WO2023241277A1 - 电路板及具有该电路板的显示装置 - Google Patents

电路板及具有该电路板的显示装置 Download PDF

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Publication number
WO2023241277A1
WO2023241277A1 PCT/CN2023/093986 CN2023093986W WO2023241277A1 WO 2023241277 A1 WO2023241277 A1 WO 2023241277A1 CN 2023093986 W CN2023093986 W CN 2023093986W WO 2023241277 A1 WO2023241277 A1 WO 2023241277A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
solder mask
pad
mask layer
heat dissipation
Prior art date
Application number
PCT/CN2023/093986
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English (en)
French (fr)
Inventor
徐洪磊
Original Assignee
高创(苏州)电子有限公司
京东方科技集团股份有限公司
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Application filed by 高创(苏州)电子有限公司, 京东方科技集团股份有限公司 filed Critical 高创(苏州)电子有限公司
Publication of WO2023241277A1 publication Critical patent/WO2023241277A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias

Definitions

  • Embodiments of the present disclosure relate to, but are not limited to, the field of electrical technology, and in particular, to a circuit board and a display device having the circuit board.
  • an embodiment of the present disclosure provides a circuit board, which includes: a circuit board body; one side of the circuit board body is a component mounting surface; and the other side of the circuit board body is opposite to the component mounting surface.
  • the side is the base surface
  • the component mounting surface is provided with a heat dissipation pad
  • the circuit board body is provided with a heat dissipation hole penetrating from the base surface to the heat dissipation pad
  • the base surface is provided with a bottom anti- solder layer
  • the bottom solder mask layer flows into the heat dissipation hole to form the heat dissipation hole into a half plug hole
  • a reinforced solder mask layer is provided outside the bottom solder mask layer
  • the reinforced solder mask layer covers the Half plug hole.
  • a half plug hole conductive portion is provided at the half plug hole, and the half plug hole conductive portion includes a conductive portion body located in the half plug hole, and a conductive portion located on the base surface.
  • the bottom solder pad on the conductive portion body is configured to be electrically connected to the heat dissipation pad.
  • the bottom solder pad is configured to be electrically connected to the conductive portion body.
  • the bottom solder mask covers the bottom layer.
  • the reinforced solder mask layer covers the bottom solder pad from the outside of the bottom solder mask layer.
  • the half-via hole conductive portion further includes a top-level solder pad located on the component mounting surface, the conductive portion body is configured to be electrically connected to the top-level solder pad, and the top-level solder pad The pad is configured to be electrically connected to the heat dissipation pad.
  • the reinforced solder mask layer is circular
  • the underlying pad is circular
  • the difference between the diameter of the reinforced solder mask layer and the diameter of the underlying pad is greater than or equal to 3 mil.
  • the reinforced solder mask layer is triangular, quadrilateral or pentagonal
  • the underlying pad is triangular, quadrilateral or pentagonal
  • the size of the reinforced solder mask layer is consistent with the underlying solder pad.
  • the difference in disk size is greater than or equal to 3mil.
  • the top pad is formed by folding one end of the conductive body close to the mounting surface outward; the bottom pad is formed by folding the conductive body close to the mounting surface. One end of the basal surface is folded outward.
  • the top layer pad and the heat dissipation pad are constructed as one piece.
  • the thickness of the reinforced solder mask layer is 0.3 mil to 0.7 mil.
  • the number of half plug holes corresponding to a single heat dissipation pad is multiple.
  • the number of the reinforced solder mask layer and the half plug holes are consistent and their positions correspond one to one.
  • a top solder mask layer is provided on the component mounting surface, and the top solder mask layer avoids the heat dissipation pad.
  • the thickness of the top solder mask layer and the bottom solder mask layer is 0.3 mil to 0.7 mil.
  • the top solder mask layer and the bottom solder mask layer are green oil layers
  • the reinforced solder mask layer is a white oil layer
  • an embodiment of the present disclosure provides a display device, including the above-mentioned circuit board.
  • Figure 1 is a schematic cross-sectional view of a circuit board according to an embodiment of the present disclosure
  • Figure 2 is a top view of a circuit board according to an embodiment of the present disclosure
  • Figure 3 is a bottom view of a circuit board according to an embodiment of the present disclosure.
  • FIG. 4 is an enlarged schematic diagram of a half plug hole, a bottom pad, and a reinforced solder mask according to an embodiment of the present disclosure.
