WO2015012405A1 - Boîtier de logement d'élément et structure de montage - Google Patents

Boîtier de logement d'élément et structure de montage Download PDF

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Publication number
WO2015012405A1
WO2015012405A1 PCT/JP2014/069778 JP2014069778W WO2015012405A1 WO 2015012405 A1 WO2015012405 A1 WO 2015012405A1 JP 2014069778 W JP2014069778 W JP 2014069778W WO 2015012405 A1 WO2015012405 A1 WO 2015012405A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
external connection
electrode terminal
circuit board
input
Prior art date
Application number
PCT/JP2014/069778
Other languages
English (en)
Japanese (ja)
Inventor
真広 辻野
芳規 川頭
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2015528367A priority Critical patent/JP6082114B2/ja
Publication of WO2015012405A1 publication Critical patent/WO2015012405A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes

Abstract

　Dans un boîtier de logement d'élément selon un mode de réalisation de la présente invention, une borne d'entrée/sortie comprend une unité de connexion externe dans laquelle une borne d'électrode à laquelle un signal de courant alternatif est appliqué et une borne d'électrode portée à un potentiel de référence sont agencées à la suite dans une direction donnée alignée avec un corps de châssis dans une partie pénétrante. La borne d'électrode portée au potentiel de référence est positionnée à un emplacement plus proche de la section latérale de l'unité de connexion externe que la borne d'électrode à laquelle le signal de courant alternatif est appliqué. L'unité de connexion externe comporte une partie coupée formée dans la section latérale de l'unité de connexion externe, et une couche conductrice formée sur la surface intérieure de la partie coupée et électriquement connectée à la borne d'électrode portée au potentiel de référence.
PCT/JP2014/069778 2013-07-26 2014-07-28 Boîtier de logement d'élément et structure de montage WO2015012405A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015528367A JP6082114B2 (ja) 2013-07-26 2014-07-28 素子収納用パッケージおよび実装構造体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013155483 2013-07-26
JP2013-155483 2013-07-26
JP2013-237562 2013-11-18
JP2013237562 2013-11-18

Publications (1)

Publication Number Publication Date
WO2015012405A1 true WO2015012405A1 (fr) 2015-01-29

Family

ID=52393436

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/069778 WO2015012405A1 (fr) 2013-07-26 2014-07-28 Boîtier de logement d'élément et structure de montage

Country Status (2)

Country Link
JP (1) JP6082114B2 (fr)
WO (1) WO2015012405A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135302A (ja) * 2016-01-29 2017-08-03 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2019186455A (ja) * 2018-04-13 2019-10-24 住友電気工業株式会社 光受信モジュール用パッケージ
JPWO2020179937A1 (fr) * 2019-03-07 2020-09-10

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319650A (ja) * 2003-04-14 2004-11-11 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2007005636A (ja) * 2005-06-24 2007-01-11 Kyocera Corp 入出力端子および電子部品収納用パッケージならびに電子装置
WO2009057691A1 (fr) * 2007-10-30 2009-05-07 Kyocera Corporation Borne de connexion, boîtier l'utilisant et dispositif électronique
WO2009096542A1 (fr) * 2008-01-30 2009-08-06 Kyocera Corporation Borne de connexion, boîtier utilisant ladite borne et dispositif électronique

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103329260B (zh) * 2011-07-26 2016-05-11 京瓷株式会社 半导体元件收纳用封装体、具备其的半导体装置及电子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319650A (ja) * 2003-04-14 2004-11-11 Kyocera Corp 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2007005636A (ja) * 2005-06-24 2007-01-11 Kyocera Corp 入出力端子および電子部品収納用パッケージならびに電子装置
WO2009057691A1 (fr) * 2007-10-30 2009-05-07 Kyocera Corporation Borne de connexion, boîtier l'utilisant et dispositif électronique
WO2009096542A1 (fr) * 2008-01-30 2009-08-06 Kyocera Corporation Borne de connexion, boîtier utilisant ladite borne et dispositif électronique

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135302A (ja) * 2016-01-29 2017-08-03 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2019186455A (ja) * 2018-04-13 2019-10-24 住友電気工業株式会社 光受信モジュール用パッケージ
JP7020261B2 (ja) 2018-04-13 2022-02-16 住友電気工業株式会社 光受信モジュール用パッケージ
JPWO2020179937A1 (fr) * 2019-03-07 2020-09-10
WO2020179937A1 (fr) * 2019-03-07 2020-09-10 京セラ株式会社 Carte de câblage, boîtier pour composant électronique et dispositif électronique
JP7145311B2 (ja) 2019-03-07 2022-09-30 京セラ株式会社 配線基板、電子部品用パッケージおよび電子装置

Also Published As

Publication number Publication date
JPWO2015012405A1 (ja) 2017-03-02
JP6082114B2 (ja) 2017-02-15

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