WO2016002036A1 - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
- Publication number
- WO2016002036A1 WO2016002036A1 PCT/JP2014/067754 JP2014067754W WO2016002036A1 WO 2016002036 A1 WO2016002036 A1 WO 2016002036A1 JP 2014067754 W JP2014067754 W JP 2014067754W WO 2016002036 A1 WO2016002036 A1 WO 2016002036A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser beam
- laser
- steel sheet
- polarized light
- grain
- Prior art date
Links
- 0 *CC1CCCC1 Chemical compound *CC1CCCC1 0.000 description 2
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D6/00—Heat treatment of ferrous alloys
- C21D6/008—Heat treatment of ferrous alloys containing Si
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/12—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
- C21D8/1277—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties involving a particular surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/12—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/12—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
- C21D8/1294—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties involving a localized treatment
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/001—Ferrous alloys, e.g. steel alloys containing N
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/06—Ferrous alloys, e.g. steel alloys containing aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/16—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
Definitions
- the present invention relates to a laser processing apparatus for irradiating a directional electromagnetic steel sheet used for a transformer iron core or the like with a laser beam to subdivide magnetic domains.
- the grain-oriented electrical steel sheet is characterized in that it is easily magnetized with respect to the rolling direction when the steel sheet is manufactured. Therefore, the grain-oriented electrical steel sheet is also called a unidirectional electrical steel sheet.
- the grain-oriented electrical steel sheet is used as a material constituting an iron core of electrical equipment such as a transformer and a rotating machine. When the grain-oriented electrical steel sheet is magnetized, energy loss such as iron loss occurs. In recent years, with the progress of global warming, energy saving of electric equipment is required worldwide. Therefore, a technique that can further reduce the iron loss of the grain-oriented electrical steel sheet is required.
- Patent Document 1 discloses a grain-oriented electrical steel sheet having a glass film formed on the surface of a steel sheet steel and an insulating film formed on the surface of the glass film.
- Patent Documents 2 and 3 listed below disclose laser magnetic domain control methods capable of suppressing abnormal eddy current loss.
- a laser beam is irradiated on the surface of a grain-oriented electrical steel sheet on which an insulating film is formed, so that it is substantially perpendicular to the width direction of the grain-oriented electrical steel sheet (that is, substantially perpendicular to the rolling direction of the grain-oriented electrical steel sheet).
- the laser beam is scanned along (direction).
- a plurality of residual strains are periodically formed along the rolling direction on the surface of the grain-oriented electrical steel sheet (that is, the surface of the ground iron), and the magnetic domains of the grain-oriented electrical steel sheet are subdivided.
- a temperature history having a strong temperature gradient with respect to the thickness direction is given to the outermost layer of the grain-oriented electrical steel sheet by scanning with a laser beam.
- a temperature history By giving such a temperature history, a residual strain is generated on the surface of the ground iron of the grain-oriented electrical steel sheet, and a circulating magnetic domain is formed due to the residual strain.
- the 180 ° domain wall interval is subdivided, and as a result, the abnormal eddy current loss of the grain-oriented electrical steel sheet is reduced.
- Patent Document 3 discloses that a TEM 00 mode laser beam having excellent minute focusing characteristics is used to form a strong magnetic distortion in a narrow region, thereby obtaining a narrow and sufficient strength of the circulating magnetic domain. A method is disclosed.
- an insulating film is formed on the glass film, and a laser beam is irradiated on the insulating film to perform magnetic domain control.
- wrinkles may occur in the insulating film and the glass film due to a temperature rise caused by laser beam irradiation.
- wrinkles refers to film damage such as defect peeling, lifting, alteration, and discoloration of the insulating film and the glass film.
- the steel plate base iron may be exposed to the outside and rust may be generated. For this reason, when wrinkles occur in the glass film, it is necessary to apply the insulating film again, which causes an increase in manufacturing cost due to the addition of processes.
- Japanese Laid-Open Patent Publication No. 2007-119821 Japanese Unexamined Patent Publication No. 59-33802 International Publication No. 2004/083465 Japanese Laid-Open Patent Publication No. 58-29592 Japanese Laid-Open Patent Publication No. 2-52192
- the absorption characteristics of the laser beam with respect to the steel sheet differ depending on whether or not the insulating film is transparent to the wavelength of the irradiated laser beam.
- the insulating film becomes opaque with respect to the wavelength of the laser beam, the laser beam is absorbed in the insulating film.
- path length the propagation distance
- the incident position of the laser beam coincides with the central portion of the laser scanning width
- the angle between the direction perpendicular to the surface of the grain-oriented electrical steel sheet (normal direction) and the propagation direction of the laser beam (the laser beam The incident angle ⁇ ) is 0 °.
- the incident angle ⁇ of the laser beam increases as the incident position of the laser beam approaches the end of the laser scanning width.
- the laser beam path length in the insulating film and the glass film increases as the incident position of the laser beam approaches the edge from the center of the laser scanning width (as the incident angle ⁇ of the laser beam increases). Therefore, the absorption of the laser beam with respect to the insulating film is increased. Therefore, as a result that more power is applied to the steel plate than at the center portion at the end portion of the laser scanning width, the risk of wrinkles occurring in the glass film increases.
- This invention is made
- a laser processing apparatus condenses a laser beam on a directional electromagnetic steel sheet and scans it in a scanning direction to subdivide the magnetic domains of the directional electromagnetic steel sheet.
- the laser beam focused on the directional electromagnetic steel sheet is linearly polarized light, and the angle formed by the direction of the linearly polarized light and the scanning direction is more than 45 ° and not more than 90 °.
- a maximum incident angle ⁇ MAX of the laser beam with respect to the grain-oriented electrical steel sheet may satisfy the following conditional expression (1). 1 / cos ⁇ MAX ⁇ 1.19 (1)
- the wavelength of the laser beam focused on the grain-oriented electrical steel sheet may be greater than 7 ⁇ m.
- the laser processing apparatus may further comprise a laser oscillator for emitting a laser beam, said laser oscillator, which emits linearly polarized light A laser may be used.
- a condensing shape of the laser beam focused on the directional electromagnetic steel sheet is an ellipse, and the short shape of the ellipse
- the axial direction may be orthogonal to the scanning direction.
- FIG. 1 is a cross-sectional view of a grain-oriented electrical steel sheet 10 according to an embodiment of the present invention. It is a flowchart which shows an example of the manufacturing process of the grain-oriented electrical steel plate 10 which concerns on one Embodiment of this invention. It is a schematic diagram which shows the structural example of the laser processing apparatus 100 which concerns on one Embodiment of this invention. It is a schematic diagram which shows the structural example of the laser irradiation apparatus 106 which concerns on one Embodiment of this invention. 2 is a view showing a condensing shape of a laser beam on a grain-oriented electrical steel sheet 10. FIG. It is a schematic diagram which shows the incident state to the directionality electromagnetic steel plate 10 of a laser beam.
- a path length e1 in the insulating film 16 and a path length e1 'in the glass film 14 of the laser beam incident on the insulating film 16 at the central portion P1 of the laser scanning width L are shown.
- the path length e2 in the insulating film 16 and the path length e2 'in the glass film 14 of the laser beam incident on the insulating film 16 at the end P2 of the laser scanning width L are shown.
- a grain-oriented electrical steel sheet is an electrical steel sheet in which the easy axis of magnetization of the crystal grains of the steel sheet (the ⁇ 100> direction of the body-centered cubic crystal) is substantially aligned with the rolling direction in the manufacturing process.
- a plurality of magnetic domains whose rolling direction and magnetization direction coincide with each other are arranged in a state of being partitioned by a domain wall.
- Such a grain-oriented electrical steel sheet is easily magnetized in the rolling direction, and is therefore suitable as an iron core material for transformers in which the direction of the lines of magnetic force is substantially constant.
- Transformer cores iron cores
- Transformer cores are roughly classified into a wound core and a laminated core.
- the grain-oriented electrical steel sheet according to the present embodiment is particularly suitable as a material for the laminated core.
- FIG. 1 is a cross-sectional view of a grain-oriented electrical steel sheet 10 according to this embodiment.
- the grain-oriented electrical steel sheet 10 includes a steel sheet body (ground iron) 12, a glass film 14 formed on both surfaces of the steel sheet body 12, an insulating film 16 formed on the glass film 14,
- ground iron steel sheet body
- glass film 14 formed on both surfaces of the steel sheet body
- insulating film 16 formed on the glass film 14
- the steel plate body 12 is made of an iron alloy containing Si.
- the composition of the steel sheet body 12 is Si: 2.5 mass% to 4.0 mass%, C: 0.02 mass% to 0.10 mass%, Mn: 0.05 mass% to 0.00 mass%. 20 mass% or less, acid-soluble Al; 0.020 mass% or more and 0.040 mass% or less, N: 0.002 mass% or more and 0.012 mass% or less, S; 0.001 mass% or more and 0.010 mass% or less
- P 0.01% by mass or more and 0.04% by mass or less
- the thickness of the steel plate body 12 is, for example, not less than 0.1 mm and not more than 0.4 mm.
- the glass film 14 is made of, for example, a composite oxide such as forsterite (Mg 2 SiO 4 ), spinel (MgAl 2 O 4 ), and cordierite (Mg 2 Al 4 Si 5 O 16 ).
- the thickness of the glass film 14 is, for example, 1 ⁇ m.
- the insulating film 16 is made of, for example, a coating liquid mainly composed of colloidal silica and phosphate (magnesium phosphate, aluminum phosphate, etc.) or a coating liquid in which alumina sol and boric acid are mixed.
- the thickness of the insulating film 16 is, for example, 2 ⁇ m or more and 3 ⁇ m or less.
- residual strain is imparted to a linear region substantially orthogonal to the rolling direction when the insulating film 16 is irradiated with a laser beam.
- a linear region to which residual strain is applied is formed in a predetermined period in the rolling direction, and a domain width in a direction substantially perpendicular to the rolling direction in a region sandwiched between two linear regions and oriented in the rolling direction. Subdivide.
