WO2016139829A1 - 架橋性樹脂組成物および電線・ケーブル - Google Patents
架橋性樹脂組成物および電線・ケーブル Download PDFInfo
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- WO2016139829A1 WO2016139829A1 PCT/JP2015/072810 JP2015072810W WO2016139829A1 WO 2016139829 A1 WO2016139829 A1 WO 2016139829A1 JP 2015072810 W JP2015072810 W JP 2015072810W WO 2016139829 A1 WO2016139829 A1 WO 2016139829A1
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- WIPO (PCT)
- Prior art keywords
- hindered amine
- stabilizer
- resin composition
- molecular weight
- mass
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 109
- 239000003381 stabilizer Substances 0.000 claims abstract description 86
- -1 amine compound Chemical class 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 37
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- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 30
- 239000011247 coating layer Substances 0.000 claims abstract description 22
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- 239000004611 light stabiliser Substances 0.000 claims description 84
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 13
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- 238000001125 extrusion Methods 0.000 abstract description 33
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- 230000000052 comparative effect Effects 0.000 description 41
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- 238000003860 storage Methods 0.000 description 17
- 238000002844 melting Methods 0.000 description 14
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- 230000001771 impaired effect Effects 0.000 description 6
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- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 240000005572 Syzygium cordatum Species 0.000 description 3
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- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
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- HCILJBJJZALOAL-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)-n'-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyl]propanehydrazide Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 HCILJBJJZALOAL-UHFFFAOYSA-N 0.000 description 2
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- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 2
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 2
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- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 2
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 2
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- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
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- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 2
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- 238000007906 compression Methods 0.000 description 2
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- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
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- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- YFHKLSPMRRWLKI-UHFFFAOYSA-N 2-tert-butyl-4-(3-tert-butyl-4-hydroxy-5-methylphenyl)sulfanyl-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(SC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 YFHKLSPMRRWLKI-UHFFFAOYSA-N 0.000 description 1
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- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- SWZOQAGVRGQLDV-UHFFFAOYSA-N 4-[2-(4-hydroxy-2,2,6,6-tetramethylpiperidin-1-yl)ethoxy]-4-oxobutanoic acid Chemical compound CC1(C)CC(O)CC(C)(C)N1CCOC(=O)CCC(O)=O SWZOQAGVRGQLDV-UHFFFAOYSA-N 0.000 description 1
- ZAAQJFLUOUQAOG-UHFFFAOYSA-N 4-benzyl-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=CC=CC=2)=C1 ZAAQJFLUOUQAOG-UHFFFAOYSA-N 0.000 description 1
- YKVAWSVTEWXJGJ-UHFFFAOYSA-N 4-chloro-2-methylsulfanylthieno[3,2-d]pyrimidine Chemical compound CSC1=NC(Cl)=C2SC=CC2=N1 YKVAWSVTEWXJGJ-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
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- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- PNVJTZOFSHSLTO-UHFFFAOYSA-N Fenthion Chemical compound COP(=S)(OC)OC1=CC=C(SC)C(C)=C1 PNVJTZOFSHSLTO-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
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- 125000000217 alkyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 1
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- 239000000314 lubricant Substances 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
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- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
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- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/372—Sulfides, e.g. R-(S)x-R'
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
Definitions
- the present invention relates to a crosslinkable resin composition and an electric wire / cable. More specifically, the present invention relates to a crosslinkable resin composition having an excellent electrical insulation containing an ethylene-based resin, and a conductor using the crosslinked product of the resin composition as an insulating coating layer. It relates to electric wires and cables formed above.
- Insulated coated electric wires / cables for electric power are usually produced by coating a crosslinkable resin composition on a conductor by extrusion molding and then cross-linking this to form an insulating coating layer.
- the crosslinkable resin composition used for insulation-coated wires and cables is required to have resistance to blooming and discoloration, scorch resistance, processing stability, water tree resistance, heat distortion resistance, heat aging resistance, etc.
- the present applicant as a stabilizer, in a crosslinkable resin composition containing an ethylene-based resin, a stabilizer and an organic peroxide, a hindered phenol type stabilizer and And dialkylthiodipropionate type stabilizers and hindered amine type stabilizers have been proposed (see Patent Document 1 below).
- the length (production unit) of the electric wire / cable continuously manufactured by extrusion molding is as long as possible. This is because the length of the electric wire / cable production unit can reduce the number of these connection joints, thereby reducing the probability of destruction of the power system.
- the screen mesh is clogged and clogged by a scorch (partially crosslinked) resin component and a relatively high viscosity stabilizer in an extruder charged with a crosslinkable resin composition to form a cable insulation coating layer.
- a scorch partially crosslinked
- a relatively high viscosity stabilizer in an extruder charged with a crosslinkable resin composition to form a cable insulation coating layer.
- a limit switch is usually activated when the internal pressure reaches a certain value or more in order to prevent the screen mesh from bursting or overloading the motor. Thus, the extrusion operation is stopped. When the extrusion operation stops, the production unit cannot be set to the desired length.
- the present inventors include 100 parts by mass of an ethylene-based resin and 0.001 to 0.5 parts by mass of a hindered amine light stabilizer having a melting point or glass transition point of 100 ° C. or less.
- a crosslinkable resin composition containing a stabilizer and 0.5 to 3.0 parts by mass of an organic peroxide and having a molecular weight of 1,500 or less for all the compounds constituting the stabilizer is proposed. (See Japanese Patent Application No. 2014-244512).
- this crosslinkable resin composition it is difficult to cause a pressure increase in the extruder in which it is introduced, and the insulating coating layer can be continuously extruded over a long period of time.
- the length can be increased.
- this crosslinkable resin composition the hindered amine light stabilizer as a constituent component bleeds out, so that the content of the hindered amine light stabilizer decreases with time. There is a problem that the activity of the organic peroxide that has been maintained by the aging decreases with time. For this reason, this crosslinkable resin composition cannot be stored for a long period of time.
- the content rate of the hindered amine light stabilizer in a crosslinkable resin composition is high (for example, when it is 0.01 mass part or more with respect to 100 mass parts of ethylene-type resin), the hindered amine type which bleeds out. Since the amount of the light stabilizer is also increased, when such a crosslinkable resin composition is extruded, the crosslinkable resin composition slips with respect to the screw, whereby the extrusion amount (discharge amount) of the resin composition. Fluctuates and there is a problem that stable extrusion cannot be performed.
- the present invention has been made based on the above situation.
- the object of the present invention is to prevent pressure rise and discharge rate fluctuations in the inserted extruder, and to stably perform the extrusion molding of the insulation coating layer over a long period of time.
- An object of the present invention is to provide a crosslinkable resin composition that can increase the length of production units and is excellent in long-term storage.
- Another object of the present invention is to provide an electric wire / cable capable of making the production unit longer than that produced using a conventionally known crosslinkable resin composition.
