WO2013077281A1 - 合金材料の研磨方法及び合金材料の製造方法 - Google Patents
合金材料の研磨方法及び合金材料の製造方法 Download PDFInfo
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- WO2013077281A1 WO2013077281A1 PCT/JP2012/079912 JP2012079912W WO2013077281A1 WO 2013077281 A1 WO2013077281 A1 WO 2013077281A1 JP 2012079912 W JP2012079912 W JP 2012079912W WO 2013077281 A1 WO2013077281 A1 WO 2013077281A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
Definitions
- the present invention relates to a method for polishing an alloy material containing a main component and an element having a hardness different from that of the main component using a polishing composition containing abrasive grains and an oxidizing agent, and an alloy material using the polishing method. It relates to the manufacturing method.
- an alloy is a eutectic of one metal element and one or more other metal elements or non-metal elements such as carbon, nitrogen and silicon.
- an alloy is manufactured for the purpose of improving properties such as mechanical strength, chemical resistance, corrosion resistance, and heat resistance, compared to pure metal.
- aluminum alloys are lightweight and have excellent strength. Therefore, various materials such as structural materials such as building materials and containers, transportation equipment such as automobiles, ships, and aircraft, various electrical appliances, electronic components, etc. Used for applications.
- Titanium alloys are widely used for precision equipment, decorations, tools, sports equipment, medical parts, etc. because they are lightweight and have excellent corrosion resistance.
- Stainless steel and nickel alloys which are iron-based alloys, have excellent corrosion resistance, and thus are used in various applications such as tools, machinery, and cooking utensils in addition to structural materials and transportation equipment.
- Copper alloys are widely used for decorative parts, tableware, musical instruments, parts of electrical materials, etc., because they have excellent electrical conductivity, thermal conductivity, corrosion resistance, processability, and beautiful finishes.
- Mirror finish methods include painting and coating of alloy surfaces.
- advantages over painting and coating can be obtained.
- polishing can provide a mirror surface that is superior to painting, eliminating the need for painting or coating processes and the materials used in them.
- polishing has high durability compared with the mirror surface by coating, the mirror surface lasts for a long time.
- An object of the present invention is to provide a method for efficiently polishing a main component and an alloy material containing an element having a hardness different from that of the main component to an excellent mirror surface.
- the inventors have polished an alloy containing a main component and an element having a hardness different from that of the main component using a polishing composition containing abrasive grains and an oxidizing agent, whereby an oxidizing agent is obtained. It has been found that an excellent mirror surface free from surface defects can be obtained by oxidizing the alloy surface to form a brittle oxide film with high hardness on the alloy surface and polishing it with abrasive grains.
- a main component and an alloy material containing 0.1% by mass or more of an element having a Vickers hardness (HV) of 5 or more different from that of the main component are used.
- HV Vickers hardness
- the alloy material is preferably at least one selected from aluminum alloy, titanium alloy, stainless steel, nickel alloy and copper alloy.
- the oxidizing agent is preferably hydrogen peroxide, and the abrasive grains are preferably colloidal silica.
- the manufacturing method of an alloy material including the process of grind
- an alloy material containing a main component and an element having a hardness different from that of the main component can be efficiently polished to an excellent mirror surface.
- the polishing method of the present embodiment is a method of polishing a main component and an alloy material containing an element having a hardness different from that of the main component using a polishing composition containing abrasive grains and an oxidizing agent.
- Alloy material is aluminum alloy, titanium alloy, stainless steel, nickel alloy, copper alloy or the like.
- An alloy containing an element having a Vickers hardness greatly different from the main component is preferable.
- the surface hardness of an alloy containing aluminum with low hardness and silicon with high hardness is easily made uniform by the oxidizing agent in the polishing composition. Therefore, the polishing method of this embodiment is particularly preferably used for polishing aluminum alloys. When an aluminum alloy is used, a particularly excellent polishing rate can be achieved, and an excellent mirror surface with gloss can be efficiently obtained.
- the element contained in the alloy material is an element that is 5 or more different from the main component in Vickers hardness (HV).
- the element is preferably contained in the alloy material in an amount of 0.1% by mass or more.
- the aluminum alloy contains 0.1 to 10% by mass of silicon, iron, copper, manganese, magnesium, zinc, chromium and the like with respect to aluminum.
