WO2015088028A1 - Boîtier de réception d'élément et structure de montage - Google Patents

Boîtier de réception d'élément et structure de montage Download PDF

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Publication number
WO2015088028A1
WO2015088028A1 PCT/JP2014/083050 JP2014083050W WO2015088028A1 WO 2015088028 A1 WO2015088028 A1 WO 2015088028A1 JP 2014083050 W JP2014083050 W JP 2014083050W WO 2015088028 A1 WO2015088028 A1 WO 2015088028A1
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WO
WIPO (PCT)
Prior art keywords
flat portion
substrate
lead terminal
storage package
element storage
Prior art date
Application number
PCT/JP2014/083050
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English (en)
Japanese (ja)
Inventor
芳規 川頭
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2015088028A1 publication Critical patent/WO2015088028A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an element storage package capable of mounting an element and a mounting structure on which the element is mounted.
  • Such an element storage package includes a substrate, a frame disposed on the upper surface of the substrate so as to surround the mounting region, a plurality of conductors led from the periphery of the mounting region to the lower surface of the substrate, and connected to these conductors. And a plurality of lead terminals arranged in a certain direction on the lower surface of the substrate.
  • the element storage package has a notch at the tip portion of the lead terminal in a region including a portion immediately below or near the portion immediately below the dielectric base as the substrate.
  • the cutout portion forms an air layer that can reduce the capacitive coupling between the lead terminal and the grounding conductor portion of the external circuit board when the element housing package is mounted on the external circuit board. And, the mismatch of characteristic impedance of the element storage package can be reduced, and the high frequency transmission characteristic can be improved.
  • the element storage package as described above, for example, when the element storage package is mounted on an external substrate, a relatively strong force may be applied to the lead terminals. If the lead terminal is deformed by this force, the electrical signal applied to the lead terminal may be affected. For example, when a high-frequency electrical signal is applied to the lead terminal, the frequency characteristics of the mounting structure are affected. There was a problem that there was a possibility of giving.
  • the present invention has been made in view of the above-described problems, and provides an element storage package that can reduce deformation of a lead terminal and has excellent high-frequency characteristics, and a mounting structure including the element storage package.
  • the purpose is to do.
  • An element storage package includes a substrate having a mounting area for mounting an element on an upper surface, a frame body surrounding the mounting area and disposed on the upper surface of the substrate, and a periphery of the mounting area A plurality of conductors led to the lower surface of the substrate and arranged in a certain direction, and a plurality of lead terminals connected to the plurality of conductors and arranged in a certain direction on the lower surface of the substrate, wherein the lead terminals are A first flat portion connected to the conductor led to the lower surface of the substrate, a second flat portion having a height position lower than that of the first flat portion, the first flat portion, and the second flat portion. And the inclined portion has a protruding portion positioned on the outer side in the fixed direction as compared with both ends of the first flat portion and both ends of the second flat portion. .
  • the element storage package according to the present invention can reduce deformation of the lead terminals and is excellent in high frequency characteristics.
  • FIG. 1 is a perspective view of a device housing package and a mounting structure according to an embodiment of the present invention with a lid removed.
  • FIG. FIG. 2 is a perspective view of the element storage package according to the embodiment of the present invention with the lid removed.
  • FIG. 3 is an exploded perspective view of the element storage package according to the embodiment of the present invention with the lid removed. It is the top view which looked at the element storage package of FIG. 2 from the upper surface of the board
  • FIG. 7 is an enlarged plan view of a portion X in FIG. 6. It is a top view which shows one lead terminal. It is the perspective view which showed the state which connected the lead terminal to the external substrate, and abbreviate
  • the mounting structure 1 includes an element storage package 2 and an element 3 disposed in a mounting region R of the element storage package 2.
  • Element 3 is mounted on pedestal 3a.
  • the pedestal 3 a is disposed in the mounting region R inside the element storage package 2.
  • the pedestal 3a mounts the element 3 and can adjust the height position of the element 3.
  • the pedestal 3a is made of an insulating material, and electrical wiring that is electrically connected to the element 3 is formed on the upper surface of the pedestal 3a.
