WO2016206320A1 - 一种射频功放模块及射频通信设备 - Google Patents

一种射频功放模块及射频通信设备 Download PDF

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Publication number
WO2016206320A1
WO2016206320A1 PCT/CN2015/097400 CN2015097400W WO2016206320A1 WO 2016206320 A1 WO2016206320 A1 WO 2016206320A1 CN 2015097400 W CN2015097400 W CN 2015097400W WO 2016206320 A1 WO2016206320 A1 WO 2016206320A1
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power amplifier
radio frequency
amplifier module
sub
frequency power
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PCT/CN2015/097400
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English (en)
French (fr)
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樊宁
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中兴通讯股份有限公司
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Publication of WO2016206320A1 publication Critical patent/WO2016206320A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving

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  • the present invention relates to the field of the structure of a radio frequency communication device, and in particular, to an RF power amplifier module and a radio frequency communication device.
  • the volume requirement of the communication device is getting higher and higher, and the smaller volume means lower installation and maintenance cost, and has a strong competitive advantage in the market.
  • the RF power amplifier module is composed of a bottom plate and a cover plate with a cavity. Its PCB circuit and power device are placed on the backplane.
  • RF power amplifier products have also made many efforts to improve the efficiency of power amplifiers, such as multi-channel power amplifier design, large-plate power amplifier design, and optimized PCB circuit layout.
  • an embodiment of the present invention provides a radio frequency power amplifier module and a radio frequency communication device.
  • the radio frequency power amplifier module provided by the embodiment of the invention comprises: a plurality of bottom plates and a sub-chamber partition wall, wherein the plurality of bottom plates and the sub-chamber partition wall are enclosed to form a radio frequency cavity, and the circuit board is provided with a circuit board, the circuit board The surface of the circuit faces the partition wall.
  • the plurality of bottom plates are mounted by a sub-chamber partition.
  • the bottom plate and the sub-chamber partition are detachably connected.
  • the bottom plate and the sub-chamber partition wall are provided with matching card members.
  • the circuit boards disposed on different backplanes are connected by a socket.
  • the circuit board is soldered to the corresponding backplane.
  • part or all of the face of the partition wall is composed of a bottom plate.
  • a power device is further included, and the power device is disposed on any of the substrates.
  • the radio frequency communication device provided by the embodiment of the invention includes the radio frequency power amplifier module described above.
  • the embodiment of the invention provides a new RF power amplifier module, which is surrounded by a plurality of bottom plates and sub-chamber partition walls to form a radio frequency cavity, thereby realizing the goal of replacing the cover plate with the bottom plate, that is, the power amplifier no longer has a cover plate.
  • the circuit layout can be performed on all the backplanes, so that the scheme of the circuit layout design of only one bottom panel surface can be compared, and the plane area of the RF power amplifier module can be greatly reduced, thereby reducing the volume of the RF power amplifier module.
  • FIG. 1 is a schematic structural diagram of a radio frequency power amplifier module according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural view of a conventional RF power amplifier module
  • FIG. 3 is a schematic structural diagram of a radio frequency power amplifier module according to a second embodiment of the present invention.
  • FIG. 4 is a schematic plan view showing the assembly of the existing RF power amplifier module
  • FIG. 5 is a schematic plan view showing the assembly of an RF power amplifier module according to a third embodiment of the present invention.
  • FIG. 6 is a schematic plan view showing the assembly of a radio frequency power amplifier module according to a fourth embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a radio frequency power amplifier module according to a first embodiment of the present invention.
  • the radio frequency power amplifier module includes: a bottom plate 1 , a sub-chamber partition wall 2 , and a circuit board 3 , wherein The bottom plate 1 and the sub-chamber partition wall 2 are enclosed to form a radio frequency cavity, and the circuit board 3 is disposed on the bottom plate, and the circuit surface of the circuit board 3 faces the sub-chamber partition wall 2.
  • the plurality of bottom plates 1 of the above embodiment are mounted by a sub-chamber 2 .
  • the bottom plate 1 of the above embodiment is detachably coupled to the sub-chamber partition 2.
  • the bottom plate 1 and the sub-chamber partition wall 2 in the above embodiment are provided with matching card members, and the detachable connection is realized by the matching card members.
