WO2016113924A1 - 半導体積層体 - Google Patents
半導体積層体 Download PDFInfo
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- WO2016113924A1 WO2016113924A1 PCT/JP2015/067999 JP2015067999W WO2016113924A1 WO 2016113924 A1 WO2016113924 A1 WO 2016113924A1 JP 2015067999 W JP2015067999 W JP 2015067999W WO 2016113924 A1 WO2016113924 A1 WO 2016113924A1
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- main surface
- silicon carbide
- carbide substrate
- semiconductor
- stacked body
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 74
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000012535 impurity Substances 0.000 claims description 19
- 239000000969 carrier Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 17
- 235000019592 roughness Nutrition 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 238000005259 measurement Methods 0.000 description 13
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000006698 induction Effects 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
- H01L21/0243—Surface structure
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/20—Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
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- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
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- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
次に、本開示にかかる半導体積層体の一実施の形態を、以下に図面を参照しつつ説明する。なお、以下の図面において同一または相当する部分には同一の参照番号を付しその説明は繰返さない場合がある。
図2を参照して、本実施の形態における半導体積層体1の製造方法においては、まず工程(S10)として基板準備工程が実施される。工程(S10)では、たとえば所望の濃度でn型不純物を含む4H-SiCからなるインゴットがスライスされることにより、円盤状の形状を有する炭化珪素基板10が準備される。炭化珪素基板10の直径は、たとえば100mmである。炭化珪素基板10の厚みは、たとえば300μmである。
10 炭化珪素基板
10A 第1の主面
10B 第2の主面
20 エピ層
20A 第2の主面
20B 第1の主面
50 CVD装置
51 保護管
52 断熱材
53 発熱体
53A 凹部
54 誘導加熱コイル
60 ホルダ
60A 外周面
61 ベース部
61A 第1の主面
62 傾斜部
62A 傾斜面
63 スリット
63A 底面
Claims (7)
- 第1の主面と、前記第1の主面と反対側の主面である第2の主面とを有する炭化珪素基板と、
前記第1の主面上に設けられた炭化珪素からなるエピ層と、を備え、
前記第2の主面の粗さの、平均値はRaで0.1μm以上1μm以下であり、標準偏差は前記平均値の25%以下である、
半導体積層体。 - 前記第1の主面を上にしたときのbowが0μmを超え10μm以下である、請求項1に記載の半導体積層体。
- 直径が75mm以上である、請求項1または2に記載の半導体積層体。
- 直径が100mm以上である、請求項1または2に記載の半導体積層体。
- 直径が150mm以上である、請求項1または2に記載の半導体積層体。
- 直径が200mm以上である、請求項1または2に記載の半導体積層体。
- 前記炭化珪素基板および前記炭化珪素エピ層のそれぞれは多数キャリアを生成させる不純物を含み、
前記炭化珪素基板における前記不純物の濃度は、前記エピ層における前記不純物の濃度より高い、請求項1から6のいずれか一項に記載の半導体積層体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580072769.7A CN107112214A (zh) | 2015-01-13 | 2015-06-23 | 半导体层叠体 |
JP2015556331A JPWO2016113924A1 (ja) | 2015-01-13 | 2015-06-23 | 半導体積層体 |
DE112015005934.2T DE112015005934T5 (de) | 2015-01-13 | 2015-06-23 | Halbleiterlaminat |
US15/542,821 US20180005816A1 (en) | 2015-01-13 | 2015-06-23 | Semiconductor laminate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015004423 | 2015-01-13 | ||
JP2015-004423 | 2015-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016113924A1 true WO2016113924A1 (ja) | 2016-07-21 |
Family
ID=56405483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/067999 WO2016113924A1 (ja) | 2015-01-13 | 2015-06-23 | 半導体積層体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180005816A1 (ja) |
JP (1) | JPWO2016113924A1 (ja) |
CN (1) | CN107112214A (ja) |
