WO2016093109A1 - Procédé de fabrication d'une carte de câblage imprimé - Google Patents

Procédé de fabrication d'une carte de câblage imprimé Download PDF

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Publication number
WO2016093109A1
WO2016093109A1 PCT/JP2015/083727 JP2015083727W WO2016093109A1 WO 2016093109 A1 WO2016093109 A1 WO 2016093109A1 JP 2015083727 W JP2015083727 W JP 2015083727W WO 2016093109 A1 WO2016093109 A1 WO 2016093109A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
layer
wiring
pattern
wiring board
Prior art date
Application number
PCT/JP2015/083727
Other languages
English (en)
Japanese (ja)
Inventor
吉川　和広
浩人 飯田
歩 立岡
中島　大輔
Original Assignee
三井金属鉱業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金属鉱業株式会社 filed Critical 三井金属鉱業株式会社
Priority to KR1020177005012A priority Critical patent/KR102402300B1/ko
Priority to JP2016563627A priority patent/JP6734785B2/ja
Priority to CN201580066930.XA priority patent/CN107003257B/zh
Publication of WO2016093109A1 publication Critical patent/WO2016093109A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une carte de câblage imprimé, ledit procédé consistant à préparer une feuille de cuivre comportant une surface traitée, dans laquelle la réflectance diffuse SCI pour la lumière incidente selon un angle de 8° est égale ou inférieure à 41 %, former un motif de résine photosensible sur la surface de la feuille de cuivre, effectuer un dépôt électrolytique de cuivre sur la feuille de cuivre, former un motif de câblage par enlèvement du motif de résine photosensible, et réaliser une inspection de l'image d'apparence du motif de câblage sur la feuille de cuivre. Selon la présente invention, il est possible de fournir un procédé de fabrication d'une carte de câblage imprimé de telle sorte qu'il soit possible de réaliser une inspection d'image d'apparence avec une grande précision sur le motif de câblage formé sur la feuille de cuivre avant la formation de la couche de câblage composite lors de la fabrication d'une carte de câblage imprimé, et qu'il soit, de ce fait, possible d'augmenter de manière significative l'efficacité de production pour des cartes de câblage imprimé.
PCT/JP2015/083727 2014-12-08 2015-12-01 Procédé de fabrication d'une carte de câblage imprimé WO2016093109A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020177005012A KR102402300B1 (ko) 2014-12-08 2015-12-01 프린트 배선판의 제조 방법
JP2016563627A JP6734785B2 (ja) 2014-12-08 2015-12-01 プリント配線板の製造方法
CN201580066930.XA CN107003257B (zh) 2014-12-08 2015-12-01 印刷板线路板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-248426 2014-12-08
JP2014248426 2014-12-08

Publications (1)

Publication Number Publication Date
WO2016093109A1 true WO2016093109A1 (fr) 2016-06-16

Family

ID=56107298

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/083727 WO2016093109A1 (fr) 2014-12-08 2015-12-01 Procédé de fabrication d'une carte de câblage imprimé

Country Status (5)

Country Link
JP (1) JP6734785B2 (fr)
KR (1) KR102402300B1 (fr)
CN (1) CN107003257B (fr)
TW (1) TWI617229B (fr)
WO (1) WO2016093109A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180060998A (ko) * 2016-11-28 2018-06-07 장 춘 페트로케미컬 컴퍼니 리미티드 다층 캐리어 포일
JP2018131590A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 コアレス基板用熱硬化性樹脂組成物、コアレス基板用プリプレグ、コアレス基板、コアレス基板の製造方法及び半導体パッケージ
JP2021057433A (ja) * 2019-09-30 2021-04-08 株式会社フジクラ フレキシブルプリント配線板及びその製造方法
CN113005484A (zh) * 2019-12-19 2021-06-22 日进材料股份有限公司 经表面处理的铜箔、其制造方法、包括其的铜箔层叠体及包括铜箔层叠体的印刷线路板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107454762A (zh) * 2017-09-14 2017-12-08 桐城市闲产网络服务有限公司 一种计算机电路板的制作方法
CN112586098B (zh) * 2018-09-28 2021-09-21 三井金属矿业株式会社 多层布线板的制造方法

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JPH04235337A (ja) * 1991-01-10 1992-08-24 Fujitsu Ltd 多層プリント配線板の検査方法
JP2002164390A (ja) * 2000-11-28 2002-06-07 Hitachi Cable Ltd テープキャリア及びその製造方法
JP2003060356A (ja) * 2001-08-09 2003-02-28 Ngk Spark Plug Co Ltd 多層プリント配線基板の製造方法

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04127494A (ja) * 1990-06-08 1992-04-28 Sumitomo Bakelite Co Ltd 多層プリント配線板
JPH04235337A (ja) * 1991-01-10 1992-08-24 Fujitsu Ltd 多層プリント配線板の検査方法
JP2002164390A (ja) * 2000-11-28 2002-06-07 Hitachi Cable Ltd テープキャリア及びその製造方法
JP2003060356A (ja) * 2001-08-09 2003-02-28 Ngk Spark Plug Co Ltd 多層プリント配線基板の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180060998A (ko) * 2016-11-28 2018-06-07 장 춘 페트로케미컬 컴퍼니 리미티드 다층 캐리어 포일
JP2018088525A (ja) * 2016-11-28 2018-06-07 長春石油化學股▲分▼有限公司 多層キャリア箔
KR101958573B1 (ko) 2016-11-28 2019-03-14 장 춘 페트로케미컬 컴퍼니 리미티드 다층 캐리어 포일
JP2018131590A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 コアレス基板用熱硬化性樹脂組成物、コアレス基板用プリプレグ、コアレス基板、コアレス基板の製造方法及び半導体パッケージ
JP2021057433A (ja) * 2019-09-30 2021-04-08 株式会社フジクラ フレキシブルプリント配線板及びその製造方法
WO2021065490A1 (fr) * 2019-09-30 2021-04-08 株式会社フジクラ Carte de circuit imprimé souple et son procédé de production
CN113005484A (zh) * 2019-12-19 2021-06-22 日进材料股份有限公司 经表面处理的铜箔、其制造方法、包括其的铜箔层叠体及包括铜箔层叠体的印刷线路板
CN113005484B (zh) * 2019-12-19 2024-05-03 乐天能源材料公司 经表面处理的铜箔、其制造方法、包括其的铜箔层叠体及包括铜箔层叠体的印刷线路板

Also Published As

Publication number Publication date
CN107003257B (zh) 2020-07-03
TWI617229B (zh) 2018-03-01
TW201633873A (zh) 2016-09-16
KR102402300B1 (ko) 2022-05-27
KR20170092519A (ko) 2017-08-11
JPWO2016093109A1 (ja) 2017-09-14
CN107003257A (zh) 2017-08-01
JP6734785B2 (ja) 2020-08-05

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