WO2016110433A1 - Optoelektronisches bauelement - Google Patents
Optoelektronisches bauelement Download PDFInfo
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- WO2016110433A1 WO2016110433A1 PCT/EP2015/081362 EP2015081362W WO2016110433A1 WO 2016110433 A1 WO2016110433 A1 WO 2016110433A1 EP 2015081362 W EP2015081362 W EP 2015081362W WO 2016110433 A1 WO2016110433 A1 WO 2016110433A1
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- Prior art keywords
- barrier layer
- layer
- barrier
- last
- band gap
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 49
- 230000004888 barrier function Effects 0.000 claims abstract description 404
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 description 142
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 141
- 229910002601 GaN Inorganic materials 0.000 description 49
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 42
- 239000000463 material Substances 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 238000002347 injection Methods 0.000 description 17
- 239000007924 injection Substances 0.000 description 17
- 239000002800 charge carrier Substances 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 206010053567 Coagulopathies Diseases 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 2
- 230000035602 clotting Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Definitions
- the invention relates to an optoelectronic component according to claim 1.
- opto-electronic devices ⁇ which have an active region for generating an electro- magnetic radiation, said active region quantum ⁇ movies which are spaced apart by barrier layers.
- the object of the invention is to provide an improved optoelectronic device.
- Electrons and holes is achieved. As a result, a larger gain of the optical wave can be achieved. In addition, absorption by unpumped quantum wells is reduced. As a result, the laser threshold decreases, whereby the slope of the laser characteristic is improved. In addition, an operational current decreases and the efficiency of the optoelectronic component is increased. This allows for higher output and longer life.
- the opto-electro ⁇ African component is formed with an active region for generating elekt ⁇ romagnetischer radiation, wherein the active zone comprises at least two quantum wells, said first quantum well between a first and a second barrier layer, wherein said second quantum well film is disposed between the second and last barrier layers, each barrier layer having a bandgap, the bandgaps of the first and second barrier layers being in a different relationship than the bandgaps of the second and third barrier layers.
- the first and the second barrier layer have an approximately equal band gap, and in particular, the last barrier layer has a larger band gap than the second barrier layer. This achieves a further improvement of the electro-optical properties.
- the first barrier layer has a larger band gap than the second barrier layer, wherein said second barrier layer having a smaller band gap than the last barrier layer, and wherein the first bar ⁇ centering layer having a smaller band gap than the last barrier layer. This also achieves an improvement in the optoelectronic properties.
- the second barrier layer has a higher doping than the first and the last barrier layer, and wherein in particular the first barrier layer has a higher doping than the last barrier layer on ⁇ .
- the first barrier layer has a larger band gap than the second barrier layer, wherein said second barrier layer having a smaller band gap than the last barrier layer, and wherein the first bar ⁇ centering layer an equal or a larger bandgap as the last barrier layer has.
- the first barrier layer has a smaller band gap than the second barrier layer, wherein the second barrier layer has a smaller band gap than the last barrier layer.
- Ver ⁇ improvement of the optoelectronic properties is achieved.
- the first and / or the second barrier layer has a higher doping than the last barrier layer, wherein in particular the first and the second barrier layer have an approximately equal doping. This achieves a further improvement of the optoelectronic properties.
- the first barrier layer has a smaller band gap than the second barrier layer.
- the second barrier layer has a smaller band gap than the last barrier layer.
- a first barrier layer is arranged on an n-contact side and has a smaller band gap than a second barrier layer.
- Barrier layer is arranged between two quantum films.
- the last barrier layer is disposed on the p-contact side angren ⁇ zend on the second quantum well.
- the second barrier layer has a smaller band gap than the first barrier layer.
- the second barrier layer and the last barrier layer have an approximately equal band gap. This also allows good optoelectronic properties.
- the last barrier layer has an equal or smaller band gap than the second barrier layer. This achieves a further improvement of the optoelectronic properties.
- the bandgap is stepped within a barrier layer or formed with an increasing value along a thickness of the barrier layer.
- the bandgap is stepped within a barrier layer or formed with a descending or rising value along a thickness of the barrier layer.
- the first barrier layer has a smaller electrical doping than the second barrier layer. This allows a further improvement of the optoelectronic properties.
- the second barrier layer has a higher electrical doping than the last barrier layer. This also improves the optoelectronic properties of the component.
- the first barrier layer has an equal or lower electrical doping than the second barrier layer. This also makes it possible to achieve a further improvement of the optoelectronic properties of the component.
- the second barrier layer has a higher or equal electrical doping than the last barrier layer.
- the electrical doping is stepped within a barrier layer or formed with an increasing value along a thickness of the barrier layer. In this way, a further optimization of the optoelectronic properties can be made possible.
- the electrical doping is formed centrally symmetrical to a center of the barrier layer in the form of a sloping profile in the direction of edge regions of the barrier layer. This can be another
- the first barrier layer is arranged between a first waveguide layer and the first quantum film.
- the last barrier layer ⁇ between the second quantum well and a second waveguide layer is arranged.
- the first waveguide layer has a smaller bandgap than the second waveguide layer. Also by a further Ver ⁇ improvement of the opto-electronic properties is achieved.
- the first barrier layer has a larger band gap than the second barrier layer, wherein the second wave guide layer has a smaller band gap than ⁇ the last barrier layer.
- the second barrier layer has a greater thickness than the first and / or the last barrier layer. Also can be achieved by a further IMPROVE ⁇ tion of the opto-electronic properties.
