WO2015194576A1 - 超電導線、超電導コイル及び磁気共鳴イメージング装置 - Google Patents
超電導線、超電導コイル及び磁気共鳴イメージング装置 Download PDFInfo
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- WO2015194576A1 WO2015194576A1 PCT/JP2015/067384 JP2015067384W WO2015194576A1 WO 2015194576 A1 WO2015194576 A1 WO 2015194576A1 JP 2015067384 W JP2015067384 W JP 2015067384W WO 2015194576 A1 WO2015194576 A1 WO 2015194576A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
- G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
- G01R33/38—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
- G01R33/3802—Manufacture or installation of magnet assemblies; Additional hardware for transportation or installation of the magnet assembly or for providing mechanical support to components of the magnet assembly
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
- G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
- G01R33/38—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
- G01R33/381—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field using electromagnets
- G01R33/3815—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field using electromagnets with superconducting coils, e.g. power supply therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/048—Superconductive coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/02—Coils wound on non-magnetic supports, e.g. formers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/20—Permanent superconducting devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
- G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
- G01R33/38—Systems for generation, homogenisation or stabilisation of the main or gradient magnetic field
- G01R33/3806—Open magnet assemblies for improved access to the sample, e.g. C-type or U-type magnets
Definitions
- the present invention relates to quench reduction of a superconducting wire, a superconducting coil, and a magnetic resonance imaging apparatus (MRI apparatus).
- MRI apparatus magnetic resonance imaging apparatus
- Patent Document 1 For example, for strengthening the adhesive force between the winding portion of the superconducting wire and the insulating plate, a resin material as an adhesive is inserted between the superconducting conductor and the insulating plate so that it can withstand shear stress.
- Patent Document 1 For example, for strengthening the adhesive force between the winding portion of the superconducting wire and the insulating plate, a resin material as an adhesive is inserted between the superconducting conductor and the insulating plate so that it can withstand shear stress. has been devised (Patent Document 1).
- Patent Document 1 when the shear stress increases beyond the effect of increasing the adhesive force at the member interface, the members are separated and quenching occurs due to Joule heat generated at that time. May occur.
- the present invention provides a superconducting wire, a superconducting coil, and an MRI apparatus in which the adhesion between members is made stronger than before in order to avoid interfacial delamination between members, which is one of the causes of quenching. With the goal.
- a superconducting coil according to the present invention includes a winding frame and a superconducting wire wound around the winding frame, and a thermoplastic resin is interposed between the winding frame and the superconducting wire.
- a first resin layer containing, a second resin layer containing a thermosetting resin, and located between the first resin layer and the second resin layer, the thermoplastic resin and the thermosetting resin And a mixed layer containing the mixture.
- the present invention it is possible to provide a superconducting wire, a superconducting coil and an MRI apparatus in which the adhesive strength between members is stronger than before, and it is possible to avoid interfacial peeling between members, which is one of the causes of quenching.
- FIG. 1 is a cross-sectional view of a superconducting coil according to this embodiment.
- FIG. 2 is an enlarged cross-sectional view of a conductive wire of the superconducting coil of FIG.
- the superconducting coil has a winding frame 1 and a superconducting wire 2 wound around the winding frame 1, and includes a self-bonding layer 3 made of a resin that fixes the superconducting wire 2.
- the material constituting the reel 1 is a nonmagnetic metal such as stainless steel or aluminum.
- an insulating plate 5 and an insulating plate 6 are inserted between the winding frame 1 and the superconducting wire 2.
- a friction material such as a fluorine resin may be inserted between the reel 1 and the superconducting wire 2 in order to reduce the frictional force.
- the insulating plate 5 is disposed at a position in contact with the inner peripheral surface of the winding frame 1
- the insulating plate 6 is disposed at a position in contact with the surface of the winding frame 1 on the flange side.
