WO2018000921A1 - Pcb板及具有该pcb板的移动终端 - Google Patents

Pcb板及具有该pcb板的移动终端 Download PDF

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Publication number
WO2018000921A1
WO2018000921A1 PCT/CN2017/081915 CN2017081915W WO2018000921A1 WO 2018000921 A1 WO2018000921 A1 WO 2018000921A1 CN 2017081915 W CN2017081915 W CN 2017081915W WO 2018000921 A1 WO2018000921 A1 WO 2018000921A1
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WIPO (PCT)
Prior art keywords
pcb board
side wall
pads
board according
pcb
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PCT/CN2017/081915
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English (en)
French (fr)
Inventor
但唯
Original Assignee
广东欧珀移动通信有限公司
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Publication of WO2018000921A1 publication Critical patent/WO2018000921A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Definitions

  • the present invention relates to the field of electronic product technologies, and in particular, to a PCB board and a mobile terminal having the same.
  • the development trend of mobile terminals is that the thickness is getting thinner, the battery capacity is getting larger and larger, and the functions are more and more, so the PCB board is required (the PCB is an abbreviation of "Printed Circuit Board”, and the Chinese name is “printed”. The area of the circuit board”) is getting smaller and smaller.
  • an object of the present invention is to provide a PCB board which has a reasonable layout and a small area.
  • Another object of the present invention is to provide a mobile terminal having the above PCB board.
  • a PCB board comprising: a board body having a first surface and a side wall surrounding an outer circumference of the first surface, the side wall being provided with a plurality of spaced apart a side pad; a shield cover disposed on the first surface and soldered to the side pad.
  • the PCB board of the embodiment of the present invention by arranging the pads for soldering the shield on the sidewalls of the PCB, the space occupied by the conventional pads on the upper surface of the PCB is saved, so that the layout of the PCB can be made. More compact, making the layout of the PCB more reasonable, effectively reducing the area of the PCB.
  • a mobile terminal includes a PCB board according to the above-described first aspect of the present invention.
  • the overall performance of the mobile terminal is improved by providing the PCB board according to the above-described first aspect of the present invention.
  • FIG. 1 is a perspective view of a PCB board in accordance with an embodiment of the present invention.
  • Figure 2 is a plan view of the PCB board shown in Figure 1;
  • FIG. 3 is a schematic diagram of a mobile terminal in accordance with an embodiment of the present invention.
  • PCB board 100 mobile terminal 1000,
  • Plate body 1 first surface 11, side wall 12,
  • a PCB board 100 according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
  • the PCB board 100 can be used on the mobile terminal 1000, such as an electronic product such as a mobile phone or a tablet computer.
  • a PCB board 100 includes a board body 1 and a shield case (not shown).
  • the board body 1 has a first surface 11 and a side wall 12 surrounding the outer circumference of the first surface 11.
  • the side wall 12 of the board body 1 is provided with a plurality of spaced side pads 2, and the shielding cover is disposed on the first side.
  • a surface 11 is soldered to the side pads 2.
  • the plate body 1 may be formed in a rectangular plate-like structure, but is not limited thereto.
  • the shielding cover may be formed in a rectangular parallelepiped shape with one end open, and the shielding cavity is defined in the shielding cover.
  • the components to be shielded may be disposed on the first surface 11 of the PCB board 100, that is, under the shielding cover to prevent electromagnetic interference.
  • the side walls of the shield are soldered to the side pads 2 on the side walls 12 of the board body 1 to securely solder the shield to the PCB board 100.
  • the pads for soldering the shield on the sidewalls 12 of the PCB board 100 the space occupied by the conventional pads on the upper surface of the PCB is saved, so that the layout of the PCB board 100 can be made more compact.
  • the layout of the PCB board 100 is made more reasonable, and the area of the PCB board 100 is effectively reduced.
  • the PCB board 100 of the embodiment of the present invention by arranging the pads for soldering the shield on the side wall 12 of the PCB board 100, the space occupied by the conventional pads on the upper surface of the PCB is saved, so that the PCB can be made
  • the layout of the board 100 is more compact, making the layout of the PCB board 100 more reasonable, effectively reducing the area of the PCB board 100.
  • the sidewall 12 may include opposite first and second sidewalls, and the first sidewall and the second sidewall are provided with side pads.
