WO2016121669A1 - 電子回路基板およびその製造方法 - Google Patents
電子回路基板およびその製造方法 Download PDFInfo
- Publication number
- WO2016121669A1 WO2016121669A1 PCT/JP2016/051961 JP2016051961W WO2016121669A1 WO 2016121669 A1 WO2016121669 A1 WO 2016121669A1 JP 2016051961 W JP2016051961 W JP 2016051961W WO 2016121669 A1 WO2016121669 A1 WO 2016121669A1
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- WIPO (PCT)
- Prior art keywords
- electronic circuit
- ink
- circuit board
- resin
- receiving layer
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Definitions
- the present invention has been made in view of such circumstances, and a highly reliable electronic circuit board capable of reliably maintaining the electrical continuity of an electronic circuit even in fabrication at room temperature and atmospheric pressure, and the electronic circuit
- An object of the present invention is to provide an electronic circuit board manufacturing method capable of stably and efficiently manufacturing a board.
- the present invention provides an electronic circuit board comprising an ink receiving layer formed from a resin composition containing polyvinyl acetal resin as a main component, and a patterned electronic circuit formed from a conductive ink. This is the first gist.
- the present inventors used a commercially available inkjet paper (photographic glossy paper, etc.) as a base material (circuit support) to form an electronic circuit (conductive ink layer) made of conductive ink by printing or transfer. Or, research was conducted focusing on variations in the electrical conductivity of electronic circuits that occur when used as carriers (supports for transportation, which will be peeled off later).
- the above-mentioned commercially available inkjet paper or the like has a receiving layer (ink receiving layer) that absorbs and accepts the solvent of the printed pigment ink or dye ink so as to help color and fix the ink.
- a resin film for example, polyethylene terephthalate (for example, polyethylene terephthalate) that does not contain the above-described cationic substance (cationic component), has suitable physical properties as a printing substrate (carrier), and is frequently used as a substrate.
- a resin for coating having a high affinity with PET and the like was examined. As a result, among many candidates, it was found that “polyvinyl acetal resin” was most suitable as a resin used for the receiving layer by repeating experiments and trial productions, and the present invention was achieved.
- the “resin composition comprising a polyvinyl acetal resin as a main component” means a polyvinyl acetoacetal (PVAA) resin, a polyvinyl formal (PVF) resin produced by reacting various alcohols with polyvinyl alcohol (PVA),
- the main component is “polyvinyl acetal resin”, which is a general term for polyvinyl butyral (PVB) resin. In the case of the present invention, it is formed in a “layer” shape or a “film” shape on the surface of a substrate or carrier.
- the main component refers to a component that occupies a majority of the entire resin contained, and includes the case where the whole is composed of only the main component.
- An electronic circuit board includes an ink receiving layer formed from a resin composition containing as a main component a polyvinyl acetal resin not containing a cationic component as described above, and a patterned electronic circuit formed from a conductive ink. And.
- the electronic circuit board of the present invention can be an electronic circuit board in which the occurrence of a portion that does not conduct to the electronic circuit portion (that is, a defect such as disconnection) is suppressed and the performance can be maintained over a long period of time.
- the electronic circuit board of the present invention preferably employs a composition containing metal nanoparticles, an organic ⁇ -conjugated ligand, and a solvent, among the nano ink compositions.
- a composition containing metal nanoparticles, an organic ⁇ -conjugated ligand, and a solvent among the nano ink compositions.
- the polyvinyl acetal resins partially benzalated polyvinyl alcohol (a kind of polyvinyl acetoacetal resin) is preferably employed.
- the method for producing an electronic circuit board of the present invention comprises a step of applying a liquid resin composition mainly comprising a polyvinyl acetal resin containing no cationic component in a layered manner, and heating and drying the liquid resin composition.
- the conductive ink is a nano ink composition containing metal particles, and the nano ink composition is dried after the step of forming the electronic circuit.
- the base material is accompanied by irreversible temperature distortion and excessive thermal expansion and contraction.
- a high-quality electronic circuit having no variation in performance such as electrical conductivity can be accurately and stably formed on the surface of the ink receiving layer in a required temperature pattern.
- the electronic circuit board manufacturing method of the present invention does not require a large-scale apparatus such as a vacuum apparatus or an oven for heating and firing in the process, and therefore can be manufactured with a small initial investment and a low running cost. Has the advantage.