- at least one further quantum film is provided between the second quantum well and the last barrier layer. Between the second quantum well and the further quantum well another second barrier layer is provided. The last barrier layer is adjacent to the other quantum film. In this way you can also active Multi-quantum well zones have improved optoelectronic properties.
- the additional second barrier layer may be formed corresponding to the second barrier layer, or according to the last Barrie ⁇ re slaughter.
- the further second barrier layer may have values relative to the bandgap and / or the electrical doping which lie between the values of the second barrier layer and the values of the last barrier layer.
- second barrier layers may depend a plurality of second barrier layers provided on the chosen embodiment, which are formed according to the second barrier layer or the final barrier layer of stabilized or have the values with respect to the band gap and / or the electrical doping, between the values of the second barrier layer and the values of the last barrier layer.
- Figures 1 to 6 show various embodiments of an optoelectronic component with two quantum wells, wherein at least a section of the component from the fluid system InGaN is formed, wherein the Indiumkonzentra- tion and the electrical doping are shown across the thickness of the opto ⁇ electronic component.
- Figures 7 and 8 show further embodiments of an optoelectronic component with two quantum wells, said tendonss WE- a partial section of the component from the material ⁇ system InGaAlN is formed, and wherein a Indiumkonzentra ⁇ tion and an aluminum concentration and an electric Do ⁇ orientation across the thickness of Subsection of the optoelectro ⁇ African component are shown.
- Figure 9 shows a further embodiment of an opto-electro ⁇ African component.
- FIG. 10 shows a schematic representation of a course of an indium concentration and an electrical doping of an optoelectronic component with three quantum wells.
- FIGS. 11 to 15 show further embodiments of an optoelectronic component with two quantum films.
- Figure 16 shows a further embodiment of a Sectionaus ⁇ section of an optoelectronic component, wherein the first and the second barrier layer have an approximately large band gap.
- FIG. 17 shows a further embodiment of a component, wherein the second barrier layer has a smaller band gap than the first and the last barrier layer.
- Figure 18 shows a further embodiment of a optoelekt ⁇ tronic component, said first and second Barri ⁇ ere Anlagen have an approximately equal doping.
- 19 shows a further embodiment of a optoelekt ⁇ tronic component, wherein the last barrier has a small t ⁇ nere band gap than the second barrier and the second Barrie re ⁇ a smaller band gap than the first barrier.
- the following statements relate to optoelectronic components, which at least partially consist of a semi ⁇ conductor material. In the following, examples of the material systems InGaN and InGaAlN are described. However, the advantages of the described optoelectronic components are not limited to these material systems, but can also be achieved with other semiconductor materials.
- FIG. 1 shows a schematic representation of a partial section of a layer structure of an optoelectronic component ⁇ Bau ⁇ , which is designed in particular as a semiconductor laser or as a semiconductor diode.
- the illustrated Operaaus ⁇ section of the component is formed of an InGaN material system, wherein the content varies across the thickness of the component.
- the Kon ⁇ concentration is indicated 8 of the indium content in the form of a solid line and the concentration of the doping electrical 9 in the form of a dashed line across a thickness of the layer structure.
- the indium content is given in percentages and the electrical doping is given in units of 1 ⁇ 10 18 / cm 3 .
- An electrically negative doping is achieved with the material system InGaN or AlInGaN eg with silicon.
- An electrically positive doping is achieved in the material systems InGaN or AlInGaN, for example with magnesium.
- a band gap between a valence band and a conduction band becomes smaller in the InGaN material system.
- the bandgap between a valence band and a conduction band becomes larger for the AlInGaN material system.
- the representation of the layer structure is schematically glutenge ⁇ give, that is, it can further or additional layers between the individual layers shown may be provided. In addition, only a section of the optoelectronic component is shown, so that further layers can be provided on both sides of the illustrated layer sequence.
- the optoelectronic component has a first waveguide layer 1.
- the first waveguide layer 1 is arranged on an n-contact side.
- After the first wave ⁇ semiconductor layer 1 follows a first barrier layer 2.
- At first quantum film 3 is followed by a second barrier layer 4.
- On the second barrier layer 4 follows a second quantum film 5.
- On follows the last barrier layer 6 is followed by a second waveguide layer 7, which is on a p-side angeord ⁇ net.
- the illustrated layers may adjoin one another directly or further layers may be arranged between the illustrated layers. The layers are over one
- An idea of the present invention is to shape the active zone, that is, the active zone barrier layers 2, 4, 6, asymmetrically such that the at least two quantum wells 3, 5 are more uniformly filled with electrons and holes.
- the first barrier layer 2 can have a small band gap, ie a high indium concentration, which is, for example, between 3 to 20%, preferably between 5 and 12%, particularly preferably between 7 and 10%.
- the thickness of the first barrier layer 2 ⁇ may be in the range between 0.5 nm and 20 nm, beispielswei ⁇ se between 2 nm and 15 nm.
- the thickness of the first barrier layer can also be between 4 nm and 10 nm.
- the second barrier layer 4, which is arranged between the two quantum ⁇ films 3, 5, may also be highly doped.
- the electrical doping may be between 1 ⁇ 10 18 / cm 3 and 3 ⁇ 10 19 / cm 3 .
- the electrical doping can be between 4 and 20 ⁇ 10 18 / cm 3 .