- FIG. 2 is a flowchart showing an example of a manufacturing process of the grain-oriented electrical steel sheet 10 according to this embodiment.
- the manufacturing process of the grain-oriented electrical steel sheet 10 includes a casting process S2, a hot rolling process S4, an annealing process S6, a cold rolling process S8, a decarburizing annealing process S10, and an annealing separation.
- An agent coating step S12, a final finish annealing step S14, an insulating film forming step S16, and a laser irradiation step S18 are included.
- the molten steel adjusted to a predetermined composition is supplied to a continuous casting machine to continuously form an ingot.
- the ingot is heated to a predetermined temperature (for example, 1150 to 1400 ° C.) to perform hot rolling. Thereby, a hot-rolled material having a predetermined thickness (for example, 1.8 to 3.5 mm) is formed.
- the hot-rolled material is heat-treated, for example, under conditions of a heating temperature of 750 to 1200 ° C. and a heating time of 30 seconds to 10 minutes.
- the cold rolling step S8 the surface of the hot rolled material is pickled and then cold rolled. Thereby, a cold-rolled material having a predetermined thickness (for example, 0.1 to 0.4 mm) is formed.
- the cold-rolled material is heat-treated, for example, under conditions of a heating temperature of 700 to 900 ° C. and a heating time of 1 to 3 minutes to form the steel plate body 12.
- An oxide layer mainly composed of silica (SiO 2 ) is formed on the surface of the steel plate body 12.
- an annealing separator mainly composed of magnesia (MgO) is applied on the oxide layer of the steel plate body 12.
- the steel sheet main body 12 coated with the annealing separator is wound in a coil shape and inserted into a batch furnace to perform heat treatment.
- the heat treatment conditions are, for example, a heating temperature of 1100 to 1300 ° C. and a heating time of 20 to 24 hours.
- a grain-oriented electrical steel sheet having high crystal orientation (crystal orientation) after finish annealing is obtained.
- the glass layer 14 made of forsterite (Mg 2 SiO 4 ) is formed on the surface of the steel plate body 12 by the reaction between the oxide layer and the annealing separator in the final finish annealing step S14.
- insulating film formation process S16 the steel plate main body 12 wound up by the coil shape is unwound, extended into a plate shape, and conveyed. And an insulating agent is apply
- the steel plate body 12 on which the insulating film 16 is formed is wound in a coil shape.
- the steel sheet body 12 wound in a coil shape is unwound and stretched into a plate shape and conveyed. Then, a laser beam is focused and irradiated on one surface of the steel sheet main body 12 by a laser irradiation device to be described later, and is scanned in the substantially width direction of the electromagnetic steel sheet conveyed in the rolling direction (conveyance direction). Thereby, linear distortion substantially orthogonal to the rolling direction is formed on the surface of the steel plate body 12 at predetermined intervals in the rolling direction. In addition, you may perform condensing and scanning of this laser beam from both the surface of the steel plate main body 12, and a back surface.
- the steel sheet body 12 on which the insulating film 16 is formed is wound into a coil shape and then sent to the laser irradiation step S18.
- the laser irradiation is performed immediately after the insulating film is formed, and then the coil shape is formed. It is also possible to wind up.
- the glass coating 14 and the insulating coating 16 are formed on the surface of the steel plate body 12, and the grain-oriented electrical steel plate 10 whose magnetic domain is controlled by laser irradiation is manufactured.
- FIG. 3 is a schematic diagram illustrating a configuration example of the laser processing apparatus 100 according to the present embodiment.
- FIG. 4 is a schematic diagram illustrating a configuration example of one laser irradiation device 106.
- the laser processing apparatus 100 irradiates a laser beam from above the insulating film 16 of the grain-oriented electrical steel sheet 10 that is conveyed at a constant speed in the rolling direction, and imparts linear distortion substantially orthogonal to the rolling direction.
- the laser processing apparatus 100 includes a plurality of laser oscillators 102, laser beam transmission paths 104, and laser irradiation apparatuses 106.
- the laser processing apparatus 100 includes a plurality of laser oscillators 102, laser beam transmission paths 104, and laser irradiation apparatuses 106.
- three laser oscillators 102, a laser beam transmission path 104, and a laser irradiation device 106 are shown, but each configuration is the same.
- the laser oscillator 102 emits a high-power laser beam of, for example, 100 W or more.
- the laser oscillator 102 is preferably an oscillator that emits a laser beam having a wavelength of more than 7 ⁇ m.
- the laser oscillator 102 for example, a CO 2 laser having a laser beam wavelength of 10.6 ⁇ m is used.
- the laser oscillator 102 emits a linearly polarized laser beam having a predetermined polarization direction. The reason for using a linearly polarized laser beam will be described later.
- the laser oscillator 102 may be a continuous wave laser or a pulsed laser.
- the linearly polarized light in the present invention is 0.9 or more and less than 1.0.
- the degree of polarization is That is, when a linearly polarized laser having a polarization degree of 0.9 or more and less than 1.0 (90% or more and less than 100%) was used, the results of Examples described later were obtained.
- the ratio of the linearly polarized light component can be analyzed by separating the linearly polarized light using an orthogonal prism or the like.
- the laser irradiation device 106 condenses the laser beam transmitted from the laser oscillator 102 through the laser beam transmission path 104 onto the directional electromagnetic steel sheet 10 and scans it in a direction substantially orthogonal to the rolling direction.
- the width in which one laser irradiation device 106 can scan the laser beam may be smaller than the plate width of the grain-oriented electrical steel sheet 10, but a plurality of laser irradiation devices 106 are arranged in the plate width direction as shown in FIG. Thus, the laser beam can be scanned over the entire width of the grain-oriented electrical steel sheet 10.
- the laser irradiation device 106 includes a ⁇ / 2 plate 125, a metal mirror 126, a polygon mirror 128, and a parabolic mirror 130.
- the ⁇ / 2 plate 125 is inserted to adjust the direction of linearly polarized light by changing its rotation angle. Note that the ⁇ / 2 plate 125 can be omitted when the direction of linearly polarized light on the steel plate surface is in a predetermined direction to be described later. Further, as an element for changing the direction of linearly polarized light, a Faraday rotator or the like can be used instead of the ⁇ / 2 plate 125.
- the laser beam emitted from the laser oscillator 102 is linearly polarized.
- the laser beam emitted from the laser oscillator 102 is not necessarily linearly polarized.
- a polarizing beam splitter may be installed in front of the ⁇ / 2 plate 125 to make it linearly polarized light. If this polarizing beam splitter can be rotated around the center axis of the laser beam, the direction of linearly polarized light on the steel plate surface can be adjusted to a predetermined direction without installing the ⁇ / 2 plate 125.
- a linearly polarized laser beam can be incident on the metal mirror 126. The reason why the laser beam is linearly polarized will be described later.
- the metal mirror 126 is a mirror for restricting and adjusting the beam diameter in the plate width direction (see FIG. 5) of the directional electromagnetic steel sheet 10 of the incident laser beam.
- a cylindrical mirror having a curvature in one axial direction or a parabolic mirror can be used as the metal mirror 126.
- the laser beam reflected by the metal mirror 126 is incident on the polygon mirror 128 that rotates at a predetermined rotation speed.
- the polygon mirror 128 is a rotatable polyhedron, and scans the laser beam in the plate width direction of the directional electromagnetic steel sheet 10 by rotating. While the laser beam is incident on one surface of the polyhedron of the polygon mirror 128, the laser beam is scanned in one linear region along the plate width direction on the directional electromagnetic steel sheet 10 as the surface rotates. Thus, residual strain is given to the linear region. As the polygon mirror rotates, the scanning of the laser beam is repeated, and at the same time, the directional electromagnetic steel sheet 10 is conveyed in the rolling direction. As a result, a region having linear residual strain on the directional electromagnetic steel sheet 10 is obtained. It will be formed periodically in the rolling direction. Note that the cycle in the rolling direction of the linear region is adjusted by the conveyance speed of the directional electromagnetic steel sheet 10 and the rotation speed of the polygon mirror 128.
- the parabolic mirror 130 is a mirror for narrowing and adjusting the beam diameter in the rolling direction of the laser beam reflected by the polygon mirror 128.
- the laser beam reflected by the parabolic mirror 130 is focused on the surface of the grain-oriented electrical steel sheet 10.
- FIG. 5 is a diagram showing a condensing shape of the laser beam on the grain-oriented electrical steel sheet 10.
- the condensing shape of the laser beam is an ellipse as shown in FIG.
- the major axis direction of the ellipse is parallel to the scanning direction of the laser beam
- the minor axis direction of the ellipse is orthogonal to the scanning direction.
- the minor axis direction of the ellipse is parallel to the rolling direction.
- the temperature can be raised to a deep position inside the grain-oriented electrical steel sheet 10, which is effective in reducing iron loss.
- the beam diameter in the plate width direction is reduced by the metal mirror 126 and the beam diameter in the rolling direction is reduced by the parabolic mirror 130, so that the condensing shape of the laser beam becomes an ellipse.
- the power density is reduced by expanding the condensing area of the laser beam as compared with the case where the condensing shape is a perfect circle. As a result, it is possible to prevent a steep temperature gradient with respect to the thickness direction in the vicinity of the surface of the grain-oriented electrical steel sheet 10, which is effective for suppressing generation of wrinkles in the glass film 14.
- the condensing shape of the laser beam on the grain-oriented electrical steel sheet 10 is an ellipse is illustrated, but the present invention is not limited to this.
- the condensing shape of the laser beam may be a perfect circle.
- the intensity distribution of the laser beam it is desirable to set the intensity distribution of the laser beam so that the beam diameter in the rolling direction (width including 86% of integrated intensity) is 200 ⁇ m or less.
- the beam diameter in the rolling direction width including 86% of integrated intensity
- iron loss can be greatly reduced by forming a narrow circulating magnetic domain while further suppressing the spread of heat conduction in the rolling direction.
- the beam diameter is 120 ⁇ m or less.
