U2, U4, U6 are provided symmetrically with respect to the center plane Poc when viewed in the XZ plane.
- Each scanning unit Un projects the beam LB from the light source device LS (LSa, LSb) so as to converge on the spot light SP on the irradiated surface of the substrate P.
- One-dimensional scanning is performed by the rotating polygon mirror PM (see FIG. 5).
- the spot light SP is one-dimensionally scanned on the irradiated surface of the substrate P by the polygon mirror (deflecting member) PM of each of the scanning units Un (U1 to U6).
- the configuration of the scanning unit Un will be described in detail later.
- the scanning unit U1 scans the spot light SP along the drawing line SL1, and similarly, the scanning units U2 to U6 scan the spot light SP along the drawing lines SL2 to SL6.
- the drawing lines SLn (SL1 to SL6) of the plurality of scanning units Un (U1 to U6) are not separated from each other in the Y direction (the width direction of the substrate P, the main scanning direction), as shown in FIGS. , Are set to be spliced.
- the beam LB from the light source device LS (LSa, LSb) that enters the scanning unit Un via the beam switching unit BDU may be represented as LBn.
- the beam LBn incident on the scanning unit U1 may be represented by LB1, and similarly, the beam LBn incident on the scanning units U2 to U6 may be represented by LB2 to LB6.
- the drawing lines SLn (SL1 to SL6) indicate the scanning trajectory of the spot light SP of the beam LBn (LB1 to LB6) scanned by the scanning unit Un (U1 to U6).
- the beam LBn incident on the scanning unit Un may be a linearly polarized beam (P-polarized light or S-polarized light) polarized in a predetermined direction, and is a P-polarized beam in the first embodiment.
- each of the scanning units Un (U1 to U6) shares the scanning area so that the plurality of scanning units Un (U1 to U6) cover all of the exposed area W in the width direction. is doing. Accordingly, each scanning unit Un (U1 to U6) can draw a pattern for each of a plurality of regions (drawing ranges) divided in the width direction of the substrate P.
- the width in the Y direction that can be drawn is increased to about 120 to 360 mm.
- the length of each drawing line SLn (SL1 to SL6) (length of the drawing range) is the same. That is, the scanning distance of the spot light SP of the beam LBn scanned along each of the drawing lines SL1 to SL6 is basically the same.
- the width of the exposed region W can be increased by increasing the length of the drawing line SLn itself or increasing the number of scanning units Un arranged in the Y direction.
- the actual drawing lines SLn are set slightly shorter than the maximum length (maximum scanning length) that the spot light SP can actually scan on the irradiated surface.
- the scanning length of the drawing line SLn on which pattern drawing is possible is 30 mm when the drawing magnification in the main scanning direction (Y direction) is an initial value (no magnification correction)
- the maximum scanning on the irradiated surface of the spot light SP The length is set to about 31 mm with a margin of about 0.5 mm on each of the drawing start point (scanning start point) side and the drawing end point (scanning end point) side of the drawing line SLn.
- the maximum scanning length of the spot light SP is not limited to 31 mm, and is mainly determined by the aperture of the f ⁇ lens FT (see FIG. 5) provided after the polygon mirror (rotating polygon mirror) PM in the scanning unit Un.
- the plurality of drawing lines SLn are arranged in a staggered arrangement in two rows in the circumferential direction of the rotary drum DR with the center surface Poc interposed therebetween.
- the odd-numbered drawing lines SL1, SL3, and SL5 are positioned on the irradiated surface of the substrate P on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P with respect to the center plane Poc.
- the even-numbered drawing lines SL2, SL4, and SL6 are positioned on the irradiated surface of the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc.
- the drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate P, that is, the central axis AXo of the rotary drum DR.
- the drawing lines SL1, SL3, and SL5 are arranged in a line on a straight line at a predetermined interval along the width direction (main scanning direction) of the substrate P.
- the drawing lines SL2, SL4, and SL6 are arranged in a line on the straight line at a predetermined interval along the width direction (main scanning direction) of the substrate P.
- the drawing line SL2 is arranged between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate P.
- the drawing line SL3 is arranged between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate P.
- the drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 with respect to the width direction of the substrate P, and the drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 with respect to the width direction of the substrate P.
- the plurality of drawing lines SLn (SL1 to SL6) are arranged so as to be shifted from each other in the Y direction (main scanning direction).
- the main scanning direction of the spot light SP of the beams LB1, LB3, LB5 scanned along each of the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction and is the same direction.
- the main scanning direction of the spot light SP of the beams LB2, LB4, and LB6 scanned along the even-numbered drawing lines SL2, SL4, and SL6 is a one-dimensional direction and is the same direction.
- the main scanning direction of the spot light SP may be opposite to each other.
- the main scanning direction of the spot light SP of the beams LB1, LB3, LB5 scanned along the drawing lines SL1, SL3, SL5 is the -Y direction.
- the main scanning direction of the spot light SP of the beams LB2, LB4, and LB6 scanned along the drawing lines SL2, SL4, and SL6 is the + Y direction.
- the end of the drawing lines SL3 and SL5 on the drawing end point side and the end of the drawing lines SL2 and SL4 on the drawing end point side are adjacent or partially overlap in the Y direction.
- each drawing line SLn so that the ends of the drawing lines SLn adjacent in the Y direction partially overlap, for example, the drawing start point or the drawing end with respect to the length of each drawing line SLn It is preferable to overlap within a range of several percent or less in the Y direction including points.
- joining the drawing lines SLn in the Y direction means that the ends of the drawing lines SLn are adjacent (closely) or partially overlapped in the Y direction.
- the width (dimension in the X direction) of the drawing line SLn in the sub-scanning direction is a thickness corresponding to the size (diameter) ⁇ of the spot light SP.
- the width of the drawing line SLn is also 3 ⁇ m.
- the spot light SP may be projected along the drawing line SLn so as to overlap by a predetermined length (for example, 1 ⁇ 2 of the size ⁇ of the spot light SP).
- drawing lines SLn for example, the drawing line SL1 and the drawing line SL2 adjacent in the Y direction are connected to each other, they are overlapped by a predetermined length (for example, 1 ⁇ 2 of the size ⁇ of the spot light SP). It is good.
- the spot light SP projected onto the drawing line SLn during main scanning Is discrete according to the oscillation frequency Fa (for example, 400 MHz) of the beam LB (LBa, LBb). Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the beam LB and the spot light SP projected by the next one pulse light in the main scanning direction.
- the amount of overlap is set by the size ⁇ of the spot light SP, the scanning speed (main scanning speed) Vs of the spot light SP, and the oscillation frequency Fa of the beam LB.
- the effective size ⁇ of the spot light SP is determined by 1 / e 2 (or 1/2) of the peak intensity of the spot light SP when the intensity distribution of the spot light SP is approximated by a Gaussian distribution.
- the scanning speed Vs and the oscillation frequency Fa of the spot light SP are set so that the spot light SP overlaps by about ⁇ ⁇ 1 ⁇ 2 with respect to the effective size (dimension) ⁇ . Is done. Therefore, the projection interval of the spot light SP along the main scanning direction is ⁇ / 2. Therefore, also in the sub-scanning direction (direction orthogonal to the drawing line SLn), the substrate P is effective for the spot light SP between one scanning of the spot light SP along the drawing line SLn and the next scanning.
- the exposure amount to the photosensitive functional layer on the substrate P can be set by adjusting the peak value of the beam LB (pulse light). However, the exposure amount can be increased in a situation where the intensity of the beam LB cannot be increased.
- the spot light SP is caused to fall by the decrease in the scanning speed Vs of the spot light SP in the main scanning direction, the increase in the oscillation frequency Fa of the beam LB, or the decrease in the transport speed Vt of the substrate P in the sub-scanning direction.
- the overlap amount in the main scanning direction or the sub-scanning direction may be increased.
- the scanning speed Vs of the spot light SP in the main scanning direction increases in proportion to the rotational speed (rotational speed Vp) of the polygon mirror PM.
- Each scanning unit Un (U1 to U6) irradiates each beam LBn toward the substrate P so that each beam LBn travels toward the central axis AXo of the rotating drum DR at least in the XZ plane.
- the optical path (beam central axis) of the beam LBn traveling from each scanning unit Un (U1 to U6) toward the substrate P becomes parallel to the normal line of the irradiated surface of the substrate P in the XZ plane.
- each scanning unit Un (U1 to U6) is configured such that the beam LBn irradiated to the drawing line SLn (SL1 to SL6) is perpendicular to the irradiated surface of the substrate P in a plane parallel to the YZ plane.
- the beam LBn is irradiated toward the substrate P. That is, the beam LBn (LB1 to LB6) projected onto the substrate P is scanned in a telecentric state with respect to the main scanning direction of the spot light SP on the irradiated surface.
- a line perpendicular to the irradiated surface of the substrate P also called an optical axis
- SLn SL1 to SL6
- Un U1 to U6
- Each irradiation center axis Len (Le1 to Le6) is a line connecting the drawing lines SL1 to SL6 and the center axis AXo on the XZ plane.
- the irradiation center axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 are in the same direction in the XZ plane, and the irradiation center axes Le2 of the even-numbered scanning units U2, U4, U6. , Le4 and Le6 are in the same direction in the XZ plane.
- irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set such that the angle is ⁇ ⁇ 1 with respect to the center plane Poc in the XZ plane (see FIG. 2).
- a plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) shown in FIG. 2 are for detecting a plurality of alignment marks MKm (MK1 to MK4) formed on the substrate P shown in FIG. And a plurality (four in the first embodiment) are provided along the Y direction.
- the plurality of alignment marks MKm (MK1 to MK4) is a reference for relatively aligning (aligning) the predetermined pattern drawn on the exposed area W on the irradiated surface of the substrate P with the substrate P. Mark.
- a plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are arranged on the substrate P supported by the outer peripheral surface (circumferential surface) of the rotating drum DR, and a plurality of alignment marks MKm (MK1 to MK4). Is detected.
- the plurality of alignment microscopes AM1m (AM11 to AM14) are more than the irradiated area (area surrounded by the drawing lines SL1 to SL6) on the substrate P by the spot light SP of the beam LBn (LB1 to LB6) from the exposure head 14. It is provided on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P.
- the plurality of alignment microscopes AM2m are irradiated from an irradiation area (area surrounded by the drawing lines SL1 to SL6) on the substrate P by the spot light SP of the beam LBn (LB1 to LB6) from the exposure head 14. Is also provided on the downstream side (+ X direction side) in the transport direction of the substrate P.
- the alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are a local region (observation region) Vw1m (Vw11) including a light source that projects illumination light for alignment onto the substrate P and an alignment mark MKm on the surface of the substrate P.
- Vw1m Vw11
- Vw2m Vw21 to Vw24
- an observation optical system including an objective lens
- the transport speed Vt of the substrate P is increased.
- an image pickup device such as a CCD or a CMOS for picking up an image with a corresponding high-speed shutter.
- Imaging signals (image data) captured by each of the plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are sent to the control device 16.
- the mark position detection unit 106 (see FIG. 9) of the control device 16 performs image analysis of the plurality of image signals that have been sent, so that the position of the alignment mark MKm (MK1 to MK4) on the substrate P (mark position). Information).
- the illumination light for alignment is light in a wavelength region that has little sensitivity to the photosensitive functional layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.
- a plurality of alignment marks MK1 to MK4 are provided around each exposed area W.
- a plurality of alignment marks MK1 and MK4 are formed on both sides of the exposed region W in the width direction of the substrate P at a constant interval Dh along the longitudinal direction of the substrate P.
- the alignment mark MK1 is formed on the ⁇ Y direction side in the width direction of the substrate P
- the alignment mark MK4 is formed on the + Y direction side in the width direction of the substrate P.
- Such alignment marks MK1 and MK4 are located at the same position in the longitudinal direction (X direction) of the substrate P when the substrate P is not deformed due to a large tension or a thermal process. Be placed.
- the alignment marks MK2 and MK3 are between the alignment mark MK1 and the alignment mark MK4, and in the width direction (short direction) of the substrate P in the margin part between the + X direction side and the ⁇ X direction side of the exposed area W. Are formed along.
- the alignment marks MK2 and MK3 are formed between the exposed area W and the exposed area W.
- the alignment mark MK2 is formed on the ⁇ Y direction side in the width direction of the substrate P
- the alignment mark MK3 is formed on the + Y direction side of the substrate P.
- the Y-direction interval between the alignment mark MK1 and the margin alignment mark MK2 arranged at the ⁇ Y direction end of the substrate P, the Y-direction interval between the margin alignment mark MK2 and the alignment mark MK3, and The interval in the Y direction between the alignment mark MK4 arranged at the end on the + Y direction side of the substrate P and the alignment mark MK3 in the margin is set to the same distance.
- These alignment marks MKm (MK1 to MK4) may be formed together when forming the first pattern layer. For example, when the pattern of the first layer is exposed, the alignment mark pattern may be exposed around the exposed area W where the pattern is exposed. The alignment mark MKm may be formed in the exposed area W. For example, it may be formed in the exposed area W along the contour of the exposed area W. Further, a pattern portion at a specific position or a specific shape portion in the pattern of the electronic device formed in the exposed region W may be used as the alignment mark MKm.
- Alignment microscopes AM11 and AM21 are arranged so as to image alignment marks MK1 existing in observation regions (detection regions) Vw11 and Vw21 by the objective lens, as shown in FIG.
- the alignment microscopes AM12 to AM14 and AM22 to AM24 are arranged so as to image the alignment marks MK2 to MK4 existing in the observation areas Vw12 to Vw14 and Vw22 to Vw24 by the objective lens.
- the plurality of alignment microscopes AM11 to AM14 and AM21 to AM24 correspond to the positions of the plurality of alignment marks MK1 to MK4, and the substrates P in the order of AM11 to AM14 and AM21 to AM24 from the ⁇ Y direction side of the substrate P. It is provided along the width direction.
- the observation region Vw2m (Vw21 to Vw24) of the alignment microscope AM2m (AM21 to AM24) is not shown.
- the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw1m (Vw11 to Vw14) in the X direction is longer than the length of the exposed region W in the X direction. It is provided to be shorter.
- the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw2m (Vw21 to Vw24) in the X direction is the length of the exposed region W in the X direction. It is provided to be shorter.
- the number of alignment microscopes AM1m and AM2m provided in the Y direction can be changed according to the number of alignment marks MKm formed in the width direction of the substrate P.
- the sizes of the observation regions Vw1m (Vw11 to Vw14) and Vw2m (Vw21 to Vw24) on the irradiated surface of the substrate P are set according to the size of the alignment marks MK1 to MK4 and the alignment accuracy (position measurement accuracy). However, it is about 100 to 500 ⁇ m square.
- scale portions SDa and SDb having scales formed in an annular shape over the entire circumferential direction of the outer peripheral surface of the rotary drum DR are provided at both ends of the rotary drum DR.
- the scale portions SDa and SDb are diffraction gratings in which concave or convex lattice lines are engraved at a constant pitch (for example, 20 ⁇ m) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are configured as incremental scales.
- the scale portions SDa and SDb rotate integrally with the rotary drum DR around the central axis AXo.
- Encoders ENja and ENjb optically detect the rotational angle position of the rotary drum DR.
- Four encoders ENja (EN1a, EN2a, EN3a, EN4a) are provided so as to face the scale part SDa provided at the end of the rotary drum DR on the ⁇ Y direction side.
- four encoders ENjb (EN1b, EN2b, EN3b, EN4b) are provided so as to face the scale part SDb provided at the end on the + Y direction side of the rotary drum DR.
- the encoders EN1a and EN1b are provided on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P with respect to the center plane Poc, and are disposed on the installation direction line Lx1 (see FIGS. 2 and 3).
- the installation azimuth line Lx1 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN1a and EN1b and the central axis AXo on the XZ plane.
- the installation orientation line Lx1 is a line connecting the observation region Vw1m (Vw11 to Vw14) of each alignment microscope AM1m (AM11 to AM14) and the central axis AXo on the XZ plane. That is, a plurality of alignment microscopes AM1m (AM11 to AM14) are also arranged on the installation direction line Lx1.
- the encoders EN2a and EN2b are provided on the upstream side ( ⁇ X direction side) in the transport direction of the substrate P with respect to the center plane Poc, and further downstream in the transport direction of the substrate P (+ X direction) from the encoders EN1a and EN1b. Side).
- the encoders EN2a and EN2b are disposed on the installation direction line Lx2 (see FIGS. 2 and 3).
- the installation azimuth line Lx2 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN2a and EN2b and the central axis AXo on the XZ plane.
- the installation azimuth line Lx2 overlaps with the irradiation center axes Le1, Le3, Le5 at the same angular position in the XZ plane.
- the encoders EN3a and EN3b are provided on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc, and are disposed on the installation direction line Lx3 (see FIGS. 2 and 3).
- the installation azimuth line Lx3 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN3a and EN3b and the central axis AXo on the XZ plane.
- This installation orientation line Lx3 overlaps with the irradiation center axes Le2, Le4, and Le6 at the same angular position in the XZ plane. Therefore, the installation azimuth line Lx2 and the installation azimuth line Lx3 are set so that the angle is ⁇ ⁇ 1 with respect to the center plane Poc in the XZ plane (see FIG. 2).
- Encoders EN4a and EN4b are provided on the downstream side (+ X direction side) in the transport direction of the substrate P from the encoders EN3a and EN3b, and are arranged on the installation direction line Lx4 (see FIG. 2).
- the installation azimuth line Lx4 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN4a and EN4b and the central axis AXo on the XZ plane.
- the installation direction line Lx4 is a line connecting the observation region Vw2m (Vw21 to Vw24) of each alignment microscope AM2m (AM21 to AM24) and the central axis AXo on the XZ plane.
- a plurality of alignment microscopes AM2m are also arranged on the installation direction line Lx4.
- the installation azimuth line Lx1 and the installation azimuth line Lx4 are set such that the angle is ⁇ ⁇ 2 with respect to the center plane Poc in the XZ plane (see FIG. 2).
- Each encoder ENja (EN1a to EN4a), ENjb (EN1b to EN4b) projects a measurement light beam toward the scale portions SDa and SDb, and detects the reflected light beam (diffracted light) to detect a pulse signal. Is output to the control device 16.
- the rotational position detector 108 (see FIG. 9) of the control device 16 counts the detection signal (pulse signal), thereby measuring the rotational angular position and angular change of the rotary drum DR with submicron resolution. From the change in the angle of the rotating drum DR, the transport speed Vt of the substrate P can also be measured.
- the rotational position detector 108 individually counts detection signals from the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b).
- the rotational position detection unit 108 includes a plurality of counter circuits CNja (CN1a to CN4a) and CNjb (CN1b to CN4b).
- the counter circuit CN1a counts the detection signal from the encoder EN1a
- the counter circuit CN1b counts the detection signal from the encoder EN1b.
- the counter circuits CN2a to CN4a and CN2b to CN4b count detection signals from the encoders EN2a to EN4a and EN2b to EN4b.
- Each of the counter circuits CNja (CN1a to CN4a) and CNjb (CN1b to CN4b) has encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) formed in a part of the circumferential direction of the scale portions SDa and SDb.
- the count values corresponding to the encoders ENja and ENjb that have detected the origin mark ZZ are reset to zero.
- One of the count values of the counter circuits CN1a and CN1b or the average value thereof is used as the rotation angle position of the rotary drum DR on the installation direction line Lx1, and either one of the count values of the counter circuits CN2a and CN2b or the average The value is used as the rotation angle position of the rotary drum DR on the installation direction line Lx2.
- one or the average value of the count values of the counter circuits CN3a and CN3b is used as the rotation angle position of the rotary drum DR on the installation direction line Lx3, and either one of the count values of the counter circuits CN4a and CN4b or The average value is used as the rotation angle position of the rotary drum DR on the installation direction line Lx4.
- the count values of the counter circuits CN1a and CN1b are the same except when the rotary drum DR rotates eccentrically with respect to the central axis AXo due to a manufacturing error of the rotary drum DR.
- the count values of the counter circuits CN2a and CN2b are the same, and the count values of the counter circuits CN3a and CN3b and the count values of the counter circuits CN4a and CN4b are also the same.
- alignment microscope AM1m (AM11 to AM14) and encoders EN1a and EN1b are arranged on installation orientation line Lx1
- alignment microscope AM2m (AM21 to AM24) and encoders EN4a and EN4b are installation orientation lines Lx4. Is placed on top. Therefore, the position detection of the alignment mark MKm (MK1 to MK4) by the image analysis of the mark position detection unit 106 of the plurality of imaging signals picked up by the plurality of alignment microscopes AM1m (AM11 to AM14) and the moment when the alignment microscope AM1m picks up the image.
- the position of the substrate P on the installation orientation line Lx1 can be measured with high accuracy based on the information on the rotational angle position of the rotary drum DR (the count value based on the encoders EN1a and EN1b).
- the position detection of the alignment mark MKm MK1 to MK4 by the image analysis of the mark position detection unit 106 of the plurality of imaging signals captured by the plurality of alignment microscopes AM2m (AM21 to AM24), and the moment when the alignment microscope AM2m images
- the position of the substrate P on the installation orientation line Lx4 can be measured with high accuracy based on the information on the rotational angle position of the rotary drum DR (the count value based on the encoders EN4a and EN4b).
- the count values of the detection signals from the encoders EN1a and EN1b, the count values of the detection signals from the encoders EN2a and EN2b, the count values of the detection signals from the encoders EN3a and EN3b, and the detection signals from the encoders EN4a and EN4b The count value is reset to zero at the moment when each encoder ENja, ENjb detects the origin mark ZZ. Therefore, when the position on the installation orientation line Lx1 of the substrate P wound around the rotary drum DR when the count value based on the encoders EN1a and EN1b is the first value (for example, 100) is the first position.
- the count value based on the encoders EN2a, EN2b is the first value (for example, , 100).
- the count value of the detection signal based on the encoders EN3a, EN3b is the first. (For example, 100).
- the count value of the detection signal based on the encoders EN4a and EN4b becomes the first value (for example, 100).
- the substrate P is wound inside the scale portions SDa and SDb at both ends of the rotary drum DR.
- the radius from the central axis AXo of the outer peripheral surface of the scale portions SDa and SDb is set smaller than the radius from the central axis AXo of the outer peripheral surface of the rotary drum DR.
- the outer peripheral surfaces of the scale portions SDa and SDb may be set so as to be flush with the outer peripheral surface of the substrate P wound around the rotary drum DR.
- the radius (distance) from the central axis AXo of the outer peripheral surfaces of the scale portions SDa and SDb and the radius (distance) from the central axis AXo of the outer peripheral surface (irradiated surface) of the substrate P wound around the rotary drum DR May be set to be the same.
- each of the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) can detect the scale portions SDa and SDb at the same radial position as the irradiated surface of the substrate P wound around the rotary drum DR. . Therefore, the Abbe error caused by the difference between the measurement positions by the encoders ENja and ENjb and the processing positions (drawing lines SL1 to SL6) in the radial direction of the rotary drum DR can be reduced.
- the radius of the outer peripheral surface of the scale portions SDa and SDb and the outer peripheral surface of the substrate P wound around the rotary drum DR are different. It is difficult to always make the radius the same. Therefore, in the case of the scale portions SDa and SDb shown in FIG. 3, the radius of the outer peripheral surface (scale surface) is set to coincide with the radius of the outer peripheral surface of the rotary drum DR. Furthermore, the scale portions SDa and SDb can be formed of individual disks, and the disks (scale disks) can be coaxially attached to the shaft Sft of the rotary drum DR. Even in this case, it is preferable to align the radius of the outer peripheral surface (scale surface) of the scale disk and the radius of the outer peripheral surface of the rotary drum DR so that the Abbe error falls within the allowable value.
