WO2014125973A1 - Substrat multicouche en résine à composant intégré, et substrat multicouche en résine - Google Patents

Substrat multicouche en résine à composant intégré, et substrat multicouche en résine Download PDF

Info

Publication number
WO2014125973A1
WO2014125973A1 PCT/JP2014/052664 JP2014052664W WO2014125973A1 WO 2014125973 A1 WO2014125973 A1 WO 2014125973A1 JP 2014052664 W JP2014052664 W JP 2014052664W WO 2014125973 A1 WO2014125973 A1 WO 2014125973A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
resin
resin multilayer
multilayer substrate
main surface
Prior art date
Application number
PCT/JP2014/052664
Other languages
English (en)
Japanese (ja)
Inventor
喜人 大坪
酒井　範夫
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2015500201A priority Critical patent/JP6139653B2/ja
Publication of WO2014125973A1 publication Critical patent/WO2014125973A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Definitions

  • the present invention relates to a component built-in resin multilayer substrate and a resin multilayer substrate.
  • Patent Document 1 Japanese Patent Laid-Open No. 9-18112
  • connection electrode When an electronic component is mounted on the connection electrode on the main surface of the flexible substrate, stress is directly applied to the electronic component against bending or twisting of the flexible substrate. As a result, there arises a problem that the connection reliability between the electronic component and the flexible substrate is lowered.
  • an object of the present invention is to provide a component-embedded resin multilayer substrate that can improve the connection reliability between a composite substrate mounted on a flexible resin multilayer substrate and the resin multilayer substrate, and a resin multilayer substrate.
  • the component built-in resin multilayer substrate according to the present invention includes a resin multilayer substrate and a composite substrate.
  • the resin multilayer substrate is formed by laminating a plurality of resin layers.
  • the resin multilayer substrate has a main surface.
  • Wiring is formed inside the resin multilayer substrate, and a cavity is formed on the main surface.
  • the composite substrate is disposed in the cavity.
  • the composite substrate includes a component, a core substrate on which the component is mounted, a sealing resin that seals the component, and a connection terminal that electrically connects the wiring and the core substrate.
  • the cavity has an inner surface.
  • the wiring includes side electrodes exposed on the inner side surface.
  • the composite substrate has an outer surface.
  • the connection terminal is exposed on the outer surface and is electrically connected to the side electrode.
  • connection reliability between the composite substrate and the resin multilayer substrate is achieved. Can be improved.
  • FIG. 14 is a cross-sectional view taken along line XIV-XIV shown in FIG. It is explanatory drawing of the 4th process of the manufacturing method of the composite substrate in Embodiment 1 based on this invention. It is sectional drawing of the component built-in resin multilayer substrate in Embodiment 2 based on this invention. It is sectional drawing of the state before mounting the composite substrate in the resin multilayer substrate in Embodiment 2 based on this invention.
  • the component built-in resin multilayer substrate 101 includes a resin multilayer substrate 2 and a composite substrate 3.
  • the resin multilayer substrate 2 has a main surface 4.
  • the component built-in resin multilayer substrate 101 is formed by mounting the composite substrate 3 on the main surface 4 of the resin multilayer substrate 2.
  • the resin multilayer substrate 2 is formed by laminating and integrating a plurality of resin layers 21.
  • the direction in which the plurality of resin layers 21 are stacked, that is, the vertical direction in the cross-sectional view shown in FIG. 1 is referred to as the thickness direction of the resin multilayer substrate 2.
  • conductive wiring 8 is formed inside the resin multilayer substrate 2.
  • the wiring 8 includes a plurality of via conductors 6 and a plurality of conductor patterns 7.
  • the via conductor 6 extends in the thickness direction of the resin layer 21 and is formed so as to penetrate the resin layer 21 in the thickness direction.
  • the conductor pattern 7 extends in a plane direction orthogonal to the thickness direction of the resin layer 21 and is disposed on the main surface of the resin layer 21. Via conductors 6 formed so as to penetrate the resin layer 21 in the thickness direction electrically connect the conductor patterns 7 formed in the different resin layers 21, thereby forming the wiring 8.
  • cavities 22 for mounting the composite substrate 3 are formed on the main surfaces 4 on both sides of the resin multilayer substrate 2.
  • the cavity 22 is formed in a shape in which a part of the main surface 4 of the resin multilayer substrate 2 is recessed.
  • the cavity 22 is open to the main surface 4, has a bottom surface 25 and an inner surface 26, and defines a hollow space therein.
  • the inner side surface 26 is a surface that extends along the thickness direction of the resin multilayer substrate 2 and forms the inner wall of the cavity 22.
  • a part of the via conductor 6 constituting the wiring 8 is exposed on the inner side surface 26 of the cavity 22.
  • the wiring 8 includes a side electrode 29 exposed on the inner side surface 26.
  • the side electrode 29 is formed by the via conductor 6.
  • the composite substrate 3 includes a core substrate 31.
  • the core substrate 31 has a facing surface 37 facing the resin multilayer substrate 2 and a back surface 38 opposite to the facing surface 37.
  • the core substrate 31 has a flat outer shape, and one of a pair of main surfaces is formed as a facing surface 37 and the other is formed as a back surface 38.
  • a surface conductor (not shown) is provided on the facing surface 37 and the back surface 38 of the core substrate 31, and an internal conductor (not shown) is provided inside the core substrate 31.
  • a plurality of components 32 are mounted on the facing surface 37 side of the core substrate 31.
  • the second component 34 is mounted on the back surface 38 side of the core substrate 31.
  • the composite substrate 3 includes a plurality of components 32 mounted on the facing surface 37 of the core substrate 31 and a second component 34 mounted on the back surface 38 of the core substrate 31.
  • Each of the plurality of components 32 is electrically connected to a surface conductor provided on the facing surface 37.
  • the second component 34 is bonded to the back surface 38 of the core substrate 31 by a bonding member 35 such as a solder ball, and is electrically connected to the surface conductor provided on the back surface 38.
  • a sealing resin 33 for sealing the component 32 is provided on the facing surface 37 side of the core substrate 31.
  • a sealing resin 36 that seals the second component 34 is provided on the back surface 38 side of the core substrate 31.
