WO2016031641A1 - 金属パターンの形成方法及び導電体 - Google Patents
金属パターンの形成方法及び導電体 Download PDFInfo
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- WO2016031641A1 WO2016031641A1 PCT/JP2015/073196 JP2015073196W WO2016031641A1 WO 2016031641 A1 WO2016031641 A1 WO 2016031641A1 JP 2015073196 W JP2015073196 W JP 2015073196W WO 2016031641 A1 WO2016031641 A1 WO 2016031641A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
- B05D1/42—Distributing applied liquids or other fluent materials by members moving relatively to surface by non-rotary members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/062—Pretreatment
- B05D3/063—Pretreatment of polymeric substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Definitions
- the present invention relates to a method of forming a metal pattern on the surface of an arbitrary substrate. Specifically, the present invention relates to a method capable of applying a dispersion in which metal particles protected with a predetermined protective agent are dispersed to form a fine metal pattern on a substrate with high efficiency at a low temperature.
- the wiring and electrode circuits used in these devices have a process that can form patterns with higher definition than ever before in a large area. It has been demanded.
- a transparent electrode material such as ITO has been applied to the wiring pattern of the touch panel so far. That is, in order to increase the panel size, it is necessary to reduce the resistance value of the wiring in order to cope with the increase in the wiring length. ITO is not originally a material with low electrical resistance, so it is necessary to increase the film thickness in order to reduce the resistance value. However, this may cause loss of transparency, making it meaningless as a transparent electrode.
- the necessity for weight reduction per unit area is increasing as the panel is increased in size, it is considered to change the substrate material from conventional glass to resin.
- it is necessary to bake at about 300 ° C. after coating the substrate, and the resin substrate cannot withstand this baking temperature. Therefore, it has been pointed out that the use of ITO has a limit from the viewpoint of weight reduction.
- Patent Document 1 a pattern is formed using a liquid material containing a conductive material constituting a pattern called a functional liquid.
- a substrate having a lyophilic portion with respect to a functional liquid is used, and droplets containing a material that becomes a liquid repellent material with respect to the functional liquid are ejected and applied to the substrate to form a liquid repellent portion.
- the pattern of the conductive material is formed by discharging and applying the functional liquid to the lyophilic part between the liquid repellent parts.
- a pattern is formed using a conductive layer forming coating liquid containing noble metal fine particles.
- a water repellent transparent layer having a predetermined pattern is formed on a substrate, and a pattern is formed by applying and drying a conductive layer forming coating liquid in a space between the water repellent transparent layers.
- a uniform water-repellent transparent layer is formed on the substrate, and after forming a water-repellent disappearance portion of a predetermined pattern on the surface of the water-repellent transparent layer, a pattern is formed by applying and drying a coating liquid for forming a conductive layer.
- the organic polymer resin to be a resist can be printed in a desired pattern shape and etched.
- Patent Document 1 performs the formation of the liquid repellent portion and the application of the functional liquid by a so-called ink jet method.
- the ink jet method discharges a liquid material with a nozzle.
- a liquid material containing conductive material particles such as a functional liquid may cause clogging of nozzle holes, and forms an extremely fine line pattern stably. Is difficult.
- the ink jet method forms a desired pattern by moving and scanning the nozzle, and it is difficult to achieve both miniaturization and large area for the metal pattern.
- the pattern forming method by photolithography which generally involves the use of a resist, such as the technique described in Patent Document 2, requires more steps for resist processing, which is not efficient and causes an increase in cost.
- the base material when the base material is changed from a hard material such as glass or ceramic to a soft material such as resin or plastic in accordance with the weight reduction of equipment, there is a concern that the metal pattern may be peeled or damaged due to deformation of the substrate. Therefore, in the future, it is expected that a bonding force between the base material and the metal pattern will be required more than ever.
- the pattern forming portion of the base material in the conventional metal pattern forming method described above, the pattern forming portion of the base material is made lyophilic or hydrophilic, but this is for retaining the liquid to be applied in the part, and the metal in the liquid There is no effect until the binding between the component and the substrate is increased. For this reason, it is considered that it is difficult to obtain a strong bond having followability with respect to deformation of the base material with the above-described conventional technology.
- the present invention proposes a method capable of efficiently producing a high-definition metal pattern as a method for forming a metal pattern on a substrate.
- the metal pattern to be formed can be formed at a relatively low temperature and aims to be able to be firmly bonded to the substrate.