- the electrical doping of the second barrier 4 can be between 5 and 10 ⁇ 10 18 / cm 3 .
- the second barrier 4 may have a larger band gap, ie less indium than the first barrier 2.
- Barrier 4 an even larger band gap, ie have little to no indium.
- the indium content of the second barrier layer 4 is less than 6%, preferably below 3%, be ⁇ Sonders preferably below 0.5%.
- no indium may be present in the second barrier layer 4.
- the first, second and last barrier layers 2, 4, 6 are formed from indium gallium nitride or gallium nitride, depending on how high the proportion of indium in the corresponding barrier layer is.
- the second barrier layer 4 may have a thickness ranging from 0.5 nm to 20 nm, preferably between 4 nm and 15 nm, more preferably have from 6 nm to 11 nm on ⁇ .
- the electric Dotie ⁇ tion may be in the range of less than 2 x 10 19 / cm 3, preferably less than 4 x 10 18 / cm 3, more preferably less than 1 x 10 18 / cm 3 or undoped.
- the last barrier layer 6 has a large band gap, ie little to no indium, wherein the indium concentration may be less than 6%, preferably less than 3%, more preferably less than 5% to 0%, so that the last barrier layer 6 may be composed of gallium nitride ,
- the thickness of the last barrier layer 6 can be in the range between 0.5 nm to 20 nm, preferably between 4 nm and 12 nm, particularly preferably between 6 nm and 10 nm.
- the electrical doping of the first, second and last barrier layers 2, 4, 6 is n-type, it being possible for example to use silicon, oxygen or germanium as the dopant. Good optoelectronic properties are achieved in that the first barrier layer 2 has a rela ⁇ tively low band gap, ie a relatively high Indiumkonzent ⁇ ration, wherein the second barrier layer 4 and the last barrier layer 6 has a larger band gap, that have a lower indium or no indium.
- the electrical doping of the first barrier layer 2 may be equal to or smaller than the electrical doping of the second barrier layer 4.
- the third barrier layer has an electrical doping, which is smaller than the electrical doping of the two ⁇ th and / or the first Barrier layer is.
- the second barrier layer 4 can be made larger in thickness than the first barrier layer 2. If more than two quantum wells 3, 4 are provided, the additional barrier layers can be formed according to the selected embodiment according to the second barrier layer 4.
- the further barrier layers with respect to the indium concentration, the electrical doping can, thick the layer and / or abandonedbil ⁇ det with respect to an aluminum concentration according to a value between the corresponding values of the second barrier layer 4 and the last barrier layer.
- the first waveguide layer 1 has no indium.
- the first barrier layer 2, for example, has a Indiumkon ⁇ concentration in the range of 10%.
- the first quantum film 3 has an indium concentration in the range of 20%.
- the second barrier layer 4 has an indium concentration which is in the range ⁇ 5 "6.
- the second quantum well 5 has an indium concentration which is in the region of 20% 4%.
- the second shafts ⁇ conductor layer 7 has no indium.
- the first waveguide layer 1 has an electrical doping, which is in the range of 2 x 10 18 / cm 3.
- the first Barrie ⁇ re Anlagen 2 has an electrical doping , which is in the range of 5 x ⁇ Be 10 18 / cm 3.
- the first quantum film 3 has no electrical doping.
- the second barrier layer 4 has an electrical doping, which is in the range of 5 x 10 18 / cm 3 .
- the second quantum film 5 has no electric ⁇ doping.
- the last barrier layer 6 has no electrical doping.
- the second wave ⁇ conductor layer 7 is undoped.
- the higher indium concentration on the n-side in comparison with the indium concentration of the barrier on the p-side is a better injection of La ⁇ makers in the quantum films 3, 5 is reached.
- Figure 2 shows the same layer structure as Figure 1, but in contrast to the layer structure of Figure 1, the first waveguide layer 1 has an indium concentration 8 in the range of 4 ⁇ 6.
- the last barrier layer 6 has an indium concentration 8 which is in the range of 0%.
- 7 the second waveguide layer an indium ⁇ concentration 8 which is in the range ⁇ 4 '6.
- the indium 8 is shown as a solid line.
- the electrical doping 9 is shown in the form of a dotted line.
- FIG. 3 shows a further embodiment of the optoelectronic component, wherein the electrical doping 9 of the layers according to FIGS. 1 and 2 is formed, but in comparison to FIG. 2 the first waveguide layer 1 has an indium concentration 8 in the region of 2%.
- the second barrier layer 4 has no indium.
- the last barrier layer 6 has no indium on.
- the indium concentration 8 of the second waveguide layer 7 is also in the region of 2%
- the first barrier layer 2 is made of indium gallium nitride
- the second and the last barrier layer 4 is formed, 6 of gallium nitride. This also makes a better injection and a more uniform Injekti ⁇ on of charge carriers in the quantum wells 3, 5 is achieved.
- the formation of the waveguides 1, 7 made of indium gallium nitride enables better waveguiding of the optical mode.
- Figure 4 shows a further embodiment of an opto-electro ⁇ African component, said indium 8 of the first barrier layer 2, the first quantum film 3, the second barrier layer 4 and the last barrier layer 6 is formed according to FIG. 3
- the first waveguide layer 1 and the second waveguide layer 7 ⁇ no indium on.
- the electrical doping 9 is formed lower than the embodiment of FIG. 3 for the first barrier layer and is in the range of 2 to 3 ⁇ 10 18 / cm 3 .
