WO2014178639A1 - 연성인쇄회로기판 및 그 제조 방법 - Google Patents
연성인쇄회로기판 및 그 제조 방법 Download PDFInfo
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- WO2014178639A1 WO2014178639A1 PCT/KR2014/003831 KR2014003831W WO2014178639A1 WO 2014178639 A1 WO2014178639 A1 WO 2014178639A1 KR 2014003831 W KR2014003831 W KR 2014003831W WO 2014178639 A1 WO2014178639 A1 WO 2014178639A1
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- circuit pattern
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- coating layer
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- forming
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Definitions
- the present invention relates to a flexible printed circuit board and a method of manufacturing the same, and more particularly to a flexible printed circuit board having a protective coating layer for protecting a circuit pattern and a method of manufacturing the same.
- Flexible printed circuit boards are flexible substrates that can be flexibly formed by forming circuit patterns on thin insulating films, and are widely used in portable electronic devices and display devices that require flexibility and flexibility in mounting and mounting.
- the flexible printed circuit board has been widely used in portable terminals such as smart phones and the like, where demand is exploding in recent years.
- flexible printed circuit boards are frequently used in near field communication (NFC) antennas and digitizers of portable terminals.
- NFC near field communication
- the digitizer is applied to a display panel of an electronic device such as a mobile phone, a PDA, a notebook, and the like to recognize and display coordinates of a point where a touch is generated, thereby enabling natural handwriting recognition on the display panel.
- an electronic device such as a mobile phone, a PDA, a notebook, and the like to recognize and display coordinates of a point where a touch is generated, thereby enabling natural handwriting recognition on the display panel.
- the digitizer has recently increased in size in accordance with the size of the display panel because the size of the display panel of a smartphone is gradually increased, and is applied to the development of a tablet PC, a display for outdoor advertising, and the like.
- the electronic blackboard 1 is used in lectures, seminars, conferences, presentations, etc., installed in a large indoor or outdoor area, and uses a large display panel so that many people can see the screen accurately.
- a flexible printed circuit board is manufactured by etching copper foil laminated on a flexible substrate, or by printing a circuit pattern on a flexible insulating film with a conductive paste or a conductive ink and then plating the circuit pattern.
- a coverlay is attached to protect the circuit pattern, but the manufacturing cost is high, and its thickness is difficult to manufacture below a predetermined thickness.
- the adhesion force between the circuit pattern and the insulating film is lowered, thereby causing a defect that the circuit pattern is easily separated from the insulating film.
- the flexible printed circuit board is manufactured to have a multi-layer structure in order to effectively arrange circuits for device operation.
- the flexible printed circuit board is manufactured by attaching insulating films having different circuit patterns formed thereon by bonding sheets.
- the flexible printed circuit board of the multilayer structure has a complicated manufacturing process for forming a via hole for electrically connecting circuit patterns of each layer, and requires a high manufacturing cost since the insulating film of each layer is bonded and bonded together. There was a problem.
- the flexible printed circuit board of the multi-layer structure has a problem that the reliability of the operation is not maintained stably when the adhesive strength of the bonding sheet is lowered, there is a limit to reduce the thickness has a problem of increasing the thickness of the applied product.
- the present invention has been made in view of the above, and provides a flexible printed circuit board which can be flexibly bent and bent while maintaining a circuit pattern firmly attached to a substrate, and a method of manufacturing the same.
- Another object of the present invention is to provide a flexible printed circuit board and a method of manufacturing the same, which have a thin thickness, a low manufacturing cost, and a stable operation reliability of the circuit.
- the protective coating layer may be formed to have a thickness of at least 9 ⁇ m on the circuit pattern.
- the flexible printed circuit board according to the exemplary embodiment of the present invention may further include another circuit pattern formed on the protective coating layer, and the protective coating layer may include a via hole for electrically connecting the circuit pattern and the other circuit pattern. Is formed and a conductor electrically connecting the circuit pattern with the other circuit pattern may be filled in the via hole.
- the sieve can be filled.
- At least one different circuit pattern layer is formed on each of the first protective coating layer and the second protective coating layer, and on the first protective coating layer and the second protective coating layer.
- At least one other protective coating layer may be formed on one surface and the other surface of the substrate to form the same number of protective coating layers and circuit pattern layers, respectively.
- the first circuit pattern is any one of the X-axis coordinate recognition pattern portion having a plurality of X-axis electrodes spaced laterally and the Y-axis coordinate recognition pattern portion having a plurality of Y-axis electrodes spaced longitudinally
- the second circuit pattern is one of an X-axis coordinate recognition pattern portion having a plurality of X-axis electrodes spaced apart in the lateral direction and a Y-axis coordinate recognition pattern portion having a plurality of Y-axis electrodes spaced in the longitudinal direction. It can be one.
- the forming of the circuit pattern may include printing the conductive paste and firing the circuit pattern.
- the conductive paste is a silver paste containing silver powder, polymer resin and solvent
- the silver paste is 73wt% ⁇ 88wt% silver powder, 5.9wt% ⁇ 9.5wt% polymer resin, 5.7wt% ⁇ 18.0 It may include wt%
- the step of firing may include the process of firing at 200 °C ⁇ 450 °C.
- the forming of the protective coating layer may include applying the coating solution except for a portion where the via hole is formed.
- the substrate is a PI film or PET film
- the coating solution may be a PAI solution or a PI solution.
- the coating liquid may further include an anti-curling agent.
- the coating solution may be a PI solution containing 2 to 5wt% silica or a PAI solution containing 2 to 5wt% silica.
- the forming of the protective coating layer in the present invention may include applying the coating solution to the substrate by screen printing using a waterproof coated screen mesh.
- the method of manufacturing a flexible printed circuit board according to an exemplary embodiment of the present invention may further include polishing the circuit pattern fired before forming the protective coating layer.
- a method of manufacturing a flexible printed circuit board includes: forming a via hole in the substrate before forming the circuit pattern; And a via hole filling step of filling a conductor in the via hole, and the forming of the circuit pattern may include forming a first circuit pattern on one surface of the substrate; And forming a second circuit pattern on the other surface of the substrate.
- the forming of the protective layer may include coating and coating a coating solution on one surface of the substrate and the other surface of the substrate, and drying and curing the substrate.
- the method may include forming a first protective coating layer and a second protective coating layer covering and protecting the first circuit pattern and the second circuit pattern on one surface and the other surface of the substrate, respectively.
- the method of manufacturing a flexible printed circuit board according to an embodiment of the present invention may further include a baking step of removing moisture in the substrate by heating the substrate before forming the circuit pattern.