- the crosslinkable resin composition of the present invention comprises 100 parts by mass of an ethylene resin (A) and a stabilizer (B) containing 0.001 to 0.5 parts by mass of a hindered amine light stabilizer (B3), A resin composition containing 0.5 to 3.0 parts by mass of an organic peroxide (C),
- the hindered amine light stabilizer (B3) is a mixture of a low molecular weight hindered amine compound having a molecular weight of 100 to 1,000 and a high molecular weight hindered amine compound having a molecular weight of 1,500 to 5,000, The reduced viscosity of the hindered amine light stabilizer (B3) measured at a temperature of 40 ° C.
- the hindered amine light stabilizer (B3) has a reduced viscosity of 2.0 to 3.5 cm 3 / g.
- the hindered amine light stabilizer (B3) preferably has a weight average molecular weight (Mw) of 700 to 2,300.
- the ratio of the high molecular weight hindered amine compound to the hindered amine light stabilizer (B3) is preferably 30 to 60% by mass.
- the stabilizer (B) together with the hindered amine type light stabilizer (B3), a hindered phenol type stabilizer (B1) and a dialkylthiodipropionate type stabilizer. It is preferable to contain an agent (B2).
- a suitable crosslinkable resin composition of the present invention comprises 100 parts by mass of an ethylene-based resin (A), 0.01 to 1.0 part by mass of a hindered phenol type stabilizer (B1), 0.005 to 0.6 parts by mass of a dialkylthiodipropionate type stabilizer (B2), 0.001 to 0.5 parts by mass of a hindered amine type light stabilizer (B3), A resin composition containing 0.5 to 3.0 parts by mass of an organic peroxide (C),
- the hindered amine type light stabilizer (B3) comprises 40 to 70% by mass of a low molecular weight type hindered amine compound having a molecular weight of 100 to 1,000, and 60 to 30% by mass of a high molecular weight type hindered amine compound having a molecular weight of 1,500 to 5,000.
- a mixture of The reduced viscosity of the hindered amine light stabilizer (B3) measured at a temperature of 40 ° C. according to ISO 1628-1 or JIS K7367-1 is measured at a temperature of 3.9 to 5.4 cm 3 / g and a temperature of 110 ° C.
- the hindered amine light stabilizer (B3) has a reduced viscosity of 2.5 to 3.5 cm 3 / g
- the hindered amine light stabilizer (B3) has a weight average molecular weight (Mw) of 900 to 2,100.
- the electric wire / cable of the present invention is characterized in that a conductor is coated with an insulating coating layer formed by crosslinking the crosslinkable resin composition of the present invention.
- the crosslinkable resin composition of the present invention it is difficult for pressure rise and fluctuation of discharge amount to occur in an extruder into which the crosslinkable resin composition is charged, and the insulation coating layer can be stably extruded continuously for a long time. Thus, it is possible to increase the length of the production unit of electric wires and cables.
- the crosslinkable resin composition of the present invention is excellent in long-term storage because the hindered amine light stabilizer (B3) hardly bleeds out.
- the production unit can be made longer than the electric wire / cable manufactured using a conventionally known crosslinkable resin composition. Therefore, by using the wire / cable (long production unit) of the present invention, the number of connection joints between production units can be reduced, thereby greatly reducing the probability of power system failure. Can do.
- the crosslinkable resin composition of the present invention contains an ethylene resin (A), a stabilizer (B) containing a hindered amine light stabilizer (B3), and an organic peroxide (C).
- the ethylene resin (A) constituting the crosslinkable resin composition of the present invention is not particularly limited, and is a high pressure method low density ethylene homopolymer, a high pressure method low density ethylene copolymer, a high density ethylene copolymer. Examples thereof include a polymer, a medium density ethylene copolymer, a linear low density ethylene copolymer, and a linear ultra low density ethylene copolymer.
- ethylene (co) polymers can be produced by a conventionally known method, and can be used alone or in combination of two or more resins as the ethylene-based resin (A).
- Examples of the polymerization catalyst used in the production of the ethylene-based resin (A) include radical generation catalysts such as organic peroxides, azo compounds, oxygen, etc.
- Examples of legal methods include Ziegler catalysts, Phillips catalysts, metallocene catalysts, and the like.
- the ⁇ -olefin to be copolymerized with ethylene in the production of the ethylene-based resin (A) comprising a copolymer, propylene, butene-1, hexene-1, 4-methylpentene-1, octene-1, decene are used.
- -1 can be exemplified.
- Suitable ethylene-based resin (A) the density of 0.91 ⁇ 0.94g / cm 3, in particular 0.915 ⁇ 0.930g / cm 3, melt mass flow rate of 0.01 ⁇ 10 g / 10 min
- a high pressure method low density ethylene homopolymer, a high pressure method low density ethylene copolymer, and a linear low density ethylene copolymer of 0.5 to 5 g / 10 min can be mentioned.
- the insulation coating layer finally formed has poor wear resistance.
- the insulating coating layer finally formed There is a tendency for flexibility to be inferior.
- an ethylene resin having an excessively low melt mass flow rate is inferior in processability, whereas when an ethylene resin having an excessively high melt mass flow rate is used, the mechanical strength, heat distortion resistance, There is a tendency for the roundness to decrease.
- the stabilizer (B) constituting the crosslinkable resin composition of the present invention contains a hindered amine light stabilizer (B3) as an essential component.
- a stabilizer (B) can be used individually or in combination of 2 or more types.
- Examples of the stabilizer (B) other than the hindered amine type light stabilizer (B3) include light stabilizers other than the hindered amine type light stabilizer (B3), an antioxidant, and a processing stabilizer.
- the hindered amine light stabilizer (B3) which is an essential stabilizer (B), is a mixture of a low molecular weight hindered amine compound having a molecular weight of 100 to 1,000 and a high molecular weight hindered amine compound having a molecular weight of 1,500 to 5,000. It is.
- Examples of the low molecular weight type hindered amine compound include a compound represented by the following general formula (1), and a dimer or tetramer of the compound (in this case, R 1 is a divalent to tetravalent group). These can be used alone or in combination of two or more.
- X —C (O) —, —CH 2 — Y: —O—, —CH 2 —, —NH—, —N (CH 3 ) —, —N (C 2 H 5 ) —, —O—C (O) — R 1 : —H, —C n H 2n + 1 , —C 6 H 5 , —C 6 H 4 —CH 3 , —C 6 H 3 (CH 3 ) 2 , —C 6 H 4 —C 2 H 5, -C 6 H 11, -CR 3 R 4 -, (When R 1 is a divalent group, a group represented by Y is bonded to both ends of this group to form a dimer.)
- R 1 is a trivalent group, a group represented by Y is bonded to the end of this group to form a trimer, and when R 1 is a tetravalent group, the end of this group is A group represented by Y is bonded to form a tetramer.
- R 2 —H, —C n H 2n + 1 , —C 6 H 5 , —C 6 H 4 —CH 3 , —C 6 H 3 (CH 3 ) 2 , —C 6 H 4 —C 2 H 5 , —C 6 H 11 , —CR 3 R 4 —, —O—C n H 2n + 1 , —O—C 6 H 5 , —O—C 6 H 4 —CH 3 , —O—C 6 H 3 (CH 3 ) 2 , —O—C 6 H 4 —C 2 H 5 , —O—C 6 H 11 , —O—C 6 H 10 —CH 3 , —O—C 6 H 9 (CH 3 ) 2 , —O—C 6 H 10 —C 2 H 5 ⁇ R 3: -H, -C n H 2n + 1, -C 6 H 5, -C 6 H a R 5 b (OH) (5-ab) R 4
- the molecular weight of the low molecular weight type hindered amine type light stabilizer is 100 to 1,000, preferably 400 to 900.
