WO2015076227A1 - ガラス板の製造方法 - Google Patents

ガラス板の製造方法 Download PDF

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Publication number
WO2015076227A1
WO2015076227A1 PCT/JP2014/080394 JP2014080394W WO2015076227A1 WO 2015076227 A1 WO2015076227 A1 WO 2015076227A1 JP 2014080394 W JP2014080394 W JP 2014080394W WO 2015076227 A1 WO2015076227 A1 WO 2015076227A1
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WO
WIPO (PCT)
Prior art keywords
glass plate
polishing
glass
producing
thickness
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Application number
PCT/JP2014/080394
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English (en)
French (fr)
Japanese (ja)
Inventor
宮谷　克明
直己 上村
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013240417A external-priority patent/JP2017013138A/ja
Priority claimed from JP2014012548A external-priority patent/JP2017014023A/ja
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to CN201480063615.7A priority Critical patent/CN105764650A/zh
Publication of WO2015076227A1 publication Critical patent/WO2015076227A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/015—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor of television picture tube viewing panels, headlight reflectors or the like

Definitions

  • the present invention relates to a method for producing a glass plate.
  • Cover glass is used to protect the display in mobile devices such as smartphones and PDAs.
  • technology for reducing the thickness and weight of portable devices has been demanded, and cover glass has been reduced in weight and thickness.
  • cover glass has been reduced in weight and thickness.
  • a cover glass having higher strength than before is required.
  • a glass plate having a higher strength is demanded other than the cover glass.
  • a technique for chemically strengthening the glass plate by an ion exchange method or the like has been developed. By forming a compressive stress layer on the surface of the glass plate by chemical strengthening, it is possible to provide a glass plate that suppresses bending and is not easily damaged.
  • Patent Document 1 discloses a method of providing a tempered glass plate that is stronger and lighter by performing a post-strengthening polishing step in which polishing is performed using a slurry containing colloidal silica having an average particle size of 80 nm or less after chemical strengthening. Is disclosed.
  • the glass plate is held on a glass plate carrier, and a polishing liquid (slurry) containing abrasive grains is interposed between the glass plate and the polishing pad using a polishing pad.
  • a polishing apparatus that polishes while supplying is used.
  • the polishing pad is attached to the upper and lower surface plates, the glass plate is sandwiched, and the planetary gear mechanism is used to relatively move the glass plate and the polishing pad held by the glass plate carrier, The main plane of the glass plate is polished.
  • the thickness of the glass plate carrier is typically set so as to be thinner than the thickness of the glass plate to be polished. Polishing by this polishing apparatus is an excellent method in terms of production efficiency because a plurality of glass plates can be polished simultaneously.
  • the present invention provides the following aspects.
  • the method for producing a glass plate wherein an average value Dp of the deformation amount of each pad is 0.04 mm or more.
  • a high-strength tempered glass sheet can be produced.
  • 6 is a graph showing the relationship between the Shore A hardness of the polishing pad and the BOR strength of the polished glass plate in Examples 1 to 4.
  • 6 is a graph showing the relationship between the amount of deformation of a polishing pad (nonwoven fabric pad) and the BOR strength of a glass plate after polishing in Examples 1 to 4.
  • 8 is a graph showing the relationship between the thickness of a glass plate carrier and the polishing rate in Examples 5 to 7.
  • a method of polishing with a double-side polishing apparatus 12 shown in FIG. As shown in FIG. 1, a glass plate carrier 10 on which a glass plate 30 (see FIG. 1) can be installed is set between the sun gear 13 and the ring gear 14 in the double-side polishing apparatus 12.
  • the gear portion 10a formed on the outer peripheral surface of the sun gear 13, the ring gear 14 and the glass plate carrier 10 constitutes a planetary gear mechanism, and rotates the sun gear 13 and the ring gear 14 at a predetermined rotation ratio, thereby enabling the glass plate.
  • the carrier 10 performs planetary gear motion that revolves around the sun gear 13 while rotating.
  • the glass plate carrier 10 holds the glass plate 30 in the glass plate holding hole 11 formed in the glass plate holding portion 10b inside the gear portion 10a, as shown in FIG. Is sandwiched between an upper surface plate 15 and a lower surface plate (not shown) on which polishing pads 16 and 18 are mounted, and the glass plate 30 is pressed with a predetermined polishing load.
