WO2014024338A1 - 部品実装基板の製造方法及び製造システム - Google Patents
部品実装基板の製造方法及び製造システム Download PDFInfo
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- WO2014024338A1 WO2014024338A1 PCT/JP2013/001108 JP2013001108W WO2014024338A1 WO 2014024338 A1 WO2014024338 A1 WO 2014024338A1 JP 2013001108 W JP2013001108 W JP 2013001108W WO 2014024338 A1 WO2014024338 A1 WO 2014024338A1
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- Prior art keywords
- solder
- electronic component
- thermosetting resin
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- resist
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 235
- 229920005989 resin Polymers 0.000 claims abstract description 95
- 239000011347 resin Substances 0.000 claims abstract description 95
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 88
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
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- 230000008018 melting Effects 0.000 claims description 12
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- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- H01L2224/818—Bonding techniques
- H01L2224/8185—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/81885—Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/81855 - H01L2224/8188, e.g. for hybrid thermoplastic-thermosetting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83886—Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a component mounting board manufacturing method and manufacturing system, and more particularly to a technique for mounting electronic components on a wiring board.
- solder for bonding has been formed in a fillet shape in order to increase the bonding strength between the wiring board and the electronic component.
- the solder formed in a fillet shape is called a solder fillet.
- the solder fillet alone is not sufficient for improving the bonding strength.
- solder paste containing a low melting point solder and a thermosetting resin as a bonding material (see, for example, Patent Document 1).
- a solder fillet is formed during mounting using this solder paste, a cured resin film 104 is formed on the solder fillet 103 as shown in FIG. 9 (see, for example, Patent Document 2).
- the solder paste is heated to melt the solder and soften the thermosetting resin.
- solder and the thermosetting resin are separated, whereby the solder having a large specific gravity moves downward to form the solder fillet 103, and the thermosetting resin having a small specific gravity moves upward to move the resin cured film. 104 is formed. Therefore, the solder fillet 103 is reinforced by the resin cured film 104, and as a result, the bonding strength is improved.
- the repair process is a process of removing the mounted electronic component from the wiring board and then mounting a new electronic component on the wiring board again.
- the removal of the electronic component is performed using an apparatus such as a suction nozzle in a state where the solder fillet is melted and the resin cured film is softened while heating the joining portion (solder fillet and resin cured film).
- the solder 105 and the thermosetting material are formed on the surface of the wiring board 101 as shown in FIG.
- the resin 106 remains in contact with each other.
- the solder 105 and the thermosetting resin 106 remain mixed on the surface of the wiring board 101.
- the thermosetting resin is mixed in the newly formed solder fillet, and as a result, there is a bonding failure between the wiring board 101 and the new electronic component. There was a risk of it occurring.
- an object of the present invention is to provide a method for manufacturing a component mounting board that has a high bonding strength between a wiring board and an electronic component and that hardly causes a bonding failure between the wiring board and the electronic component when a repair process is performed. Is to provide a system.
- the manufacturing method and the manufacturing system according to the present invention are a method and a system for manufacturing a component mounting board in which an electronic component is mounted on a wiring board, respectively.
- the wiring substrate includes an insulating substrate, a wiring layer formed on the surface of the insulating substrate, and a resist that covers the wiring layer.
- the resist is formed with an opening that exposes a bonding surface where the terminals of the electronic component are electrically bonded in the surface of the wiring layer.
- the manufacturing method includes an applying step for applying a solder paste, a mounting step for mounting an electronic component, and a heating step for heating the solder paste.
- a solder paste containing solder and a thermosetting resin is applied to the joint surface.
- the electronic component is mounted on the wiring board so that the terminal of the electronic component covers the entire opening and contacts the solder paste applied to the joint surface.
- the solder paste applied to the joint surfaces is heated to melt the solder and soften the thermosetting resin, and then cure the thermosetting resin.
- the electronic component comes close to the surface of the resist and the solder and the thermosetting resin are separated.
- the solder collects in the first space in the opening closed by the wiring layer and the electronic component
- the thermosetting resin collects in the second space formed by the upper surface of the resist and the side surface of the electronic component.
- the manufacturing system includes an applying device for applying a solder paste, a mounting device for mounting an electronic component, and a heating device for heating the solder paste.
- the applying device applies a solder paste containing solder and a thermosetting resin to the joint surface.
