WO2014075251A1 - 一种印刷电路板、一种部件及一种电路组件 - Google Patents

一种印刷电路板、一种部件及一种电路组件 Download PDF

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Publication number
WO2014075251A1
WO2014075251A1 PCT/CN2012/084626 CN2012084626W WO2014075251A1 WO 2014075251 A1 WO2014075251 A1 WO 2014075251A1 CN 2012084626 W CN2012084626 W CN 2012084626W WO 2014075251 A1 WO2014075251 A1 WO 2014075251A1
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WO
WIPO (PCT)
Prior art keywords
welding
component
limiting layer
printed circuit
circuit board
Prior art date
Application number
PCT/CN2012/084626
Other languages
English (en)
French (fr)
Inventor
李松林
贺国栋
李继厚
杜伟
黄淑君
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201280033028.4A priority Critical patent/CN103858525A/zh
Priority to PCT/CN2012/084626 priority patent/WO2014075251A1/zh
Publication of WO2014075251A1 publication Critical patent/WO2014075251A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present invention relates to the field of electronic technologies, and in particular, to a printed circuit board, a component, and a circuit component. Background of the invention
  • PCB Printed Circuit Board
  • components including soldered surfaces, and can be used to connect to a PCB (but not limited to PCB) by soldering, called components, such as metal substrates, components or multiple elements
  • the device is assembled into a device, etc.
  • the solder void has a great influence on the reliability of the product.
  • the conventional soldering method directly sinters the printed circuit board and the soldered surface of the component, as shown in Fig. 1 and Fig. 2, the printed circuit board 1 and the power amplifier tube 3
  • the structure of the heat-dissipating metal substrate 2 soldered in which FIG. 2 shows the printed circuit board 1 and its soldering surface 11
  • the structure of the printed circuit board 1 and the component 2 of FIG. 6 are printed.
  • the welding surface of both the circuit board and the welded component is directly sintered, and the problem is that a large-area cavity is formed between the PCB and the soldered surface of the component after soldering, which affects product reliability. Summary of the invention
  • the embodiment of the invention provides a printed circuit board, a component and a circuit component, which can solve the problem of large-area voids between the welding faces after welding, can realize the welding process to control the flow of the welding material, and improve the welding surface welding material.
  • the uniformity of the distribution so as to avoid large-area voids between the welding surfaces, to ensure product reliability.
  • a printed circuit board for soldering a component the soldering surface of the printed circuit board for soldering the component is provided with a solder material limiting layer, and the soldering material limiting layer is used for The solder material used to weld the component is limited to at least two regions divided by the solder material stop layer.
  • a component comprising a welding surface, a welding material limiting layer is disposed on a welding surface of the component, and the welding material limiting layer is used for limiting a welding material used for welding the component to the welding
  • the material is limited to at least two regions of the segmentation layer.
  • a method of making a printed circuit board for soldering a component comprising: providing a solder material stop layer on a soldering surface of the printed circuit board for soldering the component, the soldering A material stop layer is used to limit the solder material used to weld the component to at least two regions divided by the solder material stop layer.
  • a method of making a component, the component comprising a soldering surface comprising: Providing a solder material limiting layer on the soldering surface of the component, the solder material limiting layer for limiting a solder material used for soldering the component to at least two regions divided by the solder material limiting layer .
  • a circuit assembly comprising a component and a printed circuit board having a solder material for soldering between a solder face of the printed circuit board and a solder face of the component
  • a solder material limiting layer is further disposed between the soldering surface of the printed circuit board and the soldering surface of the component, the solder material limiting layer for limiting the solder material to be limited by the solder material
  • the layer is divided into at least two regions.
  • a method of manufacturing a circuit assembly comprising a component and a printed circuit board, the method comprising disposing a solder material for soldering between a solder face of the printed circuit board and a solder face of the component, The method also includes:
  • solder material limiting layer between the soldering surface of the printed circuit board and the soldering surface of the component, the solder material limiting layer for limiting the solder material to be separated by the solder material limiting layer In at least two areas.
  • a solder material limiting layer is disposed on the soldering surface of the printed circuit board or the soldering surface of the component or a solder material is disposed between the printed circuit board and the soldering surface of the component.
  • the limiting layer can control the flow of tin in the welding process through the limiting layer of the welding material, and improve the uniformity of the solder distribution on the welding surface, thereby avoiding large-area voids between the welding surfaces after the splicing, thereby ensuring the welding effect and ensuring the welding effect.
  • FIG. 1 is a schematic structural view of a printed circuit board and a heat dissipating metal substrate of a power amplifier tube provided by the prior art
  • FIG. 2 is a schematic view showing a soldering surface of a printed circuit board provided by the prior art
  • FIG. 3 is a schematic diagram of a circuit assembly according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic diagram of a PCB according to Embodiment 1 of the present invention.
  • Figure 5 is a schematic diagram of a circuit assembly according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic structural view of a printed circuit board and components soldered by the prior art
  • 7 is a schematic diagram of components provided in Embodiment 2 of the present invention
  • FIG. 8 is a schematic diagram of a circuit assembly according to Embodiment 1 of the present invention.