DE (1) | DE112015005934T5 (ja) |
WO (1) | WO2016113924A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018026503A (ja) * | 2016-08-12 | 2018-02-15 | 株式会社Sumco | サセプタ、エピタキシャル成長装置、及びエピタキシャルウェーハの製造方法 |
JP2018060929A (ja) * | 2016-10-06 | 2018-04-12 | クアーズテック株式会社 | サセプタ |
JP2019151543A (ja) * | 2018-03-02 | 2019-09-12 | 国立研究開発法人産業技術総合研究所 | 炭化珪素エピタキシャルウェハ及びその製造方法 |
WO2020158656A1 (ja) * | 2019-02-01 | 2020-08-06 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
JP7435880B2 (ja) | 2023-03-09 | 2024-02-21 | 株式会社レゾナック | n型SiC単結晶基板及びSiCエピタキシャルウェハ |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017175799A1 (ja) * | 2016-04-05 | 2017-10-12 | 株式会社サイコックス | 多結晶SiC基板およびその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008135611A (ja) * | 2006-11-29 | 2008-06-12 | Denso Corp | 半導体装置の製造方法 |
JP2012204487A (ja) * | 2011-03-24 | 2012-10-22 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8436366B2 (en) * | 2009-04-15 | 2013-05-07 | Sumitomo Electric Industries, Ltd. | Substrate composed of silicon carbide with thin film, semiconductor device, and method of manufacturing a semiconductor device |
CN103534810B (zh) * | 2011-05-18 | 2017-05-17 | 罗姆股份有限公司 | 半导体装置及其制造方法 |
DE112012003260T5 (de) * | 2011-08-05 | 2014-05-15 | Sumitomo Electric Industries, Ltd. | Substrat, Halbleitervorrichtung und Verfahren zur Herstellung derselben |
JP2014210690A (ja) * | 2013-04-22 | 2014-11-13 | 住友電気工業株式会社 | 炭化珪素基板の製造方法 |
-
2015
- 2015-06-23 US US15/542,821 patent/US20180005816A1/en not_active Abandoned
- 2015-06-23 JP JP2015556331A patent/JPWO2016113924A1/ja not_active Withdrawn
- 2015-06-23 CN CN201580072769.7A patent/CN107112214A/zh active Pending
- 2015-06-23 DE DE112015005934.2T patent/DE112015005934T5/de not_active Withdrawn
- 2015-06-23 WO PCT/JP2015/067999 patent/WO2016113924A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008135611A (ja) * | 2006-11-29 | 2008-06-12 | Denso Corp | 半導体装置の製造方法 |
JP2012204487A (ja) * | 2011-03-24 | 2012-10-22 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018026503A (ja) * | 2016-08-12 | 2018-02-15 | 株式会社Sumco | サセプタ、エピタキシャル成長装置、及びエピタキシャルウェーハの製造方法 |
JP2018060929A (ja) * | 2016-10-06 | 2018-04-12 | クアーズテック株式会社 | サセプタ |
JP2019151543A (ja) * | 2018-03-02 | 2019-09-12 | 国立研究開発法人産業技術総合研究所 | 炭化珪素エピタキシャルウェハ及びその製造方法 |
JP7426642B2 (ja) | 2018-03-02 | 2024-02-02 | 国立研究開発法人産業技術総合研究所 | 炭化珪素エピタキシャルウェハの製造方法 |
WO2020158656A1 (ja) * | 2019-02-01 | 2020-08-06 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
JP2020126883A (ja) * | 2019-02-01 | 2020-08-20 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
KR20210113383A (ko) * | 2019-02-01 | 2021-09-15 | 도쿄엘렉트론가부시키가이샤 | 성막 방법 및 성막 장치 |
JP7153582B2 (ja) | 2019-02-01 | 2022-10-14 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
KR102652637B1 (ko) | 2019-02-01 | 2024-04-01 | 도쿄엘렉트론가부시키가이샤 | 성막 방법 및 성막 장치 |
JP7435880B2 (ja) | 2023-03-09 | 2024-02-21 | 株式会社レゾナック | n型SiC単結晶基板及びSiCエピタキシャルウェハ |
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US20180005816A1 (en) | 2018-01-04 |
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CN107112214A (zh) | 2017-08-29 |
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