- the mounting device mounts the electronic component on the wiring board so that the terminal of the electronic component covers the entire opening and contacts the solder paste applied to the joint surface.
- the heating device heats the solder paste applied to the joint surface, thereby melting the solder and softening the thermosetting resin, and then curing the thermosetting resin. Due to the melting of the solder and the softening of the thermosetting resin by the heating device, the electronic component comes close to the surface of the resist and the solder and the thermosetting resin are separated. As a result, the solder collects in the first space in the opening closed by the wiring layer and the electronic component, and the thermosetting resin collects in the second space formed by the upper surface of the resist and the side surface of the electronic component.
- the bonding strength between the wiring board and the electronic component is high, and when a repair process is performed, a bonding failure occurs between the wiring board and the electronic component. Difficult component mounting boards can be manufactured.
- FIG. 3 is an enlarged view of a region III shown in FIG. 2. It is the block diagram which showed the manufacturing line which comprises the manufacturing system which concerns on one Embodiment of this invention. It is sectional drawing which showed the specific structure of the manufacturing line. It is sectional drawing for demonstrating the position (mounting position) on the wiring board in which an electronic component is mounted by the mounting apparatus with which a manufacturing line is provided.
- FIG. 2 is a cross-sectional view for explaining a state of a wiring board when an electronic component is removed in a repair process for the component mounting board shown in FIG. 1. It is sectional drawing which showed the conventional component mounting board
- the manufactured component mounting board includes a wiring board and electronic components mounted on the wiring board.
- the wiring substrate includes an insulating substrate, a wiring layer formed on the surface of the insulating substrate, and a resist that covers the wiring layer. An opening is formed in the resist, and the opening exposes the bonding surface of the surface of the wiring layer where the terminal of the electronic component is electrically bonded from the resist, while the entire opening is covered with the terminal.
- the first space in the opening closed by the wiring layer and the electronic component is filled with solder, and the terminal and the joint surface are electrically joined to each other by the solder.
- no thermosetting resin is present in the first space.
- the amount is about 5 vol%.
- a cured product of the thermosetting resin mechanically joins the resist and the electronic component to each other.
- no solder is present in the second space.
- the amount is about 5 vol%.
- thermosetting resin mechanically joins the resist and the electronic component to each other.
- solder there is no solder in the third space.
- the amount is about 5 vol%.
- FIG. 1 is a cross-sectional view showing an example of a component mounting board.
- the component mounting board 10 includes a wiring board 1 and an electronic component 2 mounted on the wiring board 1.
- the wiring substrate 1 includes an insulating substrate 11, a wiring layer 12 (wiring pattern) formed on the surface 11 a of the insulating substrate 11, and a solder resist 13 that covers the wiring layer 12.
- the electronic component 2 has a component main body 20 composed of passive elements such as capacitor elements, and two electrode layers 21 formed at both ends of the component main body 20 (the right end portion and the left end portion in FIG. 1). is doing. A part of each electrode layer 21 extends on the lower surface of the component body 20. Therefore, in the electronic component 2, two terminals exposed on the lower surface of the electronic component 2 are configured by the electrode layer 21.
- the solder resist 13 has two openings 14 corresponding to the electrode layers 21 one by one.
- the opening 14 exposes, from the solder resist 13, the bonding surface 12 a to which the electrode layer 21 is electrically bonded in the surface of the first wiring layer 12.
- each opening 14 is entirely covered with an electrode layer 21 corresponding to the opening 14.
- the space in the opening 14 is a space (first space 31) closed by the wiring layer 12 and the electronic component 2.
- the first space 31 is filled with the solder 41, and the electrode layer 21 and the joint surface 12 a are electrically joined to each other by the solder 41.
- no thermosetting resin is present in the first space 31.
- the amount is about 5 vol%.
- solder 41 for example, Sn—Bi or Sn—Bi—Ag low melting point solder is used.
- a cured product 42 of a thermosetting resin exists in the second space 32 formed by the upper surface of the solder resist 13 and the side surface of the electronic component 2.
- no solder is present in the second space 32.
- the amount thereof is about 5 vol%.
- the cured product 42 fills a corner formed by the solder resist 13 and the electronic component 2 in the second space 32 and spreads in a fillet shape around the corner.
- the cured product 42 mechanically joins the solder resist 13 and the electronic component 2 to each other in the second space 32.
- an epoxy resin is used as the thermosetting resin constituting the cured product 42.
