WO2019128220A1 - 金属导体微波网络电路的焊点结构及焊接结构 - Google Patents
金属导体微波网络电路的焊点结构及焊接结构 Download PDFInfo
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- WO2019128220A1 WO2019128220A1 PCT/CN2018/097597 CN2018097597W WO2019128220A1 WO 2019128220 A1 WO2019128220 A1 WO 2019128220A1 CN 2018097597 W CN2018097597 W CN 2018097597W WO 2019128220 A1 WO2019128220 A1 WO 2019128220A1
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- solder
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- solder resist
- tin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Definitions
- the present invention relates to the field of mobile communication equipment processing technology, and in particular to a solder joint structure and a solder structure of a metal conductor microwave network circuit.
- Microwave devices are indispensable in mobile communication network coverage. The performance of its performance affects the quality of the entire network coverage.
- the microwave network circuit is the core part of the microwave device, and carries the realization functions of phase, power ratio and other electrical properties.
- Microwave circuits generally include a circuit printed on a substrate such as a PCB board or a circuit composed of a metal conductor having a three-dimensional structure in accordance with known circuit principles.
- the metal conductor microwave network circuit lacks the dielectric influence of the non-metal medium, which theoretically contributes to the extremely low insertion loss of the microwave device, and the mechanical processing technology for obtaining the metal conductor circuit is also more and more than the PCB processing technology. Good source, higher production efficiency, and the same size of metal conductor microwave network circuit also has a very obvious cost advantage.
- solder joint structure and a solder structure of a metal conductor microwave network circuit which can ensure the stability of stacking tin and the conformity of the stacking tin at the solder joint, and improve the electrical connection quality of the solder joint by Reduce the secondary work caused by the difference in solder joints and improve the efficiency of assembly.
- a solder joint structure of a metal conductor microwave network circuit comprising:
- circuit body the circuit body is provided with at least one solder joint, and the solder joint is provided with a soldering work surface;
- the first set of solder layers are disposed on the soldering work surface and enclose a soldering work area, and the soldering work surface is recessed with a tin portion located in the soldering work area Wherein the welding work area is used for welding positioning with the cable core.
- the soldering work area is set on the soldering point of the metal circuit body, and the first set of solder layers is screen printed on the soldering work area, and The first set of welding layers are encircled to form a welding working area, so that when the cable core wire is soldered to the welding working area, the first set of welding layers can prevent the excessive soldering of the soldering, which makes the stacking tin difficult, and ensures the stability of the stacking tin and the stack.
- the consistency of the tin form is good; at the same time, the tin part recessed in the welding work area can ensure the complete and reliable coating of the cable core wire, ensure the good electrical connection quality of the solder joint, and enhance the cable core wire in the cable routing.
- the ability to withstand external forces is beneficial to reducing the amount of secondary work and improving the efficiency of the assembly; and the structure of the solder joint is simple to implement, low in cost and high in reliability.
- the circuit body further includes a circuit body connected to the solder joint, the first solder resist layer including a solder resist covering the junction of the soldering work surface and the circuit body Main department. This can effectively limit the flow of solder from the high temperature region of the solder joint to the low temperature region of the circuit body connected to the solder joint, thereby ensuring the stability and shape uniformity of the stack.
- the first solder resist layer further includes a first solder resist side wing portion and a second solder resist side wing portion, and the same end of the first solder resist side wing portion and the second solder resist side wing portion Both are connected to the solder resist trunk portion, and the other end is free to extend outward along both side edges of the soldering work surface. In this way, the solder can be effectively prevented from flowing through the thickness surface of the circuit body to the low temperature region where the circuit body is connected to the solder joint, thereby ensuring the stability and shape uniformity of the stack.
- the tin storage portion is a solder blind slot or a soldering through slot
- the solder blind slot or the soldering slot has a slot width smaller than a diameter of the cable core. This can prevent the cable core wire from falling into the groove during welding, affecting the convenience and reliability of the welding operation, and at the same time, it is beneficial to control the flow of the solder, ensure reliable coating with the cable core wire, and improve the quality and stability of the electrical connection.
- the weld blind groove or the weld groove has a groove width that is 0.1 to 0.2 mm smaller than the diameter of the cable core. In this range, it can adapt to the welding assembly of cable cores of different sizes, ensuring high electrical connection quality, and at the same time can meet the molding process requirements of welding blind grooves or welding channels.
- the second solder resist layer is further disposed, the solder joint is further provided with a soldering work opposite surface disposed opposite to the soldering working surface, and the second solder resist layer is coated on the soldering operation
- the soldering portion is a soldering through slot, and the opposing surface of the soldering operation is in communication with the soldering working surface through the soldering through slot.