  • the first side wall and the second side wall may be a pair of side walls extending along the length direction of the PCB board 100 (for example, the left-right direction in FIG. 1 ), or may be along the width direction of the PCB board 100 (for example, A pair of side walls extending in the front-rear direction in Fig. 1 .
  • the side pads 2 may be provided on opposite side walls of the PCB board 100.
  • the side pads 2 may be disposed only on a pair of side walls extending along the length direction of the PCB board 100, or may be provided only on a pair of side walls extending along the width direction of the PCB board 100, and It can be provided on each side wall of the PCB board 100 at the same time.
  • the side pads 2 may extend along the length direction of the first side wall and the second side wall, respectively.
  • the side pads 2 are spaced apart on a pair of side walls extending along the length direction of the PCB board 100.
  • the cover is firmly soldered to the side wall 12 of the PCB board 100, and the processing process can be simplified and the production efficiency can be improved.
  • the side pad 2 on the first sidewall 12 and the side pad 2 on the second sidewall 12 are symmetrical with respect to the center line of the board 1. Thereby, the force of the shield can be made more uniform, thereby improving the robustness of the shield.
  • the side wall 12 of the panel 1 may include a third sidewall and a fourth sidewall adjacent to the third sidewall, the third sidewall and the fourth sidewall each having a side Edge pad 2. That is, the side pads 2 may be provided on adjacent two side walls of the PCB board 100. Thereby, it is also convenient to securely solder the shield to the side wall 12 of the PCB board 100.
  • the length of the side pad 2 is L 1 , L 1 satisfies: 1.5 mm ⁇ L 1 ⁇ 5 mm, the width of the side pad 2 is L 2 , and L 2 satisfies: 0.3 mm ⁇ L 2 ⁇ 1 mm.
  • the specific value of the length L 1 and the width L 2 of the side pad 2 can be adjusted according to the actual size of the PCB board 100 and the shield cover, which is not specifically limited in the present invention.
  • the plane of the first surface 11 is a reference surface, and the orthographic projection area of the shield in the reference plane is larger than the area of the first surface 11.
  • the shield cover is disposed on the first surface 11 of the PCB board 100, and the sidewall 12 of the shield is located outside the sidewall 12 of the PCB board 100.
  • the spacing between the sidewall of the shield and the sidewall 12 of the PCB 100 may be 0.1 mm.
  • the first surface 11 is provided with a plurality of crimp pads 3 for supporting the shields, and the plurality of crimp pads 3 are arranged at intervals.
  • a plurality of positioning pads adapted to the crimp pads 3 may be disposed on the shield.
  • the positioning pad can be fixed on the crimp pad 3 such that the shield is supported at a predetermined position of the PCB board 100, so that the shield can be accurately positioned to facilitate soldering the shield to the PCB.
  • the predetermined position of the side wall 12 of the panel 100 increases the shielding effect of the shield.
  • solder may be first applied to the side pad 2 and the crimp pad 3, and then the shield may be supported at a predetermined position of the PCB to accurately solder the shield to the PCB 100.
  • a plurality of crimp pads 3 may be located near the sidewalls 12 of the PCB board 100, and a plurality of crimp pads 3 are spaced apart in the circumferential direction of the first surface 11. .
  • the shielding cover is conveniently arranged, and the structure is simple and the processing is convenient.
  • the length of the crimp pad 3 is L 3 , L 3 satisfies: 1.5 mm ⁇ L 3 ⁇ 5 mm, the width of the crimp pad 3 is L 4 , and L 4 satisfies: 0.3 mm ⁇ L 4 ⁇ 1 mm.
  • the specific value of the length L 3 and the width L 4 of the crimping pad 3 can be adjusted according to the actual size of the PCB board 100 and the shielding cover, which is not specifically limited in the present invention.
  • the distance between the crimp pad 3 and the side pad 2 adjacent to the crimp pad 3 is L 5 , and L 5 is satisfied.
  • L 5 0.5 mm. That is, when the crimp pads 3 are disposed adjacent to the side pads 2, the crimp pads 3 and the side pads 2 may be shifted by a distance L 5 .
  • PCB board 100 in accordance with an embodiment of the present invention is described below with reference to FIGS. 1 and 2.
  • a PCB board 100 includes a board body 1 and a shield case (not shown).
  • the plate body 1 is formed in a rectangular plate shape.
  • the shielding cover is formed in a rectangular parallelepiped shape with one end open, and the shielding cavity is defined in the shielding cover.