- an aluminum alloy for example, A1070, 1050, 1100, 1200, 2014, 2017, 2024, 3002, 2003, 3203, 3004, 3005, 3105, 4032, 4043, 4045, 4047 according to Japanese Industrial Standard (JIS) H4000, 5005, 5052, 5082, 5083, 5086, 5154, 5182, 5252, 5254, 5454, 5451, 5657, 6003, 6056, 6061, 6063, 6082, 6101, 6110, 6151, 6351, 7003, 7005, 7050, 7072, 7075, 7178, etc. are known.
- JIS Japanese Industrial Standard
- the titanium alloy contains 3.5 to 30% by mass of aluminum, iron, vanadium, etc. with respect to titanium.
- a titanium alloy for example, Ti-6Al-4V according to Japanese Industrial Standard (JIS) H4600 is known.
- Stainless steel contains 10 to 50% by mass of chromium, nickel, molybdenum, manganese and the like with respect to iron.
- titanium alloy for example, SUS201, 303, 303Se, 304, 304L, 304NI, 305, 305JI, 309S, 310S, 316, 316L, 321, 347, 384, XM7, 303F according to Japanese Industrial Standard (JIS) G4303, 303C, 430, 430F, 434, 410, 416, 420J1, 420J2, 420F, 420C, 631J1, etc. are known.
- JIS Japanese Industrial Standard
- Nickel alloy contains 20 to 75% by mass of iron, chromium, molybdenum, cobalt, etc. with respect to nickel.
- a nickel alloy for example, NCF600, 601, 625, 750, 800, 800H, 825, NW0276, 4400, 6002, 6022 and the like according to Japanese Industrial Standard (JIS) H4551 are known.
- the copper alloy contains 3 to 50% by mass of iron, lead, zinc, tin, etc. with respect to copper.
- a copper alloy for example, C2100, 2200, 2300, 2400, 2600, 2680, 2720, 2801, 3560, 3561, 3710, 3713, 4250, 4430, 4621, 4640, 6140 according to Japanese Industrial Standard (JIS) H3100, 6161, 6280, 6301, 7060, 7150, 1401, 2051, 6711, 6712 and the like are known.
- JIS Japanese Industrial Standard
- polishing composition used in the polishing method of this embodiment will be described.
- the polishing composition contains abrasive grains and an oxidizing agent.
- the oxidizing agent needs to have a redox potential sufficient to oxidize both the main component and the element different from the main component contained in the alloy.
- the oxidizing agent include peroxides, persulfates, perchlorates, periodates, and permanganates.
- Specific examples of the peroxide include hydrogen peroxide, peracetic acid, percarbonate, urea peroxide and perchloric acid, and persulfates such as sodium persulfate, potassium persulfate and ammonium persulfate.
- persulfate and hydrogen peroxide are preferable from the viewpoint of polishing rate, and hydrogen peroxide is particularly preferable from the viewpoint of stability in an aqueous solution and environmental load.
- the content of the oxidizing agent in the polishing composition is preferably 0.02% by mass or more, more preferably 0.03% by mass or more, and further preferably 0.1% by mass or more.
- content of an oxidizing agent exists in said range, generation
- the content of the oxidizing agent in the polishing composition is preferably 15% by mass or less, more preferably 10% by mass or less.
- the content of the oxidizing agent is within the above range, in addition to reducing the manufacturing cost of the polishing composition, reducing the environmental burden of processing the used polishing composition, that is, waste liquid processing. Can do.
- the abrasive grains are preferably silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, manganese oxide, silicon carbide, or silicon nitride. Of these, silicon oxide is preferable, colloidal silica or fumed silica is more preferable, and colloidal silica is particularly preferable. When these abrasive grains are used, a smoother polished surface can be obtained.
- colloidal silica any of colloidal silica that is not surface-modified and surface-modified colloidal silica can be used.
- Colloidal silica that is not surface-modified has a zeta potential close to zero under acidic conditions, so that silica particles are not easily repelled with each other under acidic conditions and are likely to aggregate.
- colloidal silica surface-modified so as to have a relatively large negative zeta potential even under acidic conditions is strongly repelled and dispersed well even under acidic conditions, resulting in storage stability of the polishing composition. Improves.