  • FIG. 9 is a schematic diagram of a circuit assembly according to Embodiment 2 of the present invention.
  • Figure 10 is a flow chart showing a method of soldering printed circuit boards and components according to Embodiment 6 of the present invention. Mode for carrying out the invention
  • Embodiments of the present invention provide a circuit assembly including components (22, 25) and a printed circuit board (PCB) (21), which are useful between a soldered surface of a printed circuit board and a soldered surface of a component.
  • a solder material limiting layer (24) is further disposed between the bonding surface of the printed circuit board and the soldering surface of the component, and the solder material limiting layer is used to limit the soldering material to The welding material is defined in at least two regions of the limiting layer segmentation.
  • the component is an object including a soldering surface, which may be connected to a PCB (but not limited to a PCB) by soldering, which may include a metal substrate, a component or a device, but is not limited thereto.
  • a soldering material limiting layer is further disposed between the splicing surface of the PCB and the soldering surface of the component, which may be disposed on the splicing surface of the PCB as shown in FIG. 3 or FIG. 8, or may be as shown in FIG. 5 or FIG. It can be set on the soldering surface of the component at the same time, or it can be set on the soldering surface of the PCB and the component at the same time, or as a separate layer, between the PCB and the soldering surface of the component.
  • the limiting layer of the solder material may be a solder mask, the material of which is a barrier material, and the solder resist material may be green oil.
  • the solder material may be tin antimony or other flowable material, and is not limited thereto in the embodiment of the present invention.
  • the shape of the solder material limiting layer may be a mesh shape, but is not limited thereto, and may be a shape that can restrict the solder material to at least two regions. However, in order to further improve the uniformity of the distribution of the welding material, the shape may be a uniformly divided grid shape.
  • the solder material limiting layer when the solder material limiting layer is disposed on the splicing surface of at least one of the PCB board and the component, the solder material limiting layer may be disposed in a close manner, for example, by printing, but Not limited to this. Setting in a close manner can further ensure the connection of the welding materials between the welding faces, avoiding the problem of welding faults or large-area voids.
  • the circuit assembly provided by the embodiment of the invention can limit the welding material by at least two regions formed by the solder resist material between the soldering surfaces, thereby improving the uniformity of the soldering distribution on the soldering surface, and avoiding the soldering surface of the printed circuit board and the component after soldering. A large area of voids between them ensures the welding effect and thus the reliability of the product.
  • the above circuit assembly will be further described with the component being a metal substrate for enhancing the heat dissipation of the power amplifier tube 3, the solder material limiting layer being disposed on the soldering surface of the PCB, and the solder material being solder as an example.
  • the power amplifier tube 3 passes through the through hole of the PCB 21, and is connected to the metal substrate 22 for enhancing the heat dissipation of the power amplifier tube, and the metal substrate is soldered on the PCB.
  • the PCB (printed circuit board) 21 and the metal substrate 22 (ie, the component) to be soldered have a corresponding soldering surface
  • the metal substrate 22 serves as a power radiating metal member of the power amplifier tube 3
  • the metal substrate 22 is soldered to the PCB 21, such as As shown in FIG. 3 and FIG.
  • the soldering structure further includes: a solder limiting layer 24 is disposed on the soldering surface of the PCB 21 or the soldering surface of the metal substrate, and the soldering limiting layer 24 is connected to the soldering surface of the PCB 21 or the metal substrate 22.
  • the surface matching layer 3 can adopt a grid structure. After the PCB 1 and the metal substrate 22 are soldered, the solder limiting layer 24 of the grid structure is sandwiched between the PCB 21 and the metal substrate 22, and passes through the grid structure.
  • the solder limiting layer 24 can limit the flow of solder during the soldering process, and avoid uneven distribution of solder between the PCB 21 and the metal substrate 22 after soldering to form a large-area cavity, thereby ensuring the soldering effect between the PCB 21 and the metal substrate 22.
  • the solder limiting layer 24 can be closely disposed on the soldering surface of the PCB 21.
  • the solder limiting layer 24 can be a solder resist layer of a grid-like structure formed by the solder resist material printed on the soldering surface of the PCB 21. Therefore, the solder limiting layer 24 and the soldering surface of the PCB 21 are integrated into one body.
  • the solder limiting layer 24 restricts the solder from flowing between the soldering surface of the PCB 21 and the metal substrate 22. The large-area space between the PCB 1 and the metal substrate 22 after soldering is avoided, thereby effectively ensuring the soldering effect between the PCB 21 and the metal substrate 22.
  • the grid-like solder resist layer is printed on the soldering surface of the PCB in the power amplifier circuit as a limiting layer of the solder material, and the PCB is pressed into tight contact with the metal substrate by pressing the tooling, and sintering is performed in a heating environment, so that after soldering The large area void of the PCB and the metal substrate is reduced, and the soldering effect between the PCB and the metal substrate in the power amplifier circuit is improved.
  • the "tooling" in the field of mechanical production and processing that is, the production process equipment: refers to the general term for the various tools used in the manufacturing process.
  • Figures 4 and 8 show the case where the component is component 25.
  • the descriptions in the above embodiments can be referred to.