  • Examples of the element 3 include active elements such as semiconductor elements, transistors, laser diodes, photodiodes, or thyristors, or passive elements such as resistors, capacitors, piezoelectric elements, crystal resonators, and ceramic oscillators.
  • active elements such as semiconductor elements, transistors, laser diodes, photodiodes, or thyristors
  • passive elements such as resistors, capacitors, piezoelectric elements, crystal resonators, and ceramic oscillators.
  • the element storage package 2 shown in FIG. 1 and FIG. 2 is connected to the substrate 4, the frame 5, and the periphery of the mounting region R of the substrate 4 to the lower surface of the substrate 4 to connect the inside and outside of the element storage package. And conductors.
  • the element storage package 2 is suitable for mounting and functioning the element 3 corresponding to high breakdown voltage, high current, high power, high speed and high frequency.
  • a semiconductor element is mounted as an example of the element 3.
  • the element storage package 2 may further include an input / output terminal 6 made of an insulating material.
  • the conductor is provided through the input / output terminal 6 and has a function of connecting the inside and outside of the element storage package 2.
  • description will be made by taking as an example the element storage package 2 including the input / output terminals 6.
  • the conductor may be formed on the substrate 4 or the frame 5.
  • substrate 4 has the mounting area
  • the substrate 4 is a rectangular metal plate, and is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.
  • the thermal conductivity of the substrate 4 can be set, for example, in the range of 15 W / (m ⁇ K) to 450 W / (m ⁇ K).
  • the thermal expansion coefficient of the substrate 4 can be set in the range of 3 ⁇ 10 ⁇ 6 / K to 28 ⁇ 10 ⁇ 6 / K, for example.
  • the substrate 4 is provided with a step 4c in which the height of the upper surface of the substrate 4 is lowered.
  • the shape of the step 4 c corresponds to the shape of the region where the lead terminal 62 is not connected in the lower part of the laminated structure 61.
  • a metal layer such as nickel or gold is formed on the surface of the substrate 4 by using an electroplating method or an electroless plating method.
  • the thickness of the metal layer can be set in the range of 0.5 ⁇ m to 9 ⁇ m, for example.
  • the frame body 5 is disposed on the upper surface of the substrate 4 so as to surround the mounting region R.
  • the frame 5 is bonded to the upper surface of the substrate 4 via a bonding member such as a brazing material.
  • a plurality of through holes T are formed in the frame body 5.
  • the input / output terminal 6 is inserted into one of the through holes T.
  • a cylindrical member 5 c that allows light from the optical fiber to pass to the inside of the frame 5 is inserted and fixed in one through hole T among the plurality of through holes T.
  • Examples of the material of the frame 5 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, or alloys containing these metal materials.
  • the thermal conductivity of the frame 5 is set in a range of 15 W / (m ⁇ K) to 450 W / (m ⁇ K), for example.
  • the thermal expansion coefficient of the frame 5 can be set, for example, in the range of 3 ⁇ 10 ⁇ 6 / K to 28 ⁇ 10 ⁇ 6 / K.
  • the input / output terminal 6 has a function of electrically connecting the inside and outside of the frame 5 or the substrate 4.
  • the input / output terminal 6 is fixed so as to be inserted into the frame 5 and the through hole T of the substrate 4. That is, as shown in FIGS. 2 to 4, a part of the input / output terminal 6 is located inside the frame 5, and the other part of the input / output terminal 6 is located outside the frame 5. ing.
  • the input / output terminal 6 includes a laminated structure 61 and conductors 61a and 61b, and a plurality of lead terminals 62 are connected thereto.
  • the laminated structure 61 has a plurality of conductors 61a and 61b inside the laminated body.
  • the laminated structure 61 is formed by laminating a plurality of dielectric layers.
  • the dielectric layer is an insulating layer made of a dielectric.
  • the dielectric include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic.
  • the conductors 61a and 61b include a signal conductor 61a for signals and a ground conductor 61b set to the ground potential.
  • the conductors 61a and 61b are formed of a conductive material. Examples of the conductive material include metal materials such as tungsten, molybdenum, and manganese, or alloy materials containing these metal materials.
  • the signal conductor 61a is formed from the upper part 611 of the multilayer structure 61 to the lower part 612 so as not to contact the ground conductor 61b of the ground conductor layer.