- the point of using the dispersion liquid in which the metal fine particles are dispersed, which is applied in the above-described prior art, is a suitable matter for carrying out pattern formation at a low temperature. If such a liquid is used, the surface of the substrate is used. It can also be said that it is useful to make the portion where the pattern is not formed water-repellent.
- the problem is how to easily form a region where the dispersion liquid is applied and the metal fine particles are fixed, and how to increase the bonding force between the metal fine particles and the substrate.
- the present inventors considered that it is optimal to improve both the treatment for the base material and the dispersion liquid in which the metal fine particles are dispersed, and intensively studied to arrive at the present invention.
- the present invention relates to a method for forming a metal pattern in a pattern forming portion set in a part or all of a region on a base material, wherein the base material contains at least a fluorine-containing resin on a surface including the pattern forming portion.
- a metal fine particle comprising a layer and having a functional group formed on the pattern forming portion on the surface of the fluorine-containing resin layer, and then protected by an amine compound as a first protective agent and a fatty acid as a second protective agent
- a method of forming a metal pattern comprising the steps of: applying a metal fine particle dispersion in which is dispersed in a solvent to the surface of the substrate, and fixing the metal fine particles to the pattern forming portion.
- a base material having a liquid-repellent fluorine-containing resin layer is selected, and (2) a predetermined treatment is performed on the surface of the base material.
- the configuration of the metal fine particle dispersion that is a treatment liquid for fixing the metal particles to the base material is optimized.
- the predetermined treatment for the substrate surface in (2) is to form a functional group by modifying the metal pattern forming portion on the surface of the fluorine-containing resin. Then, as described in (3), a dispersion liquid containing metal particles bonded with a predetermined protective agent is brought into contact.
- the metal pattern can be formed by spreading the metal fine particle dispersion on the surface of the substrate by the selective binding action of the metal particles to the site where the functional group is formed as described above.
- This method is more efficient than a method of forming a metal pattern by drawing such as an inkjet method.
- the number of steps can be reduced.
- formation of a functional group is possible by ultraviolet irradiation or the like, and therefore, formation of a pattern with a very small width is easy.
- a substrate having a fluorine-containing resin layer on the surface is applied.
- a substrate having a fluorine-containing resin layer on the surface is applied.
- Metal base materials and glass / ceramic base materials can be applied, and resin and plastic base materials can also be applied.
- the metal pattern can be formed at a low temperature in the present invention, resins, plastics, and the like can be applied without any problem.
- region which forms a metal pattern on a base material may be set in the whole surface of a base material, may be a part, and may be further set in several places on a base material.
- the fluororesin layer may be the one formed in advance on the above various base materials. Further, as a step of forming the metal pattern, it may be formed by coating or the like on a base material without a fluororesin layer. As long as the fluororesin layer includes the pattern forming portion, it may be formed on the entire surface of the substrate, or may be formed on a part of the surface.
- limiting in particular about the thickness of a fluorine-containing resin layer In general, liquid application can be exerted by application of 0.01 ⁇ m or more.
- the upper limit of the thickness is not particularly limited, but when transparency is required, the upper limit is about 5 ⁇ m.
- a fluorine-containing resin which is a polymer having one or more repeating units based on a fluorine-containing monomer containing a fluorine atom can be applied. Moreover, even if it is fluorine-containing resin which is a polymer which has a repeating unit based on a fluorine-containing monomer, and a repeating unit based on a fluorine non-containing monomer which does not contain a fluorine atom, respectively, one or more. good. Furthermore, the fluorine-containing resin in the present invention may contain a heteroatom such as oxygen, nitrogen, chlorine or the like in part.
- fluorine-containing resins include polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), tetrafluoroethylene-perfluoroalkyl.
- Vinyl ether copolymer PFA
- FEP tetrafluoroethylene-hexafluoropropylene copolymer
- ETFE ethylene-tetrafluoroethylene copolymer
- ECTFE ethylene-chlorotrifluoroethylene copolymer
- TFE / PDD tetrafluoroethylene -Perfluorodioxole copolymer
- fluorine-containing resin having a cyclic perfluoroalkyl structure or a cyclic perfluoroalkyl ether structure, and the like.
- the fluorine-containing resin used in the present invention is preferably a ratio of the number of fluorine atoms to the number of carbon atoms (F / C) is a fluorine-containing resin comprising a polymer having at least one repeating unit of 1.0 or more.
- the F / C of the repeating unit based on this fluorine-containing monomer is more preferably 1.5 or more.