  • an embodiment of the present invention further provides a PCB for soldering a component, and a soldering material limiting layer is disposed on a soldering surface of the PCB for soldering the component, and the soldering material limiting layer is used for soldering Used by this part
  • the solder material is confined in at least two regions divided by the solder material stop layer. Specific features of the PCB can be referred to the PCB described in the above circuit components.
  • Embodiments of the present invention also provide a circuit assembly including the above PCB.
  • Example 2
  • Embodiments of the present invention provide a circuit assembly, which further clarifies the above circuit components by using a metal substrate whose components are used to enhance the heat dissipation of the power amplifier tube 3, and the solder material is solder.
  • the example is the same as that given in the first embodiment, except that the solder limiting layer 24 is disposed on the soldering surface of the metal substrate 22 (as shown in FIG. 5, the solder limiting layer 24 can be referred to FIG. 4).
  • the solder limiting layer 24 restricts the flow of solder between the soldering surface of the PCB 21 and the soldering surface of the metal substrate 22, thereby avoiding the PCB 21 and the metal after soldering.
  • the solder stopper layer 24 may be a solder resist layer of a grid-like structure formed by the solder resist material printed on the soldering surface of the metal substrate 22.
  • Figures 7 and 9 show the case where the component is component 25.
  • the descriptions in the above embodiments can be referred to.
  • embodiments of the present invention also provide a component that includes a soldering surface that can be used for soldering components and PCBs, but not limited to PCBs.
  • a weld material stop layer is provided on the weld face of the component, the weld material stop layer being used to limit the weld material used to weld the component to at least two regions divided by the weld material stop layer.
  • the component can include a metal substrate, component or device. Specific features of the component can be referred to the components described in the above circuit components.
  • Embodiments of the present invention also provide a circuit assembly including the above components.
  • Example 3
  • Embodiments of the present invention further provide a method of making a printed circuit board for soldering a component, the method comprising:
  • solder material limiting layer for limiting the soldering material used for soldering the component to be separated by the limiting layer of the splicing material In at least two areas.
  • the solder material may be solder, but is not limited thereto.
  • the solder material limiting layer may be a solder resist layer, the solder resist layer is composed of a solder resist material, and the solder resist material may be green Oil, but not limited to this.
  • solder material limiting layer may be in the form of a grid or other shapes including at least two divided regions. Further, it may be a uniformly divided mesh shape to further improve the uniformity of the distribution of the welding material.
  • the above providing the solder material limiting layer on the soldering surface of the printed circuit board corresponding to the soldering component may include: printing the solder resist material on the soldering surface of the printed circuit board for soldering the component to form a grid shape Welding material limit layer.
  • the PCB fabricated by the method provided by the embodiment of the invention can limit the welding material through at least two regions formed by the solder resist material on the PCB, thereby improving the uniformity of solder distribution on the soldering surface, and avoiding PCB and component after soldering. A large area of voids between the joints ensures the welding effect and thus the reliability of the product.
  • Embodiments of the present invention further provide a method of fabricating a component that includes a soldering surface that can be used for soldering between the component and the PCB, but is not limited to soldering with the PCB.
  • the method includes:
  • a weld material stop layer is provided on the weld face of the component for limiting the weld material used to weld the component to at least two regions divided by the weld material stop layer.
  • the solder material may be solder, but is not limited thereto.
  • the solder material limiting layer may be a solder resist layer, and the solder resist layer is made of a solder resist material, and the solder resist material may be green oil, but is not limited thereto.
  • solder material limiting layer may be in the form of a grid or other shapes including at least two divided regions. Further, it may be a uniformly divided mesh shape to further improve the uniformity of the distribution of the welding material.
  • the provision of the solder material limiting layer on the soldering surface of the component may include: printing the solder resist material on the soldering surface of the component to form a grid-shaped solder material limiting layer.
  • the component produced by the method provided by the embodiment of the invention can limit the welding material by at least two regions formed by the solder resist material on the component, thereby improving the uniformity of the soldering distribution on the soldering surface, and avoiding the soldering surface between the soldering surfaces after soldering. A large area of voids is present to ensure the welding effect, thus ensuring the reliability of the product.
  • Example 5
  • Embodiments of the present invention provide a method of fabricating a circuit assembly including components and a printed circuit board, The method includes disposing a solder material for soldering between a solder face of the printed circuit board and a solder face of the component, the method further comprising:
  • solder material limiting layer between the soldering surface of the printed circuit board and the soldering surface of the component, the solder material limiting layer for limiting the solder material to at least two regions divided by the solder material limiting layer .
  • the provision of the solder material stop layer between the solder face of the printed circuit board and the solder face of the component may comprise placing a separate layer of solder material stop between the PCB and the solder face of the component.
  • the above settings can be set in a close manner.
  • Embodiments of the present invention provide a method of soldering a PCB and a component for soldering a printed circuit board having a corresponding soldering surface to a component, as shown in FIG. 10, including the following steps:
  • Step 101 a solder material limiting layer is disposed on a soldering area between the printed circuit board and the component, and the set soldering material limiting layer is matched with the printed circuit board and the soldering area of the component.
