WO2015046422A1 - 光硬化性樹脂組成物、画像表示用装置、及び画像表示用装置の製造方法 - Google Patents
光硬化性樹脂組成物、画像表示用装置、及び画像表示用装置の製造方法 Download PDFInfo
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- WO2015046422A1 WO2015046422A1 PCT/JP2014/075613 JP2014075613W WO2015046422A1 WO 2015046422 A1 WO2015046422 A1 WO 2015046422A1 JP 2014075613 W JP2014075613 W JP 2014075613W WO 2015046422 A1 WO2015046422 A1 WO 2015046422A1
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- Prior art keywords
- resin composition
- image display
- photocurable resin
- meth
- light
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- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- WDRCVXGINNJWPH-UHFFFAOYSA-N tris(6-methylheptyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCOC(=O)C1=CC=C(C(=O)OCCCCCC(C)C)C(C(=O)OCCCCCC(C)C)=C1 WDRCVXGINNJWPH-UHFFFAOYSA-N 0.000 description 1
- YPDXSCXISVYHOB-UHFFFAOYSA-N tris(7-methyloctyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCC(C)C)C(C(=O)OCCCCCCC(C)C)=C1 YPDXSCXISVYHOB-UHFFFAOYSA-N 0.000 description 1
- FJFYFBRNDHRTHL-UHFFFAOYSA-N tris(8-methylnonyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC(C)C)C(C(=O)OCCCCCCCC(C)C)=C1 FJFYFBRNDHRTHL-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Images
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/48—Stabilisers against degradation by oxygen, light or heat
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08F2/00—Processes of polymerisation
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- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/12—Polymers provided for in subclasses C08C or C08F
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/138—Phenolates
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- C09D7/65—Additives macromolecular
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133311—Environmental protection, e.g. against dust or humidity
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133331—Cover glasses
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Definitions
- the present invention relates to a photocurable resin composition, an image display device using the same, and a method for manufacturing the image display device.
- An image display device such as a liquid crystal display panel used in an information terminal such as a smart phone has a photocurable resin composition between an image display member such as a liquid crystal display panel or an organic EL panel and a light-transmitting cover member. After the product is disposed, the composition is manufactured by irradiating the composition with ultraviolet rays to be cured to form a light-transmitting cured resin layer, thereby bonding and laminating the image display member and the light-transmitting cover member ( Patent Document 1).
- a light-shielding layer is provided on the periphery of the surface of the light transmissive cover member on the image display member side in order to improve the brightness and contrast of the display image. Due to the presence of the light shielding layer, irradiation of ultraviolet rays to the photocurable resin composition sandwiched between the light shielding layer and the image display member becomes insufficient, and curing may not proceed sufficiently. As a result, sufficient adhesive strength between the members cannot be obtained, and there is a concern that peeling between the light-transmitting cover member and the image display member, deterioration of image quality due to intrusion of moisture into the gap, and the like may occur. ing.
- thermosetting a resin composition has been proposed (Patent Document 2).
- Patent Document 2 it can be expected that the problem concerned in Patent Document 1 will be solved.
- the thermal polymerization process is added to the photopolymerization process. Must be carried out. Therefore, there has been a problem that the burden of equipment investment for the thermal polymerization process is increased, and there is a problem that the storage stability of the heat and the photocurable resin composition is lowered.
- Patent Document 3 it can be expected that the problem concerned in Patent Document 2 is solved, but the photocurable resin composition sandwiched between the light shielding layer and the image display member is subjected to a temporary curing step.
- the object of the present invention is to solve the above-mentioned problems of the conventional technology. That is, it is suitable for filling a space between a light-transmitting cover member such as a protective panel in the image display device and the image display member, etc., and a pre-process for bonding the light-transmitting cover member and the image display member Photocurable resin composition capable of suppressing liquid float after photocuring, demonstrating sufficient adhesive force, and simplifying the production process by irradiation with active energy rays in the image, and image using the same It is to provide a display device and a method for manufacturing an image display device.
- the present inventors have conducted various studies, and as a result, a photocurable resin composition in which the blending ratio of various components, particularly the content of the photopolymerization initiator, is adjusted to be in a specific range.
- the present inventors have found that the above problems can be solved and completed the present invention.
- a photocurable resin composition comprising (A) a compound having a (meth) acryloyl group, (B) a photopolymerization initiator, and (C) a plasticizer, comprising (B) a photopolymerization initiator A photocurable resin composition having an amount of 4.0 to 10% by mass.
- the content of the compound having (A) (meth) acryloyl group is 10 to 90% by mass with respect to the total amount of the photocurable resin composition, as described in [1] or [2] above Photocurable resin composition.
- the photocurable resin composition according to any one of the above [1] to [3], comprising a monomer.
- the monomer having one (meth) acryloyl group in the molecule includes at least one (meth) acrylate having a dicyclopentanyl group, a dicyclopentenyl group, or an isobornyl group.
- the content of the monomer having one (meth) acryloyl group in the molecule (A2) in the total amount of the photocurable resin composition is 10 to 40% by mass, as described in [4] above.
- Photocurable resin composition [6] The photocurable resin composition according to any one of [1] to [5] above, which comprises (D) an antioxidant.
- a light formed from the photocurable resin composition according to any one of [1] to [8] above, wherein the image display member and a light-transmitting cover member having a light-shielding layer formed on the peripheral edge A method for manufacturing an image display device, wherein a light-shielding layer forming surface of a light-transmitting cover member is disposed on the image display member side through a transparent cured resin layer, comprising the following steps (I) to (I): (III) is a manufacturing method, and in step (II), the photocurable resin composition is cured by irradiation with active energy rays so that the curing rate of the light-transmitting cured resin layer is 80% or more.
- a method for manufacturing an image display device A method for manufacturing an image display device.
- the photocurable resin composition layer is formed on the surface of the image display member or the light-transmitting cover member with a thickness of 6 ⁇ m to 1.5 ⁇ 10 3 ⁇ m.
- the image display member is a liquid crystal display panel, an organic EL display panel, a plasma display panel, a touch panel, or a parallax barrier panel. Method.
- the present invention is suitable for filling a space between a light-transmitting cover member such as a protective panel in an image display device and the image display member, and the light-transmitting cover member and the image display member are provided.
- a photocurable resin composition capable of suppressing liquid float after photocuring by irradiating active energy rays in the pre-bonding process, exhibiting sufficient adhesive force, and simplifying the manufacturing process, and An image display device using the above and a method for manufacturing the image display device can be provided.
- process (I) of the manufacturing method of the apparatus for image displays of this invention It is a figure explaining one example of process (I) of the manufacturing method of the apparatus for image displays of this invention. It is a figure explaining one example of process (I) of the manufacturing method of the apparatus for image displays of this invention. It is a figure explaining one example of process (II) of the manufacturing method of the apparatus for image displays of this invention. It is a figure explaining one example of process (III) of the manufacturing method of the apparatus for image displays of this invention. It is a figure explaining one example of process (I) of the manufacturing method of the apparatus for image displays of this invention. It is a figure explaining one example of process (II) of the manufacturing method of the apparatus for image displays of this invention. It is a figure explaining one example of process (III) of the manufacturing method of the apparatus for image displays of this invention. It is explanatory drawing of the adhesive force test of a light transmissive cured resin layer. It is explanatory drawing of the liquid float test of a photocurable resin composition.
- the molecular weight is a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve, and specifically a value measured by the method described below. .
- Mn number average molecular weight
- -Preparation method of calibration curve Performed using gel permeation chromatography (GPC) using tetrahydrofuran (hereinafter also referred to as "THF") as a solvent, and a calibration curve is prepared and determined using polystyrene as a standard substance.
- the number average molecular weight, the weight average molecular weight, and the degree of dispersion are defined as follows.
- (C) Molecular weight distribution (dispersion degree) Dispersity Mw / Mn
- the photocurable resin composition of the present invention (hereinafter also simply referred to as “resin composition”) is a compound (A) having a (meth) acryloyl group (hereinafter also referred to as “component (A)”), (B) It contains a photopolymerization initiator (hereinafter also referred to as “component (B)”) and (C) a plasticizer (hereinafter also referred to as “component (C)”), and the content of (B) photopolymerization initiator is 4.0 to 10% by mass.
- component (A) having a (meth) acryloyl group
- component (B) contains a photopolymerization initiator (hereinafter also referred to as “component (B)”) and (C) a plasticizer (hereinafter also referred to as “component (C)”), and the content of (B) photopolymerization initiator is 4.0 to 10% by mass.
- the resin composition of the present invention contains a compound having a (meth) acryloyl group as the component (A).
- A1 a polymer having a (meth) acryloyl group in the molecule
- A2) one (meta) in the molecule
- Monomers having an acryloyl group hereinafter, also referred to as “component (A2)”. From the viewpoint of adjusting the viscosity of the resin composition, reducing the shrinkage of curing, and increasing the adhesiveness and improving the adhesiveness.
- the component (A1) and the component (A2) are preferable to use.
- the adhesiveness can be further improved by using the component (A2) together.
- the combined use of the (A1) component reduces the curing shrinkage rate of the resin composition and suppresses peeling at the interface with the adherend. it can.
- (A) component you may use components other than (A1) component and (A2) component together, but it is preferable to use only (A1) component and (A2) component.
- the component (A1) and the component (A2) will be described.
- ((A1) component a polymer having a (meth) acryloyl group in the molecule)
- the polymer having a (meth) acryloyl group in the molecule as the component (A1) include a polyester oligomer having a (meth) acryloyl group, a urethane polymer having a (meth) acryloyl group, and a polyethylene glycol mono (meth).
- Acrylate polyethylene glycol di (meth) acrylate, polypropylene glycol mono (meth) acrylate, polypropylene glycol di (meth) acrylate, butadiene polymer having (meth) acryloyl group, isoprene polymer having (meth) acryloyl group, etc. It is done. Among these, an isoprene polymer having a (meth) acryloyl group is preferable from the viewpoint of transparency, yellowing resistance, and balance of various properties.
- isoprene polymer having a (meth) acryloyl group for example, a compound represented by the following general formula (1) is preferable.
- m represents a number of 50 to 1000
- n represents a number of 1 to 5
- R 1 represents a hydrogen atom or a methyl group.
- m is a number from 50 to 1000, preferably a number from 100 to 800, more preferably a number from 150 to 700, and still more preferably a number from 200 to 600.
- n is a number of 1 to 5, preferably a number of 1.5 to 4.0, more preferably a number of 2.0 to 3.5, and still more preferably a number of 2.0 to 3.0. .
- the average number of functional groups in the component (A1) is preferably 1.5 to 4.0, more preferably 2.0 to 3.5, more preferably from the viewpoint of further reducing the curing shrinkage rate and elastic modulus of the resin composition. Preferably, it is 2.0 to 3.0.
- the “functional group number” indicates the number of functional groups ((meth) acryloyl group) in one molecule of the component (A1), and the “average functional group number” indicates the number of functional groups per molecule in the entire component (A1). The average value is shown.
- the number average molecular weight (Mn) of the component (A1) is preferably 1.0 ⁇ 10 4 or more, more preferably from the viewpoint of viscosity after blending, workability, toughness of the cured product, and elastic modulus. 25 ⁇ 10 4 or more, more preferably 1.5 ⁇ 10 4 or more, and preferably 1.0 ⁇ 10 5 or less, more preferably 5.0 ⁇ 10 4 or less, still more preferably 4.0 ⁇ 10. 4 or less, particularly preferably 3.5 ⁇ 10 4 or less, and very preferably 2.0 ⁇ 10 4 or less.