- F / C sets 2.0 as an upper limit from the reason of liquid repellency and availability.
- a particularly preferred fluorine-containing resin in relation to this requirement is a perfluoro resin having a repeating unit based on a monomer of a perfluoro compound, and a perfluoro resin having an F / C of 1.5 or more in the repeating unit. It is a fluororesin.
- a suitable fluorine-containing resin can be selected in consideration of application of a transparent substrate and characteristics of a metal pattern.
- the fluorine-containing resin is preferably a perfluoro resin having a cyclic structure in the main chain.
- transparency is required for the fluororesin layer, it is more preferable to apply an amorphous perfluororesin.
- Preferred fluorine-containing resins in consideration of these properties include perfluorobutenyl vinyl ether polymer (CYTOP (registered trademark): Asahi Glass Co., Ltd.), tetrafluoroethylene-perfluorodioxole copolymer (TFE-PDD), Teflon (registered trademark) AF: Mitsui DuPont (Fluorochemical Co., Ltd.).
- contact exposure is a means for forming a high-definition pattern.
- contact exposure can be suitably performed by selecting a fluorine-containing resin in the present invention.
- a fluorine-containing resin containing at least one oxygen atom in a repeating unit based on a fluorine-containing monomer constituting the polymer is preferable.
- the present inventors predict that by applying a fluorine-containing resin containing oxygen, the oxygen acts as a radical in the exposure process and contributes to functional group formation.
- this fluorine-containing resin containing oxygen perfluorobutenyl vinyl ether polymer (CYTOP (registered trademark): Asahi Glass Co., Ltd.), tetrafluoroethylene-perfluorodioxole copolymer (TFE-PDD), tetrafluoroethylene- A perfluoroalkyl vinyl ether copolymer (PFA) may be mentioned.
- CYTOP perfluorobutenyl vinyl ether polymer
- TFE-PDD tetrafluoroethylene-perfluorodioxole copolymer
- PFA perfluoroalkyl vinyl ether copolymer
- the fluororesin layer When the fluororesin layer is formed on the substrate, it can be dealt with by applying a solution in which a fluorine-containing resin is dissolved in an appropriate solvent. After application, the fluorine-containing resin layer is formed by firing.
- the method for applying the fluorine-containing resin is not particularly limited, such as dipping, spin coating, and roll coater. After applying the fluorine-containing resin, post-treatment (drying treatment and baking treatment) according to the type of resin is performed to form a fluorine-containing resin layer.
- a functional group is formed on the surface of the fluorine-containing resin layer on the substrate.
- This functional group is a functional group formed by cleaving the CF bond of the fluorine-containing resin. Specifically, a carboxy group, a hydroxy group, and a carbonyl group are formed.
- ultraviolet irradiation corona discharge treatment, plasma discharge treatment, or excimer laser irradiation is used. These treatments cause a photochemical reaction on the surface of the fluorine-containing resin to break the CF bond, and it is necessary to apply an appropriate energy.
- the amount of energy applied to the pattern forming portion is preferably 1 mJ / cm 2 or more and 4000 mJ / cm 2 or less.
- ultraviolet irradiation with a wavelength in the range of 10 nm to 380 nm is preferable, and ultraviolet irradiation with a wavelength in the range of 100 nm to 200 nm is particularly preferable.
- the exposure processing using a photomask is generally performed.
- a photomask reticle
- any of a non-contact exposure method (proximity exposure, projection exposure) and a contact exposure method (contact exposure) can be applied.
- the distance between the mask and the fluorine-containing resin layer surface is preferably 10 ⁇ m or less, and more preferably 3 ⁇ m or less.
- the fluorine-containing resin layer is formed on the substrate and the functional group is formed on the pattern forming portion, and the substrate is brought into contact with the metal fine particle dispersion.
- the configuration of the metal fine particle dispersion is suitable for forming a metal pattern suitably.
- the metal fine particle dispersion applied in the present invention is obtained by dispersing metal fine particles formed by binding a predetermined protective agent in a solvent.
- Metal fine particles correspond to the constituent material of the metal pattern to be formed.
- the metal fine particles are preferably made of at least one of silver, gold, platinum, palladium, copper, and alloys of these metals. These metals have excellent conductivity and are useful as electrode materials.
- the metal fine particles preferably have an average particle size of 5 nm to 100 nm. In order to form a fine wiring pattern, a particle size of 30 nm or less is required. On the other hand, excessively fine metal particles are likely to aggregate and have poor handleability.