- Examples of the surface-modified colloidal silica include colloidal silica in which an organic acid such as sulfonic acid or carboxylic acid is fixed on the surface, and colloidal silica in which the surface is substituted with a metal oxide such as aluminum oxide.
- the organic acid is fixed to the colloidal silica by chemically bonding a functional group of the organic acid to the surface of the colloidal silica. Fixation of sulfonic acid to colloidal silica can be performed, for example, by the method described in “Sulfonic acid-functionalized silica through quantitative oxidation of thiol groups", Chem.hemCommun. 246-247 (2003).
- a silane coupling agent having a thiol group such as 3-mercaptopropyltrimethoxysilane is coupled to colloidal silica, and then the thiol group is oxidized with hydrogen peroxide to fix the sulfonic acid on the surface.
- the colloidal silica thus obtained can be obtained. Fixation of carboxylic acid to colloidal silica is described in, for example, “Novel Silane Coupling Agents Containing a Photolabile 2-Nitrobenzyl Ester for Introduction of a Carboxy Group on the Surface of Silica Gel”, Chemistry Letters, 3, 228-229 It can be performed by the method described.
- colloidal silica having a carboxylic acid immobilized on the surface can be obtained by coupling a silane coupling agent containing a photoreactive 2-nitrobenzyl ester to colloidal silica and then irradiating with light. Further, the replacement of the colloidal silica surface with aluminum oxide is performed by adding an aluminum compound to the colloidal silica and causing the reaction. For example, it can be carried out by the method described in JP-A-6-199515. Specifically, colloidal silica having a surface substituted with aluminum oxide can be obtained by adding alkali aluminate to colloidal silica and heating.
- the polishing composition preferably has a pH in the range of 0.5 to 4.5.
- a modifying group such as a sulfo group is present on the surface of the surface-modified colloidal silica. Therefore, when the pH of the polishing composition is in the range of 0.5 to 4.5, the surface-modified colloidal silica is stably dispersed in the polishing composition, resulting in a high polishing rate.
- the polishing composition When using colloidal silica that has not been surface-modified, the polishing composition preferably has a pH in the range of 8.0 to 12.0. Hydroxyl groups are present on the surface of colloidal silica that is not surface-modified. Therefore, when the pH of the polishing composition is in the range of 8.0 to 12.0, colloidal silica is stably dispersed in the polishing composition, resulting in a high polishing rate.
- the average particle diameter of the abrasive grains contained in the polishing composition is preferably 5 nm or more, more preferably 10 nm or more, and further preferably 15 nm or more. When the average particle diameter of the abrasive grains is within the above range, the polishing rate of the alloy material is improved.
- the average particle diameter of the abrasive grains contained in the polishing composition is preferably 400 nm or less, more preferably 300 nm or less, still more preferably 200 nm or less, and most preferably 100 nm or less.
- the average particle diameter of the abrasive grains is within the above range, it is easy to obtain a surface with low defects and small surface roughness.
- the average particle diameter of the abrasive grains can be calculated from the measured value of the specific surface area by the nitrogen adsorption method (BET method).
- the content of abrasive grains in the polishing composition is preferably 1% by mass or more, more preferably 2% by mass or more. When the content of the abrasive grains is within the above range, the polishing rate of the alloy by the polishing composition is improved.
- the content of abrasive grains in the polishing composition is preferably 50% by mass or less, more preferably 40% by mass or less.
- the content of the abrasive grains is within the above range, it is easy to obtain a polished surface with few scratches in addition to reducing the production cost of the polishing composition. Further, the amount of abrasive grains remaining on the polished alloy surface is reduced, and the cleanliness of the alloy surface is improved.
- the polishing composition may further contain a pH adjuster for the purpose of controlling the polishing rate of the alloy material, the dispersibility of the abrasive grains, and the like.
- the pH adjuster is selected from known acids, bases, or salts thereof.
- the acid include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid and phosphoric acid, formic acid, acetic acid, propionic acid, butyric acid, Herbic acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n-heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexane Acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, tartaric acid
- sulfuric acid, nitric acid, and phosphoric acid are particularly preferable as inorganic acids, and glycolic acid, succinic acid, maleic acid, citric acid, tartaric acid, malic acid, gluconic acid, and itaconic acid are particularly preferable as organic acids.