- the content of the component (A1) in the resin composition is preferably 5% by mass or more with respect to the total amount of the resin composition from the viewpoints of curability and wet heat resistance, and more in consideration of adhesive strength. Preferably, it is 10% by mass or more, more preferably 15% by mass or more, and from the viewpoint of curing shrinkage and elastic modulus, it is preferably 55% by mass or less, and more preferably 40% by mass or less in consideration of adhesive strength. More preferably, it is 25% by mass or less. If content of (A1) component is 5 mass% or more, while being able to improve the sclerosis
- ((A2) component monomer having one (meth) acryloyl group in the molecule
- numerator which is (A2) component it is preferable that it is liquid at normal temperature (25 degreeC).
- a compound having a dicyclopentanyl group, a dicyclopentenyl group, or an isobornyl group in the molecule is preferable, and a compound having a dicyclopentenyl group or an isobornyl group in the molecule is more preferable. More preferred is a compound having a dicyclopentenyl group in the molecule.
- these plural types of compounds may be used alone or in combination.
- a (meth) acrylate represented by the following general formula (2) is preferably exemplified.
- R 2 represents a hydrogen atom or a methyl group
- R 3 represents an alkyl group having 4 to 20 carbon atoms. From the viewpoint of imparting more flexibility, R 3 is preferably an alkyl group having 6 to 18 carbon atoms, more preferably an alkyl group having 8 to 16 carbon atoms, and still more preferably an alkyl group having 8 to 12 carbon atoms.
- Examples of the component (A2) include n-butyl (meth) acrylate, tert-butyl (meth) acrylate, isobutyl (meth) acrylate, n-pentyl (meth) acrylate, n-octyl (meth) acrylate, and isooctyl (meth) ) Acrylates, 2-ethylhexyl (meth) acrylates, isodecyl (meth) acrylates, n-hexyl (meth) acrylates, stearyl (meth) acrylates, lauryl (meth) acrylates, alkyl (meth) acrylates such as tridecyl (meth) acrylates; 2-hydroxyethyl (meth) acrylate, 1-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 1-hydroxypropyl (me
- At least one of (meth) acrylates having a dicyclopentanyl group, a dicyclopentenyl group, or an isobornyl group from the viewpoints of optical properties, liquid floating, adhesive strength, wet heat resistance, and tackiness after curing. It preferably contains a species, more preferably contains at least one (meth) acrylate having a dicyclopentenyl group or an isobornyl group, and more preferably a (meth) acrylate having a dicyclopentenyl group.
- These plural types of compounds may be used alone or in combination.
- the content of the component (A2) in the resin composition is the total amount of the resin composition from the viewpoint of obtaining a resin composition having an appropriate viscosity, and from the viewpoint of adjusting the curing shrinkage rate and improving the transparency of the cured product.
- the mass ratio (A1) / (A2) of the component (A1) to the component (A2) is preferably 0.1 or more, more preferably 0.2 or more, still more preferably 0.3 or more, and particularly preferably 0. .4 or more, very preferably 0.5 or more, and preferably 5.5 or less, more preferably 4.0 or less, still more preferably 3.0 or less, particularly preferably 2.0 or less, very particularly preferably. 1.0 or less.
- the content of the component (A) is preferably 10% by mass or more, more preferably 20% by mass or more, still more preferably 30% by mass or more, and particularly preferably 40% by mass or more with respect to the total amount of the resin composition. And, it is preferably 90% by mass or less, more preferably 70% by mass or less, still more preferably 60% by mass or less, and particularly preferably 50% by mass or less.
- the photopolymerization initiator (B) is a kind of polymerization initiator that generates radicals by irradiation with active energy rays such as ultraviolet rays, electron beams, ⁇ rays, ⁇ rays, and accelerates the curing reaction of the resin composition. .
- Examples of the photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4- Methoxy-4,4′-dimethylaminobenzophenone, ⁇ -hydroxyisobutylphenone, 2-ethylanthraquinone, tert-butylanthraquinone, 1,4-dimethylanthraquinone, 1-chloroanthraquinone, 2,3-dichloroanthraquinone, 3-chloro- 2-methylanthraquinone, 1,2-benzoanthraquinone, 2-phenylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, thioxanthone, 2-chlorothioxanthone
- aromatic ketone compounds, phenylglyoxylic acid methyl esters, phosphine oxide compounds, or ⁇ -hydroxyalkylphenone compounds are preferable from the viewpoint of curability and reactivity, and ⁇ -hydroxyalkylphenone compounds are preferable.
- phosphine oxide compounds are more preferable, and phosphine oxide compounds are more preferable. These compounds can be used alone or in combination of two or more.
- content of (B) component is 4.0 mass% or more and 10 mass% or less with respect to the total amount of a resin composition, Preferably it is 4.5 mass% from a viewpoint of promoting hardening reaction. Or more, more preferably 5.0% by mass or more, still more preferably 5.2% by mass or more, particularly preferably 5.4% by mass or more, and most preferably 5.5% by mass or more, and from the viewpoint of adhesiveness Therefore, it is preferably 9.0% by mass or less, more preferably 8.0% by mass or less, still more preferably 7.5% by mass or less, particularly preferably 7.0% by mass, and most preferably 6.5% by mass or less. is there.
- component (B) When the content of component (B) is less than 4.0% by mass, the curing reaction cannot be sufficiently promoted on the surface of the coating film in the presence of oxygen, and a cured product cannot be obtained. On the other hand, when the content of the component (B) exceeds 10% by mass, the tackiness is lowered. Further, when a phosphine oxide compound is used as the component (B), the content of the phosphine oxide compound is preferably 4.5% by mass from the viewpoint of promoting the curing reaction with respect to the total amount of the resin composition.
- more more preferably 5.0% by mass or more, still more preferably 5.2% by mass or more, particularly preferably 5.4% by mass or more, and most preferably 5.6% by mass or more, and from the viewpoint of adhesiveness Therefore, it is preferably 9.0% by mass or less, more preferably 8.0% by mass or less, still more preferably 7.5% by mass or less, particularly preferably 7.0% by mass, and most preferably 6.5% by mass or less. is there.
- the mass ratio (B) / (A) between the component (A) and the component (B) is preferably 0.05 or more, more preferably 0.07 or more, still more preferably 0.08 or more, and still more preferably 0. 0.09 or more, particularly preferably 0.1 or more, very preferably 0.12 or more, and preferably 0.9 or less, more preferably 0.5 or less, still more preferably 0.3 or less, and still more preferably Is 0.25 or less, particularly preferably 0.2 or less, and very preferably 0.14 or less.
- the plasticizer used as the component (C) in the present invention has substantially no (meth) acryloyl group.
- the component (C) is preferably in a liquid state at 25 ° C. from the viewpoint of workability during preparation of the photocurable resin composition and suppression of plasticizer precipitation due to recrystallization and the like.
- component (C) examples include butadiene rubber, isoprene rubber, silicon rubber, styrene butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, ethylene propylene rubber, urethane rubber, acrylic rubber, chlorosulfonated polyethylene rubber, fluorine rubber, hydrogen Liquefied nitrile rubber, epichlorohydrin rubber liquid; poly ⁇ -olefin such as polybutene; hydrogenated ⁇ -olefin oligomer such as hydrogenated polybutene; polyvinyl oligomer such as atactic polypropylene; aromatic oligomer such as biphenyl and triphenyl; Hydrogenated polyene oligomers such as hydrogenated liquid polybutadiene; paraffinic oligomers such as paraffin oil and chlorinated paraffin oil; cycloparaffinic oligomers such as naphthenic oil; dimethyl phthalate and diethyl phthalate , Dibutyl
- Phosphoric acid derivatives such as diethylene glycol dibenzoate, dipropylene glycol Glycol derivatives such as benzoate, triethylene glycol dibenzoate, triethylene glycol di- (2-ethylbutyrate), triethylene glycol di- (2-ethylhexoate), dibutylmethylene bisthioglycolate; glycerol monoacetate, Examples thereof include glycerin derivatives such as glycerol triacetate and glycerol tributyrate, and epoxy derivatives such as epoxidized soybean
- an isoprene polymer having a (meth) acryloyl group as the component (A1) from the viewpoint of volatility, viscosity, workability, yellowing resistance, compatibility and heat resistance, butadiene rubber, isoprene rubber, Poly ⁇ -olefin, hydrogenated ⁇ -olefin oligomer, and di- (2-ethylhexyl) sebacate are preferable, and butadiene rubber and butadiene rubber having a hydroxyl group at the terminal are more preferable.
- the number average molecular weight of the component (C) is preferably 3.5 ⁇ 10 2 or more, more preferably 4.0 ⁇ 10, from the viewpoint of adjusting the optical properties and viscosity of the plasticizer and adjusting the viscosity of the resin composition. 2 or more, more preferably 5.0 ⁇ 10 2 or more, particularly preferably 8.0 ⁇ 10 2 or more, and preferably 3.0 from the viewpoint of the volatility of the plasticizer and the viscosity adjustment of the resin composition.
- ⁇ 10 4 or less more preferably 1.0 ⁇ 10 4 or less, further preferably 5.0 ⁇ 10 3 or less, and particularly preferably 3.5 ⁇ 10 3 or less.
- the number average molecular weight of (C) component is 3.5 * 10 ⁇ 2 > or more, volatilization of a plasticizer can be suppressed. And if the number average molecular weight of (C) component is 3.0 * 10 ⁇ 4 > or less, it can suppress that the viscosity of a plasticizer becomes high too much and the cloudiness of a plasticizer.
- the content of the component (C) is preferably 20% by mass or more, more preferably 30% by mass or more, and still more preferably with respect to the total amount of the resin composition from the viewpoint of adjusting the elastic force of the cured product to an appropriate range. Is 35% by mass or more, particularly preferably 40% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, still more preferably 65% by mass or less, particularly preferably 60% by mass or less. . If content of (C) component is 20 mass% or more, generation
- the resin composition of the present invention can further contain other additives as long as the effects of the present invention are not impaired.
- Other additives include adhesion improvers such as silane coupling agents, thermal polymerization initiators, moisture curing agents, (D) antioxidants (hereinafter also referred to as “component (D)”), thixotropic agents, chain General additives such as a transfer agent, a stabilizer, and a photosensitizer can be contained.
- (D) antioxidant from the viewpoint that the resin composition of the present invention can suppress liquid floating and yellowing.
- (D) Preferred embodiments of the antioxidant include (D1) a compound having a hindered phenol structure (hereinafter also referred to as “(D1) component”), an amine-based, phosphorus-based, sulfur-based, hydrazine-based, amide-based compound, etc. Is mentioned.
- (D1) a compound having a hindered phenol structure is more preferable from the viewpoint of suppressing bleeding out.
- (D1) Among the compounds having a hindered phenol structure, from the viewpoint of suppressing yellowing, (D1 ′) a hindered phenol compound (hindered phenol-thioether compound) having a thioether structure, which will be described later, or ( D1) It is more preferable to use a compound having a hindered phenol structure and a sulfur compound in combination. As the sulfur compound to be used in combination, it is preferable to use a compound (D2) having a thioether structure described later.
- (D1) component a compound having a hindered phenol structure
- D1 As a compound having a hindered phenol structure, it is preferable to use a compound represented by the following general formula (3). From the viewpoint of further suppressing yellowing, it is represented by the following general formula (4).
- (D1 ′) It is more preferable to use a hindered phenol compound (hindered phenol-thioether compound) having a thioether structure.
- R 5 represents a tert-butyl group or —CH 2 —S—R a
- R 4 represents an alkyl group having 1 to 5 carbon atoms or —CH 2 —S—R a
- R A plurality of 4 may be present as independent substituents.
- N represents an integer of 1 to 4.
- A represents an n-valent organic group.