- the electronic circuit board manufacturing method of the present invention is not limited to the case where the conductive ink having the required pattern is printed or transferred only once, but is divided into the same region on the substrate in a plurality of times (several times). This includes the case of repeating). In that case, whether to perform drying (fixation) for each printing / transfer or whether to dry (fix) the conductive ink for multiple printings / transfers at once depends on the basis after printing / transfer. It is determined appropriately according to the surface state of the material.
- the ink receiving layer R is obtained by applying a liquid resin composition in which a polyvinyl acetal resin is dispersed in an aqueous (mixed) solvent onto one surface of the substrate B, the carrier F, and the like, and then drying. Yes, the ink receiving layer R is formed in a layered form (or film form) having a predetermined thickness.
- a method for applying the liquid resin composition any coating method can be used as long as it is a coating method capable of obtaining a uniform coating thickness, such as bar coating or spin coating.
- SREC registered trademark
- BL-1, BL-2, BL-5, BL-10, BM-1, BH-1, BX-1, KS-1, KS-3 , KX-1, KX-5, KW-1, KW-3, KW-10 above, manufactured by Sekisui Chemical Co., Ltd.
- Mobital registered trademark
- polyvinyl alcohol polyvinyl acetoacetal
- SREC registered trademark
- the resin (subcomponent) other than the polyvinyl acetal resin constituting the ink receiving layer R resin composition
- a polyester not containing a cationic substance (cationic component)
- Resins such as PE polyvinyl alcohol
- acrylic acrylic
- the addition amount of resin other than polyvinyl acetal resin as a subcomponent is 50 weight% or less with respect to the whole resin.
- the resin composition containing the polyvinyl acetal resin as a main component usually has a resin content (solid content) of 5 to 20 wt% with respect to the resin + solvent in a liquid state before coating, and has a viscosity of 100 to 10000 mPa ⁇ s.
- the ink receiving layer R is formed by applying a temperature of about 80 to 120 ° C. to the applied liquid resin composition for about 1 to 10 minutes, whereby the solvent is evaporated and a cationic substance (cationic component) is obtained.
- the ink receiving layer R becomes a layer (solid phase) made of only a resin not containing).
- the electronic circuit C is formed by applying a conductive ink containing metal particles or the like on one surface of the ink receiving layer R in a required circuit pattern (plan view) using a method such as printing or transfer. It is dried and has a layer shape (or a film shape) having a predetermined thickness.
- a method of providing the electronic circuit C in addition to inkjet printing, letterpress printing such as letterpress printing and flexographic printing, intaglio printing such as gravure printing, lithographic printing such as offset printing and gravure offset printing, and stencil such as screen printing Either printing or handwritten circuit pattern drawing can be used.
- Examples of the conductive ink constituting the electronic circuit C include those composed mainly of metal nanoparticles, a binder, and water (low-temperature firing type aqueous conductive ink), and conductive ink that does not need to be fired (metal nanoparticle).
- Nano-ink composition containing particles: see Patent Document 1) and the like can be used.
- the binder of the water-based conductive ink examples include those composed of hydrophilic resins such as acrylic, vinyl acetate, and polyvinyl alcohol, and silver particles (protective colloid). And an organic complex compound in which amine-based molecules are coordinated.
- the binder and the silver particles are uniformly dispersed using water as a medium (dispersion solvent), and the viscosity is adjusted to 0.5 to 1000 mPa ⁇ s. ing.
- Various additives such as a plasticizer, a lubricant, a dispersant, a leveling agent, an antifoaming agent, and an antioxidant are added to the aqueous conductive ink as necessary.
- the metal used for the metal nanoparticles any one of gold, silver, copper, platinum, palladium, nickel, ruthenium, indium and rhodium, or a mixture of two or more metals is used.
- the content of the metal nanoparticles in the nano ink composition is preferably 0.1 to 20 wt%, more preferably 0.5 to 10 wt%.
- Examples of the organic ⁇ -conjugated ligand constituting the nano ink composition include amino group, mercapto group, hydroxyl group, carboxyl group, phosphine group, phosphonic acid group, halogen group, selenol group, sulfide group, seleno group, and the like.
- ether groups substituted with one or more of ether groups (substituents coordinated to the surface of metal nanoparticles), or amino groups, alkylamino groups, amide groups, imide groups, phosphonic acid groups, sulfonic acid groups , A cyano group, a nitro group (substituent which makes the metal nanoparticles soluble in a water-containing solvent and an alcohol solvent), and those having one or more substituents thereof.