- the insulating plate 5 and the insulating plate 6 are formed by laminating a reinforcing material made of glass fiber and an insulating material having low thermal conductivity in order to increase heat transfer resistance. Since the thickness of the insulating material can be easily adjusted and it can be impregnated with a resin or the like, polyethylene terephthalate (PET) or polyimide is suitable.
- PET polyethylene terephthalate
- An insulating coating 8 is applied on the surface of the superconducting wire 2, and a self-bonding layer 3 is provided on the surface of the insulating coating 8.
- the insulating coating 8 is made of polyvinyl formal, epoxy, polyimide, polyamideimide, etc. having a thickness of about 10 to 100 ⁇ m, or those obtained by winding fibers such as glass or polyester on these.
- the self-bonding layer 3 is made of a thermoplastic resin such as phenoxy, epoxy, polyamide, polyester, polyimide, or nylon having a thickness of about 10 to 100 ⁇ m.
- the heating temperature for fusing is 75 ° C. or higher and 150 ° C. or lower, which is lower than the softening temperature of the insulating coating 8.
- the thickness is in a range that ensures adhesive strength and does not impair thermal conduction.
- the superconducting wire 2 obtained by providing the self-bonding layer 3 on the surface of the superconducting wire 2 provided with the insulating coating 8 used for the superconducting coil is firmly fixed between the superconducting wires 2. Separation does not occur and quenching can be suppressed. In addition, since the impregnation of the resin is not necessary, the number of steps and manufacturing time can be greatly reduced.
- a prepreg sheet 7 in which a sheet glass reinforcing material and an insulating material are laminated one by one and impregnated with a resin is disposed on the curved surface portion of the inner peripheral surface of the superconducting coil.
- a resin impregnated in the prepreg sheet 7 for example, an epoxy resin such as bisphenol A diglycidyl ether (BPADGE) is used as a main agent, phthalic anhydride or dicyandiamide is mixed as a curing agent, and ethanol or the like is used as a solvent.
- the prepreg sheet 7 can be fixed to the members constituting the insulating plate 5 and the insulating plate 6 by heating from about 75 ° C. to about 150 ° C. By doing in this way, the laminated
- FRP fiber reinforced plastic
- the entire coil is heated.
- the self-bonding layer 3 is softened and the self-bonding layer 3 is cured when the temperature is returned to room temperature, so that the superconducting wires 2 are fixed to each other by the self-bonding layer 3.
- the resin contained in the self-bonding layer 3 and the prepreg sheet 7 are mixed when the coil is heated from about 75 ° C. to about 150 ° C., and the mixed layer 9 of the self-bonding layer 3 and the prepreg sheet 7 is formed.
- thermoplastic self-bonding layer 3 and the prepreg sheet 7 containing a thermosetting resin liquid come into contact with each other by applying pressure between the self-bonding layer 3 and the prepreg sheet 7.
- the self-bonding layer 3 dissolves and mixes with the resin liquid contained in the prepreg sheet 7 in the initial stage of heating at about 150 ° C.
- the pressure applied between the self-bonding layer 3 and the prepreg sheet 7 is preferably set to 0.2 to 0.5 MPa, for example. Even if a pressure smaller or larger than this range is applied, a mixed layer with a certain thickness can be created. There is a possibility that a sufficient magnetic field cannot be obtained. Therefore, the pressure is preferably set to 0.2 to 0.5 MPa so as to obtain a sufficient magnetic field.
- the thickness of the self-bonding layer 3, the mixed layer 9, and the thickness of the prepreg sheet 7 are expressed in the same order, but this is for the sake of easy understanding. Actually, the thickness of the mixed layer 9 is considerably smaller than the thickness of the self-bonding layer 3 and the prepreg sheet 7.
- Tables 1, 2 and 3 show comparative examples and examples. Experiments have shown that the bonding strength between the superconducting coil winding 1 and the superconducting wire 2 depends on the thickness of the mixed layer 9 and the type of resin constituting the self-bonding layer 3. In Tables 1, 2, and 3, only bisphenol A diglycidyl ether (BPADGE) is illustrated as the resin contained in the prepreg sheet 7. As a result of the experiment, it has been found that the dependency of the adhesive strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 on the resin contained in the prepreg sheet 7 is small, so the resin contained in the prepreg sheet 7 is: Any thermosetting resin based on epoxy can be used.
