WO2016127897A1 - 一种功率放大器的功率管连接结构及功率放大器 - Google Patents

一种功率放大器的功率管连接结构及功率放大器 Download PDF

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Publication number
WO2016127897A1
WO2016127897A1 PCT/CN2016/073380 CN2016073380W WO2016127897A1 WO 2016127897 A1 WO2016127897 A1 WO 2016127897A1 CN 2016073380 W CN2016073380 W CN 2016073380W WO 2016127897 A1 WO2016127897 A1 WO 2016127897A1
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Prior art keywords
power amplifier
power tube
power
connection structure
slot
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PCT/CN2016/073380
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English (en)
French (fr)
Inventor
李松林
田鹏博
王清云
许亮
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to MX2017010465A priority Critical patent/MX2017010465A/es
Priority to CA2976522A priority patent/CA2976522C/en
Priority to KR1020177025063A priority patent/KR101968035B1/ko
Priority to EP16748698.4A priority patent/EP3250012A4/en
Priority to JP2017542433A priority patent/JP6537622B2/ja
Publication of WO2016127897A1 publication Critical patent/WO2016127897A1/zh
Priority to US15/676,352 priority patent/US10165687B2/en
Priority to US16/192,018 priority patent/US10426036B2/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/22—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with tubes only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Definitions

  • the present invention relates to the field of power amplifier technologies, and in particular, to a power tube connection structure and a power amplifier of a power amplifier.
  • FIG. 1 is a schematic structural diagram of a sinking power amplifier in the prior art, including a substrate 01, and a printed circuit covering the upper surface of the substrate 01.
  • the board 02 and the power tube 03 and the printed circuit board 02 are provided with a through slot 04 for allowing the power tube 03 to pass through.
  • the upper surface of the substrate 01 is provided with a mounting slot 05 corresponding to the position of the through slot 04, and one end of the power tube 03 passes through the through slot. 04 is set and welded to the bottom surface of the mounting groove 05.
  • the size of the mounting slot 05 is increased by 0.25 mm compared to the dimension of the power tube 03.
  • the power tube assembly is required for the power amplifier assembly design. Push the side of the mounting slot close to the output of the power amplifier so that the mounting slot is close to the zero gap between the side wall of the output of the power amplifier and the output of the power amplifier. However, this will cause the gas flux to have no escape path during reflow soldering.
  • a weld cavity is formed at the bottom of 03.
  • Embodiments of the present invention provide a power tube connection structure and a power amplifier of a power amplifier, which solve the purpose of welding a cavity at the bottom of the power tube.
  • an embodiment of the present invention provides a power tube connection structure of a power amplifier, including a substrate, a printed circuit board covering the upper surface of the substrate, and a power tube, and the printing
  • the circuit board is provided with a through slot for allowing the power tube to pass through
  • the upper surface of the substrate is provided with a mounting slot corresponding to the position of the through slot.
  • One end of the power tube is disposed through the through slot, and is soldered to the bottom surface of the mounting slot, and one end of the power tube extending into the mounting slot is fitted to a side wall of the mounting slot near the output end of the power amplifier.
  • a flux escape passage is formed in the side wall of the mounting groove near the output end of the power amplifier.
  • the flux escape channel is a first gap formed in a sidewall of the mounting slot near the output end of the power amplifier, and the through slot of the printed circuit board A gap is left between the inner wall and the outer wall of the power tube.
  • the flux escape channel is a first gap formed in a sidewall of the mounting slot near an output end of the power amplifier, the printed circuit board and the printed circuit board A second gap is formed at a position corresponding to the first gap.
  • the power tube includes a pin that is disposed on a surface of the printed circuit board, and the pin corresponds to the A through hole is formed in the position of the first notch.
  • the first notch is a semi-circular notch disposed perpendicular to the bottom surface of the mounting groove.
  • the side wall of the mounting groove adjacent to the input end is provided with a side pushing hole perpendicular to the bottom surface of the mounting groove.
  • the bottom surface of the mounting slot is provided with a plurality of bosses located on the same plane, and the height difference between the boss and the bottom surface of the mounting slot is 0.1 to 0.2. Mm.