- the second set of solder layers coated on the opposite side of the soldering operation can prevent excessive solder flow, and because the size of the soldering pass is under the foot, the solder remains only in the groove due to surface tension. Accumulation without dripping is beneficial to improve the stability and shape consistency of the butt welds while avoiding environmental pollution.
- the opposite side of the welding operation is provided with a solder resist reserved area, and the solder resist reserved area is located between the second solder resist layer and the edge of the solder via.
- the solder resist reserved area has a width ranging from 0.5 to 1.0 mm.
- the present invention also provides a soldering structure comprising a cable core, a solder body and a solder joint structure of the metal conductor microwave network circuit as described above, the solder body being filled in the soldering work area, the tin storage part And in the solder resist reserved area, the cable core is wrapped in the solder body.
- the soldering work area is set on the soldering point of the metal circuit body, and the first group of solder layers is screen printed on the soldering work area.
- the first set of welding layers are encircled to form a welding working area, so when the cable core wire soldering is positioned in the welding working area, the first set of welding layers can prevent the excessive soldering of the soldering, which makes the stacking tin difficult, and ensures the stability of the stacking tin and The consistency of the tin form is good; at the same time, the tin part recessed in the welding work area can ensure the complete and reliable coating of the cable core wire, ensure the good electrical connection quality of the solder joint, and enhance the cable core wire in the cable routing.
- the ability to withstand external forces is beneficial to reduce the amount of secondary work and improve the efficiency of the assembly; and the structure of the solder joint is simple to implement, low in cost and high in reliability.
- the solder body is provided with an inner recess at one end of the solder resist reserved area.
- the amount of tin deposited on the welding work surface is relatively large, and the solder cooling time is longer than that in the groove.
- the solder in the groove is subjected to tensile force during cooling, resulting in soldering on the side of the second solder resist layer.
- the solder surface of the groove surface forms the above-mentioned inner concave portion, which is beneficial to ensure the flatness of the surface of the second solder resist layer, and contributes to the installation of the metal conductor microwave network circuit; on the other hand, the cable core wire is completely covered by the solder. It improves the electrical connection quality of the cable core at the soldering point and provides a strong guarantee for the stability of the electrical index.
- FIG. 1 is a schematic structural diagram of a metal conductor microwave network circuit according to an embodiment of the present invention
- Figure 2 is a partially enlarged schematic view showing the structure of Figure 1;
- FIG. 3 is a schematic structural view of an opposite side of a welding operation of a welding spot according to an embodiment of the present invention
- FIG. 4 is a schematic view showing a welded structure of a cable core wire and a solder joint according to an embodiment of the present invention
- FIG. 5 is a cross-sectional structural view of the B-B of the structure of FIG.
- first and second in the present invention do not represent a specific number and order, but are merely used for distinguishing names.
- a solder joint structure of a metal conductor microwave network circuit includes: a circuit body 100 and a first solder resist layer 200 .
- the circuit body 100 may be a metal conductor microwave network circuit, which is processed by a non-magnetic high-conductivity metal plate with good mechanical properties, generally adopting a copper plate or an aluminum alloy plate, such as Al6061-T6, so as to ensure obtaining Better end face burr quality.
- the circuit body 100 is provided with at least one circuit branch, and the end of the circuit branch is provided with at least one soldering point 110, and the soldering point 110 is provided with a soldering working surface 111; according to the needs of electrical performance, the circuit The body 100 can form a different number of circuit branches, and the outlet or the inlet of each circuit branch is an electrical connection solder joint 110 for improving the mounting capacity and performance of the circuit body.
- the first set of soldering layers are disposed on the soldering working surface 111 and enclose a soldering work area 300, and the soldering working surface 111 is recessed with a tin storage portion 400 located in the soldering working area 300;
- the welding work area 300 is used for welding positioning with the cable core 500.
- a soldering work area is disposed on the solder joint 110 of the metal circuit body 100, and the first set of solder layers is screen printed on the soldering work area. And the first set of solder layers are encircled to form the soldering work area 300. Therefore, when the cable core 500 is soldered to the soldering work area 300, the first set of solder layers can prevent the solder from being excessively flowed, resulting in difficulty in stacking the tin, ensuring the stack.
- the tin stability is consistent with the tin pattern of the stack; at the same time, the tin portion 400 recessed in the soldering work area 300 can ensure the complete and reliable soldering of the cable core 500, ensuring good electrical connection quality of the solder joint, and at the same time
- the reinforced cable core 500 is capable of withstanding external forces in the cable routing, which is advantageous for reducing the secondary workload and improving the assembly efficiency; and the solder joint structure is simple in implementation, low in cost and high in operational reliability.