- BPADGE bisphenol A diglycidyl ether
- the shear bond strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 was 24 MPa.
- the shear bonding strength between the superconducting coil winding frame 1 and the superconducting wire 2 is “the shear bonding strength between the insulating coating 8 and the self-bonding layer 3, mixed with the self-bonding layer 3. The lowest strength among the shear bond strength between the layers 9, the shear bond strength between the mixed layer 9 and the prepreg sheet 7, and the shear bond strength between the prepreg sheet 7 and the insulating plate 5 (insulating plate 6) ". .
- Examples 1-1 to 1-7 phenoxy was used as the resin constituting the self-bonding layer 3, and bisphenol A diglycidyl ether was used as the resin included in the prepreg sheet 7.
- a mixed layer 9 having a different thickness was further provided.
- the shear bond strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 was measured (see Table 1).
- the shear adhesive strength was 61 MPa. The thicker the mixed layer 9, the higher the shear bond strength.
- Comparative Example 2 nylon was used as the resin constituting the self-bonding layer 3, and bisphenol A diglycidyl ether was used as the resin included in the prepreg sheet 7. However, the mixed layer 9 was not provided. At this time, the shear bond strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 was 21 MPa.
- Examples 2-1 to 2-4 nylon was used as the resin constituting the self-bonding layer 3, and bisphenol A diglycidyl ether was used as the resin included in the prepreg sheet 7.
- a mixed layer 9 having a different thickness was further provided.
- the shear bond strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 was measured (see Table 2). When the thickness of the mixed layer 9 was 10 nm, the shear bond strength was 43 MPa. The thicker the mixed layer 9, the higher the shear bond strength.
- Comparative Example 3 polyimide was used as the resin constituting the self-bonding layer 3, and bisphenol A diglycidyl ether was used as the resin included in the prepreg sheet 7. However, the mixed layer 9 was not provided. At this time, the shear bond strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 was 5 MPa.
- Examples 3-1 to 3-3 polyimide was used as the resin constituting the self-bonding layer 3, and bisphenol A diglycidyl ether was used as the resin included in the prepreg sheet 7.
- a mixed layer 9 having a different thickness was further provided.
- the shear adhesive strength between the winding frame 1 of the superconducting coil and the superconducting wire 2 was measured (see Table 3). When the thickness of the mixed layer 9 was 10 nm, the shear bond strength was 20 MPa. The thicker the mixed layer 9, the higher the shear bond strength.
- the mixed layer 9 has a predetermined thickness or more, the molecules of the self-bonding layer 3 and the resin contained in the prepreg sheet 7 are entangled with each other, and the superconducting wire 2, the insulating plate 5, and the insulating plate 6 are The self-bonding layer 3, the prepreg sheet 7 and the mixed layer 9 are firmly bonded. Thereby, peeling between the superconducting wire 2 and the insulating plate 5 and the insulating plate 6 in the superconducting coil can be prevented, and quenching can be greatly reduced.
- Strength is improved. According to the experimental results, it was found that if the mixed layer 9 is at least 10 nm or more, the shear bond strength is improved by a factor of two or more compared to the case where the mixed layer 9 is not provided. Further, it was found that if the mixed layer 9 is at least 30 nm or more, the shear bond strength is improved by 3 times or more as compared with the case where the mixed layer 9 is not provided.
- the shear bond strength is improved by 4 times or more as compared with the case where the mixed layer 9 is not provided.
- other thermoplastic resins such as epoxy, polyamide, and polyester have the same tendency.
- the effect of the prepreg sheet 7 is that a sheet-like material is attached, so that a shape following the inner peripheral surface of the winding frame 1 can be formed, and a structure in which no gap is generated can be achieved.
