WO2020063643A1 - 电路板结构及电子设备 - Google Patents

电路板结构及电子设备 Download PDF

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Publication number
WO2020063643A1
WO2020063643A1 PCT/CN2019/107751 CN2019107751W WO2020063643A1 WO 2020063643 A1 WO2020063643 A1 WO 2020063643A1 CN 2019107751 W CN2019107751 W CN 2019107751W WO 2020063643 A1 WO2020063643 A1 WO 2020063643A1
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Prior art keywords
circuit board
groove
present disclosure
structure according
board structure
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PCT/CN2019/107751
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English (en)
French (fr)
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沈建伟
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维沃移动通信有限公司
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Publication of WO2020063643A1 publication Critical patent/WO2020063643A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate

Definitions

  • the present disclosure relates to a circuit board structure and an electronic device.
  • the circuit board of the electronic device Most of the electronic components in the electronic device are arranged on the circuit board of the electronic device. Therefore, the current integration degree of the electronic device is getting higher and higher, which is reflected in the increasing integration degree of the circuit board. Limited by the overall size of the electronic device, the area of the circuit board cannot be enlarged.
  • the circuit board In order to install more electronic components on the circuit board, the circuit board is usually arranged in at least two layers to form a three-dimensional circuit board structure. .
  • the circuit board structure in the electronic device is a stacked structure, which is beneficial to reducing the occupied area of the circuit board, and at the same time, it can increase the space for disposing electronic components on the circuit board.
  • FIG. 1 is a schematic diagram of a typical circuit board structure.
  • the first circuit board 101 is supported on the third circuit board 103 through the second circuit board 102, and the second circuit board 102 plays a supporting role, which can make the first circuit board 101 and the second circuit
  • a receiving space 104 is formed between the plates 102.
  • the electronic components 105 can be mounted on the first circuit board 101 and the second circuit board 102 on the board surfaces facing the receiving space 104.
  • the second circuit board 102 plays a role of electrically connecting the first circuit board 101 and the third circuit board 103. Both sides of the second circuit board 102 are designed with solder points. The first circuit board 101 and the third circuit board 103. The corresponding pads are provided at positions opposite to the solder points. The soldering process between the circuit boards requires higher flatness of the circuit board, and the poorer flatness of the second circuit board 102 will affect the welding quality. Since both sides of the second circuit board 102 need to be welded, the heat generated during the welding process will cause the second circuit board 102 to be locally heated and deformed.
  • the present disclosure discloses a circuit board structure to solve the problem that the current circuit board structure has difficulty in welding.
  • the circuit board structure includes a first circuit board and a second circuit board disposed on a surface of the first circuit board, and at least one of the first circuit board and the second circuit board has a groove, The first circuit board and the second circuit board are soldered and fixed, and are docked at the groove to form a receiving space for mounting electronic components.
  • the electronic device includes a casing and a circuit board structure disposed in the casing, and the circuit board structure is the circuit board structure described above.
  • the structure of the first circuit board and the second circuit board can be adjusted so that at least one of the two has a groove, and then the first circuit board and the second circuit board are recessed. A receiving space is formed at the groove, so that the three-dimensional structure formed by the first circuit board and the second circuit board can lay more electronic components.
  • the circuit board structure disclosed in this embodiment can form an accommodating space with fewer circuit boards. Therefore, only the first The circuit board and the second circuit board can be welded together, thereby reducing the difficulty of welding.
  • FIG. 1 is a schematic structural diagram of a typical circuit board structure in the related art
  • FIG. 2 is a schematic structural diagram of a first circuit board structure disclosed in an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a second circuit board in FIG. 2;
  • FIG. 4 is a schematic structural diagram of a second circuit board structure disclosed in an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a second circuit board in FIG. 4;
  • FIG. 6 is a schematic structural diagram of a third circuit board structure disclosed in an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of a fourth circuit board structure disclosed by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a fifth circuit board structure disclosed in an embodiment of the present disclosure.
  • An embodiment of the present disclosure discloses a circuit board structure.
  • the disclosed circuit board structure includes a first circuit board and a second circuit board.
  • the second circuit board is disposed on a surface of the first circuit board and is soldered to the first circuit board. fixed.
  • At least one of the first circuit board and the second circuit board has a groove, the first circuit board is fixedly connected to the second circuit board, and an accommodation space is formed at the groove.
  • the accommodation space Can accommodate electronic components.
