WO2015167178A1 - 반도체 소자 테스트용 소켓장치 - Google Patents
반도체 소자 테스트용 소켓장치 Download PDFInfo
- Publication number
- WO2015167178A1 WO2015167178A1 PCT/KR2015/004141 KR2015004141W WO2015167178A1 WO 2015167178 A1 WO2015167178 A1 WO 2015167178A1 KR 2015004141 W KR2015004141 W KR 2015004141W WO 2015167178 A1 WO2015167178 A1 WO 2015167178A1
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- Prior art keywords
- socket
- contact
- semiconductor device
- plate
- pusher plate
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Definitions
- the present invention relates to a socket device for testing a semiconductor device.
- a socket for a semiconductor device is provided in a test board or a burn-in board, and is required for driving an IC through an I / O terminal (input / output terminal) formed on a board (test board, burn-in board).
- the burn-in chamber or its peripherals, which allow input and output of power and electrical signals, and separate test devices for measuring the characteristics of the IC, are connected to the system for a series of IC tests.
- the BGA (Ball Grid Array) IC is an innovative reduction in the size and thickness of the IC by arranging the terminals, or balls, of the IC on the entire bottom surface of the IC.
- LGA Land Grid Array
- IC is an IC in a state in which a ball is not attached to a pad (or land) in a BGA type IC.
- LGA or BGA and LGA complex ICs are also produced in various ways, and the socket for testing the LGA or IC is equipped with a plurality of contacts having a predetermined elastic force in the vertical direction, and the bottom of the contact.
- the terminals are connected to the PCB by contact or soldering.
- the upper terminal of the contact is formed to be in contact with the terminal of the IC loaded in the socket (Loading), and the pressure device for pressing the IC downward for electrical stable contact should be provided in the socket.
- the physical force applied to the contact is about 10 (gf) per contact, for example, when there are 500 terminals of the IC, a strong physical force of about 5.0 (Kgf) should be applied. It can be seen.
- the socket for testing the IC should be provided with pressing means capable of effectively applying the strong physical force as described above to the IC.
- Fig. 1 (a) (b) (c) is a plan view, side view, and bottom view of a typical IC, respectively, and is a 0.35 mm pitch BGA IC having a number of leads of 456 and an IC size of 14 ⁇ 15.5. The latest production representative IC with a thickness of 0.5mm is shown.
- minute projections 2 are formed on the upper surface of the semiconductor element 1 to be processed similarly to the surface of sandpaper, and a plurality of terminals are provided on the lower surface as terminals of the semiconductor element.
- the balls 3 are arranged.
- the thickness of the semiconductor device will be thinned up to 0.25 mm in the future, the terminal pitch is 0.30mm, 0.25mm, 0.2mm pitch is minimized, the number of the singular can also be up to 500 to about 1000.
- 2A and 2B are respectively a plan view and a cross-sectional view taken along line A-A of a socket device for testing a semiconductor device according to the prior art.
- the socket device 10 for testing a semiconductor device includes a socket body 11 and a socket body 11 provided with a plurality of contacts 12 having a curved shape.
- a cover 13 that is movable up and down and an upper portion and a latch 14 that is rotatably assembled to the socket body 11 to lock or release the semiconductor element 20 in association with the vertical movement of the cover 13. .
- the latch 14 is formed with a guide slot 14a.
- the guide slot 14a is coupled to the guide pin 15a, and the guide pin 15a has a driving link 15 hinged to the cover 13. It is fixed to).
- the cover 13 is elastically supported by the coil spring 16.
- the latch 14 is opened to the outside and the semiconductor element can be loaded.
- the latch is released by the elastic restoring force of the coil spring 16. 14 presses the upper part of the semiconductor element to fix it.
- the end of the latch is repeatedly pressed to fix the upper portion of the semiconductor element with a strong force.
- the upper surface of the semiconductor element has a rough surface.
- test socket device of the conventional LGA type semiconductor device has to arrange and assemble the contacts by additional parts for assembling the contacts having the bow-shaped bends, and the number of parts is difficult and the assembling is difficult, and the semiconductor has a strong physical force.
