WO2015156101A1 - 高周波モジュール - Google Patents

高周波モジュール Download PDF

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Publication number
WO2015156101A1
WO2015156101A1 PCT/JP2015/058447 JP2015058447W WO2015156101A1 WO 2015156101 A1 WO2015156101 A1 WO 2015156101A1 JP 2015058447 W JP2015058447 W JP 2015058447W WO 2015156101 A1 WO2015156101 A1 WO 2015156101A1
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WIPO (PCT)
Prior art keywords
substrate
inductor
frequency module
helical
inductors
Prior art date
Application number
PCT/JP2015/058447
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English (en)
French (fr)
Japanese (ja)
Inventor
武 小暮
孝紀 上嶋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201580017775.2A priority Critical patent/CN106134090B/zh
Priority to KR1020167022584A priority patent/KR101848721B1/ko
Priority to JP2016512647A priority patent/JP6308293B2/ja
Publication of WO2015156101A1 publication Critical patent/WO2015156101A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral

Definitions

  • This invention relates to a high frequency module.
  • Patent Document 1 a composite high-frequency component is disclosed (Patent Document 1).
  • the composite high-frequency component disclosed in Patent Document 1 includes a plurality of helical inductors that are inserted in a multilayer board and are arranged in one direction when the multilayer board is viewed in plan.
  • a composite high-frequency component used as an antenna switch module or the like of a mobile communication device is known.
  • this composite high frequency component there is a demand for shortening the overall length of the multilayer substrate in order to reduce the size of the device.
  • adjacent inductors may be electromagnetically coupled, and there is a possibility that sufficient insulation (Isolation) cannot be obtained.
  • an object of the present invention is to solve the above-described problem, and to provide a high-frequency module capable of obtaining sufficient insulation between adjacent inductors while shortening the overall length of the substrate.
  • a high-frequency module includes a substrate having a main surface, and an annular portion extending in a ring shape when the main surface of the substrate is viewed in plan, and the annular portion is along a predetermined direction. And a plurality of inductors provided on the substrate so as to be arranged in a staggered pattern.
  • the plurality of inductors include a first inductor and a second inductor disposed adjacent to the first inductor.
  • the annular portion of the first inductor includes a first straight portion that extends linearly.
  • the annular portion of the second inductor extends linearly in a direction parallel to the first linear portion, and is a second linear portion that faces the first linear portion in an oblique direction with respect to a predetermined direction when the main surface of the substrate is viewed in plan. including.
  • the first straight line portion and the second straight line portion face each other in an oblique direction with respect to the predetermined direction. Even if it is, it becomes easy to ensure the insulation between annular parts. For this reason, it is possible to realize a high-frequency module capable of obtaining sufficient insulation between adjacent inductors while shortening the overall length of the substrate.
  • the substrate has a rectangular shape having a first side and a second side intersecting the first side when the main surface of the substrate is viewed in plan.
  • the predetermined direction is a direction in which the first side extends. According to the high-frequency module configured in this manner, it is possible to ensure sufficient insulation between adjacent inductors while shortening the total length of the substrate in the direction in which the first side extends.
  • the length of the first side is longer than the length of the second side. According to the high-frequency module configured as described above, sufficient insulation can be ensured between adjacent inductors while shortening the total length of the substrate in the direction in which the first side that is the long side extends.
  • a high-frequency module includes a substrate having a main surface, and a plurality of inductors provided on the substrate, each having an annular portion extending in a ring shape when the main surface of the substrate is viewed in plan view. Is provided.
  • the plurality of inductors include a first inductor and a second inductor disposed adjacent to the first inductor.
  • the annular portion of the first inductor includes a first straight portion that extends linearly.
  • the annular portion of the second inductor includes a second linear portion that extends linearly in a direction non-parallel to the first linear portion and faces the first linear portion.
  • the first straight line portion and the second straight line portion are provided so as to be non-parallel to each other. Therefore, the first inductor and the second inductor are disposed close to each other. However, it becomes easy to ensure the insulation between the annular portions. For this reason, it is possible to realize a high-frequency module capable of obtaining sufficient insulation between adjacent inductors while shortening the overall length of the substrate.