- the doping 9 of the second barrier layer 4 is 5-6x10 18 / cm 3 .
- the second barrier layer 4 has a higher or high doping on ⁇ . This achieves an improved charge carrier distribution between the quantum films 3, 5.
- Figure 5 shows an embodiment of an opto-electronic component, substantially corresponding to the embodiment of Figure 4, but in contrast to the execution ⁇ form the figure 4, the first and the second waveguide layer 1, are formed of indium gallium nitride 7, wherein the In ⁇ diumkonzentration 8 also in the range of 4% in the first waveguide layer in the area ⁇ 4 "6 and the indium concentration 8 of the second waveguide layer 7.
- the electrical dopings 9 of the first and the second waveguide layer 1, 7 correspond to the electrical doping 9 of the embodiment of FIG 4.
- the electrical doping 9 of the second barrier layer 4 is higher than in the embodiment of FIG. Form of Figure 4 and is in the range of 8 x 10 18 / cm 3 .
- the second barrier layer 4 having a very high electrical doping in the range of 8 ⁇ 10 18 / cm 3 .
- FIG. 6 shows a further embodiment of an optoelectronic component, the first barrier layer 2 having little or no electrical doping 9.
- the electrical doping is less than 1 ⁇ 10 18 / cm 3 .
- the electrical doping of the second barrier layer 4 is higher than 7 ⁇ 10 18 / cm 3 .
- the electrical doping 9 of the second barrier layer 4 is in the range of 8 ⁇ 10 18 / cm 3 .
- the first and the second waveguide layer 1, 7 are formed of indium gallium nitride and have a In ⁇ diumkonzentration 8 in the range of 2%.
- the second barrier layer 4 is thicker than the first and / or the last barrier layer 2, 6.
- the second barrier layer 4 may have a thickness that is 5%, preferably 10%, in particular 20% or more thicker than the first and / or the last barrier layer is. In this way better high temperature properties of the device are achieved.
- Figure 7 shows a schematic representation of a optoelekt ⁇ tronic device, which is constructed in the illustrated partial section of the material system AlInGaN, wherein the individual layers and / or indium aluminum.
- the indium or aluminum concentration is shown in the way that is shown starting from the value 0 to the top of the indium ⁇ content and starting from the value 0 to bottom of the aluminum content by the solid line.
- the electrical doping 9 for the individual layers is indicated.
- the first barrier layer 2 has a high Indiumkonzentra ⁇ tion in the range of 10%.
- the second barrier layer 4 and the last barrier layer 6 have an aluminum concentration in the range of 2.5%. That is, the second and last barrier layers 4, 6 are formed of aluminum gallium nitride. As a result, an improved charge carrier injection is achieved.
- the first waveguide layer 1 has no indium and consists of gallium nitride.
- the first quantum film 3 has an indium concentration in the range of 20%.
- the second quantum film 5 has an indium concentration in the range of 20%.
- the second waveguide layer 7 has neither aluminum nor indium.
- the first waveguide layer has a doping in the range of 3 ⁇ 10 18 / cm 3 .
- the first barrier layer and the first quantum film 3 have almost no electrical doping.
- the second barrier ⁇ layer 4 has a doping in the range 6 x 10 18 / cm 3 .
- the second quantum well 5, the last barrier layer 6 and the second waveguide layer 7 have little
- Figure 8 shows a further embodiment of an opto-electro ⁇ African component, which is formed in the illustrated partial section of the material system AlInGaN, wherein the first waveguide layer 1 is made of aluminum gallium nitride and having a concentration of 20% aluminum.
- the first barrier layer 2 is also made of aluminum gallium ⁇ nitride and has a concentration of 10% aluminum.
- the first quantum film 3 is formed of gallium nitride.
- the second quantum film 5 is formed of gallium nitride.
- the second barrier layer 4 comprises aluminum gallium nitride, the aluminum content being in the region of 20%.
- the last barrier layer 6 aluminum gallium nitride, wherein the aluminum content is 20%.
- the second waveguide layer 7 also has aluminum nitride ⁇ Galli, wherein the aluminum content is in the range from 19% lies.
- the first waveguide layer 1 has an electrical doping in the range of 8 ⁇ 10 18 / cm 3 .
- the first barrier layer 2 has a low doping, which is in the range of 1 ⁇ 10 18 / cm 3 or less.
- the first and second quantum wells 3, 5 have substantially no electrical doping.
- the second barrier layer 4 has an electrical ⁇ doping, which is in the range of 10 x 10 18 / cm 3 .
- the last barrier layer 6 and the second waveguide layer Layer 7 have a low or no electric Dotie ⁇ tion. This embodiment is suitable for. B.
- the n-side first barrier layer 2 has little aluminum, the second barrier layer 4 and the last barrier layer 6 exhibit a higher Aluminiumkonzent ⁇ ration. In this way, an improved injection of charge carriers, in particular a uniform injection of charge carriers in the first and in the second quantum film is made possible.
- due to the low to no Do ⁇ orientation of the first barrier layer 2 and by the high Do ⁇ orientation in the second barrier layer 4 has a better La ⁇ makers distribution is achieved in the quantum wells 3; 5.
- Figure 9 shows a further embodiment of an opto-electro ⁇ African component which is suitable for example for the formation of a green Hablleiterlasers with Indiumgalliumnitridbarrie ⁇ ren.