- the circuit body 100 further includes a circuit body 120 connected to the solder joint, and the first solder resist layer 200 includes a soldering work surface 111 and a cover.
- the solder resist trunk 210 of the junction of the circuit body 120 is described. This can effectively limit the flow of solder from the high temperature region of the solder joint to the low temperature region of the circuit body 100 connected to the solder joint 110, thereby ensuring the stability and shape uniformity of the stack.
- the first solder resist layer 200 further includes a first solder resist side wing portion 220 and a second solder resist side wing portion 230, and the first solder resist side wing portion 220 and the second solder resist side wing portion 230 are identical
- the ends are all connected to the solder resist trunk 210, and the other ends are free to extend outward along the two side edges of the soldering working surface 111, respectively. In this way, it is possible to effectively prevent solder from flowing through the thickness surface of the circuit body 100 to the low temperature region where the circuit body 100 is connected to the solder joint 110, thereby ensuring stability and shape uniformity of the stack.
- the first solder resist layer 200 is formed on the soldering work surface by a silk screen process, and the first solder resist layer 200 is set in a “Y” shape, “Y”.
- the vertical support of the type is the above-mentioned solder resist trunk portion 210, and the two oblique branchings are the first solder resist side wing portion 220 and the second solder resist side wing portion 230, and the "Y" type open side is It is the above-mentioned welding work area 300.
- the tin storage portion 400 is a solder blind slot or a soldering through slot, and the solder blind slot or the soldering slot has a slot width smaller than a diameter of the cable core 500 . .
- the cable core wire 500 can be prevented from falling into the groove during welding, which affects the convenience and reliability of the welding operation, and is advantageous for controlling the flow of the solder, ensuring reliable coating with the cable core wire 500, and improving the quality and stability of the electrical connection.
- the groove width of the welding blind groove or the welding through groove is smaller than the diameter of the cable core 500 by 0.1 to 0.2 mm. In this range, it can adapt to the welding assembly of cable core wires 500 of different sizes, ensuring high electrical connection quality, and at the same time, can meet the molding process requirements of welding blind grooves or welding through grooves.
- a second solder resist layer 600 is further disposed, and the solder joint 110 is further provided with a soldering work opposing surface 112 disposed opposite to the soldering working surface 111, and the second solder resist layer 600 is coated on the soldering layer
- the working tint portion 400 is a soldering through slot, and the soldering work opposing surface 112 is electrically connected to the soldering working surface 111 through the soldering through slot. In this way, it is ensured that the molten solder of the welding working surface 111 on the soldering point 110 is guided to the welding working opposite surface 112 (and the back side of the cable core 500) through the soldering groove, so that the solder can completely and reliably cover the cable core.
- the second set of solder layers coated on the opposite side 112 of the soldering operation can prevent the solder from excessively flowing, and because of the size of the soldering through the groove, the solder is due to the surface tension The effect only remains in the interior of the tank without dripping, which is beneficial to improve the stability and shape consistency of the butt weld and avoid environmental pollution.
- the second solder resist layer 600 is formed in the same manner as the first set of solder layers, and the green oil coating is applied to the solder joints 110 of the metal material by a silk screen process.
- the soldering operation opposite surface 112 is provided with a solder resist reserved area 700.
- the solder resist reserved area 700 is a U-shaped region disposed around the slot of the soldering through slot.
- a solder resist reserve area 700 is located between the second solder resist layer 600 and the edge of the solder via.
- the electrical connection quality of 110 causes a hidden danger; on the other hand, the design of the tin-filled portion 400 and the solder resist reserved area 700 is matched, specifically, the opening size of the solder resist reserved area 700 is designed to be larger than that of the tin-filled portion 400.
- the size of the opening is such that the solder in the soldering groove (the tin portion 400) is guided to the opposite surface of the soldering operation, and when the solder is cooled and solidified, a barb is formed in the solder resist reserved area 700, so that the solder can form a "work"
- the font structure is fastened to the slots on both sides of the soldering slot, thereby facilitating the improvement of the electrical connection quality and the connection strength at the solder joint.
- the solder resist reserved area 700 has a width ranging from 0.5 to 1.0 mm. The manufacturing process is difficult and the soldering effect of the solder is good.
- the present invention further provides a soldering structure including a cable core 500, a solder body 800, and a solder joint structure of a metal conductor microwave network circuit as described above, the solder body 800 being filled.