  • the components to be shielded may be disposed on the first surface 11 of the PCB board 100, that is, under the shielding cover to prevent electromagnetic interference.
  • the board body 1 has a first surface 11 and a side wall 12 surrounding the outer circumference of the first surface 11.
  • the side wall 12 of the board body 1 is provided with a plurality of spaced side pads 2, and the shielding cover is disposed on The first surface 11 and the side walls of the shield are soldered to the side pads 2.
  • the pads for soldering the shield on the sidewalls 12 of the PCB board 100 the space occupied by the conventional pads on the upper surface of the PCB is saved, so that the layout of the PCB board 100 can be made more compact.
  • the layout of the PCB board 100 is made more reasonable, and the area of the PCB board 100 is effectively reduced.
  • the side pads 2 are spaced apart on two side walls extending along the length direction of the PCB board 100, and each of the side walls 12 is spaced apart from the side pads 2 having a length of 3 mm and a width of 0.5 mm.
  • the side pads 2 on the side walls 12 are symmetrical about the center line of the board 1.
  • crimp pads 3 for supporting the shield are disposed on the first surface 11 at intervals.
  • the crimp pads 3 are disposed adjacent to the two sidewalls 12 described above.
  • the crimp pad 3 has a length of 3 mm and a width of 0.5 mm, and the gap between the crimp pad 3 and its adjacent side pad 2 is 1.5 mm.
  • a plurality of positioning pads that are adapted to the crimp pads 3 are disposed on the shield.
  • the positioning pad can be fixed on the crimp pad 3 such that the shield is supported at a predetermined position of the PCB board 100, so that the shield can be accurately positioned to facilitate soldering the shield to the PCB.
  • the predetermined position of the side wall 12 of the panel 100 increases the shielding effect of the shield.
  • the layout is more compact and reasonable, thereby effectively reducing the area of the PCB board 100.
  • a mobile terminal 1000 according to an embodiment of the second aspect of the present invention includes a PCB board 100 according to the above-described first aspect of the present invention. As shown in FIG. 3, the mobile terminal 1000 can be a mobile phone.
