WO2014013902A1 - 半導体用洗浄液及びそれを用いた洗浄方法 - Google Patents
半導体用洗浄液及びそれを用いた洗浄方法 Download PDFInfo
- Publication number
- WO2014013902A1 WO2014013902A1 PCT/JP2013/068644 JP2013068644W WO2014013902A1 WO 2014013902 A1 WO2014013902 A1 WO 2014013902A1 JP 2013068644 W JP2013068644 W JP 2013068644W WO 2014013902 A1 WO2014013902 A1 WO 2014013902A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cleaning liquid
- mass
- cleaning
- semiconductor
- lithography
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 128
- 239000004065 semiconductor Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims description 47
- 239000012530 fluid Substances 0.000 title abstract 6
- 239000007788 liquid Substances 0.000 claims abstract description 125
- 239000000126 substance Substances 0.000 claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 claims abstract description 58
- 238000001459 lithography Methods 0.000 claims abstract description 48
- 239000003960 organic solvent Substances 0.000 claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 28
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 14
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical group COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 13
- 238000001914 filtration Methods 0.000 claims description 12
- 239000004094 surface-active agent Substances 0.000 claims description 8
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 7
- 150000002596 lactones Chemical class 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 239000013522 chelant Substances 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims description 5
- 239000002516 radical scavenger Substances 0.000 claims description 3
- 125000003827 glycol group Chemical group 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 42
- 230000007547 defect Effects 0.000 abstract description 19
- 230000007261 regionalization Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 50
- -1 polytetrafluoroethylene tetrafluoride Polymers 0.000 description 34
- 239000004698 Polyethylene Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 12
- 229920000573 polyethylene Polymers 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 238000005406 washing Methods 0.000 description 12
- 238000005530 etching Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000671 immersion lithography Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 238000010828 elution Methods 0.000 description 4
- 239000006193 liquid solution Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001214 Polysorbate 60 Polymers 0.000 description 2
- 239000004147 Sorbitan trioleate Substances 0.000 description 2
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000005224 alkoxybenzenes Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 235000019337 sorbitan trioleate Nutrition 0.000 description 2
- 229960000391 sorbitan trioleate Drugs 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- NLMDJJTUQPXZFG-UHFFFAOYSA-N 1,4,10,13-tetraoxa-7,16-diazacyclooctadecane Chemical compound C1COCCOCCNCCOCCOCCN1 NLMDJJTUQPXZFG-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- XQQZRZQVBFHBHL-UHFFFAOYSA-N 12-crown-4 Chemical compound C1COCCOCCOCCO1 XQQZRZQVBFHBHL-UHFFFAOYSA-N 0.000 description 1
- VFTFKUDGYRBSAL-UHFFFAOYSA-N 15-crown-5 Chemical compound C1COCCOCCOCCOCCO1 VFTFKUDGYRBSAL-UHFFFAOYSA-N 0.000 description 1
- XEZNGIUYQVAUSS-UHFFFAOYSA-N 18-crown-6 Chemical compound C1COCCOCCOCCOCCOCCO1 XEZNGIUYQVAUSS-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- MWVTWFVJZLCBMC-UHFFFAOYSA-N 4,4'-bipyridine Chemical compound C1=NC=CC(C=2C=CN=CC=2)=C1 MWVTWFVJZLCBMC-UHFFFAOYSA-N 0.000 description 1
- XZIIFPSPUDAGJM-UHFFFAOYSA-N 6-chloro-2-n,2-n-diethylpyrimidine-2,4-diamine Chemical compound CCN(CC)C1=NC(N)=CC(Cl)=N1 XZIIFPSPUDAGJM-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RZTOWFMDBDPERY-UHFFFAOYSA-N Delta-Hexanolactone Chemical compound CC1CCCC(=O)O1 RZTOWFMDBDPERY-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- QGLBZNZGBLRJGS-UHFFFAOYSA-N Dihydro-3-methyl-2(3H)-furanone Chemical compound CC1CCOC1=O QGLBZNZGBLRJGS-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920001213 Polysorbate 20 Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 1
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 239000011954 Ziegler–Natta catalyst Substances 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000004035 chlorins Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- YSSSPARMOAYJTE-UHFFFAOYSA-N dibenzo-18-crown-6 Chemical compound O1CCOCCOC2=CC=CC=C2OCCOCCOC2=CC=CC=C21 YSSSPARMOAYJTE-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 150000002171 ethylene diamines Chemical class 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000011990 phillips catalyst Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 239000001816 polyoxyethylene sorbitan tristearate Substances 0.000 description 1
- 235000010988 polyoxyethylene sorbitan tristearate Nutrition 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 239000001589 sorbitan tristearate Substances 0.000 description 1
- 235000011078 sorbitan tristearate Nutrition 0.000 description 1
- 229960004129 sorbitan tristearate Drugs 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- WGPCZPLRVAWXPW-UHFFFAOYSA-N xi-Dihydro-5-octyl-2(3H)-furanone Chemical compound CCCCCCCCC1CCC(=O)O1 WGPCZPLRVAWXPW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2044—Dihydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2096—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- C11D2111/20—
-
- C11D2111/22—
Definitions
- the present invention relates to a semiconductor cleaning liquid used in a lithography process for manufacturing a semiconductor element, in particular, a cleaning liquid for cleaning a lithographic chemical liquid passage portion (a pipe in a semiconductor manufacturing apparatus or a filter for filtration) in a semiconductor manufacturing apparatus. It relates to the cleaning method used.
- the mainstream method is to form an underlayer film made of an organic material such as an antireflection film or a planarizing film between the semiconductor substrate and the resist, that is, an organic underlayer film. It has become.
- a portion of the organic underlayer film not protected by the resist is removed by etching using the resist pattern as a protective film, and then the semiconductor substrate is processed.
- Etching for processing the organic underlayer film and the semiconductor substrate is generally performed by dry etching.
- a film made of an inorganic substance known as a hard mask is used as a lower layer film between a semiconductor substrate and a photoresist.
- a film made of an inorganic substance known as a hard mask is used as a lower layer film between a semiconductor substrate and a photoresist.
- the rate of removal by dry etching depends on the type of gas used in dry etching. Therefore, the processing of the semiconductor substrate is performed using the property that the ratio of the etching rates is different.
- This semiconductor substrate is generally processed by dry etching.
- a liquid medium such as water having a predetermined film thickness or a dedicated high refractive index liquid is used between the exposure light and the resist.
- An ArF immersion lithography method is also studied in which a pattern is formed by making the ArF light even finer by utilizing the difference in refractive index.
- an exposure optical path space which has conventionally been an inert gas such as air or nitrogen, has a refractive index (n that is larger than the refractive index of these spaces (gas) and smaller than the refractive index of the resist film (n).
- Semiconductor manufacturing apparatuses used in the lithography process of semiconductor manufacturing include a coater (coating apparatus) and a developer (developing apparatus) for applying a chemical liquid for lithography (A) to a semiconductor substrate, and a chemical liquid for lithography applied to these apparatuses.
- the supply of (A) is supplied from a lithographic chemical solution (A) supply system sealed from the outside environment (clean room atmosphere).
- the lithographic chemical solution (A) which is normally delivered in a sealed state, is opened in a clean room and connected to the lithographic chemical solution (A) supply line to the apparatus so that impurities and the like do not enter.