- the structure of the socket device is complicated by requiring a structure and a driving mechanism for pressing the device, and in particular, due to the structure of the complicated socket device, there is a problem in that the cost of the unit and the overall quality of the socket are lowered.
- Patent Document 1 Republic of Korea Patent Publication No. 10-2013-0135563 (published date: 2013.12.11)
- Patent Document 2 Republic of Korea Patent Publication No. 10-1345816 (Notice date: 2014.01.10)
- the present invention is to improve such a conventional socket device for testing a semiconductor device, the recent or future trend of IC changes in the number of terminals increases, the terminal pitch (LEAD PITCH) becomes narrow pitch, the thickness becomes thinner It is an object of the present invention to provide a socket device for testing a semiconductor device having a means for effectively pressing and fixing a semiconductor device to a socket device in consideration of characteristics of the semiconductor device.
- a socket device for testing a semiconductor device includes: a socket body (100) having a plurality of first receiving holes (101) for contact insertion; A plurality of second accommodation holes 201 are provided below the socket body 100 and communicate with the first accommodation hole 101 so that the lower contact portion of the contact 400 makes electrical contact with the PCB terminals.
- the socket body 100 is elastically supported by a plurality of first elastic bodies (S1) is provided to be able to move up and down, the upper side is provided as a seating surface of the semiconductor element and the upper contact portion of each contact is located through A floating plate 300 having a plurality of through holes 301 formed therein; A plurality of contacts inserted into the first accommodation hole 101 and the second accommodation hole 201 such that a lower contact part contacts a terminal of a PCB and an upper contact part contacts a terminal of a semiconductor element through the through hole 301; 400); An adapter plate 500 provided on the floating plate 300 and having a guide inclined surface to allow the semiconductor device to be seated on the floating plate 300; It is elastically supported by a plurality of second elastic body (S2) is assembled with the socket body 100 by a plurality of hooks 620 to be able to flow up and down on the socket body 100, a semiconductor element on the guide inclined surface An opening 601 formed to be guided and loadable, and a socket cover 600 having an opening pro
- a pusher plate 710 disposed at a lower end of the opening protrusion 610 to press the upper surface of the semiconductor element by surface contact, including an opening cam 711 which is in contact with the opening protrusion 610;
- a latch 720 having one end hinged to the socket cover 600 and the other end hinged to the pusher plate 710;
- a link 730 having one end hinged to the socket body 100 and the other end hinged to the latch 720.
- a socket device for testing a semiconductor device includes: body elements 100 and 200 into which a contact 400 is inserted and fixed; The semiconductor device IC is placed in a seating position so that the terminal of the semiconductor device and the upper end of the contact can be contacted, and are elastically supported by the body elements 100 and 200 to enable vertical movement within a set height range.
- Movable elements 300 and 500 A socket cover 600 which is assembled to an upper portion of the movable elements 300 and 500 and is elastically assembled to the body elements 100 and 200;
- a semiconductor element pressurizing part 700 for pressurizing and fixing the semiconductor element IC which is interlocked with the upper and lower positions of the cover element 600 and is positioned on the movable elements 300 and 500, and pressurizes the semiconductor element.
- the part 700 may include an opening cam 711 positioned at a lower end of the inner wall surface structure of the socket cover 600 to be in contact with the socket cover 600 when the socket cover 600 moves downward to face the top surface of the semiconductor device IC.
- a link 730 having one end hinged to the body elements 100 and 200 and the other end hinged to the latch 720.
- the hinge shaft of the pusher plate 710 and the latch 720 is elastically supported by the first torsion spring (SS1), more preferably, the pusher plate 710 ) Includes a rotation stop surface 716 such that the rotation angle is limited in contact with the latch 720 so that the distal end is first in contact with the upper surface of the semiconductor device.