  • Step 102 disposing a splicing material on the splicing surface of the printed circuit board and the soldering area of the component, and limiting the flow of the soldering material by the soldering material limiting layer, and the printed circuit board and the component Solder by welding material.
  • the solder material limiting layer may be disposed in a close manner on the soldering surface of the soldering area of the printed circuit board, such as a printing method;
  • solder material limiting layer may be disposed in a close manner on the soldering surface of the soldering region of the component, such as a printed manner;
  • solder material stop layer acts as a separate layer that is placed between the printed circuit board and the soldered surface of the component during the soldering process.
  • solder material may be solder, but is not limited thereto.
  • the above solder material limiting layer may be a solder resist layer, but is not limited thereto.
  • the material of the above solder resist layer is a solder resist material, and the solder resist material may be green oil, but is not limited thereto.
  • solder material limiting layer is disposed on the soldering surface of the splicing area of the printed circuit board, and may include at least one of the following: soldering the solder resist material to the soldering area of the printed circuit board a solder resist layer having a mesh structure on the surface; or
  • a solder resist is printed on the soldering surface of the soldering region of the component to form a solder resist layer having a mesh structure.
  • This embodiment provides an apparatus which may include any one of the circuit components described in the above embodiments.
  • the apparatus may include, but is not limited to, a power amplifier, a transmitter or a base station.
  • the device may be a device for connecting a printed circuit board and a component, such as a communication device, a power amplifier device, etc., and particularly includes a component having a large welding surface (generally larger than 4 mm 2 ), or a printing area having a large welding surface. At least one of the boards.
  • the method in the embodiment of the present invention can be implemented by hardware, or can be implemented by means of software plus a necessary general hardware platform.