- the lithographic chemical solution (A) connected to the supply line does not come into contact with the external environment (clean room atmosphere) until the lithographic chemical solution (A) is supplied onto the semiconductor substrate (wafer) in the coater.
- a plurality of lithographic chemical (A) filtration filters are installed in a pipe through which the lithographic chemical solution (A) passes before the process up to the application to the semiconductor substrate, and the lithographic chemical solution ( A) passes through these filters and is applied onto the semiconductor substrate after removing impurities (metal and particles (microparticles)). Therefore, there should be no impurities in the lithographic chemical solution (A) that has passed through the filter for normal lithography (A).
- defects presumed to be derived from the applied lithographic chemical solution (A), particularly the presence of metal impurities are observed.
- a post-etching defect that occurs when the metal substrate is used as a mask during etching of the semiconductor substrate occurs, or bubbles are generated when these metal impurities are included.
- Defects water marks may occur due to.
- a decrease in the yield of non-defective semiconductor elements due to these defects is a major problem, and an immediate solution is desired.
- Lithographic chemicals (A) Filter base materials (resins) used in filtration filters include fluorine-based materials such as PTFE (polytetrafluoroethylene tetrafluoride) and PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer).
- the metal-containing catalyst usually used in the synthesis of these resins includes a metal catalyst composed of titanium chloride and an organoaluminum compound or magnesium chloride, called a Ziegler-Natta catalyst, and a metal catalyst composed of a chromium compound such as chromium oxide represented by a Phillips catalyst.
- the metal derived from these catalysts is considered to be one of the causes of the metal impurities.
- the diameter (hole size) of a recent lithographic chemical solution (A) filtration filter has been reduced to about 30 to 2 nanometers.
- a cleaning liquid for lithography characterized by containing a ketone organic solvent, a lactone organic solvent, and at least one organic solvent selected from alkoxybenzene and aromatic alcohol
- Patent Document 2 There are applications for a cleaning liquid for lithography (Patent Document 2) containing at least one organic solvent selected from glycol organic solvents, lactone organic solvents, and alkoxybenzenes and aromatic alcohols.
- the cleaning liquid of the application is a process of removing unnecessary chemicals from the backside or edge of the substrate after the coating film is formed on the base material, removing the entire coating film, and further the base material before applying the coating material. It is characterized by high versatility in multiple cleaning processes such as cleaning.
- Examples of (2) include (I) an organic acid, (II) a surfactant, (III) a cleaning liquid containing an inorganic acid (Patent Document 3), [I] an organic acid having at least one carboxyl group, and / or And [II] complexing agent, and [III] (1) monohydric alcohols, (2) alkoxy alcohols, (3) glycols, (4) glycol ethers, (5) ketones and (6) nitriles
- a cleaning agent for a substrate comprising an organic solvent selected from the group consisting of a group (Patent Document 4), a cleaning agent for manufacturing a semiconductor device containing a fluorine compound and a glycol ether organic solvent (Patent Document 5), a carboxylic acid,
- semiconductor circuit cleaning agents comprising a water-soluble organic solvent (Patent Document 6) and the like, but these are cleaning liquids intended for semiconductor substrate cleaning.
- an application for a method of desorbing metal ions chemically adsorbed on a filter using an acid chemical solution as a cleaning method for a filter for cleaning liquid filtration used in a semiconductor substrate cleaning process includes 1 w% hydrogen fluoride solution, 1 w% hydrochloric acid solution, and the like as the cleaning liquid.
- the filter use part of this patent document 7 is different from the present invention because it is not related to the lithography chemical solution (A) passage part, which is the object of the present invention, but relates to the substrate cleaning liquid passage part filter.
- the cleaning liquid in any of the documents is not developed for the purpose of removing metal impurities from the liquid solution (A) passing portion which is the object of the present invention, and its effect is unknown.
- JP 2007-227645 A JP 2007-256710 A JP 2009-105299 A International Publication WO2005 / 040324 Pamphlet JP 2003-171692 A JP-A-10-256210 JP 7-31810 A
- An object of the present invention is to prevent defects due to metal impurities or the like generated on a semiconductor substrate after forming a resist pattern or after processing a semiconductor substrate in a semiconductor element manufacturing process.
- the liquid passing portion of the semiconductor manufacturing apparatus for lithography process (lithographic chemical liquid (A) pipe in the semiconductor manufacturing apparatus or The present invention is to provide a cleaning liquid for effectively removing metal impurities and the like present in a lithography chemical liquid (A) filter.
- the cleaning of the lithographic chemical solution (A) with the cleaning solution of the present invention can remove the metal impurities in the portion to reduce the defects, improve the yield of non-defective semiconductor devices, and thus improve the device manufacturing process in the semiconductor manufacturing process. Cost reduction can be expected.
- the present invention has been made in view of the above circumstances, and as a result of extensive studies by the inventors, a specific cleaning liquid, specifically, a cleaning liquid obtained by mixing an inorganic acid, water, and a hydrophilic organic solvent, It has been found that the metal impurities present in the liquid passage portion can be effectively removed, and the present invention has been achieved.
- a cleaning liquid for cleaning a flow-through portion of a chemical liquid for lithography in a semiconductor manufacturing apparatus used in a lithography process of semiconductor manufacturing which includes an inorganic acid, water, and a hydrophilic organic solvent
- cleaning liquid is inorganic acid: 0.0001 mass% thru
- the cleaning liquid according to the first aspect is a washing
- the cleaning liquid according to any one of the first aspect to the third aspect in which the inorganic acid is sulfuric acid, hydrochloric acid, or nitric acid
- the cleaning liquid according to any one of the first to fourth aspects wherein the hydrophilic organic solvent is a glycol solvent or a lactone solvent
- the cleaning liquid according to any one of the first to sixth aspects further including a surfactant
- the cleaning liquid (C) of the present invention comprises a hydrophilic organic solvent (B) (preferably a glycol organic solvent or a lactone organic solvent alone or a mixture of two or more), an inorganic acid aqueous solution, and optionally water.
- B hydrophilic organic solvent
- the acidic component amount in the cleaning liquid (C) includes 0.0001 mass% to 60 mass% of an inorganic acid component based on the total amount of the cleaning liquid (C).
- the cleaning liquid (C) of the present invention is a chemical liquid for lithography (A) present in a semiconductor manufacturing apparatus such as a coater (coating apparatus) or developer (developing apparatus) used in a lithography process, mainly for the purpose of removing metal impurities. Can be used for pre-processing before connecting the lithographic chemical solution (A) to various pipes and microfiltration filters, or when replacing the lithographic chemical solution (A).
- the cleaning liquid (A) is filtered by passing the cleaning liquid (C) through the piping, the lithographic chemical solution (A) or the piping in which they are combined, and then washed with the hydrophilic organic solvent (B).
- the cleaning liquid (C) of the present invention By washing by passing the solution until all of the acidic components therein are removed, metal impurities present in the pipe and the filter can be removed. As a result, defects derived from metal impurities in the lithography process can be reduced.
- the metal impurities can be removed by the cleaning liquid (C) of the present invention, the compatibility and incompatibility of the dissolved substance in the lithography chemical liquid (A) due to the hydrophobic metal impurities.
- the present invention relates to a resist, an organic resist underlayer film, a hard film in a semiconductor manufacturing apparatus used in a lithography process of semiconductor manufacturing, which is manufactured by mixing an inorganic acid, water, and a hydrophilic organic solvent (B).