- SS1 first torsion spring
- the hinge shaft of the socket body 100 and the link 730 is elastically supported by a second torsion spring (SS2), more preferably, the link 730 Is connected to the latch 720 and the socket body 100 and the hinge pin at the top and bottom, respectively, the hinge hole is formed so that the two link plates 731, 732 are provided in parallel; The two link plates 731 and 732 are fixed to each other, and the fixing plate 733 is formed with a fixing hole for fixing one end of the second torsion spring SS2.
- SS2 second torsion spring
- the hinge shafts of the body elements 100 and 200 and the link 730 are elastically supported by the second torsion spring SS2.
- the floating plate 300 is characterized in that the ball cup 320 is formed in communication with the through hole on the mounting surface of the semiconductor element recessed to accommodate the terminal of the semiconductor element.
- the contact is formed by punching a plate and integrally processed, having an upper head portion 410 having an upper tip portion 411 protruding upward;
- a compression part 420 formed of a strip bent in a cylindrical shape from an upper shoulder part 412 extending downward from the upper head part 410;
- a lower head part 430 extending downward from the lower shoulder part 432 extending from the lower part of the compression part 420 and having a lower tip part 431 at a lower part thereof, wherein the compression part is a coil spring. It is done.
- the pusher plate 710 is characterized in that a plurality of irregularities 715 are formed along the rotational direction of the pusher plate 710 on the bottom pressing surface where direct contact with the semiconductor element is made.
- the socket body 100 is mounted by a test board and a plurality of screws, the contact 400 is compressible and the lower tip portion 431 is compressed with the terminals of the test board to contact This is characterized in that it is made.
- the lower side of the lower plate 200 further comprises a guide plate formed with a contact guide hole for guiding the contact, the contact 400 is compressible and the lower tip portion 431 is It is characterized by being soldered to the terminals of the test board.
- the socket device for testing a semiconductor device of the present invention provides a means capable of strongly pressurizing while keeping the entire surface of the IC horizontal in response to an upward contact force applied to terminals of the semiconductor device.
- the present invention has the effect that it is possible to provide a socket device for a micro pitch multi-pin that can more effectively test a semiconductor device that the number of terminals of the semiconductor element is increased, the terminal pitch is made smaller pitch, and the thickness thereof becomes thinner.
- 2 (a) and 2 (b) are a plan view and a cross-sectional view taken along line A-A of a socket device for testing a semiconductor device according to the prior art, respectively,
- FIG. 3 is a plan view of a socket device for testing a semiconductor device according to the present invention.
- FIG. 4 is a cross-sectional view taken along the line B-B of FIG.
- FIG. 5 is a cross-sectional view taken along the line C-C of FIG.
- 6 (a) and 6 (b) are cross-sectional views of a front view and a D-D line of a contact of a socket device for testing a semiconductor device according to the present invention, respectively;
- FIG. 7 is a cross-sectional view showing a preferred embodiment of the movable element in the socket device for testing a semiconductor device of the present invention
- FIG. 8 are a plan view of a socket cover, a sectional view of a F-F line, a bottom view, and a sectional view of an E-E line, respectively, in the socket device for testing a semiconductor device according to the present invention
- 9A, 9B, and 9C are a plan view, a left side view, and a front view of a link in the socket device for testing a semiconductor device according to the present invention, respectively;
- FIG. 11 are diagrams illustrating an initial process of pressurizing a semiconductor device of a pusher plate in a semiconductor device pressurizing unit in the semiconductor device test socket device of the present invention
- Figure 12 (a) (b) (c) (d) is a view showing a semiconductor device loading process of the semiconductor device test socket device of the present invention.
- the socket device for testing a semiconductor device of the present invention includes: body elements 100 and 200 into which the contact 400 is inserted and fixed;
- the semiconductor device IC is placed in a seating position so that the terminal of the semiconductor device and the upper end of the contact can be contacted, and are elastically supported by the body elements 100 and 200 to enable vertical movement within a set height range.
- a socket cover 600 which is assembled to an upper portion of the movable elements 300 and 500 so as to be elastically assembled to the body elements 100 and 200 so as to be movable up and down; And a semiconductor device pressurizing unit configured to pressurize and fix the semiconductor device IC, which is interlocked with the upper and lower positions of the socket cover 600 to be seated on the movable elements 300 and 500.