  • Electronic components can be mounted on the surface of the first circuit board and the second circuit board constituting the accommodation space.
  • the structure of the first circuit board and the second circuit board may be adjusted so that at least one of the two has a groove, and then the first circuit board and the second circuit board are adjusted. After docking, an accommodation space is formed at the groove, so that the three-dimensional structure formed by the first circuit board and the second circuit board can be used to arrange more electronic components.
  • the circuit board structure disclosed in this embodiment can form an accommodating space with fewer circuit boards. Therefore, only the first The circuit board and the second circuit board can be welded together, thereby reducing the difficulty of welding.
  • a groove 121 is formed on the surface of the second circuit board 120 facing the first circuit board 110, and the first circuit board 110 faces the second circuit board.
  • the plate surface of 120 is flat.
  • the first circuit board 110 and the second circuit board 120 are fixedly connected by soldering (soldering).
  • the first circuit board 110 faces the second circuit board 120 and the groove 121 forms a receiving space 130.
  • the electronic components A arranged on the surface of the first circuit board 110 facing the second circuit board 120 are located in the receiving space 130.
  • the circuit board structure shown in FIG. 2 only includes a groove 121 on the second circuit board 120, as shown in FIG. 3, and then the first circuit board 110 and the second circuit board 120 are docked to form a receiving space 130 without the need for the first circuit board.
  • a circuit board 110 performs structural adjustment, and the operation is simpler and more convenient.
  • the circuit board structure disclosed in the embodiment of the present disclosure may further include a mounting base 410.
  • the mounting base 410 may be considered as a mounting bracket for the circuit board structure, which facilitates the installation of the circuit board structure.
  • the mounting base 410 has a support portion 411, the first circuit board 110 is overlapped on the support portion 411, and the first circuit board 110 and the support portion 411 are fixedly connected.
  • the supporting portion 411 supports the entire circuit board structure, so that the entire circuit board structure forms a suspended structure, and finally it is convenient to set the electronic components on each board surface located on the outside.
  • the first circuit board 110 may be located between the second circuit board 120 and the mounting base 410.
  • An electronic component B1 is disposed on a surface of the first circuit board 110 facing away from the second circuit board 120.
  • the two ends of the first circuit board 110 are respectively overlapped on the two support portions 411 and are fixedly connected to the support portion 411.
  • the second circuit board 120 is located between the two support portions 411. .
  • the first circuit board 110 may be fixedly connected to the support portion 411 by a screw 420.
  • the first circuit board 110 and the supporting portion 411 may also be fixedly connected in other ways.
  • the first circuit board 110 may be fixedly connected to the supporting portion 411.
  • the second circuit board 120 may include at least two sub-circuit boards, at least two sub-circuit boards are stacked, and adjacent two sub-circuit boards are fixedly connected. Generally, two adjacent sub-circuit boards are glued to avoid soldering. At least two sub-circuit boards are electrically connected by wires.
  • electronic components can be installed on both sides of the first circuit board, and electronic components can also be installed on both sides of the second circuit board.
  • the electronic components disposed on the opposite surface of the first circuit board and the second circuit board may be disposed in the accommodation space.
  • electronic components A1 and B1 are provided on the two sides of the first circuit board 110, and electronic components are provided on the two sides of the second circuit board 140.
  • the device C1 and the electronic component D1 that is, the surface of the second circuit board 140 facing away from the first circuit board 110 is provided with the electronic component D1
  • the bottom surface of the groove 141 of the second circuit board 140 is provided with the electronic component C1.
  • Both the electronic component A1 and the electronic component C1 are disposed in the accommodation space 150.
  • the thickness of the second circuit board 140 can be increased, so that the depth of the groove 141 can be larger, and finally, the formed accommodating space 150 can simultaneously accommodate the electronic component A1 and the electronic component C1.
  • the circuit board structure shown in FIG. 4 can be provided with more electronic components, which can further improve the degree of integration.
  • the bottom surface of the groove 141 is provided with electronic components C1.
  • the opening 142 communicates with the space in the groove 141.
  • an operator or a process equipment can extend from the opening 142 into the groove 141, and then print solder paste on the bottom surface of the groove 141.
  • the groove 141 of the above structure does not affect the formation of the accommodating space 150, and can also facilitate the operation of printing solder paste.
  • FIG. 6 is a schematic structural diagram of a third circuit board structure disclosed in an embodiment of the present disclosure.
