MX2007003742A - Metodo de trazado para materiales fragiles y aparato de trazado. - Google Patents

Metodo de trazado para materiales fragiles y aparato de trazado.

Info

Publication number
MX2007003742A
MX2007003742A MX2007003742A MX2007003742A MX2007003742A MX 2007003742 A MX2007003742 A MX 2007003742A MX 2007003742 A MX2007003742 A MX 2007003742A MX 2007003742 A MX2007003742 A MX 2007003742A MX 2007003742 A MX2007003742 A MX 2007003742A
Authority
MX
Mexico
Prior art keywords
scribing
brittle material
distribution
laser beam
center axis
Prior art date
Application number
MX2007003742A
Other languages
English (en)
Inventor
Masahiro Fujii
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of MX2007003742A publication Critical patent/MX2007003742A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

En un aparato de trazado, una porcion irradiada se irradia con un rayo laser que tiene una distribucion de energia de irradiacion que es la distribucion Gaussiana, y en el caso donde una linea a lo largo de la cual un material es dividido es un eje central, la distribucion de energia de irradiacion descrita anteriormente, tiene dos porciones pico que estan a una distancia entre si sobre una anchura W con el eje central descrito anteriormente en el centro, y la energia de irradiacion entre las dos porciones pico es cero.
MX2007003742A 2004-10-01 2005-09-30 Metodo de trazado para materiales fragiles y aparato de trazado. MX2007003742A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004317170 2004-10-01
PCT/JP2005/018171 WO2006038565A1 (ja) 2004-10-01 2005-09-30 脆性材料のスクライブ方法およびスクライブ装置

Publications (1)

Publication Number Publication Date
MX2007003742A true MX2007003742A (es) 2007-06-05

Family

ID=36142639

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007003742A MX2007003742A (es) 2004-10-01 2005-09-30 Metodo de trazado para materiales fragiles y aparato de trazado.

Country Status (10)

Country Link
US (1) US20080061043A1 (es)
EP (1) EP1803538A1 (es)
JP (1) JPWO2006038565A1 (es)
KR (1) KR100849696B1 (es)
CN (1) CN101043992B (es)
BR (1) BRPI0515667A (es)
MX (1) MX2007003742A (es)
RU (1) RU2354616C2 (es)
WO (1) WO2006038565A1 (es)
ZA (1) ZA200702229B (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006011608A1 (ja) * 2004-07-30 2006-02-02 Mitsuboshi Diamond Industrial Co., Ltd. 基板の垂直クラック形成方法および垂直クラック形成装置
SI2131994T1 (sl) * 2007-02-28 2014-03-31 Ceramtec Gmbh Postopek za izdelavo gradnika ob uporabi asimetričnega vnosa energije vzdolž ločevalne ali vnaprej določene prelomne linije
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
TWI409122B (zh) * 2007-07-13 2013-09-21 Mitsuboshi Diamond Ind Co Ltd A method for processing a brittle material substrate and a crack forming apparatus for the method
JP5011048B2 (ja) * 2007-09-27 2012-08-29 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
WO2009047990A1 (ja) * 2007-10-11 2009-04-16 Mitsuboshi Diamond Industrial Co., Ltd. 脆性材料基板、および、脆性材料基板のレーザスクライブ方法、レーザスクライブ装置
JP5187556B2 (ja) * 2007-10-19 2013-04-24 澁谷工業株式会社 レーザ割断装置
DE102008007632A1 (de) * 2008-02-04 2009-08-06 Limo Patentverwaltung Gmbh & Co. Kg Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks
CN101513692B (zh) * 2008-02-21 2011-09-07 富士迈半导体精密工业（上海）有限公司 激光切割脆性材料的方法及装置
JP2010090010A (ja) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法及び割断装置
WO2010071128A1 (ja) * 2008-12-16 2010-06-24 株式会社レミ 脆性材料の分割装置および割断方法
TWI490176B (zh) * 2009-03-20 2015-07-01 Corning Inc 分離玻璃板材的製程與設備
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
EP2480507A1 (en) * 2009-08-28 2012-08-01 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
RU2459691C2 (ru) 2010-11-29 2012-08-27 Юрий Георгиевич Шретер Способ отделения поверхностного слоя полупроводникового кристалла (варианты)
CN103781587B (zh) * 2011-07-29 2016-09-07 Ats自动化加工系统公司 用于生产硅细棒的系统和方法
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
WO2014157245A1 (ja) * 2013-03-26 2014-10-02 旭硝子株式会社 ガラス板の加工方法、およびガラス板の加工装置
EP3165615B1 (en) * 2014-07-03 2022-12-21 Nippon Steel Corporation Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet
WO2016059449A1 (en) * 2014-10-13 2016-04-21 Evana Technologies, Uab Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
CN107962305A (zh) * 2017-12-21 2018-04-27 英诺激光科技股份有限公司 一种高折射率、低硬度透明材料激光切割装置及切割方法
KR102617346B1 (ko) * 2018-06-28 2023-12-26 삼성전자주식회사 산란 억제를 위한 절단용 레이저 장치
US11075496B2 (en) 2018-06-28 2021-07-27 Samsung Electronics Co., Ltd. Laser dicing device, method of laser beam modulation, and method of dicing a substrate
JP7466829B2 (ja) * 2020-02-06 2024-04-15 日本電気硝子株式会社 ガラス板の製造方法
CN112894164A (zh) * 2021-01-19 2021-06-04 嘉兴艾可镭光电科技有限公司 一种用于玻璃的激光加工设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3701880A (en) * 1968-11-29 1972-10-31 Westinghouse Electric Corp Method for sculpturing an indicia or decorative design in the surface of an article with a beam of corpuscular energy
GB1405663A (en) 1972-09-20 1975-09-10 Pilkington Brothers Ltd Cutting glass
US4468534A (en) * 1982-09-30 1984-08-28 Boddicker Franc W Method and device for cutting glass
FR2610316B1 (fr) 1987-01-29 1992-11-13 Saint Gobain Vitrage Volumes de verre trempes par contact avec contraintes de bord renforcees
US5385786A (en) 1993-02-09 1995-01-31 Glasstech, Inc. Apparatus and method for controlling stresses in laminated automotive glass
JP3153682B2 (ja) * 1993-08-26 2001-04-09 松下電工株式会社 回路板の製造方法
JP3414205B2 (ja) * 1997-06-27 2003-06-09 日本板硝子株式会社 合わせガラス
US5910235A (en) * 1997-09-12 1999-06-08 Western Digital Corporation Etching and pipelined texturing of a substrate in a stationary vacuum deposition machine
JP4390937B2 (ja) * 1999-11-25 2009-12-24 三星ダイヤモンド工業株式会社 ガラス板分割方法及び装置
KR100551526B1 (ko) * 2001-07-18 2006-02-13 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 장치 및 스크라이브 방법