- the protective agent suppresses the aggregation and coarsening of the metal fine particles and stabilizes the dispersed state. Agglomeration and coarsening of fine metal particles must be avoided because they not only cause dispersion of the metal during storage and use, but also affect the sintering properties after bonding to the substrate. .
- a protective agent also has the effect
- an amine is applied as the first protective agent, and a fatty acid is applied as the second protective agent. That is, in the present invention, the metal particles are protected in a state where two types of compounds having different basic structures are combined.
- the amine compound as the first protective agent preferably has a total carbon number of 4 or more and 12 or less. This is because the carbon number of the amine affects the stability of the metal particles and the sintering characteristics during pattern formation. With amines having less than 4 carbon atoms, it is difficult for metal fine particles to be present stably, and it becomes difficult to form a uniform sintered body. On the other hand, amines having more than 12 carbon atoms excessively increase the stability of the metal particles and require heating at a high temperature for pattern formation. From these, the protective agent of the present invention is preferably an amine compound having a total carbon number of 4 or more and 12 or less.
- the number of amino groups in the amine compound as the protective agent (mono) amine having one amino group or diamine having two amino groups can be applied.
- the number of hydrocarbon groups bonded to the amino group is preferably one or two, that is, primary amine (RNH 2 ) or secondary amine (R 2 NH) is preferable.
- RNH 2 primary amine
- R 2 NH secondary amine
- the thing whose at least 1 or more amino group is a primary amine or a secondary amine is preferable.
- the hydrocarbon group bonded to the amino group may be a hydrocarbon group having a cyclic structure in addition to a chain hydrocarbon having a linear structure or a branched structure. Further, oxygen may be partially included.
- the protective agent applied in the present invention include the following amine compounds.
- the amine compound as the first protective agent may be used by mixing and combining a plurality of types of amine compounds for the purpose of adjusting the dispersibility of the metal particles in the dispersion and the low temperature sintering property. Further, it is sufficient that at least one amine compound having a total carbon number of 4 to 12 is included, and if so, an amine compound having a carbon number outside the range may be present.
- the fatty acid applied as the second protective agent acts as an auxiliary protective agent for the amine compound in the dispersion and increases the stability of the metal fine particles.
- the action of the fatty acid clearly appears after the metal particles are applied to the substrate, and a metal pattern having a uniform film thickness can be formed by adding the fatty acid. This effect can be remarkably understood by comparing with the case where metal fine particles without fatty acid are applied, and a stable metal pattern cannot be formed with metal fine particles without fatty acid.
- the fatty acid is preferably an unsaturated fatty acid having 4 to 20 carbon atoms and a saturated fatty acid. Since unsaturated fatty acids and saturated fatty acids having 3 or less carbon atoms reduce the dispersibility of the metal fine particles in the dispersion medium, the metal fine particles are likely to aggregate and it is difficult to form a stable metal pattern. On the other hand, unsaturated fatty acids and saturated fatty acids having more than 20 carbon atoms generally have a low vapor pressure and are difficult to evaporate. Therefore, they cannot be sufficiently removed from metal fine particles when forming a metal pattern, and the resistance value of the metal pattern. Tend to be higher.
- preferable fatty acids include butanoic acid (carbon number 4), pentanoic acid (carbon number 5), hexanoic acid (carbon number 6), heptanoic acid (carbon number 7), octanoic acid (carbon number 8), Nonanoic acid (9 carbon atoms), decanoic acid (alias: capric acid, 10 carbon atoms), undecanoic acid (alias: undecyl acid, 11 carbon atoms), dodecanoic acid (alias: lauric acid, 12 carbon atoms), tridecanoic acid ( Also known as: tridecylic acid, 13 carbon atoms, tetradecanoic acid (also known as myristic acid, 14 carbon atoms), pentadecanoic acid (also known as pentadecylic acid, 15 carbon atoms), hexadecanoic acid (also known as palmitic acid, 16 carbon atoms), heptadecane Acid (alias: margaric acid, carbon
- oleic acid particularly preferred are oleic acid, linoleic acid, stearic acid, lauric acid and butanoic acid.
- fatty acid which is the second protective agent described above, a plurality of types may be used in combination.
- what is necessary is just to contain at least 1 sort (s) of unsaturated fatty acid or saturated fatty acid with 4 or more and 20 or less carbon atoms, and if so, other fatty acids may exist.
- a metal fine particle dispersion is formed by dispersing metal fine particles protected by the first and second protective agents in a solvent.