- FIG. 6 is a schematic diagram showing a state in which a laser beam is incident on the directional electromagnetic steel sheet 10.
- one laser irradiation device 106 scans a laser beam to a predetermined laser scanning width L in the scanning direction, as shown in FIG. 6, the incident state of the laser beam at the central portion P1 of the laser scanning width L and the laser scanning The incident state of the laser beam at the end portions P2 and P3 having the width L is different.
- the laser beam reflected by the parabolic mirror 130 of the laser irradiation device 106 is perpendicularly incident on the surface of the directional electromagnetic steel sheet 10 (insulating film 16). .
- the laser beam is incident obliquely on the surface of the directional electromagnetic steel sheet 10 (incident at an incident angle ⁇ with respect to the normal direction of the surface). That is, when the incident position of the laser beam coincides with the central portion P1 of the laser scanning width L, the angle formed by the direction (normal direction) perpendicular to the surface of the directional electromagnetic steel sheet 10 and the propagation direction of the laser beam ( The incident angle ⁇ of the laser beam is 0 °. On the other hand, the closer the incident position of the laser beam is to the end portion P2 or P3 of the laser scanning width L, the larger the incident angle ⁇ of the laser beam.
- FIG. 7A and 7B are schematic views showing the path length of the laser beam in the insulating film 16.
- FIG. 7A shows the path length e1 in the insulating film 16 and the path length e1 'in the glass film 14 of the laser beam incident on the insulating film 16 at the central portion P1 of the laser scanning width L.
- FIG. 7B shows the path length e2 in the insulating film 16 and the path length e2 'in the glass film 14 of the laser beam incident on the insulating film 16 at the end P2 of the laser scanning width L.
- the path length of the laser beam incident on the insulating film 16 at the end P3 of the laser scanning width L is the same as that in FIG. 7B.
- the transmittance of the laser beam inside the insulating film 16 and inside the glass film 14 is expressed by exp ( ⁇ L) according to the well-known Lambert-Beer law.
- ⁇ is an absorption coefficient
- L is a path length.
- the path length e2 (e2 ′) is longer than the path length e1 (e1 ′), and therefore the insulating film 16 (glass film) is formed at the end P2 (P3) of the laser scanning width L. The absorption of the laser beam with respect to 14) is increased.
- the laser beam focused on the surface of the grain-oriented electrical steel sheet 10 is linearly polarized and, as shown in FIG.
- the angle ⁇ formed by the laser beam scanning direction is set to be more than 45 ° and not more than 90 °.
- FIG. 8 is a schematic diagram showing the relationship between the direction of linearly polarized light and the scanning direction of the laser beam when the incident angle ⁇ of the laser beam is 0 °. If the angle ⁇ between the scanning direction of the laser beam and the direction of the linearly polarized light is greater than 45 ° and not more than 90 °, the relationship between the direction of the linearly polarized light and the scanning direction of the laser beam is symmetrical with respect to FIG. It may be a natural relationship.
- the angle ⁇ is set to more than 45 ° and not more than 90 ° as in the present embodiment, the laser beam absorptivity at the end portions P2 and P3 of the laser scanning width L can be reduced as described later. Even if the path length of the laser beam becomes long at the end portions P2 and P3 of the laser scanning width L, an increase in power absorbed by the insulating film 16 can be suppressed. As a result, the generation of wrinkles of the glass film 14 at the ends P2 and P3 of the laser scanning width L can be suppressed.
- a part of the laser beam incident on the grain-oriented electrical steel sheet 10 is reflected by the insulating film 16, and the rest is incident on the insulating film 16.
- a part of the laser beam incident on the insulating film 16 is absorbed inside the insulating film 16 and reaches the upper surface of the glass film 14, where a part of the laser beam is reflected and the rest is incident on the glass film 14.
- a part of the laser beam incident on the glass coating 14 is absorbed inside the glass coating 14, reaches the upper surface of the steel plate body (hereinafter also referred to as ground iron) 12, and a part of the laser beam is absorbed by the surface of the steel plate body 12. Is done.
- the power of the laser beam transmitted to the grain-oriented electrical steel sheet 10 depends on the absorption rate of the laser beam absorbed by the insulating film 16 and the like as described above. If the absorption rate of the laser beam in the insulating film 16 or the like is large, the power of the laser beam transmitted to the grain-oriented electrical steel sheet 10 also increases.
- linearly polarized light usually includes P-polarized light (also referred to as P-wave) and S-polarized light (also referred to as S-wave). It is known that the absorption rate of P-polarized light is different from that of S-polarized light. For this reason, the power of the laser beam transmitted to the directional electromagnetic steel sheet 10 also changes in accordance with the proportion absorbed by the P-polarized and S-polarized insulating film 16 and the like.
- FIG. 9A shows the electric field vibration direction of P-polarized light when the linearly polarized light LB is incident on the surface of the directional electromagnetic steel sheet 10 at an incident angle ⁇ .
- FIG. 9B shows the electric field vibration direction of S-polarized light when the linearly polarized light LB is incident on the surface of the directional electromagnetic steel sheet 10 at an incident angle ⁇ .
- the electric field vibration direction of P-polarized light and the electric field vibration direction of S-polarized light are different.
- FIG. 10 is a graph showing the absorptance of the P-polarized light and the S-polarized light of the laser beam with respect to the upper surface of the ground iron 12.
- the absorption rate of P-polarized light is larger than the absorption rate of S-polarized light.
- the incident angle ⁇ of the laser beam linearly polarized light
- the P-polarized light absorption rate increases and the S-polarized light absorption rate decreases.
- FIG. 10 shows the absorptance with respect to the upper surface of the base iron 12 remaining after the insulating film 16 and the glass film 14 are removed from the grain-oriented electrical steel sheet 10, and the absorptance on the upper surface of the insulating film 16 and the glass film.
- the absorptance on the upper surface of 14 also shows the same tendency as in FIG.
- the angle ⁇ formed by the direction of linearly polarized light and the scanning direction of the laser beam is set to 45 °. It is set to 90 ° or less.
- the influence of S-polarized light becomes dominant among P-polarized light and S-polarized light. Accordingly, even at the end portions P2 and P3 of the laser scanning width L, even if the path length of the laser beam through the insulating film 16 and the glass film 14 is increased, the absorption of the laser beam into the insulating film 16 and the glass film 14 is reduced. be able to.
- the temperature rise in the insulating film 16 and the like can be suppressed, the generation of wrinkles on the glass film 14 at the ends P2 and P3 of the laser scanning width L can be reduced.
- the angle ⁇ between the direction of linearly polarized light and the scanning direction of the laser beam is set to 70 ° or more and 90 ° or less, the influence of S polarization becomes more dominant, and the insulating film 16 and the glass film 14 are affected. Since the absorption of the laser beam is further lowered, the generation of wrinkles of the glass film 14 at the ends P2 and P3 of the laser scanning width L can be further reduced.
- the wavelength of the laser beam to be scanned is more than 7 ⁇ m.
- the insulating film 16 is opaque to the laser beam, and the laser beam is easily absorbed by the insulating film 16 and the glass film 14.
- a large amount of power is applied to the insulating film 16 at the end portions P2 and P3 of the laser scanning width L when the laser beam is obliquely incident. And is easily absorbed by the glass coating 14.
- the angle ⁇ is more than 45 ° and not more than 90 ° as described above, the laser beam insulating film 16 and the glass film 14 are respectively exposed at the end portions P2 and P3 of the laser scanning width L. Since the reflection on the surface increases and the absorption decreases, the power incident on each of the insulating film 16 and the glass film 14 decreases. As a result, since the power absorbed in each of the insulating coating 16 and the glass coating 14 of the laser beam can be reduced, the effectiveness of the present embodiment is further exhibited.
- the inventor of the present application when the enlargement ratio of the path length with respect to the path length (e1 + e1 ′ in FIG. 7A; hereinafter referred to as a reference path length) when the incident angle ⁇ of the laser beam is 0 ° exceeds 19%, As described above, even if the angle ⁇ between the direction of linearly polarized light and the scanning direction is set to be more than 45 ° and not more than 90 °, the laser beam absorptance at the ends P2 and P3 of the laser scanning width L is sufficiently reduced. (In other words, it was found that wrinkles are likely to occur in the glass film 14 at the ends P2 and P3 of the laser scanning width L).
- the left side indicates the enlargement ratio of the path length (path length at the maximum incident angle ⁇ MAX ) with respect to the reference path length. Therefore, according to the conditional expression (1), it is possible to obtain the maximum incident angle ⁇ MAX in which the enlargement ratio with respect to the reference path length does not exceed 19%. From the conditional expression (1), it can be seen that the maximum incident angle ⁇ MAX is preferably 33 ° or less.
- N is preferably 11 or more.
- a galvano mirror 140 may be used instead of the polygon mirror 128.
- the galvanometer mirror 140 is rotationally driven by a drive motor 141 in the direction of the arrow in the figure.
- the laser beam is scanned along the plate width direction (scanning direction) of the directional electromagnetic steel sheet 10.
- the incident angle ⁇ of the laser beam can be controlled by controlling the rotation angle of the galvanometer mirror 140. Accordingly, it is easy to set the maximum incident angle ⁇ MAX of the laser beam to an appropriate value by using the galvanometer mirror 140.
- the laser oscillator 102 emits a linearly polarized laser beam, but the present invention is not limited to this.
- the laser oscillator 102 may emit a non-polarized laser beam, and a polarizer such as a polarizing beam splitter may be provided in front of the metal mirror 126 to make the non-polarized laser beam linearly polarized light having a predetermined polarization direction. good.
- the angle ⁇ described above may be adjusted by adjusting the rotation angle of the polarizing beam splitter around the central axis of the laser beam.
- the grain-oriented electrical steel sheet 10 applied with a magnetic field in the rolling direction has a structure in which a plurality of magnetic domains in which the rolling direction and the magnetization direction substantially coincide with each other are arranged.
- a circulating magnetic domain having a narrow and sufficient strength can be obtained. It is effective to obtain.