  • the first straight portion and the second straight portion form an angle of 45 °. According to the high-frequency module configured in this way, it becomes easier to ensure insulation between the annular portions.
  • the plurality of inductors are provided so that the annular portions are arranged in one direction when the main surface of the substrate is viewed in plan.
  • the high-frequency module configured in this way, it is possible to ensure sufficient insulation between adjacent inductors while shortening the overall length of the substrate in the arrangement direction of the plurality of inductors.
  • the plurality of inductors are provided such that the annular portions are arranged in a staggered manner along a predetermined direction when the main surface of the substrate is viewed in plan.
  • the high-frequency module configured in this way, it is possible to ensure sufficient insulation between adjacent inductors while shortening the overall length of the substrate in the direction in which the annular portions are arranged in a staggered manner.
  • the high-frequency module further includes a wiring provided on the substrate so as to be positioned between the first inductor and the second inductor and connected to a ground potential. According to the high frequency module configured as described above, it is easy to ensure insulation between the first inductor and the second inductor.
  • the high-frequency module further includes a switching element having a plurality of contacts.
  • Each of the first inductor and the second inductor is connected to the plurality of contacts as a matching element that cancels the capacitance generated between the plurality of contacts.
  • the high-frequency module configured as described above, sufficient insulation can be obtained between the inductors provided as matching elements.
  • the substrate has a laminated structure in which a plurality of insulating layers are laminated.
  • the annular portion has a shape extending annularly when the substrate is viewed from the stacking direction of the plurality of insulating layers.
  • a high-frequency module capable of obtaining sufficient insulation between adjacent inductors while shortening the overall length of a substrate having a laminated structure in which a plurality of insulating layers are laminated. Can be realized.
  • FIG. 6 is a perspective view showing a first modification of the high-frequency module in FIG. 5.
  • FIG. 6 is a perspective view showing a second modification of the high-frequency module in FIG. 5.
  • FIG. 7 is a perspective view showing a third modification of the high frequency module in FIG. 5.
  • FIG. 10 is a perspective view showing a high-frequency module in a range surrounded by a two-dot chain line X in FIG. 9.
  • FIG. 1 is a cross-sectional view showing a high-frequency module according to Embodiment 1 of the present invention.
  • FIG. 2 is a perspective view of the high-frequency module viewed from the direction indicated by the arrow II in FIG.
  • FIG. 1 shows a cross section of the high-frequency module along the line II in FIG.
  • high-frequency module 10 in the present embodiment includes substrate 12 and a plurality of helical inductors 31 provided on substrate 12.
  • the substrate 12 is made of an insulating material.
  • the substrate 12 has a main surface 12a.
  • the main surface 12a has the largest area among the plurality of side surfaces of the substrate 12.
  • the substrate 12 when the main surface 12a of the substrate 12 is viewed from the front, the substrate 12 has a rectangular plan view (hereinafter, the case where the main surface 12a of the substrate 12 is viewed from the front is simply referred to as “substrate Also referred to as “12 plan view”).
  • the substrate 12 has a long side 13 and a short side 14 that intersects the long side 13 in a plan view.
  • the long side 13 extends in the direction indicated by the first arrow 102 (hereinafter also referred to as the long side direction of the substrate 12), and the short side 14 is a second direction perpendicular to the direction indicated by the first arrow 102. Extending in the direction indicated by arrow 103.
  • the long side 13 and the short side 14 have a length W and a length L, respectively.
  • the length L of the short side 14 is shorter than the length W of the long side 13 (L ⁇ W).
  • the substrate 12 is a multilayer circuit board having a laminated structure in which a plurality of insulating layers 21A, 21B, 21C, 21D, and 21E (hereinafter referred to as the insulating layer 21 unless otherwise specified) are laminated.
  • the insulating layer 21 is made of an insulating material made of ceramics or resin.
  • the material of the insulating layer 21 made of resin is made of, for example, polyimide, LCP (liquid crystal polymer), PEEK (polyether ether ketone), or PPS (polyphenylene sulfide).