- low molecular weight hindered amine light stabilizer examples include tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) butane-1,2,3,4-tetracarboxylate (LA from ADEKA). -52), 2,2,6,6-tetramethyl-4-piperidyl methacrylate (LA-87 made by ADEKA), bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate (made by ADEKA) LA-77 or BASF T INUVIN 770) and the like, and these can be used alone or in combination of two or more.
- Examples of the high molecular weight hindered amine compound include compounds represented by the following general formulas (2) to (6), and these can be used alone or in combination of two or more.
- the molecular weight of the high molecular weight type hindered amine light stabilizer (weight average molecular weight when used in combination of two or more) is 1,500 to 5,000, preferably 2,000 to 4,000. .
- the resin composition obtained by using a low molecular weight type hindered amine compound and a high molecular weight type hindered amine compound in combination as the hindered amine type light stabilizer (B3) is less likely to cause an increase in pressure and fluctuation in the discharge amount in the extruder in which the resin composition is added.
- the insulating coating layer can be stably extruded continuously for a long time.
- the obtained resin composition is excellent also in long-term storage property.
- the proportion of the high molecular weight type hindered amine compound in the hindered amine type light stabilizer (B3) is preferably 30 to 60% by mass.
- the high molecular weight type hindered amine compound and the low molecular weight type hindered amine compound are mixed in a well-balanced manner, and it is possible to reliably suppress both the pressure rise and the discharge amount fluctuation in the extruder into which the resulting resin composition is charged.
- the resin composition obtained also has excellent long-term storage properties.
- the reduced viscosity measured at a temperature of 40 ° C. according to ISO 1628-1 or JIS K 7367-1 is 3.5 to 5. It is 5 cm 3 / g, preferably 3.9 to 5.4 cm 3 / g.
- the reduced viscosity measured at a temperature of 110 ° C. according to ISO 1628-1 or JIS K 7367-1 is 2.0 to 3.5 cm 3 / g, preferably 2.5 to 3.5 cm 3 / g.
- a hindered amine type light stabilizer when the reduced viscosity at 40 ° C. exceeds 5.5 cm 3 / g or the reduced viscosity at 110 ° C. exceeds 3.5 cm 3 / g, such a high-viscosity hindered amine is used.
- the mold light stabilizer causes clogging (clogging) of the screen mesh in the extruder, leading to an increase in pressure in the extruder, and the extrusion cannot be performed for a long time (Comparative Examples 4 to 5 and Comparative Examples 7 to 5 described later). 8).
- a hindered amine light stabilizer having a reduced viscosity at 40 ° C. of less than 3.5 cm 3 / g or a reduced viscosity at 110 ° C. of less than 2.0 cm 3 / g is likely to cause bleed-out.
- the discharge amount fluctuates during extrusion molding and the extrusion stability is impaired (see Comparative Examples 1 and 2 described later), or the long-term storage property is impaired (described later). (See Comparative Example 3 and Comparative Example 6).
- the weight average molecular weight (Mw) of the hindered amine light stabilizer (B3) constituting the crosslinkable resin composition of the present invention is preferably 700 to 2,300, more preferably 900 to 2,100.
- a hindered amine light stabilizer which is a mixture of at least one low molecular weight type hindered amine compound and at least one high molecular weight type hindered amine compound.
- the weight average molecular weight (Mw) is a calculated value calculated from the following formula from the molecular weight (M i ) and molar fraction (n i ) of the hindered amine compound constituting the mixture.
- the hindered amine type light stabilizer (B3) having a weight average molecular weight (Mw) of 700 or more, particularly 900 or more hardly causes bleed-out, and the resin composition containing the hindered amine type light stabilizer (B3) has good long-term storability. There is little fluctuation in the discharge amount from the machine, and the extrusion stability is also excellent.
- a resin composition containing a hindered amine type light stabilizer having a weight average molecular weight (Mw) of 2,300 or less, particularly 2,100 or less has a low rate of pressure increase in an extruder into which the hindered amine type light stabilizer is introduced, and is extruded for a long time. Molding can be performed.
- the content of the hindered amine type light stabilizer (B3) in the crosslinkable resin composition of the present invention is 0.001 to 0.5 parts by mass, preferably 0 to 100 parts by mass of the ethylene resin (A). 0.003 to 0.1 parts by mass, more preferably 0.005 to 0.02 parts by mass.
- Resin compositions that do not contain the hindered amine light stabilizer (B3) or whose content is excessively low can be stored for a long period of time because the activity of the organic peroxide (C), which will be described later, decreases significantly over time. Can not do it.
- generated by the secondary decomposition of organic peroxide (C) increases, and an electrical property (insulating property) is impaired (refer the comparative example 9 mentioned later). On the other hand, if this content is excessive, the effect on storage stability is saturated, and the electrical characteristics and heat aging resistance may be impaired.
- the crosslinkable resin composition of the present invention may contain a stabilizer (B) other than the hindered amine type light stabilizer (B3).
- a stabilizer (B) include a hindered phenol type stabilizer (B1) and a dialkylthiodipropionate type stabilizer (B2).
- Examples of the hindered phenol type stabilizer (B1) that is an optional stabilizer (B) include those having a hindered phenol structure and a molecular weight of 1,500 or less.
- hindered phenol type stabilizer (B1) examples include 4,4′-thiobis- (3-methyl-6-tert-butylphenol) (Sinox BCS manufactured by Cypro Kasei Co., Ltd.), 4,4′-thiobis- (6-t-butyl-o-cresol) (Etanox 736 manufactured by Ethyl Corporation), tetrakis [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate] methane (BASF Irganox 1010), N, N′-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionyl] hydrazine (Irganox 1024 from BASF), 1,3,5- Tris (4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanuric acid (Cyanox 1790 manufactured by Cytec), 1,3, 5-trimethyl-2,4-6-tris (3,5-d-d
- the content of the hindered phenol type stabilizer (B1) is preferably 0.01 to 1.0 part by weight, more preferably 0.02 to 0 part per 100 parts by weight of the ethylene resin (A). .5 parts by mass.
- Examples of the optional stabilizer (B), dialkylthiodipropionate type stabilizer (B2), include those having an alkyl having 10 to 20 carbon atoms and having a molecular weight of 1,500 or less. .
- dialkylthiodipropionate type stabilizer (B2) which is an optional stabilizer (B) include dilauryl thiodipropionate (DLTP “Yoshitomi” manufactured by Yoshitomi Pharmaceutical Co., Ltd.), distearyl thiodipropionate ( Examples include Yoshitomi Pharmaceutical's DSTP “Yoshitomi”) and dimyristyl thiodipropionate (Yoshitomi Pharmaceutical's DMTP "Yoshitomi”). These may be used alone or in combination of two or more thereof as component (B2). Can be used.