  • a polishing liquid (abrasive slurry) containing abrasive grains is supplied between the polishing pads 16 and 18 and the glass plate carrier 10 and the glass plate 30, and the upper surface plate 15 and the lower surface plate rotate relative to each other.
  • both main planes of the glass plate 30 held on the glass plate carrier 10 are simultaneously polished.
  • the composition of the glass plate 30 is not particularly limited, but it is preferable that the glass plate 30 can be chemically strengthened.
  • the preferred composition of the glass plate 30 is, for example, SiO 2 : 50 to 80%, Al 2 O 3 : 2 to 25%, Li 2 O: 0 to 10%, Na 2 O in terms of mol% based on oxide. : Glass containing 0 to 18%, K 2 O: 0 to 10%, MgO: 0 to 15%, CaO: 0 to 5% and ZrO 2 : 0 to 5%.
  • SiO 2 50 to 74%
  • Al 2 O 3 1 to 10%
  • MgO expressed as mol% based on oxide.
  • the total content of SiO 2 and Al 2 O 3 is 75% or less
  • the content of Na 2 O and K 2 O Glass having a total content of 12 to 25%, a total content of MgO and CaO of 7 to 15%
  • Al 2 O 3 0 to 4%
  • the glass plate 30 is manufactured by a method such as a float method, a fusion down draw method, a slit down draw method, or a redraw method.
  • the glass plate 30 is preferably chemically strengthened glass that has been subjected to chemical strengthening treatment. Thereby, a compressive stress layer is formed on the surface of the glass plate 30, and the strength and scratch resistance are enhanced.
  • Chemical strengthening involves alkali metal ions (typically Na ions or Li ions) having a small ionic radius on the glass surface at temperatures below the glass transition point, and alkali metal ions having a larger ionic radius (typically This is a process of forming a compressive stress layer on the glass surface by exchanging with K ions.
  • the chemical strengthening treatment can be performed by a conventionally known method.
  • the size, shape, and thickness of the glass plate 30 vary depending on the application, but in the case of a cover glass application such as a mobile phone, the thickness of the glass plate 30 is usually about 0.3 mm to 1.5 mm, preferably 0.35 mm to 1.2 mm.
  • the thickness of the glass plate 30 is more preferably 0.7 mm or less, and even more preferably 0.6 mm or less.
  • the polishing can be efficiently performed by polishing in consideration of the deformation amount of the polishing pad and the plate thickness of the glass plate carrier 10.
  • the glass plate carrier 10 is also largely polished when the glass plate 30 is polished. As a result, the life of the glass plate carrier 10 is also shortened. Therefore, it is preferable to select the glass plate carrier 10 having an appropriate plate thickness because the replacement frequency of the glass plate carrier 10 can be suppressed.
  • the polishing pads 16 and 18 are preferably soft polishing pads, and the hardness laminated to a thickness of 4.5 mm is preferably 45 to 95 in Shore A hardness, more preferably 55 to 92. If the Shore A hardness is less than 45, it is difficult to obtain a sufficient polishing rate, and if it exceeds 95, there is a possibility that fine scratches may be caused on the glass due to the pressing of abrasive grains. Examples of the material of the polishing pads 16 and 18 that satisfy such conditions typically include unemployed fabric pads, woven fabric pads, and suede pads.
  • the soft polishing pad is thinner than the hard urethane pad (typically 1.5 mm to 2.0 mm), and typically has a thickness of about 0.3 mm to 5.0 mm. Also, the groove depth formed on the pad surface is shallower than that of a hard urethane pad (typically 1.2 mm to 1.7 mm), typically 0.2 mm to 2.5 mm. Have a thickness of about.
  • the nonwoven fabric pad is a soft polishing pad in which a felt in which fibers are entangled without weaving, or a material in which this felt is impregnated with rubber or resin is attached to a substrate such as PET.
  • the hardness is preferably 45 to 95 in Shore A hardness when laminated to a thickness of 4.5 mm.
  • the fibers constituting the nonwoven fabric pad can be appropriately selected from polyester fibers, aramid fibers, nylon fibers, polyolefin fibers and the like, among which polyester fibers are most preferable.
