WO2013145640A1 - 真空チャンバーの減圧方法、真空装置、有機膜の形成方法、有機el素子の製造方法、有機el表示パネル、有機el表示装置、有機el発光装置および不純物検出方法 - Google Patents
真空チャンバーの減圧方法、真空装置、有機膜の形成方法、有機el素子の製造方法、有機el表示パネル、有機el表示装置、有機el発光装置および不純物検出方法 Download PDFInfo
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- WO2013145640A1 WO2013145640A1 PCT/JP2013/001873 JP2013001873W WO2013145640A1 WO 2013145640 A1 WO2013145640 A1 WO 2013145640A1 JP 2013001873 W JP2013001873 W JP 2013001873W WO 2013145640 A1 WO2013145640 A1 WO 2013145640A1
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- vacuum chamber
- pump
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- vacuum
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- 238000000034 method Methods 0.000 title claims abstract description 228
- 239000012535 impurity Substances 0.000 title claims abstract description 135
- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 230000007704 transition Effects 0.000 claims abstract description 44
- 230000008569 process Effects 0.000 claims description 144
- 239000000463 material Substances 0.000 claims description 102
- 239000000758 substrate Substances 0.000 claims description 57
- 230000006837 decompression Effects 0.000 claims description 40
- POOSGDOYLQNASK-UHFFFAOYSA-N tetracosane Chemical group CCCCCCCCCCCCCCCCCCCCCCCC POOSGDOYLQNASK-UHFFFAOYSA-N 0.000 claims description 40
- 238000000576 coating method Methods 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 38
- 239000007789 gas Substances 0.000 claims description 24
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 20
- 239000000314 lubricant Substances 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 8
- 230000009467 reduction Effects 0.000 claims description 7
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000011109 contamination Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 257
- 239000010408 film Substances 0.000 description 96
- 238000002474 experimental method Methods 0.000 description 34
- 238000002347 injection Methods 0.000 description 27
- 239000007924 injection Substances 0.000 description 27
- 238000001035 drying Methods 0.000 description 22
- 238000007789 sealing Methods 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000003860 storage Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- -1 polyethylene Polymers 0.000 description 14
- 230000005525 hole transport Effects 0.000 description 13
- 239000011265 semifinished product Substances 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 239000011368 organic material Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 150000004866 oxadiazoles Chemical class 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229940083761 high-ceiling diuretics pyrazolone derivative Drugs 0.000 description 2
- 150000007857 hydrazones Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical class C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- JEXVQSWXXUJEMA-UHFFFAOYSA-N pyrazol-3-one Chemical class O=C1C=CN=N1 JEXVQSWXXUJEMA-UHFFFAOYSA-N 0.000 description 2
- 150000003219 pyrazolines Chemical class 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical class [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- UWRZIZXBOLBCON-VOTSOKGWSA-N (e)-2-phenylethenamine Chemical class N\C=C\C1=CC=CC=C1 UWRZIZXBOLBCON-VOTSOKGWSA-N 0.000 description 1
- BIXMBBKKPTYJEK-UHFFFAOYSA-N 1,3-benzoxazin-2-one Chemical class C1=CC=C2OC(=O)N=CC2=C1 BIXMBBKKPTYJEK-UHFFFAOYSA-N 0.000 description 1
- VERMWGQSKPXSPZ-BUHFOSPRSA-N 1-[(e)-2-phenylethenyl]anthracene Chemical class C=1C=CC2=CC3=CC=CC=C3C=C2C=1\C=C\C1=CC=CC=C1 VERMWGQSKPXSPZ-BUHFOSPRSA-N 0.000 description 1
- 150000004325 8-hydroxyquinolines Chemical class 0.000 description 1
- ZYASLTYCYTYKFC-UHFFFAOYSA-N 9-methylidenefluorene Chemical class C1=CC=C2C(=C)C3=CC=CC=C3C2=C1 ZYASLTYCYTYKFC-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910015202 MoCr Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Chemical class 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 241000593789 Stilbe Species 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 125000000641 acridinyl group Chemical class C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 150000008425 anthrones Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000005385 borate glass Substances 0.000 description 1
- 229960005057 canrenone Drugs 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 150000001846 chrysenes Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001882 coronenes Chemical class 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical class C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 150000002219 fluoranthenes Chemical class 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 150000008376 fluorenones Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007978 oxazole derivatives Chemical class 0.000 description 1
- 150000002916 oxazoles Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 150000002987 phenanthrenes Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002223 polystyrene Chemical class 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 150000003220 pyrenes Chemical class 0.000 description 1
- RQGPLDBZHMVWCH-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole Chemical class C1=NC2=CC=NC2=C1 RQGPLDBZHMVWCH-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 150000007660 quinolones Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical class [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical class C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- 150000003518 tetracenes Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000004961 triphenylmethanes Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000001834 xanthenyl group Chemical class C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/811—Controlling the atmosphere during processing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
- F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
- B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D3/00—Arrangements for supervising or controlling working operations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0379—By fluid pressure
Definitions
- the present invention relates to a vacuum chamber decompression method, and more particularly to a vacuum chamber decompression method using a roughing pump and a main exhaust pump.
- a vacuum apparatus in which a vacuum chamber is decompressed by a roughing pump and a main exhaust pump (for example, Patent Document 1).
- FIG. 23 is a diagram showing a configuration of a vacuum apparatus according to Patent Document 1. As shown in FIG. The vacuum apparatus includes a vacuum chamber 91, a roughing pump 92, and a main exhaust pump 93 as main components.
- the vacuum chamber 91 is a container in which processes such as thin film formation, etching, and coating film drying based on a coating film forming method (for example, Patent Document 2) are performed.
- the roughing pump 92 is used for a roughing step of reducing the internal pressure of the vacuum chamber 91 until the operating range of the main exhaust pump 93 is reached, and for exhausting the rear stage of the main exhaust pump 93.
- a mechanical vacuum pump such as a mechanical booster pump is used.
- the air in the vacuum chamber 91 is exhausted by opening the roughing valve 94 and operating the roughing pump 92.
- the main exhaust pump 93 is used in the main exhaust process after the vacuum chamber 91 is decompressed using the roughing pump 92.
- the main exhaust pump 93 is interposed between the vacuum chamber 91 and the roughing pump 92.
- a non-mechanical vacuum pump such as a cryopump is used.
- the rough exhaust valve 94 is closed and the main exhaust valves 95 and 96 are opened, and the main exhaust pump 93 and the roughing pump 92 are operated, so that the air in the vacuum chamber 91 is changed. Exhausted.
- ⁇ It is desirable that the vacuum chamber should be free from impurity contamination as much as possible.
- the object of the present invention is to prevent impurity contamination in the vacuum chamber as much as possible in a vacuum chamber decompression method using a roughing pump and a main exhaust pump.
- the vacuum chamber decompression method includes a roughing step of decompressing the inside of the vacuum chamber by a roughing pump that is a mechanical pump capable of reducing the internal pressure of the vacuum chamber to less than 15 [Pa]. And after the roughing step, a main exhausting step of reducing the pressure in the vacuum chamber by a main exhaust pump that is a non-mechanical pump, and the transition from the roughing step to the main exhausting step is performed in the vacuum chamber. This is performed when the internal pressure is 15 [Pa] or more.
- the vacuum chamber decompression method which is one embodiment of the present invention, it is possible to prevent impurity contamination in the vacuum chamber as much as possible.
- FIG. 6 is a flowchart for explaining an operation in a control unit 9 of the vacuum apparatus according to Embodiment 1; It is a schematic cross section which shows the structure of the organic EL element for experiment. It is a schematic cross section for demonstrating the formation procedure of the organic EL element for an experiment.
- A The graph which shows the relationship between the exhaust time by the mechanical booster pump used for experiment, and the pressure in a vacuum chamber,
- (b) The relationship between the exhaust time by the cryopump used for experiment and the pressure in a vacuum chamber is shown. It is a graph. It is a figure which shows the light emission characteristic of the organic EL element for each experiment.
- FIG. 6 is a partial cross-sectional view showing a configuration of an organic EL display panel 10 according to Embodiment 2.
- FIG. 12 is a schematic plan view showing the shape of a bank 15 in the organic EL display panel 10 according to Embodiment 2.
- FIG. 6 is a diagram illustrating an example of a manufacturing process of the organic EL display panel 10 according to Embodiment 2.
- FIG. 6 is a diagram illustrating an example of a manufacturing process of the organic EL display panel 10 according to Embodiment 2.
- FIG. 6 is a diagram illustrating an example of a manufacturing process of the organic EL display panel 10 according to Embodiment 2.
- FIG. 1 is a perspective view illustrating an organic EL display device and the like according to one embodiment of the present invention. It is a figure which shows the whole structure of the organic electroluminescent display apparatus 1000 which concerns on 1 aspect of this invention. It is a figure which shows the organic EL light-emitting device 200 which concerns on 1 aspect of this invention. It is a figure which shows the structure of the vacuum apparatus which concerns on a modification. It is a flowchart for demonstrating operation
- a vacuum chamber decompression method includes a roughing step of decompressing the vacuum chamber with a roughing pump that is a mechanical pump capable of reducing the internal pressure of the vacuum chamber to less than 15 [Pa]. And after the roughing step, a main exhausting step of reducing the pressure in the vacuum chamber by a main exhaust pump that is a non-mechanical pump, and the transition from the roughing step to the main exhausting step is performed in the vacuum chamber. This is performed when the internal pressure is 15 [Pa] or more.
- the decompression speed of the vacuum chamber is adjusted by allowing an inert gas to flow into the vacuum chamber in the roughing step.
- the roughing pump is a mechanical booster pump.
- the main exhaust pump is a pump that performs exhaust using condensation of gas by a cooling means.
- the main exhaust pump is a cryopump.
- the inside pressure of the vacuum chamber can be reduced to less than 15 Pa, and the vacuum chamber is filled with a roughing pump that is a mechanical pump using a lubricant containing alkane.
- a rough evacuation step for depressurization, and a main evacuation step for depressurizing the inside of the vacuum chamber by a main exhaust pump that is a non-mechanical pump after the rough evacuation step, and the transition from the rough evacuation step to the main exhaust step Is performed when the ratio of the vapor pressure in the alkane scattered from the roughing pump to the vacuum chamber to the internal pressure of the vacuum chamber is 7.3 ⁇ 10 ⁇ 3 or less.
- the alkane is tetracosane.