- a pusher plate 710 including an opening cam 711 which is in contact with the cover 600 and presses the upper surface of the semiconductor device IC in surface contact with the pusher plate 710;
- a latch 720 having one end hinged to the socket cover 600 and the other end hinged to the pusher plate 710;
- a link 730 having one end hinged to the body elements 100 and 200 and the other end hinged to the latch 720.
- 6 (a) and 6 (b) are respectively a front view and a sectional view taken along the line D-D of a contact of a socket device for testing a semiconductor device according to the present invention.
- the contact 400 has a cylindrical shape in an upper head portion 410 having an upper tip portion 411 protruding upward, and an upper shoulder portion 412 extending downward from the upper head portion 410.
- Compression portion 420 made of a strip bent in the shape, and the lower head portion 430 having a lower tip portion 431 is formed extending downward from the lower shoulder portion 432 extending from the compression portion 420 bottom
- the compression unit 420 may be a coil spring, which is a compressive contact having an elastic force in the longitudinal direction, and is an integral contact processed by stamping a plate integrally.
- the body elements 100 and 200 are composed of the socket body 100 and the lower plate 200.
- the socket body 100 has a rectangular or square structure as a whole, and a plurality of first accommodation holes 101 are formed to insert and fix the plurality of contacts 100, respectively.
- the socket body 100 may be fixed to a plurality of screws on a test board (PCB) (not shown), and the lower contact portion of the contact 100 supported by the socket body 100 is in contact with the terminal of the test board in a compressed state. This is done.
- PCB test board
- the lower plate 200 is provided under the socket body 100, and a plurality of second accommodation holes 201 are formed to communicate with the first accommodation hole 101, so that the lower contact portion of the contact 100 has a second accommodation hole. It penetrates 201 and makes electrical contact with the terminal of the test substrate.
- the socket body is mainly fixed to the test board such that the lower contact portion of the contact of the present invention is in compression contact with the test board
- the leader guide having a contact leader guide hole for guiding the contact leaders on the lower side of the lower plate.
- the socket structure further includes a plate, and lower contacts of the contacts are further extended to be soldered to the PCB, which is a modified embodiment of the present invention.
- the movable elements 300 and 500 are composed of a floating plate 300 and an adapter plate 500.
- the floating plate 300 is elastically supported on the socket body 100 by a plurality of first elastic bodies S1 and is provided to be vertically movable.
- the floating plate 300 is provided as a seating surface of the semiconductor device, and each of the contacts 400 A plurality of through holes are formed through which the upper contact portion is located.
- the floating plate 300 is provided with a plurality of hooks 310 in the lower portion, the socket body 100 is a socket body 100 is formed by the engaging end 110 corresponding to each hook 310 is protruded
- the floating plate 300 that can be vertically flown from the upper side is elastically supported by the first elastic body S1 because the upward movement height is limited.
- the adapter plate 500 is provided on the floating plate 300 and has a guide inclined surface to allow the semiconductor device to be seated on the floating plate 300.
- FIG. 7 is a cross-sectional view showing a preferred embodiment of the movable element in the socket device for testing a semiconductor device of the present invention.
- the floating plate 300 has a guide surface 511 which forms sidewalls surrounding the periphery of the semiconductor device IC mounting surface, and has a predetermined slope discontinuously at the guide surface 511.
- An inclined surface 512 extending laterally is formed so that the semiconductor device IC is positioned on the guide surface 511 along the inclined surface 512, so that the semiconductor device IC may be loaded at a proper position.
- a ball cup 320 for accommodating the solder ball B of the semiconductor device in a proper position may be provided in the floating plate 300, wherein the ball cup 320 may be provided.
- the upper contact portion of the contact is in communication with the through hole 301 which is located through.
- the socket cover 600 is elastically supported by the plurality of second elastic bodies S2 and is formed by the plurality of second hooks 620 such that the socket cover 600 can vertically flow over the socket body 100. It is assembled with the socket body 100, the semiconductor element is guided to the guide inclined surface is formed to be openable loading.