  • the overall performance of the mobile terminal 1000 is improved by providing the PCB board 100 according to the above-described first aspect of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. Or in one piece; it may be a mechanical connection, or it may be an electrical connection or a communication with each other; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship between two elements. Unless otherwise expressly defined. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may be a direct contact of the first and second features, or the first and second features may be indirectly through an intermediate medium, unless otherwise explicitly stated and defined. contact.
  • the first feature "above”, “above” and “above” the second feature may be that the first feature is directly above or above the second feature, or merely that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature may be that the first feature is directly below or obliquely below the second feature, or merely that the first feature level is less than the second feature.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种PCB板（100）和具有该PCB板（100）的移动终端（1000），PCB板（100）包括：板体（1）和屏蔽罩，板体（1）具有第一表面（11）和环绕在第一表面外周的侧壁（12），侧壁（12）上设有多个间隔开的侧边焊盘（2）；屏蔽罩罩设在第一表面（11）上且与侧边焊盘（2）焊接。

Description

PCB板及具有该PCB板的移动终端 技术领域
本发明涉及电子产品技术领域，尤其是涉及一种PCB板及具有该PCB板的移动终端。
背景技术
相关技术中，移动终端的发展趋势为厚度越来越薄、电池容量越来越大、功能越来越多，这样就要求PCB板(PCB为“Printed Circuit Board”的缩写，中文名称为“印制电路板”)的面积越来越小。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明的一个目的在于提出一种PCB板，该PCB板的布局合理、面积小。
本发明的另一个目的在于提出了一种具有上述PCB板的移动终端。
根据本发明第一方面实施例的PCB板，包括：板体，所述板体具有第一表面和环绕在所述第一表面外周的侧壁，所述侧壁上设有多个间隔开的侧边焊盘；屏蔽罩，所述屏蔽罩罩设在所述第一表面上且与所述侧边焊盘焊接。
根据本发明实施例的PCB板，通过将用于焊接屏蔽罩的焊盘设在PCB板的侧壁上，节省了传统的焊盘在PCB的上表面的占用空间，从而可以使得PCB板的布局更加紧凑，使得PCB板的布局更加合理，有效地减小了PCB板的面积。
根据本发明第二方面实施例的移动终端，包括根据本发明上述第一方面实施例的PCB板。
根据本发明第二方面实施例的移动终端，通过设置根据本发明上述第一方面实施例的PCB板，提高了移动终端的整体性能。
附图说明
图1是根据本发明实施例的PCB板的立体图；
图2是图1中所示的PCB板的俯视图；
图3是根据本发明实施例的移动终端的示意图。
附图标记：
PCB板100，移动终端1000，
板体1，第一表面11，侧壁12，
侧边焊盘2，压接焊盘3。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
下面参考图1和图2描述根据本发明实施例的PCB板100。其中，PCB板100可以用在移动终端1000上，例如手机，平板电脑等电子产品上。
如图1和图2所示，根据本发明第一方面实施例的PCB板100，包括：板体1和屏蔽罩(图未示出)。