  • the substrate 12 is made of a ceramic substrate using a ceramic material.
  • an LTCC (Low Temperature Co-fired Ceramics) substrate or an HTCC (High Temperature Co-fired Ceramics) substrate can be used.
  • Wirings made of a conductive material are provided on the surface and inside of the multilayer circuit board.
  • the plurality of insulating layers 21 are stacked in one direction indicated by the third arrow 101.
  • the insulating layer 21A, insulating layer 21B, insulating layer 21C, insulating layer 21D, and insulating layer 21E are arranged from top to bottom in the order listed.
  • the substrate 12 has a rectangular plan view when viewed from the stacking direction of the insulating layer 21.
  • the length (thickness) of the substrate 12 in the stacking direction of the insulating layer 21 is smaller than the lengths of the long side 13 and the short side 14.
  • substrate 12 may have a square planar view, and is not restricted to a rectangular shape, You may have a planar view of arbitrary shapes other than a rectangle.
  • the substrate 12 does not necessarily have a stacked structure.
  • the helical inductor 31 is made of a conductive material.
  • the helical inductor 31 is made of a metal such as copper, silver, aluminum, stainless steel, nickel or gold, an alloy containing these metals, or the like.
  • the helical inductor 31 has an annular portion 32 as a constituent part thereof.
  • the annular portion 32 has a shape that extends in an annular shape in plan view of the substrate 12.
  • the annular portion 32 has a shape (rectangular circular shape) that circulates along four sides of a rectangle (more specifically, a square).
  • the annular portion 32 is provided inside the substrate 12. More specifically, the annular portion 32 is formed between adjacent insulating layers 21 (an insulating layer 21A and an insulating layer 21B, an insulating layer 21B and an insulating layer 21C, an insulating layer 21C and an insulating layer 21D, Provided between the layer 21D and the insulating layer 21E).
  • the annular portions 32 provided between the respective layers are connected to each other by an internal via conductor (not shown) extending in the stacking direction of the insulating layer 21.
  • the helical inductor 31 as a whole has a shape extending in a helical (spiral) shape along the stacking direction of the insulating layer 21.
  • FIG. 3 is a perspective view showing the high-frequency module in FIG. 2 partially enlarged. 1 to 3, the plurality of helical inductors 31 are provided such that the annular portions 32 are arranged in a staggered manner along the direction indicated by the first arrow 102 (hereinafter, the annular portions 32 are referred to as the annular portions 32).
  • the direction of staggered arrangement is also referred to as the staggered arrangement direction of the annular portion 32).
  • the annular portions 32 are aligned along the direction indicated by the first arrow 102 as a whole while alternately shifting in one direction and the opposite direction along the direction indicated by the second arrow 103.
  • the staggered direction of the annular portions 32 and the long side direction of the substrate 12 coincide.
  • some of the plurality of helical inductors 31 are arranged at a pitch P1 in a predetermined direction (long side direction (staggered direction) of the substrate 12) along the main surface 12a of the substrate 12. ing. Further, the remaining of the plurality of helical inductors 31 is the interval between the plurality of helical inductors 31 in the direction perpendicular to the predetermined direction at intervals of the pitch P1 in the predetermined direction along the main surface 12a of the substrate 12. They are arranged at a position separated by a predetermined distance B from the center of some pitches P1.
  • the annular part 32 of the helical inductor 31P has a straight part 32m as a constituent part thereof.
  • the annular portion 32 of the helical inductor 31Q has a straight portion 32n as its constituent part.
  • the straight part 32m and the straight part 32n are provided to face each other between the helical inductor 31P and the helical inductor 31Q.
  • the straight part 32m and the straight part 32n extend linearly.
  • the straight line portion 32m and the straight line portion 32n correspond to one side of the rectangular circular shape formed by the annular portion 32.
  • the straight part 32m and the straight part 32n extend in parallel to each other.
  • the straight part 32m and the straight part 32n extend in an oblique direction with respect to the staggered arrangement direction of the annular part 32.