- R a represents an alkyl group having 1 to 20 carbon atoms.
- R 6 represents an alkyl group having 1 to 5 carbon atoms
- R 7 and R 8 each independently represents an alkyl group having 1 to 20 carbon atoms.
- (D1) As a compound having a hindered phenol structure, for example, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-hydroxyphenyl) propionate] (manufactured by BASF Japan Ltd., trade name: IRGANOX1010) Thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] (manufactured by BASF Japan Ltd., trade name: IRGANOX1035), octadecyl-3- (3,5-di-) tert-Butyl-4-hydroxyphenyl) propionate (manufactured by BASF Japan Ltd., trade name: IRGANOX1076), N, N′-hexane-1,6-diylbis [3- (3,5-di-tert-butyl- 4-hydroxyphenyl) propionamide] (BAS Manufactured
- pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] and 4,6-bis (octylthiomethyl) -o -Cresol is preferred, and from the viewpoint of easy handling, bleed-out and yellowing can be suppressed, and 4,6-bis (octylthiomethyl) -o-cresol having a thioether structure in the molecule is more preferred and used in a wide range Benzenepropanoic acid, 3,5-bis (1,1-dimethylethyl) -4-hydroxy, C7-C9 side from the viewpoint of suppressing bleeding out, low odor, and excellent operability More preferred are chain alkyl esters.
- Component (D2) Compound having a thioether structure
- D2 As the compound having a thioether structure, it is preferable to use a compound represented by the following general formula (5).
- R 9 represents an alkyl group having 1 to 20 carbon atoms.
- Examples of the compound having a thioether structure include didodecylthiodipropionate (manufactured by Cypro Kasei Co., Ltd., trade name: SEENOX DL; BASF Japan Ltd., trade name: IRGANOX PS 800 FL; Sumitomo Chemical) Product name: Sumilizer TPL-R), ditridecyl-3,3′-thiodipropionate (trade name: AO-503, manufactured by ADEKA Corporation), ditetradecylthiodipropionate (Sumitomo Chemical) (Trade name: Sumilizer TPM), distearyl thiodipropionate (manufactured by Sumitomo Chemical Co., Ltd., trade name: Sumilizer TPD).
- the content of the component (D) is preferably 0.5% by mass or more, more preferably 0.6% by mass or more, and still more preferably 0% with respect to the total amount of the resin composition, from the viewpoint that bleeding out can be further suppressed. 0.7 mass% or more, and preferably 3.0 mass% or less, more preferably 2.7 mass% or less, and still more preferably 2.5 mass% or less. If content of (D) component is 0.5 mass% or more, yellowing and bleed-out of a resin composition can be suppressed. And if content of (D) component is 3.0 mass% or less, the fall of sclerosis
- the mass ratio (D1) / (D2) between the component (D1) and the component (D2) is preferably 0.25 or more, more preferably It is 0.3 or more, more preferably 0.5 or more, and preferably 4 or less, more preferably 3 or less, still more preferably 2 or less.
- the resin composition of this invention can contain a chain transfer agent for adjustment of molecular weight.
- chain transfer agent examples include 2-mercaptoethanol, lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-ethylhexyl thioglycolate, 2,3-dimethylcapto-1-propanol, ⁇ -methylstyrene dimer, 1,4- Bis (3-mercaptobutyryloxy) butane, 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, And thiol compounds such as pentaerythritol tetrakis (3-mercaptobutyrate).
- the resin composition of the present invention can contain a stabilizer such as triphenyl phosphite to prevent oxygen inhibition during photocuring.
- the resin composition of this invention does not contain an organic solvent substantially from a viewpoint of suppressing heat-and-heat reliability, and the bubble generation in hardened
- the “organic solvent” means an organic compound that does not have a (meth) acryloyl group, is liquid at 25 ° C., and has a boiling point of 250 ° C. or less at atmospheric pressure.
- substantially does not contain an organic solvent means that an organic solvent is not intentionally added, and it is a trace amount as long as it does not significantly deteriorate the characteristics after photocuring of the resin composition of the present invention.
- the organic solvent may be present.
- the content of the organic solvent in the resin composition is preferably 1.0 ⁇ 10 3 ppm or less, more preferably 5.0 ⁇ 10 2 ppm or less, further based on the total amount of the resin composition. It is preferably 1.0 ⁇ 10 2 ppm or less and particularly preferably contains no organic solvent.
- the viscosity at 25 ° C. of the resin composition of the present invention is preferably 10 mPa ⁇ s or more, more preferably 4.0 ⁇ 10 2 mPa ⁇ s or more, and further preferably 5.0 ⁇ 10 2 mPa from the viewpoint of workability.
- JIS Z 8803 a value measured based on JIS Z 8803, and specifically, measured with a B-type viscometer (trade name: BL2 manufactured by Toki Sangyo Co., Ltd.). Can do.
- the viscometer can be calibrated based on JIS Z 8809-JS14000.
- the curing shrinkage rate of the resin composition of the present invention is preferably 4.0 from the viewpoint of further suppressing the warpage of a substrate such as a protective panel or an image display unit when used as a constituent member of an image display device. %, More preferably less than 3.5%, still more preferably less than 3.0%. When the curing shrinkage rate is less than 4.0%, the warpage of the substrate can be sufficiently suppressed.
- the cure shrinkage referred to here can be calculated from the following formula.
- Curing shrinkage (%) ((1 / liquid specific gravity) ⁇ (1 / cured product specific gravity)) / (1 / liquid specific gravity)
- cured material specific gravity in said formula can be measured with the following method.
- Measurement method of liquid specific gravity Measurement is performed using a Herbert specific gravity bottle according to JIS K0061.
- PET polyethylene terephthalate
- Another sheet of PET so that the resin composition is dropped onto a polyethylene terephthalate (hereinafter, also referred to as “PET”) film whose surface has been release-treated, and the film thickness after curing of the resin composition is 1 mm. Affix the film.
- PET polyethylene terephthalate
- an ultraviolet ray with an exposure amount of 1.0 ⁇ 10 4 mJ / cm 2 is irradiated using an ultraviolet ray irradiation device to cure the resin composition to produce a cured product.
- the PET film was peeled off, and the specific gravity measured at 25 ° C. was measured using a specific gravity meter (trade name: SD-200L, manufactured by Alpha Mirage Co., Ltd.) on the test piece obtained by separating the cured product into 10 mm ⁇ 10 mm. It can be the specific gravity of the cured product.
- the elastic modulus of the cured product of the resin composition of the present invention is, when used as a constituent member of an image display device, from the viewpoint of suppressing the occurrence of display unevenness by suppressing the application of local stress to the image display unit or the like. , Preferably 2.0 ⁇ 10 5 Pa or less, more preferably 1.5 ⁇ 10 5 Pa or less, and even more preferably 1.0 ⁇ 10 5 Pa or less. If the elastic modulus is 2.0 ⁇ 10 5 Pa or less, it is possible to suppress local stress application to the image display unit that may cause display unevenness.
- the elastic modulus of the cured product of the resin composition of the present invention is not limited to the lower limit of the elastic modulus as long as the liquid material is not separated from the cured product or does not sag when heated, but is preferably Is 1.0 ⁇ 10 4 Pa or more.
- the method for producing an image display device according to the present invention includes a light-transmitting curing in which an image display member and a light-transmitting cover member having a light-shielding layer formed on a peripheral portion are formed from the photo-curable resin composition of the present invention.
- a method for manufacturing an image display device wherein a light-shielding layer forming surface of a light-transmitting cover member is disposed on the image display member side through a resin layer, comprising the following steps (I) to (III)
- the photocurable resin composition is cured by irradiation with active energy rays so that the curing rate of the light transmissive cured resin layer is 80% or more.
- This is a method for manufacturing a display device.
- Step (I) (Photocurable resin composition layer forming step)>
- a light-transmitting cover member 2 having a light shielding layer 1 formed on the peripheral edge of one side is prepared, and as shown in FIG. 2, on the surface 2 a of the light-transmitting cover member 2,
- the photocurable resin composition layer 3 is formed. Specifically, it is thicker than the thickness of the light shielding layer 1 so as to embed the step 4 formed by the light shielding layer 1 and the light shielding layer forming side surface 2a of the light transmissive cover member 2, and also includes the surface of the light shielding layer 1.
- the photocurable resin composition layer 3 it is preferable to form the photocurable resin composition layer 3 so as to be flat on the entire surface 2a of the light transmissive cover member 2 on the light shielding layer forming side.
- the photocurable resin composition layer 3 is not necessarily formed to be flat, and when the light-transmitting cover member 2 and the image display member 6 are bonded together, as shown in FIG. A gap formed by the light transmissive cured resin layer 5 formed by curing the photocurable resin composition layer 3 from the image display member 6 and the light shielding layer 1, and the image display member 6 and the light transmissive cover member 2. What is necessary is just to form so that it may be embedded in.
- it is more preferably 1.0 ⁇ 10 3 ⁇ m or less, and further preferably 5.0 ⁇ 10 2 ⁇ m or less.
- Examples of the method for forming the photocurable resin composition layer 3 include screen printing, metal mask printing, general coating by a slit coater, bar coater, etc., multi-nozzles (in which a number of dispenser nozzles are arranged in a row) Dispensing in What is necessary is just to form so that required thickness may be obtained using these 1 or more types of methods. In addition, you may perform formation of this photocurable resin composition layer 3 in multiple times so that required thickness may be obtained.
- the light transmissive cover member 2 only needs to be light transmissive so that an image formed on the image display member can be visually recognized, and plate-like materials such as glass, acrylic resin, polyethylene terephthalate, polyethylene naphthalate, and polycarbonate. And a sheet-like material. These materials can be subjected to single-sided or double-sided hard coat treatment, antireflection treatment, or the like. Physical properties such as thickness and elasticity of the light-transmitting cover member 2 can be appropriately determined according to the purpose of use. Further, the light transmissive cover member 2 may include a touch sensor layer, a parallax barrier layer for the naked eye 3D, and the like.
- the light shielding layer 1 is provided to increase the contrast of an image, and is formed by applying a paint colored black or the like by a screen printing method or the like, and drying and curing.
- the thickness of the light shielding layer 1 is usually 5 ⁇ m to 1.0 ⁇ 10 2 ⁇ m, and this thickness corresponds to the step 4.
- the light curable resin layer 5 is formed by irradiating the photocurable resin composition layer 3 formed in the step (I) with an active energy ray such as ultraviolet rays and curing it.
- an active energy ray such as ultraviolet rays and curing it.
- the curing rate (gel fraction) of the light-transmitting cured resin layer 5 is a value measured by the method shown in the examples described later, preferably 80% or more, more preferably 90% or more, and still more preferably 95% or more. .
- the type, output, accumulated light amount, etc. of the light source of active energy rays such as ultraviolet rays, as long as they can be cured so that the curing rate (gel fraction) is 80% or more.
- Photo-radical polymerization process conditions of (meth) acrylate by energy ray irradiation can be employed.
- step (I) photocurable resin composition layer 3 forming step
- step (II) curing step
- the interval until irradiation is preferably within 60 seconds, more preferably within 30 seconds, still more preferably within 10 seconds, and particularly preferably within 5 seconds. If the interval from the completion of the formation of the photocurable resin composition layer to the irradiation exposure of the active energy ray is within 60 seconds, the coating end of the photocurable resin composition is thickened by the surface tension to obtain smoothness. It can be prevented from being lost.
- the image display member 6 examples include a liquid crystal display panel, an organic EL display panel, a plasma display panel, and a touch panel.
- the touch panel means an image display and input panel in which a display element such as a liquid crystal display panel and a position input device such as a touch pad are combined.