- a cured product 43 of a thermosetting resin exists in the third space 33 formed by the upper surface of the solder resist 13 and the lower surface of the component main body 20. Therefore, the cured product 43 is interposed between the upper surface of the solder resist 13 and the lower surface of the component main body 20.
- no solder is present in the third space 33.
- the amount thereof is about 5 vol%.
- the cured product 43 mechanically joins the solder resist 13 and the electronic component 2 to each other in the third space 33.
- the third space 33 is formed between the two electrode layers 21.
- the thermosetting resin that constitutes the cured product 43 is the same resin as the thermosetting resin that constitutes the cured product 42.
- the entire opening 14 is covered with the electrode layer 21 corresponding to the opening 14. Therefore, the size of each opening 14 is smaller than the size of the opening 107 (see FIG. 9) of the conventional component mounting board corresponding to the opening 14. Specifically, the ratio of the area of each opening 14 to the area of the lower surface of the electrode layer 21 corresponding to the opening 14 is 50 to 100%. As shown in FIG. 9, in the conventional component mounting substrate, a part of each opening 107 is only covered with the electronic component 102.
- FIG. 2 is a cross-sectional view showing another example of a component mounting board.
- FIG. 3 is an enlarged view of region III shown in FIG.
- the component mounting board 310 includes a wiring board 301 and a land grid array (LGA) type electronic component 302 mounted on the wiring board 301.
- the electronic component 302 includes a substrate 320, a semiconductor element 321 mounted on the substrate 320, and an exterior body 322 that covers the semiconductor element 321 on the substrate 320.
- LGA land grid array
- the substrate 320 has a plurality of first planar electrodes 323 (lands) formed on the upper surface and a plurality of second planar electrodes 324 (lands) formed on the lower surface.
- the second planar electrodes 324 are arranged in a grid.
- a terminal (not shown) of the semiconductor element 321 is electrically connected to the first planar electrode 323.
- each first planar electrode 323 and the corresponding second planar electrode 324 are electrically connected to each other by a conductive via 325 that penetrates the substrate 320 from its upper surface to its lower surface. Yes.
- the second planar electrode 324 constitutes a plurality of terminals exposed on the lower surface of the electronic component 302.
- the wiring substrate 301 includes an insulating substrate 311, a wiring layer 312 formed on the surface 311 a of the insulating substrate 311, and a solder resist 313 covering the wiring layer 312.
- a plurality of openings 314 corresponding to the second planar electrodes 324 one by one are formed.
- the opening 314 exposes, from the solder resist 313, the bonding surface 312 a to which the second planar electrode 324 is electrically bonded in the surface of the wiring layer 312.
- each opening 314 is entirely covered with a second planar electrode 324 corresponding to the opening 314.
- the space in the opening 314 is a space (first space 331) closed by the wiring layer 312 and the electronic component 302.
- the first space 331 is filled with the solder 341, and the second flat electrode 324 and the joint surface 312a are electrically joined to each other by the solder 341.
- no thermosetting resin is present in the first space 331.
- the amount is about 5 vol%.
- solder 341 for example, Sn-Bi-based or Sn-Bi-Ag-based low melting point solder is used.
- a cured product 342 of a thermosetting resin exists in the second space 332 formed by the upper surface of the solder resist 313 and the side surface of the electronic component 302.
- no solder is present in the second space 332.
- the amount thereof is about 5 vol%.
- the cured product 342 fills the corner formed by the solder resist 313 and the electronic component 302 in the second space 332 and spreads in a fillet shape around the corner.
- the cured product 342 mechanically joins the solder resist 313 and the electronic component 302 to each other in the second space 332.
- an epoxy resin is used as the thermosetting resin constituting the cured product 342.
- thermosetting resin constituting the cured product 343 is the same resin as the thermosetting resin constituting the cured product 342.
- each opening 314 is smaller than the size of the opening of a conventional component mounting board having an LGA type electronic component. Specifically, the ratio of the area of each opening 314 to the area of the lower surface of the second planar electrode 324 corresponding to the opening 314 is 50 to 100%.
- the manufacturing method and the manufacturing system according to the present invention are a method and a system for manufacturing a component mounting board in which an electronic component is mounted on a wiring board, respectively.
- the wiring substrate includes an insulating substrate, a wiring layer formed on the surface of the insulating substrate, and a resist that covers the wiring layer.
