WO2018086492A1 - 电解电容 - Google Patents

电解电容 Download PDF

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Publication number
WO2018086492A1
WO2018086492A1 PCT/CN2017/109489 CN2017109489W WO2018086492A1 WO 2018086492 A1 WO2018086492 A1 WO 2018086492A1 CN 2017109489 W CN2017109489 W CN 2017109489W WO 2018086492 A1 WO2018086492 A1 WO 2018086492A1
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WO
WIPO (PCT)
Prior art keywords
electrolytic capacitor
spacer
gasket
capacitor body
notch
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PCT/CN2017/109489
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English (en)
French (fr)
Inventor
邢伟伟
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深圳创维数字技术有限公司
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Publication date
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Publication of WO2018086492A1 publication Critical patent/WO2018086492A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/12—Vents or other means allowing expansion

Definitions

  • the present disclosure relates to the field of electronic component technology, for example, to an electrolytic capacitor.
  • the direct bonding plate bending process is usually adopted in the production of the aluminum electrolytic capacitor, so that the capacitor is in close contact with the PCB board, and a cavity is formed in the recessed portion of the capacitor pin to perform wave soldering.
  • molten solder may seal the lead hole of the PCB, so that the cavity becomes a closed space, and the air inside the cavity expands rapidly due to heat.
  • the solder which is cooled in the future is expanded.
  • the gas jets are brought out to produce welding defects such as tin and stomata, which increases the defective rate of the product, increases the production cost, and also has hidden dangers of product quality.
  • the present disclosure provides an electrolytic capacitor, which can solve the welding defects such as the explosion of tin and the occurrence of welding pores caused by the gas being automatically discharged during the wave soldering process, can reduce the defective rate of welding, and further improve the efficiency and product of the wave soldering. quality.
  • the present disclosure provides an electrolytic capacitor including a capacitor body and a spacer provided with a lead, the spacer being located at a bottom of the capacitor body, and the spacer is convexly disposed with respect to the capacitor body; The position of the foot corresponds to a gap for the exhaust gas.
  • the gasket is higher than the outer edge of the bottom of the capacitor body by 0.5 mm to 1 mm.
  • a bottom of the capacitor body is provided with a circular recess for setting the spacer.
  • the body of the gasket is a circular structure.
  • the diameter of the spacer is 0.1 mm to 0.3 mm smaller than the diameter of the circular recess.
  • the notch is composed of two spaced apart straight portions and a connecting portion connecting the two straight portions.
  • the capacitor body is symmetrically disposed with two pins, and a thickness direction of the straight portion is parallel to a line where the two pins are located.
  • the connecting portion is an arc structure or a linear structure.
  • the notch is a circular arc structure.
  • the spacer is made of the same material as the capacitor body.
  • the opening of the notch is disposed towards the edge of the spacer.
  • the electrolytic capacitor provided by the present disclosure has a simple structural design, and a gasket having a gas venting gap is provided on the basis of the capacitor body, which can reduce the possibility of welding defects such as welding pores, reduce the welding defect rate, and improve product quality.
  • FIG. 1 is a first perspective structural view of an electrolytic capacitor according to an embodiment
  • FIG. 2 is a schematic view showing a second perspective structure of an electrolytic capacitor according to an embodiment
  • FIG. 3 is a schematic view showing a third perspective structure of an electrolytic capacitor according to an embodiment
  • FIG. 4 is a schematic view showing a fourth perspective structure of an electrolytic capacitor according to an embodiment.
  • Wave soldering is to make the soldering surface of the board directly contact with high-temperature liquid tin to achieve soldering.
  • the high-temperature liquid tin maintains a bevel, and the special device makes the liquid tin form a wave-like phenomenon, so it is called “wave soldering”.
  • the present embodiment provides an electrolytic capacitor, which may include a capacitor body 1 and a spacer 3.
  • the capacitor body 1 is provided with a pin 2, and the spacer 3 is located at the capacitor body.