  • the part 32 and the second part 34 are protected from the external environment such as stress or moisture by being covered with the sealing resins 33 and 36, respectively.
  • the composite substrate 3 is a double-sided mounting type substrate in which components are mounted on both main surfaces of the core substrate 31, and a double-sided sealing type substrate in which both main surfaces of the core substrate 31 are sealed with resin. It is.
  • the composite substrate 3 is mounted on the main surface 4 of the resin multilayer substrate 2 by being fitted into the cavity 22. In a state where the composite substrate 3 is mounted on the main surface 4 of the resin multilayer substrate 2, the composite substrate 3 is disposed in the cavity 22, and the opposing surface 37 of the core substrate 31 and a plurality of components mounted on the opposing surface 37.
  • the component 32 is built in the resin multilayer substrate 2.
  • the back surface 38 of the core substrate 31 and the second component 34 mounted on the back surface 38 are disposed outside the resin multilayer substrate 2.
  • the component built-in resin multilayer substrate 101 also includes a connection terminal 9.
  • the connection terminal 9 is made of a conductive material, and is fixed to the facing surface 37 of the core substrate 31.
  • the connection terminal 9 extends in the thickness direction of the core substrate 31.
  • the connection terminal 9 has a pin shape, and a plurality of connection terminals 9 are arranged along the outer periphery of the core substrate 31.
  • a plurality of components 32 and a plurality of pin-shaped connection terminals 9 are arranged on the facing surface 37 side of the core substrate 31.
  • a component 32 is mounted on the facing surface 37 on which the pin-shaped connection terminals 9 are formed.
  • the composite substrate 3 has an outer surface 39.
  • the outer side surface 39 is a surface of the composite substrate 3 that extends in a direction intersecting the facing surface 37 and the back surface 38 of the core substrate 31, typically in a direction orthogonal thereto.
  • the outer side surface 39 extends along the thickness direction of the resin multilayer substrate 2.
  • a part of the outer peripheral surface of the connection terminal 9 is exposed on the outer surface 39.
  • the connection terminal 9 has an exposed surface that is not covered with the sealing resin 33 at a part of its front end surface and outer peripheral surface.
  • connection terminal 9 is fixed to the core substrate 31 and is electrically connected to the surface conductor formed on the facing surface 37.
  • the tip end surface at the other end of the connection terminal 9 is in contact with the conductor pattern 7 constituting a part of the wiring 8.
  • the connection terminal 9 has a length that can reliably reach the tip of the wiring terminal 8 formed inside the resin multilayer substrate 2 in the thickness direction of the core substrate 31.
  • connection terminal 9 electrically connects the wiring 8 that is an electrode on the resin multilayer substrate 2 side and the core substrate 31 that is an electrode on the composite substrate 3 side.
  • the main surface 4 of the resin multilayer substrate 2 is formed with a hollow cavity 22 in which the main surface 4 is depressed, and the composite substrate 3 is mounted on the resin multilayer substrate 2.
  • the part 32 is accommodated in the cavity 22.
  • the entire composite substrate 3 is not mounted so as to protrude from the main surface 4 of the resin multilayer substrate 2, and a part of the composite substrate 3 including the component 32 is built in the resin multilayer substrate 2.
  • the thickness of the composite substrate 3 protruding from the main surface 4 of the resin multilayer substrate 2 can be reduced, so that the dimension in the thickness direction of the component-embedded resin multilayer substrate 101 can be reduced and the height can be reduced. Can be achieved.
  • Part of the composite substrate 3 is embedded in the cavity 22.
  • the composite substrate 3 is surrounded by the resin multilayer substrate 2 in the entire circumferential direction.
  • the component 32 is covered with the sealing resin 33 and the resin multilayer substrate 2 and protected from the external environment. Since the resin multilayer substrate 2 has flexibility and elasticity, the adhesion between the resin multilayer substrate 2 and the composite substrate 3 is improved, and the holding power of the composite substrate 3 is enhanced. In addition, since the impact applied to the component 32 when the component-embedded resin multilayer substrate 101 is dropped is reduced, the impact resistance of the component-embedded resin multilayer substrate 101 can be improved.
  • the component 32 is an electronic component such as a multilayer ceramic capacitor, an integrated circuit, or a semiconductor element, and generates heat when a current flows.
  • the component 32 according to the present embodiment is mounted on the core substrate 31, and one of the outer peripheral surfaces of the component 32 faces the core substrate 31.
  • the heat generated in the component 32 is transmitted from the component 32 to the core substrate 31 and is transmitted to the outside via the core substrate 31.
  • heat dissipation from the component 32 is performed efficiently. Since the heat dissipation of the component 32 can be improved, the occurrence of problems due to overheating of the component 32 can be suppressed.
  • pin-shaped connection terminals 9 are provided on the composite substrate 3, and the connection terminals 9 are exposed on the outer surface 39 of the composite substrate 3.
  • a cavity 22 is formed on the main surface 4 of the resin multilayer substrate 2, and the wiring 8 is exposed on the inner side surface 26 of the cavity 22 to form side electrodes 29.
  • the composite substrate 3 is mounted on the resin multilayer substrate 2 by embedding a part of the composite substrate 3 in the cavity 22 formed on the main surface 4 of the resin multilayer substrate 2.
  • the connection terminal 9 is electrically connected to the side electrode 29.
  • the electrical resistance can be reduced as compared with a configuration in which only the via conductor 6 is used for electrical connection between the wiring 8 and the core substrate 31.
  • the metal pins By extending the metal pins in the thickness direction of the resin multilayer substrate 2, the bending stress acting on the core substrate 31 when the bending stress acts on the resin multilayer substrate 2 can be reduced. Therefore, the composite substrate 3 and the resin multilayer substrate 2 can be reduced. Connection reliability can be improved.
  • the outer peripheral surface of the connection terminal 9 exposed on the outer surface 39 of the composite substrate 3 is exposed on the inner surface 26 of the cavity 22.
  • the core substrate 31 of the composite substrate 3 and the wiring 8 are electrically connected by contacting the side electrode 29 that is present.