- the resist is formed with an opening that exposes a bonding surface where the terminals of the electronic component are electrically bonded in the surface of the wiring layer.
- the manufacturing method includes an applying step for applying a solder paste, a mounting step for mounting an electronic component, and a heating step for heating the solder paste.
- a solder paste containing solder and a thermosetting resin is applied to the joint surface.
- the electronic component is mounted on the wiring board so that the terminal of the electronic component covers the entire opening and contacts the solder paste applied to the joint surface.
- the electronic component is usually mounted on the wiring board with its lower surface being separated from the resist surface.
- the solder paste applied to the joint surfaces is heated to melt the solder and soften the thermosetting resin, and then cure the thermosetting resin.
- coating process mentioned above, a mounting process, and a heating process are processes performed by the application
- the manufacturing system includes an applying device for applying a solder paste, a mounting device for mounting an electronic component, and a heating device for heating the solder paste.
- the applying device applies a solder paste containing solder and a thermosetting resin to the joint surface.
- the mounting device mounts the electronic component on the wiring board so that the terminal of the electronic component covers the entire opening and contacts the solder paste applied to the joint surface.
- the mounting apparatus normally mounts the electronic component on the wiring board in a state where the lower surface thereof is separated from the surface of the resist.
- the heating device heats the solder paste applied to the joint surface, thereby melting the solder and softening the thermosetting resin, and then curing the thermosetting resin.
- the electronic component comes close to the surface of the resist and the solder and the thermosetting resin are separated due to melting of the solder by heating to the solder paste and softening of the thermosetting resin.
- the solder collects in the first space in the opening closed by the wiring layer and the electronic component
- the thermosetting resin collects in the second space formed by the upper surface of the resist and the side surface of the electronic component.
- the thermosetting resin collects in a third space formed by the upper surface of the resist and the lower surface of the electronic component.
- thermosetting resin is cured by further heating to the solder paste. Thereafter, the solder is solidified in the cooling process. As a result, the wiring board and the electronic component are electrically joined to each other in the first space by the solidified solder. Moreover, when the thermosetting resin is cured, a cured product is formed in the second space and the third space. And with this hardened
- the first space and the second space, and the first space and the third space are blocked by the electronic components.
- the second space and the third space are formed at positions separated from the first space along the upper surface of the resist. Therefore, the cured product in the second space and the cured product in the third space do not come into contact with the solder in the first space.
- thermosetting resin hardly mixes in the solder. Therefore, even when a repair process is performed on the component mounting board, defective bonding is unlikely to occur between the wiring board and the new electronic component.
- the wiring board and the electronic component are joined to each other in the first space by solder.
- the wiring board and the electronic component are joined to each other by a cured product of a thermosetting resin in the second space and the third space. Therefore, in the component mounting board, the bonding strength between the wiring board and the electronic component is high.
- the solder paste is applied to the bonding surface so that the total volume of the solder contained in the solder paste on the bonding surface is substantially the same as the volume of the first space ( Application step and application device).
- the ratio of the total solder volume to the volume of the first space is preferably 95 to 100%. This prevents the thermosetting resin from being mixed into the solder in the first space, and as a result, the occurrence of poor bonding is prevented.
- the solder is prevented from overflowing from the opening and mixed into the cured product in the second space, and as a result, a decrease in bonding strength is prevented.
- FIG. 1 a manufacturing system for manufacturing the component mounting board 10 shown in FIG. 1 will be specifically described with reference to the drawings.
- the manufacturing system described below can also be applied to the manufacture of the component mounting board 310 shown in FIG.
- FIG. 4 is a block diagram showing a production line constituting the production system according to the present embodiment.
- the production line includes a substrate supply device 201 for supplying the wiring substrate 1, a solder paste applying device 202, a mounting device 203 for mounting the electronic component 2 on the wiring substrate 1, a heating device 204, A recovery device 205 that recovers the manufactured component mounting board 10 and a transfer device 206 that transfers the wiring board 1 between these devices are provided.
- FIG. 5 is a cross-sectional view showing a specific configuration of the production line.
- the transport device 206 is configured by a conveyor having the transport belt 6.
- the transport device 206 is not limited to a conveyor, and various devices having a transport function can be used.
- the wiring substrate 1 supplied from the substrate supply device 201 is placed on the transport belt 6.
- a magazine type substrate loader is used for the substrate supply device 201.