  • the number of the bosses is four, wherein two bosses are disposed near the output of the power amplifier, and the other two bosses are close to the power. Amplifier input settings.
  • the power tube connection structure of the power amplifier provided by the embodiment of the invention has a flux escape channel formed on a sidewall of the mounting slot near the output end of the power amplifier, and the gas flux can flow out of the power amplifier through the flux escape channel during soldering, thereby Prevent welding holes from forming at the bottom of the power tube.
  • the embodiment of the present invention provides a power amplifier, including the power tube connection structure of the power amplifier according to any one of the foregoing technical solutions.
  • the power amplifier provided by the embodiment of the invention has a flux escape channel on the sidewall of the mounting slot near the output end of the power amplifier.
  • the gas flux can flow out of the power amplifier through the flux escape channel, thereby preventing the bottom of the power tube from forming. Welding holes.
  • FIG. 1 is a schematic structural view of a sinking power amplifier in the prior art
  • FIG. 2 is a schematic diagram of a power tube connection structure of a power amplifier according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a substrate in a power tube connection structure of a power amplifier according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more explicitly or implicitly. A number of this feature. In the description of the present invention, "a plurality” means two or more unless otherwise stated.
  • FIG. 2 is a specific embodiment of a power tube connection structure of a power amplifier according to an embodiment of the present invention.
  • the power tube connection structure of the power amplifier in the embodiment includes a substrate 1 and is printed on the upper surface of the substrate 1.
  • the circuit board 2 and the power tube 3, the printed circuit board 2 is provided with a through slot 21 for allowing the power tube 3 to pass through, and the upper surface of the substrate 1 is provided with a mounting slot 11 at a position corresponding to the through slot 21, and one end of the power tube 3 passes through
  • the through slot 21 is disposed and welded to the bottom surface of the mounting slot 11, and one end of the power tube 3 extending into the mounting slot 11 is fitted to the side wall of the mounting slot 11 near the output end of the power amplifier, and the mounting slot 11 is opened on the side wall of the output end of the power amplifier.
  • the flux escapes the passage 12.
  • the power tube connection structure of the power amplifier provided by the embodiment of the invention is provided with a flux escape channel 12 on the side wall of the mounting slot 11 near the output end of the power amplifier, and the gas flux can flow to the power amplifier through the flux escape channel 12 during soldering.
  • a soldering void is formed at the bottom of the power tube 3.
  • the flux escape channel 12 is a first gap formed in the sidewall of the mounting slot 11 near the output end of the power amplifier.
  • the through slot of the printed circuit board 2 A gap is left between the inner wall of the 21 and the outer wall of the power tube 3 (not shown), and the gas flux flows from the bottom of the power tube 3 into the first gap, flows from bottom to top in the first gap, and from the first gap The top portion flows out and is discharged to the outside of the power amplifier through the gap between the inner wall of the through-groove 21 of the printed circuit board 2 and the outer wall of the power tube 3, facilitating the discharge of the gas flux.
  • the flux escape passage 12 is a first notch formed on the side wall of the mounting slot 11 near the output end of the power amplifier, and the inner wall of the through slot 21 of the printed circuit board 2 is A gap is not left between the outer walls of the power tube 3, but a second gap 22 is opened at a position corresponding to the first gap of the printed circuit board 2.
  • the gas flux flows through the first gap from bottom to top and The second notch 22 is discharged from the top of the second notch 22 to the outside of the power amplifier.
  • the power tube 3 generally includes a pin 31 erected on the upper surface of the printed circuit board 2, and the lead 31 has a certain blocking effect on the discharge of the gas flux.
  • the gas flux is discharged more smoothly, and the through hole 311 is formed in the position of the pin 31 corresponding to the first notch, thereby reducing the barrier effect of the pin 31 on the gas flux, thereby making the gas flux
  • the discharge is smoother.
  • the first notch is a semi-circular notch perpendicular to the bottom surface of the mounting groove 11. Since the semi-circular chamfer is usually processed by the milling process on the substrate 1, the same process can be used to process the semicircle.
  • the shape of the gap reduces the number of processing steps, thereby reducing the process difficulty.