- the present invention protects the circuit pattern formed on the substrate with a coating layer to firmly attach the circuit pattern to the substrate, and prevents deformation and damage of the circuit pattern due to repeated bending or bending deformation of the substrate, thereby improving operation reliability. .
- the present invention does not need to attach a separate coverlay, there is an effect that the chemical resistance is stronger by protecting the circuit pattern with a coating layer.
- the present invention is to reduce the thickness in the flexible printed circuit board having a multi-layer structure to be able to manufacture a product using the compact, there is an effect to increase the marketability.
- the present invention can secure the dimensional stability when firing the circuit pattern printed with the conductive paste through the preheating treatment of the substrate, prevents the lowering of the adhesion force between the circuit pattern and the substrate due to the deformation of the film during firing and the adhesion of the circuit pattern It is effective to maintain a stable even after firing.
- the present invention has the effect of stably filling the conductive paste in the via hole to improve the operation reliability of the circuit pattern formed on both sides of the substrate.
- the present invention has the effect of greatly increasing the commerciality by reducing the manufacturing cost.
- 1 is a diagram showing an example of using an electronic blackboard.
- FIG. 2 is a cross-sectional view showing an embodiment of a flexible printed circuit board according to the present invention.
- FIG 3 is a cross-sectional view showing another embodiment of a flexible printed circuit board according to the present invention.
- FIG 4 and 5 are cross-sectional views showing yet another embodiment of the flexible printed circuit board according to the present invention.
- FIG. 6 is a process diagram showing an embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 7 is a schematic view showing an embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 8 is a process diagram showing another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 9 is a schematic view showing another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 10 is a process diagram showing another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 11 is a schematic view showing another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 12 is a flowchart illustrating still another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 13 is a schematic view showing another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 14 is a cross-sectional view showing a via hole in the method of manufacturing a flexible printed circuit board according to the present invention.
- 15 is a flowchart illustrating still another embodiment of a method of manufacturing a flexible printed circuit board according to the present invention.
- FIG. 16 illustrates a digitizer according to an embodiment of a flexible printed circuit board according to the present invention.
- circuit pattern 20a other circuit pattern
- protective coating layer 30a other protective coating layer
- the flexible printed circuit board according to an exemplary embodiment of the present invention may include a substrate 10 and the substrate 10. It includes a circuit pattern 20 formed in.
- a protective coating layer 30 is formed on the substrate 10 to cover and protect the circuit pattern 20.
- the protective coating layer 30 is formed by applying a coating solution and curing.
- the base 10 may be a PI film, PET film, polyester film and the like, preferably a PI film.
- PI film is thin, flexible, excellent in heat resistance and bending resistance, small in dimension change, resistant to heat, sinterable at temperatures of 200 °C to 450 °C, and thin and excellent in flexibility.
- the circuit pattern 20 may be formed of metal foil such as copper foil, silver foil, aluminum foil, or may be formed by firing a conductive paste.
- the circuit pattern 20 is preferably formed of a conductive paste and baked so as to reduce manufacturing costs and simplify the manufacturing process.
- the flexible printed circuit board according to the exemplary embodiment of the present invention may further include another circuit pattern 20a formed on the protective coating layer 30.
- the other circuit pattern 20a may be formed of metal foil such as copper foil, silver foil, aluminum foil, or may be formed by firing a conductive paste.
- the other circuit pattern 20a is preferably baked with a conductive paste so as to reduce manufacturing costs and simplify the manufacturing process.
- a via hole 10a is formed to electrically connect the circuit pattern 20 and the other circuit pattern 20a, and the circuit pattern 20 is different from the circuit pattern 20 in the via hole 10a.
- the conductor that electrically connects the circuit pattern 20a is filled.
- the circuit pattern 20 formed on the substrate 10 has an X-axis coordinate recognition pattern portion having a plurality of X-axis electrodes spaced laterally and a Y-axis coordinate having a plurality of Y-axis electrodes spaced longitudinally. Any of the recognition pattern portions, and the other circuit pattern 20a formed on the protective coating layer 30 is longitudinally spaced apart from the X-axis coordinate recognition pattern portion having a plurality of X-axis electrodes spaced in the lateral direction. An example of another one of the Y-axis coordinate recognition pattern unit having a plurality of Y-axis electrodes.
- any one of the X-axis coordinate recognition pattern portion and the Y-axis coordinate recognition pattern portion is formed on the substrate 10, and the X on the surface of the protective coating layer 30.
- the other one of the axis coordinate recognition pattern unit and the Y axis coordinate recognition pattern unit is formed so that the coordinate of the point where the touch is generated can be found.
- the X-axis coordinate recognition pattern portion and the Y-axis coordinate recognition pattern portion are energized with each other through the via hole 10a.
- the circuit pattern 20 may be formed in a lattice form having a plurality of X-Y coordinates on the surfaces of the substrate 10 and the protective coating layer 30.
- Another protective coating layer 30a is formed on the protective coating layer 30 to cover and protect the other circuit pattern 20a, thereby protecting the other circuit pattern 20a, and another protective coating layer 30a on the other protective coating layer 30a.
- Circuit patterns (not shown) may be formed.
- the flexible printed circuit board according to the embodiment of the present invention may be manufactured as a flexible printed circuit board having a multilayer structure by including a plurality of protective coating layers and a plurality of circuit pattern layers respectively formed on the protective coating layer.
- the protective coating layer 30 is formed to cover the circuit pattern 20 by applying a coating solution to the surface on which the circuit pattern 20 is formed and curing the substrate 10, and covering the circuit pattern 20. Protect.
- the protective coating layer 30 is formed of a synthetic resin coating layer using a cotan liquid of the same series as the base material 10, and excellent adhesion to the base material 10, it is preferable to be more firmly integrated with the base material 10. Do.
- the substrate 10 is a PI film, and the protective coating layer 30 is an example of a PI coating layer or a PAI coating layer.
- the protective coating layer 30 is preferably formed of a coating liquid containing a curling agent, the curling agent is an example that is silica.
- a curling phenomenon may occur at an end side of the substrate 10 by contraction of the protective coating layer 30 when curing the coated coating solution.
- the anti-curling agent prevents curling occurring at the end side of the substrate 10 due to shrinkage of the protective coating layer 30 so that the substrate 10 on which the protective coating layer 30 is formed is as flat as possible.