- the light transmissive level of the light transmissive cured resin layer 5 may be light transmissive so that an image formed on the image display member 6 can be visually recognized.
- FIGS. 1 to 4 the example in which the photocurable resin composition layer is formed on the light shielding layer forming surface of the light transmissive cover member has been described.
- FIGS. 5 to 7 the image display member is formed.
- the example which formed the photocurable resin composition layer on the surface is demonstrated.
- the same reference numerals represent the same components.
- a method of forming on the surface side of the image display member is also included in the step (I), but in the following description showing one example, the steps (Ir) to (IIIr) are used to distinguish from the above description. It describes.
- the photocurable resin composition layer 3 is formed on the surface of the image display member 6.
- the photocurable resin composition layer 3 formed on the image display member 6 is not necessarily formed to be flat, but is flat from the viewpoint of stably performing the subsequent steps. It is preferable.
- the thickness of the photocurable resin composition layer 3 to be formed is preferably 6 ⁇ m or more, more preferably 15 ⁇ m or more, further preferably 20 ⁇ m or more, particularly preferably 50 ⁇ m or more, and most preferably 1.0 ⁇ 10 2. It is not less than ⁇ m, and is preferably not more than 1.5 ⁇ 10 3 ⁇ m, more preferably not more than 1.0 ⁇ 10 3 ⁇ m, still more preferably not more than 5.0 ⁇ 10 2 ⁇ m.
- the well-known method mentioned by the said process (I) is employable.
- the light curable resin layer 5 is formed by irradiating the photocurable resin composition layer 3 formed in the step (Ir) with an active energy ray such as ultraviolet rays and curing it.
- an active energy ray such as ultraviolet rays and curing it.
- the curing rate (gel fraction) of the light transmissive cured resin layer 5 is preferably 80% or more, more preferably 90% or more, and still more preferably 95% or more.
- the light transmissive cover member 2 is bonded to the light transmissive cured resin layer 5 of the image display member 6 from the light shielding layer 1 side.
- the image display member 6 in which the light-transmitting cured resin layer 5 is formed and the light-transmitting cover member 2 in which the light shielding layer 1 is formed are combined with the light-transmitting cured resin layer 5 in the image display member 6.
- the light shielding layer 1 and the image display member 6 and the light transmissive cover member 2 are preferably bonded so as to be embedded in a gap. Bonding can be performed by applying pressure at a temperature of, for example, 10 ° C. to 80 ° C. using a known pressure bonding apparatus.
- Examples of the image display member 6 include a liquid crystal display panel, an organic EL display panel, a plasma display panel, a touch panel, and a parallax barrier panel.
- the light transmissive level of the light transmissive cured resin layer 5 may be light transmissive so that an image formed on the image display member 6 can be visually recognized.
- the image display device of the present invention has a cured product of the photocurable resin composition of the present invention.
- the image display device of the present invention is not particularly limited as long as it has the cured product of the photocurable resin composition of the present invention.
- an image display device obtained by the method for producing an image display device of the present invention is provided. Can be mentioned.
- the curing rate (gel fraction) in the present invention is calculated from the abundance of (meth) acryloyl groups after UV irradiation relative to the abundance of (meth) acryloyl groups in the photocurable resin composition layer before UV irradiation. It is a numerical value defined by the ratio of the consumption of the (meth) acryloyl group to be performed, and the larger the numerical value, the more the curing proceeds.
- the curing rate (gel fraction) of the optical property evaluation sample described later and the photocurable resin composition layer in the glass bonded body for adhesive strength evaluation is determined by Fourier transform infrared spectroscopy (FT-IR) analyzer (Perkin). It measured by analyzing the photocurable resin composition layer before and behind hardening by the total reflection measuring method (ATR: Attenuated Total Reflection) using the Elmer company make, brand name: Spectrum One.
- FT-IR Fourier transform infrared spectroscopy
- ultraviolet irradiation dose absorption peak height of the 800cm -1 ⁇ 820cm -1 and (X), described later from baseline in FT-IR measurement chart of the photocurable resin composition layer before the ultraviolet irradiation absorption peak height of the 800cm -1 ⁇ 820cm -1 from baseline in FT-IR measurement chart of the resin composition layer after irradiation with (Y), 2.0 ⁇ 10 4 mJ / cm 2 resin after ultraviolet irradiation absorption peak height of the 800cm -1 ⁇ 820cm -1 from baseline in FT-IR measurement chart of the composition layer and (Z), was calculated by substituting the equation (1) below. Curing rate (%) ⁇ (XY) / (XZ) ⁇ ⁇ 100 (1)
- an ultraviolet irradiation device trade name: US5-X0401 manufactured by Eye Graphics Co., Ltd.
- a metal halide lamp product name: M04-L41 manufactured by Eye Graphics Co., Ltd.
- the transmittance of the sample at a wavelength of 400 nm and b * were measured using a hue meter (manufactured by Nippon Denshoku Industries Co., Ltd., trade name: ⁇ 90) with AN100 as a reference, and evaluated according to the following criteria.
- F The transmittance at 400 nm is less than 98%, or the value of b * is more than 1.0.
- a glass / polarizing plate laminate in which a polarizing plate 8 is laminated on a glass base 7 having a size of 26 mm (width) ⁇ 76 mm (length) ⁇ 0.2 mm (thickness). 9 was prepared.
- the photocurable resin compositions obtained in Examples and Comparative Examples were applied, and the above ultraviolet rays were applied.
- the glass base 10 in which the light-transmitting cured resin layer 5 is formed on one side is obtained by curing the photocurable resin composition layer by irradiating ultraviolet rays with an irradiation apparatus at 1.0 ⁇ 10 4 mJ / cm 2. Prepared. Next, as shown in FIG. 8B, the glass base 10 on which the light transmissive cured resin layer 5 is formed is light transmissive cured so that the short sides of the glass base 7 and the glass base 10 are parallel to each other. From the resin layer 5 side, a glass joined body was obtained by bonding to the polarizing plate 8 side of the glass / polarizing plate laminate 9.
- the area of the bonded portion of the glass bonded body was 26 mm ⁇ 20 mm (520 mm 2 ), and the thickness of the light transmissive cured resin layer 5 was 0.2 mm.
- the curing rate of the light-transmitting cured resin layer 5 when irradiated with light before bonding was 100%.
- the glass base 7 of the obtained glass joined body is fixed so that the long side thereof is perpendicular to the ground and the portion bonded to the glass base 10 is vertically downward, and then the glass base 10 is attached to the glass base 10.
- a weight of 500 g was applied downward in the vertical direction, the shape change after 24 hours was observed, and evaluated according to the following criteria.
- F Position shift between the glass / polarizing plate laminate 9 and the glass base 10 was confirmed.
- the glass / polarizing plate laminate 9 is placed on a glass base 10 having a size of 26 mm (width) ⁇ 76 mm (length) ⁇ 0.2 mm (thickness). 7 and the glass base 10 were bonded together from the light transmissive cured resin layer 5 side so that the short sides of the glass base 10 were parallel to each other.
- the area of the bonded portion was 26 mm ⁇ 20 mm (520 mm 2 ), and the thickness of the light transmissive cured resin layer 5 was 0.2 mm.
- the curing rate of the light-transmitting cured resin layer 5 when irradiated with light before bonding was 100%.
- the glass base 7 of the obtained glass joined body is fixed so that the long side thereof is perpendicular to the ground and the portion bonded to the glass base 10 is vertically downward, and then the glass base 10 is attached to the glass base 10.
- a weight of 500 g was applied downward in the vertical direction, the shape change after 24 hours was observed, and evaluated according to the following criteria.
- ⁇ Liquid float evaluation> The light-transmitting cured resin layer 5 of the sample obtained by cutting the sample for evaluating optical properties into 30 mm ⁇ 30 mm was touched as shown in FIG. 9 and evaluated according to the following criteria.
- the temperature at the time of evaluation was 25 ⁇ 5 ° C.
- Examples 1 to 13 and Comparative Examples 1 to 4 Ingredients (A) to (D) described above were blended in the blending composition (mass%) shown in Table 1, and the mixture was heated and stirred for 30 minutes at 90 ° C., and Examples 1 to 13 and Comparative Examples 1 to No. 4 photocurable resin composition was prepared.
- Table 1 the numerical values for the components (A) to (D) mean mass% with respect to the total amount of the photocurable resin composition.
- the photocurable resin compositions of Examples 1 to 13 are image display members that do not require a post-process, particularly by adjusting the content of the photopolymerization initiator within the scope of the present invention. It can be seen that there is no liquid floating of the light-transmitting cured resin layer before bonding the light-transmitting cover member and the adhesive force after bonding the members through the light-transmitting cured resin layer is good. .
- a photocurable resin composition of the present invention, an image display device using the same, and a method for manufacturing the image display device include a touch panel, a smart phone provided with a parallax barrier for naked eyes 3D, a touch pad, a personal computer, and a television. It is useful for the industrial manufacture of information terminals.