- FIG. 8 are a plan view of a socket cover, a sectional view of an F-F line, a bottom view, and a sectional view of an E-E line, respectively, in the socket device for testing a semiconductor device of the present invention.
- the socket cover 600 has a rectangular or square structure having the same size as that of the socket body, and an opening 601 is formed in the center to insert a semiconductor element.
- the inner surface of the socket cover 600 is provided with an opening protrusion 610 protruding as a wall structure, the opening protrusion 610 assists the opening operation of the pressing portion of the semiconductor element.
- the wall structure may be a structure protruding from the inner plane, or a pressing operation of the opening cam 711 of the pressing portion of the semiconductor element may be performed by the lower end of the inner surface of the socket cover. It will be described in detail again with reference to the drawings.
- the socket cover 600 extends perpendicularly to the lower end of the socket cover 600, and is provided with a hinge bracket 630 having the first hinge hole 631.
- the lower end of the latch is rotatably assembled through the hinge pin.
- the semiconductor element pressing unit is fixed to the semiconductor element to be seated on the floating plate 300 in conjunction with the vertical position of the socket cover 600.
- the semiconductor element pressing unit is provided to be symmetrical to the left and right, and the same configuration to be symmetrical will be described using only one reference numeral.
- the semiconductor element pressing portion of the present invention may be composed of two or more, for example, it may be provided symmetrically in the left and right and front and rear direction and configured as four.
- the semiconductor element pressing unit includes a pusher plate 710, a latch 720, and a link 730.
- the pusher plate 710 is in surface contact with the upper surface of the semiconductor element and pressurizes the semiconductor element.
- the pusher plate 710 substantially covers the entire upper surface of the semiconductor element so that the contact area between the pusher plate and the semiconductor element is as large as possible. This would be desirable.
- One end of the latch 720 is hinge-assembled with the socket cover 600, and the other end is hinge-assembled with the pusher plate 710.
- One end of the link 730 is hinge-assembled with the socket body 100 and the other end is assembled with the latch 720.
- the hinge shafts of the pusher plate 710 and the latch 720 are elastically supported by the first torsion spring SS1, and the hinge shafts of the socket body 100 and the link 730 are second torsion springs SS2. It is elastically supported by.
- the first torsion spring SS1 and the second torsion spring SS2 maintain the pusher plate 710 in a closed state.
- the semiconductor element pressing unit configured as described above becomes a hinge shaft at which the lower end of the link 730 is fixed, and the hinge shaft at the bottom of the latch 720 moves up and down in accordance with the vertical operation of the socket body 600 to open and close the pusher plate 710. / close) action.
- the pusher plate 710 in the present invention is characterized in that the opening cam is made in direct contact with the socket cover 600 during the opening operation to increase the open rotation angle of the pusher plate 710, the semiconductor device pressurization
- the main configuration of the section will be described in detail.
- 9A, 9B, and 9C show a plan view, a left side view, and a front view of the link of the present invention, respectively.
- the link 730 may be composed of a pair of parallelly provided link plates 731 and 732 and a fixing plate 733 for fixing the two link plates 731 and 732 to each other. have.
- the link plate has a second hinge hole 732a and a third hinge hole 732b at upper and lower ends, respectively, and the second hinge hole 732a is assembled with the latch by a hinge pin, and the third hinge hole 732b. Is assembled with the socket body 100 by a hinge pin.
- the fixing plate 733 may be provided with a fixing hole 732c for fixing one end of the second torsion spring SS2.
- (A) (b) (c) (d) is the front view, the top view, the back view, the bottom view, and the side view of the pusher plate in the socket device for semiconductor element test of this invention, respectively.
- the pusher plate 710 is provided with a shaft hole 712 for assembling the latch and the hinge, and is assembled to the latch by the hinge pin 713 to be rotatable.
- An opening cam 711 is formed to protrude upwardly toward the rear end of the shaft hole 712, and the opening cam 711 opens the opening protrusion 610 of the socket cover 600 during the opening operation of the pusher plate 710.
- the open rotation angle of the pusher plate 710 may be increased by relatively pressing 711.