- This is a cleaning liquid (C) for cleaning a liquid passing portion of a lithographic chemical liquid (A) such as a mask, a top coat, and a developer.
- a hydrophilic organic solvent (B) may be added to the aqueous inorganic acid solution, and water may be added as necessary.
- the specific preparation method of the cleaning liquid (C) is as follows.
- the inside of the container is thoroughly washed with water or the like, and the container is made of polyethylene, to which the metal component is not adhered, hydrophilic organic solvent, inorganic acid aqueous solution, and further if necessary. Water is further added, and the mixture is prepared by mixing (stirring) for 0.5 to 10 hours with a shaker or a magnetic stirrer at room temperature.
- the inside (wet part) should be thoroughly washed with water, etc.
- the initial preparation is carried out at a higher concentration in advance than the calculation, and after calculating the inorganic acid concentration accurately by a method such as neutralization titration,
- a method such as neutralization titration
- the cleaning liquid (C) is prepared, in order to remove minute impurities (particles) in the cleaning liquid, it may be filtered with, for example, a polyethylene precision filter (caliber: 0.05 ⁇ m, etc.).
- the inorganic acid of the component in the cleaning liquid (C) adheres to the lithography chemical liquid (A) pipe and the lithography chemical liquid (A) filtration filter in the semiconductor manufacturing apparatus to be cleaned by acidifying the cleaning liquid. It is used to ionize metallic impurities that are easily eluted in the cleaning solution.
- inorganic acids include hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid, boric acid, hydrofluoric acid, and the like, but sulfuric acid, hydrochloric acid, or nitric acid is highly effective in removing metal impurities.
- sulfuric acid, hydrochloric acid or nitric acid has a high effect of eluting magnesium, aluminum, potassium, calcium, iron, chromium and the like adhering to the lithographic chemical solution (A) filter.
- the proportion of the inorganic acid contained in the cleaning liquid (C) of the present invention is 0.0001 mass% to 60 mass% or 0.001 mass% to 40 mass%, more preferably 0, based on the total amount of the cleaning liquid (C). 0.001% by mass to 1% by mass.
- the proportion of the inorganic acid is 0%, there is no metal elution function at the time of cleaning the liquid solution passing part (pipe or member), and when it is 60% by mass or more, the chemical solution passing part (pipe or member) is corroded. .
- the solution viscosity becomes high, and this hinders circulation in the piping of the cleaning liquid itself in the cleaning process.
- the ratio of water contained in the cleaning liquid (C) of the present invention is 0.0006 mass% to 60 mass%, 0.006 mass% to 40 mass%, more preferably 0.006 mass% based on the total amount of the cleaning liquid (C). It is 0006 mass% to 10 mass%. In order to ionize metal impurities, it is necessary that water is mixed at a minimum of 0.0006 mass%. On the other hand, when the ratio of water is 60% by mass or more, the substituting property deteriorates when the chemical liquid passing portion in the semiconductor manufacturing apparatus is replaced with the hydrophilic organic solvent (B) after cleaning with the cleaning liquid (C). Alternatively, there is a high possibility that moisture will remain in the piping, and the performance of the lithographic chemical solution (A) used in the fine lithography process for semiconductor manufacturing may not be exhibited.
- the ratio of the hydrophilic organic solvent (B) contained in the cleaning liquid (C) of the present invention is 20% by mass to 99.999% by mass based on the total amount of the cleaning liquid (C), more preferably 90% by mass to 99.99%. It is 999 mass%.
- the hydrophilic organic solvent (B) is an organic solvent that is miscible with water at a free ratio, and it is necessary that the mixed state is stable even after mixing and that phase separation does not occur.
- the hydrophilic organic solvent (B) is used as a medium that occupies most of the cleaning liquid (C), but at the same time, it remains even after it has been used as a product for the production of a lithographic chemical liquid (A) filter.
- the metal-containing catalyst is dissolved, metal impurities contained in the filter for filtration can be removed.
- the cleaning liquid (C) of the present invention it is necessary to replace the cleaning liquid (C) in the pipe with only the hydrophilic organic solvent (B) containing no inorganic acid.
- the chemical liquid for lithography (A) is passed immediately after the hydrophilic organic solvent (B) is passed. This is to improve the throughput of the semiconductor element manufacturing line. Therefore, since there is usually no step of drying the inside of the piping, the hydrophilic organic solvent (B) of the cleaning liquid (C) of the present invention is a glycol organic solvent or lactone system used as a general-purpose solvent for the chemical liquid for lithography (A). Organic solvents are desirable.
- glycol organic solvents include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, 3-methoxy-3-methyl-1- Examples include butanol, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, diethylene glycol monobutyl ether acetate, and diethylene glycol monoethyl ether acetate.
- lactone organic solvent examples include ⁇ -butyrolactone, ⁇ -methyl- ⁇ -butyrolactone, ⁇ -valerolactone, ⁇ -caprolactone, ⁇ -laurolactone, ⁇ -valerolactone, and hexanolactone.
- 1-methoxy-2-propanol (propylene glycol monomethyl ether) or 1-ethoxy-2-propanol (propylene glycol monoethyl ether) is particularly desirable as the hydrophilic organic solvent (B) of the cleaning liquid (C) of the present invention.
- a surfactant may be added to the cleaning liquid (C) of the present invention as necessary.
- the surfactant include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene alkyl ethers such as polyoxyethylene oleyl ether, polyoxyethylene octylphenol ether, polyoxyethylene nonyl Polyoxyethylene alkylaryl ethers such as phenol ether, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan monooleate, sorbitan trioleate, sorbitan tristearate Sorbitan fatty acid esters such as rate, polyoxyethylene sorbitan monolaurate, polyoxyethylene Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters such as bitan monopalmitate, polyoxyethylene
- a metal scavenger (chelate compound) may be added.
- chain coordination chelating agent include ethylenediamines such as ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine or pentaethyleneexamine, 2,2′-bipyridine, 4,4′-bipyridine and the like.
- Bipyridines ethylenediaminetetraacetic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, phthalic acid, isophthalic acid, terephthalic acid and other dicarboxylic acid compounds, and phenanthroline.
- a cyclic coordination type chelating agent porphyrins, phthalocyanines, corols, chlorins, 12-crown-4, 15-crown-5, 18-crown-6, dibenzo-18-crown-6 or diaza-18-crown-6 And crown ethers.
- the compounding amount of these metal scavengers (chelate compounds) is usually 10% by mass or less, preferably 5% by mass or less per 100% by mass of the total amount of the cleaning liquid (C) of the present invention.
- These metal scavengers (chelate compounds) may be added alone or in combination of two or more.
- the cleaning liquid (C) of the present invention having the above composition By passing the cleaning liquid (C) of the present invention having the above composition into the lithography chemical liquid (A) pipe before the lithography chemical liquid (A) is passed through the semiconductor manufacturing apparatus. Thus, metal impurities which are impurities of defects on the semiconductor substrate can be removed.
- the cleaning liquid (C) is passed through once or a plurality of circulation steps. Thereafter, the cleaning liquid (C) in the pipe is replaced only with the hydrophilic organic solvent (B) obtained by removing the aqueous inorganic acid solution from the cleaning liquid (C), and the inorganic acid component is removed from the pipe.
- the liquid passing through (A) is performed.
- the base substrate is processed by an etching method to obtain a desired semiconductor substrate pattern.