  • the side wall of the mounting slot 11 adjacent to the input end is provided with a side pushing hole 13 perpendicular to the bottom surface of the mounting slot 11, and the side pushing hole 13 can insert a cylindrical pin, with the insertion of the cylindrical pin, the cylindrical pin can squeeze the edge of the power tube 3, so that the power tube 3 moves to the side of the mounting slot 11 near the output end of the power amplifier until the mounting slot 11 is close to the power amplifier output.
  • the bottom surface of the mounting groove 11 is provided. a plurality of bosses 14 in the same plane, the height difference between the boss 14 and the bottom surface of the mounting groove 11 is 0.1 to 0.2 mm, and the boss 14 supports the power tube 3 so that the substrate 1 and the power tube 3 have A certain deformation buffer space, thereby reducing the occurrence of tearing.
  • bosses 14 In order to improve the welding precision of the substrate 1 and the power tube 3, there are four bosses 14, wherein two bosses 14 are disposed near the output of the power amplifier, and the other two bosses 14 are disposed close to the input end of the power amplifier, so that The power tube 3 is parallel to the substrate 1, and the solder filling is more uniform during soldering, thereby improving the soldering accuracy of the substrate 1 and the power tube 3.
  • the embodiment of the invention further provides a power amplifier, comprising the power tube connection structure of the power amplifier according to any of the above embodiments.
  • the power amplifier provided by the embodiment of the invention has a flux escape channel 12 on the sidewall of the mounting slot 11 near the output end of the power amplifier.
  • the gas flux can flow through the flux escape channel 12 to the power amplifier during soldering, thereby preventing power.
  • a weld cavity is formed at the bottom of the tube 3.

Abstract

一种功率放大器的功率管连接结构，包括基板（1）、覆盖于基板（1）上表面的印制电路板（2）以及功率管（3），所述印制电路板（2）开设有允许所述功率管（3）穿过的通槽（21），所述基板（1）上表面对应所述通槽（21）的位置开设有安装槽（11），所述功率管（3）的一端穿过所述通槽（21）设置，并与所述安装槽（11）的底面焊接，所述功率管（3）伸入所述安装槽（11）的一端与所述安装槽（11）靠近功率放大器输出端的侧壁贴合，所述安装槽（11）靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道（12）。该功率管连接结构可用于下沉式功率放大器，能够解决现有功率管底部焊接空洞的问题。