- the cable core 500 is wrapped in the solder body 800 in the soldering work area 300, the tin-holding portion 400, and the solder resist reserved area 700.
- solder joint assembly of the microwave device When the solder joint assembly of the microwave device is applied to the solder joint structure of the metal conductor microwave network circuit, a soldering work area is disposed on the solder joint 110 of the metal circuit body 100, and the first set of solder is screen printed on the soldering work area.
- the first set of solder layers are encircled to form the soldering work area 300, so that when the cable core 500 is soldered to the soldering work area 300, the first set of solder layers can prevent the solder from being excessively flowed, resulting in difficulty in stacking tin, ensuring The stability of the stacking tin is consistent with the shape of the stacked tin; at the same time, the tin-filled portion 400 recessed in the welding working area 300 can ensure that the solder is completely and reliably covered with the cable core 500, ensuring good electrical connection quality of the solder joint. At the same time, the ability of the cable core wire 500 to withstand the pulling force in the cable wiring is enhanced, which is beneficial to reducing the secondary operation amount and improving the assembly efficiency; and the welding point structure is simple in implementation, low in cost and high in work reliability.
- the solder body 800 is provided at one end of the solder resist reserved area 700 with an inner recess 810.
- the amount of tin deposited on the welding working surface 111 is relatively large, and the soldering time in the tank is longer than that in the tank, and the solder in the tank is subjected to tensile force during cooling, thereby causing the side of the second solder resist layer 600.