- the applicable solvent here is an organic solvent, for example, alcohol, benzene, toluene, alkane and the like. These may be mixed.
- Preferred solvents are alkanes such as hexane, heptane, octane, nonane and decane, alcohols such as methanol, ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, nonanol and decanol, and more preferably It is a mixed solvent of 1 type, or 2 or more types of alcohol selected from 1 type, or 2 or more types of alkane.
- the content of the metal particles in the dispersion is preferably 20% by weight or more and 60% by weight or less in terms of the metal mass with respect to the mass of the dispersion.
- the content of the metal fine particles in the dispersion is less than 20%, a metal pattern with a uniform film thickness for ensuring sufficient conductivity cannot be formed in the pattern forming portion, and the resistance value of the metal pattern Becomes higher.
- the content of the metal fine particles in the dispersion exceeds 60%, it becomes difficult to form a stable metal pattern due to aggregation and enlargement of the metal fine particles. Accordingly, the content of the metal particles in the dispersion of the present invention is preferably 20% by weight or more and 60% by weight or less in terms of the metal mass with respect to the dispersion mass.
- the content of the protective agent in the dispersion is the ratio of the number of moles of amine (mol amine ) to the number of moles of metal (mol metal ) in the dispersion for the amine compound that is the first protective agent (mol amine / mol).
- metal is preferably 0.01 or more and 0.32 or less.
- the content of the fatty acid as the second protective agent is 0.001 or more and 0.05 in terms of the ratio of the number of moles of fatty acid (mol fatty acid ) to the number of moles of metal (mol metal ) (mol fatty acid / mol metal ). The following is preferable. Even if the content of the protective agent in the dispersion exceeds the above preferable range, the dispersibility of the metal particles is not affected.
- the excessive protective agent is low-temperature sinterability of the metal particles and the metal pattern to be formed.
- the above range is preferable because it affects the resistance value.
- about the number-of-moles of said protective agent when using multiple types of amine compounds and a fatty acid, a total number-of-moles is applied, respectively.
- the metal fine particle dispersion described above is applied to a substrate having a fluorine-containing resin layer.
- dipping, spin coating and roll coater can be applied, but the metal fine particle dispersion may be dropped and spread using an application member such as a blade, squeegee or spatula.
- a functional group for selectively fixing metal particles to a pattern forming portion is formed in advance, and a pattern can be formed by spreading a dispersion liquid all at once, which is efficient.
- the metal fine particle dispersion is repelled due to its liquid repellency on the surface of a fluorine-containing resin having no functional group.
- an application member such as a blade
- the repelled dispersion is removed from the substrate surface.
- a substitution reaction between the protective agent for the metal fine particles and the metal particles occurs, and the metal fine particles are fixed to the substrate. Thereafter, the solvent of the dispersion liquid volatilizes, and the metal fine particles on the base material self-sinter to form a metal film, thereby forming a metal pattern.
- this self-sintering is a phenomenon that occurs even at room temperature, heating the base material is not an essential step in forming the metal pattern.
- the protective agent amine compound, fatty acid
- This baking treatment is preferably performed at 40 ° C. or higher and 250 ° C. or lower. If it is less than 40 degreeC, since removal
- the firing time is preferably from 10 minutes to 120 minutes. Note that the firing step may be performed in an air atmosphere or a vacuum atmosphere.
- a metal pattern made of metal is formed by applying the above metal fine particle dispersion, self-sintering the metal fine particles, and firing as necessary.
- substrate is equipped with the metal pattern which has a high-definition and suitable electrical property. That is, the conductor according to the present invention includes a base material in which a pattern forming portion is set in a part or all of the region, and a fluororesin layer formed on a surface including at least the pattern forming portion of the base material. And a metal pattern formed by fixing metal fine particles on the pattern forming portion of the fluororesin layer, wherein the functional group is formed on the pattern forming portion. It is.
- the conductor according to the present invention having a high-definition metal pattern can act as a transparent conductor, and can be expected to be applied to displays and touch panels.
- the metal pattern method according to the present invention can efficiently form a high-definition metal pattern. Since this metal pattern is formed of a metal film, it has a low resistance value and can be suitably used as an electrode / wiring.
- a metal pattern can be formed by a relatively simple process of applying and printing a metal fine particle dispersion after forming a functional group on a substrate.
- the present invention is simpler than a photolithography method that generally uses a resist, and more efficient than an ink jet method.
- a fine and high-definition metal pattern can be formed.
- This metal pattern can exhibit the same translucency as a transparent electrode.