  • the circuit boards disposed on different backplanes in the above embodiments are connected by a socket.
  • the circuit board 3 of the above embodiment is soldered to the corresponding backplane 1.
  • part or all of the face of the partial partition wall 2 in the above embodiment is composed of the bottom plate 1.
  • the RF power amplifier module in the above embodiment further includes a power device, and the power device is disposed on any of the base plates 1.
  • the embodiment of the present invention also provides a radio frequency communication device, which includes the radio frequency power amplifier module provided by the present application.
  • FIG. 2 a schematic structural diagram of an existing RF power amplifier module can be seen.
  • the conventional power amplifier unit is composed of a sub-chamber cover A, a PCB board B, a power device C and a bottom plate D.
  • the PCB board B and the power device C are soldered or mounted on the bottom plate D, and then assembled by screws and a sub-chamber cover A.
  • the cover A is the most important function for the cavity design of the RF circuit to ensure the stability of the circuit.
  • FIG. 3 a schematic structural diagram of a radio frequency power amplifier module according to a second embodiment of the present invention is shown.
  • the radio frequency power amplifier module is composed of two base plates D, two PCB boards B and one radio frequency partition wall E.
  • the PCB board B1 is soldered on the bottom board D1
  • the PCB board B2 is soldered on the bottom board D2
  • the power device C is mounted on any bottom board D
  • the two bottom boards D are assembled through the radio frequency partition wall E
  • one side of the circuit is opposite
  • the electrical relationship between the upper and lower PCB boards can be connected through the socket on the PCB.
  • the circuit design is equivalent to the upper and lower inner surfaces of a cavity.
  • the planar area of the power amplifier can be reduced by half.
  • the height of the entire power amplifier only slightly increases the thickness of a bottom plate, and the volume is reduced by half. .
  • FIG. 4 is a schematic plan view showing the assembly of the conventional RF power amplifier module, in which the PCB board B is soldered to the bottom plate D, and then mounted with the cover plate A.
  • FIG. 5 is a schematic plan view showing the assembly of the RF power amplifier module according to the third embodiment of the present invention.
  • the PCB board B1 is soldered on the bottom board D1
  • the PCB board B2 is soldered on the bottom board D2
  • the two bottom boards D pass the radio frequency partition wall E.
  • the electrical relationship between the two PCBs can be connected via socket F.
  • the upper and lower inner surfaces of the cavity are circuit PCBs, and theoretically, the planar area of the power amplifier can be reduced by half.
  • FIG. 6 is a schematic plan view showing the assembly of a radio frequency power amplifier module according to a fourth embodiment of the present invention.
  • the PCB board B1 is soldered on the bottom board D1
  • the PCB board B2 is soldered on the bottom board D2
  • the two bottom boards D are separated by radio frequency.
  • Wall E is assembled.
  • the RF cavity G1 inside the RF power amplifier module has three inner surfaces designed with a circuit PCB, the internal cavity G2 of the power amplifier unit, and four inner surfaces are designed with a circuit PCB, and these circuit PCBs pass through the socket F. Connect to ensure the electrical connection between the PCBs inside the module.
  • the plane area of the power amplifier can be further reduced and the volume can be reduced on the basis of FIG. 5.
  • the circuit design can be performed on the six inner surfaces of one cavity to minimize the plane of the power amplifier. area.
  • the embodiment of the present invention can perform reasonable internal surface circuit PCB design according to the needs of each cavity in the power amplifier unit according to a specific situation, and is not limited to various situations in the drawings.
  • the various cases are merely examples of the technical assembly instructions of the embodiments of the present invention.
  • the circuit layout design of only one bottom plate surface can greatly reduce the planar area of the RF power amplifier module, thereby achieving the purpose of reducing the volume of the RF power amplifier module.
  • a plurality of bottom plates and sub-chamber partition walls are enclosed into a radio frequency cavity, thereby realizing the goal of replacing the cover plate with the bottom plate, that is, the power amplifier no longer has a cover plate, and at this time, it can pass through all the bottom plates.
  • the circuit layout is performed, so that the scheme of circuit layout design with only one bottom surface is compared, and the plane area of the RF power amplifier module can be greatly reduced, thereby reducing the volume of the RF power amplifier module.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transmitters (AREA)
  • Amplifiers (AREA)

Abstract

本发明公开了一种射频功放模块及射频通信设备，该射频功放模块包括：多个底板以及分腔隔墙，多个底板与分腔隔墙围合形成射频腔体，底板上设置有电路板，电路板的电路表面朝向分腔隔墙。