- the solder surface of the soldering groove surface forms the above-mentioned inner concave portion 810, which is beneficial to ensure the flatness of the surface of the second solder resist layer 600, and contributes to the installation of the metal conductor microwave network circuit; on the other hand, the cable core wire 500 can be ensured. It is completely covered by solder, which improves the electrical connection quality of the cable core 500 at the solder joint 110, and provides a strong guarantee for the stability of the electrical index.
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Abstract
本发明公开了一种金属导体微波网络电路的焊点结构及焊接结构，包括：电路本体，电路本体设有至少一个焊接点，焊接点设有焊接作业面；及第一阻焊层，第一组焊层覆设于焊接作业面上、并围设形成焊接工作区，焊接作业面凹设有位于焊接工作区内的藏锡部；其中，焊接工作区用于与电缆芯线进行焊装定位。因而将电缆芯线锡焊定位于该焊接工作区时，第一组焊层能够防止焊锡过度流动导致堆锡困难，确保堆锡稳定性与堆锡形态的一致性好；同时藏锡部还能保证焊锡完整的包覆电缆芯线，确保焊点的电连接质量好，同时增强电缆芯线在电缆布线中承受拉扯外力的能力，有利于减少二次作业量，提升装联效率；且该焊点结构的实现方式简单，成本低且工作可靠性高。
Description
本发明涉及移动通信设备加工技术领域，特别是涉及一种金属导体微波网络电路的焊点结构及焊接结构。
在移动通信网络覆盖中，微波器件是不可缺少的。其性能的优劣影响到整个网络覆盖的质量。微波网络电路是微波器件的核心部分，承载了相位、功分比等电性能的实现功能。微波电路一般包括基于PCB板之类的基板印制而成的电路或由具有立体结构的金属导体按照已知电路原理组成的电路。金属导体微波网络电路因为缺少非金属介质的介电影响，理论上有助于微波器件获得极低的插损，同时获得金属导体电路的机械加工工艺也相较于PCB加工工艺具有更多、更好的物源，具有更高的生产效率，同等尺寸的金属导体微波网络电路也具有非常明显的成本优势。
但是由于金属电路机械加工工艺原生性问题，如毛刺、变形等，最主要的还是金属导体微波网络电路焊点的设计存在问题，导致电路焊点处焊锡过度流动、堆锡困难、电缆芯线不完全包覆等装联缺陷，焊点的电连接质量差，堆锡稳定性及形态一致性差，导致经常需要进行二次焊接作业，影响装联效率。
发明内容
基于此，本发明有必要提供一种金属导体微波网络电路的焊点结构及焊接结构，能够保证焊点处的堆锡稳定性和堆锡形态一致性要求，通过提升焊点的电连接质量，减少焊点因锡焊差异性而导致的二次作业，提升装联效率。
其技术方案如下：
一种金属导体微波网络电路的焊点结构，包括：
电路本体，所述电路本体设有至少一个焊接点，所述焊接点设有焊接作业面；及
第一阻焊层，所述第一组焊层覆设于所述焊接作业面上、并围设形成焊接工作区，所述焊接作业面凹设有位于所述焊接工作区内的藏锡部；其中，所述焊接工作区用于与电缆芯线进行焊装定位。
在应用上述金属导体微波网络电路的焊点结构进行微波器件的装联时，通过在金属电路本体的焊接点上设置焊接作业区，并在焊接作业区上丝印覆设第一组焊层，并使第一组焊层围设形成焊接工作区，因而将电缆芯线锡焊定位于该焊接工作区时，第一组焊层能够防止焊锡过度流动导致堆锡困难，确保堆锡稳定性与堆锡形态的一致性好；同时凹设于焊接工作区内的藏锡部还能保证焊锡完整可靠的包覆电缆芯线，确保焊点的电连接质量好，同时增强电缆芯线在电缆布线中承受拉扯外力的能力，有利于减少二次作业量，提升装联效率；且该焊点结构的实现方式简单，成本低且工作可靠性高。
下面对本申请的技术方案作进一步地说明：
在其中一个实施例中，所述电路本体还包括与所述焊接点连接的电路主体，所述第一阻焊层包括覆设于所述焊接作业面与所述电路主体的衔接处的阻焊主干部。如此能够有效限制焊锡由焊点高温区向电路本体上与该焊接点相连的低温区域流动，从而确保堆锡的稳定性与形态一致性。
在其中一个实施例中，所述第一阻焊层还包括第一阻焊侧翼部和第二阻焊侧翼部，所述第一阻焊侧翼部和所述第二阻焊侧翼部的同一端均与所述阻焊主干部连接、另一端分别沿所述焊接作业面的两侧边缘向外自由延展。如此能够有效防止焊锡经由电路本体的厚度表面向电路本体与该焊接点相连的低温区域流动，从而确保堆锡的稳定性与形态一致性。
在其中一个实施例中，所述藏锡部为焊接盲槽或焊接通槽，所述焊接盲槽或所述焊接通槽的槽宽小于所述电缆芯线的直径。如此能够防止电缆芯线焊接时落入槽内，影响焊接操作便利性与可靠性，同时有利于控制焊锡流动量，确保与电缆芯线可靠包覆，提升电连接质量与稳定性。
