WO2015109711A1 - 显示基板的制造方法、生产控制系统及生产装置 - Google Patents
显示基板的制造方法、生产控制系统及生产装置 Download PDFInfo
- Publication number
- WO2015109711A1 WO2015109711A1 PCT/CN2014/078707 CN2014078707W WO2015109711A1 WO 2015109711 A1 WO2015109711 A1 WO 2015109711A1 CN 2014078707 W CN2014078707 W CN 2014078707W WO 2015109711 A1 WO2015109711 A1 WO 2015109711A1
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- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- mark
- display substrate
- manufacturing
- alarm
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 136
- 238000012545 processing Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 11
- 238000011161 development Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000010410 dusting Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract 3
- 239000011159 matrix material Substances 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 230000008439 repair process Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133374—Constructional arrangements; Manufacturing methods for displaying permanent signs or marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Embodiments of the present invention relate to a method of manufacturing a display substrate, a production control system, and a production apparatus. Background technique
- the production is performed in accordance with the established production process sequence under the control of the computer production control system.
- the processing sequence of the display substrate of the TN (Twisted Nematic) mode thin film transistor liquid crystal display is different from that of the AD-SDS (Advanced Super Dimension Switch, ADS) mode thin film transistor liquid crystal display.
- Processing order Taking the color film substrate of the liquid crystal display of the ADS mode as an example, the color film substrate includes the following steps in the processing: a transparent conductive layer process, a black matrix process, a color filter process, a spacer process, and the like.
- the computer production control system control substrate is sequentially subjected to predetermined processes, and finally a display substrate is formed.
- a method of manufacturing a display substrate includes: forming a mark for recording process progress information on the display substrate in a process of manufacturing the display substrate by a plurality of processes.
- the mark is a progress bar, and the current length and/or pattern of the progress bar corresponds to current process progress information; or the mark is a three-dimensional laminated structure, and the pattern and/or material of the three-dimensional laminated structure corresponds to Current process progress information.
- the current process progress information includes at least one of the following: a currently completed process, a current process to be performed, a process that has failed or is missing.
- the method further includes: detecting the mark before the start of at least one process, determining to start execution or determining a pause process and alerting according to the detection result.
- the method further includes: after the at least one process is completed, detecting the mark, and determining whether to suspend the process and alarming according to the detection result.
- the process includes one or more of the following processes: coating, evaporation, magnetron sputtering, exposure, development, etching, cleaning, drying, cutting, dusting.
- the process is selected from the group consisting of: coating, evaporation, magnetron sputtering, exposure, development, etching; at least part of the marking is formed using a process corresponding to the marking.
- the mark is formed on a side edge of the display substrate, the side edge being located outside the display area of the display substrate.
- the alert includes an audible alert and/or a light alert.
- a production control system for a display substrate includes: a processing module: a control signal for forming a mark on the substrate when the substrate enters the process.
- the production control system further includes: an acquisition module, configured to acquire a mark formed on the substrate, wherein the processing module is connected to the acquisition module to determine whether a mark is detected, and if the mark is not detected, an alarm control is issued; And an alarm module: is connected to the processing module signal, and issues an alarm when receiving the alarm control.
- a production apparatus for a display substrate includes: a mark forming device including a coating device for coating on a substrate in each process, and an exposure corresponding to each of the coating devices and used for exposing a mark on a material coated on the substrate And a control device coupled to the mark forming device for signal connection to control the mark forming device to form a mark on the substrate when the substrate enters the processing step.
- the production apparatus further includes: a detecting device for detecting a mark formed on the substrate.
- the control device is connected to the detecting device signal.
- the control device controls the detecting device to detect the mark formed on the substrate, and determines whether the mark is detected. If not detected, Send out a warning.
- FIG. 1 is a processed display substrate according to an embodiment of the present invention. detailed description
- the embodiment of the invention provides a method for manufacturing a display substrate, a production control system and a production device.