- the starting position of the drawing exposure of the exposed area W in the longitudinal direction (X direction) of the substrate P is determined by the control device 16 based on any one or the average value. Since the length in the X direction of the exposure area W is known in advance, the control device 16 determines the drawing exposure start position every time a predetermined number of alignment marks MKm (MK1 to MK4) are detected.
- the drawing exposure start position of the exposure area W in the longitudinal direction of the substrate P is located on the drawing lines SL1, SL3, SL5. Accordingly, the scanning units U1, U3, and U5 can start scanning the spot light SP based on the count values of the encoders EN2a and EN2b.
- the drawing exposure start position of the exposure area W in the longitudinal direction of the substrate P is on the drawing lines SL2, SL4, and SL6. To position. Therefore, the scanning units U2, U4, and U6 can start scanning the spot light SP based on the count values of the encoders EN3a and EN3b.
- the tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P in the longitudinal direction, so that the substrate P is in close contact with the rotating drum DR and is rotated along with the rotation of the rotating drum DR. It is conveyed. However, because the rotational speed Vp of the rotating drum DR is high, or the tension applied to the substrate P by the tension adjusting rollers RT1 and RT2 is too low or too high, the substrate P slips with respect to the rotating drum DR. May occur.
- the encoders EN1a and EN1b at the moment when the alignment microscope AM1m images the alignment mark MKmA (a specific alignment mark MKm) based on the count value based on the encoders EN4a and 4b.
- the count value is the same as the count value based on (for example, 150)
- this alignment mark MKmA is detected by the alignment microscope AM2m.
- the count value based on the encoders EN4a and EN4b is a count value based on the encoders EN1a and EN1b at the moment when the alignment mark AMKm images the alignment mark MKmA (for example, , 150), the alignment mark MKmA is not detected by the alignment microscope AM2m.
- the count value based on the encoders EN4a and EN4b exceeds 150, for example, the alignment mark MKmA is detected by the alignment microscope AM2m.
- the slip amount of the substrate P can be measured by additionally installing the alignment microscope AM2m and the encoders EN4a and EN4b.
- each scanning unit Un (U1 to U6) has the same configuration, only the scanning unit (drawing unit) U1 will be described, and the description of the other scanning units Un will be omitted.
- the direction parallel to the irradiation center axis Len (Le1) is the Zt direction
- the substrate P is on the plane orthogonal to the Zt direction
- the substrate P passes from the processing apparatus PR2 through the exposure apparatus EX to the processing apparatus PR3.
- the direction going to the Xt direction is defined as the Yt direction
- the direction perpendicular to the Xt direction on the plane orthogonal to the Zt direction is defined as the Yt direction.
- the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 5 are the same as the three-dimensional coordinates of X, Y, and Z in FIG. 2, and the Z-axis direction is parallel to the irradiation center axis Len (Le1).
- the three-dimensional coordinates rotated as described above.
- a reflection mirror M10 As shown in FIG. 5, in the scanning unit U1, along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the irradiated surface (substrate P), a reflection mirror M10, a beam expander BE, a reflection mirror M11, Polarization beam splitter BS1, reflection mirror M12, shift optical member (light transmissive parallel plate) SR, deflection adjustment optical member (prism) DP, field aperture FA, reflection mirror M13, ⁇ / 4 wavelength plate QW, cylindrical lens CYa, A reflection mirror M14, a polygon mirror PM, an f ⁇ lens FT, a reflection mirror M15, and a cylindrical lens CYb are provided.
- an origin sensor (origin detector) OP1 that detects the timing at which the scanning unit U1 can start drawing, and reflected light from the irradiated surface (substrate P) are detected via the polarization beam splitter BS1.
- An optical lens system G10 and a photodetector DT are provided.
- the beam LB1 incident on the scanning unit U1 travels in the ⁇ Zt direction and enters the reflection mirror M10 inclined by 45 ° with respect to the XtYt plane.
- the axis of the beam LB1 incident on the scanning unit U1 is incident on the reflection mirror M10 so as to be coaxial with the irradiation center axis Le1.
- the reflection mirror M10 functions as an incident optical member that causes the beam LB1 to enter the scanning unit U1, and the incident beam LB1 is moved from the reflection mirror M10 to the ⁇ Xt direction along the optical axis AXa set parallel to the Xt axis. Reflected in the -Xt direction toward the distant reflecting mirror M11.
- the optical axis AXa is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane.
- the beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE arranged along the optical axis AXa and enters the reflection mirror M11.
- the beam expander BE expands the diameter of the transmitted beam LB1.
- the beam expander BE includes a condensing lens Be1 and a collimating lens Be2 that collimates the beam LB1 that diverges after being converged by the condensing lens Be1.
- the reflection mirror M11 is disposed with an inclination of 45 ° with respect to the YtZt plane, and reflects the incident beam LB1 (optical axis AXa) toward the polarization beam splitter BS1 in the ⁇ Yt direction.
- the polarization separation surface of the polarization beam splitter BS1 disposed away from the reflection mirror M11 in the ⁇ Yt direction is disposed with an inclination of 45 ° with respect to the YtZt plane, reflects the P-polarized beam, and is orthogonal to the P-polarized light. It transmits a linearly polarized (S-polarized) beam polarized in the direction. Since the beam LB1 incident on the scanning unit U1 is a P-polarized beam, the polarization beam splitter BS1 reflects the beam LB1 from the reflection mirror M11 in the -Xt direction and guides it to the reflection mirror M12 side.
- the reflection mirror M12 is disposed with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the ⁇ Zt direction toward the reflection mirror M13 that is separated from the reflection mirror M12 in the ⁇ Zt direction.
- the beam LB1 reflected by the reflection mirror M12 passes through the shift optical member SR, the deflection adjustment optical member DP, and the field aperture (field stop) FA along the optical axis AXc parallel to the Zt axis, and reaches the reflection mirror M13. Incident.
- the shift optical member SR two-dimensionally adjusts the center position in the cross section of the beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction (optical axis AXc) of the beam LB1.
- the shift optical member SR is composed of two quartz parallel plates Sr1 and Sr2 arranged along the optical axis AXc.
- the parallel plate Sr1 can be tilted about the Xt axis, and the parallel plate Sr2 is Yt axis. Can be tilted around.
- the parallel plates Sr1 and Sr2 are inclined about the Xt axis and the Yt axis, respectively, so that the position of the center of the beam LB1 is shifted two-dimensionally by a minute amount on the XtYt plane orthogonal to the traveling direction of the beam LB1.
- the parallel plates Sr1 and Sr2 are driven by an actuator (drive unit) (not shown) under the control of the control device 16.
- the parallel flat plate Sr2 of the shift optical member SR has the spot light SP of the beam LB1 projected onto the substrate P in the sub-scanning direction (X direction in FIG. 4), for example, the size ⁇ of the spot light SP or the pixel size. It functions as a mechanical optical beam position adjusting member (first adjusting member, first adjusting optical member) that shifts within the range of several times to several tens times.
- the deflection adjusting optical member DP finely adjusts the inclination of the beam LB1 reflected by the reflecting mirror M12 and passing through the shift optical member SR with respect to the optical axis AXc.
- the deflection adjusting optical member DP is composed of two wedge-shaped prisms Dp1 and Dp2 arranged along the optical axis AXc, and each of the prisms Dp1 and Dp2 is provided so as to be able to rotate 360 ° about the optical axis AXc. It has been.
- the axis of the beam LB1 reaching the reflecting mirror M13 and the optical axis AXc are made parallel, or the axis of the beam LB1 reaching the irradiated surface of the substrate P and irradiation Parallelism with the central axis Le1 is performed.
- the beam LB1 after the deflection adjustment by the two prisms Dp1 and Dp2 may be laterally shifted in a plane parallel to the cross section of the beam LB1, and the lateral shift is caused by the previous shift optical member SR. Can be returned to.
- the prisms Dp1 and Dp2 are driven by an actuator (drive unit) (not shown) under the control of the control device 16.
- the beam LB1 that has passed through the shift optical member SR and the deflection adjustment optical member DP passes through the circular aperture of the field aperture FA and reaches the reflection mirror M13.
- the circular aperture of the field aperture FA is a stop that cuts (shields) the peripheral portion (bottom portion) of the intensity distribution in the cross section of the beam LB1 expanded by the beam expander BE. If the circular aperture of the field aperture FA is a variable iris diaphragm whose diameter can be adjusted, the intensity (luminance) of the spot light SP can be adjusted.
- the reflection mirror M13 is disposed with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 toward the reflection mirror M14 in the + Xt direction.
- the beam LB1 reflected by the reflection mirror M13 enters the reflection mirror M14 via the ⁇ / 4 wavelength plate QW and the cylindrical lens CYa.
- the reflection mirror M14 reflects the incident beam LB1 toward the polygon mirror (rotating polygonal mirror, scanning deflection member) PM.
- the polygon mirror PM reflects the incident beam LB1 toward the + Xt direction toward the f ⁇ lens FT having the optical axis AXf parallel to the Xt axis.
- the polygon mirror PM deflects (reflects) the incident beam LB1 one-dimensionally in a plane parallel to the XtYt plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate P.
- the polygon mirror PM has a rotation axis AXp extending in the Zt-axis direction and a plurality of reflection surfaces RP formed around the rotation axis AXp (in this embodiment, the number Np of reflection surfaces RP is eight). ).
- the reflection direction of the beam LB1 is deflected by the single reflection surface RP, and the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate P is changed in the main scanning direction (width direction of the substrate P, Yt direction). Can be scanned along.
- the spot light SP of the beam LB1 can be scanned along the main scanning direction by one reflecting surface RP.
- the number of drawing lines SL1 in which the spot light SP is scanned on the irradiated surface of the substrate P by one rotation of the polygon mirror PM is eight, which is the same as the number of the reflecting surfaces RP.
- the polygon mirror PM is rotated at a constant speed by a rotation drive source (for example, a motor, a speed reduction mechanism, etc.) RM under the control of the control device 16.
- the effective length (for example, 30 mm) of the drawing line SL1 is shorter than the maximum scanning length (for example, 31 mm) that allows the spot light SP to be scanned by the polygon mirror PM.
- the center point of the drawing line SL1 (the point through which the irradiation center axis Le1 passes) is set at the center of the maximum scanning length.
- the cylindrical lens CYa converges the incident beam LB1 on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the main scanning direction (rotation direction) of the polygon mirror PM. That is, the cylindrical lens CYa converges the beam LB1 in a slit shape (ellipse shape) extending in a direction parallel to the XtYt plane on the reflection surface RP.
- a slit shape ellipse shape
- the f ⁇ lens (scanning lens system) FT having the optical axis AXf extending in the Xt axis direction projects the beam LB1 reflected by the polygon mirror PM onto the reflection mirror M15 so as to be parallel to the optical axis AXf on the XtYt plane.
- This is a telecentric scan lens.
- the incident angle ⁇ of the beam LB1 to the f ⁇ lens FT changes according to the rotation angle ( ⁇ / 2) of the polygon mirror PM.
- the f ⁇ lens FT projects the beam LB1 to the image height position on the irradiated surface of the substrate P in proportion to the incident angle ⁇ through the reflection mirror M15 and the cylindrical lens CYb.
- the reflection mirror M15 reflects the beam LB1 from the f ⁇ lens FT toward the substrate P in the ⁇ Zt direction so as to pass through the cylindrical lens CYb.
- the beam LB1 projected onto the substrate P is a minute spot light having a diameter of about several ⁇ m (for example, 3 ⁇ m) on the irradiated surface of the substrate P. Converged to SP. Further, the spot light SP projected on the irradiated surface of the substrate P is one-dimensionally scanned by the polygon mirror PM along the drawing line SL1 extending in the Yt direction.
- the optical axis AXf of the f ⁇ lens FT and the irradiation center axis Le1 are on the same plane, and the plane is parallel to the XtZt plane. Therefore, the beam LB1 traveling on the optical axis AXf is reflected in the ⁇ Zt direction by the reflection mirror M15, and is projected on the substrate P coaxially with the irradiation center axis Le1.
- at least the f ⁇ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate P.
- At least the reflecting members (reflecting mirrors M11 to M15) and the polarizing beam splitter BS1 function as an optical path deflecting member that bends the optical path of the beam LB1 from the reflecting mirror M10 to the substrate P.
- the incident axis of the beam LB1 incident on the reflecting mirror M10 and the irradiation center axis Le1 can be made substantially coaxial.
- the beam LB1 passing through the scanning unit U1 passes through a substantially U-shaped or U-shaped optical path, and then travels in the ⁇ Zt direction and is projected onto the substrate P.
- the spot light SP of the beam LBn (LB1 to LB6) is one-dimensionally arranged in the main scanning direction (Y direction) by each scanning unit Un (U1 to U6).
- the spot light SP can be relatively two-dimensionally scanned on the irradiated surface of the substrate P.
- the effective length of the drawing lines SLn (SL1 to SL6) is 30 mm
- the effective size ⁇ is 1/2 of the pulsed spot light SP with 3 ⁇ m, that is, 1.5 ⁇ m.
- the feed speed (transport speed) Vt [mm / sec] of the substrate P in the sub-scanning direction is set to the drawing line SLn.
- the time difference between the scanning start (drawing start) time and the next scanning start time along Tpx [ ⁇ sec] is 1.5 [ ⁇ m] / Tpx [ ⁇ sec].
- the maximum incident angle (corresponding to the maximum scanning length of the spot light SP) at which the beam LB1 reflected by one reflecting surface RP of the polygon mirror PM effectively enters the f ⁇ lens FT is the focal length and the maximum scanning length of the f ⁇ lens FT.
- NA thickness of the beam LB1 incident on one reflecting surface RP of the polygon mirror PM in the main scanning direction.
- NA numerical aperture
- the ratio (scanning efficiency) of the rotation angle ⁇ that contributes to actual scanning out of the rotation angles 45 ° for one reflecting surface RP is expressed as ⁇ / 45 °. Is done.
- the emission frequency (oscillation frequency) Fa of the beam LB from the light source device LS is Fa ⁇ It becomes 20000 / Tsp [ ⁇ sec].
- the origin sensor OP1 shown in FIG. 5 generates an origin signal SZ1 when the rotational position of the reflection surface RP of the polygon mirror PM reaches a predetermined position where the scanning of the spot light SP by the reflection surface RP can be started.
- the origin sensor OP1 generates the origin signal SZ1 when the angle of the reflection surface RP from which the spot light SP is scanned becomes a predetermined angular position. Since the polygon mirror PM has eight reflecting surfaces RP, the origin sensor OP1 outputs the origin signal SZ1 eight times during the period in which the polygon mirror PM rotates once.
- the origin signal SZ1 generated by the origin sensor OP1 is sent to the control device 16.
- the origin signal SZ1 is information indicating the drawing start timing (scanning start timing) of the spot light SP by the scanning unit U1.
- the origin sensor OP1 includes a beam transmission system opa for emitting a laser beam Bga in a wavelength region that is non-photosensitive to the photosensitive functional layer of the substrate P to the reflecting surface RP, and a laser beam Bga reflected by the reflecting surface RP. And a beam receiving system opb that receives the reflected beam Bgb and generates an origin signal SZ1.
- the beam transmission system opa includes a light source that emits a laser beam Bga and an optical member (such as a reflection mirror or a lens) that projects the laser beam Bga emitted from the light source onto the reflection surface RP.
- the beam receiving system opb includes a light receiving unit including a photoelectric conversion element that receives the received reflected beam Bgb and converts it into an electrical signal, and an optical member that guides the reflected beam Bgb reflected by the reflecting surface RP to the light receiving unit. (Reflection mirror, lens, etc.).
- the beam transmission system opa and the beam reception system opb emit the beam transmission system opa when the rotation position of the polygon mirror PM comes to a predetermined position immediately before the scanning of the spot light SP by the reflection surface RP is started.
- the reflected beam Bgb of the laser beam Bga is provided at a position where the beam receiving system opb can receive it.
- the origin sensors OPn provided in the scanning units U2 to U6 are represented by OP2 to OP6, and the origin signals SZn generated by the origin sensors OP2 to OP6 are represented by SZ2 to SZ6.
- the control device 16 Based on the origin signal SZn (SZ1 to SZ6), the control device 16 manages which scanning unit Un will perform scanning of the spot light SP from now on. Further, the delay time Tdn from when the origin signals SZ2 to SZ6 are generated until the scanning of the spot light SP along the drawing lines SL2 to SL6 by the scanning units U2 to U6 may be represented by Td2 to Td6.
- the photodetector DT shown in FIG. 5 has a photoelectric conversion element that photoelectrically converts incident light.
- a predetermined reference pattern is formed on the surface of the rotary drum DR.
- the portion on the rotating drum DR on which the reference pattern is formed is made of a material having a low reflectance (10 to 50%) with respect to the wavelength region of the beam LB1, and on the rotating drum DR on which the reference pattern is not formed.
- the other part is made of a material having a reflectance of 10% or less or a material that absorbs light.
- the reflected light is a cylindrical lens CYb, a reflection mirror M15, an f ⁇ lens FT, a polygon mirror PM, a reflection mirror M14, a cylindrical lens CYa, a ⁇ / 4 wavelength plate QW, a reflection mirror M13, a field aperture FA, a deflection adjusting optical member DP,
- the light passes through the shift optical member SR and the reflection mirror M12 and enters the polarization beam splitter BS1.
- a ⁇ / 4 wavelength plate QW is provided between the polarizing beam splitter BS1 and the substrate P, specifically, between the reflection mirror M13 and the cylindrical lens CYa.
- the beam LB1 irradiated to the substrate P is converted from the P-polarized light to the circularly-polarized beam LB1 by the ⁇ / 4 wavelength plate QW, and the reflected light incident on the polarizing beam splitter BS1 from the substrate P is converted to the ⁇ /
- the circularly polarized light is converted to S polarized light by the four-wavelength plate QW. Accordingly, the reflected light from the substrate P passes through the polarization beam splitter BS1 and enters the photodetector DT via the optical lens system G10.
- the rotating drum DR is rotated and the scanning unit U1 scans the spot light SP.
- the spot light SP is irradiated two-dimensionally. Therefore, the image signal (photoelectric signal corresponding to the reflection intensity) of the reference pattern formed on the rotary drum DR can be acquired by the photodetector DT.
- the change in the intensity of the photoelectric signal output from the photodetector DT is changed in response to a clock signal LTC (made by the light source device LS) for pulse emission of the beam LB1 (spot light SP). By sampling, it is acquired as one-dimensional image data in the Yt direction. Further, in response to the measurement values of the encoders EN2a and EN2b that measure the rotational angle position of the rotary drum DR on the drawing line SL1, every predetermined distance in the sub-scanning direction (for example, 1/2 of the size ⁇ of the spot light SP). By arranging the one-dimensional image data in the Yt direction in the Xt direction, the two-dimensional image information on the surface of the rotary drum DR can be acquired.
- a clock signal LTC made by the light source device LS
- spot light SP spot light SP
- the control device 16 measures the inclination of the drawing line SL1 of the scanning unit U1 based on the acquired two-dimensional image information of the reference pattern of the rotating drum DR.
- the inclination of the drawing line SL1 may be a relative inclination between the scanning units Un (U1 to U6), or may be an inclination (absolute inclination) with respect to the central axis AXo of the rotating drum DR. . It goes without saying that the inclinations of the respective drawing lines SL2 to SL6 can be measured in the same manner.
- the drawing start point and drawing end point of each drawing line SL2 to SL6 can be determined.
- the position error can be confirmed, the joint error of each drawing line SL2 to SL6 can be confirmed, and each scanning unit Un (U1 to U6) can be calibrated.
- the plurality of scanning units Un are not shown so that each of the plurality of scanning units Un (U1 to U6) can rotate (rotate) around the irradiation center axis Len (Le1 to Le6). It is held by the body frame.
- each drawing line SLn (SL1 to SL6) also has an irradiation center axis Len on the irradiated surface of the substrate P. It rotates around (Le1 to Le6). Accordingly, each drawing line SLn (SL1 to SL6) is inclined with respect to the Y direction.
- each scanning unit Un (U1 to U6) rotates around the irradiation center axis Len (Le1 to Le6), the beam LBn (LB1 to LB6) passing through each scanning unit Un (U1 to U6). And the relative positional relationship between the scanning units Un (U1 to U6) and the optical members in each scanning unit Un (U1 to U6) remain unchanged. Accordingly, each scanning unit Un (U1 to U6) can scan the spot light SP along the drawing line SLn (SL1 to SL6) rotated on the irradiated surface of the substrate P.
- the rotation of each scanning unit Un (U1 to U6) about the irradiation center axis Len (Le1 to Le6) is performed by an actuator (not shown) under the control of the control device 16.
- the control device 16 rotates the scanning unit Un (U1 to U6) around the irradiation center axis Len (Le1 to Le6) in accordance with the measured inclination of each drawing line SLn, so that a plurality of drawing lines SLn are obtained.
- the parallel state of (SL1 to SL6) can be maintained. Further, if the substrate P or the exposed area W is distorted (deformed) based on the position of the alignment mark MKm detected using the alignment microscopes AM1m and AM2m, the pattern to be drawn is also distorted accordingly. There is a need.
- each drawing line SLn is slightly inclined with respect to the Y direction in accordance with the distortion (deformation) of the substrate P and the exposed area W.
- the pattern drawn along each drawing line SLn is controlled to expand or contract in accordance with a specified magnification (for example, ppm order), or Each drawing line SLn can be individually controlled to be slightly shifted in the sub-scanning direction (Xt direction in FIG. 5).
- the predetermined allowable range is that the drawing start point (or drawing end point) of the actual drawing line SLn when the scanning unit Un is rotated by the angle ⁇ sm, the irradiation center axis Len, and the rotation center axis are completely set.
- the difference amount from the drawing start point (or drawing end point) of the designed drawing line SLn is the main scanning direction of the spot light SP. Is set to be within a predetermined distance (for example, the size ⁇ of the spot light SP). Even if the optical axis of the beam LBn actually incident on the scanning unit Un does not completely coincide with the rotation center axis of the scanning unit Un, it is sufficient if it is coaxial within the predetermined allowable range.
- FIG. 6 is a configuration diagram of the beam switching unit BDU.
- the beam switching unit BDU includes a plurality of selection optical elements AOMn (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of reflection mirrors M1 to M14, and a plurality of unit side incidence mirrors IM1 to IM6 (IMn). ), A plurality of collimating lenses CL1 to CL6, and absorbers TR1 and TR2.
- the selection optical elements AOMn are transmissive to the beam LB (LBa, LBb) and are acousto-optic modulators (AOMs) driven by ultrasonic signals. is there.
- These optical members (selection optical elements AOM1 to AOM6, condensing lenses CD1 to CD6, reflection mirrors M1 to M14, unit side incidence mirrors IM1 to IM6, collimating lenses CL1 to CL6, and absorbers TR1 and TR2) Is supported by a plate-like support member IUB.
- the support member IUB supports these optical members from above (the + Z direction side) above the plurality of scanning units Un (U1 to U6) (+ Z direction side). Therefore, the support member IUB also has a function of insulating between the selection optical element AOMn (AOM1 to AOM6) serving as a heat source and the plurality of scanning units Un (U1 to U6).
- the beam LBa from the light source device LSa is guided by the reflecting mirrors M1 to M6 so that its optical path is bent into a spiral shape and guided to the absorber TR1.