- the metal pattern forming method according to the present invention on a transparent substrate, it is possible to produce a transparent conductor.
- the photograph which shows the external appearance of the metal pattern formed in 1st Embodiment The figure which shows the Raman spectrum in the interface measured from the board
- First Embodiment A preferred embodiment of the present invention will be described below.
- fluorine-containing resin layer formation and functional group formation were performed as a pretreatment of the base material, and a dispersion in which silver fine particles were dispersed as metal particles was manufactured, and the dispersion was applied and a metal pattern was formed.
- a resin substrate (dimensions: 20 mm ⁇ 20 mm) made of polyethylene naphthalate was prepared as a base material.
- an amorphous perfluorobutenyl ether polymer (CYTOP (registered trademark): manufactured by Asahi Glass Co., Ltd.) as a fluorine-containing resin to the resin substrate by a spin coating method (rotation speed 2000 rpm, 20 sec), 50 ° C. For 10 minutes, followed by heating at 80 ° C. for 10 minutes, followed by baking in an oven at 100 ° C. for 60 minutes.
- CYTOP amorphous perfluorobutenyl ether polymer
- VUV light ultraviolet rays
- the silver particles were produced by a thermal decomposition method using a silver complex as a precursor.
- This thermal decomposition method uses a silver compound having thermal decomposability such as silver oxalate (Ag 2 C 2 0 4 ) as a starting material, and reacts the silver compound with a protective agent to form a silver complex, which is then used as a precursor. It is a method of obtaining silver particles by heating and decomposing as a body.
- silver particles were produced using silver oxalate as a raw material.
- N, N-dimethyl-1,3-diaminopropane as an amine serving as a protective agent was kneaded with silver oxalate previously wetted with decane to produce a silver oxalate amine complex serving as a precursor.
- the amount of N, N-dimethyl-1,3-diaminopropane added was 0.76 (mol / mol) with respect to silver.
- oleic acid was added as a second protective agent and kneaded.
- the addition amount of hexylamine is 1.14 (mol / mol) with respect to silver
- the addition amount of dodecylamine is 0.095 (mol / mol) with respect to silver
- the addition amount of oleic acid is with respect to silver. 0.012 (mol / mol).
- the addition of hexylamine and dodecylamine after N, N-dimethyl-1,3-diaminopropane complements the protective action of silver particles by N, N-dimethyl-1,3-diaminopropane. This is to suppress aggregation.
- the kneaded product was heated and stirred at 110 ° C. to decompose the complex.
- the kneaded material gradually turned from brown to brown and finally black.
- bubbles carbon dioxide
- the silver concentration of this silver fine particle dispersion was 40% by weight.
- the silver fine particle dispersion produced above was applied to a pretreated substrate.
- the coating was performed by sweeping the blade in one direction after wetting and spreading the dispersion in advance on the contact portion between the substrate and the blade (made of glass). Here, the sweep speed was 2 mm / sec. By applying with this blade, it was confirmed that the dispersion was adhered only to the ultraviolet irradiation portion (functional group forming portion) of the substrate.
- the dispersion was naturally dried at room temperature (25 ° C.) to form a metal pattern.
- the element bonding state of the metal pattern forming part on the substrate surface was examined by micro Raman spectroscopy.
- the metal pattern on the substrate surface is irradiated with laser light (wavelength: 532 nm) from the back surface of the substrate, and the Raman spectrum of the interface between the silver particle layer and the fluorine-containing resin layer is measured and analyzed.
- the chemical species in FIG. 2 shows a Raman spectrum at the interface by laser irradiation from the back surface of the substrate.
- the Raman spectrum measured by irradiation from the back surface shows a unique vibration structure that cannot be seen when laser irradiation is performed from the substrate surface measured in advance, around 1370 cm ⁇ 1 and 1570 cm ⁇ 1 .
- a vibrating structure was seen. This vibration structure is considered to originate from the COO bond. Therefore, in this embodiment, it has confirmed that the carboxy group was formed as a functional group on the fluorine-containing resin layer surface.
- this embodiment is a value that can be sufficiently used as an electrical wiring. is there.
- the substrate was heated at 80 ° C. to fire the metal pattern.
- the resistance value was measured in the same manner, it was confirmed that the sheet resistance was 66 ⁇ / ⁇ and the volume resistance was 16 ⁇ ⁇ cm, and a decrease in the resistance value was observed.
- Second Embodiment silver particles were produced by pyrolysis using another silver compound as a starting material, and a metal pattern was formed using the dispersion.