  • the conductors 61a and 61b have a plurality of terminal portions in the upper part 611 of the multilayer structure 61 and the lower part 612 of the multilayer structure 61.
  • the standing wall portion 63 is disposed on the upper portion 611 of the laminated structure 61.
  • the alternate long and short dash line I shown in FIG. 3 is an imaginary line that indicates a break between the stacked body 61 (laminated structure 61) and the standing wall portion 63.
  • the plurality of conductors 61 a and 61 b have terminal portions arranged on the upper part 611 and the lower part 612 of the laminated structure 61.
  • FIG. 5 is a bottom view of the element storage package 2. As shown in FIGS. 3 and 5, the terminal portions of the conductors 61a and 61b located on the upper portion 611 of the multilayer structure 61 are arranged in a certain direction. Similarly, the terminal portions of the conductors 61a and 61b located in the lower portion 612 of the multilayer structure 61 are also arranged in a certain direction.
  • Terminal portions of the plurality of conductors 61a and 61b located on the upper part 611 of the laminated structure 61 are located on the inner side of the frame 5, and are formed on the upper surface of the element 3 or the pedestal 3a by, for example, bonding wires, It is electrically connected to the electrical wiring connected to the element 3. Thereby, the element 3 is electrically connected to the input / output terminal 6.
  • the terminal portions of the plurality of conductors 61a and 61b positioned at the lower portion 612 of the laminated structure 61 are positioned outside the frame body 5 and are connected to a plurality of conductive bonding materials such as solder and silver brazing material. It is connected to the lead terminal 62 (62a, 62b).
  • the lead terminal 62 is joined to the laminated structure 61.
  • Each lead terminal 62 is connected to each conductor 61a, 61b located in the lower part 612 of the laminated structure 61.
  • the lead terminal 62 is connected to the conductors 61a and 61b via a conductive bonding material such as solder or silver brazing material.
  • Some signal lead terminals 62a among the plurality of lead terminals 62 have a function of supplying a signal voltage to the laminated structure 61 from an external electronic device or the like. That is, a signal voltage is applied to the signal lead terminal 62a.
  • the signal lead terminal 62a transmits a high-frequency signal voltage applied from an external electronic device or the like to the element 3 via the laminated structure 61 and the pedestal 3a.
  • the other ground lead terminal 62b has a function of supplying a ground potential to the laminated structure 61 from an external electronic device or the like.
  • the signal lead terminals 62a to which the signal voltage is applied and the ground lead terminals 62b set to the ground potential are alternately arranged in a certain direction.
  • the width of the ground lead terminal 62b set to the ground potential is larger than the width of the signal lead terminal 62a to which the signal voltage is applied.
  • the lead terminal 62 includes a first flat portion 621 connected to the lower portion 612 of the multilayer structure 61, a second flat portion 622 that is lower in height than the first flat portion 621, and the first flat portion 621. And an inclined portion 623 that is inclined by connecting the second flat portion 622. That is, the lead terminal 62 is bent up and down between one end and the other end in the extending direction.
  • the lead terminal 62 is bent so that the height position of the lower surface of the second flat portion 622 is the same as the height position of the lower surface of the substrate 4 with the input / output terminal 6 fitted in the step 4c.
  • both the substrate 4 and the lead terminals 62 are mounted flat on the external substrate 9.
  • the element storage package 2 can be connected so as not to be inclined with respect to the external substrate 9 while increasing the area to be fixed to the external substrate 9. As a result, the element storage package 2 can be stably and firmly connected to the external substrate 9.
  • the inclined portion 623 of the lead terminal 62 has protrusions 623a located outside the both ends of the first flat portion 621 and the both ends of the second flat portion 622 in a certain direction (the arrangement direction of the lead terminals 62). ing. That is, the protruding portion 623a is located outside the first flat portion 621 and the second flat portion 622.
  • the inclined portion 623 in the ground lead terminal 62b set to the ground potential, the inclined portion 623 has the protruding portion 623a, but the present invention is not limited to this. That is, the signal lead terminal 62a to which the signal voltage is applied may have the protruding portion 623a on the inclined portion 623. Further, in both the ground lead terminal 62b set to the ground potential and the signal lead terminal 62a to which the signal voltage is applied, the inclined portion 623 may have the protruding portion 623a.