- the protective coating layer 30 is preferably formed to cover the circuit pattern 20 with a thickness of at least 9 ⁇ m, more preferably has a thickness of 10 ⁇ m or more. This is the minimum thickness that can serve as an insulating layer to insulate the circuit pattern 20. For example, when the thickness of the circuit pattern 20 is 10 ⁇ m, the protective coating layer 30 is formed to have a thickness of 19 ⁇ m or more on the substrate 10, the thickness of the circuit pattern 20 is 15 ⁇ m When the protective coating layer 30 is preferably formed to have a thickness of 24 ⁇ m or more.
- the circuit pattern 20 may include a first circuit pattern 21 formed on one surface of the substrate 10; And a second circuit pattern 22 formed on the other surface of the substrate 10, wherein the protective coating layer covers the first circuit pattern 21 to protect the first protective coating layer 31; And a second protective coating layer 32 covering and protecting the second circuit pattern 22.
- the substrate 10 has a via hole 10a electrically connecting the first circuit pattern 21 and the second circuit pattern 22 to each other.
- the via hole 10a is filled with a conductor to electrically connect the first circuit pattern 21 and the second circuit pattern 22, and the conductor may be formed by filling a conductive paste or plating. It may be.
- the first circuit pattern 21 may be any one of an X-axis coordinate recognition pattern portion having a plurality of X-axis electrodes spaced apart in the lateral direction and a Y-axis coordinate recognition pattern portion having a plurality of Y-axis electrodes spaced in the longitudinal direction.
- the second circuit pattern 22 is an X-axis coordinate recognition pattern portion having a plurality of X-axis electrodes spaced laterally and a Y-axis coordinate recognition pattern having a plurality of Y-axis electrodes spaced longitudinally.
- the other one of the parts is taken as an example.
- any one of the X-axis coordinate recognition pattern portion and the Y-axis coordinate recognition pattern portion is formed on one surface of the substrate 10, and on the other surface of the substrate 10.
- the other one of the X-axis coordinate recognition pattern unit and the Y-axis coordinate recognition pattern unit is formed to find the coordinates of the point where the touch is generated.
- the X-axis coordinate recognition pattern portion and the Y-axis coordinate recognition pattern portion are energized with each other through the via hole 10a.
- the first circuit pattern 21 and the second circuit pattern 22 may be formed in a grid shape having a plurality of X-Y coordinates on one surface of the substrate 10 and the other surface of the substrate 10.
- the first protective coating layer 31 and the second protective coating layer 32 are formed on both sides of the substrate 10, respectively, to prevent curling of the substrate 10 and to keep the substrate 31 in a flat state. To help.
- another circuit pattern 21 ′ is formed on the first protective coating layer 31, and on the first protective coating layer 31.
- Another protective coating layer 31 ′ may be formed on the surface of the substrate 10 to include a plurality of protective coating layers and a plurality of circuit pattern layers respectively formed on the protective coating layer.
- another circuit pattern 22 ′ is formed on the second protective coating layer 32, and another protective coating layer 32 ′ is formed on the second protective coating layer 32 to form the substrate 10. It may include a plurality of protective coating layers and a plurality of circuit pattern layers formed on the protective coating layer on the other surface of the.
- the first protective coating layer 31 and the second protective coating layer 32 may be formed by applying the coating liquid except for a portion where the via hole 10a is formed when applying the coating liquid.
- the circuit pattern layer stacked on the first protective coating layer 31 and the circuit pattern layer stacked on the second protective coating layer 32 may be electrically connected to each other through the via hole 10a.
- a method of manufacturing a flexible printed circuit board includes forming a circuit pattern 20 on a substrate 10 (S300); And forming a protective coating layer 30 to cover and protect the circuit pattern 20 by applying a coating solution to the substrate 10 (S600).
- a metal foil such as copper foil, silver foil, aluminum foil, or the like may be attached to the substrate 10, and the metal foil may be formed by etching the copper foil, silver foil, aluminum foil. It can also be formed by transferring metal foils such as these and then transferring them.
- the circuit pattern 20 may be printed on the base material 10 using a conductive paste, and the circuit pattern 20 may be fired.
- the coating liquid is applied to the substrate 10, dried, and cured to cover the circuit pattern 20 on the substrate 10 to protect the protective coating layer 30. ).
- the coating liquid is cured by heating the coating liquid at 200 ° C. to 450 ° C. for 20 minutes to 50 minutes.
- circuit pattern 20 in the forming of the circuit pattern 20 (S300), it is preferable to print the circuit pattern 20 on the substrate 10 with conductive paste.
- the flexible printed circuit board manufacturing method according to an embodiment of the present invention, it is preferable to further include the step of firing the circuit pattern (20) (S400).
- Forming the circuit pattern 20 (S300) may further include forming another circuit pattern 20a on the protective coating layer 30 (S610).
- a metal foil such as copper foil, silver foil, aluminum foil, or the like may be attached onto the protective coating layer 30, and the metal foil may be formed by etching. After punching out a metal foil such as aluminum foil, the protective coating layer 30 may be formed by transferring.
- step (S610) of forming the other circuit pattern 20a it is preferable to include the step of printing the other circuit pattern 20a on the protective coating layer 30 with a conductive paste.
- the firing step (S400) preferably includes a step (S410) of firing the circuit pattern 20 and a step (S620) of firing the other circuit pattern 20a.
- the manufacturing cost can be reduced, the manufacturing process can be simplified, and the dried protective coating layer 30 can be cured without a separate curing process. have.
- the coating liquid is applied to the substrate 10 to form the protective coating layer 30, and then dried, to form the other circuit pattern 20a.
- the process (S610) is formed by printing another circuit pattern 20a with a conductive paste on the dried protective coating layer 30, and firing the other circuit pattern 20a to separately cure the protective coating layer 30. Curing without a process.
- the forming of the protective coating layer 30 may further include forming another protective coating layer 30a on the protective coating layer 30 to cover and protect the other circuit pattern 20a (S630).
- the process of forming the other circuit pattern 20a and the process of forming the other protective coating layer 30a may be repeated, and the plurality of protective coating layers 30 and the plurality of protective coating layers 30 respectively formed may be repeated.
- a multilayer flexible printed circuit board having a circuit pattern layer of can be easily manufactured.
- a step of forming a via hole 10a electrically connecting the circuit pattern 20 and the other circuit pattern 20a to the protective coating layer 30 may be performed.
- the forming of the via hole 10a may include forming a via hole 10a penetrating through the protective coating layer 30, plating and filling the inside of the via hole 10a, or filling the inside of the via hole 10a with a conductive paste. .