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Abstract
Description
また、特許文献3の技術によれば、特許文献2で懸念された問題の解消は期待できるが、遮光層と画像表示部材との間に挟まれた光硬化性樹脂組成物は、仮硬化工程を経て半硬化の状態で貼り合わせを行うため、遮光層と光透過性カバー部材表面との間からの気泡の発生、光透過性カバーと光硬化性樹脂組成物との層間剥離の発生が懸念される。また、半硬化の状態で貼り合わせた後、本硬化工程を行うまでの間は、光硬化性樹脂組成物からの液浮きによる光透過性カバーと光硬化性樹脂組成物との位置ずれの発生が懸念される。さらに、光透過性カバー部材と画像表示部材とを貼り合わせた後、更なる紫外線照射による光硬化を行い接着させるため、本硬化プロセスのための設備投資の負担が大きくなるという問題がある。
[1](A)(メタ)アクリロイル基を有する化合物、(B)光重合開始剤、及び(C)可塑剤を含む光硬化性樹脂組成物であって、(B)光重合開始剤の含有量が、4.0~10質量%である光硬化性樹脂組成物。
[2](A)(メタ)アクリロイル基を有する化合物として、(メタ)アクリロイル基を有するイソプレン重合体を含む、上記[1]に記載の光硬化性樹脂組成物。
[3](A)(メタ)アクリロイル基を有する化合物の含有量が、前記光硬化性樹脂組成物の総量に対して、10~90質量%である、上記[1]又は[2]に記載の光硬化性樹脂組成物。
[4](A)(メタ)アクリロイル基を有する化合物として、(A1)分子内に(メタ)アクリロイル基を有する重合体、及び(A2)分子内に1個の(メタ)アクリロイル基を有する単量体を含む、上記[1]~[3]のいずれかに記載の光硬化性樹脂組成物。
[5](A2)分子内に1個の(メタ)アクリロイル基を有する単量体が、ジシクロペンタニル基、ジシクロペンテニル基、又はイソボルニル基を有する(メタ)アクリレートの少なくとも1種を含み、前記光硬化性樹脂組成物の総量中の(A2)分子内に1個の(メタ)アクリロイル基を有する単量体の含有量が10~40質量%である、上記[4]に記載の光硬化性樹脂組成物。
[6](D)酸化防止剤を含む、上記[1]~[5]のいずれかに記載の光硬化性樹脂組成物。
[7](D)酸化防止剤が(D1)ヒンダードフェノール構造を有する化合物、及び(D2)チオエーテル構造を有する化合物を含む、上記[6]に記載の光硬化性樹脂組成物。
[8]25℃における粘度が5.0×102mPa・s~5.0×104mPa・sである、上記[1]~[7]のいずれかに記載の光硬化性樹脂組成物。
[9]画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、上記[1]~[8]のいずれかに記載の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示用装置の製造方法であって、以下の工程(I)~(III)を有する製造方法であり、工程(II)において、光透過性硬化樹脂層の硬化率が80%以上となるように、光硬化性樹脂組成物に、活性エネルギー線を照射して硬化させる、画像表示用装置の製造方法。
工程(I):光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面、又は画像表示部材の遮光層側表面に層形成して、光硬化性樹脂組成物層を形成する工程。
工程(II):形成された光硬化性樹脂組成物層に対し、活性エネルギー線を照射して硬化させることにより光透過性硬化樹脂層を形成する工程。
工程(III):遮光層と光透過性硬化樹脂層とが画像表示部材と光透過性カバー部材との間に介在するように、画像表示部材と光透過性カバー部材とを貼り合わせる工程。
[10]工程(I)において、光硬化性樹脂組成物層を、光透過性カバー部材の遮光層形成側表面に形成する、上記[9]に記載の画像表示用装置の製造方法。
[11]工程(I)において、光硬化性樹脂組成物層を、画像表示部材の表面に形成する、上記[9]に記載の画像表示用装置の製造方法。
[12]工程(III)において、光透過性硬化樹脂層を形成した画像表示部材と、遮光層が形成された光透過性カバー部材とを、光透過性硬化樹脂層が、画像表示部材と遮光層、及び画像表示部材と光透過性カバー部材とから形成される間隙に埋め込まれるように、貼り合せる、上記[11]に記載の画像表示装置の製造方法。
[13]工程(I)において、光硬化性樹脂組成物層を、画像表示用部材又は光透過性カバー部材の表面に、6μm~1.5×103μmの厚さで形成する、上記[9]~[12]のいずれかに記載の画像表示用装置の製造方法。
[14]画像表示部材が、液晶表示パネル、有機EL表示パネル、プラズマ表示パネル、タッチパネル、又は視差バリアパネルである、上記[9]~[13]のいずれかに記載の画像表示用装置の製造方法。
[15]上記[1]~[8]のいずれかに記載の光硬化性樹脂組成物の硬化物を有する画像表示用装置。
なお、図面中、同一又は相当部分には同一符号を付し、重複する説明は省略する。
また、本明細書における「(メタ)アクリレート」とは、「アクリレート」及びそれに対応する「メタクリレート」を意味する。同様に「(メタ)アクリル」とは、「アクリル」及びそれに対応する「メタクリル」を意味し、「(メタ)アクリロイル」とは「アクリロイル」及びそれに対応する「メタクリロイル」を意味する。
<分子量測定>
数平均分子量(Mn)は、以下の方法に基づいて測定する。
・検量線の作成方法:テトラヒドロフラン(以下、「THF」ともいう)を溶媒としたゲルパーミエーションクロマトグラフィー(GPC)を使用して行い、ポリスチレンを標準物質として検量線を作成して決定する。検量線の作成にあたっては、標準ポリスチレンとして5サンプルセット(PStQuickMP-H,PStQuick B[東ソー(株)製、商品名])を用いる。
・装置:高速GPC装置 HCL-8320GPC(検出器:示差屈折計又はUV)
(東ソー(株)製、商品名)
・使用溶媒:THF
・カラム:カラムTSKGEL SuperMultipore HZ-H
(東ソー(株)製、商品名)
・カラムサイズ:カラム長が15cm、カラム内径が4.6mm
・測定温度:40℃
・流量:0.35ml/分
・試料濃度:10mg/THF5ml
・注入量:20μl
(a)数平均分子量(Mn)
Mn=Σ(NiMi)/ΣNi=ΣXiMi
(Xi=分子量Miの分子のモル分率=Ni/ΣNi)
(b)重量平均分子量(Mw)
Mw=Σ(NiMi 2)/ΣNiMi=ΣWiMi
(Wi=分子量Miの分子の重量分率=NiMi/ΣNiMi)
(c)分子量分布(分散度)
分散度=Mw/Mn
本発明の光硬化性樹脂組成物(以下、単に「樹脂組成物」ともいう)は、(A)(メタ)アクリロイル基を有する化合物(以下、「(A)成分」ともいう)、(B)光重合開始剤(以下、「(B)成分」ともいう)、及び(C)可塑剤(以下、「(C)成分」ともいう)を含有し、(B)光重合開始剤の含有量が4.0~10質量%である。
本発明の樹脂組成物は、(A)成分として、(メタ)アクリロイル基を有する化合物を含有する。(メタ)アクリロイル基を有する化合物としては、(A1)分子内に(メタ)アクリロイル基を有する重合体(以下、「(A1)成分」ともいう)、(A2)分子内に1個の(メタ)アクリロイル基を有する単量体(以下、「(A2)成分」ともいう)が挙げられ、樹脂組成物の粘度の調整の観点、並びに硬化収縮率の低減、及び粘着性を高め接着性を向上させる観点から、(A1)成分及び(A2)成分を併用することが好ましい。(A1)成分のみを使用する場合と比べて、(A2)成分を併用することで、より粘着性を向上できる。また、(A2)成分のみを使用する場合と比べて、(A1)成分を併用することで、樹脂組成物の硬化収縮率を低減し、被着体との界面での剥離を抑制することができる。
また、(A)成分として、(A1)成分及び(A2)成分以外の成分を併用してもよいが、(A1)成分及び(A2)成分のみを使用することが好ましい。
以下、(A1)成分及び(A2)成分について説明する。
(A1)成分である分子内に(メタ)アクリロイル基を有する重合体としては、例えば、(メタ)アクリロイル基を有するポリエステルオリゴマー、(メタ)アクリロイル基を有するウレタン重合体、ポリエチレングリコールモノ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ポリプロピレングリコールモノ(メタ)アクリレート、ポリプロピレングリコールジ(メタ)アクリレート、(メタ)アクリロイル基を有するブタジエン重合体、(メタ)アクリロイル基を有するイソプレン重合体等が挙げられる。
これらの中でも、透明性、耐黄変性、及び種々の特性のバランスの観点から、(メタ)アクリロイル基を有するイソプレン重合体が好ましい。
mは、50~1000の数であり、好ましくは100~800の数、より好ましくは150~700の数、更に好ましくは200~600の数である。
nは、1~5の数であり、好ましくは1.5~4.0の数、より好ましくは2.0~3.5の数、更に好ましくは2.0~3.0の数である。
上記一般式(1)で表される化合物の市販品としては、ポリイソプレン重合体の無水マレイン酸付加物と2-ヒドロキシエチルメタクリレートとのエステル化物であるUC-102、UC-203(共に製品名、(株)クラレ製)等が挙げられる。
なお、「官能基数」とは(A1)成分の1分子中の官能基((メタ)アクリロイル基)の数を示し、「平均官能基数」とは、(A1)成分全体における分子当りの官能基数の平均値を示す。
(A1)成分の含有量が5質量%以上であれば、樹脂組成物の硬化性を向上させることができると共に、硬化物の耐湿熱信頼性を良好にすることができる。一方、(A1)成分の含有量が55質量%以下であれば、硬化収縮率が良好となると共に、硬化物の弾性率が大きくなり過ぎないため好ましい。
(A2)成分である分子内に1個の(メタ)アクリロイル基を有する単量体としては、常温(25℃)で液状であることが好ましい。
また、(A2)成分としては、分子内にジシクロペンタニル基、ジシクロペンテニル基、又はイソボルニル基を有する化合物が好ましく、分子内にジシクロペンテニル基、又はイソボルニル基を有する化合物がより好ましく、分子内にジシクロペンテニル基を有する化合物が更に好ましい。これら複数種の化合物は、単独で用いても、併用してもよい。
(A2)成分としては、下記一般式(2)で表される(メタ)アクリレートが好ましく挙げられる。
これらの化合物は、単独で又は2種以上を組み合わせて用いてもよい。
これらの中でも、光学特性、液浮き、接着力、耐湿熱信頼性及び硬化後の粘着性の観点から、ジシクロペンタニル基、ジシクロペンテニル基、又はイソボルニル基を有する(メタ)アクリレートの少なくとも1種を含むことが好ましく、ジシクロペンテニル基、又はイソボルニル基を有する(メタ)アクリレートの少なくとも1種を含むことがより好ましく、ジシクロペンテニル基を有する(メタ)アクリレートが更に好ましい。これら複数種の化合物は、単独で用いても、併用してもよい。
(A2)成分の含有量が10質量%以上であれば、適度な粘度を有する樹脂組成物とすることができ、塗布等の作業性を良好とすることができると共に、硬化収縮率を低くすることができる。また、硬化物の透明性を向上させることができる。
(A2)成分の含有量が40質量%以下であれば、硬化収縮率、及び弾性率が高くなりすぎることを抑えることができ、画像表示用装置に用いた場合に、表示ムラ及びモジュールの反りの発生を抑制することができる。
また(A1)成分と(A2)成分との質量比(A1)/(A2)は、好ましくは0.1以上、より好ましくは0.2以上、更に好ましくは0.3以上、特に好ましくは0.4以上、極めて好ましくは0.5以上であり、そして、好ましくは5.5以下、より好ましくは4.0以下、更に好ましくは3.0以下、特に好ましくは2.0以下、極めて好ましくは1.0以下である。
(B)成分の光重合開始剤は、紫外線、電子線、α線、β線等の活性エネルギー線の照射によりラジカルを発生させ、樹脂組成物の硬化反応を促進させる重合開始剤の一種である。