  • the technical solution of the present invention may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (which may be a CD-ROM, a USB flash drive, a mobile hard disk, etc.), including several The instructions are for causing a computer device (which may be a personal computer, server, or network device, etc.) to perform the methods described in various embodiments of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

提供一种印刷电路板、一种部件及一种电路组件。该印刷电路板（21），用于焊接部件，所述印刷电路板（21）的用于焊接所述部件的焊接面上设有焊接材料限位层（24），所述焊接材料限位层（24）用于将焊接所述部件所用的焊接材料限制在由所述焊接材料限位层（24）分割的至少两个区域中。通过在印刷电路板（21）的焊接面或部件的焊接面上设置焊接材料限位层（24）或者在印刷电路板（21）和部件的焊接面之间设置焊接材料限位层（24），可通过焊接材料限位层（24）实现焊接过程中控制焊锡的流动，提高焊接面焊锡分布的均匀度，从而避免焊接后焊接面之间出现大面积空洞，保证焊接效果，进而保证产品的可靠性。

Description

一种印刷电路板、 一种部件及一种电路组件 技术领域
本发明涉及电子技术领域， 尤其涉及一种印刷电路板、 一种部件及一种电路组件。 发明背景
印刷电路板 （PCB， Printed Circuit Board) 与部件 （包括焊接面的， 且可以用于 与 PCB (但并不限于 PCB)通过焊接相连的对象称为部件， 如金属基板， 元器件或多个元 器件组合成的器件等）焊接空洞对产品可靠性有较大影响， 传统焊接方式为印刷电路板 与部件焊接面直接进行烧结， 如图 1、 图 2所示的印刷电路板 1与功放管 3的散热金属基板 2焊接的结构（其中图 2给出的是印刷电路板 1及其焊接面 11的示意） 以及图 6的印刷电路 板 1与元器件 2焊接的结构示意中，均是将印刷电路板与所焊接部件两者的焊接面直接进 行烧结， 其存在的问题是： 使焊接后 PCB与部件焊接面之间出现大面积空洞， 影响产品 可靠性。 发明内容
本发明实施方式提供一种印刷电路板， 一种部件及一种电路组件， 可以解决焊接后 焊接面之间出现大面积空洞的问题， 可实现焊接过程控制焊接材料的流动， 提高焊接面 焊接材料分布的均匀度， 从而避免焊接面之间大面积空洞出现， 保证产品可靠性。
一种印刷电路板， 所述印刷电路板用于焊接部件， 所述印刷电路板的用于焊接所述 部件的焊接面上设有焊接材料限位层，所述焊接材料限位层用于将焊接所述部件所用的 焊接材料限制在由所述焊接材料限位层分割的至少两个区域中。
一种部件， 所述部件包括焊接面， 所述部件的焊接面上设有焊接材料限位层， 所述 焊接材料限位层用于将焊接所述部件所用的焊接材料限制在由所述焊接材料限位层分 割的至少两个区域中。
一种制作印刷电路板的方法， 所述印刷电路板用于焊接部件， 该方法包括： 在所述印刷电路板的用于焊接所述部件的焊接面上设置焊接材料限位层，所述焊接 材料限位层用于将焊接所述部件所用的焊接材料限制在由所述焊接材料限位层分割的 至少两个区域中。
一种制造部件的方法， 所述部件包括焊接面， 该方法包括： 在所述部件的焊接面上设置焊接材料限位层，所述焊接材料限位层用于将焊接所述 部件所用的焊接材料限制在由所述焊接材料限位层分割的至少两个区域中。
一种电路组件， 包括部件和印刷电路板， 在所述印刷电路板的焊接面和所述部件的 焊接面之间有用于焊接的焊接材料，
在所述印刷电路板的焊接面和所述部件的焊接面之间还设有焊接材料限位层，所述 焊接材料限位层用于将所述焊接材料限制在由所述焊接材料限位层分割的至少两个区 域中。
一种制造电路组件的方法， 所述电路组件包括部件和印刷电路板， 所述方法包括在 所述印刷电路板的焊接面和所述部件的焊接面之间设置用于焊接的焊接材料，该方法还 包括：
在所述印刷电路板的焊接面和所述部件的焊接面之间设置焊接材料限位层，所述焊 接材料限位层用于将所述焊接材料限制在由所述焊接材料限位层分割的至少两个区域 中。
由上述提供的技术方案可以看出， 本发明实施方式中通过在印刷电路板的焊接面 或部件的焊接面上设置焊接材料限位层或者在印刷电路板和部件的焊接面之间设置焊 接材料限位层， 可通过焊接材料限位层实现焊接过程中控制悍锡的流动， 提高焊接面焊 锡分布的均匀度， 从而避免悍接后焊接面之间出现大面积空洞， 保证焊接效果， 进而保 证产品的可靠性。 附图简要说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有 技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面描述中的附图仅仅是本 发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还 可以根据这些附图获得其他附图。
图 1为现有技术提供的印刷电路板与功放管的散热金属基板焊接的结构示意图； 图 2为现有技术提供的印刷电路板的焊接面的示意图；
图 3为本发明实施例 1提供的电路组件的示意图；
图 4为本发明实施例 1提供的 PCB的示意图；
图 5为本发明实施例 2提供的电路组件的示意图；