  • connection In the embodiments of the present disclosure, unless otherwise explicitly stated and limited, the terms “installation”, “connection”, “connection”, “fixing” and other terms should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Detachable connection, or integration; it can be mechanical connection, electrical connection or mutual communication; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction of two elements relation.
  • Detachable connection, or integration it can be mechanical connection, electrical connection or mutual communication; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction of two elements relation.
  • the present disclosure provides a circuit board and a display device having the circuit board.
  • the circuit board and display device according to the embodiment of the present disclosure will be described in detail below with reference to FIGS. 1 to 4 .
  • a circuit board (also called a PCB board) according to an embodiment of the present disclosure may include a circuit board body 1.
  • One side of the circuit board body 1 is a component mounting surface 11.
  • the opposite side of the component mounting surface is the base surface 12.
  • the top side of the circuit board body 1 is the component mounting surface 11, and the bottom side of the circuit board body 1 is the base surface 12.
  • the part is suitable for being mounted on the part mounting surface 11.
  • the part may be a chip, a resistor, etc.
  • a heat dissipation pad 2 is provided on the component mounting surface 11, and the heat dissipation pad 2 corresponds to the center of the component.
  • a plurality of ordinary pads 7 can be arranged around the heat dissipation pad 2. The pins on both sides of the part can be welded and fixed to the ordinary pads 7, and the center of the part can be welded and fixed to the heat dissipation pad 2.
  • the circuit board body 1 is provided with heat dissipation holes from the base surface 12 to the heat dissipation pad 2. In this way, part of the heat in the center of the component can be dissipated through the heat dissipation holes, and the other part of the heat can be transferred to the heat dissipation pad 2 first, and then through the heat dissipation hole. Pad 2 radiates out from the heat dissipation holes, thereby effectively preventing parts from being damaged due to excessive temperature. As shown in Figure 1, the heat dissipation holes penetrate the circuit board body 1 and the heat dissipation pad 2 in the up and down direction.
  • a bottom solder mask 3 is provided on the base surface 12.
  • the bottom solder mask 3 is a non-conductive material.
  • the bottom solder mask 3 flows into the heat dissipation holes to form the heat dissipation holes into half plug holes 13.
  • the bottom solder mask 3 in the heat dissipation hole has the function of blocking the heat dissipation hole. In this way, when the parts are soldered on the component mounting surface 11, the solder paste will not flow from the heat dissipation hole to the base surface 12.
  • the bottom solder mask layer 3 is provided with a reinforced solder mask layer 4 outside.
  • the reinforced solder mask layer 4 covers the half plug hole 13.
  • the edge of the reinforced solder mask layer 4 extends outward beyond the edge of the half plug hole 13. In this way, the reinforced solder mask layer 4 covers the half plug hole 13. Layer 4 can well cover the half plug hole 13 from the outside of the bottom solder mask layer 3, so that the half plug hole 13 is well sealed and no tin leakage occurs.
  • the half-plug hole 13 of the circuit board is well sealed, which can prevent the tin at the component from leaking from the half-plug hole 13 from the component mounting surface 11 to the base surface 12. , which is conducive to improving the placement accuracy and yield rate of circuit boards.
  • a half plug hole conductive part 6 is provided at the half plug hole 13 , and the half plug hole conductive part 6 may include a conductive part body 61 and a bottom solder pad 62, the conductive portion body 61 is located in the half plug hole 13, the bottom pad 62 is located on the base surface 12, the conductive portion body 61 is configured to be electrically connected to the heat dissipation pad 2, and the bottom pad 62 is configured to be electrically connected to the conductive portion The body 61 is electrically connected, and the bottom solder mask 3 covers the bottom pad 62 . In this way, a connected circuit can be formed between the component mounting surface 11 and the base surface 12 .
  • the reinforced solder mask layer 4 covers the bottom pad 62 from the outside of the bottom solder mask layer 3.
  • the reinforced solder mask layer 4 is located on the side of the bottom solder mask layer 3 away from the circuit board body 1, and the edge of the reinforced solder mask layer 4 faces toward The outside exceeds the edge of the bottom solder pad 62.
  • the reinforced solder mask 4 can well cover the bottom pad 62 from the outside of the bottom solder resist 3, and thus the half plug hole 13 can be covered.
  • the half plug hole 13 is not easy to Tin leakage.