- the pusher plate 710 is formed with a recess 714 to fix one end of the first torsion spring SS1.
- the pusher plate 710 is formed with a plurality of unevenness 715 along the rotation direction of the pusher plate 710 on the bottom pressing surface where direct contact with the semiconductor element is made so that the pusher plate 710 and the semiconductor element contact the semiconductor element. It is possible to reduce the occurrence of friction in the process of pressing.
- the pusher plate 710 may be formed with a rotation stop surface 716 to contact the latch so as to limit the rotation angle of the pusher plate 710.
- the rotation angle limit of the pusher plate 710 is a semiconductor device. In the initial loading process of the pusher plate 710 to pressurize the semiconductor device, the end of the pusher plate 710 may be pressed while pressing the upper surface of the semiconductor device first.
- FIG. 11 are diagrams for explaining an initial process of pressurizing a semiconductor device of a pusher plate in a semiconductor device pressurizing part in the socket device for testing a semiconductor device of the present invention. Only the pressing part 700 is shown as a center.
- the pusher plate 710 rotates to pressurize the semiconductor device IC, and is pushed by the elastic force of the first torsion spring SS1.
- the rotation stop surface 716 of the plate 710 is rotated in the state where the end of the pusher plate 710 is directed downward while being in contact with the latch 720 so that the end of the pusher plate 710 is the first semiconductor device (IC). Contact is made.
- the pusher plate 710 when the pusher plate 710 continuously rotates in the pressing direction, the pusher plate 710 is completely in contact with the semiconductor device IC to firmly fix the semiconductor device IC.
- the rotation stop surface 716 of the pusher plate 710 is spaced apart from the latch 720.
- the pusher plate 710 when the pusher plate 710 is in contact with the semiconductor device as a whole when the semiconductor device is initially pressed, the front end portion of the pusher plate 710 is first contacted with the semiconductor device and the thickness of the semiconductor device loaded as the pressing is performed. Even if a difference occurs, the semiconductor device can be stably fixed.
- FIG. 12 (a), (b), (c) and (d) are diagrams illustrating a semiconductor device loading process of the socket device for testing a semiconductor device of the present invention.
- FIG. 12A illustrates a natural state of the socket, and the socket cover 600 and the floating plate 300 are positioned at the upper end by the first elastic body S1 and the second elastic body S2.
- FIG. 12 (b) shows a state in which the socket cover 600 is pressed, and the socket cover 600 and the hinged latch 720 are moved downward together with the socket body 100 and the hinge fastening.
- the link 730 is rotated by using the lower end of the link 730 as a fixed rotation axis, and the pusher plate 710 rotates outward from the center of the socket.
- FIG. 12 (c) is a state in which the socket cover 600 is pressed to the maximum, and the pusher plate 710 has a hinge shaft coupled to the upper end of the latch 720 as an axis of rotation.
- the cam 711 opens the socket cover 600. Pressed by the opening protrusion 610 of the open as far as possible to rotate outward.
- the pusher plate 710a indicated by the dotted line in FIG. 12C shows the pusher plate while pressing the socket cover 600 by the same displacement without the open cam 711. It can be seen that the opening distance (M) between the 710a is short compared with the opening distance (N) in the present invention, and thus the present invention provides a pusher at the time of loading a semiconductor element by securing a large opening rotation angle of the pusher plate. Interference with the plate can be prevented.
- FIG. 12 (d) illustrates that when the pressing force applied to the socket cover 600 is removed after the loading of the semiconductor device is completed, the socket cover 600 is moved upward by the elastic force of the second elastic material S2.
- the pusher plate 710 pressurizes the semiconductor device IC and tests the semiconductor device IC. Proceeds.
- the front end portion of the pusher plate 710 first contacts the semiconductor device IC, and the entire pressing surface of the pusher plate 710 contacts the semiconductor device IC. It will be desirable to pressurize.