  • the composite substrate 3 having the solder applied to the side electrode 29 is inserted into the cavity 22, the side electrode 29 is brought into contact with the wiring 8, the solder is melted in this state, and then cooled, so that the side electrode 29 The metal is joined to 8 via solder. If the side electrode 29 and the wiring 8 are fixed in this way, the composite substrate 3 can be prevented from coming out of the cavity 22.
  • the composite substrate 3 can be attached to and detached from the resin multilayer substrate 2 by electrically connecting the side electrode 29 and the wiring 8 by physical contact.
  • the side electrode 29 extending in the thickness direction of the resin multilayer substrate 2 is less susceptible to the stress caused by bending or twisting of the resin multilayer substrate 2. Therefore, the bonding strength between the composite substrate 3 and the resin multilayer substrate 2 can be improved by bonding using the side surface in addition to the front end surface of the connection terminal 9. Connection reliability can be improved.
  • the electrodes that electrically connect the composite substrate 3 and the resin multilayer substrate 2 are not exposed to the outside. As a result, since the electrode can be prevented from being directly subjected to electrostatic discharge, the electrostatic resistance of the component-embedded resin multilayer substrate 101 can be improved.
  • the side electrode 29 is formed by the via conductor 6 extending in the thickness direction of the resin layer 21 constituting the resin multilayer substrate 2.
  • the side electrode 29 can be easily formed without the need for complicated work steps in forming the side electrode 29.
  • the composite substrate 3 includes a component 32 mounted on the facing surface 37 side of the core substrate 31 and a second component 34 mounted on the back surface 38 side of the core substrate 31.
  • the composite substrate 3 having components mounted on both sides of the core substrate 31 is mounted on the resin multilayer substrate 2, so that the mounting density of components on the resin multilayer substrate 2 can be further increased.
  • the method for manufacturing the component-embedded resin multilayer substrate 101 in the present embodiment includes a step of preparing a perforated resin sheet in which a plurality of through holes penetrating in the thickness direction are formed, a resin sheet, and another resin sheet are laminated.
  • the composite substrate 3 including the step of forming the resin multilayer substrate 2 having the cavity 22 formed on the main surface 4 by pressure bonding and the core substrate 31 and the plurality of components 32 mounted on the core substrate 31 is inserted into the through hole. And mounting on the resin multilayer substrate 2.
  • FIG. 3 to FIG. 15 the method for manufacturing the component-embedded resin multilayer substrate 101 in the present embodiment will be described in more detail.
  • the resin sheet with conductor foil 12 is a sheet having a structure in which the conductor foil 17 is attached to one surface of the resin layer 21.
  • the resin layer 21 is made of, for example, a thermoplastic resin.
  • the thermoplastic resin may be, for example, LCP (liquid crystal polymer), PEEK (polyether ether ketone), PEI (polyether imide), PPS (poniphenylene sulfide), thermoplastic PI (polyimide), and the like.
  • the material of the conductor foil 17 may be Cu, Ag, Al, SUS, Ni, Au, or may be an alloy of two or more different metals selected from these metals.
  • the thickness of the conductor foil 17 may be any thickness that allows circuit formation of about 2 ⁇ m to 50 ⁇ m.
  • the conductor foil 17 may be a foil having a thickness of 18 ⁇ m.
  • the surface of the conductive foil 17 is formed so that the surface roughness Rz is 3 ⁇ m, for example.
  • the following conductor pattern forming operation may proceed. However, as another method, Next, prepare a plurality of resin sheets with strip-shaped areas that should be cut out individually, proceed with the formation work of the following conductor patterns etc. in large size, and then cut into strips Also good. Here, the description will be continued assuming that the strip-shaped resin sheet 12 with conductive foil has already been cut out.
  • the resin layer 21 is penetrated by irradiating the surface of the resin layer 21 side opposite to the surface to which the conductor foil 17 of the resin sheet 12 with conductor foil adheres with a carbon dioxide laser beam.
  • the via hole 11 is formed as described above.
  • the via hole 11 penetrates the resin layer 21 but does not penetrate the conductor foil 17.
  • the smear in the via hole 11 is removed by chemical treatment such as permanganic acid as necessary.
  • a laser beam of a different type from the carbon dioxide laser beam may be used. However, it is preferable to use laser light that penetrates the resin layer 21 but does not penetrate the conductor foil 17.
  • a method other than laser beam irradiation, such as punching may be employed.
  • a resist pattern 13 corresponding to a desired circuit pattern is printed on the surface of the conductor foil 17 of the resin sheet 12 with a conductor foil by a method such as screen printing.
  • etching is performed using the resist pattern 13 as a mask, and as shown in FIG. 6, the portion of the conductor foil 17 that is not covered with the resist pattern 13 is removed. A portion of the conductor foil 17 remaining after the etching becomes the conductor pattern 7. Thereafter, the resist pattern is removed using a cleaning solution or the like.
  • the order of forming the via hole 11 and the conductor pattern 7 is not limited to the order described above, and may be the order in which the via hole 11 is formed after the conductor pattern 7 is formed.
  • a conductive paste is filled into the via hole 11 formed in the resin layer 21 by screen printing or the like. Screen printing is performed from the surface on the side where the conductor pattern 7 is not disposed, that is, the lower surface in FIG. Actually, when performing screen printing, the orientation of the perforated resin sheet may be appropriately changed.
  • the conductive paste to be filled may contain an appropriate amount of metal powder that forms an alloy layer with the metal that is the material of the conductor pattern 7 at the temperature when the laminated resin layer 21 is thermocompression bonded later. preferable.
  • This conductive paste preferably contains at least one of Ag, Cu, and Ni and at least one of Sn, Bi, and Zn.
  • the configuration shown in FIG. 8 is obtained in which the via conductor 6 is inserted into the through hole of the perforated resin sheet and the via conductor 6 penetrating the resin layer 21 in the thickness direction is formed.
  • through holes 14 are formed in the resin layer 21 by punching.
  • the through hole 14 has an area corresponding to the projected area of the composite substrate 3.