- the light path LBb from the light source device LSb is also bent into a spiral shape by the reflection mirrors M7 to M14 and guided to the absorber TR2.
- the beam LBa from the light source device LSa travels in the + Y direction in parallel with the Y axis and enters the reflection mirror M1 through the condenser lens CD1.
- the beam LBa reflected in the ⁇ X direction by the reflection mirror M1 passes straight through the first selection optical element AOM1 disposed at the focal position (beam waist position) of the condenser lens CD1, and is parallel again by the collimating lens CL1. It is made a luminous flux and reaches the reflection mirror M2.
- the beam LBa reflected in the + Y direction by the reflection mirror M2 is reflected in the + X direction by the reflection mirror M3 after passing through the condenser lens CD2.
- the beam LBa reflected in the + X direction by the reflection mirror M3 passes straight through the second selection optical element AOM2 disposed at the focal position (beam waist position) of the condenser lens CD2, and is parallel again by the collimating lens CL2. It is made a luminous flux and reaches the reflection mirror M4.
- the beam LBa reflected in the + Y direction by the reflection mirror M4 passes through the condenser lens CD3 and then is reflected in the ⁇ X direction by the reflection mirror M5.
- the beam LBa reflected in the ⁇ X direction by the reflecting mirror M5 passes straight through the third selection optical element AOM3 disposed at the focal position (beam waist position) of the condenser lens CD3, and is again reflected by the collimating lens CL3.
- the light beam is converted into a parallel light beam and reaches the reflection mirror M6.
- the beam LBa reflected in the + Y direction by the reflection mirror M6 enters the absorber TR1.
- the absorber TR1 is an optical trap that absorbs the beam LBa in order to suppress leakage of the beam LBa to the outside.
- a beam LBb (for example, a parallel light beam having a diameter of 1 mm or less) from the light source device LSb travels in the + Y direction parallel to the Y axis and enters the reflection mirror M13, and the beam LBb reflected by the reflection mirror M13 in the + X direction is the reflection mirror. Reflected in the + Y direction at M14. The beam LBb reflected in the + Y direction by the reflection mirror M14 is reflected in the + X direction by the reflection mirror M7 after passing through the condenser lens CD4.
- the beam LBb reflected in the + X direction by the reflection mirror M7 is transmitted straight through the fourth selection optical element AOM4 disposed at the focal position (beam waist position) of the condenser lens CD4, and parallel again by the collimating lens CL4. It is made a luminous flux and reaches the reflection mirror M8.
- the beam LBb reflected in the + Y direction by the reflection mirror M8 passes through the condenser lens CD5 and then is reflected in the ⁇ X direction by the reflection mirror M9.
- the beam LBb reflected in the ⁇ X direction by the reflecting mirror M9 passes straight through the fifth selection optical element AOM5 disposed at the focal position (beam waist position) of the condenser lens CD5, and is again reflected by the collimating lens CL5. It is made a parallel light beam and reaches the reflection mirror M10.
- the beam LBb reflected in the + Y direction by the reflection mirror M10 passes through the condenser lens CD6 and then is reflected in the + X direction by the reflection mirror M11.
- the beam LBb reflected in the + X direction by the reflecting mirror M11 passes straight through the sixth selection optical element AOM6 disposed at the focal position (beam waist position) of the condenser lens CD6, and is parallel again by the collimating lens CL6.
- the absorber TR2 is an optical trap that absorbs the beam LBb in order to suppress leakage of the beam LBb to the outside.
- the optical elements for selection AOM1 to AOM3 are arranged in series along the traveling direction of the beam LBa so as to sequentially transmit the beam LBa from the light source device LSa.
- the selection optical elements AOM1 to AOM3 are arranged so that the beam waist of the beam LBa is formed inside the selection optical elements AOM1 to AOM3 by the condensing lenses CD1 to CD3 and the collimating lenses CL1 to CL3.
- the diameter of the beam LBa incident on the selection optical elements (acousto-optic modulation elements) AOM1 to AOM3 is reduced to increase the diffraction efficiency and improve the responsiveness.
- the selection optical elements AOM4 to AOM6 are arranged in series along the traveling direction of the beam LBb so as to sequentially transmit the beam LBb from the light source device LSb.
- the selection optical elements AOM4 to AOM6 are arranged such that the beam waist of the beam LBb is formed inside each of the selection optical elements AOM4 to AOM6 by the condensing lenses CD4 to CD6 and the collimating lenses CL4 to CL6.
- the diameter of the beam LBb incident on the selection optical elements (acousto-optic modulation elements) AOM4 to AOM6 is reduced to increase the diffraction efficiency and improve the response.
- Each of the selection optical elements AOMn (AOM1 to AOM6), when an ultrasonic signal (high frequency signal) is applied, the incident beam (0th order light) LB (LBa, LBb) is converted into a diffraction angle corresponding to the high frequency.
- the first-order diffracted light diffracted in (2) is generated as an exit beam (beam LBn).
- beams LBn emitted as first-order diffracted light from each of the plurality of selection optical elements AOMn (AOM1 to AOM6) are referred to as beams LB1 to LB6, and each of the selection optical elements AOMn (AOM1 to AOM6).
- the generation efficiency of the first-order diffracted light is about 80% of the zero-order light, so that the beams LBn (LB1 to LB1) deflected by the respective selection optical elements AOMn (AOM1 to AOM6) LB6) is lower than the intensity of the original beam LB (LBa, LBb).
- any one of the optical elements for selection AOMn (AOM1 to AOM6) is in the ON state, about 20% of 0th-order light traveling straight without being diffracted remains, which is finally absorbed by the absorbers TR1 and TR2. Is done.
- each of the plurality of optical elements for selection AOMn applies a beam LBn (LB1 to LB6), which is a deflected first-order diffracted light, to an incident beam LB (LBa, LBb).
- LBn LB1 to LB6
- Beams LBn (LB1 to LB6) deflected and emitted from each of the selection optical elements AOMn (AOM1 to AOM6) are provided at positions separated from each of the selection optical elements AOMn (AOM1 to AOM6) by a predetermined distance.
- the light is projected onto the unit-side incident mirrors IM1 to IM6, and is reflected so as to be coaxial with the irradiation center axes Le1 to Le6 in the ⁇ Z direction.
- the beams LB1 to LB6 reflected by the unit side incident mirrors IM1 to IM6 (hereinafter also simply referred to as mirrors IM1 to IM6) pass through each of the openings TH1 to TH6 formed in the support member IUB, and the irradiation center axis Le1. Are incident on each of the scanning units Un (U1 to U6) along the lines Le6.
- the optical element for selection AOMn is a diffraction grating that causes a periodic coarse / fine change in refractive index in a predetermined direction in the transmission member by ultrasonic waves
- the incident beam LB (LBa, LBb) is linearly polarized light (P-polarized light).
- the polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of the first-order diffracted light is the highest. As shown in FIG.
- the polarization direction of the beam LB from the light source device LS (LSa, LSb) is set (adjusted) so as to match with the ⁇ Z direction.
- the same optical elements AOMn (AOM1 to AOM6) for selection, configurations, functions, operations, and the like may be used.
- the plurality of optical elements for selection AOMn (AOM1 to AOM6) generate diffracted light by diffracting the incident beam LB (LBa, LBb) in accordance with on / off of a drive signal (high frequency signal) from the control device 16. Turn on / off. For example, when the driving optical signal (high frequency signal) from the control device 16 is not applied and the selection optical element AOM1 is in an off state, the selection optical element AOM1 transmits the incident beam LBa from the light source device LSa without diffracting it.
- the beam LBa transmitted through the selection optical element AOM1 is transmitted through the collimator lens CL1 and enters the reflection mirror M2.
- the selection optical element AOM1 diffracts the incident beam LBa and directs it to the mirror IM1 when the drive signal (high frequency signal) from the control device 16 is applied and turned on. That is, the selection optical element AOM1 is switched by this drive signal.
- the mirror IM1 selects the beam LB1, which is the first-order diffracted light diffracted by the selection optical element AOM1, and reflects it to the scanning unit U1 side.
- the beam LB1 reflected by the selection mirror IM1 enters the scanning unit U1 along the irradiation center axis Le1 through the opening TH1 of the support member IUB. Therefore, the mirror IM1 reflects the incident beam LB1 so that the optical axis of the reflected beam LB1 is coaxial with the irradiation center axis Le1.
- the selection optical element AOM1 When the selection optical element AOM1 is in the ON state, the 0th-order light (intensity of about 20% of the incident beam) of the beam LB that is transmitted straight through the selection optical element AOM1 is transmitted to the subsequent collimating lenses CL1 to CL3, The light passes through the condenser lenses CD2 to CD3, the reflection mirrors M2 to M6, and the selection optical elements AOM2 to AOM3, and reaches the absorber TR1.
- the selection optical elements AOM2 and AOM3 are collimated without diffracting the incident beam LBa (0th-order light) when the drive signal (high-frequency signal) from the control device 16 is not applied and is turned off.
- the light passes through the lenses CL2 and CL3 (the reflection mirrors M4 and M6).
- the selection optical elements AOM2 and AOM3 are directed to the mirrors IM2 and IM3 by directing the beams LB2 and LB3, which are the first-order diffracted light of the incident beam LBa, when the drive signal from the control device 16 is applied and turned on. Dodge.
- the mirrors IM2 and IM3 reflect the beams LB2 and LB3 diffracted by the selection optical elements AOM2 and AOM3 toward the scanning units U2 and U3.
- the beams LB2 and LB3 reflected by the mirrors IM2 and IM3 enter the scanning units U2 and U3 through the openings TH2 and TH3 of the support member IUB and coaxial with the irradiation center axes Le2 and Le3.
- control device 16 turns on / off (high / low) the drive signals (high-frequency signals) to be applied to the selection optical elements AOM1 to AOM3, whereby the selection optical elements AOM1 to AOM3. Either one is switched and the beam LBa goes to the subsequent selection optical element AOM2, AOM3 or absorber TR1, or one of the deflected beams LB1 to LB3 goes to the corresponding scanning unit U1 to U3 Switch.
- the selection optical element AOM4 when the selection optical element AOM4 is in an OFF state without being applied with a drive signal (high frequency signal) from the control device 16, the beam LBb from the incident light source device LSb is not diffracted and the collimating lens CL4 side. The light passes through the reflection mirror M8.
- the selection optical element AOM4 directs the beam LB4, which is the first-order diffracted light of the incident beam LBb, to the mirror IM4 when the drive signal from the control device 16 is applied and turned on.
- the mirror IM4 reflects the beam LB4 diffracted by the selection optical element AOM4 toward the scanning unit U4.
- the beam LB4 reflected by the mirror IM4 is coaxial with the irradiation center axis Le4 and enters the scanning unit U4 through the opening TH4 of the support member IUB.
- the selection optical elements AOM5 and AOM6 when the selection optical elements AOM5 and AOM6 are in an off state without being applied with a drive signal (high frequency signal) from the control device 16, they do not diffract the incident beam LBb and are on the collimating lens CL5 and CL6 side. The light passes through the reflection mirrors M10 and M12. On the other hand, the selection optical elements AOM5 and AOM6 direct the beams LB5 and LB6, which are the first-order diffracted light of the incident beam LBb, to the mirrors IM5 and IM6 when the drive signal from the control device 16 is applied and turned on. .
- the mirrors IM5 and IM6 reflect the beams LB5 and LB6 diffracted by the selection optical elements AOM5 and AOM6 toward the scanning units U5 and U6.
- the beams LB5 and LB6 reflected by the mirrors IM5 and IM6 are coaxial with the irradiation center axes Le5 and Le6 and enter the scanning units U5 and U6 through the openings TH5 and TH6 of the support member IUB.
- control device 16 turns on / off (high / low) the drive signals (high-frequency signals) to be applied to the selection optical elements AOM4 to AOM6, whereby the selection optical elements AOM4 to AOM6. Either one of them is switched so that the beam LBb goes to the subsequent selection optical element AOM5, AOM6 or absorber TR2, or one of the deflected beams LB4 to LB6 goes to the corresponding scanning unit U4 to U6 Switch.
- the beam switching unit BDU includes the plurality of selection optical elements AOMn (AOM1 to AOM3) arranged in series along the traveling direction of the beam LBa from the light source device LSa, so that the optical path of the beam LBa Can be switched to select one scanning unit Un (U1 to U3) on which the beam LBn (LB1 to LB3) is incident. Accordingly, the beams LBn (LB1 to LB3), which are the first-order diffracted lights of the beam LBa from the light source device LSa, can be sequentially incident on each of the three scanning units Un (U1 to U3).
- the control device 16 when it is desired to make the beam LB1 incident on the scanning unit U1, the control device 16 turns on only the selection optical element AOM1 among the plurality of selection optical elements AOM1 to AOM3, and applies the beam LB3 to the scanning unit U3. If it is desired to make the light incident, only the selection optical element AOM3 needs to be turned on.
- the beam switching unit BDU includes a plurality of optical elements for selection AOMn (AOM4 to AOM6) arranged in series along the traveling direction of the beam LBb from the light source device LSb, thereby switching the optical path of the beam LBb.
- AOM4 to AOM6 a plurality of optical elements for selection AOMn (AOM4 to AOM6) arranged in series along the traveling direction of the beam LBb from the light source device LSb, thereby switching the optical path of the beam LBb.
- the control device 16 turns on only the selection optical element AOM4 among the plurality of selection optical elements AOM4 to AOM6, and applies the beam LB6 to the scanning unit U6. If it is desired to make the light incident, only the selection optical element AOM6 needs to be turned on.
- the plurality of selection optical elements AOMn are provided corresponding to the plurality of scanning units Un (U1 to U6), and switch whether or not the beam LBn is incident on the corresponding scanning unit Un. .
- the selection optical elements AOM1 to AOM3 are referred to as first optical element modules
- the selection optical elements AOM4 to AOM6 are referred to as second optical element modules.
- the scanning units U1 to U3 corresponding to the selection optical elements AOM1 to AOM3 of the first optical element module are referred to as a first scanning module and correspond to the selection optical elements AOM4 to AOM6 of the second optical element module.
- the scanning units U4 to U6 are referred to as a second scanning module. Therefore, the scanning of the spot light SP is performed in parallel by any one scanning unit Un of the first scanning module and any one scanning unit Un of the second scanning module.
- the scanning efficiency is 1 /. Therefore, for example, while one scanning unit Un rotates by an angle corresponding to one reflecting surface RP (45 degrees), the angle at which the spot light SP can be scanned is 15 degrees, and the other angle range (30 degrees) ), The spot light SP cannot be scanned, and the beam LBn incident on the polygon mirror PM during that time is wasted.
- the rotation angle of the polygon mirror PM of one certain scanning unit Un is an angle that does not contribute to the actual scanning
- the beam LBn is incident on the other scanning unit Un, so that the other scanning unit
- the spot light SP is scanned by the Un polygon mirror PM. Since the scanning efficiency of the polygon mirror PM is 1/3, the beam LBn is distributed to the other two scanning units Un between one scanning unit Un scanning the spot light SP and the next scanning. Thus, the spot light SP can be scanned. Therefore, in the first embodiment, the plurality of scanning units Un (U1 to U6) are divided into two groups (scanning modules), and the three scanning units U1 to U3 are used as the first scanning module. Units U4 to U6 were used as the second scanning module.
- the beam LBn (LB1 to LB3) is sequentially applied to any one of the three scanning units U1 to U3. It can be made incident. Therefore, each of the scanning units U1 to U3 can sequentially scan the spot light SP without wasting the beam LBa from the light source device LSa.
- the beam LBn (LB4 to LB6) is incident on any one of the three scanning units U4 to U6 in order while the polygon mirror PM of the scanning unit U4 rotates 45 degrees (one reflection surface RP). be able to.
- the scanning units U4 to U6 can sequentially scan the spot light SP without wasting the beam LBb from the light source device LSb. It should be noted that the polygon mirror PM is rotated exactly by an angle (45 degrees) corresponding to one reflecting surface RP after each scanning unit Un starts scanning the spot light SP and before starting the next scanning. become.
- each of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module scans the spot light SP in a predetermined order.
- the control device 16 switches on the three selection optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module in a predetermined order, and the beams LBn (LB1 to LB3, LB4 to LB6) are incident.
- the scanning units Un (U1 to U3, U4 to U6) to be switched are sequentially switched.
- the control device 16 Switches on the three optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module in the order of AOM1 ⁇ AOM2 ⁇ AOM3, AOM4 ⁇ AOM5 ⁇ AOM6, and the beam LBn is incident
- the scanning units Un to be switched are switched in the order of U1 ⁇ U2 ⁇ U3 and U4 ⁇ U5 ⁇ U6.
- each polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module needs to satisfy the following conditions and rotate.
- the condition is that the polygon mirrors PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module are synchronously controlled so as to have the same rotational speed Vp. It is necessary to perform synchronous control so that the rotation angle position (angular position of each reflecting surface RP) has a predetermined phase relationship.
- the rotation with the same rotation speed Vp of the polygon mirror PM of the three scanning units Un of each scanning module is called synchronous rotation.
- FIG. 7 is a diagram showing a configuration of a light source device (pulse light source device, pulse laser device) LSa (LSb).
- a light source device LSa (LSb) as a fiber laser device includes a pulsed light generation unit 20 and a control circuit 22.
- the pulse light generator 20 includes DFB semiconductor laser elements 30 and 32, a polarization beam splitter 34, an electro-optic element (intensity modulation section) 36 as a drawing optical modulator, a drive circuit 36a for the electro-optic element 36, and a polarization beam splitter. 38, an absorber 40, an excitation light source 42, a combiner 44, a fiber optical amplifier 46, wavelength conversion optical elements 48 and 50, and a plurality of lens elements GL.
- the control circuit 22 has a signal generator 22a that generates a clock signal LTC and a pixel shift pulse BSC.
- a signal generator 22a that generates a clock signal LTC and a pixel shift pulse BSC.
- the pixel shift pulse from the light source device LSa is distinguished.
- BSC may be represented by BSCa
- the pixel shift pulse BSC from the light source device LSb may be represented by BSCb.
- the DFB semiconductor laser element (first solid state laser element) 30 is sharp (sharp) at an oscillation frequency Fa (for example, 400 MHz) which is a predetermined frequency in cooperation with a pulse wave cutting system such as a Q switch (not shown).
- sharp pulsed seed light (pulse beam, beam) S1 is generated, and the DFB semiconductor laser element (second solid-state laser element) 32 is slow (temporal) at an oscillation frequency Fa (for example, 400 MHz) which is a predetermined frequency.
- the seed light S1 generated by the DFB semiconductor laser element 30 and the seed light S2 generated by the DFB semiconductor laser element 32 are synchronized in emission timing.
- the seed lights S1 and S2 both have substantially the same energy per pulse, but have different polarization states, and the peak intensity of the seed light S1 is stronger.
- the seed light S1 and the seed light S2 are linearly polarized light, and their polarization directions are orthogonal to each other.
- the polarization state of the seed light S1 generated by the DFB semiconductor laser element 30 will be described as S-polarized light
- the polarization state of the seed light S2 generated by the DFB semiconductor laser element 32 will be described as P-polarized light.
- the seed lights S1 and S2 are light in the infrared wavelength region.
- the control circuit 22 controls the DFB semiconductor laser elements 30 and 32 so that the seed lights S1 and S2 emit light in response to the clock pulse of the clock signal LTC sent from the signal generator 22a.
- the DFB semiconductor laser elements 30 and 32 emit seed light S1 and S2 at a predetermined frequency (oscillation frequency) Fa in response to each clock pulse (oscillation frequency Fa) of the clock signal LTC.
- the control circuit 22 is controlled by the control device 16.
- the seed lights S 1 and S 2 generated by the DFB semiconductor laser elements 30 and 32 are guided to the polarization beam splitter 34.
- the clock signal LTC serving as the reference clock signal is a pixel shift pulse supplied to each of the counter units for designating the row-direction address in the memory circuit of the bit map-like pattern data.
- This is the base of BSC (BSCa, BSCb).
- the signal generator 22a includes overall magnification correction information TMg for correcting the overall magnification of the drawing line SLn on the irradiated surface of the substrate P, and local magnification correction information for performing the local magnification correction of the drawing line SLn.
- CMgn (CMg1 to CMg6) is input from the control device 16.
- the expansion / contraction of the pattern drawing length can be performed within a range of, for example, about ⁇ 1000 ppm within the maximum scanning length (for example, 31 mm) of the drawing line SLn. Note that the overall magnification correction in the first embodiment is simply described. Along the main scanning direction, the number of spot lights included in one pixel (1 bit) on the drawing data is kept constant.
- the drawing magnification in the scanning direction of the entire drawing line SLn is uniformly corrected. Further, the local magnification correction in the first embodiment is simply described. One pixel (1 bit) located at each of a plurality of discrete correction points set on one drawing line is targeted. Further, by slightly increasing / decreasing the interval in the main scanning direction of the spot light SP at the pixel at the correction point from the normal interval (for example, 1/2 of the size ⁇ of the spot light SP), The pixel size at the correction point is slightly expanded or contracted in the main scanning direction.
- the polarization beam splitter 34 transmits S-polarized light and reflects P-polarized light, and includes seed light S1 generated by the DFB semiconductor laser element 30 and seed light S2 generated by the DFB semiconductor laser element 32. Is guided to the electro-optic element 36. Specifically, the polarization beam splitter 34 transmits the S-polarized seed light S1 generated by the DFB semiconductor laser element 30 to guide the seed light S1 to the electro-optical element 36. The polarization beam splitter 34 reflects the P-polarized seed light S2 generated by the DFB semiconductor laser element 32 to guide the seed light S2 to the electro-optic element 36.
- the DFB semiconductor laser elements 30 and 32 and the polarization beam splitter 34 constitute a pulse light source unit 35 that generates seed lights S1 and S2.
- the electro-optic element (intensity modulation section) 36 is transmissive to the seed lights S1 and S2, and for example, an electro-optic modulator (EOM: Electro-Optic Modulator) is used.
- EOM Electro-Optic Modulator
- the electro-optical element 36 switches the polarization states of the seed lights S1 and S2 by the drive circuit 36a.
- the drawing bit string data SBa is generated based on pattern data (bit pattern) corresponding to the pattern to be exposed by each of the scanning units U1 to U3, and the drawing bit string data SBb is each of the scanning units U4 to U6. Are generated based on pattern data (bit pattern) corresponding to the pattern to be exposed.
- the drawing bit string data SBa is input to the drive circuit 36a of the light source device LSa
- the drawing bit string data SBb is input to the drive circuit 36a of the light source device LSb.
- the seed light S1 and S2 from each of the DFB semiconductor laser element 30 and the DFB semiconductor laser element 32 has a long wavelength range of 800 nm or more, and therefore, the electro-optic element 36 having a polarization state switching response of about GHz is used. Can do.
- the pattern data (drawing data) is provided for each scanning unit Un, and a pattern drawn by each scanning unit Un is divided by pixels having a dimension Pxy set according to the size ⁇ of the spot light SP, and a plurality of pixels Are represented by logical information (pixel data) corresponding to the pattern. That is, this pattern data is two-dimensional so that the direction along the main scanning direction (Y direction) of the spot light SP is the row direction and the direction along the sub-transport direction (X direction) of the substrate P is the column direction.
- This is bitmap data composed of logical information of a plurality of pixels decomposed into two. The logical information of this pixel is 1-bit data of “0” or “1”.
- the logical information of “0” means that the intensity of the spot light SP irradiated on the substrate P is set to a low level (non-drawing), and the logical information of “1” is the spot light SP irradiated on the substrate P. This means that the intensity is set to a high level (drawing).