- the forming of the protective coating layer 30 includes applying the coating liquid except for a portion where the via hole 10a is formed when the coating liquid is applied to form the protective coating layer 30. It is preferable. This is to form the via hole 10a without a separate step as in the step of forming the via hole 10a to electrically connect the circuit pattern 20 and the other circuit pattern 20a.
- the via hole 10a formed in the protective coating layer 30 is formed by printing the other circuit pattern 20a with a conductive paste, the conductive paste is filled into the circuit pattern 20 and the other circuit pattern 20a. Is electrically connected.
- the via hole 10a may be filled with a conductive paste, and then the other circuit pattern 20a may be printed by using a conductive paste.
- the coating solution is applied to the substrate 10 and dried, followed by masking. If the removed portion is removed, a portion connecting the circuit pattern 20 and the other circuit pattern 20a, that is, the via hole 10a is exposed.
- the via hole 10a is formed by applying a coating liquid to the substrate 10 by screen printing using a screen mesh that masks a portion of the screen mesh in which the via hole 10a is formed. You may.
- the forming of the circuit pattern 20 may include drying the printed conductive paste before the firing step (S400), and drying of the conductive paste may be performed at a temperature of 80 ° C. or less. have.
- the printing of the circuit pattern 20 or the printing of the other circuit pattern 20a is preferably screen printing, and the screen printing is suitable for forming a fine pattern because of the fast curing speed and excellent adhesiveness and flexibility. Predesigned circuit patterns can be formed at low cost.
- circuit pattern 20 and the other circuit pattern 20a are formed by screen printing and then baking the conductive paste, the manufacturing cost of the digitizer used for the copyboard of a large screen can be greatly reduced. Can be.
- the conductive paste includes a conductive metal powder and a binder.
- the conductive metal powder may be one selected from silver, copper, aluminum and nickel, or a mixture of two or more selected.
- the said conductive paste is silver paste containing silver powder, a polymer resin, and a solvent.
- the silver paste includes 73 wt% to 88 wt% of silver powder, 5.9 wt% to 9.5 wt% of polymer resin, and 5.7 wt% to 18.0 wt% of solvent.
- the silver paste may further include 0.35 wt% to 2.90 wt dispersant.
- the polymer resin includes a polyester-based resin and has an molecular weight of 25,000 as an example.
- the silver powder is an example that the particle size is 50nm ⁇ 5 ⁇ m, preferably 0.5 ⁇ 1.2 ⁇ m.
- the silver powder has a problem that it is difficult to achieve resistance of 30 ⁇ or less, preferably 23 ⁇ or less, in the silver powder of more than 5 ⁇ m because the silver powder has a small particle size to move well in printing and the silver powder adheres to each other during firing.
- the firing step (S400) is to fire the circuit pattern 20 formed of the silver paste on the substrate 10 or the protective coating layer 30 at 200 °C ⁇ 450 °C, preferably 290 °C ⁇ 420 °C Fired.
- the firing temperature of 290 ° C to 420 ° C is a temperature range in which the circuit pattern 20 can be stably fired without deformation or damage to the synthetic resin film, ie, the PI film, which is the substrate 10 of the flexible printed circuit board.
- the printed circuit pattern 20 is fired so as to have a specific resistance value within a predetermined range, and the adhesion force of the circuit pattern 20 is equal to or higher than a reference value.
- Firing is intended to improve electrical conductivity due to grain growth between silver powders and to improve adhesion between the conductive material and the substrate 10 filled in the via hole 10a to be described later.
- the conductive powder (silver powder) printed and dried on the substrate 10 may generate an interface separation with the substrate 10 or may cause cracks.
- the substrate 10 may be carbonized.
- firing is carried out in a temperature range of 300 ⁇ 450 °C.
- the circuit pattern 20 is formed to have a specific resistance value of 4.0 ⁇ ⁇ cm or more and 6.5 ⁇ ⁇ cm or less.
- the method of manufacturing a flexible printed circuit board according to an exemplary embodiment of the present disclosure may further include heating the substrate 10 and performing linear deformation (S100) before forming the circuit pattern 20 (S300). Can be.
- the linear thermal deformation step (S100) improves the dimensional stability of the substrate 10 by thermal treatment to prevent deformation of the substrate 10 during the firing process.
- the step of thermal deformation includes the step of heating the substrate 10, that is, the PI film at a temperature equal to or higher than the firing temperature of the firing step (S400), the step of firing by linear thermal deformation In S400, the deformation of the PI film is prevented.
- the firing temperature is preset by the type of the flexible printed circuit board to be manufactured in the firing step (S400), the composition of the conductive paste, the specific resistance value required by the circuit pattern 20, and the linear thermal deformation ( S100 is to thermally deform the substrate 10 by heating the substrate 10 to a temperature equal to or higher than the firing temperature set in the firing step (S400).
- Tables 1 to 3 below show that the PI film is preheated at 400 ° C. for 7 hours by thickness and size, and the shrinkage change rate is displayed after heating the preheated PI film at 350 ° C., which is a firing temperature.
- Table 1 below is an example of a PI film of 1/2 mill thickness.
- Table 2 below is an example of a mill film of PI film.
- Table 3 below is an example of a PI film of 2 mill thickness.
- the step (S100) of heating the substrate 10 by thermal deformation of the substrate 10 prevents shrinkage deformation of the PI film upon firing of the circuit pattern 20 by performing linear thermal deformation of the PI film before firing.
- the dimensional stability of the substrate 10 is secured so that the pattern 20 can be precisely positioned at a predesigned position, and the circuit pattern 20 is formed by the deformation of the substrate 10 generated during firing. This prevents the deterioration of adhesion force attached to
- the PI film wound and stored in a roll shape is heated in a box-type heating furnace to thermally process a large amount of PI film at once, and wound in a roll form It is preferable to form the circuit pattern 20 through the roll-to-roll method of the processed PI film (S300), and to perform the firing step (S400) in this order.
- the substrate 10 may be heated by heating the linearly deformed substrate 10. It is preferable to further include a baking step (S200) to remove moisture in).
- the baking step (S200) since the moisture is absorbed into the substrate 10 during long-term storage after the substrate 10 is thermally deformed, the substrate 10 is heated in a temperature range of 80 °C ⁇ 150 °C to the substrate Moisture contained in (10) is removed.
- the baking step (S200) is performed before the step (S300) of forming the circuit pattern 20, the baking in the step (S400) by heating to remove the moisture contained in the substrate 10 during storage Shrinkage deformation by moisture included in the substrate 10 is prevented.