- the first waveguide layer 1 has Indi ⁇ umgalliumnitrid, wherein the indium content is in the range of 5%.
- the first barrier layer 2 has Indiumgallium ⁇ nitride, wherein the indium content is 15%.
- the first quantum film 3 comprises indium gallium nitride, wherein the Indi ⁇ vice halt is 30%.
- the second barrier layer 4 comprises indium gallium nitride, the indium content at 5 ⁇ 6
- the second quantum well 5 has indium gallium nitride with the indium content at 30%.
- the last Barri ⁇ ere für 6 comprises indium gallium nitride, wherein the indium ⁇ content is 5%.
- the second waveguide layer 7 comprises indium gallium nitride, wherein the indium content at 6 ⁇ 6
- the first waveguide layer 1 has an electrical doping in the range of 3 ⁇ 10 18 / cm 3
- the first barrier layer 2 a low or no doping, as well as the first quantum film 3, on.
- the second barrier layer 4 has an electrical doping in the range of 7 ⁇ 10 18 / cm 3 .
- the second quantum film 5, the last barrier layer 6 and the second waveguide layer 7 have little or no electrical doping. Due to the formation of the in ⁇ first barrier layer 2 with a high Indiumge ⁇ hold, the middle and the last barrier layer 4, 6 of indium gallium nitride with a lower indium content than that First barrier layer 2 allows a better injection of La ⁇ makers. In addition, a low to no doping of the first barrier layer 2 and a higher to high doping of the second barrier layer 4 ensures a better charge carrier distribution between the quantum films 3, 5.
- Figure 10 shows a further embodiment of a optoelekt ⁇ tronic device, which is formed substantially as the embodiment of Figure 9, but showing a further, second barrier layer 10 and a third quantum well
- the further second barrier layer 10 is arranged between the second quantum film 5 and the third quantum film 11.
- the third barrier film 11 is followed by the last barrier layer 6.
- the further second barrier layer 10 is formed substantially identically to the second barrier layer 4.
- the additional second barrier layer 10 also be formed un ⁇ differently to the second barrier layer. 4
- the additional second barrier layer 10 may have values such as the second bar ⁇ centering layer 4 or values between the values of the second barrier layer 4 and the values of the last barrier layer 6 with respect to the indium concentration and / or the aluminum concentration and / or the electrical doping.
- the indium content of the first waveguide layer 1 is in the range of 1%, as the indium content of the two ⁇ th waveguide layer 7, the indium content of the first Barri ⁇ ere Mrs 2 is in the range of 10%.
- the indium content of the second barrier layer 4, the further second barrier layer 10 and the last barrier layer 6 is in the range of 0%.
- the formation of the n-side first barrier layer 2 with a lot of indium and the remaining barrier layers with less indium, in particular only gallium nitride ensures a better injection of charge carriers.
- the first barrier layer 2 and higher, particularly a high Do ⁇ orientation of the second and further second barrier layer 4, 10 a better carrier distribution between the quantum wells 3, 5, 11 is achieved by a low to no doping.
- first and the second waveguide layer of indium gallium nitride provides a better waveguide.
- a corresponding arrangement according to FIG. 10 can also have more than three quantum films and further second barrier layers.
- the further second barrier layers may be formed in accordance with the further second barrier layer 10.
- Figure 11 shows a further embodiment in which the ers ⁇ te waveguide layer 1, an indium 8 in the region of 1%, the first barrier layer 2, a Indiumkon ⁇ concentration in the range ⁇ 9 "6" of the first quantum film 3 is an indium concentration in the range of 20%, second barrier layer 4, an indium concentration of 0%, the second quantum well 5 6 an indium concentration of 0%, and the two ⁇ te waveguide layer 7 having an indium concentration of 20%, the final barrier layer, an indium concentration of 1%.
- the first waveguide layer 1 comprises the first waveguide layer 1, an electrical doping of 8 ranging from 3 x 10 18 / cm 3, the first quantum film 3, the second quantum well 5, the last Barri- ere für 6 and the second waveguide layer 7, a clotting ⁇ ge or no electrical doping 8
- the first barrier layer 2 has an electrical doping in the range of 2 ⁇ 10 18 / cm 3 , the electrical doping being center-symmetrical with respect to e Iner center of the first barrier layer 2 is arranged and at a predetermined distance from the Randbe ⁇ rich the first barrier layer 2 drops to the value 0.
- the second barrier layer 4 has a doping in the range of 8 ⁇ 10 18 / cm 3 .
- the electrical doping is disposed in the second barrier layer 4 centrally symmetrically to a center of the second barrier layer 4, wherein the elekt ⁇ generic doping falls within a predetermined distance to the edge regions of the second barrier layer 4 to 0.
- a profile for the decrease of the electrical doping in the direction of the edge region of the first or the second barrier layer 2, 4 may also be provided. Due to the formation of the n-side first barrier layer 2 with a high indium concentration and the formation of the second barrier layer 2 Layer 4 and the last barrier layer 6 of gallium nitride, a better injection of charge carriers is achieved.
- the second barrier layer 4 may have a greater thickness than the first and / or the last barrier layer 6. As a result, a better high-temperature property of the component is made possible.
- Figure 12 shows a further embodiment of a optoelekt ⁇ tronic device.
- the first waveguide layer 1 has a low indium concentration 8 in the range of 1%.
- the first barrier layer 2 has an indium concentration which increases stepwise from a range ⁇ 8 "6 to 10 ⁇ 6 toward the first quantum well 3.