  • the direction in which the linear portion 32 m and the linear portion 32 n face each other as indicated by the fourth arrow 106 is an oblique direction with respect to the staggered arrangement direction of the annular portions 32, as indicated by the first arrow 102. . That is, the direction in which the straight portion 32 m and the straight portion 32 n face each other is not parallel to the staggered arrangement direction of the annular portion 32 and is not orthogonal to the staggered arrangement direction of the annular portion 32.
  • the annular portion 32 having a rectangular circumferential shape is provided with an inclination of 45 ° with respect to the long side 13 and the short side 14 of the substrate 12.
  • the direction in which the straight portion 32m and the straight portion 32n face each other is a direction inclined by 45 ° with respect to the staggered arrangement direction of the annular portions 32.
  • the annular portion 32 is not limited to a rectangular circumferential shape.
  • the annular portion 32 is a pair of straight portions facing each other parallel to each other when viewed from the stacking direction of the substrate 12 and another pair of straight portions connected to the pair of straight portions and facing each other in parallel. It may have a round shape of a parallelogram including a rectangle, a square having a portion, or a rhombus.
  • the annular portion 32 may have a polygonal shape other than a rectangle.
  • the straight portions 32 m and 32 n are respectively provided in the portions where the two annular portions 32 are closest to each other. Is provided.
  • the plurality of helical inductors 31 are arranged so that adjacent annular portions 32 do not overlap each other in the staggered arrangement direction of the annular portions 32, but the present invention is not limited to such a configuration. You may arrange
  • FIG. 4 is a perspective view showing a high-frequency module for comparison.
  • FIG. 4 is a view corresponding to FIG. 2 showing the high-frequency module 10 in the present embodiment.
  • a plurality of helical inductors 31 are provided such that annular portions 32 are arranged in a line in the long side direction of substrate 12.
  • the annular portions 32 approach each other between the adjacent helical inductors 31, so It is difficult to obtain sufficient insulation.
  • the straight portion 32 m and the straight portion 32 n are arranged in the staggered direction of the annular portion 32 between the adjacent helical inductors 31. On the other hand, they face each other in an oblique direction. With such a configuration, even when the plurality of helical inductors 31 are provided at a narrow pitch N, the opposing linear portions 32m and 32n can be arranged away from each other. Thus, sufficient insulation is provided between adjacent helical inductors 31 while shortening the length of the substrate 12 in the staggered arrangement direction of the annular portions 32 (in this embodiment, the length in the long side direction of the substrate 12). Can be obtained.
  • the staggered arrangement direction of the annular portions 32 coincides with the long side direction of the substrate 12 has been described, but the present invention is not limited to such a configuration.
  • the staggered arrangement direction of the annular portion 32 may coincide with the short side direction of the substrate 12 or may be oblique with respect to the long side direction and the short side direction of the substrate 12.
  • the inductor in this invention was the helical inductor 31 which has a shape extended helically (helical) along the lamination direction of the insulating layer 21, such a structure was demonstrated.
  • the annular portion 32 in the present embodiment may be provided on the surface layer of the substrate 12 or may be provided on a different layer of the substrate 12. As an example of the latter configuration, it is assumed that the annular portions 32 are alternately provided between the insulating layers 21A and 21B and the insulating layers 21B and 21C in FIG. Even in this case, the present invention is applied if the annular portions 32 are arranged in a staggered pattern when the substrate 12 is seen through in plan view.
  • the high-frequency module 10 further includes a ground via conductor 41 provided on the substrate 12.
  • the ground via conductor 41 is made of a conductive material.
  • the ground via conductor 41 is provided so as to extend in the stacking direction of the insulating layer 21.
  • the ground via conductor 41 is provided on the substrate 12 as a wiring connected to the ground potential.
  • the ground via conductor 41 is provided between the helical inductor 31P and the helical inductor 31Q that are adjacent to each other.
  • the helical inductor 31 further has an extension part 33 as a constituent part thereof.