  • the half plug hole 13, the reinforced solder mask 4, and the bottom pad 62 are all circular, and the diameter of the reinforced solder mask 4 - the diameter of the bottom pad 62 ⁇ 3mil(mil).
  • the diameter of the half plug hole 13 is 12mil
  • the diameter of bottom pad 62 22mil strengthen the diameter of solder mask 4 26mil
  • the reinforced solder mask 4 may be in one or more shapes such as triangle, quadrilateral, or pentagon, and the underlying pad 62 may also be in a triangular, quadrilateral, or pentagonal shape. One or two or more of the following shapes, it is only necessary to ensure that the edge of the reinforced solder mask 4 extends outward beyond the edge of the underlying pad 62 .
  • the half-hole conductive part 6 may also include a top-layer pad 63 located on the component mounting surface 11 , and the conductive part body 61 is provided In order to be electrically connected to the top pad 63 , the top pad 63 is configured to be electrically connected to the heat dissipation pad 2 .
  • the top pad 63 may be formed by folding the top end of the conductive part body 61 outward, and the bottom pad 62 may be formed by folding the bottom end of the conductive part body 61 outward.
  • the half-hole conductive part 6 is a conductor as a whole.
  • the half-hole conductive part 6 can be made of copper or aluminum.
  • the top pad 63 and the heat dissipation pad 2 can be constructed as an integral piece, that is, the half-via via 6 and the heat dissipation pad 2 can be constructed as an integral piece.
  • the thickness H3 of the reinforced solder mask layer 4 may be 0.3mil, 0.4mil, 0.5mil, 0.6mil, or 0.7mil.
  • the thickness H3 of the reinforced solder mask layer 4 can also be other values between 0.3mil and 0.7mil, which will not be listed here.
  • the number of half plug holes 13 corresponding to a single heat dissipation pad 2 is multiple, which is conducive to increasing the air volume at the heat dissipation pad 2 and thereby improving the heat dissipation soldering process.
  • the heat dissipation efficiency of pad 2 prevents the parts at heat dissipation pad 2 from being damaged due to excessive temperature.
  • the number of the reinforced solder mask 4 and the half-plug holes 13 are consistent and their positions correspond to each other. This can save the amount of the reinforced solder mask 4 and reduce the circuit load. The weight of the board.
  • a top solder mask 5 may be provided on the component mounting surface 11 .
  • the top solder mask 5 is a non-conductive material, and the top solder mask 5 avoids heat dissipation soldering. Disk 2. As shown in Figure 1, the heat dissipation pad 2 is exposed from the top solder mask 5, which will not affect the electrical connection between the component and the heat dissipation pad 2.
  • the thickness of the top solder mask layer 5 is H1
  • the thickness of the bottom solder mask layer 3 is H2
  • H1 0.3mil to 0.7mil
  • H2 0.3mil to 0.7mil
  • the thickness of the top solder mask layer 5 and the bottom solder mask layer 3 may be 0.3mil, 0.4mil, 0.5mil, 0.6mil, or 0.7mil.
  • the thickness of the top solder mask layer 5 and the bottom solder mask layer 3 can also be other values between 0.3 mil and 0.7 mil, which will not be listed here.
  • the top solder mask layer 5 and the bottom solder mask layer 3 may be solder mask ink layers, and the reinforced solder mask layer 4 may be a printing ink layer. Printing ink can be used to print on the outside of the bottom solder resist layer 3 at a position corresponding to the half plug hole 13 to form a reinforced solder resist layer 4 .
  • the top solder mask layer 5 and the bottom solder mask layer 3 are green oil layers
  • the reinforced solder mask layer 4 is a white oil layer.
  • White oil is often used to print text outside the green oil layer.
  • Using white oil to form a reinforced solder mask 4 can make full use of the original production and manufacturing equipment of the circuit board without adding additional equipment, that is, the enhanced anti-solder layer can be completed in the process of printing text.
  • the printing of solder layer 4 is beneficial to saving the manufacturing cost of the circuit board.
  • the color difference between white oil and green oil is large. When the white oil printing is uneven, it can be discovered in time, so that it is convenient to add a reinforced solder mask 4 to the position of the half plug hole 13 to improve the sealing of the half plug hole 13.
  • the plugging effect prevents tin leakage at 13 semi-plugged holes.
  • the reinforced solder mask layer 4 can also be called white silk screen.