- the content of the dialkylthiodipropionate type stabilizer (B2) is preferably 0.005 to 0.6 parts by mass, more preferably 0.01 to 100 parts by mass of the ethylene resin (A). To 0.3 parts by mass.
- Organic peroxide (C) constituting the crosslinkable resin composition of the present invention examples include known compounds used as a crosslinking agent for ethylene resins.
- Specific examples of the organic peroxide (C) include di-t-butyl-peroxide, 1,1-bis-t-butyl-peroxybenzoate, 2,2-bis-t-butyl-peroxybutane, t-butyl-peroxybenzoate, dicumyl peroxide, 2,5-dimethyl-2,5-di-t-butyl-peroxyhexane, t-butyl-cumyl peroxide, 2,5-dimethyl-2,5 -Di-t-butyl-peroxyhexyne-3 can be mentioned, and these can be used alone or in combination of two or more.
- the content of the organic peroxide (C) is usually 0.5 to 3.0 parts by mass with respect to 100 parts by mass of the ethylene resin (A), preferably Is 1.0 to 2.5 parts by mass.
- the content of the organic peroxide (C) is less than 0.5 parts by mass, the heat-resistant deformation property of the finally formed insulating coating layer is inferior. On the other hand, when this content exceeds 3.0 mass parts, the scorch resistance of the crosslinkable resin composition obtained is inferior.
- the crosslinkable resin composition of the present invention includes the ethylene resin (A), the stabilizer (B) containing the hindered amine light stabilizer (B3), and the organic peroxide (C).
- Olefin resins other than the ethylene resin (A), various additives, and auxiliary materials may be contained depending on the purpose of use within a range that does not impair the properties of the resin composition.
- the optional olefin resin examples include ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-maleic acid.
- examples thereof include a copolymer, an ethylene-diene compound copolymer, an ethylene-vinylsilane copolymer, a maleic anhydride grafted ethylene polymer, an acrylic acid grafted ethylene polymer, and a silane grafted ethylene polymer.
- additives and auxiliary materials which are optional components include stabilizers other than the stabilizer (B), processability improver, dispersant, copper damage inhibitor, antistatic agent, lubricant, carbon black, Examples thereof include a crosslinking aid such as allyl cyanurate and a scorch inhibitor such as ⁇ -methylstyrene dimer.
- the crosslinkable resin composition of the present invention contains essential components [ethylene resin (A), stabilizer (B) and organic peroxide (C)] and optional components in a predetermined ratio, kneaded and granulated. Can be prepared.
- the crosslinkable resin composition of the present invention is preferably in the form of pellets having an average particle diameter of about 2 to 7 mm from the viewpoint of easy penetration into the screw of the extruder, handling properties, and the like.
- a method for producing a pellet-like crosslinkable resin composition for example, (I) Ethylene resin (A), stabilizer (B), organic peroxide (C) and optional components are blended, and this blend is mixed with a known kneader (for example, a Banbury mixer, a continuous mixer, a roll, Using a twin screw extruder, etc., and melting and kneading by heating at a temperature not lower than the melting point of the ethylene resin (A) and lower than the decomposition temperature of the organic peroxide (C), and the resulting resin composition is pelletized Granulating into a shape; (Ii) Ethylene resin (A), stabilizer (B) and optional components are blended, and this blend is melt kneaded by heating at a temperature equal to or higher than the melting point of ethylene resin (A) using a known kneader.
- a known kneader for example, a Banbury mixer, a continuous mixer, a roll, Using
- the kneaded product obtained is granulated into pellets, and then the organic peroxide (C) which is heated to the melting point or higher and made liquid is added to the pellet-shaped kneaded product, and if necessary, A method of uniformly dispersing the organic peroxide (C) in the pellet by aging at a temperature lower than the melting point of the ethylene resin (A) can be mentioned.
- the electric wire / cable of the present invention is formed by covering a conductor with an insulating coating layer formed by crosslinking the crosslinkable resin composition of the present invention, that is, an insulating coating layer made of a crosslinked product of the resin composition.
- the electric wire / cable of the present invention is manufactured by coating the crosslinkable resin composition of the present invention on a conductor mainly made of copper or aluminum by extrusion molding, and forming an insulating coating layer by crosslinking this. be able to.
- the first layer of the internal semiconductive layer resin composition is formed by a three-layer extruder, the crosslinkable resin composition of the present invention.
- a layered product composed of a second layer made of a material and a third layer made of an external semiconductive layer resin composition is coated on the conductor at a temperature not lower than the melting temperature of each resin and lower than the decomposition temperature of the organic peroxide (C). Then, it can be produced by crosslinking the resin composition by heating it above the decomposition temperature of the organic peroxide (C) in an atmosphere of nitrogen, water vapor, silicone oil, molten salt or the like.
- the electric wire / cable of the present invention is excellent in various properties such as mechanical properties, electrical properties (insulation of the coating layer), long-term storage properties, and at the time of production (extrusion molding process) There is little fluctuation in the discharge amount, and continuous and stable extrusion can be performed for a long time.
- the present invention is not limited to these examples.
- the ethylene-based resin, the stabilizer and the organic peroxide used for producing the resin compositions of Examples and Comparative Examples are as follows.
- the reduced viscosity of each of the stabilizers shown below and the hindered amine type light stabilizer (B3) which is a mixture of stabilizers is determined according to ISO 1628-1 or JIS K7367-3 (2002).
- the mixture was made into diluted solutions having different concentrations with xylene, and the dynamic viscosity was measured at 40 ° C. and 110 ° C. with a capillary viscometer, and then converted into a reduced viscosity.
- Stabilizer (B2-1): -Dialkylthiodipropionate type stabilizer (B2) with molecular weight 682 ⁇
- Example 1 According to the formulation shown in Table 1 below, 100 parts by mass of the resin (A-1), 0.1 part by mass of the stabilizer (B1-1) as the hindered phenol stabilizer (B1), and 0 of the stabilizer (B1-2) 0.1 part by mass, 0.1 part by mass of a stabilizer (B2-1) as a dialkylthiodipropionate type stabilizer (B2), and 0.1% by mass of a stabilizer (B3-1) as a hindered amine type light stabilizer (B3) A mixture of 0035 parts by mass and 0.0015 parts by mass of stabilizer (B3-3) was kneaded with a Banbury mixer at a temperature of 180 ° C.
- Example 2 According to the prescription shown in the following Table 1, as a hindered amine type light stabilizer (B3), a stabilizer ( A crosslinkable resin composition of the present invention was obtained in the same manner as in Example 1 except that 0.003-1 part by mass of B3-1) and 0.0025 part by mass of stabilizer (B3-3) was used.
- Example 3 According to the formulation shown in Table 1 below, a mixture of 0.002 parts by mass of stabilizer (B3-1) and 0.003 parts by mass of stabilizer (B3-3) was used as the hindered amine type light stabilizer (B3). Obtained a crosslinkable resin composition of the present invention in the same manner as in Example 1.