Also Published As

Publication number Publication date
US20080061043A1 (en) 2008-03-13
RU2007116167A (ru) 2008-11-10
KR100849696B1 (ko) 2008-07-31
BRPI0515667A (pt) 2008-07-29
EP1803538A1 (en) 2007-07-04
KR20070088588A (ko) 2007-08-29
JPWO2006038565A1 (ja) 2008-05-15
ZA200702229B (en) 2008-08-27
WO2006038565A1 (ja) 2006-04-13
CN101043992B (zh) 2011-03-23
CN101043992A (zh) 2007-09-26
RU2354616C2 (ru) 2009-05-10

Similar Documents

Publication Publication Date Title
MX2007003742A (es) Metodo de trazado para materiales fragiles y aparato de trazado.
EP1790427A3 (fr) Procédé de coupage d'une pièce en acier C-Mn à l'aide d'une fibre contenant de l'ytterbium
WO2005081940A3 (en) Magnetically enhanced, inductively coupled plasma source for a focused ion beam system
GB0821328D0 (en) Ultrashort laser pulse wafer scribing
DE60117036D1 (de) Laserbearbeitung von halbleitermaterialen
TW200721285A (en) Laser processing method for wafer
EP1498216A4 (en) PROCESS FOR CUTTING TREATED OBJECT
SG151085A1 (en) Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device
TW200618919A (en) Laser processing method
MY131835A (en) Permanent, removable tissue markings
WO2009145798A3 (en) Methods for modifying features of a workpiece using a gas cluster ion beam
TW200634329A (en) Laser surface treatment
TW200802583A (en) Infrared laser wafer scribing using short pulses
AR053702A1 (es) Sistemas y metodos para la retroalimentacion de formacion de haces en sistemas de comunicaciones de multiples antenas
WO2004075174A3 (en) System and method for cutting using a variable astigmatic focal beam spot
SG149824A1 (en) Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel
GB0211029D0 (en) Surface modification
WO2009023280A3 (en) Laser machining method utilizing variable inclination angle
WO2011154461A3 (de) Verfahren und vorrichtung zur lasermaterialbearbeitung eines werkstücks
EP2016979A3 (de) Partikelstrahlapplikationsvorrichtung, Bestrahlungsvorrichtung sowie Verfahren zur Führung eines Partikelstrahls
DE50114071D1 (de) Vorrichtung zur beschriftung von gegenständen mittels laserstrahlen
ES2177173T3 (es) Procedimiento para cortar biseles en y.
WO2005050694A3 (en) Liquid metal ion source and its production; processing and analyzing devices provided with said source
CN208166851U (zh) 玻璃加工物切割装置
WO2005114690A3 (en) Energy generation method and apparatus

Legal Events

Date Code Title Description
FA Abandonment or withdrawal