Description

一种射频功放模块及射频通信设备 技术领域
本发明涉及射频通信设备的结构领域，尤其涉及一种射频功放模块及射频通信设备。
背景技术
在当前的通信系统中，对于通讯设备的体积要求越来越高，更小的体积意味着更低的安装、维护成本，在市场上具备强大的竞争优势。
对于射频功放而言，由于射频电路的存在，必须为其设计相应的射频腔体进行电路隔离，以保证整个电路的稳定性，所以射频功放模块是由一个底板和一个带分腔的盖板组成，其PCB电路和功率器件放置在底板上。
作为无线通信系统中重要的有源模块，射频功放产品为了能够减小体积，在提升功放效率的基础上，也进行了诸多努力，比如多通道功放设计，大板功放设计，优化PCB电路布局，优化腔体结构设计等等，对于目前的射频功放而言，在兼顾产品指标和稳定性的前提下，想要进一步降低体积已经比较困难。
因此，如何提供一种可进一步减少体积的射频功放模块，是本领域技术人员亟待解决的技术问题。
发明内容
为解决上述技术问题，本发明实施例提供了一种射频功放模块及射频通信设备。
本发明实施例提供的射频功放模块，包括：多个底板以及分腔隔墙，多个底板与分腔隔墙围合形成射频腔体，底板上设置有电路板，电路板的 电路表面朝向分腔隔墙。
在本发明一实施例中，多个底板通过分腔隔墙安装。
在本发明一实施例中，底板与分腔隔墙可拆卸连接。
在本发明一实施例中，底板与分腔隔墙设置有配套的卡件。
在本发明一实施例中，设置于不同底板上电路板之间通过插座连接。
在本发明一实施例中，电路板焊接在对应的底板上。
在本发明一实施例中，分腔隔墙的部分面或全部面由底板组成。
在本发明一实施例中，还包括功率器件，功率器件设置于任一底板上。
本发明实施例提供的射频通信设备，包括上述所述的射频功放模块。
本发明实施例的有益效果：
本发明实施例提供了一种新的射频功放模块，通过多个底板与分腔隔墙围成射频腔体，实现了利用底板取代盖板的目标，即功放不再存在盖板，此时就可以通过在所有的底板上进行电路布局，这样对比原来仅一个底板面进行电路布局设计的方案，可以很大程度的减小射频功放模块的平面面积，从而达到减小射频功放模块体积的目的。
附图说明
图1本发明第一实施例提供的射频功放模块的结构示意图；
图2为现有射频功放模块的结构示意图；
图3本发明第二实施例提供的射频功放模块的结构示意图；
图4为现有射频功放模块装配平面示意图；
图5为本发明第三实施例提供的射频功放模块装配平面示意图；
图6为本发明第四实施例提供的射频功放模块装配平面示意图。
具体实施方式
现通过具体实施方式结合附图的方式对本发明做出进一步的诠释说 明。
第一实施例：
图1为本发明第一实施例提供的射频功放模块的结构示意图，由图1可知，在本实施例中，射频功放模块包括：底板1、分腔隔墙2以及电路板3，其中，多个底板1与分腔隔墙2围合形成射频腔体，底板上设置有电路板3，电路板3的电路表面朝向分腔隔墙2。
在一个实施例中，上述实施例中的多个底板1通过分腔隔墙2安装。
在一个实施例中，上述实施例中的底板1与分腔隔墙2可拆卸连接。
在一个实施例中，上述实施例中的底板1与分腔隔墙2设置有配套的卡件，通过配套的卡件实现可拆卸连接。
在一个实施例中，上述实施例中设置于不同底板上电路板之间通过插座连接。
在一个实施例中，上述实施例中的电路板3焊接在对应的底板1上。
在一个实施例中，上述实施例中的分腔隔墙2的部分面或全部面由底板1组成。
在一个实施例中，上述实施例中射频功放模块还包括功率器件，功率器件设置于任一底板1上。
对应的，本发明实施例也提供了一种射频通信设备，其包括本申请提供的射频功放模块。
现结合具体应用场景对本发明实施例做进一步的诠释说明。
第二实施例：
结合图2及图3对本发明做进一步的诠释说明。
在图2中，可以看到现有射频功放模块的结构示意图。传统功放单元由分腔盖板A，PCB板B、功率器件C和底板D组成，PCB板B以及功率器件C焊接或安装在底板D上，然后通过螺钉和分腔盖板A装配到一起， 盖板A除了能够保护PCB表面电子元器件以外，最重要的作用是为射频电路的进行腔体设计，用来保证电路的稳定性。
在图3中，可以看到本发明第二实施例提供的射频功放模块的结构示意图，射频功放模块由两块底板D，两块PCB板B和一个射频隔墙E组成。其中，PCB板B1焊接在底板D1上，PCB板B2焊接在底板D2上，功率器件C安装在任意底板D上，然后这两个底板D通过射频隔墙E进行装配，有电路的一面均对着隔墙方向，上下两个PCB板上的电气关系，可以通过PCB上的插座进行连接。这样，相当于在一个腔体的上下内表面，均进行了电路设计，理论上最大能减小一半功放的平面面积，整个功放的高度仅略微增加了一个底板的厚度，体积接近减小了一半。
图4是现有射频功放模块的装配平面示意图，其中，PCB板B焊接在底板D上，然后和盖板A进行安装。
第三实施例：
图5为本发明第三实施例提供的射频功放模块装配平面示意图，由图5可知，PCB板B1焊接在底板D1上，PCB板B2焊接在底板D2上，两块底板D通过射频隔墙E进行装配，两块PCB间的电气关系可通过插座F进行连接。这样对于功放模块内的每个腔体而言，腔体的上下内表面均为电路PCB，理论上最大能减小一半功放的平面面积。
图6为本发明第四实施例提供的射频功放模块装配平面示意图，由图6可知，其中，PCB板B1焊接在底板D1上，PCB板B2焊接在底板D2上，两块底板D通过射频隔墙E进行装配。同时为了进一步减小射频功放模块的平面面积，我们将PCB板B3焊接在底板D3上，将PCB板B4和PCB板B5焊接在底板D4上，用底板D3和底板D4来替换部分隔墙。这样一来，射频功放模块内部的射频腔体G1，有3个内表面设计有电路PCB，功放单元内部腔体G2，有4个内表面设计有电路PCB，这些电路PCB通过插座F 进行连接，保证整个模块内部各PCB间电气关系的连接。这样，能够在图5的基础上进一步的减小功放的平面面积，降低体积，最理想情况下，可以让一个腔体的六个内表面均进行电路PCB设计，最大限度的减小功放的平面面积。
在实际应用中，本发明实施例可以依据具体的情况，对功放单元内的各个腔体，按照其需要进行合理的内表面电路PCB设计，不局限于附图中的各种情况，附图中的各种情况仅是本发明实施例的技术装配说明举例。
综上可知，通过本发明实施例的实施，至少存在以下有益效果：
通过多个底板与分腔隔墙围成射频腔体，实现了利用底板取代盖板的目标，即功放不再存在盖板，此时就可以通过在所有的底板上进行电路布局，这样对比原来仅一个底板面进行电路布局设计的方案，可以很大程度的减小射频功放模块的平面面积，从而达到减小射频功放模块体积的目的。
以上仅是本发明的具体实施方式而已，并非对本发明做任何形式上的限制，凡是依据本发明的技术实质对以上实施方式所做的任意简单修改、等同变化、结合或修饰，均仍属于本发明技术方案的保护范围。
工业实用性
本发明实施例的技术方案，通过多个底板与分腔隔墙围成射频腔体，实现了利用底板取代盖板的目标，即功放不再存在盖板，此时就可以通过在所有的底板上进行电路布局，这样对比原来仅一个底板面进行电路布局设计的方案，可以很大程度的减小射频功放模块的平面面积，从而达到减小射频功放模块体积的目的。