- examples of a preferable solvent constituting the nano ink composition include water or a water mixed solvent, alcohol or an alcohol mixed solvent, and the like.
- examples of components other than water include alcohols, ethers, esters, ketones, amides and the like, preferably alcohols, more preferably alcohols having 1 to 10 carbon atoms.
- these solvents methanol, ethanol, 2-ethoxyethanol, ethylene glycol, and propylene glycol can be used as particularly preferable solvents.
- the suitable viscosity of the nano ink composition is about 0.001 to 5 Pa ⁇ s, more preferably 0.01 to 4 Pa ⁇ s.
- nano silver colloidal ink (trade name: Dry Cure, manufactured by Colloidal Ink) is used in consideration of cost, ease of handling (storage), storage stability, and the like. Are preferably employed.
- the electronic circuit C is formed by printing the conductive ink (low-temperature firing type aqueous conductive ink or nano ink composition that does not need to be fired) by ink jet printing or transfer using a flexographic plate. After applying as a conductive ink layer (liquid phase) having a predetermined circuit pattern on the receiving layer R, it is heated and dried to form an electrically conductive state between the electronic circuits (wiring).
- conductive ink low-temperature firing type aqueous conductive ink or nano ink composition that does not need to be fired
- a film made of polyethylene terephthalate (PET) resin is preferably used, and in particular, a film made of PET resin whose surface is subjected to corona discharge treatment is preferably used. Used.
- PET polyethylene terephthalate
- the manufacturing method of the electronic circuit board 1 of 1st Embodiment is as follows. First, the base material B which consists of a polyethylene terephthalate (PET) resin is mounted on a flat surface, and a polyvinyl acetal resin is shown in FIG. A liquid resin composition containing as a main component is applied to a predetermined thickness using a bar coater or the like, and a layer (film) made of the liquid resin composition is formed on the substrate B. Next, the layer made of the liquid resin composition is heated to evaporate the solvent contained in the liquid resin composition, thereby preparing the ink receiving layer R made of the resin composition (solid phase). The thickness of the prepared ink receiving layer R (resin composition layer) is usually set in the range of 0.1 to 30 ⁇ m, preferably in the range of 1 to 10 ⁇ m.
- PET polyethylene terephthalate
- the base material B on which the ink receiving layer R is formed is set in a flexographic printing machine, and a predetermined nano ink composition (nano silver colloidal ink, trade name: dry cure, colloidal Ink Co.) is prepared.
- a predetermined nano ink composition nano silver colloidal ink, trade name: dry cure, colloidal Ink Co.
- the periphery of the flexographic printing machine is used by using a humidifier, an air conditioner, or the like before the start of production. It is desirable to adjust to a humidified atmosphere.
- the conductive ink layer (electronic circuit C) made of the nano silver colloidal ink is formed on the surface of the ink receiving layer B accurately and in accordance with the required pattern. It can be formed efficiently.
- the same effects as in the first embodiment can be obtained. Since the electronic circuit boards 3 and 4 of the third and fourth embodiments do not have a shape support member that can replace the base material B, the base material B is transported and supported as in the second embodiment. Cannot be used as carrier F, and base material B cannot be peeled from the electronic circuit board.
- [Nano ink composition] (Nano silver colloidal ink) Silver nano ink DryCure (Dry Cure) Ag-J made by Colloidal Inc.
- the following polymers were used as the resin composition for forming the ink receiving layer.
- the polymer B is used in Example 2 described later.
- ⁇ Polymer A> Polyvinyl acetal (water / isopropanol solution of partially benzalized polyvinyl alcohol) (Sekisui Chemical Co., Ltd., butyral resin ESREC (registered trademark) KX-5, resin solid content: 8 ⁇ 2 wt%, viscosity: 3000 ⁇ 1500 mPa ⁇ s)
- An electronic circuit board (for testing) was prepared using a resin composition for forming an ink receiving layer, such as carboxy-modified acrylic resin, polyacrylamide resin, urethane resin, ester urethane resin, etc.
- the conductive ink layer (electronic circuit) formed on the receiving layer did not show electrical continuity.
- Example 2 (Polymer B), Examples 3 and 4 (Polymer B + X), and Examples 5 and 6
- the other resin to be added is polymer X or polymer Y. In either case, there was no problem in the expression of electrical conductivity of the conductive ink layer (electronic circuit).