- the PI film has a property of absorbing moisture during storage, it is preferable to perform the step S300 of forming the circuit pattern 20 after the baking step S200.
- a coating liquid is applied to the substrate 10 to form a protective coating layer 30 and dried.
- the protective coating layer 30, the coating liquid can be cured by heating 20 ⁇ 50 minutes at 200 °C ⁇ 450 °C.
- the other circuit pattern 20a may be cured in a process of firing (S620).
- the coating solution is a PI (polyimide) solution, a solution containing PI 15 ⁇ 35wt%, the PI is dissolved in a solvent, the solvent is an example of dilution of NMP.
- PI polyimide
- the coating solution may be a PAI solution, and the protective coating layer 30 may be formed by applying the PAI solution.
- the PAI solution is a solution containing 15 ⁇ 35wt% PAI, dissolved in PAI with a solvent, the solvent is an example of dilution of NMP.
- the coating solution further includes an anti-curling agent, and the anti-curling agent is one example of silica.
- the coating solution it is preferable to use a PI solution containing 2 to 5 wt% of silica or a PAI solution containing 2 to 5 wt% of silica, and more preferably a PI solution or a PAI solution containing 2.5 wt% of silica.
- the PI solution is PI 15 ⁇ 35wt%, silica 2 ⁇ 5wt%, the rest of the remainder to form a solvent containing, the PAI solution PAI 15 ⁇ 35wt%, silica 2 ⁇ 5wt%, As an example, the remaining residue is formed to include a solvent.
- the anti-curling agent is to prevent the phenomenon that the end of the substrate 10 is dried after curing the protective coating layer 30.
- the end side of the substrate 10 is dried while the protective coating layer 30 is contracted.
- An anti-curling agent is included in the coating solution to prevent a phenomenon in which the end side of the substrate 10 is curled by shrinkage of the protective coating layer 30 when the protective coating layer 30 is cured.
- Forming the protective coating layer 30 (S600) includes a process of drying the coating liquid applied to one surface of the substrate 10 by heating for 5 to 25 minutes at 90 ⁇ 150 °C.
- the protective coating layer 30 is preferably formed to cover the circuit pattern 20 with a thickness of at least 9 ⁇ m, more preferably has a thickness of 10 ⁇ m or more. This is the minimum thickness that can serve as an insulating layer to insulate the circuit pattern 20.
- the coating liquid may be applied to one surface of the substrate 10 by screen printing, and the coating thickness of the coating liquid may be adjusted by the mesh size of the screen during screen printing.
- the protective coating layer 30 is preferably formed by one screen printing in order to simplify the process and reduce manufacturing costs, and the screen printing uses a screen mesh having 40 to 100 mesh per unit area (inch 2 ). It is desirable to. This means having 40 to 100 meshes per unit area (inch 2 ).
- the protective coating layer 30 having a thickness of at least 9 ⁇ m or more in the circuit pattern 20. ) Can be formed.
- the waterproof coated screen mesh can be applied to the substrate 10 using a coating solution having high viscosity, that is, a PI solution or a PAI solution, by improving the coating property of the coating solution, thereby forming the protective coating layer 30 thicker with a single coating.
- a coating solution having high viscosity that is, a PI solution or a PAI solution
- the protective coating layer 30 protects the circuit pattern 20 formed on one surface of the substrate 10, and allows the circuit pattern 20 to be more firmly attached to the substrate 10, The circuit pattern 20 is prevented from being separated from the substrate 10 even in the bending deformation of the substrate 10.
- the step of polishing the circuit pattern 20 baked before the step of forming the protective coating layer (S600) (S500) further.
- the surface of the circuit pattern 20 is partially polished to remove the hydrophobic portion of the circuit pattern 20, and the protective coating layer 30 is formed in step S600.
- the coating solution may be smoothly applied to the circuit pattern 20.
- the polishing step (S500) is an example of polishing the surface of the circuit pattern 20 by 1 ⁇ 3 ⁇ m, while polishing by contacting the surface of the circuit pattern 20 while rotating a polishing roll such as a brush roll. It is an example.
- the via hole 10a is formed in the substrate before the forming of the circuit pattern 20 (S200).
- the forming of the circuit pattern 20 (S200) may include forming a first circuit pattern 21 on one surface of the substrate 10 (S210); And forming a second circuit pattern 22 on the other surface of the substrate 10 (S220).
- the via hole 10a may be formed at a required portion of the base 10, that is, according to a predetermined circuit design, using a drill or a laser.
- the via hole 10a is formed to electrically connect the first circuit pattern 21 formed on one surface of the substrate 10 and the second circuit pattern 22 formed on the other surface of the substrate 10.
- a conductive paste is filled in the via hole 10a to electrically connect the first circuit pattern 21 and the second circuit pattern 22 formed on the other surface of the substrate 10. do.
- the via hole filling step (S140) may be performed by filling a conductive metal such as silver, copper, aluminum, gold, or the like by printing, or by printing a conductive paste.
- the first circuit pattern may be filled in the via hole 10a. 21 and the second circuit pattern 22 may be modified by another method of filling a conductor that electrically connects the second circuit pattern 22.
- a metal foil such as copper foil, silver foil, aluminum foil, or the like is attached to the base material 10.
- the metal foil may be etched and formed, or may be formed by transferring metal foils such as copper foil, silver foil, aluminum foil, and the like.
- the process of forming the first circuit pattern 21 (S210) and the process of forming the second circuit pattern 22 (S220) may be performed by printing and baking the substrate 10 with a conductive paste. have.
- the coating solution is applied to one surface of the substrate 10 and the other surface of the substrate 10, dried, and cured to form the protective coating layer on the one surface and the other surface of the substrate 10, respectively.
- a first protective coating layer 31 and a second protective coating layer 32 are formed to cover and protect the first circuit pattern 21 and the second circuit pattern 22.
- first circuit pattern 21 (S210) and forming the second circuit pattern 22 (S220), preferably comprising the step of printing with a conductive paste, the firing step In operation S400, the first circuit pattern 21 and the second circuit pattern 22 are fired.
- the forming of the first circuit pattern 21 (S210) and the forming of the second circuit pattern 22 (S220) include screen printing with a conductive paste. Is fast and has excellent adhesiveness and flexibility, so it is suitable for forming a fine pattern, and a predesigned circuit pattern can be formed at low cost.
- the first circuit pattern 21 is an X-axis coordinate recognition pattern unit having a plurality of X-axis electrodes spaced apart in the lateral direction
- the second circuit pattern 22 includes a plurality of Y-axis electrodes spaced in the longitudinal direction.