  • the process flow of the circuit board may be: inner layer ⁇ lamination to form the circuit board body 1 ⁇ drilling heat dissipation holes ⁇ electroplating ⁇ forming the heat dissipation pad 2 and the half plug hole conductive part 6 ⁇ forming the bottom solder mask layer 3 and the top solder mask layer 5 ⁇ use white oil to form the reinforced solder mask layer 4, and use white oil to print text at the target position ⁇ perform surface treatment ⁇ molding ⁇ electrical testing ⁇ finished product inspection ⁇ packaging and shipment.
  • the order of equipment used in the circuit board process can be: printing machine ⁇ solder paste printing inspection machine ⁇ high-speed placement machine ⁇ general purpose machine ⁇ reflow oven ⁇ optical solder joint inspection machine ⁇ printing machine ⁇ solder paste printing inspection machine ⁇ High-speed placement machine ⁇ general-purpose machine ⁇ reflow oven ⁇ optical solder joint inspection machine.
  • a display device includes the circuit board of the above embodiment.
  • the display device of the embodiment of the present disclosure by adding a reinforced solder mask 4 at the corresponding position at the bottom of the half plug hole 13, the half plug hole 13 of the circuit board is well sealed and no tin leakage occurs, thereby preventing tin leakage during soldering.
  • the resulting problems of poor welding and reduced mounting accuracy make the circuit board mounting accuracy higher and the yield rate higher.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种电路板及具有该电路板的显示装置，该电路板包括：电路板本体(1)，所述电路板本体(1)的一侧为零件安装面(11)，所述电路板本体(1)的另一侧为基底面(12)，所述零件安装面(11)上设有散热焊盘(2)，所述电路板本体(1)上开设有自所述基底面(12)贯通至所述散热焊盘(2)的散热孔，所述基底面(12)上设有底层防焊层(3)，所述底层防焊层(3)流入所述散热孔以使所述散热孔形成为半塞孔(13)，所述底层防焊层(3)外设有加强防焊层(4)，所述加强防焊层(4)封盖所述半塞孔(13)。

Description

电路板及具有该电路板的显示装置
本申请要求于2022年6月14日提交中国专利局、申请号为202210672765.4、发明名称为“电路板及具有该电路板的显示装置”的中国专利申请的优先权，其内容应理解为通过引用的方式并入本申请中。
技术领域
本公开实施例涉及但不限于电气技术领域，尤指一种电路板及具有该电路板的显示装置。
背景技术
在电路板上，对于零件中心带有散热焊盘的，需要在设计电路板时打半塞孔以对散热焊盘散热，达到较好的散热效果。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