  • the width W 622 of the width W 621 and a second flat portion 622 of the first flat portion 621 is set to, for example, 0.3 mm ⁇ 3 mm.
  • the width W 623 of the inclined portion 623 is set to, for example, 0.5 mm to 5 mm including the protruding portion 623a.
  • the outer periphery of the protrusion 623 has an arc-shaped portion. This makes it difficult for stress to concentrate on the inclined portion 623 of the lead terminal 62.
  • the corners of the protrusions 623 are arcuate, it is difficult for stress to concentrate on the corners of the protrusions 623.
  • the thickness of the first flat portion 621, the thickness of the second flat portion 622, and the thickness of the inclined portion 623 are set to 0.2 mm to 2 mm.
  • the thickness of the first flat portion 621, the thickness of the second flat portion 622, and the thickness of the inclined portion 623 are set to be the same, but the present invention is not limited to this.
  • the thickness of the inclined portion 623 may be larger than the thickness of the first flat portion 621 and the thickness of the second flat portion 622.
  • the inclined portion 623 may increase both the thickness of the protruding portion 623a and the thickness of the other portion, or may increase the thickness of the other portion without changing the thickness of the protruding portion 623a.
  • the material of the lead terminal 62 includes a conductive material, and the conductive material is, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel or cobalt, or an alloy containing these metal materials.
  • a seal ring 7 is disposed via a joining member such as a brazing material.
  • the seal ring 7 has a function of connecting the frame body 5 and the lid body 8.
  • the seal ring 7 is made of a metal such as copper, tungsten, iron, nickel, or cobalt having excellent seam weldability with the lid 8 or an alloy containing a plurality of these metals.
  • the thermal expansion coefficient of the seal ring 7 can be set, for example, in the range of 4 ⁇ 10 ⁇ 6 / K to 16 ⁇ 10 ⁇ 6 / K.
  • the lid 8 has a function of hermetically sealing the recessed area surrounded by the substrate 4 and the frame 5.
  • the lid 8 is disposed on the upper surface of the seal ring 7 so as to cover the element 3 located inside the frame 5.
  • the region surrounded by the frame body 5 is filled with an inert gas such as a vacuum state or nitrogen gas, and the lid body 8 is placed on the seal ring 7 and joined to form a substrate 4 and the frame body 5.
  • the enclosed recessed area can be hermetically sealed.
  • the lid 8 is placed on the seal ring 7 in a predetermined atmosphere, for example, and joined to the seal ring 7 by performing seam welding.
  • the lid 8 is, for example, a metal such as copper, tungsten, iron, nickel or cobalt, or an alloy containing a plurality of these metals, or an aluminum oxide sintered body, a mullite sintered body, or a silicon carbide sintered body. It consists of ceramics such as an aluminum nitride sintered body, a silicon nitride sintered body, or glass ceramics.
  • the inclined portion 623 of the lead terminal 62 has protrusions 623 a positioned outside both ends of the first flat portion 621 and both ends of the second flat portion 622 in the arrangement direction of the lead terminals 62. is doing.
  • the lead terminal 62 when an external force is applied to the lead terminal 62 when the element storage package 2 is mounted on the external substrate 9 or the like, the lead terminal 62 may be deformed by the external force.
  • the inclined portion 623 of the lead terminal 62 since the inclined portion 623 of the lead terminal 62 is not fixed to the laminated body 61a, and supports the second flat portion 622, the inclined portion 623 of the lead terminal 62 includes the first flat portion 621 and Since stress tends to concentrate as compared with the second flat portion 622, the inclined portion 623 of the lead terminal 62 is likely to be deformed.
  • the inclined portion 623 of the lead terminal 62 has the protruding portions 623a located outside both ends of the first flat portion 621 and both ends of the second flat portion 622, the width of the inclined portion 623 is reduced.
  • W 623 is larger than the width W 622 of the width W 621 and a second flat portion 622 of the first flat portion 621, the strength of the inclined portion 623 is increased. This makes it difficult for the inclined portion 623 to be deformed, so that the influence on the electrical signal applied to the lead terminal 62 can be reduced.
  • the external substrate 9 has a wiring conductor disposed on a dielectric.