- the X-axis coordinate recognition pattern portion is formed on one surface of the substrate 10 and the Y-axis coordinate recognition pattern portion is formed on the other surface of the substrate 10 to find the coordinates of the point where the touch is generated.
- An example is a digitizer that allows one to do so.
- the X-axis coordinate recognition pattern portion and the Y-axis coordinate recognition pattern portion are energized with each other through the via hole 10a.
- the first circuit pattern 21 and the second circuit pattern 22 may be formed in a grid shape having a plurality of X-Y coordinates on one surface and the other surface of the substrate 10.
- the first circuit pattern 21 and the second circuit pattern 22 are screen printed with a conductive paste and then fired, the first circuit pattern 21 and the second circuit pattern 22 are formed, and in particular, in manufacturing a digitizer used for an electronic blackboard of a large screen, the manufacturing cost is reduced. You can save a lot.
- the firing step (S400) is to fire the first circuit pattern 21 and the second circuit pattern 22 formed of the silver paste on the substrate 10 at 200 °C ⁇ 450 °C.
- the conductive paste filled in the via hole 10a is baked.
- the surfaces of the first circuit pattern 21 and the second circuit pattern 22 are partially polished to remove the first circuit pattern 21 and the second circuit pattern 22.
- the coating solution may be smoothly applied to the first circuit pattern 21 and the second circuit pattern 22 in the step S600 of removing the portion in which hydrophobicity is generated and forming the protective coating layer.
- the polishing step (S500) is an example of grinding the surface of the first circuit pattern 21 and the second circuit pattern 22 by 1 ⁇ 3 ⁇ m, while rotating the polishing roll such as a brush roll For example, the surface of the first circuit pattern 21 and the second circuit pattern 22 is polished in contact with each other.
- the carrier 40 is formed on the other surface of the substrate 10 between the step of forming the via hole 10a and the filling of the via hole 10a. It is preferable to further include the step of laminating (S130).
- the via hole 10a is formed in the substrate 10, the carrier 40 is laminated on the other surface of the substrate 10, and the via hole 10a portion is formed on the other surface of the substrate 10 using a conductive paste.
- a conductive paste is filled in the via hole 10a.
- the carrier 40 allows the conductive paste to be stably filled in the via hole 10a.
- the carrier 40 may block and absorb the conductive paste flowing through the via hole 10a to the other surface side of the substrate 10 so that the conductive paste remains only up to the via hole 10a. This prevents the conductive paste from being contaminated and the short caused by the conductive paste flowing out to the other surface side of the substrate 10.
- the carrier 40 blocks and absorbs the conductive paste flowing down to the other surface side of the substrate 10 when printing with the conductive paste in the process of forming the first circuit pattern 21 (S210). Only to the via hole 10a may remain. This prevents the conductive paste from being contaminated and the short caused by the conductive paste flowing out to the other surface side of the substrate 10.
- the carrier 40 may use an absorbent paper, preferably wet paper.
- the wet paper has a low density so that the conductive paste is well absorbed between the pores.
- An adhesive is attached to the carrier 40, so that the carrier 40 may be easily laminated with the substrate 10.
- the carrier 40 may be laminated or removed from the other surface or one surface of the substrate 10 in a roll to roll manner.
- the roll-to-roll method is a continuous process of forming a pattern by laminating the carrier 40 while unwinding the substrate 10 wound on the roll and printing a conductive paste on the opposite side of the carrier 40 on which the carrier 40 is laminated. .
- the roll-to-roll method is a method capable of mass production and reduce the production cost.
- the via hole 10a is pre-filled with a conductive paste on one surface of the substrate 10 before the forming of the first circuit pattern 21 (S210).
- the conductive paste can be completely filled in 10a).
- the via hole 10a may be filled with a conductive paste on one side of the base 10 in the via hole filling step S140, and at this time, the conductive paste may not be partially filled on the other side of the base 10. have.
- the portion of the via hole 10a that is not filled with the conductive paste on the other surface side of the substrate 10 is filled in the process of forming the second circuit pattern 22 (S220), and the via hole 10a
- the inside is filled with a conductive paste to electrically and stably connect the first circuit pattern 21 and the second circuit pattern 22 to improve operation reliability.
- Method of manufacturing a flexible printed circuit board according to the present invention, the step of removing the carrier 40 from the other surface of the substrate 10 after forming the first circuit pattern on one surface of the substrate (10);
- the method may further include removing the carrier 40 from one surface of the substrate 10 (S221).
- the carrier 40 blocks the via hole 10a on one surface of the substrate 10 so that the conductive paste is stably filled in the via hole 10a.
- the conductive paste filled in the via hole 10a is prevented from flowing out to one side of the substrate 10.
- the carrier 40 allows the conductive paste to be stably filled in the via hole 10a.
- the carrier 40 may block and absorb the conductive paste flowing through the via hole 10a to one side of the substrate 10 so that the conductive paste remains only up to the via hole 10a. This prevents the conductive paste from being contaminated and the short caused by the conductive paste flowing out to one side of the substrate 10.
- the method may include firing the second circuit pattern 22.
- the second circuit pattern with the conductive paste on the other surface of the substrate 10. (22) is printed followed by the steps of Secondary Drying-Secondary Sintering.
- an amount of conductive paste filled in the via hole 10a is secured, and operation reliability of the first circuit pattern 21 and the second circuit pattern 22 electrically connected through the via hole 10a is secured.
- the process of firing the first circuit pattern 21 is for fixing the shape of the conductive paste in the insulating film dried and the carrier 40 removed.
- the dried conductive paste is sintered, the shape in which the conductive paste is filled in the via hole 10a is maintained and no further shrinkage occurs.
- the conductive paste is stably filled in the via hole 10a, and interfacial separation with the substrate 10 and crack generation are prevented.
- the upper and lower portions of the conductive paste filled in the via hole 10a are slightly recessed and concave than the primary drying. However, since the sintered conductive paste does not generate any further shrinkage, it is easy to secure the conductive paste filling amount of the via hole 10a.
- the conductive paste is filled once in the via hole 10a so that the conductive paste is filled in the via hole 10a when printing the first circuit pattern 21 on one surface of the substrate 10, and the substrate 10 is filled with the conductive paste.
- the conductive paste is filled twice so that the conductive paste 19 is filled in the via hole 10a.
- the conductive paste is stably filled in the via hole 10a and electrically connects the first circuit pattern 21 and the second circuit pattern 22 of the substrate 10 through the via hole 10a. In addition, operation reliability of the first circuit pattern 21 and the second circuit pattern 22 is ensured.