Description

一种功率放大器的功率管连接结构及功率放大器
本申请要求于2015年02月15日提交中国专利局、申请号为201520112293.2、发明名称为“一种功率放大器的功率管连接结构及功率放大器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及功率放大器技术领域，尤其涉及一种功率放大器的功率管连接结构及功率放大器。
背景技术
传统的功率放大器包括下沉式功率放大器和表面贴装式功率放大器两种，图1为现有技术中下沉式功率放大器的结构示意图，包括基板01，覆盖于基板01上表面的印制电路板02以及功率管03，印制电路板02开设有允许功率管03穿过的通槽04，基板01上表面对应通槽04的位置开设有安装槽05，功率管03的一端穿过通槽04设置，并与安装槽05的底面焊接。
为方便功率管03穿过通槽04沉入到安装槽05中，安装槽05的尺寸相比功率管03的尺寸单边增加0.25mm，为提高功放一致性，功放组装设计时要求功率管03向安装槽靠近功率放大器输出端的一侧推，使安装槽靠近功率放大器输出端的侧壁与功放输出端之间零缝隙，但是，这会导致气体助焊剂在回流焊接时无逃逸通道，在功率管03底部形成焊接空洞。
发明内容
本发明的实施例提供一种功率放大器的功率管连接结构及功率放大器，解决功率管底部焊接空洞的目的。
为达到上述目的，第一方面，本发明的实施例提供了一种功率放大器的功率管连接结构，包括基板、覆盖于所述基板上表面的印制电路板、以及功率管，所述印制电路板开设有允许所述功率管穿过的通槽，所述基板上表面对应所述通槽的位置开设有安装槽，所 述功率管的一端穿过所述通槽设置，并与所述安装槽的底面焊接，所述功率管伸入所述安装槽的一端与所述安装槽靠近功率放大器输出端的侧壁贴合，所述安装槽靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道。
在第一种可能实现的方式中，结合第一方面，所述助焊剂逃逸通道为开设于所述安装槽靠近功率放大器输出端的侧壁上的第一缺口，所述印制电路板的通槽内壁与所述功率管的外壁之间留有间隙。
在第二种可能实现的方式中，结合第一方面，所述助焊剂逃逸通道为开设于所述安装槽靠近功率放大器输出端的侧壁上的第一缺口，所述印制电路板与所述第一缺口对应的位置开设有第二缺口。
在第三种可能实现的方式中，根据第一种或第二种可能实现的方式，所述功率管包括搭设于所述印制电路板上表面的引脚，所述引脚上对应所述第一缺口的位置开设有通孔。
在第四种可能实现的方式中，根据第一种或第二种可能实现的方式，所述第一缺口为垂直于所述安装槽的底面设置的半圆形缺口。
在第五种可能实现的方式中，结合第一方面，所述安装槽靠近输入端的侧壁上开设有垂直于所述安装槽的底面的侧推孔。
在第六种可能实现的方式中，结合第一方面，所述安装槽的底面设有多个位于同一平面的凸台，所述凸台与所述安装槽的底面的高度差为0.1～0.2mm。
在第七种可能实现的方式中，根据第六种可能实现的方式，所述凸台为4个，其中两个凸台靠近所述功率放大器输出端设置，其余两个凸台靠近所述功率放大器输入端设置。
本发明实施例提供的功率放大器的功率管连接结构，在安装槽靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道，焊接时气体助焊剂可通过助焊剂逃逸通道流至功率放大器外，从而防止功率管底部形成焊接空洞。
第二方面，本发明实施例供了一种功率放大器，包括上述技术方案中任一项所述的功率放大器的功率管连接结构。
本发明实施例提供的功率放大器，在安装槽靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道，焊接时气体助焊剂可通过助焊剂逃逸通道流至功率放大器外，从而防止功率管底部形成焊接空洞。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中下沉式功率放大器的结构示意图；
图2为本发明实施例功率放大器的功率管连接结构的示意图；
图3为本发明实施例功率放大器的功率管连接结构中基板的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更 多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
参照图2，图2为本发明实施例功率放大器的功率管连接结构的一个具体实施例，本实施例中的功率放大器的功率管连接结构，包括基板1、覆盖于基板1上表面的印制电路板2、以及功率管3，印制电路板2开设有允许功率管3穿过的通槽21，基板1上表面对应通槽21的位置开设有安装槽11，功率管3的一端穿过通槽21设置，并与安装槽11的底面焊接，功率管3伸入安装槽11的一端与安装槽11靠近功率放大器输出端的侧壁贴合，安装槽11靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道12。
本发明实施例提供的功率放大器的功率管连接结构，在安装槽11靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道12，焊接时气体助焊剂可通过助焊剂逃逸通道12流至功率放大器外，从而防止功率管3底部形成焊接空洞。