- marks are formed on the substrate in each process, and the processing of the substrate is recorded by the formed mark, thereby facilitating supervision of the processing of the display substrate.
- Embodiments of the present invention provide a method of manufacturing a display substrate, the method comprising:
- marks for recording the progress information of the process are formed on the display substrate.
- each tag corresponds to an operation.
- the process includes one or more of the following: coating, evaporation, magnetron sputtering, exposure, development, etching, cleaning, drying, cutting, dusting.
- coating evaporation, magnetron sputtering, exposure, development, etching, cleaning, drying, cutting, dusting.
- other different processes may be included, and the processes may be performed in different orders.
- the process is selected from the group consisting of: coating, evaporation, magnetron sputtering, exposure, development, etching.
- at least a portion of the mark is formed using a process corresponding to the mark.
- corresponding marks are formed in the above processing steps.
- the current length and/or pattern of the progress bar corresponds to the current process progress information.
- it is labeled as a three-dimensional laminated structure, and the pattern and/or material of the three-dimensional laminated structure corresponds to current process progress information.
- the other step marks are used to record the process progress information of the substrate, which is not limited by the embodiment of the present invention.
- the progress bar is arranged in the order of the substrate processing steps and the length of the progress bar corresponding to each process is the same, and the processing of the substrate is observed according to the total length and the number of the progress bars.
- the progress bar can identify different processes by using different patterns or different lengths, which can be determined according to actual conditions.
- each step forms a corresponding mark on the substrate at the same position, and the formed marks are laminated.
- the mark formed from the first process to the tail process is getting smaller and smaller, so that it is intuitively seen that several layers are laminated, so that several substrates are processed. Information on the process.
- the current process progress information includes at least one of the following: a currently completed process, a current process to be performed, a process that has failed or is missing.
- the resulting mark can cover different information.
- the resulting mark covers different information by forming different patterns on the substrate. For example, when each process is performed well, a pattern with a circular hole is formed. For example, when the process device is over alarmed, a pattern with a square hole is formed, or a pattern with a circular hole is formed, but the thickness of the pattern is lower than the thickness of the pattern formed by the normal process. Based on the formed mark, it can be judged whether or not the substrate has malfunctioned in the process.
- the detecting device is provided, the pattern of the mark formed on the substrate can be detected by the detecting device, thereby supervising the processing of the substrate in real time.
- the manufacturing method further includes: detecting the mark before the start of at least one process is performed. According to the detection result, it is determined to start execution or to determine the suspension process and alarm. By detecting the marks on the substrate, the substrate is prevented from leaking, and the production efficiency of the display substrate is improved.
- the processing of the substrate is supervised, and an alarm is issued when a leak occurs, thereby avoiding a leakage process of the substrate and improving the production efficiency of the display substrate.
- the manufacturing method further includes: detecting the mark after the at least one process is performed. Based on the test results, determine whether to suspend the process and alarm. By detecting the marks on the substrate, the substrate is prevented from leaking, and the production efficiency of the substrate is improved.
- the display substrate may be an array substrate or an opposite substrate of the liquid crystal display, an array substrate or an opposite substrate of the OLED display, or a display substrate of other types of displays, and the implementation of the present invention This example does not limit this.
- the mark 20 is formed on the side edge 11 of the substrate 10, and the side edge 11 is located outside the display area of the display substrate and is an edge of the substrate 10 that does not need to be processed to form a pattern in the process; and the mark 20 is a substrate. 10 formed in the process.
- the mark 20 is formed such that after the substrate 10 is coated in the process, the mark 20 is formed on the side edge 11 of the substrate 10 in accordance with the set pattern.
- the substrate 10 may need to be coated and exposed to form a desired pattern during the process, thereby ensuring that the substrate 10 can be exposed to the side edges 11 of the substrate 10 to form the mark 20 during the processing of the substrate, that is, When the substrate 10 is formed with the mark 20, the substrate 10 is processed in this process.