- silver carbonate was used instead of silver oxalate in the first embodiment.
- N N-dimethyl-1,3-diaminopropane was kneaded with dry silver carbonate as in the first embodiment to produce a silver carbonate amine complex as a precursor.
- hexylamine, dodecylamine and oleic acid were added and kneaded.
- the mixing amount (mixing ratio) of each amine compound and oleic acid was the same as in the first embodiment.
- the kneaded product was heated and stirred at 110 ° C. to decompose the complex, and centrifuged and washed to obtain silver fine particles.
- the silver concentration of this silver fine particle dispersion was also 40% by weight.
- the manufactured silver fine particle dispersion was applied to the same pretreated substrate as in the first embodiment under the same conditions to form a metal pattern.
- the resistance value of the metal pattern formed in this embodiment was a surface resistance of 300 ⁇ / ⁇ and a volume resistance of 80 ⁇ ⁇ cm.
- the resistance value was 80 ⁇ / ⁇ in surface resistance and 20 ⁇ ⁇ cm in volume resistance. Therefore, it was confirmed that these metal patterns formed in the second embodiment are also useful as electrical wiring.
- the technical significance of the fatty acid constituting the protective agent together with the amine was examined for the protective agent for the silver fine particle dispersion.
- silver particles are produced by adding other fatty acids (stearic acid, butanoic acid, propanoic acid) instead of adding oleic acid or without adding fatty acids.
- a dispersion was produced.
- the same pretreatment as in the first embodiment was applied with a silver fine particle dispersion by the same operation, dried and fired to form a metal pattern. Thereafter, the substrate surface was observed to confirm the presence or absence of pattern formation.
- a metal fine particle dispersion using various metals as a constituent material of a metal pattern is manufactured and applied to a substrate to form a metal pattern.
- the metal fine particle dispersion is prepared by preparing platinum, palladium, gold, and copper metal salt raw materials, dissolving the raw materials in a solvent (toluene or ethanol), and adding an amine (hexylamine or decylamine) as the first protective agent. Further, a reducing agent (sodium borohydride) was added to reduce the metal ions to produce a mixed solution in which the amine-protected metal fine particles were dispersed. Next, after separating and recovering the metal fine particles from this mixed solution and washing, toluene to which oleic acid as the second protective agent was added in advance was added to produce a metal fine particle dispersion.
- a solvent toluene or ethanol
- an amine hexylamine or decylamine
- a reducing agent sodium borohydride
- This metal fine particle dispersion was applied to a substrate.
- the configuration of the substrate, the contents of pretreatment, and the coating method are the same as in the first embodiment. Also in this embodiment, it was confirmed that the dispersion was attached only to the functional group forming part of the substrate by the dispersion application. And this dispersion liquid was naturally dried at room temperature (25 degreeC), and the metal pattern was formed. The appearance of the formed metal pattern was observed, and the line width of the pattern was measured. Moreover, the resistance value was measured about the formed metal pattern. The measurement was performed before and after the heat treatment (80 ° C.), and a value of 400 ⁇ / ⁇ or less was determined to be acceptable. Table 2 shows the results regarding the metal pattern formed by each metal fine particle dispersion.
- a suitable metal pattern similar to silver can be formed also from a metal fine particle solution of platinum, palladium, gold, and copper. These metal patterns had sufficiently small line widths and passed resistance values.
- an extremely fine metal pattern can be efficiently formed.
- the present invention is not only useful for forming electrodes / wirings of various semiconductor devices, but also can be effectively applied to forming wirings on the panel surface of touch panels that require translucency.