- a vacuum chamber decompression method includes a roughing step of decompressing the inside of the vacuum chamber with a roughing pump that is a mechanical pump capable of reducing the internal pressure of the vacuum chamber to less than 15 Pa;
- a main exhaust step of decompressing the inside of the vacuum chamber by a main exhaust pump which is a non-mechanical pump after the pulling step, and the transition from the roughing step to the main exhaust step is performed by a decompression speed by the roughing pump. Is performed when 10 [Pa / sec] or more.
- a vacuum apparatus includes a roughing pump that is a mechanical pump connected to a vacuum chamber and capable of reducing the internal pressure of the vacuum chamber to less than 15 [Pa], and a non-pumping device connected to the vacuum chamber.
- a main exhaust pump that is a mechanical pump; a roughing valve that opens and closes a roughing exhaust pipe from the vacuum chamber to the roughing pump; and a rough exhausting pipe that is provided independently from the vacuum chamber.
- a main exhaust valve that opens and closes a main exhaust pipe leading to the main exhaust pump, and a roughing pump, the main exhaust pump, a control unit that controls operations of the roughing valve and the main exhaust valve, and
- the control unit is a roughing operation that opens the roughing valve, closes the main exhaust valve, operates the roughing pump, and stops the main exhaust pump; After the roughing operation, the roughing valve is closed, the main exhaust valve is opened, and at least the main exhaust pump is in an operating state, and the transition from the roughing operation to the main exhaust operation is performed. Is performed when the internal pressure of the vacuum chamber is 15 [Pa] or more.
- the organic film forming method includes a preparation step of preparing a substrate coated with an organic film material including a material that constitutes the organic film and a solvent, and vacuuming the substrate after the organic film material is applied.
- a main evacuation step for reducing the pressure in the chamber, and the transition from the roughing step to the main evacuation step is such that the internal pressure of the vacuum chamber is 15 Pa or more. It is made to come.
- the organic EL device manufacturing method includes an organic light emitting layer material including a first electrode formed on an upper surface and a material constituting the organic light emitting layer and a solvent above the first electrode.
- a roughing step of reducing the pressure in the vacuum chamber by the roughing pump which is a mechanical pump capable of reducing the pressure below, and the main exhaust pump being a non-mechanical pump after the roughing step
- a main exhaust step of depressurizing the more the vacuum chamber, transition from the roughing process to the main exhaust process, the internal pressure of the vacuum chamber is performed when at least 15 Pa.
- the organic EL display panel according to one aspect of the present invention uses an organic EL element manufactured by the method for manufacturing an organic EL element according to one aspect of the present invention.
- the organic EL display device uses an organic EL element manufactured by the method for manufacturing an organic EL element according to one aspect of the present invention.
- the organic EL light emitting device uses an organic EL element manufactured by the method for manufacturing an organic EL element according to one aspect of the present invention.
- the impurity detection method is an impurity detection method for detecting impurities derived from a vacuum pump connected to a vacuum chamber, and an organic film is used as a detector for detecting the impurities.
- the step of placing the organic film in the vacuum chamber and setting the vacuum chamber in a vacuum state, and the vacuum pump to the vacuum A step of attaching the impurities scattered to the chamber to the organic film, and a step of analyzing the impurities in the vicinity of the surface of the organic film to which the impurities are attached.
- FIG. 1 is a diagram illustrating a configuration of a vacuum apparatus according to the first embodiment.
- the vacuum apparatus according to Embodiment 1 includes a vacuum chamber 1, a roughing pump 2, a main exhaust pump 3, a roughing valve 4, a main exhaust valve 5, a pressure gauge 7, and a control unit 9.
- a vacuum apparatus as in the vacuum apparatus according to Patent Document 1, the roughing process in which the internal pressure of the vacuum chamber 1 is reduced to the operating range of the main exhaust pump 3 by the roughing pump 2, and the roughing process, A main exhaust process of reducing the pressure by the main exhaust pump 3 is performed.
- the connection relationship of the exhaust pipe and the like is different from that of the vacuum apparatus according to Patent Document 1.
- the vacuum chamber 1 is a container in which various processes are performed in the same manner as the vacuum chamber 91 shown in FIG.
- the roughing pump 2 is connected to the vacuum chamber 1, and in this embodiment, a pump capable of reducing the internal pressure of the vacuum chamber 1 to less than 15 [Pa] is used.
- a mechanical vacuum pump such as a mechanical booster pump, a rotary pump, or a diaphragm pump is used.
- a dry pump that does not use so-called pump oil.
- the dry pump is used when it is necessary to keep the inside of the vacuum chamber clean, for example, in manufacturing a semiconductor thin film.
- the main exhaust pump 3 is inserted in the vacuum chamber 1.
- a non-mechanical pump that performs exhaust using gas condensation by cooling means such as a cryopump or a sorption pump is used.
- the roughing valve 4 opens and closes a roughing exhaust pipe from the vacuum chamber 1 to the roughing pump 2.
- the main exhaust valve 5 opens and closes a main exhaust exhaust pipe extending from the vacuum chamber 1 to the main exhaust pump 3. As shown in FIG. 1, the main exhaust exhaust pipe is provided independently of the roughing exhaust pipe.
- the pressure gauge 7 measures the internal pressure of the vacuum chamber 1, that is, the degree of vacuum in the vacuum chamber 1.
- a Pirani vacuum gauge for example, a diaphragm vacuum gauge, a spinning rotor vacuum gauge, or the like can be used.
- the gas inflow valve 8 opens and closes the inflow path of the gas for adjusting the decompression speed that flows into the vacuum chamber 1.
- the decompression speed adjusting gas is used to finely adjust the decompression speed in the vacuum chamber 1. That is, by allowing the gas to flow into the vacuum chamber 1, the pressure reduction rate in the vacuum chamber 1 can be reduced.
- the decompression speed adjusting gas for example, an inert gas such as nitrogen gas or argon gas, dry air, or the like is selected.
- the inflow of the decompression speed adjusting gas is performed as necessary when fine adjustment of the decompression speed of the vacuum chamber 1 is difficult only by the roughing pump 2.
- the controller 9 controls the operations of the roughing pump 2, the main exhaust pump 3, the roughing valve 4, the main exhaust valve 5 and the gas inflow valve 8 based on the degree of vacuum in the vacuum chamber 1 measured by the pressure gauge 7. To do. Thereby, the control unit 9 controls the transition from the roughing process to the main exhaust process in the vacuum apparatus. Specifically, the control unit 9 outputs a control signal for each component such as the roughing pump 2 and the main exhaust pump 3, and each component that receives this control signal performs an operation according to the control signal.
- FIG. 2 is a flowchart for explaining the operation of the control unit 9 of the vacuum apparatus according to the first embodiment.
- the control unit 9 stores the timing for shifting from the roughing process to the main exhaust process (step S101). Specifically, the transition of the above process is performed based on the internal pressure of the vacuum chamber 1 indicated by the pressure gauge 7. In this embodiment, when the internal pressure of the vacuum chamber 1 is 15 [Pa] or more, the above process is transferred. This numerical value of 15 [Pa] is determined based on the knowledge obtained by the present inventors as a result of intensive studies. As a precondition for this, it is necessary to use a roughing pump 2 that can reduce the internal pressure of the vacuum chamber 1 to less than 15 [Pa], which is less than this value. Details of the findings will be described later in [Experimental and Discussion].
- the internal pressure at which the transfer is performed is determined in advance before performing the vacuum process by the vacuum apparatus, and is input to the control unit 9 via, for example, a personal computer (PC).
- PC personal computer
- the internal pressure of the vacuum chamber 1 in which the transition to the above process is performed needs to be determined so as to be included in the operating range of the main exhaust pump 3.
- Steps S102 to S104 correspond to a roughing process.
- the roughing valve 4 is opened (step S102), and the roughing pump 2 is activated (step S103).
- the main exhaust valve 5 is in a closed state, and the main exhaust pump 3 is in a stopped state.
- the internal pressure of the vacuum chamber 1 is reduced from atmospheric pressure.
- step S104 it is determined based on the pressure gauge 7 whether or not the internal pressure of the vacuum chamber 1 has reached the internal pressure stored in step S101 (step S104). If it is determined that the internal pressure stored in step S101 has not been reached (NO in step S104), decompression by the roughing pump 2 is continued. If it is determined that the internal pressure stored in step S101 has been reached (YES in step S104), the roughing valve 4 is closed, the roughing pump 2 is stopped, and the roughing process is terminated (step S105).
- the flow of the pressure reducing rate adjusting gas into the vacuum chamber 1 is performed between step S103 and step S105 when the internal pressure of the vacuum chamber 1 approaches the internal pressure stored in step S101. .
- the decompression speed adjusting gas flows into the vacuum chamber 1, and the decompression speed of the vacuum chamber 1 is finely adjusted.
- the inflow of the decompression speed adjusting gas may be performed from the initial stage after the start of the roughing operation in step S103.
- Steps S106 and S107 correspond to the main exhaust process.
- the main exhaust valve 5 is opened (step S106), and at least the main exhaust pump 3 is activated (step S107).
- step S106 only the main exhaust pump 3 is in an operating state, and the roughing pump 2 is in a stopped state.
- the inside of the vacuum chamber 1 is depressurized from a medium vacuum to a high vacuum, or in some cases, an ultra-high vacuum.
- the internal pressure of the vacuum chamber 1 at the performance limit of the roughing pump 2 is less than 15 [Pa].
- the transition from the roughing process to the main exhaust process is performed when the internal pressure of the vacuum chamber 1 is 15 [Pa] or more. That is, the transition is made at an internal pressure higher than the internal pressure of the vacuum chamber 1 in a state where the roughing pump 2 is operating at the performance limit. Impurities caused by the use of at least the roughing pump among the impurities that are diffused back from the roughing pump 2 into the vacuum chamber 1 by the transition of the above steps before reaching the performance limit of the roughing pump 2. Can be reduced to such an extent that the contents of the vacuum chamber 1 are not affected.
- an organic EL element that is an element having an organic film to which impurities easily adhere was selected as an experimental element.
- An organic EL element is configured by laminating an organic light emitting layer that performs an electroluminescence phenomenon by recombination of carriers (holes and electrons) between an electrode pair of an anode as a first electrode and a cathode as a second electrode. Is.
- a coating film forming method (for example, Patent Document 2) is known as one method for forming an organic light emitting layer.
- an organic light emitting layer material including an organic material constituting an organic light emitting layer and a solvent is applied to a substrate by an inkjet method (droplet discharge method) or the like, and the coating film of the organic light emitting layer material is dried.