- Specific examples of the base include organic bases such as amines and quaternary ammonium hydroxide, alkali metal hydroxides, alkaline earth metal hydroxides and ammonia.
- a salt such as an ammonium salt or an alkali metal salt of the acid may be used as a pH adjuster.
- a combination of a weak acid and a strong base, a strong acid and a weak base, or a combination of a weak acid and a weak base is expected to exhibit a pH buffering action.
- the polishing composition may be required to have a high polishing rate and at the same time have a high cleaning removal property.
- an inorganic acid including a pH adjusting agent
- the pH for example, pH 0.5 to 4.5
- surface-modified colloidal silica is used as the abrasive. Is preferred.
- the polishing rate is improved, but the cleaning removability is lowered. Therefore, it is difficult to increase both the polishing rate and the cleaning removal property.
- the polishing rate is improved by the chemical action of the inorganic acid even if the content of abrasive grains in the polishing composition is small. Thereby, both cleaning removal property and polishing rate can be improved. Further, the surface-modified colloidal silica can stably function as abrasive grains even in a polishing composition having a low pH due to the addition of an inorganic acid.
- the polishing composition can be used with the same equipment and conditions that are normally used for polishing metal materials.
- a single-side polishing apparatus holds the alloy material using a holder called a carrier, and while supplying the polishing composition, presses the surface plate to which the polishing pad is attached against one surface of the alloy material, and rotates the surface plate. Polish one side of the alloy material.
- the double-side polishing apparatus holds the alloy material using a carrier, and while supplying the polishing composition from above, presses the surface plate to which the polishing pad is applied against both surfaces of the alloy material and rotates them in opposite directions. Thus, both surfaces of the alloy material are polished. At this time, the alloy material is polished by a physical action due to friction between the polishing pad and the polishing composition and the alloy material, and a chemical action that the polishing composition brings to the alloy.
- the polishing conditions include the polishing load.
- the greater the polishing load the higher the frictional force between the abrasive grains and the alloy material.
- the polishing load applied to the alloy material is not particularly limited, but is preferably 50 to 1,000 g / cm 2 , more preferably 100 to 800 g / cm 2 , and still more preferably 300 to 600 g / cm 2 .
- the polishing load is within the above range, a sufficiently high polishing rate can be exhibited, and the occurrence of wafer breakage and surface defects can be reduced.
- the polishing conditions include linear velocity.
- the number of revolutions of the polishing pad, the number of revolutions of the carrier, the size of the alloy material, the number of the alloy material, etc. affect the linear velocity.
- the linear velocity is high, the frictional force applied to the alloy material increases, so that the mechanical polishing action on the alloy material increases.
- the heat generated by friction may enhance the chemical polishing action by the polishing composition.
- the linear velocity is not particularly limited, but is preferably 10 to 300 m / min, and more preferably 30 to 200 m / min. When the linear velocity is within the above range, a sufficiently high polishing rate can be achieved, and an appropriate frictional force can be imparted to the alloy material.
- the polishing pad is not limited by physical properties such as material, thickness, or hardness.
- an arbitrary polishing pad such as a polyurethane type having various hardness and thickness, a nonwoven fabric type, a suede type, a type including abrasive grains, or a type including no abrasive grains can be used.
- a suede type polishing pad containing no abrasive grains is preferred.
- suede-type polishing pads those that are less deformed by pressure during processing, in other words, those that have high hardness, are more preferable.
- a suede type polishing pad having a hardness of 78 or more is preferable in the hardness measurement method using TECLOCK (registered trademark) defined in Japanese Industrial Standard (JIS) S6050.
- the hardness of the polishing pad can be increased by using polyethylene terephthalate or non-woven fabric as the base material.
- Polishing conditions include the supply rate of the polishing composition.
- the supply rate of the polishing composition depends on the type of alloy material to be polished, the type of polishing apparatus, and other polishing conditions, but the polishing composition is uniformly supplied to the entire surface of the alloy material and the polishing pad. It is preferable that the speed is sufficient.
- the alloy material may be pre-polished using the pre-polishing composition before being polished using the polishing method of the present embodiment. There may be a scratch on the surface of the alloy material due to processing or transportation of the alloy material. By removing such scratches by preliminary polishing, the time required to complete the polishing process according to the present embodiment can be shortened, and an excellent mirror surface can be obtained efficiently.