第一方面，本公开实施例提供了一种电路板，包括：电路板本体，所述电路板本体的一侧为零件安装面，所述电路板本体的与所述零件安装面相对的另一侧为基底面，所述零件安装面上设有散热焊盘，所述电路板本体上开设有自所述基底面贯通至所述散热焊盘的散热孔，所述基底面上设有底层防焊层，所述底层防焊层流入所述散热孔以使所述散热孔形成为半塞孔，所述底层防焊层外设有加强防焊层，所述加强防焊层封盖所述半塞孔。
在一示例性实施例中，所述半塞孔处设有半塞孔导通部，所述半塞孔导通部包括位于所述半塞孔内的导通部本体、位于所述基底面上的底层焊盘，所述导通部本体设置为与所述散热焊盘电连接，所述底层焊盘设置为与所述导通部本体电连接，所述底层防焊层覆盖所述底层焊盘，所述加强防焊层从所述底层防焊层外封盖所述底层焊盘。
在一示例性实施例中，所述半塞孔导通部还包括位于所述零件安装面上的顶层焊盘，所述导通部本体设置为与所述顶层焊盘电连接，所述顶层焊盘设置为与所述散热焊盘电连接。
在一示例性实施例中，所述加强防焊层为圆形，所述底层焊盘为圆形，所述加强防焊层的直径与所述底层焊盘的直径的差大于或等于3mil。
在一示例性实施例中，所述加强防焊层为三角形、四边形或五边形，所述底层焊盘为三角形、四边形或五边形，所述加强防焊层的尺寸与所述底层焊盘的尺寸的差大于或等于3mil。
在一示例性实施例中，所述顶层焊盘通过将所述导通部本体靠近所述安装面的一端向外翻折形成；所述底层焊盘通过将所述导通部本体靠近所述基底面的一端端向外翻折形成。
在一示例性实施例中，所述顶层焊盘与所述散热焊盘构造为一体件。
在一示例性实施例中，所述加强防焊层的厚度为0.3mil至0.7mil。
在一示例性实施例中，单个所述散热焊盘对应的所述半塞孔的数量为多个。
在一示例性实施例中，所述加强防焊层与所述半塞孔的数量一致且位置一一对应。
在一示例性实施例中，所述零件安装面上设有顶层防焊层，所述顶层防焊层避让所述散热焊盘。
在一示例性实施例中，所述顶层防焊层和所述底层防焊层的厚度为0.3mil至0.7mil。
在一示例性实施例中，所述顶层防焊层和所述底层防焊层为绿油层，所述加强防焊层为白油层。
第二方面，本公开实施例提供了一种显示装置，包括上述的电路板。
本公开实施例的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本公开实施例的实践了解到。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图概述
图1是本公开一个实施例的电路板的剖面示意图；
图2是本公开一个实施例的电路板的俯视图；
图3是本公开一个实施例的电路板的仰视图；
图4是本公开一个实施例的半塞孔、底层焊盘、加强防焊层的放大示意图。
详述
下面详细描述本公开的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本公开的实施例，而不能理解为对本公开的限制。
在本公开实施例的描述中，需要理解的是，术语“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开实施例的限制。此外，在本公开实施例的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本公开实施例中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或可以互相通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开实施例中的具体含义。
如前所述，目前在设计电路板时要打半塞孔以对散热焊盘进行散热，但发明人发现因不同工厂塞孔率管控能力不同，会存在焊锡融化时容易流入半塞孔内，从电路板另一面溢出的风险，造成散热焊盘吃锡不良及焊锡分布不均匀从而降低贴装精度。
为了更好地对半塞孔进行封孔，本公开提供了一种电路板以及具有该电路板的显示装置。下面结合图1至图4详细描述根据本公开实施例的电路板以及显示装置。
参照图1至图2所示，根据本公开实施例的电路板(又称PCB板)可以包括电路板本体1，电路板本体1的一侧为零件安装面11，电路板本体1的与所述零件安装面相对的另一侧为基底面12，例如在图1中，电路板本体1的顶侧为零件安装面11，电路板本体1的底侧为基底面12。零件适于安装在零件安装面11上，可选地，零件可以是芯片、电阻等。
零件安装面11上设有散热焊盘2，散热焊盘2与零件的中心对应。散热焊盘2的周围可以设置多个普通焊盘7，零件的两侧引脚能够与普通焊盘7焊接固定，零件的中心能够与散热焊盘2焊接固定。