- the substrate after application of the organic light emitting layer material is placed in a vacuum chamber maintained in a vacuum state by a vacuum pump and undergoes a vacuum process.
- the mounting period in the vacuum chamber corresponds to a drying period of the coating film, a storage period from the formation of the organic light emitting layer to the next process, and the like.
- “maintaining the vacuum chamber in a vacuum state” includes not only maintaining the vacuum chamber to be completely vacuum but also maintaining the vacuum chamber in a state that can be regarded as a vacuum.
- the “state in which the inside of the vacuum chamber can be regarded as a vacuum” refers to a state in which the internal pressure of the vacuum chamber is, for example, about 1 [Pa] or less.
- the inventor has verified whether or not a vacuum process is performed after applying the organic light emitting layer material, or whether or not a difference appears in the light emission characteristics of the organic EL element depending on the type of vacuum pump used.
- organic EL elements for experiments three kinds in total, one kind of organic EL element not subjected to a vacuum process and two kinds of organic EL elements subjected to a vacuum process, were prepared.
- FIG. 3 is a schematic cross-sectional view showing the structure of an experimental organic EL element.
- the experimental organic EL device includes an anode 102, a hole injection layer 103, a hole transport layer 104, an organic light emitting layer 105, an electron transport layer 106, a cathode 107, and a sealing layer on a substrate 101. 108 are laminated in order. There is no structural difference between an organic EL element that does not pass through a vacuum process and an organic EL element that passes through a vacuum process.
- FIG. 4 is a schematic cross-sectional view for explaining a procedure for forming an experimental organic EL element.
- an organic EL element that undergoes a vacuum process will be described.
- an anode 102, a hole injection layer 103, and a hole transport layer 104 are sequentially stacked on a substrate 101, and an organic light emitting layer material 105a is formed on the upper surface of the hole transport layer 104.
- heating is performed to dry the organic light emitting layer material 105a to form the organic light emitting layer 105, thereby preparing a semi-finished organic EL element after the formation of the organic light emitting layer 105 (FIG. 4B).
- the organic EL element semi-finished product after the formation of the organic light emitting layer 105 is placed in a vacuum chamber connected to a vacuum pump, and the vacuum pump is started to activate the vacuum chamber.
- the inside was evacuated and left for a predetermined time.
- both the mechanical booster pump and the cryopump are used as the main exhaust pump, and roughing is performed by a dry pump different from these.
- the transition from roughing by dry pump to main exhaust occurs before reaching the performance limit of the dry pump.
- FIG. 5A is a graph showing the relationship between the exhaust time by the mechanical booster pump used in the experiment and the pressure in the vacuum chamber
- FIG. 5B shows the exhaust time by the cryopump used in the experiment and the vacuum chamber. It is a graph which shows the relationship with the internal pressure.
- an experiment was performed using a pump having an exhaust profile as shown in FIG. The horizontal axis indicates the exhaust time by the vacuum pump, and the vertical axis indicates the pressure in the vacuum chamber.
- the pressure in the vacuum chamber connected to the mechanical booster pump was reduced to about 1 [Pa].
- the pressure in the vacuum chamber connected to the cryopump was reduced to about 10 ⁇ 4 to 10 ⁇ 5 [Pa].
- the semi-finished organic EL element is taken out from the vacuum chamber, and the electron transport layer 106, the cathode 107, and the sealing layer 108 are sequentially stacked on the organic light emitting layer 105 as shown in FIG. Two types of organic EL elements undergoing the process are completed.
- FIGS. 4A and 4B An organic EL element that does not go through a vacuum process will be described.
- the anode 102, the hole injection layer 103, the hole transport layer 104, and the organic light emitting layer 105 are formed on the substrate 101 as in the case of the organic EL element that undergoes a vacuum process.
- the organic EL element semi-finished product after the formation of the organic light emitting layer 105 was placed in a glove box for 20 [min] without performing the vacuum process shown in FIG.
- an electron transport layer 106, a cathode 107, and a sealing layer 108 are sequentially laminated on the organic light emitting layer 105, thereby completing an organic EL element that does not undergo a vacuum process.
- Both the organic EL element not subjected to the vacuum process and the organic EL element subjected to the vacuum process are well-known in the anode 102, the hole injection layer 103, the hole transport layer 104, the electron transport layer 106, the cathode 107, and the sealing layer 108. Material was used. As the organic light emitting layer 105, F8-F6 was used. Note that the specific formation method of each layer is not the essence of this experiment, so the description here is omitted and described in Embodiment Mode 2.
- FIG. 6 is a diagram showing the light emission characteristics of the organic EL elements for each experiment.
- FIG. 6 is a graph showing the relationship between the light emission time and the light emission intensity when the organic EL element for each experiment was caused to emit light.
- the horizontal axis represents the light emission time [hr], and the vertical axis represents the light emission intensity. Yes.
- the emission intensity is shown as a relative value when the value immediately after the start of emission is 1.
- the light emission characteristics of the organic EL element not subjected to the vacuum process (“globe box environmental storage” in FIG. 6) are indicated by broken lines.
- the light emission characteristic of the organic EL element that has undergone a vacuum process with a mechanical booster pump (“mechanical booster pump environmental storage” in FIG. 6) is indicated by a one-dot chain line
- the light emission characteristic of an organic EL element that has undergone a vacuum process with a cryopump is indicated by solid lines.
- the organic EL element stored in the cryopump environment has the smallest amount of decrease in emission intensity with time.
- the organic EL element stored in the mechanical booster pump environment is significantly larger in the amount of decrease in light emission intensity with the passage of time than the organic EL element stored in the cryopump environment and the organic EL element not subjected to the vacuum process.
- the organic EL element stored in the mechanical booster pump environment storage has a shorter half-life of emission intensity (time required for emission intensity to be halved) than the other two elements.
- FIG. 7 is a graph showing the relationship between the exhaust time by the mechanical pump and the pressure in the vacuum chamber.
- the horizontal axis is the exhaust time
- the vertical axis is the pressure in the vacuum chamber. Further, the vertical axis indicates that the degree of vacuum is higher as it goes downward.
- Time A corresponds to the starting point of the mechanical pump. Further, at time B, the vacuum in the vacuum chamber is in progress. At time C, the vacuum chamber is depressurized to the performance limit of the mechanical pump, and an equilibrium state is reached. The state in the vacuum chamber and the mechanical pump at each of time A, time B, and time C will be described with reference to FIG.
- FIG. 8 is a diagram schematically showing the inside of the vacuum chamber and the mechanical pump at time A, time B, and time C in the graph shown in FIG.
- the vacuum chamber 26 is connected to a mechanical pump 28 through an exhaust pipe 27.
- the gas in the vacuum chamber 26 is discharged to the outside through the exhaust pipes 27 and 29 by the mechanical pump 28.
- impurities 30 some components used in the mechanical pump 28 are indicated by impurities 30.
- FIG. 8A shows the starting point of the mechanical pump 28.
- the gas in the vacuum chamber 26 is exhausted from the exhaust pipe 27 to the outside through the mechanical pump 28 and the exhaust pipe 29 as indicated by the broken-line arrows in FIG. In this way, an air flow is generated from the vacuum chamber 26 toward the exhaust pipe 27, the mechanical pump 28 and the exhaust pipe 29. For this reason, it is considered that the impurity 30 does not scatter to the vacuum chamber 26 during the decompression period (time B).
- the vacuum chamber 26 is depressurized to the performance limit of the mechanical pump 28. Therefore, the airflow between the vacuum chamber 26 and the mechanical pump 28 is in an equilibrium state. Further, since the degree of vacuum in the vacuum chamber 26 and the mechanical pump 28 is increased, the mean free path of the impurities 30 is also increased. For this reason, as shown in FIG. 8C, the impurities 30 are scattered from the mechanical pump 28 to the vacuum chamber 26, and the impurities 30 are attached to the organic EL element semi-finished product 31 after the organic light emitting layer is formed. I thought. Then, the increase in the degree of vacuum in the vacuum chamber 26 and the mechanical pump 28 increases the ratio of the vapor pressure of the impurity 30 to the pressure in the vacuum chamber 26 and the mechanical pump 28.
- the present inventor considered that the use of a roughing pump, which is a mechanical pump, in the roughing step to the performance limit causes the back diffusion of impurities. Therefore, the idea was to make the transition from the roughing process to the main exhaust process until the performance limit of the roughing pump was reached.
- the organic EL element used in this experiment was formed as follows. First, in the same manner as the experimental organic EL element described in FIG. 4, an anode, a hole injection layer, a hole transport layer, and an organic light emitting layer are sequentially laminated on the substrate, thereby forming the organic EL element after the formation of the organic light emitting layer. A semi-finished product was prepared. Next, the semi-finished product was placed in a vacuum chamber connected to a roughing pump (a mechanical booster pump having an exhaust profile shown in FIG. 5A). Subsequently, the inside of the vacuum chamber in which the organic EL element semi-finished product was housed was reduced to a predetermined internal pressure by a roughing pump, and left for 20 [min]. In this experiment, a total of four elements were prepared: an element with an internal pressure of 250 [Pa], an element with 15 [Pa], an element with 10 [Pa], and an element with 5 [Pa].
- FIG. 9 is a graph showing the relationship between the exhaust time by the roughing pump used in the experiment and the pressure in the vacuum chamber.
- the horizontal axis is the exhaust time
- the vertical axis is the pressure in the vacuum chamber.
- the case where the internal pressure is 250 [Pa] is shown as a cross, the case where 15 [Pa] is set as a square, the case where 10 [Pa] is set as a black circle, and the case where 5 [Pa] is set as a white circle.
- the target internal pressure was reached in about 1 [min] after the start of exhaust.
- FIG. 10 is a diagram showing light emission characteristics of each experimental organic EL element placed in vacuum chambers having different internal pressures.
- FIG. 10 is a graph showing the relationship between the light emission time and the light emission intensity when the organic EL element for each experiment was caused to emit light.
- the horizontal axis represents the light emission time [hr]
- the vertical axis represents The emission intensity is shown respectively.
- the emission intensity is shown as a relative value when the value immediately after the start of emission is 1.
- the internal pressure is set to 250 [Pa] by a broken line, the case set to 15 [Pa] by a solid line, and the case set by 10 [Pa] by a two-dot chain line by 5 [Pa]. ] are indicated by bold lines.
- the light emission characteristics of the organic EL element that has not undergone the vacuum process are illustrated as “glove box environmental storage” by a one-dot chain line.