- the pixel dimension Pxy in the main scanning direction (Y direction) is Py, and the sub-scanning direction (X direction) dimension is Px.
- the logical information of the pixels for one column of the pattern data corresponds to one drawing line SLn (SL1 to SL6). Therefore, the number of pixels for one column is determined in accordance with the pixel size Pxy on the irradiated surface of the substrate P and the length of the drawing line SLn.
- the size Pxy of one pixel is set to be equal to or larger than the size ⁇ of the spot light SP. For example, when the effective size ⁇ of the spot light SP is 3 ⁇ m, the size Pxy of one pixel is It is set to about 3 ⁇ m square or more.
- the intensity of the spot light SP projected onto the substrate P along one drawing line SLn (SL1 to SL6) is modulated according to the logical information of the pixels for one column.
- serial data DLn This logical information of the pixels for one column is called serial data DLn. That is, the pattern data is bitmap data in which serial data DLn are arranged in the column direction.
- the serial data DLn of the pattern data of the scanning unit U1 is represented by DL1
- the serial data DLn of the pattern data of the scanning units U2 to U6 is represented by DL2 to DL6.
- the serial data DL1 to DL3 (DL4 to DL6) of the pattern data of the units U1 to U3 (U4 to U6) are also output to the drive circuit 36a of the light source device LSa (LSb) in a predetermined order.
- Serial data DL1 to DL3 sequentially output to the drive circuit 36a of the light source device LSa is referred to as drawing bit string data SBa
- serial data DL4 to DL6 sequentially output to the drive circuit 36a of the light source device LSb is referred to as drawing bit string data SBb.
- serial data DL1 for one column is the drive circuit 36a of the light source device LSa.
- the serial data DL1 to DL3 corresponding to one column constituting the drawing bit string data SBa is converted to DL1 ⁇ the serial data DL2 corresponding to one column is output to the drive circuit 36a of the light source device LSa.
- the signals are output to the drive circuit 36a of the light source device LSa in the order of DL2 ⁇ DL3.
- serial data DL1 to DL3 of the next column is output to the drive circuit 36a of the light source device LSa as the drawing bit string data SBa in the order of DL1 ⁇ DL2 ⁇ DL3.
- serial data DL4 for one column is the drive circuit of the light source device LSb.
- the serial data DL4 to DL6 for one column constituting the drawing bit string data SBb is converted to DL4, for example, serial data DL5 for one column is output to the drive circuit 36a of the light source device LSb.
- the electro-optic element 36 When the logical information for one pixel of the drawing bit string data SBa (SBb) input to the drive circuit 36a is in the low (“0”) state, the electro-optic element 36 remains as it is without changing the polarization state of the seed light S1 and S2. Guide to the polarization beam splitter 38.
- the electro-optic element 36 when the logical information for one pixel of the drawing bit string data SBa (SBb) input to the drive circuit 36a is in a high (“1”) state, the electro-optic element 36 is in the polarization state of the incident seed lights S1 and S2. Is changed, that is, the polarization direction is changed by 90 degrees and guided to the polarization beam splitter 38.
- the drive circuit 36a drives the electro-optic element 36 based on the drawing bit string data SBa (SBb), so that the logic information of the pixel of the drawing bit string data SBa (SBb) is high (“ 1 "), S-polarized seed light S1 is converted into P-polarized seed light S1, and P-polarized seed light S2 is converted into S-polarized seed light S2.
- the polarization beam splitter 38 transmits P-polarized light and guides it to the combiner 44 through the lens element GL, and reflects S-polarized light to the absorber 40.
- the light (seed light) that passes through the polarization beam splitter 38 is represented by a beam Lse.
- the oscillation frequency of this pulsed beam Lse is Fa.
- the excitation light source 42 generates excitation light, and the generated excitation light is guided to the combiner 44 through the optical fiber 42a.
- the combiner 44 combines the beam Lse emitted from the polarization beam splitter 38 and the excitation light and outputs the combined light to the fiber optical amplifier 46.
- the fiber optical amplifier 46 is doped with a laser medium that is pumped by pumping light.
- the laser medium is pumped by the pumping light, so that the beam Lse as the seed light is amplified.
- the laser medium doped in the fiber optical amplifier 46 rare earth elements such as erbium (Er), ytterbium (Yb), thulium (Tm) are used.
- the amplified beam Lse is emitted from the exit end 46 a of the fiber optical amplifier 46 with a predetermined divergence angle, converged or collimated by the lens element GL, and enters the wavelength conversion optical element 48.
- the wavelength conversion optical element (first wavelength conversion optical element) 48 is configured to convert the incident beam Lse (wavelength ⁇ ) into the second half of the wavelength ⁇ by the second harmonic generation (SHG). Convert to harmonics.
- a PPLN (Periodically Poled LiNbO 3 ) crystal which is a quasi phase matching (QPM) crystal is preferably used as the wavelength conversion optical element 48. It is also possible to use a PPLT (Periodically Poled LiTaO 3 ) crystal or the like.
- the wavelength conversion optical element (second wavelength conversion optical element) 50 includes the second harmonic (wavelength ⁇ / 2) converted by the wavelength conversion optical element 48 and the seed light remaining without being converted by the wavelength conversion optical element 48.
- a sum frequency with (wavelength ⁇ ) (Sum Frequency Generation: SFG)
- SFG Standard Frequency Generation
- a third harmonic whose wavelength is 1/3 of ⁇ is generated.
- the third harmonic becomes ultraviolet light (beam LB) having a peak wavelength in a wavelength band of 370 mm or less (for example, 355 nm).
- the electro-optical element (intensity modulation unit) 36 is incident.
- the seed lights S1 and S2 are guided to the polarization beam splitter 38 as they are without changing the polarization state. Therefore, the beam Lse that passes through the polarization beam splitter 38 becomes the seed light S2. Therefore, the P-polarized LBa (LBb) finally output from the light source device LSa (LSb) has the same oscillation profile (time characteristic) as the seed light S2 from the DFB semiconductor laser element 32.
- the beam LBa (LBb) has a low pulse peak intensity and has a broad and dull characteristic. Since the fiber optical amplifier 46 has low amplification efficiency with respect to the seed light S2 having such a low peak intensity, the beam LBa (LBb) emitted from the light source device LSa (LSb) is not amplified to the energy required for exposure. Become. Therefore, from the viewpoint of exposure, the light source device LSa (LSb) substantially has the same result as not emitting the beam LBa (LBb). That is, the intensity of the spot light SP applied to the substrate P is at a low level.
- the ultraviolet light beam LBa (LBb) derived from the seed light S2 is continuously irradiated even if it has a slight intensity. Therefore, when the drawing lines SL1 to SL6 remain in the same position on the substrate P for a long time (for example, when the substrate P is stopped due to a trouble in the transport system), the light source device LSa (LSb) A movable shutter may be provided on the exit window (not shown) of the beam LBa (LBb) to close the exit window.
- the electro-optic element (intensity modulation unit) 36 is The incident seed lights S1 and S2 are changed in polarization state and guided to the polarization beam splitter 38. Therefore, the beam Lse that passes through the polarization beam splitter 38 becomes the seed light S1. Therefore, the beam LBa (LBb) emitted from the light source device LSa (LSb) is generated from the seed light S1 from the DFB semiconductor laser element 30.
- the seed light S1 from the DFB semiconductor laser element 30 Since the seed light S1 from the DFB semiconductor laser element 30 has a strong peak intensity, it is efficiently amplified by the fiber optical amplifier 46, and the P-polarized beam LBa (LBb) output from the light source device LSa (LSb) It has the energy necessary for exposure. That is, the intensity of the spot light SP applied to the substrate P is at a high level.
- the electro-optic element 36 serving as the drawing light modulator is provided in the light source device LSa (LSb), by controlling one electro-optic element (intensity modulation section) 36, the scanning module 3
- the intensity of the spot light SP scanned by the two scanning units U1 to U3 (U4 to U6) can be modulated according to the pattern to be drawn. Therefore, the beam LBa (LBb) emitted from the light source device LSa (LSb) is a drawing beam whose intensity is modulated.
- the DFB semiconductor laser element 32 and the polarization beam splitter 34 are omitted, and only the seed light S1 from the DFB semiconductor laser element 30 is converted into pattern data (drawing bit string data SBa, SBb, or serial data). It is also conceivable to guide the fiber optical amplifier 46 in a burst wave shape by switching the polarization state of the electro-optic element 36 based on DLn). However, when this configuration is adopted, the periodicity of incidence of the seed light S1 on the fiber optical amplifier 46 is greatly disturbed according to the pattern to be drawn.
- the seed light S1 from the DFB semiconductor laser element 30 does not enter the fiber optical amplifier 46 and then the seed light S1 enters the fiber optical amplifier 46, the seed light S1 immediately after the incident is more than normal.
- a beam giant pulse
- the seed light S2 broad pulse light with low peak intensity
- the DFB semiconductor laser elements 30 and 32 may be driven based on pattern data (drawing bit string data SBa, SBb or serial data DLn).
- the DFB semiconductor laser elements 30 and 32 function as a drawing light modulator (intensity modulation unit). That is, the control circuit 22 controls the DFB semiconductor laser elements 30 and 32 based on the drawing bit string data SBa (DL1 to DL3) and SBb (DL4 to DL6), and oscillates in a pulse shape at a predetermined frequency Fa.
- Lights S1 and S2 are generated selectively (alternatively).
- the polarization beam splitters 34 and 38, the electro-optic element 36, and the absorber 40 are not necessary, and one of the seed lights S1 and S2 selectively pulse-oscillated from any one of the DFB semiconductor laser elements 30 and 32. Is directly incident on the combiner 44.
- the control circuit 22 prevents the seed light S1 from the DFB semiconductor laser element 30 and the seed light S2 from the DFB semiconductor laser element 32 from entering the fiber optical amplifier 46 at the same time. 32 drive is controlled. That is, when the substrate P is irradiated with the spot light SP of each beam LBn, the DFB semiconductor laser device 30 is controlled so that only the seed light S1 enters the fiber optical amplifier 46.
- the DFB semiconductor laser device 32 When the substrate P is not irradiated with the spot light SP of each beam LBn (the intensity of the spot light SP is extremely low), the DFB semiconductor laser device 32 is set so that only the seed light S2 enters the fiber optical amplifier 46. Control. Thus, whether or not the substrate P is irradiated with the beam LBn is determined based on the logical information (high / low) of the pixel. In this case, the polarization states of the seed lights S1 and S2 may be P-polarized light.
- N spot lights SP are aligned along the main scanning direction with respect to one pixel of the dimension Pxy on the irradiated surface of the substrate P.
- a beam LBa (LBb) is emitted so as to be projected.
- the beam LBa (LBb) emitted from the light source device LSa (LSb) is generated in response to the clock pulse of the clock signal LTC generated by the signal generator 22a.
- the correction position information (setting value) Nv of the local magnification correction information CMgn (CMg1 to CMg6) can be arbitrarily changed, and is appropriately set according to the magnification of the drawing line SLn.
- the correction position information Nv may be set so that one correction pixel is positioned on the drawing line SLn.
- the drawing line SL can be expanded and contracted also by the overall magnification correction information TMg, the local magnification correction can perform finer magnification correction finer.
- the scanning length of the drawing line SLn is expanded or contracted by 15 ⁇ m (ratio 500 ppm) based on the overall magnification correction information TMg.
- the oscillation frequency Fa must be increased or decreased by about 0.2 MHz (ratio 500 ppm), and adjustment thereof is difficult. Even if it can be adjusted, it switches to the adjusted oscillation frequency Fa with a certain delay (time constant), so that a desired magnification cannot be obtained during that time.
- the drawing magnification correction ratio is set to 500 ppm or less, for example, about several ppm to several tens of ppm
- the discrete correction pixels are more effective than the overall magnification correction method that changes the oscillation frequency Fa of the light source device LSa (LSb).
- the local magnification correction method that increases or decreases the number of spot lights in the light source can easily perform correction with high resolution.
- both the overall magnification correction method and the local magnification correction method are used in combination, there is an advantage that high-resolution correction can be performed while corresponding to a large drawing magnification correction ratio.
- FIG. 9 is a block diagram showing an electrical configuration of the exposure apparatus EX.
- the control device 16 of the exposure apparatus EX includes a polygon drive control unit 100, a selection element drive control unit 102, a beam control device 104, a mark position detection unit 106, and a rotation position detection unit 108.
- the origin signals SZn (SZ1 to SZ6) output from the origin sensors OPn (OP1 to OP6) of the respective scanning units Un (U1 to U6) are input to the polygon drive control unit 100 and the selection element drive control unit 102.
- SZn SZ1 to SZ6 output from the origin sensors OPn (OP1 to OP6) of the respective scanning units Un (U1 to U6)
- the beam LBa (LBb) from the light source device LSa (LSb) is diffracted by the selection optical element AOM2 (AOM5), and the beam LB2 (LB5) which is the first-order diffracted light is the scanning unit U2.
- a state of being incident on (U5) is shown.
- the polygon drive control unit 100 drives and controls the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6).
- the polygon drive control unit 100 has a rotation drive source (motor, speed reducer, etc.) RM that drives the polygon mirror PM of each scanning unit Un (U1 to U6), and controls the rotation of the motor to control the polygon. Drive and control the rotation of the mirror PM.
- the polygon driving control unit 100 scans the three scanning modules of each scanning module so that the rotational angle positions of the polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module have a predetermined phase relationship. Each polygon mirror PM of the unit Un (U1 to U3, U4 to U6) is rotated synchronously.
- the polygon drive control unit 100 has the same rotational speed (number of rotations) Vp of the polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module, and a predetermined angle.
- the rotation of the polygon mirror PM of the plurality of scanning units Un (U1 to U6) is controlled so that the phase of the rotation angle position is shifted one by one.
- the rotation speeds Vp of the polygon mirrors PM of the scanning units Un (U1 to U6) are all the same.
- the rotation angle ⁇ of the polygon mirror PM that contributes to actual scanning is set to 15 degrees, so that the scanning efficiency of the octagonal polygon mirror PM having eight reflecting surfaces RP is 1 / 3.
- the scanning of the spot light SP by the three scanning units Un is performed in the order of U1 ⁇ U2 ⁇ U3. Therefore, in this order, each polygon of each of the scanning units U1 to U3 is rotated so that the polygon mirror PM of each of the three scanning units U1 to U3 rotates at a constant speed with the phase of the rotational angle position shifted by 15 degrees.
- the mirror PM is synchronously controlled by the polygon drive control unit 100.
- each polygon mirror of each of the scanning units U4 to U6 is rotated at a constant speed with the rotation angle position of each polygon mirror PM of each of the three scanning units U4 to U6 being shifted by 15 degrees. PM is synchronously controlled by the polygon drive control unit 100.
- the polygon drive control unit 100 uses the origin signal SZ1 from the origin sensor OP1 of the scanning unit U1 as a reference.
- the rotational phase of the polygon mirror PM of the scanning unit U2 is controlled so that the origin signal SZ2 from the origin sensor OP2 is delayed by the time Ts.
- the polygon drive control unit 100 rotates the rotation phase of the polygon mirror PM of the scanning unit U3 so that the origin signal SZ3 from the origin sensor OP3 of the scanning unit U3 is delayed by 2 ⁇ time Ts with reference to the origin signal SZ1.
- This time Ts is a time for rotating the polygon mirror PM by 15 degrees (maximum scanning time of the spot light SP).
- the phase difference between the rotational angular positions of the polygon mirrors PM of the scanning units U1 to U3 is shifted by 15 degrees in the order of U1, U2, and U3. Therefore, the three scanning units U1 to U3 of the first scanning module can scan the spot light SP in the order of U1 ⁇ U2 ⁇ U3.
- the polygon drive control unit 100 uses the origin signal SZ5 from the origin sensor OP4 of the scanning unit U5 as a reference for the origin signal SZ4 from the origin sensor OP4 of the scanning unit U4.
- the rotational phase of the polygon mirror PM of the scanning unit U5 is controlled so as to be delayed by Ts.
- the polygon drive control unit 100 uses the rotation origin of the polygon mirror PM of the scanning unit U6 so that the origin signal SZ6 from the origin sensor OP6 of the scanning unit U6 is delayed by 2 ⁇ time Ts with reference to the origin signal SZ4. To control.
- the phase of the rotational angle position of each polygon mirror PM of each of the scanning units U4 to U6 is shifted by 15 degrees in the order of U4, U5, and U6. Therefore, the three scanning units Un (U4 to U6) of the second scanning module can scan the spot light SP in the order of U4 ⁇ U5 ⁇ U6.
- the selection element drive control unit (beam switching drive control unit) 102 controls the selection optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module of the beam switching unit BDU, and controls one of the scanning modules. From the start of scanning of the spot light SP by the scanning unit Un until the start of the next scanning, the beam LB (LBa, LBb) from the light source device LS (LSa, LSb) is converted into three scanning units of each scanning module. Allocate to Un (U1 to U3, U4 to U6) in order.
- the selection element drive control unit 102 when the origin signal SZn (SZ1 to SZ6) is generated, the selection element drive control unit 102 generates the origin signal SZn (SZ1 to SZ6) for a certain time (on time Ton) after the origin signal SZn is generated.
- Drive signals (high frequency signals) HFn (HF1 to HF6) are applied to the optical elements for selection AOMn (AOM1 to AOM6) corresponding to the scanning units Un (U1 to U6) that generate the above.
- the optical element AOMn for selection to which the drive signal (high frequency signal) HFn is applied is turned on for the on time Ton, and the beam LBn can be incident on the corresponding scanning unit Un.
- the on-time Ton is a time equal to or shorter than the time Ts.
- the origin signals SZ1 to SZ3 generated by the three scanning units U1 to U3 of the first scanning module are generated in the order of SZ1 ⁇ SZ2 ⁇ SZ3 at time Ts intervals. Therefore, drive signals (high-frequency signals) HF1 to HF3 are applied to the selection optical elements AOM1 to AOM3 of the first optical element module in the order of AOM1 ⁇ AOM2 ⁇ AOM3 at time Ts intervals for the on time Ton.
- the first optical element module (AOM1 to AOM3) transmits one scanning unit Un on which the beam LBn (LB1 to LB3) from the light source device LSa is incident in the order of U1 ⁇ U2 ⁇ U3 at time Ts intervals. Can be switched.
- the scanning unit Un that scans the spot light SP is switched in the order of U1 ⁇ U2 ⁇ U3 at time Ts intervals.
- the beam LBn (LB1 to LB3) from the light source device LSa is scanned three times. The light can be incident on any one of the units Un (U1 to U3) in order.
- the origin signals SZ4 to SZ6 generated by the three scanning units U4 to U6 of the second scanning module are generated in the order of SZ4 ⁇ SZ5 ⁇ SZ6 at time Ts intervals. Therefore, drive signals (high frequency signals) HF4 to HF6 are applied to the selection optical elements AOM4 to AOM6 of the second optical element module in the order of AOM4 ⁇ AOM5 ⁇ AOM6 at time Ts intervals for the on time Ton. . Therefore, the second optical element module (AOM4 to AOM6) transmits one scanning unit Un on which the beam LBn (LB4 to LB6) from the light source device LSb is incident in the order of U4 ⁇ U5 ⁇ U6 at time Ts intervals. Can be switched.
- the scanning unit Un that scans the spot light SP is switched in the order of U4 ⁇ U5 ⁇ U6 at time Ts intervals.
- the beam LBn (LB4 to LB6) from the light source device LSb is scanned three times. The light can be incident on any one of the units Un (U4 to U6) in order.
- the selection element drive control unit 102 will be described in more detail.
- the origin signal SZn SZ1 to SZ6
- the selection element drive control unit 102 When the origin signal SZn (SZ1 to SZ6) is generated, the selection element drive control unit 102 generates the origin signal SZn (SZ1 to SZ6) as shown in FIG. After that, a plurality of incident permission signals LPn (LP1 to LP6) that become H (high) for a certain time (on time Ton) are generated.
- the plurality of incident permission signals LPn LP1 to LP6) are signals that permit the corresponding selection optical elements AOMn (AOM1 to AOM6) to be turned on.
- the incident permission signals LPn are signals that permit the incidence of the beam LBn (LB1 to LB6) to the corresponding scanning units Un (U1 to U6).
- the selection element drive control unit 102 applies the drive signal (high frequency) to the corresponding selection optical element AOMn (AOM1 to AOM6) only during the ON time Ton when the incident permission signal LPn (LP1 to LP6) is H (high).
- Signal) HFn HF1 to HF6 is applied to turn on the corresponding selection optical element AOMn (the state in which the first-order diffracted light is generated).
- the selection element drive control unit 102 applies the drive signals HF1 to HF3 to the corresponding selection optical elements AOM1 to AOM3 for a certain time Ton when the incidence permission signals LP1 to LP3 are H (high). Thereby, the beams LB1 to LB3 from the light source device LSa enter the corresponding scanning units U1 to U3.
- the selection element drive control unit 102 supplies drive signals (high frequency signals) HF4 to HF6 to the corresponding selection optical elements AOM4 to AOM6 for a certain time Ton when the incidence permission signals LP4 to LP6 are H (high). Apply. Thereby, the beams LB4 to LB6 from the light source device LSb enter the corresponding scanning units U4 to U6.
- the incident permission signals LP1 to LP3 corresponding to the three selection optical elements AOM1 to AOM3 of the first optical element module have the rising timings LP1 ⁇ LP2 ⁇ LP3, which become H (high).
- the ON times Ton that are shifted by time Ts in this order and become H (high) do not overlap each other. Therefore, the scanning unit Un on which the beams LBn (LB1 to LB3) are incident is switched in the order of U1 ⁇ U2 ⁇ U3 at time Ts intervals.
- the incident permission signals LP4 to LP6 corresponding to the three selection optical elements AOM4 to AOM6 of the second optical element module have a rising timing that becomes H (high) in the order of LP4 ⁇ LP5 ⁇ LP6.
- the ON times Ton that are shifted by Ts and become H (high) do not overlap each other. Accordingly, the scanning unit Un on which the beam LBn (LB4 to LB6) is incident is switched in the order of U4 ⁇ U5 ⁇ U6 at time Ts intervals.
- the selection element drive control unit 102 outputs the generated plurality of incident permission signals LPn (LP1 to LP6) to the beam control device 104.
- the beam control device (beam control unit) 104 in FIG. 9 includes the emission frequency Fa of the beam LB (LBa, LBb, LBn), the magnification of the drawing line SLn on which the spot light SP of the beam LB is drawn, and the intensity of the beam LB. Modulation is controlled.
- the beam control apparatus 104 includes an overall magnification setting unit 110, a local magnification setting unit 112, a drawing data output unit 114, and an exposure control unit 116.
- the overall magnification setting unit (overall magnification correction information storage unit) 110 stores the overall magnification correction information TMg sent from the exposure control unit 116 and controls the overall magnification correction information TMg of the light source device LS (LSa, LSb).
- the signal is output to the signal generator 22a of the circuit 22.
- the clock generator 60 of the signal generator 22a generates a clock signal LTC having an oscillation frequency Fa according to the overall magnification correction information TMg.
- the detailed configuration of the overall magnification setting unit 110 and the local magnification setting unit 112 will be described in detail later.
- the local magnification setting unit (local magnification correction information storage unit, correction information storage unit) 112 stores the local magnification correction information (correction information) CMgn sent from the exposure control unit 116 and also uses the local magnification correction information CMgn as a light source. It outputs to the signal generation part 22a of the control circuit 22 of apparatus LS (LSa, LSb). Based on the local magnification correction information CMgn, the position of the correction pixel on the drawing line SLn is designated (specified), and the magnification is determined.