- socket body 101 the first accommodation ball
- socket cover 610 opening protrusion
- link S1 first elastic body
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
Claims (13)
- 콘택트 삽입을 위한 다수개의 제1수용공(101)이 형성된 소켓몸체(100)와;상기 소켓몸체(100) 하부에 구비되며, 상기 콘택트(400)의 하측 접촉부가 PCB 단자들에 전기적 접촉이 가능하도록 상기 제1수용공(101)과 연통되는 다수의 제2수용공(201)이 관통 형성된 하측 플레이트(200)와;상기 소켓몸체(100) 상부에 복수 개의 제1탄성체(S1)에 의해 탄성 지지되어 상하 유동 가능하게 마련되며, 상측면이 반도체 소자의 안착면으로 제공되고 각 콘택트들의 상측 접촉부가 관통하여 위치하게 되는 다수개의 관통공(301)이 형성된 플로팅 플레이트(300)와;상기 제1수용공(101)과 제2수용공(201)에 삽입되어 하측 접촉부가 PCB의 단자와 접촉되고 상측 접촉부가 상기 관통공(301)을 통하여 반도체 소자의 단자와 접촉하는 다수개의 콘택트(400)와;상기 플로팅 플레이트(300) 상부에 구비되어 반도체 소자가 상기 플로팅 플레이트(300)에 안착 위치할 수 있도록 가이드 경사면을 갖는 어댑터 플레이트(500)와;복수개의 제2탄성체(S2)에 의해 탄성 지지되어 상기 소켓몸체(100) 상부에 상하 유동 가능하도록 복수개의 후크(620)에 의해 상기 소켓몸체(100)와 조립되며, 반도체 소자가 상기 가이드 경사면에 안내되어 로딩 가능하게 개구부(601)가 형성되고 개구부(601)의 내측 벽면에 열림돌기(610)가 돌출 형성된 소켓커버(600)와;상기 소켓커버(600)의 상하 위치에 연동되어 상기 플로팅 플레이트(300)에 안착 위치하게 되는 반도체 소자를 가압 고정하게 되는 반도체 소자 가압부(700)를 포함하며,상기 반도체 소자 가압부(700)는,상기 열림돌기(610)의 하단에 배치되어 상기 열림돌기(610)와 접촉이 가능한 열림캠(711)을 포함하여 반도체 소자의 상면을 면접촉하여 가압하게 되는 푸셔 플레이트(710)와;일단이 상기 소켓커버(600)와 힌지 조립되고 타단이 상기 푸셔 플레이트(710)와 힌지 조립되는 래치(720)와;일단이 상기 소켓몸체(100)와 힌지 조립되고 타단이 상기 래치(720)와 힌지 조립되는 링크(730);를 포함하는 반도체 소자 테스트용 소켓장치.
- 콘택트(400)가 삽입 고정되는 몸체요소(100)(200)와;반도체 소자의 단자와 상기 콘택트의 상단이 접촉이 이루어질 수 있도록 반도체 소자(IC)가 안착 위치하게 되며, 상기 몸체요소(100)(200)에 탄성 지지되어 설정 높이 범위 내에서 상하 이동이 가능하게 마련되는 가동요소(300)(500)와;상기 가동요소(300)(500)의 상부에 조립되어 상기 몸체요소(100)(200)에 상하 탄성적으로 조립되는 소켓커버(600)와;상기 커버요소(600)의 상하 위치에 연동되어 상기 가동요소(300)(500)에 안착 위치하게 되는 반도체 소자(IC)를 가압 고정하는 반도체 소자 가압부(700)를 포함하며,상기 반도체 소자 가압부(700)는,상기 소켓커버(600)의 내측 벽면 구조물 하단에 위치하여 소켓커버(600)의 하방 이동 시에 접촉이 가능한 열림캠(711)을 포함하여 반도체 소자(IC)의 상면을 면접촉하여 가압하는 푸셔 플레이트(710)와;일단이 상기 커버요소(600)와 힌지 조립되고 타단이 상기 푸셔 플레이트(710)와 힌지 조립되는 래치(720)와;일단이 상기 몸체요소(100)(200)와 힌지 조립되고 타단이 상기 래치(720)와 힌지 조립되는 링크(730);를 포함하는 반도체 소자 테스트용 소켓장치.