- the power of the laser beam is absorbed at the ends P2 and P3 of the laser scanning width L due to the expansion of the path length.
- the power of the laser beam may be reduced.
- the generation of wrinkles at the end portions P2 and P3 can be reduced.
- the power of the laser beam is reduced to the center portion P2 of the laser scanning width L.
- linearly polarized light including S-polarized light whose absorptance decreases as the incident angle ⁇ increases. are scanned on the grain-oriented electrical steel sheet 10.
- linearly polarized light is incident perpendicular to the surface of the directional electromagnetic steel sheet 10 (the incident angle ⁇ shown in FIGS. 6 and 9 is small).
- P-polarized light and S-polarized light have substantially the same absorptance (see FIG. 10).
- the laser processing apparatus 100 of the present embodiment Since there is no difference in the absorptivity between the P-polarized light and the S-polarized light constituting the non-polarized state, there is almost no decrease in the absorptance due to the S-polarized light. For this reason, according to the laser processing apparatus 100 of the present embodiment, absorption is performed at the end portions P2 and P3 without reducing the power of the laser beam transmitted to the directional electromagnetic steel sheet 10 at the central portion P1 of the laser scanning width L. Only the power of the emitted laser beam can be reduced. Therefore, reduction of iron loss and suppression of flaws are realized over the entire laser scanning width L.
- the CO 2 laser is exemplified as the laser oscillator 102 that emits a laser beam having a wavelength exceeding 7 ⁇ m, but the present invention is not limited to this.
- a fiber laser, a Raman fiber laser, a quantum cascade laser, or the like may be used as a laser oscillator that emits a laser beam having a wavelength exceeding 7 ⁇ m.
- the laser processing apparatus 100 of the present embodiment also applies to the steel sheet having the basic structure of the base iron 12 and the two layers of the insulating film 16. Demonstrates the effect of reducing wrinkle generation. Even if the glass film 14 is not present, the laser beam is absorbed by the insulating film 16 at the ends P2 and P3 of the laser scanning width L by setting the laser beam to linearly polarized light and setting the angle ⁇ within the above-described range. It is because it can reduce.
- a grain-oriented electrical steel sheet having ultra-low iron loss characteristics is known because the surface roughness of the ground iron is small and close to a mirror surface.
- the grain-oriented electrical steel sheet having such an ultra-low iron loss characteristic in order to prevent the generation of rust due to the exposure of the base iron 12, it is necessary not to generate flaws in the insulating film 16 during the laser beam irradiation. It becomes a point.
- the laser processing apparatus 100 of this embodiment is effective in reducing this wrinkle generation as described above.
- Si 3.0% by mass
- C 0.05% by mass
- Mn 0.1% by mass
- acid-soluble Al 0.02% by mass
- N 0.01% by mass
- S 0.01% by mass %
- P 0.02 mass%
- a slab having a composition of the balance being Fe and inevitable impurities was prepared.
- the slab was hot rolled at 1280 ° C. to produce a hot rolled material having a thickness of 2.3 mm.
- heat treatment was performed on the hot-rolled material under conditions of 1000 ° C. ⁇ 1 minute. After the heat treatment, the steel sheet was pickled and then cold rolled to produce a cold rolled material having a thickness of 0.23 mm.
- the cold-rolled material was decarburized and annealed under conditions of 800 ° C. ⁇ 2 minutes.
- the annealing separation material which has a magnesia as a main component was apply
- coated the annealing separation material was charged in the batch type furnace in the state wound up in the shape of a coil, and finish annealing was implemented on the conditions of 1200 degreeC x 20 hours. Thereby, the steel plate base iron (steel plate main body) in which the glass film was formed on the surface was produced.
- an insulating material made of aluminum phosphate was applied and baked (850 ° C. ⁇ 1 minute) on the glass film to form an insulating film.
- the laser beam was irradiated with respect to the steel plate iron in which the insulating film and the glass film were formed, and the distortion was provided to the surface of the steel plate iron.
- a laser irradiation device 106 shown in FIG. 4 was used as the laser irradiation device, and a CO 2 laser was used as the laser oscillator 102.
- a ⁇ / 2 plate 125 provided between the laser oscillator 102 and the metal mirror 126 is rotated in the optical path with respect to the linearly polarized laser beam emitted from the laser oscillator 102. By doing so, the laser beam was condensed and scanned on the directional electromagnetic steel sheet 10 while changing the angle ⁇ between the direction of linearly polarized light and the scanning direction.
- a ⁇ / 4 plate was provided instead of the ⁇ / 2 plate 125, and the laser beam was condensed and scanned on the directional electromagnetic steel sheet 10 under the condition that the laser beam was circularly polarized.
- This circularly polarized light contains 50% each of P-polarized light and S-polarized light.
- the irradiation conditions of the laser beam reaching the grain-oriented electrical steel sheet 10 are as follows: the laser beam power is 2 kW, the scanning beam diameter is 4 mm, and the rolling beam diameter is 0.15 mm.
- the laser scanning width of the laser beam was 500 mm.
- the maximum incident angle ⁇ MAX was 24 °.
- coat 14 was performed by the wet test.
- the wet test was conducted according to JISK2246-5.34, and the test conditions were a temperature of 50 ° C., a humidity of 98%, and a test time of 72 hours. Then, the presence or absence of rust generation
- the occurrence of rust can be completely prevented by setting the angle ⁇ to 70 ° or more and 90 ° or less.
- the angle ⁇ was 60 °
- rust was not confirmed at the end of the laser scanning width, but the glass coating 14 was partially damaged.
- this damaged part was observed with an optical microscope, the glass coating 14 was damaged, but the ground iron part was not exposed. For this reason, it is considered that rust was not generated.
- the cross section was observed with a microscope, the glass coating 14 at the end of the laser scanning width was sound when the angle ⁇ was 70 ° or more.
- the angle range in which the influence of the S-polarized light can be dominant among the P-polarized light and the S-polarized light that is, the angle ⁇ is set to be more than 45 ° and not more than 90 °, compared with the case of no polarization. It can be seen that the absorptance of the laser beam at the end of the laser scanning width can be reduced, and as a result, the effect of reducing the occurrence of rust at the end of the laser scanning width can be obtained.
- the angle ⁇ between the direction of linearly polarized light scanned by the directional electromagnetic steel sheet 10 and the scanning direction is set to be greater than 45 ° and less than 90 °.
- the absorptance of the laser beam at the end portions P2 and P3 of the glass coating 14 with the laser scanning width L can be reduced, so that the laser beam path length at the end portions P2 and P3 is caused by the oblique incidence. Even if it becomes longer, it is possible to suppress an increase in power absorbed by the insulating film 16 and the glass film 14 at the ends P2 and P3. As a result, it is possible to suppress wrinkling of the glass film 14 at the ends P2 and P3 of the laser scanning width L. Further, as described above, the absorption power of the laser beam in the central portion P1 of the laser scanning width L does not decrease, so the iron loss reduction effect does not deteriorate in the central portion P1. That is, it is possible to realize both the point of reducing iron loss and the prevention of wrinkles in the glass coating 14 over the entire laser scanning width L.
- the grain-oriented electrical steel sheet 10 with low iron loss is manufactured while suppressing generation of wrinkles in the glass film 14 by reducing the iron loss and suppressing wrinkles of the glass film 14. It becomes possible. For this reason, the cost increase factor by re-application of the insulating film 16 resulting from the wrinkles generated in the glass film 14 can be eliminated. As a result, it becomes possible not only to supply the directional electrical steel sheet 10 with extremely low iron loss at a lower cost, but also to reduce the energy consumption by widely spreading the directional electrical steel sheet 10 with extremely low iron loss to the world. From the viewpoint that reduction can be realized, a great economic effect is produced.