  • the resin can be appropriately selected from polyurethane, epoxy, and the like, and among them, polyurethane is most preferable.
  • the nonwoven fabric pad typically has a thickness of about 1.0 mm to 5.0 mm.
  • the depth of the groove formed on the pad surface typically has a thickness of about 50% with respect to the thickness of the polishing pad.
  • Polishing pads 16 and 18 can also select suede pads.
  • the suede pad is a soft polishing pad constituted by a urethane sheet having a vertical hole.
  • the resin constituting the suede pad is a urethane resin. It is also possible to overlap a non-woven fabric and a PET sheet on a base layer of a urethane sheet having a vertical hole structure.
  • the suede pad typically has a thickness on the order of 0.3 mm to 1.2 mm. The depth of the groove formed on the pad surface is typically about 30 to 70% of the thickness of the polishing pad.
  • the glass plate carrier 10 is manufactured by laminating a plurality of prepregs.
  • the material of the prepreg is not particularly limited, and can be selected depending on the amount of deformation of the target glass plate carrier 10 or the like.
  • a glass fiber cloth, a glass fiber nonwoven cloth, an aramid fiber nonwoven cloth, a polyester fiber cloth or the like is used as a base material, and a material impregnated with an epoxy resin, a phenol resin, an unsaturated polyester resin, a polyimide resin or the like is used. be able to.
  • the prepreg used is not limited to one type, and prepregs of different materials may be laminated.
  • the laminated prepreg is pressurized and heated with a press to produce the glass plate carrier 10.
  • the deformation amounts Dp1 and Dp2 of the polishing pads 16 and 18 are the portions of the most contracted polishing pads 16 and 18 in contact with the glass plate 30 and the portions located between the glass plates 30 and the most glass plate carrier 10 side. And the distance.
  • the polishing pressure can be appropriately set depending on the relationship between the polishing time and the polishing amount, but is preferably 50 to 150 g / cm 2 (SI), and more preferably 60 to 120 g / cm 2 .
  • the polishing pressure is constant, in order to secure an average value of the deformation amount of each polishing pad 16, 18 by the polishing pressure at the time of polishing of 0.04 mm or more, a low hardness, that is, a soft polishing pad is used.
  • a hard polishing pad having a high hardness that is, a hard polishing pad
  • the deformation amount of the polishing pad can be ensured by increasing the thickness of the polishing pad.
  • a thin polishing cloth such as a suede pad, it is possible to increase the thickness by attaching a non-woven fabric to the base layer.
  • the amount of deformation was measured by applying pressure while the polishing pads 16 and 18 were wet. By measuring in a wet state, it can be measured under the same conditions as during polishing.
  • the plate thickness Lc of the glass plate carrier 10 is set to satisfy the following expression (A). Lc ⁇ Lg-2 ⁇ Dp (A)
  • the plate thickness Lc of the glass plate carrier 10 is determined from the distance (Lg ⁇ 2 ⁇ Dp) between the polishing pads 16 and 18.
  • the thickness of the polishing pads 16 and 18 is preferably 300 ⁇ m or more, more preferably 350 ⁇ m or more, and further preferably 370 ⁇ m or more from the viewpoint of strength.
  • the polishing pads 16 and 18 do not contact the glass plate carrier 10 during polishing and no pressure is applied to the glass plate carrier 10, cracking of the gear portion 10 a can be suppressed, and the life of the glass plate carrier 10 is extended. be able to.
  • the effect of suppressing the crack of the gear portion 10a is particularly remarkable in the glass plate carrier 10 in which the gear portion 10a and the glass plate holding portion 10b inside the gear portion 10a are integrally formed. Therefore, the glass plate carrier 10 is preferably formed integrally with the gear portion 10a and the glass plate holding portion 10b.
  • the glass plate carrier 10 is not limited to one in which the gear portion 10a and the glass plate holding portion 10b are integrally formed, but includes a metal gear portion and a resin glass substrate holding portion. May be.
  • polishing liquid examples include silicon oxides such as colloidal silica, rare earth oxides such as cerium oxide, zirconium oxide, aluminum oxide, magnesium oxide, silicon carbide, manganese oxide, iron oxide, diamond, boron nitride, and zircon.