其中，板体1具有第一表面11和环绕在第一表面11外周的侧壁12，板体1的侧壁12上设有多个间隔开的侧边焊盘2，屏蔽罩罩设在第一表面11上且与侧边焊盘2焊接。例如，参照图1和图2，板体1可以形成为长方形板状结构，但不限于此。屏蔽罩可以形成为一端敞开的长方体形状，屏蔽罩内限定出屏蔽腔，需要被屏蔽的元器件可以设在PCB板100的第一表面11上，即屏蔽罩的下方，以防止电磁干扰。屏蔽罩的侧壁与板体1的侧壁12上的侧边焊盘2焊接，以将屏蔽罩牢固地焊接在PCB板100上。由此，通过将用于焊接屏蔽罩的焊盘设在PCB板100的侧壁12上，节省了传统的焊盘在PCB的上表面的占用空间，从而可以使得PCB板100的布局更加紧凑，使得PCB板100的布局更加合理，有效地减小了PCB板100的面积。
根据本发明实施例的PCB板100，通过将用于焊接屏蔽罩的焊盘设在PCB板100的侧壁12上，节省了传统的焊盘在PCB的上表面的占用空间，从而可以使得PCB板100的布局更加紧凑，使得PCB板100的布局更加合理，有效地减小了PCB板100的面积。
根据本发明的一些实施例，参照图1和图2，侧壁12可以包括相对设置的第一侧壁和第二侧壁，第一侧壁和第二侧壁上均设有侧边焊盘2。其中，第一侧壁和第二侧壁可以为沿PCB板100的长度方向(例如，图1中的左右方向)延伸的一对侧壁，也可以为沿PCB板100的宽度方向(例如，图1中的前后方向)延伸的一对侧壁。侧边焊盘2可以设在PCB板100的相对的一对侧壁上。
可以理解的是，侧边焊盘2可以仅设在沿PCB板100的长度方向延伸的一对侧壁上，也可以仅设在沿PCB板100的宽度方向延伸的一对侧壁上，还可以同时设在PCB板100的各个侧壁上。侧边焊盘2可以分别沿第一侧壁和第二侧壁的长度方向延伸。例如，在图2的示例中，侧边焊盘2间隔设置在沿PCB板100的长度方向延伸的一对侧壁上。由此，便于将屏蔽 罩牢固地焊接在PCB板100的侧壁12上，且可以简化加工工艺，提高生产效率。
具体地，第一侧壁12上的侧边焊盘2与第二侧壁12上侧边焊盘2关于板体1的中心线对称。由此，可以使得屏蔽罩的受力更加均匀，从而提高了屏蔽罩的牢固性。
根据本发明的另一些实施例，板体1的侧壁12可以包括第三侧壁和与第三侧壁相邻的第四侧壁，第三侧壁和第四侧壁上均设有侧边焊盘2。也就是说，侧边焊盘2可以设在PCB板100的相邻的两个侧壁上。由此，同样便于将屏蔽罩牢固地焊接在PCB板100的侧壁12上。
具体地，侧边焊盘2的长度为L1，L1满足：1.5mm≤L1≤5mm，侧边焊盘2的宽度为L2，L2满足：0.3mm≤L2≤1mm。其中，侧边焊盘2的长度L1和宽度L2的具体数值，可以根据PCB板100及屏蔽罩的实际规格大小调整设计，本发明对此不作具体限定。例如，侧边焊盘2的长度L1可以进一步满足：L1＝3mm，侧边焊盘2的宽度L2可以进一步满足：L2＝0.5mm。由此，可以保证将屏蔽罩牢固地焊接在PCB板100的侧壁12上，且可以节省焊锡等焊接材料，节约材料成本。
根据本发明的一些实施例，第一表面11所在平面为参考面，屏蔽罩在参考面内的正投影面积大于第一表面11的面积。具体地，屏蔽罩罩设在PCB板100的第一表面11上，且屏蔽罩的侧壁12位于PCB板100的侧壁12的外部。可选地，屏蔽罩的侧壁与PCB板100的侧壁12之间的间距可以为0.1mm。由此，便于将屏蔽罩焊接在PCB板100的侧壁12上，且可以进一步地提高屏蔽罩的牢固性，提高屏蔽罩的屏蔽效果。
进一步地，第一表面11上设有多个用于支撑屏蔽罩的压接焊盘3，多个压接焊盘3间隔排布。具体地，屏蔽罩上可以设置多个与压接焊盘3相适配的定位焊盘。由此，在装配时，可以将定位焊盘固定在压接焊盘3上，使得屏蔽罩支撑在PCB板100的预定位置，从而，可以对屏蔽罩进行精确定位，便于将屏蔽罩焊接在PCB板100的侧壁12的预定位置，提高屏蔽罩的屏蔽效果。
例如，在装配时，可以先在侧边焊盘2和压接焊盘3上刷上焊锡，然后将屏蔽罩支撑在PCB的预定位置处，以便将屏蔽罩精确地焊接在PCB板100上。
具体地，参照图1和图2，多个压接焊盘3可以位于靠近PCB板100的侧壁12的位置处，且多个压接焊盘3沿第一表面11的周向方向间隔分布。由此，便于对屏蔽罩进行定位，且结构简单，加工方便。
可选地，压接焊盘3的长度为L3，L3满足：1.5mm≤L3≤5mm，压接焊盘3的宽度为L4，L4满足：0.3mm≤L4≤1mm。其中，压接焊盘3的长度L3和宽度L4的具体数值，可以根据PCB板100及屏蔽罩的实际规格大小调整设计，本发明对此不作具体限定。例如，压接焊盘3的长度L3可以进一步满足：L3＝3mm，压接焊盘3的宽度L4可以进一步满足：L4＝0.5mm。由此， 可以保证对屏蔽罩进行精确定位，且可以进一步地提高屏蔽罩的牢固性。
根据本发明的一些实施例，在第一表面11的周向方向，压接焊盘3与和该压接焊盘3相邻的侧边焊盘2之间的距离为L5，L5满足：L5≥0.5mm。也就是说，当压接焊盘3邻近侧边焊盘2设置时，压接焊盘3与侧边焊盘2可以错开距离L5。例如，L5可以进一步满足：L5＝1.5mm。由此，可以防止焊锡等焊接材料聚集在PCB板100的侧壁12上，影响屏蔽罩的屏蔽效果。
下面参考图1和图2描述根据本发明实施例的PCB板100的一个具体实施例。
如图1和图2所示，根据本发明实施例的PCB板100，包括：板体1和屏蔽罩(图未示出)。其中，板体1形成为长方形板状结构。屏蔽罩形成为一端敞开的长方体形状，屏蔽罩内限定出屏蔽腔，需要被屏蔽的元器件可以设在PCB板100的第一表面11上，即屏蔽罩的下方，以防止电磁干扰。