Abstract
Description
方向性電磁鋼板が磁化されるとき、鉄損等のエネルギー損失が発生する。近年では、地球温暖化の進行に伴い、電気機器の省エネルギー化が世界的に求められている。従って、方向性電磁鋼板の鉄損をより低減可能な技術が必要である。
このレーザ磁区制御法によれば、レーザビームの走査により、方向性電磁鋼板の最表層に、板厚方向に対して強い温度勾配を有する温度履歴が与えられる。このような温度履歴が与えられることにより、方向性電磁鋼板の地鉄の表面に残留歪みが発生し、その残留歪みが原因で環流磁区が形成される。この還流磁区により、180°磁壁間隔が細分化され、その結果、方向性電磁鋼板の異常渦電流損が低減される。
このような光学系が用いられる場合、レーザ走査幅の中央部においては、レーザビームは方向性電磁鋼板の表面に対して垂直に入射する。つまり、レーザビームの入射位置がレーザ走査幅の中央部と一致する場合、方向性電磁鋼板の表面に対して直交する方向(法線方向)とレーザビームの伝播方向とのなす角度(レーザビームの入射角φ)は、0°になる。一方、レーザビームの入射位置がレーザ走査幅の端部に近づくほど、レーザビームの入射角φは大きくなる。
このような光学系では、レーザビームの入射位置がレーザ走査幅の中央部から端部に近づくほど(レーザビームの入射角φが大きくなるほど)、絶縁皮膜およびグラス皮膜内でのレーザビームの経路長が長くなるため、絶縁皮膜に対するレーザビームの吸収が高まることになる。従って、レーザ走査幅の端部において、中央部よりも鋼板に対してより多くのパワーが付与される結果、グラス皮膜に疵が発生するリスクが高まる。
(1)本発明の一態様に係るレーザ加工装置は、方向性電磁鋼板にレーザビームを集光して走査方向に走査して、前記方向性電磁鋼板の磁区を細分化するためのレーザ加工装置であって、前記方向性電磁鋼板に集光されるレーザビームが、直線偏光であり、前記直線偏光の向きと、前記走査方向との成す角度が、45°超90°以下である。
1/cosφMAX≦1.19 …(1)
方向性電磁鋼板は、鋼板の結晶粒の磁化容易軸(体心立方晶の<100>方向)が製造工程における圧延方向に略揃っている電磁鋼板である。上記のような方向性電磁鋼板において、圧延方向と磁化方向とが一致する複数の磁区が、磁壁に仕切られた状態で配列している。このような方向性電磁鋼板は圧延方向に磁化しやすいため、磁力線の方向がほぼ一定であるトランスの鉄芯材料として適している。
トランス用のコア(鉄芯)は、巻きコアと積層コアとに大別される。巻きコアの製造工程では、鋼板に巻き変形を加えながらコアの形状に組み上げた後に、その機械的な変形で導入された歪みを除去するために焼鈍が行われる。しかしながら、この焼鈍過程においては、上述のようにレーザ照射により導入された歪みも除去されるので、磁区の細分化効果が消失してしまう。一方、積層コアの製造工程では、上記のような歪除去用の焼鈍工程は不要である。従って、本実施形態に係る方向性電磁鋼板は、特に積層コアの材料として適している。
図2を参照しながら、本実施形態に係る方向性電磁鋼板10の製造方法について説明する。図2は、本実施形態に係る方向性電磁鋼板10の製造工程の一例を示すフローチャートである。
図3及び図4を参照しながら、方向性電磁鋼板10にレーザビームを照射して残留歪を付与するレーザ加工装置100の構成例について説明する。図3は、本実施形態に係るレーザ加工装置100の構成例を示す模式図である。図4は、一つのレーザ照射装置106の構成例を示す模式図である。
尚、本発明における直線偏光レーザとして、一方向にのみ振動する電界成分(直線偏光成分)を有するレーザ光を使用することが理想的であるが、厳密には、その直線偏光成分に対して直交する電界成分(直交成分)も極わずかに存在する。直線偏光成分のパワーと直交成分のパワーとの比は、上述の偏光ビームスプリッタ124の性能やレーザ発振器102の性能に依存する。直線偏光成分のパワーをPW1とし、その直交成分のパワーをPW2とした時、(PW1/(PW1+PW2))を偏光度として定義した場合、本発明における直線偏光は、0.9以上1.0未満の偏光度を有する。すなわち、0.9以上1.0未満(90%以上100%未満)の偏光度を有する直線偏光レーザを用いた場合に、後述の実施例の結果が得られた。なお、直交プリズムなどを用いて直線偏光を分離することにより、直線偏光成分の割合を解析することができる。
レーザ照射装置106が方向性電磁鋼板10の表面に所定のレーザ走査幅に亘ってレーザビームを走査する際に、レーザ走査幅の中央部と端部において方向性電磁鋼板10の表面に対するレーザビームの入射状態が異なる。
すなわち、レーザビームの入射位置がレーザ走査幅Lの中央部P1と一致する場合、方向性電磁鋼板10の表面に対して直交する方向(法線方向)とレーザビームの伝播方向とのなす角度(レーザビームの入射角φ)は、0°になる。一方、レーザビームの入射位置がレーザ走査幅Lの端部P2またはP3に近づくほど、レーザビームの入射角φは大きくなる。
ここで、直線偏光の向きと、レーザビームの走査方向との成す角度θによって、レーザビームの吸収率が低下する原理について説明する。
これは、基準経路長に対する経路長の拡大率が19%を超えると、経路長の拡大に起因する吸収パワーの増加量を、レーザビーム(直線偏光)の吸収率の低下量で補えなくなることが原因と考えられる。
そこで、レーザ走査幅Lの全体にわたって確実にグラス皮膜14の疵発生を防止するために、レーザビームの最大入射角φMAXを以下の条件式(1)に基づいて設定することが好ましい。
1/cosφMAX ≦ 1.19 …(1)
ところで、圧延方向に磁界をかけられた方向性電磁鋼板10は、前述したように、圧延方向と磁化方向とがほぼ一致する磁区を複数配列した構造を有する。ここで、方向性電磁鋼板10の鉄損の更なる低減を図るためには、レーザビームの照射により磁区を細分化する(磁区を狭くする)ことが有効である。特に、方向性電磁鋼板10の最表層近傍の圧延方向に沿って存在するごく狭い幅の領域の板厚方向に対して大きな温度勾配を与えることにより、狭く且つ十分な強度を持った環流磁区を得ることが有効である。
上述した本実施形態に係る実施例の有効性を確認するために、本実施例及び比較例に係る確認試験例について説明する。
上述したように、本実施形態に係るレーザ加工装置100において、方向性電磁鋼板10に走査される直線偏光の向きと走査方向との成す角度θが、45°超90°以下に設定される。
12 鋼板本体
14 グラス皮膜
16 絶縁皮膜
100 レーザ加工装置
102 レーザ発振器
104 レーザビーム伝送路
106 レーザ照射装置
125 λ/2板
126 金属ミラー
128 ポリゴンミラー
130 放物面ミラー
Claims (5)
- 方向性電磁鋼板にレーザビームを集光して走査方向に走査して、前記方向性電磁鋼板の磁区を細分化するためのレーザ加工装置であって、
前記方向性電磁鋼板に集光されるレーザビームは、直線偏光であり、
前記直線偏光の向きと、前記走査方向との成す角度が、45°超90°以下であることを特徴とする、レーザ加工装置。 - 請求項1に記載のレーザ加工装置であって、
前記方向性電磁鋼板に対する前記レーザビームの最大入射角φMAXが、下記条件式(1)を満たすことを特徴とするレーザ加工装置。
1/cosφMAX≦1.19 …(1) - 請求項1または2に記載のレーザ加工装置であって、
前記方向性電磁鋼板に集光されるレーザビームの波長は、7μm超であることを特徴とする、レーザ加工装置。 - 請求項1~3のいずれか1項に記載のレーザ加工装置であって、
レーザビームを出射するレーザ発振器を更に備え、
前記レーザ発振器は、直線偏光を出射するCO2レーザであることを特徴とする、レーザ加工装置。 - 請求項1~4のいずれか1項に記載のレーザ加工装置であって、
前記方向性電磁鋼板に集光されたレーザビームの集光形状が、楕円であり、
前記楕円の短軸方向が前記走査方向に対して直交することを特徴とする、レーザ加工装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2016151358A RU2661977C1 (ru) | 2014-07-03 | 2014-07-03 | Устройство лазерной обработки |
JP2016530754A JP6341279B2 (ja) | 2014-07-03 | 2014-07-03 | レーザ加工装置 |
EP14896916.5A EP3165615B1 (en) | 2014-07-03 | 2014-07-03 | Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet |
CN201480080155.9A CN106471140B (zh) | 2014-07-03 | 2014-07-03 | 激光加工装置 |
US15/322,399 US11498156B2 (en) | 2014-07-03 | 2014-07-03 | Laser processing apparatus |
PL14896916.5T PL3165615T3 (pl) | 2014-07-03 | 2014-07-03 | Zastosowanie urządzenia dla procesów obróbki laserowej dla rafinacji domen magnetycznych blachy cienkiej ze stali elektromagnetycznej o ziarnach zorientowanych |
BR112016030522-1A BR112016030522B1 (pt) | 2014-07-03 | 2014-07-03 | aparelho de processamento a laser |
KR1020177000034A KR101881708B1 (ko) | 2014-07-03 | 2014-07-03 | 레이저 가공 장치 |
PCT/JP2014/067754 WO2016002036A1 (ja) | 2014-07-03 | 2014-07-03 | レーザ加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/067754 WO2016002036A1 (ja) | 2014-07-03 | 2014-07-03 | レーザ加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016002036A1 true WO2016002036A1 (ja) | 2016-01-07 |
Family
ID=55018635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/067754 WO2016002036A1 (ja) | 2014-07-03 | 2014-07-03 | レーザ加工装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US11498156B2 (ja) |
EP (1) | EP3165615B1 (ja) |
JP (1) | JP6341279B2 (ja) |
KR (1) | KR101881708B1 (ja) |
CN (1) | CN106471140B (ja) |
BR (1) | BR112016030522B1 (ja) |
PL (1) | PL3165615T3 (ja) |
RU (1) | RU2661977C1 (ja) |
WO (1) | WO2016002036A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3165615B1 (en) * | 2014-07-03 | 2022-12-21 | Nippon Steel Corporation | Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet |
CN113088673A (zh) * | 2021-03-25 | 2021-07-09 | 苏州健雄职业技术学院 | 一种适用于深孔类结构激光斜冲击工艺参数设计方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6383227A (ja) * | 1986-09-26 | 1988-04-13 | Nippon Steel Corp | 電磁鋼板の鉄損値改善方法 |
Family Cites Families (191)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3192078A (en) * | 1963-12-30 | 1965-06-29 | Daniel I Gordon | Method of making magnetic cores having rectangular hysteresis loops by bombardment with electrons |
DE1804208B1 (de) * | 1968-10-17 | 1970-11-12 | Mannesmann Ag | Verfahren zur Herabsetzung der Wattverluste von kornorientierten Elektroblechen,insbesondere von Wuerfeltexturblechen |
GB1246756A (en) * | 1969-04-16 | 1971-09-22 | Tokyo Shibaura Electric Co | Measuring dimensions of objects |
BE789262A (fr) * | 1971-09-27 | 1973-01-15 | Nippon Steel Corp | Procede de formation d'un film isolant sur un feuillard d'acierau silicium oriente |
US3848104A (en) * | 1973-04-09 | 1974-11-12 | Avco Everett Res Lab Inc | Apparatus for heat treating a surface |
US3947053A (en) * | 1973-05-25 | 1976-03-30 | Vereinigte Baubeschlagfabriken Gretsch & Co. | Retaining mechanism for safety ski bindings |
JPS5423647B2 (ja) * | 1974-04-25 | 1979-08-15 | ||
LU71852A1 (ja) * | 1975-02-14 | 1977-01-05 | ||
JPS5933802B2 (ja) | 1975-05-16 | 1984-08-18 | ジェイエスアール株式会社 | 反応熱の利用方法 |
US4169976A (en) * | 1976-02-27 | 1979-10-02 | Valfivre S.P.A. | Process for cutting or shaping of a substrate by laser |
US4157923A (en) * | 1976-09-13 | 1979-06-12 | Ford Motor Company | Surface alloying and heat treating processes |
JPS5518566A (en) * | 1978-07-26 | 1980-02-08 | Nippon Steel Corp | Improving method for iron loss characteristic of directional electrical steel sheet |
US4304978A (en) * | 1978-10-05 | 1981-12-08 | Coherent, Inc. | Heat treating using a laser |
DE2918283C2 (de) * | 1979-05-07 | 1983-04-21 | Carl Baasel, Lasertechnik KG, 8000 München | Gerät zur Substratbehandlung mit einem Drehspiegel od. dgl. |
US4363677A (en) * | 1980-01-25 | 1982-12-14 | Nippon Steel Corporation | Method for treating an electromagnetic steel sheet and an electromagnetic steel sheet having marks of laser-beam irradiation on its surface |
DE3126953C2 (de) | 1981-07-08 | 1983-07-21 | Arnold, Peter, Dr., 8000 München | Verfahren zur thermischen Behandlung der Oberfläche von Werkstücken mittels eines linear polarisierten Laserstrahls |
US4358659A (en) * | 1981-07-13 | 1982-11-09 | Mostek Corporation | Method and apparatus for focusing a laser beam on an integrated circuit |
US4468551A (en) * | 1982-07-30 | 1984-08-28 | Armco Inc. | Laser treatment of electrical steel and optical scanning assembly therefor |
US4456812A (en) | 1982-07-30 | 1984-06-26 | Armco Inc. | Laser treatment of electrical steel |