- a suitable member can be formed.
- a pre-molded FRP may be disposed on the insulating plate 5 formed on the flange side plane of the reel 1.
- the constituent material of the FRP is a material having characteristics equivalent to those of the sheet-like member described above.
- FRP molded with pressure applied in this way can adjust the resin content, and can prevent voids from entering between the resins, improving adhesion, increasing strength, and thickness. Etc. are easy to adjust.
- the characteristics of the insulating plate can be stabilized. Moreover, since the handling at the time of manufacture is also easy, an assembly process can be shortened and cost can be reduced.
- Insulating plates 5 and 6 have a thermal strain from room temperature to extremely low temperature (liquid helium temperature: 4.2 K) of ⁇ 0.1% with respect to the thermal strain of superconducting wire 2 of -0.4%.
- the insulating material and the reinforcing material are preferably configured to be 0.3 to -0.5%.
- the Young's modulus of the resin used for impregnation of the superconducting coil is about 10 GPa, and considering the possibility of a defect of about 0.1 mm due to poor impregnation, the strength of the resin is expected to be about 10 to 20 MPa. Is done. For this reason, if a thermal strain of 0.1% to 0.2% occurs between the superconducting wire 2 and the insulating plate 5 and insulating plate 6, the impregnated resin cracks and generates heat, or peeling between members occurs during excitation. It may generate heat and cause quenching.
- the thermal strain of the insulating plate 5 and the insulating plate 6 can be adjusted to ⁇ 0.1% or less with respect to the superconducting wire 2 and controlling the thermal strain difference, cracking of the impregnating resin can be prevented and quenching can be prevented.
- the causative heat generation can be suppressed.
- the thermal strain generated from room temperature to extremely low temperature is -0.15% for glass and -0.6% for polyimide film, respectively.
- the ratio with respect to the film is determined, with respect to glass being 1, the polyimide film is not less than 0.5 and not more than 3.5.
- the magnetic field strength of the superconducting coil varies depending on the shape, size, and structure of the coil, but in this structure, the superconducting wires are fixed by the self-bonding layer 3 and are used below the strength of the self-bonding layer 3. It is preferable.
- the strength of the self-bonding layer 3 is generally about 100 to 200 MPa, it is designed under such conditions.
- the safety factor is doubled, 50 MPa or less is appropriate. Even when it is used under more severe conditions, it is not realistic to use it at 100 MPa or higher, so the upper limit is considered to be about 100 MPa.
- the heat transfer resistance of the insulating plate 5 and the insulating plate 6 As the heat transfer resistance of the insulating plate 5 and the insulating plate 6 is increased, the amount of heat transfer is reduced. Therefore, when the superconducting coil is used in a high magnetic field, the insulating material used for the superconducting coil needs to increase the heat transfer resistance. However, if the insulating material is increased too much, the rigidity of the entire coil is lowered and the cost is increased. Therefore, it is necessary to set an appropriate insulation resistance according to the magnetic field. When exfoliation heat is generated between the members between the reel 1 and the insulating plate 5 and the insulating plate 6, the heat is transferred to the reel 1 and the insulating plate 5 and the insulating plate 6. Determined by heat transfer resistance.
- the relationship between the heat transfer resistance and the limit heat input when the thicknesses of the insulating plate 5 and the insulating plate 6 are changed is almost linear. It is better to estimate the heat generation based on the coil specifications and set the heat transfer resistance accordingly. When the magnetic field is increased, the temperature tolerance of the wire decreases, so the heat transfer resistance is taken into consideration.
- the self-bonding layer 3 having a high adhesive strength
- the prepreg sheet 7 having a sufficiently large heat transfer resistance and adjusting the thermal strain at the peeling portion between the members between the superconducting wire 2 and the winding frame 1.
- the entire superconducting coil is immersed in a cryogenic liquid such as liquid helium in order to keep the superconducting wire 2 at a temperature lower than the superconducting transition temperature.