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- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
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Abstract
Description
[基材]
PETフィルム 厚さ:100μm, 片面に易接着用のコロナ処理〔東洋紡社製,高透明ポリエステルフィルム,コスモシャイン(登録商標),品番:A4100〕
コロイダル・インク社製 銀ナノインク DryCure(ドライキュア) Ag-J
成分:銀粒子-粒径1~100nm(平均粒径:15nm),有機π共役系配位子,水を主成分とする溶媒
固形分:5~20wt%
粘度:1~2000mPa・s
〈ポリマーA〉(主成分)
ポリビニルアセタール(部分ベンザール化ポリビニルアルコールの水/イソプロパノール溶液)〔積水化学工業社製,ブチラール樹脂 エスレック(登録商標)KX-5,樹脂固形分:8±2wt%,粘度:3000±1500mPa・s〕
〈ポリマーB〉(主成分)
ポリビニルアセタール(部分ベンザール化ポリビニルアルコールの水/イソプロパノール溶液)〔積水化学工業社製,ブチラール樹脂 エスレック(登録商標)KX-1,樹脂固形分:8±2wt%,粘度:10000±6000mPa・s〕
ポリエステル系樹脂(水分散体)〔高松油脂社製,ペスレジン A-640,樹脂固形分:25wt%,粘度:50mPa・s以下〕
〈ポリマーY〉(副成分)
ポリビニルアルコール系樹脂(水溶液)〔ケン化度:88mol%,粘度:5mPa・s〕
上記基材(PETフィルム)を平坦な場所に載置した後、バーコーターで液状の各樹脂組成物を塗布した。その後、樹脂組成物からなる層を、基材ごと100℃のオーブン中で2分間加熱して乾燥させ、ポリマーA(実施例1),ポリマーX(参考例1),ポリマーY(参考例2)のみからなるインク受容層(膜厚8μm)を作製した。
得られたインク受容層の上に、バーコーターを用いて、上記ナノインク組成物(ナノ銀コロイダルインク)を、幅5mm,長さ100mm以上の帯状に塗布し、基材ごと40℃のオーブン中で20分間加熱して乾燥させ、実施例1,参考例1,参考例2の電子回路基板を得た。なお、樹脂組成物を塗布せず、基材の上に直接、ナノ銀コロイダルインクを同じ条件で塗布して乾燥させた電子回路基板を「参考例3」としている。すなわち、参考例3は、インク受容層を有していない。
テスター(カスタム社製デジタルテスター)を用いて、その両プローブを、上記帯状(長さ100mm以上)の長さ方向に10mmの間隔を空けて接触させ、各電子回路基板の電気抵抗値(Ω/cm)を測定した。なお、電気抵抗値はばらつきが大きいため、測定は長さ方向に位置を変えて複数回行い、測定された電気抵抗値のうちの最大値を、その電子回路基板の電気抵抗値とした。結果を「表1」に示す。
つぎに、上記ポリビニルアセタール樹脂(主成分)に他の樹脂(副成分)を混合した系を、インク受容層形成用の樹脂組成物として用いた実施例について説明する。
前記実施例1と同様、基材(PETフィルム)を平坦な場所に載置した後、バーコーターで、調製した液状の各樹脂組成物を塗布した。その後、樹脂組成物からなる層を、基材ごと100℃のオーブン中で2分間加熱して乾燥させ、実施例2(ポリマーB),実施例3,4(ポリマーB+X),実施例5,6(ポリマーB+Y)と、比較例1,2(ポリマーB+X),比較例3(ポリマーB+Y)で使用するインク受容層(膜厚8μm)を作製した。
使用したインク受容層が異なること以外、前記実施例1と同様にして、実施例2~6および比較例1~3の電子回路基板(電子回路の厚み:3μm)を作製した。
[ナノインク組成物](ナノ銀コロイダルインク)
コロイダル・インク社製 銀ナノインク DryCure(ドライキュア)B
成分:銀粒子-粒径1~100nm(平均粒径:15nm),有機π共役系配位子,水を主成分とする溶媒
固形分:20wt%, 粘度:152mPa・s
〔フレキソ印刷機〕
コムラテック社製 Smart Labo-III(登録商標)
〔フレキソ印刷版〕
コムラテック社製 ポリエステル系ゴム製樹脂凸版 タイプ:T-YP400V
版厚さ-2.84mm 600線/inch
硬度:40~70度(ショアA硬度)
印刷用インク保持部のインク保持量:4ml/m2(調整幅:1~5ml/m2)
なお、印刷版表面には、幅1mmの電子回路パターンのインク保持部が形成されている。
〔アニロックスロール〕
200線/inch(100~600線/inch)