- the drying of the conductive paste filled in the via hole 10a may be performed at a temperature of 80 ° C. or less.
- the conductive paste filled in the via hole 10a becomes concave in the upper and lower portions by gravity during the drying process.
- One filling of the via hole 10a may result in insufficient filling amount of the via hole 10a, thereby causing an operation reliability problem when the first circuit pattern 21 and the second circuit pattern 22 are connected.
- the conductive paste is dried, the shape filled in the via hole 10a by gravity changes to a concave shape. Therefore, in order to secure the reliability of the via hole 10a, a process of filling the via hole 10a twice is required.
- the conductive paste is filled once in the via hole 10a by filling a portion of the via hole 10a before printing the first circuit pattern 21 on one surface of the substrate 10, and the other surface of the substrate 10.
- the conductive circuit is filled twice into the via hole 10a by filling the via hole 10a before printing the two-circuit pattern 22.
- the conductive paste is stably filled in the via hole 10a and the connection reliability of the one surface pattern and the other surface pattern of the insulating film through the via hole 10a is secured.
- the method may further include a corona treatment step S131 for modifying the surface of the substrate 10 before the process of forming the first circuit pattern 21 (S210).
- the corona processing step (S131) may include: corona-processing one surface of the substrate 10 before the process of forming the first circuit pattern 21 (S210); And
- corona treating the other surface of the substrate 10 may be included (S213).
- the corona treatment step (S131) is for surface modification of the entire surface of the substrate 10 or a portion where the pattern is to be formed.
- the surface modification may be formed by any one of plasma treatment, corona treatment, laser treatment, etching treatment, and physical treatment. Of these, corona treatment having a short treatment time and excellent workability is most preferred.
- Corona treatment increases the adhesion between the substrate 10 and the conductive paste by performing modification of the surface of the substrate 10 without damaging the shrinkage, deformation, or the like of the substrate 10.
- Corona treatment of one surface of the substrate 10 is preferably performed after laminating the carrier 40 to the substrate 10 and filling the via hole (S140).
- a drying step for drying the conductive paste 15 filled in the via hole 10a may be performed. If the drying is performed after the corona treatment, the effect of the corona treatment may be reduced. It is antagonized. Therefore, the primary corona treatment is performed after filling the conductive hole in the via hole 10a, and subsequently printing the conductive paste 15 on the substrate 10 to form a pattern to improve the effect of the corona treatment. Most preferred.
- the via hole filling step (S140) is not performed separately and the via hole 10a is filled together when the second circuit pattern 22 is printed. It is preferable to form the second circuit pattern 22 by laminating the carrier 40 on the other side of the c) and then corona treatment and printing the conductive paste.
- Corona treatment is most preferred in the case of the present invention, but instead of the corona treatment, plasma treatment may be performed on the entire surface or the pattern forming portion of the substrate 10 to form fine irregularities, thereby improving adhesion between the conductive paste and the substrate 10.
- FIG. 16 illustrates a digitizer manufactured according to an embodiment of the present invention, wherein the circuit pattern 20 is an X-axis coordinate recognition pattern part having a plurality of X-axis electrodes spaced apart in a lateral direction, and the other circuit pattern ( 20a) is an example of the Y-axis coordinate recognition pattern unit having a plurality of Y-axis electrodes spaced in the longitudinal direction.
- the circuit pattern 20 is an X-axis coordinate recognition pattern part having a plurality of X-axis electrodes spaced apart in a lateral direction
- the other circuit pattern ( 20a) is an example of the Y-axis coordinate recognition pattern unit having a plurality of Y-axis electrodes spaced in the longitudinal direction.
- the present invention simplifies the manufacturing process in manufacturing the digitizer shown in FIG. 16, greatly reduces the manufacturing cost, and the effect increases as the size of the digitizer increases, thus manufacturing the digitizer applied to the electronic blackboard having a large screen. It is suitable invention.
- the present invention protects the circuit pattern 20 formed on the substrate 10 with a coating to keep the circuit pattern 20 firmly attached to the substrate 10, the repeated bending or bending deformation of the substrate 10 By preventing deformation and damage of the circuit pattern 20 by the operation reliability is improved.
- the present invention does not need to attach a separate coverlay, and the circuit pattern 20 is protected by a coating layer, thereby increasing chemical resistance.
- the present invention is to reduce the thickness in a flexible printed circuit board having a multi-layer structure to be able to manufacture a product using the compact, and to increase the marketability.
- the present invention greatly reduces the manufacturing cost and greatly increases the commerciality.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
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- Manufacturing Of Printed Wiring (AREA)
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Abstract
Description
필름의 두께 | 필름크기(mm) | 선열처리후 필름 수축 변화량(400℃ 7시간) | 소성온도(350℃ 30분) 수축량 | 누적 수축 변화량 |
1/2밀(mill) | 287 | -1.8(0.63%) | 0 | -1.8(0.63%) |
309 | -1.5(0.49%) | 0 | -1.5(0.49%) | |
250 | -0.5(0.2%) | 0 | -0.5(0.2%) | |
229 | -1.0(0.44%) | 0 | -1.0(0.44%) |
필름의 두께 | 필름크기(mm) | 선열처리후 필름 수축 변화량(400℃ 7시간) | 소성온도(350℃ 30분) 수축량 | 누적 수축 변화량 |
1밀(mill) | 291 | -2.0(0.69%) | 0 | -2.0(0.69%) |
310 | -2.5(0.81%) | 0 | -2.5(0.81%) | |
250 | -1.5(0.60%) | 0 | -1.5(0.60%) | |
233 | -1.3(0.56%) | 0 | -1.3(0.56%) |
필름의 두께 | 필름크기(mm) | 선열처리후 필름 수축 변화량(400℃ 7시간) | 소성온도(350℃ 30분) 수축량 | 누적 수축 변화량 |
2밀(mill) | 286 | -2.5(0.87%) | 0 | -2.5(0.87%) |
306 | -3.7(1.21%) | 0 | -3.7(1.21%) | |
250 | -2.0(0.80%) | 0 | -2.0(0.80%) | |
227 | -2.0(0.88%) | 0 | -2.0(0.88%) |
Claims (20)
- 기재;상기 기재에 형성된 회로패턴; 및상기 기재에 형성되며 상기 회로패턴을 덮어 보호하며, 코팅액을 도포하여 경화한 보호코팅층을 포함하는 것을 특징으로 하는 연성인쇄회로기판.
