Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
  • B29C33/68—Release sheets
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
  • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
  • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/06—Interconnection of layers permitting easy separation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
  • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
  • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
  • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
  • B29K2023/04—Polymers of ethylene
  • B29K2023/08—Copolymers of ethylene
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/748—Releasability
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment

Definitions

• the present invention relates to a release film excellent in releasability (peelability) from adhesives / adhesives such as acrylic resin adhesives / epoxy adhesives, and a method for producing the same.
• the adhesive tape wound up in a coil shape is subjected to a release treatment on the back surface of the base material so that the adhesive layer can be easily peeled off from the back surface of the base material, or a pressure-sensitive adhesive sheet used for joining various articles.
• a release liner laminated on the surface of the adhesive layer for the purpose of protecting the adhesive layer until use.
• a release film is used when a copper-clad laminate or a copper foil is hot-pressed through a prepreg or a heat-resistant film. .
• a release film is used in the manufacturing process of the flexible printed circuit board.
• Silicone mold release agents are generally used as mold release agents used for mold release treatments on the back side of such base materials and release liners on the surface of adhesive layers, or release films used in the manufacturing process of printed wiring boards. Has been used.
• a silicone-based mold release agent such as dimethylpolysiloxane is applied to the surface of the substrate (the surface that does not have an adhesive layer) and crosslinked by irradiation with temperature, light, electron beam, etc.
• a method for improving the releasability of an adhesive layer in contact with a film is known.
• a silicone compound such as a low molecular weight silicone resin, siloxane, or silicone oil contained in a silicone-based release agent applied to the surface of the substrate (the surface that does not have an adhesive layer)
• a silicone-based release agent contained in a silicone-based release agent applied to the surface of the substrate (the surface that does not have an adhesive layer)
• the adhesive performance is deteriorated by moving to the adjacent adhesive layer.
• the silicone compound that has migrated to the adhesive layer when used for fixing electronic device components, the silicone compound that has migrated to the adhesive layer generates siloxane gas, which causes a problem of corrosion or malfunction of the electronic device.
• Patent Document 1 Japanese Patent Laid-Open No. 55-65281
• a release sheet supporting substrate is separated by an ethylene- ⁇ / olefin copolymer resin having a crystallinity of 40% or less through a polyolefin resin layer.
• Patent Document 2 Japanese Patent Laid-Open No. 6-99551
• Patent Document 3 Japanese Patent No. 4531911
• Patent Document 3 Japanese Patent No. 4531911
• an ethylene / ⁇ -olefin random copolymer having a density of 0.80 to 0.90 g / cm 3 described in Patent Document 1 or Patent Document 2, or a crystallinity of 40% or less (density When an ethylene / ⁇ -olefin random copolymer of 0.8 to 0.95 g / cm 3 ) is used, the releasability from the acrylic resin-based adhesive / adhesive layer may still be inferior.
• the problems of the present invention are excellent in releasability (peelability) from adhesives / adhesives such as acrylic resin-based adhesives and epoxy resin adhesives, and the release layer is not sticky,
• the object is to obtain a release film having contamination.
• a release layer obtained from an ethylene / ⁇ -olefin random copolymer (A) having a density of 850 to 880 kg / m 3 and a melting point (Tm) of 63 ° C. or less is laminated on one surface of a base material layer.
• the release layer has a release strength of 0.1 to 1 N / 50 mm with respect to the acrylic resin-based adhesive / adhesive.
• the present invention also provides a release layer obtained from an ethylene / ⁇ -olefin random copolymer (A) having a density of 850 to 880 kg / m 3 and a melting point (Tm) of 63 ° C. or less on one side of the base material layer.
• A ethylene / ⁇ -olefin random copolymer
• Tm melting point
• the release film of the present invention has a very low peel strength of 0.1 to 0.7 N / 50 mm from an adhesive / adhesive such as an acrylic resin-based adhesive / epoxy adhesive or an epoxy resin-based adhesive, and has excellent releasability
• an adhesive / adhesive such as an acrylic resin-based adhesive / epoxy adhesive or an epoxy resin-based adhesive
• the release layer is not sticky and has a non-silicone release layer, there is no contamination with silicon compounds, and the residual adhesion rate indicating non-contamination is good at about 90%.
• the release film of the present invention has good writing properties of the release layer.
• the base material layer constituting the release film of the present invention includes various known thermoplastic resins such as polyolefin (polyethylene, polypropylene, poly-4-methyl / 1-pentene, poly-1-butene, etc.), polyester (polyethylene terephthalate, Polybutylene terephthalate, polyethylene naphthalate, etc.), polyamide (nylon-6, nylon-66, polymetaxylene adipamide, etc.), polyvinyl chloride, polyimide, ethylene / vinyl acetate copolymer or saponified product thereof, polyvinyl alcohol, A film made of polyacrylonitrile, polycarbonate, polystyrene, ionomer, or a mixture thereof.