- the preliminary polishing composition needs to have a higher polishing power than the polishing composition used in the polishing method of the present embodiment.
- the preliminary polishing composition preferably contains abrasive grains having a higher hardness and a larger particle diameter than the abrasive grains used in the polishing method of the present embodiment.
- Examples of the abrasive grains contained in the preliminary polishing composition include, but are not limited to, silicon carbide, aluminum oxide (alumina), zirconia, zircon, ceria, titania and the like. Of these abrasive grains, it is particularly preferable to use aluminum oxide.
- the aluminum oxide is not particularly limited. For example, ⁇ -alumina, ⁇ -alumina, ⁇ -alumina, ⁇ -alumina, and other crystalline forms of alumina can be used.
- the aluminum oxide may contain an impurity element such as silicon, titanium, iron, copper, chromium, sodium, potassium, calcium, and magnesium.
- alumina abrasive grains mainly composed of ⁇ -alumina.
- the proportion of ⁇ -alumina in the alumina abrasive grains is preferably 20% or more, more preferably 40% or more.
- the proportion of ⁇ -alumina in the alumina abrasive grains can be determined from the integral intensity ratio of the (113) plane X-ray diffraction lines.
- the average particle size of the abrasive grains contained in the preliminary polishing composition is preferably 0.1 ⁇ m or more, more preferably 0.3 ⁇ m or more. When the average particle diameter of the abrasive grains is within the above range, the polishing rate of the alloy material is improved.
- the average particle size of the abrasive grains contained in the preliminary polishing composition is preferably 20 ⁇ m or less, more preferably 5 ⁇ m or less. When the average particle diameter of the abrasive grains is within the above range, a polished surface with low defects and small surface roughness can be easily obtained.
- the average particle size of the abrasive grains can be measured using, for example, a laser diffraction / scattering particle size distribution measuring apparatus, for example, “LA-950” manufactured by Horiba, Ltd.
- the specific surface area of the abrasive grains contained in the preliminary polishing composition is preferably 20 m 2 / g or less. When the specific surface area of the abrasive grains is within the above range, the polishing rate of the alloy material is improved.
- the specific surface area of the abrasive grains contained in the preliminary polishing composition is preferably 5 m 2 / g or more. When the specific surface area of the abrasive grains is within the above range, a polished surface with low defects and low surface roughness can be easily obtained.
- the specific surface area of the abrasive grains can be measured using, for example, “Flow SorbII 2300” manufactured by Micromeritex.
- the content of abrasive grains in the preliminary polishing composition is preferably 0.5% by mass or more, more preferably 1% by mass or more. When the content of the abrasive grains is within the above range, the polishing rate of the alloy material is improved.
- the content of abrasive grains in the preliminary polishing composition is preferably 20% by mass or less, more preferably 10% by mass or less.
- the content of the abrasive grains is within the above range, in addition to reducing the production cost of the preliminary polishing composition, scratches on the alloy surface after preliminary polishing can be reduced.
- the preferred pH of the pre-polishing composition varies depending on the type of alloy to be polished.
- the pH in the preliminary polishing composition is adjusted with a known acid, base, or salt thereof.
- the embodiment may be modified as follows.
- -Polishing composition may contain 2 or more types of abrasive grain in arbitrary density
- the polishing composition may contain an additive having an action of further increasing the polishing rate, such as a complexing agent and an etching agent, as necessary.
- the polishing composition may contain an additive for imparting hydrophilicity to the polished alloy surface.
- additives include polycarboxylic acids such as polyacrylic acid and polymaleic acid, polyphosphonic acids, polysulfonic acids, polysaccharides, cellulose derivatives, ethylene oxide polymers, water-soluble polymers such as vinyl polymers, and the like. And their copolymers, salts, derivatives and the like. These additives can prevent the adhesion of foreign matter to the alloy surface by increasing the wettability of the alloy surface after polishing.
- the polishing composition may further contain known additives such as preservatives, antifungal agents, and rust inhibitors as necessary.
- the polishing composition may further contain an additive such as a dispersing agent for improving the dispersibility of the abrasive grains and a dispersing aid for facilitating the redispersion of the aggregates, if necessary.