在其中一个实施例中，所述焊接盲槽或所述焊接通槽的槽宽比所述电缆芯线的直径小0.1～0.2mm。在此范围内能够适应不同尺寸的电缆芯线的焊接装联，确保较高的电连接质量，同时可以兼顾焊接盲槽或焊接通槽的成型工艺要求。
在其中一个实施例中，还包括第二阻焊层，所述焊接点还设有与所述焊接作业面相背设置的焊接作业相对面，所述第二阻焊层覆设于所述焊接作业相对面上；所述藏锡部为焊接通槽，所述焊接作业相对面通过所述焊接通槽与所述焊接作业面连通。如此，可确保将焊接点上焊接作业面的熔融焊锡通过焊接通槽引导到焊接作业相对面上(及电缆芯线的背侧)，使得焊锡能够完整可靠的包覆电缆芯线，保证电连接质量与连接强度；与此同时，覆设于焊接作业相对面上的第二组焊层又能够防止焊锡过度流动，且因为焊接通槽的尺寸脚下，使得焊锡因表面张力作用只留存在槽内部蓄积而不会滴落，有利于提升对焊稳定性与形态一致性，同时避免造成环境污染。
在其中一个实施例中，所述焊接作业相对面设有阻焊预留区，所述阻焊预留区位于所述第二阻焊层与所述焊接通槽的边缘之间。通过在阻焊预留区上不丝印组焊层，一方面是为了防止第二组焊层制作时阻焊涂料渗入到焊接通槽中，影响焊接点的堆锡效果，避免对焊接点的电连接质量造成隐患；另一方面将焊接通槽中的焊锡引导到焊接作业相对面上，当焊锡冷却凝固后，使得焊锡能够形成“工”字型结构扣入到焊接通槽的两侧槽口上，进而利于提升焊点处的电连接质量和连接强度。
在其中一个实施例中，所述阻焊预留区的宽度范围为0.5～1.0mm。
本发明还提供一种焊接结构，其包括电缆芯线，焊锡体和如上所述的金属导体微波网络电路的焊点结构，所述焊锡体填设于所述焊接工作区、所述藏锡部和所述阻焊预留区内，所述电缆芯线包覆于所述焊锡体内。
在应用上述金属导体微波网络电路的焊点结构进行微波器件的焊接装联时，通过在金属电路本体的焊接点上设置焊接作业区，并在焊接作业区上丝印覆设第一组焊层，并使第一组焊层围设形成焊接工作区，因而将电缆芯线锡焊定位于该焊接工作区时，第一组焊层能够防止焊锡过度流动导致堆锡困难，确保堆锡稳定性与堆锡形态的一致性好；同时凹设于焊接工作区内的藏锡部还能保证焊锡完整可靠的包覆电缆芯线，确保焊点的电连接质量好，同时增强电缆芯线在电缆布线中承受拉扯外力的能力，有利于减少二次作业量，提升装联效率；且该焊点结构的实现方式简单，成本低且工作可靠性高。
在其中一个实施例中，所述焊锡体位于所述阻焊预留区的一端设有内凹部。当焊接作业面停止加热时，因焊接作业面堆锡量相对较大，较槽内焊锡冷却时间长，槽内焊锡在冷却时受拉力作用，从而导致在第二阻焊层一侧的焊接通槽表面的焊锡面形成上述内凹部，一方面有利于保证第二阻焊层表面的平整性，有助于金属导体微波网络电路的安装；另一方面可以保证电缆芯线完全被焊锡所包覆，提升了电缆芯线在焊接点出的电连接质量，为电气指标的稳定提供了强力保障。
图1为本发明实施例所述的金属导体微波网络电路的结构示意图；
图2为图1所示结构的A处的局部放大结构示意图；
图3为本发明实施例所述的焊接点的焊接作业相对面的结构示意图；
图4为本发明实施例所述的电缆芯线与焊接点的焊接结构示意图；
图5为本图4结构所述的B-B处的剖视结构示意图。
附图标记说明：
100、电路本体，110、焊接点，111、焊接作业面，112、焊接作业相对面，120、电路主体，200、第一阻焊层，210、阻焊主干部，220、第一阻焊侧翼部，230、第二阻焊侧翼部，300、焊接工作区，400、藏锡部，500、电缆芯线，600、第二阻焊层，700、阻焊预留区，800、焊锡体，810、内凹部。
为使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施方式，对本发明进行进一步的详细说明。应当理解的是，此处所描述的具体实施方式仅用以解释本发明，并不限定本发明的保护范围。
需要说明的是，当元件被称为“固设于”、“设置于”或“安设于”另一个元件，它可以直接在另一个元件上或者也可以存在其中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在其中元件；一个元件与另一个元件固定连接的具体方式可以通过现有技术实 现，在此不再赘述，优选采用螺纹连接的固定方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
本发明中所述“第一”、“第二”不代表具体的数量及顺序，仅仅是用于名称的区分。
如图1至图3所示，为本发明展示的一种实施例的金属导体微波网络电路的焊点结构，包括：电路本体100及第一阻焊层200。
其中，上述电路本体100可选是金属导体微波网络电路，采用力学特性较好的非磁性高导电率金属板材加工而成，一般采用铜板或铝合金板，例如Al6061-T6，如此有利于保证获得较好的端面刃口毛刺质量。
根据不同微波器件的装联需要，电路本体100设有至少一个电路分支，电路分支的末端设有至少一个焊接点110，所述焊接点110设有焊接作业面111；根据电气性能的需要，电路本体100可以形成不同数量的电路分支，每个电路分支的出口或入口即为电连接焊接点110，用以提高电路本体的装联容量与性能。