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Abstract
Description
基材としてポリエチレンナフタレートからなる樹脂基板(寸法:20mm×20mm)を用意した。この樹脂基板にフッ素含有樹脂として非晶質性パーフルオロブテニルエーテル重合体(CYTOP(登録商標):旭硝子(株)製)をスピンコート法(回転数2000rpm、20sec)で塗布した後、50℃で10分、続いて80℃で10分加熱し、更にオーブンにて100℃で60分加熱して焼成した。これにより1μmのフッ素含有樹脂層が形成された。
次に、このフッ素含有樹脂層が形成された基板に、格子パターン(線幅3μm、線間隔50μm)のフォトマスクを密着し、ここに紫外線(VUV光)を照射した(マスク-基板間距離0のコンタクト露光)。VUV光は、波長172nm、11mW/cm-2で20秒照射した。
銀微粒子分散液の製造について、銀粒子は、銀錯体を前駆体とする熱分解法により製造した。この熱分解法は、シュウ酸銀(Ag2C204)等の熱分解性を有する銀化合物を出発原料とし、銀化合物と保護剤とを反応させて銀錯体を形成し、これを前駆体として加熱し分解することで銀粒子を得る方法である。
Claims (13)
- 基材上の一部又は全部の領域に設定されたパターン形成部に金属パターンを形成する方法において、
前記基材は、少なくとも前記パターン形成部を含む表面上にフッ素含有樹脂層を備えるものであり、
前記フッ素含有樹脂層表面のパターン形成部に官能基を形成した後、
第1の保護剤であるアミン化合物と、第2の保護剤である脂肪酸により保護された金属微粒子が溶媒に分散してなる金属微粒子分散液を前記基材表面に塗布し、
前記金属微粒子を前記パターン形成部に固定する工程を含むことを特徴とする金属パターンの形成方法。 - フッ素含有樹脂層は、その重合体を構成するフッ素含有単量体に基づく繰り返し単位として、フッ素原子数と炭素原子数との比(F/C)が1.0以上の繰り返し単位を少なくとも1種有する重合体からなる請求項1記載の金属パターンの形成方法。
- フッ素含有樹脂層表面に官能基を形成する工程は、フッ素含有樹脂層表面のパターン形成部に1mJ/cm2以上4000mJ/cm2以下のエネルギーを印加するものである請求項1又は請求項2記載の金属パターンの形成方法。
- 官能基として、カルボキシ基、ヒドロキシ基、カルボニル基の少なくともいずれかが形成される請求項1~請求項3いずれかに記載の金属パターンの形成方法。
- 第1の保護剤であるアミン化合物は、炭素数4以上12以下のアミン化合物の少なくとも1種を含むものである請求項1~請求項4のいずれかに記載の金属パターンの形成方法。
- 第2の保護剤である脂肪酸は、炭素数4以上20以下の脂肪酸の少なくとも1種を含むものである請求項1~請求項5のいずれかに記載の金属パターンの形成方法。
- 脂肪酸は、オレイン酸、ステアリン酸、リノール酸、ラウリン酸、ブタン酸の少なくともいずれかを含むものであるである請求項6に記載の金属パターンの形成方法。
- 金属微粒子分散液の溶媒は、炭素数3以上8以下のアルコール溶媒、炭素数6以上10以下の炭化水素溶媒、又はこれらの混合溶媒である請求項1~請求項7のいずれかに記載の金属パターンの形成方法。
- 金属微粒子をパターン形成部に固定後、基材を40℃以上250℃以下に加熱する工程を含む請求項1~請求項8のいずれかに記載の金属パターンの形成方法。
- 金属微粒子は、銀、金、白金、パラジウム、銅、及びこれらの金属の合金の少なくともいずれかよりなる請求項1~請求項9のいずれかに記載の金属パターンの形成方法。
- その一部又は全部の領域にパターン形成部が設定された基材と、
前記基材の少なくとも前記パターン形成部を含む表面上に形成されたフッ素樹脂層と、
前記フッ素樹脂層の前記パターン形成部上に金属微粒子が固定されることで形成された金属パターンと、を含む導電体であって、
前記パターン形成部上に官能基が形成されている導電体。 - 官能基として、カルボキシ基、ヒドロキシ基、カルボニル基の少なくともいずれかが形成されている請求項11に記載の導電体。
- 基材が透明体からなる請求項11又は請求項12記載の導電体。
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KR1020177007838A KR101923330B1 (ko) | 2014-08-27 | 2015-08-19 | 금속 패턴의 형성 방법 및 도전체 |
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WO2023120512A1 (ja) * | 2021-12-22 | 2023-06-29 | 田中貴金属工業株式会社 | 導電性積層体及びその製造方法 |
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EP3196894A1 (en) | 2017-07-26 |
TW201616520A (zh) | 2016-05-01 |
CN106796829B (zh) | 2019-04-05 |
EP3196894A4 (en) | 2018-05-02 |
JP2016048601A (ja) | 2016-04-07 |
TWI590262B (zh) | 2017-07-01 |
KR20170044708A (ko) | 2017-04-25 |
US20170256332A1 (en) | 2017-09-07 |
CN106796829A (zh) | 2017-05-31 |
JP5916159B2 (ja) | 2016-05-11 |
US10892065B2 (en) | 2021-01-12 |
KR101923330B1 (ko) | 2018-11-28 |
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