(B)光重合開始剤としては、例えば、ベンゾフェノン、N,N’-テトラメチル-4,4’-ジアミノベンゾフェノン(ミヒラーケトン)、N,N’-テトラエチル-4,4’-ジアミノベンゾフェノン、4-メトキシ-4,4’-ジメチルアミノベンゾフェノン、α-ヒドロキシイソブチルフェノン、2-エチルアントラキノン、tert-ブチルアントラキノン、1,4-ジメチルアントラキノン、1-クロロアントラキノン、2,3-ジクロロアントラキノン、3-クロロ-2-メチルアントラキノン、1,2-ベンゾアントラキノン、2-フェニルアントラキノン、1,4-ナフトキノン、9,10-フェナントラキノン、チオキサントン、2-クロロチオキサントン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、2,2-ジエトキシアセトフェノン等の芳香族ケトン化合物;ベンゾイン、メチルベンゾイン、エチルベンゾイン等のベンゾイン化合物;ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソブチルエーテル、ベンゾインフェニルエーテル等のベンゾインエーテル化合物;ベンジル、ベンジルジメチルケタール等のベンジル化合物;β-(アクリジン-9-イル)(メタ)アクリル酸等のエステル化合物;9-フェニルアクリジン、9-ピリジルアクリジン、1,7-ジアクリジノヘプタン等のアクリジン化合物;2-(o-クロロフェニル)-4,5-ジフェニルイミダゾール二量体、2-(o-クロロフェニル)-4,5-ジ(m-メトキシフェニル)イミダゾール二量体、2-(o-フルオロフェニル)-4,5-ジフェニルイミダゾール二量体、2-(o-メトキシフェニル)-4,5-ジフェニルイミダゾール二量体、2-(p-メトキシフェニル)-4,5-ジフェニルイミダゾール二量体、2,4-ジ(p-メトキシフェニル)5-フェニルイミダゾール二量体、2-(2,4-ジメトキシフェニル)-4,5-ジフェニルイミダゾール二量体、2-(p-メチルメルカプトフェニル)-4,5-ジフェニルイミダゾール二量体等の2,4,5-トリアリールイミダゾール二量体;2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-1-ブタノン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノ-1-プロパン等のアルキルフェノン系化合物;1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン、1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、2-ヒドロキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]フェニル}-2-メチル-プロパン-1-オン、オリゴ{2-ヒドロキシ-2-メチル-1-[4-(1-メチルビニル)フェニル]プロパノン}等のα-ヒドロキシアルキルフェノン系化合物;フェニルグリオキシリックアシッドメチルエステル;ビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチル-ペンチルフォスフィンオキサイド、2,4,6-トリメチルベンゾイル-ジフェニルフォスフィンオキサイド等のフォスフィンオキサイド系化合物などが挙げられる。これらの中でも特に、硬化性、反応性の観点から、芳香族ケトン化合物、フェニルグリオキシリックアシッドメチルエステル、フォスフィンオキサイド系化合物又はα-ヒドロキシアルキルフェノン系化合物が好ましく、α-ヒドロキシアルキルフェノン系化合物又はフォスフィンオキサイド系化合物がより好ましく、フォスフィンオキサイド系化合物が更に好ましい。
これらの化合物は、単独で又は2種以上を組み合わせて用いることができる。
(B)成分の含有量が4.0質量%未満であると、酸素存在下の塗膜表面で十分に硬化反応を促進させることができず、硬化物とすることができない。一方、(B)成分の含有量が10質量%を超えると、粘着性が低下する。
また、(B)成分としてフォスフィンオキサイド系化合物を用いる場合、フォスフィンオキサイド系化合物の含有量は、樹脂組成物の総量に対して、硬化反応を促進させる観点から、好ましくは4.5質量%以上、より好ましくは5.0質量%以上、更に好ましくは5.2質量%以上、特に好ましくは5.4質量%以上、極めて好ましくは5.6質量%以上であり、そして、粘着性の観点から、好ましくは9.0質量%以下、より好ましくは8.0質量%以下、更に好ましくは7.5質量%以下、特に好ましくは7.0質量%、極めて好ましくは6.5質量%以下である。
本発明で(C)成分として用いる可塑剤は、実質的に(メタ)アクリロイル基を有さない。また、(C)成分は、光硬化性樹脂組成物作製時の作業性、及び再結晶化等による可塑剤の析出を抑制する観点から、25℃で液状であることが好ましい。
これらの化合物は、単独で又は2種以上を組み合わせて用いることができる。
(C)成分の数平均分子量が3.5×102以上であれば、可塑剤の揮発を抑制することができる。そして、(C)成分の数平均分子量が3.0×104以下であれば、可塑剤の粘度が高くなりすぎること、及び可塑剤の白濁を抑制することができる。
(C)成分の含有量が20質量%以上であれば、弾性率が高くなりすぎることによる反りの発生を抑制することができる。そして、(C)成分の含有量が80質量%以下であれば、弾性率が低くなりすぎることによる接着力及び信頼性の低下を抑制することができる。
本発明の樹脂組成物は、本発明の効果を阻害しない範囲において、更にその他の添加剤を配合することができる。
その他の添加剤としては、シランカップリング剤等の接着改善剤、熱重合開始剤、湿気硬化剤、(D)酸化防止剤(以下、「(D)成分」ともいう)、チキソトロピック剤、連鎖移動剤、安定剤、光増感剤などの一般的な添加剤を含有することができる。
その中でも、本発明の樹脂組成物は、液浮き及び黄変を抑制できる観点から、(D)酸化防止剤を用いることが好ましい。
(D)酸化防止剤の好ましい態様としては(D1)ヒンダードフェノール構造を有する化合物(以下、「(D1)成分」ともいう)、アミン系、リン系、イオウ系、ヒドラジン系、アミド系化合物等が挙げられる。これらの中でも特に、ブリードアウトを抑制できる観点から、(D1)ヒンダードフェノール構造を有する化合物がより好ましい。また、(D1)ヒンダードフェノール構造を有する化合物の中でも、黄変を抑制できる観点から、後述する(D1’)チオエーテル構造を有するヒンダードフェノール系化合物(ヒンダードフェノール-チオエーテル系化合物)、又は(D1)ヒンダードフェノール構造を有する化合物とイオウ系化合物とを併用することが更に好ましい。併用するイオウ系化合物としては、後述する(D2)チオエーテル構造を有する化合物を使用することが好ましい。
(D1)ヒンダードフェノール構造を有する化合物としては、下記一般式(3)で表される化合物を用いることが好ましく、より黄変を抑制できる観点からは、下記一般式(4)で表される(D1’)チオエーテル構造を有するヒンダードフェノール系化合物(ヒンダードフェノール-チオエーテル系化合物)を用いることがより好ましい。
(D2)チオエーテル構造を有する化合物としては、下記一般式(5)で表される化合物を用いることが好ましい。
(D)成分の含有量は、ブリードアウトをより抑制できる観点から、樹脂組成物の総量に対して、好ましくは0.5質量%以上、より好ましくは0.6質量%以上、更に好ましくは0.7質量%以上であり、そして、好ましくは3.0質量%以下、より好ましくは2.7質量%以下、更に好ましくは2.5質量%以下である。
(D)成分の含有量が0.5質量%以上であれば、樹脂組成物の黄変及びブリードアウトを抑制できる。そして、(D)成分の含有量が3.0質量%以下であれば、硬化性及び感度の低下を抑制できる。
また、前記(D1)成分と(D2)成分とを併用する場合、(D1)成分と(D2)成分との質量比(D1)/(D2)は、好ましくは0.25以上、より好ましくは0.3以上、更に好ましくは0.5以上であり、そして、好ましくは4以下、より好ましくは3以下、更に好ましくは2以下である。
また、本発明の樹脂組成物は、分子量の調整のために連鎖移動剤を含有することができる。
連鎖移動剤としては、例えば、2-メルカプトエタノール、ラウリルメルカプタン、グリシジルメルカプタン、メルカプト酢酸、チオグリコール酸2-エチルヘキシル、2,3-ジメチルカプト-1-プロパノール、α-メチルスチレンダイマー、1,4-ビス(3-メルカプトブチリルオキシ)ブタン、1,3,5-トリス(3-メルカプトブチルオキシエチル)-1,3,5-トリアジン-2,4,6(1H,3H,5H)-トリオン、ペンタエリスリトールテトラキス(3-メルカプトブチレート)等のチオール化合物などが挙げられる。
また、本発明の樹脂組成物は、光硬化時の酸素阻害防止のために、亜燐酸トリフェニル等の安定剤を含有することができる。
なお、本発明の樹脂組成物は、耐湿熱信頼性、及び硬化物中の気泡発生を抑制する観点から、実質的に有機溶媒を含有しないことが好ましい。
なお、本発明において「有機溶媒」とは、(メタ)アクリロイル基を有さず、25℃において液状であり、且つ、大気圧における沸点が250℃以下の有機化合物を意味する。
ここで「実質的に有機溶媒を含有しない」とは、意図的に有機溶媒を添加しないという意味であり、本発明の樹脂組成物の光硬化後の特性を著しく低下させない程度であれば、微量の有機溶媒が存在していてもよい。
具体的には、樹脂組成物中の有機溶媒の含有量が、樹脂組成物の総量に対して、好ましくは1.0×103ppm以下、より好ましくは5.0×102ppm以下、更に好ましくは1.0×102ppm以下であり、有機溶媒を全く含有しないことが特に好ましい。
本発明の樹脂組成物の25℃における粘度は、作業性の観点から、好ましくは10mPa・s以上、より好ましくは4.0×102mPa・s以上、更に好ましくは5.0×102mPa・s以上、より更に好ましくは1.0×103mPa・s以上、特に好ましくは2.0×103mPa・s以上、極めて好ましくは3.0×103mPa・s以上であり、そして、好ましくは5.0×104mPa・s以下、より好ましくは2.0×104mPa・s以下、更に好ましくは1.5×104mPa・s以下、より更に好ましくは1.25×104mPa・s以下、特に好ましくは1.0×104mPa・s以下である。
なお、ここでいう25℃における粘度は、JIS Z 8803に基づいて測定した値であり、具体的には、B型粘度計(東機産業(株)製、商品名:BL2)により測定することができる。なお、粘度計の校正は、JIS Z 8809-JS14000に基づいて行うことができる。
本発明の樹脂組成物の硬化収縮率は、画像表示用装置の構成部材として使用した場合に、保護パネル、画像表示ユニット等の基板の反りをさらに高度に抑制する観点から、好ましくは4.0%未満、より好ましくは3.5%未満、更に好ましくは3.0%未満である。硬化収縮率が4.0%未満であると、基板の反りを十分に抑制することができる。
硬化収縮率(%)=((1/液比重)-(1/硬化物比重))/(1/液比重)
また、上記式中の液比重及び硬化物比重は、下記の方法により測定することができる。
(液比重の測定方法)
ハーバート型比重瓶を用い、JIS K0061に倣い、測定を行う。
(硬化物比重の測定方法)
表面が離型処理されたポリエチレンテレフタレート(以下、「PET」ともいう)フィルムに、樹脂組成物を滴下し、該樹脂組成物の硬化後の膜厚が1mmとなるように、もう一枚のPETフィルムを貼り合わせる。そして、一方のPETフィルム側から、紫外線照射装置を用いて、露光量1.0×104mJ/cm2の紫外線を照射して、樹脂組成物を硬化させ、硬化物を作製する。
次いで、PETフィルムを剥がし、当該硬化物を10mm×10mmに分取した試験片を比重計(アルファーミラージュ(株)製、商品名:SD-200L)を用いて、25℃で測定した比重を、硬化物の比重とすることができる。
本発明の樹脂組成物の硬化物の弾性率は、画像表示用装置の構成部材として使用した場合に、画像表示ユニット等への局所的な応力付加を抑制し、表示ムラの発生を抑える観点から、好ましくは2.0×105Pa以下、より好ましくは1.5×105Pa以下、更に好ましくは1.0×105Pa以下である。弾性率が2.0×105Pa以下であれば、表示ムラの発生の原因ともなり得る画像表示ユニットへの局所的な応力付加を抑制することができる。
また、本発明の樹脂組成物の硬化物の弾性率は、加熱したときに硬化物から液状物が分離したり、垂れ落ちたりしない程度であれば弾性率の下限値に限りはないが、好ましくは1.0×104Pa以上である。
なお、本発明において、樹脂組成物の硬化物の弾性率は、膜厚t=1mm、幅10mmの硬化物を、チャック間距離25mmでオートグラフ((株)島津製作所製、商品名:EZ Test)を用いて、25℃で測定することにより得られた引張り弾性率の値を意味する。
次に、本発明の樹脂組成物を用いて製造することが可能な画像表示用装置の製造方法について説明する。本発明の画像表示装置の製造方法は、画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、本発明の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示用装置の製造方法であって、以下の工程(I)~(III)を有する製造方法であり、工程(II)において、光透過性硬化樹脂層の硬化率が80%以上となるように、光硬化性樹脂組成物に、活性エネルギー線を照射して硬化させる、画像表示用装置の製造方法である。
工程(I):光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面、又は画像表示部材の遮光層側表面に層形成して、光硬化性樹脂組成物層を形成する工程。
工程(II):形成された光硬化性樹脂組成物層に対し、活性エネルギー線を照射して硬化させることにより光透過性硬化樹脂層を形成する工程。
工程(III):遮光層と光透過性硬化樹脂層とが画像表示部材と光透過性カバー部材との間に介在するように、画像表示部材と光透過性カバー部材とを貼り合わせる工程。