- the inventor further conducted the following experiment. Purge with an inert gas was performed from the vacuum chamber to the vacuum pump side, that is, in the direction opposite to the direction of impurity diffusion, and the experimental element was stored in the vacuum chamber in which the purge was performed. Then, the light emission characteristics of the experimental element were examined. Then, it can be seen that the experimental element stored in the purged vacuum chamber has a longer half-life of emission intensity compared to the experimental element stored in the vacuum chamber without purging. It was. From this experimental result, it was clarified that the back diffusion of impurities from the vacuum pump to the vacuum chamber occurred.
- the main exhaust process can be performed in a state in which impurities are hardly scattered in the vacuum chamber.
- the decrease in the emission intensity is suppressed in the organic EL element stored in the cryopump environment. Therefore, even in the main exhaust process performed by a non-mechanical pump after the process transition, it can be maintained in a state where impurities are hardly scattered in the vacuum chamber.
- the storage time in the vacuum chamber was increased to 20 [min] so that the influence of impurities appears remarkably.
- the period from the start of pressure reduction to the transition to the above process is at most 2 to 3 It is about [min].
- the period during which pressure reduction by the mechanical pump is performed is at most about 2 to 3 [min]. Therefore, it should be noted that the decrease in emission intensity related to the experimental result shown in FIG. 10 does not appear as a characteristic of the organic EL element as a product as it is.
- the time for placing the organic EL element semi-finished product in the vacuum chamber connected to the mechanical pump is short. It's time. Therefore, if the above process is performed when the pressure is 15 [Pa] or more as in the present embodiment, the effect that “the process can be shifted to the main exhaust process with almost no impurities scattered in the vacuum chamber” is achieved. It is played.
- the above-described process transition is performed at an internal pressure higher than the internal pressure of the vacuum chamber in a state where the roughing pump is operating at the performance limit.
- the internal pressure of the vacuum chamber changes during the decompression process. Change. Therefore, the present inventor considered that the timing of the above-described process transition can be defined using the pressure reduction rate separately from the internal pressure of the vacuum chamber.
- the transition from the roughing process to the main exhaust process is performed when the pressure reduction speed by the roughing pump is 10 [Pa / sec] or more, so that the vacuum chamber is scattered due to the use of the roughing pump. It can be defined that the amount of impurities to be reduced can be reduced.
- the three organic EL element semi-finished products were respectively stored for a predetermined time in a glove box, a vacuum chamber connected to a mechanical booster pump, and a vacuum chamber connected to a cryopump.
- the storage time is 12 [hr] in the vacuum chamber connected to the cryopump, and 20 [min] in the vacuum chamber connected to the glove box and the mechanical booster pump. Note that the pressure in the vacuum chamber connected to the mechanical booster pump was reduced to 0.6 to 0.7 [Pa].
- each organic light emitting layer that passed through the storage step was heated and heated in a helium atmosphere, and the outgas emitted from the heated organic light emitting layer was collected with liquid nitrogen and analyzed by GC-MS.
- FIG. 11 is a diagram showing an analysis result of deposits on the surface of the organic light emitting layer that has undergone each storage step.
- the vertical axis represents the detection intensity
- the horizontal axis represents the retention time [min].
- FIG. 11 shows a gas chromatograph at the retention time of 0 to 30 [min].
- 11 (a), (b), and (c) show the result of the organic light emitting layer stored in the vacuum chamber connected to the cryopump, the result of the organic light emitting layer stored in the glove box, and the mechanical booster pump.
- Figure 3 shows the results for an organic light emitting layer stored in a connected vacuum chamber.
- the organic light-emitting layer (FIG. 11 (a)) stored in the cryopump environment and the organic light-emitting layer (FIG. 11 (b)) stored in the glove box environment are not so contaminated.
- the organic light emitting layer stored in the mechanical booster pump environment FIG. 11C
- many peaks were detected in the vicinity of the retention time of 18 to 21 [min]. These strong peaks were found to be linear alkanes having 20 to 26 carbon atoms.
- a lubricant is usually used for the mechanical vacuum pump described above.
- the lubricant usually contains a lubricating component such as lubricating oil, for example, a linear alkane having 20 to 26 carbon atoms.
- a linear alkane having 20 to 26 carbon atoms.
- alkane is a chain saturated hydrocarbon represented by the general formula C n H 2n + 2 .
- the “linear alkane” is an alkane having a structure in which carbon atoms are connected without branching.
- the straight-chain alkane having 20 to 26 carbon atoms detected by this analysis can be included as a lubricating component of the lubricant. It is considered that these alkanes were detected in the analysis because they were scattered from the vacuum pump to the vacuum chamber in the vacuum process and adhered to the organic light emitting layer.
- the electron transport layer in each experimental organic EL element used in the experiment shown in FIG. 6 is formed based on a vacuum film forming method. Since the light emission characteristics are still adversely affected even after this vacuum film formation step, it is presumed that the impurities have a relatively high boiling point so that they do not volatilize even under high vacuum during vacuum film formation. This fact is not inconsistent with the fact that the impurity is a component contained in the lubricant.
- the peak indicated by (C24) is a tetracosane (C 24 H 50 ), which is a linear alkane having 24 carbon atoms. It is expressed.) Further, comparing the results of FIG. 11 and FIG. 6, it can be seen that there is a correlation between the decrease in half-life and the peak intensity of tetracosane.
- tetracosane can be used as an index of the amount of impurities derived from the lubricant.
- the timing of the transition from the roughing process to the main exhaust process can also be defined by the ratio of the vapor pressure of tetracosane scattered from the roughing pump to the vacuum chamber to the internal pressure of the vacuum chamber (tetracosane partial pressure). I thought it was possible.
- FIG. 12 (a) is a table summarizing the vapor pressure of tetracosane described in Non-Patent Document 1.
- FIG. 12B is a plot of the relationship between the vapor pressure of tetracosane described in Non-Patent Document 1 and the temperature at that time.
- the horizontal axis indicates the temperature
- the vertical axis indicates the vapor pressure.
- the internal pressure of the vacuum chamber is 15 [Pa] or higher
- the transition from the roughing process to the main exhaust process is performed, so that impurities diffused back from the roughing pump into the vacuum chamber.
- the amount of impurities caused by using at least a roughing pump can be reduced. That is, the partial pressure of tetracosane in the vacuum chamber is obtained as 7.3 ⁇ 10 ⁇ 3 by dividing 0.11 [Pa] by 15 [Pa].
- the ratio of the vapor pressure in the alkane contained in the lubricant and scattered from the roughing pump to the vacuum chamber to the internal pressure of the vacuum chamber is 7.3 ⁇ .
- the present inventor connected a mechanical booster pump to the vacuum chamber, collected gas in the vacuum chamber in a state where the vacuum chamber was at atmospheric pressure, and performed GC-MS analysis.
- this method could not detect impurities, the present inventor considered that there was a problem in not depressurizing the inside of the vacuum chamber. Therefore, after placing the glass substrate and silicon wafer in the vacuum chamber, the pressure inside the vacuum chamber was reduced by a mechanical booster pump and gas in the vacuum chamber was collected, but even in this case, impurities could not be detected. It was.
- the present inventor thought that the object to which the impurities adhere needs to be an organic film such as an organic light emitting layer. Therefore, after the substrate coated with the organic light emitting layer material was placed in the vacuum chamber, the inside of the vacuum chamber was decompressed with a mechanical booster pump, and GC-MS analysis was performed based on the method described above. As a result, an impurity peak could be detected as in the spectrum shown in FIG.
- Impurities cannot be detected when a vacuum process is performed on a glass substrate or the like, so the adhesion of impurities through the vacuum process is not an inorganic material but an organic film material applied. It is thought that it can be generated because it is a film.
- an organic film as a detector is placed in the vacuum chamber, and the vacuum chamber is evacuated. This creates an environment in which impurities from the vacuum pump are scattered from the vacuum pump to the vacuum chamber.
- impurities scattered from the vacuum pump to the vacuum chamber are attached to the organic film.
- the impurities in the vicinity of the surface of the organic film to which the impurities are attached are analyzed. For example, (1) the organic film is heated and heated in a helium atmosphere, and the outgas released from the heated organic film is converted into liquid nitrogen.
- a method of analyzing the solvent after washing the surface of the organic film with a solvent and (3) A method of analyzing the solvent after dissolution by dissolving the organic film in the solvent. Conceivable.
- This impurity detection method utilizes the fact that the organic film has high adsorptivity to impurities. Therefore, it is possible to detect even impurities with a very small amount of scattering from the vacuum pump to the vacuum chamber.
- the present detection method can be widely applied to detection of impurities existing in the environment as well as impurities (for example, lubricant) caused by using a roughing pump.
- Embodiment 2 an organic EL display panel, an organic EL display device, and an organic EL light emitting device that include an organic light emitting layer formed using the vacuum device according to the first embodiment will be described.
- FIG. 13 is a partial cross-sectional view showing the configuration of the organic EL display panel 10.
- the organic EL display panel 10 is a so-called top emission type organic EL display panel having the upper side in the figure as a display surface.
- the main structure of the organic EL display panel 10 includes an anode 12, an organic light emitting layer 16, an electron transport layer 17, and a cathode 18.
- the organic EL display panel 10 includes an organic EL element having an organic light emitting layer 16 corresponding to any one of red (R), green (G), and blue (B) as one subpixel 100. Are arranged in a matrix.
- the substrate 11 is a portion that becomes a base material of the organic EL display panel 10, and includes, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, borate glass, quartz, acrylic resin, styrene resin, and polycarbonate. It can be formed of an insulating material such as resin, epoxy resin, polyethylene, polyester, silicone resin, or alumina.
- a TFT thin film transistor
- the anode 12 is, for example, ACL (alloy of aluminum, cobalt, lanthanum), APC (alloy of silver, palladium, copper), ARA (alloy of silver, rubidium, gold), MoCr (alloy of molybdenum and chromium), NiCr ( Nickel and chromium alloy).
- the ITO (indium tin oxide) layer 13 is interposed between the anode 12 and the hole injection layer 14 and has a function of improving the bonding property between the layers.
- the hole injection layer 14 may be, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- the hole injection layer 14 made of metal oxide has a function of injecting holes into the organic light emitting layer 16 in a stable manner or by assisting the generation of holes.
- a bank 15 On the surface of the hole injection layer 14, a bank 15 is provided for defining an opening 15 a serving as a region where the organic light emitting layer 16 is formed.
- the bank 15 is formed to have a certain trapezoidal cross section, and is made of an insulating organic material (for example, acrylic resin, polyimide resin, novolac type phenol resin, etc.).