  • the spacer 3 is convexly disposed with respect to the capacitor body 1 , and the spacer 3 is correspondingly provided with a notch 4 for exhausting at the position of the pin 2 .
  • the spacer 3 is protruded, so that when the electrolytic capacitor is mounted on the PCB, the pin of the electrolytic capacitor forms an unsealed structure, and a notch 4 is also provided on the spacer 3 to be used for wave soldering. Exhausting excess gas from the notch 4 can improve the occurrence of welding defects such as welding pores.
  • the spacer 3 can be disposed to be higher than the outer edge of the bottom of the capacitor body 1 by 0.5 mm to 1 mm (ie, a is 0.5 mm to 1 mm in FIG. 3).
  • the bottom of the capacitor body 1 is a planar structure, and the spacer 3 can be disposed. It is 0.5mm-1mm higher than the bottom of the capacitor body 1. This is because when the gasket 3 is higher than the outer edge of the bottom of the capacitor body 1, the expansion gas discharge speed is slow, and welding defects such as explosion tin and welding pores still occur; When the gasket 3 is higher than the outer edge of the bottom of the capacitor body 1, it is not conducive to the fixing of the capacitor body 1 on the PCB board, and the capacitor body 1 is easily shaken or even dropped.
  • the bottom of the capacitor body 1 may be provided with a circular recess for arranging the spacer 3, the bottom surface of the circular recess is a mounting plane of the spacer 3, and the body of the spacer 3 may have a circular structure.
  • the gasket 3 is set to have the same shape as the mounting plane, which can facilitate the processing of the capacitor body 1 and the gasket 3, and also facilitate the fixing of the gasket 3.
  • the diameter of the spacer 3 may be smaller than the circular plane by 0.1 mm to 0.3 mm, because the diameter of the spacer 3 is slightly smaller than the mounting plane, so that the gasket 3 can be firmly and conveniently attached to the mounting plane, but If the diameter of the gasket 3 is too small, a suitable notch 4 cannot be designed, and if it is too large, it cannot be stably mounted on the PCB.
  • the notch 4 may be composed of two spaced apart straight portions and a connecting portion connecting the two straight portions, and the distance between the two straight portions may be 1.2 mm to 1.8 mm (ie, b is 1.2 mm to 1.8 mm in FIG. 4). For example, 1.55 mm, the pitches of the two straight portions of the notches 4 corresponding to the pins of different diameters are different.
  • the opening of the notch 4 is disposed toward the edge of the gasket 3 to facilitate rapid discharge of the inflation gas.
  • the capacitor body 1 is symmetrically disposed with two pins 2, and the thickness direction of the straight portion is parallel to the straight line of the two pins 2, which is beneficial to improve the exhaust efficiency.
  • the connecting portion may be an arc structure or a linear structure, and the straight portion is smoothly connected with the notch contour enclosed by the connecting portion, so that the expanded gas can be quickly diffused out from the notch 4 without hindering the gas due to the shape of the notch 4. It affects the efficiency of gas discharge.
  • the notch 4 can also be a circular arc-shaped structure, that is, the entire notch 4 has a circular arc shape, and the notch 4 is surrounded by a continuous curved structure, so that the notch 4 has a smoother contour and a better exhaust effect.
  • the material of the gasket 3 can be the same as that of the capacitor body 1.
  • the material of the gasket 3 selected from the capacitor body 1 can be produced by using existing materials, which is advantageous for large-scale production of capacitors and expansion of application fields, and can also be used as pads.
  • the sheet 3 is integrally formed with the capacitor body 1 to improve production efficiency.
  • a gasket 3 is protruded from the capacitor body 1, and the gasket 3 is provided with a notch 4 for exhausting at the position of the pin 2, so that the electrolytic capacitor is mounted on the PCB board.
  • the upper part forms a non-closed structure.
  • the heat-expanded gas can be discharged from the notch 4 disposed at the pin position, thereby realizing the automatic discharge of excess air in the welding hole, which can reduce the occurrence of the electrolytic capacitor during wave soldering.
  • the possibility of welding defects such as welding pores reduces the defective rate of welding.
  • the electrolytic capacitor provided by the present disclosure is provided with a gasket having a gas leakage gap on the capacitor body, and has a simple structure, can effectively reduce the possibility of occurrence of welding defects such as welding pores, reduce the defective rate of welding, and improve the quality of the product.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