- the signal generator 22a of the control circuit 22 outputs a pixel shift pulse BSC (BSCa, BSCb) according to the correction pixel determined based on the local magnification correction information CMg and the magnification.
- the local magnification setting unit 112 stores the local magnification correction information CMgn (CMg1 to CMg6) for each scanning unit Un (U1 to U6) sent from the exposure control unit 116. Then, the local magnification setting unit 112 outputs the local magnification correction information CMgn corresponding to the scanning unit Un that scans the spot light SP to the signal generation unit 22a of the light source device LS (LSa, LSb).
- the local magnification setting unit 112 uses the local magnification correction information CMgn corresponding to the scanning unit Un that has generated the origin signal SZn (SZ1 to SZ6) as the light source device LSa serving as a generation source of the beam LBn incident on the scanning unit Un. (LSa, LSb) is output to the signal generator 22a.
- the correction of the drawing magnification based on the overall magnification correction information TMg and the local magnification correction information CMgn is partially performed on the clock cycle of the clock signal LTC from the signal generation unit 22a of the control circuit 22 of the light source device LS (LSa, LSb). It is done with fine adjustment.
- the detailed configuration of the control circuit 22 (signal generator 22a) will be described later.
- the scanning unit Un that has generated the origin signal SZn (that is, the scanning unit Un that will perform the scanning of the spot light SP from now on) is one of the scanning units U1 to U3, the local magnification setting unit 112
- the local magnification correction information CMgn corresponding to the scanning unit Un that has generated SZn is output to the signal generator 22a of the light source device LSa.
- the scanning unit Un that has generated the origin signal SZn is one of the scanning units U4 to U6, the local magnification setting unit 112 performs local magnification correction information corresponding to the scanning unit Un that has generated the origin signal SZn.
- CMgn is output to the signal generator 22a of the light source device LSb.
- the pixel shift pulse BSC (BSCa, BSCb) corresponding to the scanning unit Un (U1 to U3, U4 to U6) that scans the spot light SP is transmitted to the light source device LS (LSa, LSb). Output from the transmission timing switching unit 64. Thereby, the scanning length can be individually adjusted for each drawing line SLn.
- the drawing data output unit 114 corresponds to the scanning unit Un that has generated the origin signal SZn (the scanning unit Un that will perform the scanning of the spot light SP) among the three scanning units Un (U1 to U3) of the first scanning module.
- the serial data DLn for one column is output as drawing bit string data SBa to the drive circuit 36a of the light source device LSa.
- the drawing data output unit 114 is a scanning unit Un that has generated the origin signal SZn (the scanning unit Un that will scan the spot light SP from now on) among the three scanning units Un (U4 to U6) of the second scanning module.
- the exposure control unit 116 shown in FIG. 9 controls the overall magnification setting unit 110, the local magnification setting unit 112, and the drawing data output unit 114.
- the exposure control unit 116 includes positional information of the alignment marks MKm (MK1 to MK4) on the installation orientation lines Lx1 and Lx4 detected by the mark position detection unit 106, and installation orientation lines Lx1 to Lx4 detected by the rotational position detection unit 108.
- the rotation angle position information (count values based on the counter circuits CN1a to CN4a, CN1b to CN4b) of the upper rotary drum DR is input.
- the exposure control unit 116 detects the position information of the alignment mark MKm (MK1 to MK4) on the installation azimuth line Lx1 and the rotation angle position of the rotary drum DR (count values of the counter circuits CN1a and CN1b) on the installation azimuth line Lx1. Based on this, the drawing exposure start position of the exposure area W in the sub-scanning direction (X direction) of the substrate P is detected (determined).
- the exposure control unit 116 detects the rotation angle position of the rotary drum DR on the installation azimuth line Lx1 when the drawing exposure start position is detected, and the rotation angle position on the installation azimuth line Lx2 (in the counter circuits CN2a and CN2b). Based on the count value), it is determined whether or not the drawing exposure start position of the substrate P has been transported to the drawing lines SL1, SL3, and SL5 on the installation orientation line Lx2.
- the exposure control unit 116 determines that the drawing exposure start position has been conveyed to the drawing lines SL1, SL3, and SL5, the exposure control unit 116 controls the local magnification setting unit 112, the drawing data output unit 114, and the like to scan units U1, U3, U5 starts drawing by scanning the spot light SP.
- the exposure control unit 116 performs local magnification correction information CMg1 corresponding to the scanning units U1 and U3 that scan the spot light SP to the local magnification setting unit 112 at the timing when the scanning units U1 and U3 perform drawing exposure.
- CMg3 is output to the signal generator 22a of the light source device LSa.
- the signal generation unit 22a of the light source device LSa converts the pixel shift pulse BSCa for shifting the pixels of the serial data DL1 and DL3 of the scanning units U1 and U3 that scan the spot light SP into the local magnification correction information CMg1 and CMg3. In response.
- the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL1 and DL3 corresponding to the scanning units U1 and U3 that scan the spot light SP pixel by pixel.
- the exposure control unit 116 causes the local magnification setting unit 112 to output local magnification correction information CMg5 corresponding to the scanning unit U5 to the signal generation unit 22a of the light source device LSb at the timing when the scanning unit U5 performs drawing exposure. .
- the signal generator 22a of the light source device LSb generates a pixel shift pulse BSCb for shifting the pixel of the serial data DL5 corresponding to the scanning unit U5 that scans the spot light SP according to the local magnification correction information CMg5. .
- the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL5 of the scanning unit U5 that scans the spot light SP one pixel at a time.
- the exposure control unit 116 detects the rotation angle position of the rotary drum DR on the installation direction line Lx1 when the drawing exposure start position is detected, and the rotation angle position on the installation direction line Lx3 (of the counter circuits CN3a and CN3b). On the basis of the count value), it is determined whether or not the drawing exposure start position of the substrate P has been transported to the drawing lines SL2, SL4, SL6 on the installation orientation line Lx3.
- the exposure control unit 116 determines that the drawing exposure start position has been conveyed to the drawing lines SL2, SL4, and SL6, the exposure control unit 116 controls the local magnification setting unit 112 and the drawing data output unit 114, and further scan units U2 and U4. , U6 starts scanning the spot light SP.
- the exposure control unit 116 supplies the local magnification correction information CMg2 corresponding to the scanning unit U2 that scans the spot light SP to the local magnification setting unit 112 at the timing when the scanning unit U2 performs drawing exposure.
- the signal generator 22a outputs the signal.
- the signal generation unit 22a of the light source device LSa generates a pixel shift pulse BSCa that shifts the pixels of the serial data DL2 of the scanning unit U2 that scans the spot light SP according to the local magnification correction information CMg2.
- the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL2 of the scanning unit U2 that scans the spot light SP one pixel at a time.
- the exposure control unit 116 sends the local magnification correction information CMg4 and CMg6 corresponding to the scanning units U4 and U6 to the local magnification setting unit 112 at the timing when the scanning units U4 and U6 perform drawing exposure.
- the output is made to the generator 22a.
- the signal generator 22a of the light source device LSb converts the pixel shift pulse BSCb for shifting the pixels of the serial data DL4 and DL6 of the scanning units U4 and U6 that scan the spot light SP into the local magnification correction information CMg4 and CMg6.
- the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL4 and DL6 of the scanning units U4 and U6 that scan the spot light SP one pixel at a time.
- an incident permission signal LPn (LP1 to LP6) as shown in FIG. 10 is generated, and from the start of drawing exposure on the drawing lines SL1, SL3, SL5 to immediately before the start of drawing exposure on the drawing lines SL2, SL4, SL6.
- serial data DL2, DL4, and DL6 are output. Therefore, the pattern is drawn by the scanning of the spot light SP by the scanning units U2, U4, and U6 before the drawing exposure start position of the exposure area W reaches the drawing lines SL2, SL4, and SL6. Therefore, the exposure control unit 116 in FIG.
- the exposure control unit 116 detects the position information of the alignment marks MKm (MK1 to MK4) on the installation orientation lines Lx1 and Lx4 detected by the mark position detection unit 106, and the installation orientation line Lx1 detected by the rotational position detection unit 108. Based on the rotational angle position information of the rotary drum DR on Lx4, the distortion (deformation) of the substrate P or the exposed area W is sequentially calculated. For example, when the substrate P is deformed by receiving a large tension in the longitudinal direction or undergoing a thermal process, the shape of the exposed area W is also distorted (deformed), and the alignment mark MKm (MK1 to MK4) This arrangement is not a rectangular shape as shown in FIG. 4, but is distorted (deformed).
- the magnification of each drawing line SLn needs to be changed accordingly, so that the exposure control unit 116 is based on the calculated distortion of the substrate P or the exposed area W. Then, at least one of the overall magnification correction information TMg and the local magnification correction information CMgn is generated. Then, at least one of the generated overall magnification correction information TMg and local magnification correction information CMgn is output to the overall magnification setting unit 110 or the local magnification setting unit 112. Thereby, the precision of overlay exposure can be improved.
- the exposure control unit 116 may generate corrected tilt angle information for each drawing line SLn according to the distortion of the substrate P or the exposed area W. Based on the generated corrected tilt angle information, the above-described actuator rotates each scanning unit Un (U1 to U6) about the irradiation center axis Len (Le1 to Le6). Thereby, the precision of overlay exposure is further improved.
- the exposure control unit 116 scans the spot light SP by each scanning unit Un (U1 to U6), or scans the spot light SP a predetermined number of times, or the substrate P or the exposed area W. When the tendency of distortion changes beyond the allowable range, at least one of the overall magnification correction information TMg and the local magnification correction information CMgn and the corrected inclination angle information may be generated again.
- FIG. 11 is a diagram illustrating a configuration of a signal generation unit 22a provided in the light source device LSa (LSb).
- CMgn having correction position information Nv and expansion / contraction information (polarity information) POL is sent from the local magnification setting unit 112 to the signal generation unit 22a.
- the local magnification setting unit 112 stores local magnification correction information CMgn (CMg1 to CMg6) for each scanning unit Un (U1 to U6).
- the signal generation unit 22 a includes a clock signal generation unit 200, a correction point designation unit 202, and a clock switching unit 204.
- the clock signal generation unit 200, the correction point designating unit 202, the clock switching unit 204, and the like can be configured collectively by an FPGA (Field Programmable Gate Array).
- ⁇ is an effective size of the spot light SP
- Vs is a relative speed of the spot light SP with respect to the substrate P in the main scanning direction.
- the oscillation frequency Fe is set to 100 MHz in order to overlap the spot light SP by 1 ⁇ 2 of the size ⁇ .
- the clock signal generation unit 200 includes a clock generation unit (oscillator) 60 and a plurality (N ⁇ 1) of delay circuits De (De01 to De49).
- the clock signal (output signal) CK 0 from the clock generation unit 60 is input to the first delay circuit De01 of the plurality of delay circuits De (De01 to De49) connected in series and the clock switching unit 204.
- a signal (output signal) CK 1 is output.
- the second stage of the delay circuit De02 a clock signal from the preceding delay circuit De01 (output signal) CK 1 and the same reference period Te (10 nsec), and, 0 the clock signal CK 1.
- a clock signal (output signal) CK 2 having a delay of 2 nsec is output.
- the delay circuits De03 to De49 in the third and subsequent stages have the same reference cycle Te (10 nsec) as the clock signals (output signals) CK 2 to CK 48 from the preceding delay circuits De02 to De48, and the clock signal Clock signals (output signals) CK 3 to CK 49 having a delay of 0.2 nsec with respect to CK 2 to CK 48 are output.
- the clock signal CK 0 to CK 49 are signals having a phase difference of 0.2 nsec
- the clock signal CK 0 has the same reference period Te (10 nsec) as the clock signal CK 49 and A clock signal having a further delay of 0.2 nsec with respect to the signal CK 49 and a signal shifted by exactly one cycle. Therefore, the clock signal CK 0 can be regarded as a clock signal delayed by 0.2 nsec substantially with respect to each clock pulse of the clock signal CK 49 .
- the clock signals CK 1 to CK 49 from the delay circuits De01 to De49 are input to the second to 50th input terminals of the clock switching unit 204.
- the control circuit 22 controls the DFB semiconductor laser elements 30 and 32 so that the seed lights S1 and S2 emit light in response to each clock pulse of the clock signal LTC output from the clock switching unit 204. Therefore, the oscillation frequency Fa of the pulsed beam LBa (LBb) emitted from the light source device LSa (LSb) is 100 MHz in principle.
- the clock switching unit 204 is a clock resulting from the generation of the clock signal CK p output as the clock signal LTC, that is, the beam LBa (LBb) at the timing when the spot light SP passes through the specific correction point CPP located on the scanning line.
- the signal CK p is switched to another clock signal CK p having a different phase difference.
- the clock switching unit 204 sets the clock signal CK p to be selected as the clock signal LTC at the timing when the spot light SP passes through the correction point CPP to 0.2 nsec with respect to the clock signal CK p currently selected as the clock signal LTC. Is switched to a clock signal CK p ⁇ 1 having a phase difference of only.
- the direction of the phase difference of the clock signal CK p ⁇ 1 to be switched, that is, whether the phase is delayed by 0.2 nsec or the phase is advanced by 0.2 nsec is local magnification correction information (correction information) CMgn (CMg1 to CMg6) It is determined according to 1-bit expansion / contraction information (polarity information) POL, which is a part of.
- the clock switching unit 204 When the expansion / contraction information POL is high “1” (expansion), the clock switching unit 204 is a clock signal CK p + whose phase is delayed by 0.2 nsec with respect to the clock signal CK p currently output as the clock signal LTC. 1 is selected and output as the clock signal LTC. On the other hand, when the expansion / contraction information POL is low “0” (reduction), the clock switching unit 204 has a phase advanced by 0.2 nsec with respect to the clock signal CK p currently output as the clock signal LTC. p-1 is selected and output as the clock signal LTC.
- the clock switching unit 204 when the clock signal CK p currently output as the clock signal LTC is CK 11 and the expansion / contraction information POL is high (H), the clock switching unit 204 outputs the clock signal CK p as the clock signal LTC. switching the clock signal CK 12, when distortion information POL is at a low (L), it switches the clock signal CK p to be output as a clock signal LTC in the clock signal CK 10.
- the same expansion / contraction information POL is input during one scanning period of the spot light SP.
- Clock switching unit 204 using the distortion information POL of local magnification correction information CMgn corresponding to the scanning unit Un the beam LBn is incident by the beam switching unit BDU, out of phase of the clock signal CK p is output as the clock signal LTC Determine the direction (whether the phase is advanced or delayed).
- the beam LBa (LB1 to LB3) from the light source device LSa is guided to any one of the scanning units U1 to U3. Therefore, the clock switching unit 204 of the signal generation unit 22a of the light source device LSa is based on the expansion / contraction information POL of the local magnification correction information CMgn corresponding to one scanning unit Un incident with the beam LBn among the scanning units U1 to U3.
- the direction in which the phase of the clock signal CK p output as the clock signal LTC is shifted is determined. For example, when the beam LB2 is incident on the scanning unit U2, the clock switching unit 204 of the light source device LSa is output as the clock signal LTC based on the expansion / contraction information POL of the local magnification correction information CMg2 corresponding to the scanning unit U2. The direction in which the phase of the clock signal CK p is shifted is determined.
- the beam LBb (LB4 to LB6) from the light source device LSb is guided to any one of the scanning units U4 to U6. Therefore, the clock switching unit 204 of the signal generation unit 22a of the light source device LSb is based on the expansion / contraction information POL of the local magnification correction information CMgn corresponding to one scanning unit Un incident with the beam LBn among the scanning units U4 to U6. The direction in which the phase of the clock signal CK p output as the clock signal LTC is shifted is determined.
- the clock switching unit 204 of the light source device LSb is output as the clock signal LTC based on the expansion / contraction information POL of the local magnification correction information CMg6 corresponding to the scanning unit U6.
- the direction in which the phase of the clock signal CK p is shifted is determined.
- the correction point designating unit 202 designates a specific point on each drawing line SLn (SL1 to SL6) as the correction point CPP.
- the correction point designating unit 202 designates the correction point CPP based on the correction position information (setting value) Nv for designating the correction point CPP which is a part of the local magnification correction information (correction information) CMgn (CMg1 to CMg6).
- the correction position information Nv of the local magnification correction information CMgn is an equal interval on the drawing line SLn according to the drawing magnification of the pattern drawn along the drawing line SLn (or the drawing magnification of the drawing line SLn in the main scanning direction).
- the correction point designating unit 202 can designate positions that are discretely arranged at equal intervals on the drawing line SLn (SL1 to SL6) as the correction point CPP.
- the correction point CPP is set, for example, between the projection positions of two adjacent spot lights SP projected along the drawing line SLn (the center position of the spot light SP).
- the correction point designation unit 202 designates the correction point CPP using the correction position information Nv of the local magnification correction information CMgn corresponding to the scanning unit Un on which the beam LBn is incident by the beam switching unit BDU. Since the beam LBa (LB1 to LB3) from the light source device LSa is guided to any one of the scanning units U1 to U3, the correction point designating unit 202 includes one of the scanning units U1 to U3 to which the beam LBn is incident. A correction point CPP is designated based on the correction position information Nv of the local magnification correction information CMgn corresponding to the scanning unit Un.
- the correction point designating unit 202 of the light source device LSa is on the drawing line SLn2 based on the correction position information Nv of the local magnification correction information CMg2 corresponding to the scanning unit U2.
- a plurality of positions discretely arranged at equal intervals are designated as correction points CPP.
- the correction point specifying unit 202 includes a frequency division counter circuit 212 and a shift pulse output unit 214.
- the frequency division counter circuit 212 is a subtraction counter, and receives a clock pulse (reference clock pulse) of the clock signal LTC output from the clock switching unit 204.
- the clock pulse of the clock signal LTC output from the clock switching unit 204 is input to the frequency division counter circuit 212 via the gate circuit GTa.
- Drawing permission signals SQ1 to SQ3 indicating that each of the scanning units U1 to U3 is in the drawing period are applied to the gate circuit GTa as a logical sum.
- the drawing permission signals SQ1 to SQ3 are generated in response to the incident permission signals LP1 to LP3 in FIG.
- the gate circuit GTa is a gate that opens during a period when the drawing permission signal SQn is high (H). That is, the frequency division counter circuit 212 counts the clock pulse of the clock signal LTC only during the period when the drawing permission signal SQn is high. Therefore, the gate circuit GTa of the light source device LSa outputs the clock pulse of the clock signal LTC input during the period when one of the drawing permission signals SQ1 to SQ3 is high (H) to the frequency division counter circuit 212. Similarly, three drawing permission signals SQ4 to SQ6 corresponding to the scanning units U4 to U6 are applied to the gate circuit GTa of the signal generator 22a of the light source device LSb. Therefore, the gate circuit GTa of the light source device LSb outputs the clock pulse of the clock signal LTC input during the period when any of the drawing permission signals SQ4 to SQ6 is high (H) to the frequency division counter circuit 212.
- the frequency division counter circuit 212 is preset with the initial count value in the correction position information (set value) Nv, and decrements the count value every time the clock pulse of the clock signal LTC is input. When the count value reaches 0, the frequency division counter circuit 212 outputs a one-pulse coincidence signal Idc to the shift pulse output unit 214. That is, the frequency division counter circuit 212 outputs the coincidence signal Idc when the clock pulse of the clock signal LTC is counted by the correction position information Nv.
- the coincidence signal Idc is information indicating that the correction point CPP exists before the next clock pulse is generated. Further, when the next clock pulse is input after the count value becomes 0, the frequency division counter circuit 212 presets the count value in the correction position information Nv. Thereby, a plurality of correction points CPP can be designated at equal intervals along the drawing line SLn.
- the shift pulse output unit 214 outputs the shift pulse CS to the clock switching unit 204 when the coincidence signal Idc is input.
- the clock switching unit 204 switches the clock signal CK p to be output as a clock signal LTC.
- the shift pulse CS is information indicating the correction point CPP, and is generated before the next clock pulse is input after the count value of the frequency division counter circuit 212 becomes zero. Therefore, the position on the substrate P of the spot light SP of the beam LBa (LBb) generated in response to the clock pulse in which the count value of the frequency division counter circuit 212 is zero, and the beam LBa (in response to the next clock pulse)
- the correction point CPP exists between the spot light SP of LBb) and the position on the substrate P.
- the spot light SP (clock pulse of the clock signal LTC) is displayed. )
- the correction points CPP are arranged at intervals of 500, and the correction position information Nv is set to 500.
- FIG. 12 is a time chart showing signals output from each part of the signal generator 22a shown in FIG. All of the 50 clock signals CK 0 to CK 49 generated by the clock signal generation unit 200 have the same reference period Te as the clock signal CK 0 output by the clock generation unit 60, but their phases are delayed by 0.2 nsec. It has become. Therefore, for example, the clock signal CK 3 has a phase delayed by 0.6 nsec with respect to the clock signal CK 0 , and the clock signal CK 49 has a phase delayed by 9.8 nsec with respect to the clock signal CK 0 . ing.
- the frequency division counter circuit 212 When the frequency division counter circuit 212 counts the clock pulse of the clock signal LTC output from the clock switching unit 204 by the correction position information (set value) Nv, it outputs a coincidence signal Idc (not shown).
- the shift pulse output unit 214 outputs the shift pulse CS.
- the shift pulse output unit 214 normally outputs a high (logical value of 1) signal, but when the coincidence signal Idc is output, the shift pulse output unit 214 falls to low (logical value of 0), and the clock signal CK p
- a shift pulse CS that rises to high (logic value is 1) is output. Accordingly, the shift pulse CS rises before the next clock pulse is input after the frequency division counter circuit 212 counts the clock pulse of the clock signal LTC by the correction position information (set value) Nv.
- a clock signal CK p to be output as a clock signal LTC the clock signal CK p to shift pulse CS is not output until immediately before the occurrence, distortion information POL' To a clock signal CK p ⁇ 1 whose phase is shifted by 0.2 nsec.
- the clock signal CK p output as the clock signal LTC immediately before the generation of the shift pulse CS is CK 0 and the expansion / contraction information POL is “0” (reduction)
- the rising edge of the shift pulse CS In response, the clock signal CK 49 is switched.
- the clock switching unit 204 has a phase of .0. to proceed by 2nsec switching the clock signal CK p to be output as a clock signal LTC. Therefore, the clock signal CK p output (selected) as the clock signal LTC is switched in the order of CK 0 ⁇ CK 49 ⁇ CK 48 ⁇ CK 47 ⁇ .
- the clock switching unit 204 has a phase of 0.2 nsec. as late by switching the clock signal CK p to be output (selected) as the clock signal LTC. Therefore, the clock signal CK p output (selected) as the clock signal LTC is switched in the order of CK 0 ⁇ CK 1 ⁇ CK 2 ⁇ CK 3 ⁇ .
- FIG. 13A is a diagram for explaining a pattern PP drawn when local magnification correction is not performed
- FIG. 13B is a diagram when local magnification correction (reduction) is performed according to the time chart shown in FIG. It is a figure explaining pattern PP to be drawn.
- the spot light SP having a high intensity is represented by a solid line
- the spot light SP having a low intensity or zero is represented by a broken line.
- the pattern PP is drawn by the spot light SP generated in response to each clock pulse of the clock signal LTC.
- the clock signal LTC and pattern PP of FIG. 13A (when local magnification correction is not performed) are represented by LTC1 and PP1
- the clock signal LTC and the pattern PP when the magnification correction is performed are represented by LTC2 and PP2.