  • the extending portion 33 is provided so as to extend from the annular portion 32 in a plan view of the substrate 12. In the present embodiment, the extending portion 33 is provided so as to extend in one direction from the corner portion of the annular portion 32 having a rectangular circumferential shape.
  • the extension part 33 of the helical inductor 31P and the extension part 33 of the helical inductor 31Q are arranged with a space therebetween.
  • the extending portion 33 of the helical inductor 31P and the extending portion 33 of the helical inductor 31Q are arranged at a distance in the staggered direction of the annular portion 32.
  • the ground via conductor 41 which is a via conductor connected to the ground potential, is positioned between the annular portion 32 of the helical inductor 31P and the annular portion 32 of the helical inductor 31Q that are adjacent to each other. Is provided.
  • the ground via conductor 41 is provided so as to be positioned between the extension portion 33 of the helical inductor 31P adjacent to each other and the extension portion 33 of the helical inductor 31Q.
  • the high-frequency module 10 according to Embodiment 1 of the present invention includes a substrate 12 having a main surface 12a and a main surface 12a of the substrate 12. When viewed in a plan view, it includes an annular portion 32 having an annularly extending shape, and includes helical inductors 31 as a plurality of inductors provided on the substrate 12 so that the annular portions 32 are arranged in a staggered manner along a predetermined direction. .
  • the plurality of helical inductors 31 includes a helical inductor 31P as a first inductor, and a helical inductor 31Q as a second inductor disposed adjacent to the helical inductor 31P.
  • the annular portion 32 of the helical inductor 31P includes a straight portion 32m as a first straight portion extending linearly.
  • the annular portion 32 of the helical inductor 31Q extends linearly in a direction parallel to the straight portion 32m, and faces the straight portion 32m in an oblique direction with respect to a predetermined direction when the main surface 12a of the substrate 12 is viewed in plan view. It includes a straight portion 32n as a straight portion.
  • the high frequency module 10 According to the high frequency module 10 according to the first embodiment of the present invention configured as described above, sufficient insulation is obtained between the helical inductors 31 adjacent to each other while shortening the overall length of the substrate 12. Can do.
  • FIG. 5 is a perspective view showing the high-frequency module according to Embodiment 2 of the present invention.
  • FIG. 5 and FIGS. 6 to 8 described later correspond to FIG. 3 in the first embodiment.
  • the high frequency module in the present embodiment is mainly different from the high frequency module 10 in the first embodiment in the arrangement (arrangement) of the annular portions 32.
  • the description of the same structure as that of the high-frequency module 10 in Embodiment 1 will not be repeated.
  • the plurality of helical inductors 31 are provided so that the annular portions 32 are arranged in one direction.
  • the arrangement direction of the annular portions 32 and the direction in which the long side 13 of the substrate 12 extends as indicated by the first arrow 102 coincide.
  • arrangement direction of the annular portions 32 is not limited to the long side direction of the substrate 12, as in the description of the staggered arrangement direction of the annular portions 32 in the first embodiment.
  • a helical inductor 31P arbitrarily selected from among the plurality of helical inductors 31 and a helical inductor 31Q arranged adjacent to the helical inductor 31P.
  • the annular part 32 of the helical inductor 31P has a straight part 32m as a constituent part thereof.
  • the annular portion 32 of the helical inductor 31Q has a straight portion 32n as its constituent part.
  • the straight part 32m and the straight part 32n are provided to face each other between the helical inductor 31P and the helical inductor 31Q.
  • the straight part 32m and the straight part 32n extend linearly.
  • the straight line portion 32m and the straight line portion 32n correspond to one side of the rectangular circular shape formed by the annular portion 32 and facing each other in proximity to each other.
  • the straight portion 32m and the straight portion 32n extend non-parallel to each other.
  • the helical portion 31P of the helical inductor 31P having a rectangular loop shape is provided in parallel to the long side 13 and the short side 14 of the substrate 12, while the helical inductor having a rectangular loop shape is provided.
  • An annular portion 32 of 31Q is provided inclined with respect to the long side 13 and the short side 14 of the substrate 12.