- Example 4 According to the formulation shown in Table 1 below, a mixture of 0.01 part by weight of stabilizer (B3-1) and 0.01 part by weight of stabilizer (B3-3) was used as the hindered amine type light stabilizer (B3). Obtained a crosslinkable resin composition of the present invention in the same manner as in Example 1.
- Example 5 According to the formulation shown in Table 1 below, a mixture of 0.0025 parts by mass of stabilizer (B3-2) and 0.0025 parts by mass of stabilizer (B3-3) was used as the hindered amine type light stabilizer (B3). Obtained a crosslinkable resin composition of the present invention in the same manner as in Example 1.
- ⁇ Comparative Example 1> In accordance with the formulation shown in Table 1 below, a comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that 0.02 part by mass of the stabilizer (B3-1) was used as the hindered amine type light stabilizer. .
- Example 2 A comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that 0.01 parts by mass of the stabilizer (B3-1) was used as a hindered amine type light stabilizer according to the formulation shown in Table 1 below. .
- Example 3 A comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that 0.005 part by mass of the stabilizer (B3-1) was used as a hindered amine type light stabilizer according to the formulation shown in Table 1 below. .
- ⁇ Comparative example 4> According to the formulation shown in Table 1 below, as a hindered amine type light stabilizer, a mixture of 0.0015 parts by mass of stabilizer (B3-1) and 0.0035 parts by mass of stabilizer (B3-3) (at 40 ° C. and 110 ° C. A comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that a mixture having an excessively reduced viscosity was used.
- Example 5 A comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that 0.005 part by mass of the stabilizer (B3-3) was used as a hindered amine type light stabilizer according to the formulation shown in Table 1 below. .
- ⁇ Comparative Example 6> In accordance with the formulation shown in Table 1 below, a comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that 0.005 part by mass of the stabilizer (B3-2) was used as the hindered amine type light stabilizer. .
- ⁇ Comparative Example 7> According to the formulation shown in the following Table 1, as a hindered amine type light stabilizer, a mixture of 0.0025 parts by mass of stabilizer (B3-1) and 0.0025 parts by mass of stabilizer (B3-4) (at 40 ° C. and 110 ° C. A comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that a mixture having an excessively reduced viscosity was used.
- ⁇ Comparative Example 8> In accordance with the formulation shown in Table 1 below, a comparative crosslinkable resin composition was obtained in the same manner as in Example 1 except that 0.005 part by mass of the stabilizer (B3-4) was used as the hindered amine type light stabilizer. .
- the crosslinkable resin compositions obtained in Examples 1 to 5 had a low pressure increase rate in the extruder into which the crosslinkable resin compositions were put, and more than 20% during extrusion. Torque fluctuation is not recognized and the discharge rate is stable. Therefore, these crosslinkable resin compositions are excellent in extrusion stability. Therefore, according to the crosslinkable resin compositions obtained in Examples 1 to 5, the insulating coating layer can be continuously and stably extruded over a long period of time, and the production unit of electric wires and cables can be lengthened. Can be achieved. In addition, the crosslinkable resin compositions obtained in Examples 1 to 5 have small changes in the maximum torque value before and after storage under heating conditions, and are excellent in long-term storage. In addition, the amount of water generation is small and the water-resistant tree resistance is excellent, and it is suitable as an insulating coating material for electric wires and cables.
- the resin compositions obtained in Comparative Examples 1 and 2 contain only a low molecular weight type hindered amine compound as the hindered amine type light stabilizer, and the reduced viscosity of the hindered amine type light stabilizer at 40 ° C. and 110 ° C. Since it is too small, torque fluctuation is large and extrusion stability is poor.