  • the punching die and the resin layer 21 are relatively moved in a direction along the thickness direction of the resin layer 21.
  • the mold moves relative to the resin layer 21 so that the periphery of the mold passes through the via conductor 6.
  • the resin layer 21 is punched out so that the via conductor 6 is partially cut, and the through hole 14 is formed.
  • the via conductor 6 is exposed on the inner surface of the through hole 14.
  • a plurality of resin layers 21 including the perforated resin sheet shown in FIG. 9 and another resin sheet are laminated to form a laminate.
  • the plurality of resin layers forming the laminated body include a resin layer in which the through holes 14 are formed and a resin layer in which the through holes 14 are not formed.
  • pressure and heat are applied to the laminate of the plurality of resin layers 21.
  • the plurality of resin layers 21 included in the laminate are thermocompression bonded together, and as a result, the resin multilayer substrate 2 shown in FIG. 10 is formed.
  • the resin multilayer substrate 2 shown in FIG. 10 two resin layers 21 having through holes 14 are stacked on a resin layer 21 having no through holes 14 formed thereon.
  • a cavity 22 is formed by combining two through holes 14.
  • the resin layer 21 has an arbitrary depth (that is, a distance between the main surface 4 and the bottom surface 25 in the thickness direction of the resin multilayer substrate 2).
  • a cavity 22 is formed.
  • the perforated resin sheet shown in FIG. 9 is on the side away from the main surface 4 of the resin multilayer substrate 2, that is, on the bottom surface 25 of the cavity 22, of the two resin layers 21 forming the cavity 22. Laminated on the near side. As a result, a side electrode 29 where the wiring 8 is exposed to the inner side surface 26 of the cavity 22 is formed on a part of the inner side surface 26 of the cavity 22 on the side close to the bottom surface 25.
  • the composite substrate 3 is prepared.
  • the composite substrate 3 is manufactured by the following steps. First, as shown in FIG. 11, a base substrate 131 is prepared.
  • the base substrate 131 is a collective substrate that can cut out a plurality of substrates to be the core substrate 31 by being cut along a cutting line CL indicated by a two-dot chain line in FIG.
  • the base substrate 131 has a front surface 137 and a back surface 138.
  • the surface 137 is one main surface of the base substrate 131 corresponding to the facing surface 37 of the core substrate 31.
  • the back surface 138 is the other main surface of the base substrate 131 corresponding to the back surface 38 of the core substrate 31.
  • the base substrate 131 is formed of a printed circuit board (PCB), a low-temperature co-fired ceramic (LTCC), an alumina substrate, a glass substrate, a composite material substrate, a single layer substrate, a multilayer substrate, or the like using a resin or a polymer material.
  • the base substrate 131 may be formed by selecting an optimal material as appropriate according to the purpose of use of the composite substrate 3.
  • the base substrate 131 is a multilayer ceramic substrate in which a plurality of ceramic green sheets are laminated and fired.
  • the ceramic green sheet is a sheet obtained by forming a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent. Via holes are formed at predetermined positions of the ceramic green sheet by laser processing, etc., and the via holes formed are filled with a conductor paste containing Ag, Cu, etc., and via conductors for interlayer connection are formed.
  • the electrode pattern is formed. Thereafter, the ceramic green sheets are laminated and pressed to form a ceramic laminate, and the ceramic laminate is fired at a low temperature of about 1000 ° C. at a so-called low temperature to form the base substrate 131.
  • the base substrate 131 is provided with various electrode patterns such as mounting electrodes and external connection electrodes on which the internal wiring, the terminal assembly, and the component 32 are mounted.
  • the base substrate 131 is formed using the LTCC substrate, first, a ceramic slurry is coated on a PET film and then dried to form a ceramic green sheet having a thickness of 10 to 200 ⁇ m. A via hole having a diameter of about 0.1 mm is formed on the prepared ceramic green sheet from the PET film side by a mold, a laser, or the like. Next, an electrode paste kneaded with metal powder containing silver or copper as a main component, resin, and organic solvent is filled in the via hole and dried. Then, an equivalent electrode paste is screen-printed in a desired pattern on the ceramic green sheet and dried.
  • a plurality of ceramic green sheets are stacked and pressure-bonded at a pressure of 100-1500 kg / cm 2 and a temperature of 40-100 ° C.
  • the electrode paste is mainly composed of silver
  • the electrode paste is fired at about 850 ° C. in air, and when copper is the main component, it is fired at about 950 ° C. in a nitrogen atmosphere.
  • a base substrate 131 is formed by depositing Au or the like by wet plating or the like.
  • solder 132 is printed on a desired surface electrode among the surface electrodes of the base substrate 131.
  • the solder 132 is printed at a position where a plurality of components 32 are to be mounted, and the solder 132 is printed so as to straddle both sides of the cutting line CL.
  • a plurality of components 32 that are electronic components such as various chip components, integrated circuits, or semiconductor elements are printed on the solder 132 on the surface 137 that is one main surface of the base substrate 131.
  • the surface electrode Mount on the surface electrode.
  • the second component 34 which is an electronic component, is mounted at a predetermined position on the back surface 138, which is the other main surface of the base substrate 131, using the bonding member 35.
  • a plurality of terminal connection substrates 109 are further mounted on the surface 137.
  • the terminal connection substrate 109 is mounted on the surface electrode of the base substrate 131 at a position where it does not come into contact with the plurality of components 32 mounted on the surface 137.
  • the terminal connection substrate 109 may be arranged on two opposite sides of the outer periphery of the base substrate 131, or the terminal connection substrate 109 may be arranged on the four sides of the outer periphery of the base substrate 131. Also good.
  • the terminal connection substrate 109 is formed of a copper foil having a predetermined thickness. The thickness of the terminal connection substrate 109 is determined so that the height at which the terminal connection substrate 109 protrudes from the surface 137 is larger than the height at which the component 32 protrudes from the surface 137.
  • the copper foil may be made of pure copper, or may be made of a copper alloy such as an alloy in which iron is mixed with copper at a ratio of 0.1% to 20%, phosphor bronze, brass or the like. Since copper alloy has higher workability than pure copper, it has the advantage that burrs and elongation are less likely to occur during subsequent cutting with a dicer and polishing of the upper surface.