- 제1항에 있어서,상기 기재는 PI필름 또는 PET필름이며,상기 보호코팅층은 PI용액을 도포하여 경화한 PI 코팅층 또는 PAI용액을 도포하여 경화한 PAI 코팅층인 것을 특징으로 하는 연성인쇄회로기판.
- 제1항에 있어서,상기 보호코팅층은 말림 방지제가 포함된 것을 특징으로 하는 연성인쇄회로기판.
- 제3항에 있어서,상기 말림 방지제는 실리카인 것을 특징으로 하는 연성인쇄회로기판.
- 제1항에 있어서,상기 보호코팅층은 상기 회로패턴 상에서 적어도 9㎛ 이상의 두께를 가지도록 형성된 것을 특징으로 하는 연성인쇄회로기판.
- 제1항에 있어서,상기 보호코팅층 상에 형성되는 다른 회로패턴을 더 포함하며,상기 보호코팅층에는 상기 회로패턴과 상기 다른 회로패턴을 전기적으로 연결하기 위한 비아홀이 형성되고, 상기 회로패턴과 상기 다른 회로패턴을 전기적으로 연결하는 도전체가 상기 비아홀 내에 충진된 것을 특징으로 하는 연성인쇄회로기판.
- 제1항에 있어서,상기 회로패턴은,상기 기재의 일면에 형성되는 제1회로패턴; 및상기 기재의 타면에 형성되는 제2회로패턴을 포함하며,상기 보호코팅층은,상기 제1회로패턴을 덮어 보호하는 제1보호코팅층; 및상기 제2회로패턴을 덮어 보호하는 제2보호코팅층을 포함하고,상기 기재에는 상기 제1회로패턴과 상기 제2회로패턴을 전기적으로 연결하는 비아홀이 형성되며,상기 비아홀에는 도전체가 충전된 것을 특징으로 하는 연성인쇄회로기판.
- 제7항에 있어서,상기 제1보호코팅층과 상기 제2보호코팅층 상에 각각 다른 회로패턴층을 적어도 한층 형성하고, 상기 제1보호코팅층과 상기 제2보호코팅층 상에 다른 보호코팅층을 적어도 한층 형성하여 기재의 일면과 타면에 각각 동일한 층수의 보호코팅층과 회로패턴층을 형성한 것을 특징으로 하는 연성인쇄회로기판.
- 제7항에 있어서,상기 제1회로패턴은 횡방향으로 이격된 복수의 X축 전극을 구비한 X축 좌표인식패턴부와 종방향으로 이격된 복수의 Y축 전극을 구비한 Y축 좌표인식패턴부 중 어느 하나이고,상기 제2회로패턴은 횡방향으로 이격된 복수의 X축 전극을 구비한 X축 좌표인식패턴부와 종방향으로 이격된 복수의 Y축 전극을 구비한 Y축 좌표인식패턴부 중 다른 하나인 것을 특징으로 하는 연성인쇄회로기판.
- 기재에 회로패턴을 형성하는 단계; 및상기 기재에 코팅액을 도포하여 상기 회로패턴을 덮어 보호하는 보호코팅층을 형성하는 단계를 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 회로패턴을 형성하는 단계는, 도전성 페이스트로 인쇄하는 과정; 및상기 회로패턴을 소성하는 단계를 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제11항에 있어서,상기 도전성 페이스트는 은분말과, 폴리머레진, 솔벤트를 포함하는 은페이스트이며, 상기 은페이스트는 은분말 73wt% ~ 88wt%, 폴리머레진 5.9wt% ~ 9.5wt%, 솔벤트 5.7wt% ~ 18.0wt%를 포함하며,상기 소성하는 단계는 200℃ ~ 450℃에서 소성하는 과정을 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 보호코팅층을 형성하는 단계는, 비아홀이 형성되는 부분만 제외하고 상기 코팅액을 도포하는 과정을 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 코팅액은 PAI용액 또는 PI용액인 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 코팅액은 말림방지제를 더 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 코팅액은 실리카 2 ~ 5wt%를 포함하는 PI용액 또는 실리카 2 ~ 5wt%를 포함하는 PAI용액인 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 보호코팅층을 형성하는 단계는 방수코팅된 스크린 메쉬를 이용하여 스크린 인쇄로 상기 코팅액을 상기 기재에 도포하는 과정을 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제11항에 있어서,상기 보호코팅층을 형성하는 단계 이전에 소성된 상기 회로패턴을 연마하는 단계를 더 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 회로패턴을 형성하는 단계 이전에 상기 기재에 비아홀을 형성하는 단계; 및 상기 비아홀에 도전체를 충진하는 비아홀 충진단계를 더 포함하며,상기 회로패턴을 형성하는 단계는 상기 기재의 일면에 제1회로패턴을 형성하는 과정; 및상기 기재의 타면에 제2회로패턴을 형성하는 과정;을 포함하며,상기 보호층을 형성하는 단계는,상기 기재의 일면과 상기 기재의 타면에 코팅액을 도포하여 건조하고, 경화시켜 상기 기재의 일면과 타면에 각각 상기 제1회로패턴과 상기 제2회로패턴을 덮어 보호하는 제1보호코팅층과 제2보호코팅층을 형성하는 과정을 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
- 제10항에 있어서,상기 회로패턴을 형성하는 단계 이전에 상기 기재를 가열하여 기재 내 수분을 제거하는 베이킹 단계를 더 포함하는 것을 특징으로 하는 연성인쇄회로기판 제조 방법.
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KR101554304B1 (ko) * | 2015-04-20 | 2015-09-18 | 한솔테크닉스(주) | 커브드형 리지드 기판 및 이를 이용한 3차원 안테나 제조방법 |
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CN109967811B (zh) * | 2019-03-22 | 2022-04-26 | 杨小荣 | 一种用铝箔电路板制作的led灯具及其制备方法 |
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KR102192143B1 (ko) | 2019-06-28 | 2020-12-16 | 황준석 | 니켈실버 시트를 이용한 터치감응형 표시장치의 투명 연성회로기판 제조방법 및 이로부터 제조된 투명 연성회로기판 |
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CN105265029B (zh) | 2018-02-02 |
CN105265029A (zh) | 2016-01-20 |
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KR20160119731A (ko) | 2016-10-14 |
KR20140130369A (ko) | 2014-11-10 |
US20160135285A1 (en) | 2016-05-12 |
US9949379B2 (en) | 2018-04-17 |
KR101664442B1 (ko) | 2016-10-11 |
KR20140130368A (ko) | 2014-11-10 |
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