- the resin compositions obtained in Comparative Example 3 and Comparative Example 6 contain only the low molecular weight type hindered amine compound as the hindered amine type light stabilizer, and the reduced viscosity of the hindered amine type light stabilizer at 40 ° C. and 110 ° C. is too low. Therefore, it is inferior to long-term storage property.
- the resin compositions obtained in Comparative Example 4 and Comparative Example 7 have a high reduced viscosity at 40 ° C. and 110 ° C. of the hindered amine type light stabilizer, and therefore the pressure increase rate in the extruder into which the hindered amine type light stabilizer is charged is high.
- the extrusion stability is inferior.
- the resin compositions obtained in Comparative Example 5 and Comparative Example 8 contain only a high molecular weight type hindered amine compound as a hindered amine type light stabilizer, and the reduced viscosity at 40 ° C. and 110 ° C. of the hindered amine type light stabilizer is excessive. Therefore, the rate of pressure increase in the extruder into which this is introduced is high, and the extrusion stability is poor.
- the crosslinkable resin composition obtained in Comparative Example 9 does not contain a hindered amine light stabilizer, it is inferior in long-term storage property and water-resistant tree property.
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Abstract
Description
ここに、絶縁被覆電線・ケーブルに使用される架橋性樹脂組成物には、ブルーミングや変色に対する抵抗性、耐スコーチ性、加工安定性、耐水トリー性、耐熱変形性、耐熱老化性などが要求される。
電線・ケーブルの生産単位を長尺化することによれば、これらの接続ジョイントの数を少なくすることができ、これにより、電力系統の破壊確率を減少させることができるからである。
本発明の目的は、投入した押出機内において圧力上昇および吐出量の変動を起こしにくく、長時間にわたり連続して絶縁被覆層の押出成形を安定的に行うことができ、これにより、電線・ケーブルの生産単位の長尺化を図ることができるとともに、長期保管性にも優れた架橋性樹脂組成物を提供することにある。
前記ヒンダードアミン型光安定剤(B3)は、分子量100~1,000の低分子量型ヒンダードアミン化合物と、分子量1,500~5,000の高分子量型ヒンダードアミン化合物との混合物であり、
ISO1628-1またはJIS K7367-1に準拠して温度40℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が3.5~5.5cm3 /g、温度110℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が2.0~3.5cm3 /gであることを特徴とする。
ヒンダードフェノール型安定剤(B1)0.01~1.0質量部と、
ジアルキルチオジプロピオネート型安定剤(B2)0.005~0.6質量部と、
ヒンダードアミン型光安定剤(B3)0.001~0.5質量部と、
有機過酸化物(C)0.5~3.0質量部とを含有する樹脂組成物であって、
前記ヒンダードアミン型光安定剤(B3)は、分子量100~1,000の低分子量型ヒンダードアミン化合物40~70質量%と、分子量1,500~5,000の高分子量型ヒンダードアミン化合物60~30質量%との混合物であり、
ISO1628-1またはJIS K7367-1に準拠して温度40℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が3.9~5.4cm3 /g、温度110℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が2.5~3.5cm3 /gであり、
前記ヒンダードアミン型光安定剤(B3)の重量平均分子量(Mw)が900~2,100であることことを特徴とする。
また、本発明の架橋性樹脂組成物は、ヒンダードアミン型光安定剤(B3)のブリードアウトが起こりにくいので、長期保管性にも優れている。
従って、本発明の電線・ケーブル(長尺の生産単位)を使用することにより、生産単位間の接続ジョイントの数を少なくすることができ、これにより、電力系統の破壊確率を大幅に低減することができる。
<架橋性樹脂組成物>
本発明の架橋性樹脂組成物は、エチレン系樹脂(A)と、ヒンダードアミン型光安定剤(B3)を含む安定剤(B)と、有機過酸化物(C)とを含有する。
本発明の架橋性樹脂組成物を構成するエチレン系樹脂(A)としては特に限定されるものではなく、高圧法低密度エチレン単独重合体、高圧法低密度エチレン共重合体、高密度エチレン共重合体、中密度エチレン共重合体、直鎖状低密度エチレン共重合体、直鎖状超低密度エチレン共重合体などを挙げることができる。
また、メルトマスフローレートが過小なエチレン系樹脂は加工性に劣り、一方、メルトマスフローレートが過大なエチレン系樹脂を使用すると、最終的に形成される絶縁被覆層の機械的強度、耐熱変形性、真円度などが低下する傾向がある。
本発明の架橋性樹脂組成物を構成する安定剤(B)には、ヒンダードアミン型光安定剤(B3)が必須成分として含まれる。
安定剤(B)は、単独でまたは2種以上を組み合わせて使用することができる。
ヒンダードアミン型光安定剤(B3)以外の安定剤(B)としては、ヒンダードアミン型光安定剤(B3)以外の光安定剤、酸化防止剤、加工安定剤などを挙げることができる。
・X:-C(O)-、-CH2 -
・Y:-O-、-CH2 -、-NH-、-N(CH3 )-、-N(C2 H5 )-、-O-C(O)-
・R1 :-H、-Cn H2n+1、-C6 H5 、-C6 H4 -CH3 、-C6 H3 (CH3 )2 、-C6 H4 -C2 H5 、-C6 H11、-CR3 R4 -、
(R1 が2価の基である場合に、この基の両端にはYで示される基が結合して二量体を形成する。)
・R3 :-H、-Cn H2n+1、-C6 H5 、-C6 Ha R5 b (OH)(5-a-b)
・R4 :-H、-Cn Hn
・R5 :-H、-CH3 、-C2 H5 、-C3 H7 、-C4 H9
(上記において、n=1~8の正整数、aとbは正整数で、a+b=1~4である。)〕
INUVIN 770)などを挙げることができ、これらは単独でまたは2種以上を組み合わせて使用することができる。
投入した押出機内において圧力上昇および吐出量の変動を起こしにくく、長時間にわたり連続して絶縁被覆層の押出成形を安定的に行うことができる。また、得られる樹脂組成物は、長期保管性にも優れたものとなる。
これにより、高分子量型ヒンダードアミン化合物と低分子量型のヒンダードアミン化合物とがバランスよく混合され、得られる樹脂組成物を投入した押出機内における圧力上昇および吐出量の変動の両方を確実に抑制することができ、優れた押出安定性を発現することができるとともに、得られる樹脂組成物の長期保管性も優れたものとなる。
の重量平均分子量(Mw)は、当該混合物を構成するヒンダードアミン化合物の分子量(Mi )およびモル分率(ni )から、下記式により算出される計算値である。
ヒンダードアミン型光安定剤(B3)を含有しない、または、その含有量が過少である樹脂組成物は、後述する有機過酸化物(C)の活性が経時的に大きく低下するため、長期間にわたり保管することができない。また、有機過酸化物(C)の二次分解によって生成する水が増加し電気特性(絶縁性)が損なわれる(後述する比較例9参照)。
一方、この含有量が過剰である場合には、保存安定性に対する効果が飽和し、電気特性および耐熱老化性が損なわれることがある。
3,5-ジ-t-ブチル-4-ヒドロキシ-ヒドロシンナマミド)(BASF社製イルガノックス1098)、1,3,5-トリメチル-2,4,6-トリス(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン(BASF社製イルガノックス1330)、トリス-(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)-イソシアヌレート(BASF社製イルガノックス3114)、イソオクチル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート(BASF社製イルガノックス1135)、1,1,3-トリス(2-メチル-4-ヒドロキシ-5-t-ブチルフェニル)ブタン(旭電化社製アデカ・スタブAO-30)、4,4’-ブチリデンビス-(3-メチル-6-t-ブチルフェノール(旭電化社製アデカ・スタブAO-40)、2,2’-チオビス-(4-メチル-6-t-ブチルフェノール)などを例示することができ、これらは単独でまたは2種以上を組み合わせて(B1)成分として使用することができる。