- the marks 20 formed on the substrate 10 are arranged in the order in which the substrates 10 are processed, facilitating the detection of the marks 20.
- an alarm is issued, which includes an audible alarm and/or a light alarm, and different alarm modes can be selected according to actual needs.
- the opposite substrate of the ADS mode undergoes the following processes in the production process: a transparent conductive layer process, a black matrix process, a black matrix process, a color filter process, a color filter repair process, and a protective layer.
- Process, spacer process, and spacer repair process The setting conditions used during the test are to detect whether the previous process forms a mark.
- the manufacturing steps of the display substrate are as follows: Step 001: Insert the substrate;
- Step 002 forming a transparent conductive layer on the substrate, and forming corresponding marks on the side edges of the substrate;
- Step 003 forming a black matrix on the substrate, and forming corresponding marks on the side edges of the substrate;
- Step 004 repairing the transparent conductive layer and the black matrix formed on the substrate, and forming corresponding marks on the side edges of the substrate;
- Step 005 forming a color filter on the substrate, and forming a corresponding mark on a side edge of the substrate;
- the substrate sequentially forms red, green, and blue color films when forming the color filter, and marks are formed on the side edges of the substrate after each time the film is formed;
- Step 006 repairing the color filter formed on the substrate, and forming a corresponding target on the side edge of the substrate;
- Step 007 forming a protective layer process on the substrate; and forming corresponding marks on the side edges of the substrate;
- Step 008 forming a spacer on the substrate, and forming a corresponding mark on the side edge of the substrate;
- Step 009 repairing the spacer formed on the substrate to complete the production of the display substrate.
- the manufacturing method may further include detecting a mark formed on the substrate after the substrate is completed in each process or before entering each process. If the detected mark meets the requirements, the substrate continues to be processed, and if the detected mark fails, an alarm is issued.
- the number, order, and position of the step of detecting the mark during the manufacturing process of the substrate are not limited. In practice, it is possible to decide whether or not to detect the mark, and which process or processes to perform after or before, and whether an alarm needs to be issued or only a pause process is required without an alarm.
- the monitoring of the substrate processing can be realized by detecting the mark, the occurrence of the missing process of the substrate is avoided, and the production of the display substrate is improved.
- the quality increases the production efficiency of the display substrate.
- the detection method used in the manufacturing process is similar to the above manufacturing method, and is no longer - Narration.
- the embodiment of the invention further provides a production control system for a display substrate, the production control system comprising:
- Processing module When the substrate enters the process, a control signal for forming a mark on the substrate is issued.
- the marking is formed on the substrate by the processing module to facilitate the formation of the marking.
- the production control system further includes: Obtaining a module, acquiring a mark formed on the substrate, wherein the processing module is connected to the acquisition module to determine whether the mark is detected according to the set condition; if not detected, issuing an alarm control;
- Alarm module Signaled to the processing module and issued an alarm when an alarm control is received.
- the mark formed on the detected substrate is acquired by the acquisition module of the production control system, and the result is sent to the processing module.
- the alarm module issues an alarm. Therefore, the substrate is prevented from leaking the processing process during production, the processing quality is improved, and the production efficiency of the display substrate is improved.
- the alarm module can be an audible alarm device or a light alarm device.
- An embodiment of the present invention further provides a production device for a display substrate, the production device comprising: a mark forming device, including a coating device for coating on a substrate in each process, and each coating device An exposure device corresponding to and used to expose a material coated on the substrate to form a mark;
- the control device is in signal connection with the mark forming device, and controls the mark forming device to form a mark on the substrate when the substrate enters the process.
- the mark forming means is controlled by the control means to form marks on the substrate on which the substrate information is recorded.
- the production device further includes:
- a detecting device configured to detect a mark formed on the substrate
- the control device is connected to the detecting device signal, and when the substrate enters a process other than the first process, the detecting device detects the mark formed on the substrate according to the setting condition, and determines whether the mark is detected, if not detected. , an alert is issued.
- the coating device is a coating device that coats the substrate in each process.