JPS5956522A (ja) * | 1982-09-24 | 1984-04-02 | Nippon Steel Corp | 鉄損の良い一方向性電磁鋼板の製造方法 |
JPS5956523A (ja) * | 1982-09-24 | 1984-04-02 | Nippon Steel Corp | 高磁束密度一方向性珪素鋼板の製造方法 |
US4535218A (en) * | 1982-10-20 | 1985-08-13 | Westinghouse Electric Corp. | Laser scribing apparatus and process for using |
US4645547A (en) * | 1982-10-20 | 1987-02-24 | Westinghouse Electric Corp. | Loss ferromagnetic materials and methods of improvement |
US4500771A (en) * | 1982-10-20 | 1985-02-19 | Westinghouse Electric Corp. | Apparatus and process for laser treating sheet material |
US4625167A (en) * | 1983-07-05 | 1986-11-25 | Sigma Research, Inc. | Flaw imaging in ferrous and nonferrous materials using magneto-optic visualization |
US4589190A (en) * | 1984-03-23 | 1986-05-20 | General Electric Company | Fabrication of drilled and diffused junction field-effect transistors |
US4724015A (en) * | 1984-05-04 | 1988-02-09 | Nippon Steel Corporation | Method for improving the magnetic properties of Fe-based amorphous-alloy thin strip |
US4534804A (en) * | 1984-06-14 | 1985-08-13 | International Business Machines Corporation | Laser process for forming identically positioned alignment marks on the opposite sides of a semiconductor wafer |
US4541035A (en) * | 1984-07-30 | 1985-09-10 | General Electric Company | Low loss, multilevel silicon circuit board |
US4618380A (en) * | 1985-06-18 | 1986-10-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method of fabricating an imaging X-ray spectrometer |
US4683365A (en) * | 1986-03-26 | 1987-07-28 | Westinghouse Electric Corp. | Laser beam transport system |
US4835361A (en) * | 1986-07-21 | 1989-05-30 | Magnetic Peripherals Inc. | Laser machining for producing very small parts |
KR910009016B1 (ko) * | 1987-07-20 | 1991-10-26 | 미쓰비시전기주식회사 | 레이저 가동장치 |
JPH01306088A (ja) * | 1988-06-01 | 1989-12-11 | Nippei Toyama Corp | 可変ビームレーザ加工装置 |
JPH0252192A (ja) | 1988-08-11 | 1990-02-21 | Toshiba Corp | レーザ熱加工方法及びレーザ熱加工装置 |
US5089062A (en) * | 1988-10-14 | 1992-02-18 | Abb Power T&D Company, Inc. | Drilling of steel sheet |
US4963199A (en) * | 1988-10-14 | 1990-10-16 | Abb Power T&D Company, Inc. | Drilling of steel sheet |
US5067992A (en) * | 1988-10-14 | 1991-11-26 | Abb Power T & D Company, Inc. | Drilling of steel sheet |
US5166493A (en) * | 1989-01-10 | 1992-11-24 | Canon Kabushiki Kaisha | Apparatus and method of boring using laser |
US5072091A (en) * | 1989-04-03 | 1991-12-10 | The Local Government Of Osaka Prefecture | Method and apparatus for metal surface process by laser beam |
EP0406004A3 (en) * | 1989-06-30 | 1991-11-13 | Kabushiki Kaisha Toshiba | Method of introducing magnetic anisotropy into magnetic material |
US5057664A (en) * | 1989-10-20 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and apparatus for laser processing a target material to provide a uniformly smooth, continuous trim profile |
US5053704A (en) * | 1990-01-11 | 1991-10-01 | Pri Instrumentation, Inc. | Flow imager for conductive materials |
CA2072070A1 (en) * | 1990-01-11 | 1991-07-12 | Harold M. Epstein | Material properties |
JPH03216287A (ja) * | 1990-01-19 | 1991-09-24 | Fanuc Ltd | レーザ切断加工方法 |
US5109149A (en) * | 1990-03-15 | 1992-04-28 | Albert Leung | Laser, direct-write integrated circuit production system |
US5223693A (en) * | 1990-04-28 | 1993-06-29 | Mitsubishi Denki Kabushiki Kaisha | Optical machining apparatus |
CA2064004A1 (en) * | 1990-05-23 | 1991-11-24 | Shigeki Fujinaga | Laser robot and method of controlling same, and light beam deflector and control signal generator therefor |
US5180448A (en) * | 1990-08-22 | 1993-01-19 | United Container Machinery Group, Inc. | Method of laser hardening corrugating rolls |
FR2679477B1 (fr) * | 1991-07-26 | 1995-11-17 | Aerospatiale | Procede de decoupe par faisceau laser d'un materiau recouvrant un substrat et dispositifs pour sa mise en óoeuvre. |
JPH05190941A (ja) * | 1992-01-14 | 1993-07-30 | Mitsubishi Electric Corp | レーザ発振器 |
JPH0640797A (ja) * | 1992-04-23 | 1994-02-15 | Sumitomo Electric Ind Ltd | ダイヤモンドの加工方法 |
FR2696759B1 (fr) * | 1992-10-09 | 1994-11-04 | Alsthom Gec | Procédé de nitruration d'une pièce en alliage de titane et dispositif de projection d'azote et de gaz neutre. |
US5451863A (en) * | 1992-10-30 | 1995-09-19 | International Business Machines Corporation | Fiber optic probe with a magneto-optic film on an end surface for detecting a current in an integrated circuit |
US5356081A (en) * | 1993-02-24 | 1994-10-18 | Electric Power Research Institute, Inc. | Apparatus and process for employing synergistic destructive powers of a water stream and a laser beam |
US5484980A (en) * | 1993-02-26 | 1996-01-16 | General Electric Company | Apparatus and method for smoothing and densifying a coating on a workpiece |
US5446378A (en) * | 1993-12-15 | 1995-08-29 | Grumman Aerospace Corporation | Magneto-optic eddy current imaging apparatus and method including dithering the image relative to the sensor |
US6130009A (en) * | 1994-01-03 | 2000-10-10 | Litel Instruments | Apparatus and process for nozzle production utilizing computer generated holograms |
DE4402059C1 (de) * | 1994-01-25 | 1995-04-27 | Zeiss Carl Jena Gmbh | Faraday-Mikroskop sowie Verfahren zu dessen Justierung |
US5589090A (en) * | 1994-01-31 | 1996-12-31 | Song; Byung-Jun | Laser cutting apparatus with means for measuring cutting groove width |
US5611946A (en) * | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
US6084396A (en) * | 1994-03-31 | 2000-07-04 | Intel Corporation | Method for performing quantitative measurement of DC and AC current flow in integrated circuit interconnects by the measurement of magnetic fields with a magneto optic laser probe |
US5739048A (en) * | 1994-05-23 | 1998-04-14 | International Business Machines Corporation | Method for forming rows of partially separated thin film elements |
JP3209641B2 (ja) * | 1994-06-02 | 2001-09-17 | 三菱電機株式会社 | 光加工装置及び方法 |
US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
US5593606A (en) * | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
US5468308A (en) * | 1994-08-22 | 1995-11-21 | The Torrington Company | Surface treated cast iron bearing element |
US5543365A (en) * | 1994-12-02 | 1996-08-06 | Texas Instruments Incorporated | Wafer scribe technique using laser by forming polysilicon |
JP3141715B2 (ja) * | 1994-12-22 | 2001-03-05 | 松下電器産業株式会社 | レーザ加工方法 |
US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
US5843363A (en) * | 1995-03-31 | 1998-12-01 | Siemens Aktiengesellschaft | Ablation patterning of multi-layered structures |
DE19519150A1 (de) * | 1995-05-30 | 1996-12-12 | Fraunhofer Ges Forschung | Laserstrahlgerät und Verfahren zur Bearbeitung von Werkstücken |
SE508696C2 (sv) * | 1995-08-23 | 1998-10-26 | Rheinmetall Ind Ag | Draget vapenrör samt förfarande för framställning av sådant rör |
US5744780A (en) * | 1995-09-05 | 1998-04-28 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for precision micromachining with lasers |
JP3159906B2 (ja) * | 1995-10-23 | 2001-04-23 | アルプス電気株式会社 | 液晶表示素子の製造方法 |
US5894220A (en) * | 1996-02-12 | 1999-04-13 | University Of Maryland | Apparatus for microscopic imaging of electrical and magnetic properties of room-temperature objects |
DE19609199A1 (de) * | 1996-03-09 | 1997-09-11 | Vetter & Co Apotheker | Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens |
US6037565A (en) * | 1996-06-17 | 2000-03-14 | The Regents Of The University Of California | Laser illuminator and optical system for disk patterning |
US5736709A (en) * | 1996-08-12 | 1998-04-07 | Armco Inc. | Descaling metal with a laser having a very short pulse width and high average power |
US5886320A (en) * | 1996-09-03 | 1999-03-23 | International Business Machines Corporation | Laser ablation with transmission matching for promoting energy coupling to a film stack |
US5864430A (en) * | 1996-09-10 | 1999-01-26 | Sandia Corporation | Gaussian beam profile shaping apparatus, method therefor and evaluation thereof |