• thermoplastic resins preferred are thermoplastic resins having good stretchability and transparency, such as polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyamide, and polypropylene.
• the base material layer according to the present invention may be an unstretched film or a uniaxially or biaxially stretched film.
• the base material layer according to the present invention may be a single layer or a multilayer of two or more layers.
• biaxially stretched films made of polyester such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate are particularly preferable because they are excellent in solvent resistance and heat resistance.
• the surface of the substrate layer according to the present invention is subjected to surface activation treatment such as corona treatment, plasma treatment, undercoat treatment, primer coat treatment, frame treatment, etc. You may keep going.
• surface activation treatment such as corona treatment, plasma treatment, undercoat treatment, primer coat treatment, frame treatment, etc. You may keep going.
• Ethylene ⁇ alpha-olefin random copolymer constituting the release layer constituting the release film of the present invention has a density of 850 ⁇ 880kg / m 3, preferably 855 ⁇ 875kg / m 3, a melting point (Tm ) Is 63 ° C. or lower, preferably 58 ° C. or lower, and carbon number of 3 or more, preferably propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene, etc. Random copolymers with 3 to 10 ⁇ -olefins.
• the copolymer having a melting point (Tm) of 63 ° C. or lower includes an ethylene / ⁇ -olefin random copolymer that does not clearly show the melting point (Tm), that is, has no melting point (Tm). .
• An ethylene / ⁇ -olefin random copolymer having a density exceeding 880 kg / m 3 or an ethylene / ⁇ -olefin random copolymer having a melting point (Tm) exceeding 63 ° C. may be used for the release layer of the release film. It is inferior in peelability from the adhesive / adhesive, and even when irradiated with energy rays, the releasability from the adhesive / adhesive is not improved.
• An ethylene / ⁇ -olefin random copolymer having a density exceeding 880 kg / m 3 or an ethylene / ⁇ -olefin random copolymer having a melting point (Tm) exceeding 63 ° C. is soluble in an organic solvent such as toluene or hexane. Even if it is difficult to form a release layer with a uniform thickness because it is difficult, or even if it is dissolved in an organic solvent, it can be used as a release layer for a release film as described above. In addition, the releasability from the adhesive / adhesive agent is not improved by irradiation with energy rays.
• the ethylene content is not particularly limited as long as the density and the melting point (Tm) are in the above ranges, but usually in the range of 70 to 92 mol%. It is in.
• the ethylene / ⁇ -olefin random copolymer (A) according to the present invention usually has an MFR (load: 2160 g, temperature: 190 ° C.) of 0.1 to 50 g / 10 minutes, preferably 0.2 to 20 g / It is in the range of 10 minutes.
• MFR load: 2160 g, temperature: 190 ° C.
• the ethylene / ⁇ -olefin random copolymer (A) according to the present invention is a random copolymerization of ethylene and ⁇ -olefin using various known production methods, specifically, vanadium catalysts or metallocene catalysts. Can be manufactured.
• the ethylene / ⁇ -olefin random copolymer (A) according to the present invention is available from Mitsui Chemicals, Inc. as Toughmer P-0275, P-0375, P-0180, P- They are manufactured and sold under trade names such as 0280, P-0480, P-0680, and as ethylene / 1-butene random copolymers under trade names such as Toughmer A4070S and A1050S.
• the release film of the present invention is a release film obtained from an ethylene / ⁇ -olefin random copolymer (A) having a density of 850 to 880 kg / m 3 and a melting point (Tm) of 63 ° C. or less on one surface of a base material layer.
• the release film is a release film characterized in that the release layer has a peel strength of 0.1 to 1 N / 50 mm with respect to the acrylic resin-based adhesive / adhesive.
• release film of the present invention is obtained from an ethylene / ⁇ -olefin random copolymer (A) having a density of 850 to 880 kg / m 3 and a melting point (Tm) of 63 ° C. or less on one side of the base material layer.
• the release layer is a release film characterized by being irradiated with energy rays.
• the thickness of the substrate layer of the release film of the present invention is usually in the range of 10 to 200 ⁇ m, preferably 15 to 100 ⁇ m, more preferably 25 to 50 ⁇ m.
• the thickness of the release layer of the release film of the present invention is usually in the range of 0.025 to 0.20 ⁇ m, preferably 0.050 to 0.15 ⁇ m, and more preferably 0.075 to 0.125 ⁇ m.
• the peel strength with an adhesive / adhesive such as an acrylic resin adhesive / epoxy adhesive may exceed 1 N / 50 mm.