图 6为现有技术提供的印刷电路板与元器件焊接的结构示意图； 图 7为本发明实施例 2提供的元器件的示意图；
图 8为本发明实施例 1提供的电路组件的示意图；
图 9为本发明实施例 2提供的电路组件的示意图；
图 10为本发明实施例 6提供的焊接印刷电路板与部件方法的流程图。 实施本发明的方式
为便于理解， 下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进 行清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部 的实施例。基于本发明中的实施例， 本领域普通技术人员在没有做出创造性劳动前提下 所获得的所有其他实施例， 都属于本发明保护的范围。
实施例 1
本发明实施例提供一种电路组件，该电路组件包括部件 (22， 25)和印刷电路板（PCB， Printed Circuit Board) (21)， 在印刷电路板的焊接面和部件的焊接面之间有用于焊 接的焊接材料， 在印刷电路板的悍接面和部件的焊接面之间还设有焊接材料限位层 (24)，所述焊接材料限位层用于将所述焊接材料限制在由所述焊接材料限位层分割的至 少两个区域中。
其中， 部件为包括焊接面的对象， 其可以与 PCB (但并不限于 PCB)通过焊接相连， 其可以包括金属基板、 元器件或器件， 但并不限于此。
在 PCB的悍接面和部件的焊接面之间还设有焊接材料限位层，可以如图 3或图 8所示， 设置在 PCB的悍接面上， 也可以如图 5或图 9所示， 设置在部件的焊接面上， 还可以同时 设置在 PCB和部件的焊接面上，也可以作为单独的一层，设置在 PCB和部件的焊接面之间。
其中， 焊接材料限位层可以为阻焊层 (Solder Mask) , 其材料为阻悍材料， 该阻焊 材料可以为绿油。
其中， 焊接材料可以为悍锡， 也可以为其他可以流动的材料， 本发明实施例中并不 限于此。
其中， 焊接材料限位层的形状可以为网格状， 但并不限于此， 其可以是可以将焊接 材料限制在至少两个区域的形状。但为了进一步提高焊接材料分布的均匀度， 其形状可 以为均匀分割的网格状。
其中， 当焊接材料限位层设置在 PCB板和部件中的至少一个的悍接面上时， 该焊接 材料限位层可以以贴紧的方式进行设置， 比如， 以印刷的方式进行设置，但并不限于此。 以贴近的方式进行设置可以进一步保证焊接面之间焊接材料的连接，避免出现焊接断层 或者大面积空洞的问题。
本发明实施例提供的电路组件可以通过焊接面之间由阻焊材料构成的至少两个区 域对焊接材料进行限制， 从而提高焊接面焊锡分布的均匀度， 避免焊接后印刷电路板与 部件焊接面之间出现大面积空洞， 保证焊接效果， 进而保证产品的可靠性。
以下， 以部件为增强功放管 3散热性的金属基板， 焊接材料限位层设置在 PCB的焊接 面上且焊接材料为焊锡为例， 对以上电路组件进行进一步的阐述。
功放管 3从 PCB21的穿孔中穿过， 与用于增强功放管散热的金属基板 22进行相接， 金 属基板焊接在 PCB上。 PCB (印刷电路板） 21与所焊接的金属基板 22 (即部件） ， 两者具 有对应的焊接面， 金属基板 22作为功放管 3的功放散热金属部件， 金属基板 22焊接到 PCB 21上， 如图 3、 4所示， 该焊接的结构还包括： 在 PCB21的焊接面或金属基板的焊接面设 有焊锡限位层 24， 焊锡限位层 24与 PCB21的焊接面或金属基板 22的悍接面相匹配， 焊锡 限位层 3可釆用网格状结构， PCB1与金属基板 22焊接后， 网格状结构的焊锡限位层 24夹 在 PCB 21与金属基板 22之间， 通过网格状结构的焊锡限位层 24可在焊接过程中限制焊锡 的流动， 避免焊接后 PCB 21与金属基板 22之间焊锡分布不均匀形成大面积空洞， 从而保 证 PCB 21与金属基板 22之间的焊接效果。
焊锡限位层 24可贴紧设置在 PCB 21的焊接面上， 焊锡限位层 24可为由阻焊材料 印刷在 PCB 21的焊接面形成的网格状结构的阻焊层。这样相当于焊锡限位层 24与 PCB 21 焊接面复合为一体结构， 在 PCB 21焊接面与金属基板焊接时， 通过焊锡限位层 24限制 焊锡在 PCB 21焊接面与金属基板 22之间流动， 避免焊接后 PCB1与金属基板 22之间出 现大面积空洄， 从而有效保证了 PCB 21与金属基板 22之间的焊接效果。
以上在功放电路中 PCB的焊接面印刷网格状的阻焊层作为焊接材料限位层，通过压 紧工装，将 PCB与金属基板压紧并紧密接触，在加热环境下实现烧结，这样焊接后的 PCB 与金属基板焊接大面积空洞减少， 提升了功放电路中 PCB与金属基板之间的焊接效果。 其中， 在机械生产加工领域的 "工装"即生产过程工艺装备： 指制造过程中所用的各种 工具的总称。
图 4和图 8所示为部件为元器件 25的情况。除了部件为元器件 25与以上实施例中 部件为金属基板 22不同之外， 其他均可参考以上实施例中的描述。
进一步的， 本发明实施例还提供一种 PCB， 该 PCB用于焊接部件， 该 PCB的用于焊 接该部件的焊接面上设有焊接材料限位层，该焊接材料限位层用于将焊接该部件所用的 焊接材料限制在由该焊接材料限位层分割的至少两个区域中。该 PCB的具体特征可以参 考以上电路组件中所描述的 PCB。
本发明实施例还提供一种电路组件， 该电路组件包括以上 PCB。 实施例 2