本発明の架橋性樹脂組成物を構成する有機過酸化物(C)は、エチレン系樹脂の架橋剤として使用される公知の化合物を挙げることができる。
有機過酸化物(C)の具体例としては、ジ-t-ブチル-パーオキサイド、1,1-ビス-t-ブチル-パーオキシベンゾエート、2,2-ビス-t-ブチル-パーオキシブタン、t-ブチル-パーオキシベンゾエート、ジクミルパーオキサイド、2,5-ジメチル-2,5-ジ-t-ブチル-パーオキシヘキサン、t-ブチル-クミルパーオキサイド、2,5-ジメチル-2,5-ジ-t-ブチル-パーオキシヘキシン-3などを挙げることができ、これらは単独でまたは2種以上を組み合わせて使用することができる。
一方、この含有量が3.0質量部を超える場合には、得られる架橋性樹脂組成物の耐スコーチ性が劣るものとなる。
本発明の架橋性樹脂組成物には、上記のエチレン系樹脂(A)、ヒンダードアミン型光安定剤(B3)を含む安定剤(B)および有機過酸化物(C)の他に、本発明の樹脂組成物の特性を損なわない範囲で使用目的に応じ、エチレン系樹脂(A)以外のオレフィン系樹脂、各種添加剤および補助資材が含有されていてもよい。
また、任意成分である各種添加剤、補助資材としては、上記の安定剤(B)以外の安定剤、加工性改良剤、分散剤、銅害防止剤、帯電防止剤、滑剤、カーボンブラック、トリアリルシアヌレートなどの架橋助剤、α-メチルスチレンダイマーなどのスコーチ防止剤を挙げることができる。
本発明の架橋性樹脂組成物は、押出機のスクリューへのくい込みやすさ、取扱性などの観点から、平均粒径が2~7mm程度のペレット状であることが好ましい。
(i)エチレン系樹脂(A)、安定剤(B)および有機過酸化物(C)並びに任意成分を配合し、この配合物を公知の混練機(例えばバンバリーミキサー、コンティニュアスミキサー、ロール、二軸押出機等)を用い、エチレン系樹脂(A)の融点以上で、かつ有機過酸化物(C)の分解温度未満の温度で加熱して溶融混練し、得られた樹脂組成物をペレット状に造粒する方法;
(ii)エチレン系樹脂(A)および安定剤(B)並びに任意成分を配合し、この配合物を公知の混練機を用い、エチレン系樹脂(A)の融点以上の温度で加熱して溶融混練し、得られた混練物をペレット状に造粒し、次いで、このペレット状の混練物に対して、融点以上に加熱して液状とした有機過酸化物(C)を添加し、必要に応じて、エチレン系樹脂(A)の融点未満の温度で熟成させることによって有機過酸化物(C)を均一にペレット中に分散させる方法を挙げることができる。
本発明の電線・ケーブルは、本発明の架橋性樹脂組成物を架橋して形成される絶縁被覆層、すなわち、当該樹脂組成物の架橋物からなる絶縁被覆層により導体が被覆されてなる。
本発明の電線・ケーブルは、主に銅またはアルミニウムからなる導体上に、本発明の架橋性樹脂組成物を押出成形により被覆し、これを架橋処理して絶縁被覆層を形成することにより製造することができる。
高圧法低密度エチレン単独重合体、メルトマスフローレート(MFR)=2.2g/10分、密度0.922g/cm3 (株式会社NUC製)
・分子量=1,178のヒンダードフェノール型安定剤(B1)
・化合物名:テトラキス[メチレン-3-(3,5’-ジ-t-ブチル-4’-ヒドロキシフェニル)プロピオネート]メタン
・商品名 :イルガノックス1010(BASF社製)
・還元粘度(40℃) :3.2cm3 /g
・還元粘度(110℃):1.9cm3 /g
・融点またはガラス転移点:110~125℃
・分子量=359のヒンダードフェノール型安定剤(B1)
・化合物名:4,4’-チオビス-(3-メチル-6-t-ブチルフェノール)
・商品名 :シーノックスBCS(シプロ化成社製)
・還元粘度(40℃) :2.7cm3 /g
・還元粘度(110℃):1.3cm3 /g
・融点またはガラス転移点:160℃
・分子量=682のジアルキルチオジプロピオネート型安定剤(B2)
・化合物名:ジステアリルチオジプロピオネート
・商品名 :DSTP「ヨシトミ」(吉富製薬社製)
・還元粘度(40℃) :3.8cm3 /g
・還元粘度(110℃):2.6cm3 /g
・融点またはガラス転移点:64~67℃
・分子量=481の低分子量型ヒンダードアミン化合物(低分子量型HALS)
・化合物名:ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート
・商品名:LA-77(ADEKA社製)
・還元粘度(40℃) :2.7cm3 /g
・還元粘度(110℃):1.6cm3 /g
・融点またはガラス転移点:81~85℃
・分子量=847の低分子量型ヒンダードアミン化合物(低分子量型HALS)
・化合物名:テトラキス(1,2,2,6,6-ペンタメチル-4-ピペリジル)ブタン-1,2,3,4-テトラカルボキシレート
・商品名:LA-52(ADEKA社製)
・還元粘度(40℃) :3.0cm3 /g
・還元粘度(110℃):2.0cm3 /g
・融点またはガラス転移点:65~68℃
・分子量=2,000~3,100の高分子量型ヒンダードアミン化合物(高分子量型HALS)
・化合物名:ポリ((6-((1,1,3,3-テトラメチルブチル)アミノ)-1,3,5-トリアジン-2,4-ジイル)(2-(2,2,6,6テトラメチル-4ピペリジル)イミノ))ヘキサメチレン((2,2,6,6-テトラメチル-4-ピペリジル)イミノ))
・商品名:キマソーブ944(BASF社製)
・還元粘度(40℃) :7.3cm3 /g
・還元粘度(110℃):4.7cm3 /g
・融点またはガラス転移点:100~135℃
・分子量=3,100~4,000の高分子量型ヒンダードアミン化合物(高分子量型HALS)
・コハク酸ジメチルと1-(2ヒドロキシエチル)-4-ヒドロキシ- 2,2,6,6-テトラメチル-4-ピペリジン重縮合物
・商品名:チヌビン622(BASF社製)
・還元粘度(40℃) :20.3cm3 /g
・還元粘度(110℃):14.1cm3 /g
・融点またはガラス転移点:55~77℃
下記表1に示す処方に従って、樹脂(A-1)100質量部と、ヒンダードフェノール型安定剤(B1)として安定剤(B1-1)0.1質量部および安定剤(B1-2)0.1質量部と、ジアルキルチオジプロピオネート型安定剤(B2)として安定剤(B2-1)0.1質量部と、ヒンダードアミン型光安定剤(B3)として安定剤(B3-1)0.0035質量部および安定剤(B3-3)0.0015質量部の混合物とを配合し、バンバリーミキサーにより180℃の温度にて10分間混練した後、得られた混練物を直径3mm、長さ2mmのペレット状に造粒した。
次に、得られたペレット状の混練物に対して、加熱して液状とした有機過酸化物(C-1)1.6質量部添加し、ブレンダーにて60℃に加温した状態で3時間混合後室温まで冷却することにより、本発明の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤(B3)として、安定剤(
B3-1)0.0025質量部および安定剤(B3-3)0.0025質量部の混合物を使用したこと以外は実施例1と同様にして本発明の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤(B3)として、安定剤(B3-1)0.002質量部および安定剤(B3-3)0.003質量部の混合物を使用したこと以外は実施例1と同様にして本発明の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤(B3)として、安定剤(B3-1)0.01質量部および安定剤(B3-3)0.01質量部の混合物を使用したこと以外は実施例1と同様にして本発明の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤(B3)として、安定剤(B3-2)0.0025質量部および安定剤(B3-3)0.0025質量部の混合物を使用したこと以外は実施例1と同様にして本発明の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として安定剤(B3-1)0.02質量部を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として安定剤(B3-1)0.01質量部を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として安定剤(B3-1)0.005質量部を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として、安定剤(B3-1)0.0015質量部および安定剤(B3-3)0.0035質量部の混合物(40℃および110℃での還元粘度が過大である混合物)を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として安定剤(B3-3)0.005質量部を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として安定剤(B3-2)0.005質量部を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として、安定剤(B3-1)0.0025質量部および安定剤(B3-4)0.0025質量部の混合物(40℃および110℃での還元粘度が過大である混合物)を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤として安定剤(B3-4)0.005質量部を使用したこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