- the first quantum well 3 has an indium concentration of 20%
- the second barrier layer 4 and the last one barrier layer 6 have no indium on, but are gebil ⁇ det of gallium nitride.
- the second quantum well 5 comprises an indium concentration in the range of 20%.
- the second waveguide layer 7 has a low indium concentration in the range of 1%.
- the first waveguide layer 1 an electrical doping 9 in the range of 2 ⁇ 10 18 / cm 3.
- the first barrier layer 2 has little or no electrical doping, likewise the first and the second quantum film 3, 5.
- the second barrier layer 4 has an electrical barrier Dotie ⁇ tion, which is in the range of 8 x 10 18 / cm 3. Since the n-side first barrier layer 2 multi-level with a high
- FIG. 13 shows a further embodiment of a optoelekt ⁇ tronic component, said first waveguide layer 1 has a low indium 8 in the range of 1% up and is formed of indium gallium nitride.
- the first barrier layer 2 is also ge ⁇ forms of indium gallium nitride, wherein the indium content in the range of 9% by weight.
- the quantum films 3, 5 each have indium gallium nitride, where ⁇ in the indium content in the range of 20%.
- the second barrier layer 4 has an indium content 8 in the range of 3 to 8%, wherein the indium content increases in stages in the direction of the second quantum film 5.
- the last barrier ⁇ layer 6 has a low or no indium and is formed for example of gallium nitride.
- the second waveguide layer 7 is formed from indium gallium nitride with a low indium content of 1%.
- the first wave ⁇ conductor layer 1 has an electrical doping in the range of 5 x 10 18 / cm 3 .
- the first barrier layer 2 has an electrical doping 9 in the range of 2 ⁇ 10 18 / cm 3 .
- the electrical doping 9 is in the form of a profile mittensym ⁇ metric with respect to a center axis of the first barrier ⁇ layer 2, wherein at a specified distance from the edge portions of the first barrier layer 2, the electrical doping falls to 0.
- the first and second quantum wells 3, 5 have no electrical doping.
- the second barrier layer 4 has an electrical Do ⁇ tion, which is in the range of 3 x 10 18 / cm 3 .
- the electrical doping of the second barrier layer 4 is also formed mittensymmet ⁇ driven to a center axis of the second barrier layer 4 of ⁇ , wherein the electrical doping 9 in the direction of the edge portions of the second barrier layer 4 and above Errei ⁇ surfaces of the edge region drops to the value 0.
- the last barrier layer 6 and the second waveguide layer 7 have little or no electrical doping. Since the in ⁇ side first barrier layer 2 has a high indium concentration in the range ⁇ 9 "6 and the second barrier layer 4 has a ge ⁇ ringere indium concentration, but at least one or more stages in the direction of the second quantum 5 increases and the last barrier layer 6 consists Gal ⁇ liumnitrid, an improved injection of La ⁇ makers is possible. In addition, 9 allows a better Ladungsträ ⁇ gerver notorious in the area of the second barrier layer 4 by the low or no electric doping 9 in the area of the first barrier layer 2 and a higher electrical doping.
- FIG. 14 shows a further embodiment of an optoelectronic component, the first barrier layer 2 and the second barrier layer 4 having an indium content 8 decreasing in the direction of the p-side.
- the p-side last barrier layer 6 is formed from gallium nitride.
- the indium content falls in at least one or more stages within the first and / or second barrier layer 2, 4.
- the indium content may also be continuous in the direction of the p-side within the Barrie ⁇ retik 2 , 4 fall off. This allows a better injection of charge carriers.
- the first barrier layer 2 has a lower electrical doping 9 in the range of 2 ⁇ 10 18 / cm 3 compared to the second barrier layer 4.
- the second barrier layer 4 has an electrical Do ⁇ tion in the range of 6 x 10 18 / cm 3 . As a result, a better charge carrier distribution between the quantum films 3, 5 is achieved.
- the indium content decreases from 12% to 8%.
- Within the second Barrier ⁇ esch layer 4 of indium ⁇ 5 "6 is lowered to 1% or to 0%.
- the electrical doping of the second barrier layer 4 is in the range of 6 x 10 18 / cm 3.
- the electrical doping the first barrier layer 2 is in the range of 2
- FIG. 15 shows a further embodiment of an optoelectronic component in which the indium content 8 within the first barrier layer 2 rises continuously starting from the first waveguide layer 1 in the direction of the first quantum film 3.
- the indium content increases from 2% to 10%.
- the electrical doping 9 falls within the first one Barrier layer 2 of 3 x 10 18 / cm 3 to a value of 0.
- the Indiumkonzent ⁇ ration in the second barrier layer 4 is less than 2%, in particular 0%.
- the indium concentration in the last barrier layer 6 is below 2%, in particular at 0%.
- the second barrier layer 4 and the last Barri ⁇ ere für 6 is preferably formed of gallium nitride.
- the electrical doping of the first waveguide layer 1 is in the range of 3 ⁇ 10 18 / cm 3 .
- the electrical doping of the first quantum well 3, the second quantum well 5, the last barrier layer 6 and the second waveguide layer 7 is in the range of zero.
- the indium concentrations, the aluminum concentrations, the electrical conductivity in the form of steps may fall off or increase or fall off in the form of continuous profiles within a layer.