- a dry etching method is preferably used.
- a wiring, an insulating film, and the like are repeatedly formed on these patterns to form a desired semiconductor element.
- Example 1 Metal impurity elution test from chemical solution through circulation of cleaning solution
- Fluorine resin (PTFE) pharmaceutical liquid piping (inner diameter / outer diameter; 4mm / 6mm, total length of about 2m), chemical liquid filtration filter (commercially available) and circulation pump used in semiconductor manufacturing equipment piping
- PGEE solvent
- Synthesis Example 1 for about 36 L
- ICP -The metal content was analyzed by MS (Agilent 7500, manufactured by Agilent Technologies). The analysis results are shown in Table 1.
- the cleaning liquid By passing this cleaning liquid through the liquid passing part in the cleaning device (chemical solution piping in the semiconductor manufacturing apparatus or chemical filter), the metal impurities that cause defects in the lithography process at the time of semiconductor element creation are removed. As a result, the yield of non-defective semiconductor elements is improved and cost reduction is expected.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
近年の半導体素子の微細化に伴い、使用される活性光線もKrFエキシマレーザー(248nm)からArFエキシマレーザー(193nm)、EUV光(13.5nm)へと短波長化されている。これに伴い活性光線の半導体基板からの反射を初め様々な影響によりレジストパターン形成が適切に出来ない問題が生じている。
現在では上記のような不具合を解消するため、半導体基板とレジストとの間に、反射防止膜や平坦化膜等の有機物質よりなる下層膜、即ち有機下層膜を形成して行う方法が主流となっている。この場合、レジストパターンを保護膜としてレジストで保護されていない部分の有機下層膜をエッチングにより除去し、その後、半導体基板の加工が行なわれる。有機下層膜、半導体基板の加工のためのエッチングは一般にドライエッチングにより行なわれる。
また、半導体基板とフォトレジストとの間の下層膜として、ハードマスクとして知られる無機物質からなる膜を使用することが行なわれている。この場合、フォトレジスト(有機物質)とハードマスク(下層膜:無機物質)では、その構成成分に大きな違いが有るため、それらのドライエッチングによって除去される速度は、ドライエッチングに使用されるガス種に大きく依存するため、このエッチング速度の比が異なる性質を利用して半導体基板の加工が行なわれる。この半導体基板の加工は一般にドライエッチングにより行われる。
またハードマスクの下層に塗布法もしくはCVD法等の方法にて有機下層膜を形成し、ハードマスクと有機下層膜のドライエッチング速度のガス種依存性を利用した多層レジストプロセスも検討されている。
ArF液浸リソグラフィーにおいては、レジスト露光時に水等の液体をレジスト上に直接接する状態で行う。このためレジストからの異物溶出による欠陥を防ぐために、レジスト上に液浸プロセス用レジスト上部保護膜(トップコート)が使用される場合もある。
現在半導体素子製造の量産において適用されている微細リソグラフィー工程、特にArFエキシマレーザーを用いた液浸リソグラフィーにおいては、レジストパターンの微細化のため及び露光時に液体媒体が直接接触するという特殊な工程を経るため、従来検出されていなかった微小欠陥や、更にはリソグラフィー用薬液(A)(レジスト、有機系レジスト下層膜、ハードマスク、トップコート、現像液等)中に含まれる泡が原因の欠陥(ウオーターマーク)が観察されている。
これらの樹脂合成にあたり通常用いられる金属含有触媒としては、Ziegler-Natta触媒と呼ばれる塩化チタンと有機アルミニウム化合物又は塩化マグネシウムからなる金属触媒、Phillips触媒に代表される酸化クロム等のクロム化合物からなる金属触媒等があり、これらの触媒に由来する金属が上記金属不純物の原因の1つと考えられている。
また、最近のリソグラフィー用薬液(A)ろ過用フィルターの口径(穴の大きさ)は30ナノメートル乃至2ナノメートル程度まで超微細化されている。
現在のところ、半導体製造工程用の洗浄液としては、(1)汎用洗浄液、(2)半導体基板用洗浄液、(3)洗浄液ろ過用フィルター用洗浄液、等がある。
(1)の例としては、ケトン系有機溶剤、ラクトン系有機溶剤、及びアルコキシベンゼン及び芳香族アルコールの中から選ばれる少なくとも1 種の有機溶剤を含有することを特徴とするリソグラフィー用洗浄液(特許文献1)、グリコール系有機溶剤、ラクトン系有機溶剤、及びアルコキシベンゼン及び芳香族アルコールの中から選ばれる少なくとも1種の有機溶剤を含有するリソグラフィー用洗浄液(特許文献2)の出願があるが、これらの出願の洗浄液は、基材上に塗膜を形成した後の基板裏面部または端縁部の不要な薬液の除去や塗膜全体を除去する工程、さらには塗膜材料を塗布する前の基材を洗浄など、複数の洗浄工程に汎用性が高いことを特徴としている。
(2)の例としては、(I)有機酸、(II)界面活性剤、(III)無機酸を含有する洗浄液(特許文献3)、〔I〕カルボキシル基を少なくとも1個有する有機酸又は/及び〔II〕錯化剤と、〔III〕(1)1価アルコール類、(2)アルコキシアルコール類、(3)グリコール類、(4)グリコールエーテル類、(5)ケトン類及び(6)ニトリル類からなる群より選ばれる有機溶剤とを含んでなる基板用洗浄剤(特許文献4)、フッ素化合物とグリコールエーテル系有機溶剤を含有する半導体装置製造用洗浄剤(特許文献5)、カルボン酸と水溶性有機溶剤とからなる半導体回路用洗浄剤(特許文献6)等の出願があるが、これらは半導体基板洗浄を目的とした洗浄液である。
(3)の例としては、半導体基板洗浄工程で使用される洗浄液ろ過用フィルターの清浄化方法として酸系の薬液を用いてフィルターに化学的に吸着した金属イオンを脱離させる方法の出願(特許文献7)があり、その洗浄液として1w%フッ化水素溶液、1w%塩酸溶液等が挙げられている。この特許文献7のフィルター使用部分は、本発明の目的であるリソグラフィー用薬液(A)通液部分ではなく、基板洗浄用洗浄液通液部分のフィルターに関するものであるため本発明とは異なる。
以上、いずれの文献における洗浄液も本発明の目的であるリソグラフィー用薬液(A)通液部分の金属不純物除去等を目的に開発されたものではなく、その効果は不明である。
本発明は第1観点として、無機酸と、水と、親水性有機溶剤とを含む、半導体製造のリソグラフィー工程で用いられる半導体製造装置内のリソグラフィー用薬液の通液部分を洗浄するための洗浄液、
第2観点として、上記洗浄液中の各成分の濃度が、洗浄液の総量に基づいて
無機酸 :0.0001質量%乃至60質量%
水 :0.0006質量%乃至60質量%
親水性有機溶剤:20質量%乃至99.999質量%
である第1観点に記載の洗浄液、
第3観点として、上記通液部分が、半導体製造装置内配管又はろ過用フィルターである第1観点又は第2観点に記載の洗浄液、
第4観点として、上記無機酸が、硫酸、塩酸又は硝酸である第1観点乃至第3観点のいずれか1項に記載の洗浄液、
第5観点として、上記親水性有機溶剤が、グリコール系溶剤又はラクトン系溶剤である第1観点乃至第4観点のいずれか1項に記載の洗浄液、
第6観点として、上記親水性有機溶剤が、1-メトキシ-2-プロパノール又は1-エトキシ-2-プロパノールである第1観点乃至第5観点のいずれか1項に記載の洗浄液、