まず、図1に示すように、片面の周縁部に形成された遮光層1を有する光透過性カバー部材2を用意し、図2に示すように、光透過性カバー部材2の表面2aに、光硬化性樹脂組成物層3を形成する。
具体的には、遮光層1と光透過性カバー部材2の遮光層形成側表面2aとで形成される段差4を埋め込むように、遮光層1の厚さより厚く、遮光層1の表面も含め、光透過性カバー部材2の遮光層形成側表面2aの全面に、光硬化性樹脂組成物層3が平坦になるように形成することが好ましい。なお、光硬化性樹脂組成物層3は、必ずしも平坦になるように形成される必要はなく、光透過性カバー部材2と画像表示部材6とを貼り合せた場合に、図4に示すように、光硬化性樹脂組成物層3を硬化してなる光透過性硬化樹脂層5が、画像表示部材6と遮光層1、及び画像表示部材6と光透過性カバー部材2とから形成される間隙に埋め込まれるように形成すればよい。
光硬化性樹脂組成物層3を、紫外線等の活性エネルギー線を照射して硬化させて得られる、光透過性カバー部材2と画像表示部材6との間の光透過性硬化樹脂層の厚さは、好ましくは6μm以上、より好ましくは15μm以上、更に好ましくは20μm以上、特に好ましくは50μm以上、極めて好ましくは1.0×102μm以上であり、そして、好ましくは1.5×103μm以下、より好ましくは1.0×103μm以下、更に好ましくは5.0×102μm以下である。
これらの材料には、片面又は両面ハードコート処理、反射防止処理等を施すことができる。光透過性カバー部材2の厚さ、弾性等の物性は、使用目的に応じて適宜決定することができる。また、光透過性カバー部材2はタッチセンサー層、裸眼3D用視差バリア層等を含んでもよい。
遮光層1の厚さとしては、通常5μm~1.0×102μmであり、この厚さが段差4に相当する。
次に、図3に示すように、工程(I)で形成された光硬化性樹脂組成物層3に対し紫外線等の活性エネルギー線を照射して硬化させることにより光透過性硬化樹脂層5を形成する。
光透過性硬化樹脂層5の硬化率(ゲル分率)は、後述する実施例に示す方法により測定される値で、80%以上が好ましく、90%以上がより好ましく、95%以上が更に好ましい。
次に、図4に示すように、画像表示部材6に、光透過性カバー部材2をその光透過性硬化樹脂層5側から貼り合わせる。貼り合わせは、公知の圧着装置を用いて、例えば10℃~80℃の温度にて加圧することにより行うことができる。
また、画像表示部材の表面側に形成する方法も、工程(I)に含まれるが、その中の1例を表す下記説明内では、上記説明と区別するために工程(Ir)~(IIIr)と記載する。
まず、図5に示すように、画像表示部材6の表面に光硬化性樹脂組成物層3を形成する。
ここで、画像表示部材6に形成される光硬化性樹脂組成物層3は、必ずしも平坦になるように形成される必要はないが、その後の工程を安定的に行う観点からは、平坦であることが好ましい。
この場合、形成する光硬化性樹脂組成物層3の厚さは、好ましくは6μm以上、より好ましくは15μm以上、更に好ましくは20μm以上、特に好ましくは50μm以上、極めて好ましくは1.0×102μm以上であり、そして、好ましくは1.5×103μm以下、より好ましくは1.0×103μm以下、更に好ましくは5.0×102μm以下である。
次に、図6に示すように、工程(Ir)で形成された光硬化性樹脂組成物層3に対し紫外線等の活性エネルギー線を照射して硬化させることにより光透過性硬化樹脂層5を形成する。
光透過性硬化樹脂層5の硬化率(ゲル分率)は、80%以上が好ましく、90%以上がより好ましく、95%以上が更に好ましい。
次に、図7に示すように、画像表示部材6の光透過性硬化樹脂層5に、光透過性カバー部材2をその遮光層1側から貼り合わせる。
具体的には、光透過性硬化樹脂層5を形成した画像表示部材6と、遮光層1が形成された光透過性カバー部材2とを、光透過性硬化樹脂層5が、画像表示部材6と遮光層1、及び画像表示部材6と光透過性カバー部材2とから形成される間隙に埋め込まれるように、貼り合せることが好ましい。
貼り合わせは、公知の圧着装置を用いて、例えば10℃~80℃の温度にて加圧することにより行うことができる。
本発明の画像表示用装置は、本発明の光硬化性樹脂組成物の硬化物を有する。
本発明の画像表示用装置は、本発明の光硬化性樹脂組成物の硬化物を有するもであれば特に限定されないが、例えば、本発明の画像表示装置の製造方法により得られる画像表示装置が挙げられる。
<光硬化性樹脂組成物の粘度>
実施例及び比較例で得られた光硬化性樹脂組成物の25℃における粘度は、JIS Z 8803に基づいて測定した。具体的には、B型粘度計(東機産業(株)製、商品名:BL2)により測定した。なお、粘度計の校正は、JIS Z 8809-JS14000に基づいて行った。
本発明における硬化率(ゲル分率)とは、紫外線照射前の光硬化性樹脂組成物層中の(メタ)アクリロイル基の存在量に対する、紫外線照射後の(メタ)アクリロイル基の存在量から算出される(メタ)アクリロイル基の消費量の割合で定義される数値であり、この数値が大きい程、硬化が進行していることを示す。
具体的には、紫外線照射前の光硬化性樹脂組成物層のFT-IR測定チャートにおけるベースラインからの800cm-1~820cm-1の吸収ピーク高さ(X)と、後述する照射量で紫外線照射後の樹脂組成物層のFT-IR測定チャートにおけるベースラインからの800cm-1~820cm-1の吸収ピーク高さ(Y)と、2.0×104mJ/cm2紫外線照射後の樹脂組成物層のFT-IR測定チャートにおけるベースラインからの800cm-1~820cm-1の吸収ピーク高さ(Z)とを、以下の数式(1)に代入することにより算出した。
硬化率(%)={(X-Y)/(X-Z)}×100 (1)
膜厚700μmの表面研磨ガラス(旭硝子(株)製、商品名:AN100)(以下、「AN100」ともいう)上に膜厚200μmとなるように、実施例及び比較例で得られた光硬化性樹脂組成物を塗布した。次いで、光源としてメタルハライドランプ(アイグラフィックス(株)製、商品名:M04-L41)を備えた紫外線照射装置(アイグラフィックス(株)製、商品名:US5-X0401)を用いて紫外線を1.0×104mJ/cm2照射して光硬化性樹脂組成物を硬化させることにより、表面研磨ガラス上に光透過性硬化樹脂層が形成された光学特性評価用サンプルを作製した。なお、形成された光透過性硬化樹脂層の硬化率は100%であった。
前記サンプルの波長400nmにおける透過率、及びb*を、色相計(日本電色工業(株)社製、商品名:Σ90)を用いて、AN100をリファレンスとして測定し、下記の基準で評価した。
A:400nmの透過率が98%以上、かつb*の値が1.0以下
F:400nmの透過率が98%未満、又はb*の値が1.0超
まず、図8(a)に示すように、26mm(幅)×76mm(長さ)×0.2mm(厚さ)のサイズのガラスベース7上に偏光板8をラミネートしたガラス/偏光板積層体9を用意した。
次に、26mm(幅)×76mm(長さ)×0.2mm(厚さ)のガラスベース10上に、実施例及び比較例で得られた光硬化性樹脂組成物を塗布し、上記の紫外線照射装置を用いて紫外線を1.0×104mJ/cm2照射して光硬化性樹脂組成物層を硬化させることにより、片面に光透過性硬化樹脂層5が形成されたガラスベース10を用意した。
次いで、図8(b)に示すように、光透過性硬化樹脂層5が形成されたガラスベース10を、ガラスベース7とガラスベース10の短辺同士が平行となるように、光透過性硬化樹脂層5側から、ガラス/偏光板積層体9の偏光板8側に貼り合わせることによりガラス接合体を得た。
ガラス接合体の接着部分の面積は、26mm×20mm(520mm2)、光透過性硬化樹脂層5の厚さは0.2mmとした。貼り合わせ前に光照射を行った際の光透過性硬化樹脂層5の硬化率は100%であった。
得られたガラス接合体のガラスベース7を、その長辺が地面に対して垂直になり、且つガラスベース10と貼り合わせた箇所が鉛直方向下向きになるように固定し、次いで、ガラスベース10に500gの加重を鉛直方向下向きにかけ、24時間後の形状変化を観察し、下記の基準で評価した。
A:形状変化は確認されなかった。
F:ガラス/偏光板積層体9とガラスベース10との位置ずれが確認された。
26mm(幅)×76mm(長さ)×0.2mm(厚さ)のガラスベース7に偏光板8をラミネートしたガラス/偏光板積層体9上の偏光板8側に、実施例及び比較例で得られた光硬化性樹脂組成物を塗布し、上記の紫外線照射装置を用いて紫外線を1.0×104mJ/cm2照射して光硬化性樹脂組成物層を硬化させることにより、光透過性硬化樹脂層5が形成されたガラス/偏光板積層体9を用意した。
次いで、図8(b)に示すように、上記ガラス/偏光板積層体9を、26mm(幅)×76mm(長さ)×0.2mm(厚さ)のサイズのガラスベース10に、ガラスベース7とガラスベース10の短辺同士が平行となるように、光透過性硬化樹脂層5側から貼り合わせることによりガラス接合体を得た。
接着部分の面積は、26mm×20mm(520mm2)、光透過性硬化樹脂層5の厚さは0.2mmとした。貼り合わせ前に光照射を行った際の光透過性硬化樹脂層5の硬化率は100%であった。
得られたガラス接合体のガラスベース7を、その長辺が地面に対して垂直になり、且つガラスベース10と貼り合わせた箇所が鉛直方向下向きになるように固定し、次いで、ガラスベース10に500gの加重を鉛直方向下向きにかけ、24時間後の形状変化を観察し、下記の基準で評価した。
A:形状変化は確認されなかった。
F:ガラス/偏光板積層体9とガラスベース10との位置ずれが確認された。
上記光学特性評価用サンプルを30mm×30mmに切り出したサンプルの光透過性硬化樹脂層5を図9に示すように指触し、下記の基準で評価した。評価を行う際の温度は25±5℃とした。
A:液浮きは認められず、粘着質であり、指にサンプルが付着した。
F:サンプルが指に付着せず、サンプル表面に滲み出た液のみが指に付着した。
<(A)成分:(メタ)アクリロイル基を有する化合物>
「UC-102」:(株)クラレ製、上記一般式(1)で表される構造を有し、R1はメチル基、n=2(メタクリロイル基数=2)、Mn=17000
「UC-203」:(株)クラレ製、上記一般式(1)で表される構造を有し、R1はメチル基、n=3(メタクリロイル基数=3)、Mn=35000
「FA-513AS」:日立化成(株)製、ジシクロペンタニルアクリレ-ト
「FA-512M」:日立化成(株)製、ジシクロペンテニルオキシエチルメタクリレート
「ライトアクリレートIB-XA」:共栄社化学(株)製、イソボルニルアクリレート
「ライトエステルIB-XM」:共栄社化学(株)製、イソボルニルメタクリレート
<(B)成分:光重合開始剤>
「LUCIRIN TPO」:BASFジャパン(株)製、2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド
「IRGACURE 184」:BASFジャパン(株)製、1-ヒドロキシ-シクロヘキシル-フェニル-ケトン
「DAROCUR 1173」:BASFジャパン(株)製、2-ヒドロキシ-2-メチル-1-フェニル-プロパン-1-オン
「DAROCUR MBF」:BASFジャパン(株)製、フェニルグリオキシリックアシッドメチルエステル
<(C)成分:可塑剤>
「G-1000」:日本曹達(株)製、末端水酸基含有ポリブタジエン
「B-2000」:日本曹達(株)製、ポリブタジエン
「G-3000」:日本曹達(株)製、末端水酸基含有ポリブタジエン
<(D)成分:酸化防止剤>
「IRGANOX 1135」:BASFジャパン(株)製、ベンゼンプロパン酸,3,5-ビス(1,1-ジメチルエチル)-4-ヒドロキシ,C7-C9側鎖アルキルエステル
「AO-503」:(株)ADEKA製、ジ(トリデシル)3,3’-チオジプロピオネート
表1に示す配合組成(質量%)で、前述した原料(A)~(D)成分を配合し、90℃で30分間、加熱及び撹拌混合して、実施例1~13及び比較例1~4の光硬化性樹脂組成物を調製した。なお、表1中の、(A)~(D)成分についての数値は、光硬化性樹脂組成物総量に対する質量%を意味する。
2 光透過性カバー部材
2a 光透過性カバー部材の遮光層形成側表面
3 光硬化性樹脂組成物層
4 段差
5 光透過性硬化樹脂層
6 画像表示部材
7 ガラスベース
8 偏光板
9 ガラス/偏光板積層体
10 ガラスベース
11 表面研磨ガラス
12 染み出た液
13 指
Claims (15)
- (A)(メタ)アクリロイル基を有する化合物、(B)光重合開始剤、及び(C)可塑剤を含む光硬化性樹脂組成物であって、(B)光重合開始剤の含有量が、4.0~10質量%である光硬化性樹脂組成物。
- (A)(メタ)アクリロイル基を有する化合物として、(メタ)アクリロイル基を有するイソプレン重合体を含む、請求項1に記載の光硬化性樹脂組成物。
- (A)(メタ)アクリロイル基を有する化合物の含有量が、前記光硬化性樹脂組成物の総量に対して、10~90質量%である、請求項1又は2に記載の光硬化性樹脂組成物。