- the dimension Pxy of each pixel to be drawn has a constant length in the main scanning direction.
- the length of the pixel in the sub-scanning direction (X direction) is represented by Px
- the length of the main scanning direction (Y direction) is represented by Py.
- the exposure apparatus EX of the present embodiment uses the spot light SP of the beam LB (Lse, LBa, LBb, LBn) generated according to the seed lights S1, S2 from the pulse light source unit 35 as pattern data.
- the pattern is drawn on the substrate P by relatively scanning the spot light SP along the drawing line SLn on the substrate P while performing the intensity modulation according to the above.
- the exposure apparatus EX includes at least a clock signal generation unit 200, a control circuit (light source control unit) 22, and a clock switching unit 204.
- the clock signal generator 200 has a reference period Te (for example, 10 nsec) shorter than the period determined by ⁇ / Vs, and a correction time (for example, 0.2 nsec) that is 1 / N of the reference period Te.
- Control circuit (light source control unit) 22 a pulse light source unit 35 so that the beam LB is generated in response to each clock pulse of one of the clock signal CK p among the plurality of clock signals CK p (clock signal LTC) To control.
- the clock switching unit 204 is output as the clock signal CK p resulting from the generation of the beam LB, that is, the clock signal LTC at the timing when the spot light SP passes through the specific correction point CPP designated on the drawing line SLn.
- the clock signal CK p switch to other different clock signal CK p phase difference. Therefore, the magnification of the drawing line SLn (pattern to be drawn) can be finely corrected, and precise overlay exposure on the micron order can be performed.
- the correction position information (setting value) Nv of the local magnification correction information CMgn (CMg1 to CMg6) can be arbitrarily changed, and is appropriately set according to the magnification of the drawing line SLn.
- the correction position information Nv may be set so that there is one correction point CPP located on the drawing line SLn.
- the value of the correction position information Nv may be changed for each scan of the spot light SP along the drawing line SLn, and each time the spot light SP reaches the correction point CPP during one scan, the correction position information Nv The value may be changed.
- the plurality of correction points CPP are designated at discrete positions on the drawing line SLn, but the interval between the correction points CPP is changed by changing the correction position information Nv. Can be non-uniform. Further, the correction pixel (correction point CPP) is not changed without changing the number of correction pixels on the drawing line SLn for each scanning of the beam LBn (spot light SP) along the drawing line SLn or for each rotation of the polygon mirror PM. ) May be made different.
- the first embodiment can be modified as follows.
- symbol is attached
- the selection optical element AOMn (AOM1) for selectively supplying the beam LBa (LBb) from the light source device LSa (LSb) to any of the scanning units Un (U1 to U6).
- AOM6 were used as acoustooptic modulators. That is, the first-order diffracted light deflected and output with respect to the incident beam by a predetermined diffraction angle is supplied to the scanning unit Un as the drawing beam LBn, but the selection optical elements AOMn (AOM1 to AOM6) An electro-optic deflecting member that does not use the diffraction phenomenon may be used.
- the 14 shows a configuration of a beam switching unit corresponding to one scanning unit Un in the beam switching unit BDU according to the first modification.
- the beam LBa (LBb) from the light source device LSa (LSb) is incident.
- the selection optical element AOM1 shown in FIG. 6 and the unit side include the electro-optical element OSn that transmits and the polarization beam splitter BSn that transmits or reflects the beam according to the polarization characteristics of the beam transmitted through the electro-optical element OSn. It is provided instead of the combination system with the incident mirror IM1.
- the beam transmitted through the electro-optical element OSn becomes linearly polarized light that is polarized in the Y direction while maintaining the polarization state at the time of incidence. Accordingly, when the voltage between the electrodes EJp and EJm is in the off state, the beam from the electro-optical element OSn is 45 in the polarization splitting plane psp (XY plane and YZ plane) of the cubic polarization beam splitter BSn. It passes through the tilted surface as it is.
- the electro-optic element OSn is composed of a crystalline medium or an amorphous medium exhibiting a Pockels effect in which the refractive index changes with the first power of the applied electric field strength, or a Kerr effect in which the refractive index changes with the square of the applied electric field strength. Is done.
- the electro-optic element OSn may be a crystal medium that exhibits a Faraday effect in which the refractive index changes with a magnetic field instead of an electric field.
- FIG. 15 shows a modification 2 in which the optical elements for selection AOM1 to AOM6 and the unit side incident mirrors IM1 to IM6 constituting the beam switching unit BDU shown in FIG. 6 are replaced with the structure of the modification 1 of FIG. Indicates.
- the linearly polarized beam LBa emitted from the light source device LSa as a parallel light beam (with a beam diameter of 1 mm or less) is a beam shifter using an acoustooptic modulator (or acoustooptic deflector) as shown in FIGS.
- the polarizing beam splitter BS1 After passing through the part SFTa in the order of the electro-optical element OS1, the polarizing beam splitter BS1, the electro-optical element OS2, the polarizing beam splitter BS2, the electro-optical element OS3, and the polarizing beam splitter BS3, the light enters the absorber TR1.
- the polarization beam splitter BS1 When an electric field is applied to the electro-optic element OS1, the polarization beam splitter BS1 reflects the beam LBa toward the scanning unit U1 as a drawing beam LB1.
- the polarization beam splitter BS2 reflects the beam LBa as a drawing beam LB2 toward the scanning unit U2, and the polarization beam splitter BS3 reflects to the electro-optic element OS3.
- the beam LBa is reflected as a drawing beam LB3 toward the scanning unit U3.
- an electric field is applied only to the electro-optical element OS2 of the electro-optical elements OS1 to OS3, and the beam LBa emitted from the beam shifter part SFTa is incident only on the scanning unit U2 as a beam LB2.
- a linearly polarized beam LBb emitted as a parallel light beam (a beam diameter of 1 mm or less) from the light source device LSb is electrically transmitted through a beam shifter unit SFTb using an acoustooptic modulator (or acoustooptic deflector).
- the light passes through the optical element OS4, the polarizing beam splitter BS4, the electro-optical element OS5, the polarizing beam splitter BS5, the electro-optical element OS6, and the polarizing beam splitter BS6 in this order, and then enters the absorber TR2.
- the polarizing beam splitter BS4 When an electric field is applied to the electro-optical element OS4, the polarizing beam splitter BS4 reflects the beam LBb as a drawing beam LB4 toward the scanning unit U4, and the polarizing beam splitter BS5 applies an electric field to the electro-optical element OS5. Then, the beam LBb is reflected toward the scanning unit U5 as a drawing beam LB5, and the polarization beam splitter BS6 scans the beam LBb as the drawing beam LB6 when an electric field is applied to the electro-optic element OS6. Reflected toward unit U6. In FIG. 15, the electric field is applied only to the electro-optical element OS6 among the electro-optical elements OS4 to OS6, and the beam LBb emitted from the beam shifter unit SFTb is incident only on the scanning unit U6 as the beam LB6.
- the beam shifter portions SFTa and SFTb are configured as shown in FIG. 16 using acoustooptic deflection elements AODs.
- Acousto-optic deflection elements AODs are driven by high-frequency drive signals HGa and HGb similar to drive signal HFn as high-frequency power from selection element drive control unit 102 shown in FIG.
- a parallel beam LBa (LBb) from the light source device LSa (LSb) is incident on the same axis as the optical axis of the lens CG1 having a focal length f1, and is condensed so as to be a beam waist on the surface pu.
- the deflection point of the acousto-optic deflection element AODs is arranged at the position of the surface pu.
- the drive signal HGa (HGb) is off
- the beam LBa (LBb) that has become a beam waist on the surface pu is not diffracted and enters the lens CG2 at the focal length f2 from the surface pu to become a parallel light beam. It is reflected by the mirror OM and enters the absorber TR3.
- the acousto-optic deflector AODs When the drive signal HGa (HGb) is applied to the acousto-optic deflector AODs, the acousto-optic deflector AODs is a beam LBa (LBb) deflected at a diffraction angle corresponding to the frequency of the drive signal HGa (HGb). First-order diffracted light is generated.
- the first-order diffracted light is referred to herein as a deflected beam LBa (LBb).
- the beam LBa (LBb) emitted from the lens CG2 is a parallel light beam parallel to the optical axis of the lens CG2.
- the light enters the electro-optical element OS1 or OS4 in FIG.
- the beam LBa (LBb) emitted from the lens CG2 is parallel to the optical axis of the lens CG2 and perpendicular to the optical axis. Shift position in the direction.
- the direction of the position shift of the beam LBa (LBb) corresponds to the Z direction on the incident end face of the electro-optic element OSn (OS1 or OS4) shown in FIG. 14, and the shift amount is a change in the frequency of the drive signal HGa (HGb). Corresponds to the quantity.
- the beam shifter portion SFTa (SFTb) is provided in common for the three scanning units U1, U2, U3 (U4, U5, U6).
- the frequency of the drive signal HGa (HGb) applied to the acousto-optic deflection elements AODs is ON for any one of the electro-optic elements OS1 to OS3 or any one of the electro-optic elements OS4 to OS6 in FIG. It is possible to change (frequency modulation) in synchronization with the timing of the state.
- the beam LBa (LBb) passing through the electro-optical elements OS1 to OS3 (OS4 to OS6) is shifted parallel to the Z direction in FIG.
- LBn (LB1 to Lb6) is shifted in parallel in the X direction in FIG.
- the spot light SP of the beam LBn from the scanning unit Un corresponding to the electro-optical element OSn in the on state can be shifted at a high speed by a minute amount in the sub-scanning direction (X direction).
- the deflection action is performed.
- the electro-optic elements OS1 to OS3 (OS4 to OS6) having no beam are used. Therefore, in order to finely adjust the position of the spot light SP in the sub-scanning direction, the beam shifter section SFTa (acousto-optic deflection element AODs having a deflection action) is used. SFTb) is provided.
- FIGS. 17A and 17B show an example of a beam deflecting member that is provided in place of the selection optical elements AOM1 to AOM6 and the acousto-optic deflection elements AODs used in the above-described embodiments and modifications, and does not depend on the diffraction action.
- FIG. 17A shows an electro-optical element ODn in which electrodes EJp and EJm are formed on opposite parallel side surfaces (upper and lower surfaces in FIG. 17A) of a transparent crystal medium formed in a prism shape (triangle) with a predetermined thickness. .
- the crystal medium has a chemical composition of KDP (KH 2 PO 4 ), ADP (NH 4 H 2 PO 4 ), KD * P (KD 2 PO 4 ), KDA (KH 2 AsO 4 ), BaTiO 3 , SrTiO 3 , It is a material represented by LiNbO 3 , LiTaO 3 or the like.
- the beam LBa (LBb) incident from one inclined surface of the electro-optic element ODn is deflected according to the difference between the initial refractive index of the crystal medium and the refractive index of air when the electric field between the electrodes EJp and EJm is zero. And ejected from the other slope.
- the refractive index of the crystal medium changes from the initial value, so that the incident beam LBa (LBb) is different from the initial angle from the other slope.
- the beam LBn is emitted. Even using such an electro-optical element ODn, the beam LBa (LBb) from the light source device LSa (LSb) can be switched and supplied to each of the scanning units U1 to U6 in a time-sharing manner.
- the deflection angle of the emitted beam LBn can be slightly changed at high speed by changing the electric field intensity applied to the electro-optical element ODn
- the spot light SP on the substrate P is sub-directed to the electro-optical element ODn together with the switching function.
- a beam shift function for shifting a slight amount in the scanning direction may also be provided.
- electro-optic elements ODn may be used instead of acousto-optic deflection elements AODs of a single beam shifter portion SFTa (SFTb) as shown in FIG.
- FIG. 17B uses an electro-optical element KDn made of KTN (KTa 1-x Nb x O 3) crystal as disclosed in, for example, Japanese Patent Application Laid-Open No. 2014-081575 and International Publication No. 2005/124398.
- deviation member is shown.
- the electro-optical element KDn is composed of a crystal medium formed in a long prismatic shape along the traveling direction of the beam LBa (LBb), and electrodes EJp and EJm arranged to face each other with the crystal medium interposed therebetween.
- the electro-optical element KDn is housed in a case having a temperature control function so as to be maintained at a constant temperature (for example, 40 degrees).
- the beam LBa (LBb) incident from one end face of the prismatic KTN crystal medium travels straight in the KTN crystal medium and is emitted from the other end face.
- the beam LBa (LBb) passing through the KTN crystal medium is deflected in the direction of the electric field and emitted from the other end face as a beam LBn.
- the KTN crystal medium is also a material whose refractive index changes depending on the strength of the electric field, but a large refractive index change can be obtained with an electric field strength (several hundreds V) that is one digit lower than the various crystal media mentioned above. .
- the deflection angle of the beam LBn emitted from the electro-optical element KDn with respect to the original beam LBa (LBb) is relatively large (for example, 0 to 5 degrees). ) To adjust at high speed.
- the beam LBa (LBb) from the light source device LSa (LSb) can be switched and supplied to each of the scanning units U1 to U6 in a time-sharing manner.
- the deflection angle of the emitted beam LBn can be changed at high speed by changing the electric field intensity applied to the electro-optical element KDn
- the sub-scan of the spot light SP on the substrate P is performed together with the switching function of the electro-optical element KDn. It may also have a function of shifting in the direction.
- the electro-optic element KDn may be used instead of the acousto-optic deflection elements AODs of the single beam shifter portion SFTa (SFTb) as shown in FIG.
- the scanning units Un are used to shift the spot light SP scanned along each drawing line SLn in the sub-scanning direction.
- a mechanical optical shifter by a shift optical member SR (parallel plate Sr2) provided in each of the above and a beam LBn incident on each of the scanning units Un (U1 to U6), an acousto-optic deflection element AODs, an electro-optic element
- An electro-optical shifter that is shifted by OSn, ODn, KDn, or the like is provided.
- the calibration for setting the positional relationship in the sub-scanning direction of the drawing line SLn by the scanning of the spot light SP of the beam LBn from each of the scanning units Un (U1 to U6) to a predetermined state (initial arrangement state or the like).
- a mechanical optical shifter parallel plate Sr2
- an error remaining by the calibration is also measured by an electrooptical shifter (acousto-optic deflection elements AODs, electro-optical elements OSn, ODn, KDn). Further, it can be corrected more finely.
- the beam waist position of the beam LBa (LBb) is finally set to be optically conjugate with the surface of the substrate P (the spot lights SP of the beams LB1 to LB6), the optical element for selection (acoustics) Even if an error occurs in the deflection angle due to changes in the characteristics of the optical modulation elements AOM1 to AOM6, the spot light SP on the substrate P is suppressed from drifting in the sub-scanning direction (Xt direction). Therefore, when finely adjusting the drawing line SLn by the spot light SP in the sub-scanning direction (Xt direction) within a range of about a pixel size (several ⁇ m) for each scanning unit Un, the scanning unit Un shown in FIG.
- the inner parallel plate Sr2 may be tilted. Furthermore, in order to automate the inclination of the parallel plate Sr2, a mechanism such as a small piezo motor or an inclination amount monitoring system may be provided.
- the optical elements for selection (acousto-optic modulation elements) AOM1 to AOM6 are changed slightly so as to have both a beam switching function and a shift function for finely adjusting the position of the spot light SP in the sub-scanning direction.
- the configuration of the second embodiment will be described below with reference to FIGS.
- FIG. 18 is a diagram showing in detail the configuration of the wavelength conversion unit in the pulsed light generation unit 20 of the light source device LSa (LSb) shown in FIG. 7, and FIG. 19 is for the first selection from the light source device LSa (LSb).
- FIG. 20 shows the optical path of the beam LBa (LBb is omitted) to the optical element AOM1
- FIG. 20 shows the configuration of the optical path from the selection optical element AOM1 to the next-stage selection optical element AOM2 and the driver circuit of the selection optical element AOM1.
- FIG. 21 is a diagram for explaining the state of beam selection and beam shift in the selection mirror (branch reflection mirror) IM1 after the selection optical element AOM1
- FIG. 22 is a diagram from the polygon mirror PM to the substrate P. It is a figure explaining behavior of a beam.
- the amplified seed light (beam) Lse is emitted at a small divergence angle (NA: numerical aperture) from the emission end 46a of the fiber optical amplifier 46 in the light source device LSa.
- the lens element GL (GLa) condenses the seed light Lse so as to be a beam waist in the first wavelength conversion element (wavelength conversion optical element) 48. Accordingly, the first-order harmonic beam wavelength-converted by the first wavelength conversion element 48 is incident on the lens element GL (GLb) with a divergence.
- the lens element GLb condenses the first-order harmonic beam so that it becomes a beam waist in the second wavelength conversion element (wavelength conversion optical element) 50.
- the secondary harmonic beam wavelength-converted by the second wavelength conversion element 50 is incident on the lens element GL (GLc) with a divergence.
- the lens element GLc is arranged so that the secondary harmonic beam is turned into a thin beam LBa (LBb) that is substantially parallel and exits from the exit window 20H of the light source device LSa.
- the diameter of the beam LBa emitted from the emission window 20H is several mm or less, and preferably about 1 mm.
- each of the wavelength conversion elements 48 and 50 is set so as to be optically conjugate with the emission end 46a (light emission point) of the fiber optical amplifier 46 by the lens elements GLa and GLb.
- the traveling direction of the generated harmonic beam is slightly inclined due to the change in the crystal characteristics of the wavelength conversion elements 48 and 50, the drift related to the angular direction (azimuth) of the beam LBa emitted from the emission window 20H is suppressed. It is done.
- the lens element GLc and the exit window 20H are shown apart from each other, but the lens element GLc itself may be arranged at the position of the exit window 20H.
- the beam LBa emitted from the exit window 20H travels along the expander optical axis AXj of the two condenser lenses CD0 and CD1, and has a beam diameter of about 1 ⁇ 2 (about 0.5 mm). ), And is incident on the first-stage selection optical element AOM1.
- the beam LBa from the exit window 20H becomes a beam waist at a condensing position Pep between the condensing lens CD0 and the condensing lens CD1.
- the condensing lens CD1 is provided as the condensing lens CD1 in FIG.
- the deflection position PDF (diffraction point) of the beam in the selection optical element AOM1 is set so as to be optically conjugate with the exit window 20H by the expander system using the condenser lenses CD0 and CD1. Further, the condensing position Pep is set so as to be optically conjugate with each of the emission end 46a of the fiber optical amplifier 46 and the wavelength conversion elements 48 and 50 in FIG.
- the deflection direction of the beam of the optical element AOM1 for selection that is, the diffraction direction of the beam LB1 emitted as the first-order diffracted light of the incident beam LBa at the time of switching, (Direction to shift).
- the beam LBa passing through the selection optical element AOM1 is, for example, a parallel light beam having a beam diameter of about 0.5 mm, and the beam LB1 emitted as the first-order diffracted light is also a parallel light beam having a beam diameter of about 0.5 mm. become. That is, in each of the above embodiments (including modifications), the beam LBa (LBb) is converged so as to be a beam waist in the selection optical element AOM1, but in the second embodiment, for selection
- the beam LBa (LBb) passing through the optical element AOM1 is a parallel light beam having a minute diameter.
- the beam LBa transmitted through the selection optical element AOM1 and the beam LB1 deflected as the first-order diffracted light at the time of switching are collimator lenses CL1 (the lens in FIG. 6) arranged coaxially with the optical axis AXj. (Corresponding to CL1).
- the deflection position PDF of the selection optical element AOM1 is set to the position of the front focal point of the collimator lens CL1. Therefore, the beams LBa and LB1 are converged so as to be beam waists on the rear focal plane Pip of the collimator lens (condensing lens) CL1.
- the beam LBa traveling along the optical axis AXj of the collimator lens CL1 is incident on the condenser lens (condenser lens) CD2 shown in FIG. 6 in a state of diverging from the surface Pip, and is again a parallel light beam having a beam diameter of about 0.5 mm. And enters the second-stage selection optical element AOM2.
- the deflection position PDF of the second-stage selection optical element AOM2 is arranged in a conjugate relationship with the deflection position pdf of the selection optical element AOM1 by a relay system including the collimator lens CL1 and the condenser lens CD2.
- the selection mirror IM1 shown in FIG. 6 is arranged in the vicinity of the surface Pip between the collimator lens CL1 and the condenser lens CD2.
- the beams LBa and LB1 become the thinnest beam waist and are separated in the Z direction, so that the arrangement of the reflection surface IM1a of the mirror IM1 is facilitated.
- the deflection position PDF and the surface Pip of the optical element for selection AOM1 have a relationship between the pupil position and the image plane by the collimator lens CL1, and the central axis (mainly) of the beam LB1 from the collimator lens CL1 toward the reflection surface IM1a of the mirror IM1.
- the beam LB1 reflected by the reflecting surface IM1a of the mirror IM1 is converted into a parallel light beam by a collimator lens CL1a equivalent to the condensing lens CD2, and goes to the mirror M10 of the scanning unit U1 shown in FIG.
- the surface Pip has an optically conjugate relationship with the condensing position Pep by the collimator lens CL1 and the condensing lens CD1 in FIG. Accordingly, the plane Pip is in a conjugate relationship with each of the emission end 46a of the fiber optical amplifier 46 and the wavelength conversion elements 48 and 50 of FIG.
- the surface Pip is formed by the relay lens system including the lens elements GLa, GLb, GLc, the condensing lenses CD0, CD1, and the collimating lens CL1, and the emission end 46a of the fiber optical amplifier 46 and the wavelength conversion elements 48, 50. It is set to be conjugate with each of the above.
- the optical axis AXm of the collimator lens CL1a is set coaxially with the irradiation center axis Le1 in FIG. 5, and when the deflection angle of the beam LB1 by the selection optical element AOM1 at the time of switching is a specified angle (reference setting angle), The beam LB1 is incident on the collimator lens CL1a so that the center line (principal ray) is coaxial with the optical axis AXm. Further, as shown in FIG. 20, the reflection surface IM1a of the mirror IM1 reflects only the beam LB1 so as not to block the optical path of the beam LBa, and the beam LB1 reaching the reflection surface IM1a is slightly shifted in the Z direction.
- the size is set so as to reliably reflect the beam LB1.
- spot light is generated by collecting the beam LB1 on the reflecting surface IM1a, so that the reflecting surface IM1a is slightly shifted from the position of the surface Pip. It is preferable to dispose IM1 in the X direction.
- a reflective film dielectric multilayer film having high ultraviolet resistance is formed on the reflective surface IM1a.
- a drive circuit 102A for providing the selection optical element AOM1 with both a beam switching function and a shift function is provided in the selection element drive control unit 102 shown in FIG. It is done.
- the drive circuit 102A receives the correction signal FSS for changing the frequency of the drive signal HF1 to be applied to the selection optical element AOM1 from the reference frequency, and generates a correction high-frequency signal corresponding to the frequency to be corrected with respect to the reference frequency.
- the local oscillation circuit 102A1 VCO: voltage control oscillator, etc.
- the high frequency signal of stable frequency produced by the reference oscillator 102S, and the corrected high frequency signal from the local oscillation circuit 102A1 are combined so that the frequency is added or subtracted.
- the circuit 102A2 and an amplification circuit 102A3 that converts the high frequency signal frequency-synthesized by the mixing circuit 102A2 into a drive signal HF1 amplified to an amplitude suitable for driving the ultrasonic transducer of the selection optical element AOM1.