  • the terminal connection substrate 109 may be formed of another metal conductor such as Au, Ag, or Al.
  • the component 32, the second component 34, and the terminal connection substrate 109 may be mounted by a general surface mounting technique such as ultrasonic vibration bonding in addition to solder reflow.
  • the base substrate 131 is cut along the cutting line CL using a dicer.
  • the terminal connection substrate 109 is also divided at the same time.
  • the base substrate 131 is singulated and the core substrate 31 is formed.
  • the core substrate 31 has a facing surface 37 and a back surface 38, a plurality of components 32 and connection terminals 9 are mounted on the facing surface 37, and a second component 34 is mounted on the back surface 38. Since the terminal connection substrate 109 is disposed so as to straddle the cutting line CL, a structure in which the connection terminal 9 is exposed to the side surface is obtained as shown in FIGS.
  • a resin sheet is laminated on both the facing surface 37 and the back surface 38 of the core substrate 31.
  • a sealing resin 33 for sealing the component 32 mounted on the opposing surface 37 and a sealing resin 36 for sealing the second component 34 mounted on the back surface 38 are formed.
  • the facing surface 37 of the core substrate 31 is filled with the sealing resin 33, and the component 32 mounted on the facing surface 37 of the core substrate 31 is sealed with the sealing resin 33.
  • the back surface 38 of the core substrate 31 is filled with the sealing resin 36, and the second component 34 mounted on the back surface 38 of the core substrate 31 is sealed with the sealing resin 36.
  • the resin sheet may be formed of a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin.
  • an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide
  • a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin.
  • the sealing resins 33 and 36 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
  • the resin sheets may be laminated and cured together on both the opposing surface 37 and the back surface 38, but the resin sheets may be laminated and cured separately on the opposing surface 37 and the back surface 38, respectively.
  • the surface of the sealing resin 33 on the side away from the core substrate 31, that is, the upper surface of the sealing resin 33 shown in FIG. 15 may be polished using a roller blade or the like. Thereby, even when the heights of the plurality of connection terminals 9 vary, the shape of the plurality of connection terminals 9 exposed from the top surface of the sealing resin 33 as a result of polishing the cured sealing resin 33. Can be substantially matched.
  • the composite substrates 3 shown in FIG. 15 may be individually manufactured according to the above-described steps. However, after forming an aggregate of a plurality of composite substrates 3, the composite substrates 3 are separated into individual composite substrates 3. May be manufactured.
  • the composite substrate 3 manufactured in this way is mounted on the main surface 4 of the resin multilayer substrate 2.
  • a cavity 22 is formed on the main surface 4 of the resin multilayer substrate 2, and a side electrode 29 is exposed on the inner side surface 26 of the cavity 22.
  • the connection terminals 9 are exposed on the outer surface 39 of the composite substrate 3. Therefore, by inserting the composite substrate 3 into the cavity 22, the side electrode 29 and the connection terminal 9 are in surface contact, and the wiring 8 and the core substrate 31 are electrically connected.
  • the composite substrate 3 is bonded to the resin multilayer substrate 2 using solder, whereby the mounting of the composite substrate 3 on the resin multilayer substrate 2 is completed, and the component built-in resin multilayer substrate 101 shown in FIG. 1 is obtained.
  • the manufacturing method in this way it is possible to easily obtain the component built-in resin multilayer substrate 101 in which the composite substrate 3 is partially accommodated in the cavity 22 and the thickness is reduced. Due to the flexibility of the resin multilayer substrate 2, the adhesion between the resin multilayer substrate 2 and the composite substrate 3 can be improved, and the holding power of the composite substrate 3 can be increased. Since the composite substrate 3 and the resin multilayer substrate 2 are electrically connected when the side surface of the connection terminal 9 is in contact with the side electrode 29, the connection strength between the composite substrate 3 and the resin multilayer substrate 2 is improved. The reliability can be improved and the static electricity resistance of the component built-in resin multilayer substrate 101 can be improved.
  • FIGS. 1 and 2 A component built-in resin multilayer substrate 101 according to the second embodiment of the present invention will be described with reference to FIGS.
  • the entire core substrate 31 is accommodated in a cavity 22 formed on the main surface 4 of the resin multilayer substrate 2.
  • the number of portions of the composite substrate 3 that are embedded in the resin multilayer substrate 2 is increased as compared with the first embodiment. With this configuration, the holding power of the composite substrate 3 by the resin multilayer substrate 2 can be further improved.
  • connection terminals 9 exposed on the outer surface 39 of the composite substrate 3 are pierced by via conductors 6 formed inside the resin multilayer substrate 2.
  • the via conductor 6 is made of a conductive paste mainly composed of Ag, a conductive paste mainly composed of Sn—Ag alloy, a conductive paste mainly composed of bismuth, a tin solder material, or a conductive material such as copper. Is formed. Since the formation material of the via conductor 6 becomes soft when heated, the formation material of the connection terminal 9 becomes relatively hard compared to the formation material of the via conductor 6.
  • the composite substrate 3 is inserted into the cavity 22 and the tip end surface of the connection terminal 9 is in contact with the via conductor 6 while being heated to about the reflow temperature, the composite substrate 3 is further directed into the resin multilayer substrate 2.
  • the via conductor 6 is easily deformed by pushing it forward.
  • the structure shown in FIG. 16 in which the connection terminal 9 is pierced into the via conductor 6 is obtained.
  • the outer peripheral surface of the connection terminal 9 is in contact with the side electrode 29 formed by the deformed via conductor 6. Thereby, the electrical connection between the wiring 8 and the core substrate 31 via the connection terminal 9 can be reliably formed.
  • FIG. 18 illustrates a state in which the resin layer 21 in which the via conductors 6 are formed through the same process as in the first embodiment is viewed in a plan view.