- FIG. 16 shows a schematic representation of a partial detail of a further embodiment of an optoelectronic component, which consists of a semiconductor material, in particular in the illustrated section of InGaN or AlInGaN, with an active zone for generating electromagnetic radiation, the active zone having a first Wel ⁇ lenleiter Anlagen 1, wherein the first waveguide ⁇ layer 1, a first barrier layer 2 adjacent.
- a second barrier layer 4 and a last barrier layer 6 are provided. Between the first barrier layer 2 and the second barrier layer 4, a first quantum film 3 is arranged. Between the second barrier layer 4 and the last barrier layer 6, a second quantum film 5 is arranged. A second world bordering on the last barrier layer 6 conductor layer 7.
- the illustrated region of the opto ⁇ electronic component is formed of indium gallium nitride or gallium nitride.
- the indium content 8 is plotted as a solid line across the thickness of the device.
- the electrical doping 9 is applied in the form of a dashed line over the thickness of the component.
- the first waveguide layer 1 is assigned to an n-doped side of the component.
- the second waveguide layer 7 is assigned to a p-doped side of the component.
- the first and the second barrier layer 2, 4 is a high indium concentration in the range ⁇ 8 "6, wherein the Indiumkonzentrationen the first and second waveguide layers 2, 4 are approximately equal.
- the first and the second barrier layer 2, 4 is a relatively small band gap between the conduction band and the valence band.
- the last barrier 6, which represents ⁇ represents a p-side barrier has a lower indium, and thus a larger band gap than the second barrier layer 4 and / or the first barrier layer 2 on.
- the last barrier layer 6, as shown in Fig. 16, also consist of gallium nitride. With this choice of bandgap better Ladungsträ ⁇ gerinjetechnisch is achieved.
- the second barrier layer 4 also has a higher indium concentration than the first Barrie Layer 2, that is, have a smaller band gap than the first barrier layer 2. This also achieves an improvement in the injection of the charge carriers.
- the first and / or the second waveguide layer 1, 7 have an indium concentration and are formed from indium gallium nitride. 7 thereby, the first and / or second waveguide layer 1, a smaller bandgap than GaN and thus can cause egg ⁇ ne better waveguide of electromagnetic radiation.
- the first waveguide layer 1 has a doping in the range of 1 ⁇ 10 18 / cm 3 .
- the first barrier layer 2 has a doping in the range of 2 ⁇ 10 18 / cm 3 .
- the first and second quantum wells 3, 5 are substantially undoped.
- the second barrier layer 4 has a doping in the region of 4 ⁇ 10 18 / cm 3 up.
- the last barrier layer 6 and the second Wel ⁇ lenleiter Anlagen 7 are undoped.
- Figure 17 shows a partial section of a further exemplary form of an optoelectronic component, which is formed from egg ⁇ nem semiconductor material, particularly InGaN or AlInGaN.
- the device has a layer sequence of a first waveguide layer 1, a first barrier ⁇ layer 2, a first quantum film 3, a second barrier layer 4, a second quantum well 5, a final barrier layer 6, and a second waveguide layer.
- the middle that is, the second barrier layer 4 has a smaller band gap than the first barrier layer 2 or the last barrier layer 3. This is achieved that the indium ⁇ concentration is greater in the second barrier layer 4 as in the first barrier layer 2 or the last barrier layer 6.
- the embodiment is ge ⁇ selected in such a way that the first barrier layer 6, a smaller Bandlü- CKE as the last barrier layer 6 has. This is achieved that the indium content of the first barrier ⁇ layer 2 is greater than the indium content of the last Barrie ⁇ re harsh 6.
- the first and the second waveguide layer 1, 7 is formed of indium gallium nitride in the illustratedariessbei ⁇ game.
- the first waveguide layer 7 has an indium concentration in the range of 1%.
- the first barrier layer 2 has "6.
- the second barrier layer 4 has an in ⁇ diumkonzentration in the range ⁇ 8" an indium concentration in the rich Be ⁇ 6 ⁇ 6.
- the third barrier layer 6 has an indium concentration in the range of 4 ⁇ 6.
- the second waveguide layer 7 has a Indiumkon ⁇ concentration in the range of 1%.
- the first and second quantum wells 3, 5 have an indium concentration in the range of 20%.
- This choice of band gaps in the barrier layers 2, 4, 6 is overall better injection he ⁇ enough.
- the waveguide guidance is improved by the fact that the waveguides consist of indium gallium nitride.
- the first waveguide layer 1 has an electrical doping in the range of 1 ⁇ 10 18 / cm 3 .
- the first barrier Layer 2 has a doping in the range of 2 ⁇ 10 18 / cm 3 .
- the second barrier layer 4 has a doping in the loading on ⁇ range from 4 x 10 18 / cm 3.
- the first quantum film 3, the second quantum well 5, the last barrier layer 6 and the second waveguide layer 7 are undoped in the illustrated execution ⁇ example.
- FIG. 18 shows a schematic section in a further embodiment of an optoelectronic component which is formed from a semiconductor material, in particular from InGaN or AlInGaN.
- the component has the following
- the second Barri ⁇ ere für 4 has a smaller band gap than the first and last barrier layers 2, 6.
- the first and the last barrier layer 2, 6 have an approximately equal band gap.
- the barrier layers are formed from indium gallium nitride, with the indium concentration of the second barrier layer 4 being in the range of ⁇ 5 "6.
- the indium concentrations of the first and the last barrier layer 2, 6 are in the range ⁇ 4 "6.