セル容量(セル容積):8ml/m2(調整幅:1.5~50ml/m2)
・印刷速度(印刷ステージ移動量):18m/分
・アニロックスロール速度:25m/分(周速)
・アニロックスロール-印刷版間 ニップ幅:8mm(調整幅:4~8mm)
・印刷版-基材間 ニップ幅:10mm(調整幅:8~12mm)
・印刷チャンバーの環境(雰囲気)
温度:15~30℃ 湿度:40~70%RH
なお、印刷(転写)は、電子回路の厚み(膜厚)を確保するために、同じ位置(パターン)に3回重ねて行った。
風乾:温度23℃(大気圧下自然乾燥):30秒~60分
なお、温風を吹き付けて導電性インク層(ナノインク組成物)の乾燥を促進させる場合は、温風の温度および基材の温度が70℃以下で維持されるように調整した。
電子回路の配線パターンの中央付近で、テスター(カスタム社製デジタルテスター)を用いて、形成された幅1mmの電子回路(配線)の2点間(距離:10mm)の電気抵抗値(Ω)を測定した。結果は、導電性インク層(電子回路)の厚みは2μmで、電気抵抗値は15Ωであった。
上記「電気抵抗値」試験で電気導通性があると確認された電子回路基板を使用して、その電子回路(配線)の所定位置(バンプ等)に、導電ペースト(銀銅導電塗料、プラスコート社製、PTP-1202G、銀コート銅+1液型ポリエステル樹脂バインダ、常温乾燥常温硬化 有機溶剤型)を用いて、IC,LED等の電子部品を実装し、電源を接続した。結果は、上記LEDの所定パターンでの点滅が視認され、電子回路として機能していることが確認された。
R インク受容層
Claims (8)
- ポリビニルアセタール樹脂を主成分とする樹脂組成物から形成されたインク受容層と、導電性インクからなるパターン形成された電子回路とを備えることを特徴とする電子回路基板。
- 上記導電性インクが、金属粒子を含有するナノインク組成物である請求項1記載の電子回路基板。
- 上記ナノインク組成物が、金属ナノ粒子と、有機π共役系配位子と、溶媒とを含む組成物である請求項2記載の電子回路基板。
- 上記ポリビニルアセタール樹脂が、部分ベンザール化ポリビニルアルコールである請求項1~3のいずれか一項に記載の電子回路基板。
- ポリビニルアセタール樹脂を主成分とする液状の樹脂組成物を層状に塗布する工程と、上記液状の樹脂組成物を加熱乾燥させてインク受容層とする工程と、印刷または転写により導電性インクからなる電子回路を所定の回路パターンに形成する工程と、を備えることを特徴とする電子回路基板の製造方法。
- 上記導電性インクが、金属粒子を含有するナノインク組成物であり、上記電子回路を形成する工程の後に、上記ナノインク組成物を乾燥させて固定化する工程を備える請求項5記載の電子回路基板の製造方法。
- 上記ナノインク組成物が、金属ナノ粒子と、有機π共役系配位子と、溶媒とを含む組成物である請求項6記載の電子回路基板の製造方法。
- 上記ポリビニルアセタール樹脂が、部分ベンザール化ポリビニルアルコールである請求項5~7のいずれか一項に記載の電子回路基板の製造方法。
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KR1020177017166A KR20170107973A (ko) | 2015-01-27 | 2016-01-25 | 전자회로기판 및 그 제조 방법 |
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CN116200160A (zh) * | 2022-11-16 | 2023-06-02 | 深圳市励高表面处理材料有限公司 | 一种非微蚀型有机铜面键合剂及其制备方法 |
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CN110754140A (zh) * | 2017-06-23 | 2020-02-04 | 富士胶片株式会社 | 配线基板的制造方法及导电性墨液 |
CN109219237A (zh) * | 2017-07-03 | 2019-01-15 | 张文耀 | 以硅胶板材为基板的电路板及其制造方法 |
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US20180001683A1 (en) | 2018-01-04 |
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TWI674827B (zh) | 2019-10-11 |
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