  • a two-dot chain line shown in FIG. 18 indicates a cutting line CL where a part of the resin layer 21 is cut by the laser processing of the resin layer 21.
  • the via conductor is formed in the cavity 22 formed by melting the resin layer 21.
  • the structure shown in FIG. 19 in which 6 remains is obtained. Thereby, a configuration in which the side electrode 29 is exposed on the inner side surface 26 of the cavity 22 is obtained.
  • the side electrode 29 is disposed at a position corresponding to the connection terminal 9 provided on the composite substrate 3 in plan view. Therefore, as described above, the connection terminal 9 can be reliably connected to the wiring 8 by fitting the composite substrate 3 into the cavity 22.
  • Laser processing of the resin layer 21 along the cutting line CL may be performed after laminating only the plurality of resin layers 21 in which through holes for forming the cavity 22 are to be formed.
  • the main surface 4 of the resin multilayer substrate 2 has a first main surface 4a and a second main surface 4b opposite to the first main surface 4a.
  • a conductor pattern 7 extending in the surface direction of the resin layer 21 is formed on the main surface of one of the resin layers 21 constituting the resin multilayer substrate 2.
  • a part of the conductor pattern 7 protrudes into the cavity 22.
  • the conductor pattern 7 has an end 7 a that protrudes into the cavity 22.
  • the side electrode 29 is formed of a conductor pattern 7 whose end 7a is bent away from the first main surface 4a and closer to the second main surface 4b.
  • the side electrode 29 is exposed from the inner side surface 26 of the cavity 22 and disposed inside the cavity 22.
  • the cavity 22 of the third embodiment has an area that is slightly larger than the projected area of the composite substrate 3 in plan view.
  • the conductor pattern 7 extends in the surface direction.
  • the end 7 a of the conductor pattern 7 protrudes toward the inner side of the cavity 22 with respect to the inner side surface 26 of the cavity 22.
  • FIG. 21 shows a configuration in which the end portions 7a of the pair of conductor patterns 7 protrude into the cavity 22 on both the left and right sides in the figure, and the pair of end portions 7a are respectively seen in plan view in the composite substrate 3. It overlaps with the projection.
  • the conductor pattern 7 is formed of conductor foil as described in the first embodiment, it can be easily elastically deformed.
  • the composite substrate 3 and the resin multilayer substrate 2 are moved relative to each other so that the composite substrate 3 is disposed inside the cavity 22 from the state where the composite substrate 3 shown in FIG. Contacts the end 7 a of the conductor pattern 7. Further, by pushing the composite substrate 3 into the cavity 22, the conductor pattern 7 in contact with the composite substrate 3 is such that the end portion 7a is away from the first main surface 4a and approaches the second main surface 4b as shown in FIG. Bend to. Then, in the state shown in FIG. 20 where the mounting of the composite substrate 3 on the resin multilayer substrate 2 is completed, the end 7a of the conductor pattern 7 is electrically connected to the surface exposed to the outer surface 39 of the connection terminal 9.
  • the side electrode 29 is formed.
  • the bonding strength between the composite substrate 3 and the resin multilayer substrate 2 is increased. Can be improved.
  • the conductor pattern 7 forming the side electrode 29 is elastically deformed again and returns to the shape extending in the surface direction shown in FIG. Therefore, the component built-in resin multilayer substrate 101 in which the composite substrate 3 can be freely attached to and detached from the resin multilayer substrate 2 can be provided.
  • the conductor pattern 7 forming the side electrode 29 is disposed inside the resin multilayer substrate 2.
  • the conductor pattern 7 of the fourth embodiment is the resin multilayer substrate 2. Is arranged on the first main surface 4a.
  • FIG. 24 a component built-in resin multilayer substrate 101 according to the fifth embodiment of the present invention will be described.
  • the end portion 7a of the conductor pattern 7 and the resin layer 21 on the second main surface 4b side with respect to the conductor pattern 7 are the first main surface. It is bent integrally on the side away from 4a and approaching the second main surface 4b.
  • the bent conductor pattern 7 forms a side electrode 29.
  • the main surface 4 of the resin multilayer substrate 2 has a first main surface 4a and a second main surface 4b opposite to the first main surface 4a.
  • the composite substrate 3 is mounted on both the first main surface 4a and the second main surface 4b.
  • each of the connection terminals 9 penetrates the via conductor 6.
  • the composite substrate 3 When viewing the component built-in resin multilayer substrate 101 in a plan view, the composite substrate 3 is mounted on the upper first main surface 4a in FIG. 25, and is mounted on the lower second main surface 4b in FIG. The composite substrate 3 is disposed so as to overlap each other.
  • the components 32 are mounted on both main surfaces 4 of the resin multilayer substrate 2, so that the mounting density of the components 32 on the resin multilayer substrate 2 can be increased. Therefore, the size of the component built-in resin multilayer substrate 101 can be reduced.
  • the composite substrate among the resin multilayer substrates 2 is more difficult to bend. Therefore, since the bending stress acting on the composite substrate 3 can be further reduced, the connection stability between the composite substrate 3 and the resin multilayer substrate 2 can be further improved.
  • the composite substrate 3 that is detachable from the resin multilayer substrate 2 described in the third and fourth embodiments has both the first main surface 4a and the second main surface 4b as in the sixth embodiment. Has been implemented. Thereby, since the mounting density of the components 32 on the resin multilayer substrate 2 can be increased, the size of the component-embedded resin multilayer substrate 101 can be reduced.
  • the composite substrate 3 mounted on the surface 4b is disposed so as to overlap each other. From the viewpoint of suppressing deformation of the resin multilayer substrate 2 sandwiched between the composite substrates 3, the arrangement of the sixth embodiment in which the pair of composite substrates 3 almost completely overlap each other in the thickness direction of the resin multilayer substrate 2 is most preferable.
  • 2 resin multilayer substrate 3 composite substrate, 4 main surface, 4a first main surface, 4b second main surface, 6 via conductor, 7 conductor pattern, 7a end, 8 wiring, 9 connection terminal, 21 resin layer, 22 cavity , 25 bottom surface, 26 inner surface, 29 side electrode, 31 core substrate, 32 components, 33, 36 sealing resin, 34 second component, 35 bonding member, 37 facing surface, 38 back surface, 39 outer surface, 101 component built-in Resin multilayer substrate.