具体地，板体1具有第一表面11和环绕在第一表面11外周的侧壁12，板体1的侧壁12上设有多个间隔开的侧边焊盘2，屏蔽罩罩设在第一表面11上且屏蔽罩的侧壁与侧边焊盘2焊接。由此，通过将用于焊接屏蔽罩的焊盘设在PCB板100的侧壁12上，节省了传统的焊盘在PCB的上表面的占用空间，从而可以使得PCB板100的布局更加紧凑，使得PCB板100的布局更加合理，有效地减小了PCB板100的面积。
侧边焊盘2间隔设置在沿PCB板100的长度方向延伸的两个侧壁上，每个上述侧壁12间隔设置四个长度为3mm，宽度为0.5mm的侧边焊盘2，且每个上述侧壁12上的侧边焊盘2关于板体1的中心线对称。
进一步地，第一表面11上间隔设置四个用于支撑屏蔽罩的压接焊盘3。压接焊盘3邻近上述两个侧壁12设置。压接焊盘3的长度为3mm，宽度为0.5mm，压接焊盘3与其邻近的侧边焊盘2之间的间距为1.5mm。具体地，屏蔽罩上设置多个与压接焊盘3相适配的定位焊盘。由此，在装配时，可以将定位焊盘固定在压接焊盘3上，使得屏蔽罩支撑在PCB板100的预定位置，从而，可以对屏蔽罩进行精确定位，便于将屏蔽罩焊接在PCB板100的侧壁12的预定位置，提高屏蔽罩的屏蔽效果。
根据本发明实施例的PCB板100，布局更加紧凑、合理，从而有效地减小了PCB板100的面积。
根据本发明第二方面实施例的移动终端1000，包括根据本发明上述第一方面实施例的PCB板100。如图3所示，移动终端1000可以为手机。
根据本发明第二方面实施例的移动终端1000，通过设置根据本发明上述第一方面实施例的PCB板100，提高了移动终端1000的整体性能。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、 “轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (15)

  1. 一种PCB板，其特征在于，包括：
    板体，所述板体具有第一表面和环绕在所述第一表面外周的侧壁，所述侧壁上设有多个间隔开的侧边焊盘；
    屏蔽罩，所述屏蔽罩罩设在所述第一表面上且与所述侧边焊盘焊接。
  2. 根据权利要求1所述的PCB板，其特征在于，所述侧壁包括相对设置的第一侧壁和第二侧壁，所述第一侧壁和所述第二侧壁上均设有所述侧边焊盘。
  3. 根据权利要求2所述的PCB板，其特征在于，所述第一侧壁上的所述侧边焊盘与所述第二侧壁上所述侧边焊盘关于所述板体的中心线对称。
  4. 根据权利要求1-3中任一项所述的PCB板，其特征在于，所述侧壁包括第三侧壁和与所述第三侧壁相邻的第四侧壁，所述第三侧壁和所述第四侧壁上均设有所述侧边焊盘。
  5. 根据权利要求1-4中任一项所述的PCB板，其特征在于，所述侧边焊盘的长度为L1，所述L1满足：1.5mm≤L1≤5mm，
    所述侧边焊盘的宽度为L2，所述L2满足：0.3mm≤L2≤1mm。
  6. 根据权利要求5所述的PCB板，其特征在于，所述L1＝3mm，所述L2＝0.5mm。
  7. 根据权利要求1-6中任一项所述的PCB板，其特征在于，所述第一表面所在平面为参考面，所述屏蔽罩在所述参考面内的正投影面积大于所述第一表面的面积。
  8. 根据权利要求7所述的PCB板，其特征在于，所述屏蔽罩的侧壁与所述PCB板的侧壁之间的间距为0.1mm。
  9. 根据权利要求1-8中任一项所述的PCB板，其特征在于，所述第一表面上设有多个用于支撑所述屏蔽罩的压接焊盘，多个所述压接焊盘间隔排布。
  10. 根据权利要求9所述的PCB板，其特征在于，多个所述压接焊盘位于靠近所述侧壁的位置处，且多个所述压接焊盘沿所述第一表面的周向方向间隔分布。
  11. 根据权利要求9或10所述的PCB板，其特征在于，所述压接焊盘的长度为L3，所述L3满足：1.5mm≤L3≤5mm，
    所述压接焊盘的宽度为L4，所述L4满足：0.3mm≤L4≤1mm。
  12. 根据权利要求11所述的PCB板，其特征在于，所述L3＝3mm，所述L4＝0.5mm。
  13. 根据权利要求9-12中任一项所述的PCB板，其特征在于，在所述第一表面的周向方向，所述压接焊盘与和该所述压接焊盘相邻的所述侧边焊盘之间的距离为L5，所述L5满足：L5≥0.5mm。
  14. 根据权利要求13所述的PCB板，其特征在于，所述L5满足：L5＝1.5mm。
  15. 一种移动终端，其特征在于，包括根据权利要求1-14中任一项所述的PCB板。
PCT/CN2017/081915 2016-06-28 2017-04-25 Pcb板及具有该pcb板的移动终端 WO2018000921A1 (zh)

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CN203554786U (zh) * 2013-11-13 2014-04-16 小米科技有限责任公司 一种pcb单元及终端设备
CN105338730A (zh) * 2015-11-17 2016-02-17 小米科技有限责任公司 一种印刷电路板
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