• the thickness of the release layer is increased, the peel strength is further reduced, but the surface state of the release layer is deteriorated, the slipping property is lowered, and the handling property may be lowered.
• the release film of the present invention is also characterized in that the release layer is as thin as 0.050 to 0.15 ⁇ m.
• the release film of the present invention usually has a peel strength from an adhesive / adhesive such as an acrylic resin-based adhesive / epoxy resin-based adhesive of 0.1-1 N / 50 mm, preferably 0.1-0. Within the range of 7 N / 50 mm.
• the release layer obtained from the ethylene / ⁇ -olefin random copolymer (A) according to the present invention With energy rays, acrylic resin-based adhesives, epoxy resin-based adhesives, etc.
• the reason why the peel strength with the agent is in the range of 0.1 to 1 N / 50 mm, preferably 0.1 to 0.7 N / 50 mm is not clear, but by applying energy rays, the adhesive / adhesive The release strength is reduced, and a release film having excellent peelability can be obtained.
• the release film of the present invention is obtained by applying and drying a solution of the ethylene / ⁇ -olefin random copolymer (A) according to the present invention on one surface of a previously obtained base material layer, and then ethylene / ⁇ -olefin random It can be produced by irradiating the surface of the copolymer (A) with energy rays.
• the peel strength from an adhesive / adhesive such as an acrylic resin-based adhesive / epoxy adhesive is 0.1-1 N / 50 mm, preferably 0.1-0.7 N / 50 mm. It is possible to produce a release film having excellent release properties within the range.
• the thickness of the release layer is 0.025 to 0.20 ⁇ m, preferably 0.8. This is preferable because it can be as thin as 050 to 0.15 ⁇ m.
• Solvents used for preparing the ethylene / ⁇ -olefin random copolymer (A) solution include aliphatic hydrocarbons such as n-decane, n-heptane, and n-hexane, and aromatics such as toluene and xylene. Examples include hydrocarbons, alicyclic hydrocarbons such as decalin and tetralin, organic solvents such as methyl ethyl ketone and methyl isobutyl ketone, and mixed solvents thereof, and toluene / isobutyl ketone mixed solvent (9/1) is most preferable.
• a method of applying a solution of the ethylene / ⁇ -olefin random copolymer (A) to the base material layer a method of applying the solution to the surface of the base material layer, a method of immersing the base material layer in the solution, the solution
• Various known coating methods such as a method of spraying the surface of the substrate layer can be employed.
• Examples of the method for applying the ethylene / ⁇ -olefin random copolymer (A) solution to the base material layer include an air knife coater, a direct gravure coater, a gravure offset, an arc gravure coater, a gravure reverse and a jet nozzle method.
• the ethylene / ⁇ -olefin random copolymer (A) in the solution (solid content) may be applied in an amount of 0.05 to 10 g / m 2 , preferably 0.1 to 5 g / m 2 .
• the application temperature of the solution can be usually carried out at room temperature, for example, a temperature range of 10 to 40 ° C., preferably 15 to 30 ° C.
• the ethylene / ⁇ -olefin random copolymer (A) If it is difficult to dissolve, it may be heated to a temperature below the boiling point depending on the solvent used.
• the applied solution is usually dried at a temperature of 70 to 120 ° C., preferably 90 to 100 ° C.
• the energy ray that irradiates the surface of the ethylene / ⁇ -olefin random copolymer (A) according to the present invention is usually an energy ray having a wavelength range of 0.0001 to 800 nm. Examples thereof include rays, ⁇ rays, ⁇ rays, X rays, visible rays, ultraviolet rays, and electron beams. Among these ionizing radiations, visible light in the wavelength range of 400 to 800 nm, ultraviolet light in the range of 50 to 400 nm, and electron beam in the range of 0.01 to 0.002 nm are easy to handle and equipment is widespread. Therefore, it is preferable.
• the peel strength from the adhesive / adhesive such as acrylic resin-based adhesive / epoxy resin-based adhesive can be increased.
• the reason why it is in the range of 0.1 to 1 N / 50 mm, preferably 0.1 to 0.7 N / 50 mm is not clear, but by irradiation with energy rays, an ethylene / ⁇ -olefin random copolymer ( It is inferred that A) aggregates and the peel strength changes.
• the melting point (Tm) of the ethylene / ⁇ -olefin random copolymer (A) is changed. Absent.
• the toluene solubility of the copolymer was expressed as follows: ⁇ : dissolved when stirred at room temperature (15-30 ° C.), ⁇ : dissolved when stirred at 40 ° C., x: not dissolved even when stirred at 40 ° C. (3) Peeling force [N / 50mm]
• the release films obtained in Examples and Comparative Examples were placed on a horizontal table with the release layer facing up, and the polyester adhesive tape having an acrylic adhesive layer on the release layer surface [manufactured by Nitto Denko Corporation, Part No. 31B] was pasted and cut into a size of 200 mm ⁇ 50 mm, and a load was placed on the polyester pressure-sensitive adhesive tape so as to be 20 g / cm 2 , followed by aging at 70 ° C. for 20 hours.