- the solder paste applying device 202 applies a solder paste 4 containing solder and a thermosetting resin to the wiring board 1. Specifically, the solder paste applying device 202 supplies the solder paste 4 to the bonding surface 12 a by supplying the solder paste 4 to the opening 14. At this time, the solder paste application device 202 has the total volume of solder contained in the solder paste 4 on each joint surface 12a substantially equal to the volume of the first space 31 (see FIG. 1) corresponding to the joint surface 12a. Thus, the solder paste 4 is supplied to the opening 14.
- the ratio of the total solder volume to the volume of the first space 31 is preferably 95 to 100%.
- the size of the opening 14 is smaller than the size of the opening 107 (see FIG. 9) of the conventional component mounting board. Therefore, if the thickness of the solder resist 13 is the same as the thickness of the solder resist 110 (see FIG. 9) of the conventional component mounting board, the following problem occurs. That is, when the same amount of solder paste 4 applied to each opening 107 in the manufacturing process of the conventional component mounting substrate is applied to each opening 14, the solder contained in the applied solder paste 4 Is larger than the volume of the first space 31 corresponding to the opening 14. For this reason, in the component mounting board to be manufactured, the solder overflows from the first space 31, and the solder and the thermosetting resin come into contact with each other.
- the thickness of the solder resist 13 is set large so that the volume of each first space 31 matches the total volume of the solder. Specifically, this thickness is 30 to 70 ⁇ m.
- the amount of solder paste 4 applied to each opening 14 is adjusted to be small by the solder paste applying device 202 so that the total volume of the solder matches the volume of each first space 31.
- the solder paste 4 may be prepared so that the solder content in the solder paste 4 is reduced so that the total volume of the solder matches the volume of each first space 31.
- solder and the thermosetting resin constituting the solder paste 4 for example, Sn-Bi or Sn-Bi-Ag low melting point solder and epoxy resin are used, respectively.
- the solder paste 4 may contain an activator or a thixotropic agent as necessary.
- the solder and the thermosetting resin are not limited to these materials.
- the epoxy resin is suitable as a thermosetting resin to be used because it is easy to handle, the strength of the cured product is high, and the curing characteristics are good.
- a screen printing device is used as the solder paste applying device 202.
- FIG. 5 shows a mask 7 for screen printing.
- the solder paste applying device 202 may be a printing device (for example, an ink jet printer) having a printing nozzle or a coating device having a coating head (needle or nozzle) and a dispenser.
- the mounting device 203 mounts the electronic component 2 at a mounting position on the wiring board 1. As shown in FIG. 6, each electrode layer 21 of the electronic component 2 covers the entire opening 14 corresponding to the electrode layer 21 and is attached to the bonding surface 12 a corresponding to the electrode layer 21 as shown in FIG. 6. The position is such that it contacts the solder paste 4.
- the mounting device 203 mounts the electronic component 2 on the wiring board 1 in a state where the lower surface of the electrode layer 21 is separated from the surface of the solder resist 13 by a predetermined distance L.
- the mounting device 203 includes an electronic component supply device and a chip mounter that places the electronic component 2 supplied from the electronic component supply device at the mounting position. Devices such as a tape feeder, a bulk feeder, and a tray feeder can be used as the electronic component supply device. In addition, a device such as a suction nozzle can be used for the chip mounter.
- the heating device 204 heats the solder paste 4 applied to the bonding surface 12a, thereby melting the solder 41 in the solder paste 4 and softening the thermosetting resin 44 (see FIG. 6) in the solder paste 4.
- the solder resist 13 has a property that the molten solder 41 hardly adheres to the surface, in other words, a property that it is easy to play the molten solder 41. Therefore, as shown in FIG. 7, the melted solder 41 moves through the gap 8 to a place where the solder resist 13 does not exist (specifically, in the opening 14). In FIG. 7, the movement of the solder 41 is indicated by solid arrows.
- the solder 41 has a higher specific gravity than the thermosetting resin 44. Accordingly, as shown in FIG. 7, the solder 41 moves downward in the opening 14, whereby the solder 41 is accumulated on the joint surface 12 a. On the other hand, as the solder 41 moves into the opening 14, the thermosetting resin 44 in the opening 14 is driven out of the opening 14. Then, the thermosetting resin 44 moves onto the solder resist 13 through the gap 8. In FIG. 7, the movement of the thermosetting resin 44 is indicated by broken line arrows.
- the electronic component 2 comes close to the surface of the solder resist 13.