  • the high frequency impedance along the first flat portion 621, the inclined portion 623, and the second flat portion 622 of the signal lead terminal 62 a is large at the inclined portion 623. There is a tendency to change.
  • the laminated structure 61 or the external substrate 9 that is a dielectric exists in contact with the signal lead terminal 62a and the ground lead terminal 62b, whereas the inclined portion 623 The portion is surrounded by air, and the capacitance component between the signal lead terminal 62a and the ground lead terminal 62b decreases. Therefore, the high frequency impedance changes at the inclined portion 623.
  • the protruding portion 623a is present on the inclined portion 623 of the signal lead terminal 62a or the ground lead terminal 62b, the capacitance component between the signal lead terminal 62a and the ground lead terminal 62b can be increased. The degree of change can be reduced.
  • the protrusion 623a is preferably provided on the ground lead terminal 62b side as shown in FIGS. If the signal lead terminal 62a has a constant width, the influence on the high frequency impedance can be reduced.
  • the bonding material B such as solder for bonding the second flat portion 622 and the external substrate 9 can form a meniscus between the protruding portion 623a. Thereby, the bonding strength between the lead terminal 62 and the external substrate 9 can be further improved.
  • the excessive bonding material B is accumulated between the inclined portion 623 and the protruding portion 623a and the external substrate 9.
  • the change in the electrical characteristics between the adjacent lead terminals 62 due to the excessive bonding material B being disposed around the second flat portion 622 is suppressed, and the mounting structure 1 has the desired frequency characteristics. Can be realized.
  • the wiring conductor provided on the external substrate 9 is provided so as to overlap the second flat portion 622 and the inclined portion 623 along the length direction of the lead terminal 62 when the element storage package 2 is viewed in plan. Also good. This makes it easier for the bonding material B such as solder to join the wiring conductors of the second flat portion 622 and the external substrate 9 to form a meniscus between the protruding portion 623a. Further, when the second flat portion 622 and the external substrate 9 are bonded, the excessive bonding material B is easily collected between the inclined portion 623, the protruding portion 623a, and the wiring conductor. As a result, it is possible to improve the strength of the inclined portion 623 whose surroundings are in the air, and to suppress the deformation of the lead terminal 62.
  • the input / output terminal 6 can maintain desired electrical characteristics.
  • the protruding portion 623 a of the inclined portion 623 is located in the entire region between the first flat portion 621 and the second flat portion 622. That is, in the entire region between the first flat portion 621 and the second flat portion 622, both ends of the inclined portion 623 are located outside both ends of the first flat portion 621 and both ends of the second flat portion 622. Thereby, the strength of the inclined portion 623 can be improved, so that the deformation of the lead terminal 62 can be suppressed. Changes in electrical characteristics are also suppressed.
  • the substrate 4, the frame 5, the cylindrical member 5c, the lead terminal 62, and the seal ring 7 are produced.
  • the substrate 4, the frame body 5, the lead terminal 62 and the seal ring 7 are metal processing such as conventionally known rolling processing, punching processing, cutting processing, etc. for an ingot obtained by casting a molten metal material into a mold and solidifying it. By using the method, it is produced in a predetermined shape.
  • the input / output terminal 6 having the laminated structure 61 and the lead terminal 62 is produced.
  • an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a mixture into a sheet, thereby preparing a plurality of ceramic green sheets.
  • raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide
  • the shape of the predetermined input / output terminal 6 is obtained, and a plurality of green sheets are electrically connected to each other by punching at predetermined positions of the ceramic green sheets. A through hole is formed.
  • a refractory metal powder such as tungsten or molybdenum, which is a raw material for the conductors 61a and 61b, is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to prepare a metal paste. Then, this metal paste is printed on a predetermined position of the unfired ceramic green sheet. At this time, the metal paste can be filled in the through holes by printing the metal paste on the through hole portions that penetrate the upper and lower surfaces of the ceramic green sheet.
  • the ceramic green sheet is formed so that the ceramic green sheet has a predetermined input / output terminal 6 shape, and the through holes filled with the metal paste formed on the ceramic green sheet are arranged in the vertical direction.
  • a plurality of layers are stacked.