第7観点として、更に界面活性剤を含む、第1観点乃至第6観点のいずれか1項に記載の洗浄液、
第8観点として、更に金属捕捉剤(キレート化合物)を含む、第1観点乃至請第7観点のいずれか1項に記載の洗浄液、
第9観点として、第1観点乃至第8観点のいずれか1項に記載の洗浄液を、リソグラフィー工程で用いられる半導体製造装置内のリソグラフィー用薬液の通液部分に通液して行う洗浄方法、
第10観点として、第1観点乃至第8観点のいずれか1項に記載の洗浄液にて洗浄されたリソグラフィー工程用半導体製造装置を用いて形成された半導体素子、
第11観点として、第1観点乃至第8観点のいずれか1項に記載の洗浄液にて洗浄されたリソグラフィー工程用半導体製造装置を用いて形成された、半導体素子の製造に用いられるレジストパターンを用いて半導体基板を加工する工程を含む半導体素子の製造方法、
である。
本発明の洗浄液(C)は、親水性有機溶剤(B)(グリコール系有機溶剤又はラクトン系有機溶剤の単体もしくは2つ以上の混合液が望ましい)と、無機酸水溶液、さらに必要に応じて水を添加したものの混合物である。ここで、効果的に金属不純物を取り除くために、洗浄液(C)中の酸性成分量として、洗浄液(C)の総量に基づいて0.0001質量%乃至60質量%の無機酸成分を含むことが望ましい。
本発明の洗浄液(C)は、金属不純物除去を主な目的として、リソグラフィー工程にて用いられるコーター(塗布装置)、ディベロッパー(現像装置)等の半導体製造装置内に存在するリソグラフィー用薬液(A)が通過する、各種配管及び微細ろ過用フィルターに、リソグラフィー用薬液(A)を繋ぐ前に行う前処理に又はリソグラフィー用薬液(A)交換(繋ぎ変え)の場合に使用できる。すなわち、上記配管、リソグラフィー用薬液(A)ろ過用フィルター単体又はそれらが複合化した配管に上記洗浄液(C)を通液して洗浄し、その後親水性有機溶剤(B)を用いて、上記洗浄液中の酸性成分がすべて取り除かれるまで通液により洗浄を行うことで、配管及びフィルター中に存在する金属不純物を取り除くことができる。この結果、リソグラフィー工程における金属不純物由来の欠陥を少なくすることが出来る。
具体的には、本発明の洗浄液(C)により上記金属不純物を取り除くことが出来れば、疎水性である金属不純物によるリソグラフィー用薬液(A)内の溶解している物質の相溶性、不相溶性のバランスの不均衡により発生する泡を抑えることができるため、リソグラフィー工程後、作成されたレジストパターンに存在する欠陥又は、ドライエッチング後、泡が原因の欠陥(ウオーターマーク)を無くすことができる。さらには、金属不純物が半導体基板表面に直接存在することによる、半導体基板エッチング時に該金属がマスクとなり発生するエッチング後ディフェクト(コーンディフェクト)を防ぐことができる。
洗浄液(C)の調製方法としては、無機酸水溶液に親水性有機溶剤(B)、さらに必要に応じて水を追加することが挙げられる。さらに必要に応じて界面活性剤、金属捕捉剤(キレート化合物)を添加してもよい。
洗浄液(C)の具体的な調製方法を示すと、容器内部を水等で十分に洗浄した金属分が付着していないポリエチレン製容器に、親水性有機溶剤、無機酸水溶液、更には必要に応じて水をさらに追加し、室温にて振とう攪拌器又はマグネチックスターラー等にて0.5乃至10時間混合(攪拌)させ調製する。大量(数kg~数トン)に調製する場合は、内部(接液部分)を水等で十分に洗浄した、所定容量のポリエチレン製等の樹脂製薬液混合槽やフッ素樹脂ライニング等を施した所定容量のステンレス製混合槽等に、上記と同様に洗浄液(C)の成分を導入した後、攪拌翼等にて混合し調製できる。また、無機酸成分濃度等を精密に調製するため、予め計算上より多めの濃度にて初期調製を行い、中和滴定等の方法にて無機酸濃度を正確に算出した後、最終調製用の有機溶剤(あるいは水)を加えて混合(攪拌)することで、最終目的の濃度の洗浄液を調製する方法もある。洗浄液(C)調製後、洗浄液中の微小不純物(パーティクル)を除去するために、例えばポリエチレン製の精密フィルター(口径:0.05μm等)にてろ過してもよい。
本発明の洗浄液(C)中に含まれる無機酸の割合は洗浄液(C)の総量に基づいて0.0001質量%乃至60質量%又は、0.001質量%乃至40質量%、より好ましくは0.001質量%乃至1質量%である。無機酸の割合が0%であると、薬液通液部分(配管や部材)洗浄時の金属溶出機能が無く、60質量%以上であると、薬液通液部分(配管や部材)の腐食が起こる。また無機酸の種類(例えば硫酸)によっては溶液粘度が高くなり、洗浄工程において、洗浄液自体の配管内の循環に支障をきたす。
親水性有機溶剤(B)は、水と自由な割合で混和する有機溶剤であり、混和した後もその混合状態が安定し、相分離することが無いことが必要である。親水性有機溶剤(B)は、上記洗浄液(C)の大部分を占める媒体として用いられるが、同時に、リソグラフィー用薬液(A)ろ過用フィルター製造時に使用され製品となった後にも残存している金属含有触媒を溶解させるので、ろ過用フィルターに含まれる金属不純物を除去することが出来る。
本発明の洗浄液(C)で洗浄後、配管内にある該洗浄液(C)を無機酸を含まない親水性有機溶剤(B)のみで置換をすることが必要であるが、通常の半導体素子の製造工程においては、該親水性有機溶剤(B)の通液後直ぐにリソグラフィー用薬液(A)が通液される。これは半導体素子製造ラインのスループット向上のためである。従って、配管内を乾燥させる工程は通常存在しないため、本発明の洗浄液(C)の親水性有機溶剤(B)としてはリソグラフィー用薬液(A)の汎用溶剤として用いられるグリコール系有機溶剤又はラクトン系有機溶剤が望ましい。
ラクトン系有機溶剤としてはγ-ブチロラクトン、α-メチル-γ-ブチロラクトン、γ-バレロラクトン、γ-カプロラクトン、γ-ラウロラクトン、δ-バレロラクトン、ヘキサノラクトン等がある。
これらの中でも特に1-メトキシ-2-プロパノール(プロピレングリコールモノメチルエーテル)又は1-エトキシ-2-プロパノール(プロピレングリコールモノエチルエーテル)が本発明の洗浄液(C)の親水性有機溶剤(B)として望ましい。
環状配位型キレート剤として、ポルフィリン類、フタロシアニン、コロール、クロリン、12-クラウン-4、 15-クラウン-5、18-クラウン-6、ジベンゾ-18-クラウン-6又はジアザ-18-クラウン-6等のクラウンエーテル類等がある。これらの金属捕捉剤(キレート化合物)の配合量は、本発明の洗浄液(C)の総量100質量%当たり通常10質量%以下、好ましくは5質量%以下である。これらの金属捕捉剤(キレート化合物)は単独で添加してもよいし、また2種以上の組合せで添加することもできる。
さらにこれらのレジストパターンをマスクとして、下地基板をエッチング法により加工し、所望の半導体基板のパターンが得られる。エッチング法はドライエッチング法が好ましく用いられる。これらのパターンに、さらに配線、絶縁膜等の形成を繰り返し行い、所望の半導体素子が形成される。
(洗浄液の調製)
(合成例1)
金属不純物等を水洗により十分に取り除いた4Lポリエチレン製容器(アイセロ化学株式会社製)に精製1-エトキシ-2-プロパノール(プロピレングリコールモノエチルエーテル(PGEE))(東京化成工業株式会社製)3600g、98質量%硫酸水溶液(日産化学工業株式会社製)0.4gと水399.6gを加え封をし、室温にて十分に振とう攪拌させて、0.01質量%硫酸含有洗浄液を得た(有機溶剤濃度:90.0質量%、水濃度:9.99質量%)。
(合成例2)
金属不純物等を水洗により十分に取り除いた250mLポリエチレン製容器(アイセロ化学株式会社製)に精製PGEE(東京化成工業株式会社製)20.0g、98質量%硫酸水溶液(日産化学工業株式会社製)40.8gと水39.2gを加え封をし、室温にて十分に振とう攪拌させて40質量%硫酸含有洗浄液を得た(有機溶剤濃度:20.0質量%、水濃度:40.0質量%)。
(合成例3)
金属不純物等を水洗により十分に取り除いた250mLポリエチレン製容器(アイセロ化学株式会社製)に、合成例1で作成した0.01質量%硫酸含有洗浄液10gと90gの精製PGEE(東京化成工業株式会社製)を加えて0.001質量%硫酸含有洗浄液を得た(有機溶剤濃度:99.0質量%、水濃度:0.999質量%)。
(合成例4)
金属不純物等を水洗により十分に取り除いた250mLポリエチレン製容器(アイセロ化学株式会社製)に、精製PGEE(東京化成工業株式会社製)99.99gと36.46質量%塩酸水溶液(関東化学株式会社製)0.01gとを加え封をし、室温にて十分に振とう攪拌させて0.003646質量%塩酸含有洗浄液を得た(有機溶剤濃度:99.99質量%、水濃度:0.006354質量%)。
(合成例5)
金属不純物等を水洗により十分に取り除いた250mLポリエチレン製容器(アイセロ化学株式会社製)に、精製PGEE(東京化成工業株式会社製)99.9gと36.46質量%塩酸水溶液(関東化学株式会社製)0.1gとを加え封をし、室温にて十分に振とう攪拌させて0.03646質量%塩酸含有洗浄液を得た(有機溶剤濃度:99.9質量%、水濃度:0.06354質量%)。