- Each opening 14 is closed by the electrode layer 21 corresponding to the opening 14, thereby forming a first space 31 (see FIG. 1). Accordingly, a second space 32 and a third space 33 (see FIG. 1) are formed on the solder resist 13. Accordingly, the electronic component 2 blocks the space between the first space 31 and the second space 32 and the space between the first space 31 and the third space 33.
- the solder 41 is collected in the first space 31, but the thermosetting resin 44 is not included.
- the amount is about 5 vol%.
- the thermosetting resin 44 collects in the second space 32 and the third space 33 while the solder 41 is not included. Or even if the solder 41 is contained in the second space 32 and the third space 33, the amount thereof is about 5 vol%.
- the heating device 204 further heats the solder paste 4 to cure the thermosetting resin 44.
- the solder 41 is solidified in the cooling process.
- the wiring board 1 and the electronic component 2 are electrically joined to each other in the first space 31 by the solidified solder 41.
- the thermosetting resin 44 is cured, whereby cured products 42 and 43 are formed in the second space 32 and the third space 33, respectively.
- the wiring boards 1 and the electronic component 2 are mechanically joined to each other in the second space 32 and the third space 33 by the cured products 42 and 43.
- the collection device 205 collects the manufactured component mounting board 10 from the conveyor belt 6.
- a magazine-type substrate unloader is used for the collection device 205.
- the electronic component 2 blocks the space between the first space 31 and the second space 32 and the space between the first space 31 and the third space 33. For this reason, the second space 32 and the third space 33 are formed at positions separated from the first space 31 along the upper surface of the solder resist 13. Therefore, the cured product 42 in the second space 32 and the cured product 43 in the third space 33 do not contact the solder 41 in the first space 31.
- thermosetting resin 44 in the repair process for the component mounting board 10, when the electronic component 2 is removed from the wiring board 1 as shown in FIG. 8, the solder 41 and the thermosetting resin 44 remain on the wiring board 1, but the solder 41 Is located in the first opening 14, and the thermosetting resin 44 is located on the upper surface of the solder resist 13 without contacting the solder 41. For this reason, even when a new electronic component 2 is remounted, the thermosetting resin hardly mixes in the solder. Therefore, even when a repair process is performed on the component mounting board 10, it is difficult for a bonding failure to occur between the wiring board 1 and the new electronic component 2.
- the wiring board 1 and the electronic component 2 are joined to each other in the first space 31 by the solder 41.
- the wiring board 1 and the electronic component 2 are joined to each other by the cured product 42 in the second space 32 and are joined to each other by the cured product 43 in the third space 33. Therefore, in the component mounting board 10, the bonding strength between the wiring board 1 and the electronic component 2 is high.
- the opening 107 exposes the bonding surface 109 on the surface of the wiring layer 108 to which the electronic component 102 is electrically bonded from the solder resist 110.
- the electronic component 102 is electrically bonded to the bonding surface 109 via the solder fillet 103 with both ends thereof floating from the bonding surface 109. Therefore, when applying the solder paste for forming the solder fillet 103 to the two joint surfaces 109 in the manufacturing process of the conventional component mounting board, the amount of solder paste applied to the two joint surfaces 109 is different from each other. The following phenomenon is likely to occur.
- both ends of the electronic component 2 are located on the surface of the solder resist 13. Therefore, even if one end of the electronic component 2 is pulled downward, the downward movement of the one end is blocked by the solder resist 13. Therefore, the electronic component 2 is difficult to tilt.
- each part structure of this invention is not restricted to the said embodiment, A various deformation
- the substrate supply device 201, the solder paste applying device 202, the mounting device 203, the heating device 204, and the recovery device 205 are configured separately and independently.
- the present invention is not limited to this.
- a composite device having these functions may be used.
- the above-described manufacturing method and manufacturing system can also be applied to the case where a ball grid array (BGA) type electronic component is mounted on a wiring board. Further, the above-described manufacturing method and manufacturing system can also be used to manufacture various component mounting boards that are not limited to the component mounting board 10 shown in FIG. 1 and the component mounting board 310 including the LGA type electronic components shown in FIG. It can be applied.