电路板本体1上开设有自基底面12贯通至散热焊盘2的散热孔，这样，零件中心的一部分热量可以经散热孔散发出去，另一部分热量可以先传递给散热焊盘2，再经散热焊盘2从散热孔散发出去，从而有效防止零件温度过高而导致损坏。如图1所示，散热孔沿上下方向贯通电路板本体1和散热焊盘2。
参照图1、图3所示，基底面12上设有底层防焊层3，底层防焊层3为不导电物质，底层防焊层3流入散热孔以使散热孔形成为半塞孔13，散热孔内的底层防焊层3具有封堵散热孔的作用，这样，在零件安装面11上对零件进行锡焊时，锡膏不会从散热孔流到基底面12去。底层防焊层3外设有加强防焊层4，加强防焊层4封盖半塞孔13，换言之，加强防焊层4的边缘向外超出半塞孔13的边缘，这样，加强防焊层4能够很好地从底层防焊层3外封盖半塞孔13，使得半塞孔13封闭良好，不会出现漏锡现象。
根据本公开实施例的电路板，通过设置加强防焊层4，使得电路板的半塞孔13封闭良好，可以防止零件处的锡从半塞孔13由零件安装面11漏到基底面12去，有利于提升电路板的贴装精度和良品率。
在本公开的一个实施例中，参照图1至图4所示，半塞孔13处设有半塞孔导通部6，半塞孔导通部6可以包括导通部本体61和底层焊盘62，导通部本体61位于半塞孔13内，底层焊盘62位于基底面12上，导通部本体61设置为与散热焊盘2电连接，底层焊盘62设置为与导通部本体61电连接，底层防焊层3覆盖底层焊盘62，这样，可以在零件安装面11和基底面12之间形成连通的电路。
加强防焊层4从底层防焊层3外封盖底层焊盘62，换言之，加强防焊层4位于底层防焊层3的背离电路板本体1的一侧，加强防焊层4的边缘向外超出底层焊盘62的边缘，这样，加强防焊层4能够很好地从底层防焊层3外封盖底层焊盘62，也就可以封盖半塞孔13，半塞孔13处不易漏锡。
在图1、图3至图4所示的实施例中，半塞孔13、加强防焊层4、底层焊盘62均为圆形，加强防焊层4的直径-底层焊盘62的直径≥3mil(密耳)。例如，在一些实施例中，半塞孔13的直径为12mil，底层焊盘62的直径为22mil，加强防焊层4的直径为26mil，加强防焊层4的直径-底层焊盘62的直径
在图中未示出的一些实施例中，加强防焊层4可以为三角形、四边形、五边形等形状中的一种或两种以上，底层焊盘62也可以为三角形、四边形、五边形等形状中的一种或两种以上，只需保证加强防焊层4的边缘向外超出底层焊盘62的边缘即可。
在本公开的一个实施例中，参照图1至图2所示，半塞孔导通部6还可以包括顶层焊盘63，顶层焊盘63位于零件安装面11上，导通部本体61设置为与顶层焊盘63电连接，顶层焊盘63设置为与散热焊盘2电连接。顶层焊盘63可以通过将导通部本体61的顶端向外翻折而形成，底层焊盘62可以通过将导通部本体61的底端向外翻折而形成。半塞孔导通部6整体为导体，例如，半塞孔导通部6可以是铜或铝。
在一个实施例中，如图1所示，顶层焊盘63与散热焊盘2可以构造为一体件，即半塞孔导通部6与散热焊盘2可以构造为一体件。
在本公开的一个实施例中，参照图1所示，加强防焊层4的厚度为H3，H3＝0.3mil至0.7mil。例如可选地，加强防焊层4的厚度H3可以是0.3mil、0.4mil、0.5mil、0.6mil、0.7mil。当然，加强防焊层4的厚度H3也可以是0.3mil至0.7mil之间的其它数值，这里不再一一列举。
在本公开的一个实施例中，参照图2至图3所示，单个散热焊盘2对应的半塞孔13数量为多个，这样有利于增加散热焊盘2处的风量，从而提高散热焊盘2的散热效率，防止散热焊盘2处的零件温度过高导致损坏。
在本公开的一个实施例中，参照图1、图3所示，加强防焊层4与半塞孔13的数量一致且位置一一对应，这样可以节省加强防焊层4的用量，减轻电路板的重量。
在本公开的一个实施例中，参照图1至图2所示，零件安装面11上可设有顶层防焊层5，顶层防焊层5为不导电物质，顶层防焊层5避让散热焊盘2。如图1所示，散热焊盘2从顶层防焊层5露出，这样不会影响零件与散热焊盘2之间的电连接。
在本公开的一个实施例中，参照图1所示，顶层防焊层5的厚度为H1，底层防焊层3的厚度为H2，H1＝0.3mil至0.7mil，H2＝0.3mil至0.7mil。例如可选地，顶层防焊层5和底层防焊层3的厚度可以是0.3mil、0.4mil、0.5mil、0.6mil、0.7mil。当然，顶层防焊层5和底层防焊层3的厚度也可以是0.3mil至0.7mil之间的其它数值，这里不再一一列举。
在本公开的一个实施例中，顶层防焊层5和底层防焊层3可为防焊油墨层，加强防焊层4可为印刷油墨层。可以使用印刷文字的油墨印刷在底层防焊层3外对应半塞孔13的位置处以形成加强防焊层4。