- FIG. 14 is a schematic plan view showing the bank 15 in the organic EL display panel 10.
- a line bank (line-shaped bank) 15 is employed as an example.
- each bank 15 extends in the Y-axis direction, and partitions between adjacent subpixels 100 in the X-axis direction.
- the sub-pixels 100 are formed so as to have different emission colors for each of the areas partitioned by the bank 15.
- the sub-pixels 100 (R), the G sub-pixels 100 (G), and the B sub-pixels 100 are formed.
- One pixel (one pixel) is constituted by a combination of three subpixels of the subpixel 100 (B).
- FIG. 13 corresponds to the A-A ′ cross-sectional view in FIG. 14.
- an organic light emitting layer 16 as an organic film corresponding to one of R, G, and B emission colors is formed on the surface of the hole injection layer 14 partitioned by the opening 15 a of the bank 15. Has been.
- the organic light emitting layer 16 is a portion that emits light by recombination of carriers, and is configured to include an organic material corresponding to one of R, G, and B colors.
- Examples of materials that can be used for the organic light-emitting layer 16 include, for example, F8-F6 used in each experiment in Embodiment 1, polyparaphenylene vinylene (PPV), polyfluorene, and a patent publication (Japanese Patent Laid-Open No. Hei 5).
- the oxinoid compounds perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, pyrrolopyrrole compounds, naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, Pyrene compounds, coronene compounds, quinolone compounds and azaquinolone compounds, pyrazoline derivatives and pyrazolone derivatives, rhodamine compounds, chrysene compounds, phenanthrene compounds, cyclopentadiene compounds, stilbes Compound, diphenylquinone compound, styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound, fluorescein compound, pyrylium compound, thiapyrylium compound, serenapyrylium compound, telluropyrylium compound, aromatic
- the organic light emitting layer 16 according to the present embodiment is formed based on the vacuum apparatus and the vacuum chamber decompression method according to the first embodiment as described later. Therefore, there are few impurities mixed in in a manufacturing process between the organic light emitting layer 16 and the electron carrying layer 17 formed on it. Therefore, compared with a case where the manufacturing method described later is not performed, the organic light emitting layer 16 is less deteriorated due to impurities, and a characteristic close to a set value can be obtained. At the same time, the influence of impurities on the electron transport layer 17 formed on the organic light emitting layer 16 can be reduced. As a result, the organic light emitting layer 16 according to this embodiment has good light emission characteristics.
- the electron transport layer 17 has a function of transporting electrons injected from the cathode 18 to the organic light emitting layer 16.
- the electron transport layer 17 is made of a material having electron transport properties (electron transport material). Examples of such materials include nitro-substituted fluorenone derivatives, thiopyrandioxide derivatives, diphequinone derivatives, and perylene tetracarboxyl derivatives. , Anthraquinodimethane derivatives, fluorenylidenemethane derivatives, anthrone derivatives, oxadiazole derivatives, perinone derivatives, quinoline complex derivatives (all described in JP-A-5-163488) and the like.
- the cathode 18 formed on the electron transport layer 17 in this embodiment is a conductive material having optical transparency such as ITO and IZO (indium zinc oxide). It is made of an oxide material.
- the sealing layer 19 formed on the cathode 18 is provided to protect the organic light emitting layer 16 and the cathode 18 from moisture or oxygen that has entered the organic EL display panel 10. Since the organic EL display panel 10 is a top emission type, for example, a light-transmitting material such as SiN (silicon nitride) or SiON (silicon oxynitride) is used for the sealing layer 19.
- a light-transmitting material such as SiN (silicon nitride) or SiON (silicon oxynitride) is used for the sealing layer 19.
- a sealing substrate facing the substrate 11 is provided above the sealing layer 19. Furthermore, an insulating material may be filled in a space formed by the sealing layer 19 and the sealing substrate. By doing so, it is possible to prevent moisture or oxygen from entering the organic EL display panel 10. Since the organic EL display panel 10 is a top emission type, it is necessary to select a light transmissive material such as SiN or SiON as the insulating material.
- a hole transport layer having a function of promoting the transport of holes from the hole injection layer 14 to the organic light emitting layer 16 is further formed between the hole injection layer 14 and the organic light emitting layer 16. Also good.
- materials that can be used for the hole transport layer include triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives and pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, and amino-substituted chalcone derivatives.
- an electron injection layer having a function of promoting electron injection from the cathode 18 to the electron transport layer 17 may be formed between the electron transport layer 17 and the cathode 18.
- Examples of materials that can be used for the electron injection layer include barium, phthalocyanine, and lithium fluoride.
- [Method of manufacturing organic EL display panel] 15 to 17 are diagrams showing an example of manufacturing steps of the organic EL display panel 10 according to the second embodiment. The manufacturing method of the organic EL display panel 10 will be described with reference to these drawings.
- the anode 12 is formed on the upper surface, and a preparatory process for preparing the substrate 11 on which the organic light emitting layer material including the material constituting the organic light emitting layer 16 and the solvent is applied above the anode 12 is performed.
- FIG. 15A to FIG. 16A correspond to the preparation process.
- the substrate 11 is placed in a film forming container of a sputter film forming apparatus. Then, a predetermined sputtering gas is introduced into the film formation container, and the anode 12 is formed on the basis of a reactive sputtering method, a vacuum deposition method, or the like.
- an ITO layer 13 is formed on the anode 12 based on the sputtering method as shown in FIG.
- a metal film is formed on the surface of the substrate 11 including each surface of the ITO layer 13 by using a sputtering method or the like.
- the hole injection layer 14 is formed by oxidizing the formed metal film.
- a bank 15 is formed as shown in FIG.
- the bank material for example, a photosensitive resist material, preferably a photoresist material containing a fluorine-based material is prepared. After this bank material is uniformly applied on the hole injection layer 14 and prebaked, a mask having a pattern that can form the opening 15a is overlaid. Then, after exposure from above the mask, uncured excess bank material is washed out with a developer. Finally, the bank 15 is completed by washing with pure water.
- a hole transport layer is formed as necessary after the step of forming the bank 15 and before the step of forming the organic light emitting layer 16.
- the hole transport layer can be formed by, for example, a coating film forming method, similarly to the organic light emitting layer 16 described later.
- the organic light emitting layer material which contains the material and solvent which comprise an organic light emitting layer based on the inkjet method with respect to the opening part 15a (FIG.15 (c)) of the bank 15 16a is added dropwise.
- the substrate 11 having the anode 12 formed on the upper surface and the organic light emitting layer material including the material constituting the organic light emitting layer 16 and the solvent applied above the anode 12 was prepared.
- the dropping method of the organic light emitting layer material 16a is not limited to the ink jet method, and may be, for example, a gravure printing method, a dispenser method, a nozzle coating method, intaglio printing, letterpress printing, or the like.
- a substrate on which an organic light emitting layer material including a material constituting the organic light emitting layer and a solvent is applied above the anode is a substrate on which the organic light emitting layer material is directly applied on the anode
- a substrate on which an organic light emitting layer material is indirectly applied on the anode is also included. That is, another layer may be included between the anode and the applied organic light emitting layer material.
- the substrate prepared in the preparation step of this embodiment includes the ITO layer 13 and the hole injection layer 14 between the anode 12 and the organic light emitting layer material 16a.
- the coating film of the organic light emitting layer material 16a is dried based on the vacuum apparatus according to the first embodiment and the vacuum chamber decompression method. Specifically, the substrate 11 coated with the organic light emitting layer material 16a is placed in a vacuum chamber, and the inside of the vacuum chamber is maintained in a vacuum state by a roughing pump and a main exhaust pump connected to the vacuum chamber.
- the drying step according to this embodiment includes a roughing step of reducing the pressure inside the vacuum chamber with a roughing pump that is a mechanical pump capable of reducing the internal pressure of the vacuum chamber to less than 15 [Pa], and after the roughing step. And a main evacuation step of reducing the pressure in the vacuum chamber by a main evacuation pump that is a non-mechanical pump. Further, as described in Embodiment 1, the transition from the roughing process to the main exhaust process is performed when the internal pressure of the vacuum chamber is 15 [Pa] or more. In this way, at least the amount of impurities caused by using the roughing pump among the impurities diffused back from the roughing pump into the vacuum chamber affects the coating film of the organic light emitting layer material 16a. It is possible to reduce it to a certain extent.
- the organic light emitting layer 16 formed by a drying process or the organic light emitting layer material 16a being dried is applied.
- a membrane is conceivable.
- the “coating film of the organic light emitting layer material 16a” is described as being the organic light emitting layer 16 formed by a drying process.
- the organic light emitting layer 16 is formed (FIG. 16B).
- the surface of the organic light emitting layer 16 as the coating film of the organic light emitting layer material 16a is in a state in which impurities caused by using at least a roughing pump are not attached. Therefore, at least impurities caused by using the roughing pump are left as they are attached to the organic light emitting layer 16, or other layers (in this embodiment, on the upper surface of the organic light emitting layer 16 to which the impurities are attached). Is an electron transport layer).
- the organic light emitting layer 16 is considered to have very little adverse effect on the organic light emitting layer 16 as long as it is not energized even if the organic light emitting layer 16 is left with impurities attached to its surface. This is because, in the vicinity of the surface of the organic light emitting layer 16, it is considered that the impurities are merely physically adsorbed and no reaction between the material constituting the organic light emitting layer 16 and the impurities occurs. It is done.
- an electron transport layer 17 is formed on the organic light emitting layer 16 based on a vacuum film forming method.
- the electron transport layer 17 is formed by depositing a material constituting the electron transport layer 17 on the upper surface of the organic light emitting layer 16 based on a vacuum film formation method such as a vacuum deposition method or a sputtering method. .
- the ratio of the vapor pressure of the electron transport material to the pressure in the film formation container is quite high, and the ratio of the vapor pressure of impurities is approximately 0 [%]. Therefore, there is no possibility that impurities caused by using the roughing pump adhere to the surface of the organic light emitting layer 16.
- a non-mechanical pump such as a cryopump instead of a mechanical pump. By doing in this way, it can prevent that the impurity derived from a vacuum pump diffuses into the film-forming container in the first place.
- the vacuum chamber decompression method according to Embodiment 1 may also be used in the vacuum treatment in the electron transport layer forming step.
- an electron injection layer is formed as necessary.
- the electron injection layer can be formed, for example, by depositing a material having an electron injection property based on a vacuum film formation method such as a vacuum evaporation method or a sputtering method.