  • a groove 211 may be formed on a surface of the first circuit board 210 facing the second circuit board 220, and a surface of the second circuit board 220 facing the first circuit board 210 may be a flat surface.
  • the first circuit board 210 and the second circuit board 220 are fixedly connected by soldering (soldering).
  • the second circuit board 220 faces the first circuit board 210 and a receiving space 230 is formed between the board surface and the groove 211.
  • the electronic component A2 provided in the groove 211 is located in the receiving space 230.
  • At least one end of the groove 211 is provided with an opening, and an operator or a process equipment can extend into the groove 211 through the opening, and then print solder paste on the bottom surface of the groove 211 , And then provide conditions for the subsequent setting of electronic components.
  • FIG. 7 is a schematic structural diagram of a fourth circuit board structure disclosed in an embodiment of the present disclosure.
  • grooves are formed on opposite surfaces of the first circuit board 310 and the second circuit board 320. Are respectively the first groove 311 and the second groove 321.
  • the notch of the first groove 311 and the notch of the second groove 321 are butted to form an accommodation In the space 330, the notch edge of the first groove 311 and the notch edge of the second groove 321 are welded and fixedly connected, so that the first circuit board 310 and the second circuit board 320 are fixedly connected.
  • grooves are provided in the first circuit board 310 and the second circuit board 320, and then two grooves (ie, the first groove 311 and the second groove 321) are formed to receive the grooves.
  • Space 330 In this way, the space in the thickness direction of the first circuit board 310 and the second circuit board 320 can be fully used for hollowing out, and it is easier to form the height direction (that is, the thickness direction of the first circuit board 310 or the second circuit board 320). (Thickness direction), so that the accommodating space 330 can accommodate electronic components having a relatively high height.
  • the first circuit board 110 is overlapped on the supporting portion 411, so as to achieve a fixed connection with the supporting portion 411.
  • the second circuit board 120 ' is overlapped on the support portion 411, and the second circuit board 120' is fixedly connected to the support portion 411.