所述第一组焊层覆设于所述焊接作业面111上、并围设形成焊接工作区300，所述焊接作业面111凹设有位于所述焊接工作区300内的藏锡部400；其中，所述焊接工作区300用于与电缆芯线500进行焊装定位。
在应用上述金属导体微波网络电路的焊点结构进行微波器件的装联时，通过在金属电路本体100的焊接点110上设置焊接作业区，并在焊接作业区上丝印覆设第一组焊层，并使第一组焊层围设形成焊接工作区300，因而将电缆芯线500锡焊定位于该焊接工作区300时，第一组焊层能够防止焊锡过度流动导致堆锡困难，确保堆锡稳定性与堆锡形态的一致性好；同时凹设于焊接工作区300内的藏锡部400还能保证焊锡完整可靠的包覆电缆芯线500，确保焊点的电连接质量好，同时增强电缆芯线500在电缆布线中承受拉扯外力的能力，有利于减少二次作业量，提升装联效率；且该焊点结构的实现方式简单，成本低且工作 可靠性高。
请继续参阅图2，在一个实施例中，所述电路本体100还包括与所述焊接点连接的电路主体120，所述第一阻焊层200包括覆设于所述焊接作业面111与所述电路主体120的衔接处的阻焊主干部210。如此能够有效限制焊锡由焊点高温区向电路本体100上与该焊接点110相连的低温区域流动，从而确保堆锡的稳定性与形态一致性。
进一步地，所述第一阻焊层200还包括第一阻焊侧翼部220和第二阻焊侧翼部230，所述第一阻焊侧翼部220和所述第二阻焊侧翼部230的同一端均与所述阻焊主干部210连接、另一端分别沿所述焊接作业面111的两侧边缘向外自由延展。如此能够有效防止焊锡经由电路本体100的厚度表面向电路本体100与该焊接点110相连的低温区域流动，从而确保堆锡的稳定性与形态一致性。
具体到本优选的实施方式中，上述第一阻焊层200采用丝印工艺将俗称为绿油的涂料制作在焊接工作面上，且第一阻焊层200呈“Y”型设置，“Y”型的竖直支干即为上述阻焊主干部210，交错布置的两个斜支干即为上述第一阻焊侧翼部220和第二阻焊侧翼部230，“Y”型的开口侧即为上述焊接工作区300。
请继续参阅图5，在一个实施例中，所述藏锡部400为焊接盲槽或焊接通槽，所述焊接盲槽或所述焊接通槽的槽宽小于所述电缆芯线500的直径。如此能够防止电缆芯线500焊接时落入槽内，影响焊接操作便利性与可靠性，同时有利于控制焊锡流动量，确保与电缆芯线500可靠包覆，提升电连接质量与稳定性。
进一步地，所述焊接盲槽或所述焊接通槽的槽宽比所述电缆芯线500的直径小0.1～0.2mm。在此范围内能够适应不同尺寸的电缆芯线500的焊接装联，确保较高的电连接质量，同时可以兼顾焊接盲槽或焊接通槽的成型工艺要求。
此外，还包括第二阻焊层600，所述焊接点110还设有与所述焊接作业面111相背设置的焊接作业相对面112，所述第二阻焊层600覆设于所述焊接作业相对面112上；所述藏锡部400为焊接通槽，所述焊接作业相对面112通过所述焊接通槽与所述焊接作业面111电性连通。如此，可确保将焊接点110上焊接作业面111的熔融焊锡通过焊接通槽引导到焊接作业相对面112上(及电缆芯线500的背侧)，使得焊锡能够完整可靠的包覆电缆芯线500，保证电连接质量与 连接强度；与此同时，覆设于焊接作业相对面112上的第二组焊层又能够防止焊锡过度流动，且因为焊接通槽的尺寸脚下，使得焊锡因表面张力作用只留存在槽内部蓄积而不会滴落，有利于提升对焊稳定性与形态一致性，同时避免造成环境污染。
上述第二阻焊层600同第一组焊层制作方式一样，采用丝印工艺将绿油涂料涂覆在金属材质的焊接点110上。
请继续参阅图3至图5，所述焊接作业相对面112设有阻焊预留区700，具体的，阻焊预留区700为环绕焊接通槽的槽口设置的U型区域，所述阻焊预留区700位于所述第二阻焊层600与所述焊接通槽的边缘之间。通过在阻焊预留区700上不丝印组焊层，一方面是为了防止第二组焊层制作时阻焊涂料渗入到焊接通槽中，影响焊接点110的堆锡效果，避免对焊接点110的电连接质量造成隐患；另一方面，藏锡部400与阻焊预留区700的设计是匹配的，具体的是将阻焊预留区700的开口大小设计成大于藏锡部400的开口大小，由此使得焊接通槽(藏锡部400)中的焊锡引导到焊接作业相对面上，当焊锡冷却凝固后在阻焊预留区700形成倒勾，即使得焊锡能够形成“工”字型结构扣入到焊接通槽的两侧槽口上，进而利于提升焊点处的电连接质量和连接强度。可选地，所述阻焊预留区700的宽度范围为0.5～1.0mm。制造工艺难度低，同时对焊锡的阻流效果好。
请继续参阅图4和图5，本发明还提供一种焊接结构，其包括电缆芯线500，焊锡体800和如上所述的金属导体微波网络电路的焊点结构，所述焊锡体800填设于所述焊接工作区300、所述藏锡部400和所述阻焊预留区700内，所述电缆芯线500包覆于所述焊锡体800内。