  • silicon oxides such as colloidal silica
  • rare earth oxides such as cerium oxide, zirconium oxide, aluminum oxide, magnesium oxide, silicon carbide, manganese oxide, iron oxide, diamond, boron nitride, and zircon.
  • a known slurry containing abrasive grains is used.
  • Abrasive grains may be used alone or in combination of two or more.
  • the method for producing a glass plate of the present invention may include other steps of removing scratches (cracks) existing on the surface of the glass plate and bending or dents of the glass plate before the chemical strengthening treatment.
  • a method of removing the cracks on the surface of the glass plate before the chemical strengthening treatment a method of polishing the surface of the glass plate can be mentioned as in the above-described step of removing the defective layer.
  • cover glass manufacturing method will be described with reference to FIG. 3 as an example of the glass plate manufacturing method of the present embodiment.
  • a glass plate manufactured by a float method or the like is cut to obtain a predetermined glass base plate (S1). Then, it cuts so that it may meet the size of a desired cover glass, and the chamfering process of an end surface is performed (S2). Subsequently, the surface of the glass plate is polished (pre-strengthening polishing) using the double-side polishing apparatus 12 to remove cracks (S3).
  • a chemical strengthening process is performed (S4).
  • the surface of the glass is ion-exchanged and a surface layer in which compressive stress remains is formed. Specifically, by ion exchange on the surface of the glass, ions with a small ion radius (for example, Li ions and Na ions) contained in the glass are replaced with ions with a large ion radius (for example, K ions). The Thereby, compressive stress remains on the surface of the glass, and the strength of the glass is improved.
  • the chemical strengthening treatment is performed, for example, by immersing in KNO 3 molten salt at 400 ° C. to 450 ° C. for 1 to 10 hours. Moreover, it is preferable to wash
  • Defects are generated on the surface of the tempered glass plate that has been chemically strengthened by ion exchange.
  • fine irregularities of up to about 1 ⁇ m may remain on the surface of the tempered glass plate.
  • the thickness of the defect layer in which defects exist is usually 0.01 to 0.5 ⁇ m, although it depends on the conditions of the chemical strengthening treatment. Therefore, following the chemical strengthening treatment, it is preferable to remove a layer (referred to as a defect layer) having defects and fine irregularities present on at least one surface of the glass after the chemical strengthening treatment.
  • the removal of the defective layer is performed by polishing (polishing after strengthening) the surface of the glass plate using the double-side polishing apparatus 12 (S5). Finally, a black layer having a light shielding property or the like is printed on the peripheral edge of the glass plate (S6), and the cover glass is manufactured.
  • the present invention may be applied to the pre-strengthening polishing (S3), may be applied to the post-strengthening polishing (S5), or may be applied to both, but after the strengthening in which a softer polishing pad is used. There is a more remarkable effect in the polishing (S5).
  • Example 1 a glass plate having a size of 300 mm in length, 225 mm in width, and a plate thickness Lg of 0.56 mm obtained by molding after the float method was used.
  • the composition of the glass plate used was expressed in terms of mol% on the basis of oxide, SiO 2 : 64%, Al 2 O 3 : 8%, MgO: 11%, Na 2 O: 12.5%, ZrO 2 : 0.00. It was 5%.
  • polishing treatment was performed after the chemical strengthening treatment using the polishing pads (nonwoven fabric pads) of Examples 1 to 4.
  • Table 1 shows the thickness, density, compression rate, deformation, compression modulus, and hardness of the polishing pads of Examples 1 to 4.
  • the glass plate was immersed in KNO 3 molten salt, subjected to ion exchange treatment, and then chemically strengthened by cooling to near room temperature. At this time, the temperature of the KNO 3 molten salt was 435 ° C., and the immersion time was 4 hours.
  • the obtained chemically strengthened glass plate (hereinafter referred to as “tempered glass plate”) was washed with water and subjected to the next cerium oxide polishing step.
  • the tempered glass sheet after strengthening had a surface compressive stress (CS) of 700 ⁇ 50 MPa and a compressive stress layer depth (DOL) of 18 ⁇ 2 ⁇ m.