本发明实施例提供一种电路组件， 仍以部件为增强功放管 3散热性的金属基板， 且 焊接材料为焊锡为例， 对以上电路组件进行进一步的阐述。 与实施例 1给出的例子基本 相同， 不同的是， 该焊锡限位层 24设置在金属基板 22的焊接面上（如图 5所示， 焊锡 限位层 24结构可参照图 4)。这种焊接的结构在 PCB 21的焊接面与金属基板 22悍接时， 通过焊锡限位层 24限制焊锡在 PCB 21焊接面与金属基板 22的焊接面之间流动， 避免 焊接后 PCB 21与金属基板 22之间出现大面积空洄， 从而有效保证了 PCB 21与金属基 板 22之间的焊接效果。 焊锡限位层 24可为由阻焊材料印刷在金属基板 22的焊接面形 成的网格状结构的阻焊层。
图 7和图 9所示为部件为元器件 25的情况。除了部件为元器件 25与以上实施例中 部件为金属基板 22不同之外， 其他均可参考以上实施例中的描述。
进一步的， 本发明实施例还提供一种部件， 该部件包括焊接面， 该焊接面可以用于 部件与 PCB (但并不限于 PCB) 的焊接。 该部件的焊接面上设有焊接材料限位层， 该焊 接材料限位层用于将焊接该部件所用的焊接材料限制在由该焊接材料限位层分割的至 少两个区域中。 该部件可以包括金属基板， 元器件或器件。 该部件的具体特征可以参考 以上电路组件中所描述的部件。
本发明实施例还提供一种电路组件， 该电路组件包括以上部件。 实施例 3
本发明实施例进一歩提供一种制作印刷电路板的方法， 该印刷电路板用于焊接部 件， 该方法包括：
在该印刷电路板的用于焊接该部件的焊接面上设置焊接材料限位层，该焊接材料限 位层用于将焊接该部件所用的焊接材料限制在由所述悍接材料限位层分割的至少两个 区域中。
该焊接材料可以为焊锡， 但并不限于此。
该焊接材料限位层可以为阻焊层，该阻焊层由阻焊材料构成，该阻焊材料可以为绿 油， 但并不限于此。
以上焊接材料限位层的可以为网格状， 也可以为其他包括至少两个分割区域的形 状。 进一步的， 还可以为均匀分割的网格状， 以进一步提高焊接材料分布的均匀度。
以上在印刷电路板与用于焊接部件所对应的焊接面上设置焊接材料限位层可以包 括：将阻焊材料印刷在印刷电路板的用于焊接所述部件的焊接面上形成网格状的焊接材 料限位层。
该制作 PCB的方法中的一些细节， 可以参考其他实施例中的一些描述。 通过本发明 实施例提供的方法制作出的 PCB，可以通过 PCB上由阻焊材料构成的至少两个区域对焊接 材料进行限制， 从而提高焊接面焊锡分布的均匀度， 避免焊接后 PCB与部件悍接面之间 出现大面积空洞， 保证焊接效果， 进而保证产品的可靠性。 实施例 4
本发明实施例进一步提供一种制造部件的方法， 该部件包括焊接面， 该焊接面可以 用于该部件与 PCB之间的焊接， 但并不限于与 PCB之间的焊接。 该方法包括：
在该部件的焊接面上设置焊接材料限位层，该焊接材料限位层用于将焊接该部件所 用的焊接材料限制在由所述焊接材料限位层分割的至少两个区域中。
该焊接材料可以为焊锡， 但并不限于此。
该焊接材料限位层可以为阻焊层，该阻焊层由阻焊材料构成，该阻焊材料可以为绿 油， 但并不限于此。
以上焊接材料限位层的可以为网格状， 也可以为其他包括至少两个分割区域的形 状。 进一步的， 还可以为均匀分割的网格状， 以进一步提高焊接材料分布的均匀度。
以上在部件的焊接面上设置焊接材料限位层可以包括：将阻焊材料印刷在部件的焊 接面上形成网格状的焊接材料限位层。
该制作部件的方法中的一些细节， 可以参考其他实施例中的一些描述。通过本发明 实施例提供的方法制作出的部件，可以通过部件上由阻焊材料构成的至少两个区域对焊 接材料进行限制， 从而提高焊接面焊锡分布的均匀度， 避免焊接后焊接面之间出现大面 积空洞， 保证焊接效果， 进而保证产品的可靠性。 实施例 5
本发明实施例提供一种制造电路组件的方法， 该电路组件包括部件和印刷电路板， 该方法包括在印刷电路板的焊接面和部件的焊接面之间设置用于焊接的焊接材料，该方 法还包括：
在印刷电路板的焊接面和部件的焊接面之间设置焊接材料限位层，焊接材料限位层 用于将所述焊接材料限制在由所述焊接材料限位层分割的至少两个区域中。
其中，在印刷电路板的焊接面和部件的焊接面之间设置焊接材料限位层可以包括将 单独的一层焊接材料限位层设置在 PCB和部件的焊接面之间。
其中， 以上设置可以为以贴紧的方式设置。
本方法中的一些细节， 可以参考其他实施例中的描述， 在此不予赘述。 实施例 6
本发明实施例提供一种焊接 PCB与部件的方法，用于将具有对应焊接面的印刷电路 板与部件焊接， 如图 10所示， 包括以下步骤：
步骤 101， 在所述印刷电路板与所述部件之间的焊接区域设置焊接材料限位层， 使 设置的所述焊接材料限位层与所述印刷电路板及所述部件的焊接区域相匹配；
步骤 102， 将悍接材料设置在所述印刷电路板及所述部件的焊接区域的悍接面上， 通过所述焊接材料限位层限制所述焊接材料流动，将所述印刷电路板与部件通过焊接材 料焊接。
上述焊接的方法中，焊接材料限位层可以以贴紧的方式设置在所述印刷电路板的焊 接区域的焊接面上， 如印刷的方式；
或者， 焊接材料限位层可以以贴紧的方式设置在所述部件的焊接区域的焊接面上， 如印刷的方式；
或者， 焊接材料限位层作为独立的一层， 在焊接过程中设置在印刷电路板和部件的 焊接面之间。
以上焊接材料可以为焊锡， 但并不限于此。
以上焊接材料限位层可以为阻焊层， 但不限于此。
以上阻焊层的材料为阻焊材料， 该阻焊材料可以为绿油， 但不限于此。
其中， 将焊接材料限位层设置在所述印刷电路板的悍接区域的焊接面上， 可以包括 以下方式中的至少一种：将阻焊材料印刷在所述印刷电路板的焊接区域的焊接面上形成 网格状结构的阻焊层； 或者
将阻焊材料印刷印刷在所述部件的焊接区域的焊接面上形成网格状结构的阻焊层。 本发明实施例中提供的方法中的一些细节， 可以参考其他实施例中的描述。 实施例 7