- a cathode forming step is performed (FIG. 17A).
- the cathode 18 is formed by depositing ITO, IZO or the like on the organic light emitting layer 16 as a coating film based on a vacuum film forming method such as a vacuum deposition method or a sputtering method.
- forming the cathode above the coating film includes not only forming the cathode directly on the coating film but also forming the cathode indirectly on the coating film. And That is, a step of forming another layer may be included between the vacuum forming step and the cathode forming step. When a step of forming another layer is included between the vacuum forming step and the cathode forming step, another layer is included between the coating film and the cathode in the organic EL element semi-finished product after the cathode formation. . In the organic EL element semi-finished product in this embodiment, an electron transport layer 17 is included between the organic light emitting layer 16 as a coating film and the cathode 18. Therefore, the cathode 18 is formed on the upper surface of the electron transport layer 17.
- a sealing layer 19 is formed on the cathode 18 based on a vapor deposition method, a sputtering method, or the like. Then, the sealing substrate is disposed above the sealing layer 19, and an insulating material is filled in the space formed by the sealing layer 19 and the sealing substrate as necessary.
- the organic EL display panel 10 is completed through the above steps.
- FIG. 18 is a perspective view illustrating an organic EL display device and the like according to one embodiment of the present invention.
- the organic EL display device 1000 is an organic EL display and includes the organic EL display panel 10 described above.
- FIG. 19 is a diagram showing an overall configuration of an organic EL display device 1000 according to an aspect of the present invention.
- the organic EL display device 1000 includes an organic EL display panel 10 and a drive control unit 20 connected thereto.
- the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
- the arrangement and connection relationship of the drive control unit 20 with respect to the organic EL display panel 10 are not limited thereto.
- the organic EL element constituting the organic EL display panel 10 included in the organic EL display device 1000 includes an organic light emitting layer formed through the vacuum process described above. Therefore, the organic EL display device 1000 is excellent in image quality because the light emitting characteristics of the organic light emitting layer are good.
- an organic EL light emitting device 200 includes a plurality of organic EL elements 210 formed by the manufacturing method according to one embodiment of the present invention, a base 220 on which the organic EL elements 210 are mounted, and a base 220, and a pair of reflecting members 230 attached so as to sandwich the organic EL element 210 therebetween.
- Each organic EL element 210 is electrically connected to a conductive pattern (not shown) formed on the base 220, and emits light by driving power supplied by the conductive pattern. The light distribution of a part of the light emitted from each organic EL element 210 is controlled by the reflecting member 230.
- the organic EL element 210 included in the organic EL light emitting device 200 includes an organic light emitting layer formed through the vacuum process described above. Therefore, the organic EL light emitting device 200 has good light emission characteristics.
- Embodiment 1 the organic EL element was housed in a vacuum chamber and various experiments were performed. However, an organic EL element that can be influenced by impurities caused by using a roughing pump is used. It is not limited to.
- the vacuum chamber decompression method and vacuum apparatus according to the present invention can be widely applied regardless of the object accommodated in the vacuum chamber.
- the internal pressure of the vacuum chamber that performs the transition from the roughing process to the main exhaust process is 15 [Pa] or more when the organic EL element that easily adsorbs impurities is contained. It became clear by examination. However, in the case of a container that hardly adsorbs impurities (for example, a polymerized film), even if the amount of impurities scattered from the roughing pump to the vacuum chamber increases, it is considered that there is not much influence. That is, if the container is difficult to adsorb impurities, the internal pressure of the vacuum chamber can be reduced to an internal pressure lower than 15 [Pa] in the roughing process, and then the main exhaust process can be switched. In this way, it is possible to appropriately adjust the timing of the process transition in consideration of the adsorptivity of the contents to the impurities.
- the structure and properties of impurities can change depending on the type of vacuum pump and the like. Under high vacuum or ultra-high vacuum, when the impurities have a low vapor pressure, it is assumed that the impurities are less likely to scatter than those with a high vapor pressure. Therefore, if the impurity has a low vapor pressure, the internal pressure of the vacuum chamber can be reduced to an internal pressure smaller than 15 [Pa] in the roughing step. In this way, it is possible to appropriately adjust the timing of process transition in consideration of the structure and properties of impurities.
- the vacuum apparatus shown in FIG. 1 is merely an example, and the vacuum apparatus of the present invention is not limited to this example.
- the gas inflow valve 8 in FIG. 1 is not an essential component for implementing the present invention.
- FIG. 21 is a diagram showing a configuration of a vacuum apparatus according to a modification.
- Embodiment 1 FIGS. 1 and 2
- the configuration of the vacuum apparatus according to the modification differs from the vacuum apparatus according to the first embodiment in that the main exhaust exhaust pipe from the vacuum chamber 1 to the main exhaust pump 3 is further connected from the main exhaust pump 3 to the roughing pump 2. And an extended exhaust pipe valve 6 for opening and closing the extended main exhaust pipe.
- the extended exhaust pipe valve 6 is used in the main exhaust process.
- the extended exhaust pipe valve 6 is referred to as a main exhaust valve 6.
- the control unit 9 controls the operation on the main exhaust valve 6.
- FIG. 22 is a flowchart for explaining the operation of the controller of the vacuum apparatus according to the modification.
- the difference from the flowchart (FIG. 2) according to Embodiment 1 is Step S106A and Step S107 which are main exhaust steps.
- Step S105 After the roughing process is completed (step S105), the main exhaust valve 5 and the main exhaust valve 6 are opened in this order (step S106A).
- step S106A the main exhaust pump 3 is also operated in addition to the roughing pump 2 (step S106A). Step S107A).
- the main exhaust process in which the inside of the vacuum chamber is decompressed by the main exhaust pump which is a non-mechanical pump after the roughing process includes the main exhaust process using only the main exhaust pump, the roughing pump, and the main exhaust pump. The main exhaust process using both of them is included.
- this value is not limited to straight-chain alkanes having 20 to 26 carbon atoms, but can also be applied to other alkanes having similar molecular weights, that is, similar vapor pressures, and compounds having alkanes as substituents. Is.
- the vapor pressure of impurities can change depending on the type of vacuum pump and the like. Even when the type of the impurity changes, if the operating temperature of the vacuum pump and the vapor pressure of the impurity at the operating temperature can be grasped, the process transition timing based on the partial pressure of the impurity can be defined. Therefore, the definition of the process transition timing based on the partial pressure of impurities can be widely applied not only to the case where the impurities are the above-mentioned compounds but also to impurities in general.
- the organic light-emitting layer is considered to have little adverse effect on the organic light-emitting layer as long as no current is applied, even if the organic light-emitting layer is left with impurities attached to the surface. It was. However, this is only for the organic light emitting layer. In other organic films other than the organic light emitting layer, it is possible that the organic film deteriorates only by the adhesion of impurities, even if no current is applied. In the case of such an organic film, it is difficult to remove impurities before the organic film reacts with the impurities. However, when the present invention is applied, it is possible to prevent impurities from adhering to the organic film, which is very useful. Therefore, the present invention can be said to be more effective as the vacuum chamber contents are more likely to adsorb impurities.
- a layer described as being formed using a vacuum film formation method may be formed by a coating film formation method, and conversely, a layer described as being formed using a coating film formation method is vacuum formed. It may be formed by a film method.
- the organic film is described as an organic light emitting layer, but the present invention is not limited to this.
- the layers constituting the organic EL element all the layers formed by the coating film forming method correspond to the organic film in the present invention.
- the ITO layer, the hole injection layer, the hole transport layer, the bank, and the sealing layer are not essential constituent requirements.
- the present invention can also be applied to organic EL elements that do not have these configurations.
- other constituent elements such as a hole blocking layer may be further included.
- the ITO layer, the hole injection layer, the hole transport layer, and the bank are not necessarily formed on the substrate prepared in the preparation step.
- the process of forming a sealing layer can be skipped.
- the present invention can also be applied to a method for manufacturing an element having an organic film formed by a coating film forming method, such as an organic TFT or a solar battery.
- the present invention can be widely applied when an organic film containing an organic material is formed on a substrate.
- a coating film forming method such as an organic TFT or a solar battery.
- a preparation process for preparing a substrate coated with an organic film material including a material constituting the organic film and a solvent is performed.
- the substrate after application of the organic film material is placed in a vacuum chamber, and the vacuum chamber is evacuated by a roughing pump and a main exhaust pump connected to the vacuum chamber.
- a vacuum process is performed to maintain the vacuum.
- the vacuum process includes a roughing process for reducing the pressure inside the vacuum chamber with a roughing pump that is a mechanical pump capable of reducing the internal pressure of the vacuum chamber to less than 15 [Pa], and a non-mechanical pump after the roughing process.
- a main evacuation step in which the inside of the vacuum chamber is decompressed by a certain main evacuation pump. The transition from the roughing process to the main exhaust process is performed when the internal pressure of the vacuum chamber is 15 [Pa] or higher.
- the “organic light emitting layer material coating film” has been described as an organic light emitting layer formed by a drying process.
- impurities can also adhere to the coating film of the organic light emitting layer material in the middle of drying.
- the “coating film of the organic light emitting layer material” includes an organic light emitting layer completed by completing the drying of the organic light emitting layer material and a coating film of the organic light emitting layer material in the middle of drying. The same applies to the “coating film of organic film material”.
- the drying process for drying the organic light emitting layer material has been described as a vacuum process, but the present invention is not limited to this.
- this storage step also corresponds to a vacuum step, and impurity contamination may occur. That is, in the “substrate after the organic light emitting layer material application”, in addition to the substrate immediately after the organic light emitting layer material application until the coating film is completely dried, the drying of the coating film is completed and the organic light emitting layer is completed. State substrates are also included. The same applies to the “substrate after application of the organic film material”. That is, the vacuum chamber decompression method disclosed in this specification can also be applied to the vacuum process in the storage process.
- a substrate in a state from immediately after application of the organic light emitting layer material to when the coating film is completely dried is accommodated.
- a “substrate in a state where the drying of the coating film is completed and the organic light emitting layer is completed” is accommodated in the vacuum chamber in the storage process.
- drying step and the storage step is a step performed after the organic light emitting layer material application and before the step of forming a layer positioned on the upper surface of the organic light emitting layer, and the substrate after the organic light emitting layer material application is performed.
- a process placed in a vacuum state is a vacuum process.
- the drying of the coating film of the organic light emitting layer material may be completed only by a vacuum process, may be completed only by baking, or may be completed by performing baking in addition to the vacuum process. Also good.