- BGA ball grid array
- the manufacturing system and the manufacturing method according to the present invention can be applied to manufacture of a component mounting board provided in an electronic device such as a liquid crystal display module.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
2 電子部品
4 半田ペースト
10 部品実装基板
11 絶縁基板
11a 表面
12 配線層
12a 接合面
13 ソルダーレジスト
14 開口
21 電極層(端子)
31 第1空間
32 第2空間
33 第3空間
41 半田
42,43 硬化物
44 熱硬化性樹脂
201 基板供給装置
202 半田ペースト付与装置
203 搭載装置
204 加熱装置
205 回収装置
301 配線基板
302 電子部品
310 部品実装基板
311 絶縁基板
311a 表面
312 配線層
312a 接合面
313 ソルダーレジスト
314 開口
324 第2平面電極(端子)
331 第1空間
332 第2空間
333 第3空間
341 半田
342,343 硬化物
L 所定の距離
Claims (6)
- 配線基板に電子部品が実装された部品実装基板を製造する方法であって、前記配線基板は、絶縁基板と、前記絶縁基板の表面に形成された配線層と、前記配線層を覆うレジストとを備え、前記レジストには、前記配線層の表面のうち前記電子部品の端子が電気的に接合されることとなる接合面を露出させる開口が形成されており、
(a)前記接合面に、半田と熱硬化性樹脂とを含む半田ペーストを付与する工程と、
(b)前記電子部品の端子が、前記開口の全体を覆うと共に前記接合面に付与された半田ペーストに当着する様に、前記電子部品を前記配線基板に搭載する工程と、
(c)前記工程(b)の実行後、前記接合面に付与された半田ペーストを加熱することにより、前記半田を溶融させると共に前記熱硬化性樹脂を軟化させ、その後、前記熱硬化性樹脂を硬化させる工程と
を有し、前記工程(c)では、前記半田の溶融及び前記熱硬化性樹脂の軟化により、前記電子部品が前記レジストの表面に近接すると共に前記半田と前記熱硬化性樹脂とが分離し、これにより、前記配線層と前記電子部品とで閉じられた前記開口内の第1空間に前記半田が集まると共に、前記レジストの上面と前記電子部品の側面とで形成された第2空間に前記熱硬化性樹脂が集まる、部品実装基板の製造方法。 - 前記工程(a)では、前記接合面上の前記半田ペーストに含まれる半田の総体積が前記第1空間の容積と略同一となる様に、前記半田ペーストを付与する、請求項1に記載の部品実装基板の製造方法。
- 前記工程(b)では、前記電子部品を、その下面を前記レジストの表面から離間させた状態で前記配線基板に搭載する、請求項1又は請求項2に記載の部品実装基板の製造方法。
- 配線基板に電子部品が実装された部品実装基板を製造するシステムであって、前記配線基板は、絶縁基板と、前記絶縁基板の表面に形成された配線層と、前記配線層を覆うレジストとを備え、前記レジストには、前記配線層の表面のうち前記電子部品の端子が電気的に接合されることとなる接合面を露出させる開口が形成されており、
前記接合面に、半田と熱硬化性樹脂とを含む半田ペーストを付与する付与装置と、
前記電子部品の端子が、前記開口の全体を覆うと共に前記接合面に付与された半田ペーストに当着する様に、前記電子部品を前記配線基板に搭載する搭載装置と、
前記接合面に付与された半田ペーストを加熱することにより、前記半田を溶融させると共に前記熱硬化性樹脂を軟化させ、その後、前記熱硬化性樹脂を硬化させる加熱装置と
を備え、前記加熱装置による前記半田の溶融及び前記熱硬化性樹脂の軟化により、前記電子部品が前記レジストの表面に近接すると共に前記半田と前記熱硬化性樹脂とが分離し、これにより、前記配線層と前記電子部品とで閉じられた前記開口内の第1空間に前記半田が集まると共に、前記レジストの上面と前記電子部品の側面とで形成された第2空間に前記熱硬化性樹脂が集まる、部品実装基板の製造システム。 - 前記付与装置は、前記接合面上の前記半田ペーストに含まれる半田の総体積が前記第1空間の容積と略同一となる様に、前記半田ペーストを付与する、請求項4に記載の部品実装基板の製造システム。
- 前記搭載装置は、前記電子部品を、その下面を前記レジストの表面から離間させた状態で前記配線基板に搭載する、請求項4又は請求項5に記載の部品実装基板の製造システム。
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CN201380001276.5A CN103797901B (zh) | 2012-08-10 | 2013-02-26 | 部件安装基板的制造方法及制造系统 |
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