本实施例提供一种装置， 该装置可以包括以上实施例中所描述的任意一种电路组 件。 该装置可以包括功率放大器， 发信机或基站， 但并不限于此。
该装置可以是通信设备、功放设备等需要用到印刷电路板与部件悍接的装置， 特别 包括焊接面的面积较大 （一般大于 4平方毫米） 的部件， 或焊接面的面积较大的印刷电 路板中的至少一个。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到本发明实施例中 的方法可以通过硬件实现， 也可以借助软件加必要的通用硬件平台的方式来实现。基于 这样的理解， 本发明的技术方案可以以软件产品的形式体现出来， 该软件产品可以存储 在一个非易失性存储介质 （可以是 CD-ROM, U盘， 移动硬盘等） 中， 包括若干指令用以 使得一台计算机设备（可以是个人计算机， 服务器， 或者网络设备等）执行本发明各个 实施例所述的方法。 以上所述， 仅为本发明较佳的具体实施方式， 但本发明的保护范围并不局限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可轻易想到的变化或替 换， 都应涵盖在本发明的保护范围之内。 因此， 本发明的保护范围应该以权利要求的保 护范围为准。

Claims

权利要求
1、 一种印刷电路板， 所述印刷电路板用于焊接部件， 其特征在于， 所述印刷电路 板的用于焊接所述部件的焊接面上设有焊接材料限位层，所述焊接材料限位层用于将焊 接所述部件所用的焊接材料限制在由所述焊接材料限位层分割的至少两个区域中。
2、根据权利要求 1所述的印刷电路板， 其特征在于， 所述焊接材料限位层的材料为 阻焊材料。
3、 根据权利要求 2所述的印刷电路板， 其特征在于， 所述阻焊材料为绿油。
4、 根据权利要求 1至 3中任意一项所述的印刷电路板， 其特征在于， 所述焊接材料 限位层的形状为网格状。
5、 根据权利要求 1至 4中任意一项所述的印刷电路板， 其特征在于， 所述焊接材料 限位层以贴紧的方式设置在所述印刷电路板上。
6、 根据权利要求 1至 5中任意一项所述的印刷电路板， 其特征在于， 所述部件包括 金属基板， 元器件或器件。
7、 根据权利要求 1至 6中任意一项所述的印刷电路板， 其特征在于， 所述焊接材料 为焊锡。
8、 一种部件， 所述部件包括焊接面， 其特征在于， 所述部件的焊接面上设有焊接 材料限位层，所述焊接材料限位层用于将焊接所述部件所用的焊接材料限制在由所述焊 接材料限位层分割的至少两个区域中。
9、根据权利要求 8所述的部件， 其特征在于， 所述焊接材料限位层的材料为阻焊材 料。
10、 根据权利要求 9所述的部件， 其特征在于， 所述阻焊材料为绿油。
11、 根据权利要求 8至 10任意一项所述的部件， 其特征在于， 所述焊接材料限位层 的形状为网格状。
12、 根据权利要求 8至 11中任意一项所述的部件， 其特征在于， 所述焊接材料限位 层以贴紧的方式设置在所述部件上。
13、 根据权利要求 8至 12中任意一项所述的部件， 其特征在于， 所述部件包括金属 基板， 元器件或器件。
14、 根据权利要求 8至 13中任意一项所述的部件， 其特征在于， 所述焊接材料为焊 锡。
15、 一种电路组件， 其特征在于， 包括如权利要求 1至 7中任意一项所述的印刷电路 板和如权利要求 8至 14中任意一项所述的部件中的至少一个。
16、 一种装置， 其特征在于， 包括如权利要求 15所述的电路组件。
17、 根据权利要求 16所述的装置， 其特征在于， 所述装置包括功率放大器， 发信机 或基站。
18、 一种制作印刷电路板的方法， 所述印刷电路板用于焊接部件， 其特征在于， 该 方法包括：
在所述印刷电路板的用于焊接所述部件的焊接面上设置焊接材料限位层，所述焊接 材料限位层用于将焊接所述部件所用的焊接材料限制在由所述焊接材料限位层分割的 至少两个区域中。
19、 根据权利要求 18所述的方法， 其特征在于， 所述焊接材料限位层的材料为阻焊 材料。
20、 根据权利要求 19所述的方法， 其特征在于， 所述在所述印刷电路板的用于焊接 所述部件的焊接面上设置焊接材料限位层包括：将所述阻焊材料印刷在所述印刷电路板 的用于焊接所述部件的焊接面上形成网格状的焊接材料限位层。
21、 一种制造部件的方法， 所述部件包括焊接面， 其特征在于， 包括： 在所述部件的焊接面上设置焊接材料限位层，所述焊接材料限位层用于将焊接所述 部件所用的焊接材料限制在由所述焊接材料限位层分割的至少两个区域中。
22、 根据权利要求 21所述的方法， 其特征在于， 所述焊接材料限位层的材料为阻焊 材料。
23、 根据权利要求 22所述的方法， 其特征在于， 所述在所述部件的焊接面上设置焊 接材料限位层包括：将所述阻焊材料印刷在所述部件的焊接面上形成网格状的焊接材料 限位层。
24、 一种电路组件， 包括部件和印刷电路板， 在所述印刷电路板的焊接面和所述部 件的焊接面之间有用于焊接的焊接材料， 其特征在于，
在所述印刷电路板的焊接面和所述部件的焊接面之间还设有焊接材料限位层，所述 焊接材料限位层用于将所述焊接材料限制在由所述焊接材料限位层分割的至少两个区 域中。
25、 一种制造电路组件的方法， 所述电路组件包括部件和印刷电路板， 所述方法包 括在所述印刷电路板的焊接面和所述部件的焊接面之间设置用于焊接的焊接材料，其特 征在于， 该方法还包括： 在所述印刷电路板的焊接面和所述部件的焊接面之间设置焊接材料限位层，所述焊 接材料限位层用于将所述焊接材料限制在由所述焊接材料限位层分割的至少两个区域 中。
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