  • the first circuit board 110 ' is a second circuit board The installation is based on 120 ′, as shown in FIG. 8.
  • the embodiment of the present disclosure discloses an electronic device.
  • the disclosed electronic device includes a casing and a circuit board structure disposed in the casing.
  • the circuit board structure is the circuit board described above. structure.
  • the electronic devices disclosed in the embodiments of the present disclosure may be devices such as tablet computers, smart phones, game consoles, e-book readers, wearable devices (such as smart watches), and the embodiments of the present disclosure do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板结构，包括第一电路板（110）和设置在所述第一电路板（110）上的板面上的第二电路板（120），所述第一电路板（110）和所述第二电路板（120）中至少一者具有凹槽（121），所述第一电路板（110）与所述第二电路板（120）焊接固定、且在所述凹槽（121）处形成用于容纳电子元器件的容纳空间（130）。还包括一种电子设备。

Description

电路板结构及电子设备
相关申请的交叉引用
本申请主张在2018年9月29日在中国提交的中国专利申请No.201811156325.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及一种电路板结构及电子设备。
背景技术
随着电子设备的发展及用户需求的提升，目前的电子设备内集成了越来越多的电子元器件，进而使得电子设备的功能越来越多。考虑到电子设备的便携性，电子设备的整机尺寸一般比较小，因此，电子设备内的电子元器件集成度越来越高，充分利用电子设备的壳体内空间显得尤为必要。
电子设备内的大部分电子元器件布设在电子设备的电路板上，因此，目前的电子设备集成度越来越高，体现在其电路板集成化程度越来越高。受限于电子设备的整机尺寸，电路板的面积无法做大，为了在电路板上设置更多的电子元器件，通常将电路板设置成至少两层结构，从而形成立体式的电路板结构。此种情况下，电子设备内的电路板结构为堆叠结构，这有利于减少电路板的占用面积，同时又能增加电路板上布设电子元器件的空间。
请参考图1，图1为一种典型的电路板结构的示意图。图1所示的结构中，第一电路板101通过第二电路板102支撑于第三电路板103上，第二电路板102起到支撑的作用，能够使得第一电路板101与第二电路板102之间形成容纳空间104。在具体的设计过程中，第一电路板101和第二电路板102上朝向容纳空间104的板面均可以安装电子元器件105。
第二电路板102起到电连接第一电路板101和第三电路板103的作用，第二电路板102的两侧的板面均设计有焊锡点，第一电路板101和第三电路板103与焊锡点相对的位置均设置相应的焊盘。电路板之间的焊接工艺对电路板的平整度要求较高，第二电路板102的平整度较差会影响焊接质量。由 于第二电路板102的两侧的板面均需要焊接，焊接过程中产生的热会导致第二电路板102局部受热而发生形变，当第二电路板102的一侧焊接完成时，往往已经导致第二电路板102另一侧的板面的平整度受到不良的影响，进而会影响第二线路板102的另一侧的板面的焊接，可见，目前的电路板结构存在焊接难度较大的问题。
发明内容
本公开公开一种电路板结构，以解决目前的电路板结构存在焊接难度较大的问题。
为了解决上述问题，本公开采用下述技术方案：
电路板结构，包括第一电路板和设置在所述第一电路板上的板面上的第二电路板，所述第一电路板和所述第二电路板中至少一者具有凹槽，所述第一电路板与所述第二电路板焊接固定、且在所述凹槽处对接形成用于安装电子元器件的容纳空间。
电子设备，包括壳体和设置在所述壳体内的电路板结构，所述电路板结构为上文所述的电路板结构。
本公开采用的技术方案能够达到以下有益效果：
本公开公开的电路板结构中，可以通过对第一电路板和第二电路板的结构进行调整，使得两者中至少有一者具有凹槽，然后使得第一电路板与第二电路板在凹槽处形成容纳空间，从而使得第一电路板和第二电路板形成的立体结构来布设更多的电子元器件。相比于背景技术中通过三块电路板通过焊接形成容纳空间而言，本实施例公开的电路板结构能够用更少的电路板形成容纳空间，因此在焊接组装的过程中只需要将第一电路板与第二电路板焊接在一起即可，进而能降低焊接难度。
附图说明
此处所说明的附图用来提供对本公开的进一步理解，构成本公开的一部分，本公开的示意性实施例及其说明用于解释本公开，并不构成对本公开的不当限定。在附图中：
图1为相关技术中一种典型的电路板结构的结构示意图；