US7732732B2 (en) * | 1996-11-20 | 2010-06-08 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
US7462801B1 (en) * | 1996-11-20 | 2008-12-09 | Ibiden Co., Ltd. | Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board |
EP0897016B8 (en) | 1997-01-24 | 2007-04-25 | Nippon Steel Corporation | Grain-oriented electrical steel sheet having excellent magnetic characteristics, its manufacturing method and its manufacturing device |
US5911890A (en) * | 1997-02-25 | 1999-06-15 | Lsp Technologies, Inc. | Oblique angle laser shock processing |
US5870421A (en) * | 1997-05-12 | 1999-02-09 | Dahm; Jonathan S. | Short pulsewidth, high pulse repetition frequency laser system |
US5872684A (en) * | 1997-05-15 | 1999-02-16 | International Business Machines Corporation | Air bearing slider having a relieved trailing edge |
JPH1147965A (ja) * | 1997-05-28 | 1999-02-23 | Komatsu Ltd | レーザ加工装置 |
JPH1158056A (ja) * | 1997-08-12 | 1999-03-02 | Nec Corp | レーザテクスチャー加工装置 |
JPH11211899A (ja) * | 1997-11-21 | 1999-08-06 | Sony Corp | 短波長光発生装置 |
US6141093A (en) * | 1998-08-25 | 2000-10-31 | International Business Machines Corporation | Method and apparatus for locating power plane shorts using polarized light microscopy |
JP3945951B2 (ja) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工機 |
US6469275B2 (en) * | 1999-01-20 | 2002-10-22 | Lsp Technologies, Inc | Oblique angle laser shock processing |
DE19919688A1 (de) * | 1999-04-30 | 2000-11-02 | Rheinmetall W & M Gmbh | Verfahren zur Innenbeschichtung eines Waffenrohres |
US6420245B1 (en) * | 1999-06-08 | 2002-07-16 | Kulicke & Soffa Investments, Inc. | Method for singulating semiconductor wafers |
US6359686B1 (en) * | 1999-06-29 | 2002-03-19 | Corning Incorporated | Inspection system for sheet material |
JP2001105164A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
JP3348283B2 (ja) * | 2000-01-28 | 2002-11-20 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工用マスク並びにその製造方法 |
US6356337B1 (en) * | 2000-03-08 | 2002-03-12 | Anvik Corporation | Two-sided substrate imaging using single-approach projection optics |
US6804086B2 (en) * | 2000-04-27 | 2004-10-12 | Seagate Technology Llc | Unitary crystalline slider with edges rounded by laser ablation |
US6376797B1 (en) * | 2000-07-26 | 2002-04-23 | Ase Americas, Inc. | Laser cutting of semiconductor materials |
AU2001249140A1 (en) * | 2000-09-20 | 2002-04-02 | Electro Scientific Industries, Inc. | Uv laser cutting or shape modification of brittle, high melting temperature target materials such as ceramics or glasses |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US6970644B2 (en) * | 2000-12-21 | 2005-11-29 | Mattson Technology, Inc. | Heating configuration for use in thermal processing chambers |
US7015422B2 (en) * | 2000-12-21 | 2006-03-21 | Mattson Technology, Inc. | System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy |
JP4176968B2 (ja) * | 2001-02-14 | 2008-11-05 | 富士通株式会社 | レーザ曲げ加工方法及びレーザ曲げ加工装置 |
US7887645B1 (en) * | 2001-05-02 | 2011-02-15 | Ak Steel Properties, Inc. | High permeability grain oriented electrical steel |
JP3666435B2 (ja) * | 2001-09-28 | 2005-06-29 | 松下電器産業株式会社 | 光照射装置と光加工装置およびその加工方法 |
US6750423B2 (en) * | 2001-10-25 | 2004-06-15 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, laser irradiation apparatus, and method of manufacturing a semiconductor device |
SG108878A1 (en) * | 2001-10-30 | 2005-02-28 | Semiconductor Energy Lab | Laser irradiation method and laser irradiation apparatus, and method for fabricating semiconductor device |
TWI289896B (en) * | 2001-11-09 | 2007-11-11 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device |
DE10297451B4 (de) * | 2001-11-15 | 2009-12-24 | Mitsubishi Denki K.K. | Laser-Materialverarbeitungsvorrichtung |
US7026227B2 (en) * | 2001-11-16 | 2006-04-11 | Semiconductor Energy Laboratory Co., Ltd. | Method of irradiating a laser beam, and method of fabricating semiconductor devices |
JP3973882B2 (ja) * | 2001-11-26 | 2007-09-12 | 株式会社半導体エネルギー研究所 | レーザ照射装置およびレーザ照射方法 |
JP2003225786A (ja) * | 2002-01-30 | 2003-08-12 | Uht Corp | レーザー加工ユニット及び該レーザー加工ユニットを備えた加工装置 |
US20040104208A1 (en) * | 2002-03-28 | 2004-06-03 | Kenichi Ijima | Laser machining apparatus |
US20050155956A1 (en) * | 2002-08-30 | 2005-07-21 | Sumitomo Heavy Industries, Ltd. | Laser processing method and processing device |
US7259082B2 (en) * | 2002-10-03 | 2007-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
JP2004128421A (ja) * | 2002-10-07 | 2004-04-22 | Semiconductor Energy Lab Co Ltd | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
SG129265A1 (en) * | 2002-11-29 | 2007-02-26 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
TWI334156B (en) * | 2002-12-25 | 2010-12-01 | Semiconductor Energy Lab | Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device |
US7387922B2 (en) * | 2003-01-21 | 2008-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method, method for manufacturing semiconductor device, and laser irradiation system |
US7265845B2 (en) * | 2003-01-27 | 2007-09-04 | Lake Shore Cryotronics, Inc. | Surface corrugation enhanced magneto-optical indicator film |
US6934068B2 (en) * | 2003-02-10 | 2005-08-23 | Lake Shore Cryotronics, Inc. | Magnetic field and electrical current visualization system |
DE602004020538D1 (de) * | 2003-02-28 | 2009-05-28 | Semiconductor Energy Lab | Verfahren und Vorrichtung zur Laserbestrahlung, sowie Verfahren zur Herstellung von Halbleiter. |
JP4515034B2 (ja) * | 2003-02-28 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US7304005B2 (en) * | 2003-03-17 | 2007-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
US7442260B2 (en) * | 2003-03-19 | 2008-10-28 | Nippon Steel Corooration | Grain-oriented electrical steel sheet superior in electrical characteristics and method of production of same |
JP4373115B2 (ja) * | 2003-04-04 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4413569B2 (ja) * | 2003-09-25 | 2010-02-10 | 株式会社 日立ディスプレイズ | 表示パネルの製造方法及び表示パネル |
JP4357944B2 (ja) * | 2003-12-05 | 2009-11-04 | トヨタ自動車株式会社 | 固体レーザ加工装置およびレーザ溶接方法 |
EP1553643A3 (en) * | 2003-12-26 | 2009-01-21 | Sel Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and method for manufacturing crystalline semiconductor film |
US7199330B2 (en) * | 2004-01-20 | 2007-04-03 | Coherent, Inc. | Systems and methods for forming a laser beam having a flat top |
US20050237895A1 (en) * | 2004-04-23 | 2005-10-27 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method for manufacturing semiconductor device |
US8525075B2 (en) * | 2004-05-06 | 2013-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus |
CN1981291B (zh) * | 2004-06-30 | 2011-06-15 | 通明国际科技有限公司 | 基于激光的用于处理目标表面材料的方法 |
US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
FR2872910B1 (fr) * | 2004-07-07 | 2006-10-13 | Nanoraptor Sa | Composant optique pour l'observation d'un echantillon nanometrique, systeme comprenant un tel composant, procede d'analyse mettant en oeuvre ce composant, et leurs applications |
JP4182034B2 (ja) * | 2004-08-05 | 2008-11-19 | ファナック株式会社 | 切断加工用レーザ装置 |
US7459406B2 (en) * | 2004-09-01 | 2008-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing unit, laser processing method, and method for manufacturing semiconductor device |
JP4354376B2 (ja) * | 2004-09-28 | 2009-10-28 | 株式会社ディスコ | レーザ加工装置 |
MX2007003742A (es) * | 2004-10-01 | 2007-06-05 | Mitsuboshi Diamond Ind Co Ltd | Metodo de trazado para materiales fragiles y aparato de trazado. |
EP1806202B1 (en) * | 2004-10-25 | 2011-08-17 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and device for forming crack |
KR101074408B1 (ko) * | 2004-11-05 | 2011-10-17 | 엘지디스플레이 주식회사 | 펨토초 레이저 발생장치 및 이를 이용한 기판의 절단방법 |
US7718921B2 (en) * | 2004-11-17 | 2010-05-18 | Metal Improvement Company Llc | Active beam delivery system with variable optical path segment through air |
US7851725B2 (en) * | 2004-11-17 | 2010-12-14 | Metal Improvement Company Llc | Active beam delivery system with image relay |