- a cryogenic liquid such as liquid helium
- the cause of quenching in superconducting coils at extremely low temperatures is mechanical disturbance.
- Mechanical disturbances such as cracking of the resin impregnated with the superconducting coil, separation between members when the relative displacement occurs between the members constituting the superconducting coil or the surrounding members When it occurs, it generates an exotherm and causes quenching.
- Such cracking of the resin and separation between the members are caused by cooling the superconducting coil, and each member constituting the superconducting coil is thermally contracted, and the shrinkage rate is different, so that the self-bonding layer 3 is cracked due to thermal stress. It is considered that peeling occurs between the constituent members, and further, when the electromagnetic force is applied during excitation, the peeling progresses and relative displacement occurs between the constituent members.
- a certain amount or more is previously set so that tension remains in the superconducting wire 2 and does not slip on the winding frame 1. You may employ
- FIG. 2 is an enlarged cross-sectional view of a superconducting coil using square wires.
- the superconducting coil in FIG. 2, which is an enlarged view of FIG. 1, has a superconducting wire 2, a self-bonding layer 3, an insulating coating 8, an insulating plate 5, a prepreg sheet 7, and a mixed layer 9.
- FIG. 3 is an enlarged cross-sectional view of a superconducting coil using a round wire.
- the superconducting coil has a superconducting wire 2, an insulating coating 8, a self-bonding layer 3, a mixed layer 9, a prepreg sheet 7, and an insulating plate 6, as in the case of the square wire in FIG. 2.
- the superconducting coil of this embodiment quenching can be suppressed in both MRI apparatuses.
- the open type superconducting coils are arranged above and below, so that the shear stress due to the magnetic field applied to the superconducting coil is larger than in the tunnel type in which the coils are arranged in a cylindrical shape.
- the effect of this embodiment of suppressing the occurrence of quenching by improving the adhesive strength is high.
- the rate of quench generation in the MRI apparatus can be reduced to less than 1%.
- a magnetic resonance imaging apparatus (hereinafter referred to as an MRI apparatus) will be described with reference to FIG.
- the MRI apparatus 20 includes a pair of static magnetic field generation units 21 and a connecting member 22 that are connected so that a central axis Z indicating a vertical direction is a rotationally symmetric axis.
- a space formed by the pair of static magnetic field generation units 21 and the connecting member 22 is referred to as an imaging region 23.
- a gradient magnetic field generator 24 exists so as to sandwich the imaging region 23.
- the MRI apparatus 20 also includes a bed 26 on which the subject 25 is placed, and a transport unit 27 that transports the subject 25 placed on the bed 26 to the imaging region 23.
- the pair of static magnetic field generators 21 includes the superconducting coil described in the first embodiment, and generates a static magnetic field by the superconducting coil.
- the MRI apparatus 10 has, as another component not shown in the overall perspective view of FIG. 4, an RF oscillation unit (RF that irradiates the imaging region 23 with an electromagnetic wave having a resonance frequency that causes the subject 25 to develop an NMR phenomenon. Radio Frequency) 28, a receiving coil 29 for receiving a response signal emitted when the NMR phenomenon occurs and the spin state of the hydrogen nucleus changes, and a control device 30 for controlling each part of the MRI apparatus 10 An analysis device 31 is provided for processing and analyzing the signal.
- RF oscillation unit RF that irradiates the imaging region 23 with an electromagnetic wave having a resonance frequency that causes the subject 25 to develop an NMR phenomenon.
- Radio Frequency Radio Frequency
- a receiving coil 29 for receiving a response signal emitted when the NMR phenomenon occurs and the spin state of the hydrogen nucleus changes
- An analysis device 31 is provided for processing and analyzing the signal.
- the static magnetic field generation unit 21 generates a uniform static magnetic field (uniform magnetic field) in the imaging region 23, and the gradient magnetic field generation unit 24 generates a uniform magnetic field so that the magnetic field strength in the imaging region 23 is inclined.
- a gradient magnetic field is superimposed.