一种可降低焊接气孔不良率的电解电容，其包括设置有引脚的电容本体和垫片，所述垫片位于电容本体底部，且所述垫片相对于电容本体凸出设置；所述垫片在引脚的位置对应设有用于排气的缺口。

Description

电解电容 技术领域
本公开涉及电子元件技术领域，例如涉及一种电解电容。
背景技术
由于便携式电子产品内空间紧凑，在制作铝制电解电容时通常采用直接贴板弯脚固定工艺，使得电容与PCB板接触非常紧密，电容引脚凹陷密封处形成了一个腔体，在进行波峰焊接过程中，可能出现融化的焊锡封住PCB引脚孔，使得上述腔体成为一密闭空间，该腔体内部的空气因受热而急剧膨胀，当通过波峰的一瞬间，未来得及冷却的焊锡被膨胀的气体喷涌带出，产生爆锡及气孔等焊接缺陷，增加了产品的不良率，提高了生产成本，同时也存在产品品质的隐患。
发明内容
本公开提供一种电解电容，可以解决电解电容结构在波峰焊过程中气体无法自动排出而导致的爆锡及出现焊接气孔等焊接缺陷，可降低焊接的不良率，进而提高波峰焊的效率及产品品质。
本公开提供一种电解电容，包括设置有引脚的电容本体和垫片，所述垫片位于电容本体底部，且所述垫片相对于电容本体凸出设置；所述垫片在所述引脚的位置对应设有用于排气的缺口。
可选地，所述垫片高于电容本体底部外边缘0.5mm-1mm。
可选地，所述电容本体的底部设置有一用于设置所述垫片的圆形凹陷，所 述垫片的主体为圆形结构。
可选地，所述垫片的直径比所述圆形凹陷的直径小0.1mm-0.3mm。
可选地，所述缺口由两条间隔设置的直线部及连接所述两条直线部的连接部组成。
可选地，所述电容本体上对称设置有两个引脚，所述直线部的厚度方向平行于所述两个引脚所在直线。
可选地，所述连接部为弧形结构或直线形结构。
可选地，所述缺口为圆弧形结构。
可选地，所述垫片的材质与电容本体相同。
可选地，所述缺口的开口朝向所述垫片的边缘设置。
本公开提供的电解电容的结构设计简单，在电容本体基础上设置具有排气缺口的垫片，可以降低出现焊接气孔等焊接缺陷的可能性，降低焊接的不良率，提高产品品质。
附图说明
图1是一实施例提供的电解电容的第一视角结构示意图；
图2是一实施例提供的电解电容的第二视角结构示意图；
图3是一实施例提供的电解电容的第三视角结构示意图；
图4是一实施例提供的电解电容的第四视角结构示意图。
具体实施方式
波峰焊是让插件板的焊接面直接与高温液态锡接触实现焊接，高温液态锡保持一个斜面，并由特殊装置使液态锡形成一道道类似波浪的现象，所以叫“波峰焊”。
如图1和2所示，本实施例提供了一种电解电容，可以包括电容本体1和垫片3，所述电容本体1上设置有引脚2，所述垫片3位于所述电容本体1的底部，所述垫片3相对于电容本体1凸出设置，所述垫片3在引脚2的位置对应设有用于排气的缺口4。
本实施例将所述垫片3凸出设置，使得电解电容安装在PCB板上时，电解电容的引脚处形成非密封结构，同时还在垫片3上设置缺口4，以在波峰焊时将多余的气体从缺口4处排出，可以改善出现焊接气孔等焊接缺陷的情况。
所述垫片3可以设置为高于电容本体1底部外边缘0.5mm-1mm(即图3中a为0.5mm-1mm)，例如电容本体1的底部为一平面结构，则垫片3可以设置为高于电容本体1底部0.5mm-1mm，这是因为，垫片3高出电容本体1底部外边缘较小时，膨胀气体排出速度较慢，仍会出现爆锡及焊接气孔等焊接缺陷；而垫片3高出电容本体1底部外边缘较大时，不利于电容本体1在PCB板上的固定，容易产生电容本体1晃动甚至脱落等问题。
所述电容本体1的底部可以设置有一用于设置所述垫片3的圆形凹陷，所述圆形凹陷的底面为垫片3的安装平面，所述垫片3的主体可以为圆形结构，将垫片3设置为与安装平面形状相同，可以便于电容本体1及垫片3的加工成型，同时也方便垫片3的固定。
所述垫片3的直径较圆形平面的直径可以小0.1mm-0.3mm，这是因为，垫片3直径略小于安装平面使得垫片3能牢固和方便的贴合在安装平面上，但垫片3直径太小则不能设计合适的缺口4，太大则无法稳定安装在PCB板上。
所述缺口4可以由两条间隔设置的直线部及连接两条直线部的连接部组成，且两个直线部的间距可以为1.2mm-1.8mm(即图4中b为1.2mm-1.8mm)，例如1.55mm，不同直径的引脚对应的缺口4的两条直线部的间距尺寸不同。所述缺口4的开口朝向垫片3的边缘设置，以方便膨胀气体迅速排出。
所述电容本体1对称设置有两个引脚2，所述直线部的厚度方向平行于两引脚2所在直线，这样有利于提高排气效率。
所述连接部可以为弧形结构或直线形结构，直线部与连接部围成的缺口轮廓流畅连接，使得膨胀的气体能够迅速从缺口4扩散出去，不会因缺口4形状对气体产生阻滞而影响气体排出效率。
所述缺口4还可以为圆弧形结构，即整个缺口4为圆弧形状，相当于缺口4由连续的弧形结构围成，使得缺口4轮廓更加流畅，排气效果更好。
所述垫片3的材质可以与电容本体1相同，垫片3选择与电容本体1相同的材料可以利用现有材料进行生产，有利于电容的大规模生产及应用领域的扩展，也可以使垫片3与电容本体1一体成型，提高生产效率。
本实施例在电容本体1底部，相对于电容本体1凸出设置了一垫片3，且垫片3在引脚2的位置对应设有用于排气的缺口4，使得电解电容安装在PCB板上时形成非密闭结构，在波峰焊过程中，受热膨胀的气体可以从在引脚位置设置的缺口4排出，从而实现了焊接孔内多余空气的自动排出，可以降低电解电容在波峰焊接时出现焊接气孔等焊接缺陷的可能性，降低焊接的不良率。通过设计合适的垫片直径及高度，有利于垫片3在PCB板上固定，而选择合适尺寸和形状的缺口有利于膨胀气体快速扩散，保证该结构设计的效果能够实现。
工业实用性
本公开提供的电解电容在电容本体上设置具有排气缺口的垫片，结构简单，可以有效降低出现焊接气孔等焊接缺陷的可能性，降低焊接的不良率，提高产品的品质。