US7750266B2 (en) * | 2004-11-17 | 2010-07-06 | Metal Improvement Company Llc | Active beam delivery system for laser peening and laser peening method |
US7054051B1 (en) * | 2004-11-26 | 2006-05-30 | Alces Technology, Inc. | Differential interferometric light modulator and image display device |
TWI305548B (en) * | 2005-05-09 | 2009-01-21 | Nippon Steel Corp | Low core loss grain-oriented electrical steel sheet and method for producing the same |
US7365855B2 (en) * | 2005-07-08 | 2008-04-29 | The Chinese University Of Hong Kong | Optical sensing devices with SPR sensors based on differential phase interrogation and measuring method using the same |
US7416621B2 (en) * | 2005-07-22 | 2008-08-26 | Gkn Sinter Metals, Inc. | Laser rounding and flattening of cylindrical parts |
JP5030512B2 (ja) * | 2005-09-30 | 2012-09-19 | 日立ビアメカニクス株式会社 | レーザ加工方法 |
JP5008855B2 (ja) | 2005-10-26 | 2012-08-22 | 新日本製鐵株式会社 | 磁気特性の優れた一方向性電磁鋼板の製造方法 |
US7883586B2 (en) * | 2005-11-01 | 2011-02-08 | Nippon Steel Corporation | Method for production and apparatus for production of grain-oriented electrical steel sheet excellent in magnetic properties |
WO2007069516A1 (en) * | 2005-12-16 | 2007-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device |
WO2007072837A1 (en) * | 2005-12-20 | 2007-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method for manufacturing semiconductor device |
JP5000182B2 (ja) * | 2006-04-07 | 2012-08-15 | 新日本製鐵株式会社 | 磁気特性の優れた方向性電磁鋼板の製造方法 |
US8497449B1 (en) * | 2006-05-26 | 2013-07-30 | Synchron Laser Service Inc. | Micro-machining of ceramics using an ytterbium fiber-laser |
JP2008068270A (ja) * | 2006-09-12 | 2008-03-27 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP5613972B2 (ja) | 2006-10-23 | 2014-10-29 | 新日鐵住金株式会社 | 鉄損特性の優れた一方向性電磁鋼板 |
KR101203286B1 (ko) * | 2007-12-12 | 2012-11-20 | 신닛테츠스미킨 카부시키카이샤 | 레이저광의 조사에 의해 자구가 제어된 방향성 전자기 강판의 제조 방법 |
US8170072B2 (en) * | 2008-01-07 | 2012-05-01 | Ihi Corporation | Laser annealing method and apparatus |
KR101234452B1 (ko) * | 2008-02-19 | 2013-02-18 | 신닛테츠스미킨 카부시키카이샤 | 저철손 일방향성 전자기 강판 및 그 제조 방법 |
US8173931B2 (en) * | 2008-06-13 | 2012-05-08 | Electro Scientific Industries, Inc. | Automatic recipe management for laser processing a work piece |
IT1394891B1 (it) * | 2008-07-25 | 2012-07-20 | Matteo Baistrocchi | Impianto di scribing laser per il trattamento superficiale di lamierini magnetici con spot a sezione ellittica |
TWI510320B (zh) | 2008-10-10 | 2015-12-01 | Ipg Microsystems Llc | 雷射加工系統、雷射加工方法及光學頭 |
US8659291B2 (en) * | 2008-12-31 | 2014-02-25 | Infinitum Solutions, Inc. | Magneto-optical detection of a field produced by a sub-resolution magnetic structure |
US8289818B2 (en) * | 2008-12-31 | 2012-10-16 | Infinitum Solutions, Inc. | Magneto-optic write-head characterization using the recording medium as a transducer layer |
US8341976B2 (en) * | 2009-02-19 | 2013-01-01 | Corning Incorporated | Method of separating strengthened glass |
US8327666B2 (en) * | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
US8187983B2 (en) * | 2009-04-16 | 2012-05-29 | Micron Technology, Inc. | Methods for fabricating semiconductor components using thinning and back side laser processing |
US8525073B2 (en) * | 2010-01-27 | 2013-09-03 | United Technologies Corporation | Depth and breakthrough detection for laser machining |
JP5701618B2 (ja) * | 2010-03-04 | 2015-04-15 | ギガフォトン株式会社 | 極端紫外光生成装置 |
EP2554685B1 (en) * | 2010-04-01 | 2016-07-27 | Nippon Steel & Sumitomo Metal Corporation | Grain oriented electrical steel sheet and method for manufacturing same |
JP5696380B2 (ja) * | 2010-06-30 | 2015-04-08 | Jfeスチール株式会社 | 方向性電磁鋼板の鉄損改善装置および鉄損改善方法 |
CN103025473B (zh) | 2010-07-26 | 2015-12-09 | 浜松光子学株式会社 | 基板加工方法 |
WO2012014724A1 (ja) * | 2010-07-26 | 2012-02-02 | 浜松ホトニクス株式会社 | 基板加工方法 |
JP5998424B2 (ja) * | 2010-08-06 | 2016-09-28 | Jfeスチール株式会社 | 方向性電磁鋼板 |
US8427929B2 (en) * | 2010-09-08 | 2013-04-23 | Infinitum Solutions, Inc. | Sub-optical-resolution kerr signal detection for perpendicular write-head characterization |
JP5766423B2 (ja) * | 2010-10-15 | 2015-08-19 | 三菱重工業株式会社 | レーザ切断装置及びレーザ切断方法 |
JP6054028B2 (ja) * | 2011-02-09 | 2016-12-27 | ギガフォトン株式会社 | レーザ装置および極端紫外光生成システム |
JP5819149B2 (ja) | 2011-09-27 | 2015-11-18 | キヤノンマシナリー株式会社 | 周期構造の作成方法および周期構造の作成装置 |
US10745773B2 (en) * | 2011-12-27 | 2020-08-18 | Jfe Steel Corporation | Device to improve iron loss properties of grain-oriented electrical steel sheet |
JP5987610B2 (ja) * | 2012-09-28 | 2016-09-07 | Jfeスチール株式会社 | 鋼板検査装置、鋼板検査方法、および鋼板製造方法 |
IN2015DN03147A (ja) | 2012-11-08 | 2015-10-02 | Nippon Steel & Sumitomo Metal Corp | |
CN103433618B (zh) * | 2013-07-25 | 2017-07-04 | 长春理工大学 | 一种控制金属表面微纳米结构尺寸和分布的方法 |
US20150034613A1 (en) * | 2013-08-02 | 2015-02-05 | Rofin-Sinar Technologies Inc. | System for performing laser filamentation within transparent materials |
EP3165614B1 (en) * | 2014-07-03 | 2023-05-10 | Nippon Steel Corporation | Use of a laser processing apparatus and method for manufacturing a grain- oriented electromagnetic steel sheet |
EP3165615B1 (en) * | 2014-07-03 | 2022-12-21 | Nippon Steel Corporation | Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet |
-
2014
- 2014-07-03 EP EP14896916.5A patent/EP3165615B1/en active Active
- 2014-07-03 RU RU2016151358A patent/RU2661977C1/ru active
- 2014-07-03 BR BR112016030522-1A patent/BR112016030522B1/pt active IP Right Grant
- 2014-07-03 KR KR1020177000034A patent/KR101881708B1/ko active IP Right Grant
- 2014-07-03 CN CN201480080155.9A patent/CN106471140B/zh active Active
- 2014-07-03 WO PCT/JP2014/067754 patent/WO2016002036A1/ja active Application Filing
- 2014-07-03 US US15/322,399 patent/US11498156B2/en active Active
- 2014-07-03 PL PL14896916.5T patent/PL3165615T3/pl unknown
- 2014-07-03 JP JP2016530754A patent/JP6341279B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6383227A (ja) * | 1986-09-26 | 1988-04-13 | Nippon Steel Corp | 電磁鋼板の鉄損値改善方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101881708B1 (ko) | 2018-07-24 |
BR112016030522B1 (pt) | 2019-11-05 |
CN106471140A (zh) | 2017-03-01 |
CN106471140B (zh) | 2019-02-05 |
KR20170015455A (ko) | 2017-02-08 |
EP3165615B1 (en) | 2022-12-21 |
PL3165615T3 (pl) | 2023-05-08 |
JP6341279B2 (ja) | 2018-06-13 |
RU2661977C1 (ru) | 2018-07-23 |
US11498156B2 (en) | 2022-11-15 |
EP3165615A4 (en) | 2018-01-24 |
EP3165615A1 (en) | 2017-05-10 |
US20170136575A1 (en) | 2017-05-18 |
JPWO2016002036A1 (ja) | 2017-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2509813C1 (ru) | Лист электротехнической стали с ориентированной зеренной структурой | |
RU2238340C2 (ru) | Способ улучшения магнитных свойств листов текстурированной электротехнической кремнистой стали посредством лазерной обработки | |
JP4782248B1 (ja) | 方向性電磁鋼板及びその製造方法 | |
JP6044642B2 (ja) | レーザ加工装置及びレーザ照射方法 | |
WO2009104521A1 (ja) | 低鉄損一方向性電磁鋼板及びその製造方法 | |
JP6341280B2 (ja) | レーザ加工装置 | |
JP2018037572A (ja) | 巻鉄芯、及び巻鉄芯の製造方法 | |
JP6341279B2 (ja) | レーザ加工装置 | |
WO2012172624A1 (ja) | 一方向性電磁鋼板の製造方法 | |
JP6838321B2 (ja) | 方向性電磁鋼板の製造方法、及び方向性電磁鋼板 | |
JP7031364B2 (ja) | 方向性電磁鋼板の製造方法 | |
JP2023507438A (ja) | 方向性電磁鋼板およびその磁区微細化方法 | |
JPWO2019164012A1 (ja) | 方向性電磁鋼板 | |
JP2019135323A (ja) | 方向性電磁鋼板、巻鉄芯、方向性電磁鋼板の製造方法、及び、巻鉄芯の製造方法 | |
JPWO2012172624A1 (ja) | 一方向性電磁鋼板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14896916 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2016530754 Country of ref document: JP Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2014896916 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014896916 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15322399 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020177000034 Country of ref document: KR |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112016030522 Country of ref document: BR |
|
ENP | Entry into the national phase |
Ref document number: 2016151358 Country of ref document: RU Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 112016030522 Country of ref document: BR Kind code of ref document: A2 Effective date: 20161226 |