- the MRI apparatus 10 causes the NMR phenomenon to appear only in the region of interest (usually a slice surface with a thickness of 1 mm) in the imaging region 23 and images the tomography of the subject 25.
- the gradient magnetic field generation unit 24 is disposed in a pair of accommodation spaces respectively provided on opposing surfaces of the pair of static magnetic field generation units 21.
- the gradient magnetic field generator 24 is configured to arbitrarily switch the three directions orthogonal to the imaging region 23 during operation of the MRI apparatus 20 and to superimpose the gradient magnetic field. In this way, the intensity of the magnetic field in the imaging region 23 is By arbitrarily switching and tilting in three orthogonal directions, the three-dimensional position where the NMR phenomenon appears becomes clear.
- the vertical magnetic field type MRI apparatus has been described as an example, but the configuration of the present embodiment can also be used with a horizontal magnetic field type MRI apparatus (not shown).
- FIG. 5 is a cross-sectional view of a superconducting wire.
- the superconducting wire includes a superconducting raw material 10, a metal sheath 11, an insulating coating 12 covering the metal sheath 11, a self-bonding layer 13, a resin mixed layer 14, a prepreg sheet 15, and an insulator 16. Consists of.
- the superconducting coil has been described as an invention.
- the invention is described as “a superconducting wire including a self-bonding layer 13, a resin mixed layer 14, and a prepreg sheet 15.” explain.
- the metal sheath superconducting wire of this embodiment has a structure in which at least one superconducting raw material 10 is embedded in a filament shape in the metal sheath 11. Further, the shape of the superconducting wire can be a round shape, a square shape, a tape shape, or a collective shape obtained by twisting these round wires.
- the superconducting raw material 10 can be selected from a wide range such as NbTi, MgB 2 , an oxide superconductor, and an organic superconductor.
- the metal sheath 11 is preferably a metal tube such as pure Fe, pure Ni, or pure Cu.
- An insulating coating 12 is applied to the surface of the metal sheath 11, and a self-bonding layer 13 is provided on the surface of the insulating coating 12.
- the insulation coating 12 is made of polyvinyl formal, epoxy, polyimide, polyamideimide, etc. having a thickness of about 10 to 100 ⁇ m, or those obtained by winding fibers such as glass or polyester on these.
- the self-bonding layer 13 is made of a thermoplastic resin such as phenoxy, epoxy, polyamide, polyester, polyimide, or nylon having a thickness of about 10 to 100 ⁇ m.
- the heating temperature for fusing is 75 ° C. or higher and 150 ° C. or lower, which is lower than the softening temperature of the insulating coating 8.
- the thickness is in a range that ensures adhesive strength and does not impair thermal conduction.
- the resin impregnated in the prepreg sheet 15 formed outside the self-bonding layer 13 is mainly composed of epoxy such as bisphenol A diglycidyl ether, phthalic anhydride or dicyandiamide is mixed in the curing agent, and ethanol or the like is used as a solvent. Use what you used. Then, by heating the entire superconducting wire from about 75 ° C. to about 150 ° C., the prepreg sheet 15 can be fixed to the insulator 16 formed outside the prepreg sheet 15. By doing in this way, the laminated
- FRP fiber reinforced plastic
- the insulator 16 formed outside the prepreg sheet 15 is formed by laminating a reinforcing material made of glass fiber and an insulating material having a low thermal conductivity in order to increase heat transfer resistance. Since the thickness of the insulating material can be easily adjusted and it can be impregnated with a resin or the like, polyethylene terephthalate (PET) or polyimide is suitable.
- PET polyethylene terephthalate
- the resin contained in the self-bonding layer 13 and the prepreg sheet 15 is mixed, and the resin contained in the self-bonding layer 13 and the prepreg sheet 15 is mixed.
- Layer 14 is formed. This is an interface where the thermoplastic self-bonding layer 13 and the prepreg sheet 15 containing a thermosetting resin liquid are in contact with each other.