  • the plurality of helical inductors 31 includes a helical inductor 31P having an annular portion 32 that cannot be tilted with respect to the long side 13 and the short side 14 of the substrate 12, and an oblique direction with respect to the long side 13 and the short side 14 of the substrate 12.
  • Helical inductors 31Q having inclined annular portions 32 are provided alternately.
  • the linear portion 32m and the linear portion 32n are provided non-parallel between the adjacent helical inductors 31.
  • the portions where the straight portion 32m and the straight portion 32n are close to each other are reduced as compared with the comparative example shown in FIG. be able to.
  • sufficient insulation is provided between the adjacent helical inductors 31 while shortening the length of the substrate 12 in the arrangement direction of the annular portions 32 (in this embodiment, the length in the long side direction of the substrate 12).
  • At least one set of helical inductor 31P and helical inductor 31Q each having a non-parallel straight portion 32m and a straight portion 32n may be present.
  • FIG. 6 is a perspective view showing a first modification of the high-frequency module in FIG. Referring to FIG. 6, in the present modification, the straight portion 32m and the straight portion 32n form an angle of 45 °.
  • An annular portion 32 of a helical inductor 31Q having a rectangular circumferential shape is provided in parallel to the long side 13 and the short side 14 of the substrate 12, while an annular portion 32 of a helical inductor 31P having a rectangular circumferential shape is provided.
  • the substrate 12 is provided with an inclination of 45 ° with respect to the long side 13 and the short side 14 of the substrate 12.
  • the plurality of helical inductors 31 includes a helical inductor 31Q having an annular portion 32 that cannot be inclined with respect to the long side 13 and the short side 14 of the substrate 12, and 45 ° with respect to the long side 13 and the short side 14 of the substrate 12.
  • Helical inductors 31P having inclined annular portions 32 are provided alternately.
  • the straight part 32m extends from the closest part with respect to the straight part 32n as an apex, and away from the straight part 32n on both sides thereof.
  • the adjacent helical shapes are reduced by minimizing the portions where the straight portions 32m and the straight portions 32n are close to each other. Electromagnetic field coupling between the inductors 31 can be more effectively prevented.
  • FIG. 7 is a perspective view showing a second modification of the high-frequency module in FIG.
  • the high-frequency module in the present modification further includes a ground via conductor 41 connected to the ground potential.
  • the ground via conductor 41 is provided between the helical inductor 31P and the helical inductor 31Q that are adjacent to each other.
  • the ground via conductor 41 is provided so as to be positioned between the annular portion 32 of the helical inductor 31P and the annular portion 32 of the helical inductor 31Q which are adjacent to each other.
  • the ground via conductor 41 is provided so as to be positioned between the extension portion 33 of the helical inductor 31P adjacent to each other and the extension portion 33 of the helical inductor 31Q.
  • FIG. 8 is a perspective view showing a third modification of the high-frequency module in FIG. Referring to FIG. 8, in this modification, a plurality of helical inductors 31 are provided such that annular portions 32 are arranged in a staggered manner along the direction indicated by first arrow 102. The straight part 32m and the straight part 32n form an angle of 45 °.
  • An annular portion 32 of a helical inductor 31Q having a rectangular circumferential shape is provided in parallel to the long side 13 and the short side 14 of the substrate 12, while an annular portion 32 of a helical inductor 31P having a rectangular circumferential shape is provided.
  • the substrate 12 is provided with an inclination of 45 ° with respect to the long side 13 and the short side 14 of the substrate 12.
  • the plurality of helical inductors 31 includes a helical inductor 31Q having an annular portion 32 that cannot be inclined with respect to the long side 13 and the short side 14 of the substrate 12, and 45 ° with respect to the long side 13 and the short side 14 of the substrate 12.
  • Helical inductors 31P having inclined annular portions 32 are alternately arranged in a staggered manner.
  • the high-frequency module in this modification further has a ground via conductor 41 connected to the ground potential.
  • the ground via conductor 41 is provided between the helical inductor 31P and the helical inductor 31Q that are adjacent to each other.
  • the ground via conductor 41 is provided so as to be positioned between the extending portion 33 of the helical inductor 31P adjacent to each other and the extending portion 33 of the helical inductor 31Q.