图2为本公开实施例公开的第一种电路板结构的结构示意图；
图3为图2中第二电路板的结构示意图；
图4为本公开实施例公开的第二种电路板结构的结构示意图；
图5为图4中第二电路板的结构示意图；
图6为本公开实施例公开的第三种电路板结构的结构示意图；
图7为本公开实施例公开的第四种电路板结构的结构示意图；
图8为本公开实施例公开的第五种电路板结构的结构示意图。
附图标记说明：
101-第一电路板、102-第二电路板、103-第三电路板、104-容纳空间、105-电子元器件；
110-第一电路板、120-第二电路板、121-凹槽、130-容纳空间、140-第二电路板、141-凹槽、142-开口、150-容纳空间、110′-第一电路板、120′-第二电路板；
210-第一电路板、211-凹槽、220-第二电路板、230-容纳空间；
310-第一电路板、311-第一凹槽、320-第二电路板、321-第二凹槽、330-容纳空间；
410-安装基础、411-支撑部、412-空间、420-螺钉。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚，下面将结合本公开具体实施例及相应的附图对本公开技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
以下结合附图，详细说明本公开各个实施例公开的技术方案。
本公开实施例公开一种电路板结构，所公开的电路板结构包括第一电路板和第二电路板，第二电路板设置在第一电路板的板面上、且与第一电路板焊接固定。
本实施例中，第一电路板与第二电路板中至少一者具有凹槽，第一电路板与第二电路板固定相连、且在凹槽处形成容纳空间，此种情况下，容纳空间中能够容纳电子元器件。第一电路板和第二电路板构成容纳空间的板面上均可以安装电子元器件。此种结构能够实现电子元器件在立体空间上的分布，进而能达到更高的集成度。
本公开实施例公开的电路板结构中，可以通过对第一电路板和第二电路板的结构进行调整，使得两者中至少有一者具有凹槽，然后使得第一电路板与第二电路板对接后在凹槽处形成容纳空间，从而使得第一电路板和第二电路板形成的立体结构来布设更多的电子元器件。相比于背景技术中通过三块电路板通过焊接形成容纳空间而言，本实施例公开的电路板结构能够用更少的电路板形成容纳空间，因此在焊接组装的过程中只需要将第一电路板与第二电路板焊接在一起即可，进而能降低焊接难度。
另外，由于整个电路板结构由第一电路板和第二电路板焊接完成，焊接难度降低，在对后续的电路板结构进行维修时，也更容易对电路板结构实施拆卸维修。
为了方便对上述方案的理解，在上文所描述的基础之上，现在结合附图介绍几种更具体的电路板结构。
请参考图2，本公开实施例公开的第一种电路板结构中，第二电路板120朝向第一电路板110的板面上开设有凹槽121，第一电路板110朝向第二电路板120的板面为平面。第一电路板110与第二电路板120之间通过焊接(锡焊)实现固定相连，第一电路板110朝向第二电路板120的板面与凹槽121形成容纳空间130。第一电路板110朝向第二电路板120的板面上布设的电子元器件A位于容纳空间130中。
图2所示的电路板结构，只在第二电路板120上开设凹槽121，如图3所示，然后使得第一电路板110与第二电路板120对接形成容纳空间130，无需对第一电路板110进行结构上的调整，操作更加简单、方便。
请参考图2，本公开实施例公开的电路板结构还可以包括安装基础410，安装基础410可以认为是电路板结构的安装支架，方便电路板结构的安装。安装基础410具有支撑部411，第一电路板110搭接在支撑部411上，第一电 路板110与支撑部411固定相连。支撑部411将整个电路板结构支起，进而使得整个电路板结构形成悬空结构，最终方便在位于外侧的各个板面上进行电子元器件的设置。
具体地，第一电路板110可以位于第二电路板120与安装基础410之间，第一电路板110背离第二电路板120的板面上设置有电子元器件B1，电子元器件B1位于安装基础410与第一电路板110之间的空间412内。
为了方便安装，可选的方案中，第一电路板110的两端分别搭接在两个支撑部411上、且与支撑部411固定相连，第二电路板120位于两个支撑部411之间。具体地，第一电路板110可以通过螺钉420与支撑部411固定连接。当然，第一电路板110与支撑部411还可以采用其它方式固定相连，例如第一电路板110可以与支撑部411粘接固定相连。
本实施例中，第二电路板120可以包括至少两块子电路板，至少两块子电路板叠置，相邻的两块子电路板固定相连。通常，相邻的两块子电路板通过胶水粘接，避免采用焊接。至少两块子电路板通过电线实现电连接。
本实施例中，第一电路板的两侧的板面上可以安装电子元器件，第二电路板的两侧的板面上也可以都安装有电子元器件。此种情况下，第一电路板和第二电路板相对的板面上设置的电子元器件均可以设置在容纳空间中。
请参考图4，具体地，第一电路板110的两侧的板面上分别设置有电子元器件A1和电子元器件B1，第二电路板140的两侧的板面上分别设置有电子元器件C1和电子元器件D1，即，第二电路板140背离第一电路板110的板面设置有电子元器件D1，第二电路板140的凹槽141的底面均设置有电子元器件C1。电子元器件A1和电子元器件C1均设置在容纳空间150中。上述结构中，可以增大第二电路板140的厚度，进而使得凹槽141的深度可以更大，最终能使得形成的容纳空间150同时容纳电子元器件A1和电子元器件C1。很显然，图4所示的电路板结构能够设置更多的电子元器件，能进一步提高集成度。