- the amplifier circuit 102A3 has a switching function for switching the high-frequency drive signal HF1 between a high level and a low level (or amplitude zero) in response to the incident permission signal LP1 generated by the selection element drive control unit 102 of FIG. Yes. Therefore, while the drive signal HF1 is at a high level amplitude (while the signal LP1 is at H level), the selection optical element AOM1 deflects the beam LBa to generate the beam LB1.
- the optical system of the mirror IM1 and the collimator lens CL1a and the drive circuit 102A as shown in FIG. 20 are similarly provided for each of the other optical elements for selection AOM2 to AOM6.
- the local oscillation circuit 102A1 and the mixing circuit 102A2 function as a frequency modulation circuit that changes the frequency of the drive signal HF1 according to the value of the correction signal FSS.
- the frequency of the drive signal HF1 output from the amplifier circuit 102A3 is the specified angle (reference set angle) of the deflection angle of the beam LB1 by the selection optical element AOM1. ) Is set to a specified frequency.
- the correction signal FSS represents the correction amount + ⁇ Fs
- the frequency of the drive signal HF1 is corrected so that the deflection angle of the beam LB1 by the selection optical element AOM1 is increased by ⁇ with respect to the specified angle.
- the frequency of the drive signal HF1 is corrected so that the deflection angle of the beam LB1 by the selection optical element AOM1 is decreased by ⁇ with respect to the specified angle.
- the deflection angle of the beam LB1 changes by ⁇ ⁇ with respect to the specified angle, the position of the beam LB1 incident on the reflection surface IM1a of the mirror IM1 is slightly shifted in the Z direction, and the beam LB1 (parallel light beam) emitted from the collimator lens CL1a Is slightly inclined with respect to the optical axis AXm. This will be further described with reference to FIG.
- FIG. 21 is an optical path diagram exaggeratingly illustrating the shift of the beam LB1 deflected by the selection optical element AOM1.
- the center axis of the beam LB1 is coaxial with the optical axis AXm of the collimator lens CL1a.
- the central axis of the beam LB1 emitted from the collimator lens CL1 is separated by ⁇ SF0 in the ⁇ Z direction from the central axis (optical axis AXj) of the original beam LBa.
- the central axis AXm ′ of the beam LB1 ′ directed toward the mirror IM1 moves from the specified position (position coaxial with the optical axis AXm) by ⁇ SF1 ⁇ SF0, only in the ⁇ Z direction. Shift horizontally (translate).
- the beam LB1 (LB1') is condensed on the surface Pip 'so as to be a beam waist.
- the center axis AXm ′ of the beam LB1 ′ directed from the surface Pip ′ toward the collimator lens CL1a is parallel to the optical axis AXm, and the surface Pip ′ is set at the position of the front focal point of the collimator lens CL1a, thereby exiting from the collimator lens CL1a.
- the beam LB1 ′ is converted into a parallel light beam slightly tilted in the XZ plane with respect to the optical axis AXm.
- the lens system in the scanning unit U1 (the lenses Be1 and Be2, the cylindrical lens CYa, FIG. 5) so that the surface Pip ′ is finally conjugate with the surface of the substrate P (spot light SP).
- CYb, f ⁇ lens TF is arranged.
- FIG. 22 is a diagram of the optical path from one reflecting surface RP (RPa) of the polygon mirror PM in the scanning unit U1 to the substrate P developed from the Yt direction.
- the beam LB1 deflected at a specified angle by the selection optical element AOM1 is incident on the reflection surface RPa of the polygon mirror PM and reflected in a plane parallel to the XtYt plane.
- the beam LB1 incident on the reflecting surface RPa is converged in the Zt direction on the reflecting surface RPa by the first cylindrical lens CYa shown in FIG. 5 in the XtZt plane.
- the beam LB1 reflected by the reflecting surface RPa is deflected at a high speed in accordance with the rotational speed of the polygon mirror PM within a plane parallel to the XtYt plane including the optical axis AXf of the f ⁇ lens FT, and the f ⁇ lens FT and the second cylindrical beam. It is condensed as spot light SP on the substrate P via the lens CYb.
- the spot light SP is one-dimensionally scanned in the direction perpendicular to the paper surface in FIG.
- the beam LB1 ′ laterally shifted by ⁇ SF1 ⁇ SF0 with respect to the beam LB1 on the surface Pip ′ is slightly in the Zt direction with respect to the irradiation position of the beam LB on the reflection surface RPa of the polygon mirror PM. Incident at a position shifted to.
- the optical path of the beam LB1 ′ reflected by the reflecting surface RPa is slightly shifted from the optical path of the beam LB1 in the XtZt plane, passes through the f ⁇ lens FT and the second cylindrical lens CYb, and passes through the substrate P.
- the light is condensed as spot light SP ′.
- the reflection surface RPa of the polygon mirror PM is optically disposed on the pupil plane of the f ⁇ lens FT.
- the RPa and the surface of the substrate P are in a conjugate relationship. Therefore, when the beam LB1 irradiated on the reflection surface RPa of the polygon mirror PM is slightly shifted in the Zt direction as the beam LB1 ′, the spot light SP on the substrate P is changed in the sub-scanning direction as the spot light SP ′. Is shifted by ⁇ SFp.
- the spot light SP can be shifted by ⁇ ⁇ SFp in the sub-scanning direction by changing the frequency of the drive signal HF1 of the selection optical element AOM1 by ⁇ ⁇ Fs from the specified frequency.
- ) is the maximum range of the deflection angle of the selection optical element AOM1 itself, the size of the reflection surface IM1a of the mirror IM1, and the optical system (relay system) up to the polygon mirror PM in the scanning unit U1.
- the magnification Although it is limited by the magnification, the Zt-direction width of the reflection surface of the polygon mirror PM, the magnification from the polygon mirror PM to the substrate P (the magnification of the f ⁇ lens FT), etc., the effective size of the spot light SP on the substrate P ( (Diameter) or a range of pixel dimensions (Pxy) defined on the drawing data.
- the effective size of the spot light SP on the substrate P (Diameter) or a range of pixel dimensions (Pxy) defined on the drawing data.
- a shift amount larger than that may be set.
- the selection optical element AOM1 and the scanning unit U1 have been described, but the same applies to the other selection optical elements AOM2 to AOM6 and the scanning units U2 to U6.
- the selection optical element AOMn uses the beam switching function in response to the incident permission signal LPn (LP1 to LP6) and the spot light SP in response to the correction signal FSS. Since it can also be used for the shift function, the configuration of the beam transmission system (beam switching unit BDU) for supplying the beam to each scanning unit Un (U1 to U6) is simplified. Furthermore, compared to the case where acousto-optic modulators (AOM and AOD) for beam selection and spot light SP shift are separately provided for each scanning unit Un, the heat source can be reduced and the temperature of the exposure apparatus EX can be stabilized. Can increase the sex.
- the drive circuit (102A) for driving the acousto-optic modulator is a large heat source, but is disposed near the acousto-optic modulator because the drive signal HF1 has a high frequency of 50 MHz or higher. Even if a mechanism for cooling the drive circuit (102A) is provided, if the number is large, the temperature in the apparatus tends to rise in a short time, and the drawing accuracy decreases due to fluctuations due to temperature changes of the optical system (lens and mirror). there's a possibility that. For this reason, it is desirable that the number of drive circuits and acousto-optic modulation elements as heat sources be small.
- each of the selection optical elements AOMn (AOM1 to AOM6) changes the deflection angle of the beam LBn deflected as the first-order diffracted light of the incident beam LBa (LBb) under the influence of the temperature change
- this embodiment is performed.
- by providing a feedback control system that adjusts the value of the correction signal FSS given to the drive circuit 102A of FIG. 20 in accordance with a temperature change it is possible to easily cancel the variation in the deflection angle.
- the beam shift function by the selection optical element AOMn of the present embodiment can finely adjust the position of the drawing line SLn by the spot light SPn of the beam LBn from each of the plurality of scanning units Un at high speed in the sub-scanning direction.
- the selection optical element AOM1 shown in FIG. 20 is controlled so that the correction amount by the correction signal FSS is changed every time the incident permission signal LP1 becomes H level, each reflection surface of the polygon mirror PM, that is, spot light.
- the drawing line SL1 can be shifted in the sub-scanning direction within a range of about the pixel size (or spot light size).
- the drawing magnification is set as in the first embodiment.
- the drawing magnification is set as in the first embodiment.
- by shifting the drawing line SLn in the sub-scanning direction as in the second embodiment it is possible to increase the accuracy of splicing at the end of each drawing line SLn during pattern drawing. Become.
- the overlay accuracy can be increased.
- the surface of the substrate P (the position where the beam LBn is condensed as the spot light SP) and the surface Pip ′ in FIG. 21 are set in a conjugate relationship with each other, and the surface Pip ′.
- (Pip) is set in a conjugate relationship with each of the wavelength conversion elements 48 and 50 in the light source device LSa (LSb) and the emission end 46a of the fiber optical amplifier 46. Therefore, with one of the reflecting surfaces of the polygon mirror PM stationary in a certain direction, the beam LBn is projected as a spot light SP on one point on the surface of the substrate P through the f ⁇ lens FT and the cylindrical lens CYb.
- the spot light SP on the substrate P is stationary without being affected by the drift.
- the scanning start position of the spot light SP in the main scanning direction or the drawing start position in response to the origin signal SD is stable without drifting in the main scanning direction. Therefore, pattern drawing can be performed with long-term stable accuracy.
- FIG. 23 is a diagram according to the third embodiment showing a specific configuration of the scanning unit U1 (Un) applied to the second embodiment, and includes the scanning direction (deflection direction) of the beam LB1. It is the figure seen from the plane (XZ plane) orthogonal to a plane (plane parallel to XY plane). In FIG. 23, it is assumed that the optical axis AXf of the f ⁇ lens system FT is arranged parallel to the XY plane, and the reflection mirror M15 at the tip is arranged so that the optical axis AXf is bent at 90 degrees.
- a reflection mirror M10 In the scanning unit U1, along the light transmission path of the beam LB1 from the incident position of the beam LB1 to the irradiated surface (substrate P), a reflection mirror M10, a beam expander BE, a variable flat plate HVP with a variable tilt angle, and an aperture stop PA , A reflection mirror M12, a first cylindrical lens CYa, a reflection mirror M13, a reflection mirror M14, a polygon mirror PM (reflection surface RP), an f ⁇ lens system FT, a reflection mirror M15, and a second cylindrical lens CYb.
- the configuration in FIG. 23 is basically the same as the configuration in FIG. 5, but some parts that are not necessary for explanation are omitted.
- the parallel flat plate Sr2 of the shift optical member SR provided in FIG. 5 is provided as a light transmissive parallel flat plate (quartz plate) HVP.
- the parallel light beam LB1 reflected in the ⁇ Z direction by the mirror IM1 shown in FIG. 6 is incident on the reflection mirror M10 inclined by 45 degrees with respect to the XY plane.
- the reflection mirror M10 reflects the incident beam LB1 in the ⁇ X direction toward the reflection mirror M12 that is separated from the reflection mirror M10 in the ⁇ X direction.
- the beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE and the aperture stop PA and enters the reflection mirror M12.
- the beam expander BE expands the diameter of the transmitted beam LB1.
- the beam expander BE includes a condensing lens Be1 and a collimating lens Be2 that makes the beam LB1 diverged after being converged by the condensing lens Be1 into a parallel light beam.
- This beam expander BE makes it easy to irradiate the aperture portion of the aperture stop PA with the beam LB6.
- a quartz parallel plate HVP whose inclination angle can be changed by a drive motor (not shown) or the like is disposed.
- the drawing line SLn which is the scanning locus of the spot light SP scanned on the substrate P, is slightly changed in the sub-scanning direction (for example, the effective size ⁇ of the spot light SP). It can be shifted by several times to several ten times.
- the reflection mirror M12 is disposed at an inclination of 45 degrees with respect to the YZ plane, and reflects the incident beam LB1 in the ⁇ Z direction toward the reflection mirror M13 that is separated from the reflection mirror M12 in the ⁇ Z direction.
- the beam LB1 reflected in the ⁇ Z direction by the reflection mirror M12 passes through the first cylindrical lens CYa (first optical member) and then reaches the reflection mirror M13.
- the reflection mirror M13 is disposed with an inclination of 45 degrees with respect to the XY plane, and reflects the incident beam LB1 in the + X direction toward the reflection mirror M14.
- the beam LB1 reflected by the reflection mirror M13 is reflected by the reflection mirror M14 and projected onto the polygon mirror PM.
- One reflecting surface RP of the polygon mirror PM reflects the incident beam LB1 in the + X direction toward the f ⁇ lens system FT having the optical axis AXf extending in the X-axis direction.
- the drawing line SLn can be shifted in the sub-scanning direction by changing the inclination angle of the parallel flat plate HVP provided between the lens systems Be1 and Be2 constituting the beam expander BE.
- 24A and 24B illustrate how the drawing line SLn shifts due to the inclination of the parallel flat plate HVP.
- FIG. 24A shows the parallel plane HVP where the parallel incident surface and exit surface are the center lines of the beam LBn (mainly It is a figure which shows the state which is 90 degree
- the parallel plane HVP has an incident plane and an exit plane that are inclined from 90 degrees with respect to the center line (principal ray) of the beam LBn, that is, the parallel plane HVP is an angle ⁇ with respect to the YZ plane. It is a figure which shows the state which inclined.
- the position of the aperture stop PA is approximately the position of the pupil when viewed from the position of the reflecting surface RP of the polygon mirror PM (or the position of the front focal point of the f ⁇ lens system FT) with respect to the sub-scanning direction by the first cylindrical lens CYa. It is set to be.
- the aperture stop PA is disposed so as to be optically conjugate with the position of the entrance pupil which is the position of the front focal point of the f ⁇ lens system FT.
- the center line of the beam LBn (here, the divergent light beam) that passes through the parallel plate HVP and enters the lens system Be2 is very small in the ⁇ Z direction with respect to the optical axis AXe.
- the beam LBn emitted from the lens system Be2 is converted into a parallel light beam, and the center line of the beam LBn is slightly inclined with respect to the optical axis AXe.
- the beam LBn parallel light beam
- the beam LBn that has passed through the circular aperture of the aperture stop PA is accurately cut in the sub-scanning direction within the XZ plane with respect to the optical axis AXe in a state where the intensity of the skirt of 1 / e 2 on the intensity distribution is accurately cut. It goes toward the first cylindrical lens CYa at the rear stage at a slightly inclined angle.
- the aperture stop PA corresponds to the pupil position when viewed from the reflection surface RP of the polygon mirror PM with respect to the sub-scanning direction, and according to the tilt angle of the beam LBn that has passed through the circular aperture of the aperture stop PA with respect to the sub-scanning direction.
- the position on the reflecting surface of the beam LBn (converged with respect to the sub-scanning direction) incident on the reflecting surface RP of the polygon mirror PM is slightly shifted. Therefore, the beam LBn reflected by the reflecting surface RP of the polygon mirror PM is also slightly shifted in the Z direction with respect to the plane parallel to the XY plane including the optical axis AXf of the f ⁇ lens system FT shown in FIG. The light enters the lens system FT.
- the beam LBn incident on the second cylindrical lens CYb is slightly tilted in the sub-scanning direction, and the position of the spot light SP of the beam LBn projected on the substrate P can be slightly shifted in the sub-scanning direction. .
- FIG. 25 is a block diagram showing the configuration of the control device 16 of the exposure apparatus EX (pattern drawing apparatus) according to the fourth embodiment.
- the polygon drive control unit 100, the selection element drive control unit 102, the beam control device 104 (exposure control unit 116), the mark position detection unit 106, and the rotation position detection unit 108 constituting the control device 16 are The configuration is the same as that shown in FIG.
- representatively, only the state where the beam LBa from the light source device LSa is supplied to the scanning unit U1 is schematically shown.
- the selection optical element AOM1, the collimator lens CL1, and the unit-side incident mirror IM1 are shown as follows.
- a servo control system DU including a piezo motor for inclining a parallel plate HVP as a mechanical optical beam shifter in the scanning unit U1 with a predetermined stroke, and an underlayer measuring unit MU are provided.
- the underlayer measurement unit MU has a circuit configuration that digitally samples the waveform change of the photoelectric signal from the photodetector DT (see FIG. 5) in the scanning unit U1 at high speed, and the spot light SP is used for overlay exposure.
- the main scan direction and sub-scan direction of the base pattern Or a relative positional error (overlapping error) between a new pattern to be overlaid and a ground pattern is measured.
- the measurement result measured by the underlayer measurement unit MU particularly information relating to the overlay error, is used to generate the correction signal FSS applied to the drive circuit 102A in the selection element drive control unit 102 shown in FIG. . In this way, by providing the photodetector DT (see FIG.
- the sub-scan of the pattern drawn on the substrate P is performed by continuously changing the inclination angle ⁇ of the parallel plate HVP for each scanning unit Un.
- the direction dimension can be expanded and contracted by a minute ratio. Therefore, even if the substrate P is partially expanded and contracted in the longitudinal direction (sub-scanning direction) of the substrate P, a base pattern (first pattern) for the electronic device formed on the substrate P together with the alignment mark MKn. It is possible to maintain good overlay accuracy when overlay exposure (drawing) is performed on the pattern for the second layer with respect to (single layer pattern). For example, as shown in FIG.
- the local expansion and contraction of the substrate P in the longitudinal direction is formed at both sides in the width direction of the substrate P at a constant pitch (for example, 10 mm).
- the alignment marks MK1 and MK4 can be measured by detecting them with the alignment microscope AM1m shown in FIG. Specifically, as shown in FIG. 4, the alignment marks MK1 and MK4 are sequentially imaged by the image pickup device by the alignment microscopes AM11 and AM14, and the change in the mark position in the longitudinal direction (change in the mark pitch, etc.) Measurement can be performed by the exposure control unit 116 using the detection unit 106, the rotation position detection unit 108, and the like.
- the exposure control unit 116 changes the servo control system DU according to the movement position (or movement amount) of the substrate P in the sub-scanning direction.
- a control command for sequentially tilting the parallel plate HVP is given. Accordingly, the pattern drawing position can be gradually adjusted in the sub-scanning direction in conjunction with the movement position of the substrate P, and a decrease in accuracy of the overlay exposure for the substrate P with large expansion and contraction can be suppressed.
- the parallel plate HVP is also used to adjust the distance in the sub-scanning direction (the transport direction of the substrate P) between the odd-numbered drawing lines SL1, SL3, SL5 and the even-numbered drawing lines SL2, SL4, SL6. Can do. For example, when a gradual change occurs in the conveyance speed of the substrate P, the pattern drawn with odd-numbered drawing lines and the pattern drawn with even-numbered drawing lines are micron in the sub-scanning direction due to the speed fluctuation. It will be out of order and the splicing accuracy will deteriorate. Therefore, the rotational position detection unit 108 that counts measurement signals from encoders ENja and ENjb (only representative EN1a and EN2a are shown in FIG.
- a fluctuation (speed fluctuation of the substrate P) may be detected, and the inclination of the parallel plate HVP may be driven by the servo control system DU in accordance with the increase / decrease amount of the fluctuation.
- a mechanical optical beam shifter (beam position adjusting member, first adjusting member) using a parallel plate HVP is used for coarse adjustment of position adjustment of the spot light SP in the sub-scanning direction, and the optical element for selection shown in FIG.
- Electro-optical beam shifter (beam position adjusting member, second adjusting member, second adjusting member) by AOM1 (or acousto-optic deflecting elements AODs shown in FIG. 16 and electro-optical elements ODn, KDn, etc. shown in FIG. 17).
- the adjusting optical member may be used in combination for fine adjustment of the position adjustment of the spot light SP in the sub-scanning direction. As shown in FIG.
- the parallel flat plate HVP and the selection optical element AOM1 (AOMn) are combined, the parallel flat plate HVP as a mechanical optical beam shifter is spot light on the substrate P within a tiltable stroke range.
- the SP can be displaced by several tens of pixels (for example, about ⁇ 100 ⁇ m) in the sub-scanning direction.
- the selection optical element AOM1 (AOMn) as an electro-optical beam shifter is used as the spot light SP on the substrate P.
- the value of the correction signal FSS is changed every time the incident permission signal LPn shown in FIG. 10 is generated.
- the position of the spot light SP in the sub-scanning direction can be finely adjusted at high speed for each scan. Therefore, it is possible to reduce the drawing quality when drawing a fine pattern, in particular, the joining error when the pattern drawn by each of the plurality of drawing lines SLn is joined in the main scanning direction.
- the drawing is performed.
- Information on the overlay error at the joint portion measured by the underlayer measurement unit MU provided in the scanning unit U1 for drawing the pattern by the line SL1, and the scanning unit U2 for drawing the pattern by the drawing line SL2.
- the splicing error can be confirmed.
- the position in the sub-scanning direction on the substrate P drawn by the drawing line SL1 is moved by the drawing line SL2 after the substrate P has moved by the interval in the sub-scanning direction between the drawing line SL1 and the drawing line SL2. Since drawing is performed, there is a time difference corresponding to the movement time corresponding to the interval, but the overlay error measurement by the underlayer measurement unit MU should be performed sequentially for each appropriate movement amount of the substrate P (for example, every 1 mm or every 5 mm). For example, the tendency of splicing error (whether or not the error has increased) can be grasped.
- the splicing error is reduced so that the splicing error is reduced in the selection element drive control unit 102 provided corresponding to at least one of the scanning unit U1 and the scanning unit U2.
- the correction signal FSS applied to the drive circuit 102A is adjusted based on information on the joint error measured by the underlayer measurement unit MU, and scanned along at least one of the drawing line SL1 and the drawing line SL2. What is necessary is just to finely adjust the position of the spot light SP in the sub-scanning direction.
- the tiltable parallel flat plate Sr2 as a mechanical optical beam shifter (position adjusting member, first adjusting member) that shifts the beam LBn (spot light SP) in the sub-scanning direction
- the HVP is provided in the optical path from the mirror M10 to the polygon mirror PM in the scanning unit Un, but may be provided in the optical path from the polygon mirror PM to the substrate P.
- a mechanical optical beam shifter may be provided in the optical path from the unit side incident mirror IMn (IM1 to IM6) of the beam switching unit BDU to the mirror M10 of the scanning unit Un.
- the mechanical optical beam shifter (first adjusting member, first adjusting optical member) can shift the spot light SP of the beam LBn in the sub-scanning direction within a relatively large range. Since an error depending on the accuracy tends to remain, an electro-optic beam shifter (second adjusting member, second adjusting optical member) can be used in combination to reduce the residual error.
- the electro-optical beam shifter is preferably provided in front of the mechanical optical beam shifter along an optical path along which the beams LBa and LBb from the light source devices LSa and LSb travel.
- the lens systems Be1 and Be2 constituting the beam expander BE are provided as convex lens systems having positive refractive power as shown in FIG.
- the lens system Be1 that receives the beam LBn reflected by the reflecting mirror M10 may be replaced with a concave lens system Be1 ′ having negative refractive power.
- FIG. 26 schematically exaggerates the state of the beam LBn in the optical path from the reflection mirror M10 to the aperture stop PA among the optical paths in the scanning unit (drawing unit) Un shown in FIG.
- the beam LBn reflected by the reflecting mirror M10 becomes a thin parallel light beam having an effective beam diameter of 1 mm or less and enters the concave lens system Be1 ′.
- the lens system Be1 ′ causes the incident beam LBn to enter the convex lens system Be2 having a positive refractive power while diverging in accordance with the focal length of the lens system Be1 ′.
- the beam LBn emitted from the convex lens system Be2 by matching the position of the front focal length of the concave lens system Be1 ′ with the position of the front focal length of the convex lens system Be2 is as described in FIG.