Abstract

L'invention concerne un substrat multicouche en résine à composant intégré qui est apte à améliorer une fiabilité d'une connexion entre un substrat composite et le substrat multicouche en résine. Un substrat multicouche en résine à composant intégré (101) est pourvu d'un substrat multicouche en résine (2), et d'un substrat composite (3). Le substrat multicouche en résine (2) est formé par empilement d'une pluralité de couches de résine (21), un fil (8) étant formé dans l'intérieur du substrat, et une cavité étant formée dans la surface principale (4) de celui-ci. Le substrat composite (3) comprend des composants (32), un substrat de cœur (31) sur lequel les composants (32) sont montés, et des bornes de connexion (9) qui connectent électriquement le fil (8) et le substrat de cœur (31). Le fil (8) comprend des électrodes de surface latérale (29) qui sont exposées sur les surfaces latérales internes de la cavité. Les bornes de connexion (9) sont exposées sur les surfaces latérales externes (39) du substrat composite, et sont électriquement connectées aux électrodes de surface latérale (29).
PCT/JP2014/052664 2013-02-12 2014-02-05 Substrat multicouche en résine à composant intégré, et substrat multicouche en résine WO2014125973A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015500201A JP6139653B2 (ja) 2013-02-12 2014-02-05 部品内蔵樹脂多層基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-024530 2013-02-12
JP2013024530 2013-02-12

Publications (1)

Publication Number Publication Date
WO2014125973A1 true WO2014125973A1 (fr) 2014-08-21

Family

ID=51353980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/052664 WO2014125973A1 (fr) 2013-02-12 2014-02-05 Substrat multicouche en résine à composant intégré, et substrat multicouche en résine

Country Status (2)