在应用上述金属导体微波网络电路的焊点结构进行微波器件的焊接装联时，通过在金属电路本体100的焊接点110上设置焊接作业区，并在焊接作业区上丝印覆设第一组焊层，并使第一组焊层围设形成焊接工作区300，因而将电缆芯线500锡焊定位于该焊接工作区300时，第一组焊层能够防止焊锡过度流动导致堆锡困难，确保堆锡稳定性与堆锡形态的一致性好；同时凹设于焊接工作区300内的藏锡部400还能保证焊锡完整可靠的包覆电缆芯线500，确保焊点 的电连接质量好，同时增强电缆芯线500在电缆布线中承受拉扯外力的能力，有利于减少二次作业量，提升装联效率；且该焊点结构的实现方式简单，成本低且工作可靠性高。
在上述实施例的基础上，所述焊锡体800位于所述阻焊预留区700的一端设有内凹部810。当焊接作业面111停止加热时，因焊接作业面111堆锡量相对较大，较槽内焊锡冷却时间长，槽内焊锡在冷却时受拉力作用，从而导致在第二阻焊层600一侧的焊接通槽表面的焊锡面形成上述内凹部810，一方面有利于保证第二阻焊层600表面的平整性，有助于金属导体微波网络电路的安装；另一方面可以保证电缆芯线500完全被焊锡所包覆，提升了电缆芯线500在焊接点110处的电连接质量，为电气指标的稳定提供了强力保障。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。
Claims (10)
- 一种金属导体微波网络电路的焊点结构，其特征在于，包括：电路本体，所述电路本体设有至少一个焊接点，所述焊接点设有焊接作业面；及第一阻焊层，所述第一组焊层覆设于所述焊接作业面上、并围设形成焊接工作区，所述焊接作业面凹设有位于所述焊接工作区内的藏锡部；其中，所述焊接工作区用于与电缆芯线进行焊装定位。
- 根据权利要求1所述的金属导体微波网络电路的焊点结构，其特征在于，所述电路本体还包括与所述焊接点连接的电路主体，所述第一阻焊层包括覆设于所述焊接作业面与所述电路主体的衔接处的阻焊主干部。
- 根据权利要求2所述的金属导体微波网络电路的焊点结构，其特征在于，所述第一阻焊层还包括第一阻焊侧翼部和第二阻焊侧翼部，所述第一阻焊侧翼部和所述第二阻焊侧翼部的同一端均与所述阻焊主干部连接、另一端分别沿所述焊接作业面的两侧边缘向外自由延展。
- 根据权利要求1所述的金属导体微波网络电路的焊点结构，其特征在于，所述藏锡部为焊接盲槽或焊接通槽，所述焊接盲槽或所述焊接通槽的槽宽小于所述电缆芯线的直径。
- 根据权利要求4所述的金属导体微波网络电路的焊点结构，其特征在于，所述焊接盲槽或所述焊接通槽的槽宽比所述电缆芯线的直径小0.1～0.2mm。
- 根据权利要求1所述的金属导体微波网络电路的焊点结构，其特征在于，还包括第二阻焊层，所述焊接点还设有与所述焊接作业面相背设置的焊接作业相对面，所述第二阻焊层覆设于所述焊接作业相对面上；所述藏锡部为焊接通槽，所述焊接作业相对面通过所述焊接通槽与所述焊接作业面连通。
- 根据权利要求6所述的金属导体微波网络电路的焊点结构，其特征在于，所述焊接作业相对面设有阻焊预留区，所述阻焊预留区位于所述第二阻焊层与所述焊接通槽的边缘之间。
- 根据权利要求7所述的金属导体微波网络电路的焊点结构，其特征在于，所述阻焊预留区的宽度范围为0.5～1.0mm。
- 一种焊接结构，其特征在于，包括电缆芯线，焊锡体和如上述权利要求1至8任一项所述的金属导体微波网络电路的焊点结构，所述焊锡体填设于所述焊接工作区、所述藏锡部和所述阻焊预留区内，所述电缆芯线包覆于所述焊锡体内。
- 根据权利要求9所述的焊接结构，其特征在于，所述焊锡体位于所述阻焊预留区的一端设有内凹部。
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| US20100132985A1 (en) * | 2008-11-28 | 2010-06-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having metal bump and method of manufacring the same |
| CN105364290A (zh) * | 2014-08-18 | 2016-03-02 | 通用汽车环球科技运作有限责任公司 | 用于具有轴向导线的电气部件的坚固集成的熔锡连结 |
| CN205211738U (zh) * | 2015-12-07 | 2016-05-04 | 深圳市振华微电子有限公司 | 引线焊接结构及混合集成电路 |
| CN205566799U (zh) * | 2016-04-28 | 2016-09-07 | 深圳市恒思科科技有限公司 | 一种制作简单的双层印刷电路板 |
| CN108112189A (zh) * | 2017-12-29 | 2018-06-01 | 京信通信系统（中国）有限公司 | 金属导体微波网络电路的焊点结构及焊接结构 |
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