- the self-bonding layer 13 This is because it dissolves and mixes with the resin liquid contained in the prepreg sheet 15.
- the mixed layer 14 has a predetermined thickness or more, the molecules of the self-bonding layer 13 and the resin contained in the prepreg sheet 14 are entangled with each other, and the metal sheath 11 and the insulator 16 are connected to each other. 13 and the prepreg sheet 15 and the resin mixed layer 14 are firmly bonded. Thereby, peeling between the metal sheath 11 and the insulator 16 in the superconducting wire can be prevented, and quenching can be greatly reduced.
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Abstract
Description
(1)自己融着層3を構成する樹脂にフェノキシを用い、混合層9の厚さを10nm以上にした場合、(2)自己融着層3を構成する樹脂にナイロンを用い、混合層9の厚さを25nm以上にした場合、超電導コイルの巻枠1と超電導線2の間のせん断接着強度が60MPa以上となる。
(1)自己融着層3を構成する樹脂にフェノキシを用い、混合層9の厚さを20nm以上にした場合、(2)自己融着層3を構成する樹脂にナイロンを用い、混合層9の厚さを100nm以上にした場合、超電導コイルの巻枠1と超電導線2の間のせん断接着強度が80MPa以上となる。
自己融着層3を構成する樹脂にフェノキシを用い、混合層9の厚さを50nm以上にした場合、超電導コイルの巻枠1と超電導線2の間のせん断接着強度が100MPa以上となる。
このように撮像領域23における磁場の強度が、直交する三方向に任意に切り替わって傾斜することにより、NMR現象が発現する三次元位置が明らかになる。
7…プリプレグシート、8…絶縁被覆、9…混合層、
10…超電導原料、11…金属シース、12…絶縁被覆、13…自己融着層
14…混合層、15…プリプレグシート、16…絶縁体
20…MRI装置、21…一対の静磁場発生部、22…連結部材、
23…撮像領域、24…傾斜磁場発生部、25…被検体、26…ベッド
27…搬送手段、28…RF発振部、29…受信コイル、
30…制御装置、31…解析装置
Claims (20)
- 巻枠と、前記巻枠に巻きつけられた超電導線とを有する超電導コイルにおいて、
前記巻枠と前記超電導線との間に、
熱可塑性樹脂を含む第1の樹脂層と、
熱硬化性樹脂を含む第2の樹脂層と、
前記第1の樹脂層と前記第2の樹脂層の間に位置し、前記熱可塑性樹脂と熱硬化性樹脂の混合物を含む混合層と、
を有することを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記混合層の厚さが10nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記混合層の厚さが30nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記混合層の厚さが100nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記熱可塑性樹脂はフェノキシであり、
前記混合層の厚さが10nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記熱可塑性樹脂はフェノキシであり、
前記混合層の厚さが20nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記熱可塑性樹脂はフェノキシであり、
前記混合層の厚さが50nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記熱可塑性樹脂はナイロンであり、
前記混合層の厚さが25nm以上であることを特徴とする超電導コイル。 - 請求項1に記載の超電導コイルにおいて、
前記熱可塑性樹脂はナイロンであり、
前記混合層の厚さが100nm以上であることを特徴とする超電導コイル。 - 請求項1乃至9のいずれかに記載の超電導コイルにおいて、
前記第1の樹脂層は自己融着性を有することを特徴とする超電導コイル。 - 請求項1乃至10のいずれかに記載の超電導コイルにおいて、
前記第2の樹脂層はプリプレグシートであることを特徴とする超電導コイル。 - 請求項1乃至11のいずれかに記載の超電導コイルにおいて、
さらに絶縁被覆と絶縁板を有し、