- the light beam becomes a parallel light beam with an effective beam diameter expanded toward the aperture stop PA.
- the beam expander using the concave lens system Be1 ′ and the convex lens system Be2 can shorten the physical distance between the two lens systems compared to the beam expander using the two convex lens systems Be1 and Be2.
- the drawing line SLn that is the scanning locus of the spot light SP on the substrate P is mechanically optically measured in the sub-scanning direction (X direction). Only the parallel plate HVP to be shifted was provided. However, in order to finely adjust the entire drawing line SLn in the main scanning direction (Y direction), a parallel flat plate HVPx as a shifter for the X direction and a parallel flat plate HVPy as a shifter for the Y direction are set on the optical axis AXe.
- the lens system Be1 ′ and the lens system Be2 may be juxtaposed.
- the rotation center axis Sy for inclining the parallel plate HVPx and the rotation center axis Sx for inclining the parallel plate HVPy are orthogonal to each other in a plane orthogonal to the optical axis AXe (parallel to the YZ plane).
- a parallel plate HVPy as a mechanical optical shifter for finely adjusting the entire drawing line SLn in the main scanning direction (Y direction) may be provided after the f ⁇ lens system FT as shown in FIG.
- FIG. 27 shows an optical system arrangement from the polygon mirror PM to the substrate P in the scanning unit (drawing unit) Un shown in FIG. Since the beam LBn is scanned in the main scanning direction (Y direction) after the f ⁇ lens system FT, a parallel plate HVPy is provided between the reflection mirror M15 and the second cylindrical lens CYb as shown in FIG. In this case, the parallel flat plate HVPy is set to a length approximately equal to the dimension in the Y direction of the cylindrical lens CYb.
- the rotation center axis Sx for inclining the parallel flat plate HVPy in FIG. 27 in a plane parallel to the YZ plane is set parallel to the X axis and is bent by the reflecting mirror M15 to be parallel to the Z axis. It is set to be orthogonal to the optical axis AXf of the f ⁇ lens system FT.
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Abstract
Description
図1は、第1の実施の形態の基板(被照射体)Pに露光処理を施す露光装置EXを含むデバイス製造システム10の概略構成を示す図である。なお、以下の説明においては、特に断わりのない限り、重力方向をZ方向とするXYZ直交座標系を設定し、図に示す矢印にしたがって、X方向、Y方向、およびZ方向を説明する。
上記第1の実施の形態は、以下のような変形が可能である。なお、上記の実施の形態と同一の構成については同様の符号を付し、異なる箇所を中心に説明する。
上記の第1の実施の形態では、光源装置LSa(LSb)からのビームLBa(LBb)を走査ユニットUn(U1~U6)のいずれかに選択的に供給するための選択用光学素子AOMn(AOM1~AOM6)を音響光学変調素子とした。すなわち、入射ビームに対して所定の回折角で偏向されて出力される1次回折光を描画用のビームLBnとして走査ユニットUnに供給しているが、選択用光学素子AOMn(AOM1~AOM6)は、回折現象を使わない電気光学偏向部材であっても良い。図14は、変形例1によるビーム切換部BDU内の1つの走査ユニットUnに対応したビーム切換部の構成を示し、本変形例では、光源装置LSa(LSb)からのビームLBa(LBb)を入射する電気光学素子OSnと、電気光学素子OSnを透過したビームの偏光特性に応じて、ビームを透過または反射する偏光ビームスプリッタBSnとが、先の図6に示した選択用光学素子AOM1とユニット側入射ミラーIM1との組み合せ系の代わりに設けられる。
図15は、図6に示したビーム切換部BDUを構成する選択用光学素子AOM1~AOM6とユニット側入射ミラーIM1~IM6とを、図14の変形例1の構成に置き換えた場合の変形例2を示す。光源装置LSaから平行光束(ビーム径は1mm以下)として射出される直線偏光のビームLBaは、図6、図9に示したような音響光学変調素子(又は音響光学偏向素子)を用いたビームシフター部SFTaを介して、電気光学素子OS1、偏光ビームスプリッタBS1、電気光学素子OS2、偏光ビームスプリッタBS2、電気光学素子OS3、偏光ビームスプリッタBS3の順に通った後、吸収体TR1に入射する。偏光ビームスプリッタBS1は、電気光学素子OS1に電界が印加されたとき、ビームLBaを描画用のビームLB1として走査ユニットU1に向けて反射する。同様に、偏光ビームスプリッタBS2は、電気光学素子OS2に電界が印加されたとき、ビームLBaを描画用のビームLB2として走査ユニットU2に向けて反射し、偏光ビームスプリッタBS3は、電気光学素子OS3に電界が印加されたとき、ビームLBaを描画用のビームLB3として走査ユニットU3に向けて反射する。図15では、電気光学素子OS1~OS3のうちの電気光学素子OS2のみに電界が印加され、ビームシフター部SFTaから射出されるビームLBaがビームLB2として走査ユニットU2のみに入射している。
図17A及びBは、上記の実施形態や変形例で使われた選択用光学素子AOM1~AOM6や音響光学偏向素子AODsの代わりに設けられ、回折作用によらないビーム偏向部材の一例を示す。図17Aは、所定の厚みでプリズム状(三角形)に形成された透過性の結晶媒体の対向する平行な側面(図17Aでは上下面)に電極EJp、EJmが形成された電気光学素子ODnを示す。結晶媒体は、化学組成として、KDP(KH2PO4)、ADP(NH4H2PO4)、KD*P(KD2PO4)、KDA(KH2AsO4)、BaTiO3、SrTiO3、LiNbO3、LiTaO3等で表される材料である。電気光学素子ODnの一方の斜面から入射したビームLBa(LBb)は、電極EJp、EJm間の電界が零のときは、結晶媒体の初期の屈折率と空気の屈折率との差に応じて偏向されて、他方の斜面から射出する。電極EJp、EJm間に一定値以上の電界が印加されると、結晶媒体の屈折率が初期値から変化するため、入射したビームLBa(LBb)は、他方の斜面から初期の角度と異なる角度で射出するビームLBnとなる。このような電気光学素子ODnを用いても、光源装置LSa(LSb)からのビームLBa(LBb)を、走査ユニットU1~U6の各々に時分割でスイッチングして供給することができる。また、電気光学素子ODnに印加する電界強度を変えることで、射出するビームLBnの偏向角を微少に高速に変えられるので、電気光学素子ODnにスイッチング機能と共に、基板P上のスポット光SPを副走査方向に微少量シフトさせるビームシフト機能を併せ持たせても良い。さらに、図16のような単独のビームシフター部SFTa(SFTb)の音響光学偏向素子AODsの代わりに電気光学素子ODnを用いても良い。
次に、第2の実施の形態について説明する。なお、上記の実施の形態(変形例も含む)と同様の構成については同一の符号を付し、異なる箇所のみを説明する。上記実施の形態として説明した図6の構成では、集光レンズCDとコリメータレンズ(コリメートレンズ)LCによる多数のリレー系によって、光源装置LSa(LSb)からのビームLBa(LBb)に複数のビームウェスト(集光点)を作り、そのビームウェストの位置の各々に選択用光学素子(音響光学変調素子)AOM1~AOM6を配置した。ビームLBa(LBb)のビームウェスト位置は、最終的に基板Pの表面(ビームLB1~LB6の各スポット光SP)と光学的に共役になるように設定されているため、選択用光学素子(音響光学変調素子)AOM1~AOM6の特性変化等によって偏向角に誤差が生じても、基板P上のスポット光SPが副走査方向(Xt方向)にドリフトすることが抑制される。そのため、走査ユニットUn毎に、スポット光SPによる描画ラインSLnを副走査方向(Xt方向)に画素寸法(数μm)程度の範囲で微調整する場合は、先の図5に示した走査ユニットUn内の平行平板Sr2を傾ければよい。さらに平行平板Sr2の傾斜を自動化するには、小型のピエゾモータや傾斜量のモニター系といった機構を設ければよい。
図23は、上記第2の実施の形態に適用される走査ユニットU1(Un)の具体的な構成を示す第3の実施の形態による図であり、ビームLB1の走査方向(偏向方向)を含む平面(XY平面と平行な平面)と直交する平面(XZ平面)からみた図である。なお、図23では、fθレンズ系FTの光軸AXfがXY面と平行に配置され、先端の反射ミラーM15が光軸AXfを90度で折り曲げるように配置されるものとする。走査ユニットU1内には、ビームLB1の入射位置から被照射面(基板P)までのビームLB1の送光路に沿って、反射ミラーM10、ビームエキスパンダーBE、傾斜角可変の平行平板HVP、開口絞りPA、反射ミラーM12、第1のシリンドリカルレンズCYa、反射ミラーM13、反射ミラーM14、ポリゴンミラーPM(反射面RP)、fθレンズ系FT、反射ミラーM15、および、第2のシリンドリカルレンズCYbが設けられる。図23の構成は、基本的に図5の構成と同じであるが、一部説明に不要な部材等は省略してある。そして本実施の形態では、図5で設けられていたシフト光学部材SRの平行平板Sr2を、光透過性の平行平板(石英板)HVPとして設ける。
図25は、第4の実施の形態による露光装置EX(パターン描画装置)の制御装置16の構成を示すブロック図である。図25において、制御装置16を構成するポリゴン駆動制御部100、選択素子駆動制御部102、ビーム制御装置104(露光制御部116)、マーク位置検出部106、および、回転位置検出部108は、先の図9に示した構成と同じである。また、図25では、代表して、光源装置LSaからのビームLBaが走査ユニットU1に供給されている状態のみを模式的に表し、選択用光学素子AOM1、コリメートレンズCL1、ユニット側入射ミラーIM1は図20と同様に配置され、反射ミラーM10から第2のシリンドリカルレンズCYbまでの走査ユニットU1は図23と同様に構成されるものとする。本実施の形態では、走査ユニットU1内の機械光学的なビームシフターとしての平行平板HVPを所定のストロークで傾斜する為のピエゾモータ等を含むサーボ制御系DUと、下地層計測部MUとが設けられる。下地層計測部MUは、走査ユニットU1内の光検出器DT(図5参照)からの光電信号の波形変化を高速にデジタルサンプリングする回路構成を有し、重ね合せ露光の為にスポット光SPが基板P上に既に形成されている下地パターン(金属層、絶縁層、半導体層等に対応)を走査したときに発生する反射光の強度変化に基づいて、下地パターンの主走査方向や副走査方向に関する位置、或いは重ね合せ露光される新たなパターンと下地パターンとの相対的な位置誤差(重ね誤差)を計測する。下地層計測部MUで計測される計測結果、特に重ね誤差に関する情報は、図20に示した選択素子駆動制御部102内のドライブ回路102Aに印加される補正信号FSSを生成する為に利用される。このように、走査ユニットUnの各々に光検出器DT(図5参照)を設け、位置計測部としての下地層計測部MUを設けることにより、アライメント用のマークMKnが無い被露光領域(図4のデバイス形成領域)W内での重ね合せ精度の確認、或いはパターン露光中の基板Pの移動位置(デバイス形成領域Wの移動位置)を確認することができる。
以上の各実施の形態や変形例では、ビームLBn(スポット光SP)を副走査方向にシフトさせる機械光学的なビームシフター(位置調整部材、第1調整部材)としての傾斜可能な平行平板Sr2、又はHVPを、走査ユニットUn内のミラーM10からポリゴンミラーPMまでの光路中に設けたが、ポリゴンミラーPMから基板Pまでの光路中に設けても良い。さらに、機械光学的なビームシフターは、ビーム切換部BDUのユニット側入射ミラーIMn(IM1~IM6)から走査ユニットUnのミラーM10までの光路中に設けても良い。先に説明したように、機械光学的なビームシフター(第1調整部材、第1調整光学部材)は、ビームLBnのスポット光SPを比較的に大きな範囲で副走査方向にシフトできるが、機械的な精度に依存した誤差が残留し易いので、残留誤差の低減する為に電気光学的なビームシフター(第2調整部材、第2調整光学部材)を併用することができる。その場合、電気光学的なビームシフターは、光源装置LSa、LSbからのビームLBa、LBbが進む光路に沿って機械光学的なビームシフターの手前に設けるのが良い。
走査ユニット(描画ユニット)Unの各々には、ビームエキスパンダーBEを構成するレンズ系Be1、Be2が先の図23に示したように、正の屈折力を有する凸レンズ系で設けられているが、図26に示すように、反射ミラーM10で反射されたビームLBnを入射するレンズ系Be1を、負の屈折力を有する凹のレンズ系Be1’に替えても良い。図26は、図23に示した走査ユニット(描画ユニット)Un内の光路のうち、反射ミラーM10から開口絞りPAまでの光路におけるビームLBnの状態を模式的に誇張して示したものである。反射ミラーM10で反射されるビームLBnは、実効的なビーム径が1mm以下の細い平行光束となって凹のレンズ系Be1’に入射する。レンズ系Be1’は、入射したビームLBnをレンズ系Be1’の焦点距離に応じて発散させながら、正の屈折力を有する凸のレンズ系Be2に入射させる。凹のレンズ系Be1’の前側焦点距離の位置と、凸のレンズ系Be2の前側焦点距離の位置とを一致させることにより、凸のレンズ系Be2から射出するビームLBnは、図23で説明したように、実効的なビーム径が拡大された平行光束となって開口絞りPAに向かう。凹のレンズ系Be1’と凸のレンズ系Be2によるビームエキスパンダーは、2つの凸のレンズ系Be1、Be2によるビームエキスパンダーに比べて、2つのレンズ系の間の物理的な距離を短くできる。
描画ラインSLnの全体を主走査方向(Y方向)に微調整する為の機械光学的なシフターとしての平行平板HVPyは、図27に示すように、fθレンズ系FTの後に設けても良い。図27は、図23に示した走査ユニット(描画ユニット)Un内のポリゴンミラーPMから基板Pまでの光学系配置を示したものである。fθレンズ系FTの後では、ビームLBnが主走査方向(Y方向)に走査されている為、図27のように、反射ミラーM15と第2のシリンドリカルレンズCYbとの間に平行平板HVPyを設ける場合は、平行平板HVPyをシリンドリカルレンズCYbのY方向の寸法と同程度の長さに設定する。さらに、図27の平行平板HVPyをYZ面と平行な面内で傾ける為の回転中心軸Sxは、X軸と平行に設定されると共に、反射ミラーM15で折り曲げられてZ軸と平行になったfθレンズ系FTの光軸AXfと直交するように設定される。
Claims (19)
- 基板上にスポットとして集光される描画ビームを第1方向に走査してパターンを描画する描画ユニットが前記第1方向に複数配置され、前記基板の前記第1方向と交差する第2方向への移動により、複数の前記描画ユニットで描画されるパターンを前記第1方向に継ぎ合わせて描画するパターン描画装置であって、
前記複数の描画ユニットによって描画すべき前記基板上の被露光領域の位置を計測する位置計測部と、
前記描画ユニットの各々で描画されるパターンの前記被露光領域に対する位置誤差を低減する為に、前記位置計測部で計測された位置に基づいて前記描画ユニットの各々による前記スポットの位置を前記基板の移動中に前記第2方向に調整する第1調整部材と、
前記描画ユニットの各々で描画されるパターンの前記第2方向に関する継ぎ誤差を低減する為に、前記描画ユニットの各々による前記スポットの位置を前記基板の移動中に前記第1調整部材よりも高い応答性で前記第2方向に調整する第2調整部材と、
を備える、パターン描画装置。 - 請求項1に記載のパターン描画装置であって、
前記基板は、前記第2方向を長尺方向とする可撓性を持ったシート基板であって、前記第2方向に沿って所定の設計間隔で形成された複数のマークを有し、
前記位置計測部は、前記シート基板の移動方向に関して前記描画ユニットによるパターンの描画位置の上流側で、前記複数のマークの各々の位置を順次検出するマーク位置検出部を備える、パターン描画装置。 - 請求項2に記載のパターン描画装置であって、
前記第1調整部材は、前記マーク位置検出部によって検出される前記複数のマークの各々の前記第2方向に関する間隔の前記設計間隔に対する誤差に応じて前記スポットの位置を前記第2方向に調整する、パターン描画装置。 - 請求項3に記載のパターン描画装置であって、
前記複数の描画ユニットの各々は、前記描画ビームを前記第1方向に対応した方向に角度を変えて反射させる複数の反射面を有する回転多面鏡と、前記回転多面鏡の反射面で反射された前記描画ビームを前記基板上でスポットに集光する走査用光学系と、を備え、
前記第1調整部材は、前記回転多面鏡の反射面に投射される前記描画ビームの位置を、前記回転多面鏡の反射面上で前記第2方向に対応した方向に機械的な駆動によりシフトさせる機械光学シフターである、パターン描画装置。 - 請求項4に記載のパターン描画装置であって、
前記描画ビームを生成する光源装置をさらに備え、
前記第2調整部材は、前記光源装置から前記第1調整部材の間に設けられ、前記回転多面鏡の反射面に投射される前記描画ビームの位置を、前記回転多面鏡の反射面上で前記第2方向に対応した方向に、電気的な物性制御でシフトさせる電気光学シフターである、パターン描画装置。 - 請求項5に記載のパターン描画装置であって、
電気光学シフターは、駆動信号として印加される高周波電力の周波数に応じて偏向角が調整できる音響光学変調素子または音響光学偏向素子である、パターン描画装置。 - 請求項4に記載のパターン描画装置であって、
前記基板には、前記複数のマークと共に下地パターンが形成されており、
前記複数の描画ユニットの各々は、前記描画ビームのスポットの走査により前記下地パターンに重ね合せ露光すべき新たなパターンを描画している間、前記スポットが前記下地パターンを走査したときに発生する反射光の変化を検出する光検出器を備え、
前記位置計測部は、前記複数の描画ユニットの各々の前記光検出器からの光電信号に基づいて、前記下地パターンを基準として、前記描画ユニットの各々で描画される前記新たなパターンの間の継ぎ誤差を計測する下地層計測部を含む、パターン描画装置。 - 請求項7に記載のパターン描画装置であって、
前記第2調整部材は、前記下地層計測部で計測される前記継ぎ誤差が低減されるように、前記スポットの位置を前記第2方向に調整する、パターン描画装置。 - 第1方向に配置された複数の描画ユニットの各々から投射される描画ビームのスポットを基板上で前記第1方向に走査し、前記基板を前記第1方向と交差する第2方向に移動させて、前記複数の描画ユニットの各々で描画されるパターンを前記第1方向に継いで描画するパターン描画方法であって、
前記基板に形成された基準パターンの位置を前記基板の移動中に検出し、前記基板上の被露光領域の位置を計測する計測段階と、
前記描画ユニットの各々で描画されるパターンを、前記計測段階で計測された位置に基づいて前記被露光領域に位置合わせする為に、前記描画ユニットの各々による前記スポットの位置を前記基板の移動中に前記第2方向に調整する第1の調整段階と、
前記描画ユニットの各々で描画されるパターンの前記第2方向に関する継ぎ誤差を低減する為に、前記描画ユニットの各々による前記スポットの位置を、前記第1の調整段階よりも微細に前記第2方向に調整する第2の調整段階と、
を含む、パターン描画方法。 - 請求項9に記載のパターン描画方法であって、
前記基板は、前記第2方向を長尺方向とする可撓性を持ったシート基板であって、前記基準パターンは前記第2方向に沿って所定の設計間隔で形成された複数のマークであり、
前記計測段階は、前記シート基板の移動方向に関して前記描画ユニットによるパターンの描画位置の上流側で、前記複数のマークの各々の位置を順次検出する、パターン描画方法。 - 請求項10に記載のパターン描画方法であって、
前記第1の調整段階は、前記計測段階で検出される前記複数のマークの各々の前記第2方向に関する間隔の前記設計間隔に対する誤差に応じて、前記スポットの位置を前記第2方向に調整する、パターン描画方法。 - 請求項11に記載のパターン描画方法であって、
前記複数の描画ユニットの各々は、前記描画ビームを前記第1方向に対応した方向に角度を変えて反射させる複数の反射面を有する回転多面鏡と、前記回転多面鏡の各反射面で反射された前記描画ビームを前記基板上でスポットに集光する走査用光学系と、を備え、
前記第1の調整段階では、前記回転多面鏡の各反射面に投射される前記描画ビームの位置を、前記回転多面鏡の反射面上で前記第2方向に対応した方向に調整部材の機械的な駆動によりシフトさせる、パターン描画方法。 - 請求項12に記載のパターン描画方法であって、
前記基板には、前記複数のマークと共に下地パターンが形成されており、
前記複数の描画ユニットの各々は、前記描画ビームのスポットの走査により前記下地パターンに重ね合せ露光すべき新たなパターンを描画している間、前記スポットが前記下地パターンを走査したときに発生する反射光の変化を検出する光検出器が設けられ、
前記計測段階では、前記複数の描画ユニットの各々の前記光検出器からの光電信号に基づいて、前記下地パターンを基準として、前記描画ユニットの各々で描画される前記新たなパターンの間の継ぎ誤差を計測する、パターン描画方法。 - 請求項13に記載のパターン描画方法であって、
前記第2の調整段階は、前記計測段階で計測される前記継ぎ誤差が低減されるように、前記スポットの位置を前記第2方向に調整する、パターン描画方法。 - 基板上に描画すべきパターンに応じて強度変調された描画ビームを主走査方向に1次元走査する回転多面鏡と、1次元走査された前記描画ビームを前記基板上にスポット光として集光する走査用光学系とを備え、前記スポット光の前記主走査方向の走査と、前記基板と前記スポット光との前記主走査方向と交差した副走査方向への相対移動とによって、前記基板上にパターンを描画するパターン描画装置であって、
前記主走査方向に1次元走査される前記スポット光を前記副走査方向に位置調整する為に、前記回転多面鏡に入射する前の前記描画ビームの光路中、又は前記回転多面鏡から前記基板までの前記描画ビームの光路中に配置される機械光学的な第1調整部材と、
前記主走査方向に1次元走査される前記スポット光を前記副走査方向に位置調整する為に、前記回転多面鏡に入射する前の前記描画ビームの光路中であって、前記第1調整部材よりも手前の光路中に配置される電気光学的な第2調整部材と、
を備える、パターン描画装置。 - 請求項15に記載のパターン描画装置であって、
前記第1調整部材は、前記回転多面鏡の反射面に入射する前記描画ビームの位置を、前記回転多面鏡の反射面上で前記副走査方向に対応した方向に機械的な駆動によりシフトさせる傾斜可能な透過性の平行平板である、パターン描画装置。 - 請求項16に記載のパターン描画装置であって、
前記描画ビームを生成する光源装置をさらに備え、
前記第2調整部材は、前記光源装置から前記第1調整部材の間に設けられ、前記回転多面鏡の反射面に入射する前記描画ビームの位置を、前記回転多面鏡の反射面上で前記副走査方向に対応した方向に、電気的な物性制御でシフトさせる電気光学シフターである、パターン描画装置。 - 請求項17に記載のパターン描画装置であって、
電気光学シフターは、駆動信号として印加される高周波電力の周波数に応じて偏向角が調整できる音響光学変調素子または音響光学偏向素子である、パターン描画装置。 - 請求項16~18のいずれか一項に記載のパターン描画装置であって、
前記回転多面鏡の反射面に入射する前記描画ビームの前記主走査方向に対応した方向のビーム径を拡大する為に、所定の間隔で配置される2つのレンズ系によるビームエキスパンダーを、更に備え、
前記第1調整部材としての前記平行平板は、前記2つのレンズ系の間に設けられる、パターン描画装置。
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