Country Link
JP (1) JP6139653B2 (fr)
WO (1) WO2014125973A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220428A (ja) * 2013-05-09 2014-11-20 株式会社デンソー 多層基板およびその製造方法
JP2016134593A (ja) * 2015-01-22 2016-07-25 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子部品収納用パッケージの製造方法
JP2016136615A (ja) * 2015-01-23 2016-07-28 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵基板およびその製造方法
JP2020527702A (ja) * 2017-07-09 2020-09-10 日本テキサス・インスツルメンツ合同会社 マザーボードとドーターボードとの間に焼結接続を備えるテストフィクスチャ
WO2022102444A1 (fr) * 2020-11-10 2022-05-19 株式会社村田製作所 Module de composant électronique et procédé de fabrication de module de composant électronique
US11355427B2 (en) * 2016-07-01 2022-06-07 Intel Corporation Device, method and system for providing recessed interconnect structures of a substrate
US11448914B2 (en) 2019-10-31 2022-09-20 Canon Kabushiki Kaisha Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3709777A1 (fr) 2019-03-11 2020-09-16 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Connexion de support de composant sans soudure à l'aide d'un élément élastique et procédé
US20230354525A1 (en) * 2021-05-06 2023-11-02 Innoscience (Suzhou) Technology Co., Ltd. Nitride-based semiconductor module and method for manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750482A (ja) * 1993-08-05 1995-02-21 Fujitsu Ltd プリント板の接続方法
JPH10321987A (ja) * 1997-05-15 1998-12-04 Sony Corp プリント配線基板及びその製造方法
JP2003045762A (ja) * 2001-07-31 2003-02-14 Matsushita Electric Ind Co Ltd 回路モジュール
JP2005317908A (ja) * 2004-03-31 2005-11-10 Alps Electric Co Ltd 素子内蔵基板および素子内蔵基板の製造方法
JP2008177506A (ja) * 2007-01-22 2008-07-31 Fujifilm Corp 電子部品実装方法及びこれを用いた電子部品実装基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000200977A (ja) * 1998-10-26 2000-07-18 Taiyo Yuden Co Ltd ハイブリッドモジュ―ル
JP4501524B2 (ja) * 2004-05-07 2010-07-14 株式会社村田製作所 セラミック多層基板およびその製造方法
JP4765330B2 (ja) * 2005-02-02 2011-09-07 株式会社村田製作所 積層型電子部品を内蔵した多層配線基板及び多層配線基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750482A (ja) * 1993-08-05 1995-02-21 Fujitsu Ltd プリント板の接続方法
JPH10321987A (ja) * 1997-05-15 1998-12-04 Sony Corp プリント配線基板及びその製造方法
JP2003045762A (ja) * 2001-07-31 2003-02-14 Matsushita Electric Ind Co Ltd 回路モジュール
JP2005317908A (ja) * 2004-03-31 2005-11-10 Alps Electric Co Ltd 素子内蔵基板および素子内蔵基板の製造方法
JP2008177506A (ja) * 2007-01-22 2008-07-31 Fujifilm Corp 電子部品実装方法及びこれを用いた電子部品実装基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220428A (ja) * 2013-05-09 2014-11-20 株式会社デンソー 多層基板およびその製造方法
JP2016134593A (ja) * 2015-01-22 2016-07-25 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子部品収納用パッケージの製造方法
JP2016136615A (ja) * 2015-01-23 2016-07-28 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵基板およびその製造方法
US11355427B2 (en) * 2016-07-01 2022-06-07 Intel Corporation Device, method and system for providing recessed interconnect structures of a substrate
JP2020527702A (ja) * 2017-07-09 2020-09-10 日本テキサス・インスツルメンツ合同会社 マザーボードとドーターボードとの間に焼結接続を備えるテストフィクスチャ
JP7339237B2 (ja) 2017-07-09 2023-09-05 テキサス インスツルメンツ インコーポレイテッド マザーボードとドーターボードとの間に焼結接続を備えるテストフィクスチャ
US11448914B2 (en) 2019-10-31 2022-09-20 Canon Kabushiki Kaisha Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device
WO2022102444A1 (fr) * 2020-11-10 2022-05-19 株式会社村田製作所 Module de composant électronique et procédé de fabrication de module de composant électronique

Also Published As

Publication number Publication date
JP6139653B2 (ja) 2017-05-31
JPWO2014125973A1 (ja) 2017-02-02

Similar Documents

Publication Publication Date Title
JP6139653B2 (ja) 部品内蔵樹脂多層基板
JP6149920B2 (ja) リジッドフレキシブル基板およびその製造方法
JP4453702B2 (ja) 複合型電子部品及びその製造方法
JP5610064B2 (ja) 部品内蔵樹脂基板およびその製造方法
JP5093353B2 (ja) 部品内蔵モジュールの製造方法及び部品内蔵モジュール
WO2012137548A1 (fr) Substrat multicouche à composant de puce intégré et son procédé de fabrication
TW201251556A (en) Printed circuit board and method for manufacturing the same
JP2014107552A (ja) 多層回路基板及びその製作方法
JP2007273654A (ja) フレキシブル回路基板、フレキシブル回路基板の製造方法および電子機器
JPWO2009037833A1 (ja) 立体プリント配線板およびその製造方法ならびに電子部品モジュール
WO2012117872A1 (fr) Substrat de résine doté d'un composant électronique incorporé
JPWO2011148915A1 (ja) モジュール基板およびその製造方法
JP2012064600A (ja) 多層基板およびその製造方法
TW201429326A (zh) 具有內埋元件的電路板、其製作方法及封裝結構
JP2007335675A (ja) 電源装置および電源装置の製造方法
JP4598140B2 (ja) 部品内蔵配線板、部品内蔵配線板の製造方法
JP2010021368A (ja) 部品内蔵配線基板及びその製造方法
JP2008182039A (ja) 多層配線板およびその製造方法
JP2014157857A (ja) 部品内蔵樹脂多層基板およびその製造方法
JP2012089568A (ja) 有機多層基板及びその製造方法
KR101109287B1 (ko) 전자부품 내장형 인쇄회로기판 및 그 제조방법
TWI477214B (zh) 具有內埋元件的電路板及其製作方法
JP2005045228A (ja) 光学情報記録媒体とその製造方法
JP6387226B2 (ja) 複合基板
KR100797693B1 (ko) 칩 내장형 인쇄회로기판의 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14752021

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2015500201

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14752021

Country of ref document: EP

Kind code of ref document: A1