- the production device provided in the above embodiment detects the mark formed on the substrate in each process, and if no mark is detected, an alarm is issued, thereby avoiding the missing process during the processing of the substrate, thereby improving the display substrate produced. The quality of the display substrate is improved.
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Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/427,680 US9664933B2 (en) | 2014-01-27 | 2014-05-28 | Production method of display substrate, production control system and production apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410041060.8 | 2014-01-27 | ||
CN201410041060.8A CN103792715B (zh) | 2014-01-27 | 2014-01-27 | 一种显示基板制造方法、系统及装置 |
Publications (1)
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WO2015109711A1 true WO2015109711A1 (zh) | 2015-07-30 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2014/078707 WO2015109711A1 (zh) | 2014-01-27 | 2014-05-28 | 显示基板的制造方法、生产控制系统及生产装置 |
Country Status (3)
Country | Link |
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US (1) | US9664933B2 (zh) |
CN (1) | CN103792715B (zh) |
WO (1) | WO2015109711A1 (zh) |
Families Citing this family (4)
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CN104656529B (zh) * | 2015-01-04 | 2017-08-29 | 合肥鑫晟光电科技有限公司 | 用于基板加工的监控方法和监控装置 |
KR102111045B1 (ko) * | 2017-10-31 | 2020-05-14 | 엘지디스플레이 주식회사 | 표시장치 |
CN110519982A (zh) * | 2019-08-13 | 2019-11-29 | Oppo(重庆)智能科技有限公司 | 贴片方法、装置、电子设备以及存储介质 |
CN112151589B (zh) * | 2020-09-28 | 2024-04-05 | 京东方科技集团股份有限公司 | 显示基板母版及其制备方法、偏移检测方法及装置 |
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CN102483471A (zh) * | 2009-08-31 | 2012-05-30 | 柯尼卡美能达精密光学株式会社 | 晶片透镜的制造方法 |
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CN103477433A (zh) * | 2011-06-22 | 2013-12-25 | 松下电器产业株式会社 | 具有点标记的半导体基板及其制造方法 |
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EP1005035B1 (en) * | 1995-10-09 | 2000-11-02 | Matsushita Electric Industrial Co., Ltd. | An optical disk and an optical disk reproduction apparatus |
US6043864A (en) * | 1999-03-08 | 2000-03-28 | Taiwan Semiconductor Manufacturing Company | Alignment method and apparatus using previous layer calculation data to solve critical alignment problems |
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US7100826B1 (en) * | 2001-03-26 | 2006-09-05 | Advanced Micro Devices, Inc. | Barcode marking of wafer products for inventory control |
JP3614418B2 (ja) * | 2002-10-04 | 2005-01-26 | 株式会社Neomax | 薄膜磁気ヘッド用基板およびその製造方法 |
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2014
- 2014-01-27 CN CN201410041060.8A patent/CN103792715B/zh active Active
- 2014-05-28 US US14/427,680 patent/US9664933B2/en active Active
- 2014-05-28 WO PCT/CN2014/078707 patent/WO2015109711A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102483471A (zh) * | 2009-08-31 | 2012-05-30 | 柯尼卡美能达精密光学株式会社 | 晶片透镜的制造方法 |
CN102576558A (zh) * | 2009-10-22 | 2012-07-11 | 松下电器产业株式会社 | 光学信息记录媒体及其制造方法 |
CN103477433A (zh) * | 2011-06-22 | 2013-12-25 | 松下电器产业株式会社 | 具有点标记的半导体基板及其制造方法 |
CN103354770A (zh) * | 2012-02-01 | 2013-10-16 | 三菱电机株式会社 | 激光加工方法及激光加工装置 |
Also Published As
Publication number | Publication date |
---|---|
US20160026015A1 (en) | 2016-01-28 |
CN103792715B (zh) | 2017-01-25 |
CN103792715A (zh) | 2014-05-14 |
US9664933B2 (en) | 2017-05-30 |
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