- the impurity deposited due to the vacuum process has been described by taking the impurity derived from the vacuum pump as an example, but the present invention is not limited to this.
- the lubricant was taken up as an impurity derived from the vacuum pump.
- the present invention is not limited to the impurities derived from the lubricant.
- reverse diffusion can occur even in materials used in vacuum pumps other than lubricants, such as vacuum seal materials. That is, the present invention can be widely applied to the suppression of the amount of scattered impurities attached through a vacuum process.
- the dry pump is used when it is necessary to keep the inside of the vacuum chamber clean.
- a mechanical booster pump generally classified as a dry pump.
- the vacuum chamber can be maintained in a state in which no impurity contamination occurs by applying the present invention to an organic EL element including an organic light emitting layer that easily adsorbs impurities.
- a non-mechanical vacuum pump is different from a mechanical one and does not require the use of a lubricant. Further, the non-mechanical pump used in the above embodiment performs exhaust using gas condensation by the cooling means. Therefore, even if a lubricant is used in such a non-mechanical pump, it is considered that the component vapor contained in the lubricant is very unlikely to be generated. Also from this point, it is very useful to use a non-mechanical pump as the main exhaust pump. On the other hand, the mechanical pump generates heat during its operation, so that vapor of components contained in the lubricant is relatively easily generated.
- a business operator who performs a vacuum process applies the organic light emitting layer material on the substrate to apply the organic light emitting layer material.
- a prepared substrate for example, a case where a business operator performing a vacuum process purchases a substrate coated with an organic light emitting layer material from another business operator is also included. The same applies to “preparing a substrate coated with an organic film material”.
- Embodiment 2 the example in which the hole injection layer is formed on the entire surface so as to cover the upper part of the substrate is shown, but the present invention is not limited to this.
- the hole injection layer may be formed only on the ITO layer. Moreover, it is good also as forming so that only the side surface and upper surface of an ITO layer may be covered.
- the anode is formed of a silver (Ag) material, it is desirable to form an ITO layer thereon as in the above embodiment.
- the anode is formed of an aluminum-based material, it is possible to eliminate the ITO layer and make the anode have a single layer structure.
- an organic EL display panel having a configuration in which a plurality of organic EL elements are integrated on a substrate as subpixels has been described.
- the present invention is not limited to this example, and a single organic EL element is used. It is also possible to use it.
- an organic EL element by single an illuminating device etc. are mentioned, for example.
- the organic EL display panel is a full-color display panel in which R, G, and B emit light, but the present invention is not limited to this.
- the organic EL display panel may be a display panel in which a plurality of R, G, B, white, and other single-color organic EL elements are arranged. Furthermore, it is good also as an organic electroluminescent display panel of a monochromatic display which has an organic electroluminescent element only in any one color.
- an organic material is used as the bank material, but an inorganic material can also be used.
- the bank material layer can be formed by, for example, a coating film forming method as in the case of using an organic material.
- the above-mentioned organic EL display panel employs a line bank system in which a plurality of line-shaped banks are arranged in parallel and the organic light emitting layer is partitioned into stripes, the present invention is not limited to this.
- a so-called pixel bank system may be used in which banks are formed in a grid pattern (lattice shape) and the periphery of each subpixel is surrounded by the banks.
- the method for manufacturing a top emission type organic EL display panel has been described as an example, but the present invention is not limited to this.
- the present invention can also be applied to a manufacturing method of a so-called bottom emission type organic EL display panel having the display surface on the substrate 11 (FIG. 13) side.
- a transparent conductive material for the anode as well as the cathode, it can be applied to a method for manufacturing a double-sided emission type organic EL display panel that extracts light from both the anode side and the cathode side.
- the organic EL element in which the first electrode is the anode and the second electrode is the cathode has been described, but the present invention is not limited to this.
- An organic EL element in which the first electrode is a cathode and the second electrode is an anode may be used.
- the present invention is suitable for the production of organic EL elements used in, for example, household or public facilities, various displays for business use, television devices, displays for portable electronic devices, various thin film forming processes, etching processes, and the like. Is available.
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Abstract
Description
本発明の一態様に係る真空チャンバーの減圧方法は、真空チャンバーの内部圧力を15[Pa]未満に減圧可能な機械式ポンプである粗引きポンプにより、前記真空チャンバー内を減圧する粗引き工程と、前記粗引き工程後、非機械式ポンプである主排気ポンプにより前記真空チャンバー内を減圧する主排気工程と、を含み、前記粗引き工程から前記主排気工程への移行は、前記真空チャンバーの内部圧力が15[Pa]以上であるときに行われる。
[真空装置の構成]
図1は、実施の態様1に係る真空装置の構成を示す図である。
図2は、実施の態様1に係る真空装置の制御部9における動作を説明するためのフローチャートである。
<実験用素子の選定>
本発明者は、真空ポンプ由来の不純物が真空チャンバーに収容される収容物に対して与える影響について、各種実験を行った。実験を行うにあたり、上記収容物としては、不純物が付着しやすい構成を有するものがふさわしいと考えた。そこで、不純物が付着しやすい有機膜を有する素子である有機EL素子を実験用の素子として選択した。有機EL素子は、第1電極としての陽極および第2電極としての陰極の電極対間に、キャリア(正孔と電子)の再結合による電界発光現象を行う有機発光層を積層して構成されるものである。
本発明者は、有機発光層材料塗布後に真空工程を行うか否か、または用いる真空ポンプの種類によって有機EL素子の発光特性に違いが現れるかを検証した。実験用の有機EL素子として、真空工程を経ない有機EL素子1種と、真空工程を経る有機EL素子2種の計3種を準備した。
図7は、機械式ポンプによる排気時間と真空チャンバー内の圧力との関係を示すグラフである。横軸が排気時間であり、縦軸が真空チャンバー内の圧力である。また、縦軸において、下方にいくほど真空度が高いことを示している。
粗引き工程から主排気工程への移行を行う真空チャンバーの内部圧力の数値について検討する実験を行った。具体的には、内部圧力の異なる真空チャンバー内に載置した4種の実験用有機EL素子の発光特性を調べることにより行った。