Claims (10)

  1. 一种电解电容，包括设置有引脚的电容本体和垫片，所述垫片位于电容本体底部，且所述垫片相对于电容本体凸出设置；所述垫片在所述引脚的位置对应设有用于排气的缺口。
  2. 根据权利要求1所述的电解电容，其中，所述垫片高于电容本体底部外边缘0.5mm-1mm。
  3. 根据权利要求1所述的电解电容，其中，所述电容本体的底部设置有一用于设置所述垫片的圆形凹陷，所述垫片的主体为圆形结构。
  4. 根据权利要求3所述的电解电容，其中，所述垫片的直径比所述圆形凹陷的直径小0.1mm-0.3mm。
  5. 根据权利要求1所述的电解电容，其中，所述缺口由两条间隔设置的直线部及连接所述两条直线部的连接部组成。
  6. 根据权利要求5所述的电解电容，其中，所述电容本体上对称设置有两个引脚，所述直线部的厚度方向平行于所述两个引脚所在直线。
  7. 根据权利要求5所述的电解电容，其中，所述连接部为弧形结构或直线形结构。
  8. 根据权利要求1所述的电解电容，其中，所述缺口为圆弧形结构。
  9. 根据权利要求1所述的电解电容，其中，所述垫片的材质与电容本体相同。
  10. 根据权利要求1所述的电解电容，其中，所述缺口的开口朝向所述垫片的边缘设置。
PCT/CN2017/109489 2016-11-09 2017-11-06 电解电容 WO2018086492A1 (zh)

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CN201621208542.9U CN206134508U (zh) 2016-11-09 2016-11-09 一种可降低焊接气孔不良率的电解电容
CN201621208542.9 2016-11-09

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Publication number Priority date Publication date Assignee Title
CN206134508U (zh) * 2016-11-09 2017-04-26 深圳创维数字技术有限公司 一种可降低焊接气孔不良率的电解电容

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2005209822A (ja) * 2004-01-21 2005-08-04 Nippon Chemicon Corp 電解コンデンサ
JP2007109940A (ja) * 2005-10-14 2007-04-26 Yaskawa Electric Corp 電解コンデンサの設置構造
US20140085775A1 (en) * 2012-09-24 2014-03-27 Fujitsu Limited Electrolytic capacitor and method of manufacturing the same
CN205508635U (zh) * 2016-02-03 2016-08-24 广东黄宝石电子科技有限公司 贴片电解电容
CN206134508U (zh) * 2016-11-09 2017-04-26 深圳创维数字技术有限公司 一种可降低焊接气孔不良率的电解电容

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209822A (ja) * 2004-01-21 2005-08-04 Nippon Chemicon Corp 電解コンデンサ
JP2007109940A (ja) * 2005-10-14 2007-04-26 Yaskawa Electric Corp 電解コンデンサの設置構造
US20140085775A1 (en) * 2012-09-24 2014-03-27 Fujitsu Limited Electrolytic capacitor and method of manufacturing the same
CN205508635U (zh) * 2016-02-03 2016-08-24 广东黄宝石电子科技有限公司 贴片电解电容
CN206134508U (zh) * 2016-11-09 2017-04-26 深圳创维数字技术有限公司 一种可降低焊接气孔不良率的电解电容

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