下記表1に示す処方に従って、ヒンダードアミン型光安定剤を配合しなかったこと以外は実施例1と同様にして比較用の架橋性樹脂組成物を得た。
有効長(L/D)=25の単軸押出機「ラボプラストミル」((株)東洋精機製作所製)に80/150/400/80メッシュのスクリーンメッシュを装着し、実施例および比較例で得られた架橋性樹脂組成物の各々を温度115℃、回転数30rpmで押出し、押出開始直後の機内圧力と、押出を開始してから8時間経過後の機内圧力とを測定して、その上昇率を算出した。評価基準としては、上昇率が2%未満である場合を合格(○)とし、2%以上である場合を不合格(×)とした。
上記(1)の押出中においてスクリュートルクを連続的に測定し、このスクリュートルクの平均値に対して、20%以上のトルク変動が発生したか否かを確認し、20%以上のトルク変動が発生しなかった場合を合格(○)とし、1回でも発生した場合には不合格(×)とした。ここに、トルク変動が生じると、これに起因して押出機からの吐出量が変動する。従って、トルク変動の状況を観察することにより、吐出量の変動の状況を把握することができる。
実施例および比較例で得られた架橋性樹脂組成物の各々を圧縮プレス成形機により120℃、0.5MPaで5分間シートの予備成形を行い、続いて180℃、15MPaで20分間架橋させることにより厚さ6mmのシートを作製した。
このシートを空気雰囲気下80℃に2日間保管した後、6mmシートの厚み方向の中心部から2g切り出し、カールフィッシャー水分計を用い測定温度200℃、測定時間20分の条件にて水分含量を測定した。
実施例および比較例で得られた架橋性樹脂組成物の各々を、80℃の過熱条件下に14日間保管した。
保管前後の樹脂組成物の各々について、ISO6502/JIS K6300-2に準拠した移動ダイレオメータ(MDR)を使用して測定温度180℃の最大トルク値を測定した。保管前の最大トルク値(T0 )に対する保管後の最大トルク値(T)の比率(T/T0 )が80%以上である場合を合格(○)とし、80%未満である場合を不合格(×)
とした。
実施例および比較例で得られた架橋性樹脂組成物の各々を圧縮プレス成形機により120℃、0.5MPaで5分間シートの予備成形を行い、続いて180℃、15MPaで20分間架橋させることにより厚さ3mmのシートを作製した。
このシートに、水電極を用いて1kV/1000Hzの交流電圧を500時間印加した後、このシートを厚み方向に約0.1mmにスライスして10個のスライス片を作製し、このスライス片をメチレンブルー染色液に浸し染色し、染色したスライス片を光学顕微鏡で観察して水トリーの発生の有無を確認し、水トリーの発生が認められない場合を合格(○)とし、認められた場合を不合格(×)とした。
従って、実施例1~5で得られた架橋性樹脂組成物によれば、長時間にわたって連続的に安定した絶縁被覆層の押出成形を行うことができ、電線・ケーブルの生産単位の長尺化を図ることができる。
また、実施例1~5で得られた架橋性樹脂組成物は、加熱条件下での保管前後における
最大トルク値の変化が小さく、長期保管性にも優れている。
また、水分生成量が少なく、耐水トリー性にも優れており、電線・ケーブルの絶縁被覆材料として好適である。
また、比較例3および比較例6で得られた樹脂組成物は、ヒンダードアミン型光安定剤として低分子量型ヒンダードアミン化合物のみが含有され、ヒンダードアミン型光安定剤の40℃および110℃における還元粘度が過小であるので、長期保管性に劣るものである。
また、比較例4および比較例7で得られた樹脂組成物は、ヒンダードアミン型光安定剤の40℃および110℃における還元粘度が過大であるので、これを投入した押出機内における圧力上昇率が高く、押出安定性に劣るものである。
また、比較例5および比較例8で得られた樹脂組成物は、ヒンダードアミン型光安定剤として高分子量型ヒンダードアミン化合物のみが含有され、ヒンダードアミン型光安定剤の40℃および110℃における還元粘度が過大であるので、これを投入した押出機内における圧力上昇率が高く、押出安定性に劣るものである。
また、比較例9で得られた架橋性樹脂組成物は、ヒンダードアミン型光安定剤を含有していないので、長期保管性および耐水トリー性に劣るものである。
Claims (6)
- エチレン系樹脂(A)100質量部と、ヒンダードアミン型光安定剤(B3)0.001~0.5質量部を含む安定剤(B)と、有機過酸化物(C)0.5~3.0質量部とを含有する樹脂組成物であって、
前記ヒンダードアミン型光安定剤(B3)は、分子量100~1,000の低分子量型ヒンダードアミン化合物と、分子量1,500~5,000の高分子量型ヒンダードアミン化合物との混合物であり、
ISO1628-1またはJIS K7367-1に準拠して温度40℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が3.5~5.5cm3 /g、温度110℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が2.0~3.5cm3 /gであることを特徴とする架橋性樹脂組成物。 - 前記ヒンダードアミン型光安定剤(B3)の重量平均分子量(Mw)が700~2,300であることを特徴とする請求項1に記載の架橋性樹脂組成物。
- 前記高分子量型ヒンダードアミン化合物の前記ヒンダードアミン型光安定剤(B3)に占める割合が30~60質量%であることを特徴とする請求項1または請求項2に記載の架橋性樹脂組成物。
- 前記安定剤(B)として、前記ヒンダードアミン型光安定剤(B3)とともに、ヒンダードフェノール型安定剤(B1)と、ジアルキルチオジプロピオネート型安定剤(B2)とを含有することを特徴とする請求項1乃至請求項3の何れかに記載の架橋性樹脂組成物。
- エチレン系樹脂(A)100質量部と、
ヒンダードフェノール型安定剤(B1)0.01~1.0質量部と、
ジアルキルチオジプロピオネート型安定剤(B2)0.005~0.6質量部と、
ヒンダードアミン型光安定剤(B3)0.001~0.5質量部と、
有機過酸化物(C)0.5~3.0質量部とを含有する樹脂組成物であって、
前記ヒンダードアミン型光安定剤(B3)は、分子量100~1,000の低分子量型ヒンダードアミン化合物40~70質量%と、分子量1,500~5,000の高分子量型ヒンダードアミン化合物60~30質量%との混合物であり、
ISO1628-1またはJIS K7367-1に準拠して温度40℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が3.9~5.4cm3 /g、温度110℃で測定される前記ヒンダードアミン型光安定剤(B3)の還元粘度が2.5~3.5cm3 /gであり、
前記ヒンダードアミン型光安定剤(B3)の重量平均分子量(Mw)が900~2,100であることことを特徴とする架橋性樹脂組成物。 - 請求項1乃至請求項5の何れかに記載の架橋性樹脂組成物を架橋して形成される絶縁被覆層により導体を被覆してなる電線・ケーブル。
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WO2019121721A1 (en) * | 2017-12-18 | 2019-06-27 | Borealis Ag | Crosslinkable composition with antioxidant and methane formation and article |
CN111727215A (zh) * | 2017-12-18 | 2020-09-29 | 博里利斯股份公司 | 含有抗氧化剂且形成甲烷的交联组合物及其制品 |
CN111727215B (zh) * | 2017-12-18 | 2022-08-09 | 博里利斯股份公司 | 含有抗氧化剂且形成甲烷的交联组合物及其制品 |
US11674017B2 (en) | 2017-12-18 | 2023-06-13 | Borealis Ag | Cable made from crosslinkable composition with antioxidant and beneficial methane formation |
US11674016B2 (en) | 2017-12-18 | 2023-06-13 | Borealis Ag | Crosslinkable composition with antioxidant and methane formation and article |
Also Published As
Publication number | Publication date |
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KR20170051485A (ko) | 2017-05-11 |
EP3266823A1 (en) | 2018-01-10 |
KR101855637B1 (ko) | 2018-05-04 |
JP2016160402A (ja) | 2016-09-05 |
CN107001726A (zh) | 2017-08-01 |
US20170362411A1 (en) | 2017-12-21 |
TW201632575A (zh) | 2016-09-16 |
TWI583731B (zh) | 2017-05-21 |
EP3266823A4 (en) | 2018-01-10 |
EP3266823B1 (en) | 2021-12-15 |
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