在本发明的一种实施例中，助焊剂逃逸通道12为开设于安装槽11靠近功率放大器输出端的侧壁上的第一缺口，为方便气体助焊剂的排出，印制电路板2的通槽21内壁与功率管3的外壁之间留有间隙(图中未示出)，气体助焊剂从功率管3底部流入第一缺口，在第一缺口内自下而上流动，并从第一缺口的顶部流出，再通过印制电路板2的通槽21内壁与功率管3的外壁之间的间隙排出至功率放大器外，方便了气体助焊剂的排出。
在本发明的另一种实施例中，参照图2，助焊剂逃逸通道12为开设于安装槽11靠近功率放大器输出端的侧壁上的第一缺口，印制电路板2的通槽21内壁与功率管3的外壁之间不留间隙，而是在印制电路板2与第一缺口对应的位置开设有第二缺口22，此时，气体助焊剂自下而上依次流经第一缺口和第二缺口22，从第二缺口22的顶部排出至功率放大器外。
参照图2，功率管3一般包括搭设于印制电路板2上表面的引脚31，而引脚31会对气体助焊剂的排出产生一定的阻挡作用，为 使气体助焊剂的排出更顺畅，引脚31上对应所述第一缺口的位置开设有通孔311，由此，减小了引脚31对气体助焊剂的阻挡作用，从而使气体助焊剂的排出更顺畅。
为降低工艺难度，所述第一缺口为垂直于安装槽11的底面设置的半圆形缺口，由于基板1上通常采用铣削工艺加工半圆形倒角，由此，可采用同样工艺加工半圆形缺口，减少了加工工序，从而降低了工艺难度。
参照图3，为方便将功率管3向安装槽11靠近功率放大器输出端的一侧推，安装槽11靠近输入端的侧壁上开设有垂直于安装槽11的底面的侧推孔13，侧推孔13内可插入圆柱销，随着圆柱销的插入，圆柱销可挤压功率管3的边沿，使功率管3向安装槽11靠近功率放大器输出端的一侧移动，直至安装槽11靠近功率放大器输出端的侧壁与功放输出端之间零缝隙。
由于基板1和功率管3的材料不同，受热后的膨胀率也有较大差别，致使焊接时容易产生撕裂现象，造成材料的损坏，因此，如图3所示，安装槽11的底面设有多个位于同一平面的凸台14，凸台14与安装槽11的底面的高度差为0.1～0.2mm，凸台14对功率管3起到了支撑作用，使得基板1与功率管3之间具有一定的形变缓冲空间，从而减少了撕裂现象的产生。
为了提高基板1与功率管3的焊接精度，凸台14为4个，其中两个凸台14靠近所述功率放大器输出端设置，其余两个凸台14靠近所述功率放大器输入端设置，使得功率管3和基板1平行，焊接时焊料填充更均匀，从而提高了基板1与功率管3的焊接精度。
本发明实施例还提供了一种功率放大器，包括上述任一实施例所述的功率放大器的功率管连接结构。
本发明实施例提供的功率放大器，在安装槽11靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道12，焊接时气体助焊剂可通过助焊剂逃逸通道12流至功率放大器外，从而防止功率管3底部形成焊接空洞。
关于本发明实施例的功率放大器的其他构成等已为本领域的技术人员所熟知，在此不再详细说明。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (9)

  1. 一种功率放大器的功率管连接结构，其特征在于，包括基板、覆盖于所述基板上表面的印制电路板、以及功率管，所述印制电路板开设有允许所述功率管穿过的通槽，所述基板上表面对应所述通槽的位置开设有安装槽，所述功率管的一端穿过所述通槽设置，并与所述安装槽的底面焊接，所述功率管伸入所述安装槽的一端与所述安装槽靠近功率放大器输出端的侧壁贴合，所述安装槽靠近功率放大器输出端的侧壁上开设有助焊剂逃逸通道。
  2. 根据权利要求1所述的功率放大器的功率管连接结构，其特征在于，所述助焊剂逃逸通道为开设于所述安装槽靠近功率放大器输出端的侧壁上的第一缺口，所述印制电路板的通槽内壁与所述功率管的外壁之间留有间隙。
  3. 根据权利要求1所述的功率放大器的功率管连接结构，其特征在于，所述助焊剂逃逸通道为开设于所述安装槽靠近功率放大器输出端的侧壁上的第一缺口，所述印制电路板与所述第一缺口对应的位置开设有第二缺口。
  4. 根据权利要求2或3所述的功率放大器的功率管连接结构，其特征在于，所述功率管包括搭设于所述印制电路板上表面的引脚，所述引脚上对应所述第一缺口的位置开设有通孔。
  5. 根据权利要求2或3所述的功率放大器的功率管连接结构，其特征在于，所述第一缺口为垂直于所述安装槽的底面设置的半圆形缺口。
  6. 根据权利要求1所述的功率放大器的功率管连接结构，其特征在于，所述安装槽靠近输入端的侧壁上开设有垂直于所述安装槽的底面的侧推孔。
  7. 根据权利要求1所述的功率放大器的功率管连接结构，其特征在于，所述安装槽的底面设有多个位于同一平面的凸台，所述凸台与所述安装槽的底面的高度差为0.1～0.2mm。
  8. 根据权利要求7所述的功率放大器的功率管连接结构，其特征在于，所述凸台为4个，其中两个凸台靠近所述功率放大器输出端设置，其 余两个凸台靠近所述功率放大器输入端设置。
  9. 一种功率放大器，其特征在于，包括权利要求1～8中任一项所述的功率放大器的功率管连接结构。
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