上述したように、粗引き工程から主排気工程への移行を真空チャンバーの内部圧力が15[Pa]以上であるときに行えば、粗引きポンプを用いたことが原因で真空チャンバーに飛散する不純物の量を低下させることができることが分かった。本発明者は、上記工程の移行を行うタイミングについて、さらに別の指標を用いて規定しようと考えた。
本発明者は、保管環境の違いによって有機発光層表面の付着物に差異が現れるかを検討した。本実験では、3つの実験用有機EL素子半製品における有機発光層表面に付着している物質について分析を行った。
本発明者は、上記の一連の実験の過程で、真空ポンプ由来の不純物を検出する検出器として有機膜を用いた、不純物検出方法を考案するに至った。本項ではその経緯および具体的な検出方法について説明する。
真空チャンバーに飛散した不純物の検出(図11)にあたっては、真空チャンバーへの収容対象が有機膜であることが必要であると判明した。このことについて説明する。
まず、真空チャンバー内に検出器としての有機膜を載置するともに、真空チャンバー内を真空状態にする。これにより、真空ポンプ由来の不純物が真空ポンプから真空チャンバーへ飛散する環境となる。次に、真空ポンプから真空チャンバーへ飛散した不純物を有機膜に付着させる。最後に、不純物を付着させた有機膜の表面近傍における当該不純物を分析する。不純物を付着させた有機膜の表面近傍の付着物を分析する方法としては、例えば、(1)有機膜をヘリウム雰囲気下で昇温加熱し、加熱された有機膜から放出されるアウトガスを液体窒素で捕集し分析する方法、(2)有機膜表面を溶媒で洗い、洗浄後の溶媒を分析する方法、および(3)有機膜を溶媒に溶解させ、溶解後の溶媒を分析する方法等が考えられる。
本実施の態様においては、実施の態様1に係る真空装置を用いて形成された有機発光層を備える有機EL表示パネル、有機EL表示装置および有機EL発光装置について説明する。
図13は、有機EL表示パネル10の構成を示す部分断面図である。有機EL表示パネル10は、同図上側を表示面とする、いわゆるトップエミッション型の有機EL表示パネルであり、その主な構成として、陽極12、有機発光層16、電子輸送層17、陰極18を備える。有機EL表示パネル10は、赤(R),緑(G),青(B)の何れかの発光色に対応する有機発光層16を有する有機EL素子を1つのサブピクセル100とし、サブピクセル100がマトリクス状に配設されている。
基板11は有機EL表示パネル10の基材となる部分であり、例えば、無アルカリガラス、ソーダガラス、無蛍光ガラス、燐酸系ガラス、硼酸系ガラス、石英、アクリル系樹脂、スチレン系樹脂、ポリカーボネート系樹脂、エポキシ系樹脂、ポリエチレン、ポリエステル、シリコーン系樹脂、またはアルミナ等の絶縁性材料で形成することができる。
正孔注入層14は、例えば、銀(Ag)、モリブデン(Mo)、クロム(Cr)、バナジウム(V)、タングステン(W)、ニッケル(Ni)、イリジウム(Ir)等の酸化物、あるいは、PEDOT(ポリチオフェンとポリスチレンスルホン酸との混合物)等の導電性ポリマー材料からなる層である。上記のうち、酸化金属からなる正孔注入層14は、正孔を安定的に、または正孔の生成を補助して、有機発光層16に対し正孔を注入する機能を有する。
正孔注入層14の表面には、有機発光層16の形成領域となる開口部15aを区画するためのバンク15が設けられている。バンク15は一定の台形断面を持つように形成されており、絶縁性の有機材料(例えばアクリル系樹脂、ポリイミド系樹脂、ノボラック型フェノール樹脂等)からなる。
図13に戻り、バンク15の開口部15aにより区画された正孔注入層14の表面には、R,G,Bのいずれかの発光色に対応する、有機膜としての有機発光層16が形成されている。有機発光層16は、キャリアの再結合による発光を行う部位であり、R,G,Bのいずれかの色に対応する有機材料を含むように構成されている。
電子輸送層17は、陰極18から注入された電子を有機発光層16へ輸送する機能を有する。電子輸送層17は電子輸送性を有する材料(電子輸送性材料)で構成されており、このような材料としては、例えば、ニトロ置換フルオレノン誘導体、チオピランジオキサイド誘導体、ジフェキノン誘導体、ペリレンテトラカルボキシル誘導体、アントラキノジメタン誘導体、フレオレニリデンメタン誘導体、アントロン誘導体、オキサジアゾール誘導体、ペリノン誘導体、キノリン錯体誘導体(いずれも特開平5-163488号公報に記載)等が挙げられる。
トップエミッション型有機EL表示パネルを実現するため、本実施の態様において電子輸送層17の上に形成された陰極18は、例えば、ITO、IZO(酸化インジウム亜鉛)等の光透過性を有する導電性酸化物材料で形成されている。
陰極18の上に形成された封止層19は、有機EL表示パネル10内に浸入した水分又は酸素から有機発光層16および陰極18を保護するために設けられている。有機EL表示パネル10はトップエミッション型であるため、封止層19には、例えば、SiN(窒化シリコン)、SiON(酸窒化シリコン)等の光透過性材料が採用されている。
特に図示していないが、封止層19の上方には、基板11と対向する封止基板が設けられる。さらに、封止層19と封止基板とでできる空間に、絶縁性材料を充填することとしてもよい。このようにすることで、有機EL表示パネル10内に水分又は酸素が浸入するのを防ぐことができる。有機EL表示パネル10はトップエミッション型であるため、絶縁性材料としては、SiN、SiON等の光透過性材料を選択する必要がある。
図15~図17は、実施の態様2に係る有機EL表示パネル10の製造工程例を示す図である。これらの図を参照しながら、有機EL表示パネル10の製造方法について説明する。
はじめに、上面に陽極12が形成されているとともに、陽極12の上方に有機発光層16を構成する材料と溶媒とを含む有機発光層材料が塗布された基板11を準備する準備工程を行う。図15(a)~図16(a)は準備工程に相当する。
真空工程としての乾燥工程(図16(b))では、実施の態様1に係る真空装置および真空チャンバーの減圧方法に基づき、有機発光層材料16aの塗布膜を乾燥させる。具体的には、有機発光層材料16a塗布後の基板11を真空チャンバー内に載置し、真空チャンバーに接続された粗引きポンプおよび主排気ポンプにより、真空チャンバー内を真空状態に維持する。
乾燥工程後、図16(c)に示すように、有機発光層16の上に真空成膜法に基づき電子輸送層17を形成する。具体的には、例えば真空蒸着法やスパッタ法等の真空成膜法に基づき、有機発光層16の上面に電子輸送層17を構成する材料を成膜することにより、電子輸送層17を形成する。
図18は、本発明の一態様に係る有機EL表示装置等を示す斜視図である。図18に示すように、有機EL表示装置1000は有機ELディスプレイであり、上述した有機EL表示パネル10を備える。
図20は、本発明の一態様に係る有機EL発光装置200を示す図であって、図20(a)は縦断面図、図20(b)は横断面図である。図20に示すように、有機EL発光装置200は、本発明の一態様に係る製造方法により形成された複数の有機EL素子210と、有機EL素子210が上面に実装されたベース220と、ベース220にそれら有機EL素子210を挟むようにして取り付けられた一対の反射部材230と、から構成されている。各有機EL素子210は、ベース220上に形成された導電パターン(不図示)に電気的に接続されており、前記導電パターンにより供給された駆動電力によって発光する。各有機EL素子210から出射された光の一部は、反射部材230によって配光が制御される。
以上、実施の態様について説明したが、本発明は上記の実施の態様に限られない。例えば、以下のような変形例等が考えられる。
2 粗引きポンプ
3 主排気ポンプ
4 粗引きバルブ
5 主排気バルブ
6 主排気バルブ(延設排気管用バルブ)
7 圧力計
8 ガス流入バルブ
9 制御部
10 有機EL表示パネル
11、101 基板
12、102 陽極
13 ITO層
14、103 正孔注入層
15 バンク
15a 開口部
16、105 有機発光層
16a、105a 有機発光層材料
17、106 電子輸送層
18、107 陰極
19、108 封止層
20 駆動制御部
21~24 駆動回路
25 制御回路
26 真空チャンバー
27 排気管
28 機械式ポンプ
29 排気管
30 不純物
31 有機EL素子半製品
100 サブピクセル
104 正孔輸送層
109 有機発光層と電子輸送層との界面領域
200 有機EL発光装置
210 有機EL素子
220 ベース
230 反射部材
1000 有機EL表示装置
91 真空チャンバー
92 粗引きポンプ
93 主排気ポンプ
94 粗引きバルブ
95 主排気バルブ
96 主排気バルブ
Claims (16)
- 真空チャンバーの内部圧力を15Pa未満に減圧可能な機械式ポンプである粗引きポンプにより、前記真空チャンバー内を減圧する粗引き工程と、
前記粗引き工程後、非機械式ポンプである主排気ポンプにより前記真空チャンバー内を減圧する主排気工程と、を含み、
前記粗引き工程から前記主排気工程への移行は、前記真空チャンバーの内部圧力が15Pa以上であるときに行われる、
真空チャンバーの減圧方法。 - 前記粗引き工程において、
前記真空チャンバー内に不活性ガスを流入させることにより、前記真空チャンバーの減圧速度を調整する、
請求項1に記載の真空チャンバーの減圧方法。 - 前記粗引きポンプはメカニカルブースターポンプである、
請求項1に記載の真空チャンバーの減圧方法。 - 前記主排気ポンプは冷却手段による気体の凝縮を利用して排気を行うポンプである、
請求項1に記載の真空チャンバーの減圧方法。 - 前記主排気ポンプはクライオポンプである、
請求項4に記載の真空チャンバーの減圧方法。 - 真空チャンバーの内部圧力を15Pa未満に減圧可能であり、アルカンを含む潤滑剤を用いる機械式ポンプである粗引きポンプにより、前記真空チャンバー内を減圧する粗引き工程と、
前記粗引き工程後、非機械式ポンプである主排気ポンプにより前記真空チャンバー内を減圧する主排気工程と、を含み、
前記粗引き工程から前記主排気工程への移行は、前記粗引きポンプから前記真空チャンバーへ飛散した前記アルカンにおける蒸気圧の、前記真空チャンバーの内部圧力に対する比が7.3×10-3以下であるときに行われる、
真空チャンバーの減圧方法。 - 前記アルカンは、テトラコサンである、
請求項6に記載の真空チャンバー減圧方法。 - 真空チャンバーの内部圧力を15Pa未満に減圧可能な機械式ポンプである粗引きポンプにより、前記真空チャンバー内を減圧する粗引き工程と、
前記粗引き工程後、非機械式ポンプである主排気ポンプにより前記真空チャンバー内を減圧する主排気工程と、を含み、
前記粗引き工程から前記主排気工程への移行は、前記粗引きポンプによる減圧速度が10Pa/sec以上であるときに行われる、
真空チャンバーの減圧方法。 - 真空チャンバーに接続され、真空チャンバーの内部圧力を15Pa未満に減圧可能な機械式ポンプである粗引きポンプと、
前記真空チャンバーに接続された非機械式ポンプである主排気ポンプと、
前記真空チャンバーから前記粗引きポンプへ至る粗引き用排気管を開閉する粗引きバルブと、
前記粗引き用排気管と独立に設けられ、前記真空チャンバーから前記主排気ポンプへ至る主排気用排気管を開閉する主排気バルブと、
前記粗引きポンプ、前記主排気ポンプ、前記粗引きバルブおよび前記主排気バルブの動作を制御する制御部と、を備え、
前記制御部は、
前記粗引きバルブを開状態、前記主排気バルブを閉状態、前記粗引きポンプを動作状態、前記主排気ポンプを停止状態とする粗引き動作と、当該粗引き動作後に前記粗引きバルブを閉状態、前記主排気バルブを開状態、少なくとも前記主排気ポンプを動作状態とする主排気動作とを行い、
前記粗引き動作から前記主排気動作への移行を、前記真空チャンバーの内部圧力が15Pa以上であるときに行う、
真空装置。 - 有機膜を構成する材料と溶媒とを含む有機膜材料が塗布された基板を準備する準備工程と、
前記有機膜材料塗布後の基板を真空チャンバー内に載置し、前記真空チャンバーに接続された粗引きポンプおよび主排気ポンプにより、当該真空チャンバー内を真空状態に維持する真空工程と、を含み、
前記真空工程は、
前記真空チャンバーの内部圧力を15Pa未満に減圧可能な機械式ポンプである前記粗引きポンプにより、前記真空チャンバー内を減圧する粗引き工程と、
前記粗引き工程後、非機械式ポンプである前記主排気ポンプにより前記真空チャンバー内を減圧する主排気工程と、を含み、
前記粗引き工程から前記主排気工程への移行は、前記真空チャンバーの内部圧力が15Pa以上であるときに行われる、
有機膜の形成方法。 - 上面に第1電極が形成されているとともに、当該第1電極の上方に有機発光層を構成する材料と溶媒とを含む有機発光層材料が塗布された基板を準備する準備工程と、
前記有機発光層材料塗布後の基板を真空チャンバー内に載置し、前記真空チャンバーに接続された粗引きポンプおよび主排気ポンプにより、当該真空チャンバー内を真空状態に維持する真空工程と、
前記有機発光層材料の塗布膜の上方に第2電極を形成する第2電極形成工程と、を含み、
前記真空工程は、
前記真空チャンバーの内部圧力を15Pa未満に減圧可能な機械式ポンプである前記粗引きポンプにより、前記真空チャンバー内を減圧する粗引き工程と、
前記粗引き工程後、非機械式ポンプである前記主排気ポンプにより前記真空チャンバー内を減圧する主排気工程と、を含み、
前記粗引き工程から前記主排気工程への移行は、前記真空チャンバーの内部圧力が15Pa以上であるときに行われる、
有機EL素子の製造方法。 - 請求項11に記載の有機EL素子の製造方法により製造された有機EL素子を用いた、
有機EL表示パネル。 - 請求項11に記載の有機EL素子の製造方法により製造された有機EL素子を用いた、
有機EL表示装置。 - 請求項11に記載の有機EL素子の製造方法により製造された有機EL素子を用いた、
有機EL発光装置。 - 真空チャンバーに接続された真空ポンプ由来の不純物を検出する、不純物検出方法であって、
前記不純物を検出する検出器として有機膜を用いる、
不純物検出方法。 - 前記真空チャンバー内に前記有機膜を載置するともに、前記真空チャンバー内を真空状態にする工程と、
前記真空ポンプから前記真空チャンバーへ飛散した前記不純物を前記有機膜に付着させる工程と、
前記不純物を付着させた前記有機膜の表面近傍における、当該不純物を分析する工程と、を含む、
請求項15に記載の不純物検出方法。
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