- the quantum films 3, 5 have an indium concentration. concentration in the range of 20%.
- the quantum films are also formed from indium gallium nitride.
- the first and the second waveguide layers 1, 7 are formed from indium gallium nitride, wherein the indium content is 1%.
- the first waveguide layer 1 has a doping in the range of 1 ⁇ 10 18 / cm 3 .
- the first and the second barrier layer ⁇ 2, 4 have a doping in the range of 4 x 10 18 / cm 3.
- the first quantum well 3, the second quantum well 5, the last barrier layer 6, and the second waveguide layer 7 are substantially undoped.
- FIG. 19 shows a further detail of a further embodiment of an optoelectronic component which is formed from a semiconductor material, in particular from InGaN or AlInGaN.
- the device has an active zone for generating electromagnetic radiation. It points the component has the following layer sequence: a first wave ⁇ conductor layer 1, a first barrier layer 2, a first quantum well 3, a second barrier layer 4, a second quantum well 5, a last barrier layer 6 and a second waveguide layer 7.
- a special feature of this embodiment is ⁇ form in that the last barrier layer 6 has a smaller band gap than the second barrier layer 4. 4
- the second barrier layer has a smaller band gap than the first barrier ⁇ layer.
- the layer structure is formed of indium gallium nitride with varying indium concentration.
- the first waveguide layer 1 has a Indiumkonzentrati ⁇ on of 1%.
- the first barrier layer 2 has a ⁇ indium concentration of 2%.
- the second barrier layer 4 has "6.
- the last barrier ⁇ layer 6 has an indium concentration ⁇ 6" an indium ⁇ 4 6.
- the second waveguide layer 7 has an indium concentration of 1%.
- the first and second quantum wells 3, 5 have an indium concentration of 20%.
- the first waveguide layer 1 has a doping in the range of 1 ⁇
- the first barrier layer 2 has a doping in the range of 4 ⁇ 10 18 / cm 3 .
- the second barrier layer 2 has a doping in the range of 4 ⁇ 10 18 / cm 3 .
- the first quantum film 3, the second quantum film 5, the last barrier layer 6 and the second waveguide layer 7 are undo ⁇ oriented. Also in this embodiment, an improvement in the injection of the charge carriers is achieved.
- the formation of the waveguide layers of indium gallium nitride enables a better waveguide.
- the band gap of the barrier layers can be reduced depending on the material of the barrier layer for example, in Indiumgallium ⁇ nitride by increasing the indium concentration and decreased by reducing the aluminum concentration in the formation of aluminum gallium nitride.
- the exemplary embodiments described in the figures can be made from the material system indium gallium nitride or from the aluminum gallium nitride material system or from the material system Indium aluminum gallium nitride are formed.
- the indium content or the aluminum content can be adjusted accordingly.
- the values for the doping and the values for the indium content or the band gaps may vary.
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Abstract
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US15/539,996 US10020421B2 (en) | 2015-01-05 | 2015-12-29 | Optoelectronic component |
JP2017531552A JP6681400B2 (ja) | 2015-01-05 | 2015-12-29 | オプトエレクトロニクス部品 |
DE112015005885.0T DE112015005885B4 (de) | 2015-01-05 | 2015-12-29 | Optoelektronisches Bauelement |
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DE102012217681A1 (de) * | 2012-09-27 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zum Betreiben eines optoelektronischen Bauteils |
DE102013104351B4 (de) * | 2013-04-29 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterschichtenfolge und Verfahren zum Betreiben eines optoelektronischen Halbleiterchips |
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2015
- 2015-01-05 DE DE102015100029.6A patent/DE102015100029A1/de not_active Withdrawn
- 2015-12-29 DE DE112015005885.0T patent/DE112015005885B4/de active Active
- 2015-12-29 WO PCT/EP2015/081362 patent/WO2016110433A1/de active Application Filing
- 2015-12-29 CN CN201580072462.7A patent/CN107112387B/zh active Active
- 2015-12-29 JP JP2017531552A patent/JP6681400B2/ja active Active
- 2015-12-29 US US15/539,996 patent/US10020421B2/en active Active
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US11444222B2 (en) | 2017-09-12 | 2022-09-13 | Nikkiso Co., Ltd. | Nitride semiconductor light-emitting element and production method for nitride semiconductor light-emitting element |
JP2019054236A (ja) * | 2018-08-23 | 2019-04-04 | 日機装株式会社 | 窒化物半導体発光素子及び窒化物半導体発光素子の製造方法 |
JP2021192457A (ja) * | 2018-08-23 | 2021-12-16 | 日機装株式会社 | 窒化物半導体発光素子及び窒化物半導体発光素子の製造方法 |
JP7194793B2 (ja) | 2018-08-23 | 2022-12-22 | 日機装株式会社 | 窒化物半導体発光素子及び窒化物半導体発光素子の製造方法 |
Also Published As
Publication number | Publication date |
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CN107112387B (zh) | 2019-12-24 |
US10020421B2 (en) | 2018-07-10 |
DE102015100029A1 (de) | 2016-07-07 |
US20170373220A1 (en) | 2017-12-28 |
DE112015005885A5 (de) | 2017-09-28 |
JP2018500762A (ja) | 2018-01-11 |
CN107112387A (zh) | 2017-08-29 |
DE112015005885B4 (de) | 2023-11-23 |
JP6681400B2 (ja) | 2020-04-15 |
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