Claims (10)

  1. 一种射频功放模块，包括：多个底板以及分腔隔墙，所述多个底板与所述分腔隔墙围合形成射频腔体，所述底板上设置有电路板，所述电路板的电路表面朝向所述分腔隔墙。
  2. 如权利要求1所述的射频功放模块，其中，多个所述底板通过所述分腔隔墙安装。
  3. 如权利要求2所述的射频功放模块，其中，所述底板与所述分腔隔墙可拆卸连接。
  4. 如权利要求3所述的射频功放模块，其中，所述底板与所述分腔隔墙设置有配套的卡件。
  5. 如权利要求1所述的射频功放模块，其中，设置于不同底板上电路板之间通过插座连接。
  6. 如权利要求1所述的射频功放模块，其中，所述电路板焊接在对应的底板上。
  7. 如权利要求1至6任一项所述的射频功放模块，其中，所述分腔隔墙的部分面或全部面由底板组成。
  8. 如权利要求7所述的射频功放模块，其中，还包括功率器件，所述功率器件设置于任一所述底板上。
  9. 如权利要求1至6任一项所述的射频功放模块，其中，还包括功率器件，所述功率器件设置于任一所述底板上。
  10. 一种射频通信设备，包括如权利要求1至9任一项所述的射频功放模块。
PCT/CN2015/097400 2015-06-24 2015-12-15 一种射频功放模块及射频通信设备 WO2016206320A1 (zh)

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CN204721340U (zh) * 2015-06-24 2015-10-21 中兴通讯股份有限公司 一种射频功放模块及射频通信设备

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