在本公开的一个实施例中，顶层防焊层5和底层防焊层3为绿油层，加强防焊层4为白油层。白油常用于在绿油层外印制文字，利用白油形成加强防焊层4，可以充分利用电路板原有的生产制造设备，不必另外增加设备，即在印制文字的工序中完成加强防焊层4的印制，有利于节省电路板的制造成本。并且，白油与绿油的色差较大，当白油印刷不均匀时，可以及时发现，从而便于对半塞孔13的位置补加加强防焊层4，以提升对半塞孔13的封堵效果，防止半塞孔13处漏锡。加强防焊层4也可以称为白色丝印。
在一个实施例中，电路板的工艺流程可以是：内层→压合形成电路板本体1→钻散热孔→电镀→形成散热焊盘2和半塞孔导通部6→形成底层防焊层3和顶层防焊层5→使用白油形成加强防焊层4，并使用白油在目标位置印刷文字→进行表面处理→成型→电测→成品检查→包装出货。
电路板的工艺流程所使用的设备顺序可以是：印刷机→锡膏印刷检查机→高速贴片机→泛用机→回焊炉→光学焊点检测机→印刷机→锡膏印刷检查机→高速贴片机→泛用机→回焊炉→光学焊点检测机。
根据本公开另一方面实施例的显示装置，包括上述实施例的电路板。
根据本公开实施例的显示装置，通过在半塞孔13的底部对应位置增设加强防焊层4，使得电路板的半塞孔13封闭良好，不会出现漏锡现象，从而防止焊接时漏锡而导致的焊接不良及贴装精度下降的问题，使得电路板的贴装精度较高，良品率较高。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料 或者特点包含于本公开的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。此外，本领域的技术人员可以将本说明书中描述的不同实施例或示例进行接合和组合。
尽管上面已经示出和描述了本公开的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本公开实施例的限制，本领域的普通技术人员在本公开的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (14)

  1. 一种电路板，包括：电路板本体，所述电路板本体的一侧为零件安装面，所述电路板本体的与所述零件安装面相对的另一侧为基底面，所述零件安装面上设有散热焊盘，所述电路板本体上开设有自所述基底面贯通至所述散热焊盘的散热孔，所述基底面上设有底层防焊层，所述底层防焊层流入所述散热孔以使所述散热孔形成为半塞孔，所述底层防焊层外设有加强防焊层，所述加强防焊层封盖所述半塞孔。
  2. 根据权利要求1所述的电路板，其中，所述半塞孔处设有半塞孔导通部，所述半塞孔导通部包括位于所述半塞孔内的导通部本体、位于所述基底面上的底层焊盘，所述导通部本体设置为与所述散热焊盘电连接，所述底层焊盘设置为与所述导通部本体电连接，所述底层防焊层覆盖所述底层焊盘，所述加强防焊层从所述底层防焊层外封盖所述底层焊盘。
  3. 根据权利要求2所述的电路板，其中，所述半塞孔导通部还包括位于所述零件安装面上的顶层焊盘，所述导通部本体设置为与所述顶层焊盘电连接，所述顶层焊盘设置为与所述散热焊盘电连接。
  4. 根据权利要求2所述的电路板，其中，所述加强防焊层为圆形，所述底层焊盘为圆形，所述加强防焊层的直径与所述底层焊盘的直径的差大于或等于3mil。
  5. 根据权利要求2所述的电路板，其中，所述加强防焊层为三角形、四边形或五边形，所述底层焊盘为三角形、四边形或五边形，所述加强防焊层的尺寸与所述底层焊盘的尺寸的差大于或等于3mil。
  6. 根据权利要求5所述的电路板，其中，所述顶层焊盘通过将所述导通部本体靠近所述安装面的一端向外翻折形成；所述底层焊盘通过将所述导通部本体靠近所述基底面的一端端向外翻折形成。
  7. 根据权利要求5所述的电路板，其中，所述顶层焊盘与所述散热焊盘构造为一体件。
  8. 根据权利要求1所述的电路板，其中，所述加强防焊层的厚度为0.3mil至0.7mil。
  9. 根据权利要求1所述的电路板，其中，单个所述散热焊盘对应的所述半塞孔的数量为多个。
  10. 根据权利要求9所述的电路板，其中，所述加强防焊层与所述半塞孔的数量一致且位置一一对应。
  11. 根据权利要求1所述的电路板，其中，所述零件安装面上设有顶层防焊层，所述顶层防焊层避让所述散热焊盘。
  12. 根据权利要求11所述的电路板，其中，所述顶层防焊层和所述底层防焊层的厚度为0.3mil至0.7mil。
  13. 根据权利要求11所述的电路板，其中，所述顶层防焊层和所述底层防焊层为绿油层，所述加强防焊层为白油层。
  14. 一种显示装置，包括权利要求1至13中任一项所述的电路板。
PCT/CN2023/093986 2022-06-14 2023-05-12 电路板及具有该电路板的显示装置 WO2023241277A1 (zh)

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