如图4所示，凹槽141的底面布设有电子元器件C1，为了方便在凹槽141的底面上印刷锡膏，可选的方案中，请参考图5，凹槽141至少一端设置有开口142，开口142与凹槽141内的空间连通，在操作的过程中，操作人员 或工艺设备可以从开口142伸入到凹槽141中，进而在凹槽141的底面印刷锡膏。上述结构的凹槽141不影响容纳空间150形成的基础上，还能方便印刷锡膏的操作。
请参考图6，图6示出了本公开实施例公开的第三种电路板结构的结构示意图。图6所示的电路板结构中，第一电路板210朝向第二电路板220的板面上可以开设有凹槽211，第二电路板220朝向第一电路板210的板面可以为平面。第一电路板210与第二电路板220之间通过焊接(锡焊)实现固定相连，第二电路板220朝向第一电路板210的板面与凹槽211之间形成容纳空间230。凹槽211内设置的电子元器件A2位于容纳空间230中。
图6所示的电路板结构中，只在第一电路板210上开设凹槽211，然后使得第一电路板210与第二电路板220对接形成容纳空间230，无需对第二电路板220进行结构上的调整，操作更加简单、方便。图6中，第二电路板220朝向第一电路板210的板面上并没有设置电子元器件，实际的操作过程中，第二电路板220朝向第一电路板210的板面上同样可以设置电子元器件。
同样，为了方便向凹槽211的底面上印刷锡膏，凹槽211至少一端设置有开口，操作人员或工艺设备可以通过开口伸入到凹槽211中，进而在凹槽211的底面印刷锡膏，进而为后续的电子元器件的设置提供条件。
请参考图7，本公开实施例公开的第四种电路板结构的结构示意图，图7所示的结构中，第一电路板310和第二电路板320相对的板面上均开设有凹槽，分别为第一凹槽311和第二凹槽321，第一电路板310与第二电路板320焊接固定后，第一凹槽311的槽口与第二凹槽321的槽口对接形成容纳空间330，第一凹槽311的槽口边缘与第二凹槽321的槽口边缘焊接固定相连，进而实现第一电路板310与第二电路板320的固定相连。
图7所示的电路板结构中，在第一电路板310和第二电路板320上均开设凹槽，然后由两个凹槽(即第一凹槽311和第二凹槽321)形成容纳空间330，此种方式能够充分利用第一电路板310和第二电路板320的厚度方向的空间进行挖空，较容易形成高度方向(即第一电路板310的厚度方向或第二电路板320的厚度方向)更大的空间，进而能使得容纳空间330能够容纳高度较大的电子元器件。
如上文所述，第一电路板110搭接在支撑部411上，进而实现与支撑部411的固定连接。当然，也可以是，第二电路板120′搭接在支撑部411上，第二电路板120′与支撑部411固定相连，此种情况下，第一电路板110′则以第二电路板120′为基础进行安装，如图8所示。
基于本公开实施例公开的电路板结构，本公开实施例公开一种电子设备，所公开的电子设备包括壳体和设置在壳体内的电路板结构，该电路板结构为上文描述的电路板结构。
本公开实施例公开的电子设备可以是平板电脑、智能手机、游戏机、电子书阅读器、可穿戴设备(例如智能手表)等设备，本公开实施例不限制电子设备的具体种类。
本公开上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本公开的实施例而已，并不用于限制本公开。对于本领域技术人员来说，本公开可以有各种更改和变化。凡在本公开的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本公开的权利要求范围之内。

Claims (10)

  1. 电路板结构，包括第一电路板和设置在所述第一电路板上的板面上的第二电路板，所述第一电路板和所述第二电路板中至少一者具有凹槽，所述第一电路板与所述第二电路板焊接固定、且在所述凹槽处形成用于安装电子元器件的容纳空间。
  2. 根据权利要求1所述的电路板结构，其中，所述第二电路板朝向所述第一电路板的板面上开设有所述凹槽，所述第一电路板朝向所述第二电路板的板面为平面。
  3. 根据权利要求2所述的电路板结构，其中，所述第二电路板包括至少两块子电路板，至少两块所述子电路板叠置，相邻的两块所述子电路板固定相连。
  4. 根据权利要求2所述的电路板结构，其中，所述第二电路板背离所述第一电路板的板面以及所述凹槽的底面均设置有电子元器件。
  5. 根据权利要求4所述的电路板结构，其中，所述凹槽至少一端设置有开口。
  6. 根据权利要求1所述的电路板结构，其中，所述第一电路板朝向所述第二电路板的板面上开设有所述凹槽，所述第二电路板朝向所述第一电路板的板面为平面。
  7. 根据权利要求1所述的电路板结构，其中，所述第一电路板和所述第二电路板相对的板面上均开设有所述凹槽，且分别为第一凹槽和第二凹槽，所述第一凹槽的槽口与所述第二凹槽的槽口对接形成所述容纳空间，所述第一凹槽的槽口边缘与所述第二凹槽的槽口边缘焊接固定相连。
  8. 根据权利要求1所述的电路板结构，还包括安装基础，所述安装基础具有支撑部，所述第一电路板或所述第二电路板搭接在所述支撑部上、且与所述支撑部固定相连，所述第一电路板位于所述第二电路板与所述安装基础之间，所述第一电路板背离所述第二电路板的板面上的电子元器件位于所述第一电路板与所述安装基础之间的空间内。
  9. 根据权利要求8所述的电路板结构，其中，所述第一电路板的两端分 别搭接在两个所述支撑部上、且与所述支撑部固定相连，所述第二电路板位于两个所述支撑部之间。
  10. 电子设备，包括壳体和设置在所述壳体内的电路板结构，所述电路板结构为权利要求1-9中任一项所述的电路板结构。
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