  • cerium oxide having an average particle diameter (d50) of 1 ⁇ m was dispersed in water to prepare a slurry, and the tempered glass plate was polished for a predetermined time using the obtained slurry.
  • FIG. 4 is a schematic diagram for explaining the strength test used in the present invention.
  • a tempered glass plate 1 as a sample is horizontally installed on a receiving jig 3 made of SUS304.
  • a pressurizing jig 2 for pressurizing the tempered glass plate 1 is installed above the tempered glass plate 1.
  • the central region of the tempered glass plate 1 was pressurized from above the tempered glass plate 1.
  • the test conditions are as follows. Sample thickness: 0.56 (mm); Lowering speed of the pressure jig 2: 1.0 (mm / min): At this time, the breaking load (unit N) when the glass was broken was defined as BOR strength.
  • the BOR intensity shown in Table 1 was obtained by calculating the average of the BOR intensity for a predetermined number of times (N number) while changing the polishing pressure and the platen rotation speed, and set the range in which the average of the obtained BOR intensity could be included.
  • Example 1 For example, in Example 1, as shown in Table 2 below, 6 lots (N number) are polished under each condition while changing the polishing pressure within the range of 60 to 100 g / cm 3 and the rotation speed of the lower platen within the range of 20 to 40 rpm. Went. The average of 6 lots is shown in Table 2 as BOR intensity. Further, the machining allowance was also measured and shown in Table 2. In Example 1, the lowest BOR intensity average value is 323N and the highest value is 339N. When rounded off, the average BOR intensity range can be 320N to 340N. Table 1 shows this range as BOR intensity. Note that the lower surface plate, the upper surface plate, the carrier rotation, and the carrier revolution are set in advance at predetermined ratios, and the polishing time is 300 seconds.
  • FIG. 5 is a graph showing the relationship between the Shore A hardness of the polishing pad (nonwoven fabric pad) in Examples 1 to 4 and the BOR strength of the tempered glass after polishing. Comparing Examples 1 to 3 using polishing pads having substantially the same thickness (about 1.35 mm), the Shore A hardness decreases, that is, the BOR strength of the glass plate increases as the polishing pad becomes softer. I understand. On the other hand, when the thick polishing pad of Example 4 (3 mm) is used, it can be seen that the Shore A hardness is high, that is, the BOR strength of the plate glass is high although the polishing pad is hard.
  • FIG. 6 shows the relationship between the average value Dp of the amount of deformation (the amount of deformation of the polishing pad) when a load of 100 g / cm 2 is applied to the polishing pads in Examples 1 to 4 and the BOR strength of the tempered glass plate 1 after polishing. It is a graph which shows. As is apparent from FIG. 6, when the average value Dp of the deformation amount of the polishing pad is taken on the horizontal axis, it can be seen that the BOR intensity increases as the average value Dp of the deformation amount of the polishing pad increases.
  • FIG. 7 is a graph showing the relationship between the plate thickness Lc of the glass plate carrier and the polishing rate, where the vertical axis shows the polishing rate and the horizontal axis shows the plate thickness Lc of the glass plate carrier.
  • a soft polishing pad (Example 5) having a total deformation amount of 0.08 mm, a 0.1 mm soft polishing pad (Example 6), and 0. A 25 mm soft polishing pad (Example 7) was prepared, and the polishing rate was measured when polishing was performed using a glass plate carrier having a plate thickness Lc different from 0.250 mm, 0.350 mm, and 0.450 mm.
  • the total deformation amount means an amount obtained by adding the deformation amounts (sink amounts) of the upper and lower polishing pads.
  • the polishing rate was calculated based on the polishing rate in a glass plate carrier having a plate thickness Lc of 0.450 mm as a reference (100%).
  • the polishing rate showed a substantially constant value regardless of the plate thickness Lc of the glass plate carrier.
  • the polishing rate is increased. .
  • the difference in polishing rate between the 0.350 mm and 0.250 mm glass plate carriers was slight.
  • the polishing rate was clearly increased as the plate thickness Lc of the glass plate carrier was decreased.