- 제1항 또는 제2항에 있어서, 상기 푸셔 플레이트(710)와 상기 래치(720)의 힌지축은 제1토션스프링(SS1)에 의해 탄성 지지되는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제1항에 있어서, 상기 소켓몸체(100)와 상기 링크(730)의 힌지축은 제2토션스프링(SS2)에 의해 탄성 지지되는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제2항에 있어서, 상기 몸체요소(100)(200)와 상기 링크(730)의 힌지축은 제2토션스프링(SS2)에 의해 탄성 지지되는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제3항에 있어서, 상기 푸셔 플레이트(710)는 상기 래치(720)와 접촉하여 회동각이 제한되도록 회동 정지면(716)을 포함하여 반도체 소자에 대한 가압 초기에 선단부가 먼저 반도체 소자의 상면과 접촉이 이루어지도록 하는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제1항에 있어서, 상기 플로팅 플레이트(300)는 반도체 소자의 안착면에 상기 관통공과 연통되어 반도체 소자의 단자가 수용되도록 함몰 형성된 볼컵(320)이 형성되는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제4항에 있어서, 상기 링크(730)는,상단과 하단에 각각 래치(720) 및 소켓몸체(100)와 힌지핀으로 조립이 이루어지도록 힌지공이 형성되어 평행하게 마련된 두 개의 링크 플레이트(731)(732)와;두 링크 플레이트(731)(732)를 서로 고정하며, 상기 제2토션스프링(SS2) 일단을 고정하게 되는 고정홀이 형성된 고정 플레이트(733)로 구성됨을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제1항 또는 제2항에 있어서, 상기 콘택트는 판재를 타발하여 일체형으로 가공된 것으로써,상방으로 돌출 형성된 상측첨단부(411)를 갖는 상측머리부(410)와;상측머리부(410)에서 아래로 연장된 상측어깨부(412)에서 원통 형상으로 벤딩된 스트립으로 이루어진 압축부(420)와;압축부(420) 하단에서 연장된 하측어깨부(432)에서 아래로 연장 형성되어 하단에 하측첨단부(431)를 갖는 하측머리부(430);를 포함하는 반도체 소자 테스트용 소켓장치.
- 제9항에 있어서 상기 압축부는 코일스프링인 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제1항 또는 제2항에 있어서, 상기 푸셔 플레이트(710)는 반도체 소자와 직접 접촉이 이루어지는 바닥 가압면에 푸셔 플레이트(710)의 회동 방향을 따라서 다수의 요철(715)이 형성됨을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제1항에 있어서, 상기 소켓몸체(100)는 테스트보드와 복수개의 스크류에 의해 장착되며, 상기 콘택트(400)는 압축성을 갖고 하측첨단부(431)가 테스트보드의 단자와 압축되어 접촉이 이루어지는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
- 제1항에 있어서, 상기 하측 플레이트(200)의 하측에 콘택트를 안내하게 되는 콘택트 가이드 홀이 형성된 가이드 플레이트를 더 구비하고, 상기 콘택트(400)는 압축성을 갖고 하측첨단부(431)가 테스트보드의 단자와 솔더링되는 것을 특징으로 하는 반도체 소자 테스트용 소켓장치.
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- 2015-04-27 CN CN201580021262.9A patent/CN106561084B/zh active Active
- 2015-04-27 WO PCT/KR2015/004141 patent/WO2015167178A1/ko active Application Filing
- 2015-04-27 JP JP2016564624A patent/JP6411546B2/ja active Active
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Also Published As
Publication number | Publication date |
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KR101585182B1 (ko) | 2016-01-14 |
JP2017518489A (ja) | 2017-07-06 |
US10241132B2 (en) | 2019-03-26 |
CN106561084A (zh) | 2017-04-12 |
US20170045551A1 (en) | 2017-02-16 |
CN106561084B (zh) | 2020-06-30 |
JP6411546B2 (ja) | 2018-10-24 |
KR20150124092A (ko) | 2015-11-05 |
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