(合成例6)
金属不純物等を水洗により十分に取り除いた250 mLポリエチレン製容器(アイセロ化学株式会社製)に、精製PGEE(東京化成工業株式会社製)99.616gと36.46質量%塩酸水溶液(関東化学株式会社製)0.384gとを加え封をし、室温にて十分に振とう攪拌させて0.14質量%塩酸含有洗浄液を得た(有機溶剤濃度:99.616質量%、水濃度:0.244質量%)。
(合成例7)
金属不純物等を水洗により十分に取り除いた250 mLポリエチレン製容器(アイセロ化学株式会社製)に、精製1-メトキシ-2-プロパノール(プロピレングリコールモノメチルエーテル(PGME))(東京化成工業株式会社製)99.973gと36.46質量%塩酸水溶液(関東化学株式会社製)0.027gとを加え封をし、室温にて十分に振とう攪拌させて0.01質量%塩酸含有洗浄液を得た(有機溶剤濃度:99.973質量%、水濃度:0.017質量%)。
(洗浄液循環による薬液通液部分からの金属不純物溶出試験)
半導体製造装置内配管に用いられるフッ素樹脂(PTFE)製薬液配管 (内径/外径;4mm/6mm、全長約2m)、薬液濾過用フィルター(市販品)及び循環用ポンプで構成された循環ろ過装置にて、溶剤(PGEE)又は合成例1の洗浄液にて9回(約36L相当分)循環させ、循環後の洗浄液を精製PGEE(東京化成工業株式会社製)にて10倍に希釈し、ICP-MS(Agilent7500、アジレント・テクノロジー株式会社製)にて金属含有量を分析した。分析結果を表1に示す。
[表1]
<実施例2>
(半導体用薬液通液部分使用部材からの金属不純物溶出試験)
半導体製造装置内配管内に存在する薬液接液部材用樹脂(市販品、ポリエチレン製、不純物としてMg、K、Al、Ca、Feを含む)約0.3gをセラミックハサミにて6片切り出し、その樹脂片各々を合成例2乃至合成例6にて合成した洗浄液及び水入り250mLポリエチレンボトルに入れて、室温にて1週間静置して浸漬し、その後その浸漬液を、精製PGEE(東京化成工業株式会社製)にて10倍に希釈しICP-MS(Agilent7500、アジレント・テクノロジー株式会社製)にて金属含有量を分析した。結果を表2に示す。
[表2]
Claims (11)
- 無機酸と、水と、親水性有機溶剤とを含む、半導体製造のリソグラフィー工程で用いられる半導体製造装置内のリソグラフィー用薬液の通液部分を洗浄するための洗浄液。
- 上記洗浄液中の各成分の濃度が、洗浄液の総量に基づいて
無機酸 :0.0001質量%乃至60質量%
水 :0.0006質量%乃至60質量%
親水性有機溶剤:20質量%乃至99.999質量%
である請求項1に記載の洗浄液。 - 上記通液部分が、半導体製造装置内配管又はろ過用フィルターである請求項1又は請求項2に記載の洗浄液。
- 上記無機酸が、硫酸、塩酸又は硝酸である請求項1乃至請求項3のいずれか1項に記載の洗浄液。
- 上記親水性有機溶剤が、グリコール系溶剤又はラクトン系溶剤である請求項1乃至請求項4のいずれか1項に記載の洗浄液。
- 上記親水性有機溶剤が、1-メトキシ-2-プロパノール又は1-エトキシ-2-プロパノールである請求項1乃至請求項5のいずれか1項に記載の洗浄液。
- 更に界面活性剤を含む、請求項1乃至請求項6のいずれか1項に記載の洗浄液。
- 更に金属捕捉剤(キレート化合物)を含む、請求項1乃至請求項7のいずれか1項に記載の洗浄液。
- 請求項1乃至請求項8のいずれか1項に記載の洗浄液を、リソグラフィー工程で用いられる半導体製造装置内のリソグラフィー用薬液の通液部分に通液して行う洗浄方法。
- 請求項1乃至請求項8のいずれか1項に記載の洗浄液にて洗浄されたリソグラフィー工程用半導体製造装置を用いて形成された半導体素子。
- 請求項1乃至請求項8のいずれか1項に記載の洗浄液にて洗浄されたリソグラフィー工程用半導体製造装置を用いて形成された、半導体素子の製造に用いられるレジストパターンを用いて半導体基板を加工する工程を含む半導体素子の製造方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13820182.7A EP2876669B1 (en) | 2012-07-19 | 2013-07-08 | Cleaning fluid for semiconductor, and cleaning method using same |
JP2014525789A JP6187778B2 (ja) | 2012-07-19 | 2013-07-08 | 半導体用洗浄液及びそれを用いた洗浄方法 |
US14/415,844 US9834745B2 (en) | 2012-07-19 | 2013-07-08 | Cleaning fluid for semiconductor, and cleaning method using the same |
KR1020217035208A KR102463726B1 (ko) | 2012-07-19 | 2013-07-08 | 반도체용 세정액 및 이것을 이용한 세정방법 |
KR1020157002663A KR20150036307A (ko) | 2012-07-19 | 2013-07-08 | 반도체용 세정액 및 이것을 이용한 세정방법 |
KR1020217000380A KR102396007B1 (ko) | 2012-07-19 | 2013-07-08 | 반도체용 세정액 및 이것을 이용한 세정방법 |
SG11201500393RA SG11201500393RA (en) | 2012-07-19 | 2013-07-08 | Cleaning fluid for semiconductor, and cleaning method using same |
CN201380035843.9A CN104412370B (zh) | 2012-07-19 | 2013-07-08 | 半导体用洗涤液及使用该洗涤液的洗涤方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012160884 | 2012-07-19 | ||
JP2012-160884 | 2012-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014013902A1 true WO2014013902A1 (ja) | 2014-01-23 |
Family
ID=49948732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/068644 WO2014013902A1 (ja) | 2012-07-19 | 2013-07-08 | 半導体用洗浄液及びそれを用いた洗浄方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US9834745B2 (ja) |
EP (1) | EP2876669B1 (ja) |
JP (1) | JP6187778B2 (ja) |
KR (3) | KR102463726B1 (ja) |
CN (1) | CN104412370B (ja) |
MY (1) | MY172318A (ja) |
SG (1) | SG11201500393RA (ja) |
TW (1) | TWI577794B (ja) |
WO (1) | WO2014013902A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020155649A (ja) * | 2019-03-20 | 2020-09-24 | 株式会社Screenホールディングス | 基板処理装置、及び基板処理装置の配管洗浄方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6199686B2 (ja) * | 2013-10-04 | 2017-09-20 | 信越化学工業株式会社 | レジスト組成物の製造方法 |
JP6466650B2 (ja) * | 2014-04-03 | 2019-02-06 | 信越化学工業株式会社 | レジスト組成物の製造方法 |
SG11201707787SA (en) * | 2015-03-31 | 2017-10-30 | Versum Mat Us Llc | Cleaning formulations |
WO2017170428A1 (ja) * | 2016-03-31 | 2017-10-05 | 富士フイルム株式会社 | 電子材料製造用薬液の製造方法、パターン形成方法、半導体デバイスの製造方法、電子材料製造用薬液、容器、及び、品質検査方法 |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05217988A (ja) * | 1992-01-09 | 1993-08-27 | Nec Corp | 洗浄装置 |