前記超電導線、前記絶縁被覆、前記第1の樹脂層、前記混合層、前記第2の樹脂層、前記絶縁板、前記巻枠が順に形成されていることを特徴とする超電導コイル。 - 請求項1乃至12のいずれかに記載の超電導コイルにおいて、
前記第1の樹脂層と前記混合層の間のせん断接着強度、及び前記混合層と前記第2の樹脂層の間のせん断接着強度が30MPa以上であることを特徴とする超電導コイル。 - 請求項1乃至12のいずれかに記載の超電導コイルにおいて、
前記第1の樹脂層と前記混合層の間のせん断接着強度、及び前記混合層と前記第2の樹脂層の間のせん断接着強度が60MPa以上であることを特徴とする超電導コイル。 - 請求項1乃至14のいずれかに記載の超電導コイルと、
被検体を載せるベッドと、
前記ベッドに載せられた被検体を撮像領域へ搬送する搬送手段と、
前記搬送手段により撮像領域に搬送された被検体からの核磁気共鳴信号を解析する解析手段と、
を備えたことを特徴とする磁気共鳴イメージング装置。 - 巻枠と、前記巻枠に巻きつけられた超電導線とを有する超電導コイルの製造方法において、
前記巻枠と前記超電導線との間に、
熱可塑性樹脂を含む第1の樹脂層を形成する工程と、
熱硬化性樹脂を含む第2の樹脂層を形成する工程と、
前記第1の樹脂層と前記第2の樹脂層の間に、前記熱可塑性樹脂と熱硬化性樹脂の混合物を含む混合層を形成する工程と、
を有することを特徴とする超電導コイルの製造方法。 - 請求項16に記載の超電導コイルの製造方法において、
前記混合層の厚さが10nm以上であることを特徴とする超電導コイルの製造方法。 - 請求項16または17に記載の超電導コイルの製造方法において、
前記混合層を形成する工程において、前記第1の樹脂層と前記第2の樹脂層との間に、0.2~0.5MPaの圧力をかけることを特徴とする超電導コイルの製造方法。 - 請求項16または17に記載の超電導コイルの製造方法において、
前記混合層を形成する工程において、前記第1の樹脂層と前記混合層の間のせん断接着強度、及び前記混合層と前記第2の樹脂層の間のせん断接着強度が30MPa以上となるように、前記第1の樹脂層と前記第2の樹脂層との間に圧力をかけることを特徴とする超電導コイルの製造方法。 - 金属管内に超電導体を収容した超電導線において、
前記金属管の表面に、
熱可塑性樹脂を含む第1の樹脂層と、
熱硬化性樹脂を含む第2の樹脂層と、
前記第1の樹脂層と前記第2の樹脂層の間に位置し、前記熱可塑性樹脂と熱硬化性樹脂の混合物を含む混合層と、
を有することを特徴とする超電導線。
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EP15809728.7A EP3159899A4 (en) | 2014-06-18 | 2015-06-17 | Super-conducting wire, super-conducting coil, and magnetic resonance imaging device |
CN201580026543.3A CN106463230B (zh) | 2014-06-18 | 2015-06-17 | 超导导线、超导线圈以及磁共振成像装置 |
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JPH07192912A (ja) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | 超電導コイルおよびその安定性診断方法 |
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JPH08172013A (ja) * | 1994-10-04 | 1996-07-02 | Toshiba Corp | 超電導コイルおよびその製造方法並びに超電導ワイヤ |
JP2005340637A (ja) | 2004-05-28 | 2005-12-08 | Toshiba Corp | 超電導コイル |
WO2015098637A1 (ja) * | 2013-12-26 | 2015-07-02 | 古河電気工業株式会社 | 絶縁ワイヤ、モーターコイル、電気・電子機器および絶縁ワイヤの製造方法 |
EP3089169B1 (en) * | 2013-12-26 | 2018-07-04 | Furukawa Electric Co., Ltd. | Insulated wire, coil, and electronic/electrical equipment |
CN105900185B (zh) * | 2014-01-10 | 2018-04-20 | 古河电气工业株式会社 | 绝缘电线、线圈和电气电子设备以及绝缘电线的防破裂方法 |
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JPH07192912A (ja) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | 超電導コイルおよびその安定性診断方法 |
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