- (A)(メタ)アクリロイル基を有する化合物として、(A1)分子内に(メタ)アクリロイル基を有する重合体、及び(A2)分子内に1個の(メタ)アクリロイル基を有する単量体を含む、請求項1~3のいずれかに記載の光硬化性樹脂組成物。
- (A2)分子内に1個の(メタ)アクリロイル基を有する単量体が、ジシクロペンタニル基、ジシクロペンテニル基、又はイソボルニル基を有する(メタ)アクリレートの少なくとも1種を含み、前記光硬化性樹脂組成物の総量中の(A2)分子内に1個の(メタ)アクリロイル基を有する単量体の含有量が10~40質量%である、請求項4に記載の光硬化性樹脂組成物。
- (D)酸化防止剤を含む、請求項1~5のいずれかに記載の光硬化性樹脂組成物。
- (D)酸化防止剤が(D1)ヒンダードフェノール構造を有する化合物、及び(D2)チオエーテル構造を有する化合物を含む、請求項6に記載の光硬化性樹脂組成物。
- 25℃における粘度が5.0×102mPa・s~5.0×104mPa・sである、請求項1~7のいずれかに記載の光硬化性樹脂組成物。
- 画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、請求項1~8のいずれかに記載の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示用装置の製造方法であって、以下の工程(I)~(III)を有する製造方法であり、工程(II)において、光透過性硬化樹脂層の硬化率が80%以上となるように、光硬化性樹脂組成物に、活性エネルギー線を照射して硬化させる、画像表示用装置の製造方法。
工程(I):光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面、又は画像表示部材の遮光層側表面に層形成して、光硬化性樹脂組成物層を形成する工程。
工程(II):形成された光硬化性樹脂組成物層に対し、活性エネルギー線を照射して硬化させることにより光透過性硬化樹脂層を形成する工程。
工程(III):遮光層と光透過性硬化樹脂層とが画像表示部材と光透過性カバー部材との間に介在するように、画像表示部材と光透過性カバー部材とを貼り合わせる工程。 - 工程(I)において、光硬化性樹脂組成物層を、光透過性カバー部材の遮光層形成側表面に形成する、請求項9に記載の画像表示用装置の製造方法。
- 工程(I)において、光硬化性樹脂組成物層を、画像表示部材の表面に形成する、請求項9に記載の画像表示用装置の製造方法。
- 工程(III)において、光透過性硬化樹脂層を形成した画像表示部材と、遮光層が形成された光透過性カバー部材とを、光透過性硬化樹脂層が、画像表示部材と遮光層、及び画像表示部材と光透過性カバー部材とから形成される間隙に埋め込まれるように、貼り合せる、請求項11に記載の画像表示装置の製造方法。
- 工程(I)において、光硬化性樹脂組成物層を、画像表示用部材又は光透過性カバー部材の表面に、6μm~1.5×103μmの厚さで形成する、請求項9~12のいずれかに記載の画像表示用装置の製造方法。
- 画像表示部材が、液晶表示パネル、有機EL表示パネル、プラズマ表示パネル、タッチパネル、又は視差バリアパネルである、請求項9~13のいずれかに記載の画像表示用装置の製造方法。
- 請求項1~8のいずれかに記載の光硬化性樹脂組成物の硬化物を有する画像表示用装置。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014224969A (ja) * | 2013-04-26 | 2014-12-04 | 株式会社日本触媒 | 樹脂硬化物および表示装置 |
JP2017052864A (ja) * | 2015-09-09 | 2017-03-16 | 日立化成株式会社 | 光硬化性樹脂組成物、画像表示装置及びその製造方法 |
JP2018100403A (ja) * | 2016-12-20 | 2018-06-28 | 荒川化学工業株式会社 | 紫外線硬化型粘着剤、硬化物、及び粘着シート |
WO2020137401A1 (ja) * | 2018-12-26 | 2020-07-02 | デクセリアルズ株式会社 | 光硬化性樹脂組成物及び画像表示装置の製造方法 |
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Families Citing this family (4)
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US10696817B2 (en) * | 2016-07-06 | 2020-06-30 | Lg Chem, Ltd. | Plasticizer composition, resin composition and method of preparing the same |
JP6370967B1 (ja) * | 2017-06-28 | 2018-08-08 | デクセリアルズ株式会社 | 画像表示装置の製造方法、光硬化性樹脂組成物及び光透過性硬化樹脂層 |
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KR20210143985A (ko) | 2020-05-20 | 2021-11-30 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치 제조 방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006328094A (ja) * | 2005-05-23 | 2006-12-07 | Denki Kagaku Kogyo Kk | 組成物及びそれを用いる部材の仮固定方法 |
JP2008200857A (ja) * | 2007-02-16 | 2008-09-04 | Tokyo Ohka Kogyo Co Ltd | 感光性組成物、及び電極形成用印刷原版 |
JP2012067314A (ja) * | 2011-10-27 | 2012-04-05 | Denki Kagaku Kogyo Kk | 表面保護用硬化性組成物 |
JP2012144634A (ja) * | 2011-01-12 | 2012-08-02 | Jsr Corp | 光学樹脂および光学樹脂層の製造方法、光学樹脂用組成物、ならびに画像表示装置 |
JP2013124357A (ja) * | 2011-12-16 | 2013-06-24 | Hitachi Chemical Co Ltd | 液状硬化性樹脂組成物、これを用いた画像表示用装置の製造方法、及び画像表示用装置 |
WO2013115250A1 (ja) * | 2012-02-03 | 2013-08-08 | 昭和電工株式会社 | 光硬化性透明粘着シート用組成物、光学用粘着シート |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05138820A (ja) | 1991-11-22 | 1993-06-08 | Denki Kagaku Kogyo Kk | 積層体およびその成型体 |
JP2009186957A (ja) | 2007-04-09 | 2009-08-20 | Sony Chemical & Information Device Corp | 樹脂組成物及び表示装置 |
TWI485214B (zh) | 2008-09-05 | 2015-05-21 | Kyoritsu Chemical Co Ltd | And a photohardenable resin composition for bonding an optical functional material |
-
2014
- 2014-09-26 KR KR1020167006281A patent/KR20160064082A/ko not_active Application Discontinuation
- 2014-09-26 CN CN201480052549.3A patent/CN105579482A/zh active Pending
- 2014-09-26 US US15/025,621 patent/US20160237281A1/en not_active Abandoned
- 2014-09-26 WO PCT/JP2014/075613 patent/WO2015046422A1/ja active Application Filing
- 2014-09-26 JP JP2015539379A patent/JPWO2015046422A1/ja active Pending
- 2014-09-30 TW TW103133950A patent/TW201518380A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006328094A (ja) * | 2005-05-23 | 2006-12-07 | Denki Kagaku Kogyo Kk | 組成物及びそれを用いる部材の仮固定方法 |
JP2008200857A (ja) * | 2007-02-16 | 2008-09-04 | Tokyo Ohka Kogyo Co Ltd | 感光性組成物、及び電極形成用印刷原版 |
JP2012144634A (ja) * | 2011-01-12 | 2012-08-02 | Jsr Corp | 光学樹脂および光学樹脂層の製造方法、光学樹脂用組成物、ならびに画像表示装置 |
JP2012067314A (ja) * | 2011-10-27 | 2012-04-05 | Denki Kagaku Kogyo Kk | 表面保護用硬化性組成物 |
JP2013124357A (ja) * | 2011-12-16 | 2013-06-24 | Hitachi Chemical Co Ltd | 液状硬化性樹脂組成物、これを用いた画像表示用装置の製造方法、及び画像表示用装置 |
WO2013115250A1 (ja) * | 2012-02-03 | 2013-08-08 | 昭和電工株式会社 | 光硬化性透明粘着シート用組成物、光学用粘着シート |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014224969A (ja) * | 2013-04-26 | 2014-12-04 | 株式会社日本触媒 | 樹脂硬化物および表示装置 |
US10947326B2 (en) | 2015-07-29 | 2021-03-16 | Showa Denko Materials Co., Ltd. | Adhesive composition, cured article, semiconductor device, and production method for same |
JP2017052864A (ja) * | 2015-09-09 | 2017-03-16 | 日立化成株式会社 | 光硬化性樹脂組成物、画像表示装置及びその製造方法 |
JP2018100403A (ja) * | 2016-12-20 | 2018-06-28 | 荒川化学工業株式会社 | 紫外線硬化型粘着剤、硬化物、及び粘着シート |
WO2020137401A1 (ja) * | 2018-12-26 | 2020-07-02 | デクセリアルズ株式会社 | 光硬化性樹脂組成物及び画像表示装置の製造方法 |
JP2020106830A (ja) * | 2018-12-26 | 2020-07-09 | デクセリアルズ株式会社 | 光硬化性樹脂組成物及び画像表示装置の製造方法 |
KR20210090235A (ko) * | 2018-12-26 | 2021-07-19 | 데쿠세리아루즈 가부시키가이샤 | 광경화성 수지 조성물 및 화상 표시 장치의 제조 방법 |
CN113195571A (zh) * | 2018-12-26 | 2021-07-30 | 迪睿合株式会社 | 光固化性树脂组合物以及图像显示装置的制造方法 |
JP7319546B2 (ja) | 2018-12-26 | 2023-08-02 | デクセリアルズ株式会社 | 光硬化性樹脂組成物及び画像表示装置の製造方法 |
KR102586595B1 (ko) | 2018-12-26 | 2023-10-10 | 데쿠세리아루즈 가부시키가이샤 | 광경화성 수지 조성물 및 화상 표시 장치의 제조 방법 |
CN113195571B (zh) * | 2018-12-26 | 2023-12-19 | 迪睿合株式会社 | 光固化性树脂组合物以及图像显示装置的制造方法 |
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TW201518380A (zh) | 2015-05-16 |
KR20160064082A (ko) | 2016-06-07 |
CN105579482A (zh) | 2016-05-11 |
US20160237281A1 (en) | 2016-08-18 |
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