  • the multilayer structure 61 having the terminal portions of the conductors 61a and 61b on the upper part 611 and the lower part 612 can be produced by simultaneously firing the ceramic green sheet laminate at a predetermined temperature and cutting it into a predetermined shape.
  • the input / output terminal 6 can be produced by joining the lead terminal 62 (62a, 62b) to the conductors 61a, 61b formed on the lower portion 612 of the laminated structure 61 with a brazing material.
  • the cylindrical member 5c is fitted and joined to the through hole T of the frame body 5 through the brazing material.
  • substrate 4, the frame 5, the input-output terminal 6, and the seal ring 7 are joined via a brazing material. In this way, the element storage package 2 can be manufactured.
  • the pedestal 3a and the element 3 are prepared. And the base 3a is arrange
  • the element 3 is mounted on the pedestal 3a, and the electrode of the element 3 and the wiring conductor of the input / output terminal 6 in the frame 5 are electrically connected via a bonding wire.
  • the mounting structure 1 can be manufactured by attaching the lid 8 to the element storage package 2.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

L'invention porte sur un boîtier de réception d'élément (2) qui comprend les éléments suivants : une première partie plate (621) dans laquelle une pluralité de bornes de conducteur (62) sont connectées à la surface inférieure (4a) d'un substrat (4) ; une seconde partie plate (622) dont l'emplacement de hauteur est inférieur à celui de la première partie plate (621) ; et une partie inclinée (623) qui est inclinée et connecte la première partie plate (621) et la seconde partie plate (622). La partie inclinée (623) possède, dans une direction donnée, une partie en saillie (623a) qui est positionnée davantage vers l'extérieur que les deux extrémités de la partie plate (621) et les deux extrémités de la seconde partie plate (622). En raison de cette configuration, il est possible de réduire une déformation d'une borne de conducteur et d'améliorer des caractéristiques de fréquence élevées.
PCT/JP2014/083050 2013-12-13 2014-12-12 Boîtier de réception d'élément et structure de montage WO2015088028A1 (fr)

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JP2013-258018 2013-12-13
JP2013258018 2013-12-13

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CN109417054A (zh) * 2016-06-27 2019-03-01 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
WO2022004644A1 (fr) * 2020-06-29 2022-01-06 京セラ株式会社 Substrat de câblage et dispositif électronique
EP4191657A4 (fr) * 2020-08-03 2024-05-01 Nippon Telegraph And Telephone Corporation Emballage et son procédé de fabrication

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JP2010177364A (ja) * 2009-01-28 2010-08-12 Nippon Telegr & Teleph Corp <Ntt> 半導体パッケージおよびその実装方法
WO2013099936A1 (fr) * 2011-12-27 2013-07-04 京セラ株式会社 Élément d'entrée/sortie, boîtier permettant de loger un composant électronique et appareil électronique

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Publication number Priority date Publication date Assignee Title
JPH07211849A (ja) * 1994-01-19 1995-08-11 Sony Corp リードフレーム
JP2003243552A (ja) * 2002-02-21 2003-08-29 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2010177364A (ja) * 2009-01-28 2010-08-12 Nippon Telegr & Teleph Corp <Ntt> 半導体パッケージおよびその実装方法
WO2013099936A1 (fr) * 2011-12-27 2013-07-04 京セラ株式会社 Élément d'entrée/sortie, boîtier permettant de loger un composant électronique et appareil électronique

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Publication number Priority date Publication date Assignee Title
CN109417054A (zh) * 2016-06-27 2019-03-01 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
EP3477693A4 (fr) * 2016-06-27 2019-06-12 NGK Electronics Devices, Inc. Substrat céramique haute fréquence et boîtier de logement d'élément semi-conducteur haute fréquence
US10790245B2 (en) 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
CN109417054B (zh) * 2016-06-27 2022-11-15 Ngk电子器件株式会社 高频用陶瓷基板及高频用半导体元件收纳封装体
WO2022004644A1 (fr) * 2020-06-29 2022-01-06 京セラ株式会社 Substrat de câblage et dispositif électronique
EP4191657A4 (fr) * 2020-08-03 2024-05-01 Nippon Telegraph And Telephone Corporation Emballage et son procédé de fabrication

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