JPH0731810A (ja) | 1993-07-23 | 1995-02-03 | Sony Corp | 洗浄工程におけるフィルタの清浄化方法 |
JPH10256210A (ja) | 1997-03-12 | 1998-09-25 | Mitsubishi Gas Chem Co Inc | 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法 |
JP3287074B2 (ja) * | 1993-09-03 | 2002-05-27 | 栗田工業株式会社 | 酸化鉄スケールの溶解除去方法 |
JP2003171692A (ja) | 2001-12-04 | 2003-06-20 | Sony Corp | 半導体装置製造用洗浄剤及びそれを用いた半導体装置の製造方法 |
JP2004104029A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
WO2005040324A1 (ja) | 2003-10-27 | 2005-05-06 | Wako Pure Chemical Industries, Ltd. | 基板用洗浄剤及び洗浄方法 |
JP2007123776A (ja) * | 2005-10-31 | 2007-05-17 | Tokyo Ohka Kogyo Co Ltd | 洗浄液および洗浄方法 |
JP2007123775A (ja) * | 2005-10-31 | 2007-05-17 | Tokyo Ohka Kogyo Co Ltd | 洗浄液および洗浄方法 |
JP2007160206A (ja) * | 2005-12-13 | 2007-06-28 | Seiko Epson Corp | 塗布装置 |
JP2007165866A (ja) * | 2005-11-16 | 2007-06-28 | Tokyo Ohka Kogyo Co Ltd | 半導体製造用薬液供給装置の洗浄液 |
JP2007227645A (ja) | 2006-02-23 | 2007-09-06 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄液、およびこれを用いた基材の洗浄方法、並びに薬液供給装置の洗浄方法 |
JP2007256710A (ja) | 2006-03-24 | 2007-10-04 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄液、およびこれを用いた基材の洗浄方法、並びに薬液供給装置の洗浄方法 |
JP2008216843A (ja) * | 2007-03-07 | 2008-09-18 | Mitsubishi Gas Chem Co Inc | フォトレジスト剥離液組成物 |
JP4191162B2 (ja) * | 2005-04-20 | 2008-12-03 | 宮崎沖電気株式会社 | レジスト塗布装置のレジスト配管の洗浄方法 |
JP2009105299A (ja) | 2007-10-05 | 2009-05-14 | Mitsubishi Chemicals Corp | 半導体デバイス用基板の洗浄液 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW263531B (ja) * | 1992-03-11 | 1995-11-21 | Mitsubishi Gas Chemical Co | |
JPH0764284A (ja) * | 1993-08-24 | 1995-03-10 | Sumitomo Chem Co Ltd | 溶剤、溶液型キノンジアジド系感光剤、フォトレジスト組成物および洗浄液 |
TW593674B (en) * | 1999-09-14 | 2004-06-21 | Jsr Corp | Cleaning agent for semiconductor parts and method for cleaning semiconductor parts |
US6831048B2 (en) | 2000-04-26 | 2004-12-14 | Daikin Industries, Ltd. | Detergent composition |
US6799589B2 (en) * | 2000-11-08 | 2004-10-05 | Sony Corporation | Method and apparatus for wet-cleaning substrate |
US9217929B2 (en) * | 2004-07-22 | 2015-12-22 | Air Products And Chemicals, Inc. | Composition for removing photoresist and/or etching residue from a substrate and use thereof |
KR101232249B1 (ko) * | 2004-08-10 | 2013-02-12 | 간또 가가꾸 가부시끼가이샤 | 반도체 기판 세정액 및 반도체 기판 세정방법 |
EP1628336B1 (en) * | 2004-08-18 | 2012-01-04 | Mitsubishi Gas Chemical Company, Inc. | Cleaning liquid and cleaning method |
WO2007020979A1 (ja) * | 2005-08-19 | 2007-02-22 | Nissan Chemical Industries, Ltd. | ハードマスクの除去用組成物及び除去方法 |
KR100734274B1 (ko) * | 2005-09-05 | 2007-07-02 | 삼성전자주식회사 | 기판 세정용 조성물을 이용한 게이트 형성 방법 |
KR20070052205A (ko) * | 2005-11-16 | 2007-05-21 | 도오꾜오까고오교 가부시끼가이샤 | 반도체 제조용 약액 공급 장치의 세정액 |
US7884062B2 (en) | 2006-02-23 | 2011-02-08 | Tokyo Ohka Kogyo Co., Ltd. | Cleaning liquid for lithography and cleaning method using same |
US9034108B2 (en) * | 2008-04-09 | 2015-05-19 | Dow Global Technologies Llc | Cleaning compositions for use in closed loop cleaning machines |
JP2010056208A (ja) * | 2008-08-27 | 2010-03-11 | Hitachi Kokusai Electric Inc | 基板洗浄装置 |
KR101051375B1 (ko) * | 2008-09-26 | 2011-07-22 | (주) 나노팩 | 이산화티타늄 졸 제조장치 및 제조방법 및 이를 이용한 페이스트 조성물 |
DE102009002095A1 (de) * | 2009-04-01 | 2010-10-07 | Henkel Ag & Co. Kgaa | Reinigungsmittel |
CN102548654A (zh) | 2009-09-29 | 2012-07-04 | 株式会社日本触媒 | 颗粒状吸水剂及其制造方法 |
US20130186764A1 (en) * | 2012-01-19 | 2013-07-25 | Kesheng Feng | Low Etch Process for Direct Metallization |
-
2013
- 2013-07-08 WO PCT/JP2013/068644 patent/WO2014013902A1/ja active Application Filing
- 2013-07-08 KR KR1020217035208A patent/KR102463726B1/ko active IP Right Grant
- 2013-07-08 JP JP2014525789A patent/JP6187778B2/ja active Active
- 2013-07-08 KR KR1020217000380A patent/KR102396007B1/ko active IP Right Grant
- 2013-07-08 US US14/415,844 patent/US9834745B2/en active Active