  • a new high-frequency module may be configured by appropriately combining various arrangements and arrangements of the annular portion 32 of the helical inductor 31 described in FIGS. 5 to 8. Further, as the shape of the annular portion 32, a circle or ellipse other than the rectangle may be used, and these may be combined with the rectangle.
  • the substrate 12 having the main surface 12a and the main surface 12a of the substrate 12 are viewed in plan view.
  • a plurality of helical inductors 31 provided on the substrate 12 are provided.
  • the plurality of helical inductors 31 includes a helical inductor 31P as a first inductor, and a helical inductor 31Q as a second inductor disposed adjacent to the helical inductor 31P.
  • the annular portion 32 of the helical inductor 31 includes a straight portion 32m as a first straight portion extending linearly.
  • the annular portion 32 of the helical inductor 31Q includes a straight portion 32n as a second straight portion that extends linearly in a direction non-parallel to the straight portion 32m and faces the straight portion 32m.
  • FIG. 9 is a circuit diagram showing a high-frequency module according to Embodiment 3 of the present invention.
  • FIG. 10 is a perspective view showing the high-frequency module in a range surrounded by a two-dot chain line X in FIG.
  • the high-frequency module according to the present embodiment further includes a switching element 51 in addition to the plurality of helical inductors 31.
  • the switching element 51 has a plurality of contacts 56 arranged in one direction.
  • a plurality of helical inductors 31 are connected to a plurality of contacts 56, respectively.
  • the helical inductor 31 is provided as an inductive matching element that cancels the capacitance generated between the plurality of contacts 56.
  • the plurality of helical inductors 31 are provided so as to include the annular portion 32 in the staggered arrangement described in the first embodiment.
  • the impedance on the output terminal 52 side becomes capacitive.
  • the helical inductor 31 described in the first embodiment as a matching element on the substrate 12, a plurality of elements arranged along the long side of the main surface of the substrate 12 as shown in FIG. It is possible to cancel the capacitance of the output terminal 52 and to achieve matching while preventing the deterioration of the insulation between the output terminals 52.
  • the helical inductor 31 does not necessarily have to be provided at all of the plurality of contacts 56.
  • the structure of the high-frequency module described in the first embodiment is described when applied to a switching element having a multi-port structure.
  • the structures of the various high-frequency modules described in the second embodiment are used. You may apply similarly.
  • the present invention is used for an antenna module or the like built in a mobile phone.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Transceivers (AREA)
PCT/JP2015/058447 2014-04-08 2015-03-20 高周波モジュール WO2015156101A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201580017775.2A CN106134090B (zh) 2014-04-08 2015-03-20 高频模块
KR1020167022584A KR101848721B1 (ko) 2014-04-08 2015-03-20 고주파 모듈
JP2016512647A JP6308293B2 (ja) 2014-04-08 2015-03-20 高周波モジュール

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JP2014-079402 2014-04-08
JP2014079402 2014-04-08

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KR (1) KR101848721B1 (ko)
CN (1) CN106134090B (ko)
WO (1) WO2015156101A1 (ko)

Citations (5)

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JPH0251417U (ko) * 1988-10-05 1990-04-11
JPH05326270A (ja) * 1992-05-25 1993-12-10 Murata Mfg Co Ltd 複合インダクタ部品
JP2002110422A (ja) * 2000-09-28 2002-04-12 Murata Mfg Co Ltd チップ型コイル部品
JP2010269215A (ja) * 2009-05-19 2010-12-02 Shibaura Mechatronics Corp 圧電素子駆動装置および塗布装置
JP2012095257A (ja) * 2010-09-30 2012-05-17 Nippon Dempa Kogyo Co Ltd 可変減衰器及び可変減衰装置

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KR20160110991A (ko) 2016-09-23
CN106134090A (zh) 2016-11-16
JPWO2015156101A1 (ja) 2017-04-13
CN106134090B (zh) 2019-01-22
KR101848721B1 (ko) 2018-04-13

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