- an additive such as a dispersing agent for improving the dispersibility of the abrasive grains and a dispersing aid for facilitating the redispersion of the aggregates, if necessary.
- the polishing composition After the polishing composition is once used for polishing an alloy, it can be recovered and used for polishing again.
- a method of reusing a polishing composition a method of once collecting a used polishing composition discharged from a polishing apparatus in a tank and circulating it from the tank to the polishing apparatus again is used. It is done. By circulating the polishing composition, it is possible to reduce the amount of the polishing composition discharged as a waste liquid and to reduce the amount of the polishing composition used. This is useful in that the environmental load can be reduced and the manufacturing cost of the alloy material can be suppressed.
- the polishing composition is recycled, components such as silica in the polishing composition are consumed and lost by polishing. For this reason, you may replenish the polishing composition in circulation use for the decrease of components, such as a silica.
- the components to be replenished may be added individually to the polishing composition, or may be added to the polishing composition as a mixture containing two or more components at an arbitrary concentration. In this case, the polishing composition is adjusted to a state suitable for reuse, and the polishing performance is suitably maintained.
- the polishing composition may be prepared by diluting a stock solution of the polishing composition with water.
- the polishing composition may be a one-part type or a multi-part type having two or more parts.
- two or more compositions are prepared in advance, and these compositions are mixed in the polishing apparatus to form a polishing composition. Also good.
- Polishing compositions of Compositions 1-1 to 1-5 were prepared by diluting colloidal silica having an average particle size of 78 nm and no surface modification with water and further adding an oxidizing agent.
- the polishing composition of Composition 1-6 was prepared without adding an oxidizing agent.
- Table 2 shows the concentration and average particle size of colloidal silica, the type and concentration of the oxidizing agent, and the pH.
- An aluminum alloy, a titanium alloy, a stainless steel, and a copper alloy were prepared as alloys to be polished. Pure aluminum (1N99) was also prepared for reference.
- Table 3 shows the composition of the alloys used.
- Table 4 shows the Vickers hardness of each element constituting the alloy. These alloys are pre-polished using a pre-polishing composition so that the surface roughness is in the range of 0.02 ⁇ m to 0.04 ⁇ m.
- Each alloy was polished under the polishing conditions shown in Table 1 using polishing compositions having compositions 1-1 to 1-6. And about each alloy, the polishing rate, the surface defect, and the surface roughness were evaluated.
- polishing rate The weight of the alloy was measured before and after polishing. The polishing rate is calculated from the difference in weight before and after polishing and is shown in the “Polishing rate” column of Table 5.
- Polishing compositions of Composition 2-1 to Composition 2-6 were prepared by diluting colloidal silica having an average particle size of 17 nm, 31 nm, or 78 nm with no surface modification with water and adding an oxidizing agent.
- Table 6 shows the concentration and average particle diameter of colloidal silica, the type and concentration of the oxidizing agent, and the pH of each polishing composition.
- Aluminum alloy A5052 shown in Table 3 was prepared as an alloy to be polished. This alloy is pre-polished using the pre-polishing composition so that the surface roughness is in the range of 0.02 ⁇ m to 0.04 ⁇ m.
- the alloys were polished under the polishing conditions shown in Table 1 using polishing compositions having compositions 2-1 to 2-6. Then, the polishing rate, surface defects, and surface roughness were evaluated by the same method as in Test 1. The results are shown in the “Polishing rate” column, “Defect” column, and “Ra” column in Table 7, respectively.
- Examples 2-1 to 2-6 an excellent mirror surface free from surface defects could be obtained. Moreover, a high polishing rate can be obtained by using a polishing composition containing abrasive grains having a large average particle diameter or containing abrasive grains at a high concentration.
- Test 3 For polishing of compositions 3-1 and 3-3 with pH 2.0 by diluting colloidal silica surface-modified with sulfonic acid having an average particle diameter of 17 nm or 31 nm with water and adding an oxidizing agent and a pH adjusting agent. A composition was prepared. Sulfuric acid was used as the pH adjuster. Polishing compositions of Compositions 3-2 and 3-4 were prepared without adding a pH adjuster. For each polishing composition, Table 8 shows the concentration and average particle size of colloidal silica, the type and concentration of the oxidizing agent, and the pH.