- 2013-07-08 EP EP13820182.7A patent/EP2876669B1/en active Active
- 2013-07-08 CN CN201380035843.9A patent/CN104412370B/zh active Active
- 2013-07-08 MY MYPI2015000131A patent/MY172318A/en unknown
- 2013-07-08 SG SG11201500393RA patent/SG11201500393RA/en unknown
- 2013-07-08 KR KR1020157002663A patent/KR20150036307A/ko active Application Filing
- 2013-07-17 TW TW102125553A patent/TWI577794B/zh active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05217988A (ja) * | 1992-01-09 | 1993-08-27 | Nec Corp | 洗浄装置 |
JPH0731810A (ja) | 1993-07-23 | 1995-02-03 | Sony Corp | 洗浄工程におけるフィルタの清浄化方法 |
JP3287074B2 (ja) * | 1993-09-03 | 2002-05-27 | 栗田工業株式会社 | 酸化鉄スケールの溶解除去方法 |
JPH10256210A (ja) | 1997-03-12 | 1998-09-25 | Mitsubishi Gas Chem Co Inc | 半導体回路用洗浄剤及びそれを用いた半導体回路の製造方法 |
JP2003171692A (ja) | 2001-12-04 | 2003-06-20 | Sony Corp | 半導体装置製造用洗浄剤及びそれを用いた半導体装置の製造方法 |
JP2004104029A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
WO2005040324A1 (ja) | 2003-10-27 | 2005-05-06 | Wako Pure Chemical Industries, Ltd. | 基板用洗浄剤及び洗浄方法 |
JP4191162B2 (ja) * | 2005-04-20 | 2008-12-03 | 宮崎沖電気株式会社 | レジスト塗布装置のレジスト配管の洗浄方法 |
JP2007123775A (ja) * | 2005-10-31 | 2007-05-17 | Tokyo Ohka Kogyo Co Ltd | 洗浄液および洗浄方法 |
JP2007123776A (ja) * | 2005-10-31 | 2007-05-17 | Tokyo Ohka Kogyo Co Ltd | 洗浄液および洗浄方法 |
JP2007165866A (ja) * | 2005-11-16 | 2007-06-28 | Tokyo Ohka Kogyo Co Ltd | 半導体製造用薬液供給装置の洗浄液 |
JP2007160206A (ja) * | 2005-12-13 | 2007-06-28 | Seiko Epson Corp | 塗布装置 |
JP2007227645A (ja) | 2006-02-23 | 2007-09-06 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄液、およびこれを用いた基材の洗浄方法、並びに薬液供給装置の洗浄方法 |
JP2007256710A (ja) | 2006-03-24 | 2007-10-04 | Tokyo Ohka Kogyo Co Ltd | リソグラフィー用洗浄液、およびこれを用いた基材の洗浄方法、並びに薬液供給装置の洗浄方法 |
JP2008216843A (ja) * | 2007-03-07 | 2008-09-18 | Mitsubishi Gas Chem Co Inc | フォトレジスト剥離液組成物 |
JP2009105299A (ja) | 2007-10-05 | 2009-05-14 | Mitsubishi Chemicals Corp | 半導体デバイス用基板の洗浄液 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2876669A4 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020155649A (ja) * | 2019-03-20 | 2020-09-24 | 株式会社Screenホールディングス | 基板処理装置、及び基板処理装置の配管洗浄方法 |
JP7302997B2 (ja) | 2019-03-20 | 2023-07-04 | 株式会社Screenホールディングス | 基板処理装置、及び基板処理装置の配管洗浄方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102463726B1 (ko) | 2022-11-07 |
JPWO2014013902A1 (ja) | 2016-06-30 |
KR102396007B1 (ko) | 2022-05-10 |
KR20150036307A (ko) | 2015-04-07 |
KR20210132246A (ko) | 2021-11-03 |
EP2876669A4 (en) | 2016-05-11 |
EP2876669A1 (en) | 2015-05-27 |
TW201412976A (zh) | 2014-04-01 |
MY172318A (en) | 2019-11-21 |
CN104412370A (zh) | 2015-03-11 |
US9834745B2 (en) | 2017-12-05 |
US20150166941A1 (en) | 2015-06-18 |
CN104412370B (zh) | 2018-05-11 |
EP2876669B1 (en) | 2021-07-07 |
TWI577794B (zh) | 2017-04-11 |
SG11201500393RA (en) | 2015-04-29 |
KR20210006013A (ko) | 2021-01-15 |
JP6187778B2 (ja) | 2017-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI737798B (zh) | 處理液、基板的清洗方法、半導體裝置的製造方法 | |
TWI702310B (zh) | 處理液、基板清洗方法及抗蝕劑的去除方法 | |
JP6187778B2 (ja) | 半導体用洗浄液及びそれを用いた洗浄方法 | |
WO2018043697A1 (ja) | 有機溶剤の精製方法および有機溶剤の精製装置 | |
TWI764923B (zh) | 溶液、溶液收容體、感光化射線性或感放射線性樹脂組成物、圖案形成方法、半導體裝置的製造方法 | |
KR102373044B1 (ko) | 약액, 약액 수용체, 및 패턴 형성 방법 | |
CN108885410A (zh) | 电子材料制造用药液的制造方法、图案形成方法、半导体装置的制造方法、电子材料制造用药液、容器及品质检查方法 | |
JP6542393B2 (ja) | 処理液、基板の洗浄方法および半導体デバイスの製造方法 | |
JP7090625B2 (ja) | 処理液、キット、基板の洗浄方法 | |
TWI693635B (zh) | 圖案處理方法、半導體基板製品的製造方法及圖案結構的前處理液 | |
TW202019551A (zh) | 處理化學液體的方法及純化化學液體的方法 | |
TW202006480A (zh) | 藥液、藥液收容體 | |
WO2021039701A1 (ja) | 処理液 | |
TW202229531A (zh) | 組成物、基板的清洗方法 | |
JPWO2020041388A5 (ja) | ||
JP2006160859A (ja) | 半導体製造装置の洗浄用溶剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13820182 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2014525789 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14415844 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20157002663 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013820182 Country of ref document: EP |