• the release film is peeled off, and the polyester adhesive tape is pressure-bonded 3 times with a 2 kg rubber roller to a stainless steel plate and heat-treated at 70 ° C. for 2 hours.
• the adhesive force F is measured according to the method of JIS-C-2107 (adhesive strength to stainless steel plate, 180 ° peeling method). The percentage of F (F / F0 ⁇ 100) relative to the adhesive force F0 when the polyester adhesive tape was directly adhered to and peeled from the stainless steel plate was determined as the residual adhesion rate.
• Example 1 Ethylene prepared by the above-described method as a release layer on one side of a biaxially stretched polyethylene terephthalate film (trade name Lumirror R58 manufactured by Toray Industries, Inc.) having a thickness of 31 ⁇ m and a stretching ratio of 3 ⁇ 3 as a base film.
• a solution of the propylene random copolymer (A1) was added to the Mayer bar No. 4 was applied and dried in an oven at 95 ° C. for 20 seconds to obtain a release film precursor.
• the release layer surface of the precursor was irradiated with ultraviolet rays (UV) (200 mW / cm 2 , 100 mJ / cm 2 ) to obtain a release film.
• UV ultraviolet rays
• Example 2 A release film was obtained in the same manner as in Example 1 except that instead of the ethylene / propylene random copolymer (A1) used in Example 1, an ethylene / propylene random copolymer (A2) was used. Table 1 shows the results of the obtained precursor and the release film.
• Example 3 A release film was obtained in the same manner as in Example 1 except that the ethylene / propylene random copolymer (A1) used in Example 1 was used instead of the ethylene / propylene random copolymer (A1). Table 1 shows the results of the obtained precursor and the release film.
• Example 4 A release film was obtained in the same manner as in Example 1 except that instead of the ethylene / propylene random copolymer (A1) used in Example 1, an ethylene / propylene random copolymer (A4) was used. Table 1 shows the results of the obtained precursor and the release film.
• Example 5 A release film was obtained in the same manner as in Example 1, except that the ethylene / propylene random copolymer (A1) used in Example 1 was used instead of the ethylene / propylene random copolymer (A5). Table 1 shows the results of the obtained precursor and the release film.
• Example 6 A release film was obtained in the same manner as in Example 1 except that the ethylene / propylene random copolymer (A1) used in Example 1 was used instead of the ethylene / propylene random copolymer (A6). Table 1 shows the results of the obtained precursor and the release film.
• Example 7 A release film was obtained in the same manner as in Example 1 except that the ethylene / 1-butene random copolymer (A7) was used instead of the ethylene / propylene random copolymer (A1) used in Example 1. .
• Table 1 shows the results of the obtained precursor and the release film.
• Example 8 A release film was obtained in the same manner as in Example 1 except that the ethylene / 1-butene random copolymer (A8) was used instead of the ethylene / propylene random copolymer (A1) used in Example 1. . Table 1 shows the results of the obtained precursor and the release film.
• Example 2 A release film was obtained in the same manner as in Example 1 except that the propylene / ethylene random copolymer (C2) was used instead of the ethylene / propylene random copolymer (A1) used in Example 1. Table 1 shows the results of the obtained precursor and the release film.
• Example 3 A release film was obtained in the same manner as in Example 1 except that the propylene / ethylene random copolymer (C3) was used instead of the ethylene / propylene random copolymer (A1) used in Example 1. Table 1 shows the results of the obtained precursor and the release film.
• the precursor film before UV irradiation has a release layer peel strength of 4.8 to 13.9 N / 15 mm, whereas the release layer is irradiated with UV.
• (Release film) shows that the release layer has a release strength as low as 0.18 to 0.60 N / 50 mm, and a release film having excellent release properties can be obtained.
• the ethylene / ⁇ -olefin random copolymer having a density and melting point (Tm) exceeding the upper limit used in Comparative Example 1 was insoluble in a solvent such as toluene and could not be applied. Further, as shown in Comparative Examples 2 and 3, when a propylene / ethylene random copolymer having a melting point (Tm) exceeding 63 ° C. was used, the peel strength did not change even when irradiated with UV, and the releasability was improved. It was not possible to obtain a release film excellent in.
• the release film of the present invention is excellent in releasability, and can be used as a release film for acrylic adhesives and epoxy adhesives. It is used for a release film for a process such as a substrate, a flexible printed circuit board, a multilayer printed circuit board.

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• 2013
  • 2013-12-16 JP JP2014554333A patent/JP6076375B2/ja active Active
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