  • Example 5 the plate thickness Lc of the glass plate carrier 10 only needs to be smaller than 0.48 mm, and in Example 6, the plate thickness Lc of the glass plate carrier 10 is 0.00. It can be smaller than 46 mm, and in Example 7, it can be seen that the plate thickness Lc of the glass plate carrier 10 should be smaller than 0.31 mm.
  • the present invention is not limited to the embodiment described above, and can be implemented in various forms without departing from the gist of the present invention.
  • the manufacturing method of the cover glass was illustrated as an example of the manufacturing method of a glass plate, it is applicable not only to this but glass of various uses.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Surface Treatment Of Glass (AREA)
PCT/JP2014/080394 2013-11-20 2014-11-17 ガラス板の製造方法 WO2015076227A1 (ja)

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Application Number Priority Date Filing Date Title
CN201480063615.7A CN105764650A (zh) 2013-11-20 2014-11-17 玻璃板的制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-240417 2013-11-20
JP2013240417A JP2017013138A (ja) 2013-11-20 2013-11-20 ガラス板の製造方法
JP2014-012548 2014-01-27
JP2014012548A JP2017014023A (ja) 2014-01-27 2014-01-27 強化ガラス板の製造方法

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CN107188398A (zh) * 2016-03-10 2017-09-22 旭硝子株式会社 化学强化玻璃的制造方法

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JP2004303280A (ja) * 2003-03-28 2004-10-28 Hoya Corp 情報記録媒体用ガラス基板の製造方法
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JP2011063503A (ja) * 2009-08-18 2011-03-31 Hoya Corp ガラス製造方法、ガラス溶融炉、ガラス製造装置、ガラスブランク製造方法、情報記録媒体用基板製造方法、情報記録媒体製造方法、ディスプレイ用基板製造方法および光学部品製造方法
JP2012018408A (ja) * 2011-08-24 2012-01-26 Nippon Electric Glass Co Ltd ディスプレイ基板
WO2013118648A1 (ja) * 2012-02-06 2013-08-15 旭硝子株式会社 ガラス製品の製造方法および磁気ディスクの製造方法
JP2013198969A (ja) * 2012-03-26 2013-10-03 Fujibo Holdings Inc 研磨パッド及び研磨パッドの製造方法
JP2014008555A (ja) * 2012-06-28 2014-01-20 Asahi Glass Co Ltd ガラス基板の研磨方法
JP2014188668A (ja) * 2013-03-28 2014-10-06 Hoya Corp ガラス基板の製造方法

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JP2004058201A (ja) * 2002-07-29 2004-02-26 Hoya Corp ワークの研磨方法および電子デバイス用基板の製造方法
JP5334428B2 (ja) * 2008-03-10 2013-11-06 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05177539A (ja) * 1991-12-24 1993-07-20 Sumitomo Electric Ind Ltd 両面ポリッシュ装置によるウェハ研磨方法
JP2004303280A (ja) * 2003-03-28 2004-10-28 Hoya Corp 情報記録媒体用ガラス基板の製造方法
DE102007029907A1 (de) * 2007-06-28 2009-01-02 Peter Wolters Gmbh Läuerscheibe zum materialabtragenden Bearbeiten eines Werkstücks in einer Bearbeitungsmaschine sowie Doppelseiten-Bearbeitungsmaschine
JP2011063503A (ja) * 2009-08-18 2011-03-31 Hoya Corp ガラス製造方法、ガラス溶融炉、ガラス製造装置、ガラスブランク製造方法、情報記録媒体用基板製造方法、情報記録媒体製造方法、ディスプレイ用基板製造方法および光学部品製造方法
JP2012018408A (ja) * 2011-08-24 2012-01-26 Nippon Electric Glass Co Ltd ディスプレイ基板
WO2013118648A1 (ja) * 2012-02-06 2013-08-15 旭硝子株式会社 ガラス製品の製造方法および磁気ディスクの製造方法
JP2013198969A (ja) * 2012-03-26 2013-10-03 Fujibo Holdings Inc 研磨パッド及び研磨パッドの製造方法
JP2014008555A (ja) * 2012-06-28 2014-01-20 Asahi Glass Co Ltd ガラス基板の研磨方法
JP2014188668A (ja) * 2013-03-28 2014-10-06 Hoya Corp ガラス基板の製造方法

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