- Aluminum alloy A5052 shown in Table 3 was prepared as an alloy to be polished. This alloy is pre-polished using the pre-polishing composition so that the surface roughness is in the range of 0.02 ⁇ m to 0.05 ⁇ m.
- the alloys were polished under the polishing conditions shown in Table 1 using polishing compositions having compositions 3-1 to 3-4. Then, the polishing rate, surface defects, and surface roughness were evaluated by the same method as in Test 1. The results are shown in the “polishing rate” column, “defect” column, and “Ra” column in Table 9, respectively.
- Examples 3-1 to 3-4 As shown in Table 9, in Examples 3-1 to 3-4, an excellent mirror surface free from surface defects could be obtained. Further, in Examples 3-1 and 3-3 using the polishing composition adjusted to pH 2.0, the polishing rate was improved.
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Abstract
Description
平均粒子径が78nmの表面修飾されていないコロイダルシリカを水で希釈し、さらに酸化剤を加えることにより、組成1-1から1-5の研磨用組成物を調製した。組成1-6の研磨用組成物は酸化剤を加えずに調製した。各研磨用組成物について、コロイダルシリカの濃度と平均粒子径、酸化剤の種類とその濃度、並びにpHを表2に示す。
研磨の前後に合金の重量を測定した。研磨前後の重量の差から研磨速度を算出し、表5の“研磨速度”欄に示す。
研磨後の合金表面を蛍光灯下にて目視で確認した。その結果を表5の“欠陥”欄に示す。なお、“欠陥”欄中、“C”は合金表面にオレンジピール状の凹凸欠陥が発生したことを表し、“B”は合金表面にオレンジピール状の凹凸欠陥が僅かに発生したことを表し、“A”は合金表面にオレンジピール状の凹凸欠陥が発生しなかったことを表す。
研磨後の合金表面の表面粗さ(Ra)は、SURFCOM(登録商標)1500DXを用いて測定長30.0mm、測定速度0.3mm/secの条件で測定した。その結果を表5の“Ra”欄に示す。
平均粒子径が17nm、31nm、又は78nmの表面修飾されていないコロイダルシリカを水で希釈し、さらに酸化剤を加えることにより、組成2-1から組成2-6の研磨用組成物を調製した。各研磨用組成物について、コロイダルシリカの濃度と平均粒子径、酸化剤の種類とその濃度、並びにpHを表6に示す。
平均粒子径が17nm又は31nmのスルホン酸で表面修飾されたコロイダルシリカを水で希釈し、さらに酸化剤及びpH調整剤を加えることにより、pH2.0の組成3-1及び3-3の研磨用組成物を調製した。pH調整剤には硫酸を使用した。組成3-2及び3-4の研磨用組成物はpH調整剤を加えずに調製した。各研磨用組成物について、コロイダルシリカの濃度と平均粒子径、酸化剤の種類とその濃度、並びにpHを表8に示す。
Claims (7)
- 主成分及び前記主成分とはビッカース硬度(HV)が5以上異なる元素を0.1質量%以上含む合金材料の研磨方法であって、
砥粒及び酸化剤を含有する研磨用組成物を使用して前記合金材料の表面を研磨することを特徴とする合金材料の研磨方法。 - 前記合金材料が、アルミニウム合金、チタン合金、ステンレス鋼、ニッケル合金又は銅合金である、請求項1に記載の合金材料の研磨方法。
- 前記酸化剤が過酸化水素である請求項1又は2に記載の合金材料の研磨方法。
- 前記砥粒がコロイダルシリカである請求項1~3のいずれか1項に記載の合金材料の研磨方法。
- 予備研磨用組成物を用いて前記合金材料を予備研磨する工程を含む、請求項1~4のいずれか1項に記載の合金材料の研磨方法。
- 請求項1~5のいずれか1項に記載の合金材料の研磨方法を用いて合金材料を研磨する工程を含む、合金材料の製造方法。
- 請求項6に記載の製造方法を用いて製造される合金材料。
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WO2016021254A1 (ja) * | 2014-08-07 | 2016-02-11 | 株式会社フジミインコーポレーテッド | チタン合金材料研磨用組成物 |
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JP6757259B2 (ja) * | 2015-01-19 | 2020-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
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